TW201238992A - Thermosetting crosslinking cyclic olefin resin composition, thermosetting crosslinking cyclic olefin resin film, method for producing thermosetting crosslinking cyclic olefin resin composition and method for producing thermosetting crosslinking cyclic ol - Google Patents

Thermosetting crosslinking cyclic olefin resin composition, thermosetting crosslinking cyclic olefin resin film, method for producing thermosetting crosslinking cyclic olefin resin composition and method for producing thermosetting crosslinking cyclic ol Download PDF

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TW201238992A
TW201238992A TW101101527A TW101101527A TW201238992A TW 201238992 A TW201238992 A TW 201238992A TW 101101527 A TW101101527 A TW 101101527A TW 101101527 A TW101101527 A TW 101101527A TW 201238992 A TW201238992 A TW 201238992A
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Taiwan
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cyclic olefin
olefin resin
ring
mass
thermosetting
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TW101101527A
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Chinese (zh)
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Satoshi Iwabuchi
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Zeon Corp
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • C08G61/08Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/14Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers obtained by ring-opening polymerisation of carbocyclic compounds having one or more carbon-to-carbon double bonds in the carbocyclic ring, i.e. polyalkeneamers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F32/00Homopolymers and copolymers of cyclic compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic ring system
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers

Abstract

Thermosetting crosslinking cyclic olefin resin composition of the present invention is obtained by heating, ring opening metathesis polymerization and crosslinking polymerizable composition which contains 100 parts by weight of (a) cyclic olefin monomer, 0.7 to 40 parts by weight of (b) [except for the (a), crosslinking agent having two or more polymerizable unsaturated bonds], 1.15 to 15 parts by weight of (c) organic peroxide series thermal polymerization initiator having one minute half-life temperature of 135 to 200 DEG C, and (d) ring opening metathesis polymerization catalyst.

Description

201238992 六、發明說明: 【發明所屬之技術領域】 本發明關於表面的水接觸角大之熱硬化性 烯烴樹脂組成物及包含該組成物的熱硬化性交 烴樹脂薄膜。包含本發明的樹脂組成物的薄膜 1C晶片、LED等的半導體封裝步驟、多層印刷 造時之積層熱壓步驟、撓性印刷配線板製造時 貼附步驟等的組裝步驟之良率提高。再者,本 該組成物之製造方法及該薄膜之製造方法。 【先前技術】 稀經樹脂主要係作為各種成形品的原料使 用稀煙樹脂的成形品的用途之一,有樹脂薄膜 明、輕量、加工性良好,焚燒處理容易等之優 泛使用。然而,有耐熱性差的的缺點,由於不 °C以上的南溫之用途使用,故檢討改良。 於具有高溫耐熱性的樹脂薄膜之用途中, 體製程的脫模薄膜。脫模薄膜係在半導體元件 驟中’用於與密封材、半固化片等之脫模的薄 1C晶片、LED等的半導體元件之小型化及 係隨著行動電話等的移動式機器之小型化及薄 展。密封有此等元件的封裝晶片形狀亦變化。 以往之表面安裝用元件可見到的引線框由封裝 之方式而配置的形狀之晶片係非為主流,端子 在元件上的形狀之晶片尺寸封裝(CSP)、3 (BGA)、四面扁平無導線封裝(qfn)等形狀的安 交聯環狀 聯環狀烯 係有助於 配線板製 之覆蓋層 發明關於 用。於使 。由於透 點,被廣 能在100 有在半導 的封裝步 膜。 薄型化, 型化而進 最近,在 晶片延伸 直接配置 象栅陣列 裝用封裝 -4- 201238992 晶片係正在成為主流。此等形狀具有 點,有助於機器的小型化。再者,此辜 裝晶片係薄,有助於密封膜厚的薄化。 然而,製品的破裂、密封材自端^ 此等形狀的安裝用封裝晶片之製程中$ 率降低。使用藉由脫模薄膜的輔助成方 於良率提尚而被檢討(例如參照專利文丨 方法所使用的脫模薄膜之材料的聚四肩 稀-四氟乙烯共聚物(ETFE)及聚醯亞 PTFE製及ETFE製脫模薄膜由於產生; 基氟、全氟異丁烯等,對環境造成不辞 時不能焚燒處理。 另一方面,檢討將含有複分解聚< 聚合的環烯烴類之液狀物在載體上聚4 薄臈當作脫模薄膜(例如參照專利文獻 係水接觸角小,不具有與密封材、半ϋ 使用的樹脂之充分的脫模性。 先前技術文獻 專利文獻 專利文獻1 曰本公開發明專利公報「 號公報」 專利文獻2 日本公開發明專利公報「 號公報」 專利文獻3 曰本公開發明專利公報「 號公報j 安裝面積小的優 :形狀的安裝用封 •部的滲出,係在 :易發生,製造良 ^之密封方法,由 氏1及2)。該密封 L乙稀(PTFE)、乙 胺係高價,而且 I*害的氟化氫、幾 !影響,故在廢棄 >觸媒與能複分解 卜而得之交聯樹脂 3)。然而,該薄膜 ]化片、黏著劑所 特開 2000-167841 特開 2001-250838 特開 2001-253934 -5- 201238992 【發明内容】 [發明所欲解決的問題] 最近,希望要求含有將環㈣烴單體開環複分解节 合而得之熱硬化性交聯環狀烤烴樹脂,能供給具有與密 封材、半固化片、黏著劑所使用的樹脂之充分的加熱前 後之脫模性、拉伸斷裂伸長度、拉伸斷裂強度等的機械 強度、撥水性與高溫耐變色性,在廢棄時可焚燒的薄膜 之樹脂組成物,但尚未發現如此的樹脂組成物。 、 〇〇本發明所欲的解決的問題在於提供含有將環狀烯烴 單體開環複分解聚合而得之熱硬化性交聯環狀烯烴樹 脂,能供給具有與密封材、半固化片、黏著劑所使用的 樹脂之充分的加熱前後之脫模性、拉伸斷裂伸長度、拉 伸斷裂強度等機械強度、撥水性、高溫耐變色性之薄膜 的樹脂組成物’包含該樹脂組成物的薄膜,該組成物之 製造方法及該薄膜之製造方法。 [解決問題的手段] 本發明的發明者進行專心致力的檢討,結果發現將 含有(a)環狀烯烴單體、(b)〔除了該(a)以外,具有2個 以上聚合性不飽和鍵的交聯劑〕及丨分鐘半衰期溫度 為135〜200°C的有機過氧化物系熱聚合起始劑之聚合性 組成物加熱、開環複分解聚合及交聯而得之熱硬化性交 聯環狀烯烴樹脂組成物,其供給具有與密封材、半固化 片、黏著劑所使用的樹脂之充分的加熱前後之脫模性、 高機械強度、高撥水性、高溫耐變色性之薄膜,而完成 本發明的熱硬化性交聯環狀烯烴樹脂組成物、由該樹脂 組成物所成的薄膜以及彼等之製造方法。 -6 - 201238992 本發明的熱硬化性交聯環狀烯烴樹脂組成物係將含 有100質量份的(a)環狀烯烴單體、0.7〜40質量份的(b) 〔除了該(a)以外’具有2個以上聚合性不飽和鍵的交聯 劑〕、1.15〜15質量份的(c)1分鐘半衰期溫度為135〜2〇〇。 C的有機過氧化物系熱聚合起始劑及開環複分解聚合 觸媒之聚合性組成物加熱、開環複分解聚合及交聯而得。 本發明的熱硬化性交聯環狀烯烴樹脂薄膜係包含上 述組成物。上述熱硬化性交聯環狀烯烴樹脂薄膜的較佳 用途係半導體封裝步驟或印刷基板製造步驟中所用的脫 模薄膜。 本發明的熱硬化性交聯環狀烯烴樹脂組成物之製造 方法包含:將含有100質量份的(a)環狀烯烴單體、〇 7〜4〇 質量份的(b)〔除了該(a)以外’具有2個以上聚合性不飽 和鍵的交聯劑〕、1.1 5〜1 5質量份的(c) 1分鐘半衰期溫度 為1 35〜200 ° C的有機過氧化物系熱聚合起始劑及(d)開環 複分解聚合觸媒之聚合性組成物加熱、開環複分解聚合 及交聯之步驟。 本發明的熱硬化性交聯環狀烯烴樹脂薄膜之製造方 法包含:將含有100質量份的(a)環狀烯烴單體、〇 7~4〇 質量份的(b)〔除了該(a)以外,具有2個以上聚合性不飽 和鍵的交聯劑〕、1.15〜15質量份的(c)l分鐘半衰期溫度 為1 3 5〜200 ° C的有機過氧化物系熱聚合起始劑及(d)開環 複分解聚合觸媒之聚合性組成物塗布在支擇體上, **•3 J3- 在上述支撐體上進行加熱、開環複分解聚合及交聯之步 驟0 201238992 [發明的效果] 本發明的熱硬化性交牌声“丨* 具有與密封材、半::=烴樹脂經成物係供給 等的機械強度、撥水性;申::長度、拉伸斷裂強度 内__耐變色性之薄膜。 本發明之其它目的、 士 的記載而充分得知。 &優異點係可由以下所示 【實施方式】 [貫施發明的形態] 本發明的熱硬化性交聯環狀稀烴樹脂組成物之原料 二的狀稀烴單體’係具有由碳原子所形成的環構 烯系-和衣11有石反_碳雙鍵的化合物。其具體例為降福 降花:& 單裱環狀烯烴等。較佳的⑷環狀烯烴單體係 '、單體。降箱烯系單體係、含有降箱烯環的單體。 η烯系單體的具體例係降花烯類、二環戊二烯類、四 =二稀類等。此等係、可含有烧基、烯基、亞烧基、芳 "等的烴基’羧基、酸酐基等的極性基當作取代基。 且 $稀系單體係除了降萡烯環的雙鍵以外,還可更 的有又鍵。從脫模薄膜的脫模性提高之觀點來看,較佳 、S烯系單體係非極性的,即僅由碳原子與氫原子所 構成的降稍烯系單體。 非極性的降箱烯系單體之具體例係二環戊二烯、甲 = 衣戊一缔、二氫二環戊二烯(亦稱為三環[5·2.1·02,6] 癸_8-烯)等的非極性二環戊二烯類; -8- 201238992 四環[6.2.1.13,6_02,7]十二-4-烯、9-曱基四環 [6.2.1.13,6.02,7]十二-4-烯、9-乙基四環[6.2.1.13,6.02,7] 十二-4-烯、9-環己基四環[6.2.1.13,6.02,7]十二-4-烯、9- 環 戊 基四環[6.2. 1.13,6. 〇2,7]十二- 4-烯 、9 丨-亞 甲基四 環 [6.2. .1.13,6. 02,7] 十 — -4- 烯 、 9- 亞 乙 基四 環 [6.2. .1.13,6. 02,7] 十 二 -4- 稀 、 9- 乙 烯 基四 環 [6 .2. .1.13,6. 〇2,7] 十 二 -4- 烯 、 9- 丙 烯 基四 環 [6 .2. .1.13,6. 〇2,7] 十 二 -4- 烯 、 9-環 己 烯 基四 環 [6.2. .1.13,6. 02,7] 十 —~ -4- 烯、 9-環 戊 烯 基四 環 [6 .2, .1.13,6. 〇2,7]十二 -4-稀、 9-苯基 四環 [6·: 2.1. 13,6.02 ,7] 十 -- -4-烯等的非 極性四 環十 二烯類; 2-降稻 烯、i 曱 基- 2-降 葙烯、 5-乙 基_ 2-降稍烯、 5- 丁 基 -2-降萡烯、 5-己 基 -2-降葙烯、 5-癸 基- 2-降稍烯、 5- 環 己 基-2-降花烯 、5- 環 戊基 -2-降祐 :烯、 5-亞乙 基-2-降 捐 烯 、 5-乙烯 基-2- 降箱 烯 、5- 丙烯基 -2-降 烯、 5-環己 烯 基-2-降葙烯、5-環戊烯基-2-降稻烯、5-苯基-2-降葙烯、 四瓖[9.2.1.02,10.03,8]十四-3,5,7,12-四烯(亦稱為 1,4-亞 甲基-1,4,4狂,9 8-四氫-911-第)、四環[10.2.1.02,11.04,9]十 五-4,6,8,13-四烯(亦稱為1,4-亞曱基- l,4,4a,9,9a,10-六氫 蒽)等的非極性降葙烯類; 五環[6.5.1.1 3,6.02,7.09,13]十五-4,10-二烯、五環 [9.2.1.14,7.02,10.03,8]十五-5,12-二烯、六環 [6.6.1.13,6.110,13.02,7.09,14]十七-4-烯等的五環體以上 之非極性環狀烯烴類等。 -9 - 201238992 從取得容易性與薄膜的耐埶性 佳的非極性降箱烯系單體係非極:之觀點來看,較 性四環十二稀類,更佳的非極性降::戊二埽類、非極 二環戊二烯類。 福烯糸單體係非極性 含有極性基的降葙歸系 [6.2.^6.02,7]十二_9-浠+ 具體例係四環 [6.2丄!3,6.〇2,7]十二_9_稀 夂曱酯、四環 ,/j丁一 y佈-4_曱醇、四 十二-9-稀|竣酸、四環[6 2 li36 二緩酸、四環[6·2」13,6 〇2,7]十二 _9·场 一 ·9-稀 _4,5_ 5_降稍婦-2-幾酸甲醋、2•甲基_5•降,缓酸針、 酸5-降葙嫌9 Αe 締2-叛酸甲酯、醋 5_降…醇、5-降…醇、 等婦甲猜、2·乙醯基I降花稀、氧雜州稀 :環環狀侧具體例係環丁烯、環戊烯、、 %辛烯 '環十二烯、! 5 师 ...^ ^ 衣肀一烯及具有取代基的此等 <何生物等。 此等(a)環狀稀烴單體係可將i種單獨或2種以上組 。使用。單核環狀烯烴的添加量,相對於⑷環狀稀煙單 體的王量,較佳為40質量%以下,更佳為2〇質量%以下。 藉由單環環狀烯烴的添加量為40質量%以下,所得之熱 更化性父聯ί衣狀浠烴樹脂組成物及熱硬化性交聯環狀烯 垣樹脂薄膜之耐熱性變充分。 含有(a)環狀烯烴單體、(b)〔除了該(a)以外,具有2 個以上聚合性不飽和鍵的交聯劑〕、(c)丨分鐘半衰期溫度 為1 3 5〜200°C的有機過氧化物系熱聚合起始劑及(d)開環 -10- 201238992 複分解聚合觸媒之聚合性組成物’係加熱而開核複分解 聚合及交聯。(d)開環複分解聚合觸媒’係使(a)環狀烯煌 單體開環複分解聚合。該聚合觸媒係不限定於特定的觸 媒。 以過渡金屬原子為中心,離子、原子、多原子離子 及/或化合物複數鍵結而成的錯合物’係可作為(d)開環複 分解聚合觸媒使用。5族、6族及8族(長週期型週期表, 以下相同)的原子係作為過渡金屬原子使用。各族的原子 係沒有特別的限定,但較佳的5族原子係鈕,較佳的石 族原子係鉬、鶴,較佳的8族原子係釕、餓。 合物’特佳的(d)開環複分解聚合觸媒係釕碳締錯合物 釘碳稀錯合物由於塊狀聚合時的催化活性優異,可 性良好地得到殘留未反應單體少之交聯環狀歸煙^ 較佳的(d)開環複分解聚合觸媒係8族的釕、蛾之[Technical Field] The present invention relates to a thermosetting olefin resin composition having a large water contact angle on a surface and a thermosetting hydrocarbon resin film containing the composition. The yield of the assembly step of the thin film 1C wafer including the resin composition of the present invention, the semiconductor packaging step of the LED, the laminated hot pressing step at the time of multilayer printing, and the attaching step in the production of the flexible printed wiring board is improved. Further, the method for producing the composition and the method for producing the film. [Prior Art] The use of a thin resin as a raw material of various molded articles is one of the uses of a molded article of a thin smoke resin, and the resin film is excellent in light weight, good in workability, and easy to incinerate. However, there is a disadvantage that the heat resistance is poor, and since it is used for the use of the south temperature of not more than °C, the improvement is reviewed. In the use of a resin film having high temperature heat resistance, a release film of a mechanical process. The release film is a small-sized semiconductor chip such as a thin 1C wafer or a LED for demolding a sealing material or a prepreg, and is miniaturized and thinned by a mobile device such as a mobile phone. exhibition. The shape of the package wafer in which such components are sealed also varies. In the past, the surface mount component has a chip frame in which the shape of the lead frame is not encapsulated. The chip is packaged on the component in the shape of a chip size package (CSP), 3 (BGA), and a four-sided flat wireless package. The (bfn) and other shaped cross-linked cyclic cyclic olefinic copolymers contribute to the use of a cover layer made of a wiring board. Yu. Due to the penetration point, it is widely available in 100 packages with a semi-conductive package. Thinner, more advanced. Recently, wafer layout is directly arranged. Grid array package -4- 201238992 The chip system is becoming mainstream. These shapes have points that contribute to the miniaturization of the machine. Furthermore, the packaged wafer is thin, which contributes to thinning of the sealing film thickness. However, the rupture of the product and the sealing material are reduced in the process of mounting the packaged wafer. It is reviewed by using the auxiliary film of the release film to improve the yield (for example, the polytetrapod-tetrafluoroethylene copolymer (ETFE) and the polyfluorene of the material of the release film used in the patent document method. Sub-PTFE and ETFE release film are produced; base fluorine, perfluoroisobutylene, etc., can not be incinerated when the environment is not lost. On the other hand, review the liquid material containing cyclodepolymerization and polymerization of cyclic olefins. The carrier is a release film (for example, the patent document has a small water contact angle, and does not have sufficient mold release property with the resin used for the sealing material or the semiconductor. PRIOR ART DOCUMENT Patent Document Patent Document 1 Japanese Laid-Open Patent Publication No. Publication No. Japanese Patent Laid-Open Publication No. Publication No. JP-A No. JP-A No. In the case of: easy to occur, the sealing method of manufacturing good ^, by 1 and 2). The seal L-diethyl (PTFE), ethylamine is high-priced, and I * harmful hydrogen fluoride, a few! a catalyst and a cross-linking resin which can be decomposed into a resin 3). However, the film is made of a tablet and an adhesive. 2000-167841, JP-A-2001-250838, JP-A-2001-253934-5-201238992 [Problems to be Solved by the Invention] Recently, it has been desired to provide a thermosetting crosslinked cyclic hydrocarbon resin containing a ring-opening metathesis of a cyclic (tetra) hydrocarbon monomer, which can be supplied and used together with a sealing material, a prepreg, and an adhesive. The resin has sufficient mechanical properties such as mold release property, tensile elongation at break, tensile strength at break, tensile strength, and high-temperature discoloration resistance before and after heating, and the resin composition of the film that can be incinerated at the time of disposal, but has not been found yet. The resin composition of the present invention solves the problem of providing a thermosetting crosslinked cyclic olefin resin obtained by ring-opening metathesis polymerization of a cyclic olefin monomer, and can be supplied with a sealing material and a prepreg. a film having mechanical strength, water repellency, high temperature and discoloration resistance such as mold release property, tensile elongation at break, tensile strength at break before and after heating of the resin used for the adhesive A resin composition comprising a film of the resin composition, a method for producing the composition, and a method for producing the film. [Means for Solving the Problem] The inventors of the present invention conducted a focused review and found that (a) a cyclic olefin monomer, (b) [a crosslinking agent having two or more polymerizable unsaturated bonds in addition to the (a)], and an organic peroxide-based thermal polymerization having a half-life temperature of 135 to 200 ° C A thermosetting crosslinked cyclic olefin resin composition obtained by heating, ring-opening metathesis polymerization, and crosslinking of a polymerizable composition of an initiator, which is supplied with sufficient heating with a resin used for a sealing material, a prepreg, and an adhesive. A film of a thermosetting crosslinked cyclic olefin resin of the present invention, a film formed of the resin composition, and the like, which have a mold release property before and after, a high mechanical strength, a high water repellency, and a high temperature and discoloration resistance film. Production method. -6 - 201238992 The thermosetting crosslinked cyclic olefin resin composition of the present invention contains 100 parts by mass of (a) a cyclic olefin monomer, and 0.7 to 40 parts by mass of (b) [except for (a) The cross-linking agent having two or more polymerizable unsaturated bonds], and the (c) one-minute half-life temperature of 1.15 to 15 parts by mass is 135 to 2 Torr. The organic peroxide-based thermal polymerization initiator of C and the polymerizable composition of the ring-opening metathesis polymerization catalyst are heated, ring-opened metathesis polymerization, and crosslinked. The thermosetting crosslinked cyclic olefin resin film of the present invention comprises the above composition. A preferred use of the above thermosetting crosslinked cyclic olefin resin film is a release film used in a semiconductor packaging step or a printing substrate manufacturing step. The method for producing a thermosetting crosslinked cyclic olefin resin composition of the present invention comprises: (b) containing (inclusive) (a) containing 100 parts by mass of (a) a cyclic olefin monomer, 〇 7 to 4 parts by mass Other than 'crosslinking agent having two or more polymerizable unsaturated bonds', 1.1 5 to 15 parts by mass of (c) organic peroxide-based thermal polymerization initiator having a one-minute half-life temperature of from 1 to 35 ° C And (d) a step of heating, ring-opening metathesis polymerization, and crosslinking of the polymerizable composition of the ring-opening metathesis polymerization catalyst. The method for producing a thermosetting crosslinked cyclic olefin resin film of the present invention comprises: (b) containing (inclusive) (a) containing 100 parts by mass of (a) a cyclic olefin monomer and 〇7 to 4 parts by mass. , a crosslinking agent having two or more polymerizable unsaturated bonds, and 1.15 to 15 parts by mass of (c) an organic peroxide-based thermal polymerization initiator having a half-life temperature of 1 3 5 to 200 ° C and (1) d) a polymerizable composition of a ring-opening metathesis polymerization catalyst is coated on a support, **•3 J3- a step of heating, ring-opening metathesis polymerization and crosslinking on the support 0 201238992 [Effect of the invention] The thermosetting card sound "丨* of the present invention has mechanical strength and water repellency with a sealing material, a semi-::= hydrocarbon resin, and the like; and the length: tensile fracture strength __ discoloration resistance The film of the present invention is fully described in the following description of the object of the present invention. [Embodiment] [Embodiment of the invention] The thermosetting crosslinked cyclic dilute resin of the present invention is composed of the present invention. The dilute hydrocarbon monomer of the raw material of the second product has a carbon atom The formed cyclic olefinic system and the coating 11 have a compound having a stone anti-carbon double bond. Specific examples thereof are a sulphate: & a monoterpene cyclic olefin, etc. Preferred (4) a cyclic olefin single system', Monomer: a monomer system having a reduced boxene system and a monomer having a reduced olefin ring. Specific examples of the η olefin monomer are a dinosaene, a dicyclopentadiene, a tetra = dicholine, etc. A polar group which may contain a hydrocarbon group such as a carboxyl group, an alkenyl group, a pyridyl group or an aromatic group, or an acid anhydride group, etc., is used as a substituent. Moreover, the rare monosystem includes a double bond of a norbornene ring. Further, it is also possible to have more bonds. From the viewpoint of improving the mold release property of the release film, it is preferred that the S-ene system is non-polar, that is, a lower alkyl group composed only of carbon atoms and hydrogen atoms. Monomers. Specific examples of non-polar lower-case olefinic monomers are dicyclopentadiene, A = pentylene, dihydrodicyclopentadiene (also known as tricyclic [5·2.1·02, 6] non-polar dicyclopentadienes such as 癸8-ene); -8- 201238992 tetracyclic [6.2.1.13,6_02,7]dodec-4-ene, 9-fluorenyltetracyclic [6.2. 1.13,6.02,7]dodec-4-ene, 9-ethyltetracyclo[6.2.1.13,6.02,7] 4-ene, 9-cyclohexyltetracyclo[6.2.1.13,6.02,7]dodec-4-ene, 9-cyclopentyltetracyclo[6.2. 1.13,6. 〇2,7]12- 4 - alkene, 9 fluorene-methylenetetracyclo[6.2.1.1.13,6.22,7] 1,4--4-ene, 9-ethylenetetracyclo[6.2.1.1.13,6.22,7] Di-4-, 9-vinyltetracyclo[6 .2. .1.13,6. 〇2,7] dode-4--4-ene, 9-propenyltetracyclo[6 .2. .1.13,6. 〇2,7] dodeca-4-ene, 9-cyclohexenyltetracyclo[6.2.1.1.13,6. 02,7] dec-~-4-ene, 9-cyclopentenyltetracycline [6 .2, .1.13,6. 〇2,7]12-4-divalent, 9-phenyltetracyclo[6·: 2.1. 13,6.02,7] non-polar four of 1,4-ene Cyclododecene; 2-norbornene, i-mercapto-2-northene, 5-ethyl-2-lowene, 5-butyl-2-northene, 5-hexyl-2- Decalene, 5-mercapto-2-lowerene, 5-cyclohexyl-2-norbornene, 5-cyclopentyl-2-norrene: alkene, 5-ethylidene-2-norrene , 5-vinyl-2-norboxene, 5-propenyl-2-norkenene, 5-cyclohexenyl-2-northene, 5-cyclopentenyl-2-norbornene, 5- Phenyl-2-northene Four 瓖 [9.2.1.02, 10.03, 8] fourteen-3,5,7,12-tetraene (also known as 1,4-methylene-1,4,4 mad, 9 8-tetrahydro-911 - s), tetracyclo [10.2.1.02, 11.04, 9] fifteen-4,6,8,13-tetraene (also known as 1,4-indolyl-l,4,4a,9,9a, Non-polar decenes such as 10-hexahydroindole; pentacyclic [6.5.1.1 3, 6.02, 7.09, 13] fifteen-4,10-diene, pentacyclic [9.2.1.14, 7.02, 10.03, 8] Fifteen-5,12-diene, hexagonal [6.6.1.13, 6.110, 13.02, 7.09, 14] hepta-4-ene or the like, a pentacyclic or higher non-polar cyclic olefin or the like. -9 - 201238992 From the point of view of the non-polar lower-case olefinic single system non-polar: which is easy to obtain and has good susceptibility to the film, the tetracycline is more selective, and the non-polarity is better: Pentacene and non-polar dicyclopentadienes. Phenene oxime system non-polar 葙 葙 [ [6.2.^6.02,7]12_9-浠+ Specific examples are four rings [6.2丄! 3,6.〇2,7]12_9_lean ester, tetracyclic, /j butyl-y cloth-4_sterol, forty-two-9-thin|capric acid, tetracyclic [6 2 Li36 diacidic acid, tetracycline [6·2" 13,6 〇2,7] twelve _9·field one·9-lean _4,5_ 5_lowering woman-2-acid acid vinegar, 2• Methyl _5 • drop, acid-lowering needle, acid 5 - sputum suspicion 9 Αe ─ 2 - retinoic acid methyl ester, vinegar 5 _ drop ... alcohol, 5 - drop ... alcohol, and so on, 2, acetyl I is thinner and more oxidized than the state: the ring-ring side is a specific example of cyclobutene, cyclopentene, and % octene 'cyclododecene. 5 division ...^ ^ 肀 肀 olefins and such substituents with substituents. These (a) cyclic dilute hydrocarbon single systems may be used alone or in combination of two or more. use. The amount of the mononuclear cyclic olefin to be added is preferably 40% by mass or less, and more preferably 2% by mass or less based on the total amount of the (4) cyclic thin tobacco monomer. When the amount of the monocyclic cyclic olefin to be added is 40% by mass or less, the heat resistance of the obtained heat-reducing parent-linked oxime hydrocarbon resin composition and the thermosetting crosslinked cyclic olefin resin film becomes sufficient. (a) a cyclic olefin monomer, (b) [a crosslinking agent having two or more polymerizable unsaturated bonds in addition to the (a)), and (c) a half-life temperature of 1 3 5 to 200 °. The organic peroxide-based thermal polymerization initiator of C and (d) the ring-opening-10-201238992 metathesis polymerization catalyst polymerizable composition' is heated to open core metathesis polymerization and cross-linking. (d) A ring-opening metathesis polymerization catalyst is a ring-opening metathesis polymerization of (a) a cyclic olefinic monomer. The polymerization catalyst is not limited to a specific catalyst. A complex compound in which an ion, an atom, a polyatomic ion, and/or a compound are bonded in plural by a transition metal atom can be used as the (d) ring-opening metathesis polymerization catalyst. The atomic systems of Groups 5, 6 and 8 (long-period periodic table, the same below) are used as transition metal atoms. The atomic system of each group is not particularly limited, but a preferred group 5 atomic system button, a preferred group of atomic molybdenum, a crane, and a preferred group 8 atomic system are hungry. The compound (d) ring-opening metathesis polymerization catalyst system ruthenium carbon-carbonate complex carbon-carbon-dif compound is excellent in catalytic activity at the time of bulk polymerization, and can obtain a small amount of residual unreacted monomer. Cross-linked ring-shaped returning smoke ^ Preferred (d) ring-opening metathesis polymerization catalyst series 8 group of cockroaches, moths

錯合物。 釘碳歸錯合物的具體例 的式(1)或式(2)所示的Complex compound. Specific examples of the nail carbon-derived compound are represented by formula (1) or formula (2)

⑵ (1) 201238992 式⑴及⑺中,R^R2係各自獨立表 鹵素原子或可含有齒素原子、氧原子、氮原子、〜、 磷原子或矽原子的環狀或鏈狀之碳數u的二、子: 及X2係各自獨立,表示任意的陰離子性配位子。土。^ x L2係各自獨立’表示中性電子供予性化合物。'及 :2係可互相鍵結’含有雜原子,也可形成脂肪族二: 香族環。再者 ’Ri、R'Xl、x2、LiL、C 組合,互相鍵結而形成多座螯合化配位子。 壬思之 本發明中的雜原子相期表⑽及_ 雜原子的具體例係氮原子( # s 硫原子⑻、珅原子(As)…Γ ()、破原子(p)、 # 原子(Se)等。從碳缔化合物 牲疋•之觀點來看,較佳的雜原子係N、〇、 特佳的雜原子係N。 及 中性電子供予性化合物係大 烯化合物與盆它的中性電子徂工 刀為3雜原子的碳 的活性之性化合物。從聚合觸媒 :觀點來看,較佳的中性電子供予性化合物係含 的兩側Γ:稀化合物:較佳為雜原子鱗接鍵結於碳稀碳 子斑复3雜原子的被烯化合物’更佳為包含碳烯碳原 C!的雜原子而形成雜環之含雜原子的碳讳化合 基。…碳鄰接的雜原子,較佳為具有體積大的取代 式ut之含雜原子的碳歸化合物之具體例,係以下 式(4)所示之化合物 的 -12- 201238992(2) (1) 201238992 In the formulae (1) and (7), R^R2 is a ring-shaped or chain-like carbon number which is independently a halogen atom or may contain a dentate atom, an oxygen atom, a nitrogen atom, a ~, a phosphorus atom or a ruthenium atom. The second and sub-X2 lines are independent of each other and represent any anionic ligand. earth. ^ x L2 are each independently 'representing a neutral electron-donating compound. 'And : 2 series can be bonded to each other' containing a hetero atom, or an aliphatic two: an aromatic ring. Further, 'Ri, R'Xl, x2, LiL, and C are combined to form a plurality of chelating ligands. The hetero atom phase table (10) and the specific examples of the hetero atom in the present invention are nitrogen atoms (# s sulfur atom (8), germanium atom (As) ... Γ (), broken atom (p), # atom (Se From the viewpoint of the carbon-bonding compound, the preferred hetero atom system N, ruthenium, a particularly good hetero atom system N, and the neutral electron-donating compound are a macroene compound and a potted medium. The electron knives are active compounds of carbon having 3 hetero atoms. From the viewpoint of polymerization catalyst: a preferred neutral electron-donating compound contains two sides of a ruthenium: a dilute compound: preferably a miscellaneous The olefinic compound bonded to the carbon-carbon carbon plaque complex 3 hetero atom is more preferably a hetero atom-containing carbon ruthenium group containing a hetero atom of a carbene carbonogen C! A specific example of a hetero atom having a bulky substituted ut containing a hetero atom, which is a compound represented by the following formula (4), -12-201238992

σσ

(3) ⑷ 式(3)及式(4)中,R3〜R6係各自獨立表示,氫原子、 鹵素原子或可含有鹵素原子、氧原子、氮原子、硫原子、 鱗原子或矽原子之環狀或鏈狀的碳數 1〜20個之烴基。 R3〜R6亦可以任意之組合,互相鍵結而形成環。 前述式(3)或式(4)所示的化合物之具體例,係1,3-二菜基咪唑啶-2-亞基、1,3-二(1-金剛烷基)咪唑啶-2-亞 基、1-¾己基-3-苐基°米。坐σ定-2-亞基、1,3-二某基八鼠苯 并咪唑-2-亞基、1,3-二異丙基-4-咪唑啉-2-亞基、1,3-二 (1-苯基乙基)-4-咪唑啉-2-亞基、1,3-二莱基-2,3-二氫苯 并咪唑-2-亞基等。 除了前述式(3)或式(4)所示的化合物,還可使用 1,3,4-三苯基-2,3,4,5-四氫-111-1,2,4-三唑-5-亞基、1,3-二環己基六氫嘧啶-2-亞基、Ν,Ν,Ν’,Ν’-四異丙基亞甲 脒、1,3,4-三苯基-4,5-二氫-1Η-1,2,4-三唑-5-亞基、 3-(2,6-二異丙基苯基)-2,3-二氫噻唑-2-亞基等之含雜原 子的碳烯化合物。 -13- 201238992 含雜原子的碳烯化合物以外之中性 物,在已自t心金屬 :子供予性化合 子。該中性雷+供芊疋八有中性的電荷之配位 二類、醚類、赌類,、膦類、硫喊類二胺: 性電子:iL: 硫氰酸酯類等。較佳” ’生電子仏予性化合物係膦類 性電子供予性化合物係三燒基鱗。 更佳的中 以前=Γ(2)中’陰離子(陰離子)性配… ; 立子屬原子拉開時,是具有負電荷的配 位子’其具體例為氟原子(F)、氣原子(ci)i原子(βγ)' 碘原子⑴等的鹵素原子、二酮化物基、取代環戊二烯基、 烷氧基、芳氧基、羧基等。較佳的陰離子性配位子係函 素原子’更佳的配位子係氣原子。 前述式⑴中,X、L2互相鍵結合而形成多座整合 化配位子的釕碳烯錯合物之例,係下式(5)所示的希夫 (Schiff)鹼配位錯合物。(3) (4) In the formulae (3) and (4), R3 to R6 each independently represent a hydrogen atom, a halogen atom or a ring which may contain a halogen atom, an oxygen atom, a nitrogen atom, a sulfur atom, a scale atom or a ruthenium atom. A hydrocarbon group having 1 to 20 carbon atoms in the form of a chain or a chain. R3 to R6 may be arbitrarily combined and bonded to each other to form a ring. Specific examples of the compound represented by the above formula (3) or formula (4) are 1,3-dicotyl imidazolidin-2-ylidene, 1,3-bis(1-adamantyl)imidazolidin-2 - Subunit, 1-3⁄4 hexyl-3-indenyl. Sitting sigma-2-ylidene, 1,3-diyl octa Benzimidazole-2-ylidene, 1,3-diisopropyl-4-imidazolin-2-ylidene, 1,3- Bis(1-phenylethyl)-4-imidazolin-2-ylidene, 1,3-dilyl-2,3-dihydrobenzimidazole-2-ylidene and the like. In addition to the compound represented by the above formula (3) or formula (4), 1,3,4-triphenyl-2,3,4,5-tetrahydro-111-1,2,4-triazole can also be used. -5-subunit, 1,3-dicyclohexylhexahydropyrimidin-2-ylidene, oxime, oxime, Ν', Ν'-tetraisopropylmethylene guanidine, 1,3,4-triphenyl- 4,5-Dihydro-1Η-1,2,4-triazole-5-ylidene, 3-(2,6-diisopropylphenyl)-2,3-dihydrothiazole-2-ylidene A hetero atom-containing carbene compound. -13- 201238992 An intermediate other than a carbene compound containing a hetero atom, which has been supplied from a t-heart metal: a sub-combination zygote. The neutral thunder + supply 有 eight neutral charge coordination type II, ethers, gambling, phosphine, sulfur shunt diamine: Sexual electrons: iL: thiocyanate. Preferably, the 'electron-producing compound is a phosphine-based electron-donating compound which is a tribasin-based scale. More preferably, the former is = an anion (anion) in the ruthenium (2); In the case of a negatively charged ligand, a specific example thereof is a halogen atom such as a fluorine atom (F), a gas atom (ci) i atom (βγ), an iodine atom (1), a diketonate group, or a substituted cyclopentadiene. a preferred alkoxy ligand, a aryloxy group, a carboxyl group, etc. a preferred anionic ligand, a cyclin atom, a more preferred ligand gas atom. In the above formula (1), X and L2 are bonded to each other to form a plurality of An example of the indene carbene complex of the integrated ligand is a Schiff base coordination complex represented by the following formula (5).

-14- .201238992 式(5)中’ Z表示氧原子、硫原子、碼原子、NR12、 PR1 2或AsR1 2 ’ R12係與R1及r2所例示者相同。 式(5)中,R7〜R9係各自獨立,表示氫原子、鹵素原 子或可含有雜原子的1價有機基。可含有雜原子的1價 有機基之具體例,係碳數1〜2〇的烷基、碳數2〜20的稀 基、奴數2〜20的炔基、芳基、碳數1〜20的烧氧基、碳 數2〜20的烯氧基、碳數2〜20的炔氧基、芳氧基、碳數 1〜8的烷硫基、碳數ido的羰氧基、碳數1〜2〇的烷氧 数基、碳數1〜20的烷基磺醯基、碳數uo的烷基亞續 醯基、碳數1〜20的烷基磺酸基、芳基磺酸基、碳數卜汕 的膦酸基、芳基膦酸基、碳數丨〜川的烷基銨基、芳基銨 基等。 此等可含有雜原子的1 也可互相鍵結而形成環。取 基、碳數1〜1 〇的烷ϋ且、v 1價有機基亦可具有取代基,-14- .201238992 In the formula (5), "Z" represents an oxygen atom, a sulfur atom, a code atom, NR12, PR1 2 or AsR1 2 ' R12 is the same as those exemplified for R1 and r2. In the formula (5), R7 to R9 are each independently a hydrogen atom, a halogen atom or a monovalent organic group which may contain a hetero atom. Specific examples of the monovalent organic group which may contain a hetero atom are an alkyl group having 1 to 2 carbon atoms, a dilute group having 2 to 20 carbon atoms, an alkynyl group having 2 to 20 slave numbers, an aryl group, and a carbon number of 1 to 20 An alkoxy group, an alkenyloxy group having 2 to 20 carbon atoms, an alkynyloxy group having 2 to 20 carbon atoms, an aryloxy group, an alkylthio group having 1 to 8 carbon atoms, a carbonyloxy group having a carbon number of ido, and a carbon number of 1. a 2 〇 alkoxy group, an alkylsulfonyl group having 1 to 20 carbon atoms, an alkyl sulfonium group having a carbon number uo, an alkylsulfonic acid group having 1 to 20 carbon atoms, an arylsulfonic acid group, A phosphonic acid group, an arylphosphonic acid group, an alkylammonium group having a carbon number of 川~, an aryl ammonium group, and the like. These 1 which may contain a hetero atom may also be bonded to each other to form a ring. The alkyl group having a carbon number of 1 to 1 Å and the v 1 -valent organic group may have a substituent.

1〜20的烷基、碳數2〜20 表示氫原子、碳數 的烯基或雜芳基,此等基可An alkyl group of 1 to 20 and a carbon number of 2 to 20 represent a hydrogen atom, a carbon number of an alkenyl group or a heteroaryl group, and these groups may be used.

一菜基-4-咪唑琳亞基)(3· 201238992 本基·1Η -節-1-亞基)(r搭p * 士 丞)(—裱己基膦)釕二氯化物、(ι,3-二 基如米唾咬-2-亞基)(3_甲基_2_ 丁稀]亞基)(三環戊基 膦)釕二氣化物、亞苯基 叶 ^ 土 基)(三環己基膦)釕二氣化物—::_八虱本并喃°坐_2_亞 氯化物、亞本基[1,3-二(1-苯基乙 ^ ''坐啉_2_亞基](二環己基膦)釕二氣化物、亞笨義 (1丨二菜基-2,3·二氫苯并°米唾·2-亞基)(三環己基膦 Γ '亞苯基(三環己基膦)(三苯基_2,3,4,5_四 111-1,2,4-三唑-5-亞基)舒二氯化物、(1,3_二異丙基六 氫嘧定2-亞基)(乙氧基亞甲基三環己基膦)釕二氣化 物、亞本基(1,3-二菜基_4-咪唾咬_2_亞基)η比咬釘二氯化 物、(1,3-二某基_4_咪唑啶_2亞基)(2_苯基亞乙基κ三環 =基膦)釕二氣化物、(1,3_二菜基_4·咪唑啉_2_亞基⑽· 本基亞乙基)(三環己基膦)釕二氯化物、(1,3二某基·4 5 ^臭_4♦坐琳·2·亞基)[(苯硫基)亞甲基](三環己基膦)釘 一 Kt # ' (1n 基 _4’5_二漠 _4_味 D坐琳 _2_亞基)(2、 咯啶酮小基亞曱基)(三環己基膦)釕二氣化物等之含雜 原子的碳烯化合物及"生電子供予性化合 結的釕錯合物化合物; 個鍵 亞苯基雙(三環己基膦)釕二氣化物、(3_甲基·2_ 丁烯 亞基)雙(二環戊基膦)釕二氯化物等之2個中性電子供 予性化合物鍵結的釕錯合物化合物; " =基雙(1,3_二環己基如米口坐咬I亞基)釕二氣化 等=基雙(1,3-二異丙基一米…亞基)舒二氣化 物寺之2個含雜原石炭稀化合物鍵結的在了錯合物化合 -16- 201238992 位子合?等…鍵結而形成多座8合化配A dish of 4-imidazolinyl) (3·201238992 Benji·1Η-section-1-ylidene) (r-p* 士丞)(—裱hexylphosphine)钌 dichloride, (ι,3- Dibasic, such as rice, sulphate, 2-ylidene) (3-methyl-2-butylene) subunit) (tricyclopentylphosphine) quinone dihydrate, phenylene leaf ^ soil base) (tricyclohexylphosphine) ) 钌二化化—::_八虱本和喃°2_2chloride, subunit [1,3-bis(1-phenylethyl]''sopromaline_2_subunit] Dicyclohexylphosphine) bismuth hydride, sub-succinct (1 丨 菜 -2,3 · dihydrobenzo-m-sodium 2-pyryl) (tricyclohexylphosphine Γ 'phenylene (tricyclic) Hexylphosphine) (triphenyl-2,3,4,5-tetra-111-1,2,4-triazole-5-ylidene) dichloride, (1,3-diisopropylhexahydropyrimidine) Derived 2-substrate) (ethoxymethylenetricyclohexylphosphine) ruthenium dimerate, subunit (1,3-difenyl -4-4-salt bite_2_subunit) Dichloride, (1,3-diyl-4-imidazolidinium-2-ylidene) (2-phenylethylidene κ-tricyclo-ylphosphine) ruthenium dihydrate, (1,3-didecyl) _4·Imidazoline_2_Subunit (10)· Benzoethylene)(tricyclohexylphosphine)phosphonium dichloride, (1,3二基基·4 5 ^臭_4♦坐琳·2·subunit)[(phenylthio)methylene](tricyclohexylphosphine) nail-Kt # ' (1n base_4'5_二漠_4_味D sitting on the _2_subunit) (2, pyridone ketone sulfhydryl) (tricyclohexylphosphine) ruthenium dihydride and other hetero atom-containing carbene compounds and " Preselectively combined ruthenium complex compound; phenylene bis(tricyclohexylphosphine) ruthenium dimerate, (3_methyl.2_butene subunit) bis(dicyclopentylphosphine) ruthenium a ruthenium complex compound in which two neutral electron donor compounds such as chloride are bonded; " = bis (1,3-dicyclohexyl such as rice mouth bit I subunit) 钌 two gasification, etc. The base of the double (1,3-diisopropyl one meter...subunit) Shu two gasification temple of the two kinds of heterogeneous carboniferous compound bonding in the complex compound-16 - 201238992 seat combination? Forming a plurality of 8-integrated

R 曱基式^中’ MeS表示架基°汉7及r8各自為氮原子或 梅工. 者為甲基。Rl3及R〗4係各自獨立,表示氫 ⑻ 俨古掩/' 、子或可含有雜原子的1價有機基。再者,Γΐ 斤、’、與在式(5)的說明中之上述R7〜R9相同者。 架基-4^'式(2)所示的錯合物化合物之具體例,係(1,3_二 二急# ^唑啶_2_亞基)(苯基亞乙烯基)(三環己基膦)釕 -2-亞茂v二(f二丁基亞乙烯基)(1,3_二異丙基-4-咪唑啉 咪唑啉〇厂%戊基膦)釕二氣化物、雙d,3·二環己基_4_ 亞基)苯基亞乙烯基釕二氣化物等。 4圭的錯合物化合物 _ 1個作為阶伤工 係以刚返式(1)表示,而且具有 ^配位子的前述式(3)或(4)所示之化合物。 第U 9釘5;炭烯錯合物係可藉由在⑷〇r 一,测年 表頁、(b)Tetrahedr〇n. Lett.,1999 年,第 40 巷,2247頁、(c)國際公M。 方法來製造 A開第2003/062253號等所記載的 201238992 (d)開環複分解聚合觸媒的使用量,以((d)開環複a 解聚合觸媒中的金屬原子:(a)環狀烯烴單體)之莫耳比 通常為 1:2,000 〜1:2,00〇,〇〇〇,較佳為1:5,〇〇〇〜1:1,()()()〇(^ ’更佳為1:10,000〜1:500,000的範圍。藉由使(〇})開環複 分解聚合觸媒的量對(a)環狀烯烴單體的莫耳比成為 1/2,000,000以上,可得到充分的聚合反應率,可防止聚 合物中單體殘留,或交聯聚合物的交聯度降低,或所得 之熱硬化性交聯環狀烯烴樹脂組成物及熱硬化性交聯環 狀稀烴樹脂薄膜的耐熱性降低。藉由使(d)開環複分解聚 合觸媒的量對(a)環狀烯烴單體的莫耳比成為1/2,〇〇〇以 下,可減低製造成本,而且藉由抑制反應速度的過快, 使後述的塊狀聚合時之熱硬化性交聯環狀烯烴樹脂薄膜R 曱 式 ^ ' MeS represents the shelf base ° Han 7 and r8 are each a nitrogen atom or a plum. The methyl group. Rl3 and R are 4 independently, and represent hydrogen (8), or a monovalent organic group which may contain a hetero atom. Further, the amount of Γΐ, ', is the same as the above-mentioned R7 to R9 in the description of the formula (5). Specific examples of the complex compound represented by the formula -4^' (2) are (1,3-dioxax#oxazolidin-2-yylidene) (phenylvinylidene) (tricyclic) Hexylphosphine) indole-2-ylidene v bis(f dibutylvinylidene) (1,3-diisopropyl-4-imidazolinium imidazolinium hydrazine plant pentylphosphine) bismuth hydride, double d , 3·dicyclohexyl_4_subunit) phenylvinylidene quinone dihydrate. The compound of the formula (3) or (4) which is represented by the formula (3) and has a ligand. U 9 nail 5; carbon olefin complex system can be obtained by (4) 〇r one, dating page, (b) Tetrahedr〇n. Lett., 1999, 40th lane, 2247 pages, (c) international Public M. The method is used to produce the amount of the 201238992 (d) ring-opening metathesis polymerization catalyst described in A. 2003/062253, etc., ((d) ring opening complex a metal atom in the polymerization catalyst: (a) ring The molar ratio of the olefin monomer is usually 1:2,000 to 1:2,00 Å, 〇〇〇, preferably 1:5, 〇〇〇~1:1, ()()()〇(^ It is more preferably in the range of 1:10,000 to 1:500,000. By making the amount of the (开) ring-opening metathesis polymerization catalyst to (a) the molar ratio of the cyclic olefin monomer to 1/2,000,000 or more, A sufficient polymerization rate can prevent the monomer remaining in the polymer, or the crosslinking degree of the crosslinked polymer is lowered, or the obtained thermosetting crosslinked cyclic olefin resin composition and the thermosetting crosslinked cyclic thin hydrocarbon resin film The heat resistance is lowered. By making the amount of (d) ring-opening metathesis polymerization catalyst to 1/2 of the (a) cyclic olefin monomer, the production cost can be reduced, and by The reaction rate is suppressed to be too fast, and the thermosetting crosslinked cyclic olefin resin film in the bulk polymerization described later is used.

容易成形。 N 以控制聚合活性、提高聚合反應率為目,(d)開環複 分解聚合觸媒可與活性劑(辅觸媒)併用。活性劑的具體 例係鋁、釩、錫、矽的烷基化物、_化物、烷氧基化物 及芳氧基化物等。活性劑的更具體例係三烷氧基鋁、三 苯氧基鋁、二烷氧基烷基鋁、烷氧基二烷基鋁、三烷基 鋁、氣化二烷氧基鋁、氣化烷氧基烷基鋁、氯化二烷基 專的紹化合物;三烧氧基銃等的銃化合物;四烧氧基 鈦等的鈦化合物;四烷基錫、四烷氧基錫等的錫化合物; 四烧氧基錯等的錯化合物;二甲基單IU夕院、二甲基二 氣矽烷、二苯基二氯矽烷、四氯矽烷、雙環庚烯基曱基 一氣矽烷、笨基甲基二氯矽烷、二己基二氣矽烷、苯基 一氯碎貌、甲基三氯矽烷等的矽烷化合物等。 201238992 活性劑的使用量,以Gd) pg 屬原子:活性^之莖: 合觸媒中的金 活!·生劑)之莫耳比,通常為1:〇 〇5 為1更佳為1:0.5〜1:1〇的範圍。.圭 環複.分解^ I °活調卽聚合反應速度為目的,⑷開 且體例伟-媒可與聚合調節劑併用。聚合調節劑的 八體例係二笨基膦、三 苯基膦基)甲γ、14^ 雙(二 基膦基)戊“㈣化!本基膦基)丁烧、雙(二苯 此等的使用趟、酉旨、猜等的路易士驗等。 用$,相對於1莫耳的\ & 媒,通常為〇〇1 50莖且? 複分解聚合觸 .1〜50莫耳,較佳為0.05〜1〇莫耳。 硬化Π:::: Γ化性交聯環㈣煙樹脂組成物及熱 更狀稀烴樹脂薄膜之製造方法令,可採用容 液♦口法、塊狀聚合法中的任一 …爺 / 的步驟,在鱼聚A的同拄 ,攸不需要溶劑去除 組成物之觀來:、二到成形為薄臈形狀的樹脂 〃來看,較佳為採用塊狀聚合法。 方法,聯環狀婦烴樹脂纽成物之製造 以外,具有、⑻〔除了該⑷ 鐘半衰期溫度4 135 聯劑〕、(c)1分 始劑及⑷開環複分解聚二:有::氧化物系熱聚合起 劑之存在下,加熱、開環複分解聚合及 造方:,:::含熱二?…嶋烯烴樹脂薄膜之製 以外,具有2 -、有a)%狀烯烴單體、(b)〔除了該⑷ 以上聚合性不飽和鍵的交聯劑〕、(c)1分 201238992 鐘半衰期溫度為135〜20(TC的有機過氧化物系熱聚合起 始劑及(d)開環複分解聚合觸媒之聚合性組成物,在視需 要而使用的添加劑之存在下,加熱、開環複分解聚合及 交聯,而成形為薄膜形狀之步驟。 兹認為(a)環狀烯烴單體係被開環複分解聚合,而得 到環狀烯烴聚合物,更者,該環狀烯烴聚合物係在開環 複分解聚合後或與開環複分解聚合的同時,被交聯而得 到交聯環狀烯烴聚合物。 環狀烯烴聚合物、熱硬化性交聯環狀烯烴樹脂組成 物及熱硬化性交聯環狀烯烴樹脂薄膜的三次元交聯構造 係藉由對於1,2 -二氯苯中的溶解性來確認。將環狀稀烴 聚合物在23 C浸潰於1,2-二氯苯中24小時,將以8〇網 目的金屬網過慮所得之溶液時之聚合物的不溶份之質 量,除以原本過濾前的聚合物之質量而求得之交聯度, 較佳為70質量%以上,更佳為8〇質量%以上,尤佳為 8 5質量%以上。藉由為7 0質量%以上,可得到更良好的 财熱性與機械強度,而可抑制未交聯成分所造成的基 板、模具、加壓裝置等之污染。 本發明的熱硬化性交聯環狀烯烴樹脂組成物之原料 的聚合性組成物,係含有(b)具有2個以上聚合性不飽和 鍵的交聯劑。該交聯劑的具體例係季戊四醇二(曱基)丙 烯酸酯、1,6-己二醇二(甲基)丙烯酸酯、1>2_乙二醇二(甲 基)丙烯酸酯、1,12-十二烷二醇二(甲基)丙烯酸酯、聚乙 二醇二(甲基)丙烯酸酯、聚丙二醇二(曱基)丙烯酸酯 '新 戊二醇二(甲基)丙烯酸酯、三環癸烷二甲醇二(甲基)丙稀 -20- 201238992Easy to shape. N is used to control the polymerization activity and increase the polymerization rate. (d) The ring-opening metathesis polymerization catalyst may be used in combination with an active agent (auxiliary catalyst). Specific examples of the active agent are alkyl, amide, alkoxylate and aryloxy compounds of aluminum, vanadium, tin and antimony. More specific examples of the active agent are trialkoxy aluminum, triphenyloxy aluminum, dialkoxy aluminum alkyl, alkoxydialkyl aluminum, trialkyl aluminum, vaporized dialkoxy aluminum, gasification Alkoxyalkylaluminum, a dialkyl chloride-specific compound; a ruthenium compound such as trisodium oxyhydroxide; a titanium compound such as tetra-oxygenated titanium; or a tin such as tetraalkyltin or tetraalkoxide a compound; a compound of tetra-oxygenoxy group; dimethyl mono IU Xi, dimethyl dioxane, diphenyl dichlorodecane, tetrachloro decane, bicycloheptenyl fluorenyl monooxane, stupid base a decane compound such as chlorodichlorosilane, dihexyldioxane, phenylmonochloride, methyltrichloromethane or the like. 201238992 The amount of active agent used, Gd) pg is an atom: the stem of the activity ^: the gold in the catalyst! The molar ratio of the greening agent is usually 1: 〇 〇 5 is 1 and more preferably 1: 0.5 to 1:1 。. . 圭 环 复. Decomposition ^ I ° 卽 卽 polymerization rate for the purpose, (4) open and the system can be used together with polymerization regulators. The eight types of polymerization regulators are diphenylphosphine, triphenylphosphino), gamma, 14^bis(diylphosphino)penta-(tetra), phenylphosphino), butadiene, bis(diphenyl, etc.) Use the 路, 酉, guess, etc. Louis test. Use $, relative to 1 mole of \ & media, usually 〇〇1 50 stem and ? metathesis polymerization touch. 1~50 m, preferably 0.05~1〇莫耳. Hardened Π:::: Γ 性 交 ( 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 四 ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ ♦ In any of the steps of the fish, it is preferable to use a block polymerization method in view of the fact that the fish does not require a solvent to remove the composition: The method has the following steps: (8) [except for the (4) half-life temperature 4 135 crosslinking agent], (c) 1 minute starting agent, and (4) open-loop metathesis poly 2: with: oxidation In the presence of a thermal polymerization initiator, heating, ring-opening metathesis polymerization, and eliminator:,::: a system containing a heat-containing olefin resin film, 2 -, a) % olefin monomer, (b) [crosslinker of (4) or more polymerizable unsaturated bond], (c) 1 minute 201238992 half-life temperature 135~20 (TC organic peroxide a polymerizable thermal polymerization initiator and (d) a polymerizable composition of a ring-opening metathesis polymerization catalyst, which is formed into a film shape by heating, ring-opening metathesis polymerization, and crosslinking in the presence of an additive used as needed It is considered that (a) the cyclic olefin single system is subjected to ring-opening metathesis polymerization to obtain a cyclic olefin polymer, and more preferably, the cyclic olefin polymer is subjected to ring-opening metathesis polymerization or ring-opening metathesis polymerization. At the same time, crosslinked to obtain a crosslinked cyclic olefin polymer. The three-dimensional crosslinked structure of the cyclic olefin polymer, the thermosetting crosslinked cyclic olefin resin composition and the thermosetting crosslinked cyclic olefin resin film is It was confirmed for the solubility in 1,2-dichlorobenzene. The cyclic dilute polymer was immersed in 1,2-dichlorobenzene at 23 C for 24 hours, and the metal mesh of 8 〇 mesh was used for consideration. The mass of the insoluble portion of the polymer in solution, divided by the original The degree of crosslinking determined by the mass of the former polymer is preferably 70% by mass or more, more preferably 8% by mass or more, and particularly preferably 5% by mass or more. By 70% by mass or more, More favorable heat and mechanical strength can be obtained, and contamination of the substrate, the mold, the pressurizing device, and the like by the uncrosslinked component can be suppressed. The polymerizable composition of the raw material of the thermosetting crosslinked cyclic olefin resin composition of the present invention The material contains (b) a crosslinking agent having two or more polymerizable unsaturated bonds. Specific examples of the crosslinking agent are pentaerythritol bis(indenyl) acrylate and 1,6-hexanediol di(methyl). Acrylate, 1> 2_ethylene glycol di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol II (Mercapto) acrylate 'neopentyl glycol di(meth) acrylate, tricyclodecane dimethanol di(methyl) propylene-20 - 201238992

Ss_S曰、二赵甲基丙烷三(甲基)丙烯酸酯、雙三羥甲基丙 烷二(甲基)丙烯酸酯、季戊四醇三(甲基)丙烯酸酯、季戊 四醇四(甲基)丙烯酸酯'二季戊四醇六(曱基)丙烯酸酯等 之具有2個以上聚合性不飽和鍵的(甲基)丙烯酸酯等。 可使用1種或2種以上的具有聚合性不飽和鍵之交 聯劑。 相對於100質量份的(a)環狀烯烴單體,〔除了該 (a)以外,具有2個以上聚合性不飽和鍵的交聯劑〕之含 里為0.7〜40質篁份,較佳為】〜3〇質量份,更佳為2〜2〇 質量份’尤佳為4〜10質量份。⑻〔除了該⑷以外,具 有2個以上聚合性不飽和鍵的交聯劑〕之含量若過少, 則熱硬化性交聯環狀烯烴樹脂薄膜之加熱前後的脫模 性、撥水性及咼溫耐變色性係降低。另一方面,除 了省(a)以外,具有2個以上聚合性不飽和鍵的交聯劑〕 之含量若過多,則無法將聚合性組成物製膜。 本發明的熱硬化性交聯環狀烯烴樹脂組成物之原料 的聚合性組成物,係含有(c)1分鐘半衰期溫度為135〜2〇〇 C的有機過氧化物系熱聚合起始劑。該熱聚合起始劑的 具體例係1,6-雙(第三丁基過氧幾氧基)己&、13_雙以 三丁基過氧異丙基)苯等。 可使用1種或2種以上的丨分鐘半衰期溫度為 13 5〜200°C的有機過氧化物系熱聚合起始劑。 ^相對於1〇〇質量份的(a)環狀烯烴單體,(c)1分鐘半 衰期溫度為135〜200。(:的有機過氧化物系熱聚合起始劑 之含量為^545質量份,較佳為i 5〜1〇質量份,更佳 201238992 為2〜8質量份。(c)1分鐘半衰期溫度為135〜2〇〇t>c的有 機過氧化物系熱聚合起始劑之含量若過少,則熱硬化性 交聯環狀烯烴樹脂薄膜之加熱前後的脫模性、機械強 度、撥水性及高溫耐變色性係降低,亦有無法將聚合性 組成物聚合之虞。另一方面,(c)1分鐘半衰期溫度為 135〜200°C的有機過氧化物系熱聚合起始劑之含量若過 多’則有無法將聚合性組成物聚合之虞。 。 再者’有機過氧化物系熱聚合起始劑的(分鐘 期溫度若低於135。。’則有無法將聚合性組成物聚合: 虞。 將符合各種用途、目的之薄膜的特性改質、 :、成形作業性之改善等作為目的,在本發明 2聯環狀烯烴樹脂組成物之原料的聚合性組成物中可 3有各種添加劑。如此之添加劑的具體例係 填充材、消泡劑、發泡劑、著綠 ' ::化劑、阻燃劑、濕潤劑、分散劑、脫模滑劑…先 劑等。為了提高交聯環狀稀烴 可塑 ^ , 取D物的耐久性及侔左— 疋性,較佳為含有抗氧化劑與光安定劑。 ’、女 抗氧化劑的具體例係對苯酿、甲苯職 類;氫醌、對第三丁基兒茶酚、2,5_二不醌,的醌 的氫醌類;二第三丁基·對甲酚:氫醌單:I基氫醌等 料的齡類;環烧酸銅或辛烯酸銅等的銅蜂土鍵、焦梧 基卞基銨、馬來酸三曱基苄基録、* 虱化二甲 Γ級銨鹽類;艇二肪或甲基乙基酮聘等的=錄等 基胺鹽酸鹽或二丁基胺鹽酸晓 肟頰;三乙 I專的胺鹽酸鹽類。此等抗 -22- 201238992 氧化劑的種類及旦 時之機械特性、f係可按照交聯環狀烯烴聚合物的高溫 來適宜選擇。專犋形成作業性、保存安定性等之條件 的相溶性高,=佳為㈣,因為與交聯環狀炼烴聚合物 定性。抗氧化#丨焱 溽犋的耐久性及保存安 1ΛΛ * 可為1種類或併用複數而使用。相對 於f量份的(a)環狀稀烴單體,抗氡化劑的使用量通 常為0.001〜10質量份。 光安定劑的具體可舉出受阻胺光安定劑(HALS)化 合物。爻阻胺光安定劑化合物的具體例是4 -經基 -2,2,6,6-四甲基哌啶、卜烯丙基_4_羥基_2,2,6,6_四曱基哌 啶、1-苄基-4-羥基_2,2,6,6_四曱基哌啶、i_(4_第三丁基 -2-丁烯基)-4-羥基-2,2,6,6_四曱基哌啶、4_硬脂醯氧基 -2,2,6,6-四曱基哌啶、1_乙基-4-水楊醯氧基_2,2,6,6_四甲 基°底啶、4 -甲基丙烯醯氧基_ 1,2,2,6,6 -五曱基哌啶、 1,2,2,6,6-五甲基哌啶_4•基- β(3,5-二-第三丁基_4_羥基苯 基)-丙酸酯、1-苄基-2,2,6,6-四甲基-4-哌啶基馬來酸化物 (maleinate)、(二 _2,2,6,6-四曱基哌啶-4-基)-己二酸酯、 (二-2,2,6,6-四曱基哌啶-4-基)-癸二酸酯、(二四 曱基-2,6-二乙基-呢。定-4-基)-癸二酸g旨、(二_ι_烯丙基 -2,2,6,6-四甲基-哌啶-4-基)-苯二甲酸酯、卜乙醯基 -2,2,6,6-四甲基0底咬-4-基-乙醯酯、偏笨三酸-三 -(2,2,6,6-四甲基派咬-4 -基)酯、1-丙晞醯基_4_苄氧基 -2,2,6,6-四曱基哌啶、二丁基-丙二酸-:-(12,2,6,6 -五曱 基-哌啶-4-基)-酯、二苄基-丙二酸- :-(12,3,6-四甲基 -2,6-二乙基-哌啶-4-基)_酯、二曱基-雙_(2,2,6,6-四甲基 -23- 201238992 哌啶-4-氧基)-矽烷、三_(1_ 基)-亞填酸酯、三仆丙基·2,2f6 6_,2’6’6·四甲基^定_4-酸酯、N,N,-雙-(2,2,6,6 ’ 7 基旅咬·4-基 二乙酿胺、乙酿基_4例二定'4妨六亞甲基],6- 派咬、4·节基胺基-2 2 6 /乙隨胺⑷,6,6-四甲基 ? ^ ^ ^ ,2,6,6·四甲基哌啶、N,N,-雙 -(2,2,6,6 -四甲基哌啶-4_基 _ ◎,-雙-(2,2,6’6-四甲基0辰咬^其一丁基'己二醯胺、 幻其系κ、 χτχ 疋基MM,-二環己基-(2· ΪΓΛ ΓΓΓ^ I 7甲乙基),基切从五曱基旅 ;λ7[ν"Γ;7'1,2,2^ :Μ (,,6,6,曱基…-基州 交聯=::=安定劑化合物的種類及量,係可按照 等丄:件來:物的向溫時之機械特性、保存安定性 4之條件來適宜選擇。枋π 數而蚀田“丄 氧化刻係可為1種類或併用複 相對於100質量份的⑷環狀稀烴單體,受阻 月女先女定劑化合物的使Η通常為〇._〜㈣量份。 填充材的具體你丨彳系石々I Λ ^ ^ 彳係矽石矽砂、玻璃粉、碳酸鈣、 氣氧化銘t氧化鎂、黏土等的無機填充材;木粉、聚 =珠、聚苯乙烯珠等的有機填充材。填充材係提高交聯 裒狀烯焱斌合物的收縮率、彈性率、導熱率、導電性等 的物性。 填充材的粒徑'形狀、縱橫比、品級等之等級係按 ”、、交U銥狀烯烴聚合物的物性來適宜決定。相對於1 〇 〇 -24- 201238992 質量的(a)環狀烯烴單體,此等填充材的使用量較佳為 5〜400質量份,更佳為10〜300質量份。 脫模滑劑的具體例係聚矽氧油、硬脂酸鋅等。脫模 滑劑係改良薄膜的成形性、脫模性、處理性等,對薄膜 賦予潤滑劑特性等之機能。相對於1 〇〇質量的(a)環狀稀 烴單體,脫模滑劑的使用量較佳為〇. ^200質量份。 將含有(a)環狀烯烴單體、(b)〔除了該(a)以外,具 有2個以上聚合性不飽和鍵的交聯劑〕、(c) 1分鐘半衰期 溫度為135〜200°C的有機過氧化物系熱聚合起始劑及(d) 開環複分解聚合觸媒之聚合性組成物,在視需要而使用 的添加劑之存在下,加熱、開環複分解聚合及交聯。(d) 開%複分解聚合觸媒係按照需要可溶解或懸浮在少量的 惰性溶劑中使用。該溶劑的具體例係正戊烷 '正己烷、 庚燒、流動石蝶、礦油精等的鏈狀脂肪族烴;環戊烧、 %己烷、甲基環己烷、二甲基環己烷、三曱基環己烷、 =基%己烷、二乙基環己烷、十氫萘、二環庚烷、三環 :烷/、氫茚、環辛烷等的脂環式烴;苯、曱苯、二曱 =等的芳香族烴;茚、四氫萘等之具有脂環與芳香環的 2 n硝基甲烷、硝基苯、乙腈等之含氮烴;二乙醚、四 " 等之3氧煙專。較佳的溶劑係芳香族烴、脂肪族 & 长式烴,及具有脂環與芳香環的烴。亦可使用不 衣啜刀解聚合觸媒之活性降低的液狀之老化防止劑 或可塑劑當作溶劑。 , 有(a)^狀烯烴單體、(b)〔除了該(a)以外,具有2 11¾ yJs上聚八^ α δ性不飽和鍵的交聯劑〕、(c)1分鐘半衰期溫度 -25- 201238992 為1 3 5〜2 0 0 C的有機過氧化物系熱聚合起始劑、(d)開環 複分解聚合觸媒及視需要使用的添加劑之聚合性組成物 在室溫下的黏度’係亦取決於所欲的薄膜之厚度,但通 常為3〜3 0,000Pa · s ’較佳為5~500Pa · s。上述組成物 的黏度係藉由(a)環狀烯烴單體、(b)〔除了該(a)以外, 具有2個以上聚合性不飽和鍵的交聯劑〕、(c) 1分鐘半衰 期溫度為135~200°C的有機過氧化物系熱聚合起始劑及 (d)開環複分解聚合觸媒之種類及使用量來調整。 將上述聚合性組成物加熱’進行塊狀聚合及交聯, 可製造本發明的熱硬化性交聯環狀烯煙樹脂組成物。製 造本發明的熱硬化性交聯環狀烯烴樹脂薄膜之方法的具 體例’係將上述聚合性組成物洗注或塗布在支撲體上, 進行加熱、塊狀聚合及交聯之方法,將上述聚合性組成 物在模内加熱、塊狀聚合及交聯之方法等。將上述聚合 性組成物澆注或塗布在支撐體上’進行加熱、塊狀聚合 及交聯之方法,由於可連續製造薄且均勻的薄膜而更佳。 可選擇樹脂、玻璃、金屬等一般已知的素材當作上 述支撐體。樹脂的具體例係聚對苯二甲酸乙二醋、聚蔡 二曱酸乙二酯、聚碳酸酯、聚芳酯等的聚酯;聚丙烯、 聚乙稀荨的聚烯經;尼龍等的聚酿胺;聚四I乙烯等的 氟樹脂;較佳為取得容易的聚酯。若材料為金屬或樹脂, 則支撐體的較佳形狀係圓筒或帶。較佳的支撐體係取\寻 容易且便宜的樹脂薄膜。 將上述聚合性組成物塗布到支撐體上之方法係沒有 特別的限制。該方法的具體例係噴塗法、浸塗法、觀塗 法、簾幕塗布法、模口塗布法、縫塗法等。 -26- 201238992 將上述聚合性組成物按照需要加熱至(d)開環複八 解聚合觸媒展現活性的溫度為止以進行塊狀聚a n 聯。聚合及交聯時的溫度通常為0〜250°C,較佳為、 ^υ〜2〇〇 °C。上述聚合性組成物的加熱方法係沒有特別的限_ 該加熱方法的具體例係在加熱板上加熱之方法,係m 1之用衝 壓機一邊進行加壓,一邊加熱(熱M)之方法,藉由 屯匕加 熱的輥推壓之方法’使用加熱爐之方法等。聚合Λ ^ 時的反應時間係可按照聚合觸媒的量、有機過氧化物系 熱聚合起始劑的添加量及加熱溫度等來適宜決定,、 通常 為1分鐘〜24小時。 將上述聚合性組成物加熱,藉由(c)丨分鐘半衰期% 度為135〜200°C的有機過氧化物系熱聚合起始劑使(b)〔 除了該(a)以外,具有2個以上聚合性不飽和鍵的交聯劑 〕交聯反應。交聯反應係在開環複分解聚合後或與開環 複分解聚合同時地進行。交聯反應溫度必須與開環複分 解聚合觸媒展現活性的溫度、必需與⑷開環複分解聚合 觸媒的添加量、有機過氧化物系熱聚合起始劑展現活性 的咖度、有機過氧化物系熱聚合起始劑的添加量等相關 吁而。又疋通常為130〜250〇C,較佳為15〇〜230〇C。加熱 時間係沒有特別的限制’通常為數分鐘〜數小時。 =上述聚合性組成物的加熱方法係沒有特別的限制。 :加熱方法的具體例係有加熱板上加熱之方法,使用衝 埶機邊進订加壓,-邊加熱(熱壓)之方法,藉由已加 ’、、、的輥推壓之方法’使用加熱爐之方法等。 -27- 201238992 作為使上述聚合性組成物進行交聯反應之方法,除 了添加有機過氧化物系熱聚合起始劑,進行加熱之方 法,其它可舉出(A)添加習知的重氮化合物、非極性自由 基產生劑等的自由基產生劑,進行加熱之方法;(B)對已 加有習知的光聚合起始劑之組成物,照射光或電子射線 而使聚合及交聯反應之方法等,此等亦可與添加有機過 氧化物系熱聚合起始劑而進行加熱之方法併用。 環狀烯烴聚合物亦藉由交聯性環狀烯烴單體進行交 聯父聯係在聚合後或與聚合同時地進行。與聚合同時 地進行之交聯係更佳,因為能以更少的步驟而在工業上 有利地得到本發明的熱硬化性交聯環狀烯烴樹脂薄膜。 又,此處所言的「同時地」,就是指藉由一步驟的加熱來 進行開環複分解聚合反應及交聯反應,依照開環複分 解聚合觸媒活性化的溫度及(c)丨分鐘半衰期溫度為 1 3 5〜200 °C的有機過氧化物系熱聚合起始劑活性化的溫 度而可考慮到以下的情況,即(i)先發生開環複分解聚合 反應’其後繼續發生父聯反應的情況,(i i)先發生交聯反 應,其後繼續發生開環複分解聚合反應的情況,(丨丨丨)幾 乎同時發生開環複分解聚合反應與交聯反應的情況,係 皆包含於「同時.地」的概念。 具有2個以上碳·碳雙鍵的(a)環狀烯烴單體係作為 (A)之方法所用的交聯性單體使用。該環狀烯烴單體具體 例係二環戊二烯、三環戊二烯。可藉由交聯性單體的使 用量及聚合時的加熱溫度來控制交聯密度。交聯性單體 的使用量,由於按照薄膜的用途其適當交聯密度為各式 -28- 201238992 限定 量中 。交聯性單體的較佳使用量, 的交聯性單體之比例計為 各樣,故沒有特別的 以環狀稀煙單體全 〇·1〜100莫耳%。 其匕父聯方法的具體例 光或電子射線,在聚合後進 存在的塊㈣合及交聯,較佳為在氧及水的不 f下,:。該塊狀聚合及交聯方法的具體例為:⑴於 氮乳、虱氣等的惰性氣體 方法,& τ料塊狀聚合及交聯之 );真空下進行塊狀聚合及 脂薄膜等覆蓋塗布於支Μ… 法(3)以樹 狀離 、牙體上的上述組成物,在密閉的 塊狀聚合及交聯之方法。該樹脂薄膜的具體 =:述支樓體所例示者。若於氧或水的存在下進 4丁塊狀聚合及交聯,目l| %彡Θ Μ 、斤侍之薄膜的表面被氧化,會有 難以發揮所欲的脫模性能之狀況。 本發明的勃^硬化j生办 性又聯J衣狀烯烴樹脂薄膜之厚度, =照用途而適當值為各式各樣,故沒有特別的限 二:通常為0.5〜5,000μπι’從處理性之觀點來看,較佳 灼二I度為5〜“O’。本發明的熱硬化性交聯環狀烯烴 曰,、膜之表面係可為平滑,也可經由麼紋加工 凹凸形狀。 取 亦可利用氣相反應、塗覆、真空蒸鍍、離子鍍、濺 CVD、無電解鍍敷等習知的表面處理技術,將包含 有機物、無機物、金屬等之異種素材的層形成在本發明 的熱硬化性交聯環狀烯烴樹脂組成物及熱硬化性交聯環 -29- 201238992 狀烯烴樹脂薄膜之表面上。例如,於薄膜表面層上設置 包含Si〇2、MgF2、氟樹脂等之提高脫模性的素材的薄 膜,以氟氣、CF系前驅物進行表面處理,亦可將薄膜表 面氟化] 隹於本發明的熱硬化性交聯環狀烯烴樹脂薄 膜,即使不進行氟化,也可提高脫模性。 最後於本發明的熱硬化性交聯環狀烯烴樹脂組成 物中,較佳的上述(a)環狀烯烴單體係降箱烯系單體。較 佳的上述(b)〔除了該⑷以外,具有2個以上聚合性不飽 和鍵的交聯劑〕係具有2個以上聚合性不飽和鍵的(甲基) 丙烯酸Sa。較佳的上述(d)開環複分解聚合觸媒係釕碳烯 錯合物。 烯烴樹脂 單體係降 具有2個 上聚合性 環複分解 狀烯烴樹 單體係降 具有2個 上聚合性 環複分解 組成物 萡烯系 以上聚 不飽和 聚合觸 脂薄膜 葙烯系 以上聚 不飽和 聚合觸 又’於本發明的熱硬化性交聯環狀 之製造方法中,較佳的上述(&)環狀烯烴 單體’較佳的上述(b)〔除了該(a)以外, 合性不飽和鍵的交聯劑〕係具有2個以 鍵的(甲基)丙烯酸酯,較佳的上述(d)開 媒係釘^稀錯合物。 另外,於本發明的熱硬化性交聯環 之製造方法中,較佳的上述(&)環狀烯烴 單體’較佳的上述(b)〔除了該(a)以外, 合性不飽和鍵的交聯劑〕係具有2個以 鍵的(甲基)丙烯酸酯,較佳的上述(d)開 媒係旬碳稀錯合物。 ' 3 〇 - 201238992 [實施例] 以下’藉由實施例及比較例來更具體說明本發明, 隹本啦月係不党此等實施例所限定。實施例及比較例中 的份及%,只要沒有特別預先指明,則以質量為基準。 各種物性係如下述地測定。 (1) 熱硬化性交聯環狀烯烴樹脂薄膜之水接觸角 使用全自動接觸角計(協和表面科學(股)製 DM-70 1),使用離子交換水當作溶劑,滴下〇 6pL(〇 6微 升)的液滴’以Θ/2法來解析被衝裁成5〇ninix50mm的樹 脂薄膜之水接觸角《水接觸角愈大,撥水性愈高。 (2) 熱硬化性交聯環狀烯烴樹脂薄膜之拉伸特性 依據JIS K687 1來測定熱硬化性交聯環狀烯烴樹脂 薄膜的拉伸斷裂伸長度及拉伸斷裂強度。薄膜的拉伸斷 裂伸長度愈大,金屬模型的密閉性愈高,而可抑制密封 樹脂的毛邊之生成。薄膜的拉伸斷裂強度愈大,薄膜愈 不易破裂,而可抑制密封樹脂的洩漏。 (3) 熱硬化性交聯環狀烯烴樹脂薄膜之對半固化片剝離 力 將被衝裁成300mmx300mm的印刷基板積層用半固 化片(Panasonic電工(股)製FR_4 R1661(G)GB型)之兩 面,以各實施例或比較例的脫模薄膜夾住,插入真空衝 壓機中,在1 .OMPa、18〇。(:下加熱硬化7〇分鐘後,冷卻 至4(TC,自真空衝壓機中取出所得之試料。自該試料切 出25mmxl50mm的試驗片,依照JIS κ 6854_2測定18〇 度剝離力。將該剝離力當作初期對半固化片剝離力。 -3 1- 201238992 將自真空壓機取出的试料保存在9 5 °C的烘箱中3 日,自該試料切出2 5 m m X 1 5 0 m m的試驗片,依照j I s κ 6 8 5 4 - 2測定1 8 0度剝離力。將該剝離力當作加熱後對半 固化片剝離力。對半固化片剝離力愈小.,脫模性愈高。 (4)熱硬化性交聯環狀烯烴樹脂薄膜之加熱後變色 將被衝裁成50mmxl5 0mm的樹脂薄膜保存在95。〇 的烘箱中3日後取出,使用Konica-Minolta Sensing(股) 製色彩色差計CR-400來測定所取出的薄膜之色差。值愈 小,高溫耐變色性愈高。 實施例1〜1 3及比較例1〜1 5 將表1及表2所示之質量的具有2個以上聚合性不 飽和鍵的交聯劑、安定劑溶解在含有92.6質量%的二環 戊二烯及7.4質量%的5 -乙基-2 -降花烯之降花稀系單體 混合液中,得到反應原液。接著,將表丨及表2所示之 質量的具有式(7)的構造之釕觸媒、有機過氧化物系熱聚 合起始劑添加到上述反應原液中,以流動混合器(Line Mixer)進行混合,在25°C塗布於厚度0.075mm的聚對苯 二甲酸乙二酯製載體薄膜上,進行流延製膜,接著立刻 自塗布層之上’積層另行準備的上述同樣之載體薄膜。 然後’以200°C進行3分間加熱,而使進行開環複分解 聚合及交聯,得到樹脂薄膜。 表1及表2中顯示結果。 -32- 201238992Ss_S曰, diozomethylpropane tri(meth)acrylate, ditrimethylolpropane di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate dipentaerythritol (Meth) acrylate having two or more polymerizable unsaturated bonds, such as acrylate. One type or two or more types of crosslinking agents having a polymerizable unsaturated bond can be used. With respect to 100 parts by mass of the (a) cyclic olefin monomer, [in addition to the (a), the crosslinking agent having two or more polymerizable unsaturated bonds] is preferably 0.7 to 40 parts by mass, preferably It is 〜3〇 parts by mass, more preferably 2~2〇 parts by mass, and particularly preferably 4 to 10 parts by mass. (8) When the content of the crosslinking agent having two or more polymerizable unsaturated bonds other than the above (4) is too small, the mold release property, water repellency, and temperature resistance of the thermosetting crosslinked cyclic olefin resin film before and after heating are high. The discoloration is reduced. On the other hand, if the content of the crosslinking agent having two or more polymerizable unsaturated bonds is excessive in addition to the above (a), the polymerizable composition cannot be formed into a film. The polymerizable composition of the raw material of the thermosetting crosslinked cyclic olefin resin composition of the present invention contains (c) an organic peroxide-based thermal polymerization initiator having a one-minute half-life temperature of 135 to 2 〇〇 C. Specific examples of the thermal polymerization initiator are 1,6-bis(t-butylperoxyoxy)hexane, 13-bis-tributylperoxyisopropyl)benzene and the like. One type or two or more types of organic peroxide-based thermal polymerization initiators having a half-life temperature of from 135 to 200 ° C can be used. ^ (c) The one-minute half-life temperature is 135 to 200 with respect to 1 part by mass of the (a) cyclic olefin monomer. The content of the organic peroxide-based thermal polymerization initiator is 545 parts by mass, preferably i 5 to 1 part by mass, more preferably 2 to 8 parts by mass of 201238992. (c) 1 minute half-life temperature is When the content of the organic peroxide-based thermal polymerization initiator of 135 to 2〇〇t>c is too small, the mold release property, mechanical strength, water repellency, and high temperature resistance of the thermosetting crosslinked cyclic olefin resin film before and after heating are increased. The discoloration property is lowered, and there is also a possibility that the polymerizable composition cannot be polymerized. On the other hand, (c) if the content of the organic peroxide-based thermal polymerization initiator having a one-minute half-life temperature of 135 to 200 ° C is excessive ' There is a possibility that the polymerizable composition cannot be polymerized. Further, the organic peroxide-based thermal polymerization initiator (the minute temperature is lower than 135°) may not polymerize the polymerizable composition: 虞. For the purpose of improving the properties of the film for various purposes and purposes, and the improvement of the moldability, the polymerizable composition of the raw material of the bicyclic olefin resin composition of the present invention may have various additives. Specific examples of additives Materials, defoamers, foaming agents, greening agents, flame retardants, wetting agents, dispersants, mold release agents, etc. In order to improve the cross-linking of cyclic hydrocarbons, take D The durability of the material and the left-twisting property are preferably antioxidants and light stabilizers. ', specific examples of female antioxidants are benzene, toluene; hydroquinone, p-tert-butylcatechol , 2,5_二醌, the hydrazine hydroquinone; di-tert-butyl-p-cresol: hydroquinone: I-based hydroquinone and other ages; ring-sintered copper or octenoate Copper bee soil bond, pyroyl guanidinium ammonium, trimethyl benzyl maleate, * dimethylated dimethyl sulfonium salt; kedi or methyl ethyl ketone Acid salt or dibutylamine chlorhexidine hydrochloride; triethylamine I amine hydrochloride. These anti--22- 201238992 oxidant species and mechanical properties at maturity, f system can be cross-linked cyclic olefin polymer The high temperature is suitable for selection. The compatibility of the conditions for the formation of workability, preservation stability, etc. is high, = good (four), because it is qualitative with the cross-linked cyclic smelting polymer. Antioxidant #丨焱溽The durability and the storage stability can be used in one type or in combination. The amount of the anti-tanking agent is usually 0.001 to 10 parts by mass based on the amount of the (a) cyclic dilute hydrocarbon monomer. Specific examples of the stabilizer include a hindered amine light stabilizer (HALS) compound. Specific examples of the guanidine-resistant amine stabilizer are 4-thio-2,2,6,6-tetramethylpiperidine and cumene. Base_4_hydroxy-2,2,6,6-tetradecylpiperidine, 1-benzyl-4-hydroxy-2,2,6,6-tetradecylpiperidine, i_(4_third 2-butenyl)-4-hydroxy-2,2,6,6-tetradecylpiperidine, 4-stearyloxy-2,2,6,6-tetradecylpiperidine, 1 _Ethyl-4-salicylideneoxy-2,2,6,6-tetramethyl stilbene, 4-methylpropenyloxy_ 1,2,2,6,6-pentamethylpiper Pyridine, 1,2,2,6,6-pentamethylpiperidine _4•yl-β(3,5-di-t-butyl-4-yl-hydroxyphenyl)-propionate, 1-benzyl -2,2,6,6-tetramethyl-4-piperidinyl maleate (maleinate), (di-2,2,6,6-tetradecylpiperidin-4-yl)-hexane Acid ester, (di-2,2,6,6-tetradecylpiperidin-4-yl)-sebacate, (ditetradecyl-2,6-diethyl-?). D--4-yl)-sebacic acid g, (di-I-Allyl-2,2,6,6-tetramethyl-piperidin-4-yl)-phthalate, Mercapto-2,2,6,6-tetramethyl 0 bottom bit-4-yl-acetamidine, trimenic acid-tris-(2,2,6,6-tetramethyl-bite-4 - Ester, 1-propenyl 4- 4-benzyloxy-2,2,6,6-tetramethylpiperidine, dibutyl-malonic acid-:-(12,2,6,6- Pentadecyl-piperidin-4-yl)-ester, dibenzyl-malonic acid-:-(12,3,6-tetramethyl-2,6-diethyl-piperidin-4-yl) _ ester, dimercapto-bis-(2,2,6,6-tetramethyl-23- 201238992 piperidin-4-yloxy)-nonane, tri-(1_yl)-sub-allate, three servants Propyl·2,2f6 6_,2'6'6·Tetramethyl- _4-ester, N,N,-bis-(2,2,6,6 ' 7 base brigade ·4-base two Ethylamine, ethyl ketone _4 cases of two fixed '4 hexamethylene], 6-bite, 4 · arylamino-2 2 6 / ethane with amine (4), 6,6-tetramethyl? ^ ^ ^ , 2,6,6·tetramethylpiperidine, N,N,-bis-(2,2,6,6-tetramethylpiperidine-4_yl_ ◎,-bis-(2, 2,6'6-tetramethyl 0 Chen bite ^1 butyl 'hexamethylenediamine, phantom κ, χτχ 疋 MM,-dicyclohexyl-(2· ΪΓΛ ΓΓΓ^ I 7 methyl ethyl), Quiche from Wuyi Brigade; λ7[ν"Γ;7'1,2,2^ :Μ (,,6,6,曱基...-Kizhou cross-linking =::= The type and amount of stabilizer compound can be equal to : The parts are: the conditions of the mechanical properties of the temperature and the stability of the storage 4 are suitable for selection. 枋 π number and the etch field "丄 丄 刻 can be 1 type or combined with 100 parts by mass (4) ring Dilute hydrocarbon monomer, the hindrance of the female first female formula compound is usually 〇._~(4) parts. The specific material of the filler is 丨彳石々I Λ ^ ^ 彳 矽 矽 、 、 、 、 、 Inorganic fillers such as calcium carbonate, gas oxidized magnesium oxide, clay, etc.; organic fillers such as wood powder, poly-beads, polystyrene beads, etc. Filling materials improve the shrinkage of cross-linked bismuth bismuth bismuth Physical properties such as elastic modulus, thermal conductivity, and electrical conductivity. The particle size of the filler, such as the shape, the aspect ratio, and the grade, are appropriately determined according to the physical properties of the U-shaped olefin polymer. 〇〇-24- 201238992 A mass of the (a) cyclic olefin monomer, and the filler is preferably used in an amount of 5 to 400 parts by mass, more preferably 10 to 300 parts by mass. Specific examples of the release agent are polyoxygenated oil, zinc stearate, etc. The release agent is a function of improving the formability, mold release property, and handleability of the film, and imparting a lubricant property to the film. 1 〇〇 mass of (a) cyclic dilute hydrocarbon monomer, the amount of the release slip agent is preferably 〇. ^ 200 parts by mass. (a) a cyclic olefin monomer, (b) [a crosslinking agent having two or more polymerizable unsaturated bonds in addition to the (a)), and (c) a one-minute half-life temperature of 135 to 200 ° C The organic peroxide-based thermal polymerization initiator and (d) the polymerizable composition of the ring-opening metathesis polymerization catalyst are heated, ring-opened metathesis polymerization, and crosslinked in the presence of an additive used as needed. (d) The open % metathesis polymerization catalyst may be dissolved or suspended in a small amount of an inert solvent as needed. Specific examples of the solvent are chain aliphatic hydrocarbons such as n-pentane 'n-hexane, heptane, flowing stone butterfly, mineral oil, etc.; cyclopentene, % hexane, methylcyclohexane, dimethylcyclohexane An alicyclic hydrocarbon such as an alkane, a trimethylcyclohexane, a decyl hexane, a diethylcyclohexane, a decahydronaphthalene, a dicycloheptane, a tricyclo: alkane, a hydroquinone or a cyclooctane; An aromatic hydrocarbon such as benzene, toluene or dioxane; a nitrogen-containing hydrocarbon such as 2 n-nitromethane, nitrobenzene or acetonitrile having an alicyclic ring and an aromatic ring such as anthracene or tetrahydronaphthalene; diethyl ether, tetra "; etc. 3 oxygen smoke special. Preferred solvents are aromatic hydrocarbons, aliphatic & long hydrocarbons, and hydrocarbons having an alicyclic and aromatic ring. A liquid aging preventive agent or a plasticizer which is reduced in the activity of the polymerization catalyst can be used as a solvent. , (a) olefin monomer, (b) [crosslinker having 2 113⁄4 yJs on the poly -8 δ unsaturated bond in addition to the (a)], (c) 1 minute half-life temperature - 25- 201238992 The viscosity of a polymerizable composition of an organic peroxide-based thermal polymerization initiator of 1 3 5 to 2 0 0 C, (d) a ring-opening metathesis polymerization catalyst, and an additive as needed, at room temperature The 'system is also dependent on the thickness of the desired film, but is usually from 3 to 30,000 Pa·s', preferably from 5 to 500 Pa·s. The viscosity of the above composition is (a) a cyclic olefin monomer, (b) a crosslinking agent having two or more polymerizable unsaturated bonds in addition to the (a), and (c) a one minute half-life temperature. It is adjusted by the type and amount of the organic peroxide-based thermal polymerization initiator of 135 to 200 ° C and (d) the ring-opening metathesis polymerization catalyst. The thermosetting crosslinked cyclic olefin resin composition of the present invention can be produced by heating the above polymerizable composition to carry out bulk polymerization and crosslinking. A specific example of the method for producing the thermosetting crosslinked cyclic olefin resin film of the present invention is a method in which the above polymerizable composition is washed or applied onto a baffle body, and heating, bulk polymerization, and crosslinking are carried out. A method in which a polymerizable composition is heated in a mold, a bulk polymerization, and a crosslinking. The method of casting or coating the above polymerizable composition on a support is carried out by heating, bulk polymerization, and crosslinking, and it is more preferable because a thin and uniform film can be continuously produced. A generally known material such as resin, glass, or metal can be selected as the above support. Specific examples of the resin are polyesters such as polyethylene terephthalate, polyethylene terephthalate, polycarbonate, polyarylate, polypropylene, polypropylene, polyene, nylon, etc. A styrene; a fluororesin such as polytetraethylene or the like; preferably a polyester which is easy to obtain. If the material is metal or resin, the preferred shape of the support is a cylinder or a belt. A preferred support system is to find an easy and inexpensive resin film. The method of applying the above polymerizable composition to the support is not particularly limited. Specific examples of the method are a spray coating method, a dip coating method, a coating method, a curtain coating method, a die coating method, a slit coating method, and the like. -26-201238992 The above polymerizable composition is heated as needed until the temperature at which (d) the ring-opening complex catalyst exhibits activity is carried out to carry out bulk aggregation. The temperature at the time of polymerization and crosslinking is usually from 0 to 250 ° C, preferably from υ to 2 ° ° C. The heating method of the above polymerizable composition is not particularly limited. The specific example of the heating method is a method of heating on a hot plate, and the method of heating (heat M) while pressurizing the press using m 1 is performed. A method of using a heating furnace by a method of pushing a heated roller. The reaction time at the time of polymerization Λ ^ can be appropriately determined depending on the amount of the polymerization catalyst, the amount of the organic peroxide-based thermal polymerization initiator added, the heating temperature, and the like, and is usually from 1 minute to 24 hours. The polymerizable composition is heated to have (b) an organic peroxide-based thermal polymerization initiator having a half-life of 135 to 200 ° C, and (b) (in addition to the (a), two The crosslinking agent of the above polymerizable unsaturated bond] is crosslinked. The crosslinking reaction is carried out after ring-opening metathesis polymerization or simultaneously with ring-opening metathesis polymerization. The crosslinking reaction temperature must be attained with the temperature at which the ring-opening metathesis polymerization catalyst exhibits activity, and (4) the amount of the ring-opening metathesis polymerization catalyst added, the organic peroxide-based thermal polymerization initiator exhibiting activity, and the organic peroxide. The amount of the thermal polymerization initiator added is related. Further, it is usually 130 to 250 ° C, preferably 15 to 230 ° C. The heating time is not particularly limited, and is usually from several minutes to several hours. = The heating method of the above polymerizable composition is not particularly limited. Specific examples of the heating method include a method of heating on a hot plate, a pressurization using a punching machine, and a method of heating (hot pressing) by means of a roll having been applied with ',, and '. A method using a heating furnace or the like. -27-201238992 As a method of crosslinking the above-mentioned polymerizable composition, a method of heating by adding an organic peroxide-based thermal polymerization initiator is mentioned, and (A) adding a conventional diazonium compound a method of heating a radical generating agent such as a non-polar radical generating agent; (B) a composition of a conventional photopolymerization initiator, which is irradiated with light or an electron beam to cause polymerization and crosslinking reaction. The method or the like may be used in combination with a method in which an organic peroxide-based thermal polymerization initiator is added and heated. The cyclic olefin polymer is also crosslinked by a crosslinkable cyclic olefin monomer to be carried out after polymerization or simultaneously with polymerization. It is more preferable to carry out the crosslinking at the same time as the polymerization because the thermosetting crosslinked cyclic olefin resin film of the present invention can be industrially advantageously obtained in a smaller number of steps. In addition, the term "simultaneously" as used herein refers to a ring-opening metathesis polymerization reaction and a crosslinking reaction by one-step heating, a temperature at which a catalyst is activated according to a ring-opening metathesis polymerization, and (c) a half-life temperature of 丨 minute. The temperature at which the organic peroxide-based thermal polymerization initiator is activated at 1 3 5 to 200 ° C can be considered in the case where (i) the ring-opening metathesis polymerization occurs first, and then the parent reaction continues to occur. In the case of (ii) the cross-linking reaction occurs first, and then the ring-opening metathesis polymerization reaction continues, and the ring-opening metathesis polymerization reaction and the cross-linking reaction occur at the same time. The concept of "land". The (a) cyclic olefin single system having two or more carbon-carbon double bonds is used as the crosslinkable monomer used in the method of (A). Specific examples of the cyclic olefin monomer are dicyclopentadiene and tricyclopentadiene. The crosslinking density can be controlled by the amount of the crosslinking monomer and the heating temperature at the time of polymerization. The amount of the crosslinkable monomer used is appropriately defined by the amount of the crosslink density according to the use of the film, in the various amounts of -28-201238992. The preferred amount of the crosslinkable monomer and the ratio of the crosslinkable monomer are various, so that it is not particularly limited to 1 to 100 mol% of the ring-shaped flue-cured monomer. The specific example light or electron ray of the method of the father-in-law is formed by the block (4) and cross-linking after the polymerization, preferably under the oxygen and water. Specific examples of the bulk polymerization and crosslinking method are: (1) an inert gas method such as nitrogen emulsion or helium gas, & τ bulk polymerization and crosslinking; and a block polymerization and a lipid film covering under vacuum The method of applying to the support (3) is a method of polymerizing and cross-linking the above-mentioned composition on a tooth in a tree shape in a closed block. The specificity of the resin film =: exemplified by the branch body. When the polymerization and crosslinking are carried out in the presence of oxygen or water, the surface of the film of l | 、 斤 and 侍 侍 is oxidized, and it is difficult to exert the desired release property. The thickness of the urethane-based olefin resin film of the present invention is as follows, and the appropriate values are various according to the use, so there is no particular limitation: usually 0.5 to 5,000 μm. From the viewpoint of the above, it is preferable that the degree of the first degree is 5 to "O'. The thermosetting crosslinked cyclic olefin oxime of the present invention, the surface of the film may be smooth, and the uneven shape may be processed through the ruling. A layer containing a heterogeneous material of an organic substance, an inorganic substance, a metal, or the like can be formed in the heat of the present invention by a conventional surface treatment technique such as gas phase reaction, coating, vacuum evaporation, ion plating, sputtering CVD, electroless plating, or the like. A hardenable crosslinked cyclic olefin resin composition and a surface of a thermosetting crosslinked ring -29-201238992 olefin resin film. For example, an anti-release property including Si〇2, MgF2, fluororesin or the like is provided on the surface layer of the film. The film of the material is surface-treated with a fluorine gas or a CF-based precursor, and the surface of the film may be fluorinated to the thermosetting crosslinked cyclic olefin resin film of the present invention, and the film may be improved without fluorination. Modularity. Finally In the thermosetting crosslinked cyclic olefin resin composition of the present invention, the above-mentioned (a) cyclic olefin single-system lower-case-ene monomer is preferred. (b) above (in addition to the above (4), The cross-linking agent of two or more polymerizable unsaturated bonds is a (meth)acrylic acid Sa having two or more polymerizable unsaturated bonds. Preferably, the above (d) ring-opening metathesis polymerization catalyst ruthenium carbene is misaligned. Olefin resin single system drop with two upper polymerizable cyclic metathesis-like olefin tree single system drop with two upper polymerizable cyclic metathesis compositions terpene-based polyunsaturated polymerized contact grease film decene system above In the method for producing a thermosetting crosslinked ring of the present invention, the above preferred (&) cyclic olefin monomer is preferably (b) above (in addition to the (a) The cross-linking agent of the unsaturated bond has two (meth) acrylates which are bonded, preferably the above (d) open-cell nail-like complex. Further, the thermosetting cross-linking of the present invention In the method for producing a ring, the above (&) cyclic olefin monomer is preferred. Preferably, the above (b) [in addition to the (a), the crosslinker of the unsaturated unsaturated bond] has two (meth) acrylates bonded by a bond, preferably the above (d) opener Carbon thin complex. ' 3 〇 - 201238992 [Examples] Hereinafter, the present invention will be more specifically described by way of Examples and Comparative Examples, which are defined by the examples. Examples and Comparative Examples The parts and % are determined based on the mass unless otherwise specified. (1) The water contact angle of the thermosetting crosslinked cyclic olefin resin film is controlled by a fully automatic contact angle meter (Concord) Surface Science (Unit) DM-70 1), using ion-exchanged water as a solvent, dropping 〇6pL (〇6 μL) of droplets' by Θ/2 method to be processed into a 5〇ninix50mm resin film The contact angle of the water "The greater the water contact angle, the higher the water repellency. (2) Tensile properties of the thermosetting crosslinked cyclic olefin resin film The tensile elongation at break and the tensile breaking strength of the thermosetting crosslinked cyclic olefin resin film were measured in accordance with JIS K687 1. The greater the tensile elongation at break of the film, the higher the airtightness of the metal mold, and the formation of the burrs of the sealing resin can be suppressed. The higher the tensile breaking strength of the film, the more the film is less likely to be broken, and the leakage of the sealing resin can be suppressed. (3) The peeling force of the semi-cured sheet of the thermosetting crosslinked cyclic olefin resin film is punched out into two sides of a prepreg for printed circuit board laminates (FR_4 R1661 (G) GB type manufactured by Panasonic Electric Co., Ltd.) of 300 mm x 300 mm. The release film of the example or the comparative example was clamped and inserted into a vacuum punching machine at 1.0 MPa and 18 Torr. (: After heating and hardening for 7 minutes, it was cooled to 4 (TC, the sample obtained was taken out from the vacuum press machine. The test piece of 25 mm x 150 mm was cut out from this sample, and the peeling force of 18 degree was measured according to JIS κ 6854_2. Force is used as the initial peeling force on the prepreg. -3 1- 201238992 The sample taken out from the vacuum press is stored in an oven at 95 °C for 3 days, and the test of cutting out 25 mm X 150 mm from the sample For the sheet, the peeling force of 180° was measured according to j I s κ 6 8 5 4 - 2. The peeling force was taken as the peeling force to the prepreg after heating. The smaller the peeling force to the prepreg, the higher the mold release property. The thermochromic crosslinked cyclic olefin resin film is heated and discolored. The resin film which has been punched out into a 50 mm x 105 mm film is stored in a 95 〇 oven, and taken out after 3 days, using a Konica-Minolta Sensing (color) color difference meter CR- The color difference of the film taken out was measured by 400. The smaller the value, the higher the high-temperature discoloration resistance. Examples 1 to 1 3 and Comparative Examples 1 to 1 5 Two or more polymerizations of the masses shown in Tables 1 and 2 were obtained. The cross-linking agent and stabilizer of the unsaturated bond are dissolved in a bicyclic ring containing 92.6% by mass. The reaction stock solution was obtained from a mixture of pentadiene and 7.4% by mass of 5-ethyl-2-pyrene in a reduced monomer mixture. Next, the masses shown in Table 2 and Table 2 have the formula (7). The structure of the catalyst, organic peroxide-based thermal polymerization initiator was added to the above reaction stock solution, mixed with a flow mixer (Line Mixer), and applied to a polyacetate having a thickness of 0.075 mm at 25 ° C. On the carrier film made of ethylene glycolate, casting film was formed, and then the same carrier film prepared separately was laminated on the coating layer immediately. Then, 'opening at 200 ° C for 3 minutes to perform ring-opening metathesis Polymerization and crosslinking to obtain a resin film. The results are shown in Tables 1 and 2. -32- 201238992

⑺ 201238992 實施例13 〇 〇 ρ ρ τ-^ ρ ο τ—Η ο (Ν 1 1 〇 Ι—Η CN 〇 VO oo o o g Ο On v〇 CN 實施例12 Ρ 〇 ρ ρ ο Γ"Η ο Ο CN 1 1 1 〇 1 ι> 〇\ S r- <N (Ν in s o o CN 實施例11 ο ο ρ ρ ο 1-Η Ο Ο (Ν 1 1 1 ο 1 1 卜 ρ r—Η »-Η 寸 p o o o Os OO CN 實施例10 ο ο r—Η Ο ο ο ο Η 1 1 1 ο <Ν 1 ί 〇 1 1 1 g w-^ On 令 s o o <N 實施例9 100.0 Ο ρ ρ ρ Ι-Η ο ο 1 1 1 1 1 〇 »ri 1 1 1 to s ON s o o r-J 00 o 實施例8 100.0 ο ^Η ο ο ρ Ο u-i 1 1 1 1 1 〇 tn 1 1 1 CS s 寸 m o o d oo 〇\ d 實施例7 100.0 ρ ρ *—Η ο r*H ο 1 1 1 1 1 ο νί 1 1 1 卜 oo o t-H o 卜 o 1—^ CN d 實施例6 ο ο ρ ρ ρ ο Ο CN 1 1 1 1 1 ο 1 1 1 卜 σ\ s CN o c> o «-Η 卜 o 實施例5 ο ο ρ ρ ρ ρ Ο CN 1 1 1 1 1 ο ο 1 1 1 卜 oo s 寸 d s o s d <N 00 o 實施例4 ο ο ρ »-Η ρ ρ ο Ο CN 1 1 1 1 1 ο 1 1 1 卜 »~Η s ro 卜 αί g o s o fS 〇\ d 實施例3 100.0 ρ 1"Η ο r·^ ο ι—Η ο 1-Η Ο (Ν 1 1 1 1 1 ρ 1 1 1 卜 «-Η 100.9 寸 (Ν QC Ό CN 〇 o d o CN 實施例2 100.0 Ο ο ρ ο Η Ο (Ν 1 1 1 1 ο »ri 1 1 1 1 卜 101.2 m On 寸 s o o o 〇\ 00 o 實施例1 100.0 Ο ο «-Η ο ο Ο (Ν 1 1 1 ο ν*ί 1 1 1 1 1 卜 oo s v〇 cn »—H p o o d «η 寸 fN 降祐烯系單體混合液 安定劑Αυ 安定劑Β2) 安定劑c3) 安定劑D4) 熱聚合起始劑α5) 熱聚合起始劑β6) 熱聚合起始劑c7) 熱聚合起始劑d8) 三甲基丙烷三甲基丙烯酸酯9) 季戊四醇三丙烯酸酯⑼ 二季戊四醇六丙烯酸酯η) 三環癸烷二甲醇二丙烯酸酯ι2) 聚乙二醇#200二丙烯酸酯13) 聚乙二醇#400二丙烯酸酯M) 釕觸媒15) 水接觸角(°) MD拉伸斷裂伸長度(%) MD拉伸斷裂強度(MPa) 初期對半固化片剝離力(N/25mm) 加熱後對半固化片剝離力(N/25mm) 加熱後變色(ΔΕ氺) 塌咳(狄啊拿) -寸ε- 201238992 <Ν< 比較例15 〇 〇 〇 〇 ρ ο 1 1 οο 1 1 1 〇 in 1 1 1 1 1 1 1 1 1 比較例14 〇 〇 〇 〇 ρ ο 1 <Ν 1 1 1 1 〇 iri 1 1 1 卜 1 1 1 1 1 1 比較例13 100.0 ρ 〇 ο ο 1 l 1 1 1 1 1 〇 in o 〇\ m vo to — S 比較例12 100.0 〇 q ο ο 1 1 1 1 1 1 1 1 〇 us 1 卜 o s; SO vd cn uS 躁 g (Ν 比較例11 100.0 〇 ο ο ο 1 1 ! 1 1 1 1 〇 wS 1 1 o (N ON m cs is o 卜 寸· 比較例10 100.0 〇 ο ο ρ ο 1 1 1 1 1 ο u-ϊ 1 1 1 1 1 1 1 1 1 比較例9 〇 〇 〇 ο ο ο ο 1 1 1 1 1 ο uS 1 1 1 o S 寸 〇 比較例8 100.0 〇 ο ο ο (Ν ο 1 1 1 1 1 ο uS 1 1 1 o σ\ Ό JO 钟P 辟 15.10 比較例7 〇 〇 〇 ρ ο ο 1 I 1 1 1 1 ο iri 1 1 1 o uS On 卜 ·!〇 m 比較例6 100.0 〇 ο ρ ρ 1 1 1 1 1 〇 uS 1 1 1 1 σ\ CN 卜 r*^ (N — ο ο 比較例5 100.0 q ο ο ρ 1 1 1 1 ο 1 1 1 1 1 (N 00 O od -L〇 CN (Ν 寸’ 比較例4 100.0 〇 ο ο ο ο (Ν’ 1 1 1 1 1 ο 矣 1 1 1 r^; 1 1 1 1 1 1 比較例3 100.0 〇 ο ρ ο ο (Ν 1 1 1 1 1 ο 1 1 1 i 对 (N 戋 〇〇 CN s Os 比較例2 〇 〇 〇 ρ ρ ο ο CN 1 1 1 1 1 1 1 1 1 r- 卜 ΓΛ V〇 vd 〇 棋 o ci 比較例1 100.0 〇 ρ ρ ρ 1 1 1 1 1 ' 1 1 1 1 1 卜 m C-; in 寸 CN 蒜 ON 降葙烯系單體混合液 安定劑Αυ 安定劑Β2) 安定劑C3) 安定劑D4) 熱聚合起始劑α5) 熱聚合起始劑β6) 熱聚合起始劑c7) 熱聚合起始劑d8) 三甲基丙烷三甲基丙烯酸酯9) :季戊四醇三丙烯酸酯⑼ 二季戊四醇六丙烯酸酯H) 三環癸烷二甲醇二丙烯酸酯|2) 聚乙二醇#200二丙烯酸酯13) 聚乙二醇#400二丙烯酸酯|4) 釕觸媒15) 水接觸角(°) MD拉伸斷裂伸長度(%) MD拉伸斷裂強度(MPa) 初期對半固化片剝離力(N/25mm) 加熱後對半固化片剝離力(N/25mm) 加熱後變色(ΔΕ*) 刼噠(鉍峒甶) -ιηε- 201238992 1) BASF 曰本(股)製 IRGANOX565 2) BASF 曰本(股)製 IRGANOX1010 3) (股)ADEKA 製 ADEKASTAB HP-10 4) BASF 曰本(股)製 TINUVIN770(7) 201238992 Embodiment 13 〇〇ρ ρ τ-^ ρ ο τ—Η ο (Ν 1 1 〇Ι—Η CN 〇VO oo oog Ο On v〇CN Example 12 Ρ 〇ρ ρ ο Γ"Η ο Ο CN 1 1 1 〇1 ι> 〇\ S r- <N (Ν in soo CN Example 11 ο ο ρ ρ ο 1-Η Ο Ο (Ν 1 1 1 ο 1 1 卜ρ r—Η »-Η inch Pooo Os OO CN Embodiment 10 ο ο r Η Ο ο ο ο Η 1 1 1 ο <Ν 1 ί 〇1 1 1 g w-^ On Let soo <N Example 9 100.0 Ο ρ ρ ρ Ι- ο ο ο 1 1 1 1 1 〇»ri 1 1 1 to s ON soo rJ 00 o Example 8 100.0 ο ^Η ο ο ρ Ο ui 1 1 1 1 1 〇tn 1 1 1 CS s inch mood oo 〇\ d Example 7 100.0 ρ ρ * - Η ο r * H ο 1 1 1 1 1 ο νί 1 1 1 oo o tH o 卜 o 1 - ^ CN d Example 6 ο ο ρ ρ ρ ο Ο CN 1 1 1 1 1 ο 1 1 1 卜σ\ s CN o c> o «-Η 卜 o Example 5 ο ο ρ ρ ρ ρ Ο CN 1 1 1 1 1 ο ο 1 1 1 oo s inch dsosd <N 00 o Embodiment 4 ο ο ρ »-Η ρ ρ ο Ο CN 1 1 1 1 1 ο 1 1 1 卜»~Η s ro 卜αί goso fS 〇\d Real Example 3 100.0 ρ 1"Η ο r·^ ο ι—Η ο 1-Η Ο (Ν 1 1 1 1 1 ρ 1 1 1 Bu «-Η 100.9 inch (Ν QC Ό CN 〇odo CN Example 2 100.0 Ο ο ρ ο Η Ο (Ν 1 1 1 1 ο »ri 1 1 1 1 卜 101.2 m On inch sooo 〇\ 00 o Example 1 100.0 Ο ο «-Η ο ο Ο (Ν 1 1 1 ο ν*ί 1 1 1 1 1 oo sv〇cn »—H pood «η inch fN olefinic monomer mixture stabilizer Αυ stabilizer Β 2) stabilizer c3) stabilizer D4) thermal polymerization initiator α5) thermal polymerization Starting agent β6) Thermal polymerization initiator c7) Thermal polymerization initiator d8) Trimethylpropane trimethacrylate 9) Pentaerythritol triacrylate (9) Dipentaerythritol hexaacrylate η) Tricyclodecane dimethanol diacrylate Ester ι2) Polyethylene glycol #200 diacrylate 13) Polyethylene glycol #400 diacrylate M) 钌 Catalyst 15) Water contact angle (°) MD tensile elongation at break (%) MD tensile strength at break (MPa) Initial peeling force on prepreg (N/25mm) Peeling force on prepreg after heating (N/25mm) Discoloration after heating (ΔΕ氺) Cough (Di ah) - inch ε- 201238992 <Ν< Comparative Example 15 〇〇〇〇ρ ο 1 1 οο 1 1 1 〇in 1 1 1 1 1 1 1 1 1 Comparative Example 14 〇〇〇〇ρ ο 1 <Ν 1 1 1 1 〇iri 1 1 1 Bu 1 1 1 1 1 1 Comparative Example 13 100.0 ρ 〇ο ο 1 l 1 1 1 1 1 〇in o 〇\ m vo to — S Comparative Example 12 100.0 〇q ο ο 1 1 1 1 1 1 1 1 〇us 1 os; SO vd cn uS 躁g (Ν Comparative Example 11 100.0 〇ο ο ο 1 1 ! 1 1 1 1 〇wS 1 1 o (N ON m cs is o 卜 寸 · Comparative Example 10 100.0 〇ο ο ρ ο 1 1 1 1 1 ο u-ϊ 1 1 1 1 1 1 1 1 1 Comparative Example 9 〇〇〇ο ο ο ο 1 1 1 1 1 ο uS 1 1 1 o S inch 〇 Comparative Example 8 100.0 〇ο ο ο (Ν ο 1 1 1 1 1 ο uS 1 1 1 o σ\ Ό JO clock P 15.10 Comparative Example 7 〇〇〇ρ ο ο 1 I 1 1 1 1 ο iri 1 1 1 o uS On 卜·!〇m Comparative Example 6 100.0 〇ο ρ ρ 1 1 1 1 1 〇uS 1 1 1 1 σ\ CN 卜r*^ (N - ο ο Comparative Example 5 100.0 q ο ο ρ 1 1 1 1 ο 1 1 1 1 1 (N 00 O od -L〇CN (寸 inch ' Comparative Example 4 100.0 〇ο ο ο ο (Ν' 1 1 1 1 1 ο 矣1 1 1 r^; 1 1 1 1 1 1 Comparative Example 3 100.0 〇ο ρ ο ο (Ν 1 1 1 1 1ο 1 1 1 i Pair (N 戋〇〇CN s Os Comparative Example 2 〇〇〇ρ ρ ο ο CN 1 1 1 1 1 1 1 1 1 r- ΓΛVΓΛvd 〇棋 o ci Comparative Example 1 100.0 〇 ρ ρ ρ 1 1 1 1 1 ' 1 1 1 1 1 卜m C-; in inch CN garlic ON decene-based monomer mixture stabilizer Αυ stabilizer Β 2) stabilizer C3) stabilizer D4) thermal polymerization Starting agent α5) thermal polymerization initiator β6) thermal polymerization initiator c7) thermal polymerization initiator d8) trimethylpropane trimethacrylate 9): pentaerythritol triacrylate (9) dipentaerythritol hexaacrylate H) three Cyclodecane dimethanol diacrylate|2) Polyethylene glycol #200 diacrylate 13) Polyethylene glycol #400 diacrylate|4) Cerium catalyst 15) Water contact angle (°) MD tensile elongation at break Degree (%) MD tensile strength at break (MPa) Initial peeling force on prepreg (N/25mm) Peeling force on prepreg after heating (N/25mm) Discoloration after heating (ΔΕ*) 刼哒(铋峒甶) -ιηε- 201238992 1) BASF 曰本(股)制IRGANOX565 2) BASF 曰本(股)制IRGANOX1010 3) 股KAADEKASTAB HP-10 4) BASF 曰本(股)制TINUVIN770

5) 化藥AKZO(股)製Kayalene 6-70 1分鐘半衰期溫 度 150〇C5) Kayalene 6-70, a chemical AKZO (stock) 1 minute half-life temperature 150 〇C

6) 曰油(股)製Peroyl TCP 1分鐘半衰期溫度92.KC6) Peroyl TCP 1 minute half-life temperature 92.KC

7) 曰油(股)製Nyper E 1分鐘半衰期溫度130°C7) Nyper E 1 min half-life temperature 130 ° C

8) 化藥AKZO(股)製Perkadoxl4R-Gl分鐘半衰期溫 度 185°C8) Chemical AKZO (share) system Perkadoxl4R-Gl minute half-life temperature 185 ° C

9) 共榮社化學(股)製Light Ester TMP9) Light Ester TMP by Gongrongshe Chemical Co., Ltd.

1〇)共榮社化學(股)製 Light Acrylate PE-3A1〇)Chengrongshe Chemical Co., Ltd. Light Acrylate PE-3A

11) 共榮社化學(股)製 Light Acrylate DPE-6A11) Gongrongshe Chemical Co., Ltd. Light Acrylate DPE-6A

12) 新中村化學工業(股)製NK Ester A-DCP 13) 新中村化學工業(股)製nk Ester A-200 14) 新中村化學工業(股)製NK Ester A-400 15) RIMTEC(股)製 VC843 由含有具有2個以上聚合性不飽和鍵的交聯劑及1 匀釦半衰期溫度為1 3 5〜200。(:的有機過氧化物系熱聚合 起始劑之聚合性組成物所得之實施例丨〜丨3的脫模薄獏 之初期脫模性、加熱後脫模性、機械強度 '撥水性及高 溫耐變色性係高。 由不含有具有2個以上聚合性不飽和鍵的交聯劑及 1刀釦半衰期溫度為135〜2〇〇t>c的有機過氧化物系熱聚 合起始劑之聚合性址成物所得之比較W丨的熱硬化性交 -36- 201238992 初期脫模性、加熱後脫 聯環狀烯烴樹脂薄膜之撥水性 模性及馬溫耐變色性係低。 由含有1分鐘丰衰湘、、ra择# 化物系埶咿,恤度為135〜20(TC的有機過氧 ΜΗ ^ ^ ΛΑ - 有具有2個以上聚合性不 飽和鍵的交聯劑之聚合性組成 ^ ^ ω 取物所得之比較例2的熱硬 化性父環狀稀烴樹脂薄膜 m ^ , τ θ溥膜之撥水性、加熱後脫模性及 機械強度係低。 化物m 溫度為135〜贿的有機過氧 物糸…聚&起始劑,但具有2個以上聚合性不飽和鍵 的父聯劑的含量過少之聚合性組成物所得之比較例3的 熱硬化性交聯環狀烯烴樹脂薄瞑之撥水性、初期脫模 性、加熱後脫模性及高溫耐變色性係低。 由含有1分鐘半衰期溫度為135〜20(TC的有機過氧 化物系熱聚合起始劑,但具有2個以上聚合性不飽和鍵 的交聯劑的含量過多之聚合性組成物所得之比較例4的 熱硬化性交聯環狀烯烴樹脂薄膜係脆,無法測定其物性。 由含有具有2個以上聚合性不飽和鍵的交聯劑,但 不3有1分鐘半衰期溫度為135〜2〇〇它的有機過氧化物 系熱聚合起始劑之聚合性組成物所得之比較例5及6的 熱硬化性交聯環狀烯烴樹脂薄膜之撥水性、機械強度、 初期脫模性及加熱後脫模性係低。由含有具有2個以上 聚合性不飽和鍵的交聯劑,但不含有1分鐘半衰期溫度 為135〜20Ot的有機過氧化物系熱聚合起始劑之聚合性 組成物所得之比較例7的熱硬化性交聯環狀稀烴樹脂薄 膜之撥水性、初期脫模性、加熱後脫模性及高溫耐變色 性係低。 -37- 201238992 由二有具有2個以上聚合性不飽和鍵的交聯劑 1为鐘半衰期溫度為135〜20(rc的有機過氧化物系 合起始劑的含量過少之聚合性組成物所得之比較例 9的熱硬化性交聯環狀烯烴樹脂薄膜之撥水性、初 模性、加熱後脫模性及高溫耐變色性係低。 由含有具有2個以上聚合性不飽和鍵的交聯劑 1分鐘半衰期溫度為135〜20(rc的有機過氧化物系 合起始.劑的含量過多之聚合性組成物所得之比較令 的熱硬化性交聯環狀烯烴樹脂薄臈係脆,無法測定 性。 由含有具有2個以上聚合性不飽和鍵的交聯劑 不含有1分鐘半衰期溫度為135〜2〇〇它的有機過氧 系熱聚合起始劑之聚合性組成物所得之比較例丨丨〜] 熱硬化性交聯環狀烯烴樹脂薄膜之撥水性、初期脫 及加熱後脫模性係低。 含有具有2個以上聚合性不飽和鍵的交聯劑, 含有1分鐘半衰期溫度為135〜200t的有機過氧化 熱聚合起始劑,含有1分鐘半衰期溫度低於135〇c 機過氧化物系熱聚合起始劑之比較例丨4及比較例 聚合性組成物的製膜係不可能。 [產業上的利用可能性] 本發明的熱硬化性交聯環狀烯烴樹脂組成物係 可適用於半導體裝置的製造中之半導體封裝步驟 膜。使用本發明的熱硬化性交聯環狀烯烴樹脂薄膜 半導體封封之方法係沒有特別的限定。該半導體封 ,但 熱聚 8及 期脫 ,但 熱聚 .j 10 其物 ,但 化物 ί3的 模性 但不 物系 的有 15之 供給 的薄 進行 裝方 -38- 201238992 法的具體例係:(i)於搭載有半導體晶片的引線框與一側 的金屬模型内面之間’以與引線框基板接觸的方式,使 脫模薄骐介在而進行樹脂密封之方法,(II)搭載有半導體 晶片的引線框基板之半導體晶片面與至少一側的金屬模 型内面之間’以密封時在晶片與模具之間填充密封材料 之方式,使脫模薄膜介在而進行樹脂密封之方法’即, 使脫模薄膜介在於上模具、下模具内面的至少一側之方 法。 再者’本發明的熱硬化性交聯環狀烯烴樹脂組成 t ’、係利用即使不含有在分子中含有氟的氟成分及聚矽 氧成刀也具有優異的撥水性之性質,成形為半導體封裝 步驟用溥膜以外的各種成形體。 本發明的熱硬化性交聯環狀烯烴樹脂薄臈係適用作 ."、印刷基板製造時及撓性印刷基板的覆蓋層貼附步 之脫模薄膜。 【圖式簡單說明】 無。 【主要元件符號說明】 無0 -39-12) NK Ester A-DCP, Xinzhongcun Chemical Industry Co., Ltd. 13) nk Ester A-200, Xinzhongcun Chemical Industry Co., Ltd. 14) NK Ester A-400, Xinzhongcun Chemical Industry Co., Ltd. 15) RIMTEC The VC843 is made of a crosslinking agent having two or more polymerizable unsaturated bonds and a half-life temperature of 1 3 5 to 200. (Example of the polymerizable composition of the organic peroxide-based thermal polymerization initiator): initial release property of the release sheet of 丨~丨3, mold release property after heating, mechanical strength, water repellency and high temperature High discoloration resistance. Polymerization of an organic peroxide-based thermal polymerization initiator which does not contain a crosslinking agent having two or more polymerizable unsaturated bonds and a half-life temperature of 135 to 2 〇〇t> Comparison of the properties of the product W. The thermosetting property of the W丨-36-201238992 The initial mold release property, the water-repellent moldability of the de-linked cyclic olefin resin film after heating, and the horse temperature-resistant discoloration are low.衰湘,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, The heat-curable parent-ring thin hydrocarbon resin film of the comparative example 2 obtained in the sample 2 was water-repellent, and the mold release property after heating and the mechanical strength were low. The temperature of the compound m was 135. Oxide 糸...poly & starter, but parental agent with more than 2 polymerizable unsaturated bonds The thermosetting crosslinked cyclic olefin resin of Comparative Example 3 obtained from the polymerizable composition having a too small content is low in water repellency, initial mold release property, mold release property after heating, and high temperature discoloration resistance. The half life of 1 minute is contained. The thermosetting property of Comparative Example 4 obtained by using a polymerizable composition having a temperature of 135 to 20 (TC of an organic peroxide-based thermal polymerization initiator but having a crosslinking agent having two or more polymerizable unsaturated bonds) The bicyclic olefin resin film is brittle and cannot be measured for physical properties. It contains an organic peroxide having a crosslinking agent having two or more polymerizable unsaturated bonds, but not having a one-minute half-life temperature of 135 to 2 〇〇. The thermosetting crosslinked cyclic olefin resin films of Comparative Examples 5 and 6 obtained by the polymerizable composition of the thermal polymerization initiator have low water repellency, mechanical strength, initial mold release property, and mold release property after heating. A thermosetting bond of Comparative Example 7 obtained by using a crosslinking agent having two or more polymerizable unsaturated bonds, but not containing a polymerizable composition of an organic peroxide-based thermal polymerization initiator having a one-minute half-life temperature of 135 to 20 Ot Link The water repellency, initial mold release property, mold release property after heating, and high temperature change resistance of the thin hydrocarbon resin film are low. -37- 201238992 Two crosslinkers having two or more polymerizable unsaturated bonds are used for the half life. Water repellency, initial moldability, and heat-heating of the thermosetting crosslinked cyclic olefin resin film of Comparative Example 9 obtained by a polymerizable composition having a content of 135 to 20 (the organic peroxide-based initiator of rc) The release property and the high-temperature discoloration resistance are low. The half-life temperature of the cross-linking agent containing a cross-linking agent having two or more polymerizable unsaturated bonds is 135 to 20 (the organic peroxide-based starting agent of rc is excessively added). The thermosetting crosslinked cyclic olefin resin which is obtained by comparison with the polymerizable composition is brittle and cannot be measured. A comparative example obtained from a polymerizable composition containing an organic peroxide-based thermal polymerization initiator having a one-minute half-life temperature of 135 to 2 Å containing a crosslinking agent having two or more polymerizable unsaturated bonds The water repellency of the thermosetting crosslinked cyclic olefin resin film is low in the initial release and the release property after heating. Containing a cross-linking agent having two or more polymerizable unsaturated bonds, containing an organic peroxide thermal polymerization initiator having a one-minute half-life temperature of 135 to 200 tons, containing a one-minute half-life temperature lower than 135 〇c machine peroxide heat Comparative Example 4 of the polymerization initiator and the film formation system of the polymerizable composition of the comparative example were impossible. [Industrial Applicability] The thermosetting crosslinked cyclic olefin resin composition of the present invention is applicable to a semiconductor encapsulating step film in the manufacture of a semiconductor device. The method of using the thermosetting crosslinked cyclic olefin resin film of the present invention for semiconductor encapsulation is not particularly limited. The semiconductor package, but the heat polymer 8 and the period off, but the heat polymer.j 10, but the mode of the compound ί3, but the system of the supply of 15 is thin, the specific method of the method -38-201238992 (i) a method of resin-sealing between a lead frame on which a semiconductor wafer is mounted and an inner surface of a metal mold on one side so as to be in contact with the lead frame substrate, and (II) mounting a semiconductor a method of performing a resin sealing by interposing a release film between a semiconductor wafer surface of a lead frame substrate of a wafer and an inner surface of at least one metal mold to fill a sealing material between the wafer and the mold during sealing. The release film is interposed between at least one side of the upper surface of the upper mold and the lower mold. In addition, the thermosetting crosslinked cyclic olefin resin composition t' of the present invention is excellent in water repellency even if it does not contain a fluorine component containing fluorine in a molecule and a polyfluorene-forming knife, and is formed into a semiconductor package. The steps used various molded bodies other than the enamel film. The thermosetting crosslinked cyclic olefin resin of the present invention is suitable for use as a release film for a cover layer attachment step of a printed circuit board and a flexible printed circuit board. [Simple description of the diagram] None. [Main component symbol description] No 0 -39-

Claims (1)

201238992 七、申請專利範圍: 1. 一種熱硬化性交聯環狀烯烴樹脂組成物,其係將含有 100質量份的(a)環狀烯烴單體、〇 7〜4〇質量份的(b)〔 除了該(a)以外,具有2個以上聚合性不飽和鍵的交聯 劑〕、1.15〜15質量份的⑷i分鐘半衰期溫度(half time 沈1111^1^111^)為13S〜20(rc的有機過氧化物系熱聚合起 始劑及(d)開環複分解(metathesis)聚合觸媒之聚合性 組成物加熱、開環複分解聚合及交聯而得。 2. 如申請專利範圍丨項之熱硬化性交聯環狀烯烴樹脂組 成物,其中該(a)環狀烯烴單體係降稍烯系單體。 3_如申請專利範圍丨項之熱硬化性交聯環狀烯烴樹脂組 成物,其中該(b)〔除了該(a)以外,具有2個以上聚合 性不飽和鍵的交聯劑〕係具有2個以上聚合性不飽和 鍵的(甲基)丙稀酸醋。 4·如申請專利範圍1項之熱硬化性交聯環狀烯烴樹脂組 成物’其中該(d)開環複分解聚合觸媒係釕碳烯 (ruthenium carbene)錯合物。 5·—種熱硬化性交聯環狀烯烴樹脂薄膜,其係由如申請 專利範圍1項之熱硬化性交聯環狀烯烴樹脂組成物所 構成。 6. 如申請專利範圍5項之熱硬化性交聯環狀烯烴樹脂薄 膜’其係半導體封裝步驟所使用的脫模薄膜。 7. 如申請專利範圍5項之熱硬化性交聯環狀烯烴樹脂薄 膜’其係印刷基板製造用的脫模薄膜。 -40- 201238992 種如申請專利範圍丨項之熱硬化性交聯環狀烯烴樹 知組成物的製造方法,其係包含將含有1 〇〇質量份的 u)環狀烯烴單體、0·7〜40質量份的(b)〔除了該以外 ’具有2個以上聚合性不飽和鍵的交聯劑〕、1.1 5〜丄$ 質量份的(c)l分鐘半衰期溫度為135〜2〇(rc的有機過 氧化物系熱聚合起始劑及(d)開環複分解聚合觸媒之聚 合性組成物加熱、開環複分解聚合及交聯的步驟。 9. 如申請專利範圍8項之熱硬化性交聯環狀烯烴樹脂組 成物的製造方法,其中該(a)環狀烯烴單體係降萡烯系 單體。 10. 如申請專利範圍8項之熱硬化性交聯環狀烯烴樹脂組 成物的製造方法,其中該(b)〔除了該(a)以外,具有2 個以上聚合性不飽和鍵的交聯劑〕係具有2個以上聚 合性不飽和鍵的(曱基)丙烯酸酯。 1 1.如申請專利範圍第8至10項中任一項之熱硬化性交 聯環狀烯烴樹脂組成物的製造方法,其中該開環複 分解聚合觸媒係釕碳烯錯合物。 12.—種如申請專利範圍5項之熱硬化性交聯環狀烯烴樹 脂薄膜的製造方法,其係包含將含有丨〇〇質量份的 環狀烯烴單體、0.7〜40質量份的(b)〔除了該(a)以外, 具有2個以上聚合性不飽和鍵的交聯劑〕、丨丨5 ~丨5質 量份的(c)l分鐘半衰期溫度為135〜2〇〇<>c的有機過氧 化物系熱聚合起始劑及(d)開環複分解聚合觸媒之聚合 性組成物塗布在支撐體上,而且在上述支撐體上進行 加熱、開環複分解聚合及交聯之步驟。 -41 - 201238992 1 3 ·如申請專利範圍 薄膜的製造方法 單體。 12項‘’、、硬化性交聯環狀烯烴樹脂 Ί 狀稀烴單體係降描烯系 14 ·如申請專利範圍1 2項之熱碩仆,地丄咖 、更化性父聯環狀烯烴樹脂 薄膜的製造方法,其中該(b)〔除了該(a)以外,具有2 個以上聚合性不飽和鍵的交聯劑〕係具有2個以上聚 合性不飽和鍵的(曱基)丙烯酸酯。 15.如申請專利範圍12〜14項中任一項之熱硬化性交聯環 狀烯烴樹脂薄膜的製造方法,其中該(d)開環複分解聚 合觸媒係釕碳烯錯合物。 I -42- 201238992 四、指定代表圖: (一) 本案指定代表圖為:無。 (二) 本代表圖之元件符號簡單說明: 無0 五、本案若有化學式時,請揭示最能顯示發明特徵的化學式:201238992 VII. Patent Application Range: 1. A thermosetting crosslinked cyclic olefin resin composition containing 100 parts by mass of (a) a cyclic olefin monomer and 〇7 to 4 parts by mass of (b) [ In addition to the (a), a crosslinking agent having two or more polymerizable unsaturated bonds, and a (4) i minute half-life temperature (half time sinking 1111^1^111^) of 1.15 to 15 parts by mass is 13S to 20 (rc) The organic peroxide-based thermal polymerization initiator and (d) the polymerizable composition of the ring-opening metathesis polymerization catalyst are heated, ring-opened metathesis polymerization and cross-linking. 2. The heat of the patent application scope a hardenable crosslinked cyclic olefin resin composition, wherein the (a) cyclic olefin single system is a lower alkylene monomer. 3_ The thermosetting crosslinked cyclic olefin resin composition according to the scope of the application, wherein (b) [In addition to the (a), a crosslinking agent having two or more polymerizable unsaturated bonds] is a (meth)acrylic acid vinegar having two or more polymerizable unsaturated bonds. a thermosetting crosslinked cyclic olefin resin composition of the range 1 of which d) a ring-opening metathesis polymerization catalyst ruthenium carbene complex. 5. A thermosetting crosslinked cyclic olefin resin film which is a thermosetting crosslinked ring as claimed in claim 1 6. The olefin resin composition is composed of 6. The thermosetting crosslinked cyclic olefin resin film of claim 5 is a release film used in the semiconductor packaging step. 7. The thermosetting hardening agent according to claim 5 A cyclic olefin resin film which is a release film for producing a printed circuit board. -40 - 201238992 A method for producing a thermosetting crosslinked cyclic olefin tree composition according to the scope of the patent application, which contains 1 〇〇 parts by mass of u) a cyclic olefin monomer, 0. 7 to 40 parts by mass of (b) [except for the 'crosslinker having two or more polymerizable unsaturated bonds'), 1.1 5 to 丄$ The mass fraction of (c) l minute half-life temperature is 135~2 〇 (rc organic peroxide-based thermal polymerization initiator and (d) open-loop metathesis polymerization catalyst polymerizable composition heating, ring-opening metathesis polymerization and Steps for cross-linking. 9. If applying A method for producing a thermosetting crosslinked cyclic olefin resin composition according to the invention, wherein the (a) cyclic olefin single system norbornene-based monomer. 10. The thermosetting cross-linking according to claim 8 In the method for producing a cyclic olefin resin composition, the (b) [crosslinking agent having two or more polymerizable unsaturated bonds in addition to the (a)) has two or more polymerizable unsaturated bonds (曱) The method for producing a thermosetting crosslinked cyclic olefin resin composition according to any one of claims 8 to 10, wherein the ring-opening metathesis polymerization catalyst is ruthenium carbene Things. 12. A method for producing a thermosetting crosslinked cyclic olefin resin film according to claim 5, which comprises a cyclic olefin monomer containing ruthenium by mass, and 0.7 to 40 parts by mass of (b) [In addition to the (a), a crosslinking agent having two or more polymerizable unsaturated bonds], and (c) one minute half-life temperature of 丨丨5 to 丨5 parts by mass is 135 to 2 〇〇 <> The organic peroxide-based thermal polymerization initiator and (d) the polymerizable composition of the ring-opening metathesis polymerization catalyst are coated on the support, and the steps of heating, ring-opening metathesis polymerization and crosslinking on the support are carried out. . -41 - 201238992 1 3 ·If the scope of application is patented How to make a film Monomer. 12 items of '', hardened cross-linked cyclic olefin resin Ί-like dilute hydrocarbon single system 降 olefin system 14 · as claimed in the scope of patent 1-2, 丄 丄 、, 更 父 父 父 、 In the method for producing a resin film, the (b) [crosslinker having two or more polymerizable unsaturated bonds in addition to the (a)] is a (fluorenyl) acrylate having two or more polymerizable unsaturated bonds. . The method for producing a thermosetting crosslinked cyclic olefin resin film according to any one of claims 12 to 14, wherein the (d) ring-opening metathesis polymerization catalyst is a ruthenium carbene complex. I -42- 201238992 IV. Designated representative map: (1) The representative representative of the case is: None. (2) A brief description of the symbol of the representative figure: None 0. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention:
TW101101527A 2011-03-28 2012-01-16 Thermosetting crosslinking cyclic olefin resin composition, thermosetting crosslinking cyclic olefin resin film, method for producing thermosetting crosslinking cyclic olefin resin composition and method for producing thermosetting crosslinking cyclic ol TW201238992A (en)

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