201232226 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種電子裝置，尤指一種方便拆裝電路板之 電子裝置。 【先前技術】 [0002] 個人電腦、筆記本等電子裝置中之電路板均是藉由螺絲 鎖固等方式固定於所述電子裝置中之機殼之底壁中。螺 絲鎖固之方式於拆裝所述電路板時，均會拆裝大量之螺 絲，極為不便。 【發明内容】 [0003] 鑒於以上内容，有必要提供一種可方便拆裝電路板之電 子裝置。 [0004] 一種電子裝置，包括機殼、電路板及安裝於電路板之下 表面之背板，所述機殼包括有底壁，所述底壁開設有第 一定位槽及第二定位槽，所述背板用以將所述電路板固 定於所述底壁上，並包括有第一卡固部與第二卡固部， 所述第一卡固部設置於所述背板之第一邊緣，所述第二 卡固部設置於所述背板之相鄰於所述第一邊緣之第二邊 緣，所述背板沿一平行於所述底壁之第一方向移動，而 使所述第一卡固部與第二卡固部分別滑動卡扣於所述第 一定位槽與第二定位槽中。 [0005] 與習知技術相比，上述電子裝置中之電路板藉由背板上 之第一卡固部與第二卡固部分別滑動卡扣於所述底壁上 之第一定位槽與第二定位槽中，即可將所述主機板固定 於所述底壁上。拆卸時，所述第一卡固部與第二卡固部 100103503 表單編號A0101 第4頁/共16頁 1002006277-0 201232226 [0006] J脫離所迷第一定位槽與第二定位槽即可。拆裝均益 需使用螺辞+ ，極為方便。 【實施方式】 請參閱圖1月„ 及圖2，於本發明之一較佳實施方式中，一電 子裝置包紅 〜機殼10 (圖中僅示一部分）、一電路板2〇 可位於所述電路板2〇之下表面之背板30、一可位於 所述電路板20之上表面之支撑架40、及-安裝於所述支 撐架40之散熱器50。 ο _7] 所述機喊包括一底壁11，兩分別連接於所述底壁11之 兩較長邊緣之第一側壁13 (圖中僅示一個）、及兩分別 連接於所述底壁11之兩較短邊緣之第二側壁14 (圖中僅 示個）°所述底壁11開設有兩相對之第广定位槽η 2及 兩相對之第—定位槽114。所述兩第一定位槽11 2位於一 平行於所述第一側壁13之第一方向所於之一直線上，所 述兩第二定位槽114位於一垂直於所述第一方向之第二方 向所於之一直線上。每一第一定位槽112包括一導入部 ο 1121及—連通於所述導入部1121之定位部1123。於一較 佳實施方式中，所述導入部112ι之寬度大於所述定位部 1123之寬度；每一第一侧壁13大致垂直於所述底壁11及 每一第二側壁14。 [0008] 所述電路板20上安裝有一中央處理器21，並於所述中央 處理器21周圍開設有四個安裝孔23。於一較佳實施方式 中，所述四個安裝孔23大致呈矩形陣列排列。 [0009] 所述背板30之兩相對邊緣對應所述第一定位槽112延伸有 100103503 兩第一卡固部31，另兩相對邊緣對應所述第二定位槽Π4 表單坞號A0101 第5頁/共16頁 1002006277-0 201232226 延伸有第二卡固部33。每一第一卡固部31可由每一第一 定位槽112之導入部1121滑入所述第一定位槽112中，而 止位於所述定位部1123。每一第二卡固部33可分別於所 述第二定位槽114之兩相對端之間滑動。於一較佳實施方 式中，所述第二卡固部33之結構與所述第一卡固部31之 結構相同，均為片狀；所述背板30之四邊緣可分別豎直 向下延伸一折邊32 (見圖1)，所述第一卡固部31與第二 卡固部33分別沿所述折邊32彎折垂直延伸而形成。於另 一較佳實施方式中，所述第一卡固部31與第二卡固部33 可直接由所述背板30之邊緣垂直向下延伸並彎折。 [0010] 所述背板30之四個角落另對應所述電路板20之四安裝孔 23開設有四個固定孔35，並開設有複數開孔36。每一開 孔36之四邊緣各凸設形成一用以提高所述背板30之結構 強度之加強肋361。 [0011] 所述支撐架40用以支撐於所述中央處理器21上，其四個 角落分別延伸一安裝部41。每一安裝部41凸設有一具有 鎖固孔（圖未標）之凸柱411。所述支撐架40另對應所述 電路板20之安裝孔23及背板30之固定孔35開設有四個開 孔43。 [0012] 所述散熱器50用以為所述中央處理器21散熱，包括一基 座51及複數豎直設於所述基座51上之散熱鰭片53。所述 基座51之兩較長邊緣分別延伸有一第一固定片511，並於 兩遠離所述第一固定片511之角落分別延伸有一第二固定 片513。所述第一固定片511與所述第二固定片513上均 固定有一定位件70。所述複數鰭片53相互平行，且每一 100103503 表單編號A0101 第6頁/共16頁 1002006277-0 201232226 鰭片53垂直位於所述基座51之一較長邊所於方向之一方 向上。於〆較佳實施方式中，所述第一固定片511大致呈 三角形，所述第二固定片513之結構與所述支撐架40之安 裝部41之結構大致相同。 [0013] Ο 請參閱圖3及圖4 ’組裝時，將所述背板30放置於電路板 20之下表面’所述支撐架40放置於所述電路板20之上表 面。對齊所述電路板20之安裝孔23、背板30之固定孔35 與支撐架40之開孔43，四鎖固件6〇，如螺絲等同時穿過 所述安裝孔23與固定孔35中，而鎖固於所述開孔43中， 從而將所述電路板2〇、背板30與支撐架40安裝於一起。 將所述散熱器放置於所述支樓架40之上表面，並使每 一定位件70同時鎖入所述凸柱411對應之鎖固孔中，從而 將所述散熱器50安裝於所述支撐架40上。 [0014] ο 將組裝完畢之背板30、電路板20、支撐架40及散熱器50 放置於所述機殼1〇之底壁11上，且所述背板30之第一卡 固部31插入所述底壁U之第一定位槽112中之導入部 1121中’所述背板30之第二卡固部33位於所述底壁^之 第二定位槽Π4之第一端。沿所述平行於所述第一侧壁13 之第一方向平移所述背板30，而使所述背板3〇之第一卡 固部31由所述導入部1121向定位部1123滑動，同時，所 述第二卡固部33向所述第二定位槽114之相對之第二端滑 動，直到所述第一卡固部31卡扣於所述定位部1123中停 止。即可將所述背板30卡扣於所述底壁11上，從而完成 整個組裝。 [0015] 100103503 拆卸時，沿一與所述第—方向相反之方向移動所述背板 表單編號Α0101 第7頁/共16頁 1002006277-0 201232226 ，而使所述背板30之第一卡固部31由所逑定位部U23 嚮導入部1121滑動，同時，所述第二卡固部33向所述第 —疋位槽114之第一端滑動，直到所述第—^固部31位於 所述導入部1121時停止。向上提取所述背板3〇 ,即可將 所述背板30由所述底壁π分離出來。若要拆卸散熱器5〇 、電路板20、背板30與支撐架4〇時，則用螺釘起子將所 述鎖固件60及定位件7〇拆卸下來即可。 [0016] [0017] [0018] [0019] [0020] [0021] [0022] [0023] 综上所述，本發明確已符合發明專利要求，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式 舉凡熟悉本發明技藝之人士，爰依本發明之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 圖1是本發明電子裝置之一較佳實施方式之一立體分解圖 〇 圖2是本發明電子裝置之一較隹實施方式之另一立體分解 團0 ..... 圖3是圖1之一立體組裝圖。 圖4是圖2之一立體組裝圖。 【主要元件符號說明】 機殼：10 底壁：11 第一側壁：1 3 100103503 表單編號A0101 第8頁/共16頁 1002006277-0 201232226201232226 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to an electronic device, and more particularly to an electronic device that facilitates disassembly and assembly of a circuit board. [Prior Art] [0002] A circuit board in an electronic device such as a personal computer or a notebook is fixed in a bottom wall of a casing in the electronic device by screwing or the like. In the way of screwing the circuit board, a large number of screws are disassembled and disassembled, which is extremely inconvenient. SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide an electronic device that can easily disassemble a circuit board. An electronic device includes a casing, a circuit board, and a backboard mounted on a lower surface of the circuit board, the casing includes a bottom wall, and the bottom wall defines a first positioning slot and a second positioning slot. The backplane is configured to fix the circuit board to the bottom wall, and includes a first fastening portion and a second fastening portion, wherein the first fastening portion is disposed on the first backplane An edge, the second fastening portion is disposed on a second edge of the backboard adjacent to the first edge, and the backboard moves along a first direction parallel to the bottom wall, and The first fastening portion and the second fastening portion are respectively slidably engaged in the first positioning slot and the second positioning slot. [0005] Compared with the prior art, the circuit board in the electronic device is respectively slidably engaged with the first positioning slot on the bottom wall by the first fastening portion and the second fastening portion on the back plate. In the second positioning slot, the motherboard can be fixed to the bottom wall. When disassembling, the first fastening portion and the second fastening portion 100103503 Form No. A0101 Page 4 / Total 16 pages 1002006277-0 201232226 [0006] J can be separated from the first positioning slot and the second positioning slot. It is extremely convenient to use the thread + for the disassembly and assembly. [Embodiment] Please refer to FIG. 1 and FIG. 2. In a preferred embodiment of the present invention, an electronic device is packaged in red to the casing 10 (only a part of which is shown), and a circuit board 2 can be located in the office. a backplane 30 on the lower surface of the circuit board 2, a support frame 40 on the upper surface of the circuit board 20, and a heat sink 50 mounted on the support frame 40. ο _7] A bottom wall 11 is defined, and two first side walls 13 (only one shown in the figure) respectively connected to the two longer edges of the bottom wall 11 and two short edges respectively connected to the bottom wall 11 are included. Two side walls 14 (only one is shown). The bottom wall 11 is provided with two opposite wide positioning grooves η 2 and two opposite first positioning grooves 114. The two first positioning grooves 11 2 are located in a parallel The first direction of the first sidewall 13 is on a straight line, and the two second positioning slots 114 are located on a line perpendicular to the second direction of the first direction. Each of the first positioning slots 112 An introduction portion ο 1121 and a positioning portion 1123 connected to the introduction portion 1121 are provided. In a preferred embodiment, The width of the introduction portion 112i is greater than the width of the positioning portion 1123; each of the first side walls 13 is substantially perpendicular to the bottom wall 11 and each of the second side walls 14. [0008] A central portion is mounted on the circuit board 20. The processor 21 is provided with four mounting holes 23 around the central processing unit 21. In a preferred embodiment, the four mounting holes 23 are arranged in a substantially rectangular array. [0009] The two opposite edges corresponding to the first positioning slot 112 have 100103503 two first fastening portions 31, and the other two opposite edges correspond to the second positioning slot 4 Form Dock No. A0101 Page 5 / Total 16 Pages 1002006277-0 201232226 A second fastening portion 33 is extended. Each of the first fastening portions 31 can be slid into the first positioning slot 112 by the introduction portion 1121 of each first positioning slot 112, and is located at the positioning portion 1123. A second fastening portion 33 is slidable between the opposite ends of the second positioning slot 114. In a preferred embodiment, the structure of the second fastening portion 33 and the first fastening portion The portions 31 have the same structure and are all in the form of a sheet; the four edges of the back plate 30 can be vertically oriented A lower flange 32 (see FIG. 1) is extended, and the first fastening portion 31 and the second fastening portion 33 are respectively formed by bending and extending perpendicularly along the flange 32. In another preferred embodiment, The first fastening portion 31 and the second fastening portion 33 may directly extend downward from the edge of the back plate 30 and be bent. [0010] The four corners of the back plate 30 further correspond to the circuit The four mounting holes 23 of the plate 20 are provided with four fixing holes 35, and a plurality of opening holes 36 are formed. The four edges of each opening 36 are respectively convexly formed to form a reinforcing rib for improving the structural strength of the back plate 30. 361. [0011] The support frame 40 is supported on the central processing unit 21, and four corners thereof respectively extend from a mounting portion 41. Each mounting portion 41 is convexly provided with a stud 411 having a locking hole (not shown). The support frame 40 further defines four openings 43 corresponding to the mounting holes 23 of the circuit board 20 and the fixing holes 35 of the back plate 30. [0012] The heat sink 50 is configured to dissipate heat from the central processing unit 21, and includes a base 51 and a plurality of heat dissipation fins 53 vertically disposed on the base 51. A first fixing piece 511 is defined on each of the two long edges of the base 51, and a second fixing piece 513 extends from a corner of the first fixing piece 511. A positioning member 70 is fixed to both the first fixing piece 511 and the second fixing piece 513. The plurality of fins 53 are parallel to each other, and each of the 100103503 form numbers A0101 6th/16 pages 1002006277-0 201232226 The fins 53 are vertically located in one direction of the longer side of one of the bases 51. In a preferred embodiment, the first fixing piece 511 is substantially triangular, and the structure of the second fixing piece 513 is substantially the same as the structure of the mounting portion 41 of the support frame 40. [0013] Referring to FIG. 3 and FIG. 4 'when assembled, the back plate 30 is placed on the lower surface of the circuit board 20'. The support frame 40 is placed on the upper surface of the circuit board 20. Aligning the mounting hole 23 of the circuit board 20, the fixing hole 35 of the backboard 30 and the opening 43 of the support frame 40, and the four locking fasteners 6, such as screws, pass through the mounting hole 23 and the fixing hole 35 at the same time. And locked in the opening 43, thereby mounting the circuit board 2, the back plate 30 and the support frame 40 together. The heat sink is placed on the upper surface of the support frame 40, and each positioning member 70 is simultaneously locked into the corresponding locking hole of the protruding post 411, thereby mounting the heat sink 50 on the Support frame 40. [0014] ο The assembled back plate 30, the circuit board 20, the support frame 40 and the heat sink 50 are placed on the bottom wall 11 of the casing 1 and the first fastening portion 31 of the back plate 30 The second fastening portion 33 of the backing plate 30 in the introduction portion 1121 of the first positioning groove 112 of the bottom wall U is located at the first end of the second positioning groove 4 of the bottom wall. Translating the back plate 30 along the first direction parallel to the first side wall 13 so that the first fastening portion 31 of the back plate 3 is slid by the introduction portion 1121 toward the positioning portion 1123. At the same time, the second fastening portion 33 slides toward the opposite second end of the second positioning slot 114 until the first fastening portion 31 is snapped into the positioning portion 1123 to stop. The backing plate 30 can be snapped onto the bottom wall 11 to complete the assembly. [0015] 100103503, when disassembling, moving the backplane form number Α0101, page 7/16 pages 1002006277-0 201232226 in a direction opposite to the first direction, so that the first backing of the backboard 30 is completed The portion 31 slides from the positioning portion U23 to the introduction portion 1121, and the second fastening portion 33 slides toward the first end of the first clamping groove 114 until the first solid portion 31 is located The introduction unit 1121 stops. The backing plate 3 is extracted upward, and the backing plate 30 is separated from the bottom wall π. When the heat sink 5, the circuit board 20, the back board 30, and the support frame 4 are removed, the lock 60 and the positioning member 7 can be removed by a screwdriver. [0023] [0023] [0023] In summary, the present invention has indeed met the requirements of the invention patent, and filed a patent application according to law. However, the above description is only for those skilled in the art, and equivalent modifications or variations made in accordance with the spirit of the present invention are intended to be included in the following claims. 1 is a perspective exploded view of one of the preferred embodiments of the electronic device of the present invention. FIG. 2 is another perspective exploded view of one of the electronic devices of the present invention. FIG. It is an assembled view of one of Figure 1. Figure 4 is an assembled, isometric view of Figure 2; [Main component symbol description] Case: 10 Bottom wall: 11 First side wall: 1 3 100103503 Form number A0101 Page 8 of 16 1002006277-0 201232226
[0024] 第二側壁：14 [0025] 第一定位槽： 112 [0026] 導入部：1121 [0027] 定位部：1123 [0028] 第二定位槽： 114 [0029] 電路板：20 [0030] 安裝孔：23 [0031] 中央處理器： 21 [0032] 背板：30 [0033] 第一卡固部： 31 [0034] 折邊：32 [0035] 第二卡固部： 33 [0036] 固定孔：3 5 [0037] 開孔：36 [0038] 加強肋：361 [0039] 支撐架：40 [0040] 安裝部：41 [0041] 凸柱：411 [0042] 開孔：43 100103503 表單編號A0101 第9頁/共16頁 1002006277-0 511201232226 [0043] 散熱器：50 [0044] 基座：51 [0045] 鰭片：5 3 [0046] 第一固定片： [0047] 第二固定片： [0048] 鎖固件：60 [0049] 定位件：70 513 100103503 表單編號A0101 第10頁/共16頁 1002006277-0[0024] Second side wall: 14 [0025] First positioning groove: 112 [0026] Introduction portion: 1121 [0027] Positioning portion: 1123 [0028] Second positioning groove: 114 [0029] Circuit board: 20 [0030] Mounting hole: 23 [0031] Central processing unit: 21 [0032] Back plate: 30 [0033] First fastening part: 31 [0034] Folding: 32 [0035] Second fastening part: 33 [0036] Fixed Hole: 3 5 [0037] Opening: 36 [0038] Reinforcing rib: 361 [0039] Support: 40 [0040] Mounting: 41 [0041] Stud: 411 [0042] Opening: 43 100103503 Form No. A0101 Page 9 of 16 1002006277-0 511201232226 [0043] Heat sink: 50 [0044] Base: 51 [0045] Fin: 5 3 [0046] First fixed piece: [0047] Second fixed piece: [ 0048] Locking: 60 [0049] Positioning member: 70 513 100103503 Form number A0101 Page 10 / Total 16 pages 1002006277-0