TW201231462A - Curable compositions - Google Patents

Abstract

A curable composition or system including (a) at least one divinylarene dioxide, (b) at least one polythiol compound curing agent; and (c) at least one catalyst; wherein the resulting curable composition may be cured at ambient conditions to provide a durable cured material.

Description

201231462 VI. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a curable composition and a cured product obtained therefrom. More particularly, the present invention relates to a curable composition using a divinylarene diene (divinylbenzene) & polythiol curing agent, wherein the congee composition such as «Hai is cured at a reasonable rate and The cured product made of the curable composition has good solvent resistance and good surface hardness characteristics. The composition of the present invention can be applied, for example, to the manufacture of castings, composites, coatings and adhesives. [Prior Art] Dioxyethylene aromatic hydrocarbons are known to be cured with various curing agents. For example. The hydration of a bismuth oxide divinylarene and a blend of polythiols is taught in U.S. Patent No. 2,927,580. For example, Ha q· Pham and Maurice !· Marks^ unmann, s Encyc!〇pedia 〇f μ, as described in Chapter 15.5 “Ep〇xy(6)(10)”, requires a tertiary amine catalyst to cure the epoxy resin with a polythiol. However, it has been found that the tertiary amine catalyst taught in U.S. Patent No. 2,927,5,80 is ineffective in the divinylarene formulation. Therefore, it is necessary to prepare a divinylarene-containing hydrocarbon, a polythiol, and a catalytic backing under the conditions of the ring (for example, at a temperature of about 20 ° C to about 25 ° C and at a pressure of 1 bar). A curable composition that cures within about 24 hours of formulating the composition and applying the composition to various substrates. SUMMARY OF THE INVENTION The present invention solves the problem of the prior art 201231462 by providing a curable composition, such as comprising (1) at least one type of diethylene oxide, (b) to: a thiol compound and (at least a curable epoxy resin composition selected from the group consisting of a catalyst corresponding to a catalyst of the following formula;

N R2 r5 —~2 k

m η 匕 · where, wherein 2 of the above structures may be selected from 〇, s or a single bond; R|to 4 may be selected from a group or a cycloalkyl group each having from 1 to about 2G carbon atoms; Selected from η or alkyl or cycloalkyl, wherein the alkyl or cycloalkyl groups each have from 1 to about 2G carbon atoms; any of them may be bonded to form - or any of a plurality of rings uR8 It may contain a tertiary amine functional group, such as an aryl group, a dilute group or a block group, a (tetra) group, a keto group, a keto group, a thiol group, an aryl group, an imine group each having from about 20 carbon atoms. Base or nitro; η can be an integer.... , may be an integer 〇 to... and _ may be less than or equal to (y) an integer of about 2 。. Containing the above formula I: the remainder of the catalyst may be any having from about 2 to about 2 carbon atoms and Any one or more organic groups resistant to tertiary amine functional groups. The composition of the present invention is preferably cured under a predetermined period of time under "ambient conditions" (as defined below) A non-tacky solvent resistant cured article having a good surface hardness of 201231462 was obtained. A specific example of the present invention relates to a curable composition comprising (a) at least one divinylarene diolefin, (b) at least one type of polythioester curing agent, and (c) at least one selected from the group consisting of The catalyst corresponding to the catalyst compound of the fragment of the above formula ι is such that the resulting curable composition is cured under ambient conditions for a predetermined amount of time, such as within about 4 M, to obtain a material having useful properties. The curable composition of the present invention can be applied to, for example, specialty articles, coatings, composites, and adhesives. In a preferred embodiment of the invention, divinylarene dioxide (such as divinylbenzene (DVBD)) can be combined with a polythiol curing agent such as a polythiol or a polysulfide. use. [Embodiment] A broad aspect of the present invention includes a curable resin composition comprising (a) at least one divinylarene dihydrate; (1)) at least one polythiol curing agent, and (c) at least A catalyst selected from the group consisting of catalyst compounds corresponding to fragments of the above formula; wherein the resulting curable composition is capable of curing under ambient conditions for a predetermined amount of time (e.g., within about 48 hours) to provide a cured product. The divinylarene diene (component (a)) suitable for use in the present invention may comprise, for example, any substituted or unsubstituted aromatic hydrocarbon ring having one or more vinyl groups at any ring position. For example, the aryl fe portion of the divinylarene diene can be derived from benzene, substituted benzene, (substituted) ring-annulated benzene or homologously bonded (substituted) benzene or mixtures thereof. composition. The divinylbenzene moiety of diethylene terephthalate can be 201231462. Other substituents may be ortho, meta or para isomers or any mixture thereof may be composed of a ruthenium-resistant group, including, for example, a saturated alkyl or aryl group each having from i to about one carbon atom; halogen, A nitro, isocyanurate or r〇- group (wherein R may be a saturated alkyl or aryl group each having from 1 to about 20 carbon atoms). The cycloacene may be composed of naphthalene, tetrahydronaphthalene, and the like. The homologously bonded (substituted) benzene may be composed of biphenyl, diphenyl ether, and the like. The divinylarene diene oxide used to prepare the composition of the present invention can be illustrated by the following general chemical structures I to IV:

Structure I

Structure II 6 201231462

Ri The structures of the soil comonomers in the above-described dioxide II, structure II, structure oxime and structure IV of the present invention may individually be hydrogen; each individually has: R2, 〜 and L, respectively, A 'if ^ A ^ ^ A + - to 2, an alkyl group of a carbon atom, an alkyl group, a aryl group or an aralkyl group; or H, 〇 闹 妄 妄 * * * * * * * * * * 2 2 2 2 2 2 2 2 , isocyanate or R0_ group Beans 1.7 K f R can be individually /, with 1 to, . 20 bases of 20 carbon atoms, Λ s, square or square); It can be! The number 〇 to 4, y can be greater than or equal to M ^ . , , ijc ^ The wild number ' x + y can be less than or an integer of 6; z can be an integer 〇 and z + y can be Less than

An integer of 8; and Ar can be a 栌κr U methane hydrocarbon slave (including, for example, 1,3-phenylene). Further, 'R_4 may be a reactive group, and the straight earth circle VIII includes, for example, a decyloxy group, an isocyanate group or any other reactive group, and the Z-color & mm mm and the B-substitution substitution mode may be an integer 〇 To 6. In a specific example, the diethylene terephthalate used in the present invention may be, for example, a US patent entitled "processforPreparingDivinylareneDi〇xides" by Marks et al., December 30, 2008, 201231462. The divinylarene oxide produced by the process described in Provisional Application No. 61/141457, which is incorporated herein by reference. One of the oxidized divinylarene compounds of the present invention is also disclosed in, for example, U.S. Patent No. 2,924,580, the disclosure of which is incorporated herein by reference. In another embodiment, the divinyl arsenic oxyfluoride suitable for use in the present invention may comprise, for example, diphenyl benzene, diethylene hydride, divinyl biphenyl, dioxide Vinyl diphenyl ether or a mixture thereof 0. In the preferred embodiment of the present invention, the divinylarene diolefin used in the epoxy resin formulation may be, for example, divinylbenzene (10). For example, dioxinyl-(乍' and knife (a)) suitable for use in the present invention may include divinyl dioxide as illustrated by the chemical formula of structure V below:

The chemical formula of the above DVBDO compound can be as follows: ClQH1Q02; the molecular 詈 of DVBDO is about 〇, '-62·2' and the elemental analysis of DVBDO is about: , 74.06; 1^, 6.21; and 〇197<:14^, ' _73 'of which the epoxy equivalent is about 81 g/mo b 8 201231462 divinylarene dioxide, especially derived from divinylbenzene Vinyl arenes (such as DVBDO) are a class of diepoxides having a relatively low liquid viscosity but a higher stiffness and crosslink density than conventional epoxy resins. The following structure VI illustrates a specific example of a preferred chemical structure of DVBDO suitable for use in the present invention:

Structure VI The following structure VII illustrates another specific example of a preferred chemical structure of DVBDO suitable for use in the present invention.

Structure VII When DVBDO is prepared by methods known in the art, it is possible to obtain one of three possible isomers: ortho, meta and para isomers. Accordingly, the invention includes DVBDO that is individually illustrated or in the form of a mixture of any of the above structures. The above structures VI and VII show the (1,3-DVBDO) isomer and the para isomer between the DVBDO, respectively. There are very few ortho isomers; and usually DVBDO is mostly prepared as a meta isomer (Structure VI): the para isomer 201231462 (Structure VII) at a ratio of about 9:1 to about 1.9 target. As a specific example, the present invention has a ratio ranging from about 6:1 to about 1:6', and is in the form of 祛 红 & & 、 、 、 、 、 、 且 且 且 且 且 且 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 In the example, the ratio of structure VI: structure νπ may be from about 4:1 to about i:4 or from & 2:1 to about 1:2. In another embodiment of the invention, the _ _ τ-emulsified monovinylarene may contain a certain amount [such as less than about 2 〇 里 /. ( wt /〇 )] substituted aromatic hydrocarbon. The amount and structure of the substituted aromatic hydrocarbons are determined by the method used to prepare the divinylarene aromatic hydrocarbon precursor. For example, diethyl benzene benzene prepared by dehydrogenation of diethyl benzene may contain a certain amount of ethyl vinyl benzene (EVB) and when reacted with hydrogen peroxide, EVB is produced - oxidized Ethyl benzene, A DEB remains unchanged. The presence of such compounds increases the epoxy equivalent of the divinylarene diene to a value greater than the epoxy equivalent of the pure compound' but can be used at a percentage of the epoxy resin portion A 0 (%) to 99%. . - In a specific example, a diethylene glycol dihydrocarbamate suitable for use in the present invention comprises, for example, DVBDO, a low viscosity liquid epoxy resin. One of the oxyethylene aromatic hydrocarbons used in the process of the present invention is at 25. The viscosity of the underarm is generally in the range of about 〇·〇〇i pa s to about 〇] Pa s in a specific example, and in the range of about 0_01 Pas to about 0.05 Pas in another specific example and in yet another specific example The range is from about 0.01 Pas to about Pa25 Pas. The concentration of the oxidized ethylene-based aromatic hydrocarbon used as the epoxy resin portion of the formulation in the present invention depends on the fraction of the other formulation components, and in one embodiment can generally range from about 0.5 wt% to about 100 wt〇/ Within the range of 〇, in another specific example, in the range of about i wt% to about 99 wt%, in another specific example 10 201231462, in the range of about 2 wt% to about 98 wt% and in yet another specific example The range is from about 5 wt% to about 95 wt%. One of the oxyethylene.aromatic hydrocarbons used in this month may be used as a separate epoxy resin component in the curable composition of the present invention; or divinylidene oxide may be other than known in the art. Epoxy resin (such as in Lee, H and Neville, κ, Kai (4) acupuncture moxibustion / knowledge and (3).

The epoxy resin described in Book Company, New Y〇rk, 1967, Chapter 2, page 2 to page m, which is incorporated herein by reference), -. In addition to the aromatic hydrocarbons, particularly suitable epoxy resins may include, for example, epoxy resins based on the reaction product of a polyfunctional alcohol, a phenol, a cycloaliphatic carboxylic acid, an aromatic amine or an amine benzene with a surface alcohol. Several non-limiting specific examples include, for example, bisphenol quinone diglycidyl ether, bisphenol F diglycidyl chlorpheniramine diglycidyl diglycidyl ether, and p-aminophenol phenol triglycidyl ether. Other suitable epoxy resins known in the art include, for example, the reaction products of epichlorohydrin with o-cresol and phenol novolac, respectively. It is also possible to use a mixture of two or more other epoxy resins and divinylarene. Other epoxy resins may also be selected from commercially available products such as D E R 33 i8, d e r 332, d e r Μ*, D.E.N. 438, D.E.R. 736 or D.E.R. 732 D.E.R. 580, D.E.N. 431 epoxy resins available from Zixin Chemical Company. The concentration of the total epoxy resin used in the formulations of the present invention will depend on the fraction of the other formulation components, and in a particular embodiment may range from about 1 to about 99 wt%, in another embodiment. 2 _ to about μ 纠 % within the dry circumference, in another embodiment, from about 5 wt% to about % (four) 201231462 and in yet another embodiment, from about 10 Wt% to about 90 wt%. Any of the polythiol compounds containing at least one thiol (-SH) moiety can be used in the curable composition of the present invention in the broadest range of the present invention. For example, [the polythiol compound (component (1)) used in the present invention in a specific example may contain, for example, any organic compound having two or more thiols (-SH). In a specific example, the polythiol compound (component (b)) suitable for use in the present invention may comprise, for example, any of those having from 1 to about 20 carbon atoms each having two or more thiol (_SH) moieties. A substituted or unsubstituted alkyl or aromatic group. Examples of polythiols suitable for use in the present invention include polythiols such as 3-800, 40 SEC HV and L0F available from BASF Corporation; polysulfides such as polysulfide rubber Lp_2 available from T〇ray Fine Chemicals Co., Ltd. , Lp_3, 2, [pH, LP-32, LP-33, LP-977 and LP-980; purchased from Br_B〇ck Chemische

Fabrik GmbH & Co. KG Thiocure pETMp, TMpMp, GDMp and TMPMA; gambling from Chevron PhilHps Chemical LLP's polythiol 358 '407 and 805C; and mixtures thereof. In general, the concentration of the polythiol compound used as component (b) of the curable composition in the present invention may generally range from about i wt〇/〇 to about 99 wt% in one embodiment, in another In one embodiment, it is in the range of from about 2% to about 98% by weight, in yet another embodiment, in the range of from about 5 to about % by weight, and in yet another embodiment, from about 1% to about 9% by weight. Within the wt% range. In the broadest scope of the invention, the catalyst of the invention may comprise any amine compound containing at least two nitrogen atoms which are separated by two or more substituted or unsubstituted carbon atoms 12 201231462. For example, a well-characterized catalyst can be used to kill people, and this preparation can be represented by the following chemical formula: What compound: 6 &

Ri Ν· R2

Re -z-

-N

R8n L -- mAJL R4 where Z, R| to r8, n, m and m + n are as defined above. The remainder of the catalyst containing the fragment of Formula 1 above can be any organic group having from i to about 20 carbon charcoal and optionally having any of the tertiary amine functional groups defined above. Suitable catalysts suitable for use in the present invention may include, for example, one or more catalysts: ch2 CH> ch5

JEFFCAT PMDETA); pentadecyl-extended ethyltriamine (eg

H3C -N CH, CH, mercapto-4-(2-dimethylaminoethyl)piperate 13 201231462 Well (eg JEFFCAT TAP)

Di-propyltriamine (eg JEFFC AT ZR-40)

CHj N,N,N-gin-(3-dimethylaminopropyl)amine (eg JEFFCAT Z-80); (CHa)rN (CH3)2 (CH3)2-N (CHj)3 (CHj) 3-N (CHs) 2 1,3,5-paran (3-(didecylamino)propyl) hexahydro-average tillage (eg JEFFCAT TR-90); ch3 I ύ

曱基培口 well (eg JEFFCAT DMP ch3 CH,

Bis-(2-dimethylaminoethyl)ether You J Shikou JEFFCAT ZF-20 14 201231462

w,i,8 diazabicyclo[5.4.G]deca-carbon 1 dilute (face h3c' CH' 丄NJ'ch3 'CH- , tetradecyl-1,4-butanediamine TMBD); CH3 ch3 The 'N CH3 amine; and mixtures thereof for use in the catalyst of the invention may, for example, be used in a single component or in combination with other catalysts known in the art. The indifference of the catalyst used in the formulation of the present invention depends on the fraction of the other formulation components, and in one embodiment may range from about 0.01 wt% to about 20 wm, and in another concrete form 2 in about 〇 .lwt% to about 1〇wt%, in another_specific example in about i

From wt% to about 1 〇 wt% and in the range of about 2 wt〇/〇 to about 10 wt% in another and in the case of A. Dan. Other optional components may be used in the curable composition of the present invention, including, for example, a curing agent other than a thiol compound (used as a co-curing agent), such as an amine with active hydrogen; other thermosetting resins such as those described above. A film by Lee et al. (4) Office (10) Moxibustion/Office (10) Rings as described in the following, resin: filler, such as clay 'talc, sulphur dioxide or carbon (IV); solvent, such as ether or alcohol; a toughening agent, such as an elastomer or liquid block copolymer; a pigment such as carbon black or iron oxide; a surfactant such as polyfluorene; a fiber, a fiber such as glass fiber or carbon fiber; and two or more of the above Condition 201231462 The mixture of components selected. In general, the concentration of any of the compounds selected for use in the compositions of the present invention will generally range from 0 wt% to about 9 wt% in one particular example, and about 0.0 i wt% in another embodiment. It is in the range of about 80 wt%, in another embodiment, in the range of about 1 wt% to about 65 wt%, and in yet another embodiment, in the range of from about 10 wt% to about 50 wt%. The preparation of the curable resin composition of the present invention is achieved, for example, by blending the components of the present invention in a container, including divinylarene dioxide, a polythiol curing agent, a catalyst, and any other optional groups. (Additional additives and/or solvents selected as appropriate in the above-mentioned items); and then the components are formulated into a curable resin composition. The order of mixing is not critical, i.e., the formulation or composition of the compositions of the present invention can be provided in any order: the thermally curable or curable composition of the invention. Any of the above-described optional formulation additives (e.g., fillers) may optionally be added to the composition during mixing or prior to forming the composition. In some cases, = the catalyst may be dissolved in the epoxy resin component or the polythiol component prior to combining with other compounding components. By preparing a solution of the catalyst in the epoxy resin or the polythiol component by 咼 刊 . 、 、 、 、 、 、 、 、 、 、 、 、 、 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型 典型/, I Ί; The viscosity of the heart is effective at the temperature of the resin composition. Production, 1 Ding Cheng 5 and i Knife in a specific example, the temperature production during the mixing of the components - about 0 ° c to about I0 (rc and in another specific example is about to about ° ° C. In a preferred embodiment, the dioxane aryl aryl alcohol 26 16 201231462 alcohol compound, a catalyst, and optionally a component may be mixed at a temperature of about 2 Torr (>c to about π c. Below the above range, the viscosity of the formulation may become excessive, and at temperatures above the above range, the formulation may react in advance. The above-described curable resin composition of the present invention is known in the art. The composition has an improved cure rate compared to the composition. For example, the cure rate of the compositions of the present invention is within a predetermined period of time (such as within about 48 hours in one particular example and within about 24 hours in another embodiment) And in yet another embodiment within about 18 hours; wherein the predetermined period of time provides no-flow, non-stick, and solvent resistant for preparing the formulation, applying the formulation to the substrate, and exposing the formulation to ambient conditions) Curing material. The invention The component (divinylarene diene oxide (such as dvbd〇) can be used as a separate epoxy resin to form a resin matrix in the final formulation; or the divinylarene dioxide resin can be used as one of the final formulation components. Another thermosetting resin, such as another conventional epoxy resin, is used in combination. One of the advantages of the curable composition of the present invention includes the ability of the composition to cure under ambient strip = as used herein with respect to the compositions of the present invention. By "ambient condition" is meant that the composition can be cured at a temperature of from about Torr to about 50 C and at a pressure of about 1 bar. In a preferred embodiment, the composition can be at room temperature ( The cured resin composition can be cured at a predetermined temperature for a predetermined period of time sufficient to partially or completely cure the composition. The temperature of the cured formulation is in a specific state. In the example, generally 17, 201231462 may be from about 0 ° C to about 50 ° C; in another embodiment, from about 1 Torr to about 4 ° C; and in yet another embodiment, about 2 Torr. : to about 3 (r c; and the curing time may be selected from about 0.0 hr to about 48 hours in one specific example, between about 1 hr to about 24 hr in another specific example, and in about 1 in another specific example. Between hours and hours: about less than about an hour, the time may be too short to ensure adequate response under conventional processing conditions; and above about 48 hours, the time may be too long to be practical or Uneconomical. The curing process of the present invention can be batch or continuous. The reactor used in the process can be any reactor and auxiliary equipment well known to those skilled in the art. Methods of Composition Producing Thermoset Products may include, for example, gravity casting, vacuum casting, automatic pressure gelation (ApG), vacuum pressure gelation (VPG), infusion, filament winding, laminating injection, transfer forming, prepreg impregnation, Apply 'spray, brush and the like. The cured composition obtained when the curable composition is cured exhibits excellent characteristics such as organic solvent resistance and surface hardness. The characteristics of the cured product of the present day and the month may depend on the nature of the components of the curable formulation. In a preferred embodiment, the cured composition of the present invention is coated with H Double Mo (4) (10) after being soaked in a cotton nipple soaked in methyl ketone. In the preferred embodiment, the cured composition of the present invention is:

The spoon has from 5 to about 100, in another embodiment, from about 10 to about 100, and in specific examples from about 10 to about 10, the Shore A hardness value (sh0-hardness value). Re A 18 201231462 The curable composition of the present invention can be used in applications using conventional epoxy resins (such as in coatings, films, adhesives, encapsulation, castings, composites, laminates, electronic devices, electrical lamination) Used in the fields of products, insulation, civil engineering and construction and similar fields. For example, in one specific embodiment, the cured compositions of the present invention are suitable for use in environmentally cured coatings and adhesives.

Embodiment I The following examples and comparative examples are intended to describe the present invention in further detail, but are not to be construed as limiting. Various terms and names are used in the following examples, such as: "DVBDO" means divinylbenzene dioxide. The DVB DO used in the examples was divinylbenzene having an oxygen equivalent of 81 g/eq. Polythiol 358 is a thiolated soybean oil (MSO) having a thiol equivalent weight of 354 g/eq.

Jeffcat is an amine catalyst available from Huntsman Performance Products; and is a trademark of Jeffcat T1^ Huntsrnan. In the following examples, standard analytical equipment and methods were used, such as: Shore A hardness using astM D2240 as measured by Shore-Instron's Shore A durometer. "Tack-free" means that the cured formulation is non-tacky, as determined by the absence of stickiness or material clarity on the surface of the cured formulation when manually applied with a stick. 、, :用和聚醇醇358 19 201231462 Add 1.0 g DVBD Ο, 4.0 g polythiol 3 5 8 (epoxide/thiol equivalent ratio 1.1) and 〇· 1 g to the 20 m L platelet Amine catalyst. The resulting formulation mixture was mixed for 1 minute, poured into a 5.1 cm aluminum pan and allowed to cure at ambient temperature (20 ° C to 25 ° C) for 18 hours to form a non-sticky flexible solid. The amine catalysts used in Examples 1 to 3 are listed in Table I. Further, the Shore A hardness values of the obtained cured materials are also listed in Table 1. In Examples 1 to 11, the DVBDO-catalyst mixture was heated to 50 ° C for 5 minutes to dissolve the catalyst, and then the mixture was cooled to about 30 ° C. The cooled DVBDO-catalyst mixture was added to the MSO (thiol compound) and the two were mixed together. The resulting formulation mixture was poured into an aluminum pan as described above to cure. Each of the cured samples of Examples 1 to π showed no adhesion and showed no scratches after double rubbing for 100 times with a cotton applicator soaked in mercaptoethyl ketone. Table I - Catalysts corresponding to Shore A hardness of DVBDO-MSO cured compositions. Example amine catalyst Shore A hardness 1 1,4-diazabicyclo[2.2.2]octane (DABCO) 62 2 1^ Where 1^^^-五曱基二伸ethyltriamine !£^^1^0 丑丁八) 50 3 1,4·Dimethyl 派井井 (Jeffcat DMP) 35 4 1-Methyl- 4-(2-Didecylaminoethyl) piperene (Jeffcat TAP) 48 5 bis-(2-dimethylaminoethyl)ether (JeffcatZF-20) 54 6 1^凡1^,^&quot ;-Pentacyl di-propyltriamine ([[^^211-40) 53 7 N,N,N,-para-(3-didecylaminopropyl)amine (Jeffcat Z-80) 57 8 1,3,5-parade (3-(didecylamino)propyl)hexahydro-all three tillage (Jeffcat TR-90) 57 9 1,8-diazabicyclo [5.4.0] eleven carbon -7-ene (DBU) 48 10 N,N,N',N,-tetradecyl-1,4-butanediamine (TMBD) 47 11 Ν,Ν,Ν',Ν1-tetradecyl-1, 6-Hexanediamine (TMHD) 54 20 201231462 Recombination implementation... A 4 I : Curing non-catalysts listed in Table II with hot pVBDO and polysulfon 358 as in Examples 1 to 11 The evaluation is performed. After 18 hours at ambient temperature, the formulations of Comparative Examples A through I remained liquid and did not cure.

The chemical structures and chemical names of the non-catalysts used in Comparative Examples A to 显 which are not shown in Table II are as follows: 21 201231462

Ch3, ch3

1,8-bis(didecylamino)naphthalene (Proton Sponge)

H2N

Diethyltriamine (DETA) ΝΗ N,N-dimercapto amidoxime (BDMA) h3c^ ^n^.ch3 ch3 triethylamine

Ch3 xh3

Η 0 洛洛 bite 1,3,5-trimethylhexafluoro-1,3,5-three wells (ΤΜΗΤ)

slightly. set

OH

2,4,6-gin(diamidomethyl)phenol (DMP-30) ΝΗ ch3 ch3 ' 1,1,3,3-tetramethyl 胍 [Simple description] No [Major component symbol description] Benefit 4 **> 22

Claims (1)

201231462 VII. Patent application scope: ι A curable composition comprising (a) at least one - 'gasification-ethylene aryl aromatic tobacco; (b) at least one polythiol compound curing I, a J and (C) a catalyst; wherein the curable composition is capable of being cured in the environment. [2] The curable composition of claim 1, wherein the at least one type of Dunhua divinylarene comprises divinylbenzene dioxide. 3. The curable composition of claim 1 The curable composition of the at least one divinylarene-containing hydrocarbon in an amount of from about 1% by weight to about 99% by weight. The curing composition according to the invention of claim 2, wherein the at least one polythiol compound curing agent comprises A curable composition comprising at least one thiol moiety. 5. The curable composition of claim 3, wherein the at least one polythiol compound curing agent is present in a concentration of from about 99% by weight to about 1% by weight. The curable composition of claim 1, wherein the at least one catalyst comprises one or more compounds having the following formula: -"m R5 ---z Re , wherein z in the above structural formula i contains hydrazine, s or a single bond; and 1 to R 4 each comprise an alkyl group or a cycloalkane each having from 1 to about 20 carbon atoms 23 201231462, Rs Each of Rs individually comprises H or an alkyl or cycloalkyl group, wherein the alkyl or cycloalkyl group each independently has from L to about 20 carbon atoms; n comprises an integer from 2 to 20; m comprises an integer 〇 to 18; And m+n comprises an integer less than or equal to about 20; and the remainder of the catalyst containing the fragment of the above formula contains an organic group having from 1 to about 20 carbon atoms. The curable composition of claim 6, wherein n comprises 2 to an integer less than or equal to 1 ;; m comprises an integer 〇 to about 8; and wherein m + n comprises less than or equal to about ι 8 Integer. 8. The curable composition of claim 6 wherein n comprises from 2 to an integer less than or equal to 6; the paw comprises an integer 〇 to about 4; and m + n comprises an integer less than or equal to about 6. 9. The curable composition of claim 6, wherein the curing catalyst comprises 丨,4-diazabicyclo[2·2 2]octane; Ν, Ν, Ν, Ν, Ν, Ν, - pentamethylethyl ester January female, I, 4 - bisinyl basal well; 1-methyl _4_ (2 dimethylamino basal) bottom well, bis-(2-didecylamine Ethyl ethyl ether; hydrazine, hydrazine, hydrazine, Νη, Νπ-pentamethyldipropyltriamine; ^^ _(3-dimethylaminopropyl)amine; 1,3,5_^ (3 (-Methylamino)propyl) hexahydro_s_ three wells; 丨, 8_diazabicyclo[5 4 〇] eleven slave-7-ene; N,N,N',N,_ Tetramethyl group, dibutyl diamine; N, N, N, N, _ tetramethyl-1,6-hexanediamine; or a mixture thereof. The curable composition of claim 6, wherein the concentration of the curing catalyst is from about 0.1% by weight to about 20% by weight. , 1丨h as claimed in the patent scope 帛1 of the curable composition, including epoxy resin other than 乂# divinylarene dimerate', in addition to the active hydrogen of the thiol compound curing agent Curing agent, filler, 24 201231462 kinetic, adhesion promoter or a mixture thereof. 12. The curable composition of claim 1, wherein the composition is capable of curing into a tack-free cured composition within about 48 hours under ambient conditions. I3. The curable composition of claim 1, wherein the composition is capable of curing into a non-stick cured composition within about 24 hours under ambient conditions. 14. The curable composition of claim 1, wherein the composition is curable to form a non-stick cured composition within about 8 hours under ambiguous conditions. 15. A method of preparing a curable composition or system, the method comprising blending (a) at least one divinylarene diene oxide, (b) at least one polymethanolating agent curing agent, at least one catalyst Wherein the curable composition or system is capable of being cured under ambient conditions. I6. A method of preparing a curable composition or system, comprising the steps of: - blending a monoethylaphthalene aromatic hydrocarbon with at least one catalyst to form a first solution; and (11) step ( 1) The first solution is exchanged with at least one polythiol curing agent. I7. A method of preparing a curable composition or system comprising the steps of: (A) incorporating at least one polythiol curing agent with at least one catalyst to form a first solution; and / / 25 201231462 solution and at least one Dioxide (B) combines the first ethyl aryl cigarette of step (A). 18. A cured product comprising a cured composition as claimed in claim ii, wherein the cured product comprises a non-stick surface. 19. A cured product comprising a cured composition as claimed in the scope of the patent application, wherein the cured product comprises an un-marred surface after rubbing the surface with an organic solvent. 20. A cured product comprising a cured composition according to the scope of claim 2, wherein the cured product comprises a Shore A hardness (Sh〇re Ahardness) of from about 5 to about 100 as determined according to ASTM 〇224〇 .疋21, A method of preparing a thermosetting product, comprising the steps of: (i) preparing a curable composition comprising blending (a) at least one, a vinyl arene, (b) at least one polythiol compound curing agent And (at least a catalyst; wherein the curable composition is capable of being cured in an environment; and under conditions) curing the curable composition under ambient conditions. wherein the environmental condition package 22 is as claimed in claim 21 The method of the item includes a temperature of about o ° c to about 50 ° C. 8. Pattern: & • *»> 26