201227768 六、發明說明： 【發明所屬之技術領域】 本發明是一種電子元件的製造技術，尤其是 膜式電容器的製造方法。 _ 【先前技術】201227768 VI. Description of the Invention: [Technical Field] The present invention relates to a manufacturing technique of an electronic component, and more particularly to a method of manufacturing a film capacitor. _ [Prior technology]
電容器是儲存電荷的電子元件，它在工業生產和生活 中的用途很廣，是電子、電力領域不可缺少的元件，主要 疋作為阻絕直流、_合交流、濾波、調諧、相移、儲存能 里、作為旁路、麵合電路、制口八系统的網路等等，甚至也 被應用於相機之中的閃光燈等儲電放電用途。 而根據材料及結構的不同，電容ϋ又可分為電解带 容、固態電容、薄膜電容、陶莞電容、组電解電容、雲: 電容、玻璃釉電容、聚苯乙埽電容、玻璃膜電容、合^ 解龟各、條綸電容、聚笨稀電容等。 ” 其中薄膜電容是先在絕緣材質的薄膜上蒸鑛— 材質而形成薄膜導體，並把薄膜導體捲成素子後、於早 ⑽線做成的’由於薄膜電容具有良好的頻率 應特性、輕巧的體積以及優良的自我恢復能力，因此= 泛應用於音響電路之中。此外，隨著現今以小 = 聯代替高價的大容量電_勢下，触 電錢 旁路電路(bypass)部位亦大量軸吏用。、％ '線路的 然而薄膜電容與電解電容，陶究 相比之下雖具有較大的電容 201227768 膜導體部分，隨著製造工程 電容在抑制雜訊噪音和品質 ，甚至影響製造出來的電容 車父困難’特別是電容器中的薄 和方法的不同，所製造出來的 品質方面的表現會有顯著差異 用途。 位般的聚_產品多用於繼電器發射信號的部 位。福溥膜電容由於是低端的產品，多用於低價的安定 器Γ號部。薄膜電容聚丙婦電容，聚酉旨薄膜電 ΓίΓίΓ容職可啸據㈣叹製造方法的不 冋，擁有夕樣的音質以及音色的特性。 =請_ i目’如騎示’ 容製造方 法疋先將捲取機依據捲取容量的中心值來設置回轉數、办 度。並把薄膜導體以捲取機捲成圓柱狀的素子，接著取= 定數量的素子置放在熱屢縮機的熱壓縮板上，以敎壓 2上赫子進行加細及辭的_，私使素子的結構 =加機械強度，排除内部氣體以及提綠_ 疋性。熱壓處理後，再騎子進行錢 _ =業2續噴灑工程的前置作業，為避免素料 接j附金屬材料，而在素子周圍包了一層紙膠帶。在 遮敝封裝後㈣在素子喊_上錫粉，㈣素子 導體有效引出。接著是轉工程，為了去除素子兩邊薄膜 的殘邊，在轉工程時進行電顯理，並且在素子兩邊炫 焊上兩刺嶋，在__時， 然後以_解錢行齡。㈣是賴乾燥工程。 把預熱乾無完的產品進行浸潰後，便是在產品外進行上粉 201227768 處理的上粉階段。按刻印式樣進行刻印後，再使用樹脂切 割機切除樹脂。接著經過1次，2次硬化乾燥階段。最後， 通過構4查’自動選別，最終檢查工程，判定選別出不 良後，一批薄膜電容就製造出來了。 在上述製造過程中，由於生產製造用的機台運轉時會 產生的振動，_對絲本糾魏缝及壽命沒有影 二仁振動可能引發噪音，降低了薄膜電容的品質。此外 薄膜电谷在捲取作業時，由於自動捲取機的彈性，使薄膜 之2存在間隔。或是捲取後的素子在浸潰時，當臘沒有完 全浸潰的情況下。以及在電壓處理時，由於電氣引起的振 動也能造成噪音。 【發明内容】 」综合上魏有技術之缺點，本發日简目的在於提供— 種薄膜電容的製造方法，使製造出的電容H與-般經熱壓 縮的薄膜電容ϋ概較下具有更顿噪音，以及 用電流。 本么明之另-目的在於，以施加物理特性的力的基礎 上來提高電容器在電子電路方面的特性。 為了達到上述目的，本發明圓柱型電容器的製造 包含以下步驟·· 首先以捲取機將薄臈導體卷成圓柱形的素子；再將素 子進储處理，使素子定型並排除内部溼氣；接著進行遮 敝封裝階段；完成遮蔽封裝後在素子兩端嘴麗錫粉，使薄 5 201227768 膜導體巾的極板順利導出，再於素子喷上錫粉的兩端進行 熔焊，將引腳線熔焊於素子兩端；完成熔焊之後的素子以 躐或灌膠進行浸潰後’在產品外進行上粉處理鄉成外殼 的上粉階段。按刻印式樣進行刻印後，再使用樹脂切割機 切除樹脂。接著分別經過i次硬化乾燥階段以及2次硬化 乾燥階段。最後，通過構造檢查，自動選別，最終檢查工 程，判定選別出不良後，便完成了圓柱型f容的製造。 在上述的熱處理階段中，為了保持素子本身的圓柱 形狀態，並未對素子施祕力，僅單純的進行熱處理。並 且在喷灑雜增大所喷獅錫粉齡，避免因錫粉填滿捲 心孔而導致電性連通。 在溶焊階段中’引腳線熔悍到素子面的三分之二距離 的支點上，讓引腳線封閉捲心孔的兩端，使素子中的捲心 孔形成-氣密空間，避免捲心孔處漏出空氣的同時，也避 免了外部空氣進入捲心孔。 本發明藉著利用引腳線將素子中的捲心孔封閉形成氣 密空間，使素子可在保有捲心孔的同時維持高機械強度， 並錯著未經壓縮的圓柱型結構而增加電容器抑制噪音的功 效，以及使用於旁路電路時提高可用魏的效果。 【實施方式】 為便於對本發明的結構、使用及其特徵有更進一步明 確、誶貫的認識與瞭解，現舉出較佳實施例，並 說明如下。 201227768 …見明參考帛2 ® ’以本發明製造方法所製造的圓柱型 =奋器100基本構造具有由薄膜導體捲繞而成的素子， 然後在素子110的兩側炫'焊上引腳線14〇後封裝而成。上 述引腳線140是炫烊到素子11Q的兩側，且兩引腳線⑽ 的溶焊方向是相同的；且引腳、線M0的前端溶焊到素子110 側面直徑二分之二的位置上，使引腳線14〇封閉捲心孔⑽ 的兩端而讓捲心孔13()形成—氣密空間。 • 再請參照第7a圖與第％圖，如圖所示，習用的壓縮 '電谷在引腳線丨4〇炫焊時’引腳線⑽的溶焊部位約為 素子110側面直/^的二分之—處。*本發明提到的圓柱型 電容器100的引腳線140的溶焊部位是橫過素子110的捲 心孔130，並在側面三分之二的位置進行炫谭。 。採用上述方法進行料的目的是為了防止在上粉後乾 燥的過程巾，在捲心孔13G的位置發生氣孔不良，同時也 有德、封捲心孔130的作用。 見明 > 閱弟3圖，為了更明確的說明本發明圓柱型電 容器的製造方法，現配合程序流程圖按順序進行詳細說明。 在卷取階段（S210)使用捲取機，對捲取的容量中心 值’回轉數’寬度進行設置後’把薄膜導體捲成素子11〇。 需注意的是，一般壓縮式電容的薄膜導體在卷取成素 子no時，使用的捲軸的直徑為2〜7公釐。而圓柱型電容 器100在捲取成型時，使用的卷軸的直徑為1〜3公釐。 而為了使中央具有捲心孔130的素子11〇保持足夠的 機械強度，以及避免薄膜導體從捲心孔13〇處發生自動開 201227768 圭I的現f。在㈣的壓縮式電容製程帽取了熱壓縮的工 而發明的圓柱型電容器100使用了較小直徑的絲， 因而不用進行此一熱壓縮步驟。Capacitors are electronic components that store electric charge. They are widely used in industrial production and life. They are indispensable components in the fields of electronics and electric power. They are mainly used to block DC, _AC, filter, tuning, phase shift, and storage. As a bypass, a face-to-face circuit, a network of eight-port system, etc., it is even used for storage and discharge applications such as flash lamps in cameras. According to different materials and structures, capacitors can be divided into electrolytic strip capacitors, solid capacitors, film capacitors, ceramic capacitors, group electrolytic capacitors, clouds: capacitors, glass glaze capacitors, polystyrene capacitors, glass membrane capacitors, Combine the turtle, the strip capacitor, the squeezing capacitor and so on. The film capacitor is made by first evaporating the material on the insulating material to form a thin film conductor, and after winding the film conductor into a prime, it is made in the early (10) line. Because the film capacitor has good frequency characteristics, light weight. Volume and excellent self-recovery ability, so = is widely used in audio circuits. In addition, with the current large-capacity electricity in the small = joint, the electric shock bypass circuit (bypass) also has a large number of axes吏 。 、 % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % % 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜 薄膜Capacitor car fathers' difficulties, especially in the thinness and method of capacitors, the quality of the manufactured performance will be significantly different. The poly-products are used in the relay to transmit signals. The low-end products are mostly used in the low-cost ballast nickname. The film capacitors are used to make the film capacitors, and the film is used to make the film (4) Sighs the manufacturing method, has the sound quality of the evening and the characteristics of the tone. = Please _ i mesh 'such as riding the display' capacity manufacturing method, first set the reel according to the center value of the winding capacity to set the number of revolutions, degree And the film conductor is wound into a cylindrical element by a coiler, and then a predetermined amount of the element is placed on the hot compression plate of the heat shrinking machine, and the _, _, The structure of the private element = mechanical strength, the exclusion of internal gas and the promotion of green _ 疋. After the hot pressing treatment, the rider carries the money _ = industry 2 continued spray project front work, in order to avoid the material attached to j Material, and a layer of paper tape around the element. After the concealer is packaged (4) in the prime minister shouting _ tin powder, (four) elemental conductor is effectively led out. Then the transfer project, in order to remove the residual edge of the film on both sides of the prime, during the transfer project Conduct electric sensation, and brightly weld two hedgehogs on both sides of the prime, in __, then _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The powdering stage of the processing of the powder 201227768 is carried out outside the product. After the engraved pattern is engraved, the resin is used to cut the resin. Then, one pass and two hardening and drying stages are passed. Finally, the structure is checked by automatic inspection, and the final inspection is performed to determine the batch of film capacitors. In the above manufacturing process, due to the vibration generated during the operation of the machine for manufacturing, the vibration of the wire and the life of the wire can cause noise and reduce the quality of the film capacitor. In the coiling operation, due to the elasticity of the automatic coiler, there is a gap between the film 2, or the film after the coiling is in the case of impregnation, when the wax is not completely impregnated, and in the voltage treatment. At the time, vibration caused by electrical can also cause noise. [Summary of the Invention] The general purpose of this invention is to provide a method for manufacturing a film capacitor, and to manufacture a capacitor H and a The hot-compressed film capacitor ϋ has a lower noise and uses current. The other is to improve the characteristics of the capacitor in terms of electronic circuits based on the force exerting physical properties. In order to achieve the above object, the manufacture of the cylindrical capacitor of the present invention comprises the following steps: First, the thin tantalum conductor is rolled into a cylindrical element by a coiler; the element is then stored for processing, the element is shaped and the internal moisture is removed; Carry out the concealing and encapsulating stage; after completing the shielding and encapsulation, the tin-plated tin powder is sprinkled at both ends of the element, so that the plate of the thin 5 201227768 film conductor towel is smoothly exported, and then the ends of the tin powder are sprayed on the ends of the powder, and the pin line is welded. The welding is carried out on both ends of the element; after the completion of the welding, the element is impregnated with sputum or potting, and then the powder is processed outside the product to form the outer layer of the shell. After engraving in the engraved pattern, the resin was cut using a resin cutter. Then, it passes through the i-hardening drying stage and the secondary hardening drying stage, respectively. Finally, through the structural inspection, automatic sorting, final inspection of the project, and determination of the bad after the selection, the manufacture of the cylindrical type f capacity is completed. In the heat treatment stage described above, in order to maintain the cylindrical state of the element itself, no force is applied to the element, and only heat treatment is simply performed. Moreover, the age of the sprayed lion powder is increased during the spraying, so as to avoid electrical connection due to the tin powder filling the core hole. In the soldering stage, the 'pin line is fused to the fulcrum of the two-thirds of the surface of the element, and the pin line is closed at both ends of the core hole, so that the core hole in the element forms a gas-tight space, avoiding At the same time as the air leaks from the core hole, external air is also prevented from entering the core hole. The invention closes the core hole in the element by using the pin line to form an airtight space, so that the element can maintain the high mechanical strength while retaining the core hole, and increase the capacitor suppression by the uncompressed cylindrical structure. The effectiveness of the noise, as well as the effect of using the Wei when used in the bypass circuit. [Embodiment] In order to facilitate the understanding and understanding of the structure, the use and the features of the present invention, the preferred embodiments are illustrated and described below. 201227768 ... see the reference 帛 2 ® 'The cylindrical type manufactured by the manufacturing method of the present invention = the basic structure of the device 100 has a metal element wound by a thin film conductor, and then sleek on both sides of the element 110 Packaged after 14 inches. The above-mentioned pin line 140 is dazzled to both sides of the prime 11Q, and the welding directions of the two lead wires (10) are the same; and the front end of the lead and the wire M0 is welded to the position of two-half of the diameter of the side of the element 110. Upper, the pin line 14 is closed to close both ends of the core hole (10) to allow the core hole 13 () to form an airtight space. • Refer to Figure 7a and Figure %. As shown in the figure, the conventional compression 'Electric Valley is soldered at the pin line 丨4〇'. The soldering site of the pin line (10) is about the side of the element 110 straight /^ The dichotomy - at. * The soldered portion of the pin line 140 of the cylindrical capacitor 100 of the present invention is traversed through the core hole 130 of the element 110, and is placed at a position two-thirds of the side. . The purpose of the material by the above method is to prevent the process towel which is dried after the powder is applied, and the pores are broken at the position of the core hole 13G, and the function of the core hole 130 is also formed. See the > Figure 3 for a more detailed description of the manufacturing method of the cylindrical capacitor of the present invention, which will be described in detail in the order of the program flow chart. In the winding stage (S210), the coiler is used, and the volume center value "revolution number" width of the winding is set, and the film conductor is wound into a factor of 11 turns. It should be noted that the film conductor of a general compression type capacitor is used to take the element no, and the diameter of the reel used is 2 to 7 mm. The cylindrical capacitor 100 is used for coil forming, and the diameter of the reel used is 1 to 3 mm. In order to maintain the mechanical strength of the element 11〇 having the center hole 130 in the center, and to prevent the film conductor from automatically opening from the core hole 13 , the current f is opened. The (C) compression type capacitor processing cap takes the thermal compression work and the cylindrical capacitor 100 invented uses a smaller diameter wire, so that this thermal compression step is not required.
現請參閱第如圖及第4b圖，如圖中所示，習用的麼 縮式電容必須經過座縮作業才能使素子110具有足夠的機 械強度，碰騎財素子⑽的上下面受力，使捲心孔 130的部位也被壓、缩。而本發明所提到的圓柱型電容器僅僅 在定的時間内對素子110進行熱處理。並不施加壓力。 所以在作業完成後，素子110仍然保持圓形的形態。 所以壓縮式電容受到了物理性的壓力作業，會造成電 氣方面的雛如壓降，敏糕或絕緣電_都將同步受 到影響。 再請參閱第3圖，在噴•程（S216)，通過調節喷麗 距離、厚度、壓力、電壓、電流、溶化速度，在素子110 的兩側噴社金屬錫粉，只有經過了喷麗工程才能使引腳 線140堅固的溶焊到素子no上。 此階段作業時，要求噴灑的錫粉顆粒必須比一般的壓 縮式電容所使用的錫粉顆粒大。目的是為了在噴灑的同時 堵住素子110兩侧的捲心孔130。使捲心孔13〇保持中空而 不至於連接，造成短路現象。 現睛參閱第5圖、第6a圖以及第6b圖，在喷灑作業 時，金屬錫粉喷灑在素子11〇的兩側，在喷灑圓柱型電容 器100時，如果同樣的調節喷灑小顆粒錫粉的話，錫粉就 會從素子110兩侧進入圓柱型電容器⑽的捲心孔13〇内， 8 201227768 並塞滿捲心孔130 ’使捲心孔130連通而發生短路的不良現 象。 而於第6a圖及第6b圖中所示是在喷灑時所用的錫粉 顆粒放大圖。第6a圖是將一般壓縮式電容於嘴灑時所使用 的錫粉顆粒放大50倍的相片’由比例尺可知每個锡粉顆粒 約3公釐左右。而第6b圖中所示的是圓柱型電容器1〇〇所 使用的錫粉顆粒經放大50倍的照片，由圖中顯示每個顆粒 約為7公S。在此使用的照片是由韓誠業技術測試中心 (KTL)進行放大測試的結果，也就是說，圓柱型電容器 1〇〇所使用的錫粉顆粒不但比一般壓縮電容所用的錫粉顆 粒尺寸要大2倍社，啊也比捲,现13Q的直徑還大。 則當錫麵㈣素子11G _鱗，除了可將薄膜導 體的極板引出之外，更可將捲心孔130的兩端封閉。 再請參閱第7a圖以及第7b圖，在轉作斜，習用 的壓縮式電容在炫焊引腳線14〇時，引腳線14〇枯貼到素 子二10側面的位置是素子110直徑的三分之一。而圓柱型 電容器1〇〇的引腳線140橫過中央的捲心孔13〇，溶焊到素 子110側面的距離是素子11〇直徑的三分之二。這是為了 防止在上财的麵階段，捲心孔13()雜發生氣孔不良。 因此在=焊步驟時便利用引腳線M0再次密封捲心孔130。 現明參财3 U，其中浸潰階段(S22_最後的包裝出 貨㈣S228)與—般的壓縮式電容製作過程是相同的，在些 就不詳細介紹。 一 由本發明所製造出的圓柱型電容器100具有中空且氣 2〇1227768 进的的捲心孔13G ’整體的_導體也保持為圓柱型未智愿 縮，因此由本發明所製造出的圓柱型電容器100與習= 屋縮式電容相比較下，不但減少了噪音，更增加了可 流。 ％ 現請參閱第8目，如圖中所示，_式電容的噪音平 =為72，最小值與最大值分別是69 *乃。而圓柱型^ 裔綱的平均。喿音值是51，最小值與最大值分別是5〇和 52。由此資料看來，圓柱型電容器⑽比壓縮式電容能 少30%~40%的噪音效果。 再睛參考第9 ® ’如圖聯當電容蹄各種不同溫度 情況下所測得的可用電流值，習用的壓縮式電容器在溫^ „ l‘:C ’ 3。。，5。。，7。。以及1(TC的條件下，可用電流 分別是“1.53 ’ 3.28 ’ 5.14，6.43以及6.79”而在本發明所 提到的圓柱型電容器觸，在同樣的溫度條件下，可用電流 分別是 “1.72，3.86，5.6卜 6.59 及 7.23”。 再請參閱第l〇a圖與第勘圖，圖中所示是圓柱型電 容器10G和壓縮式電容的電氣性比較資料。由圖表所列的 數據中可知本發明所述的圓柱魏容器⑽在電氣性能方 面，諸如損失值、耐電壓、絕緣電阻等方面都有了顯著的 改善。 以上所舉實施例’僅用為方便說明本創作並非加以限 制’在不離本創作精神範脅，熟悉此一行業技藝人士依本 創作申請專利範圍及創作說明所作之各種簡易變形與修 飾，均仍應含括於以下申請專利範圍中。 201227768Referring now to Figure 4 and Figure 4b, as shown in the figure, the conventional capacitor must be subjected to a squashing operation to enable the element 110 to have sufficient mechanical strength to be subjected to the force of the upper and lower sides of the carrier (10). The portion of the core hole 130 is also pressed and contracted. The cylindrical capacitor of the present invention heats the element 110 only for a predetermined period of time. No pressure is applied. Therefore, after the operation is completed, the element 110 remains in a circular shape. Therefore, the compression capacitor is subjected to physical pressure work, which will cause a voltage drop in the electrical field, and the sensitive cake or the insulated electricity will be affected at the same time. Referring to Figure 3, in the spray process (S216), by adjusting the spray distance, thickness, pressure, voltage, current, and melting speed, the metal tin powder is sprayed on both sides of the element 110, only after the spray project In order to make the pin line 140 firmly soldered to the prime no. At this stage of operation, the tin powder particles required to be sprayed must be larger than the tin powder particles used in the conventional compression capacitors. The purpose is to block the core hole 130 on both sides of the element 110 while spraying. Keeping the core hole 13〇 hollow and not connected causes a short circuit phenomenon. Now look at Figure 5, Figure 6a and Figure 6b. During the spraying operation, the metal tin powder is sprayed on both sides of the prime 11 ,. When the cylindrical capacitor 100 is sprayed, if the same adjustment is applied, the spray is small. In the case of the granular tin powder, the tin powder enters the core hole 13 of the cylindrical capacitor (10) from both sides of the element 110, and 8 201227768 fills the core hole 130' to cause the core hole 130 to communicate and short-circuit occurs. An enlarged view of the tin powder particles used in the spraying is shown in Figures 6a and 6b. Fig. 6a is a photograph in which the tin powder particles used for sprinkling a general compression type capacitor on the nozzle is magnified 50 times. It is known from the scale that each tin powder particle is about 3 mm. The picture shown in Fig. 6b is a photograph of a magnified 50-fold magnesia powder used for the cylindrical capacitor 1 ,, which shows that each particle is about 7 s. The photograph used here is the result of amplification test by the Hankook Technology Testing Center (KTL). That is to say, the tin powder particles used in the cylindrical capacitor are not only larger than the tin powder particles used in general compression capacitors. Bishe, ah is also larger than the volume, now 13Q diameter. Then, when the tin (4) element 11G _ scale is used, in addition to the electrode plate of the film conductor, the two ends of the core hole 130 can be closed. Referring to Figure 7a and Figure 7b, when the conventional compression capacitor is turned on the lead wire 14〇, the position of the pin line 14 is applied to the side of the element 12 and the diameter of the element 110 is one third. The pin line 140 of the cylindrical capacitor 1 横 traverses the central core hole 13 〇, and the distance to the side of the element 110 is two-thirds of the diameter of the element 11 。. This is to prevent the occurrence of poor pores in the core hole 13() during the surface of the upper class. Therefore, it is convenient to seal the core hole 130 again with the pin line M0 at the = soldering step. It is now known that the investment is 3 U, and the impregnation stage (S22_ final package delivery (4) S228) is the same as the general compression capacitor fabrication process, and will not be described in detail. A cylindrical capacitor 100 manufactured by the present invention has a hollow core and a core hole 13G' in which the gas core 13G's integral conductor is also kept in a cylindrical shape, so that the cylindrical capacitor manufactured by the present invention is manufactured. Compared with the Xi = house-type capacitor, the 100 not only reduces the noise, but also increases the flow. % Please refer to item 8. As shown in the figure, the noise level of the _ capacitor is 72, and the minimum and maximum values are 69 *. And the average of the cylindrical type. The arpeggio value is 51, and the minimum and maximum values are 5〇 and 52, respectively. From this data, the cylindrical capacitor (10) is 30% to 40% less noisy than the compression capacitor. For further reference to the available current values measured in Figure 9 for the various temperatures of the capacitor hoist, the conventional compression capacitors are at the temperature „ l': C ' 3, . . . , . And 1 (TC conditions, the available current is "1.53 ' 3.28 ' 5.14, 6.43 and 6.79" respectively. In the cylindrical capacitor mentioned in the present invention, the available current is "1.72" under the same temperature conditions. , 3.86, 5.6, 6.59 and 7.23". Please refer to the l〇a diagram and the map. The figure shows the electrical comparison of the cylindrical capacitor 10G and the compression capacitor. It is known from the data listed in the chart. The cylindrical Wei container (10) according to the present invention has a significant improvement in electrical properties such as loss value, withstand voltage, insulation resistance, etc. The above-mentioned embodiment 'is only used for convenience to illustrate the creation and is not limited' Without departing from the spirit of this creation, all kinds of simple modifications and modifications made by those skilled in the industry in accordance with the scope of application for the creation of this patent and the description of the creation should still be included in the scope of the following patent application.
【圖式簡單說明】 第1圖為習用_電容器製造方法麟程圖； 第2圖為本發明圓柱型電容器的立體示意圖； 第3圖為本發明詳細製造步驟的製造步驟_圖，· 第4a圖及第扑目為習用的壓縮式電容與本發明的圓 柱型電容進行熱處理的比較圖； 第5圖是噴錫粉顆粒的大小不同情況下，喷麗的效 果示意圖； 第6a圖及第6b圖是會麟錫粉顆粒大小的放大示意 第％圖及帛％圖是引腳線炫谭時習用壓縮式電容盘 本發明的圓柱型電容器比較圖； 第8圖是習用壓'缩式電容和本發明的 音比較資料； 圓柱型電容器噪BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a conventional capacitor manufacturing method; FIG. 2 is a perspective view of a cylindrical capacitor of the present invention; FIG. 3 is a manufacturing step of a detailed manufacturing step of the present invention. The figure and the first object are a comparison diagram of the heat treatment of the conventional compression type capacitor and the cylindrical type capacitor of the present invention; Fig. 5 is a schematic view showing the effect of the sprayed powder particle size in different sizes; Fig. 6a and Fig. 6b The figure is a magnified schematic diagram of the particle size of Huilin tin powder. The % diagram is a comparison of the cylindrical capacitors of the present invention with a compression capacitor disk. Figure 8 is a conventional compression capacitor. Sound comparison data of the present invention; cylindrical capacitor noise
第9圖是習用壓縮式電容和本明 的圓柱型電容器可 用電流比較資料；以及 柱型圖是f用壓縮式電容和本發明的 屯合斋電軋特徵的比較資料。 【主要元件符號說明】 1〇〇圓柱型電容器 圓 110素子 12〇外殼 13〇捲心孔 140引腳線 11Fig. 9 is a comparison of the usable currents of the conventional compression type capacitor and the cylindrical type capacitor of the present invention; and the column pattern is a comparison data of the compression type capacitor of f and the characteristics of the electric winding of the present invention. [Main component symbol description] 1〇〇Cylindrical capacitor Round 110 prime 12〇 housing 13〇 core hole 140 pin line 11