201227080 六、發明說明： 【發明所屬之技術領域】 本發明關於_種背光模組，尤指—種其光賴組可輕鬆拆抑之 背光模組。 【先前技術】 在無法自行發光之電子裝置中，例如液晶顯示器，均設置有背 光模、'且’供所需的背心在產品設計輕薄的要求下，背光模組 的厚度尺蚀隨之心、，通常採關H(edge_littype)的背光模 組，其光源模組以-電路板上承載多個發光二極體製成。於光源模 組與支職件__組斜，於·板及支撐構叙間，以黏勝將 電路板黏著敎職件上，鱗到支撐、蚊光賴_目的。 當有需要4H轉*需將光顯崎離支撐構件時，通常 使用-片狀X具插人電路板與支_件之間，以將電路板掀離支撐 構，。械掀離的程序中，黏膠受到片狀工具的推擠而變形，間接 使传附著其上的電路板亦隨之變形；當電路板變形的情況嚴重時， 光源模組將受到鄕’甚至無法再使用。此外，光源餘的電路板 的彈性變形範圍不大，使得前述掀離過程極易造成電路板的永久形 變，最常見的就是掀離後的電路板呈現料的外觀。此彎曲的電路 ，於再利用時’需更強_著力來岐於支雜件上，並伴隨有殘 存内應力，使得電路板具有自行自支撐構件剝離的潛在風險。 201227080 對光=组=::翼翼地拆卸光源模組之情形，仍難避免 部分掀離的邊=;路:^^ 個電路板自域構件剝離所造成的損害，故 = 的固定方式’可無損傷的拆卸，以利於重工或維修 【發明内容】 =發月的目的之—在於提供—種背光模組’其固定件與光源模 組分設燈架的兩面，顧定件透過該燈架的通孔來固定該光源模、 組’此結構便於拆卸該光源模組，且不會損傷該光賴組。、 本發月之方光模組包含一燈架、一光源模組及一固定件。該燈 ==表面、相對於該第一表面之一第二表面、及貫穿該第 〇 一表面之—通孔。該光源模組設置於該第—表面上並 遮蓋該通孔之至少-部分。顧_著於綠：表面並穿過該通 孔以黏著該絲额。·，制請_統额條該燈架之 f面’但該固定件仍能經由該通孔來黏著、固定該光源模組於該燈 ^上，並且§峨件可獨立於該光源模组，輕易地自該燈架剝離， 故δ亥光源模組可近乎無傷地自該燈架上移離。 簡言之’本發明之背光模組之固定件係相對於該光源模组設 置，不_先前技射郷·於光賴轉切構件之間，故本 201227080 故該 t It 固定件於剝料，不會拉扯到該光源模組，- 組 =莫^鋪其原來的結構’解決了先前技射掀離的光雜 無可避免的損傷或變形的問題，並有利於該背細組的重工或维修。 得到：=優點與精神可以藉由以下的發明詳— 【實施方式】 請參第1圖及第2圖，第1圖為根據本發明之-較佳具體實施 例之-背光模組i之分解圖，第2圖為第！圖背光模組ι之剖面圖。 背光模組1可包含-導光板12、—燈架14、—光源模組16及一固 定件18。燈架14具有第—表面142、相對於第—表面142之一第 二表面144、及貫穿第-表面142及第二絲144之一通孔146。光 源模組16設置於第-表面142上並遮蓋通孔146。固定件18黏著 於第二表面144並穿過 146 _著光源池16，藉此達到將光 源模組16固定於燈架14上之目的；其巾，為清楚表麵定件18 之結構，$ 2圖中固定件18之厚度結構係誇大繪示。光源模組16 發射之光線即進入導光板12，用以提供背光。 進-步來說，於本實關中，光賴組16包含—電路板162 及設置於電路板162上之複數個發光二極體164，電路板162可為 硬式電路板或軟性電路板，發光二極體164可為側面發光發光二極 體(SideviewLED)或頂面發光發光二極體(topviewLED)，但本發明 201227080 不以此為限，可視實際需求調整。於背光模組丨組裝時，電路板i62 設置於第-表面142上並完全遮蓋通孔146，但於實作上，電路板 • 162得僅部分地遮蓋通孔146，固定件18仍得穿過通孔146以黏著 電路板162同樣月b達到將光源模组16固定於燈架μ上之目的。 此外，於本實施例中，固定件18包含一基材182、一平台184、 -第-黏膠層186及-平台黏膠層188，基材182具有一第三表面 春822平口 184固疋於第二表面1822上，第一黏膠層186形成於第 二表面1822上，平台黏膠層188形成於平台184上，固定件a即 藉由第-黏膠層186黏著於第二表面144上，固定件18並且藉由平 台184伸入通孔146中以使平台黏膠層188㈣光源模組16之電路 板162 ’藉此，固定件18同時黏著於燈架14及光源模組16，故能 達到固定光源模組16於燈架14上之目的。另外，平台184固定於 第三表面I822上的方式可包括平台收與基材脱具有相同材質且 藝平台184從第王表面1822延伸而出；平纟184固定於第三表面膨 上的方式亦可包括平台184利用黏著方式固定於基材182。補充說 明的是，雖前述說明僅以單-通孔146及單一平台184為例，但亦 適用於本實施例中之其他通孔、平台(未標示於财），不再贊述。 另外，於本實施例中，平台184具有一側表面1842,大致垂直 •於第三表面1822,固定件18更包含一側黏膠層19〇，形成於側表面 1842上，平台184藉由側黏膠層190黏著通孔146内壁，使得固定 件18與光源模組ι6及燈架14間之黏著更為穩定。補充說明的是， 201227080 為使平台黏膠層188能有效黏著光源模組16之電路板i62，平台i84 與平台黏膠層188之總厚度大於通孔146之内壁之厚度·換言之， 當僅固定件18黏著於燈架14上時，平台黏膠層188將略突出於燈 ㈣之第-表面142，藉此尺寸設計，確保平台黏膠層188能有效 黏著電路板162，但本發明不以此為限。 。於前述實施射，定件184雖主··定光賴㈣於燈 架Η上，但本發财以此為限。請參閱第3圖，其為根據本發明之 另一實施例之背光模組3之剖面圖。背光模組3與背光模組！結構 大致相同，主要不同之處在於背光模組3尚包含-框架2G，1中固 定件18之基材182可具有相對於第三表面1822之一第四表面 刪，固定件18更包含一第二黏膠層192，形成於第四表面刪 士:燈架14藉由第二黏膠層192黏著於框架2〇上。補充說明的是， 田背光m應用於液晶顯示器時，此框㈣亦可與該液晶顯示器 之其他構件整合，例如縣20㈣液晶面板之固定框架等。 再補充說明的疋，則述固定件18主要藉由平台184形成突出的 j ’但並不以圖中所示平纟184係直接固定於基材⑻上，再於 平台184上形成平台黏膠層188之情形為限，例如得以一雙面膠帶 (p基材上兩侧塗布有黏膠)作為基材182及第一黏膠層撕、第二 轉層192之結構’再以—層或多轉帶(即-基材上單側塗布有黏 膠)疊置於前述雙面膠帶上，作為平台184及平台黏膠層188之結 構或以層或多層雙面膠帶疊置於前述雙面膠帶上，亦可作為平 201227080 cr 184及平台黏膠層188之結構。因此，前述固定件π之實現方式 可多樣化且不以前述揭露之方式為限。 睛參閱第4圖’其為根據本發明之另—較佳具體實施例之一背 光模組5之剖面圖’背光模組5與背光模組3之結構大致相同，故 背光模組5係放大繪示於第4圖中。背光模組5與背光模組3主要 不同之處在於背光模組5之固定件58之實現方式。固定件％包含 鲁長黏膠層582、5又置於長黏膠層582上之-基材584及設置於基 材584上之-短黏膠層586，基材划長度小於長黏膠層撕。長黏 膠層582黏著於第二表面⑷上，基材584及短黏膠層586可伸入 通孔146以使短黏膠層586黏著光源模組16之電路板⑹，藉此， 固定件58能將光源模組16固定於燈架14上，同時燈架14亦可藉 由長黏勝層撕黏著於框架2〇上。另外，於本實施例中，基材別: I具有-側表面’固定件58更包含—_膠層娜，形成於側 2面難上，側黏膠層588黏著通孔146内壁，使得固定件％鱼 擊光源额丨_架14 _著更為敏。飾_是，於本實 施例中，基材584與短黏膠層586之總厚度大於通孔146内壁 度’藉此確保短黏膠層娜能有效黏著電路板丨 此為限。 4奴乃个以 堉筝閲第 ^ 難類實施例之- 光Μ、.且7之剖面圖，背光模組7與昔伞 咎上此 緣料切組3之結構大致相同， 孑先模組7係放大繪示於第5圖中。背 才先模組7與背光模組3主 201227080 不同之處在於背光模組7之固定件78之實現方式。固定件78係一 不等厚度黏膠層’其具有一突出部分782，固定件78黏著於第二表 面H4上並藉由突出部分782伸入通孔146以黏著光源模組 16之電 雜162。同樣地，燈架14亦藉由此不等厚度黏膠麟固定件, 黏著於购20上。於實作上，此科厚度姉層销絲度不相等 之二黏膠層疊置形成，但本發明不以此為限。補充說_是，突出 部分⑽突出的高度大於通孔⑽内壁之厚度，藉此罐保突出部分 ⑽能有效黏著電路板⑹，但本發明不以此為限；另外，因突出部 分782本身即具黏性，故當突出部分Μ2之輪廊與通孔撕之内壁φ 輪廓相當時，突出部分782之側邊亦能黏著通孔146内壁，使得固 定件78與細驗16及麟Η間絲著更械I f光模組7 尚包含-框架2〇，燈架M藉由料厚度黏膠層黏著於框架加上。 於則述各實施例中，固定件 …，0个牙巧具有突出的結 以伸入通孔M6中，進而黏著光源模組16，但本發明不以此為丨201227080 VI. Description of the Invention: [Technical Field] The present invention relates to a backlight module, and more particularly to a backlight module in which a light-receiving group can be easily removed. [Prior Art] In an electronic device that cannot emit light by itself, such as a liquid crystal display, a backlight module is provided, and 'and the required vest is required for the thin design of the product, and the thickness of the backlight module is eclipsed. A backlight module of H (edge_littype) is usually used, and the light source module is made of a plurality of light-emitting diodes on the circuit board. In the light source module and the support member __ group oblique, between the board and the support structure, to adhere to the board to adhere to the job, scale to support, mosquito light. When there is a need for 4H to turn the light out of the support member, it is usually used between the board and the support to remove the board from the support. In the process of mechanical separation, the adhesive is deformed by the pushing of the sheet tool, and the circuit board attached to it is indirectly deformed; when the deformation of the circuit board is serious, the light source module will be subjected to Can no longer be used. In addition, the elastic deformation range of the remaining circuit board is not large, so that the aforementioned separation process is very likely to cause permanent deformation of the circuit board, and the most common is the appearance of the circuit board after the separation. This curved circuit, when reused, needs to be stronger to focus on the miscellaneous components, with residual internal stresses, causing the board to have the potential risk of self-supporting members peeling off. 201227080 For the case where the light = group =:: the light source module is removed, it is still difficult to avoid the edge of the partial deviation =; road: ^^ The damage caused by the stripping of the circuit board from the domain member, so the fixed way of = Non-invasive disassembly for rework or maintenance [Invention] The purpose of the moon is to provide a backlight module in which the fixing member and the light source module are provided on both sides of the lamp holder, and the fixing member passes through the lamp holder. The through hole is used to fix the light source module, the group 'this structure is convenient for disassembling the light source module without damaging the light source group. The square light module of the present month comprises a light stand, a light source module and a fixing piece. The lamp == surface, a second surface relative to one of the first surfaces, and a through hole extending through the first surface. The light source module is disposed on the first surface and covers at least a portion of the through hole. Gu_在绿: The surface passes through the through hole to adhere the wire. · _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ It is easily peeled off from the lamp holder, so the δHai light source module can be removed from the lamp holder almost without damage. In short, the fixing member of the backlight module of the present invention is disposed relative to the light source module, and is not between the prior art and the light-cutting and cutting member. Therefore, the 2012T is fixed to the stripping member. , will not pull the light source module, - group = do not spread its original structure 'to solve the problem of the inevitable damage or deformation of the previous technology, and to facilitate the rework of the back group Or repair. Obtaining: = Advantages and spirits can be detailed by the following invention - [Embodiment] Referring to Figures 1 and 2, Figure 1 is a breakdown of the backlight module i according to the preferred embodiment of the present invention. Figure, Figure 2 is the first! A cross-sectional view of the backlight module ι. The backlight module 1 can include a light guide plate 12, a light frame 14, a light source module 16, and a fixing member 18. The light fixture 14 has a first surface 142, a second surface 144 opposite the first surface 142, and a through hole 146 extending through the first surface 142 and the second wire 144. The light source module 16 is disposed on the first surface 142 and covers the through hole 146. The fixing member 18 is adhered to the second surface 144 and passes through the light source pool 16 to thereby fix the light source module 16 to the lamp holder 14; the towel is configured to clearly define the surface member 18, 2 The thickness structure of the fixing member 18 is exaggerated. The light emitted by the light source module 16 enters the light guide plate 12 to provide backlight. In the present embodiment, in the actual implementation, the optical group 16 includes a circuit board 162 and a plurality of light emitting diodes 164 disposed on the circuit board 162. The circuit board 162 can be a hard circuit board or a flexible circuit board. The diode 164 can be a side-emitting LED or a top-view LED. However, the invention 201227080 is not limited thereto and can be adjusted according to actual needs. When the backlight module is assembled, the circuit board i62 is disposed on the first surface 142 and completely covers the through hole 146. However, in practice, the circuit board 162 only partially covers the through hole 146, and the fixing member 18 still has to be worn. The through hole 146 is used to adhere the circuit board 162 to the lamp holder μ for the same month b. In addition, in the embodiment, the fixing member 18 comprises a substrate 182, a platform 184, a first-adhesive layer 186 and a platform adhesive layer 188, and the substrate 182 has a third surface spring 822 flat mouth 184 solid On the second surface 1822, a first adhesive layer 186 is formed on the second surface 1822, and a platform adhesive layer 188 is formed on the platform 184. The fixing member a is adhered to the second surface 144 by the first adhesive layer 186. The fixing member 18 is inserted into the through hole 146 through the platform 184 to make the platform adhesive layer 188 (four) the circuit board 162 of the light source module 16 . Thereby, the fixing member 18 is simultaneously adhered to the lamp holder 14 and the light source module 16 . Therefore, the purpose of fixing the light source module 16 on the lamp holder 14 can be achieved. In addition, the manner in which the platform 184 is fixed on the third surface I822 may include the platform receiving the same material as the substrate and the platform 184 extending from the king surface 1822; the manner in which the flat 184 is fixed on the third surface is also The platform 184 can be included to be secured to the substrate 182 by adhesive means. It should be noted that although the foregoing description is only exemplified by the single-via 146 and the single platform 184, it is also applicable to other through-holes and platforms in the present embodiment (not shown), and will not be described. In addition, in this embodiment, the platform 184 has a side surface 1842 which is substantially perpendicular to the third surface 1822. The fixing member 18 further includes a side adhesive layer 19〇 formed on the side surface 1842, and the platform 184 is laterally The adhesive layer 190 adheres to the inner wall of the through hole 146, so that the adhesion between the fixing member 18 and the light source module ι6 and the lamp holder 14 is more stable. In addition, 201227080, in order to enable the platform adhesive layer 188 to effectively adhere to the circuit board i62 of the light source module 16, the total thickness of the platform i84 and the platform adhesive layer 188 is greater than the thickness of the inner wall of the through hole 146. In other words, when only fixed When the member 18 is adhered to the lamp holder 14, the platform adhesive layer 188 will slightly protrude from the first surface 142 of the lamp (4), thereby being sized to ensure that the platform adhesive layer 188 can effectively adhere to the circuit board 162, but the present invention does not This is limited. . In the above-mentioned implementation, the fixed piece 184 is mainly fixed on the lamp holder, but the money is limited to this. Please refer to FIG. 3, which is a cross-sectional view of a backlight module 3 according to another embodiment of the present invention. Backlight module 3 and backlight module! The structure is substantially the same, the main difference is that the backlight module 3 still includes a frame 2G, and the substrate 182 of the fixing member 18 can have a fourth surface with respect to the third surface 1822, and the fixing member 18 further includes a first The second adhesive layer 192 is formed on the fourth surface: the lamp holder 14 is adhered to the frame 2 by the second adhesive layer 192. In addition, when the field backlight m is applied to a liquid crystal display, the frame (4) can also be integrated with other components of the liquid crystal display, such as a fixed frame of a county 20 (four) liquid crystal panel. In addition, the fixing member 18 is mainly formed by the platform 184, but is not directly fixed to the substrate (8) by the flat 184 series shown in the figure, and the platform adhesive is formed on the platform 184. The layer 188 is limited to, for example, a double-sided tape (the two sides of the p substrate are coated with a glue) as the substrate 182 and the first adhesive layer is torn, and the structure of the second transfer layer 192 is further layered or The multiple transfer belts (ie, the one side coated with the adhesive on the substrate) are stacked on the double-sided tape as the structure of the platform 184 and the platform adhesive layer 188 or stacked on the double-sided tape with a layer or layers of double-sided tape. On the tape, it can also be used as the structure of the flat 201227080 cr 184 and the platform adhesive layer 188. Therefore, the implementation of the aforementioned fixing member π can be varied and is not limited to the manner disclosed above. 4 is a cross-sectional view of a backlight module 5 according to another preferred embodiment of the present invention. The structure of the backlight module 5 and the backlight module 3 are substantially the same, so that the backlight module 5 is enlarged. Shown in Figure 4. The main difference between the backlight module 5 and the backlight module 3 is the implementation of the fixing member 58 of the backlight module 5. The fixing member % comprises a base material 584 which is disposed on the long adhesive layer 582 and a short adhesive layer 586 which is disposed on the base material 584. The length of the substrate is shorter than the long adhesive layer. tear. The long adhesive layer 582 is adhered to the second surface (4), and the substrate 584 and the short adhesive layer 586 can extend into the through hole 146 to adhere the short adhesive layer 586 to the circuit board (6) of the light source module 16, thereby, the fixing member 58 can fix the light source module 16 to the lamp holder 14, and the lamp holder 14 can also be torn to the frame 2 by a long adhesive layer. In addition, in the embodiment, the substrate has the following: I have a side surface, and the fixing member 58 further includes a rubber layer, which is formed on the side 2, and the side adhesive layer 588 adheres to the inner wall of the through hole 146, so as to be fixed. %% of the fish hit the light source 丨 _ 14 _ more sensitive. Preferably, in the present embodiment, the total thickness of the substrate 584 and the short adhesive layer 586 is greater than the inner wall of the through hole 146, thereby ensuring that the short adhesive layer can effectively adhere to the circuit board. 4 奴乃一堉 堉 阅 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The 7 series is enlarged and shown in Fig. 5. The first module 7 and the backlight module 3 main 201227080 differ in the implementation of the fixing member 78 of the backlight module 7. The fixing member 78 is an unequal thickness adhesive layer having a protruding portion 782. The fixing member 78 is adhered to the second surface H4 and protrudes into the through hole 146 through the protruding portion 782 to adhere to the electric light module of the light source module 16. . Similarly, the lamp holder 14 is also adhered to the purchase 20 by the unequal thickness of the adhesive lining fastener. In practice, the two layers of adhesive having different thicknesses of the enamel layer are formed by lamination, but the invention is not limited thereto. In addition, the protruding portion (10) has a protruding height greater than the thickness of the inner wall of the through hole (10), whereby the canned protruding portion (10) can effectively adhere to the circuit board (6), but the invention is not limited thereto; in addition, since the protruding portion 782 itself is It is viscous, so when the rim of the protruding portion Μ2 is equivalent to the inner wall φ contour of the through hole, the side of the protruding portion 782 can also adhere to the inner wall of the through hole 146, so that the fixing member 78 and the snippet 16 and the lining line The mechanical I f optical module 7 still includes a frame 2 〇, and the lamp holder M is adhered to the frame by a thickness of the adhesive layer. In each of the embodiments, the fixing member, 0 teeth have a protruding knot to protrude into the through hole M6, thereby adhering the light source module 16, but the present invention does not take this as a defect.
凊參閱第6圖，其為根據本發明之另一較佳具體實施例之一㈣ 組8之剖_ ’背光模組8射光模組3之結構大致相同， 模組8係放大_於第6财。f賴組8射賴組3 之處在於背光觀8之固定件88之實财式。_件88可包令 基材882、一第一黏膠層884及一第二黏膠層咖，基材882且有 第三表面斯及相對於第三表面_之一第四表面跑，第有 膠層则成於第三表面驗，第：黏膠層咖形成於第四表歪 8824上。藉此’固定件88藉由第—轉層黏著於第二表面^ 10 201227080 上並藉由第一黏膠層884穿過通孔146以黏著光源模組16之電路板 162，此外，燈架14可藉由第二黏膠層886黏著於框架20上。補充 說明的是’於實作上，固定件88於通孔146處的彎曲結構可藉由治 具實現，例如以小於通孔146截面的插梢將固定件88擠入成形，此 時固定件88可用-雙面膠帶實作，又或利用其上已對應通孔146 成形突出部分的塑膠片，於其兩侧塗布黏膠來實現；但本發明均不 以此為限。此外’擠入通孔M6内的第—黏膠層m可藉由適當尺 鲁寸的插梢，亦黏著通孔146之内壁，同樣可使得固定件88與光源模 組16及燈架14間之黏著更為穩定。 …明參閱第7圖’其為根據本發明之另—較佳具體實施例之一背 f模組9之剖面圖’背光模組9與背光模組8之結構大致相同，故 背光模組9係放大繪示於第7圖中。f光模組9與背光模組8主要 不同之處在於責光模組9之固定件％可為一等厚度黏膠層；同樣Referring to FIG. 6, which is a further preferred embodiment of the present invention (4) Section 8 of the section _ 'Backlight module 8 light-emitting module 3 has substantially the same structure, and module 8 is enlarged _ at the 6th fiscal. The F Lai group 8 is based on the solid type of the fixing member 88 of the backlight 8 . The piece 88 can be used to wrap the substrate 882, a first adhesive layer 884 and a second adhesive layer, the substrate 882 has a third surface and runs against the fourth surface of the third surface. The adhesive layer is formed on the third surface, and the adhesive layer is formed on the fourth surface 8824. Thereby, the fixing member 88 is adhered to the second surface ^ 10 201227080 by the first-layer layer and passes through the through hole 146 through the first adhesive layer 884 to adhere the circuit board 162 of the light source module 16 , and further, the lamp holder 14 can be adhered to the frame 20 by the second adhesive layer 886. It is added that, in practice, the curved structure of the fixing member 88 at the through hole 146 can be realized by a jig, for example, the fixing member 88 is extruded into a shape with a tip smaller than the cross section of the through hole 146, and the fixing member is at this time. 88 can be implemented by using a double-sided tape, or by using a plastic sheet on which a protruding portion is formed corresponding to the through hole 146, and applying adhesive on both sides thereof; however, the present invention is not limited thereto. In addition, the first adhesive layer m that is squeezed into the through hole M6 can be adhered to the inner wall of the through hole 146 by a suitable nipple, and the fixing member 88 and the light source module 16 and the light frame 14 can also be The adhesion is more stable. Referring to FIG. 7 , which is a cross-sectional view of the back-f-module 9 of the preferred embodiment of the present invention, the backlight module 9 and the backlight module 8 are substantially identical in structure, so that the backlight module 9 is The enlargement is shown in Figure 7. The main difference between the f-light module 9 and the backlight module 8 is that the fixing component of the light-receiving module 9 can be a first-thickness adhesive layer;
也*固疋件98直接黏著於第二表面144上並穿過通孔146以點著光 ^模、且1=之電路板162，並且燈架14藉由此料度郷層(即固定 9_者於檀架2〇上。補充說明的是，擠入通孔撕内的固定件 8^可黏著通孔146之_，同樣可使得固定件％與光源模㈣ 及燈采14間之黏著更為穩定。 於⑴述各實施例中’由於光源模組16僅於通孔Μ6處與固定件 修二！^ ^ 58、78、88、98)黏著’故當光源模組16需重工或是維 …使用者可自燈架14之第二表面144側，將固定件18自燈架 201227080 14剝離’此_力量雜賴組16轉微小，故光源模組π能儘 量保持其絲的結構’解決了先前技射掀_光賴組無可避免 的損傷或變__。此外’本發明之背光模組之狀件與光賴 組分置於燈架之兩面，故固定件與光源模組可各自與燈妓位，避 免先前技術巾光賴_對支撐構件之定錢到位於其間黏膠的影 響，並進-步地減少光源模組固定重工的機率。另外，由於光源模 組直接接紐架’導絲可更魏縣，姉於射賴組銜接的 顯不面板而言，混光距離可放大，也就是說，在原來的設計條件下， 背光模組可提供顯示面板可獲得更均勻的背光。 以上所述僅為本發明之較佳實施例，凡依本發明申請專 所做之均㈣化與修飾’皆應屬本㈣之涵蓋範圍。 【圖式簡單說明】 :較佳具體實施例之—背光模組之分解圖。 第2圖為第1圖背光模組之剖面圖。 第3圖為根據本發明之另—實施例之背統組之剖面圖。 第4圖為根據本發明之另—較佳具體實施例之—背光模組之剖 圖。 第5圖為減本翻之另—較佳具财施例之—背賴組之 圖。 叫 第6圖為減本發明之另—難具體實施狀-背光模組之剖面 圖。 叫 12 201227080 第7圖為根據本發明之另一較佳具體實施例之一背光模組之剖面 圖。 【主要元件符號說明】 1、3、5、7、8、9 背光模組Also, the fixing member 98 is directly adhered to the second surface 144 and passes through the through hole 146 to point to the optical module, and 1 = the circuit board 162, and the lamp holder 14 is thereby layered (ie, fixed 9) _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ It is more stable. In the embodiment (1), since the light source module 16 is adhered to the fixing member only at the through hole Μ6, ^^58, 78, 88, 98), the light source module 16 needs to be reworked or From the second surface 144 side of the lamp holder 14, the user can peel the fixing member 18 from the lamp holder 201227080 14 'this _ power miscellaneous group 16 turns tiny, so the light source module π can maintain the structure of the wire as much as possible' Solved the inevitable damage or change of the previous technical 掀 _ _ _ _ group. In addition, the components of the backlight module of the present invention and the light-receiving component are placed on both sides of the lamp holder, so that the fixing member and the light source module can be respectively placed with the lamp to avoid the prior art towel _ _ the support member Go to the effect of the glue located between them, and further reduce the probability of fixing the heavy work of the light source module. In addition, because the direct connection of the light source module 'guide wire can be more Weixian County, the mixing distance can be enlarged, that is, under the original design conditions, the backlight mode The group can provide a display panel for a more uniform backlight. The above description is only the preferred embodiment of the present invention, and all of the (four) and modifications made in accordance with the application of the present invention should fall within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS: An exploded view of a backlight module in a preferred embodiment. Figure 2 is a cross-sectional view of the backlight module of Figure 1. Figure 3 is a cross-sectional view of a backing set in accordance with another embodiment of the present invention. Figure 4 is a cross-sectional view of a backlight module in accordance with another preferred embodiment of the present invention. Figure 5 is a diagram of the reduction of the book - the preferred example of the wealthy example. Fig. 6 is a cross-sectional view of the backlight module in accordance with another embodiment of the present invention. 12 201227080 FIG. 7 is a cross-sectional view of a backlight module in accordance with another preferred embodiment of the present invention. [Main component symbol description] 1, 3, 5, 7, 8, 9 backlight module
12 導光板 14 燈架 16 光源模組 20 框架 18、58 、78、88、98 固定件 142 第一表面 144 第二表面 146 通孔 162 電路板 164 發光二極體 182 基材 184 平台 186 第一黏膠層 188 平台黏膠層 190 側黏膠層 192 第二黏膠層 582 長黏勝層 584 基材 586 短黏膠層 588 側黏膠層 782 突出部分 882 基材 884 第一黏膠層 886 第二黏膠層 1822 第三表面 1824 第四表面 1842 側表面 5842 側表面 8822 第三表面 8824 第四表面 1312 light guide plate 14 lamp holder 16 light source module 20 frame 18, 58, 78, 88, 98 fixing member 142 first surface 144 second surface 146 through hole 162 circuit board 164 light emitting diode 182 substrate 184 platform 186 first Adhesive layer 188 Platform adhesive layer 190 Side adhesive layer 192 Second adhesive layer 582 Long adhesive layer 584 Substrate 586 Short adhesive layer 588 Side adhesive layer 782 Projection portion 882 Substrate 884 First adhesive layer 886 Second adhesive layer 1822 third surface 1824 fourth surface 1842 side surface 5842 side surface 8822 third surface 8824 fourth surface 13