201224720 六、發明說明： 【發明所屬之技術領域】 [刚本發日隸及—種散熱”，特如找-種顧於記憶體 的散熱裝置。 【先前技術】 [0002] ❹ 伺服器系統的記憶能較以往有很大提升，伴隨著 記憶體性能的提升，記憶體的發熱量也在增加。為維持 伺服器系統穩定地運行，f知技術均㈣在記憶體上增 加散熱片以加強記憶體散熱。然而，僅利用自然對流的 方式散熱並無法有致的對記‘_進行散熱，導致散熱效 果不佳。 μ '现·厂 【發明内容】 ，： ..201224720 VI. Description of the invention: [Technical field to which the invention belongs] [The original heat and the heat dissipation of the invention], such as looking for a kind of heat sink for the memory. [Prior Art] [0002] 伺服 Server system The memory can be greatly improved compared with the past, and the heat generation of the memory is also increased along with the improvement of the memory performance. In order to maintain the stable operation of the server system, the technology is added (4) the heat sink is added to the memory to enhance the memory. Body heat dissipation. However, the use of natural convection only to dissipate heat and not to cause heat dissipation, resulting in poor heat dissipation. μ 'now·factory【invention content】 ,:..
[0003]鑒於以上内容，有必要提供一種可增強對記憶體散熱效 .果的散熱裝置。 [0004] ❹ 一種散熱裝置，用於對主機板上的複數記憶體進行散熱 ，該散熱裝置包括固定於主機板尊位於該等記憶體兩側 的兩支架、一承載架及一風扇，該承載架包括一固定板 及垂直地設置在固定板一侧的兩擋板，兩擋板可轉動地 分別組設於兩支架’該風扇組設於該承載架。 [0005] 相較習知技術’本發明散熱裝置透過支架與承載架安穿 一風扇，該風扇提供的氣流可直接流經該等記憶體，以 增強散熱效果。 【實施方式】 [0006] 請參閱圖1，本發明散熱裝置用於對主機板10上的複數記 憶體20進行散熱’其第一較佳實施方式包括兩支架3〇、 099143154 表單編號Α0101 第3頁/共17頁 0992074744-0 201224720 一承載架40、兩卡固件5〇、一風扇7〇、第一固定件60及 第二固定件6 2。 [0007] 主機板10設有複數連接器12，以供複數記憶體20相互平 行的插置於其中。主機板1〇於該等記憶體2〇兩侧的中部 分別開設兩固定孔100。 [0008] 每一支架30包括一底板32及一垂直設置於底板32的懸掛 板34。該懸掛板34頂端形成一半圓部36。底板32呈長方 形，其設有兩通孔320。半圓部36的圓心設有一樞孔362 ，該半圓部36還設有一以該樞孔362為面心的半圓形的滑 槽360。 [0009] 承載架呈U形’其包括一長條狀的固定板42、垂直設置 在固定板42同一側的兩擋板44及兩承載板46。兩承載板 46相向地設置於兩擋板44的内側面。固定板42設有兩通 孔420。兩擔板44於遠離固定板42的一端朝向相反的方向 設有兩鉚柱440，並於兩鉚柱在0:的内侧設有兩固定孔 442。鉚柱440與相應的固走孔442之間的距離與滑槽360 的半徑等長。每一承載板46包括一垂直於擋板44的承載 部460及一垂直承載部460且與承載部46〇的底端相連接 的卡扣部4 6 2。 [0010] 卡固件50具有彈性。每一卡固件50包括第一卡扣部51及 兩第二卡扣部55。第一卡扣部51包括一水準的第一抵接 段52及兩設在第一抵接段52相對端的第一彎折段μ。每 一第二卡扣部55包括設在第一彎折段53遠離第一抵接段 52的一端的連接段54、設在連接段54遠離第一彎折段53 099143154 表單編號Α0101 第4頁/共Π頁 0992074744-0 201224720 的一端垂直於第一抵接段52的第二抵接段56及設在第二 抵接段56的末端的第二彎折段58。 [0011] 第一固定件60及第二固定件62均為螺釘。 [0012] 風扇70包括一上邊框74及一下邊框76。下邊框76於四角 分別設有一固定孔760。 [0013] 請參閱圖2至5，組裝時，將兩支架30的通孔320正對主機 板10的固定孔100，且兩懸掛板34分別靠近外側的兩記憶 體20，第二固定件62穿過支架30的通孔320後鎖入主機 〇 板10的固定孔100，使得支架30固定於主機板10。將承 載架40的兩鉚柱440穿設於兩支架30的兩樞孔362，使得 承載架40可以鉚柱440為轉私相對支無30轉動。該承載架 40轉動至水準位置而位於該等記憶體20的上方。該承載 架40可位於該兩支架30的左側或右側，固定孔442正對半 圓形的滑槽360的第一端或第二端《第一固定件6〇穿過滑 槽360鎖入固定孔442，使得承載架40固定於支架30。 ❹ [0014] 請參閱圖2及圖3 ..，風:扇70放置於承載架40的兩承載部 460，該風扇70的兩側擋止於兩擋板44，將兩卡固件5〇 的第一抵接段52抵接於承載架40的承載部460的下表面， 第一彎折段53卡扣對應的卡扣部462及擋板44，第二抵接 段56抵接於風扇70下邊框76的上表面，第二彎折段58對 應卡固於該風扇70的固定孔760内，以使風扇70固定。該 風扇70可從記憶體20的上方對其進行散熱。 [0015]請參閱圖4及圖5，風扇70可放置於該等記憶體2〇的兩端 而組設於承載架40。該風扇70的固定孔760正對承載架 0992074744-0 099143154 表單編號A0101 第5頁/共17頁 201224720 40的固定板4 2的通孔420。第三固定件64，如螺釘，穿 過固定板42的通孔420鎖入該風扇70的固定孔760，以將 該風扇70固定於該承載架40。該風扇70可從記憶體20的 一端對其進行散熱。 [0016] 請參閱圖6及圖7，本發明散熱裝置的第二較佳實施方式 與第一較佳實施方式的結構大致相同，然，第二較佳實 施方式是利用兩風扇70同時對主機板10上的記憶體20進 行散熱，該兩風扇70可分別固定於承載架40的兩擋板44 及固定板42。該兩風扇70可從記憶體20的上方及一端同 時對其進行散熱。 [0017] 本發明散熱裝置透過支架30與承載架40安裝風扇70對記 憶體20進行散熱，以增強散熱效果。風扇70的位置還可 根據記憶體20的散熱需求進行調節。 [0018] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之如申請專利範圍内。 【圖式簡單說明】 [0019] 圖1為本發明散熱裝置的第一較佳實施方式、主機板及記 憶體的立體分解圖。 [0020] 圖2至圖5為本發明散熱裝置的第一較佳實施方式的使用 狀態圖。 [0021] 圖6及圖7本發明散熱裝置的第二較佳實施方式的使用狀 態圖。 099143154 表單編號A0101 第6頁/共17頁 0992074744-0 201224720 - 【主要元件符號說明】 [0022] 主機板：10 [0023] 連接器：12 [0024] 固定孔：100、442、760 [0025] 記憶體：20 [0026] 支架：30 [0027] 底板：32 〇 [0028] 懸掛板：34 [0029] 半圓部：3 6 [0030] 通孔：320、420 [0031] 滑槽：360 [0032] 枢孔：362 [0033] 承載架：40 〇 [0034] 固定板：42 [0035] 擋板：44 [0036] 承載板：46 [0037] 鉚柱：44 0 [0038] 承載部：460 [0039] 卡扣部：462 [0040] 卡固件：50 099143154 表單編號A0101 0992074744-0 第7頁/共17頁 201224720 [0041] 第--^扣部： 51 [0042] 第一抵接段： 52 [0043] 第一彎折段： 53 [0044] 連接段：54 [0045] 第二卡扣部： 55 [0046] 第二抵接段： 56 [0047] 第二彎折段： 58 [0048] 第一固定件： 60 [0049] 第二固定件： 62 [0050] 第三固定件： 64 [0051] 風扇：7 0 [0052] 上邊框：74 [0053] 下邊框：76 099143154 表單編號 A0101 第 8 頁/共 17 頁 0992074744-0In view of the above, it is necessary to provide a heat sink that can enhance the heat dissipation effect on the memory. [0004] A heat dissipating device for dissipating heat from a plurality of memory boards on a motherboard, the heat dissipating device comprising two brackets fixed on the two sides of the main board, a carrier and a fan, the bearing The frame includes a fixing plate and two baffles vertically disposed on one side of the fixing plate, and the two baffles are rotatably respectively assembled to the two brackets. The fan assembly is disposed on the carrier. [0005] Compared with the prior art, the heat dissipating device of the present invention wears a fan through the bracket and the carrier, and the airflow provided by the fan can directly flow through the memory to enhance the heat dissipation effect. [0006] Referring to FIG. 1, a heat dissipating device of the present invention is used to dissipate heat from a plurality of memory devices 20 on a motherboard 10. The first preferred embodiment includes two brackets 3, 099143154, and the form number Α 0101 is 3 Page / Total 17 pages 0992074744-0 201224720 A carrier 40, two card fasteners 5〇, a fan 7〇, a first fixing member 60 and a second fixing member 62. The motherboard 10 is provided with a plurality of connectors 12 for interposing the plurality of memories 20 in parallel with each other. The motherboard 1 defines two fixing holes 100 in the middle of the two sides of the memory 2 . Each bracket 30 includes a bottom plate 32 and a suspension plate 34 disposed perpendicularly to the bottom plate 32. The top end of the suspension plate 34 forms a semicircular portion 36. The bottom plate 32 has a rectangular shape and is provided with two through holes 320. The center of the semicircular portion 36 is provided with a pivot hole 362. The semicircular portion 36 is further provided with a semicircular sliding groove 360 which is centered on the pivot hole 362. [0009] The carrier has a U-shape, which includes an elongated fixing plate 42, two baffles 44 vertically disposed on the same side of the fixing plate 42, and two carrier plates 46. The two carrier plates 46 are disposed opposite to each other on the inner side of the baffle 44. The fixing plate 42 is provided with two through holes 420. Two struts 44 are provided with two studs 440 in opposite directions from one end away from the fixed plate 42, and two fixing holes 442 are provided on the inner side of the two studs at 0:. The distance between the stud 440 and the corresponding fixed aperture 442 is as long as the radius of the chute 360. Each carrier plate 46 includes a latching portion 426 that is perpendicular to the carrier portion 460 of the baffle 44 and a vertical carrier portion 460 and that is coupled to the bottom end of the carrier portion 46〇. [0010] The fastener 50 has elasticity. Each of the fasteners 50 includes a first fastening portion 51 and two second fastening portions 55. The first fastening portion 51 includes a first level abutting portion 52 and two first bending portions μ disposed at opposite ends of the first abutting portion 52. Each of the second fastening portions 55 includes a connecting portion 54 disposed at an end of the first bending portion 53 away from the first abutting portion 52, and is disposed at the connecting portion 54 away from the first bending portion 53 099143154. Form No. Α0101 Page 4 One end of the 0992074744-0 201224720 is perpendicular to the second abutment section 56 of the first abutment section 52 and the second bending section 58 provided at the end of the second abutment section 56. [0011] The first fixing member 60 and the second fixing member 62 are both screws. [0012] The fan 70 includes an upper frame 74 and a lower frame 76. The lower frame 76 is provided with a fixing hole 760 at each of the four corners. 2 to 5, in the assembly, the through holes 320 of the two brackets 30 are opposite to the fixing holes 100 of the motherboard 10, and the two suspension plates 34 are respectively close to the outer two memory bodies 20, and the second fixing member 62 After passing through the through hole 320 of the bracket 30, the fixing hole 100 of the main board 10 is locked, so that the bracket 30 is fixed to the main board 10. The two studs 440 of the carrier 40 are disposed through the two pivot holes 362 of the two brackets 30, so that the carrier 40 can be rotated by the studs 440 for the opposite direction. The carrier 40 is rotated to a level position above the memory 20. The carrier 40 can be located on the left or right side of the two brackets 30. The fixing hole 442 is opposite to the first end or the second end of the semicircular sliding slot 360. The first fixing member 6 is locked and fixed through the sliding slot 360. The hole 442 allows the carrier 40 to be fixed to the bracket 30. ❹ [0014] Please refer to FIG. 2 and FIG. 3, the wind: the fan 70 is placed on the two carrying portions 460 of the carrier 40. The two sides of the fan 70 are blocked by the two baffles 44, and the two fasteners are clamped. The first abutting section 52 abuts the lower surface of the carrying portion 460 of the carrier 40 , the first bending section 53 snaps the corresponding latching portion 462 and the baffle 44 , and the second abutting section 56 abuts the fan 70 . The upper surface of the lower frame 76 and the second bending portion 58 are correspondingly fixed in the fixing holes 760 of the fan 70 to fix the fan 70. The fan 70 can dissipate heat from above the memory 20. Referring to FIG. 4 and FIG. 5, the fan 70 can be placed at the two ends of the memory 2〇 and assembled on the carrier 40. The fixing hole 760 of the fan 70 faces the through hole 420 of the fixing plate 4 2 of the carrier 0992074744-0 099143154 Form No. A0101 Page 5 of 17 201224720 40. A third fixing member 64, such as a screw, is inserted into the fixing hole 760 of the fan 70 through the through hole 420 of the fixing plate 42 to fix the fan 70 to the carrier 40. The fan 70 can dissipate heat from the end of the memory 20. [0016] Referring to FIG. 6 and FIG. 7 , the second preferred embodiment of the heat dissipation device of the present invention is substantially the same as the structure of the first preferred embodiment. However, the second preferred embodiment utilizes two fans 70 simultaneously to the host. The memory 20 on the board 10 is dissipated, and the two fans 70 are respectively fixed to the two baffles 44 and the fixing plate 42 of the carrier 40. The two fans 70 can dissipate heat from the upper side and the one end of the memory 20 at the same time. [0017] The heat sink of the present invention dissipates the memory 20 through the bracket 30 and the mounting bracket 40 to mount the fan 70 to enhance the heat dissipation effect. The position of the fan 70 can also be adjusted according to the heat dissipation requirements of the memory 20. [0018] In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0019] FIG. 1 is an exploded perspective view of a first preferred embodiment, a motherboard, and a memory of a heat sink according to the present invention. 2 to 5 are diagrams showing the use state of the first preferred embodiment of the heat sink according to the present invention. 6 and 7 are views showing the use of a second preferred embodiment of the heat sink of the present invention. 099143154 Form No. A0101 Page 6 of 17 0992074744-0 201224720 - [Main component symbol description] [0022] Motherboard: 10 [0023] Connector: 12 [0024] Fixing holes: 100, 442, 760 [0025] Memory: 20 [0026] Bracket: 30 [0027] Base plate: 32 〇 [0028] Suspension plate: 34 [0029] Semicircular portion: 3 6 [0030] Through hole: 320, 420 [0031] Chute: 360 [0032 ] Pivot hole: 362 [0033] Carrier: 40 〇 [0034] Fixed plate: 42 [0035] Baffle: 44 [0036] Carrier plate: 46 [0037] Stud: 44 0 [0038] Bearing: 460 [ 0039] Buckle: 462 [0040] Card firmware: 50 099143154 Form number A0101 0992074744-0 Page 7 of 17 201224720 [0041] -^扣: 51 [0042] First abutment: 52 [0043] First bending section: 53 [0044] Connecting section: 54 [0045] Second fastening part: 55 [0046] Second abutment section: 56 [0047] Second bending section: 58 [0048] First fixing member: 60 [0049] Second fixing member: 62 [0050] Third fixing member: 64 [0051] Fan: 7 0 [0052] Upper border: 74 [0053] Lower border: 76 099143154 Form number A0101 Page 8 of 17 0992074744-0