201222088 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種顯示面板及其使用之光源模組；具體而古， 本發明係關於一種液晶顯示面板及其使用之光源模纟且。° 【先前技術】 各式顯示面板及使用顯示面板之面板顯示裝置已漸漸成為 各類顯示裝置之主流。例如各式面板顯示屏、家用的平面電 視、個人電腦及膝上型電腦之平板型監視器、行動電話及數位 相機之顯示幕等，均為大量使用顯示面板之產品。在各式顯示 面板之中，目前主要分為包含有機發光二極體面板在内之自發 光性顯示面板，以及需使用外部光源之非自發光性顯示面板， 例如液晶顯示面板。 由於使用顯示面板之各式電子裝置體積均不斷縮減，因此 顯示面板本身之體積及厚度亦需隨之減少。圖1所示為傳統液 晶顯示面板之示意圖。如圖1所示，顯示面板係包含導光板 10、反射片15、光學膜片20、光源30、下基板40及上基板 5〇。光源30係設置於導光板10之一端’反射片15則設置於 導光板10之下方。光源30產生之光線由導光板1〇之端部進 入導光板10，並藉由導光板10及反射片15之反射作用分佈 於導光板10上。光學膜片20係設置於導光板10上方，包含 有擴散片、増光片、偏光片及其他各類光學膜片20。當光源201222088 VI. Description of the Invention: [Technical Field] The present invention relates to a display panel and a light source module therefor; and in particular, the present invention relates to a liquid crystal display panel and a light source module therefor. ° [Prior Art] Various display panels and panel display devices using the display panel have gradually become the mainstream of various types of display devices. For example, various panel displays, flat-panel TVs for homes, flat-panel monitors for personal computers and laptops, display screens for mobile phones and digital cameras, etc., are products that use display panels in large quantities. Among various display panels, there are currently mainly classified into a self-luminous display panel including an organic light-emitting diode panel, and a non-self-luminous display panel using an external light source, such as a liquid crystal display panel. Since the size of various electronic devices using the display panel is continuously reduced, the volume and thickness of the display panel itself need to be reduced. Figure 1 shows a schematic view of a conventional liquid crystal display panel. As shown in FIG. 1, the display panel includes a light guide plate 10, a reflection sheet 15, an optical film 20, a light source 30, a lower substrate 40, and an upper substrate 5A. The light source 30 is disposed at one end of the light guide plate 10. The reflection sheet 15 is disposed below the light guide plate 10. The light generated by the light source 30 enters the light guide plate 10 from the end of the light guide plate 1 and is distributed on the light guide plate 10 by the reflection of the light guide plate 10 and the reflection sheet 15. The optical film 20 is disposed above the light guide plate 10 and includes a diffusion sheet, a calender sheet, a polarizer, and other types of optical films 20. When the light source
S 4 201222088 30產生之光線離開導光板削爰，即穿過光學膜片2〇以進行 進-步之光學處理。下基板4〇及上基板5G係設置於光學膜片 20上方，其間係設有液晶層。下基板40上並佈有薄膜電路， 以控制液晶分子之行為。穿過光學膜片2{)之光線係射入下基 板40内，並於穿過液晶層後經由上基板50產生影像。 2傳統之顯示面板巾，由於使絲3()產生之光線均勾分佈 f具備偏極化等特性，需經由導光板10及光學膜片20等進行 然而導光板10及光學膜片20係佔顯示面板 比例，因此如何整合及減少導光板忉及光學 、 之使用係為顯示面板整體厚度降低的重要課題。 【發明内容】 本發明之一目的在於提供一種顯示面板，具有較薄之整體 厚度。 本發明之另一目的在於提供一種顯示面板，具有較少之組 裝元件。 本發明之另一目的在於提供-麵示面板，可節省組裝工 時及成本。 —目的在於提供-種光賴組，可降低顯示面 板組裝之整體厚度。 本發明之另-目的在於提供—種光賴組，可依需求提供 一極化光線。 本發明之顯示面板包含導光薄膜電路基板、反射板、光源 及偏光層。導光薄膜電路基板具有入光端及出光頂面，其中入 光端係位於出光頂面之端部。光源係設置對應於導光薄膜電路 201222088 基板之入光端。光源發出之光線由入光端進入導光薄膜電路基 板中，經導光薄膜電路基板導引傳遞後，再由出光頂面離開導 光薄膜電路基板。反射板則設置於導光薄膜電路基板下方，供 反射自導光薄膜電路基板底面漏失之光線，以增加光之利用效 率。 偏光層係設置於導光薄膜電路基板，且其分佈係平行於導 光薄膜電路基板之出光頂面。偏光層與導光薄膜電路基板之相. 對位置關係可視需求而加以改變。例如偏光層係可覆蓋於導光 薄膜電路基板上出光頂面，並以偏光膜之形式存在；然而亦可 設置於導光薄膜電路基板之内部，或以導光薄膜電路基板整體 形成偏光層。光線自導光薄膜電路基板之出光頂面射出後，在 通過偏光層後，即形成具平面光源效果之極化光線，供作為系 統之背光光源。 顯示面板更可包含複數個光變向結構。光變向結構係包含 於導光薄膜電路基板，且沿平行出光頂面之方向分佈。導光薄 膜電路基板係藉由内部反射導引光源之光線分佈於出光頂 面，而光變向結構則使導光薄膜電路基板内部之光線產生偏 折，進而影響内部之反射行為，並使出光頂面之出射光更為均 勻。 在另一實施例中，顯示面板包含導光基板、電路、複數個 麵接部及絲。導絲板具有人光端及頂面，且人光端係位於 頂面之端部。電_賴於導絲板之頂面。複數軸接部係 位於導光基板之入光端端面上。耦接部並延伸至導光義板之頂The light generated by S 4 201222088 30 is cut away from the light guide plate, i.e., through the optical film 2 〇 for further optical processing. The lower substrate 4A and the upper substrate 5G are disposed above the optical film 20 with a liquid crystal layer interposed therebetween. A thin film circuit is disposed on the lower substrate 40 to control the behavior of the liquid crystal molecules. Light passing through the optical film 2{) is incident into the lower substrate 40, and an image is generated via the upper substrate 50 after passing through the liquid crystal layer. 2 Conventional display panel towel, because the light generated by the wire 3() is characterized by polarization, etc., it is required to pass through the light guide plate 10 and the optical film 20, but the light guide plate 10 and the optical film 20 are occupied. Since the panel ratio is displayed, how to integrate and reduce the use of the light guide plate and the optical is an important issue for reducing the overall thickness of the display panel. SUMMARY OF THE INVENTION One object of the present invention is to provide a display panel having a thin overall thickness. Another object of the present invention is to provide a display panel having fewer components. Another object of the present invention is to provide a face panel that saves assembly time and cost. - The purpose is to provide a light-receiving group that reduces the overall thickness of the display panel assembly. Another object of the present invention is to provide a light-receiving group that provides a polarized light as desired. The display panel of the present invention comprises a light guiding film circuit substrate, a reflecting plate, a light source and a polarizing layer. The light guiding film circuit substrate has an light incident end and an light emitting top surface, wherein the light incident end is located at an end of the light emitting top surface. The light source is disposed corresponding to the light incident end of the substrate of the light guide film circuit 201222088. The light emitted by the light source enters the light guide film circuit substrate through the light entrance end, is guided and transmitted through the light guide film circuit substrate, and then exits the light guide film circuit substrate from the light exit top surface. The reflector is disposed under the light guide film circuit substrate for reflecting light that is lost from the bottom surface of the light guide film circuit substrate to increase light utilization efficiency. The polarizing layer is disposed on the light guiding film circuit substrate, and the distribution thereof is parallel to the light emitting top surface of the light guiding film circuit substrate. The phase of the polarizing layer and the light guiding film circuit substrate can be changed depending on the positional requirements. For example, the polarizing layer may be applied to the light-emitting top surface of the light-guide film substrate and may be in the form of a polarizing film; however, it may be disposed inside the light-guiding film circuit substrate or form a polarizing layer as a whole on the light-guide film circuit substrate. After the light is emitted from the light-emitting top surface of the light-guide film circuit substrate, after passing through the polarizing layer, polarized light having a planar light source effect is formed for use as a backlight source of the system. The display panel can further include a plurality of light redirecting structures. The light redirecting structure is included in the light guiding thin film circuit substrate and distributed in the direction parallel to the top surface of the light emitting. The light guiding film circuit substrate is distributed on the light emitting top surface by the internal reflection guiding light source, and the light redirecting structure causes the light inside the light guiding film circuit substrate to be deflected, thereby affecting the internal reflection behavior and enabling the light output. The light from the top surface is more uniform. In another embodiment, the display panel includes a light guiding substrate, a circuit, a plurality of facets, and a wire. The guide wire has a human light end and a top surface, and the human light end is located at the end of the top surface. Electricity_ depends on the top surface of the guide wire. The plurality of shaft portions are located on the light incident end surface of the light guiding substrate. Coupling and extending to the top of the light guide
S 6 201222088 面上，以與電路相連接。光源包含成對接腳及發光元件。成對 接腳係分別耦接於耦接部，發光元件係設置於成對接腳之間， 並與成對接腳耦接。發光元件係具有面朝向導光基板入光端之 發光面。發光元件產生之光線係經由發光面射入入光端，再經 由導光基板之導引將光線分佈於導光基板之頂面。 發光元件更可包含有本體及電激發光體。本體係設置於成對接 腳之間，並形成内部空間及光線出口。電激發光體係容納於本 體之内部空間’其兩電極係分別耦接於成對接腳。本體具有光 線出二之一面係形成整體之發光面，偏光件係設置於本體上， 並覆蓋光線出口。當電激發光體產生光線時，光線即由光線出 口射出’並在穿過偏光件後形成偏極化光離開光源。 【實施方式】 本發明係提供一種顯示面板及其使用之光源模組。在較佳 實施例中，本發明之顯示面板係包含一彩色液晶顯示面板。然 而在不同實施例中，本發明之液晶面板亦可包含單色之液晶面 板。而液晶顯示裝置則泛指使用液晶面板之顯示裝置，包含家 用的液晶電視、個人電腦及膝上型電腦之液晶監視器、行動電 話及數位相機之液晶顯示幕等。 如圖2a所示，本發明之顯示面板包含導光薄膜電路基板 200、反射板150、光源300及偏光層400。導光薄膜電路基板 200具有入光端210及出光頂面230，其中入光端21〇係位於 出光頂面230之端部。在較佳實施例中，導光薄膜電路基板 200並包含有薄膜電路層25〇。導光薄膜電路基板2〇〇係由透 明或半透明材料所製成；在較佳實施例中，導光薄膜電路基板 201222088 200之材質可以為有機樹脂材質、玻璃、石英或其他透明或半 透明材料。 光源300係設置對應於導光薄膜電路基板2〇〇之入光端 21〇。光源300發出之光線由入光端21〇進入導光薄膜電路基 板200中，經導光薄膜電路基板2⑼導引傳遞後，再由出光頂 面230離開導光薄膜電路基板2〇〇。光源3〇〇較佳係包含發光 二極體(LED)光源；，然而在不同實施例中，光源咖亦可包含 燈管光源及其他形式之光源^反射板15〇則設置於導光薄膜電 路基板200下方，供反射自導光薄膜電路基板2〇〇底面漏失之 光線，以增加光之利用效率。反射板15〇較佳係可使用丙稀 腈、丁二烯、苯乙烯共聚物(ABS)或聚碳酸酯(pc)等材質形 成；然而在不同實施例中亦可以直接電鍍或濺鍍等方式形成於 導光薄膜電路基板200底面。 在圖2a所示之實施例中，顯示面板更包含上基板11〇。上 基板110係位於導光薄膜電路基板200之上方，並突出於入光 端210外。液晶層130係夾設於上基板11〇與導光薄膜電路基 板200之間。上基板110之底面係對應於導光薄膜電路基板 200之出光頂面230。光源300係設置於上基板110之底面上， 並位於導光薄膜電路基板200之入光端210外侧。光源300係 朝向入光端210設置及發光，因此光源300發出之光線即可直 接射入入光端210内。 然而在圖2b所示之實施例中，光源300則直接連接於導光 薄膜電路基板200靠近入光端210之端面。光源3〇〇係朝向入On the surface of S 6 201222088, it is connected to the circuit. The light source includes a pair of pins and a light emitting element. The pair of pins are respectively coupled to the coupling portion, and the light emitting elements are disposed between the pair of pins and coupled to the pair of pins. The light-emitting element has a light-emitting surface that faces toward the light-input end of the light-guiding substrate. The light generated by the light-emitting element is incident on the light-emitting end via the light-emitting surface, and is guided by the light-guiding substrate to distribute the light on the top surface of the light-guiding substrate. The light emitting element may further comprise a body and an electroluminescent body. The system is placed between the pair of pins and forms an internal space and a light exit. The electroluminescent system is housed in the internal space of the body. The two electrode systems are respectively coupled to the pair of pins. The body has a light-emitting surface formed by one of the two light-emitting surfaces, and the polarizing member is disposed on the body and covers the light exit. When the electroluminescent body produces light, the light exits from the exit of the light and forms polarized light away from the source after passing through the polarizer. Embodiments The present invention provides a display panel and a light source module used therewith. In a preferred embodiment, the display panel of the present invention comprises a color liquid crystal display panel. However, in various embodiments, the liquid crystal panel of the present invention may also comprise a monochromatic liquid crystal panel. The liquid crystal display device generally refers to a display device using a liquid crystal panel, and includes a liquid crystal television for a home, a liquid crystal monitor for a personal computer and a laptop computer, a liquid crystal display screen for a mobile phone and a digital camera. As shown in FIG. 2a, the display panel of the present invention includes a light guiding film circuit substrate 200, a reflecting plate 150, a light source 300, and a polarizing layer 400. The light guide film circuit substrate 200 has an light incident end 210 and an light exit top surface 230, wherein the light incident end end 21 is located at an end of the light exit top surface 230. In the preferred embodiment, the light directing film circuit substrate 200 further includes a thin film circuit layer 25A. The light guiding film circuit board 2 is made of a transparent or translucent material; in a preferred embodiment, the material of the light guiding film circuit substrate 201222088 200 may be made of organic resin, glass, quartz or other transparent or translucent. material. The light source 300 is disposed to correspond to the light incident end 21 of the light guiding thin film circuit substrate 2 . The light emitted from the light source 300 enters the light guide film circuit substrate 200 through the light incident end 21, is guided and transmitted through the light guide film circuit substrate 2 (9), and then exits the light guide film circuit substrate 2 from the light exit top surface 230. Preferably, the light source 3 includes a light emitting diode (LED) light source; however, in different embodiments, the light source coffee can also include a light source and other forms of light source. The reflective plate 15 is disposed on the light guiding thin film circuit. Below the substrate 200, light that is reflected from the bottom surface of the light-guide film circuit board 2 is reflected to increase the utilization efficiency of light. The reflecting plate 15 is preferably formed of a material such as acrylonitrile, butadiene, styrene copolymer (ABS) or polycarbonate (pc); however, in different embodiments, it may be directly plated or sputtered. It is formed on the bottom surface of the light guide film circuit board 200. In the embodiment shown in FIG. 2a, the display panel further includes an upper substrate 11A. The upper substrate 110 is located above the light guiding thin film circuit substrate 200 and protrudes beyond the light incident end 210. The liquid crystal layer 130 is interposed between the upper substrate 11A and the light guiding film circuit substrate 200. The bottom surface of the upper substrate 110 corresponds to the light-emitting top surface 230 of the light-guide film circuit substrate 200. The light source 300 is disposed on the bottom surface of the upper substrate 110 and outside the light incident end 210 of the light guiding thin film circuit substrate 200. The light source 300 is disposed and emitted toward the light incident end 210, so that light emitted from the light source 300 can be directly incident into the light incident end 210. However, in the embodiment shown in FIG. 2b, the light source 300 is directly connected to the end surface of the light guiding thin film circuit substrate 200 near the light incident end 210. Light source 3
S 8 201222088 光端210發光’因此光源300發出之光線即可直接射入入光端 210内。圖2c所示則為另一實施例。在此實施例中，光源3〇〇 係固接於導光薄膜電路基板200之出光頂面230上靠近入光端 210之位置。光源300之出光面係朝向出光頂面230，使光源 300之光線經由出光頂面230進入導光薄膜電路基板2〇〇内。 進入導光薄膜電路基板200後之光線則可經由導光薄膜電路 基板200及反射板150之反射效應傳導至導光薄膜電路基板 200之各區域。 偏光層400係設置於導光薄膜電路基板2〇〇，且其分佈係平 行於導光薄膜電路基板200之出光頂面230。此處所言之平行 分佈並不限定偏光層400應分佈於導光薄膜電路基板2〇〇之表 面或其内部。偏光層400與導光薄膜電路基板2〇〇之相對位置 關係可視需求而加以改變。在如圖2a所示之實施例中，偏光 層400係覆蓋於導光薄膜電路基板200之出光頂面230上，並 以偏光膜之形式存在；然而在圖2b之實施例中，偏光層4〇〇 係可設置於導光薄膜電路基板200之内部，形成一夾層。在不 同實施例中’亦可以導光薄膜電路基板200本身作為偏光層 400。此一設置亦符合偏光層400分佈平行於出光頂面23〇之 要求。此外，偏光層400較佳係設置於薄膜電路層25〇之上. 然而在不同實施例中，偏光層400亦可設置於薄膜電路層25〇 之下方。 如圖2d所示’顯示面板進一步包含有低折射率層45〇。低 折射率層450係設置於出光頂面230的薄膜電路層250之下， 201222088 而偏光層400則設置於低折射率層45〇上，然而在不同實施例 中，偏光層400亦可設置於薄膜電路層25〇之上方。低折射率 層450之折射率（refracti〇n index)係小於導光薄膜電路基板 200之折射率。藉由低折射率層45〇之設置，係可增進光於導 光薄膜電路基板2〇〇中之反射傳導效率，以將部分光線導引至 導光薄臈電路基板2〇〇之後端。在較佳實施例中，低折射率層 450係可為導光薄膜電路基板細中之空氣夾層。空氣爽層之 形成方式係包含以雷射形成或以其他封裝或貼附方式形成。然 而在不同實施例中，低折射率層亦可以鍵膜方式形成於導 光薄膜電路基板2〇〇上。此外，在圖2b所示之實施例中，當 偏光層400之折射率(refraction index)小於導光薄膜電路基 板200之折射率，且直接位於薄膜電路層25〇之下方時，偏光 層400亦可取代低折射率層450之功效。 如圖2a所示，導光薄膜電路基板2〇〇係接收光源3〇〇產生 之光線。接著藉由導光薄膜電路基板200内部及反光板150產 生之光學反射及折射等效應將進入其内部之光線導引分佈於 出光頂面230上，以產生平面光源之效果。光線自出光頂面 230射出後，即進入偏光層4〇〇。光線自偏光層4〇〇射出後， 即形成具平面光源效果之極化光線。然而在圖2b所示之實施 例中，進入導光薄膜電路基板2〇〇中之光線係先經由偏光層 400之偏極化處理後，才自出光頂面230出射。 在圖3所示之實施例中，本發明之顯示面板另包含有擴散 層500。擴散層500較佳係以平行於出光頂面23〇之方式分佈 201222088 於導光薄膜電路基板簡之上或之内。擴散層5⑼係設置於偏 光層400朝向導光薄膜電路基板2〇〇内部之一側；換言之，以 導光薄膜電路基板2GG平置之方向觀之，如圖3所示，擴散層 500係設置於偏光層400之下方。擴散層5〇〇主要之設置目的 在於使通狀統㈣分散，以制使統更加均自之目的。 在此實施例中’導光薄膜電路基板内之光線係先經過擴散 層500，使光線較為分散後，方始進入偏光層棚進行偏極化 處理。 如圖3所示，擴散層500較佳係覆蓋於薄膜電路層25〇之 上，然而在不同實施例中，擴散層5〇〇亦可設置於薄膜電路層 250之下，當擴散層500設置於薄膜電路層25〇之下時，且折 射率小於導光薄膜電路基板2〇〇時，亦可以取代低折射率層 450(如圖2d所示）之功效。此外，在此實施例中，擴散層5〇〇 係以薄膜方式形成於導光薄膜電路基板20Q之上，且其中包含 複數個擴散粒子510。擴散粒子510較佳係於薄膜製程前或製 程中摻入擴散層500或其原料中。在較佳實施例中，擴散粒子 510可包含MMA、Si02、Ti02等粒子。然而在不同實施例中， 擴散層500亦可藉由設置光擴散微結構於表面之方式，以達到 擴散光線之效果。 在圖4所示之實施例中，顯示面板更包含偏光件6〇〇。偏光 件600係設置於光源300與導光薄膜電路基板2〇〇之入光端 210之間。偏光件600較佳係包含貼附於光源3〇〇上或入光端 210上之極化膜。必需強調的是’此處所言之入光端21〇並非 ,ς. 11 201222088 單指導光薄膜電路基板200之一端面而言，而是泛指導光薄膜 電路基板200上接受光源300光線一端之附近區域。例如出光 頂面230接近導光薄膜電路基板2〇〇端面之部分亦包含於入光 端210之範圍内。 在圖4所示之實施例中，偏光件6〇〇之兩側係分別與光源 300及導光薄膜電路基板200之入光端21〇端面密接，以減少 空氣層介入對光行進路線造成之影響。如圖4所示，光源3〇〇 產生之光線係先經過偏光件6〇〇後始進入導光薄膜電路基板 200之入光端210 ;換言之，進入導光薄膜電路基板2〇〇入光 端210之光線係為已經過偏極化處理之光線。 圖5a所示為本發明之另一實施例。在此實施例中，顯示面 板包含導光薄膜電路基板2〇〇、反射板15〇、光源3〇〇以及複 數個光變向結構700。在此實施例中’縣薄膜電路基板2〇〇、 反射板150及光源300之設置均與前述之實施例近似。光變向 結構700係包含於導光薄膜電路基板2〇〇，且沿平行出光頂面 230之方向分佈；換言之，光變向結構7GG係形成設置於導光 薄膜電路基板·之上或其巾。如目5a所示，導光薄膜電路 基板200係藉由内部反射導引光源300之光線分佈於出光頂面 230，而光變向結構7〇〇則使導光薄獏電路基板2〇〇内部之光 線產生偏折’進而影響内部之反射行為，並使出光頂面230之 出射光更為均勻。 在圖5a所示之實施例中，光變向結構7〇〇係形成於導光薄 膜電路基板200之中。在此實施例中，光變向結構·係包含 12 201222088 形成於導光薄臈電路基板200中之氣泡。氣泡之形成方法較佳 係以雷射打入導光薄膜電路基板200内之特定位置，以產生氣 泡。然而在不同實施例中，亦可以其他物理性或化學性之方式 產生氣泡作為光變向結構7〇〇。此外，在不同實施例中，亦可 以植入粒子或雜質等方式作為光變向結構700。如圖5a所示， 光源300產生之光線經由入光端21〇進入導光薄膜電路基板 200内。其中部分之光線經由内部全反射及反射板150之反射 傳到導光薄膜電路基板2〇〇之遠端；而亦有部分之光線則經由 光變向結構700之偏折直接射至出光頂面23〇形成出射光，或 經再一次反射產生出射光。藉由光變向結構700之設置，可避 免導光薄膜電路基板200内產生過多之全反射狀況，以使出光 頂面230上之光線分佈均勻化。 在圖5b所示之實施例中，光變向結構7〇〇則形成於導光薄 膜電路基板200之底面。以此實施例而言，光變向結構7〇〇係 包含开>成於導光薄膜電路基板2〇〇底面上之突起結構，且此突 起結構面向導光薄膜電路基板2〇〇之一面具有複數斜面朝入 光端210傾斜。此一突起結構係可以印刷成形、滾壓成形、蝕 刻成形或微機械切削加工成形形成於導光薄膜電路基板2〇〇 之底面上。 如圖5b所示，進入導光薄膜電路基板200之光線部份經由 全反射傳遞至導光薄膜電路基板2〇〇内之其他部分，而經由光 變向結構700反射之部分光線則改變其原本之全反射路徑，而 由出光頂面230射出導光薄膜電路基板2〇〇外。此外，在不同 13 201222088 實施例中，形成於導光薄膜電路基板200之光變向結構7〇〇並 不限於本實施例中之鋸齒狀突起’亦可為其他如半球形突起或 波浪突起等不同形狀之結構，或可以於底面加設或改變部分材 質之方式為之。 如圖6a及圖6b所示，分佈於導光薄膜電路基板2〇〇之内 或其底面上之光變向結構700具有可變之分佈密度。以圖如 及圖6b之實施例而言，光變向結構700於接近光源3〇〇之位 置處具有較小之分佈密度；換言之，導光薄膜電路基板2〇〇較 遠離光源300之部分具有較多之光變向結構7〇〇分佈。藉由此 光變向結構700分佈密度之改變，可避免過多之光線在導光薄 膜電路基板20G中接近光源3GG之部分被反射出出光頂面 230，以調整出射光線於出光頂面23〇上之分佈狀況。 如圖7a及圖7b所示，分佈於導光薄膜電路基板2〇〇之内 或其底面上之光變向結構7〇〇具有可變之截面尺寸。以圖％ 及圖7b之實施例而言，光變向結構7〇〇於接近光源3〇〇之位 置處具有較小之截面尺寸；換言之，分佈於導光薄膜電路基板 200較遠離光源3〇〇部分之光變向結構7〇〇具有較大之截面尺 寸。藉由此光變向結構7〇〇截面尺寸之改變，可避免過多之光 線在導光薄膜電路基板2GG中接近光源3GG之部分被反射出出 光頂面230，以均勻化出射光線於出光頂面23〇上之分佈狀 況。綜觀圖6a、圖6b、圖7a及圖7b所示之實施例，藉由改 變於導光薄膜電路基板200之截面或底面上光變向結構700所 佔之面積比例’即可達到調整及均勻化出射綠於出光頂面 14 201222088 230上之分佈狀況。 圖8a所不為本發明之另一實施例。在此實施例中，顯示面 板包含導光基板810、電路830、複數個耦接部85〇及光源87〇。 導光基板810具有入光端811及頂面813，且入光端8U係位 於頂面813之端部。導光基板81〇係由透明或半透明材料所製 成；在較佳實施例巾’導光基板81Q之材#可以為有機樹脂材 質、玻璃、石英或其他透明或半透明材料。 如圖8a所示’電路830係形成於導光基板81〇之頂面813。 在較佳實施例中，電路83〇係為覆蓋於頂面gw之薄膜電路層。 複數個耦接部850係位於導光基板81〇之入光端811端面 上。耦接部850並延伸至導光基板81〇之頂面813上，以與電 路830相連接。耦接部85〇較佳係由有機樹脂基之導電膠材所 形成。導電膠材較佳係由膠材基材及導電材混合而成，而導電 材必須均勻分散於膠材基材内。常用之膠材基板係包含熱硬化 型膠材或光硬化型膠材。常見之熱硬化型膠材有聚酯類 (polyesters)、環氧基(epoxy)、石夕基樹脂（silic〇ne)、胺基 甲酸乙脂(urethanes)等。這類型的高分子基材受熱、壓力或 觸媒後會促成進行縮合（condensati〇n)及交聯（cr〇ss linking)反應，產生三度空間的網狀結構聚合物，對腐蝕及濕 氟知钱的抵抗力佳’同時具適當的機械強度以及可靠性。光硬 化型南分子部分則可為壓克力（Acryiate)類型，如胺基甲酸乙 脂雙丙稀酸（Urethane Diaacrylate)以及環氧基雙丙烯酸 (Epoxy Diacrylate)等，而紫外光起始劑（ph〇t〇initiator) 15 201222088 則可為苯f酮(benz〇Phenone)等。導電材則可以為銀、 他具導電性又稍轉基敎分齡讀#。 或，、 如圖8b及圖9所示，其為顯示面板上視圖，導光 於入光端811之端面上形成有複數個凹槽815。在較佳土實 中，如圖9所示，係可於導光基板⑽自原料基板= =前即於頂面813上入光端811之位置進行鑽孔姻將： 土板810自原料基板801裁切下來後，其入光端811之端s ^即可形成凹槽815，裁切時，裁切線必須穿過所有之凹槽 如圖8b所示’每-凹槽815之一端係曝露於導光基板_ 2面813 ’而每—她部850之—部分或全部係分別設置於 =同凹娜内。在較佳實施财，如圖9所示，形絲接部 50之材料，例如有機樹脂基之導電膠材，係可於導光基板刚 自原料基板801裁切下來前，先行注入入光端8ιι位置之孔 :當裁切導光额8_，即—併將料或全部容納於 815之耦接部85〇裁切成形。 在圖8a所示之實施例中，顯示_更包含有保護膜獅。 保護膜係覆於輕接部850與電路830之連接處。保護膜_係 可以點膠、鑛膜或其他不同方式形成於雛部85〇與電路83〇 之連接處。此外’保護膜_之材質係可包含絕緣或導電材 質。藉由保護膜890之設置，得以避免搞接部85〇與電路83〇 連接位置產生接觸不良或分離的狀況。 接著’請參照圖8b，光源870包含成對接腳871及發光元 16 201222088 件873。成對接腳871係分別耦接於耦接部85〇，其接合方式 係包含焊接、黏接或其他不妨礙導電性質之方法。發光元件 873係设置於成對接腳871之間，並與成對接腳871耦接。發 光元件873較佳係為發光二極體；然而在不同實施例中，發光 元件873亦可為其他點光源或線性光源。如圖此所示，發光 元件873係具有面朝向導光基板81〇入光端811之發光面 875。發光元件873產生之光線係經由發光面875射入入光端 811，再經由導光基板810之導引將光線分佈於導光基板81〇 之頂面813。 如圖8a及圖8b所示，接腳871較佳係包含一 L型之導電 結構，其中包含相互垂直之電源連接面91〇及發光元件連接面 930。電源連接面91〇係與提供訊號之電路83〇耦接；而發光 元件連接面930則與發光元件873耦接。在此實施例中，電源 連接面910係與發光元件873之發光面875面朝同一方向。換 &之，電源連接面910係面向導光基板_人光端811之端面 並與耦接部850耦接；而發光元件873之發光面875亦朝向入 光端之端面，並朝入光端發射光線。然而在另一實施例中，如 圖ίο所示，電源連接面910亦可與發光面875垂直。在此實 施例中，成對接腳871並非直接連接至導光基板81〇上，而是 連接至光祕板_。發光元件的電源供應模式，如同傳統方 法，是經由光源基板950提供電源給發光元件873。 在如圖11所示之實施例中，光源87〇並包含有設置於發光 面875上之偏光件970。偏光件970較佳係為由複數層鍍膜所 17 201222088 形成已偏極化之光線。如圖11所示， 本體880及電激發光體980。本體88ί 形成之極化膜。發光元件873發出之光線在射出發光面875後 即進入偏光件970内。當光線通過偏光件97〇向外射出時，則 1所示，發光元件873係包含有 本體880係設置對應於成對接腳 871 ’並藉由側壁881及底部883圍成内部空間885及光線出 口 887。側壁881較佳係包含具反射性之内表面，並具有預設 之反射角度。内部空間885較佳係灌注有螢光粉或其他化學^ 如圖11所不，電激發光體98〇係容納於本體_之内部空 間885,其兩電極係直接或經由導線分別減於成對接腳871。 電激發光體980較鶴為發光二極體晶體。本體88()具有光線 出口 887之-面係形成整體之發光面奶，偏光件97〇係設置 於本體880上，並覆蓋光線出口 887。當電激發光體删產生 光線時’光線即由光線出口 887射出，並在穿過偏光件後 形成偏極化総開光源87〇。細在不同實細巾，本體_ 亦可為由透光材質形成之光學透鏡，並以—體·方式包裹住 電激發光體換言之，電激發光體98G係敌入在本體880 之内部。由於本體_啊兼有縣及光學透鏡之效果 ，因此 光線必需穿透本體_始得向外射出。此時光線出口 之定S 8 201222088 The light end 210 emits light. Therefore, the light emitted by the light source 300 can be directly incident into the light incident end 210. Another embodiment is shown in Figure 2c. In this embodiment, the light source 3 is fixed to the light-emitting top surface 230 of the light-guide film circuit substrate 200 near the light-incident end 210. The light exiting surface of the light source 300 faces the light emitting top surface 230, and the light of the light source 300 enters the light guiding thin film circuit substrate 2 through the light emitting top surface 230. The light entering the light guiding thin film circuit substrate 200 can be conducted to the respective regions of the light guiding thin film circuit substrate 200 via the reflection effect of the light guiding thin film circuit substrate 200 and the reflecting plate 150. The polarizing layer 400 is disposed on the light guiding thin film circuit substrate 2, and is distributed parallel to the light emitting top surface 230 of the light guiding thin film circuit substrate 200. The parallel distribution as used herein does not limit that the polarizing layer 400 should be distributed on the surface of the light guiding thin film circuit substrate 2 or in the inside thereof. The relative positional relationship between the polarizing layer 400 and the light guiding thin film circuit board 2 can be changed as needed. In the embodiment shown in FIG. 2a, the polarizing layer 400 covers the light-emitting top surface 230 of the light-guide film circuit substrate 200 and exists in the form of a polarizing film; however, in the embodiment of FIG. 2b, the polarizing layer 4 The lanthanide system may be disposed inside the light guiding thin film circuit substrate 200 to form an interlayer. In the different embodiments, the light guiding thin film circuit substrate 200 itself may be used as the polarizing layer 400. This arrangement also meets the requirement that the polarizing layer 400 be distributed parallel to the top surface 23 of the light exiting surface. In addition, the polarizing layer 400 is preferably disposed on the thin film circuit layer 25A. However, in different embodiments, the polarizing layer 400 may also be disposed under the thin film circuit layer 25A. The display panel as shown in Fig. 2d further includes a low refractive index layer 45A. The low refractive index layer 450 is disposed under the thin film circuit layer 250 of the light emitting top surface 230, and the polarizing layer 400 is disposed on the low refractive index layer 45, however, in different embodiments, the polarizing layer 400 may also be disposed on Above the thin film circuit layer 25〇. The refractive index of the low refractive index layer 450 is smaller than the refractive index of the light guiding thin film circuit substrate 200. By the arrangement of the low refractive index layer 45, the reflection conduction efficiency of the light in the light guiding film circuit substrate 2 is improved to guide part of the light to the rear end of the light guiding thin circuit substrate 2. In a preferred embodiment, the low refractive index layer 450 can be an air interlayer of the thin film of the light directing film circuit. The formation of the air layer is formed by laser formation or by other encapsulation or attachment. However, in various embodiments, the low refractive index layer may be formed on the light guiding film circuit substrate 2 by a key film. In addition, in the embodiment shown in FIG. 2b, when the refractive index of the polarizing layer 400 is smaller than the refractive index of the light guiding film circuit substrate 200 and directly under the thin film circuit layer 25, the polarizing layer 400 is also The effect of the low refractive index layer 450 can be replaced. As shown in Fig. 2a, the light guiding thin film circuit board 2 receives the light generated by the light source 3''. Then, light rays entering the inside thereof are guided and distributed on the light-emitting top surface 230 by the effects of optical reflection and refraction generated inside the light-guiding film circuit substrate 200 and the light-reflecting plate 150 to produce a planar light source. After the light is emitted from the top surface 230 of the light, it enters the polarizing layer 4〇〇. After the light is emitted from the polarizing layer 4, a polarized light having a planar light source effect is formed. However, in the embodiment shown in Fig. 2b, the light entering the light-guide film circuit substrate 2 is first polarized by the polarizing layer 400 before being emitted from the light-emitting top surface 230. In the embodiment shown in Figure 3, the display panel of the present invention further includes a diffusion layer 500. The diffusion layer 500 is preferably distributed on or in parallel with the light-emitting thin film circuit substrate in a manner parallel to the light-emitting top surface 23〇. The diffusion layer 5 (9) is disposed on one side of the polarizing layer 400 facing the inside of the light guiding film circuit substrate 2; in other words, in the direction in which the light guiding thin film circuit substrate 2GG is placed flat, as shown in FIG. 3, the diffusion layer 500 is disposed. Below the polarizing layer 400. The main purpose of the diffusion layer 5 is to disperse the general system (4) to make the system more uniform. In this embodiment, the light in the light-guide film circuit substrate passes through the diffusion layer 500 first, so that the light is relatively dispersed, and then enters the polarizing layer shed to perform polarization treatment. As shown in FIG. 3, the diffusion layer 500 preferably covers the thin film circuit layer 25A. However, in different embodiments, the diffusion layer 5〇〇 may also be disposed under the thin film circuit layer 250 when the diffusion layer 500 is disposed. When the refractive index of the thin film circuit layer 25 is lower than that of the light guiding thin film circuit substrate 2, the effect of the low refractive index layer 450 (as shown in FIG. 2d) may be replaced. Further, in this embodiment, the diffusion layer 5 is formed on the light guiding thin film circuit substrate 20Q in a thin film manner, and includes a plurality of diffusion particles 510 therein. The diffusion particles 510 are preferably incorporated into the diffusion layer 500 or its materials prior to or during the film processing. In a preferred embodiment, the diffusion particles 510 may comprise particles such as MMA, SiO 2 , TiO 2 , and the like. However, in various embodiments, the diffusion layer 500 can also achieve the effect of diffusing light by providing a light diffusing microstructure on the surface. In the embodiment shown in FIG. 4, the display panel further includes a polarizer 6〇〇. The polarizer 600 is disposed between the light source 300 and the light incident end 210 of the light guide film circuit board 2 . The polarizer 600 preferably includes a polarizing film attached to the light source 3 or to the light end 210. It must be emphasized that the terminating end of the light-emitting end 21 is not the same as that of the end surface of the light-guide film substrate 200. region. For example, a portion of the light-emitting top surface 230 close to the end surface of the light-guide film circuit board 2 is also included in the range of the light-incident end 210. In the embodiment shown in FIG. 4, the two sides of the polarizer 6 are respectively closely connected to the end faces of the light source 300 and the light incident end of the light guiding film circuit substrate 200 to reduce the interference of the air layer on the light traveling path. influences. As shown in FIG. 4, the light generated by the light source 3〇〇 first enters the light-input end 210 of the light-guide film circuit substrate 200 after passing through the polarizer 6〇〇; in other words, enters the light-guide film circuit substrate 2 and enters the light end. The light of 210 is the light that has been subjected to polarization treatment. Figure 5a shows another embodiment of the invention. In this embodiment, the display panel includes a light guiding thin film circuit substrate 2, a reflecting plate 15A, a light source 3A, and a plurality of light redirecting structures 700. In this embodiment, the arrangement of the county thin film circuit substrate 2, the reflecting plate 150, and the light source 300 is similar to that of the foregoing embodiment. The light redirecting structure 700 is included in the light guiding thin film circuit substrate 2〇〇 and is distributed along the parallel light emitting top surface 230; in other words, the light redirecting structure 7GG is formed on the light guiding thin film circuit substrate or on the surface thereof. . As shown in FIG. 5a, the light guiding film circuit substrate 200 is distributed by the internal reflection guiding light source 300 to the light emitting top surface 230, and the light redirecting structure 7 is used to make the light guiding thin circuit substrate 2 inside. The light produces a deflection, which in turn affects the internal reflection behavior and makes the light exiting the top surface 230 more uniform. In the embodiment shown in Fig. 5a, the light redirecting structure 7 is formed in the light guiding film circuit substrate 200. In this embodiment, the light redirecting structure includes 12 201222088 bubbles formed in the light guiding thin circuit substrate 200. The bubble formation method is preferably performed by laser striketing a specific position in the light guide film circuit substrate 200 to generate a bubble. However, in various embodiments, bubbles may be generated as light redirecting structures 7 in other physical or chemical ways. Further, in various embodiments, the light redirecting structure 700 may be implanted in the form of particles or impurities. As shown in FIG. 5a, the light generated by the light source 300 enters the light guide film circuit substrate 200 via the light incident end. A part of the light is transmitted to the distal end of the light guiding film circuit board 2 through the internal total reflection and the reflection of the reflecting plate 150; and part of the light is directly incident on the light emitting top surface through the deflection of the light redirecting structure 700. 23〇 forms an outgoing light, or is reflected again to produce an outgoing light. By the arrangement of the light redirecting structure 700, excessive total reflection conditions in the light guiding thin film circuit substrate 200 can be avoided to uniformize the light distribution on the light emitting top surface 230. In the embodiment shown in Fig. 5b, the light redirecting structure 7 is formed on the bottom surface of the light guiding film circuit substrate 200. In this embodiment, the light redirecting structure 7 includes a protrusion structure formed on the bottom surface of the light guiding film circuit substrate 2, and the protruding structure surface is on one side of the light film circuit substrate 2 The plurality of slopes are inclined toward the light incident end 210. The projecting structure can be formed on the bottom surface of the light guiding film circuit substrate 2 by print forming, roll forming, etch forming or micromachining. As shown in FIG. 5b, the portion of the light entering the light guiding film circuit substrate 200 is transmitted to the other portions of the light guiding film circuit substrate 2 via total reflection, and the portion of the light reflected by the light redirecting structure 700 changes its original portion. The total reflection path is emitted from the light-emitting thin film circuit substrate 2 by the light-emitting top surface 230. In addition, in the embodiment of the different 13 201222088, the light redirecting structure 7 formed on the light guiding film circuit substrate 200 is not limited to the zigzag protrusions in the embodiment, and may be other such as a hemispherical protrusion or a wave protrusion. Different shapes of structure, or you can add or change parts of the material on the bottom. As shown in Figs. 6a and 6b, the light redirecting structure 700 distributed in or on the bottom surface of the light guiding film circuit substrate 2 has a variable distribution density. In the embodiment of FIG. 6b, the light redirecting structure 700 has a small distribution density at a position close to the light source 3〇〇; in other words, the light guiding thin film circuit substrate 2 has a portion farther away from the light source 300. More light is redirected to the structure 7〇〇. By changing the distribution density of the light redirecting structure 700, excessive light can be prevented from being reflected out of the light emitting top surface 230 in the light guiding thin film circuit substrate 20G near the light source 3GG, so as to adjust the outgoing light on the light emitting top surface 23〇. The distribution status. As shown in Figs. 7a and 7b, the light redirecting structure 7〇〇 distributed in the light guide film circuit board 2 or on the bottom surface thereof has a variable cross section size. In the embodiment of FIG. 7 and FIG. 7b, the light redirecting structure 7 has a smaller cross-sectional dimension at a position close to the light source 3〇〇; in other words, the light-guiding thin film circuit substrate 200 is disposed farther from the light source 3〇. The light redirecting structure 7〇〇 of the 〇 portion has a larger cross-sectional dimension. By changing the cross-sectional dimension of the light redirecting structure 7 , it is possible to prevent excessive light from being reflected out of the light emitting surface 230 in the portion of the light guiding thin film circuit substrate 2GG that is close to the light source 3GG, so as to homogenize the outgoing light on the light emitting top surface. 23 distribution on the raft. Referring to the embodiment shown in FIG. 6a, FIG. 6b, FIG. 7a and FIG. 7b, the adjustment and uniformity can be achieved by changing the area ratio of the light redirecting structure 700 on the cross section or the bottom surface of the light guiding film circuit substrate 200. The distribution of the green on the top surface 14 201222088 230. Figure 8a is not another embodiment of the present invention. In this embodiment, the display panel includes a light guide substrate 810, a circuit 830, a plurality of coupling portions 85A, and a light source 87A. The light guiding substrate 810 has a light incident end 811 and a top surface 813, and the light incident end 8U is located at the end of the top surface 813. The light guiding substrate 81 is made of a transparent or translucent material; in the preferred embodiment, the material of the light guiding substrate 81Q may be an organic resin material, glass, quartz or other transparent or translucent material. As shown in Fig. 8a, the circuit 830 is formed on the top surface 813 of the light guide substrate 81. In the preferred embodiment, circuit 83 is a thin film circuit layer overlying top surface gw. A plurality of coupling portions 850 are located on the end surface of the light incident end 811 of the light guiding substrate 81. The coupling portion 850 extends to the top surface 813 of the light guide substrate 81 to be connected to the circuit 830. The coupling portion 85 is preferably formed of an organic resin-based conductive paste. The conductive adhesive material is preferably formed by mixing a rubber substrate and a conductive material, and the conductive material must be uniformly dispersed in the rubber substrate. Commonly used rubber substrates include thermosetting adhesives or photocurable adhesives. Common thermosetting rubbers are polyesters, epoxy, silicium, urethanes, and the like. This type of polymer substrate is subjected to heat, pressure or catalyst to promote condensation and cr〇ss linking reaction, resulting in a three-dimensional network of polymer, corrosion and wet fluorine. The resistance to knowing money is good at the same time with appropriate mechanical strength and reliability. The photohardenable southern molecular moiety may be of the Acryiate type, such as Urethane Diaacrylate and Epoxy Diacrylate, and an ultraviolet light initiator ( Ph〇t〇initiator) 15 201222088 can be benzophenone (benz〇Phenone) and the like. The conductive material can be silver, which is electrically conductive and slightly transferred to the base age reading #. Or, as shown in FIG. 8b and FIG. 9, which is a top view of the display panel, a plurality of grooves 815 are formed on the end surface of the light-injecting end 811. In the preferred soil, as shown in FIG. 9, the light guide substrate (10) can be drilled at the position of the light-emitting end 811 on the top surface 813 before the raw material substrate ==: the earth plate 810 from the raw material substrate After the 801 is cut, the groove 815 can be formed at the end of the optical end 811. When cutting, the cutting line must pass through all the grooves. As shown in Fig. 8b, one end of each groove 815 is exposed. Part or all of the light guide substrate _ 2 surface 813 ' and each of the 850 portions are respectively disposed in the same recess. In a preferred embodiment, as shown in FIG. 9, the material of the wire bonding portion 50, such as an organic resin-based conductive rubber material, can be injected into the optical end immediately before the light guiding substrate is cut from the raw material substrate 801. The hole of the position of 8 ιι: when the cutting light amount 8_, that is, the material or all of the coupling portion 85 accommodated in the 815 is cut and formed. In the embodiment shown in Figure 8a, the display _ further includes a protective film lion. The protective film is applied to the junction of the light contact portion 850 and the circuit 830. The protective film _ can be formed at the junction of the young portion 85〇 and the circuit 83〇 by dispensing, mineral film or other different means. Further, the material of the 'protective film _ may contain an insulating or electrically conductive material. By the arrangement of the protective film 890, it is possible to avoid a situation in which the contact portion 85A and the circuit 83 are connected to each other to cause poor contact or separation. Next, please refer to FIG. 8b. The light source 870 includes a pair of pins 871 and a light-emitting element 16 201222088 piece 873. The pair of pins 871 are respectively coupled to the coupling portion 85, and the manner of bonding includes welding, bonding or other methods that do not interfere with the conductive properties. The light-emitting element 873 is disposed between the pair of pins 871 and coupled to the pair of pins 871. Light emitting element 873 is preferably a light emitting diode; however, in various embodiments, light emitting element 873 can also be other point source or linear source. As shown in the figure, the light-emitting element 873 has a light-emitting surface 875 which faces toward the light-guiding substrate 81 and enters the light end 811. The light generated by the light-emitting element 873 is incident on the light-incident end 811 via the light-emitting surface 875, and the light is distributed on the top surface 813 of the light-guiding substrate 81A via the light guide substrate 810. As shown in FIG. 8a and FIG. 8b, the pin 871 preferably includes an L-shaped conductive structure including a power supply connection surface 91 and a light-emitting element connection surface 930 which are perpendicular to each other. The power connection surface 91 is coupled to the circuit 83 that provides the signal; and the light-emitting element connection surface 930 is coupled to the light-emitting element 873. In this embodiment, the power supply connection surface 910 is oriented in the same direction as the light-emitting surface 875 of the light-emitting element 873. And the power connection surface 910 is connected to the end surface of the light-emitting substrate 811 and coupled to the coupling portion 850; and the light-emitting surface 875 of the light-emitting element 873 is also facing the end surface of the light-incident end, and is directed toward the light. The end emits light. In another embodiment, however, the power connection surface 910 can also be perpendicular to the light emitting surface 875 as shown in FIG. In this embodiment, the pair of pins 871 are not directly connected to the light guide substrate 81, but are connected to the optical plate_. The power supply mode of the light-emitting element, like the conventional method, supplies power to the light-emitting element 873 via the light source substrate 950. In the embodiment shown in Fig. 11, the light source 87A includes a polarizer 970 disposed on the light emitting surface 875. The polarizer 970 is preferably formed by a plurality of layers of coatings 2012 2012088 to form polarized light. As shown in FIG. 11, the body 880 and the electroluminescent body 980. The polarizing film formed by the body 88ί. The light emitted from the light-emitting element 873 enters the polarizer 970 after exiting the light-emitting surface 875. When the light is emitted outward through the polarizer 97, the light-emitting element 873 includes a body 880 disposed corresponding to the pair of pins 871' and surrounded by the side wall 881 and the bottom 883 to form an internal space 885 and a light exit. 887. Side wall 881 preferably includes a reflective inner surface and has a predetermined angle of reflection. The internal space 885 is preferably filled with phosphor powder or other chemicals. As shown in FIG. 11, the electroluminescent body 98 is housed in the internal space 885 of the body, and the two electrodes are directly or indirectly connected to each other via wires. Feet 871. The electroluminescent body 980 is a light-emitting diode crystal. The body 88() has a light exit 887-face to form a whole luminous face milk, and the polarizer 97 is disposed on the body 880 and covers the light exit 887. When the electric excitation light is cut to generate light, the light is emitted from the light exit 887 and forms a polarization opening light source 87 after passing through the polarizer. Thinner in different fine towels, the body _ may also be an optical lens formed of a light-transmitting material, and enclose the electroluminescent body in a body-like manner, in other words, the electro-excitation body 98G is embedded inside the body 880. Since the ontology _ has both the effect of the county and the optical lens, the light must pass through the body _ to be emitted outward. At this time, the light exit is fixed.
義則不侷限於圖U中由本體_所圍成空間上之出口，本體 880本身允許光線穿透向外㈣之部分亦可為此處所言之光線 描述，然而上述實施例僅為實 ，已揭露之實施例並未限制本The meaning is not limited to the space in Figure U surrounded by the body _, the body 880 itself allows light to penetrate the outer (four) part can also be described for the light here, but the above embodiment is only true, has been disclosed The embodiment does not limit this
S 18 201222088 發明之範圍。相反地，包含於申請專利範圍之 改及均等設置均包含於本發明之範圍内。 精神及範圍 之修 【圖式簡單說明】 圖1為傳統顯示面板之示意圖； 圖2a為本發明顯示面板之實施例剖面示意圖； =2b為本發鴨涵板絲設置之另—實施例咖示 圖2c為本發鴨示面板光源設置之另—實施例剖面示意·’ 圖2d為本發_示面板光源設置之另—實施例麵示:圖·’ 圖3為包含擴散層之顯示面板實施例剖面示意圖；， 圖4為包含偏光件之顯示面板實施例剖面示意圖； 圖5a為包含紐肖結構讀示蛛實糊獅示意圖； 圖5b為另-包含光變向結構之顯示面板實施例示意圖； 圖6a為另—包含光變向結構之顯示面板實施例示意圖； 圖6b為另-包含光變向結構之顯示面板實施例示意圖； 圖7a為包含光變向結構之顯示面板實施例示意圖； 圖7b為另-包含光變向結構之顯示面板實施例示意圖； 圖8a為本發嗎示面板之另—實關剖面示意圖； 圖8b為圖8a所示實施例之上視圖； 圖9為導絲板自原料基板均狀實賴上視圖； 圖為顯示面板另一實施例之刮面圖； 圖U為光源裝置之實施例示意圖。 19 201222088 【主要元件符號說明】 110上基板 130液晶層 150反射板 200導光薄膜電路基板 210入光端 230出光頂面 250薄膜電路層 300光源 400偏光層 450低折射率層 500擴散層 510擴散粒子 600偏光件 700光變向結構 801原料基板 810導光基板 811入光端 813頂面 815凹槽 830電路 850耦接部 870光源S 18 201222088 Scope of the invention. On the contrary, modifications and equivalent arrangements are intended to be included within the scope of the invention. Figure 1 is a schematic view of a conventional display panel; Figure 2a is a schematic cross-sectional view of an embodiment of the display panel of the present invention; Fig. 2c is a cross-sectional view showing another embodiment of the light source of the duck display panel. Fig. 2d is another embodiment of the light source of the present invention. Fig. 3 is a display panel including a diffusion layer. FIG. 4 is a schematic cross-sectional view showing an embodiment of a display panel including a polarizing member; FIG. 5a is a schematic view showing a spider with a Newshaw structure; FIG. 5b is a schematic view showing an embodiment of a display panel including a light redirecting structure. Figure 6a is a schematic view of another embodiment of a display panel including a light redirecting structure; Figure 6b is a schematic view of another embodiment of a display panel including a light redirecting structure; Figure 7a is a schematic view of an embodiment of a display panel including a light redirecting structure; Fig. 7b is a schematic view showing another embodiment of a display panel including a light redirecting structure; Fig. 8a is a schematic view showing another embodiment of the present invention; Fig. 8b is a top view of the embodiment shown in Fig. 8a; The screen is a top view of the raw material substrate; the figure is a scraping view of another embodiment of the display panel; FIG. 19 201222088 [Description of main components] 110 upper substrate 130 liquid crystal layer 150 reflective plate 200 light guiding film circuit substrate 210 light-emitting end 230 light-emitting top surface 250 thin film circuit layer 300 light source 400 polarizing layer 450 low refractive index layer 500 diffusion layer 510 diffusion Particle 600 polarizer 700 light redirecting structure 801 raw material substrate 810 light guiding substrate 811 light receiving end 813 top surface 815 groove 830 circuit 850 coupling portion 870 light source
20 201222088 871成對接腳 873發光元件 875發光面 880本體 881側壁 883底部 885内部空間 887光線出口 890保護膜 910電源連接面 930發光元件連接面 950光源基板 970偏光件 980電激發光體20 201222088 871 Paired pins 873 Light-emitting elements 875 Light-emitting surface 880 body 881 side wall 883 bottom 885 internal space 887 light exit 890 protective film 910 power connection surface 930 light-emitting element connection surface 950 light source substrate 970 polarizer 980 electric excitation body