201221964 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係有關於一種成型裝置及其成型方法’尤其 是指一種可降低裝置精度與設置成本之柱狀體成型裝置 及其成型方法。 [先前技術] [0002] 現今，隨著科技發展迅速因而發展出許多電子產品201221964 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to a molding apparatus and a molding method thereof, particularly to a columnar molding apparatus capable of reducing device accuracy and installation cost, and a molding method thereof . [Prior Art] [0002] Today, with the rapid development of technology, many electronic products have been developed.
099141581 ，而帶給民眾許多便利性’所以很多電子裝置已是現今 民眾不可或缺的生活配備，譬如行動電話、個人電腦以 及電視等。電子裝置從一開始製作到出貨至市面上販賣 之前，必須經邁許多測試關卡，以測試所裳.造出來的電 子產品是否為良品。現今電子裝置皆由晶片控制’所以 晶片為電子裝置的核心元件，因而晶片測試為重要的一 環。 測試晶片的過程中，其包含了晶圓測試’在晶圓偵 測時必須利用晶片測試用探針。晶圓經製造（Wafer099141581, and bring a lot of convenience to the people' so many electronic devices are indispensable living facilities for today's people, such as mobile phones, personal computers and televisions. Before the electronic device is manufactured from the beginning to the time of shipment to the market, it must pass many test levels to test whether the electronic products produced by the company are good. Today's electronic devices are controlled by wafers, so wafers are the core components of electronic devices, and wafer testing is an important part. In the process of testing the wafer, it involves wafer testing. The wafer testing probe must be used during wafer inspection. Wafer manufacturing (Wafer
Fabrication)後，而在尚未送封裝之前，係利用探針 與晶片上的接點或晶片之内部電路接觸，以便直接對晶 片輪入信號或偵讀輸出值，以進行測試而分辯出晶圓上 面的晶粒（die)為良品或為不良品。此外’封裝作業過 程中，係會進行金屬導線拉力測試，其利用探針呈拉鉤 狀之針尖部勾住金屬導線，並施加向上拉力’以測試金 屬導線是否容易脫落，即應用於線上可靠度測試。因晶 片或晶圓上之接點及封裝作業之導引電路#常精細’以 致於執行上述電氣測試時須以細針狀之探針進行’所以 進行測試時常容易因操作不當，而導致探針常遭折損破 表單塢號A0101 第3頁/共24頁 0992072293-0 201221964 裹致使測試必須停止而進行更換，故 此外，由;^探針大量耗損。 由八於探針成型生產不易，故以許多設備成本。 見7係有多種製造棒狀探針之 今該些裳置與方法皆不盡完善，下面=與方法，然而現 式進行^^ v 13針對該些習用方 u明。口灣公告第I2394Qi_ “圓或^賴賤聽針成型 〃為' 週波加埶方_v 万去」，其利用一高 再以绩 顏線材急速達㈣合紅熱之溫度 一-切割方式將該線材進行裁剪，"又 筆直之探針基材，而該基材並由二：線“ 前端形成針尖狀，再利用放叫 將針尖狀以下部份進行電鍍處理，球狀’且 於握捭杜， & μ於藉由雷射焊接 件上，而形成可被握持於機件上之測試探針。 部份八 ㈣㈣,部及握持件兩 :開製造成型，其後再經焊接成—齡，如此焊接 探I會提高料料料件讀合介_㈣值及降低 之機械強度’因此即會龜簡时電氣測試之可 ’二且容易斷裂損壞，另造過緣壟長且複雜，因 製作成本及工時而降低生差效率’進而導致探針 ρ貝料，由於針尖部之直徑小，所以不易正確 /而焊接於㈣件之預定位置，因此每根探針之針尖 轉接於握持件之位置無法㈣定相同，如此失持該些 探=進行檢測時’探針之針尖部係不易精確對位於晶圓 或阳片上之電路，故降低測試效率與準確度。 /灣公告第1225921號發明專利「晶圓或晶片測試 用探十成m此發明為改良上述台灣第12394〇1赛 明專利之單-成型方法’由於其加工方法生產速度較為 099141581 表單編號_1 ^1/^24, 幽 201221964 緩慢，所以具有未能予以大量生產之缺點，因此該 1225921發明專利仍以1239401發明專利為基礎，而將線 材加溫方纽以線材本身電阻作料電加熱架構， 並以線切割作輔助’且以夹捭贫 守裝置失持多數個線材施以 電解加工，並在電解槽内底端 卸°又有—電解用之陰極金 屬板，以進行探針央端電解加工。該i22592i發明專利雖 在先前_01發明專利之基礎上進-步改良其部分製程 ’使其可呈量產方式製作探針’但其製程程序仍與先前 m痛發料_肖，例如冑焊接針尖部及麟件為— 1 體’因此製造時仍具有先前12394〇1發明專利之缺點例 如降低探針電氣測試之可靠性、容、易斷裂損壞，提高製 作成本與工時、降低生纽率與每根探針之針尖部焊接 於握持件之位置無法皆固定等缺點。. 台灣公告第12 9 2 4 7 9號發明專利「電路測試探針成 型裝置」，此發明為改善機械單支研磨成型方式，由於 研磨方式之製造費時’且隨著捸句:直徑日趨小型化，採Fabrication), before the package is sent, the probe is used to contact the contacts on the wafer or the internal circuit of the chip to directly input the signal to the wafer or to read the output value for testing to distinguish the wafer. The die is good or bad. In addition, during the packaging operation, the metal wire tensile test is performed. The probe is hooked to the metal wire and the upward pulling force is applied to test whether the metal wire is easy to fall off, that is, it is applied to the online reliability test. . Because the contact circuit on the wafer or wafer and the guiding circuit of the packaging operation are often 'fine' so that the above-mentioned electrical test must be performed with a fine needle-like probe, it is often easy to perform the test because of improper operation. Frequently damaged form dock number A0101 Page 3 / 24 pages 0992072293-0 201221964 The wrap-in test must be stopped and replaced, so in addition, the probe is heavily depleted. It is not easy to produce by eight probes, so it costs a lot of equipment. See the 7 series of a variety of rod-shaped probes. Today, these skirts and methods are not perfect, the following = and method, but the current method ^ ^ v 13 for these common use. Mouth Bay Announcement I2394Qi_ "Circle or ^ Lai 贱 贱 贱 贱 ' ' 周 周 周 周 周 周 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , For cutting, "straight probe base material, and the base material is formed by two: "the front end is formed into a needle tip shape, and then the lower part of the needle tip is plated by using the release, spherical" and , & μ is formed by the laser welding member to form a test probe that can be gripped on the machine member. Part eight (four) (four), part and grip member two: open manufacturing molding, and then welded into - Age, so welding I will improve the material reading _ (four) value and reduce the mechanical strength 'so that when the turtle is simple, the electrical test can be 'two and easy to break and damage, the other edge is long and complicated , because of the production cost and working hours to reduce the difference in productivity, which in turn leads to the probe p material, because the diameter of the tip portion is small, it is not easy to be correctly / but welded to the predetermined position of the (four) pieces, so the tip of each probe is transferred The position of the grip can not be (4) the same, so the loss of the probe = When the test is performed, the tip of the probe is not easy to accurately measure the circuit on the wafer or the positive film, so the test efficiency and accuracy are reduced. / Bay Bulletin No. 1225521, "Inventive patent for wafer or wafer test" The invention is a single-forming method for improving the above-mentioned Taiwanese 12394〇1 Saiming patent. The production speed of the processing method is relatively higher than 099141581, the form number _1 ^1/^24, and the quiet 201221964 is slow, so it has the disadvantage of not being mass-produced. Therefore, the 1225921 invention patent is still based on the invention patent of 1239041, and the wire heating section is made of electric resistance structure of the wire itself, and is assisted by wire cutting, and most of the wires are lost by the clamping device. Electrolytic processing, and at the bottom end of the electrolytic cell, the cathode metal plate for electrolysis is used for electrolytic processing of the probe central end. The i22592i invention patent is further improved on the basis of the previous _01 invention patent. Part of the process 'making it possible to produce probes in mass production', but the process procedure is still the same as the previous m pain, such as 胄 solder tip and ligament - 1 body' It still has the disadvantages of the previous 12394〇1 invention patent, such as reducing the reliability, capacity, and breakage damage of the probe electrical test, increasing the manufacturing cost and working time, reducing the feed rate and the tip of each probe being welded to the grip. The position of the parts cannot be fixed, etc.. Taiwan Announcement No. 12 9 2 4 7 9 invention "circuit test probe molding device", the invention is to improve the mechanical single-branch grinding method, because the manufacturing method of the grinding method is time-consuming With the haiku: the diameter is getting smaller and smaller,
用研磨方式加工難度高。該1292479號發明專利因此利用 I 電解加工方式進行探針加工，該裝置於電解槽之底部設 置陰極板，且同時利用夾具夾持固定多支待加工探針， 並利用一直線致動結構帶動該夾具做上下位移，以利用 電解原理使探針加工段浸泡於電解液中，並調變加工電 壓，且移動該夾具以使探針之端部成型為尖部。然而， 該探針成型製程方式仍與上述兩發明專利相同，將探針 之針尖部及握持件兩部份分開製造成型，之後再經焊接 成一體，所以同樣具有上述兩發明專利之缺點，且該加 工裝置同時需設置精密之直線致動結構與驅動裝置及上 099141581 表單编號 A0101 第 5 頁/共 24 頁 0992072293-0 201221964 因移控制裝置，以及複雜調變之加工電壓調整裝置， 15會增加裝置設置成本，且加工過程耗時繁瑣。 自0灣公開第200946283號發明專利申請案「微探針 口動連續研磨機」，此發明為解決傳統機械式研磨探針 只倉I ^ ~人研磨一支，且研磨作業無法連續之問題，以及 電解加 、 工方式加工時間長，因此加工迷度受到相當大的 限制，Ιϊϊ ， 因此提出自動連續研磨機，以同時加工複數探針 利0輪送作業與研磨作業連續同步完成。但，該發明專 π案之機械研磨方式只能加工同徑之探針基材， 此仍發、 進行焊接探針之針尖部及握轉件之加工步驟， _ 11之精度有限，所以該發明專利申請案仍具有上述 明專利之缺點。此外，該加工方式為利用機械力 一〜式斜尖化探針基材之端部，因此該探針基材需要有 —^強度，使得探針之直徑大小有一定限制，且要求 僅長比之探針加工有一定困難度。 由上述說明習用成型探針之裝置與方法可得知 缺點， ^ 要在於上述方式皆必須將探針乏針尖部與握持 分開製造成型，再經加卫成_|，如此即會具有降低 斑針電氣測試之可靠性、容易斷裂損壞，提高製作成本 、工時'降低生產效率與探針形狀精度不佳等缺點且 上述成型裝置與方法之加Μ«長且複雜，所以裝置 精度需求“增加成本，且“製造高徑長比 之探針。 因此本發明即在針對上述問題而提出一種枝狀體 及其成型裝置及其成型方法，不僅可改善上述習用缺點 ’又可簡化加4置’降低装置精度需求及設置成本， 以解決上述問題。 099141581 表單編號A0101 第6頁/共24頁 0992072293-0 201221964 【發明内容】 [〇⑻3] 本發日月> a *?λ 的之一，其在於提供一種柱狀體之成型 "及其成型方法，其藉由旋轉基材並對基材進行電解 加工’如此即可讓基材—體成型為柱狀體，而達到簡化 ，震置與加工步驟、降低加卫時間與設置成本、增加 探針之形狀精度以及可製造高徑長比探針之目的。 |@之目的之―，其在於提供_種柱狀體其握 ㈣、細#部與針尖料—體成型，因此可達到提高探 #導電率與強度等機械性質之目的。 Ο _本發明之柱狀體之_裝置及其成型方法，其包含 槽體固持單元、一旋轉單元與一電源單元，槽體 具有-電解液與1極，電極位於電解液中 固持一基耔> _ ^ 加1段於槽體内並相鄰於電極，旋轉 5用於旋轉固持單元進而旋轉基材，電源單元之兩極 連接電極與基材。本發明之成型方法係旋轉基材， 且错由電源單元供應電源至電極與基材，㈣基材進行 電解加工，以使基材成型一柱狀體，並使基材之加工段 Ο 成型為—細徑部。本發明之成型裝置與成型方法簡易， 所以可達到簡化裝置結構，降低裝置精度需求、設置成 本以及加工時間之目的，且可加工高徑長比之柱狀體以 及提高加工精度。 此外，本發明之柱狀體係包含一握柄部、一均勻直 徑狀之細徑部與一針尖部，細徑部位於握柄部下方，並 位於握柄部之軸中心方向，針尖部位於細徑部末端，且 握柄部、細徑部與針尖部為一體成型，如此可提高柱狀 體之機械特性，進而提升柱狀體之使用效能。 099141581 表單編號Α0101 第7頁/共24頁 0992072293-0 201221964 【實施方式】 [0004] 兹為使貴審查委員對本發明之技術特徵及所達成 之功效更有進-步讀解與賴，謹細較佳之實施例 圖及配合詳細之說明，說明如後： 請參閱第一圖與第二圖，其係本發明 裝置之一較佳實施例的立體示意圖與剖視 ’本發明之柱狀體成型裝置包含一槽體i、 之柱狀體成型 圖。如圖所示 一固持單元3 、-旋轉單元5與-電源單元6，電極？與電解峨立於槽 則内，槽體Μ更放置有欲進行加工的基材9。電極了與 基材9皆浸於電解液8中，但基材9並非整體位於電解液8 中，其僅欲進行電解加工之一加工段位於電解液8内，美 材9之截面形狀為-圓形或非圓形。固持單元㈣於固持 基材9 ’以讓基材9之加工段位於槽體μ，且亦可用於固 持電極7於槽體1内’基材9之側壁相鄰於電極7。於本發 明之-實施射，固持單元3更包含—基座31與複數固持 件33，基材9穿設基座31之穿孔並藉树持件如持基材 9 ’而使基材9於加工時不易移動。上述固持單以僅為本 發明之-實施例’其固持方式會依據加卫需求而有所不 同’此實施例並非限制本發明之固持單元3僅為於此。 099141581 復參閱第-圖與第二圖，旋轉單元5用於帶動固持單 兀3旋轉，進而旋轉基材9，於本發明之一實施例中旋 轉單元5為旋轉馬達。電源單元6之負極連接電極？，而陽 極連接基材9，以供應電源至電極7與基材9，而對基材9 之側壁進行電解加工。基材9進行電解加工時，旋轉單元 5會帶動基材9旋轉，如此基材9相鄰於電極7之加工段的 側壁即會逐漸被電解，使得基材9成型為一柱狀體且位 表單編號Α0101 第8頁/共24頁 0992072293-0 於電解液8中之加工段變成均勻直徑狀，而成型為一細徑 部90。於此實施例中，細徑部9〇之末端可進一步成型為 —針尖狀，而為一針尖部91。另外，基材9被固持單元3 所固持且沒有位於電解液8之未加工段即保持原尺寸，以 作為握柄部92 ’因此藉由本發明之成型裝置即可成型基 材9為一體成型的柱狀體，且柱狀體之末端更可成型為針 4狀，如此即可以達到一體化成型之目的。 在此實施例中’本發明之電極7的整體並非為相同尺 寸’因柱狀體之末端需成型為針尖部91，所以電極7之底 部具有突出部71，以離基材9之底部末端較近，如此進行 電解加工時，電極7之突出部71會使基材9之底部末端侧 壁被電解去除較深，且同時基材9會七旋轉，因此即會成 型針尖部91。由此可知’本發明之電極7的形狀會依據欲 成型之細徑部90與針尖部91的形狀而有所不同。此外， ：. . 本發明之成型裝置並不侷限僅能於柱狀體之底部成型針 尖部91，而製作探針，其可成型任何形狀之柱狀體，只 需改變電極7之幾何形狀即可成型出欲成型之柱狀體。 由上述說明可知’本發明是利用化學電解加工方式 成型出如第五圖所示之一體成型的柱狀體，其可用於作 為探針，其細徑部90、針尖部91與握柄部92為一體成型 ，所以不同於習用技術必須分段加工探針之細徑部90、 針尖部91與握柄部92’因此本發明可減少焊接加工步驟 及加工時間，而降低加工製造之不良率，並同時能增加 生產效能。另外，利用此方法可成型高徑長比之枉狀體 ，同時增加柱狀體之形狀精度。此外，因簡化加工步驟 ，使得加工裝置因此簡單化，而降低裝置精度需求及設 表單編號A0101 第9頁/共24頁 201221964 置成本，使得製造出之柱狀體更具有競爭力。 復參閱第一圖，本發明之槽體丨的前後端更分別設有 一電解液流入口 12及一電解液流出口 η，以用於讓電解 液8經由電解液流入口 12流入槽體丨，而由電解液流出口 14流出槽體1，如此讓電解液8可以流動更新，而避免一 直持續使用經反應之電解液8而影響加工精度，且流動更 新電解液8可進一步帶離進行電解加工過程所產生之氣泡 10。由於氣泡10會上升而聚集在基材9位於電解液8之液 面的加工段，此會導致加快電解該加工段的速度，而不 同於電解其他加工段的遠度，如此即^法加工成型出預 定加工尺寸’而影響加工精度1本發明藉由讓電解液8流 入/流出於槽體1，其除可更新電解液8之外，亦可帶離電 解加工過程所產生之氣泡1〇，所以可避免氣泡1〇上升而 聚集於基材9的某一加工段，如此即可增加工精度及加工 效率，同時基材9於電解加工過程會同時進行旋轉運動， 其也可提高成型後之柱狀體之形敢精度。本發明之電極7 可為呈非環繞基材9狀，以讓電淋液8更容易更新及帶離 氣泡1 0。 此外，電解液流入口 12外接有一電解液儲存槽（圖 未示），以傳輸電解液至槽體1，而電解液流出口14外接 有一過遽單元（圖未示），以過濾、反應過之電解液8而再 儲存回電解液儲存槽。另外如第二圖所示，本發明柱狀 體成型裝置更包含一控制電路21 ,控制電路21耗接電源 單元6 ’以控制電源單元6所供應之電源大小，例如傳送 至電極7與基材9之電流的大小，以控制電解加工之速度 與精度。 099141581 表單編號A0101 第10頁/共24頁 0992072293-0 請參閱第三圖，其係本發明之柱狀體成型裝置之另 一較佳實施例的剖視圖。如圖所示，此實施例之槽體4係 不同於上一實施例之槽體1 ’此實施例之槽體4具有6面側 壁，且此實施例之電解液流入口 4 2與電解液流出口 4 4設 置位置不同於上一實施例。此實施例之電解液流入口 42 設置於槽體4之底部侧壁下方’而兩電解液流出口44分別 設置於槽體4之兩相對侧壁的頂部’所以電解液8經由電 解液流入口 42流入槽體4，再經由兩電解液流出口 44流出 槽體4。此實施例之電解液流入口 42與電解液流出口 44之 設置位置，使得電解液8流出槽體4之流動方向相同於氣 泡10之向上移動方向，以讓電解液8之流動方向可順應氣 泡10會向上移動之特性，而提高電解液8帶離氣泡1〇之效 率，如此氣泡10被帶離加工基材7之速度提高，即可提高 電解加工之精度《此外，此實施例之電極7係設置於槽體 4之頂部側壁，槽體4之頂部側壁係設有孔洞，以供基材9 之加工段穿置而位於槽體4内。 請參閱第四圖，其係本發明之柱狀體成型裝置之第 三實施例的剖視圖。如圖所示，本發明更包含一磁性元 件100，其包含一磁場並位於基材9上方，磁性元件100可 設置於固持單元3或者基材9，以位於基材9上方。本發明 藉由磁性元件100之磁場而對基材9之表面解離之離子產 生勞倫兹力（Lorentz force)，藉以對基材9之表面解 離之離子產生一牽引力，而讓解離之離子盡速脫離基材9 之表面，並進一步藉由電解液8流動而帶離，如此可避免 解離之離子集中於基材9之表面，因此可提升電化學電解 之加工效率。本發明之磁性元件1〇〇不侷限設置於固持單 表單編號A0I01 第1〗頁/共24頁 nqq?n 201221964 元3，亦可依據不同用法設置於不同位置。 請參閱第五圖，其係本發明之柱狀體之一較佳實施 例的立體圖。如圖所示，此實施例之柱狀體為一探針， 其包含細徑部90、針尖部91與握柄部92，針尖部91位於 細徑部90末端，而細徑部90位於握柄部92下方且具有均 勻直徑狀。握柄部9 2為基材9未進行化學電解加工之未加 工段，所以其與基材9之加工段成型之細徑部90和針尖部 91為一體成型，而無須經焊接接合，因此提高其機械強 度及降低其電阻，而提高導電率。此外，細徑部9 0與針 尖部91為與電極7相鄰之部位，即為加工段，因此利用本 發明成型方法及成型裝置進行探針成型加工時，不需位 移基材9僅需旋轉基材9，即可成型探針之細徑部90與針 尖部91，因此提高探針之細徑部90與針尖部91成型時之 形狀精度。此外，本發明之成型裝置與成型方法簡單， 因而降低設備設置成本，且減少加工步驟及加工時間， 而降低加工製程產生之不良率，並增加產能。另外，由 於基材9於電解加工過程係會旋轉而不需位移，所以成型 後之探針的細徑部90會位於握柄部92之軸中心方向，所 以細徑部90之位置固定，如此本發明之探針用於檢測時 ，即可便於定位且可提高定位精準度。 請參閱第六圖，其係本發明之柱狀體之另一較佳實 施例的立體圖。如圖所示，此實施例之探針的針尖部93 可呈一勾針狀，以用於測試金屬導線之可靠度。此種型 態之探針僅需將第五圖的探針進行後段加工，而將第五 圖之針尖部91向上彎折，即可形成一勾針狀之針尖部93 099141581 表單編號A0101 第12頁/共24頁 0992072293-0 201221964 表τ'上所述，本發明之柱狀體之成型裝置，其包含槽 體、固持單元、旋轉單元與電源單元，電解液與電極設 置於槽體内’ 1U持單;^用於固持基材之加卫段在槽體内 並相鄰於電極’旋轉單元用於旋轉ϋ持單元進而旋轉基 材，電源單元之兩極分別耦接電極與基材◊本發明之成 型方法係藉由電源單元供應電源至電極與基材而對基材 進行電解加卫時，係旋轉基材，如此即可輕易讓基材成 型為—體成型之柱狀體，並使基材之加玉段成型為細徑 部。由於本發明之成型裝置與成型方法簡單，所以可簡 化成型裝置之結構，轉《置精度需求及設置成本， 1降低柱狀體之不良率而提高精度，且由於成型時間短 所以可提同生產效率。此蜂，：由於本發明之柱狀體之 整體結構皆為—體成型，所以其強度、導電度與耐熱度 等機械特性佳》 故本發明實為一具有新穎性、進步性及可供產業上 利用者，應符合我國專利法專利申請萎件無疑，麦依法 提出發明專利中請，析鈞局早日賜准專利，至感為禱。 惟以上所述者，僅為本發明—較佳實施例而已，並 非用來限定本發明實施之，故舉凡依本發明申請專 利範圍所述之形狀、構造、特徵及精神所為之均等變化 與修飾，均應包括於本發明之申請專利範圍内。 【圖式簡單說明】 [_第-圖係本發明之錄體成録置之—較佳實施例的立 體不意圖； 第二圖係本發明之柱狀體成型裝置之—較佳實施例的剖 視圖； 099141581 A0101 第13頁/共24頁 0992072293-0 201221964 第三圖係本發明之柱狀體成型裝置之另一較佳實施例的 剖視圖； 第四圖係本發明之柱狀體成型裝置之又一較佳實施例的 剖視圖； 第五圖係本發明之柱狀體之一較佳實施例的立體圖；以 及 第六圖係本發明之柱狀體之另一較佳實施例的立體圖。 【主要元件符號說明】 [0006] 1 槽體 3 固持單元 4 槽體 5 旋轉單元 6 電源單元 7 電極 8 電解液 9 基材 10 氣泡 12 電解液流入口 14 電解液流出口 21 控制電路 31 基座 33 固持件 42 電解液流入口 44 電解液流出口 71 突出部 90 細徑部 表單編號A0101 第14頁/共24頁 099141581 0992072293-0 201221964 91 針尖部 92 握柄部 93 針尖部 100 磁性元件 ΟIt is difficult to process by grinding. The invention patent No. 1292479 thus uses the I electrolytic machining method for probe processing. The device is provided with a cathode plate at the bottom of the electrolytic cell, and at the same time, a plurality of probes to be processed are clamped and fixed by a clamp, and the clamp is driven by a linear actuation structure. The upper and lower displacements are performed to soak the probe processing section in the electrolyte by the electrolysis principle, and the processing voltage is modulated, and the jig is moved to shape the end of the probe into a tip. However, the probe forming process is still the same as the above two invention patents, and the probe tip portion and the grip member are separately manufactured and then integrated by welding, so that the disadvantages of the above two invention patents are also obtained. At the same time, the processing device needs to be equipped with a precise linear actuating structure and driving device and the upper 099141581 Form No. A0101 Page 5 of 24 0992072293-0 201221964 The shift control device and the processing voltage adjustment device of the complex modulation, 15 It will increase the installation cost of the device, and the processing time is cumbersome. The invention discloses a micro-probe intermittent continuous grinding machine of the invention patent application No. 200946283, which solves the problem that the conventional mechanical grinding probe only grinds one of the chambers and the grinding operation cannot be continuous. As well as the electrolytic processing and processing methods, the machining time is long, so the processing density is considerably limited. Therefore, an automatic continuous grinding machine is proposed to simultaneously process the complex probes and the 0-turning operation and the grinding operation are continuously synchronized. However, the mechanical polishing method of the invention π can only process the probe substrate of the same diameter, and the processing steps of the tip end portion and the holding member of the welding probe are still performed, and the precision of the _ 11 is limited, so the invention The patent application still has the shortcomings of the above patents. In addition, the processing method is to sharpen the end of the probe substrate by mechanical force, so the probe substrate needs to have a strength, so that the diameter of the probe has a certain limit, and only a long ratio is required. The probe processing has a certain degree of difficulty. The above-mentioned description of the device and method for forming a probe can be used to understand the disadvantages. ^ In the above-mentioned manner, the tip of the probe must be separately formed from the grip and then shaped into a _|, which will have a reduced spot. The reliability of the needle electrical test, easy to break and damage, increase the manufacturing cost, reduce the production efficiency and the poor shape accuracy of the probe, and the addition of the above-mentioned molding device and method is long and complicated, so the device precision demand is increased. Cost, and "manufacture probes with high aspect ratios. Therefore, the present invention has been made in view of the above problems, and provides a dendrite and a molding apparatus therefor, and a molding method thereof, which can not only improve the above-mentioned conventional disadvantages, but also simplify the addition and lowering of the precision requirements and installation costs of the apparatus to solve the above problems. 099141581 Form No. A0101 Page 6 of 24 0992072293-0 201221964 [Summary of the Invention] [〇(8)3] One of the days of the present day > a *?λ, which is to provide a columnar body forming " The molding method, which rotates the substrate and electrolyzes the substrate, so that the substrate can be formed into a columnar body, thereby simplifying, oscillating and processing steps, reducing the curing time and installation cost, and increasing The shape accuracy of the probe and the purpose of manufacturing a high-diameter length ratio probe. The purpose of @@, is to provide _ kinds of columnar body grip (four), fine # part and needle tip material-body molding, so it can achieve the purpose of improving the mechanical properties such as conductivity and strength.柱 _ the column device of the present invention and a molding method thereof, comprising a tank holding unit, a rotating unit and a power unit, the tank body having an electrolyte and a pole, the electrode being located in the electrolyte to hold a substrate > _ ^ Add 1 segment in the tank and adjacent to the electrode, and rotate 5 to rotate the holding unit to rotate the substrate, and the two poles of the power unit connect the electrode to the substrate. The molding method of the present invention rotates the substrate, and the power supply unit supplies power to the electrode and the substrate, and (4) the substrate is electrolytically processed to form a columnar body, and the processing section of the substrate is formed into - Small diameter section. Since the molding apparatus and the molding method of the present invention are simple, the apparatus structure can be simplified, the apparatus precision requirement, the installation cost, and the processing time can be reduced, and the columnar body having a high aspect ratio can be processed and the machining accuracy can be improved. In addition, the columnar system of the present invention comprises a grip portion, a narrow diameter portion having a uniform diameter and a tip portion, the small diameter portion being located below the grip portion and located at the center of the shaft of the grip portion, the needle tip portion being located at the center The end of the diameter portion, and the grip portion, the small diameter portion and the needle tip portion are integrally formed, so that the mechanical properties of the columnar body can be improved, thereby improving the use efficiency of the columnar body. 099141581 Form No. 1010101 Page 7 / Total 24 Pages 0992072293-0 201221964 [Embodiment] [0004] In order to make the reviewer's technical characteristics and the effects achieved by the reviewer, there is a further step-by-step explanation. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT AND READING DETAILED DESCRIPTION OF THE INVENTION As explained below: Please refer to the first and second figures, which are perspective views and cross-sectional views of a preferred embodiment of the apparatus of the present invention. The device comprises a trough body i, a columnar body forming diagram. As shown, a holding unit 3, a rotating unit 5 and a - power unit 6, electrodes? The substrate is placed in the tank with the electrolysis, and the substrate 9 is placed with the substrate 9 to be processed. Both the electrode and the substrate 9 are immersed in the electrolyte 8, but the substrate 9 is not entirely located in the electrolyte 8, and only one of the processing sections to be electrolytically processed is located in the electrolyte 8, and the cross-sectional shape of the material 9 is - Round or non-circular. The holding unit (4) holds the substrate 9' so that the processing section of the substrate 9 is located in the groove μ, and can also be used to hold the electrode 7 in the groove 1. The side wall of the substrate 9 is adjacent to the electrode 7. In the present invention, the holding unit 3 further includes a base 31 and a plurality of holding members 33. The substrate 9 is pierced with a through hole of the base 31, and the substrate 9 is held by a holding member such as a substrate 9'. It is not easy to move during processing. The above-mentioned holding list is only the embodiment of the present invention, and the holding manner thereof may vary depending on the need for reinforcement. This embodiment is not limited to the holding unit 3 of the present invention. 099141581 Referring to the first and second figures, the rotary unit 5 is used to drive the holding unit 3 to rotate, thereby rotating the substrate 9. In one embodiment of the invention, the rotary unit 5 is a rotary motor. The negative electrode of the power supply unit 6 is connected to the electrode? The anode is connected to the substrate 9 to supply power to the electrode 7 and the substrate 9, and the sidewall of the substrate 9 is electrolytically processed. When the substrate 9 is subjected to electrolytic processing, the rotating unit 5 drives the substrate 9 to rotate, so that the side wall of the processing section adjacent to the electrode 7 of the substrate 9 is gradually electrolyzed, so that the substrate 9 is formed into a columnar body and bit. Form No. 1010101 Page 8 of 24 0992072293-0 The processing section in the electrolytic solution 8 becomes uniform in diameter and is formed into a small diameter portion 90. In this embodiment, the end of the small diameter portion 9〇 can be further formed into a needle tip shape and is a needle tip portion 91. In addition, the substrate 9 is held by the holding unit 3 and is not located in the unprocessed section of the electrolyte 8, that is, the original size is used as the grip portion 92'. Therefore, the substrate 9 can be integrally molded by the molding apparatus of the present invention. The columnar body, and the end of the columnar body can be formed into a needle shape 4, so that the purpose of integral molding can be achieved. In this embodiment, the entirety of the electrode 7 of the present invention is not the same size. Since the end of the columnar body needs to be formed into the tip end portion 91, the bottom portion of the electrode 7 has a protruding portion 71 to be spaced from the bottom end of the substrate 9. When the electrolytic processing is performed in this manner, the protruding portion 71 of the electrode 7 causes the bottom end side wall of the substrate 9 to be electrolytically removed deep, and at the same time, the substrate 9 is rotated seven times, so that the needle tip portion 91 is formed. From this, it is understood that the shape of the electrode 7 of the present invention differs depending on the shape of the small diameter portion 90 to be formed and the shape of the needle tip portion 91. Further, the molding apparatus of the present invention is not limited to forming the needle tip portion 91 only at the bottom of the columnar body, but a probe can be formed which can form a columnar body of any shape, and only needs to change the geometry of the electrode 7 The columnar body to be formed can be formed. As apparent from the above description, the present invention is a columnar body formed by one body molding as shown in Fig. 5 by a chemical electrolytic machining method, which can be used as a probe, the small diameter portion 90, the needle tip portion 91 and the grip portion 92. In order to be integrally formed, it is necessary to process the small diameter portion 90 of the probe, the needle tip portion 91 and the grip portion 92' differently from the conventional technology. Therefore, the present invention can reduce the welding processing steps and processing time, and reduce the defective rate of the manufacturing process. At the same time, it can increase production efficiency. In addition, by this method, the shape of the high diameter to length ratio can be formed, and the shape accuracy of the column body can be increased. In addition, due to the simplification of the processing steps, the processing apparatus is simplified, and the accuracy requirements of the apparatus are reduced. The form number A0101 is used to make the columnar body more competitive. Referring to the first figure, the front and rear ends of the tank body of the present invention are further provided with an electrolyte inflow port 12 and an electrolyte outflow port η for allowing the electrolyte 8 to flow into the tank body through the electrolyte inflow port 12. The electrolyte outlet 8 flows out of the tank body 1 so that the electrolyte 8 can be flow-updated, and the continuous use of the reacted electrolyte 8 is avoided to affect the processing accuracy, and the flow-update electrolyte 8 can be further removed for electrolytic processing. The bubble 10 produced by the process. Since the bubble 10 rises and accumulates in the processing section of the substrate 9 at the liquid level of the electrolyte 8, this leads to an increase in the speed of electrolysis of the processing section, and is different from the distance of other processing sections, so that the processing is performed. The predetermined processing size is used to affect the processing accuracy. 1 The present invention allows the electrolyte 8 to flow into/out of the tank body 1. In addition to the renewable electrolyte 8, it can also carry out the bubbles generated by the electrolytic process. Therefore, it is possible to prevent the bubbles from rising and accumulating in a certain processing section of the substrate 9, so that the precision and the processing efficiency can be increased, and at the same time, the substrate 9 is simultaneously rotated in the electrolytic processing process, which can also improve the molding. The shape of the column is dare to be precise. The electrode 7 of the present invention may be in the form of a non-surrounding substrate 9 to make the electrospray 8 easier to renew and carry away from the bubble 10. In addition, an electrolyte storage tank (not shown) is externally connected to the electrolyte inlet 12 for transferring the electrolyte to the tank body 1, and an electrolyte unit (not shown) is externally connected to the electrolyte outlet 14 for filtering and reacting. The electrolyte 8 is then stored back into the electrolyte storage tank. In addition, as shown in the second figure, the columnar molding apparatus of the present invention further includes a control circuit 21 that consumes the power supply unit 6' to control the power supply supplied by the power supply unit 6, for example, to the electrode 7 and the substrate. The magnitude of the current of 9 to control the speed and accuracy of electrolytic processing. 099141581 Form No. A0101 Page 10 of 24 0992072293-0 Please refer to the third drawing, which is a cross-sectional view showing another preferred embodiment of the columnar body forming apparatus of the present invention. As shown, the tank 4 of this embodiment is different from the tank 1 of the previous embodiment. The tank 4 of this embodiment has 6 side walls, and the electrolyte inlet 4 2 and electrolyte of this embodiment. The outflow port 4 is disposed at a different position from the previous embodiment. The electrolyte inflow port 42 of this embodiment is disposed below the bottom side wall of the trough body 4 and the two electrolyte outflow ports 44 are respectively disposed at the top of the opposite side walls of the trough body 4, so the electrolyte 8 flows through the electrolyte inflow port. 42 flows into the tank body 4 and flows out of the tank body 4 via the two electrolyte outlet ports 44. The electrolyte inflow port 42 and the electrolyte outflow port 44 of this embodiment are disposed such that the flow direction of the electrolyte 8 out of the tank 4 is the same as the upward moving direction of the bubble 10, so that the flow direction of the electrolyte 8 can conform to the bubble. 10 will move upwards, and improve the efficiency of the electrolyte 8 away from the bubble, so that the speed at which the bubble 10 is carried away from the processed substrate 7 is improved, and the precision of electrolytic processing can be improved. Further, the electrode 7 of this embodiment It is disposed on the top side wall of the tank body 4. The top side wall of the tank body 4 is provided with holes for the processing section of the substrate 9 to be placed in the tank body 4. Referring to Figure 4, there is shown a cross-sectional view of a third embodiment of the columnar forming apparatus of the present invention. As shown, the present invention further includes a magnetic element 100 comprising a magnetic field and positioned above the substrate 9, and the magnetic element 100 can be disposed on the holding unit 3 or the substrate 9 to be positioned above the substrate 9. The present invention generates a Lorentz force by the ions dissociated from the surface of the substrate 9 by the magnetic field of the magnetic element 100, thereby generating a pulling force on the ions dissociated from the surface of the substrate 9, and allowing the ions to dissociate as quickly as possible. The surface of the substrate 9 is separated from the surface of the substrate 9 and further separated by the flow of the electrolyte 8. This prevents the dissociated ions from being concentrated on the surface of the substrate 9, thereby improving the processing efficiency of the electrochemical electrolysis. The magnetic component 1 of the present invention is not limited to the holding order form number A0I01 1st page / total 24 pages nqq?n 201221964 yuan 3, and can also be set at different positions according to different usages. Please refer to the fifth drawing, which is a perspective view of a preferred embodiment of the columnar body of the present invention. As shown in the figure, the columnar body of this embodiment is a probe including a small diameter portion 90, a needle tip portion 91 and a grip portion 92, the needle tip portion 91 is located at the end of the small diameter portion 90, and the small diameter portion 90 is located at the grip. Below the handle 92 and having a uniform diameter. The grip portion 92 is an unprocessed portion of the substrate 9 which is not subjected to chemical electrolytic processing, so that it is integrally formed with the small diameter portion 90 and the needle tip portion 91 formed in the processing section of the substrate 9, without being welded, thereby improving Its mechanical strength and its electrical resistance reduce the electrical conductivity. Further, since the small-diameter portion 90 and the needle tip portion 91 are portions adjacent to the electrode 7, that is, the processing portion, when the probe molding process is performed by the molding method and the molding device of the present invention, the substrate 9 does not need to be displaced and only needs to be rotated. Since the base material 9 can shape the small diameter portion 90 of the probe and the needle tip portion 91, the shape accuracy of the small diameter portion 90 of the probe and the needle tip portion 91 can be improved. Further, the molding apparatus and the molding method of the present invention are simple, thereby reducing the equipment installation cost, reducing the processing steps and processing time, reducing the defective rate of the processing process, and increasing the productivity. In addition, since the substrate 9 is rotated during the electrolytic machining process without displacement, the small diameter portion 90 of the probe after molding is located in the axial center direction of the grip portion 92, so that the position of the small diameter portion 90 is fixed, When the probe of the present invention is used for detection, it can be easily positioned and the positioning accuracy can be improved. Referring to Figure 6, a perspective view of another preferred embodiment of the columnar body of the present invention. As shown, the tip end portion 93 of the probe of this embodiment can be in the form of a hook for testing the reliability of the metal wire. In this type of probe, only the probe of the fifth figure needs to be processed in the back stage, and the needle tip portion 91 of the fifth figure is bent upward to form a needle-shaped needle tip portion 93 099141581 Form No. A0101 No. 12 Page / Total 24 pages 0992072293-0 201221964 Table τ', the apparatus for molding a columnar body of the present invention, comprising a tank body, a holding unit, a rotating unit and a power supply unit, and an electrolyte and an electrode are disposed in the tank body 1U holding a single; ^ for holding the substrate of the reinforcing section in the tank and adjacent to the electrode 'rotating unit for rotating the holding unit and then rotating the substrate, the two poles of the power unit are respectively coupled to the electrode and the substrate The molding method of the invention is to rotate the substrate by supplying power to the electrode and the substrate by the power supply unit, and rotating the substrate, so that the substrate can be easily formed into a body-shaped column and The jade section of the substrate is formed into a small diameter portion. Since the molding apparatus and the molding method of the present invention are simple, the structure of the molding apparatus can be simplified, and the precision requirement and the installation cost can be changed, and the defect rate of the columnar body can be lowered to improve the precision, and the production time can be improved due to the short molding time. effectiveness. The bee is: since the overall structure of the columnar body of the present invention is formed by body molding, the mechanical properties such as strength, electrical conductivity and heat resistance are good. Therefore, the present invention is novel, progressive and available for the industry. The use of the user should be in line with the patent application of the patent law in China, and it is undoubted that the patent is filed in accordance with the law, and the analysis of the patent is granted by the Bureau of Analysis. However, the above description is only for the purpose of the present invention, and is not intended to limit the implementation of the present invention, so that the shapes, structures, features, and spirits described in the claims of the present invention are equally varied and modified. All should be included in the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS [ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Sectional view; 099141581 A0101 Page 13 of 24 0992072293-0 201221964 The third drawing is a cross-sectional view of another preferred embodiment of the columnar body forming apparatus of the present invention; and the fourth drawing is the columnar body forming apparatus of the present invention. A cross-sectional view of a preferred embodiment of the present invention; a fifth perspective view of a preferred embodiment of the columnar body of the present invention; and a sixth perspective view of another preferred embodiment of the columnar body of the present invention. [Main component symbol description] [0006] 1 tank 3 holding unit 4 tank 5 rotating unit 6 power unit 7 electrode 8 electrolyte 9 substrate 10 bubble 12 electrolyte inlet 14 electrolyte outlet 21 control circuit 31 base 33 Holding member 42 Electrolyte inflow port 44 Electrolyte outflow port 71 Projection portion 90 Small diameter portion Form No. A0101 Page 14 of 24 099141581 0992072293-0 201221964 91 Tip portion 92 Grip portion 93 Tip portion 100 Magnetic member Ο
099141581 表單編號Α0101 第15頁/共24頁 0992072293-0099141581 Form No. Α0101 Page 15 of 24 0992072293-0