201219662 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱裝置，特別是指/種用於電子設備 上之散熱裝置。 【先前技術】 [0002] ο 隨著電腦之配置越來越高，功能越來越強大’對系統内 部電子器件處理資料之速度要求亦越來越高，相關電子 器件產生之熱量亦大量增加。如果不及時將熱量排出， 將影響電腦運行時之穩定性。因此必須利用散熱裝置來 為此類電子元件散雜' [0003] 習知技術中’散熱裝置通常包括有風扇及風扇罩。風馬 固定於風扇罩内，再藉由螺絲將風扇罩固定於電腦機鉍 上。採用該種固定方式，於拆卸與安裝所述風屬罩時又 需要藉由螺絲起子等工具對螺絲拆卸與安擧， ， 其繁項費時。 、其過程極 ...::丨 υ 丨； 【發明内容】 [0004] [0005] ο 鑒於以上内容，有必要提供錄，料，裝方便之散熱 、裝置。 風 定架包括 一種散熱裝置，用以對一發熱元件散熱，包括有第 扇固定架和第二風扇固定架，所述第一風扇固 有前壁及設於所述前壁上之定位部，所述第二 〜風扇固定 架包括有側板及設於側板上之卡扣部，所述前 气 雙設有吹 之方 099137527 〇992〇654〇4.〇 容槽，所述定位部設有第一定位片，所述側板與所述卡 扣部之間形成有間隙，所述卡扣部卡扣於所述收容槽 ，所述卡扣部抵靠於所述定位部上，以阻止m述第二風 扇固定架相對第-風崩固定架沿大致平行所述前壁 表單編號 A0101 % 5 16 1 201219662 向滑動，所述第一定位片插入所述卡扣部與所述側板之 間，以阻止所述第二風扇固定架相對第一風扇固定架沿 大致垂直所述前壁之方向移動。 [0006] 與習知技術相比，於上述散熱裝置中，所述前壁設有收 容槽，所述定位部設有第一定位片，所述側板與所述卡 扣部之間形成有間隙，所述卡扣部卡扣於所述收容槽中 ，所述卡扣部抵靠於所述定位部上，以阻止所述第二風 扇固定架相對第一風扇固定架沿大致平行所述前壁之方 向滑動，所述第一定位片插入所述卡扣部與所述側板之 間，以阻止所述第二風扇固定架相對第一風扇固定架沿 大致垂直所述前壁之方向移動，就能將第二風扇固定架 固定於第一風扇固定架上。拆卸時，只要驅使所述卡扣 部脫離所述收容槽，就能所述第二風扇固定架移出所述 定位部，將所述第二固定架取下，完全避免了繁瑣之螺 絲拆卸與安裝，過程簡便，省時省力。 【實施方式】 [0007] 請參閱圖卜2，於本發明之一較佳實施方式中，一散熱裝 置固定於一機箱70中，且包括一第一散熱組合100及一第 二散熱組合200。 [0008] 所述機箱70包括一側板71及一底板72。所述側板71垂直 連接所述底板72。所述侧板71上開設複數出風口 711，所 述第一散熱組合1〇〇固定於所述侧板71上。所述底板72上 裝設一主機板73，所述主機板73上裝設複數發熱元件75 。於一實施方式中，所述發熱元件75可以是記憶體。 [0009] 所述第一散熱組合100固定於所述機箱70上，包括一第一 099137527 表單編號A0101 第6頁/共16頁 0992065404-0 201219662 風扇固定架10及一第一風扇30。所述第一風扇固定架1〇 包括一底璧（圖未示）、兩相對側壁13及一前壁15。所 述前壁15於中間位置設有一通風網孔151，並於底部之兩 拐角處分別設有一收容部丨54。每一收容部154包括一平 行於所述側壁13之凸邊152、一平行於所述底壁之凸邊 且設 153、及一連接所述凸邊152、153之折邊155。每一連接 —起之凸邊152、153及折邊155分別與所述前壁15形成 —定位槽158。所述别壁15向内凹設一收容槽156， Ο [0010] Ο 有一定位部157。所述收谷槽15.6靠近所述定位部is? 所述定位部157設置於所述前壁15之下邊緣。於—實施方 式中，所述定狃部157成LS。所述定位部157沿平行且遠 離所述前璧15之邊緣向上延伸一第—定位片1571，且沿 垂直於所述前壁15之兩侧邊緣分別向上延伸一第二定位 片1573。於-實施方式中’所述第二定位片1573垂直於 所述第一定位片1571。 所述第二散熱組合200包括一第二風扇固定㈣及一第二 風扇50。所述第二風扇固定架2〇包括一通風面⑽、沿 所述通風面板之四條邊垂直向下延伸出之四個側㈣ 、23、24、25、及沿所述側板以底邊向外大致垂直延 伸之-平板26。所述側板22、25分別向内凹設一凹槽 :251 處：便人工組裝。所述側板23與所述側板22 向外延伸出，27。所述側⑽設有 :面板21之切.並設有-可彈性變 形之卡扣⑽。所述卡扣部29包括— 便騍使所述卡扣部29彈性變形―3。二方 099137527201219662 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for an electronic device. [Prior Art] [0002] ο As the configuration of computers becomes higher and higher, the functions become more and more powerful. The speed of processing data in the internal electronic devices of the system is also increasing, and the amount of heat generated by related electronic devices is also increasing. If the heat is not discharged in time, it will affect the stability of the computer during operation. Therefore, it is necessary to use a heat sink to disperse such electronic components. [0003] In the prior art, the heat sink usually includes a fan and a fan cover. The wind horse is fixed in the fan cover, and the fan cover is fixed to the computer case by screws. In this kind of fixing method, when the windshield cover is disassembled and installed, the screw needs to be disassembled and lifted by a tool such as a screwdriver, which is complicated and time consuming. The process is extremely ...:: 丨 υ 丨; [Summary of the Invention] [0004] [0005] In view of the above, it is necessary to provide a recording, material, convenient heat dissipation, device. The air cooling frame includes a heat dissipating device for dissipating heat to a heat generating component, including a first fan fixing frame and a second fan fixing frame, wherein the first fan has an inner front wall and a positioning portion disposed on the front wall. The second fan holder includes a side plate and a buckle portion disposed on the side plate, and the front air double is provided with a blowing side 099137527 〇992〇654〇4. The cavity is provided, and the positioning portion is provided with the first a positioning piece, a gap is formed between the side plate and the buckle portion, the buckle portion is buckled in the receiving groove, and the buckle portion abuts against the positioning portion to block the description The two fan holders are slid relative to the first avalanche holder along a substantially parallel front wall form number A0101 % 5 16 1 201219662, and the first positioning piece is inserted between the buckle portion and the side plate to block The second fan holder moves relative to the first fan holder in a direction substantially perpendicular to the front wall. [0006] Compared with the prior art, in the heat dissipation device, the front wall is provided with a receiving groove, the positioning portion is provided with a first positioning piece, and a gap is formed between the side plate and the buckle portion. The latching portion is fastened in the receiving slot, and the latching portion abuts against the positioning portion to prevent the second fan fixing bracket from being substantially parallel to the front side of the first fan fixing bracket Sliding in the direction of the wall, the first positioning piece is inserted between the buckle portion and the side plate to prevent the second fan holder from moving relative to the first fan holder in a direction substantially perpendicular to the front wall. The second fan holder can be fixed to the first fan holder. When disassembling, the second fan holder can be removed from the positioning portion to remove the second fixing frame, thereby completely avoiding the cumbersome screw disassembly and installation. The process is simple, saves time and effort. [0007] Referring to FIG. 2, in a preferred embodiment of the present invention, a heat dissipating device is fixed in a chassis 70 and includes a first heat dissipating assembly 100 and a second heat dissipating assembly 200. The chassis 70 includes a side plate 71 and a bottom plate 72. The side plate 71 is vertically connected to the bottom plate 72. A plurality of air outlets 711 are defined in the side plate 71, and the first heat dissipation assembly 1 is fixed to the side plates 71. A motherboard 73 is mounted on the bottom plate 72. The motherboard 73 is provided with a plurality of heating elements 75. In an embodiment, the heat generating component 75 can be a memory. The first heat dissipation assembly 100 is fixed on the chassis 70 and includes a first 099137527 form number A0101 page 6 / page 16 0992065404-0 201219662 fan holder 10 and a first fan 30. The first fan holder 1A includes a bottom cymbal (not shown), two opposite side walls 13 and a front wall 15. The front wall 15 is provided with a ventilation mesh hole 151 at an intermediate position, and a receiving portion 丨 54 is respectively provided at two corners of the bottom portion. Each of the receiving portions 154 includes a flange 152 parallel to the side wall 13, a flange parallel to the bottom wall, and a flange 155 connecting the flanges 152, 153. The flanges 152, 153 and the flanges 155 of each connection form a positioning groove 158 with the front wall 15, respectively. The housing wall 15 is recessed inwardly with a receiving slot 156, and has a positioning portion 157. The valley receiving groove 15.6 is close to the positioning portion is? The positioning portion 157 is disposed at a lower edge of the front wall 15. In the embodiment, the fixed portion 157 is LS. The positioning portion 157 extends upwardly and away from the edge of the front cymbal 15 by a first positioning piece 1571, and a second positioning piece 1573 extends upwardly along two side edges perpendicular to the front wall 15. In the embodiment, the second positioning piece 1573 is perpendicular to the first positioning piece 1571. The second heat dissipation assembly 200 includes a second fan fixed (four) and a second fan 50. The second fan holder 2 includes a ventilation surface (10), four sides (four), 23, 24, 25 extending vertically downward along four sides of the ventilation panel, and a bottom edge along the side plate The plate 26 extends substantially vertically. The side plates 22, 25 are respectively recessed inwardly into a groove: 251: manually assembled. The side plate 23 and the side plate 22 extend outward, 27 . The side (10) is provided with a cut of the panel 21 and is provided with an elastically deformable buckle (10). The latching portion 29 includes a latch to elastically deform the latching portion 29 to three. Two parties 099137527
表單編號A0I0I 第7頁/共16 f 0992065404-0 201219662 291連接所述切口 231之兩側，且凸設一凸塊295。所述 驅動板293伸入所述切口 231中，且與所述通風面板21大 致處於一個平面上。 [0011] 請繼續參閱圖3，於安裝時，用手抓住所述側板22、25之 凹槽221、251將所述第二風扇固定架20之滑軌27滑入所 述第一風扇固定架10之定位槽158内。由於所述凸塊295 之存在，所述第二風扇固定架20於下滑過程中受到阻礙 。用力驅使所述第二風扇固定架20下滑，所述凸塊受到 所述第一風扇固定架10之擠壓產生向外之彈性形變。所 述第二風扇固定架20下滑至與所述第一風扇固定架10之 定位部157相抵靠，所述卡扣部29之本體291處於兩所述 第二定位片1 573之間，且與所述第二定位片1 573相抵靠 。所述第一定位片1571進入所述切口 231中，且與所述本 體291相抵靠。所述第二風扇固定架20下滑停止，所述卡 扣部29彈性形變回復，所述凸塊295卡入所述收容槽156 中，將所述第二風扇固定架20與所述第一風扇固定架10 固定於一起。所述第二風扇固定架20遮罩所述發熱元件 75。於一實施方式中，所述發熱元件75為記憶體條。 [0012] 所述散熱裝置於工作時，所述第二散熱組合200將所述發 熱元件75產生之熱風流排至所述機箱70中，所述第一散 熱組合100再將所述機箱70中之熱風流沿所述出風口 711 排出所述機箱70來完成散熱。 [0013] 當需要拆卸所述第二風扇固定架20時，只要藉由所述卡 扣部29之驅動板293驅使所述卡扣部29彈性變形，以使所 述凸塊295脫離所述收容槽156，用手按住所述凹槽221 099137527 表單編號A0101 第8頁/共16頁 0992065404-0 201219662 向上拉動所述第二風扇固定架20，從而使所述第二風扇 固定架2 0脫離所述第一風扇固定架10。 [0014] 綜上所述，本發明確已符合發明專利要求，爰依法提出 專利申請。惟，以上所述者僅為本發明之較佳實施方式 ，舉凡熟悉本發明技藝之人士，爰依本發明之精神所作 之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内 〇 【圖式簡單說明】 _ [0015] 圖1是本發明實施方式散熱裝置一立體分解圖。 Ο [0016] 圖2是圖1之一另一視角圖。 [0017] 圖3是圖1之一立體組裝圖。 【主要元件符號說明】 [0018] 第一散熱組合：100 [0019] 第二散熱組合：200 [0020] 第一風扇固定架：10 Ο [0021] 側壁：13 [0022] 前壁：15 [0023] 通風網孔：151 [0024] 凸邊：152、153 [0025] 收容部：154 [0026] 折邊：155 099137527 表單編號A0101 第9頁/共16頁 0992065404-0 201219662 [0027] 收容槽：156 [0028] 定位部：157 [0029] 定位槽：158 [0030] 第一定位片：1571 [0031] 第二定位片：1573 [0032] 第二風扇固定架：20 [0033] 通風面板：21 [0034] 侧板：22、23、24、25、71 [0035] 凹槽：221、251 [0036] 切口 ： 2 31 [0037] 平板：26 [0038] 滑轨：27 [0039] 卡扣部：29 [0040] 本體：291 [0041] 驅動板：29 3 [0042] 凸塊：295 [0043] 第一風扇：3 0 [0044] 第二風扇：50 [0045] 機箱：70 099137527 表單編號A0101 第10頁/共16頁 0992065404-0 201219662 [0046] 出風口 ： 711 [0047] 底板：72 [0048] 主機板：73 [0049] 發熱元件：75 〇 099137527 表單編號A0101 第11頁/共16頁 0992065404-0Form No. A0I0I Page 7 of 16 f 0992065404-0 201219662 291 is connected to both sides of the slit 231, and a bump 295 is protruded. The drive plate 293 extends into the slit 231 and is substantially in a plane with the vent panel 21. [0011] Please continue to refer to FIG. 3. During installation, the slides 27 of the second fan holder 20 are slid into the first fan by grasping the grooves 221 and 251 of the side plates 22 and 25 by hand. The positioning groove 158 of the frame 10 is inside. Due to the presence of the bumps 295, the second fan mount 20 is obstructed during the descent. The second fan holder 20 is driven to slide down, and the protrusion is pressed by the first fan holder 10 to produce an outward elastic deformation. The second fan holder 20 is slidably abutted against the positioning portion 157 of the first fan holder 10, and the body 291 of the locking portion 29 is between the two positioning pieces 1 573, and The second positioning piece 1 573 abuts. The first positioning piece 1571 enters the slit 231 and abuts against the body 291. The second fan holder 20 is slid and stopped, the buckle portion 29 is elastically deformed, and the protrusion 295 is inserted into the receiving slot 156 to fix the second fan holder 20 and the first fan. The holders 10 are fixed together. The second fan holder 20 shields the heat generating component 75. In one embodiment, the heating element 75 is a memory strip. [0012] When the heat dissipating device is in operation, the second heat dissipating assembly 200 discharges the hot air flow generated by the heating element 75 into the chassis 70, and the first heat dissipating assembly 100 is further disposed in the chassis 70. The hot air flow exits the chassis 70 along the air outlet 711 to complete heat dissipation. [0013] When the second fan holder 20 needs to be disassembled, the locking portion 29 is elastically deformed by the driving plate 293 of the locking portion 29 to disengage the protrusion 295 from the receiving portion. Slot 156, holding the groove 221 by hand 099137527 Form No. A0101 Page 8 / Total 16 Page 0992065404-0 201219662 Pulling the second fan holder 20 upward, thereby disengaging the second fan holder 20 The first fan holder 10 is described. [0014] In summary, the present invention has indeed met the requirements of the invention patent, and has filed a patent application according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0015] FIG. 1 is an exploded perspective view of a heat sink according to an embodiment of the present invention. 2 is another perspective view of one of FIG. 1. 3 is an assembled, isometric view of FIG. 1. [Main component symbol description] [0018] First heat dissipation combination: 100 [0019] Second heat dissipation combination: 200 [0020] First fan holder: 10 Ο [0021] Side wall: 13 [0022] Front wall: 15 [0023] Ventilation mesh: 151 [0024] Flange: 152, 153 [0025] Containment: 154 [0026] Folding: 155 099137527 Form No. A0101 Page 9 of 16 0992065404-0 201219662 [0027] Storage trough: 156 [0028] positioning portion: 157 [0029] positioning groove: 158 [0030] first positioning piece: 1571 [0031] second positioning piece: 1573 [0032] second fan holder: 20 [0033] ventilation panel: 21 [0034] Side panels: 22, 23, 24, 25, 71 [0035] Grooves: 221, 251 [0036] Cuts: 2 31 [0037] Flat: 26 [0038] Slide rails: 27 [0039] Buckle : 29 [0040] Body: 291 [0041] Driver board: 29 3 [0042] Bump: 295 [0043] First fan: 3 0 [0044] Second fan: 50 [0045] Chassis: 70 099137527 Form number A0101 Page 10 of 16 0992065404-0 201219662 [0046] Air outlet: 711 [0047] Base plate: 72 [0048] Motherboard: 73 [0049] Heating element: 75 〇 099137527 Form number A0101 11/16 Page 0992065404-0