201219178 六、發明說明： 【發明所屬之技術領域】 本發明係有關-種切咖線材及其製作方法，特別是指—種包覆奈求 碳材的切割用線材及其製作方法。 【先前技術】 -般用於切财機獅棒或者⑪晶棒的騎可以分為無包覆式的線材 以及有包覆式的線材_。而所謂的有包覆式的線材是先將細粉顆粒與樹 脂混合，隨後塗佈於如鋼琴線之線材的表面上，以有祕切舰率的提升。 但包覆式的線材所使用的細粉顆粒—般為高單價_石粉顆粒，或者是有 污染性且回收不㈣碳化普顆粒兩種等，因此具有成本過高或者環保問 題的缺點存在。 而所謂的無包覆式雜，則是使賴似於紐的原理將鋼或黃銅被覆 於線材表面’以助於切割期間線材行_利。但進行有機樹脂棒或者石夕晶 棒切割時，她於包赋的線材，使用無包覆式的雜進行鑄鍵切割時， 則需要依賴相較於大量的冷卻_及溶娜協崎溫，以避免切割時的過 熱以及線材陳b但大量的冷卻_及溶騎衍生出的成本與環境污染 問題更是一大困擾。 有鑑於此，本發明遂針對上述習知技術之缺失，提出—鶴新的切割 用線材及其製作方法，贿效克服上述之該等問題。 【發明内容】 本發明之主要目的在提供—種切制線材與及製作方法，其線材之最 外層包覆有输#，w娜順,⑽，嶋峨 性。 / 201219178 為達上述之目的’本發明提供一種切割用線材，其包含有一線材其 外周圍包覆有-有機酸接面層，而有機酸接面層之外周園包覆有一外殼 層，此外殼層是由奈麵材、錢纖轉分散_混合而成。 本發明尚提供-種_麟材㈣作方法，其步熟含有先提供一線 材’接續於線材表面包覆—有機酸接面層；再於有機酸接面層上包覆一外 殼層’外殼層是由奈米储、械鋪軸分鋪所混合喊；最後對外 殼層進行硬化處理。 底下藉由具體實施例詳加說明，當更容易瞭解本發明之目的技術内 容、特點及其所達成之功效。 【實施方式】 本發明係針對切财猜樹祕或抑晶棒提出—種展_切割用線 材。請參閱第！圖，其係本發明之切割用線材的剖面示意圖。如圖所示， 本發明之切期線材1G包含有-線材12，其外包覆有—有機酸接面層 而有機酸接面層14之外包覆有—外殼層16，此外殼層μ是由奈 米碳材、錢嶋旨與分散綱齡喊。再者，較層16制為表面所 顯露出的奈米碳材，呈現出相當微細的凹凸起伏，如_狀。 上述之有機酸接面層14可增加外殼層16與線材12間的附著性與線材 12表面的顧度’此有機酸接面層14之材質可叫甲酸，崎材η可以 是鋼琴線。 此外，上述之有機類樹脂包含有一第一樹脂與一第二樹脂，第—樹脂 是選自於尿酸樹脂、環氧樹脂或橡膠樹脂，第二樹脂是—感光性樹脂，^ 光性樹輯自於料光雜化_或熱硬化蘭脂4述之錄劑是含有 201219178 極性基的有機分子材料’以將奈米碳材均勻分佈於有機樹脂内。在進行製 備時’第一樹脂、第二樹脂與分散劑的重量比例為20〜35 : 10〜25 : 10 : 35。而奈米碳材混入上述有機樹脂内的重量比例可視需求進行適當調整， 因此於此將不進行界定。 而奈米碳材的選用上，可選自於富勒烯球及其衍生物、單壁型或多壁 型奈米碳管及其衍生物，或是經純化處理之奈米碳顆粒。 接續’請再一併參閱第2圖，其係上述之切割用線材的製作步驟流程 _ 圖。首先，如步驟S1所述’提供一線材12 ;再如步驟S2所述，於線材12 表面包覆一有機酸接面層14 ;如步驟S3所述，於有機酸接面層η上包覆 一外殼層16，外殼層16是由奈米碳材、有機類樹脂與分散劑混合而成；最 後如步驟S4所述，對外殼層16進行硬化處理。 在硬化處理過程中可視感光性樹脂為紫外光硬化型樹脂或熱硬化型樹 脂的類型來進行適當的處理，例如當感光性樹脂為紫外光硬化型樹脂時， 可利用紫外光照射外殼層來進行硬化處理。 鲁此外，線材12是利用浸泡於一有機酸溶液中的方式，來使線材12表 面包覆有機酸接面層14 ’且有機酸溶液為曱酸。而相關的材料種類與配方 比例係如先前所述，因此不再贅述。 綜上所述’本發明提供一種嶄新的切割用線材，其使用較鑽石粉顆粒 易於取得且價格較低的奈米碳材來作為外殼層，以在優異切割特性下，同 時具有低成本與環保性。再者，本發明之切割用線材的製作過程相當簡單， 易於施行，也促使本發明之切割用線材深具產業利用性。 唯以上所述者，僅為本發明之較佳實施例而已，並非用來限定本發明 201219178 實施之範圍。故即凡依本發明申請範圍所述之特徵及精神所為之均等變化 或修飾，均應包括於本發明之申請專利範圍内。 【圖式簡單說明】 第1圖係本發明之切割用線材的剖面示意圖。 第2圖係本發明之切割用線材的製作步驟流程圖。 【主要元件符號說明】 10切割用線材 12線材 14有機酸接面層 16外殼層201219178 VI. Description of the Invention: [Technical Field] The present invention relates to a dicing wire and a method for producing the same, and particularly to a wire for cutting a carbon material and a method for producing the same. [Prior Art] - The rides used for the cutting machine lion or the 11-ring can be divided into uncoated wires and covered wires. The so-called coated wire is first mixed with fine powder particles and then coated on the surface of a wire such as a piano wire to increase the rate of the secret ship. However, the fine powder particles used for the coated wire are generally high-priced _ stone powder granules, or contaminated and recycled (four) carbonized granules, etc., and thus have the disadvantages of excessive cost or environmental problems. The so-called uncoated type of miscellaneous is to make steel or brass coated on the surface of the wire to help the wire rod during cutting. However, when the organic resin rod or the stone enamel rod is cut, when the wire is cut by the uncoated type, the wire is cut by the uncoated type, and the crystallization is required to be compared with a large amount of cooling _ and 娜Na To avoid overheating during cutting and wire b but a lot of cooling _ and the cost of solvent riding and environmental pollution problems are even more troublesome. In view of the above, the present invention is directed to the lack of the above-mentioned prior art, and proposes a new cutting wire and a manufacturing method thereof, and the briber effect overcomes the above problems. SUMMARY OF THE INVENTION The main object of the present invention is to provide a cutting wire and a manufacturing method thereof, wherein the outermost layer of the wire is covered with a loser #, w Na Shun, (10), 嶋峨. / 201219178 For the above purposes, the present invention provides a wire for cutting comprising a wire having an outer layer coated with an organic acid junction layer, and an outer layer of the organic acid junction layer is coated with an outer shell layer. The layer is made up of a mixture of naphthalene materials and money fibers. The invention further provides a method for preparing a material, which comprises first providing a wire 'continuously covering the surface of the wire—the organic acid junction layer; and coating the outer layer of the organic acid on the outer layer of the outer layer. The layer is mixed and shouted by the nano-storage and mechanical paving. The final layer is hardened. The details of the technical purpose, the features and the effects achieved by the present invention are more readily understood by the detailed description of the specific embodiments. [Embodiment] The present invention is directed to a cutting-for-cutting-cutting wire for a chip-cutting tree or a bar. See the first! Figure is a schematic cross-sectional view of a wire for cutting of the present invention. As shown in the figure, the cut wire 1G of the present invention comprises a wire 12 which is covered with an organic acid joint layer and an organic acid joint layer 14 which is covered with a shell layer 16, which is provided. It is shouted by nano carbon materials, money and purpose. Further, the nanocarbon material which is formed on the surface of the layer 16 exhibits a relatively fine unevenness, such as a _ shape. The organic acid junction layer 14 described above can increase the adhesion between the outer shell layer 16 and the wire 12 and the surface of the wire 12. The material of the organic acid junction layer 14 can be called formic acid, and the crucible material η can be a piano wire. Further, the above organic resin comprises a first resin and a second resin, the first resin is selected from a uric acid resin, an epoxy resin or a rubber resin, and the second resin is a photosensitive resin. The recording agent is a organic molecular material containing a polar group of 201219178 to uniformly distribute the nano carbon material in the organic resin. When the preparation is carried out, the weight ratio of the first resin, the second resin to the dispersant is 20 to 35: 10 to 25: 10:35. The weight ratio of the nano carbon material mixed into the above organic resin can be appropriately adjusted as needed, and thus will not be defined here. The carbon material may be selected from the group consisting of fullerene spheres and derivatives thereof, single-walled or multi-walled carbon nanotubes and derivatives thereof, or purified nanocarbon particles. Continuation ‘Please refer to Figure 2 again, which is the flow chart of the above-mentioned cutting wire manufacturing process _ figure. First, a wire 12 is provided as described in step S1; and an organic acid junction layer 14 is coated on the surface of the wire 12 as described in step S2; and coated on the organic acid junction layer η as described in step S3. An outer shell layer 16 is formed by mixing a nano carbon material, an organic resin, and a dispersing agent; finally, the outer shell layer 16 is hardened as described in step S4. In the hardening treatment, the photosensitive resin may be appropriately treated as a type of ultraviolet curing resin or thermosetting resin. For example, when the photosensitive resin is an ultraviolet curing resin, the outer layer may be irradiated with ultraviolet light. Hardening treatment. In addition, the wire 12 is immersed in an organic acid solution to coat the surface of the wire 12 with the organic acid junction layer 14' and the organic acid solution is citric acid. The relevant material types and formula ratios are as described above, so they will not be described again. In summary, the present invention provides a novel cutting wire material which uses a nano carbon material which is easier to obtain and has a lower price than diamond powder particles as an outer layer to provide low cost and environmental protection under excellent cutting characteristics. Sex. Furthermore, the manufacturing process of the cutting wire of the present invention is relatively simple and easy to implement, and the cutting wire of the present invention is also industrially usable. The above is only the preferred embodiment of the present invention and is not intended to limit the scope of the implementation of the present invention 201219178. Therefore, any changes or modifications of the features and spirits of the present invention should be included in the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a wire for cutting of the present invention. Fig. 2 is a flow chart showing the steps of producing the wire for cutting of the present invention. [Main component symbol description] 10 cutting wire 12 wire 14 organic acid bonding layer 16 outer layer