TW201218929A - Temperature adjusting equipment of electronic device - Google Patents

Temperature adjusting equipment of electronic device Download PDF

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Publication number
TW201218929A
TW201218929A TW099135875A TW99135875A TW201218929A TW 201218929 A TW201218929 A TW 201218929A TW 099135875 A TW099135875 A TW 099135875A TW 99135875 A TW99135875 A TW 99135875A TW 201218929 A TW201218929 A TW 201218929A
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TW
Taiwan
Prior art keywords
fan
speed
electronic device
temperature
motor
Prior art date
Application number
TW099135875A
Other languages
Chinese (zh)
Inventor
Chao-Ke Wei
Yao-Ting Chang
Original Assignee
Hon Hai Prec Ind Co Ltd
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Publication date
Application filed by Hon Hai Prec Ind Co Ltd filed Critical Hon Hai Prec Ind Co Ltd
Priority to TW099135875A priority Critical patent/TW201218929A/en
Priority to US12/963,767 priority patent/US20120097375A1/en
Publication of TW201218929A publication Critical patent/TW201218929A/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D27/00—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids
    • F04D27/004—Control, e.g. regulation, of pumps, pumping installations or pumping systems specially adapted for elastic fluids by varying driving speed
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Abstract

This invention disclose a temperature adjusting equipment of electronic device, which includes temperature measuring unit, core controlling chip and fan system. The fan system includes some fans, and each fan includes some motor. The temperature measuring unit measure the temperature in the electronic device. The core controlling chip sets the speed of each fan according to the temperature. And the core controlling chip get the speed of each motor, if one motor of a fan stop running, the temperature reset the speed of each motor, to make all the fan have the same ability of radiation.

Description

201218929 六、發明說明： 【發明所屬之技術頜威】 _本發明涉及〆種電子裝置溫度調節裝置，特別涉及一種 具有多風扇系統的電子裝置溫度調節裝置° 【先前技術】 [0002]隨著科學技術的不斷發展’伺服器等電子裝置内的各元 件的工作頻率不斷提高，相應的工作時所產生的熱量亦 ❹201218929 VI. Description of the invention: [Technology of the invention] The present invention relates to a temperature adjustment device for an electronic device, and more particularly to an electronic device temperature adjustment device having a multi-fan system. [Prior Art] [0002] With Science The continuous development of technology's operating frequency of various components in electronic devices such as servers are constantly increasing, and the heat generated during the corresponding work is also reduced.

099135875 不斷增多’為了使電子裝置能夠及時散熱’保證電子裝 置内各元件的正常工作’通常於電子赛置内設置有溫度 調節裝置以進行散熱。現在常用的電子裝置溫度調節裝 置多為由複數風扇組成的多風扇系統，且每個風扇通常 均設置有複數馬達提供動力，以產生較大的風力，獲得 較好的散熱效果。另，電子裝置内還會設置有溫度感測 單元，用以感測溫度並對應地發送與溫度數值對應的電 訊號至主控晶片’主控晶片得根據即時的溫度相應調節 風扇的馬㈣料，於保證較佳的散熱效果的同時, 能地節省電能。然，於壯的電子 ，-般設置為個風扇的，或錢個馬達 ，為防=散熱效果受到影響，主控晶片立即控 常的馬達均全速運轉，以儘量增大多風㈣ ； 藉此，不僅損耗較大的電能，而且，㈣軸 乂 達的風扇所獲得的動力比其他風扇小，其產^ 強較正常運轉的風扇產生的風力壓強小。'藉此的風力 將無法抵抗其他正常運轉的風扇對其施加的風麼= 其進風困難並產生系統熱回流的現象，_電子^ 散熱效果。 衮置 表單編號A0101 第3頁/共12頁 201218929 【發明内容】 [0003] 鑒於以上内容，有必要提供一種具有多風扇系統且有效 防止熱回流現象的電子裝置溫度調節裝置。 [0004] 一種電子裝置溫度調節裝置，包括依次電性連接的溫度 檢測單元、主控晶片與多風扇系統，多風扇系統包括若 干風扇，每一風扇包括若干馬達，溫度檢測單元檢測電 子裝置内的溫度，主控晶片根據檢測到的溫度設定風扇 的馬達的轉速，主控晶片還獲取每一風扇的馬達的轉速 ，若獲取到其中一個風扇中有馬達轉速為零，主控晶片 重新設定所有風扇的馬達的轉速，使所有風扇的散熱效 能一致。 [0005] 本發明電子裝置溫度調節裝置中，主控晶片根據電子裝 置内的溫度相應設定多風扇系統的轉速，且當某一風扇 的一馬達停止旋轉時，主控晶片將重新設定所有風扇的 馬達轉速，保證所有風扇的散熱效能一致，在保證較佳 的散熱效果的同時還且可有效防止熱回流現象的產生。 【實施方式】 [0006] 如圖1所示，本發明電子裝置溫度調節裝置100裝設於一 習知電子裝置中，為該電子裝置進行散熱。該電子裝置 溫度調節裝置100包括主板90及設於主板90上的溫度檢測 單元10、主控晶片20、速度調節模組30以及連接到主板 90的多風扇系統50。該主板90得整合於所述習知電子裝 置的主板中作為其一部分。溫度檢測單元10檢測電子裝 置内的溫度等參數，並傳送至主控晶片20，然後主控晶 片20根據溫度設定轉速，並由速度調節模組30調節多風 099135875 表單編號 A0101 第 4 頁/共 12 頁 0992062711-0 201218929 扇系統50的轉速。同時，該主控晶片20還能夠獲取多風 ' 扇系統50的轉速，並根據獲取的轉速判斷是否每一風扇 均正常運轉，若檢測到某一風扇運轉異常時，主控晶片 20將藉由速度調節模組30重新設定每一風扇的轉速，使 所有風扇的散熱與效能一致。應說明的是，於本較佳實 施例中，以該多風扇系統50包括風扇51與風扇53，且以 風扇51為運轉異常的風扇，而風扇53作為正常運轉的風 扇來舉例說明。 [0007] 主板90用以接入多風扇系統50，以便主板90上的主控晶 片20能夠獲取及調節該多風扇系統50的轉速。 [0008] 溫度檢測單元10耦接到主控晶片20，用以檢測電子裝置 内的溫度，並對應地發送與溫度數值對應的電訊號至主 控晶片20，使主控晶片20得根據即時的溫度相應設定多 風扇系統50的轉速。於本發明實施方式中，該溫度檢測 早元10得為由熱敏電阻等感溫元件組成的溫度檢測電路 〇 [0009] 主控晶片20與溫度檢測單元10、速度調節模組30均電性 〇 連接，用以根據溫度檢測單元ίο檢測到的溫度設定多風 扇系統50的轉速，並將該設定的轉速值發送至速度調節 模組30，以藉由速度調節模組30調節多風扇系統50的轉 速。所述的轉速是以duty cycle (工作週期）的值來表 示的。例如，風扇的轉速為50% duty cycle。於本發明 實施方式中，所述主控晶片20得為一BIOS(Basic In-put Or Output,基本輸入輸出系統）或 • BMC(Baseboard Management Control ler，基板管理 099135875 表單編號A0101 第5頁/共12頁 0992062711-0 201218929 控制器）。該主控晶片20設置風扇51、風扇53的Duty cycle值，以調整風扇51與風扇53的轉速，使該多風扇 系統50的散熱效能滿足當前電子裝置内的溫度的散熱性 能要求。 [0010] 該主控晶片20還能夠獲取風扇51與風扇53的轉速，並藉 由獲取到的轉速判斷風扇51、風扇53是否正常運轉。於 本發明實施方式中，當風扇51運轉異常時，主控晶片20 將重新設定風扇51與風扇53的Duty cycle值，再藉由速 度調節模組30對應設定的Duty cycle值調節風扇51與風 扇53的轉速，以確保風扇51與風扇53的散熱效能一致。 [0011] 速度調節模組30電連接至主控晶片20與多風扇系統50， 該速度調節模組30接收主控晶片20對風扇51與風扇53設 定的Duty cycle值，然後依照該設定的Duty cycle值 分別設定風扇51、風扇53的轉速。 [0012] 於本發明實施方式中，該電子裝置溫度調節裝置100還包 括連接至主控晶片20的速度檢測模組40，用以分別檢測 風扇51、風扇53的轉速，主控晶片20即藉由速度檢測模 組40獲取多風扇系統50的轉速。該速度檢測模組40設於 主板90上，以藉由主板90連接至多風扇系統50，並將測 得的風扇51、風扇53的轉速發送至主控晶片20，以便主 控晶片20判斷風扇51、風扇53運轉是否正常。 [0013] 風扇51與風扇53藉由主板90連接至主控晶片20和速度檢 測模組40。於本發明實施方式中，風扇51包括二馬達511 ，風扇53包括二馬達531，且馬達511與馬達531的最大 099135875 表單編號A0101 第6頁/共12頁 0992062711-0 201218929 Ο [0014] 轉迷相同。應說明的是，通常情況下，風扇51的二馬達 511與風扇53的二馬達531均以相同的轉速運轉，以提供 相同的散熱效能。而，當風扇51中的一個馬達511損壞而 停止旋轉時’該風扇51的轉速將減慢，此時該風扇51的 散熱效能為正常運轉的風扇53的散熱效能的4〇%-6〇%， 無法抵抗風扇53產生的風壓而將被風扇53搶風，最終導 致熱回流現象的產生，影響散熱效果。為解決上述問題 ’此時主控晶片20將重新設定馬達511和馬達51 3的轉速 ，使風扇51、風扇53的散熱效能一致。 當速度檢測模組4 0横洌到風扇51的一個馬達511的停止旋 轉，而另一馬達511與風扇53的二馬達533均於主控晶片 2〇設置的轉速下旋轉時，為了使珥扇51與風扇53的散熱 效能一致，風扇51的正常運轉的馬達511將全速旋轉，而 風扇53的二馬達531均以大致半速的轉速旋轉。 [0015] Ο 該電子裝置溫度調即襄置100工作厚理如下：當該電子裝 置溫度調節裝置1 0 0工作時，溫度檢測單元1 0不斷檢測該 電子裝置溫度調節裝置100内的溫度，並將該溫度參數發 送至主控晶片20。然後主控晶片20根據接收到的溫度參 數相應設定馬達511與馬達513的Duty cycle值，速度 調節模組30再根據設定的Duty cycle值調節馬達511與 馬達513的轉速，使該多風扇系統50的散熱效能一致，且 滿足當前溫度的散熱效能要求。於此過程中，速度檢測 模組40不斷偵測風扇51的每一馬達511以及風扇53的每 一馬達5 31的轉速’並將偵測到的轉速回饋給主控晶片2 〇 。若速度檢測模組40偵測到風扇51的一個馬達511停止旋 099135875 表單編號A0101 第7頁/共12頁 0992062711-0 201218929 轉，而另一馬達511及風扇53的二馬達531均於主控晶片 20設置的轉速下旋轉時，控制模組35判斷風扇51失效， 風扇53正常運轉。此時’主控晶片2〇將設定風扇51以 100%的Duty cycle值全速旋轉，而風扇53則以4〇-6〇〇/ 的Duty cycle值旋轉。風扇51只有一馬達511，其全速 旋轉的散熱效能與具有二以大約半速旋轉的馬達531的風 扇53的散熱效能一致，有效防止熱回流現象的產生。 [0016] [0017] [0018] 得理解，該馬達511與馬達513的最大轉速應該足夠大， 使得當風扇51失效而僅剩一個馬達511全速旋轉時，風扇 51的散熱效能仍能夠滿足電手裝置正常工作狀態下任一 溫度的散熱效能需求。 得理解，風扇51與風扇53包含的馬達511、513數量不限 於2個，得為3個、4個或者更複數，當風扇51中有一個或 者幾個馬達511損壞時，主控晶片2〇將分別重新設定風扇 51與風扇53的轉速，使風,51與風爲53的散熱效能能夠 一致。 .. .... 本發明電子裝置溫度調節裝置100 ,由主控晶片2〇根據電 子裝置内的溫度相應調節所多風扇系統5〇的轉速，且當 風扇51的一個馬達511損壞而僅剩一個馬達μι工作時， 主控晶片20將藉由速度調節模組3〇重新調節馬達51丨與馬 達531的轉速’使風扇51與風扇53的散熱效能一致，不僅 散熱效果較佳，且可有效防止熱回流現象的產生。 综上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 099135875 表單編號Α0101 第8頁/共12頁 0992062711-0 [0019] 201218929 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0020] 圖1是本發明電子裝置溫度調節裝置的較佳實施方式的示 意圖。 【主要元件符號說明】 [0021] 電子裝置溫度調節裝置：100 [0022] 溫度檢測單元：10 〇 [0023] 主控晶片：20 [0024] 速度調節模組：30 [0025] 速度檢測模組：40 . [0026] 多風扇系統：5 0 [0027] 風扇：51、53 [0028] 馬達：511、531 〇 [0029] 主板：90 099135875 表單編號A0101 第9頁/共12頁 0992062711-0099135875 Increasingly 'in order to enable the electronic device to dissipate heat in time to ensure the normal operation of the components in the electronic device', a temperature regulating device is usually provided in the electronic game for heat dissipation. Nowadays, the commonly used electronic device temperature regulating devices are mostly multi-fan systems composed of a plurality of fans, and each of the fans is usually provided with a plurality of motors to provide power to generate a larger wind force for better heat dissipation. In addition, a temperature sensing unit is further disposed in the electronic device for sensing the temperature and correspondingly transmitting the electrical signal corresponding to the temperature value to the main control chip. The main control chip can adjust the fan (four) material according to the instantaneous temperature. It can save energy while ensuring better heat dissipation. However, Yu Zhuang's electronics, generally set as a fan, or money motor, to prevent the heat dissipation effect, the main control chip immediately control the motor at full speed to maximize wind (4); Not only does it consume a lot of power, but (4) the fan of the shaft is less powerful than other fans, and its production is lower than that of a fan that is normally operated. 'The wind will not be able to withstand the wind applied by other normally operating fans. It is difficult to enter the wind and cause the system to return to the heat. _Electronic ^ heat dissipation effect.表单 Form No. A0101 Page 3 of 12 201218929 SUMMARY OF THE INVENTION [0003] In view of the above, it is necessary to provide an electronic device temperature adjusting device having a multi-fan system and effectively preventing thermal backflow. [0004] An electronic device temperature adjustment device includes a temperature detection unit electrically connected in sequence, a main control chip and a multi-fan system, the multi-fan system includes a plurality of fans, each fan includes a plurality of motors, and the temperature detection unit detects the inside of the electronic device Temperature, the master wafer sets the speed of the motor of the fan according to the detected temperature, and the master wafer also acquires the speed of the motor of each fan. If one of the fans has zero motor speed, the master wafer resets all the fans. The speed of the motor makes the heat dissipation performance of all fans consistent. [0005] In the electronic device temperature adjustment device of the present invention, the main control chip sets the rotation speed of the multi-fan system according to the temperature in the electronic device, and when a motor of a certain fan stops rotating, the main control chip resets all the fans. The motor speed ensures that all the fans have the same heat dissipation performance, which can prevent the heat reflow phenomenon while ensuring better heat dissipation. [Embodiment] As shown in Fig. 1, the electronic device temperature adjusting device 100 of the present invention is installed in a conventional electronic device to dissipate heat from the electronic device. The electronic device temperature adjustment device 100 includes a main board 90, a temperature detecting unit 10 disposed on the main board 90, a main control chip 20, a speed adjusting module 30, and a multi-fan system 50 connected to the main board 90. The main board 90 is integrated as a part of the main board of the conventional electronic device. The temperature detecting unit 10 detects parameters such as temperature in the electronic device and transmits the parameters to the main control chip 20, and then the main control chip 20 sets the rotational speed according to the temperature, and adjusts the windy speed by the speed adjusting module 30. 099135875 Form No. A0101 Page 4 / Total 12 pages 0992062711-0 201218929 The speed of the fan system 50. At the same time, the master wafer 20 can also acquire the rotational speed of the multi-winding fan system 50, and determine whether each fan is normally operated according to the obtained rotational speed. If a certain fan operation abnormality is detected, the main control chip 20 will be used by The speed adjustment module 30 resets the speed of each fan to make the heat dissipation and performance of all the fans consistent. It should be noted that in the preferred embodiment, the multi-fan system 50 includes a fan 51 and a fan 53, and the fan 51 is a fan that operates abnormally, and the fan 53 is exemplified as a fan that operates normally. The main board 90 is used to access the multi-fan system 50 so that the main control chip 20 on the main board 90 can acquire and adjust the rotational speed of the multi-fan system 50. The temperature detecting unit 10 is coupled to the main control chip 20 for detecting the temperature in the electronic device, and correspondingly transmitting the electrical signal corresponding to the temperature value to the main control chip 20, so that the main control chip 20 is obtained according to the instant. The temperature sets the rotational speed of the multi-fan system 50 accordingly. In the embodiment of the present invention, the temperature detecting element 10 is a temperature detecting circuit composed of a temperature sensing element such as a thermistor, and the main control chip 20, the temperature detecting unit 10, and the speed adjusting module 30 are electrically connected. The 〇 connection is configured to set the rotation speed of the multi-fan system 50 according to the temperature detected by the temperature detecting unit ίο, and send the set rotation speed value to the speed adjustment module 30 to adjust the multi-fan system 50 by the speed adjustment module 30. Speed. The stated speed is expressed as the value of the duty cycle. For example, the fan speed is 50% duty cycle. In the embodiment of the present invention, the main control chip 20 is a BIOS (Basic In-put Or Output) or a BMC (Baseboard Management Controller, Base Management 099135875 Form No. A0101 Page 5 / Total 12 pages 0992062711-0 201218929 controller). The master wafer 20 is provided with a duty cycle value of the fan 51 and the fan 53 to adjust the rotational speed of the fan 51 and the fan 53, so that the heat dissipation performance of the multi-fan system 50 satisfies the heat dissipation performance requirement of the temperature in the current electronic device. [0010] The master wafer 20 is also capable of acquiring the rotational speed of the fan 51 and the fan 53, and determining whether the fan 51 and the fan 53 are operating normally by the obtained rotational speed. In the embodiment of the present invention, when the fan 51 is abnormally operated, the main control chip 20 resets the duty cycle value of the fan 51 and the fan 53, and adjusts the fan 51 and the fan by the Duty cycle value corresponding to the speed adjustment module 30. The rotational speed of 53 is such that the heat dissipation performance of the fan 51 and the fan 53 is consistent. [0011] The speed adjustment module 30 is electrically connected to the main control chip 20 and the multi-fan system 50. The speed adjustment module 30 receives the Duty cycle value set by the main control chip 20 for the fan 51 and the fan 53, and then according to the set Duty. The cycle value sets the rotational speed of the fan 51 and the fan 53, respectively. In the embodiment of the present invention, the electronic device temperature adjustment device 100 further includes a speed detecting module 40 connected to the main control chip 20 for detecting the rotation speeds of the fan 51 and the fan 53, respectively, and the main control chip 20 is borrowed. The rotational speed of the multi-fan system 50 is obtained by the speed detecting module 40. The speed detecting module 40 is disposed on the main board 90 to connect to the multi-fan system 50 via the main board 90, and transmits the measured speeds of the fan 51 and the fan 53 to the main control chip 20, so that the main control chip 20 determines the fan 51. Whether the fan 53 is operating normally. [0013] The fan 51 and the fan 53 are connected to the main control chip 20 and the speed detecting module 40 by the main board 90. In the embodiment of the present invention, the fan 51 includes two motors 511, the fan 53 includes two motors 531, and the motor 511 and the motor 531 have a maximum of 099135875. Form No. A0101 Page 6 / Total 12 Page 0992062711-0 201218929 Ο [0014] the same. It should be noted that, in general, the two motors 511 of the fan 51 and the two motors 531 of the fan 53 are all operated at the same rotational speed to provide the same heat dissipation performance. However, when one of the fans 51 of the fan 51 is broken and stops rotating, the speed of the fan 51 will be slowed down. At this time, the heat dissipation performance of the fan 51 is 4〇%-6〇% of the heat dissipation performance of the fan 53 operating normally. The wind pressure generated by the fan 53 cannot be resisted, and the fan 53 will be robbed of the wind, eventually causing a heat reflow phenomenon and affecting the heat dissipation effect. In order to solve the above problem, the master wafer 20 will reset the rotational speeds of the motor 511 and the motor 513 to make the heat dissipation performance of the fan 51 and the fan 53 uniform. When the speed detecting module 40 is slid to the stop rotation of one motor 511 of the fan 51, and the other motor 511 and the two motors 533 of the fan 53 are both rotated at the rotational speed set by the master wafer 2, in order to make the fan 51. Consistent with the heat dissipation performance of the fan 53, the normally operating motor 511 of the fan 51 will rotate at full speed, and the two motors 531 of the fan 53 will rotate at substantially half speed. [0015] Ο the electronic device temperature adjustment is set to 100 working thick as follows: when the electronic device temperature adjusting device 100 operates, the temperature detecting unit 10 continuously detects the temperature inside the electronic device temperature adjusting device 100, and This temperature parameter is sent to the master wafer 20. Then, the master wafer 20 sets the duty cycle value of the motor 511 and the motor 513 according to the received temperature parameter, and the speed adjustment module 30 adjusts the rotation speed of the motor 511 and the motor 513 according to the set duty cycle value to make the multi-fan system 50. The heat dissipation performance is consistent and meets the heat dissipation performance requirements of the current temperature. During this process, the speed detecting module 40 continuously detects each motor 511 of the fan 51 and the rotational speed of each motor 51 of the fan 53 and returns the detected rotational speed to the master wafer 2 。 . If the speed detecting module 40 detects that one motor 511 of the fan 51 stops rotating 099135875, the form number A0101 is 7th/12 pages 0992062711-0 201218929, and the other motor 511 and the fan 53 are both controlled. When the wafer 20 is rotated at the rotational speed set, the control module 35 determines that the fan 51 has failed and the fan 53 is operating normally. At this time, the master wafer 2 turns the setting fan 51 to rotate at a full speed of 100% Duty cycle value, and the fan 53 rotates at a Duty cycle value of 4 〇 -6 〇〇. The fan 51 has only one motor 511, and its heat dissipation performance at full speed is the same as that of the fan 53 having two motors 531 rotating at approximately half speed, effectively preventing the occurrence of heat reflow. [0018] It should be understood that the maximum rotational speed of the motor 511 and the motor 513 should be sufficiently large, so that when the fan 51 fails and only one motor 511 is rotated at full speed, the heat dissipation performance of the fan 51 can still satisfy the electric hand. The heat dissipation performance requirement of any temperature under normal working conditions of the device. It should be understood that the number of the motors 511, 513 included in the fan 51 and the fan 53 is not limited to two, and may be three, four or more. When one or several motors 511 in the fan 51 are damaged, the main control chip 2〇 The rotational speeds of the fan 51 and the fan 53 will be reset, respectively, so that the heat dissipation performance of the wind 51 and the wind 53 can be matched. The electronic device temperature adjusting device 100 of the present invention adjusts the rotational speed of the multi-fan system 5〇 according to the temperature in the electronic device by the main control chip 2, and only one motor 511 of the fan 51 is damaged and only When a motor μι is working, the main control chip 20 will re-adjust the rotation speed of the motor 51 丨 and the motor 531 by the speed adjustment module 3 使 to make the heat dissipation performance of the fan 51 and the fan 53 consistent, not only the heat dissipation effect is better, but also effective. Prevent the occurrence of heat backflow. In summary, the present invention complies with the requirements of the invention patent and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, such as 099135875 Form No. 101 0101 Page 8 / Total 12 Page 0992062711-0 [0019] 201218929 Persons familiar with the art of the present invention, etc., in accordance with the spirit of the present invention Modifications or changes shall be covered by the following patents. BRIEF DESCRIPTION OF THE DRAWINGS [0020] FIG. 1 is a schematic view of a preferred embodiment of an electronic device temperature adjusting device of the present invention. [Main component symbol description] [0021] Electronic device temperature adjustment device: 100 [0022] Temperature detection unit: 10 〇 [0023] Master control chip: 20 [0024] Speed adjustment module: 30 [0025] Speed detection module: 40 . [0026] Multi-fan system: 5 0 [0027] Fan: 51, 53 [0028] Motor: 511, 531 〇 [0029] Main board: 90 099135875 Form No. A0101 Page 9 / Total 12 Page 0992062711-0

Claims (1)

201218929 七、申請專利範圍： 1 . 一種電子裝置溫度調節裝置，包括依次電性連接的溫度檢 測單元、主控晶片與多風扇系統，多風扇系統包括若干風 扇，每一風扇包括若干馬達，溫度檢測單元檢測電子裝置 内的溫度，主控晶片根據檢測到的溫度設定風扇的馬達的 轉速，其改良在於：主控晶片還獲取每一風扇的馬達的轉 速，若獲取到其中一個風扇中有馬達轉速為零，主控晶片 重新設定所有風扇的馬達的轉速，使所有風扇的散熱效能 一致。 2. 如申請專利範圍第1項所述之電子裝置溫度調節裝置，其 中每一風扇包括二馬達，主控晶片獲取到風扇的一個馬達 停止旋轉時，主控晶片控制具有停止旋轉的風扇的另一個 馬達全速旋轉，其他正常運轉的風扇的二馬達半速旋轉。 3. 如申請專利範圍第1項所述之電子裝置溫度調節裝置，其 中主控晶片為基本輸入輸出系統或者基板管理控制器。 4 .如申請專利範圍第1項所述之電子裝置溫度調節裝置，其 中電子裝置溫度調節裝置還包括連接至主控晶片與多風扇 系統的速度檢測模組，主控晶片藉由速度檢測模組獲取每 一個馬達的轉速。 5. 如申請專利範圍第1項所述之電子裝置溫度調節裝置，其 中電子裝置溫度調節裝置還包括連接至主控晶片與多風扇 系統的速度調節模組，主控晶片藉由速度調節模組調節每 一個風扇的馬達的轉速。 6. 如申請專利範圍第5項所述之電子裝置溫度調節裝置，其 中主控晶片根據溫度檢測單元檢測到的溫度設定每一個風 099135875 表單編號A0101 第10頁/共12頁 0992062711-0 201218929 扇的馬達的工作週期值，速度調節模組根據設定的工作週 期值對應設定馬達的轉速。 7 .如申請專利範圍第6項所述之電子裝置溫度調節裝置，其 中當主控晶片獲取到其中一個風扇有馬達的轉速為零時， 主控晶片重新設定所有風扇的馬達的工作週期值，速度調 節模組根據設定的工作週期值對應設定每一馬達的轉速。 8 .如申請專利範圍第1項所述之電子裝置溫度調節裝置，其 中電子裝置還包括主板，溫度檢測單元與主控晶片設於主 板上，多風扇系統連接至主板，以藉由主板連接至主控晶 片。 9 .如申請專利範圍第1項所述之電子裝置溫度調節裝置，其 中溫度檢測單元為由感溫元件組成的溫度檢測電路。 099135875 表單編號A0101 第11頁/共12頁 0992062711-0201218929 VII. Patent application scope: 1. An electronic device temperature adjusting device, comprising a temperature detecting unit, a main control chip and a multi-fan system, which are electrically connected in sequence, the multi-fan system comprises a plurality of fans, each fan comprises a plurality of motors, and temperature detection The unit detects the temperature in the electronic device, and the main control chip sets the rotation speed of the motor of the fan according to the detected temperature. The improvement is that the main control chip also acquires the rotation speed of the motor of each fan, and if a motor speed is obtained in one of the fans Zero, the master chip resets the speed of all the fans' motors, so that the heat dissipation performance of all fans is the same. 2. The electronic device temperature adjusting device according to claim 1, wherein each fan comprises two motors, and when the main control chip acquires a motor of the fan to stop rotating, the main control chip controls another fan having a rotation stop One motor rotates at full speed, and the two motors of other normally operating fans rotate at half speed. 3. The electronic device temperature regulating device according to claim 1, wherein the main control chip is a basic input/output system or a substrate management controller. 4. The electronic device temperature adjusting device according to claim 1, wherein the electronic device temperature adjusting device further comprises a speed detecting module connected to the main control chip and the multi-fan system, and the main control chip is driven by the speed detecting module. Get the speed of each motor. 5. The electronic device temperature adjusting device according to claim 1, wherein the electronic device temperature adjusting device further comprises a speed adjusting module connected to the main control chip and the multi-fan system, and the main control chip is controlled by the speed adjusting module. Adjust the speed of the motor of each fan. 6. The electronic device temperature adjusting device according to claim 5, wherein the main control chip sets each wind according to the temperature detected by the temperature detecting unit. 099135875 Form No. A0101 Page 10 / Total 12 Page 0992062711-0 201218929 Fan The working cycle value of the motor, the speed adjusting module correspondingly sets the rotational speed of the motor according to the set working cycle value. 7. The electronic device temperature adjusting device according to claim 6, wherein when the master wafer acquires the rotational speed of one of the fans and the motor is zero, the master wafer resets the duty cycle value of the motors of all the fans. The speed adjustment module sets the rotation speed of each motor according to the set duty cycle value. 8. The electronic device temperature regulating device according to claim 1, wherein the electronic device further comprises a main board, the temperature detecting unit and the main control chip are disposed on the main board, and the multi-fan system is connected to the main board to be connected to the main board by the main board. Master wafer. 9. The electronic device temperature adjusting device according to claim 1, wherein the temperature detecting unit is a temperature detecting circuit composed of a temperature sensing element. 099135875 Form No. A0101 Page 11 of 12 0992062711-0
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