201216127 WP9905-C400-1179 35357twf.doc/n 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種觸控面板以及觸控顯示面板，且 特別是有關於一種可提供收音功能的觸控面板與觸控顯示 面板。 【先前技術】 φ 目前，觸控面板大致可區分為電阻式、電容式、紅外 線式及超音波式等觸控面板’其中以電阻式觸控面板與電 容式觸控面板為最常見的產品。就電容式觸控面板而言， 可多點觸控的特性提供更人性化的操作模式而使得電容式 觸控面板逐漸受到市場的青睞。以電阻式觸控面板而言， 無論使用者以何種介質碰觸觸控面板都可以進行操作，因 而提高了觸控面板的使用便利性。另外，電阻式觸控面板 所需成本較低且電阻式觸控面板技術發展較為成熟，因而 市場佔有率較高。 近年來，各式電子產品都不斷朝向操作簡便、小體積 以及大螢幕尺寸的方向邁進，特別是攜帶式的電子產品對 於體積及螢幕尺寸的要求更為嚴格。因此，許多電子產品 都將觸控面板與液晶顯示面板整合，以省略鍵盤或是操控 按鍵所需的空間，進而使螢幕可配置的面積擴大。 舉例而言，智慧型手機即為一種以異備觸控顯示面板 作為銷售特點的產品。為了提高觸控顯示面板可操作的面 積’這類型產品大多將具備收音功能的麥克風配置於產品 201216127 wr77uj-^*t00-1179 35357twf.doc/n 側面。然而，這樣的設計可能造成手機在收音功能上受 局限。 【發明内容】 本發明提供一種觸控面板，具備收音功能。 本發明提供一種觸控顯示面板，在使用者可碰觸的一 側配置收音晶片以達體積精簡的特點並進-步提升收音效 果。 __本發明提供一種觸控面板，包括一基板、一觸控感測 元件以及一收音晶片。基板具有一透光區以及一周邊區， 其中周邊區圍繞透光區。觸控感測元件配置於基板上。收 音晶片配置於基板上，並位於周邊區中。 本發明另乂供一種觸控顯示面板，包括如前所述之觸 控面板以及一顯示面板。顯示面板配置於基板遠離收音晶 片的一側。 、，基於上述，本發明在觸控面板以及觸控顯示面板的觸 碰面上直接配置收音晶片。如此一來，在不需額外的體積 下，觸控面板及觸控顯示面板即具備觸控感測以及收音的 功能。 為讓本發明之上述特徵和優點能更明顯易懂，下文特 舉實施例，並配合所附圖式作詳細說明如下。 【實施方式】 圖1繪示為本發明一實施例的觸控面板上視示意圖。 201216127 WP9905-C400-1179 35357twf.doc/n 5青參照圖1 ’觸控面板100包括一基板11〇、一觸控感測元 件120以及一收音晶片130。基板no實質上具有一透光 區112以及圍繞於透光區112的一周邊區1丨4，而收音晶 片130則位於周邊區114中。值得一提的是，觸控感= 件120以及收音晶片130皆配置於基板u〇上。因此，觸 控面板100在既有的面積設計下，即具備了觸控感測的功 能以及收音的功能》 ~ 在本實施例中’基板no例如是一覆蓋板，其材質可 9 為聚碳酸酯或是玻璃等透光且具支撐性的材料。收音晶片 130可以在製作元成後採用玻璃_晶粒接合製程(chip Glass，COG)配置於基板110上，或是採用合適的製程直接 製作在基板110上。在此，所謂合適的製程包括有沉積製 程、微影钱刻製程、退火製程等，但本發明不特別地偈限 收音晶片130的製作方式。本實施例將收音晶片13〇直接 配置於基板110上’可以在不增加體積的前提下實現收音 的功月t·。此外，覆蓋板一般為電子產品中最外層的結構， • 本實施例將收音晶片130配置於覆蓋板(也就是基板110) 上更有助於提尚收音晶片130的收音效果。 另外，觸控感測元件120例如包括位在透光區112中 的多條第-感測串列122以及多條第二感測串列124。各 第-感測串列122的第-延伸方向m可以與各第二感測 串列124的第二延伸方向D2相交，甚至彼此垂直。舉例 而言’每一條第一感測串列122可以包括多個第一感測墊 mA以及將l彳墊122A沿第—延伸方向m串接在 35357twf.doc/n 201216127 … ........ W0-1179 一起的第一橋接線122B。相似地，每一條第二感測串列 124可以包括多個第二感測墊124A以及將第二感測墊 124A沿第二延伸方向D2串接在一起的第二橋接線 124B。此外，觸控感測元件12〇可以更包括有配置於周邊 區114中的傳輸線126，以將各感測串列122與124電性 連接至一驅動晶片（未緣示）。 圖2至圖5繪示為圖1的觸控面板的剖面結構之多種 貫施方式。請同時參照圖1與圖2，在本實施例中，觸控 感測元件120與收音晶片13〇例如配置基板】的同一 側’也就疋使用者的手指F可觸碰的一側。由於，手指f 可觸碰的一側為接近使用者的一側，收音晶片可以直 接接受到使用者的聲音而具有理想的收音效果。不過，本 發明不限於此，請同時參照圖丨與圖3，在另一實施方式 中，觸控感測元件120與收音晶片13〇可分別配置於基板 110的相對兩側。值得一提的是，為了具備良好的收音效 果，收音晶片130可配置於使用者的手指F可觸碰的一側。 除此之外，請同時參照圖1與圖4，基板11〇上可設 有一凹槽116，而收音晶片13〇則配置於凹槽116中。同 時，觸控感測元件120可與收音晶片13〇配置於同一側。 在此，凹槽116例如是設置於使用者的手指F可碰觸的一 侧，亦即收音晶片130是配置於基板11〇接近使用者的一 側。當然，在其他實施方式中，基板11〇上可以設置有另 一凹槽（未繪示）以配置觸控感測元件12〇而使觸控面板 100具有平坦的觸碰面。當然，由圖5可知，觸控感測元 201216127 WP9905-C400-U79 35357twf.doc/n 件120可選擇性地配置於基板110遠離使用者的一側，以 使基板110在使用者可碰觸的一側具有平坦的觸碰面。 以上的剖面結構皆示意性地表示觸控感測元件12〇以 及收音晶片130，但具體而言，觸控感測元件12〇的剖面 結構設計可如圖6至圖9所示。圖6至圖9為圖i的觸控 感測元件120沿剖線Ι-Γ以及剖線ΙΙ-ΙΓ所繪示的多種剖面 結構。請先同時參照圖1與圖6，觸控感測元件12〇例如 依照以下步驟加以製作。首先，利用一導電材料(例如透明 導電材料)形成第一感測墊122A、第一橋接線122B以及第 二感測墊124A。然後，形成一絕緣層Π，以覆蓋住第一 感測塾122A、第一橋接線122B以及第二感測塾124A， 其中絕緣層II具有多個暴露出第二感測墊124A的接觸開 口 隨後，於絕緣層η上形成第二橋接線ι24Β以使第 二橋接線124B透過接觸開口 C電性連接第二感測墊 124A。再者’於上述結構上形成另一絕緣層12以保護第 一感測串列122以及第二感測串列124。在另一實施例中， 請同時參照圖1與圖7，本實施例的製作方式與圖6所繪 示的實施例之製作方式大致相同，不過本實施例係以島狀 的絕緣圖案13取代圖6中的絕緣層II，其中絕緣圖案13 設置於第一橋接線122B與第二橋接線124B之間。 此外，請同時參照圖1與圖8，在本實施例中，觸控 感測元件120的製作方式可以是先以金屬或是其他導電材 料形成第一橋接線122B。然後，形成一絕緣層14覆蓋於 基板110上’其中絕緣層14具有多個暴露出各第一橋接線 201216127 wryyio<400-1179 35357twf.doc/n 兩端的綱開口 〇隨後’於絕緣層i4上以透 電材料或其他導電材料形成第1測墊122A、第二感測塾 124A以及第二橋接線124B。此時，第一感測垡122 透過接觸開口 c連接至第-橋接線122B以構成第一 串列122。之後’可於上述結構上形成—絕緣層i2以保護 第一感測串列122以及第二感測串列124。當麸，迷來照 圖9,可以利用島狀的絕緣圖案15來取代前述“ς層、 14，其中絕緣圖案15設置於第一橋接線122Β與第二 線124Β之間。 、一 另一方面，圖1所繪示的收音晶片13〇例如是一駐極 體電容式收音晶片。圖10繪示了圖丨之收音晶片的上視示 意圖，而圖11與圖12分別繪示了圖丨之收音晶片沿著剖 線III-III’以及剖線IV-IV，的剖面示意圖。請同時參照圖 10、11以及12 ’收音晶片130包括一矽基底131、一控制 電晶體133、一浮置閘極駐極體135、一隔板137以及一擋 牆139。控制電晶體133配置於矽基底131上，且控制^ 晶體133包括一控制閘極G、一源極S以及一沒極D，其 中源極S與沒極D設置於石夕基板131中，控制閘極Q位於 矽基板131上’且源極S與汲極D位於控制閘極g的相對 兩側。 浮置閘極駐極體135包括位於控制閘極g與石夕基板 131之間的一第一部位135A以及懸浮於石夕基板131上的一 第一部位135B。隔板137配置於梦基板131上。擔牆139 配置於矽基板131與隔板137之間，以將浮置閘極駐極體 201216127 WP9905-C400-1179 35357twf.doc/n 135包覆於石夕基板131與隔板137之間。具體而言，控制 電晶體133還可包括一絕緣層16以及一絕緣結構17,其中 絕緣層16可以隔離浮置閘極駐極體135與矽基板131，而 絕緣結構17用以隔離控制閘極〇以及浮置閘極駐極體 135。 經過控制電晶體133的操作可以使浮置閘極駐極體 135具有電極性。由圖12可知，浮置閘極駐極體135的第 二部份135B懸浮於矽基板131與隔板137之間。當聲波 傳遞至收音晶片130時，懸浮的第二部份135B可隨聲波 震動。此時，第二部份135B與矽基板131之間的電容值 將隨之改變’而可做為聲音的判別。在一實施例中，收音 晶片130可連接至一放大器（未繪示）以將其產生的訊號放 大而有利於進行聲波的識別。當然，上述内容僅是舉例說 明收音晶片130的一種實施方式，並非用以限定本發明。 圖13繪示為本發明一實施例的觸控顯示面板示意 圖。請參照圖13，觸控顯示面板2〇〇包括了前述的觸控面 板100以及一顯示面板210。其中觸控面板1〇〇的收音晶 片130與顯示面板210分別位於基板11〇的相對兩側。在 本實施例中，收音晶片130所在一側係為接近使用者的— 側，所以收音晶片130可以具有理想的收音效果。另外’ 使用觸控顯示面板200的電子裝置可以省略額外設置收音 元件所需體積而有助於縮減整體體積大小。 綜上所述，本發明將收音晶片配置於觸控面板以及觸 控顯示面板接近使用者的一側。因此，收音晶片可具有理 201216127 WKyyuD-c4〇0-H79 35357twf.doc/n ==二Γ，收音晶片的配置不會造成整體體積 的增加而有助於達到體積精簡的需求。 谓 本發已以實施例揭露如上’然其並非用以限定 本發日:之二中具有通常知識者，在不脫離 發明之保護範圍作些許之更糊飾，故本 乾圍田視_之中請專利範_界定者為準。 【圖式簡單說明】 示為本發明—實關_控面板上視示意圖。 實施方式。圖5繪不為圖1的觸控面板的剖面結構之多種 圖6 $国 圖9為圖1的觸控感測元件沿剖線I-Γ以及剖 線1Μ所_的多種剖面結構。 .1 广會示了圖1之收音晶片的上視示意圖。 圖1夂4線IV-IV，的剖面示意圖。 3繪不為本發明一實施例的觸控顯示面板示意圖。 【主要元件符號說明】 110 112 114 120 100 :觸控面板 基板 透光區 周邊區 觸控感測元件 201216127 WP9905-C400-1179 35357twf.doc/n 122 :第一感測串列 122A :第一感測墊 122B :第一橋接線 124 :第二感測串列 124A :第二感測墊 124B :第二橋接線 126 :傳輸線 130 :收音晶片 • 131 :矽基板 133 :控制電晶體 135:浮置閘極駐極體 135A :第一部份 135B :第二部份 137 :隔板 139 :擋牆 200 :觸控顯示面板 φ 210 :顯示面板… C:接觸開口 D :汲極 D1 :第一延伸方向 D2 :第二延伸方向 F :手指 G :控制閘極 Ι-Γ、ΙΙ-ΙΓ、ΙΙΙ-ΙΙΓ、IV-IV’ ：剖線 11 201216127 wpyy〇5-c400-1179 35357twf.doc/n II、12、14、16 :絕緣層 13、15 :絕緣圖案 16 :絕緣結構 S :源極201216127 WP9905-C400-1179 35357twf.doc/n VI. Description of the Invention: [Technical Field] The present invention relates to a touch panel and a touch display panel, and more particularly to a touch capable of providing a radio function Control panel and touch display panel. [Prior Art] φ At present, touch panels can be roughly classified into resistive, capacitive, infrared, and ultrasonic touch panels. Among them, resistive touch panels and capacitive touch panels are the most common products. In the case of a capacitive touch panel, the multi-touch feature provides a more user-friendly operation mode, and the capacitive touch panel is gradually favored by the market. In the case of a resistive touch panel, no matter which medium the user touches the touch panel, the operation can be performed, thereby improving the convenience of use of the touch panel. In addition, the resistive touch panel requires lower cost and the resistive touch panel technology is more mature, resulting in a higher market share. In recent years, various electronic products have been moving toward simple operation, small size, and large screen size. In particular, portable electronic products have stricter requirements on volume and screen size. Therefore, many electronic products integrate the touch panel with the liquid crystal display panel to omit the space required for the keyboard or the control buttons, thereby expanding the configurable area of the screen. For example, a smart phone is a product with a special touch display panel as a sales feature. In order to improve the area that the touch display panel can operate, most of the products of this type are equipped with a microphone with a radio function on the side of the product 201216127 wr77uj-^*t00-1179 35357twf.doc/n. However, such a design may cause the phone to be limited in its radio function. SUMMARY OF THE INVENTION The present invention provides a touch panel having a sound collecting function. The present invention provides a touch display panel in which a radio chip is disposed on a side touched by a user to achieve a compact size and further improve the sound receiving effect. The invention provides a touch panel comprising a substrate, a touch sensing component and a sound receiving chip. The substrate has a light transmissive area and a peripheral area, wherein the peripheral area surrounds the light transmissive area. The touch sensing component is disposed on the substrate. The radio chip is disposed on the substrate and located in the peripheral area. The present invention further provides a touch display panel comprising a touch panel as described above and a display panel. The display panel is disposed on a side of the substrate away from the sound collecting wafer. Based on the above, the present invention directly disposes the radio wafer on the touch surface of the touch panel and the touch display panel. In this way, the touch panel and the touch display panel have the functions of touch sensing and sound collection without additional volume. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. Embodiments FIG. 1 is a schematic top view of a touch panel according to an embodiment of the invention. 201216127 WP9905-C400-1179 35357twf.doc/n 5 Green Referring to FIG. 1 'The touch panel 100 includes a substrate 11A, a touch sensing element 120, and a sound receiving chip 130. The substrate no has substantially a light transmissive region 112 and a peripheral region 1丨4 surrounding the light transmissive region 112, and the sound collecting wafer 130 is located in the peripheral region 114. It is worth mentioning that the touch sensing device 120 and the radio chip 130 are disposed on the substrate u〇. Therefore, the touch panel 100 has the functions of touch sensing and the function of sound pickup under the existing area design. In the present embodiment, the substrate is, for example, a cover plate, and the material thereof can be polycarbonate. A light-transmissive and supportive material such as ester or glass. The radio chip 130 can be disposed on the substrate 110 by using a glass chip (COG) after fabrication, or can be directly fabricated on the substrate 110 by a suitable process. Here, the so-called suitable process includes a deposition process, a micro-etching process, an annealing process, and the like, but the present invention does not particularly limit the manner in which the sound-receiving wafer 130 is fabricated. In this embodiment, the sound receiving chip 13 is directly disposed on the substrate 110. The power of the sound can be realized without increasing the volume. In addition, the cover plate is generally the outermost structure of the electronic product. In this embodiment, the arrangement of the sound receiving chip 130 on the cover plate (that is, the substrate 110) is more helpful for improving the sound collection effect of the sound receiving chip 130. In addition, the touch sensing component 120 includes, for example, a plurality of first-sensing strings 122 and a plurality of second sensing series 124 located in the light-transmitting region 112. The first extending direction m of each of the first sensing series 122 may intersect the second extending direction D2 of each of the second sensing series 124, or even perpendicular to each other. For example, each of the first sensing series 122 may include a plurality of first sensing pads mA and serially connect the first pads 122A along the first extending direction m at 35357 twf.doc/n 201216127.. ... W0-1179 The first bridge connection 122B. Similarly, each of the second sensing series 124 can include a plurality of second sensing pads 124A and a second bridge 124B that connects the second sensing pads 124A in series along the second extending direction D2. In addition, the touch sensing component 12A may further include a transmission line 126 disposed in the peripheral region 114 to electrically connect the sensing series 122 and 124 to a driving wafer (not shown). 2 to 5 illustrate various aspects of the cross-sectional structure of the touch panel of FIG. 1. Referring to FIG. 1 and FIG. 2 simultaneously, in the present embodiment, the touch sensing element 120 and the sound receiving chip 13 are disposed on the same side of the substrate, for example, on the side where the user's finger F can be touched. Since the touchable side of the finger f is the side close to the user, the radio film can directly receive the user's voice and has an ideal sound collection effect. However, the present invention is not limited thereto. Referring to FIG. 3 and FIG. 3 simultaneously, in another embodiment, the touch sensing component 120 and the sound receiving chip 13A may be disposed on opposite sides of the substrate 110, respectively. It is worth mentioning that in order to have a good sound collection effect, the radio chip 130 can be disposed on the side of the user's finger F that can be touched. In addition, referring to FIG. 1 and FIG. 4 simultaneously, a groove 116 may be disposed on the substrate 11 and the sound receiving chip 13 is disposed in the groove 116. At the same time, the touch sensing element 120 can be disposed on the same side as the sound receiving chip 13A. Here, the groove 116 is disposed, for example, on the side where the finger F of the user can be touched, that is, the sound receiving chip 130 is disposed on the side of the substrate 11 that is close to the user. Of course, in other embodiments, another recess (not shown) may be disposed on the substrate 11 to configure the touch sensing component 12 to have the flat touch surface of the touch panel 100. Of course, as shown in FIG. 5, the touch sensing element 201216127 WP9905-C400-U79 35357twf.doc/n 120 can be selectively disposed on the side of the substrate 110 away from the user, so that the substrate 110 can be touched by the user. One side has a flat touch surface. The above cross-sectional structures schematically represent the touch sensing element 12 and the sound receiving chip 130. However, the cross-sectional structure design of the touch sensing element 12A can be as shown in FIGS. 6 to 9. 6 to 9 are various cross-sectional structures of the touch sensing element 120 of FIG. 1 taken along a line Ι-Γ and a line ΙΙ-ΙΓ. Referring to FIG. 1 and FIG. 6 simultaneously, the touch sensing element 12 is fabricated, for example, according to the following steps. First, a first sensing pad 122A, a first bridge line 122B, and a second sensing pad 124A are formed using a conductive material such as a transparent conductive material. Then, an insulating layer 形成 is formed to cover the first sensing 塾 122A, the first bridge line 122B and the second sensing 塾 124A, wherein the insulating layer II has a plurality of contact openings exposing the second sensing pad 124A, and then A second bridge wire ι24Β is formed on the insulating layer η to electrically connect the second bridge wire 124B to the second sensing pad 124A through the contact opening C. Further, another insulating layer 12 is formed on the above structure to protect the first sensing series 122 and the second sensing series 124. In another embodiment, referring to FIG. 1 and FIG. 7 simultaneously, the manufacturing method of the embodiment is substantially the same as the embodiment of the embodiment shown in FIG. 6, but the embodiment is replaced by an island-shaped insulating pattern 13. Insulation layer II in FIG. 6, wherein the insulation pattern 13 is disposed between the first bridge line 122B and the second bridge line 124B. In addition, referring to FIG. 1 and FIG. 8 simultaneously, in the embodiment, the touch sensing component 120 can be formed by first forming a first bridge wire 122B with a metal or other conductive material. Then, an insulating layer 14 is formed to cover the substrate 110. The insulating layer 14 has a plurality of opening openings exposing the ends of each of the first bridge wires 201216127 wryyio <400-1179 35357twf.doc/n, and then 'on the insulating layer i4 The first pad 122A, the second sensing pad 124A, and the second bridge 124B are formed of a dielectric material or other conductive material. At this time, the first sensing unit 122 is connected to the first bridge line 122B through the contact opening c to constitute the first series 122. The insulating layer i2 may be formed on the above structure to protect the first sensing series 122 and the second sensing series 124. When the bran is shown in Fig. 9, an island-shaped insulating pattern 15 may be used instead of the aforementioned "layer" 14, wherein the insulating pattern 15 is disposed between the first bridge line 122 and the second line 124A. The sound receiving chip 13 shown in FIG. 1 is, for example, an electret condenser type sound collecting chip. FIG. 10 is a top view of the sound collecting chip of the drawing, and FIG. 11 and FIG. 12 respectively illustrate the drawing. A cross-sectional view of the sound receiving wafer along the line III-III' and the line IV-IV. Referring also to Figures 10, 11 and 12, the sound receiving chip 130 includes a substrate 131, a control transistor 133, and a floating gate. a pole electrode 135, a partition plate 137 and a retaining wall 139. The control transistor 133 is disposed on the crucible base 131, and the control crystal 133 includes a control gate G, a source S and a gate D, wherein The source S and the gate D are disposed in the Shishi substrate 131, the control gate Q is located on the germanium substrate 131, and the source S and the drain D are located on opposite sides of the control gate g. The floating gate electret 135 includes a first portion 135A between the control gate g and the Shixi substrate 131 and suspended in Shi Xiji A first portion 135B on the 131. The spacer 137 is disposed on the dream substrate 131. The support wall 139 is disposed between the germanium substrate 131 and the spacer 137 to float the gate electret 201216127 WP9905-C400-1179 35357twf The .doc/n 135 is coated between the Shishi substrate 131 and the spacer 137. Specifically, the control transistor 133 may further include an insulating layer 16 and an insulating structure 17, wherein the insulating layer 16 can isolate the floating gate The electret 135 and the germanium substrate 131, and the insulating structure 17 is used to isolate the control gate 〇 and the floating gate electret 135. The operation of the control transistor 133 can make the floating gate electret 135 have an electrode property. As can be seen from Fig. 12, the second portion 135B of the floating gate electret 135 is suspended between the germanium substrate 131 and the spacer 137. When the sound waves are transmitted to the sound collecting chip 130, the suspended second portion 135B can follow Acoustic vibration. At this time, the capacitance value between the second portion 135B and the germanium substrate 131 will change accordingly' as a sound discrimination. In an embodiment, the sound collecting chip 130 can be connected to an amplifier (not drawn It is shown that the signal generated by the signal is amplified to facilitate the recognition of the sound wave. Of course, the above description is only an example of a radio display chip 130, and is not intended to limit the present invention. Figure 13 is a schematic diagram of a touch display panel according to an embodiment of the present invention. Referring to Figure 13, the touch display panel 2 The touch panel 100 and the display panel 210 are included, wherein the sound receiving chip 130 and the display panel 210 of the touch panel 1 are respectively located on opposite sides of the substrate 11 . In the embodiment, the sound receiving chip 130 The side is close to the side of the user, so the radio chip 130 can have an ideal sound collection effect. Further, the electronic device using the touch display panel 200 can omit the additional volume required for the sound pickup element to help reduce the overall volume. In summary, the present invention arranges the radio chip on the touch panel and the side of the touch control panel that is close to the user. Therefore, the radio chip can have the same 201216127 WKyyuD-c4〇0-H79 35357twf.doc/n == two, and the configuration of the radio chip does not cause an increase in the overall volume and contributes to the demand for volume reduction. It is said that the present invention has been disclosed in the above embodiments. However, it is not intended to limit the ordinary knowledge of the present day: the second one has a little more ambiguity without departing from the scope of protection of the invention. The patent scope is defined as the standard. [Simple description of the diagram] It is shown as a schematic view of the invention - the actual control panel. Implementation. FIG. 5 illustrates a plurality of cross-sectional structures of the touch panel of FIG. 1. FIG. 9 is a cross-sectional view of the touch sensing element of FIG. 1 along a line I-Γ and a section line 。. .1 The general view of the radio chip of Figure 1 is shown. Figure 1夂4 is a schematic cross-sectional view of line IV-IV. 3 is a schematic diagram of a touch display panel according to an embodiment of the invention. [Main component symbol description] 110 112 114 120 100 : touch panel substrate transparent area peripheral area touch sensing element 201216127 WP9905-C400-1179 35357twf.doc/n 122: first sensing series 122A: first sense Test pad 122B: first bridge wire 124: second sense series 124A: second sense pad 124B: second bridge wire 126: transmission line 130: radio chip • 131: 矽 substrate 133: control transistor 135: floating Gate electret 135A: first part 135B: second part 137: partition 139: retaining wall 200: touch display panel φ 210: display panel... C: contact opening D: drain D1: first extension Direction D2: Second extension direction F: Finger G: Control gate Ι-Γ, ΙΙ-ΙΓ, ΙΙΙ-ΙΙΓ, IV-IV': Section 11 201216127 wpyy〇5-c400-1179 35357twf.doc/n II, 12, 14, 16: Insulation Layer 13, 15: Insulation Pattern 16: Insulation Structure S: Source
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