TW201211694A - Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for producing printed wiring board - Google Patents

Abstract

A photosensitive resin composition comprises a binder polymer (component A), a polymerizable monomer which has at least one ethylenically unsaturated bond (component B), and a photopolymerization initiator (component C). The component B comprises a compound represented by the following Formula (I). In Formula (I), R1 represents a divalent organic group and R2 represents a group represented by the following Formula (II). R3 represents a hydrogen atom or a methyl group, X represents an alkylene group and n represents an integer from 0 to 25.

Description

[Technical Field] The present invention relates to a photosensitive resin composition, a photosensitive element using the same, a method for producing a photoresist pattern, and a method for producing a printed wiring board. [Prior Art] Conventionally, in the field of manufacturing printed wiring boards, as a photoresist material for etching treatment, plating treatment, and the like, a photosensitive resin composition and a support and a protective film thereof have been widely used. In the obtained photosensitive element, the printed wiring board is formed by laminating the photosensitive element on the circuit-forming substrate, and after exposing it to a pattern, the unexposed portion is removed by the developing solution to form a resist pattern, which is used as a mask. After the mask is subjected to an etching treatment or a plating treatment to form a circuit, the mask is peeled off from the substrate to remove the hardened portion. From the standpoint of environmental and safety, the developer for use as a photoresist for removing the unexposed portion is a main stream using an alkali-developing type such as sodium carbonate. The developer can be used as long as it has a certain ability to dissolve the photosensitive resin composition layer, and the photosensitive resin composition is dissolved or dispersed in the developer at the time of development. Here, when the through hole provided in the circuit formation substrate is covered with the photoresist film, the photosensitive resin composition to be used is required to have a photoresist film covering the through hole without being sprayed by the developer or the water. The cover hole which is broken by pressure, that is, has the reliability of the cover hole. A photosensitive resin composition containing a difunctional monomer or a trifunctional monomer having a urethane bond (-5-201211694) has been proposed as a photosensitive resin composition having excellent cover hole reliability (for example, refer to Patent Document 1) And 2). Further, a photosensitive resin composition of a polycaprolactone-modified isocyanuric acid ring monomer is also disclosed (for example, see Patent Document 3). [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei No. 2001-117224 (Patent Document No. JP-A-2001-117224). However, the photosensitive resin composition containing a difunctional monomer having a urethane bond described in Patent Documents 1 and 2 may not have sufficient capping reliability, and may contain an amine. A photosensitive resin composition of a trifunctional monomer having a urethane bond may be such that the cured film is easily hardened and becomes brittle. Further, the photosensitive resin composition described in Patent Document 3 needs to be further improved in resolution. The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a photosensitive resin composition which is excellent in resolution and excellent in mechanical strength of a cured film and has flexibility, that is, a photosensitive resin excellent in lid hole reliability. A composition, a photosensitive element using the same, a method for producing a photoresist pattern, and a method for producing a printed wiring board. -6- 201211694 [Means for Solving the Problem] The first aspect of the present invention is a photosensitive resin composition containing the following components: (A) component: binder polymer '(B) component: having at least one ethylene The polymerizable compound of the unsaturated bond, and the component (C): a photopolymerization initiator, and the component (B) contains a compound represented by the following formula (I): [Chem. 1] 〇R1 - N - C Ο一R2. Vr 〇 R2 - 0 - N_R1 丨, j^N, R1 - N - jj_0_R2 η II Η (I) (wherein R1 represents a divalent organic group, and R2 represents a group represented by the following formula (II)), R3 ~ -C - C--CH〇 (wherein R3 represents a hydrogen atom or a methyl group, X represents an alkylene group, and η represents an integer of 1〇~2 5 ). When the photosensitive resin composition contains the compound represented by the above formula (I), the lid hole reliability and the resolution can be improved. And a second aspect of the present invention is a photosensitive resin composition comprising the following components: (Α) component: a binder polymer, (Β) component: a polymerizable compound having at least one ethylenically unsaturated bond, And (C) component: 201211694 Photopolymerization starter', and the component (B) contains a reaction product of a compound represented by the following formula (ΠΙ) and a compound represented by the following formula (IV), [Chem. 3] ΗΟ +χ—seven § R3 I 'C=CH2 (III) η represents 1〇~25 (wherein R represents a hydrogen atom or a methyl group, and χ represents an integer of an alkyl group), [Chemical 4]

-NCO OCN-R

(IV) (wherein R1 represents a divalent organic group). By allowing the photosensitive resin composition to contain the reaction product of the ureidolation reaction of the above formula (III) and the above formula (IV), the reliability and resolution of the cap hole can be improved. Further, a third aspect of the invention is a photosensitive element comprising a support and a photosensitive resin layer, wherein the photosensitive resin layer is a coating film of the photosensitive resin composition formed on the support. Further, a fourth aspect of the present invention is a method for producing a resist pattern having a photosensitive resin layer formed by forming a photosensitive resin layer of a coating film of the photosensitive resin composition on a substrate for forming a circuit. a step of exposing at least a part of the photosensitive resin layer to an active portion and photocuring the exposed portion; and a developing step of removing an uncured portion of the photosensitive resin layer from the circuit-forming substrate by development. Further, a fifth aspect of the present invention is a printing method comprising the steps of: forming a conductor pattern by processing a substrate for forming a circuit having a photoresist pattern formed by the photoresist. [Effect of the Invention] According to the present invention, it is possible to provide a photosensitive resin composition which is excellent in resolution, excellent in strength, and excellent in sensitivity, and a photosensitive resin composition excellent in composition reliability, a method for producing a photoresist pattern, and a printed wiring board. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail. Further, "acrylic" means acrylic acid and its corresponding methacrylate means acrylate and its corresponding methyl) acryloyl group means acrylonitrile group and its corresponding. In addition, in this specification, the term "step" is used. Even the expected effects of steps that are not clearly distinguishable from other steps are included in this term. The range of numbers represented by "~" indicates that the number of the included points is the minimum 値 and the maximum 値 range. In the case of the amount of each component in the composition and composition, when the substance is composed of each component, the total amount of the plurality of substances in the composition is not particularly limited. The manufacturing method of the wiring board is the manufacturing method of the pattern type. The etching process or the plating place is a method of manufacturing the photosensitive element which simultaneously cures the film, that is, the photosensitive element which can be used for the cover hole. In the present invention (methacrylic acid, (meth) acrylate, (methyl methacryl fluorenyl group), as long as it is not only an independent step, but also in the present specification, the "~" is not described in this specification. In the present specification, the presence of a plurality of equivalents means that it is present in Group-9-201211694 <Photosensitive Resin Composition> The photosensitive resin composition of the present invention contains (A) component: a binder polymer, (B) component: a polymerizable compound having at least one ethylenically unsaturated bond, and (C) component: a photosensitive resin composition of a photopolymerization initiator, wherein the component (B) contains the following formula (I) a reaction product of a compound represented by the following formula (III) or a amide grouping reaction of a compound represented by the following formula (IV) [Chemical Formula 1]

In the general formula (I) and the general formula (II), R1 represents a divalent organic group, and R2 represents a group represented by the above formula (II). R3 represents a hydrogen atom or a methyl group, X represents an alkylene group, and η represents an integer of from 1 to 25 nm. [Chemical 2]

In the general formula (III) and the general formula (IV), R3, X and η are respectively synonymous with R3, X and η in the above formula (II), and R1 has the same meaning as R1 in the formula (I). -10-201211694 The photosensitive resin composition which is excellent in the reliability and the resolution of the capping of the above-mentioned specific compound as a polymerizable compound is suitable for the production of a micro-electric multilayer printed wiring board. Suitable for cover holes. [Component (B): a polymer having at least one ethylenically unsaturated bond] The photosensitive resin composition of the present invention contains (B) a compound represented by the above formula (I) or the above formula (shown as The reaction product of the amination reaction of the compound and the compound represented by the above formula (IV) is an essential component. In the above formula (I) and formula (IV), R1 represents a diyl group. The organic group is not particularly limited as long as it contains a carbon atom and can be an isocyanurate ring and a guanamine group, and examples thereof include an alkylene group having 1 to 10 carbon atoms and an extended aryl group having 6 to 10 carbon atoms. The alkylene group of 1 to 10 may be linear or branched. The three R1 in the general formula (I) and the general formula (IV) may be the same as the above, and the carbon number is 1 to 1 〇. The alkyl group, specifically, a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an extended pentyl group, a neopentyl group, a hexyl group, a heptyl group, and a octyl group. a 2-hexyl group, a fluorene group, and a fluorene group. Examples of the carbon number of 6 to 10 are extended to give a phenyl group, etc. The nature of the compound is III). The exoformate valence is organic enough to be linked to, for example, the above carbon. Further, for example, a butylene group, an ethyl group, and an exo group can be used. -11 - 201211694 In the present invention, the reliability and resolution of the cap hole are obtained. From the standpoint of view, R1 is preferably an alkylene group having a carbon number of 2 to 10, more preferably an alkylene group having a carbon number of 3 to 8. The three R2 in the above formula (I) may be the same or different from each other. In the above formula (Π) and formula (III), X represents an alkylene group. The carbon number of the alkylene group is not particularly limited, but from the viewpoint of the reliability and resolution of the cap hole, it is preferably an alkylene group having 2 to 7 carbon atoms, more preferably an alkylene group having 2 to 4 carbon atoms. Specific examples of the alkylene group in X include an ethyl group, a propyl group, a butyl group, a pentyl group and a hexyl group. Further, the above alkylene group may be linear or branched. Further, 10 or more Xs in the general formula (Π) may be the same or different from each other, and are preferably the same as each other. Further, η represents an integer of 10 to 25, but is preferably 15 to 25 from the viewpoint of the reliability and strength of the lid hole. The compound represented by the above formula (I) can be produced, for example, by an esterification reaction of a compound represented by the following formula (III) with a compound represented by the following formula (IV). The reaction conditions are not particularly limited as long as it is a reaction condition in which a urethane bond is usually formed, and a reaction can be suitably carried out using a catalyst or the like. [Chemical 5]

R1-NCO

OCN-π k1 - NCO ο (IV) R3, X and η are respectively synonymous with R3, X and η in the above formula (Π), and the preferred forms are also the same. Further, R 1 is synonymous with R 1 in the formula (I), and the preferred form of -12-201211694 is also the same. The compound represented by the formula (I) is a compound obtained by subjecting a compound represented by the formula (III) of three molecules to an addition reaction of three isocyanate groups of the compound represented by the formula (IV). The reaction product of the compound represented by the above formula (III) and the compound represented by the above formula (IV) may contain one molecule or two molecules in addition to the compound represented by the formula (I). A compound produced by the addition reaction of a compound represented by III) with a compound represented by the formula (IV). In addition, reaction products other than these may also be included. The content of the compound represented by the formula (I) contained in the reaction product of the compound represented by the above formula (III) and the compound represented by the above formula (IV) is particularly limited. From the viewpoint of the reliability and strength of the lid hole, it is preferably 15% by mass or more, more preferably 25% by mass or more. In the photosensitive resin composition, the content of the reaction product of the compound represented by the above formula (I), the compound represented by the above formula (III) and the compound represented by the above formula (IV) is not particularly high. limit. From the viewpoint of the reliability of the lid hole, the mechanical strength of the cured film, and the flexibility, it is preferably from 1% by mass to 25% by mass, more preferably from 5% by mass to 20% by mass, based on the photosensitive resin composition.

In the photosensitive resin composition, the compound represented by the above formula (I) or the compound represented by the above formula (ΠΙ) and the compound represented by the above formula (IV) are reacted as the component (B). The product preferably contains 1% by mass to 25% by mass of a compound having 1 to 10 carbon atoms, X is an alkylene group having 2 to 4 carbon atoms, and η is 10 to 25; The reaction product of the compound represented by (I-13-201211694) or the compound represented by the above formula (III) and the compound represented by the above formula (IV) preferably further contains 5 mass% to 20 mass% of 1^. X is a compound having a carbon number of 2 to 4 and an alkyl group of 15 to 25. Further, the reaction product of the compound represented by the above formula (I) or the compound represented by the above formula (ΙΠ) and the compound represented by the above formula (IV) as an essential component of the (Β) component in the present invention. In addition, a polymerizable compound having at least one ethylenically unsaturated bond (hereinafter sometimes referred to as "other polymerizable compound") may be contained. Examples of the other polymerizable compound include a compound obtained by subjecting α,β-unsaturated tannic acid to a condensation reaction with a polyhydric alcohol, and addition of α,β-unsaturated tannic acid to a glycidyl group-containing compound. a compound, an alkyl ester of (meth)acrylic acid, a phthalic acid ester of a (meth)acrylic acid derivative, a (meth) acrylate compound having a urethane bond, and a bisphenol A system (Methyl) propyl vinegar compound. The compound which is obtained by subjecting the α,β-unsaturated carboxylic acid to the condensation reaction of the polyhydric alcohol as described above may, for example, be a polyethylene glycol di(meth)acrylate having a number of ethylene oxide groups of 2 to 14 and Polypropylene glycol di(meth)acrylate having a number of propoxy groups of 2 to 14 and polyethylene glycol polypropylene glycol having a number of 2 to 14 ethoxy groups and 2 to 14 groups of propoxy groups Methyl)propene; 13⁄4 acid vinegar, trimethylolpropane di(meth) acrylate, trimethylol propyl tris(meth) acrylate, trimethylolpropane ethoxylated tris(A) Acrylic acid ester, trimethylolpropane diethylene oxide tris(methyl) propyl sulphate, trimethylolpropane trisethoxy ethoxy tris(methyl) acrylate, -14 - 201211694 Propane tetraethylene ethoxy tri(meth) acrylate, trimethylolpropane pentaethoxy ethoxy tri(meth) acrylate, tetramethylol methane tri(meth) acrylate, tetramethylol Methane tetra (meth) acrylate, dipentaerythritol penta (meth) acrylate, and dipentaerythritol hexa (meth) acrylate. The compound obtained by adding the α,β-unsaturated carboxylic acid to the glycidyl group-containing compound may, for example, be bisphenol quinone dioxyethylidene di(meth)acrylate or bismuth A trioxane. Bisphenol A polyoxyalkylene di(meth)acrylate, trimethylolpropane triglycidyl, such as ethyl di(meth)acrylate, bisphenol A decaxenethyl di(meth)acrylate A (meth) acrylate adduct of ether and a (meth) acrylate adduct of bisphenol A diglycidyl ether. Examples of the alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate. Wait. Examples of the phthalic acid ester of the (meth)acrylic acid derivative include γ-chloro-β-hydroxypropyl·β′-(meth)acryloxyethyl-phthalate. --hydroxyethyl (meth) propylene oxiranyl ethyl phthalate and β-hydroxypropyl·β'·(meth) propylene methoxyethyl phthalate . Examples of the (meth) acrylate compound having a urethane bond include a (meth)acrylic acid derivative having a fluorenyl group at the β-position, isophorone diisocyanate, and 2,6-toluene diisocyanate. -15-201211694 addition reaction product of diisocyanate compound such as 2,4-toluene diisocyanate or 1,6-hexamethylene diisocyanate, tris((meth)acryloxytetramethylene isocyanate) Methyl isocyanurate, EO-modified urethane di(meth)acrylate, and EO, PO-modified urethane di(meth)acrylate, and the like. Further, Ε Ο represents ethylene oxide, and the ruthenium-modified compound has a block structure of an ethoxy group. Further, PO represents propylene oxide, and the PO-modified compound has a block structure in which a propoxy group is extended. The EO-modified urethane di(meth)acrylate may, for example, be a product name UA-1 1 manufactured by Shin-Nakamura Chemical Industry Co., Ltd. Further, as EO and PO-modified urethane di(meth)acrylate, for example, the product name UA-13 manufactured by Shin-Nakamura Chemical Industry Co., Ltd. can be cited. Examples of the bisphenol A-based (meth) acrylate compound include 2,2-bis(4-((meth) propylene oxy) ethoxy) phenyl) propane, 2,2-double. (4-((Methyl)propenyloxypolypropoxy)phenyl)propane and 2,2-bis(4-((meth)propenyloxy)polyethoxylated polypropoxyl Phenyl)propane, etc. These may be used singly or in combination of two or more. In the above, from the viewpoint of chemical resistance, at least one of a bisphenol A-based (meth) acrylate compound and a (meth)acrylic acid derivative phthalate is preferably contained. Contains both. The content of the other polymerizable compound is not particularly limited, but is preferably 50% by mass to 90% by mass based on 100% by mass of the total amount of the component (B), from the viewpoint of the reliability of the cap hole and the resolution. The content of the polymerizable compound having at least one ethylenically unsaturated bond in the above (B) is preferably from 60% by mass to 80% by mass in the range of (A) and (B). The total amount of 100% by mass is set to 20% by mass to 60% by mass, and more preferably 30% by mass to 55% by mass. When the content is 20% by mass or more, the light sensitivity is improved, and the softening property of the cured film tends to be improved by making it 60% by mass or less. [Component (A): Binder Polymer] The (A) component: the binder polymer which can be used in the present invention, examples thereof include an acrylic resin, a styrene resin, an epoxy resin, and a guanamine resin. A guanamine epoxy resin, an alkyd resin, a phenol resin, or the like. From the standpoint of alkali developability, an acrylic resin is preferred. The above resins may be used alone or in combination of two or more. The above (A) binder polymer can be produced, for example, by radical polymerization of a polymerizable monomer. The polymerizable monomer may, for example, be a polymerizable styrene derivative or a diacetone propylene substituted at the α-position or the aromatic ring, such as a biphenyl, an ethylbenzene or an α-methylstyrene. Esters of vinyl alcohols such as decylamine, acrylonitrile, and vinyl-n-butyl ether, alkyl (meth)acrylate, benzyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate , dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, glycidyl (meth)acrylate, 2,2,2-trifluoroethyl (meth)acrylate, 2,2,3,3-tetrafluoropropyl (meth)acrylate, (meth)acrylic acid, α-bromoacrylic acid, α-chloroacrylic acid, β-furyl (meth)acrylic acid, β-styryl ( Methyl)acrylic acid, 201211694 maleic acid, maleic anhydride, monomethyl maleate, monoethyl maleate, monoisopropyl maleate, maleic acid monoester, fumaric acid, cinnamic acid, alpha - cyano cinnamic acid, itaconic acid, crotonic acid, and propiolic acid. These may be used alone or in combination of two or more. The alkyl (meth)acrylate may, for example, be a compound represented by the following formula (V): h2c = c(r6)-coor7 (V) [In the formula (V), R6 represents a hydrogen atom or a The group, R7 represents an alkyl group having 1 to 12 carbon atoms, a compound in which an alkyl group of the compound is substituted with a hydroxyl group, an epoxy group, a halogen group or the like. The alkyl group having 1 to 12 carbon atoms represented by R7 in the above formula (V) may, for example, be a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, a hexyl group, a heptyl group, an octyl group or a fluorene group. Structural isomers of thiol, decyl, undecyl, dodecyl and the like. Examples of the monomer represented by the above formula (V) include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, and butyl (meth)acrylate. Amyl methacrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, decyl (meth) acrylate , (meth) methacrylate, undecyl (meth) acrylate and dodecyl (meth) acrylate. These may be used alone or in combination of two or more. Further, the binder polymer of the component (A) in the present invention preferably contains a carboxyl group from the viewpoint of alkali developability. The carboxyl group-containing binder polymer -18-201211694 can be produced, for example, by radically polymerizing a polymerizable monomer having a carboxyl group with another polymerizable monomer. The polymerizable monomer having a carboxyl group may, for example, be acrylic acid or methacrylic acid, preferably methacrylic acid. From the viewpoint of balance between alkali developability and alkali resistance, the above (A) binder polymer The content ratio of the structural unit derived from the polymerizable monomer having a carboxyl group (the ratio of the polymerizable monomer having a carboxyl group to the total polymerizable monomer used) is preferably from 12% by mass to 50% by mass, more preferably 12%. The mass % to 40% by mass, more preferably 15% by mass to 30% by mass, most preferably 15% by mass to 25% by mass. When the content is 12% by mass or more, the alkali developability tends to be improved. In addition, when it is 50% by mass or less, the alkali resistance is excellent. Further, from the standpoint of flexibility, the binder polymer of the component (A) in the present invention preferably contains a structural unit derived from styrene or a styrene derivative. The content of the structural unit derived from the styrene or the styrene derivative is not particularly limited, and from the viewpoint of good adhesion and peeling properties, the binder polymer preferably contains 0.1% by mass to 30%. The mass%, more preferably 1% by mass to 28% by mass, particularly preferably 1.5% by mass to 27% by mass. When the content is 0.1% by mass or more, the adhesion tends to be improved. Further, by setting it to 30% by mass or less, it is possible to suppress the peeling sheet from becoming large and suppressing the elongation of the peeling time. -19- 201211694 These binder polymers may be used alone or in combination of two or more. Examples of the binder polymer when two or more types are used in combination include two or more kinds of binder polymers composed of different copolymerized components, two or more kinds of binder polymers having different weight average molecular weights, and different dispersities. Two or more kinds of binder polymers and the like. The weight average molecular weight of the above (A) binder polymer is preferably from 20,000 to 300,000, more preferably from 30,000 to 150,000, still more preferably from 40,000 to 110,000, from the standpoint of balance of mechanical strength and alkali developability.

When the weight average molecular weight is 20,000 or more, the development liquid resistance tends to be further improved. Further, by making it 300 or less, the development time can be suppressed from being extended. Further, the weight average molecular weight in the present invention is obtained by gel permeation chromatography and converted to a calibration curve prepared using standard polystyrene, and the content of the above (A) binder polymer is compared with (A). The total amount of the component and the component (B) is 1% by mass, preferably 3% by mass to 80% by mass, more preferably 50% by mass to 70% by mass. When the content of the component (A) is 30% by mass or more, the flexibility of the cured film is further improved. Further, it has a tendency to exhibit better light sensitivity by making it 80% by mass or less. [Component (C): Photopolymerization initiator] The photopolymerization initiator of the component (C) may, for example, be diphenyl-20-201211694 ketone or N,N'-tetramethyl-4,4'. -diaminobenzophenone (Michler's ketone), N,N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylamino Benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1,2-methylindole-1-[4-(methylthio)benzene Alkyl ketones such as morpholinoacetone-1; 2-ethyl hydrazine, phenanthrenequinone, 2-tert-butyl fluorene, octamethyl onion, 1,2-benzo hydrazine (1 , 2-Benzanthr aquinone), 2,3-benzopyrene, 2-phenylhydrazine, 2,3-diphenylanthracene, ι·chloropurine, 2-methylindole, 1,4 - Naphthoquinone, 9,10-phenanthrenequinone, 2-methyl-l,4-naphthoquinone, 2,3-dimethylhydrazine and the like; benzoin methyl ether, benzoin ethyl ether'. a benzoin ether compound such as benzoin phenyl ether; a benzoin compound such as benzoin, methyl benzoin or ethyl benzoin; a benzoin derivative such as benzoin dimethyl ketal; -(o-chlorophenyl)-4,5-diphenylimidazole dimer, 2- (o-chlorophenyl)-4,5-bis(methoxyphenyl)imidazole dimer, 2-(o-fluorophenyl)-4,5-diphenylimidazole dimer, 2-(neighbor 2,4,5-triaryl group such as oxyphenyl)-4,5-diphenylimidazole dimer, 2-(p-methoxyphenyl)-4,5-diphenylimidazole dimer Imidazole dimer; acridine derivative such as 9-phenyl acridine, 1,7-bis(9,9'-acridinyl)heptane; Ν-phenylglycine, Ν-phenylglycine a derivative; a coumarin compound; an oxazole compound. These may be used alone or in combination of two or more. Further, the substituents of the aryl groups of the two 2,4,5-triarylimidazoles in the above 2,4,5-triarylimidazole dimer may be the same as each other and may be symmetrical. Asymmetric compound. Further, the thioxanthone-based compound may be combined with the tertiary amine compound as in the combination of diethylthioxanthone and dimethylaminobenzoic acid. -21 - 201211694 The photosensitive resin composition preferably contains at least one of 2,4,5-triarylimidazole dimer as a photopolymerization initiator, from the standpoint of adhesion and sensitivity. At least one of the 2,4,5-triarylimidazole dimer and at least one of the aromatic ketones are more preferably used as a photopolymerization initiator. The content of the (C) photopolymerization initiator is preferably from 质量.〇1% by mass to 20% by mass, more preferably 0.2% by mass, based on 100% by mass of the total of the components (A) and (B). ~ 5 mass%. When the content is 0.01% by mass or more, the light sensitivity is improved, and when it is 20% by mass or less, the increase in absorption at the surface of the photosensitive resin layer during exposure is suppressed. The internal light hardening tends to be better. [Other components] Further, if necessary, the photosensitive resin composition may contain other components. Examples of other components include sensitizing dyes such as coumarin and pyrazoline, dyes such as malachite green, photochromic agents such as tribromophenylhydrazine and colorless crystal violet, and thermal coloring preventive agents and p-toluenesulfonamide. Plasticizers, pigments, chelants, defoamers, flame retardants, stabilizers, adhesion imparting agents, leveling agents, peeling accelerators, antioxidants, perfumes, imaging agents, and thermal crosslinking agents. The content of the other components may be from 0.01% by mass to 20% by mass based on 100% by mass of the total of the components (A) and (B). These may be used singly or in combination of two or more. The above photosensitive resin composition may contain at least one organic solvent as needed. - The above organic solvent can be used as long as it is an organic solvent which is usually used, and is not limited. Specific examples thereof include solvents such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, and propylene glycol monomethyl ether. And such mixed solvents. For example, the (A) binder polymer '(B) polymerizable compound and (C) photopolymerization initiator may be dissolved in the organic solvent jj to have a solid content of 30% by mass to 60% by mass. The solution (hereinafter referred to as "coating liquid") is used. In addition, the solid component refers to a component remaining after removing a volatile component from the solution (photosensitive resin composition). The above coating liquid can be used, for example, in the formation of a photosensitive resin layer as described below. The coating liquid is applied onto the surface of a support such as a support film or a metal plate to be described later and dried, whereby a photosensitive resin layer derived from the photosensitive resin composition can be formed on the support. Examples of the metal plate include iron-based alloys such as copper, copper-based alloys, nickel, chromium, iron, and stainless steel, and copper, copper-based alloys, and iron-based alloys are preferable. * The thickness of the photosensitive resin layer to be formed varies depending on the use thereof, but is preferably about πμπι to 100 μπι in terms of the thickness after drying. A surface (surface) of the photosensitive resin layer opposite to the opposite side of the support may be covered with a protective film. The protective film may, for example, be a polymer film such as polyethylene or polypropylene. <Photosensitive element> The photosensitive element of the present invention has a support and a photosensitive resin layer which is a coating film of the above-mentioned photosensitive -23-201211694 resin composition formed on the support 'And other layers such as a protective film provided as needed. [Support] As the support, for example, a polymer film having heat resistance and solvent resistance such as polyethylene terephthalate, polypropylene, polyethylene, or polyester can be used. The thickness of the "support film," is preferably Ιμπι~ΙΟΟμιη', more preferably Ιμηι~50μηι, and further preferably Ιμιη~30μηη. By making the thickness of the support Ιμιη or more, the support film when the support film is peeled off can be suppressed. It is possible to suppress the decrease in the resolution by making it 100 μΐΏ or less. [Protective film] The photosensitive element may have a surface covering the opposite side of the surface opposite to the support of the photosensitive resin layer as needed. The protective film is preferably a protective film having a lower adhesive force to the photosensitive resin layer than the support film to the photosensitive resin layer, and is preferably a fish eye film. Here, 'fisheye' refers to a material that is formed by heat-melting a material constituting a protective film and is produced by kneading, extrusion, biaxial stretching, casting, or the like. Phenomenon is contained in the film of the composition, oxidative degradation and the like. That is, 'low fish eye "is meant the foreign matter and the like in the film less. The thickness of the protective film is preferably Ιμπι~ΙΟΟμηι, more preferably 5_~-24-201211694 50μιη, further preferably 5μιη to 30μηι, more preferably 15μιη to 30μιη. By setting the thickness of the protective film to 1 μm or more, the protective film can be prevented from being broken when the photosensitive resin layer and the support film are laminated on the substrate while the protective film is peeled off. Further, productivity is improved by making it 100 μηη or less. [Production Method] The photosensitive element of the present invention can be produced, for example, as follows. It can be produced by a production method comprising the steps of: dissolving (Α) component: a binder polymer, a (Β) component: a polymerizable compound, and (C) a photopolymerization initiator in the above-mentioned buffer solvent, and preparing for coating. a step of coating the liquid; a step of applying the coating liquid onto the support to form a coating layer; and a step of drying the coating layer to form a photosensitive resin layer. (Α) component constituting the coating liquid: binder polymer, (Β) component: polymerizable compound, (C) photopolymerization initiator, and organic solvent. The detailed description of the coating liquid and the coating liquid are as described above. Further, a commercially available coating liquid may be used as the coating liquid, and it may be prepared by a conventional method. Coating of the above coating liquid onto the support can be carried out by using a roll coater, a notch coater, a gravure coater, an air knife coater, a die coater, a bar coater, and a spray coater. It is carried out by a known method such as a machine. Further, the coating layer is not particularly limited as long as it can remove at least a part of the organic solvent from the coating layer. For example, it can be carried out at 70 ° C to 150 ° C for 5 minutes to 30 minutes. From the viewpoint of preventing the diffusion of the organic solvent in the subsequent step, the amount of the residual organic solvent in the photosensitive resin layer after drying is preferably 2% by mass or less - 25 - 201211694 The thickness of the photosensitive resin layer in the photosensitive element can be used according to the use. And choose the right one. The thickness of the photosensitive resin layer is preferably from 1 μηι to 200 μηι', more preferably from 5 μηι to ΙΟΟμιη, and most preferably from ΙΟμηι to 50 μηι, in terms of the thickness after drying. By making the thickness of the photosensitive resin layer Ιμηη or more, industrial coating becomes easy and productivity is improved. When it is 200 μm or less, the effect of the present invention can be sufficiently obtained, the light sensitivity is high, and the photocurability of the bottom of the photoresist tends to be excellent. The photosensitive element of the present invention may have an intermediate layer such as a buffer layer, an adhesion layer, a light absorbing layer, or a gas barrier layer, etc., as needed. In the present invention, the intermediate layer described in, for example, JP-A-2006-098 9 82 or the like can be applied to the intermediate layer. The form of the photosensitive element of the present invention is not particularly limited. For example, it may be in the form of a sheet or may be wound into a roll shape on a winding core. In the case of winding into a roll shape, it is preferred to wind the support film to the outside. Examples of the core of the core include a polyethylene resin, a polypropylene resin, a polystyrene resin, a polyvinyl chloride resin, and a plastic such as ABS (acrylonitrile-butadiene-styrene copolymer). From the standpoint of protecting the end face, it is preferred to provide the end face spacer on the end face of the roll-shaped photosensitive member thus obtained, and from the standpoint of edge fusion, it is preferable to provide the moisture-proof end face spacer. Further, as the packing method, it is preferably packaged in a black sheet having a small moisture permeability. The photosensitive element of the present invention can be suitably used, for example, in a method for producing a photoresist pattern which will be described later. -26-201211694 <Manufacturing Method of Photoresist Patterns> The method for producing a resist pattern of the present invention is characterized in that (i) the photosensitive film of the photosensitive resin composition is formed on the circuit-forming substrate. a photosensitive resin layer forming step of the resin layer, an exposure step of irradiating at least a part of the photosensitive resin layer with active light rays to lightly cure the exposed portion, and (iii) removing the above-mentioned substrate from the circuit formation substrate by development a developing step of the uncured portion of the photosensitive resin layer; other steps are included as needed. (i) Photosensitive resin layer forming step In the photosensitive resin layer forming step, a photosensitive resin layer of the photosensitive resin composition coating film is formed on a circuit-forming substrate (hereinafter sometimes simply referred to as "substrate"). The circuit formation substrate usually has an insulating layer and a conductor layer formed on the insulating layer. The surface of the circuit-forming substrate to which the photosensitive resin layer is in contact is usually a metal surface, but the material thereof is not particularly limited. As a method of forming a photosensitive resin layer on a substrate, for example, when the photosensitive element has a protective film, the photosensitive resin layer of the photosensitive element can be heated as needed after removing the protective film. At the same time, it is bonded to the substrate for circuit formation. Thus, a laminate having the circuit formation substrate, the photosensitive resin layer, and the support in this order is obtained. The photosensitive resin layer forming step is preferably carried out under reduced pressure from the standpoint of adhesion and followability. The heating at the time of crimping is preferably carried out at a temperature of 70 ° C to 130 ° (: and the pressure is preferably in the range of 〇.1 河? 3~1.〇]\〇3 ( -27- 201211694 lkgf/cm2~ It is carried out under a pressure of about 10 kgf/cm 2 , but these conditions can be appropriately selected as needed. Further, if necessary, pre-heat treatment of the substrate for circuit formation can be performed. The photosensitive resin layer is heated to 7 ° C to 130 ° In the case of °C, it is not necessary to perform preheating on the circuit-forming substrate in advance, but the pre-heat treatment of the circuit-forming substrate can further improve adhesion and followability. (ii) Exposure step In the exposure step, At least a part of the photosensitive resin layer grease formed on the circuit-forming substrate is irradiated with active light rays, whereby the exposed portion irradiated with the active light is photo-cured to form a latent image. At this time, the support is present on the photosensitive resin layer. When the body (support film) is transparent to the active light, the active light can be transmitted through the support film. On the other hand, when the support film is impermeable to the active light, the photosensitive resin layer is removed after the support film is removed. Irradiation Active light ray. As an exposure method, a method of irradiating active light into an image (mask exposure method) via a negative or positive mask pattern called a wiring diagram (ART WORK) may be mentioned. A method of irradiating active light into an image by direct drawing exposure method such as LDI (Laser Direct Imaging) exposure method or DLP (Digital Light Processing) exposure method. As a light source of active light, Known light sources such as carbon arc lamps, mercury vapor arc lamps, ultra-high pressure mercury lamps, high pressure mercury lamps, xenon lamps, argon lasers, gas lasers such as YAG lasers, semiconductor lasers, and nitrogen can be used. 28 - 201211694 A gallium-based blue-violet laser light source that emits ultraviolet light effectively. In addition, a photographic floodlight, a fluorescent lamp, or the like that efficiently emits visible light may be used. (iii) Development step in the development step 'by developing The uncured portion of the photosensitive resin layer is removed from the circuit formation substrate, and the photosensitive resin layer is photocured on the circuit formation substrate. In the case of the photoresist pattern formed of the compound, when the support film is present on the photosensitive resin layer, the unexposed portion other than the exposed portion is removed (developed) after the support film is removed. The development method includes wet development and dry development. In the case of wet development, development is carried out by a known development method using a developer corresponding to the photosensitive resin composition. Examples of the development method include an immersion method, an paddle method, a spray method, a brushing method, and a tapping method. (Slapping), scraping, shaking, etc., from the viewpoint of improving the resolution, the high-pressure spray method is most suitable. It is also possible to develop two or more of the above methods in combination. The configuration of the developer can be appropriately selected depending on the configuration of the photosensitive resin composition. For example, an alkaline aqueous solution, an aqueous developing solution, an organic solvent developing solution, and the like can be given. When an alkaline aqueous solution is used as the developing solution, it is safe and stable, and the workability is also good. As the base of the alkaline aqueous solution, for example, an alkali hydroxide such as a hydroxide of lithium, sodium or potassium, a carbonate of lithium, sodium, potassium or ammonium or a carbonate such as a hydrogen carbonate -29-201211694 salt, potassium phosphate or phosphoric acid can be used. An alkali metal phosphate such as sodium, an alkali metal pyrophosphate such as sodium pyrophosphate or potassium pyrophosphate. The alkaline aqueous solution used for development is preferably 0.1% by mass to 5% by mass of a dilute solution of sodium carbonate, 〇·1% by mass to 5% by mass of a dilute solution of potassium carbonate, and 0.1% by mass to 5% by mass of a dilute solution of sodium hydroxide. 〇.1% by mass to 5% by mass of a tetrabasic sodium dilute solution. Further, the pH of the alkaline aqueous solution used for development is preferably in the range of 9 to 1 1 , and the temperature thereof can be adjusted in accordance with the developability of the photosensitive resin layer. Further, an aqueous surfactant, an antifoaming agent, and a small amount of an organic solvent for promoting development may be mixed in the alkaline aqueous solution. The aqueous developing solution is, for example, a developing solution composed of water or an alkaline aqueous solution and one or more organic solvents. Here, as the base of the alkaline aqueous solution, in addition to the above, 'borax, sodium metasilicate, tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethylenetriamine, 2-amine may also be mentioned. Alkyl-2-hydroxymethyl-1,3-propanediol, 1,3-diaminopropanol-2, morpholine, and the like. The pH of the aqueous developing solution is preferably as small as possible within a range in which development is sufficiently performed, and is preferably set to pH 8 to 12, more preferably to pH 9 to 10. Examples of the organic solvent used in the aqueous developing solution include 3-acetone alcohol, acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethanol, isopropanol, butanol, and the like. Diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, and the like. These may be used alone or in combination of two or more. The content of the organic solvent in the aqueous developing solution is usually preferably from 2% by mass to 90% by mass. Further, the temperature thereof can be adjusted in accordance with the developability of the photosensitive resin layer. A small amount of a surfactant, an antifoaming agent, or the like may be mixed in the aqueous developing solution. -30- 201211694 The organic solvent-based developing solution may, for example, be 1,1,1-trichloroethane, N-methylpyrrolidone, N,N-dimethylformamide, cyclohexanone or methyl group. Isobutyl ketone, γ-butyrolactone, and the like. In order to prevent ignition, water is preferably added in an amount of from 1% by mass to 20% by mass based on the organic solvent. In the present invention, after the unexposed portion is removed in the developing step, it may be subjected to heat treatment at about 60 ° C to 250 ° C or exposure treatment at about 0.2 mJ/cm 2 to 10 μm/cm 2 as needed. The step of further hardening the photoresist pattern. <Manufacturing Method of Printed Wiring Board> The method for producing a printed wiring board according to the present invention includes etching or plating a circuit forming substrate on which a resist pattern is formed by the above-described photoresist pattern manufacturing method. The step of processing to form a conductor pattern, including other steps such as a photoresist removal step, as needed. In the etching process, a photoresist pattern formed on a substrate is used as a mask, and a conductor layer of a substrate for circuit formation not covered with a photoresist is etched away to form a conductor pattern. The etching treatment method can be appropriately selected depending on the conductor layer to be removed. For example, a copper chloride solution, a ferric chloride solution, an alkali etching solution, or a hydrogen peroxide-based etching solution may be mentioned as the etching liquid, and from the viewpoint of a good etching factor, a ferric chloride solution is preferably used. On the other hand, in the plating treatment, the photoresist pattern formed on the substrate is a mask. The conductor layer of the circuit-forming substrate not covered with the photoresist is plated with copper, solder, or the like. After the plating treatment, the hardened photoresist is removed, and the conductor layer covered by the photoresist is etched to form a conductor pattern. As a method of the plating treatment, it may be an electrolytic plating treatment or an electroless plating treatment. Examples of the plating treatment include copper plating such as copper sulfate plating and copper pyrophosphate plating, solder plating such as high-throw solder plating, and Watt bath (nickel sulfate-nickel chloride). Nickel plating such as plating and nickel sulfonate plating, hard gold plating, and gold plating such as soft gold plating. After the etching treatment and the plating treatment, the photoresist pattern on the substrate is removed. The removal of the photoresist pattern can be carried out, for example, by using an alkaline aqueous solution which is more alkaline than the alkaline aqueous solution used in the above development step. As the strongly alkaline aqueous solution, for example, a 1% by mass to 10% by mass aqueous sodium hydroxide solution, a 1% by mass to 10% by mass aqueous potassium hydroxide solution, or the like can be used. Among them, a 1% by mass to 10% by mass aqueous sodium hydroxide solution or an aqueous potassium hydroxide solution is preferably used, and a 1% by mass to 5% by mass aqueous sodium hydroxide solution or an aqueous cesium hydroxide solution is more preferably used. The removal mode of the photoresist pattern may, for example, be a dipping method or a spray method, and these may be used singly or in combination. When the photoresist pattern is removed after the plating treatment, the conductor layer covered with the photoresist can be further etched by etching to form a conductor pattern, whereby a desired printed wiring board can be manufactured. The etching treatment method can be appropriately selected depending on the conductor layer to be removed. For example, the above etching liquid can be applied. The method for producing a printed wiring board of the present invention can be applied not only to the manufacture of a single-layer printed wiring board, but also to the manufacture of a multilayer printed wiring board, and also to a printed wiring board having a small-diameter through hole. Manufacturing - 32 - 201211694 [Examples] Hereinafter, the present invention will be more specifically described by way of examples. However, the present invention is not limited by the embodiments as long as it does not depart from the technical idea of the present invention. And, unless otherwise specified, “parts” and “%” are quality benchmarks. <Examples 1 to 4, Comparative Examples 1 to 2 > Each component of the type and the amount (unit: g) shown in Table 1 was mixed'. The photosensitive resins of Examples 1 to 4 and Comparative Examples 1 to 2 were obtained. a solution of the composition. [Table 1] _ __--- Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 50 50 (A 戚 (A-1) 50 50 Å (A-2) 50 50 — — (B戚BPE-500 30 30 30 a 30 30 30 FA-MECH 5 5 5 a 5 5 5 — — Sample A 15 a 15 Sample B _ 15 15 — — 一—15 JTX0309 _ — — UA-21 1 — 一— 15 — L.——. 5 5 5 (C戚B-CIM 5 5 5一—0.2一·—0.2 0.2 EAB 0.2 0.2 0.2 ___ Additive MKG 0.05 0.05 0.05 0.05 0.05 0.05 LCV 0.5 0.5 0.5 0.5 0.5 0.5 —— 15 15 15 Solvent Acetone 15 15 15 Toluene 10 10 10 10 10 10 Methanol 10 10 10 10 10 L··· The abbreviations of the components in Table 1 are as follows: -33- 201211694 [Component A] (A — 1): Methacrylic acid/methyl methacrylate/butyl acrylate/styrene (2 5/50/20/5 (mass ratio)) 'weight average molecular weight = 80,000, 50% by mass methyl cellosolve / Toluene = 6/4 (mass ratio) solution. (A - 2): methacrylic acid / methyl methacrylate / ethyl acrylate (20/55/25 (mass ratio)), weight average molecular weight = 8 〇, 000 , 50% by mass Methyl cellosolve / toluene = 6 / 4 (mass ratio) solution and 'weight average molecular weight is determined by gel permeation chromatography (GPC) method and calculated using standard polystyrene calibration curve to calculate ° G pc conditions and acid The measurement procedure is as follows: (GPC condition) Pump··Hitachi L-6000 type [manufactured by Hitachi, Ltd.] Column: Gelpack GL-R420 + Gelpack GL-R430 + Gelpack GL-R440 (3 in total) The above is manufactured by Hitachi Chemical Co., Ltd., product name] Dissolved liquid · Tetrahydrofuran Measurement temperature: 40 ° C Flow rate: 2.05 mL / min Detector: Hitachi L-3300 type RI [manufactured by Hitachi, Ltd., product name] [Component B] -34- 201211694 ♦ΒΡΕ-5 00: 2,2-ψ. (4-(Methylpropyl decyloxypentadecyloxy)phenyl) [Manufactured by Shin-Nakamura Chemical Industry Co., Ltd.] •FA—MECH: γ-Chloro-β-propyl-β'-methyl-propyl decyloxyethyl-phthalate [Manufactured by Yuli Chemical Industry Co., Ltd.] • Sample A: a compound of the formula (I) 'and. Is -C6H12-, R2 is a compound of the formula (II) wherein n = l, X is an ethyl group and R3 is a methyl group. • Sample B: a compound of the formula (I) and R1 is -C6H12. 'R2 is a compound of the formula (II) wherein n = 15, X is an ethyl group and R3 is a methyl group. JTX0309: a compound represented by the following formula (VI), and R51 and R52 are the following formula (Vila) ) The group represented by R53 is a group represented by the following formula (VI lb ) (manufactured by Cytec Industries Inc., Japan, sample name: JTX03 09 ) [Chem. 6]

ΌΗ2〇Η2—0—C—C=CH2 ί! Αη3 (Vllb)

• UA-21: Tris(methacryloxytetramethylene glycol isocyanate hexamethylene)isocyanurate (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.) [Component C] B-CIM: 2-(Neighbor Chlorophenyl)·4,5-diphenylimidazole 2mer-35- 201211694 •EAB: N,N'-tetraethyl·4,4,-diaminobenzophenone [other ingredients] .MKG : Malachite Green • LCV: colorless crystal violet The solution of the photosensitive resin composition obtained above was uniformly applied to a 16 μη thick polyethylene terephthalate film as a support film (trade name G2-16, Teijin) ()), dried in a hot air convection dryer at 100 ° C for 1 minute to form a photosensitive resin layer, and then adhered to a protective film of polyethylene on the photosensitive resin layer (trade name: NF-13, Tamapoly shares) The product of the company is protected to obtain a photosensitive resin composition laminate. The film thickness after drying of the photosensitive resin layer was 40 μm. Next, on a 1.6 mm-thick copper-clad laminate (manufactured by AIN) having 35 μm thick copper foil on both sides, as shown in Fig. 1, four die-cutting machines were used, each having a diameter of 4, 5, and 6 mm. The apertures are respectively made into three independent circular holes 4 1 and three three-holes 42 in which the circular holes are connected and the intervals of the circular holes are gradually reduced. The burrs generated when the round holes 41 and the three connecting holes 42 were produced were removed by a honing machine (manufactured by Sanken Co., Ltd.) having a brush equivalent to #600, and this was used as the hole crack number measuring substrate 40. The substrate for measuring the number of fractures of the obtained pores was heated to 80 ° C, and the photosensitive resin composition laminate obtained above was peeled off from the protective film so that the photosensitive resin layer was opposed to the copper surface at 120 ° C, 〇. 4 MPa. Lamination was carried out to obtain a laminated plate in which a photosensitive resin layer and a polyethylene terephthalate film were laminated on a substrate for measuring the number of pore fractures. After lamination, the substrate was cooled to -36-201211694 for the number of cracks in the hole, and the Stouffer was adhered to the polyethylene terephthalate film surface at the time when the temperature of the substrate for measuring the number of fractures of the hole was lowered to 23 ° C. A 21-stage stage exposure meter was subjected to photohardening using an exposure machine HMW-201B (manufactured by OAK Co., Ltd.) having a high pressure mercury lamp at an exposure amount of 8.0-stage photocuring. (Cover hole reliability) After exposure, it was allowed to stand at room temperature for 15 minutes, and then the polyethylene terephthalate film was peeled off from the substrate for measuring the number of holes to be broken, by spraying 30 ° C, 1% by weight aqueous sodium carbonate solution 60 Development is performed in seconds. After the development, the number of holes broken in the three-joined hole was measured, and the crack rate of the abnormal shape cap hole was calculated, and the reliability of the cap hole was evaluated. Next, a cylinder having a diameter of 1,5 mm was inserted into the cured film covering the circular hole portion, and the strength and elongation at the time of breaking were measured by a rheometer (manufactured by RHEOTECH Co., Ltd.). The larger the number of strengths and elongations, the better the reliability of the cap hole. These results are shown in Table 2. (Resolution) Further, the resolution was evaluated as follows. A photomask _ (photo tool ) having a Stouffer 21-stage stage exposure meter and a negative type negative film for resolution evaluation have a width/line width of 3 0/4 00 to 2 00/4 00 (unit: μιη) The wiring pattern of the photomask was adhered to the exposure, and the amount of energy remaining in the Stouffer 21-stage stage exposure meter after the development was 8.0. Here, the resolution is evaluated by the minimum 値 (unit: μTM) of the interval width between the line widths in which the portion which is not photohardened can be completely removed by the development treatment -37-201211694. Moreover, the smaller the number of 値 in the evaluation of the resolution, the better. [Table 2] _ Example 1 Example 2 Example 3 Example 4 Comparative Example 1 Comparative Example 2 Abnormal shape cap hole cracking rate (%) 11 8 13 10 39 10 Strength (N) 5.4 5.6 5.2 5.4 4.2 5.5 Elongation (mm) 1.1 1.2 1.2 1.4 0.9 1.4 Resolving property 45 45 45 45 50 50 As is apparent from Table 2, the abnormal shape of the examples 1 to 4 has a low crack rate and a large strength and elongation. On the other hand, in the abnormal shape of Comparative Example 1, the cap hole breaking rate was high, and the strength and the elongation were small. Further, Comparative Examples 1 and 2 were inferior to Examples 1 to 4 in terms of resolution. Therefore, according to the present invention, it is possible to provide a photosensitive resin composition which is excellent in mechanical strength of a cured film and has flexibility, that is, a photosensitive resin composition excellent in lid hole reliability, and a photosensitive element and a resist pattern using the same. Manufacturing method and manufacturing method of printed wiring board. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view showing a substrate for measuring the number of cracks in a hole in an embodiment of the present invention. Figure 2 is an enlarged view of the 3 connection holes in the area indicated by A in Figure 1. [Description of main component symbols] 4 0 : Substrate for measuring the number of holes broken 4 1 : Round hole 42 : 3 holes -38-

Claims (1)

201211694 VII. Patent application scope: 1 · A photosensitive resin composition containing the following components: (A) component: binder polymer, (B) component: a polymerizable compound having at least one ethylenically unsaturated bond, And (C) component: a photopolymerization initiator, and the component (B) contains a compound represented by the following formula (1), [Chemical Formula 1] (wherein R1 represents a divalent organic group, and R2 represents a group represented by the following formula (π)), [Chemical 2] (wherein R 3 represents a hydrogen atom or a methyl group χ represents an alkylene group, and η represents an integer of io 〜 25). 2) A photosensitive resin composition containing the following components: (A) component: a binder polymer, (B) component: a polymerizable compound having at least one ethylenically unsaturated bond, and (C) component: light The polymerization initiator, 201211694, and the component (B) contains a reaction product of a compound represented by the following formula (III) and a compound represented by the following formula (IV), [Chem. 3] (wherein R3 represents a hydrogen atom or a methyl group, X represents an alkylene group, and η represents an integer of 10 to 25), and R1 to NCO.丫 Α 丫. OCN—R1'N 丫 N, R1-NCO 〇 (IV) (wherein R1 represents a divalent organic group). A photosensitive element comprising: a support; and a photosensitive resin layer formed on the support by a coating film of the photosensitive resin composition of claim 1 or 2. 4. A method for producing a photoresist pattern having the following steps: Photosensitive property of a photosensitive resin layer formed on a substrate for forming a photosensitive resin composition according to claim 1 or 2 on a substrate for circuit formation a resin layer forming step of irradiating at least a portion of the photosensitive resin layer with active light, exposing the exposed portion to photohardening, and causing the uncured portion of the photosensitive resin layer to be formed by a circuit The imaging step of removing the substrate. 201211694 5. A method for producing a printed wiring board, comprising: etching or slashing a substrate for forming a circuit having a photoresist pattern formed by a method for manufacturing a photoresist pattern according to claim 4; The step of forming a conductor pattern. A printed wiring board manufactured by the method of manufacturing a printed wiring board according to claim 5 of the patent application. -41 -