TW201209090A - Curable composition for use in a heat-resistant component in a semiconductor, liquid crystal, solar cell, or organic el manufacturing device - Google Patents

Curable composition for use in a heat-resistant component in a semiconductor, liquid crystal, solar cell, or organic el manufacturing device

Info

Publication number
TW201209090A
TW201209090A TW100111326A TW100111326A TW201209090A TW 201209090 A TW201209090 A TW 201209090A TW 100111326 A TW100111326 A TW 100111326A TW 100111326 A TW100111326 A TW 100111326A TW 201209090 A TW201209090 A TW 201209090A
Authority
TW
Taiwan
Prior art keywords
heat
resistant component
elastomer
tetrafluoroethylene
curable composition
Prior art date
Application number
TW100111326A
Other languages
English (en)
Chinese (zh)
Inventor
Keiko Washino
Shoji Fukuoka
Tomohisa Konishi
Eisaku Sumino
Tsuyoshi Noguchi
Original Assignee
Daikin Ind Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Ind Ltd filed Critical Daikin Ind Ltd
Publication of TW201209090A publication Critical patent/TW201209090A/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16J—PISTONS; CYLINDERS; SEALINGS
    • F16J15/00—Sealings
    • F16J15/02—Sealings between relatively-stationary surfaces
    • F16J15/06—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces
    • F16J15/10—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing
    • F16J15/102—Sealings between relatively-stationary surfaces with solid packing compressed between sealing surfaces with non-metallic packing characterised by material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/43—Compounds containing sulfur bound to nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Electroluminescent Light Sources (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
TW100111326A 2010-03-31 2011-03-31 Curable composition for use in a heat-resistant component in a semiconductor, liquid crystal, solar cell, or organic el manufacturing device TW201209090A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010081492 2010-03-31

Publications (1)

Publication Number Publication Date
TW201209090A true TW201209090A (en) 2012-03-01

Family

ID=44762561

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100111326A TW201209090A (en) 2010-03-31 2011-03-31 Curable composition for use in a heat-resistant component in a semiconductor, liquid crystal, solar cell, or organic el manufacturing device

Country Status (2)

Country Link
TW (1) TW201209090A (ja)
WO (1) WO2011125614A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105980415A (zh) * 2014-02-18 2016-09-28 大金工业株式会社 全氟弹性体水性分散液的制造方法和全氟弹性体的制造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3223776B2 (ja) * 1995-03-31 2001-10-29 日本メクトロン株式会社 含フッ素エラストマー組成物
US6803425B2 (en) * 2001-04-12 2004-10-12 3M Innovative Properties Company Fluoropolymers having pendant imidate structures
KR100950352B1 (ko) * 2005-07-26 2010-03-29 다이킨 고교 가부시키가이샤 경화성 조성물, 이를 포함하는 성형품 및 성형품의 제조 방법

Also Published As

Publication number Publication date
WO2011125614A1 (ja) 2011-10-13

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