201208527 六、發明說明： 【發明所屬之技術領域】 . [0001] 本發明涉及一種電子裝置殼體及其製造方法。 [0002] [先前技術3 請參閱圖1，一種電子裝置殼體10，其包括底殼11、頂蓋 12及邊框13。頂蓋12之邊緣藉由烊接方式與底殼11連接 在一起。頂蓋12上開設有定位槽（圖未標），邊框丨3定 位於頂蓋12之定位槽中，且二者藉由雙面膠14相互連接 ❹ [0003] 然，在製造上述電子裝置殼體1〇之過程中，需對底殼Η 與頂蓋12進行焊接，並對焊接部位進行拋光，然後將邊 框13黏接在頂蓋12，製造過程較為%瑣。另，對焊接部 位進行拋光後仍可能存在色差，導致電子裝置殼體10之 外觀品質較差。 [0004] ❹ 【發明内谷】 • ! 鑒於以上内容’有必要提供一種易於製造且具有較佳外 觀之電子裝置殼體及其製造方法。 [0005] 一種電子裝置殼體，其包括底殼、支架及塑膠邊框，支 架固定設置於底殼上，支架邊緣開設有定位槽，塑膠邊 框部分嵌入定位元槽内。 [0006] 一種電子裝置殼體之製造方法’其包括：（1)提供一底 殼及支架，並將支架固定於底殼上；（2)於支架上銑削 出定位槽；（3)對準支架之定位槽注射熔融之塑膠材料 ;(4)冷卻塑膠材料以於支架上形成塑膠邊框。 099126701 表單編號A0101 第3頁/共14頁 0992046845-0 201208527 [0007] 製造上述電子裝置殼體時，只需將底殼與支架固定，然 後於支架上開設定位槽，以注入塑膠材料成型塑膠邊框 即可，不僅可省去影響外觀品質之焊接制程，亦可省去 需對焊接部位需進行拋光之制程，易於製造且具有較佳 之外觀。 【實施方式】 [0008] 下面將結合附圖及實施方式對本發明之電子裝置殼體及 其製造方法作進一步詳細說明。 [0009] 請參閲圖2，本發明實施例之電子裝置殼體30包括相互連 接之底殼31、支架32及塑膠邊框33。 [0010] 請參閱圖3至圖5，底殼31包括底板311及由底板311邊緣 延伸形成之側壁312，且側壁312之頂端彎折形成有掛接 部3121。本實施例中，底板311大致為矩形，側壁312為 弧形，掛接部3121大致為矩形環狀。 [0011] 支架32藉由鉚合之方式固定於底殼31上，支架32之底面 321為與底殼31之側壁312相適配之弧形。底殼31之掛接 部31 21扣合於支架32之頂面322之邊緣。支架32之頂面 322之邊緣藉由銑削之方式形成有定位槽325。本實施例 中，支架32為矩形框狀，定位槽325之内表面為曲面，且 其上開設有卡槽326。 [0012] 塑膠邊框33包括嵌入定位槽325之卡合部331和伸出定位 槽325之安裝部332。卡合部331與支架32藉由曲面3311 連接。安裝部332與底殼31之掛接部3121相連，且其上 開設有安裝槽3321。本實施例中，曲面3311上形成與卡 099126701 表單編號A0101 第4頁/共14頁 0992046845-0 201208527 [0013] 槽326相對應之卡位凸起3312，以加強塑膠邊框33與支 架32之連接強度。 上述電子裝置殼體30之製造方法如下·· [0014] (1)提供上述底殼31及支架32，並將支架32固定於底殼 31上，本實施例中，支架32藉由鉚合之方式固定於底殼 31上，可以理解，支架32與底殼31亦可藉由黏接等方式 固定； [0015] ❹ [0016] (2 )於支架32上銑削出定位槽325 ; (3)對準支架32之定位楕325注射熔融之塑膠材料，本 實施例中，藉由將底殼31與支架32放入模具中，用模具 對準定位槽325注入熔融之塑膠材料。 [0017] (4)冷卻塑膠材料以於支架32上形成塑膠邊框。本實施 例中，冷卻後形成之塑膠邊框33部分嵌入支架32之定位 槽325中，且伸出定位槽325部分與底殼31之掛接部3121 相連。 〇 [0018] 電子裝置殼體30之制程只需將底殼31與支架32鉚合固定 ，然後於支架3 2上銳削出定位槽3 2 5，以注入塑膠材料成 型塑膠邊框33即可，不僅可以省去可能會影響外觀品質 之焊接制程，還可省去對焊接部位需進行拋光之制程， 易於製造且具有較佳之外觀。另，塑膠邊框33與支架32 藉由曲面3311連接，提高了電子裝置殼體3〇之結構強度 0 [0019] 綜上所述，本發明確已符合發明專利之要件，遂依法提 099126701 表單編號删1 第5頁/共14頁 0992046845-0 201208527 出專利申請。惟，以上該者僅為本發明之較佳實施方式 ，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化， 皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 [0020] 圖1係一種電子裝置殼體之立體示意圖。 [0021] 圖2係本發明實施例之電子裝置殼體之立體示意圖。 [0022] 圖3係圖2所示電子裝置殼體之立體分解圖。 [0023] 圖4係圖2所示電子裝置殼體沿IV- IV線之部分剖面示意圖 〇 [0024] 圖5係圖4所示電子裝置殼體成型塑膠邊框前之示意圖。 【主要元件符號說明】 [0025] 電子裝置殼體30 [0026] 底殼 31 [0027] 底板 311 [0028] 侧壁 31 2 [0029] 掛接部 3121 [0030] 支架 3 2 [0031] 底面 321 [0032] 頂面 3 2 2 [0033] 定位槽3 2 5 099126701 表單編號A0101 第6頁/共14頁 0992046845-0 201208527 [0034] [0035] [0036] [0037] [0038] [0039] ❹ 塑膠邊框33 卡合部3 31 曲面3311 卡位凸起3312 安裝部332 安裝槽3321201208527 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to an electronic device housing and a method of manufacturing the same. [Prior Art 3] Referring to FIG. 1, an electronic device housing 10 includes a bottom case 11, a top cover 12, and a bezel 13. The edge of the top cover 12 is joined to the bottom case 11 by means of splicing. The top cover 12 is provided with a positioning groove (not shown), and the frame 丨3 is positioned in the positioning groove of the top cover 12, and the two are connected to each other by the double-sided tape 14 [0003], in the manufacture of the above electronic device case In the process of the body 1 ,, the bottom case Η and the top cover 12 are welded, and the welded portion is polished, and then the frame 13 is adhered to the top cover 12, and the manufacturing process is relatively trivial. In addition, there may still be chromatic aberration after polishing the soldered portion, resulting in poor appearance quality of the electronic device housing 10. [0004] ❹ [Inventive Inner Valley] • In view of the above, it is necessary to provide an electronic device casing which is easy to manufacture and has a better appearance and a method of manufacturing the same. [0005] An electronic device housing includes a bottom case, a bracket and a plastic frame. The bracket is fixedly disposed on the bottom case, and a positioning groove is formed in the edge of the bracket, and the plastic side frame portion is embedded in the positioning element slot. [0006] A method of manufacturing an electronic device housing includes: (1) providing a bottom case and a bracket, and fixing the bracket to the bottom case; (2) milling the positioning groove on the bracket; (3) aligning The positioning groove of the bracket is injected with the molten plastic material; (4) the plastic material is cooled to form a plastic frame on the bracket. 099126701 Form No. A0101 Page 3 of 14 0992046845-0 201208527 [0007] When manufacturing the above electronic device housing, it is only necessary to fix the bottom case and the bracket, and then open a positioning groove on the bracket to inject a plastic material to form a plastic frame. It can not only save the welding process which affects the appearance quality, but also eliminate the need to polish the welding part, which is easy to manufacture and has a better appearance. [Embodiment] Hereinafter, an electronic device casing and a method of manufacturing the same according to the present invention will be further described in detail with reference to the accompanying drawings and embodiments. Referring to FIG. 2, the electronic device housing 30 of the embodiment of the present invention includes a bottom case 31, a bracket 32, and a plastic frame 33 that are connected to each other. Referring to FIG. 3 to FIG. 5, the bottom case 31 includes a bottom plate 311 and a side wall 312 extending from the edge of the bottom plate 311, and the top end of the side wall 312 is bent to form a hook portion 3121. In this embodiment, the bottom plate 311 is substantially rectangular, the side wall 312 is curved, and the hook portion 3121 is substantially rectangular. [0011] The bracket 32 is fixed to the bottom case 31 by riveting, and the bottom surface 321 of the bracket 32 is curved in conformity with the side wall 312 of the bottom case 31. The hook portion 31 21 of the bottom case 31 is fastened to the edge of the top surface 322 of the bracket 32. The edge of the top surface 322 of the bracket 32 is formed with a positioning groove 325 by milling. In this embodiment, the bracket 32 has a rectangular frame shape, and the inner surface of the positioning groove 325 is a curved surface, and a card slot 326 is opened thereon. [0012] The plastic bezel 33 includes an engaging portion 331 that is fitted into the positioning groove 325 and a mounting portion 332 that protrudes from the positioning groove 325. The engaging portion 331 and the bracket 32 are connected by a curved surface 3311. The mounting portion 332 is connected to the hook portion 3121 of the bottom case 31, and a mounting groove 3321 is formed thereon. In this embodiment, a card protrusion 3312 corresponding to the slot 326 is formed on the curved surface 3311 to form a card protrusion number 3312 corresponding to the card 099126701 form number A0101 page 4/14 page 0992046845-0 201208527 [0013] to strengthen the connection of the plastic frame 33 and the bracket 32. strength. The manufacturing method of the electronic device casing 30 is as follows: [0014] (1) The bottom case 31 and the bracket 32 are provided, and the bracket 32 is fixed to the bottom case 31. In this embodiment, the bracket 32 is riveted. The method is fixed on the bottom case 31. It can be understood that the bracket 32 and the bottom case 31 can also be fixed by bonding or the like; [0015] [0016] (2) Milling the positioning groove 325 on the bracket 32; (3) The molten material is injected into the positioning frame 325 by the positioning of the holder 32. In this embodiment, the molten plastic material is injected into the positioning groove 325 by the mold by placing the bottom case 31 and the holder 32 into the mold. [0017] (4) cooling the plastic material to form a plastic frame on the bracket 32. In this embodiment, the plastic frame 33 formed after cooling is partially embedded in the positioning groove 325 of the bracket 32, and the protruding positioning groove 325 portion is connected to the hook portion 3121 of the bottom case 31. [0018] The process of the electronic device housing 30 only needs to rive and fix the bottom case 31 and the bracket 32, and then sharply cut out the positioning groove 3 2 5 on the bracket 3 2 to inject the plastic material to form the plastic frame 33. Not only can the welding process which may affect the appearance quality be omitted, but also the process of polishing the welded portion can be omitted, which is easy to manufacture and has a better appearance. In addition, the plastic frame 33 and the bracket 32 are connected by the curved surface 3311, which improves the structural strength of the electronic device housing 3 [0019] In summary, the present invention has indeed met the requirements of the invention patent, and the law number is 099126701. Delete 1 Page 5 / 14 pages 0992046845-0 201208527 Patent application. However, the above is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by those skilled in the art to the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0020] FIG. 1 is a perspective view of a housing of an electronic device. 2 is a perspective view of a housing of an electronic device according to an embodiment of the invention. 3 is an exploded perspective view of the electronic device housing shown in FIG. 2. 4 is a partial cross-sectional view of the electronic device housing of FIG. 2 taken along line IV-IV. [0024] FIG. 5 is a schematic view of the electronic device housing shown in FIG. [Main component symbol description] [0025] Electronic device housing 30 [0026] bottom case 31 [0027] bottom plate 311 [0028] side wall 31 2 [0029] hook portion 3121 [0030] bracket 3 2 [0031] bottom surface 321 [0032] top surface 3 2 2 [0033] positioning slot 3 2 5 099126701 form number A0101 page 6 / total 14 page 0992046845-0 201208527 [0034] [0036] [0038] [0039] Plastic frame 33 Engagement part 3 31 Curved surface 3311 Card position projection 3312 Mounting part 332 Mounting groove 3321
099126701 表單編號A0101 第7頁/共14頁 0992046845-0099126701 Form No. A0101 Page 7 of 14 0992046845-0