201205706 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明是有關於一種防震保護裝置及其防震保護方法， 特別是用於半導體設備之防震保護裝置及其防震保護方 法。 【先前技術 [0002] 一直以來，半導體廠之設計為提高結構剛性，都以粗壯 的鋼結構來抵抗震動的衝擊力，然成本亦隨之提高。另 外也可以提高建築結構體的韌性達到耐震的功能，利用 結構體的變形與振動抵消震動衝擊的能量。防震設計可 分為被動式與主動式，被動式裝置是以材料變形與摩擦 阻尼吸收衝擊能量，被動控制系統經濟且穩定性高；而 主動式減震系統是以感測器回振動訊號驅動防震機構。 又，半導體設備是一種高科技、高精密度設備，此半導 體設備對震動相當敏感。當震動較大時會使系統在讀取 資料時出現誤差的情況，對半導體製程有很大的影響， 故综觀前所述，本發明之發明人思索並設計一種半導體 設備之防震保護裝置及其防震保護方法，以期針對現有 技術之缺失加以改善，進而增進產業上之實施利用。 【發明内容】 [0003] 有鑑於上述習知技藝之問題，本發明之目的就是在提供 一種半導體設備之防震保護裝置，以解決因半導體設備 受到震動或搖晃而容易對半導體製程產生影響的問題。 [0004] 根據本發明之目的，提出一種半導體設備之防震保護裝 置。防震保護裝置具有一移動載具、至少一感測器、至 099124813 表單編號A0101 第4頁/共19頁 0992043587-0 201205706 Ο 少一驅動單元以及一控制單元。移動載具設置於一平台 之一特定位置上，並提供設置一半導體設備。感測器設 置於移動載具，用以感測並傳送移動載具的一運動資訊 。驅動單元於平台上圍繞設置移動載具的周圍，係驅動 移動載具帶動半導體設備進行移動。控制單元電性連接 感測器以及驅動單元，控制單元接收感測器量測到之半 導體設備的運動資訊，並根據此運動資訊進行運算以產 生對應此運動資訊的第一訊號。當感測器量測的半導體 設備之運動資訊不符合一預設值時，控制單元即傳送第 一訊號予驅動單元，驅動單元根據第一訊號產生與半導 體設備之運動相反之作用力，此作用力驅動移動載具帶 動半導體設備進行與運動資訊相反的運動，藉此抑制半 導體設備所受到的震動或衝擊，使半導體設備維持在特 定位置上，進而達到保護半導體設備之目的。 [0005] Ο [0006] 其中，控制單元更包含一估計器，估計器預估半導體設 備的運動，進而產生一運動預測資訊。當感測器傳遞實 際量測之半導體設備的運動資訊予控制單元時，估計器 同時根據此運動資訊校正運動預測資訊。 其中，當估計器的校正次數達到控制單元的一設定次數 時，控制單元改以根據估計器產生之運動預測資訊進行 運算，並產生對應於此運動預測資訊的一第二訊號。控 制單元傳遞第二訊號予驅動單元，驅動單元根據此第二 訊號產生對應此第二訊號的作用力，並透過移動載具施 力於半導體設備，使半導體設備進行與運動預測資訊相 反的運動。 099124813 表單編號Α0101 第5頁/共19頁 0992043587-0 201205706 [0007] 其中，平台包含一上基座以及一下基座。上基座係承載 移動載具以及半導體設備，且上基座係透過至少一彈性 阻尼器連接下基座，以限制半導體設備之垂直位移。 [0008] 其中，移動載具係承載半導體設備，並活動地設置於平 台的上基座上，使能限制半導體設備之水平位移。 [0009] 其中，驅動單元包括電機裝置、電磁裝置、可變阻尼器 以及微機電裝置的其中之一。 [0010] 根據本發明之目的，再提出一種半導體設備之防震保護 方法。其步驟包括：提供一半導體設備並將其活動設置 於一移動載具上，並將移動載具移動地設置於一平台之 一特定位置上。提供至少一感測器量測半導體設備的一 運動資訊後，將運動資訊傳送予一控制單元。控制單元 接收此運動資訊，並根據此運動資訊運算對應產生一第 一訊號。當感測器量測半導體設備所得到的運動資訊不 符一預設值時，控制單元即傳遞第一訊號予驅動單元， 使驅動單元根據第一訊號產生對應於第一訊號的作用力 ，此作用力為與半導體設備之運動相反之作用力，此作 用力驅動移動載具以帶動半導體設備進行與運動資訊相 反的運動，使得半導體設備能透過移動載具維持在特定 位置上。 [0011] 其中，本發明所述之防震保護方法，更包含一預測運動 資訊的步驟，步驟包括：提供一估計器產生一運動預測 資訊，估計器根據此運動資訊進行校正，並再產生一運 動預測資訊。 099124813 表單編號A0101 第6頁/共19 1 0992043587-0 201205706 [0012] 其中，估計器校正次數達到控制單元的一設定次數時， 控制單元根據運動預測資訊產生一第二訊號。當估計器 校正次數到達該控制單元的設定次數，且運動預測資訊 不符預設值時，控制單元傳遞第二訊號予驅動單元，驅 動單元根據第二訊號產生對應此第二訊號的作用力，並 施加於移動載具帶動半導體設備進行與運動預測資訊相 反的運動。 [0013] 承上所述，依本發明之半導體設備之防震裴置及其防震 ◎ 保護方法，其可具有一或多個下述優點： [0014] (1)此半導體設備之防震保護裝置及其防震保護方法可 藉由估計器預估半導體設備的下一個動作，進而提供對 應於半導體設備動作的反作用力於半導體設備，達到提 早保護半導體設備的效果。 [0015] (2)此半導體設備之防震保護裝置及其防震保護方法， 其控制單元内具有相關半導體設備運動資訊的預測值， 當感測器量測的半導體設備之運動資訊不符合此預設值 ❹ 時，控制器即啟動驅動單元施加反作用力於半導體設備 ，進而達到主動防震保護半導體設備之效用。 【實施方式】 [0016] 請參閱第1圖，係為本發明之半導體設備之防震保護裝置 之方塊圖。圖中，半導體設備之防震保護裝置1包含一移 動載具2、一感測器3、一控制單元4以及一驅動單元5， 其中控制單元4包含一估計器41。半導體設備6設於移動 載具2並連結感測器3。感測器3連結控制單元4。控制單 元4係電性連結感測器3與驅動單元5。移動載具2係設置 099124813 表單編號 A0101 第 7 頁/共 19 頁 0992043587-0 201205706 在平台之一特定位置上，在移動載具2上可提供設置一 半導體設備6。感測器3係量測半導體設備6的運動資訊， 並將里測到之運動資訊31傳至控制單元4。接著控制單元 嫌據運動資訊31運算產生對應此運動的一第一訊 號44，且控制單元4内可設定有一預設值42、。當感測器3 量測到之半導體設備6的運動資訊31的值不符合此預設值 夺控制單凡4即傳遞第一訊號44以啟動驅動單元5驅 移動載具2，用以帶動半導體設備6進行與感測器3量測 之運動資訊31相反的運動。 [0017] [0018] 值得一提的是，控制單元4包含有—估計器41，係預測半 導體設備6的運動，進而產生運動預測資訊412。當感測 器3量測之運動資訊31傳至控制單元4，估計器〇即根據 運動資訊31校正自身預測的運動預測資訊412。當估計器 產生的運動預測寊訊412進行校正的次數到達控制單元 4内的设定次數43時，控制單元4改以根據估計器41產生 的運動預測資訊412進行運算，而產生對應此運動預測資 讯412的一第二訊號45，笔二卿號託係用以啟動驅動單元 5驅動移肖载具2，進-步帶動半導體設備6進行與感測器 3量測之運動資訊31相反的運動。 研參閲第2圖’係為本發明之半導體設備之防震保護裝置 第一實施例之示意圖。圖中，半導體設備6係設置於一移 動栽具2上，移動載具2係設在一平台8之一特定位置上， 平。8包含一上基座81以及一下基座82 ,上基座81係透過 至；彈丨生阻尼器7連接下基座82 ,其中彈性阻尼器7可 協助吸收定量的震動能量，藉此限制半導體設備6之垂直 099124813 表單編號A0101 第8頁/共19頁 0992043587-0 201205706 位移，在本實例中可為Z軸向的移動。且移動載具2係活 動的被設在上基座81上，藉此限制半導體設備6之水平位 移，亦即X軸向以及Y轴向的移動。驅動單元5係設在平台 8與移動載具2的周圍。感測器3係設在移動載具2上，用 以感測半導體設備6的運動資訊31，如位移、速度、加速 度、震動頻率等，並將半導體設備6的運動資訊31傳送至 控制單元4。控制單元4電性連結驅動單元5及感測器3。 控制單元4係為内部具有回饋系統之微電腦裝置，用以接 收感測器3所量測的半導體設備6的運動資訊31。 〇 [0019] 又，控制單元4的回饋系統包含一估計器41，估計器41用 以預測半導體設備6的運動，進而產生一運動預測資訊 412。控制單元4根據半導體設備6的運動資訊31進行運算 產生對應此運動資訊31的一第一訊號44，並將此訊號傳 遞至驅動單元5。驅動單元5根據第一訊號44進行與半導 體設備6的運動資訊31相反的運動，進而達到防震的目的 〇 Ο [0020] 值得注意的是，雖然前述為了表示量測半導體設備6的運 動資訊31，將單個感測器3、驅動單元5以及控制單元4的 位置設置在移動載具3周圍，但熟悉此項技藝者當可輕易 理解並可延伸至不同的位置及數量，端看使用者之設定 ，其中驅動單元5可包括電機裝置、電磁裝置、可變阻尼 器以及微機電裝置的其中之一。 [0021] 本實施例之感測器3為可同時量測速度以及位移之感測器 3，驅動單元5採用電磁驅動裝置，控制單位4之預設值42 係以速度為基準，但實際實施時不限於此。當感測器3量 099124813 表單編號A0101 第9頁/共19頁 0992043587-0 201205706 測到半導體設備6因震動或衝擊而產生的速度與位移後， 感測器3將半導體設備6的速度與位移傳遞至控制單元4。 控制單元4將根據半導體設備6的速度積分運算可產生對 應此速度的力，並再將此力轉換成第一訊號44，此第一 訊號44為電流訊號。當半導體設備6的速度超過或接近控 制單元4裡的預設速度值時，控制單元4傳遞第一訊號至 驅動單元5，驅動單元5為電磁驅動單元將根據此第一訊 號產生對應的磁力，此磁力係與半導體設備6運動之受力 相反，藉此將半導體設備6反推，使其滯留於特定位置上 ，在本實施例中，特定位置係為平台之中心的位置。反 之，當半導體設備6的速度不符控制單元4裡的預設速度 值時，控制單元4則不將第一訊號44傳遞至驅動單元5， 即不啟動驅動單元5。 [0022] 當感測器3回傳半導體設備6的速度及位移至控制單元4時 ，控制單元4不僅運算產生第一訊號44，同時於控制單元 4内部的估計器41會產生半導體設備6的預估速度以及預 估位移。當感測器3回傳半導體設備6的實際速度及位移 至控制單元4時，估計器41會根據實際量測的速度以及位 移進行預測速度以及位移值的校正。當校正次數到達控 制單元5的設定次數43時，控制單元5改以根據估計器41 所產生半導體設備6的預估速度進行積分運算，產生對應 此預估速度的力，再將此力轉換成第二訊號45，此第二 訊號45亦為電流訊號。驅動單元5為電磁驅動單元將根據 此第二訊號45產生對應的磁力，此磁力係與半導體設備6 運動之受力相反，且此磁力為對應預測速度所產生之磁 099124813 表單編號A0101 第10頁/共19頁 0992043587-0 201205706 [0023] ❹ [0024] [0025] [0026] [0027] Ο [0028] [0029] [0030] [0031] 099124813 力’故在半導體設備6發生運動可以達到即時反制半導體 設備6運動的效果，使半導體設備6在受震動或衝擊時依 然保持在中心的位置。在此感測器3以及驅動單元5可設 置於半導體設備6周圍，各別限制半導體設備6於Ζ軸、χ 軸以及Υ軸上之行動，如此一來半導體設備之防震保護裝 置1即可達到三維防震的目的。且彈性阻尼器7也可與感 測器3以及驅動單元5同時使用於各軸上。 請參閱第3圖，係為本發明之用於半導體設備之防震保護 方法之流程圖。其步驟係包括： 531 :提供一半導體极備並將其活動地設置於一移動載具 9 532 :將移動載具活動地設置於一平台之一特定位置上； 533 :提供至少一感測器量測半導體設備的一運動資訊， 並傳送運動資訊予一控制單元； , 534 :控制單元接收運動資訊，並根捧祥動資訊 進行運算產生對應運動資訊的一第一1^號1 ; 535 :以控制單元判斷運動資訊是否不符一預設值，若是 進行步驟S36，否則進行步驟s38 ’ 536 :控制單元將第-訊號傳遞至驅動單几’ 537 :驅動單元根據第-訊號驅動移動載具帶動半導體設 備進行與運動資訊反向的運動’使半導體攻備透過移動 載具維持在特定位置上，姐一步驟S34 ;以及 538 :控制單元不將第-訊號傳遞至驅動單疋’即不啟動 表單編號A0101 第11頁/共19真 0992043587-0 201205706 驅動單元，並回到步驟S34。 [0032] [0033] [0034] [0035] [0036] [0037] [0038] [0039] [0040] [0041] [0042] 本發明之半導體設備之防震保護方法，其中更包含一預 測運動資訊的步驟，請參閱第4圖，係為本發明之防震保 護方法的預測運動資訊步驟之流程圖。該步驟係包括： 541 :提供一估計器產生一運動預測資訊； 542 :估計器根據運動資訊校正運動預測資訊； 543 :判斷估計器的校正次數是否達到控制單元的設定次 數，若否進行步驟S44，若是進行步驟S46 ; 544 :若否，則控制早元根據運動資訊運算產生第一訊號 ， 545 :驅動單元根據第一訊號驅動移動載具帶動半導體設 備進行與運動資訊反向的運動，再進行步驟S41 ; 546 :若是，則控制單元根據運動預測資訊運算產生第二 訊號，再進行步驟S47 ; 547 :判斷估計器產生的運動預測資訊是否不符一預設值 ，若是進行步驟S48，否則進行步驟S49 ; 548 :若是，則驅動單元根據第二訊號驅動移動載具帶動 半導體設備進行與運動資訊反向的運動，再進行步驟S41 :以及 549 :若否，則控制單元不將第二訊號傳遞至驅動單元， 即不啟動驅動單元，再進行步驟S41。 綜上所述，本發明之半導體設備之防震保護裝置及其防 099124813 表單編號A0101 第12頁/共19頁 0992043587-0 201205706 震保護方法至少具有下列優點： [0043] 一、克服先前技藝只能以高剛性的建築結構體來抵抗震 動的能量，而發展出主動式的防震保護裝置保護半導體 設備。 [0044] 二、藉由估計器預估半導體設備的下一個動作，可提供 對應於半導體設備動作的反作用力於半導體設備，藉此 提早保護半導體設備，而不致對半導體製程造成影響， 故能提高半導體製程的穩定性。 〇 [0045] 以上所述僅為舉例性，而非為限制性者。任何未脫離本 發明之精神與範疇，而對其進行之尊效修改或變更，均 應包含於後附之申請專利範圍中。 [0046] 【圖式簡單說明】 第1圖係為本發明之半導體設備之防震保護裝置之方塊圖 〇 [0047] 第2圖係為本發明之半導體設備之防震保護裝置第一實施 例之示意圖。 第3圖係為本發明之用於半導體設備之防震保護方法之流 程圖。 第4圖係為本發明之防震保護方法的預測運動資訊步驟之 流程圖。 【主要元件符號說明】 1 :半導體設備之防震保護裝置 2:移動載具 3 :感測器 099124813 表單編號A0101 第13頁/共19頁 0992043587-0 201205706 31 ··運動資訊 4 :控制單元 41 :估計器 412 :運動預測資訊 42 :預設值 43 :設定次數 44 :第一訊號 45 :第二訊號 5 :驅動單元 6:半導體設備 7:彈性阻尼器 8 :平台 81 :上基座 82 :下基座 S3卜S38、S4卜S49 :步驟 099124813 表單編號A0101 第14頁/共19頁 0992043587-0201205706 VI. Description of the Invention: [Technical Field] [0001] The present invention relates to an anti-vibration protection device and a seismic protection method thereof, and more particularly to an anti-vibration protection device for a semiconductor device and a shock protection method thereof. [Prior Art [0002] The semiconductor factory has been designed to increase the structural rigidity, and the steel structure is resistant to the impact of vibration, and the cost is also increased. In addition, the toughness of the building structure can be improved to achieve the function of seismic resistance, and the deformation and vibration of the structure can be used to offset the energy of the shock. The anti-vibration design can be divided into passive and active. The passive device absorbs impact energy by material deformation and friction damping. The passive control system is economical and stable. The active damping system drives the anti-vibration mechanism with the sensor back vibration signal. Also, the semiconductor device is a high-tech, high-precision device that is quite sensitive to vibration. When the vibration is large, the system will have an error in reading the data, which has a great influence on the semiconductor process. Therefore, the inventors of the present invention have considered and designed a shockproof protection device for the semiconductor device and Its anti-seismic protection method aims to improve the lack of existing technology, thereby enhancing the implementation and utilization of the industry. SUMMARY OF THE INVENTION [0003] In view of the above-described problems of the prior art, it is an object of the present invention to provide an anti-vibration protection device for a semiconductor device to solve the problem that the semiconductor device is easily affected by vibration or shaking of the semiconductor device. In accordance with the purpose of the present invention, a shock protection device for a semiconductor device is proposed. The anti-vibration protection device has a mobile vehicle, at least one sensor, to 099124813 Form No. A0101 Page 4/19 pages 0992043587-0 201205706 少 One less drive unit and one control unit. The mobile carrier is placed at a specific location on a platform and provides a semiconductor device. The sensor is placed on the mobile carrier to sense and transmit a motion information of the mobile vehicle. The driving unit surrounds the periphery of the moving carrier on the platform, and drives the mobile carrier to drive the semiconductor device to move. The control unit is electrically connected to the sensor and the driving unit. The control unit receives the motion information of the semiconductor device measured by the sensor, and performs an operation according to the motion information to generate a first signal corresponding to the motion information. When the motion information of the semiconductor device measured by the sensor does not meet a predetermined value, the control unit transmits the first signal to the driving unit, and the driving unit generates a force opposite to the motion of the semiconductor device according to the first signal. The force-driven mobile vehicle drives the semiconductor device to perform a motion opposite to the motion information, thereby suppressing the shock or impact of the semiconductor device, and maintaining the semiconductor device at a specific position, thereby achieving the purpose of protecting the semiconductor device. [0005] wherein the control unit further includes an estimator that estimates the motion of the semiconductor device to generate a motion prediction information. When the sensor transmits the motion information of the actually measured semiconductor device to the control unit, the estimator simultaneously corrects the motion prediction information based on the motion information. Wherein, when the number of corrections of the estimator reaches a set number of times of the control unit, the control unit performs an operation based on the motion prediction information generated by the estimator, and generates a second signal corresponding to the motion prediction information. The control unit transmits the second signal to the driving unit, and the driving unit generates a force corresponding to the second signal according to the second signal, and applies a force to the semiconductor device through the moving carrier to cause the semiconductor device to perform a motion opposite to the motion prediction information. 099124813 Form No. Α0101 Page 5 of 19 0992043587-0 201205706 [0007] The platform includes an upper base and a lower base. The upper pedestal carries the mobile carrier and the semiconductor device, and the upper pedestal is connected to the lower pedestal through at least one elastic damper to limit the vertical displacement of the semiconductor device. [0008] wherein the mobile carrier carries the semiconductor device and is movably disposed on the upper pedestal of the platform to limit the horizontal displacement of the semiconductor device. [0009] wherein the driving unit comprises one of a motor device, an electromagnetic device, a variable damper, and a micro-electromechanical device. [0010] According to an object of the present invention, a shock protection method for a semiconductor device is further proposed. The steps include: providing a semiconductor device and setting its activity on a mobile carrier, and moving the mobile carrier to a specific location on a platform. After providing at least one sensor to measure a motion information of the semiconductor device, the motion information is transmitted to a control unit. The control unit receives the motion information and generates a first signal according to the motion information operation. When the motion information obtained by the sensor measuring semiconductor device does not match a preset value, the control unit transmits the first signal to the driving unit, so that the driving unit generates a force corresponding to the first signal according to the first signal, and the function The force is the opposite of the motion of the semiconductor device that drives the mobile carrier to drive the semiconductor device to perform motion opposite to the motion information so that the semiconductor device can be maintained in a particular position through the mobile carrier. [0011] The anti-seismic protection method of the present invention further includes a step of predicting motion information, the step comprising: providing an estimator to generate a motion prediction information, the estimator correcting according to the motion information, and generating a motion again. Forecast information. 099124813 Form No. A0101 Page 6 / 19 1 0992043587-0 201205706 [0012] When the number of estimator corrections reaches a set number of times of the control unit, the control unit generates a second signal according to the motion prediction information. When the number of times of the estimator correction reaches the set number of the control unit, and the motion prediction information does not match the preset value, the control unit transmits the second signal to the driving unit, and the driving unit generates a force corresponding to the second signal according to the second signal, and Applying to the mobile carrier drives the semiconductor device to perform a motion opposite to the motion prediction information. [0013] As described above, the anti-vibration device of the semiconductor device and the anti-vibration ◎ protection method thereof according to the present invention may have one or more of the following advantages: [0014] (1) the anti-shock protection device of the semiconductor device and The anti-seismic protection method can estimate the next action of the semiconductor device by the estimator, thereby providing a reaction force corresponding to the action of the semiconductor device to the semiconductor device, thereby achieving the effect of protecting the semiconductor device early. [0015] (2) The shock protection device of the semiconductor device and the anti-vibration protection method thereof, wherein the control unit has a predicted value of motion information of the related semiconductor device, and the motion information of the semiconductor device measured by the sensor does not meet the preset When the value is ,, the controller activates the driving unit to apply a reaction force to the semiconductor device, thereby achieving the utility of the active anti-shock protection semiconductor device. [Embodiment] FIG. 1 is a block diagram of a shock protection device for a semiconductor device of the present invention. In the figure, the anti-vibration protection device 1 for a semiconductor device comprises a mobile carrier 2, a sensor 3, a control unit 4 and a drive unit 5, wherein the control unit 4 comprises an estimator 41. The semiconductor device 6 is provided on the mobile carrier 2 and is coupled to the sensor 3. The sensor 3 is connected to the control unit 4. The control unit 4 electrically connects the sensor 3 and the drive unit 5. Mobile Vehicle 2 Series Settings 099124813 Form Number A0101 Page 7 of 19 0992043587-0 201205706 A semiconductor device 6 can be provided on the mobile carrier 2 at a specific location on the platform. The sensor 3 measures the motion information of the semiconductor device 6, and transmits the motion information 31 measured to the control unit 4. Then, the control unit generates a first signal 44 corresponding to the motion by the motion information 31, and a preset value 42 can be set in the control unit 4. When the value of the motion information 31 of the semiconductor device 6 measured by the sensor 3 does not meet the preset value, the first signal 44 is transmitted to activate the driving unit 5 to drive the carrier 2 to drive the semiconductor. The device 6 performs a motion opposite to the motion information 31 measured by the sensor 3. [0018] It is worth mentioning that the control unit 4 includes an estimator 41 for predicting the motion of the semiconductor device 6, thereby generating motion prediction information 412. When the motion information 31 measured by the sensor 3 is transmitted to the control unit 4, the estimator corrects the motion prediction information 412 predicted by itself based on the motion information 31. When the number of times the motion prediction signal generated by the estimator is corrected reaches the set number of times 43 in the control unit 4, the control unit 4 performs an operation based on the motion prediction information 412 generated by the estimator 41 to generate a motion prediction corresponding thereto. A second signal 45 of the information 412 is used to activate the driving unit 5 to drive the shifting vehicle 2, and the semiconductor device 6 is driven to perform the opposite of the motion information 31 measured by the sensor 3. motion. 2 is a schematic view of a first embodiment of a shock protection device for a semiconductor device of the present invention. In the figure, the semiconductor device 6 is disposed on a moving device 2, and the moving carrier 2 is disposed at a specific position of one of the platforms 8, and is flat. 8 includes an upper base 81 and a lower base 82 through which the upper base 81 is transmitted; the elastic damper 7 is coupled to the lower base 82, wherein the elastic damper 7 assists in absorbing a predetermined amount of vibration energy, thereby limiting the semiconductor Vertical of the device 6 099124813 Form No. A0101 Page 8 / Total 19 pages 0992043587-0 201205706 Displacement, in this example can be the movement of the Z axis. And the moving carrier 2 is active on the upper base 81, thereby limiting the horizontal displacement of the semiconductor device 6, i.e., the X-axis and the Y-axis. The drive unit 5 is provided around the platform 8 and the mobile carrier 2. The sensor 3 is disposed on the mobile carrier 2 for sensing motion information 31 of the semiconductor device 6, such as displacement, velocity, acceleration, vibration frequency, etc., and transmitting the motion information 31 of the semiconductor device 6 to the control unit 4. . The control unit 4 electrically connects the driving unit 5 and the sensor 3. The control unit 4 is a microcomputer device having a feedback system therein for receiving the motion information 31 of the semiconductor device 6 measured by the sensor 3. Further, the feedback system of the control unit 4 includes an estimator 41 for predicting the motion of the semiconductor device 6, thereby generating a motion prediction information 412. The control unit 4 performs an operation based on the motion information 31 of the semiconductor device 6 to generate a first signal 44 corresponding to the motion information 31, and transmits the signal to the driving unit 5. The driving unit 5 performs the opposite movement of the motion information 31 of the semiconductor device 6 according to the first signal 44, thereby achieving the purpose of anti-vibration. [0020] It is noted that although the foregoing describes the motion information 31 of the semiconductor device 6, The positions of the single sensor 3, the driving unit 5 and the control unit 4 are arranged around the mobile carrier 3, but those skilled in the art can easily understand and extend to different positions and numbers, and look at the user's settings. The drive unit 5 may include one of a motor device, an electromagnetic device, a variable damper, and a micro-electromechanical device. [0021] The sensor 3 of the embodiment is a sensor 3 capable of simultaneously measuring speed and displacement, the driving unit 5 adopts an electromagnetic driving device, and the preset value 42 of the control unit 4 is based on the speed, but the actual implementation The time is not limited to this. When the sensor 3 amount 099124813 Form No. A0101 Page 9 / Total 19 page 0992043587-0 201205706 After detecting the speed and displacement of the semiconductor device 6 due to vibration or shock, the sensor 3 will speed and shift the semiconductor device 6 Transfer to the control unit 4. The control unit 4 will generate a force corresponding to the speed according to the speed integral operation of the semiconductor device 6, and then convert the force into a first signal 44, which is a current signal. When the speed of the semiconductor device 6 exceeds or approaches the preset speed value in the control unit 4, the control unit 4 transmits a first signal to the driving unit 5, and the driving unit 5 is an electromagnetic driving unit that generates a corresponding magnetic force according to the first signal. This magnetic force is opposite to the force of the movement of the semiconductor device 6, whereby the semiconductor device 6 is reversely pushed back to a specific position. In the present embodiment, the specific position is the position of the center of the platform. Conversely, when the speed of the semiconductor device 6 does not match the preset speed value in the control unit 4, the control unit 4 does not pass the first signal 44 to the drive unit 5, i.e., does not activate the drive unit 5. [0022] When the sensor 3 returns the speed and displacement of the semiconductor device 6 to the control unit 4, the control unit 4 not only operates to generate the first signal 44, but also the estimator 41 inside the control unit 4 generates the semiconductor device 6. Estimated speed and estimated displacement. When the sensor 3 returns the actual speed and displacement of the semiconductor device 6 to the control unit 4, the estimator 41 performs the correction of the predicted speed and the displacement value based on the actually measured velocity and the displacement. When the number of corrections reaches the set number of times 43 of the control unit 5, the control unit 5 performs an integral operation based on the estimated speed of the semiconductor device 6 generated by the estimator 41, generates a force corresponding to the estimated speed, and converts the force into The second signal 45, the second signal 45 is also a current signal. The driving unit 5 is an electromagnetic driving unit that generates a corresponding magnetic force according to the second signal 45. The magnetic force is opposite to the force of the movement of the semiconductor device 6, and the magnetic force is the magnetic generated by the corresponding predicted speed. 099124813 Form No. A0101 Page 10 [1923] 0992043587-0 201205706 [0023] [0023] [0027] [0027] [0029] [0031] 099124813 force 'so that the movement of the semiconductor device 6 can be achieved instantly The effect of counteracting the movement of the semiconductor device 6 causes the semiconductor device 6 to remain in the center position when subjected to shock or impact. The sensor 3 and the driving unit 5 can be disposed around the semiconductor device 6 to limit the actions of the semiconductor device 6 on the x-axis, the x-axis and the x-axis, so that the anti-shock protection device 1 of the semiconductor device can reach The purpose of three-dimensional shockproof. And the elastic damper 7 can also be used on the respective shafts together with the sensor 3 and the drive unit 5. Referring to Fig. 3, there is shown a flow chart of a method for preventing shock protection of a semiconductor device of the present invention. The steps include: 531: providing a semiconductor device and movably disposed on a mobile carrier 9 532: movably placing the mobile carrier at a specific position on a platform; 533: providing at least one sensor Measuring a motion information of the semiconductor device, and transmitting the motion information to a control unit; 534: the control unit receives the motion information, and controls the motion information to generate a first 1^ number 1 corresponding to the motion information; 535: The control unit determines whether the motion information does not match a preset value. If the process proceeds to step S36, otherwise step s38 '536: the control unit transmits the first signal to the drive list 537: the drive unit drives the mobile vehicle according to the first signal drive The semiconductor device performs a motion opposite to the motion information 'to maintain the semiconductor attack at a specific position through the mobile carrier, the first step S34; and 538: the control unit does not pass the first signal to the drive unit' No. A0101 Page 11 / Total 19 True 0992043587-0 201205706 Drive unit, and return to step S34. [0035] [0040] [0042] [0042] The anti-seismic protection method of the semiconductor device of the present invention further includes a predicted motion information For the steps, please refer to FIG. 4, which is a flow chart of the steps of predicting motion information of the anti-seismic protection method of the present invention. The step includes: 541: providing an estimator to generate a motion prediction information; 542: the estimator corrects the motion prediction information according to the motion information; 543: determining whether the number of corrections of the estimator reaches the set number of times of the control unit, and if not, performing step S44 If the process proceeds to step S46; 544: if no, the control element generates the first signal according to the motion information operation, 545: the driving unit drives the mobile device to drive the semiconductor device to perform the motion opposite to the motion information according to the first signal, and then Step S41; 546: If yes, the control unit generates a second signal according to the motion prediction information operation, and then proceeds to step S47; 547: determines whether the motion prediction information generated by the estimator does not match a preset value, if step S48 is performed, otherwise steps are performed. S49; 548: If yes, the driving unit drives the mobile device to drive the semiconductor device to perform motion opposite to the motion information according to the second signal, and then proceeds to steps S41 and 549: if not, the control unit does not transmit the second signal to The drive unit, that is, the drive unit is not activated, proceeds to step S41. In summary, the anti-vibration protection device for the semiconductor device of the present invention and its anti-099124813 Form No. A0101 Page 12 of 19 0992043587-0 201205706 The seismic protection method has at least the following advantages: [0043] 1. Overcoming the prior art can only The high-rigidity building structure resists the energy of vibration, and an active anti-shock protection device is developed to protect the semiconductor device. [0044] 2. By estimating the next action of the semiconductor device by the estimator, a reaction force corresponding to the action of the semiconductor device can be provided to the semiconductor device, thereby protecting the semiconductor device early without affecting the semiconductor process, thereby improving The stability of the semiconductor process. The above description is by way of example only and not as a limitation. Any modification or modification of the privilege that is made without departing from the spirit and scope of the invention should be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram of a shock protection device for a semiconductor device of the present invention. FIG. 2 is a schematic view showing a first embodiment of a shock protection device for a semiconductor device according to the present invention. . Fig. 3 is a flow chart of the anti-vibration protection method for a semiconductor device of the present invention. Fig. 4 is a flow chart showing the steps of predicting motion information of the anti-seismic protection method of the present invention. [Description of main component symbols] 1 : Shockproof device for semiconductor equipment 2: Mobile carrier 3: Sensor 099124813 Form No. A0101 Page 13 of 19 0992043587-0 201205706 31 ··Motion Information 4: Control Unit 41: Estimator 412: Motion prediction information 42: preset value 43: set number of times 44: first signal 45: second signal 5: drive unit 6: semiconductor device 7: elastic damper 8: platform 81: upper base 82: lower Base S3 Bu S38, S4 Bu S49: Step 099124813 Form No. A0101 Page 14 / Total 19 Page 0992043587-0