201203304 六、發明說明： 【發明所屬之技術領域】 本發明係一種電流保護的元件結構，係提供一種玎避免電弧 效應產生’並可供輕、薄、短、小之電器設備使用，以符合市場 的需求之結構。 【先前技術】 ® 現有的保線絲，其大都係由二相互疊合之基板所構成，並於 一基板之間夾設有一熔斷體，另於二基板之兩側分別設有一電 極，電極係電性連接熔斷體，其中，該基板為一實心體。 於理想狀態巾’當過大電流通過崎體，麟體會產生溶斷 之現象，但於實際狀態中，熔斷體於熔斷時所產生壓力，因受到 貫之基板的限制’而播法卸除’使得原本應溶斷之炫斷體仍有 #部分依舊處於連接狀態中，如此會有電弧效性之產生，進而使得 電路安全無法糾轉，並會使絲設備受損、燒毀、傷害或危 險事故等發生。 因此’現有的保險絲無法符合電器設備輕、帛、短、小的趨 勢，而且亦無法滿足市場的需求。 【發明内容】 種電流保護的元件結 ’以符合市場的需求， 有鑒於上述之缺點，本發明係提供一 構，其可供輕、薄、短、小之電器設備使用 201203304 以保護電 而且能避免電弧效應的產能，並讓電路安全受到保障， 器設備。 本發明之目的錄提供—種錢傾的元躲構，其具有依 序疊設之第-基板、支撐層、線路層與第二基板，第—基板相對 於支撐層的-面為設置面，第二基板相對於線路層的—面為貼合 面，貼合面具有第二凹穴，二電極係設於已疊合之第—基板、^ 撐層、線路層與第二基板之兩側，二電極係電性連接線路層。 該設置面可進—步具有第-凹穴，第1穴中可具有^一辅 助凹穴，第二凹穴可具有第二輔助凹穴。 本發明之又-目的在於提供一種電流保護的元件結構，宜呈 有依序疊狀第-基板、第一支撐層、第一線路層、中基板、、第 -線路層、第二支撐層與第二基板，中基板具有貫孔，二電極， 其係設於已叠合之第—基板 '第—支制、該第_線路層、中基 板、第二電路層、第二支撐層與第二基板之兩側，二電極係電性 連接该第一線路層與該第二線路層。 ,、 本發明之再—目的在於提供—_聽制元件結構，盆呈 =叠:之第一支撐層、第一線路層、第，、第二支樓 θ、第一線路層、第二中基板、第三線路層、第 基:，第-中基板具有第一貫孔，第二中基板具:第= 二線路層具有導電柱，導電柱係穿過第二切 、第 而使第二線峨性； 電枉係穿過第二中基板，而使第三線路層電錢接第 Γ 1 201203304 層，二電極係設於已疊合之第一基板、第一支撐層、第一線路層、 第一中基板、第二支撐層、第二線路層、第二中基板、第三支撐 層、第三線路層與第二基板之兩側，其一電極係電性連接第三線 路層，另一電極係電性連接第一線路層。 如上所述之凹穴、輔助凹穴或貫孔的設計，其係使線路層於 炼斷時所產生之壓力，得以由凹穴、輔助凹穴或貫孔卸除，進而 使線路層得以完全、賴’以贼電弧賴的紅，*本發明得以 可供輕、薄、短、小之電器設備使用，以符合市場的需求，並可 保護電器設備。 【實施方式】201203304 VI. Description of the Invention: [Technical Field] The present invention is a current-protected component structure that provides an electrical device that can be used for light, thin, short, and small electrical appliances to meet the market. The structure of the demand. [Prior Art] ® The existing wire is mostly composed of two substrates which are superposed on each other, and a fuse is sandwiched between the substrates, and an electrode is arranged on both sides of the two substrates. The fuse is connected, wherein the substrate is a solid body. In the ideal state of the towel, when a large current passes through the body, the body will be dissolved. However, in the actual state, the pressure generated by the fuse in the fuse is removed by the restriction of the substrate. The part of the blunt body that should be dissolved is still in the connected state, so there will be arc effect, which will make the circuit safe and cannot be corrected, and the wire equipment will be damaged, burned, injured or dangerous. . Therefore, the existing fuses cannot meet the trend of light, sturdy, short, and small electrical equipment, and they cannot meet the market demand. SUMMARY OF THE INVENTION A current-protected component node is designed to meet the needs of the market. In view of the above disadvantages, the present invention provides a structure that can be used for light, thin, short, and small electrical equipment to protect electricity and energy. Avoid the effects of arcing, and keep circuit safety protected. The object of the present invention provides a meta-concealed structure, which has a first substrate, a support layer, a circuit layer and a second substrate which are sequentially stacked, and the first substrate is disposed opposite to the surface of the support layer. The second substrate is a bonding surface with respect to the surface of the circuit layer, the bonding surface has a second recess, and the two electrodes are disposed on the two sides of the laminated first substrate, the supporting layer, the circuit layer and the second substrate The two electrodes are electrically connected to the circuit layer. The set surface may have a first recess, the first pocket may have an auxiliary pocket, and the second pocket may have a second auxiliary pocket. Still another object of the present invention is to provide a current-protected component structure, which preferably has a sequentially stacked first substrate, a first support layer, a first circuit layer, a middle substrate, a first circuit layer, and a second support layer. a second substrate, the middle substrate has a through hole, and the two electrodes are disposed on the overlapped first substrate, the first layer, the first circuit layer, the middle substrate, the second circuit layer, the second support layer, and the second substrate Two sides of the two substrates are electrically connected to the first circuit layer and the second circuit layer. Further, the present invention aims to provide a structure of the audible component, the basin is = stack: the first support layer, the first circuit layer, the second, the second branch θ, the first circuit layer, the second middle a substrate, a third circuit layer, and a base: the first intermediate substrate has a first through hole, and the second intermediate substrate has a second conductive layer having a conductive pillar, the conductive pillar passing through the second cut, and the second The electric raft is passed through the second intermediate substrate, and the third circuit layer is connected to the first layer of 201203304, and the two electrodes are disposed on the first substrate, the first supporting layer, and the first line that have been stacked. a layer, a first middle substrate, a second supporting layer, a second circuit layer, a second intermediate substrate, a third supporting layer, a third circuit layer and two sides of the second substrate, wherein one of the electrodes is electrically connected to the third circuit layer The other electrode is electrically connected to the first circuit layer. The design of the recess, the auxiliary recess or the through hole as described above is such that the pressure generated by the circuit layer during the refining can be removed by the recess, the auxiliary recess or the through hole, thereby completing the circuit layer completely. Lai's red with the thief arc, * The invention can be used for light, thin, short, and small electrical equipment to meet the needs of the market and to protect electrical equipment. [Embodiment]
清配合參考第一及二圖所示，本發明係一種電流保護的元件 結構之第—實施例，其具有一第一基板丄〇、一支撐層1 1、一 、、氣路層1 2、一第二基板1 3與二電極1 4、1 5。 第一基板10與第二基板i 3係相互疊設，以將支撐層丄 及線路層12炎設於第一基板10與第二基板13之間，第一 板1〇相對於支樓層丄丄的一面為設置面丄〇 〇 =具有一第一凹穴1〇1，第一基板1〇的另一面· u J，顯不面1〇 2可選擇性設有一標示1〇 3，第一某 ^相對於線路層i 2的—面為貼合面i 3 Q，貼合面丄^ 〇了第2凹穴131，第二凹穴131之空間係大於第一凹穴 之空間，第二基板13的另一面為顯示面i 3 2 ’顯示面 201203304 32可選擇性設有標示133，標示133、1Q3為規格或文 字之一者。 電極14、15係分別設於上述之已疊合之第一基板丄〇、 支撐層1 1、線路層12與第二基板13之兩側，並且電極丄4、 15係電性連接線路層12。 請配合參考第三圖所示’本發明之電流保護的元件結構之第 二實施例，如第一實施例般係由第一基板2〇、支撐層2丄、線 路層2 2與第二基板2 3疊合而成’二電極24、2 5係設於該 疊口、’口構之兩側’於本實施例中第一凹穴2 〇 〇之空間係等於第 二凹穴2 3 0。 «月配口參考第四、五及六圖所示，本發明之電流保護的元科 結構之第三、四、五實施例，其如第—實施般係由第-基板3 〇、 4 0 5 0、支撐層 3 1、4 1、5 1、線路層 3 2、4 2、5 2與第二基板3 3、4 3、5 3所疊合而成，並於該疊合結構之 兩侧分別設有電極（圖中未示），第-凹穴3 0 〇、4 〇 〇、5 〇 ◦中進一步具有一第一輔助凹穴301、401、501，而第 3 3 1、4 3 基板3 3、4 標示。 -凹八3 30、430、530中亦進-步具有—第二輔助凹穴 、5 31，而第一基板3 〇、4〇、5〇與第二 、5 3之顯示面係可選擇性於其一或二者處設有 .凹=::Γ所示’第，3〇。之_'大於第 201203304 凊再配合參考第五圖所示，第一凹穴4 0 0之空間係等於第 二凹穴4 3 0之空間。 請再配合參考第六圖所示，第—凹穴5 0 0之空間係小於第 二凹穴4 3 0之空間。 請配合參考第七圖所示’本發明之電流碰的元件結構之第 五實施例’其具有-第一基板7 〇、一第一支擇層7 ^、—第— 線路層7 2、-第-中基板7 3、-第二支制7 4、-第二線 路層75、一第二中基板76與二電極（圖中未示）。 第一基板60的一面為設置面6〇〇，設置面6〇〇具有一 第-凹穴6 ϋ1 ’第—支撐層6 i與第―線路層6 2係依序疊設 於5又置面6 Q Q處’中基板6 3係疊設於第-線路層6 2，中美 板6 3中且崎於第—凹穴6 Q i位置處具有—貫孔6 3 〇 二線路層64與第二支撐層65係依序叠設於中基板63，第二 基板6 6係疊設於第二支撐層6 5處，第二基板6 6相對於第= 支撐層6 5的-面為貼合面6 6 〇，貼合面6 6 〇具有―第二: 穴6 6 1°另將電極分職於第—基板 第-線路層6 2、中基板6 3'第二線路層6 4、第:二 板6 6之疊合結構的兩侧，電極細生連接 層Θ2與第二線路層64。 —第基板6 0的另—面為顯示面，第二基板6 6的另 ’、’、員不面’於其-顯7Γ：面或二_示面處可轉性設有標示。 。月配合參考第人_示，本發明之電流保護的元件結構之第 201203304 六實施例’其具有—第—基板7〇、一第一支撐層7卜一第一 線路層7 2、—第—恤7 3、—第： 路層7 5、一筮- 。 弟 第-中基板76、-第三線路層7 7、_第：支樓 層78與-第二基板79。 第一錢 展7支樓層71、第—線路層7 2、第—中基板7 3、第二 '曰_ 4、第二線路層7 5、第二中基板7 6、第三線路層7 ^第三支撐層7 δ與第二基板7 9係依序疊設於第—基板^ 為—堆疊結構’第二線路層7 5具有-導電柱了 5 0， =柱7 5 Q财過第二域層7 4料—中基板7 3，以使第 層7 5相蝴峨1三線路層7 7 \ 一導電柱7 70，導電柱77◦係穿過第二中基板76，以 $第一線路層77電性連接第二線路層Η，其中，第一中基板 3中具有-第-貫孔7 3 〇，第二中基板7 6中具有一第二貫 〇紐—電極（®中未示）分別設於該堆疊機構之兩側， 線路層72係電性連接其一電極，第三線路層77係電性連 接另一電極。 一第基板7 0的另-面為顯示面，第二基板7 9的另一面為 、丁面於其‘顯不面或二顯示面處可選擇性設有標示。 /々上所述之各實〜例，基板為為陶兗㈣，線路層與導電柱 係為可導電之合金或可導電之合成材料所製。 凹八輔助凹八與貝孔之設計，其係當線路層因通過之電流 過大，而產纽_情鱗，線路層_向喊、獅喊或 I 〇 i 201203304 孔方向熔斷，以使線關紋全_，而戦產生電弧效應，並 且凹穴、輔助凹穴或貫孔係可卸除線路層於熔斷時所產生之壓力。 【圖式簡單說明】 第-圖係本發明之電流保酬元件結構之立體外觀示意圖。 第二圖係本發明之電流倾的元件結構之第—實關之剖面圖。 第三圖係本發明之電流保護的元件結構之第二實施例之局部剖面 圖。 第四圖係本發明之電祕軸元魏構之第三實施狀局部剖面 圖。 第五圖係本發明之電祕_元件轉之細實施狀局部剖面 圖。 第六圖係本發明之電祕_树結構之第五實施例之局部剖面 圖。 第七圖係本發明之電舰_元件轉之第六實施狀局部剖面 圖。 第八圖係本剌之電祕_元騎構之第七實施狀局部剖面 圖。 【主要元件符號說明】 第一基板 10、20、30、40、5〇 100設置面 201203304 第一凹穴 101、200、300、400、500 102 顯示面 10 3 標示 11、 21、31、41、51 支撐層 12、 22、32、42、52 線路層 13、 23、33、43、53 第二基板 130 貼合面 第二凹穴 • 131、230、330、430、530 132 顯示面 13 3 標示 14、 15 電極 301、401、501 第一輔助凹穴 3 3 1、4 3 1、5 31第二輔助凹穴 60 第一基板 • 600設置面 6 0 1 第一凹穴： 61 第一支撐層 6 2 第一線路層 6 3 中基板 6 3 0 貫孔 6 4 第二線路層 6 5 第二支撐層 201203304 6 6 第二基板 660 貼合面 661 第二凹穴 70 第一基板 71 第一支撐層 72 第一線路層 73 第一中基板 • 730第一貫孔 74 第二支撐層 75 第二線路層 750 導電柱 76 第二中基板 760 第二貫孔 77 第三線路層 鲁 7 7 0導電柱 78 第三支撐層 7 9 第二基板As shown in the first and second figures, the present invention is a first embodiment of a current-protected component structure having a first substrate 丄〇, a support layer 1 1 , a , and a gas path layer 2 . A second substrate 13 and two electrodes 14 and 15. The first substrate 10 and the second substrate i 3 are stacked on each other to dispose the support layer and the circuit layer 12 between the first substrate 10 and the second substrate 13. The first board 1 is opposite to the branch floor. One side is a setting surface 丄〇〇=having a first recess 1〇1, the other side of the first substrate 1〇·u J, the display surface 1〇2 can be selectively provided with a mark 1〇3, the first one ^ The surface of the circuit layer i 2 is the bonding surface i 3 Q, the bonding surface 〇 〇 the second cavity 131, the space of the second cavity 131 is larger than the space of the first cavity, the second substrate The other side of the 13 is the display surface i 3 2 'the display surface 201203304 32 can be optionally provided with a mark 133, the mark 133, 1Q3 is one of the specifications or the text. The electrodes 14 and 15 are respectively disposed on the two sides of the stacked first substrate 丄〇, the support layer 11 , the circuit layer 12 and the second substrate 13 , and the electrodes 丄 4 and 15 are electrically connected to the circuit layer 12 . . Referring to the second embodiment of the current-protecting element structure of the present invention, as shown in the third figure, the first substrate 2, the support layer 2, the wiring layer 2 2 and the second substrate are as in the first embodiment. 2 3 superimposed 'the two electrodes 24, 2 5 are arranged on the stack, the two sides of the 'mouth structure'. In the present embodiment, the space of the first recess 2 〇〇 is equal to the second recess 2 3 0 . «The monthly matching port refers to the fourth, fifth and sixth embodiments of the current protection of the present invention. The third, fourth and fifth embodiments of the current protection of the present invention are based on the first substrate 3 〇, 4 0 50, the support layer 3 1, 4 1 , 5 1 , the circuit layer 3 2, 4 2, 5 2 and the second substrate 3 3, 4 3, 5 3 are stacked, and in the two overlapping structures The sides are respectively provided with electrodes (not shown), and the first recesses 3 0 〇, 4 〇〇, 5 进一步 further have a first auxiliary recess 301, 401, 501, and the third 3 1 , 4 3 The substrates 3 3, 4 are labeled. - the concave eight 3 30, 430, 530 also has a second auxiliary recess, 5 31, and the display surfaces of the first substrate 3 〇, 4 〇, 5 〇 and the second, 5 3 are selectable It is provided at one or both of them. The concave =:: Γ shows 'the third, 〇. The _' is larger than the 201203304 凊. Referring to the fifth figure, the space of the first pocket 400 is equal to the space of the second pocket 430. Please refer to the sixth figure again, the space of the first recess 500 is smaller than the space of the second recess 430. Referring to the fifth embodiment of the present invention, the fifth embodiment of the current-carrying element structure of the present invention has a first substrate 7 〇, a first selected layer 7 ^, a first circuit layer 7.2, The first-neutral substrate 7 3, the second support 74, the second wiring layer 75, the second intermediate substrate 76 and the two electrodes (not shown). One side of the first substrate 60 is an installation surface 6〇〇, and the installation surface 6〇〇 has a first recess 6 ϋ1 '. The first support layer 6 i and the first circuit layer 6 2 are sequentially stacked on the 5th surface. 6 QQ's middle substrate 6 3 series is stacked on the first circuit layer 6 2, the middle and the middle plate 6 3 and the bottom of the first hole 6 Q i position has a through hole 6 3 2 circuit layer 64 and the first The second supporting layer 65 is sequentially stacked on the middle substrate 63, the second substrate 66 is stacked on the second supporting layer 65, and the second substrate 66 is attached to the -surface of the second supporting layer 65. Face 6 6 〇, the bonding surface 6 6 〇 has "second: hole 6 6 1 ° and the electrode is divided into the first substrate - the circuit layer 6 2, the middle substrate 6 3' the second circuit layer 6 4, the first : On both sides of the laminated structure of the two plates 66, the electrodes are connected to the second layer 64. The other surface of the second substrate 60 is a display surface, and the other ', ', and the non-face of the second substrate 66 are provided with a mark on the surface of the substrate or the surface of the second substrate. . The monthly cooperation reference numeral _ shows that the current protection component structure of the present invention is 201203304. The sixth embodiment has a -first substrate 7 〇, a first support layer 7 and a first circuit layer 7.2, - Shirt 7 3, - the first: the road layer 7 5, a 筮 -. The first to middle substrate 76, the third circuit layer 7 7 , the _th: the branch layer 78 and the second substrate 79. The first money exhibition 7 floors 71, the first circuit layer 7, the second intermediate substrate 7.3, the second '曰 _ 4, the second circuit layer 7.5, the second intermediate substrate 7.6, the third circuit layer 7 ^ The third supporting layer 7 δ and the second substrate 7 9 are sequentially stacked on the first substrate ^ the stacked structure 'the second circuit layer 7 5 has - the conductive column is 50, the column 7 5 Q the second The domain layer 7 - the middle substrate 7 3, so that the first layer of the 7 5 phase butterfly 1 3 circuit layer 7 7 \ a conductive column 7 70, the conductive column 77 is passed through the second intermediate substrate 76, to the first The circuit layer 77 is electrically connected to the second circuit layer Η, wherein the first middle substrate 3 has a - via-hole 7 3 〇, and the second middle substrate 76 has a second via-electrode (the The circuit layer 72 is electrically connected to one of the electrodes, and the third circuit layer 77 is electrically connected to the other electrode. The other surface of the first substrate 70 is a display surface, and the other surface of the second substrate 7 9 is a surface of the second substrate 79, and the surface of the surface of the second substrate 7 is selectively provided with an indication. In the case of the above-mentioned examples, the substrate is made of ceramics (four), and the circuit layer and the conductive column are made of an electrically conductive alloy or a conductive composite material. The design of the concave eight auxiliary concave eight and the shell hole is that when the circuit layer is too large due to the passing current, the production line is _ _ scale, the line layer _ shouting, lion shouting or I 〇i 201203304 hole direction to make the line off The pattern is full, and the crucible produces an arc effect, and the recess, the auxiliary recess or the through hole can remove the pressure generated by the wiring layer during the fuse. BRIEF DESCRIPTION OF THE DRAWINGS The first figure is a schematic perspective view of the structure of the current-retaining element of the present invention. The second figure is a cross-sectional view of the first embodiment of the current tilting element structure of the present invention. The third figure is a partial cross-sectional view showing a second embodiment of the current-protecting element structure of the present invention. The fourth figure is a partial cross-sectional view of a third embodiment of the electrospindle element of the present invention. Fig. 5 is a partial cross-sectional view showing a detailed embodiment of the electric secret_component rotation of the present invention. Figure 6 is a partial cross-sectional view showing a fifth embodiment of the electric secret tree structure of the present invention. Figure 7 is a partial cross-sectional view showing the sixth embodiment of the electric ship_element of the present invention. The eighth picture is a partial cross-sectional view of the seventh embodiment of the electric secret _ yuan riding structure. [Description of main component symbols] First substrate 10, 20, 30, 40, 5〇100 setting surface 201203304 First recess 101, 200, 300, 400, 500 102 Display surface 10 3 indicates 11, 21, 31, 41, 51 support layer 12, 22, 32, 42, 52 circuit layer 13, 23, 33, 43, 53 second substrate 130 bonding surface second cavity • 131, 230, 330, 430, 530 132 display surface 13 3 mark 14, 15 electrodes 301, 401, 501 first auxiliary pockets 3 3 1 , 4 3 1 , 5 31 second auxiliary pockets 60 first substrate • 600 setting surface 6 0 1 first pocket: 61 first support layer 6 2 First circuit layer 6 3 Medium substrate 6 3 0 through hole 6 4 Second circuit layer 6 5 Second support layer 201203304 6 6 Second substrate 660 Bonding surface 661 Second recess 70 First substrate 71 First support Layer 72 first circuit layer 73 first middle substrate 730 first through hole 74 second support layer 75 second circuit layer 750 conductive column 76 second middle substrate 760 second through hole 77 third circuit layer ru 7 7 0 conductive Column 78 third support layer 7 9 second substrate