201201461 六、發明說明： 【發明所屬之技術領域1 [0001 ] 本發明涉及一種模組連接器及應用於該模組連接器内的 子電路板’尤其涉及一種可於端子之間進行補償從而降 低信號傳輸路徑之間串音干優的模乡且連接器及其内的 電路板σ 1兀*月，Η文调Μ [0002] 與本發明相關之習知技術可參閱於2002年9月曰八生 美國第6447341號發明專利。該專利揭示了 一種模組連接 器，其包括本體部及收容於本體部内的端子模组。端子矣 模組包括-對晶片、配置於晶片内表面的複數導電路捏 及配置於該對晶片之間的複數端子β複數導電路徑中的 -個導電路徑具有第-主體部及連接部。所述導電路柄 的主體部與複數導電端子中的一個端子對齊連接Μ 附於複數導電端子中的另—個端子上，從秘-個端子 與另一個端子之間建立耗合以減少由錢端干涉所產生 的干擾。 國餘連接器的導電端子之_串音干擾仍然未 減小到理想程度。 [〇〇〇4] 所以，有必要對習知 缺陷。的择組連接器進行改良以克服上述 【發明内容】 [0005] 目的在於提供一種可確保信號 到有效降低的模組連接器及該 赛於上述内容，本發明之 傳輸途徑之間串音干擾得 模組連接器内的子電路极 099121350 表單編號Α0101 苐4頁/共24頁 0992037608-0 201201461 - [0006] Ο [0007]201201461 VI. Description of the Invention: [Technical Field 1 of the Invention] [0001] The present invention relates to a module connector and a sub-circuit board applied to the module connector, and particularly relates to a method for compensating between terminals to reduce The crosstalk between the signal transmission path and the connector and the circuit board in the connector σ 1兀*月,Η文Μ [0002] The related art related to the present invention can be referred to in September 2002曰Eight births US Patent No. 6434731 invention patent. This patent discloses a modular connector that includes a body portion and a terminal module housed within the body portion. The terminal 模组 module includes a pair of wafers, a plurality of conductive circuits disposed on the inner surface of the wafer, and a plurality of conductive paths disposed between the pair of transistors. The plurality of conductive paths have a first body portion and a connecting portion. The main body portion of the guiding circuit handle is aligned with one of the plurality of conductive terminals, and is attached to the other of the plurality of conductive terminals, and the friction between the terminal and the other terminal is established to reduce the cost Interference caused by interference at the end. The crosstalk interference of the conductive terminals of the national connector has not been reduced to a desired level. [〇〇〇4] Therefore, it is necessary to be familiar with the defects. The selection connector is modified to overcome the above [expiration] [0005] The object is to provide a module connector that can ensure a signal reduction and the crosstalk between the transmission paths of the present invention. Subcircuit poles in the module connector 099121350 Form number Α0101 苐4 pages/ Total 24 pages 0992037608-0 201201461 - [0006] Ο [0007]
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[0008] 為達成前述目的，本發明提供_種模組連接器，其包括 絕緣本體及收容純緣本體㈣端讀組，端子模組包 括子電路板、4導電料及人個轉接端子，子電路板 具有設置複數導電片的正面及反面、電性連接所述八個 導電端子的卜至“上導魏域及魏連接所述八個 轉接端子的第一至第八下導電區域，所述第一至第八上 導電區域與第-至第人下導電區域分别對齊以構成第一 至第八對導電區域’所述第—至第八對導電區域中的一 對導電區域通過配置於其間的電片建立電性連接 ’另-對導電區域通過配置__另—個導電片建立 電性連接’再—料電區域通料—個導電片建立電性 連接’其中’所述-個導電片與所述再_個導電片輕合 o m丨 本發明提供-種制於模組連接器上的子觀板，其包 括：配置有第-至第四前導電片的正面、配置有第―： 第六後導電片的反面、電性連接人個導電端子的第—至 第八上導電區域及電雜接八個轉接端子的第—至第又 下導電區域’所述第-至第八上導電區域與第—至第1 下導電區域分別對齊以構成第-至第八料電區域，所 述第-至第八對導電區域中的第—對導電區域通過配置 於其間的第-後導電片建立電性連接，第二對導電區域 通過配置於其間的第二後導電片建立電性連接，第:對 導電區域通過第一前導電片建立電性連接，其中，所述 第一前導電片與所述第一後導電片耦合。 a 與習知技術減，本發明具有如下有益絲：本發明的 099121350 表單編號A0101 第5頁/共24頁 0992037608-0 201201461 一對導電區域及另一對導電區域分別建立電性連接以傳 輸第一差分信號對。再一對導電區域建立電性連接以傳 輸第二差分信號對中的一個信號。本發明的一個導電片 與再一個導電片耦合，從而令傳輸第二差分信號對的導 電路徑對傳輸第一差分信號對的導電路徑進行補償以降 低串音干擾。通過測試結果可知，此種配置方式的信號 傳輸路徑之間的串音干擾可減小到理想程度。 【實施方式】 [0009] 參閱第一圖至第五圖，本發明揭示一種模組連接器100包 括設有收容腔11的絕緣本體1、收容於收容腔11内的端子 模組、插設於絕緣本體1上的一對發光二極管5、及覆蓋 於絕緣本體1上的遮蔽蓋體6。於其他實施方式中，絕緣 本體1亦可設置成多接口。 [0010] 絕緣本體1包括收容腔11、容置腔12及位於收容腔11下方 的一對插入槽13。所述一對發光二極管5插入所述一對插 入槽13内。 [0011] 參閱第二圖、第三圖及第五圖，端子模組包括子電路板3 、配置於子電路板3前面的端子固持體2及配置於子電路 板3的後面的轉接模組4。端子固持體2包括絕緣片21及八 個導電端子22。八個導電端子22包括第一至第八導電端 子221-228且配置成彼此錯位排列的上下兩列。各導電端 子22包括接觸部22a及鑲埋於絕緣片21内的主體部22b。 [0012] 轉接模組4包括基座41及固持於基座41上的八個轉接端子 42。八個轉接端子42亦配置成彼此錯位排列的上下兩列 。各轉接端子42包括導通部421及焊接部422。子電路板 099121350 表單編號A0101 第6頁/共24頁 0992037608-0 201201461 3與轉接模組4收容於絕緣本體1的容置腔12内。 [0013] 子電路板3於前後方向上具有正面311及反面312。子電路 板3於左右方向上具有第一側端313及第二侧端314。第六 圖揭示子電路板3的正面311。第五圖揭示子電路板3的反 面312。第七圖是以觀看正面311同樣的角度透過正面 311透視反面312後的示意圖。第六圖、第七圖的左側皆 為子電路板3的第一侧端313，右侧皆為第二侧端314。第 六圖及第七圖揭示了配置於子電路板3之正、反面311、 0 312上的導電片的重疊情況。 .... . .· ; ' - ...： [0014] 子電路板3於其上端設有第一至第八上導電孔32卜328， 且於其下端設有第一至第八下導電孔33卜338。所述第一 至第八上導電孔32卜328及第一至第八下導電孔33卜338 皆分別貫穿子電路板3的正、反面311、3Ϊ 2。第一至第八 導電端子221-228分別插設於第一至第八上導電孔 321-328。八個轉接端子42的導通部421分別插設於第一 至第八下導電孔33Γ-338。[0008] In order to achieve the foregoing objective, the present invention provides a module connector including an insulative housing and a receiving end of a pure edge body (four). The terminal module includes a sub-circuit board, 4 conductive materials, and a human adapter terminal. The circuit board has a front surface and a reverse surface on which the plurality of conductive sheets are disposed, and the eight conductive terminals are electrically connected to the upper conductive region and the first to eighth lower conductive regions connecting the eight transfer terminals. The first to eighth upper conductive regions are respectively aligned with the first to the eighth lower conductive regions to constitute the first to eighth pairs of conductive regions, and the pair of the first to eighth pairs of the conductive regions are disposed through In the middle of the film, the electrical connection is established. 'Another-to-conducting area is electrically connected through the configuration__ another conductive sheet. 'Re--electrical area material--one conductive sheet establishes electrical connection' The conductive sheet is lightly coupled to the re-conductive sheet. The present invention provides a sub-panel formed on a module connector, comprising: a front surface configured with first to fourth front conductive sheets, and a first surface ―: The reverse side and electrical properties of the sixth rear conductive sheet Connecting the first to the eighth upper conductive regions of the conductive terminals and the first to the eighth conductive regions of the first to the second conductive regions of the eight terminal blocks and the first to the first The conductive regions are respectively aligned to form the first to eighth power-electric regions, and the first-to-eighth conductive regions of the first to eighth pairs of conductive regions are electrically connected through the first-back conductive sheets disposed therebetween, and the second pair The conductive region is electrically connected through the second rear conductive sheet disposed therebetween, and the conductive region is electrically connected through the first front conductive sheet, wherein the first front conductive sheet and the first rear conductive sheet Coupled with the prior art, the present invention has the following benefits: 099121350 of the present invention Form No. A0101 Page 5 of 24 0992037608-0 201201461 A pair of conductive regions and another pair of conductive regions are respectively electrically connected Transmitting a first differential signal pair. A pair of conductive regions establishes an electrical connection to transmit one of the second differential signal pairs. A conductive strip of the present invention is coupled to a further conductive strip to thereby transmit a second differential signal The pair of conductive paths compensates for the conductive path of the first differential signal pair to reduce crosstalk interference. The test results show that the crosstalk between the signal transmission paths of this configuration can be reduced to a desired level. [0009] Referring to the first to fifth figures, the present invention discloses a module connector 100 including an insulative housing 1 having a receiving cavity 11 and a terminal module received in the receiving cavity 11 and being inserted into the insulative housing. In the other embodiments, the insulative housing 1 can also be configured as a plurality of interfaces. [0010] The insulative housing 1 includes a receiving cavity 11 and a capacitor. The cavity 12 and a pair of insertion slots 13 located below the receiving cavity 11 are inserted into the pair of insertion slots 13. [0011] Referring to the second, third, and fifth figures, the terminal module includes a sub-board 3, a terminal holding body 2 disposed on the front of the sub-board 3, and a transfer mold disposed at the rear of the sub-board 3. Group 4. The terminal holding body 2 includes an insulating sheet 21 and eight conductive terminals 22. The eight conductive terminals 22 include first to eighth conductive terminals 221-228 and are arranged in upper and lower columns arranged offset from each other. Each of the conductive terminals 22 includes a contact portion 22a and a body portion 22b embedded in the insulating sheet 21. [0012] The adapter module 4 includes a base 41 and eight adapter terminals 42 that are held on the base 41. The eight transfer terminals 42 are also arranged in two columns arranged in a staggered arrangement with each other. Each of the transfer terminals 42 includes a conductive portion 421 and a welded portion 422. Sub-board 099121350 Form No. A0101 Page 6 of 24 0992037608-0 201201461 3 and the adapter module 4 are housed in the accommodating cavity 12 of the insulative housing 1. [0013] The sub-board 3 has a front surface 311 and a reverse surface 312 in the front-rear direction. The sub-board 3 has a first side end 313 and a second side end 314 in the left-right direction. The sixth figure discloses the front side 311 of the sub-board 3. The fifth figure reveals the reverse side 312 of the sub-board 3. The seventh figure is a schematic view of the reverse side 312 through the front side 311 at the same angle as the front side 311. The left side of the sixth and seventh figures are both the first side end 313 of the sub-board 3, and the right side is the second side end 314. The sixth and seventh figures disclose the overlap of the conductive sheets disposed on the front and back surfaces 311, 0 312 of the sub-board 3. .... . . . ; ' - ...: [0014] The sub-board 3 is provided with first to eighth upper conductive holes 32 328 at its upper end, and first to eighth lower portions at its lower end. Conductive hole 33 338. The first to eighth upper conductive holes 32 and 328 and the first to eighth lower conductive holes 33 and 338 respectively penetrate the front and back surfaces 311 and 3Ϊ2 of the sub-board 3. The first to eighth conductive terminals 221-228 are respectively inserted in the first to eighth upper conductive vias 321-328. The conductive portions 421 of the eight transfer terminals 42 are respectively inserted into the first to eighth lower conductive holes 33A-338.
QQ
[0015] 子電路板3的正面311上配置有第一至第四前導電片 341-344。第一前導電片341位於第一上、下導電孔321 、331之間且與第三上、下導電孔323、333電性連接。 第二前導電片342位於第三上、下導電孔323 ' 333之間 且與第二上、下導電孔323、333電性連接β第三前導電 片343位於第六上、下導電孔321、331之間且與第四上 、下導電孔324、334電性連接。第四前導電片344位於 第八上、下導電孔328、338之間且與第六上、下導電孔 326、336電性連接。 099121350 表單編號Α0101 第7頁/共24頁 nQ(i9l 201201461 [0016] [0017] 子電路板3的反面321上配置有第一至第六後導電片 35卜356。第一後導電片351位於第一上、下導電孔321 、331之間且與第一上、下導電孔如、331電性連接。 第二後導電片352位於第二上、下導電孔322、咖之間 且與第二上、下導電孔322、332電性連接。第三後導電 片353位於第三上、下導電孔323、333之間且與第五上 、下導電孔325、335電性連接。第四後導電片354位於 第六上、下導電孔326、336之間且與第六上、下導電孔 326、336電性連接。第五後導電片355位於第七上下 導電孔3 2 7、3 3 7之間且與第七上、下導電孔327、337電 性連接。第六後導電片356位於第八上、下導電孔328、 338之間且與第八上、下導電孔328、338電性連接。 通過所述配置’第一上導電孔321與第一下導電孔331通 過第一後導電片351電性連接以建立第一導電路徑。第二 上導電孔322與第二下導電孔332通過第二後導電片352 電性連接以建立第二導電4徑。第三上導電孔323與第二 下導電孔333通過第一前導電片341及第二前導電片342 電性連接以建立一對並聯第三導電路徑。第四上導電孔 324與第四下導電孔334通過第三前導電片343電性連接 以建立第四導電路徑。第五上導電孔325與第五下導電孔 335通過第三後導電片353電性連接以建立第五導電路徑 。第六上導電孔326與第六下導電孔336通過第四前導電 片344、第四後導電片354電性連接以建立一對並聯第六 導電路徑。第七上導電孔327與第七下導電孔337通過第 五後導電片355電性連接以建立第七導電路徑。第八上導 099121350 表單編號A0101 第8頁/共24頁 0992037608-0 201201461 電孔328與第八下導電孔338通過第六後導電片356電性 連接以建立第八導電路徑。 [0018] 第一、第二導電路徑為第一差分信號對傳輸路徑。第三 、第六導電路徑為第二差分信號對傳輸路徑。第四、第 五導電路徑為第三差分信號對傳輸路徑。第七、第八導 電路徑為第四差分信號對傳輸路徑。 [0019] ❹ ο 由於第一前導電片341與第一後導電片351重疊且耦合， 故一對並聯第三導電路徑中的第一前導電片341所在分路 對第一差分信號對傳輸路徑進行補償以降低第三導電路 徑對第一差分信號對傳輸路徑的串音干擾。由於第二前 導電片342與第三後導電片353重疊且耦合，故通過第三 後導電片353的第五導電路徑對第二差分信號對傳輸路徑 進行補償以降低第五導電路徑對第二差分信號對傳輸路 徑的串音干擾。由於第三前導電片343與第四後導電片 354重疊且耦合，故第三前導電片343所在的第四導電路 徑對第二差分信號對傳輸路徑進行補償以降低第四導電 路徑對第第二差分信號對傳輸路徑的串音干擾。由於第 四前導電片344與第六後導電片356重疊且耦合，故一對 並聯第六導電路徑中的第四前導電片344所在分路對第四 差分信號對傳輸路徑進行補償以降低第六導電路徑對第 四差分信號對傳輸路徑的串音干擾。 [0020] 在第一圖至第七圖所示的第一實施方式中，由於第一前 導電片341與第一後導電片351重疊並耦合，第二前導電 片342與第三後導電片353重疊並耦合，第三前導電片 343與第四後導電片354重疊並耦合，第四前導電片344 099121350 表單編號Α0101 第9頁/共24頁 0992037608-0 201201461 與第六後導電片356重疊並輕合，故這些導電片341、 351 ' 342 ' 353 ' 343 ' 354、344、356 皆設置成相同的 較寬的寬度。由於第二、第五後導電片352、355無需與 任何導電片重疊，故其寬度小於其他導電片341、351、 342、353、343、354、344、356的寬度。 [0021] [0022] 根據測試，第-、第二導電路彳s與第三、第六導電路徑 之間的串音干擾為-48. 6分貝。第一、第二導電路徑與第 四、第五導電路徑之間的串音干擾為_61. 3分貝。第一、 第二導電路徑與第七、第八導電路徑之間的串音干擾為— 79. 2分貝。第二、第六導電路徑與第四、第五導電路徑 之間的串音干擾為-43.4分貝。第三、第六導電路徑與第 七、第八導電路徑之間的串音干擾為_42 β分貞。第四、 第五導電路徑與第m電路徑之觸串音干擾為_ 55.8分貝。信號傳輸之間的串音干擾已減小到理想程度 在第八圖所示的第二實施轉中，和、第五後導電片 託2、355亦可設置成與其他導電片34ι、351、、 53 343、354、344、356相同的寬度。根據測試結果 ’此時的第-、第二導電路徑與第三、第六導電路經之 間的串音干擾為-39.4分貝。第―、第二導電路徑與第四 、第五導電路徑之間的串音干擾為_66 3分貝。第―、第 -導電路徑與第七、第人導電路徑之間的串音干擾為— 79. 5分貝。第三、第六導電路徑與第四、第五導電路徑 之間的串音干擾為_後4分貝。第三、第六導電路經與第 七、第八«路徑之_串音干擾為_38]分貝。第四、 099121350 表單編號A0I01 第10頁/共24頁 0992037608-0 201201461 第五導電路徑與第七、第八導電路徑之間的串音干擾為 58. 8分貝。 [0023] 綜上所述，本發明符合發明專利要件，爰依法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，本發 明之範圍並不以上述實施例為限，舉凡熟習本案技藝之 人士援依本發明之精神所作之等效修飾或變化，皆應涵 蓋於以下申請專利範圍内。 0 [〇〇24] 【圖式簡單說明】 第一圖係本發明第一實施方式中的模組連接器的立體組 裝圖。 [0025] 第二圖係第一圖所示的模組連接器的立體分解圖。 - [0026] 第三圖係第一圖所示的模組連接器的另一角度的立體分 解圖。 [0027] 第四圖係第二圖所示的端子模組的立體組零圖。 [0028] ❹ 第五圖係第二圖所示的端子模組的另一角度的立體組裝 圖。 [0029] 第六圖係第二圖所示的子電路板的正面的視圖。 [0030] 第七圖係以觀看子電路板正面同樣的角度透過正面透視 反面的示意圖。 [0031] 第八圖係本發明第二實施方式中以觀看子電路板正面同 樣的角度透過正面透視反面的示意圖。 [0032] 【主要元件符號說明】 絕緣本體：1 099121350 表單編號A0101 第11頁/共24頁 0992037608-0 201201461 [0033] 模組連接器：100 [0034] 收容腔：11 [0035] 容置腔：12 [0036] 插入槽：13 [0037] 端子固持體：2 [0038] 絕緣片：21 [0039] 導電端子：22 [0040] 接觸部：22a [0041] 主體部：22b [0042] 第一至第八導電端子 ：221-228 [0043] 子電路板：3 [0044] 正面：311 [0045] 反面：312 [0046] 第一側端：313 [0047] 第二側端：314 [0048] 第一至第八上導電孔 ：321-328 [0049] 第一至第八下導電孔 ：331-338 [0050] 第一至第四前導電片 ：341-344 [0051] 第一至第六後導電片 ：351-356 099121350 表單編號A0101 第12頁/共24頁 0992037608-0 201201461 [0052] 轉接模組：4 [0053] 基座：41 [0054] 轉接端子：42 [0055] 導通部：421 [0056] 焊接部：422 [0057] 發光二極管：5 [0058] Ο 遮蔽蓋體：6 099121350 表單編號Α0101 第13頁/共24頁 0992037608-0[0015] The first to fourth front conductive sheets 341 to 344 are disposed on the front surface 311 of the sub-board 3. The first front conductive strip 341 is located between the first upper and lower conductive holes 321 and 331 and is electrically connected to the third upper and lower conductive holes 323 and 333. The second front conductive strip 342 is located between the third upper and lower conductive holes 323 333 and electrically connected to the second upper and lower conductive holes 323 and 333. The third front conductive sheet 343 is located at the sixth upper and lower conductive holes 321 . Between the 331 and the fourth upper and lower conductive holes 324, 334 are electrically connected. The fourth front conductive strip 344 is located between the eighth upper and lower conductive vias 328, 338 and is electrically connected to the sixth upper and lower conductive vias 326, 336. 099121350 Form No. Α0101 Page 7 of 24 nQ (i9l 201201461 [0016] [0017] The first to sixth rear conductive sheets 35 are disposed on the reverse surface 321 of the sub-board 3. The first rear conductive sheet 351 is located. The first upper and lower conductive holes 321 and 331 are electrically connected to the first upper and lower conductive holes, for example, 331. The second rear conductive plate 352 is located between the second upper and lower conductive holes 322, and between The second upper and lower conductive holes 322 and 332 are electrically connected. The third rear conductive plate 353 is located between the third upper and lower conductive holes 323 and 333 and is electrically connected to the fifth upper and lower conductive holes 325 and 335. The rear conductive strip 354 is located between the sixth upper and lower conductive holes 326, 336 and electrically connected to the sixth upper and lower conductive holes 326, 336. The fifth rear conductive sheet 355 is located at the seventh upper and lower conductive holes 3 2 7 , 3 And electrically connected to the seventh upper and lower conductive holes 327, 337. The sixth rear conductive sheet 356 is located between the eighth upper and lower conductive holes 328, 338 and with the eighth upper and lower conductive holes 328, The electrical connection is 338. The first upper conductive via 321 and the first lower conductive via 331 are electrically connected through the first rear conductive strip 351 to establish The first upper conductive via 322 and the second lower conductive via 332 are electrically connected through the second rear conductive strip 352 to establish a second conductive fourth diameter. The third upper conductive via 323 and the second lower conductive via 333 pass through The first front conductive strip 341 and the second front conductive strip 342 are electrically connected to establish a pair of parallel third conductive paths. The fourth upper conductive via 324 and the fourth lower conductive via 334 are electrically connected through the third front conductive strip 343. A fourth conductive path is established. The fifth upper conductive via 325 and the fifth lower conductive via 335 are electrically connected through the third rear conductive strip 353 to establish a fifth conductive path. The sixth upper conductive via 326 and the sixth lower conductive via 336 pass through The fourth front conductive strip 344 and the fourth rear conductive strip 354 are electrically connected to establish a pair of parallel sixth conductive paths. The seventh upper conductive via 327 and the seventh lower conductive via 337 are electrically connected through the fifth rear conductive strip 355. Establishing a seventh conductive path. The eighth upper conductor 099121350 Form No. A0101 Page 8 / Total 24 page 0992037608-0 201201461 The electric hole 328 and the eighth lower conductive hole 338 are electrically connected through the sixth rear conductive sheet 356 to establish the eighth conductive Path [0018] First and second conductive The path is the first differential signal pair transmission path. The third and sixth conductive paths are the second differential signal pair transmission paths. The fourth and fifth conductive paths are the third differential signal pair transmission paths. The seventh and eighth conductive paths are The fourth differential signal pair transmission path. [0019] Since the first front conductive strip 341 overlaps and is coupled to the first rear conductive sheet 351, the first front conductive sheet 341 of the pair of parallel third conductive paths is shunted The first differential signal is compensated for the transmission path to reduce crosstalk interference of the third conductive path to the first differential signal pair transmission path. Since the second front conductive strip 342 overlaps and is coupled to the third rear conductive sheet 353, the second differential signal is compensated for the transmission path by the fifth conductive path of the third rear conductive sheet 353 to reduce the fifth conductive path pair second. Crosstalk interference from the differential signal to the transmission path. Since the third front conductive strip 343 and the fourth rear conductive strip 354 are overlapped and coupled, the fourth conductive path of the third front conductive strip 343 compensates the second differential signal to the transmission path to reduce the fourth conductive path to the first The crosstalk interference of the two differential signals on the transmission path. Since the fourth front conductive strip 344 and the sixth rear conductive strip 356 are overlapped and coupled, the branch of the fourth front conductive strip 344 of the pair of parallel sixth conductive paths compensates the fourth differential signal for the transmission path to reduce the The crosstalk of the six conductive paths to the fourth differential signal to the transmission path. [0020] In the first embodiment shown in the first to seventh figures, since the first front conductive sheet 341 is overlapped and coupled with the first rear conductive sheet 351, the second front conductive sheet 342 and the third rear conductive sheet 353 is overlapped and coupled, the third front conductive sheet 343 is overlapped and coupled with the fourth rear conductive sheet 354, and the fourth front conductive sheet 344 099121350 is shown in the form of Α0101, page 9/24 pages 0992037608-0 201201461 and the sixth rear conductive sheet 356 The conductive sheets 341, 351 ' 342 ' 353 ' 343 ' 354, 344, 356 are all arranged to have the same wide width. Since the second and fifth rear conductive sheets 352, 355 do not need to overlap any of the conductive sheets, the width thereof is smaller than the widths of the other conductive sheets 341, 351, 342, 353, 343, 354, 344, 356. [0022] [0022] According to the test, the crosstalk between the first and second conductive circuits 彳s and the third and sixth conductive paths is -48. 6 decibels. The crosstalk between the first and second conductive paths and the fourth and fifth conductive paths is _61. 3 decibels. The crosstalk between the first and second conductive paths and the seventh and eighth conductive paths is -79. 2 decibels. The crosstalk interference between the second and sixth conductive paths and the fourth and fifth conductive paths is -43.4 dB. The crosstalk interference between the third and sixth conductive paths and the seventh and eighth conductive paths is _42 β tiller. The fourth, fifth conductive path and the mth electrical path have a crosstalk interference of _ 55.8 decibels. The crosstalk between the signal transmissions has been reduced to a desired level. In the second implementation shown in the eighth figure, the fifth rear conductive pad 2, 355 can also be disposed with other conductive sheets 34, 351, , 53 343, 354, 344, 356 the same width. According to the test result, the crosstalk between the first and second conductive paths and the third and sixth conductive circuits at this time is -39.4 dB. The crosstalk between the first and second conductive paths and the fourth and fifth conductive paths is _66 3 decibels. The crosstalk between the first and the first conductive paths and the seventh and first conductive paths is -79. 5 decibels. The crosstalk between the third and sixth conductive paths and the fourth and fifth conductive paths is 4 dB after _. The third and sixth conductive circuits are decibels of _38] with the crosstalk of the seventh and eighth paths. Fourth, 099121350 Form No. A0I01 Page 10 of 24 0992037608-0 201201461 The crosstalk between the fifth conductive path and the seventh and eighth conductive paths is 58. 8 decibels. [0023] In summary, the present invention complies with the requirements of the invention patent, and submits a patent application according to law. However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited to the above embodiments, and those skilled in the art will be able to make equivalent modifications or variations in accordance with the spirit of the present invention. It should be covered by the following patent application. 0 [〇〇24] [Simplified description of the drawings] The first figure is a three-dimensional assembly diagram of the module connector in the first embodiment of the present invention. [0025] The second figure is an exploded perspective view of the module connector shown in the first figure. - [0026] The third figure is a perspective view of another angle of the module connector shown in the first figure. [0027] The fourth figure is a three-dimensional group zero map of the terminal module shown in the second figure. [0028] FIG. 5 is a perspective assembled view of another angle of the terminal module shown in the second figure. [0029] The sixth figure is a front view of the sub-board shown in the second figure. [0030] The seventh figure is a schematic view through the front perspective back side at the same angle as the front side of the sub-board. [0031] The eighth figure is a schematic view of the second embodiment of the present invention through the front perspective back side at the same angle as the front surface of the viewing sub-board. [Main component symbol description] Insulating body: 1 099121350 Form number A0101 Page 11 / 24 pages 0992037608-0 201201461 [0033] Module connector: 100 [0034] Containment cavity: 11 [0035] accommodating cavity :12 [0036] Inserting groove: 13 [0037] Terminal holding body: 2 [0038] Insulating sheet: 21 [0039] Conductive terminal: 22 [0040] Contact portion: 22a [0041] Main body portion: 22b [0042] To eighth conductive terminal: 221-228 [0043] Sub-board: 3 [0044] Front: 311 [0045] Reverse: 312 [0046] First side: 313 [0047] Second side: 314 [0048] First to eighth upper conductive vias: 321-328 [0049] first to eighth lower conductive vias: 331-338 [0050] first to fourth front conductive sheets: 341-344 [0051] first to sixth Rear conductive sheet: 351-356 099121350 Form No. A0101 Page 12/24 pages 0992037608-0 201201461 [0052] Adapter module: 4 [0053] Base: 41 [0054] Adapter terminal: 42 [0055] Part: 421 [0056] Welded part: 422 [0057] Light-emitting diode: 5 [0058] 遮蔽 Covering cover: 6 099121350 Form number Α 0101 Page 13 / 24 0992037608-0