201201194 六、發明說明： 【發明所屬之技術領域】 本技藝適用於軟性電子壓阻樂器，包含下述但不限於下述產品：電子鼓、 電子鈸、電子木琴、電子鋼琴…等藉由壓阻原玉里而輸出鼓聲、鈸聲 樂聲音的樂器。 9 【先前技術】 圖1.是先前技藝立體圖 習知技藝如圖1所示，一個傳統的空氣震動式的樂器鼓(drum)，具有一個相 對龐大的鼓身DR1以及一個鼓皮區域PA稱之為打擊區域pA。當鼓棒订打 擊在打擊區域ΡΑ時，打擊區域ΡΑ的鼓皮便會震動而帶動附近空氣的震動， 進而產生聲音。這種習知鼓的空氣震動式結構鼓身DR1，不但堅硬龐大、 無法收縮、而且重量相對較重’因此’無論、移動 '或是收藏皆不容 本技藝發明人首先思考現今壓喊測技術錢電子發鞋等的技術已經很 發達，若是可以克服前述傳統的空氣震動式的樂器鼓的堅硬、龐大、不可 • 彎折的缺點，開發一種軟性電子鼓或是其他壓阻樂器，則可以提供使用^ 廉價、輕便、可以捲曲便於攜帶、移動或是收藏的優點。 【發明内容】 本技藝開發一種輕便的、可以捲曲收藏的軟性電子壓阻樂器，包含作不限 於鼓、鈸、木琴、以及鋼琴…等，不使用時可以捲曲成為圓筒狀，入 移動、或是收藏。本說明書以「鼓」作為本技藝的壓阻樂器之範例加以說 日月，其他的壓阻樂器例如鈸、木琴、鋼琴…等，只要在電路結構加以修改， 使輸出對應的樂器的特有「音色」便可以製成如軟性電子鈸、軟性電子木 琴、軟性電子鋼琴…等產品。 201201194 【實施方式】 圖2.是本技藝立體圖 圖中顯示本技藝之軟性電子壓阻樂器以鼓DR2作為範例，本技藝範例所製 成的電子鼓DR2的厚度約在300um附近，包含上層軟性基材約125um、上 層電極6um、上層壓阻材料層i5Um、狹縫空間l〇um、下層壓阻材料層 l5um、下層電極6um、以及下層軟性基材約125um。不使用時可以捲成一 個捲筒R便於攜帶、移動、或是收藏。當本技藝之軟性電子打鼓DR2展開 時，具有一個打擊區域P，當鼓棒ST施以力量，打擊到打擊區域p時，打 擊區域P下方的壓阻感測器(pjezoresjstjve sens〇r)便會隨著壓力大小，產生 對應的信號傳遞至電路系統30。然後經由電路系統3〇之訊號轉換處理，將 打擊力量的大小轉換為輸出的聲音大小訊號，便可以將對應的鼓聲，由揚 聲器40播放出來。201201194 VI. Description of the Invention: [Technical Field of the Invention] The present technology is applicable to a soft electronic piezoresistive musical instrument, including the following but not limited to the following products: electronic drum, electronic cymbal, electronic xylophone, electronic piano, etc. by piezoresistance The original jade is a musical instrument that outputs drum sounds and vocal sounds. 9 [Prior Art] FIG. 1 is a prior art stereogram of the prior art. As shown in FIG. 1, a conventional air-vibrating drum of a musical instrument has a relatively large drum DR1 and a drum area PA. To hit the area pA. When the drum stick is hit in the strike zone, the drum skin of the strike zone will vibrate and drive the vibration of the nearby air, which will produce sound. This kind of drum's air-vibration structure body DR1 is not only hard and bulky, it can't be contracted, and its weight is relatively heavy. Therefore, no matter whether it is moving or collecting, the inventor of this technology can not think about the current technology. The technology of electronic shoe-making has been developed. If it can overcome the shortcomings of the above-mentioned traditional air-vibrating instrument drum, it is difficult to develop a soft electronic drum or other piezoresistive instrument. ^ Cheap, lightweight, and can be curled for easy carrying, moving or collecting. SUMMARY OF THE INVENTION The present technology develops a lightweight, crimpable soft electronic piezoresistive musical instrument, including, not limited to, drums, cymbals, xylophones, and pianos, etc., which can be curled into a cylindrical shape when not in use, into movement, or It is a collection. This manual uses "drums" as an example of the piezoresistive musical instrument of the art to describe the sun and the moon, and other piezoresistive instruments such as cymbals, xylophones, pianos, etc., as long as the circuit structure is modified, so that the corresponding musical instrument's unique "tone" is output. It can be made into products such as soft electronic cymbals, soft electronic xylophones, soft electronic pianos, etc. 201201194 [Embodiment] FIG. 2 is a perspective view showing a soft electronic piezoresistive instrument of the present technology. The drum DR2 is taken as an example. The thickness of the electronic drum DR2 made by the prior art example is about 300 um, including the upper soft base. The material is about 125 um, the upper electrode 6 um, the upper laminated resistive layer i5Um, the slit space l〇um, the lower laminated resistive material layer l5um, the lower layer electrode 6um, and the lower soft substrate about 125 um. It can be rolled into a roll R when not in use for portability, movement, or collection. When the soft electronic drum DR2 of the present technology is deployed, it has a striking area P. When the drum stick ST exerts a force and hits the striking area p, the piezoresistive sensor (pjezoresjstjve sens〇r) under the striking area P will As the magnitude of the pressure, a corresponding signal is generated to be passed to circuitry 30. Then, through the signal conversion process of the circuit system 3, the magnitude of the striking power is converted into the output sound size signal, and the corresponding drum sound can be played by the speaker 40.
圖2顯示本技藝的軟性電子鼓捲筒R上面製作有許対以打擊的鼓面p，形 狀則可以設計絲圓形或是矩形，其他如五_歧六邊料多邊形也是 可以的。軟性電子鼓顯R展開赠，可以提供多人同物擊，也可以安 置耳齡統’每—術擊鼓面p皆對應—個輸錄置。制範例包含下述 但不限於下L，學習者可峨由耳機，聽到自己打擊的聲音，也可 :經由耳機聽到老師示範打擊的聲音，學習者可以對照修正自己打擊的聲 Θ ° 圖 圖3.是本技藝製程半成品頂面視 圖3顯不本技藝量產半成品示意 ^ β 固甲顯不氟作軟性電子鼓DR2的兩個 產口〇早兀作為範例說明之，後續只要由中央切丨蠄r + φ丨y.战 出兩個產品單元。 T央切_〔蝴讀，便可以產 201201194 圖中顯示_單搞半n棚，歧仙_打擊p料目俨# 擊區域，打擊_ P的上層具有—個 :打,域p作為叫打 具有上表面10T鱼下表面10_ 4).圖q /_基材10 ’上層軟性基材10 -個開口 U，門 上層軟性基材10的中間具有 電路Ε12 Ε22 1Γ1裸露出上層連接電路E12與下層連接電路E22 ;連接 電_人至技藝的電子鼓的兩個電極延伸端，在後續製程t，將會 電生麵°至電路系統30處理，然後輸出對應的聲音。 圖4.是圖3的ΑΑ'剖面視圖 含下述_及⑶的三個單元：⑴上層結構、⑵ 下層、，。構與女置於上層結構與下層結構之間的⑶隔離單元。 (1)上層結構，係包含： =上表面1〇Τ與下表面1〇Β ;設定一個打擊區域Ρ作 二個Ρ /顯不生產兩個單元的製程’因此設定左邊、右邊各 居上層電路層E1 ’安置於上層軟性基材扣的下方，上 之面穑」1對準於打擊區域？且上層電路層E1的面積至少涵蓋打擊區域p …上層壓阻材料層(Piezc)resistive 路 的上層電路E1由中間的連接電路E12相連接。 ⑵下層結構，係包含： 署1軟^基材2〇 ’具有上表面2〇了與下表面20Β ; 一層下層電路層Ε2，安 置於下層軟性基材2〇的上方，對進 女 ;:rr. 蓋打擊區域。之面積大小。左右兩單元中二 201201194 (3}隔離元件S ’安置於上層結構與下層結構之間，使得上層壓阻材料層ρζι 與下層壓阻材料層PZ2之間，具有一個事先定義好的狹縫空間21。圖中係 將隔離元件S ’安置於上層電路E1與下層電路E2之間。 圏5.是圖3的BB’剖面視圖 圖5顯示上層軟性基材1〇的中間開口 n裸露出下層連接電路E22。下層連 接電路E22係用以連接左右兩個單元的下層電路E2。 Φ 圖6A〜6B.是本技藝上層結構製程示意圖 圖6A顯示上層軟性基材1〇的下表面1〇B，設置在左右兩個單元產品分別 製作一個上層電極E1，每一單元的上層電極E1的面積至少涵蓋一個打擊區 域P的大小。上層軟性基材1〇中間設置一個開口 u ;左右兩個上層電極 El中間設置有延伸電路E11，延伸至開口 1：1附近。。 =6B顯不上層電極E1上面，設置一層上層壓阻材料層ρζι，每一單元的上 壓阻材料層PZ1的面積至少涵蓋一個打擊區域p的大小。Fig. 2 shows a drumhead p on which a soft electronic drum reel R of the present technology is made to strike, and the shape can be designed to be round or rectangular, and other polygonal shapes such as a hexahedral hexagon are also possible. The soft electronic drum shows the R launch, which can provide multiple people with the same object, and can also set the ear age system. The example of the system includes the following but not limited to the lower L. The learner can listen to the sound of the blow by the earphones. It can also: hear the sound of the teacher's demonstration blow through the earphone, and the learner can correct the sound of the blow by the learner. Is the top view of the semi-finished products of this technology process 3 shows the skill of mass production semi-finished products ^ β solid armor is not fluorine for the soft electronic drum DR2 two production mouth as early as the example, the follow-up as long as the central cut r + φ丨y. Battle out two product units. T央切_[Butterfly reading, you can produce 201201194. The picture shows _ single half-n shed, qixian _ blow p material 俨# hit area, blow _ P upper layer has one: hit, domain p as called The upper surface 10T has a lower surface 10_4). Fig. q /_substrate 10' upper soft substrate 10 - an opening U, the middle of the upper soft substrate 10 has a circuit Ε12 Ε22 1Γ1 bare upper connection circuit E12 and lower layer The connecting circuit E22 is connected to the two electrode extension ends of the electronic drum of the electronic technology, and in the subsequent process t, the electric surface is processed to the circuit system 30, and then the corresponding sound is output. Fig. 4 is a cross-sectional view of Fig. 3 showing three units of the following _ and (3): (1) upper layer structure, (2) lower layer, ,. The (3) isolation unit between the upper structure and the lower structure. (1) The upper structure consists of: = upper surface 1〇Τ and lower surface 1〇Β; setting a striking area for two Ρ / display two units of the process 'so set the left and right upper layer circuits Layer E1 'is placed under the upper soft substrate buckle, and the upper surface 穑"1 is aligned with the strike area? The upper circuit E1 of the upper circuit layer E1 covers at least the striking region p...the upper layer circuit E1 of the resistive material layer (Piezc) resistive path is connected by the intermediate connecting circuit E12. (2) The lower layer structure includes: Department 1 soft ^substrate 2〇' has an upper surface 2〇 and a lower surface 20Β; a lower layer circuit layer Ε2, placed on the lower layer of soft substrate 2〇, facing the female;:rr Cover the hit area. The size of the area. Two of the left and right units 201201194 (3} the spacer element S' is disposed between the upper structure and the lower structure such that there is a previously defined slit space 21 between the upper laminate resistance material layer ρζι and the lower laminate resistance material layer PZ2. In the figure, the isolation element S' is disposed between the upper layer circuit E1 and the lower layer circuit E2. 圏5. is the BB' cross-sectional view of FIG. 3. FIG. 5 shows the intermediate opening n of the upper flexible substrate 1 裸 exposed the lower layer connection circuit E22. The lower layer connection circuit E22 is used to connect the lower layer circuit E2 of the left and right units. Φ FIG. 6A to FIG. 6B are schematic diagrams of the process of the upper layer structure of the present technology. FIG. 6A shows the lower surface 1〇B of the upper layer soft substrate 1 ,, which is set in The upper and lower electrodes E1 are respectively formed on the left and right unit products, and the area of the upper layer electrode E1 of each unit covers at least one striking area P. An upper layer is disposed in the middle of the upper flexible substrate 1; and the upper left and right upper electrodes El are disposed in the middle There is an extension circuit E11 extending to the vicinity of the opening 1:1. =6B is not displayed on the upper electrode E1, and a layer of the upper laminated resistive material layer ρζι is provided, and the upper piezoresistive material layer PZ1 of each unit is provided. It covers an area at least the size of a region p blow.
圖7A〜7B•是本技藝下層結構製程示意 圖 E2 ^顯^下層軟性基材2〇的上表Φ 2〇丁，設置左右兩個單元的下層電極 ，每一單元的下層電極Ε2的面積至少涵蓋一個打擊區域Ρ的大小。左右 個單元的下層電極Ε2中間設置有1獨立的上層連接電路Εΐ2以及一段 2連接電路Ε22。上層連接· Ε12録後續，財連接左右兩個打擊區 ^的上層電路E1 ;下層連接電路Ε22健性耦合至左右兩個單元的下層 圖顯不下層電極Ε2上面’設置-層下層壓阻材料層ρΖ2，每一單元的下 201201194 p的大小 層壓阻材料層PZ2的面積至少涵蓋一個打擊區域 圖 圖SA SB.是本技藝上層結構與下層結構愿合時的a與⑽截面示意 圖SA係將圖邱左右反轉，以上層壓阻材料^^ ^ 圖8A顯示圖砧上層社槿^丨―人_ ㈣口至圖7B的狀況’ 圖。-個_單元°壓圖7BT層結構的叩，剖面分解 層連接縫y左右兩個單元的上層延伸電路Ei1會壓合至上 互電性轉人。 兩11單7°的上層電路E1藉由上層連接電路E12而相 圖^壓合以後的結構，左右兩個單元中間有上層連接電路 延伸電H裸二ΪΓ接電路E12雜左右兩個單元的上層電極ei的 相電性耗σ，也就是將左右兩個單元的上層電極E1電性輕合。 9A~9B.是本技藝上層結構與下層結構壓合時的EE,與FF,截面示意 圖防左右反轉，以上層壓阻材料層ρζι向下，壓合至圖π的狀 解圖一員示圖。6B上層結構的EE,剖面壓合至圖7B下層結構的FF'剖面分 用途θ S被安置在上層結構與下層結構中間。_單元S的 個蓽I，上層壓阻材料層PZ1與下層壓阻材料層PZ2相隔開，以產生一 個事先堍定好的狹縫空間21。 圖9^顯賴9A壓合以後的結構，左右兩個料，中財下層連接電路 ^自開口 u裸露。下層連接電路⑵左邊電性编合至左邊單元的下層電 極E2 ’下層連接電路E22右邊電_合至右邊單元的下層_ E2， 圖 圖 圖1〇·是圖8B或是圖9B切割成為兩單元示意圖 201201194 將8B ^疋圖、9B的左右兩個單元的半成品，依據中央切割線c加以切割 之後，便可以獲知兩個單元DU。圖示顯示兩個單元DM中央處，裸露出 上層電極連接電路E12與下層電極連接電路E22。 圖11_是本技藝-單元與電路單元結合示意圖 圖中顯不本技藝的上層電極E1與下層電極η的設計示意圖；將上層電極 E1的連接電路EU與下層電極η的連接電路a，分別電性耗合至電路系 統30。電路系統30若是將打擊力量轉換成為鼓聲自揚聲器4〇輸出，便構 f軟性電子鼓。電路系統3〇若是將打擊力量轉換成為鈸聲自揚聲器4〇輸 ’便構成軟性電子鈸。電路系統％包含：訊號壓力轉換單元3〇ι，以將 打擊訊號藉著壓阻感測單元轉換成為壓力訊號；壓力聲音轉換單元迎， =將壓力訊號轉換成為聲音訊號；聲音輸出單元舶，以將對應的聲音訊號 輪出至外部的揚聲器4〇 ’楊聲器4〇便會發出對應的鼓聲或是跋聲。 圖12.是本技藝應用於木琴示意圖 ，本產品製成木琴捲XR時，展開來便可以當做軟性電子木琴χ2樂器加以 =奏。產品製作時’可以在「上層結構」製作類似傳統木琴的多條神用 ^擬金屬條ΧΡ ’第-條酿金祕χρ電_合至電路⑽3Q使對應產 估音自揚聲器40輸出、第二條模擬金屬條XP電性耗合至電路系統30 ^對應產生Re音自揚聲器4〇輸出、第三條模擬金屬條χρ電_合 =30使對應產生Mi音自揚聲器4〇輸出..依次類推；當以打擊棒X ^模擬金祕XP時，便可以在揚聲H 4〇產生對應的Dq、Re、以及Μ =琴聲音。整體結構原理類似前面電子鼓的結構，只是每—條金屬條沖八 =〜條獨立的上層電極且分顧導線L m連接輯路系統％中加以^ 圖13.是本技藝電子鼓另一實施例 圖中顯示-個雙頻電子鼓設計’將上層電路劃分成為兩個區域，即是··一 201201194 個周邊電極E101與中心電極E102,兩個電極區域分別製作於上層基材的下 方，周邊電極E101與中心電極E1〇2中間存在一個間隔26使得周邊電極 E101與中心電極E102的電性各自獨立。周邊電極E1〇1具有一個連接電路 E121，中心電極E102具有一個連接電路E122。將上層電極中的連接電路 Ein、E122分別電性耦合至電路系統3〇〇。圖的下層結構與前面的實施 例的下層結構類似，電極E2將下層電極E2的連接電路E22電性耦合至電 路系統300。經過電路系統3〇〇處理以後，周邊電極E1〇1結合上下結構， 構成第一打擊區域，對應產生第一音頻，中心電極E1〇2結合上下結構，構 成第一打擊區域，對應產生第二音頻，構成雙頻電子鼓。7A to 7B are the schematic diagrams of the process of the lower layer structure of the present technology. The upper surface of the soft substrate 2 显 2 显 2, the lower layer electrodes of the left and right units are arranged, and the area of the lower electrode Ε 2 of each unit covers at least The size of a hit area. A separate upper connection circuit Εΐ2 and a length 2 connection circuit Ε22 are disposed in the middle of the lower electrode Ε2 of the left and right cells. The upper layer is connected to the Ε12 recording, and the upper layer circuit E1 of the two strike zones is connected to the left and right sides; the lower layer connection circuit Ε22 is mechanically coupled to the lower layer of the left and right units, and the lower layer electrode Ε2 is above the upper layer. ρΖ2, the size of each layer of the next 201201194 p laminated resistive material layer PZ2 covers at least one striking area map SA SB. It is a schematic diagram of the a and (10) cross-section of the art upper layer structure and the lower layer structure. Qiu reversing left and right, the above laminate resistance material ^^ ^ Figure 8A shows the picture of the top layer of the anvil in the upper layer of the anvil - _ _ (four) mouth to the situation of Figure 7B. - _ unit ° pressure Figure 7 BT layer structure 叩, section decomposition layer joint seam y left and right two units of the upper layer extension circuit Ei1 will be pressed to the upper reciprocal transfer. Two 11 single 7° upper layer circuits E1 are connected by the upper layer connecting circuit E12, and the upper layer is connected with the upper layer connecting circuit E1 bare two connecting circuit E12. The phase consuming σ of the electrode ei, that is, the upper layer electrode E1 of the left and right cells is electrically coupled. 9A~9B. is the EE when the upper layer structure and the lower layer structure of the technology are pressed together, and the FF, the cross-sectional schematic diagram prevents the left and right reversal, and the above laminated resisting material layer ρζι is downward, and is pressed to the figure π. . The EE of the upper structure of 6B, the profile is pressed to the FF' section of the lower structure of Fig. 7B. The use θ S is placed between the upper structure and the lower structure. The upper layer I of the unit S, the upper layer of the barrier material layer PZ1 is spaced apart from the layer of the lower layer of the barrier material PZ2 to produce a slit space 21 which is predetermined. Figure 9 ^ shows the structure after pressing 9A, the left and right materials, the middle and lower layer connection circuit ^ from the opening u bare. The lower layer connection circuit (2) is electrically coupled to the lower layer electrode E2 of the left unit. The lower layer connection circuit E22 is electrically connected to the lower layer of the right unit _ E2, and the figure is shown in FIG. 8B or FIG. 9B is cut into two units. Schematic 201201194 After the semi-finished products of the left and right units of 8B^疋, 9B are cut according to the central cutting line c, the two units DU can be known. The figure shows the center of the two cells DM, exposing the upper electrode connection circuit E12 and the lower electrode connection circuit E22. 11 is a schematic diagram showing the design of the upper layer electrode E1 and the lower layer electrode η of the present technology in combination with the unit and the circuit unit; the connection circuit EU of the upper layer electrode E1 and the connection circuit a of the lower layer electrode η are respectively electrically connected The consumption is integrated into the circuitry 30. If the circuit system 30 converts the striking force into a drum sound output from the speaker 4, it constructs a soft electronic drum. If the circuit system 3 converts the striking power into a click, it will form a soft electronic 钹. The circuit system % includes: a signal pressure conversion unit 3〇ι, to convert the striking signal into a pressure signal by the piezoresistive sensing unit; the pressure sound converting unit welcomes, = converts the pressure signal into an audio signal; When the corresponding sound signal is turned to the external speaker 4〇's speaker 4, a corresponding drum sound or click sound will be emitted. Figure 12. This is a schematic diagram of the application of the technique to a xylophone. When the product is made into a xylophone roll XR, it can be used as a soft electronic xylophone χ 2 instrument. When the product is produced, it is possible to make a number of god-like metal strips similar to the traditional xylophone in the "upper-layer structure". 'The first-piece stuffing gold secret χ _ electricity to the circuit (10) 3Q makes the corresponding production estimate sound from the speaker 40 output, the second Strip analog metal strip XP electrically consumes to the circuit system 30 ^ correspondingly produces Re sound from the speaker 4 〇 output, the third analog metal strip χ 电 _ _ = 30 to make the corresponding Mi sound from the speaker 4 〇 output.. and so on When you use the striker X ^ to simulate the Golden Secret XP, you can generate the corresponding Dq, Re, and Μ = piano sounds in the speaker H 4〇. The overall structure principle is similar to that of the front electronic drum, except that each strip of metal strips punches eight = ~ separate upper layer electrodes and separates the wires L m from the connection system. Figure 13. This is another implementation of the electronic drum of the present technology. In the example, a dual-frequency electronic drum design is shown to divide the upper circuit into two regions, namely, a 201201194 peripheral electrode E101 and a center electrode E102. The two electrode regions are respectively formed under the upper substrate, and the periphery is formed. There is a gap 26 between the electrode E101 and the center electrode E1〇2 such that the electrical properties of the peripheral electrode E101 and the center electrode E102 are independent of each other. The peripheral electrode E1〇1 has a connection circuit E121, and the center electrode E102 has a connection circuit E122. The connection circuits Ein and E122 in the upper electrode are electrically coupled to the circuit system 3A, respectively. The lower structure of the figure is similar to the lower structure of the previous embodiment, and the electrode E2 electrically couples the connection circuit E22 of the lower electrode E2 to the circuit system 300. After the circuit system 3〇〇 process, the peripheral electrode E1〇1 is combined with the upper and lower structures to form a first striking area, corresponding to the first audio, and the central electrode E1〇2 is combined with the upper and lower structures to form a first striking area, corresponding to the second audio. , constitute a dual-frequency electronic drum.
電路系統300包含有第-音頻系統如與第二音頻系統3〇2，第一音頻系統 301係處理第-打擊區域之訊號，並且輸出第一音頻；第二音頻系統迎， 係處理第二打擊區域之城，並且輸出第二音頻，構成雙頻軟性電子鼓。 ^音⑽統肌包含：訊號-壓力轉換單元順，以將受壓訊號轉換成為 壓力訊號；壓力-聲音轉換單元，以將壓力訊號觀成為聲音訊號；聲 曰輸出單元3〇31，以將對應的聲音訊號輸出至外部的揚聲器4〇 4〇 便會發出對應的第—音頻。第二音㈣統啦包含：訊號·壓力轉換單元 3〇12 ’以將受壓訊號轉贼為壓力訊號；壓力聲音轉換單元迎2，以將壓 =號轉縣鱗音滤；聲音輸出單元咖，崎職畴音訊 至外部的楊聲器40，楊聲器40便會發出對應的第二音頻。 不同頻率的多頻電 雙電路區域^與__例說明，製作出雙頻電子鼓或是 鼓，依據同-原理，可以製作出更多區域分別對 子鼓或是鈸。 圖14.是本技藝應用於電子琴示意圖 圖14的原理類似於圖12的木琴結構，圖14县 疋將棋擬鍵盤P丨製成鋼琴鍵盤， 备以手才日按壓模擬鍵盤FM時，便可以發出料庙 發出對應的鋼琴聲音。模擬鍵盤PI中 201201194 的每-雜鍵分卿絲合到電路祕3G，而輪㈣應的音頻；例如七個 按鍵分別輸出 Do、Re、Mi、Fa、So、Ra、Si、d〇 音。 本技藝的軟性基材，可以使用聚合物薄膜、紙張、皮革、以及布材。應用 之-便是製作在衣服上面，當-個人穿了-件附帶有軟性電子_樂^的 衣服時，便可以隨時在衣服上敲擊產生鼓聲、鈸聲'或是樂音。 了本技#之較佳實施例以及設計圖式，惟，較佳實施例以及設 = 删，咖均等之 而實施者，均不脫離本技藝之精神而為申請:之腺權利範圍The circuit system 300 includes a first audio system, such as a second audio system 3〇2, the first audio system 301 processes the signal of the first strike zone, and outputs the first audio; the second audio system welcomes the second strike. The city of the area, and outputs the second audio to form a dual-frequency soft electronic drum. The sound (10) muscle includes: the signal-pressure conversion unit is compliant to convert the pressure signal into a pressure signal; the pressure-sound conversion unit is to make the pressure signal view an audio signal; the sonar output unit 3〇31 to correspond The sound signal is output to the external speaker 4〇4, and the corresponding first audio is emitted. The second sound (four) system includes: signal and pressure conversion unit 3〇12 'to turn the pressure signal into a thief as a pressure signal; pressure sound conversion unit to 2, to press the pressure = number to the county scale sound filter; sound output unit coffee When the Suzuki domain audio is sent to the external Yang sounder 40, the Yang sounder 40 will emit the corresponding second audio. The multi-frequency electric double-circuit area of different frequencies and the __ example illustrate that a dual-frequency electronic drum or drum is produced, and according to the same principle, more regions can be produced for the sub-drum or the cymbal. Figure 14. Schematic diagram of the application of the present technology to the keyboard. The principle of Figure 14 is similar to the structure of the xylophone of Figure 12, and Figure 14 shows that the game keyboard is made into a piano keyboard, and when the analog keyboard FM is pressed by the hand, it can be The temple is issued to emit the corresponding piano sound. In the analog keyboard PI, each of the miscellaneous keys of 201201194 is merged into the circuit secret 3G, and the round (four) should be audio; for example, seven keys respectively output Do, Re, Mi, Fa, So, Ra, Si, d〇. As the soft substrate of the art, a polymer film, paper, leather, and cloth can be used. The application is made on the top of the clothes. When the person wears the piece with the soft electronic _ music, you can tap the drum to make a drum sound, a buzzing sound or a tone at any time. The preferred embodiment of the present invention and the design drawings, but the preferred embodiment and the implementation of the deletion, the coffee, and the like, are all applied without departing from the spirit of the art:
10 201201194 【圖式簡單說明】 圖1.是先前技藝立體圖 圖2.是本技藝立體圖 圖3.是本技藝製程半成品頂面視圖 圖4.是圖3的M'剖面視圖 圖5.是圖3的BB'剖面視圖 圖6Α~6Β·是本技藝上層結構製程示意圖 圖7Α~7Β.是本技藝下層結構製程示意圖 Λ 圖8Α~8Β.是本技藝上層結構與下層結構壓合時的CC與DD'截面示意圖 圖9Α~9Β.是本技藝上層結構與下層結構壓合時的ΕΕ'與FF'截面示意圖 圖10.是圖8Β或是圖9Β切割成為兩單元示意圖 圖11.是本技藝一單元與電路單元結合示意圖 圖12.是本技藝應用於木琴示意圖 圖13.是本技藝電子鼓另一實施例 圖14.是本技藝應用於電子琴示意圖 【主要元件符號說明】 H 10上層軟性基材 10Τ上層軟性基材上表面 10Β上層軟性基材下表面 11開口 20下層軟性基材 20Τ下層軟性基材上表面 20Β下層軟性基材下表面 21狹縫空間 26空間 30,300電路系統 11 201201194 301,3011,3012第一音頻處理系統 302, 3021, 3022第二音頻處理系統 303,3031, 3032第二音頻處理系統 40揚聲器 E101上層電極 E102上層電極 E1上層電極 E11延伸電路 E12上層電極連接電路 E121上層電極連接電路 E122上層電極連接電路 E2下層電極 E22下層電極連接電路 DR2軟性電子鼓 P打擊區域 PZ1上層壓阻材料層 PZ2下層壓阻材料層 R軟性電子鼓捲 S隔離單元 ST鼓棒 X2軟性電子木琴 XR軟性電子木琴捲 XP模擬金屬鍵 X3軟性電子琴 XST打擊棒 RP軟性電子琴捲 PI模擬電子琴鍵 1210 201201194 [Simplified illustration of the drawings] Figure 1. is a perspective view of the prior art. Figure 2. is a perspective view of the present technology. Figure 3. is a top view of the semi-finished product of the art process. Figure 4. is a cross-sectional view of the M' of Figure 3. Figure 5. BB' section view Figure 6Α~6Β·This is the schematic diagram of the process of the upper structure of this technology. Figure 7Α~7Β. This is the schematic diagram of the process of the lower layer structure of this technology. Figure 8Α~8Β. It is the CC and DD when the upper structure and the lower structure of this technology are pressed together. 'Sectional schematic diagram Fig. 9Α~9Β. is a schematic diagram of the cross section of ΕΕ' and FF' when the upper structure and the lower structure of the art are pressed together. Fig. 10. Fig. 8Β or Fig. 9Β is a schematic diagram of two units. Fig. 11. Is a unit of the art. FIG. 12 is a schematic view of the application of the present invention to the xylophone. FIG. 13 is another embodiment of the electronic drum of the present technology. FIG. 14 is a schematic view of the application of the present technology to the electronic organ. [Main component symbol description] H 10 upper soft substrate 10 Τ Upper soft substrate upper surface 10 Β upper soft substrate lower surface 11 opening 20 lower layer soft substrate 20 Τ lower layer soft substrate upper surface 20 Β lower layer soft substrate lower surface 21 slit space 26 space 30, 300 circuit system 11 201201194 30 1, 3011, 3012 first audio processing system 302, 3021, 3022 second audio processing system 303, 3031, 3032 second audio processing system 40 speaker E101 upper layer electrode E102 upper layer electrode E1 upper layer electrode E11 extension circuit E12 upper layer electrode connection circuit E121 Upper electrode connection circuit E122 Upper electrode connection circuit E2 Lower electrode E22 Lower layer electrode connection circuit DR2 Soft electronic drum P Strike area PZ1 Upper laminate resistance material layer PZ2 Lower laminate resistance material layer R Soft electronic drum roll S isolation unit ST drum stick X2 Soft electronic Xylophone XR soft electronic xylophone roll XP analog metal key X3 soft keyboard XST hit bar RP soft electronic piano volume PI analog keyboard key 12