TW201144794A - Method of checking an inspection apparatus and method of establishing a measurement variable of the inspection apparatus - Google Patents

Method of checking an inspection apparatus and method of establishing a measurement variable of the inspection apparatus

Info

Publication number
TW201144794A
TW201144794A TW100112796A TW100112796A TW201144794A TW 201144794 A TW201144794 A TW 201144794A TW 100112796 A TW100112796 A TW 100112796A TW 100112796 A TW100112796 A TW 100112796A TW 201144794 A TW201144794 A TW 201144794A
Authority
TW
Taiwan
Prior art keywords
inspection apparatus
inspection
establishing
checking
histogram
Prior art date
Application number
TW100112796A
Other languages
Chinese (zh)
Other versions
TWI460419B (en
Inventor
Hee-Wook You
Original Assignee
Koh Young Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koh Young Tech Inc filed Critical Koh Young Tech Inc
Publication of TW201144794A publication Critical patent/TW201144794A/en
Application granted granted Critical
Publication of TWI460419B publication Critical patent/TWI460419B/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/30—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces
    • G01B11/306—Measuring arrangements characterised by the use of optical techniques for measuring roughness or irregularity of surfaces for measuring evenness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/08—Testing mechanical properties
    • G01M11/081—Testing mechanical properties by using a contact-less detection method, i.e. with a camera
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • General Health & Medical Sciences (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

In order to establish a lighting intensity of an inspection apparatus, an inspection board is installed in an inspection apparatus. Then, a width of a histogram of a captured image acquired through a camera of the inspection apparatus is adjusted to avoid from a dark region and a bright region. Thereafter, a lighting intensity of the inspection apparatus is adjusted by adjusting the histogram to be near a middle of a graph. Thus, a setting time of an inspection condition stored in a job file may be reduced to increase the user's convenience, and measurement error due to mis-establishment may be reduced to enhance inspection precision.
TW100112796A 2010-04-14 2011-04-13 Method of checking an inspection apparatus and method of establishing a measurement variable of the inspection apparatus TWI460419B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20100034056 2010-04-14
KR1020110023171A KR101343375B1 (en) 2010-04-14 2011-03-16 Method of checking and setting inspection apparatus
KR1020110032487A KR101227110B1 (en) 2010-04-14 2011-04-08 Method of checking and setting inspection apparatus

Publications (2)

Publication Number Publication Date
TW201144794A true TW201144794A (en) 2011-12-16
TWI460419B TWI460419B (en) 2014-11-11

Family

ID=45029849

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100112796A TWI460419B (en) 2010-04-14 2011-04-13 Method of checking an inspection apparatus and method of establishing a measurement variable of the inspection apparatus

Country Status (3)

Country Link
JP (2) JP2011227077A (en)
KR (2) KR101343375B1 (en)
TW (1) TWI460419B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468640B (en) * 2012-09-25 2015-01-11 Machvision Inc Socket connector detection system and detection method

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101810991B1 (en) * 2016-02-04 2018-01-25 주식회사 고영테크놀러지 Inspection stand, inspection system and inspection method
CN107024339B (en) * 2017-04-21 2023-10-20 小艾帮帮（杭州）科技有限公司 Testing device and method for head-mounted display equipment
US11599988B2 (en) * 2020-09-11 2023-03-07 Super Micro Computer, Inc. Inspection of circuit boards for unauthorized modifications
KR102344054B1 (en) * 2021-09-07 2021-12-28 주식회사 시스템알앤디 A diagnostic method of a multi-optical vision system using a reference target

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02145904A (en) * 1988-11-28 1990-06-05 Hitachi Ltd Pattern inspection and pattern inspecting device used therefor
JPH0719825A (en) * 1993-06-23 1995-01-20 Sharp Corp Substrate inspection apparatus
JPH07181671A (en) * 1993-12-22 1995-07-21 Toshiba Corp Mask alignment inspecting method and inspecting device
US6606402B2 (en) * 1998-12-18 2003-08-12 Cognex Corporation System and method for in-line inspection of stencil aperture blockage
US6545275B1 (en) 1999-09-03 2003-04-08 Applied Materials, Inc. Beam evaluation
JP2003139718A (en) * 2001-10-30 2003-05-14 Nikon Corp Device and method for inspecting surface
AU2003225698A1 (en) 2002-03-05 2003-10-08 Arizona Board Of Regents Wave interrogated near field array system and method for detection of subwavelength scale anomalies
US7271838B2 (en) * 2002-05-08 2007-09-18 Olympus Corporation Image pickup apparatus with brightness distribution chart display capability
KR20070001360A (en) * 2005-06-29 2007-01-04 삼성전자주식회사 Method for detecting defect of semiconductor substrate
US7512269B2 (en) * 2005-08-04 2009-03-31 Asaf Golan Method of adaptive image contrast enhancement
KR100870930B1 (en) * 2007-05-08 2008-11-28 주식회사 고영테크놀러지 Multi-directional projection type moire interferometer and inspection method using it

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI468640B (en) * 2012-09-25 2015-01-11 Machvision Inc Socket connector detection system and detection method

Also Published As

Publication number Publication date
KR101343375B1 (en) 2013-12-20
KR101227110B1 (en) 2013-01-29
JP2011227077A (en) 2011-11-10
KR20110115083A (en) 2011-10-20
TWI460419B (en) 2014-11-11
JP2014197034A (en) 2014-10-16
KR20110115078A (en) 2011-10-20

Similar Documents

Publication Publication Date Title
FI20135189L (en) Portable lateral test result reader
WO2009060951A1 (en) Face image picking-up device, face image picking-up method and its program
WO2011137731A3 (en) Method for controlling light-emitting device in terminal equipment, apparatus thereof and terminal equipment
ATE555418T1 (en) INTERNAL CAMERA METHOD FOR DETECTING FLASH EYES WITH HIGH ACCURACY
TW201144794A (en) Method of checking an inspection apparatus and method of establishing a measurement variable of the inspection apparatus
EP3301664A3 (en) Method and apparatus for adjusting screen brightness
WO2007012839A3 (en) Light measurement method and apparatus
EP2866197A3 (en) Guiding method and information processing apparatus
WO2016025935A3 (en) Precision luxmeter methods for digital cameras to quantify colors in uncontrolled lighting environments
GB2510076A (en) Gain value of image capture component
GB2482648A (en) Method for creating content using a camera of a portable terminal and a portable terminal adapted therefor
EP2688285A3 (en) Image capture apparatus and control method thereof, and lens unit
ATE511153T1 (en) OBJECT RECOGNITION DEVICE, IMAGING DEVICE, OBJECT RECOGNITION METHOD AND PROGRAM
EP2560463A3 (en) Lighting control systems and methods
EP3094089A3 (en) Electronic device and method
EP2650824A3 (en) Image processing apparatus and image processing method
EP2783735A3 (en) Apparatus and method for smart lighting of depicted objects on a display terminal
EP2202687A3 (en) Image quality evaluation device and method
EP2357794A3 (en) Multi-step exposed image acquisition method by electronic shutter and photographing apparatus using the same
EP2222089A3 (en) Image processing device and method
EP2658242A3 (en) Apparatus and method for recognizing image
EP2424217A3 (en) Apparatus and method of controlling an image forming apparatus
EP2712175A3 (en) Method and apparatus for generating photograph image
JP2012247648A5 (en)
MY168232A (en) Method and system for determining quality of tubes