TW201144349A - Curable composition and cured article - Google Patents

Curable composition and cured article Download PDF

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TW201144349A
TW201144349A TW100104535A TW100104535A TW201144349A TW 201144349 A TW201144349 A TW 201144349A TW 100104535 A TW100104535 A TW 100104535A TW 100104535 A TW100104535 A TW 100104535A TW 201144349 A TW201144349 A TW 201144349A
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group
ring
molecule
meth
acrylate
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TW100104535A
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Chinese (zh)
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Takashi Kubo
Hiroki Takenaka
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Daicel Chem
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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins

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  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)

Abstract

This invention provides a curable composition having such characteristics as a high transmittance and a high refraction index, the curable composition being useful for obtaining a curable resin of high Abbe's number which has such characteristics that the optical properties and physical properties would hardly change even under high temperature conditions. The curable composition of this invention is characterized in containing (A) an epoxy compound having an aliphatic ring in the molecule, (B) a (meth) acrylic acid ester having an aliphatic ring in the molecule, and (C) a (meth) acrylic acid ester having an epoxy group in the molecule. At least one kind of compound selected from the group consisting of a (meth) acrylic acid ester having an aliphatic ring epoxy group and a (meth) acrylic acid ester having a glicidyl group is used as (C) (meth) acrylic acid ester having an epoxy group in the molecule.

Description

201144349 六、發明說明: 【發明所屬之技術領域】 本發明是有關硬化性組成物、其硬化物及光學構件。 更詳言之’是有關光學特性及物理特性優異,同時即使在 高溫下也可形成該光學特性及物理特性不會 之硬化性組成物、該硬化性組成物硬化而得的硬化樹脂, 及由該硬化樹脂而成之鏡片等光學構件。 【先前技術】 ,在機餘件材料、電氣•電子元件材料、汽車元件材 料、土木建築材料、成形材料、塗料、接著劑、密封材等 ,,已使用硬化性組成物作為塑膠材料,近年來作為鏡片 等光學構件用的材料上也受到矚目。 兄 使用硬化性組成物作為塑膠鏡片材料的例子,已知是 以具有第架構的(甲基)丙烯酸g旨為主成分的塑膠鏡片材 料(專利文獻1)。在此塑膠鏡片材料中,因所具有第架構 的(甲基)丙烯酸g旨之黏度偏高,故藉由在主鏈上添二具 有環氧院基的乙縣化合物或單官能之自由基聚合性單 體’以降低黏度而作成成形物。不過,在這樣的組成物中, 會產生折射率搖擺不定或降低關題。同時,也有硬化收 縮大、吸濕率亦高的問題。 在專利文獻2中提議一種硬化性組成物,其係為了解 決如上述具有芳香環的(曱基)丙烯酸醋為主體之硬化組 成,所具有的問題*併用具有芳香環的(曱基)丙烯酸醋 與陽離子聚合性化合物者。制此組成物時,在硬化速度 322757 4 201144349 J之提高、因低黏度化的作業性之提高、硬化物之硬化收縮 、的抑制、尚折射率之維持上可達到某種程度之功效。由此 組成物而得的塑膠鏡片,可使用作為阿貝數(Abbe Number) 40以下的低阿貝數鏡片。然而,由此組成物硬化 而得的塑膠鏡片之耐熱性不足,在高溫下,會使形狀變化 或使透光率明顯降低。因此,例如附相機的手機等雖然是 經過回焊(reflow)方式的焊接步驟(貼裝步驟;m〇unting process)而製得,但因不能耐受該步驟溫度(大約26〇〇c ), 故在焊接步驟之後’必須有以連接器連接他種方式製作成 之照相模組的步驟。同時’雖然已有阿貝數45以上的高阿 貝數之樹脂材料,但幾乎未見可耐受回焊方式的耐熱性優 異之塑膠材料。 [先前技術文獻] [專利文獻] 專利文獻1:日本特許3130555號說明書 專利文獻2:日本特開2〇〇9 —235196號公報 【發明内容】 [發明所欲解決的問題] 本發明的目的疋提供一種硬化性組成物,其具有高透 光率及折射率,同時即使在高溫條件下,也可得具有光學 特性或物理特性不易變化的特性及具有阿貝數 45以上的 高阿貝數之硬化樹脂(以下,將「具有阿貝數45以上的高 阿貝數之硬化樹脂」簡稱為「高阿貝數之硬化樹脂」)。 本發明的另一目的是提供:即使在以回焊方式焊接等 5 322757 201144349 -的高溫條件下’也具有光學特性或物理特性不易變化之特 s 性的高阿貝數之硬化樹脂,及由該硬化樹脂而成的光學構 件0 [解決問題的方式] 本發明人等為達成上述目的而進行深入探討的結果 發現,使包含特定結構的環氧化合物、特定結構的(曱基) 丙烯酸酯與分子内具有環氧基的(曱基)丙烯酸酯之硬^匕 組成物硬化後,可使其具有高的透光率及折射率,同時即 使在例如大約26〇t的高溫條件下也可得到具有光學特性 或物理特性不易變化的性質之高阿貝數的硬化樹脂,而完 成本發明。 即,本發明可提供一種硬化性組成物,其特徵為:包 含分子内具有脂環的環氧化合物⑷、分子内具有脂環的 (曱基)丙稀酸S旨(B)與分子内具有環氧基的(曱基) 丙烯酸酯(C)。 刀子内/、有環氧基的(曱基)丙烯酸酯(c),可使用 例如選自具有I環環氧基之(▼基)丙稀_及具有縮水 甘油基之(甲基)丙烯酸酯中的至少一種化合物。 前述分子内具有脂環的環氧化合物(A),可使用如選 自具有脂壞魏基之環氧化合物、環氧基直接以單鍵鍵結 月曰壤的壞氧化合物’及具有脂環與縮水甘油醚基的環氧化 合物之中的至少一種環氧化合物。 分子内具有脂環的(甲基)丙稀酸S旨(B),宜為分子 内具有脂環的多官能之(甲基)丙稀酸醋。 6 322757 201144349 ▲ 同時,本發明可提供使前述硬化性組成物硬化而得的 , 硬化樹脂。 並且’本發明可提供由前述硬化樹脂而成的光學構 件0 [發明的效果] 應用本發明的硬化性組成物,經硬化而具有高的透光 率及折射率’同時即使在例如大約260°C的高溫條件下也 可知到具有光學特性(透光率、折射率、阿貝數)或物理特 性不易變化的特性之高阿貝數的硬化樹脂。由於這種硬化 樹脂即使在回烊方式的焊接步驟中也不黃變,同時形狀也 不會變化’故尤其可供使用於鏡片等光學構件的用途上。 例如將由本發明的硬化樹脂而成的鏡片使用作為附相機 之手機的鏡片時,即可在以回焊方式的焊接步驟(貼裝步 驟)中,同時進行照相模組的貼裝步驟,而可省略焊接步 驟後所施行之以連接器連接照相模組的步驟。 【實施方式】 [用以實施發明的形態] 本發明的硬化性組成物包含有分子内具有脂環(脂肪 族烴% )的環氧化合物(A)、分子内具有脂環(脂肪族烴 銥)的(甲基)丙烯酸酯(B)與分子内具有環氧基的(曱 基)丙烯酸酯(C)。 在本發明中,由於是將分子内具有脂環的環氧化合物 陽離子聚合性化合物(陽離子硬化性化合物),與分子内 具有月曰%的(甲基)丙烯酸酯之自由基聚合性化合物(自 322757 7 201144349 ; 由基硬化性化合物)組合使用,故經硬化後,可得具有高 :的透光率及折射率的高阿貝數之硬化樹脂。同時,此硬化 樹脂在與僅由陽離子聚合性化合物而得的硬化物比較時, 其具有的優勢是強度高、可即時顯現耐溶劑性,同時在與 僅由自由基聚合性化合物而得的硬化物比較時,其硬化收 縮率較低及吸濕性較低。同時,在本發明中,除了此等聚 合性化合物之外’因可調配分子内具有陽離子聚合性基之 環氧基與自由基聚合性基之(甲基)丙烯醯氧基的聚合性 化合物,此聚合性化合物是作用為陽離子硬化樹脂與自由 基硬化樹脂的交聯劑,故可顯著提高硬化樹脂的耐熱性, 即使在高溫下亦可得光學特性(透光率、折射率、阿貝數 等)或物理特性也不易變化的硬化樹脂。 [分子内具有脂環的環氧化合物(A)] 至於分子内具有脂環的環氧化合物(A),只要是分子 内具有脂環與環氧基之化合物即可,並無特別的限定(但 是’分子内具有環氧基之(甲基)丙烯酸酯除外)。分子内 具有脂環的環氧化合物(A)宜不具有芳香環者。分子内 具有脂環的環氧化合物(A)可單獨使用或將2種以上組 合後使用。在分子内具有脂環的環氧化合物(A),宜為分 子内具有2個以上環氧基之多官能的環氧化合物。 分子内具有脂環的環氧化合物(A),可列舉出:(i) 具有以構成脂環的2個相鄰之碳原子與氧原子所構成之環 氧基(脂環環氧基)的脂環式環氧化合物、㈤環氧基直 接以單鍵鍵結脂環的環氧化合物、(iii)具有脂環與縮水甘 8 322757 201144349 油駿基的縮水甘_型環氧化合物等。 環十==單環姐環'環己_、環辛院環、 峨環以==員,並以大約員 環K3.0]壬燒環)王” ^、全虱節環(二 苊環、全Μ I,β n全4環、全氫菲環、全氫 :衣全虱肥%、降获⑨(norbornane) [5 2丨金聽環、二卵.3辦_、三環 h)的脂環(交聯碳環)等。同時,前述脂環環氧 基可列舉如:環氧基環絲、3,4_環氧基環 環氧基三環似㈣]癸烧δ—(或9)基(環氧化二環戍 一稀基)等。 具有前述脂環環氧基的脂環式環氧化合物(i),可列 =如下述式(A-1)表示的化合物(2個脂環環氧基以 單鍵或介由連結基而結合的化合物)。201144349 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a curable composition, a cured product thereof, and an optical member. More specifically, it is excellent in optical properties and physical properties, and at the same time, it is possible to form a curable composition in which the optical properties and physical properties are not cured, a cured resin obtained by curing the curable composition, and An optical member such as a lens made of the cured resin. [Prior Art] In the machine parts, electrical and electronic component materials, automotive component materials, civil construction materials, molding materials, coatings, adhesives, sealing materials, etc., hardenable compositions have been used as plastic materials. It has also attracted attention as a material for optical members such as lenses. In the case of using a hardening composition as a plastic lens material, a plastic lens material containing a (meth)acrylic acid g as a main component is known (Patent Document 1). In this plastic lens material, because of the high viscosity of the (meth)acrylic acid g of the first structure, by adding two epoxy compound-based compounds or monofunctional radical polymerization in the main chain The monomer 'is reduced in viscosity to form a shaped body. However, in such a composition, there is a problem that the refractive index is swayed or lowered. At the same time, there are also problems of hardening shrinkage and high moisture absorption rate. Patent Document 2 proposes a curable composition for solving the hardening composition of the above-mentioned (fluorenyl) acryl vine having an aromatic ring as a main body, and having the problem* and using a (fluorenyl) acrylate vinegar having an aromatic ring. And cationically polymerizable compounds. When the composition is prepared, the improvement in the curing rate of 322757 4 201144349 J, the improvement in workability due to low viscosity, the suppression of hardening and shrinkage of the cured product, and the maintenance of the refractive index can achieve a certain degree of effect. As the plastic lens obtained from the composition, a low Abbe number lens having an Abbe Number of 40 or less can be used. However, the plastic lens obtained by hardening the composition is insufficient in heat resistance, and at a high temperature, the shape is changed or the light transmittance is remarkably lowered. Therefore, for example, a camera-equipped mobile phone or the like is manufactured by a reflow soldering step (m〇unting process), but since the temperature of the step cannot be tolerated (about 26 〇〇c), Therefore, after the soldering step, there must be a step of making a camera module by connecting the connector. At the same time, although there are resin materials having a high Abbe number of Abbe number of 45 or more, there is almost no plastic material which is excellent in heat resistance which can withstand the reflow method. [PRIOR ART DOCUMENT] Patent Document 1: Japanese Patent No. 3130555, Patent Document 2: Japanese Patent Laid-Open Publication No. Hei No. Hei. No. Hei. Provided is a curable composition which has high light transmittance and refractive index, and which has characteristics which are not easily changed in optical characteristics or physical properties and high Abbe number having an Abbe number of 45 or more even under high temperature conditions. Hardened resin (hereinafter, "hardened resin having a high Abbe number of Abbe number of 45 or more" is simply referred to as "hardened resin of high Abbe number"). Another object of the present invention is to provide a hardened resin having a high Abbe number which has an optical property or a physical property which is not easily changed even under high temperature conditions of 5 322757 201144349 - such as soldering by reflow soldering, and [Offects of the present invention] The inventors of the present invention have conducted intensive studies to achieve the above object, and have found that an epoxy compound having a specific structure and a (meth) acrylate having a specific structure are The hardening composition of the (fluorenyl) acrylate having an epoxy group in the molecule can be cured to have high light transmittance and refractive index, and can be obtained even at a high temperature of, for example, about 26 〇t. The present invention has been completed by a hardened resin having a high Abbe number having a property in which optical characteristics or physical properties are not easily changed. That is, the present invention can provide a curable composition characterized by comprising an epoxy compound (4) having an alicyclic ring in the molecule, (indenyl) acrylic acid having an alicyclic ring in the molecule (B) and having intramolecular Epoxy (indenyl) acrylate (C). In the knives/epoxy group-containing (fluorenyl) acrylate (c), for example, (▼-) propylene having an I-epoxy group and a (meth) acrylate having a glycidyl group can be used. At least one compound. The epoxy compound (A) having an alicyclic ring in the above molecule may be, for example, an epoxy compound selected from the group consisting of an epoxy compound having a lipowei group, an epoxy group directly bonded to a ruthenium by a single bond, and having an alicyclic ring. At least one epoxy compound among the glycidyl ether-based epoxy compounds. The (meth)acrylic acid having an alicyclic ring in the molecule is intended to be (B), and is preferably a polyfunctional (meth)acrylic acid vinegar having an alicyclic ring in the molecule. 6 322757 201144349 ▲ Meanwhile, the present invention can provide a cured resin obtained by curing the above-mentioned curable composition. Further, the present invention can provide an optical member 0 made of the above-mentioned hardening resin. [Effects of the Invention] The curable composition of the present invention is applied to have a high light transmittance and a refractive index by hardening, even at, for example, about 260°. A cured resin having a high Abbe number of optical characteristics (transmittance, refractive index, Abbe number) or a property in which physical properties are not easily changed is also known under high temperature conditions of C. Since the hardened resin does not yellow in the soldering step of the returning method, and the shape does not change, it is particularly useful for use in optical members such as lenses. For example, when a lens made of the cured resin of the present invention is used as a lens of a camera-attached mobile phone, the mounting step of the camera module can be simultaneously performed in a soldering step (mounting step) in a reflow manner. The step of connecting the camera module with the connector after the soldering step is omitted. [Embodiment] The form of the curable composition of the present invention comprises an epoxy compound (A) having an alicyclic ring (aliphatic hydrocarbon %) in the molecule, and an alicyclic ring in the molecule (aliphatic hydrocarbon oxime) (M) acrylate (B) and (fluorenyl) acrylate (C) having an epoxy group in the molecule. In the present invention, an epoxy compound cationically polymerizable compound (cationic curable compound) having an alicyclic ring in the molecule, and a radically polymerizable compound having a monthly (%) (meth) acrylate in the molecule (since) 322757 7 201144349 ; Used in combination with a base-hardening compound), after hardening, a hardened resin having a high Abbe number of high light transmittance and refractive index can be obtained. Meanwhile, when the hardened resin is compared with a cured product obtained only from a cationically polymerizable compound, it has an advantage of high strength, immediate solvent resistance, and hardening with a radical polymerizable compound only. When the materials are compared, the hardening shrinkage rate is low and the hygroscopicity is low. In addition, in the present invention, in addition to these polymerizable compounds, a polymerizable compound of a (meth)acryloxy group having a cationically polymerizable group and a radical polymerizable group in the molecule may be added. Since the polymerizable compound acts as a crosslinking agent for the cationically hardening resin and the radically curable resin, the heat resistance of the cured resin can be remarkably improved, and optical properties (transmittance, refractive index, Abbe number) can be obtained even at high temperatures. Or a hardened resin whose physical properties are not easily changed. [Epoxy compound (A) having an alicyclic ring in the molecule] The epoxy compound (A) having an alicyclic ring in the molecule is not particularly limited as long as it is a compound having an alicyclic ring and an epoxy group in the molecule ( However, 'except for the (meth) acrylate having an epoxy group in the molecule). The epoxy compound (A) having an alicyclic ring in the molecule preferably does not have an aromatic ring. The epoxy compound (A) having an alicyclic ring in the molecule may be used singly or in combination of two or more kinds. The epoxy compound (A) having an alicyclic ring in the molecule is preferably a polyfunctional epoxy compound having two or more epoxy groups in the molecule. The epoxy compound (A) having an alicyclic ring in the molecule includes (i) an epoxy group (alicyclic epoxy group) composed of two adjacent carbon atoms and oxygen atoms constituting the alicyclic ring. An alicyclic epoxy compound, (5) an epoxy compound in which an epoxy group is directly bonded to an alicyclic ring by a single bond, (iii) a glycidyl-epoxy compound having an alicyclic ring and a glycidyl alcohol 832757 201144349 oil base. Ring ten == single ring sister ring 'ring _ _, ring Xin ring, ring ring == member, and about the ring K3.0] 壬 burning ring) king" ^, full 虱 ring (two ring , Μ I, β n all 4 rings, all hydrogen phenanthrene rings, total hydrogen: clothing total 虱 fertilizer%, reduced 9 (norbornane) [5 2 丨 gold listening ring, two eggs. 3 _, three ring h) An alicyclic ring (cross-linked carbocyclic ring), etc. Meanwhile, the above-mentioned alicyclic epoxy group may, for example, be an epoxy group ring wire, a 3,4-epoxycycloepoxy group, a tricyclo-like (tetra)-anthracene δ-( Or 9) a group (epoxidized bicycloindole), etc. The alicyclic epoxy compound (i) having the above alicyclic epoxy group can be listed as a compound represented by the following formula (A-1) (2) a compound in which an alicyclic epoxy group is bonded by a single bond or via a linking group).

(A-1) 上述式中’ Y1是表示單鍵或連結基。至於連結基,可 舉例如2價的烴基、羰基(—co—)、醚鍵(—〇—)、酯 鍵(一COO—)、醯胺鍵(_c〇NH—)、碳酸酯鍵(—〇c〇〇 )、及數個此等基結合成的基等。2價的烴基,可舉例如 亞甲基、亞乙基、亞異丙基、伸乙基、伸丙基、三亞甲基、 四亞甲基等直鏈狀或分枝鏈狀的伸烷基(例如Cl_6伸烧 基)’ 1,2 —伸環戊基、1,3 _伸環戍基、亞環戊基、1,2 —伸 322757 9 201144349 環己基、1,3 —伸環己基、1,4一伸環己基、亞環己基等2 價的脂環式烴基(尤其是2價的伸環烷基);數個此等基結 合成的基等。 以下所示是包括在式(A—1)表示的化合物中之代表 性化合物。(A-1) In the above formula, 'Y1' means a single bond or a linking group. As the linking group, for example, a divalent hydrocarbon group, a carbonyl group (—co—), an ether bond (—〇—), an ester bond (a COO—), a guanamine bond (—c〇NH—), a carbonate bond (— 〇c〇〇), and a plurality of bases in which these groups are combined. The divalent hydrocarbon group may, for example, be a linear or branched alkyl group such as a methylene group, an ethylene group, an isopropylidene group, an exoethyl group, a propyl group, a trimethylene group or a tetramethylene group. (eg Cl_6 extended alkyl) ' 1,2 —cyclopentyl, 1,3 _cyclohexyl, cyclopentylene, 1,2 — extension 322757 9 201144349 cyclohexyl, 1,3 —cyclohexyl, A divalent alicyclic hydrocarbon group such as a cyclohexylene group or a cyclohexylene group (particularly a divalent cycloalkylene group); a group in which a plurality of such groups are bonded. The following are representative compounds included in the compound represented by the formula (A-1).

同時’上述式中,η是1至30的整數。 脂環式環氧化合物,另外還可舉出:分子内具有脂環 與2個以上之環氧基的化合物,且2個以上的環氧基之中 僅有1個是構成脂環的相鄰2個碳原子與氧原子所構成的 322757 10 201144349 環氧基(脂環環氧基)。以下所示是其代表性的化合物(葶 二環氧化物)。Meanwhile, in the above formula, η is an integer of 1 to 30. The alicyclic epoxy compound may also be a compound having an alicyclic ring and two or more epoxy groups in the molecule, and only one of the two or more epoxy groups is adjacent to the alicyclic ring. 322757 10 201144349 epoxy (alicyclic epoxy) composed of 2 carbon atoms and oxygen atoms. Shown below are representative compounds (anthracene biepoxide).

同時,也可使用以下的化合物作為脂環式環氧化合 物,如具有3個以上的脂環環氧基之脂環式環氧化合物、 或僅具有1個脂環環氧基而無其他環氧基的脂環式環氧化 合物。Meanwhile, the following compounds may also be used as the alicyclic epoxy compound, such as an alicyclic epoxy compound having three or more alicyclic epoxy groups, or only one alicyclic epoxy group and no other epoxy group. A alicyclic epoxy compound.

co-f O-CCH^CO ^ o-ch2-C^° CO -f 0 C0 太 0 _ CHg-Co-f O-CCH^CO ^ o-ch2-C^° CO -f 0 C0 Too 0 _ CHg-

CH — i2—co o ~^ch2)j co o—ch2~C^x^0 I —co-f O-fCH^CO -^0-CH2-C^0 C0~f 〇-(CH2>jC0 士〇—ch2-C^〇 〇νCH — i2—co o ~^ch2)j co o—ch2~C^x^0 I —co-f O-fCH^CO -^0-CH2-C^0 C0~f 〇-(CH2>jC0 〇—ch2-C^〇〇ν

-co-f 0-(CH2)^C0 卞 0—CH2-〔3^C-co-f 0-(CH2)^C0 卞 0—CH2-[3^C

OH 同時,上述式中,a、b、c、d、e、f是0至30的整數。 至於環氧基直接以單鍵鍵結前述脂環的環氧化合物 (ii),可舉例如下述式(A—2)表示的化合物。 11 322757 201144349 $OH Meanwhile, in the above formula, a, b, c, d, e, and f are integers of 0 to 30. The epoxy compound (ii) in which the epoxy group is directly bonded to the alicyclic ring by a single bond is, for example, a compound represented by the following formula (A-2). 11 322757 201144349 $

(ΛΑ 上述式中’ R1是由q價的醇[Rl—( 個0H之後的基,p是表示!至3〇的整數H中去除q 10的整數。q個括弧内的基中,p是分別為相同疋或相不異1至 價的(0H)q],可列舉出巧醇、乙醇^相異。q 異丙醇、卜丁醇等一元醇;乙二醇、…丙— 丙H4—τ二醇、新戊二醇 ,- 絲一夕一― ^ 一醉、二乙一 -一 一:、四乙二醇、二丙二醇、聚丙二醇等二元 甘油、二甘油、赤藻糖醇、三㈣基乙燒、三”卜 ,四醇、二新戊四醇、山梨糖醇等三元醇。前‘醇:可 以疋㈣多元醇、聚酉旨多元醇、聚碳酸酉旨多元醇、聚㈣ 多:醇等。前述醇’宜為碳數U10的脂肪族醇(尤其β 二羥甲基丙燒等脂肪族多元醇)。 疋 至於具有脂環與縮水甘油鱗基的縮水甘油趟型環氧 化合物(iii),可舉出脂環式醇(尤其是脂環式多元㈤的 縮水甘_。此化合物也可以是分子㈣有芳香環與環氧 基的環氧化合物(例如,由物A、雙紛F、雙紛s、雙 紛第等雙_與表_之縮合反應而得的表雙型縮水甘油 謎型壤氧樹脂等)之芳香環經核氫化的化合物。 具有脂環與縮水甘油醚基的縮水甘油醚型環氧化合 物(111) ’可例示如以下的化合物。 322757 12 201144349(ΛΑ) In the above formula, 'R1 is an alcohol from the q-valent alcohol [Rl—(the base after 0H, p is an integer that removes q 10 from the integer H to 3〇. Among the bases in q brackets, p is They are the same hydrazine or the same as the valence (0H)q, which can be exemplified by a mixture of alcohols and ethanol. q Monohydric alcohols such as isopropanol and butanol; ethylene glycol, ... C-propane H4 —τ diol, neopentyl glycol, — 丝 一 一 — ^ 一醉, 二一一一一:, diethylene glycol, dipropylene glycol, polypropylene glycol and other binary glycerin, diglycerin, erythritol, Tri- (tetra)-based ethidium, triterpenoid, tetraol, dipentaerythritol, sorbitol and other triols. Pre-alcohol: can be used to (4) polyols, poly-polyhydric alcohols, polycarbonate-based polyols, Poly(tetra): alcohol, etc. The aforementioned alcohol 'is preferably an aliphatic alcohol having a carbon number of U10 (especially an aliphatic polyol such as β-dimethylolpropane). 疋 as for a glycidyl type having an alicyclic ring and a glycidyl squara group The epoxy compound (iii) may, for example, be an alicyclic alcohol (especially an alicyclic polybasic (f)). This compound may also be an epoxidized group of an aromatic ring and an epoxy group. (For example, an aromatic ring-nuclear hydrogenated compound derived from the condensation reaction of a substance A, a double F, a double s, a double bis, and a double condensed reaction with a table _) The glycidyl ether type epoxy compound (111) having an alicyclic ring and a glycidyl ether group can be exemplified by the following compounds. 322757 12 201144349

II

本發明的硬化性組成物中的分子内具有脂環之J署氧^ 化合物(A )的比例,雖然可因硬化樹脂的用途等而異, 但在相對於硬化性組成物整體(或硬化性化合物之總量) 時’例如約為10至70重量%,宜為20至60重量%,而 以大約30至50重量%時較佳。如分子内具有脂環的環氧 化合物(A)之量太少時,除了造成成形性的問題之硬化 收縮變大之外,而且也容易產生吸濕性變大、耐濕性降低 等問題。同時’如分子内具有脂環的環氧化合物(A)之 量過多時’將使後述的回焊條件下等S溫下的絲特性之 變化量變大,而容易產生耐熱性的問題。 [分子内具有脂環的(甲基)丙稀酸醋⑻] 至於分子内具有脂環的(甲基)丙稀酸醋(b),只要 ^分子内具有脂環與(?基)㈣醯氧基的化合物,即無 (但疋’分子内具有環氧基的(甲基)丙稀酸 外)°分子内具有脂環的(甲基)丙稀酸酯⑻宜為 322757 13 201144349 不具有芳香環者。分子内具有脂環的(曱基)丙烯酸酯(B) 可單獨使用,或將2種以上組合後使用。分子内具有脂環 的(曱基)丙烯酸酯(B)’宜為分子内具有2個以上(曱 基)丙烯醯氧基的多官能之(曱基)丙烯酸能。 同時’分子内具有脂環的(甲基)丙歸酸醋(B),是 以分子内具有脂環的丙烯酸酯更佳。在比較具有丙烯醯氧 基之單體與具有甲基丙烯醯氧基之單體的自由基聚合速度 時,前者較為緩慢。另一方面,一般在比較自由基聚合的 反應速度與陽離子聚合的反應速度時,自由基聚合的反應 較為快速。如同本發明’在自由基聚合與陽離子聚合並行 之系統中’就硬化樹脂之物性等而言,宜儘可能使自由基 聚合與陽離子聚合均等進行。如使自由基聚合先行進行 時,因將使生成的硬化樹脂之硬化收縮率變大,同時即使 自由基聚合完畢後,也將殘留多量未反應的自由基聚合性 基,而在硬化後的加熱處理中引起陽離子聚合性基的反應 或分解,而可能使硬化樹脂的物性受損。因此,分子内具 有脂環的(曱基)丙烯酸S旨⑻’是以分子内具有脂環的 丙稀酸g旨更佳。 至於上述脂環,可舉出:環戊院環、環已烧環、環辛 烧環、環十二烧環等單環的脂環(3至15員,並以大約$ 至6員的環烧環等為佳);十氫萘環(全氫蔡環)、全氮節 環(二環[4.3.0]壬燒環)' 全氫蒽環、全氣第環、全氮菲環、 全氫危環、全氫16環、降获炫環(二環[2上1]庚烧環)、異 菠烷環、金剛烷環、二環[3 3.0]辛烷環、三環[521〇2,6] 322757 14 201144349 ,癸烷環、三環[6.2.1.〇2’7]十一烷環等多環(大約2至4環) • 的脂環(交聯碳環)等。 分子内具有脂環的(曱基)丙烯酸g旨(B)中,脂環 與(曱基)丙烯醯氧基可直接鍵結,也可介由連結基而鍵 結。連結基,可舉例如2價的烴基、羰基(—co—)、峻 鍵(—〇—)、酯鍵(—coo_ )、醯胺鍵(_c〇NH—)、 碳酸酯鍵(一OCOO—)、及數個此等基結合成的基等。2 價的烴基,可舉例如亞曱基、亞乙基、亞異丙基、伸乙基、 伸丙基一亞曱基、四亞曱基等直鏈狀或分枝鏈狀的伸燒 基(例如伸烷基,並宜為Ci_6伸烷基);丨,2—伸環 戊基、1,3 —伸環戊基、亞環戊基、丨,2—伸環己基、丨。— 伸環己基、I,4-伸環己基、亞環己基等2價的脂環式煙基 (尤其是2價的伸環烷基);數個此等基結合成的基等。 分子内具有脂環的(甲基)丙烯酸酯(B)上,可舉 例如下述式(B—1)表示的化合物。The ratio of the oxygen compound (A) having an alicyclic ring in the molecule of the curable composition of the present invention may vary depending on the use of the cured resin, etc., but may be integral to the curable composition (or hardenability). The total amount of the compound is, for example, about 10 to 70% by weight, preferably 20 to 60% by weight, and preferably about 30 to 50% by weight. When the amount of the epoxy compound (A) having an alicyclic ring in the molecule is too small, the hardening shrinkage is increased in addition to the problem of moldability, and problems such as an increase in hygroscopicity and a decrease in moisture resistance are likely to occur. At the same time, when the amount of the epoxy compound (A) having an alicyclic ring in the molecule is too large, the amount of change in the wire property at the S temperature such as the reflowing condition to be described later is increased, and the problem of heat resistance is likely to occur. [(Methyl)acrylic acid vinegar (8) having an alicyclic ring in the molecule] As for the (meth)acrylic acid vinegar (b) having an alicyclic ring in the molecule, as long as it has an alicyclic ring and (?) (tetra) in the molecule The compound of the oxy group, that is, the (meth)acrylic acid having an alicyclic ring in the molecule (excluding the (meth)acrylic acid having an epoxy group in the molecule) is preferably 322757 13 201144349 does not have Aromatic ring. The (fluorenyl) acrylate (B) having an alicyclic ring in the molecule may be used singly or in combination of two or more. The (fluorenyl) acrylate (B)' having an alicyclic ring in the molecule is preferably a polyfunctional (fluorenyl) acrylic acid having two or more (fluorenyl) acryloxy groups in the molecule. Meanwhile, the (meth) glycerol (B) having an alicyclic ring in the molecule is preferably an acrylate having an alicyclic ring in the molecule. When the radical polymerization rate of a monomer having an acryloxy group and a monomer having a methacryloxy group is compared, the former is relatively slow. On the other hand, in general, when the reaction rate of radical polymerization is compared with the reaction rate of cationic polymerization, the reaction of radical polymerization is relatively fast. As in the present invention, in the system in which the radical polymerization and the cationic polymerization are carried out, it is preferable to carry out the radical polymerization and the cationic polymerization as much as possible in terms of physical properties of the cured resin and the like. When the radical polymerization is carried out in advance, the curing shrinkage ratio of the formed hardened resin is increased, and even after the radical polymerization is completed, a large amount of unreacted radical polymerizable group remains, and the heating after hardening is performed. The reaction or decomposition of the cationically polymerizable group is caused during the treatment, and the physical properties of the hardened resin may be impaired. Therefore, the (())-acrylic acid S having an alicyclic ring in the molecule is preferably acrylic acid g having an alicyclic ring in the molecule. As for the above alicyclic ring, a single ring alicyclic ring (3 to 15 members, and a ring of about $6 to 6 members) such as a ring-ring ring, a ring-burned ring, a ring-burning ring, and a ring-shaped ring is exemplified. Burning ring is preferred); decahydronaphthalene ring (all hydrogen ring), total nitrogen ring (bicyclo[4.3.0] ring) 'hydrogen ring, all gas ring, all nitrogen ring, All hydrogen dangerous ring, all hydrogen 16 ring, reduced danning ring (bicyclo[2 upper 1] heptane ring), iso-araconne ring, adamantane ring, bicyclo[3 3.0]octane ring, tricyclic [521 〇2,6] 322757 14 201144349 , decane ring, tricyclo[6.2.1.〇2'7] undecane ring and other polycyclic rings (about 2 to 4 rings) • alicyclic (crosslinked carbocyclic ring), etc. . In the (B) group having an alicyclic thiol group, the alicyclic group may be directly bonded to the (fluorenyl) acryloxy group or may be bonded via a linking group. The linking group may, for example, be a divalent hydrocarbon group, a carbonyl group (—co—), a stern bond (—〇—), an ester bond (—coo — ), a guanamine bond (—c〇NH—), a carbonate bond (an OCOO— And a plurality of bases in which these groups are combined. The divalent hydrocarbon group may, for example, be a linear or branched chain extension group such as an anthracenylene group, an ethylene group, an isopropylidene group, an ethylidene group, a propylidene group or a tetradecylene group. (e.g., an alkyl group and preferably an alkyl group of Ci_6); anthracene, 2-cyclopentyl group, 1,3-cyclopentyl group, cyclopentylene group, anthracene, 2-cyclohexylene group, anthracene. — a bivalent alicyclic nicotinyl group (especially a divalent cycloalkylene group) such as a cyclohexyl group, an I, 4-cyclohexylene group or a cyclohexylene group; a group in which a plurality of such groups are bonded. The (meth) acrylate (B) having an alicyclic ring in the molecule may, for example, be a compound represented by the following formula (B-1).

0 II CHg^C —C—0—γ0 II CHg^C —C—0—γ

R3R3

上述式中’環Z1表示脂環’ γ2、丫3是相同或相異, 表示單㈣連結基。至於環ζι中的脂環,可舉出例 的脂環。以,宜為三卵.•鬥纽環等多環的脂環 (交聯碳環)。 至於Y2、Y3中的連結基,可舉出上述例示的連結基。 中的連結基,尤其宜為2價的烴基(尤其是伸院基)、 心或2個以上的2價烴基(尤其是伸絲)與 322757 15 201144349 以上的氧原子(一 〇—)結合成的基。 至於式(Β — 1)表示的化合物之代表例,可舉出1,4 —環己二醇二(甲基)丙烯酸酯、1,4—環己烷二曱醇二(曱 基)丙烯酸酯、二環[2.2.1]庚烷二甲醇二(甲基)丙稀酸 酯、1,3 —金剛二醇二(曱基)丙烯酸酯、1,3 _金剛炫二 曱醇二(甲基)丙烯酸酯、三環[5.2.1.〇2·6]癸烷二曱醇二(曱 基)丙烯酸酯等。 分子内具有脂環的(甲基)丙稀酸醋(Β),也可使用 環己基(甲基)丙烯酸酯、環己烷甲醇(甲基)丙烯酸酯、 1 —金剛醇(甲基)丙烯酸酯、i—金剛烷曱醇(曱基)丙 烯酸酯、異菠烷基(甲基)丙烯酸酯、三環[5.2.1.02,6]癸烷 甲醇(曱基)丙烯酸酯[=二環戊基(甲基)丙烯酸酯]、 二環戊基氧乙基(甲基)丙烯酸酯等單官能的(甲基)丙 埽酸醋。 本發明的硬化性組成物中分子内具有脂環的(甲基) 丙烯酸酯(B)之比例,雖然因硬化樹脂的用途等而異, 但在相對於硬化性組成物整體(或硬化性化合物之總量) 時,是例如10至70重量%,並宜為2〇至6〇重量%,而 以大力30至50重置%時較佳。如分子内具有脂環的(甲 基烯酸i旨(B)之量太少時,將使後述的回焊條件下 等在高溫下之光學特性的變化量變大,容易產生财熱性上 的題。同時,如分子内具有脂環的(甲基)丙烯酸酯⑻ 量過多時❺了使硬化收縮變大而造成成形性的問題之 外’同時也使吸濕性變大而容易產生⑼濕性降低等問題。 322757 16 201144349 ,[分子内具有環氧基的(甲基)丙烯酸酯(c)] , 至於分子内具有環氧基的(甲基)丙烯酸酯(c),只 要是分子内具有環氧基與(甲基)丙烯醯氧基的化合物, 即無特別的限定。分子内具有環氧基的(甲基)丙烯酸酯 (C)可單獨使用,或將2種以上組合後使用。 分子内具有環氧基的(甲基)丙烯酸酯(c),因與上 述分子内具有脂環的(甲基)丙烯酸酯(B)時相同的理 由(儘可能使自由基聚合與陽離子聚合均等進行的理由), 故以分子内具有環氧基的丙烯酸酯更佳。 分子内具有環氧基的(甲基)丙稀酸酯(C),可舉例 如(0具有脂環環氧基的(甲基)丙烯酸醋、(ii)具有縮 尺甘/由基的(甲基)丙烯酸醋等。至於脂環環氧基,口要 是構成脂環的相鄰2個碳原子與氧原子所構成之環減, =特別的料。脂環可列舉出:環錢環、環己烧環、 ==環十二烧環等單環的脂環(3至。員,並以大 員的魏環等為佳);十氫萘環(全氫萘環)、全 ^=[4.3.。]壬烧環)、全氣葱環、全氫第環、全氣 環(二環[叫庚烧 衣)異纽%、金剛烧環、二環[33〇]辛 [”丄〇,6]癸院環、三環〇2,7]十一 二二衣 2至4環)的脂環(交聯碳環)等。脂環環=大約 如:環氧基環戊基、3,4-環氣基環己基、、^可列= 不的3,4-環氧基三環[5 21〇2,6 工(a)表 瑷卢备或9)基箄。脂 鳅%氧基疋以下述式(a)表示 土寺月曰 幻,4~裱虱基三環[5.2.1.〇2,6] 322757 201144349 癸烧8—(或9)基等脂環環氧基為佳,其是由交聯碳環虚 構成該交聯碳環的相鄰2個碳原子與氧原子所構成的環氧 基。In the above formula, 'ring Z1 represents alicyclic ring γ2, 丫3 is the same or different and represents a single (tetra) linking group. As for the alicyclic ring in the ring ζι, an alicyclic ring is exemplified. Therefore, it is preferable to be a multi-ring alicyclic ring (cross-linked carbon ring) such as a three-negative. Examples of the linking group in Y2 and Y3 include the above-exemplified linking groups. The linking group in the middle, particularly preferably a divalent hydrocarbon group (especially a stretching base), a core or two or more divalent hydrocarbon groups (especially an extruded wire) combined with an oxygen atom (one 〇-) of 322757 15 201144349 or more Base. Representative examples of the compound represented by the formula (Β-1) include 1,4-cyclohexanediol di(meth)acrylate and 1,4-cyclohexanedimethanol di(decyl)acrylate. , bicyclo [2.2.1] heptane dimethanol di(methyl) acrylate, 1,3 - adamantane bis(indenyl) acrylate, 1,3 _ hexaerythritol di(methyl) Acrylate, tricyclo[5.2.1.〇2·6]decanedioxanyl (indenyl) acrylate, and the like. (Meth)acrylic acid vinegar (Β) having an alicyclic ring in the molecule, and cyclohexyl (meth) acrylate, cyclohexane methanol (meth) acrylate, 1 - adamantyl (meth) acrylate may also be used. Ester, i-adamantane sterol (mercapto) acrylate, iso-spinyl (meth) acrylate, tricyclo [5.2.1.02,6] decane methanol (mercapto) acrylate [= dicyclopentyl Monofunctional (meth)propionic acid vinegar such as (meth) acrylate] or dicyclopentyloxyethyl (meth) acrylate. The proportion of the (meth) acrylate (B) having an alicyclic ring in the curable composition of the present invention varies depending on the use of the cured resin, etc., but is integral with the curable composition (or a curable compound). The total amount) is, for example, 10 to 70% by weight, and preferably 2 to 6 % by weight, and more preferably 30 to 50% by weight. When the amount of the methacrylate in the molecule is too small, the amount of change in the optical characteristics at a high temperature, such as the reflowing conditions described later, is increased, and the problem of heat recovery is likely to occur. At the same time, if the amount of the (meth) acrylate (8) having an alicyclic ring in the molecule is too large, the hardening shrinkage is increased to cause a problem of formability, and at the same time, the hygroscopic property is also increased to easily produce (9) wetness. Reduce the problem. 322757 16 201144349 , [(meth) acrylate (c) having an epoxy group in the molecule], as for the (meth) acrylate (c) having an epoxy group in the molecule, as long as it has intramolecular The (meth) acrylate (C) having an epoxy group in the molecule may be used singly or in combination of two or more kinds. The (meth) acrylate (c) having an epoxy group in the molecule is the same as that of the (meth) acrylate (B) having an alicyclic ring in the above molecule (the radical polymerization and the cationic polymerization are equalized as much as possible) Ring in the molecule The acrylate of the group is more preferable. The (meth) acrylate (C) having an epoxy group in the molecule may, for example, be (meth)acrylic acid vinegar having an alicyclic epoxy group, (ii) having a scale. As for the alicyclic epoxy group, the ring is composed of two adjacent carbon atoms and oxygen atoms constituting the alicyclic ring, and the alicyclic ring is exemplified. Out: ring ring of ring, ring of ring, ring of ring = 12 ring of ring, etc. (3 to the member, and the Wei ring of the big member is preferred); decahydronaphthalene ring (perhydronaphthalene) Ring), all ^=[4.3..]壬烧环), whole gas onion ring, all hydrogen ring, full gas ring (two rings [called Geng burning clothes) different New%, diamond ring, two rings [33 〇] Xin [" 丄〇, 6] 癸 ring, three ring 〇 2, 7] eleven two clothes 2 to 4 ring) alicyclic (crosslinked carbon ring), etc. alicyclic ring = approximately as: ring Oxycyclopentyl, 3,4-cyclohexylcyclohexyl, ^collistin = 3,4-epoxytricyclo[5 21〇2,6 (a) 瑷 Lu Bei or 9) Based on the formula (a), the sputum 疋 疋 疋 土 土 土 土 土 , , , , , , , , , , , , , , , 322 322 322 322 322 322 322 322 322 322 44349 An alicyclic epoxy group such as an 8-(or 9) group is preferably an oxime group which is an epoxy group composed of two adjacent carbon atoms and an oxygen atom of the crosslinked carbocyclic ring.

(a) —具有月ϋ述脂環環氧基的(甲基)㊅稀酸酉旨⑴,可例 不如下述式(C-1)表示的化合物。具有縮水甘油基的(甲 基)丙烯酸西旨(ii),可例示如下述式(c—2)表示的化合 R3 0(a) - (meth) hexahydrate which has an alicyclic epoxy group, and the compound represented by the following formula (C-1). The (meth)acrylic acid having a glycidyl group (ii) can be exemplified by the compound represented by the following formula (c-2).

(C-1) 1 II „ —C—0—γ4 Μ-ϋ—0 —γ(C-1) 1 II „ —C—0—γ4 Μ-ϋ—0 —γ

(02) 上述式中,R3表示氳原子或甲基,γ4表示單鍵、碳數 1至10的伸烷基,或1至2個以上碳數1至1〇的伸烷基 與1至2個以上的氧原子(一〇—)結合之基,環Ζ2表示 脂環環氧基。至於γ4中碳數!至1〇之伸烷基,可舉例如 亞曱基、伸乙基、伸丙基、三亞曱基、四亞曱基、六亞曱 基等直鏈狀或分枝鏈狀的伸烷基。 至於Y4 ’尤其宜為單鍵、碳數1至6的伸烷基、碳數 1至6的伸燒氧基(氧原子在右端)、數個碳數1至6的伸 烷氧基(例如,大約2至2〇個)結合成的聚伸烷氧基(末 端氧原子在右端)。 322757 18 201144349 , 比式(c—i)表示的化合物更加具體之例,可舉出以 : 下的化合物。(02) In the above formula, R3 represents a halogen atom or a methyl group, γ4 represents a single bond, an alkylene group having 1 to 10 carbon atoms, or 1 to 2 alkylene groups having 1 to 1 carbon number and 1 to 2 More than one oxygen atom (monoterpene-) is bonded to the group, and ring Ζ2 represents an alicyclic epoxy group. As for the carbon number in γ4! The alkylene group may be a linear or branched alkyl group such as an anthracenylene group, an exoethyl group, a propyl group, a triadenylene group, a tetradecylene group or a hexamethylene group. As for Y4', it is particularly preferred to be a single bond, an alkylene group having 1 to 6 carbon atoms, an alkyloxy group having 1 to 6 carbon atoms (oxygen atom at the right end), and a plurality of alkylene groups having 1 to 6 carbon atoms (for example). , about 2 to 2 )) a polyalkylene group (the terminal oxygen atom is at the right end). 322757 18 201144349, a more specific example of the compound represented by the formula (c-i), and the following compounds can be mentioned.

上述式中,R3、Y4是與前述相同。 比具有縮水甘油基的(甲基)丙烯酸酯(ϋ)更加具 體之例,可舉出縮水甘油基(曱基)丙烯酸酯等。 本發明的硬化性組成物中分子内具有環氧基之(曱 基)丙烯酸酯(C)的比例,在相對於硬化性組成物整體 (或硬化性化合物之總量)時,例如為1至5〇重量%,宜 為5至40重量%,而以大約1〇至3〇重量%時較佳。當分 子内具有環氧基的(甲基)丙烯酸酯(c)之量在上述範 圍内時,可在維持陽離子硬化樹脂與自由基硬化樹脂的各 別硬化樹脂之優點下,藉由上述(C)成分的交聯劑作用, 而使硬化樹脂之耐熱性更為提高。 [其他成分] 本發明的硬化性組成物可在不損及硬化樹脂的光學 特性、物理特性之範圍下,含有上述(A)、(B)、(C)成 分以外的其它硬化性化合物(陽離子聚合性化合物、自由 基聚合性化合物等)。同時,本發明的硬化性組成物可依所 322757 19 201144349 , 使用之硬化性化合物的種類等而含有陽離子聚合起始劑、 , 硬化劑、硬化促進劑、自由基聚合起始劑、光增敏劑、各 種添加劑。 相對於本發明的硬化性組成物中硬化性化合物之總 量,前述(A )、( B )及(C )成分之總量的比例,例如是 60重量%以上,以80重量%以上為佳,而以90重量%以 上時更佳。同時,相對於本發明的硬化性組成物之總量, 前述(A )、( B )及(C )成分之總量的比例,例如是60 重量%以上,以80重量%以上為佳,而以90重量%以上 更佳。 陽離子聚合起始劑是一種起始劑(硬化觸媒;氧氣產 生劑),其是以加熱或光而放出可起始陽離子聚合的物質。 陽離子聚合起始劑,宜為熱陽離子聚合起始劑。相對於硬 化性組成物整體,陽離子聚合起始劑的調配量例如是0至 15重量%,宜為0.01至10重量%。藉由在此範圍内調配, 可得财熱性、透明性、耐候性等均良好的硬化物。 上述陽離子聚合起始劑,可列舉出芳基重氮鑌鹽[例 如,PP—33,旭電化工業(株)製]、芳基二碘鏽鹽、芳基 二硫鑌鹽[例如,FC—509,3M (株)製]、UVE1014[G.E. (株)製]、CP—66、CP—77[旭電化工業(株)製]、SI —60L、SI—80L、SI—100L、SI—110L[三新化學工業(株) 製]、芳烴(arene)離子錯鹽[例如,CG—24-61,CibaGeigy (株)製]。並且,也可使用鋁或鈦等金屬與乙醯醋酸酯或 二酮類的螯合化合物與矽醇或酚類之系列。螯合化合物有 20 322757 201144349 銘三乙醯丙酮酸醋、銘三乙酿醋酸乙s旨等。石夕醇或紛類可 列舉出三苯基矽醇或雙酚s等。 作為硬化劑係可使用酸酐。至於酸酐,雖然可使用一 般環氧化合物之硬化所使用的酸酐,但宜為常溫中是液狀 的酸酐,具體上可舉例如:甲基四氫酞酸酐、曱基六氫酞 酸酐、十二稀基琥珀酸酐、甲基末端亞曱基四氫醜酸酐等。 同時,在不致對本發明的硬化性組成物之含浸性有不良影 響的範圍内,可使用常溫中是固體的酸酐,例如酞酸針、 四氫酞酸酐、六氫酞酸酐、甲基環己烯二羧酸酐等。在使 用常溫中為固體的酸酐時,宜使其在常溫中溶解於液狀的 酸酐中,在常溫中作成液狀的混合物後使用。硬化劑的調 配量’雖然可因硬化性組成物中的陽離子硬化性化合物之 種類及量而異,但相對於硬化性組成物整體時,例如為〇 至60重量%,並以大約5至40重量%為佳。 在使用酸酐作為硬化劑時,硬化促進劑是具有促進硬 化反應的機能之化合物。硬化促進劑並無特別的限制,〇 要是一般所使用的硬化促進劑即可,可舉例如二氮雜二環 十一烯類硬化促進劑(1,8—二氮雜二環[5.4.0]十一烯 (DBU)或其鹽)、苯甲基二甲胺、2,4,6—三(二甲爲胺 基甲基)酚等三級胺、2—乙基一4—甲基咪唑、丨―氛茂乙 基一2—乙基一4一甲基咪唑等咪唑類、三苯基膦等有機膦 化合物、三級胺鹽、四級銨鹽、磷鑌鹽、辛酸錫、辛醆 等金屬鹽等。在此等化合物之中,以二氮雜二環十一^鋅 硬化促進劑為佳。相對於硬化性組成物整體,硬化促進劑 322757 21 201144349 之調配量例如是〇至5重量%,以大約〇 〇5至3重量%為 佳。如調配量太少時,可能有硬化促進效果不足的情形, 如其量過多時,則可能使硬化物的色相惡化。 自由基聚合基起始劑(自由基產生劑),可使用作為 光或熱自由基聚合基起始劑之已知常用的起始劑。至於光 自由基聚合基起始劑的代表例,可舉出安息香、安息香曱 醚、安息香乙醚、安息香異丙醚等安息香•安息香烷醚類; 笨乙酮、2,2 —二曱氧基一2 —苯基苯乙酮、2,2_二乙氧基 —2—苯基苯乙酮、—二氯苯乙酮、2 —曱基—丨―^ — (曱基硫基)苯基]—2—嗎福林基—丙烷—!—酮、2一苯 甲基一2—二甲基胺基_ι_(4_嗎福林基苯基)_ 丁烷— 1 —酮等苯乙酮類;2—曱基蒽醌、2_乙基蒽醌、2—第三 丁基蒽醌、1 —氯蒽醌、2—戊基蒽醌等蒽醌類;2,4_二甲 基噻噸酮、2,4—二乙基噻噸酮、2 —氯噻噸酮、2,4_異丙 基噻噸酮等噻噸酮類;苯乙酮二曱基縮酮、苯曱基二甲基 縮酮等縮酮類;二苯甲酮等二苯甲酮類;氧雜蒽酮類;I? —雙(9-吖啶基)庚烷等。 熱自由基聚合性起始劑之例,可列舉出如二酿基過氧 化物類、過氧二碳酸酯類、烷基過酯類、二烷基過氧化物 類、過縮酮類、酮過.氧化物類及烷基氫過氧化物的形態之 有機過氧化物等。至於此等熱聚合起始劑之具體例,可列 舉出·二苯甲醯基過氧化物、過苯甲酸第三丁酯及偶氮二 異丁腈等。 自由基聚合起始劑的市售品中,例如光自由基聚合起 22 322757 201144349 始劑可列舉如:購自Ciba公司的Irgacure (註冊商標)184 (1 —經基環己基苯基嗣)、Irgacure (註冊商標)5〇〇 ( 1 —經基環己基苯基_、二苯曱酮)及Irgacure (註冊商標) 型的其他光聚合起始劑;Darocur (註冊商標)1173、1116、 1398、1174及1〇2〇 (可購自Merck公司)等。 自由基聚合起始劑的調配量,可依硬化性組成物中的 自由基聚合性化合物之種類及量而異,惟相對於硬化性組 成物整體’例如大約為0.1至20重量%。 光增敏劑宜與光聚合起始劑組合後使用。光增敏劑, 可利用已知常用的光增敏劑。可舉例如N,N—二曱基胺基 苯甲酸乙酯、N,N_二甲基胺基苯甲酸異戊酯、戊基_4_ 二曱基胺基笨甲酸S旨、三乙胺、三乙醇胺等三級胺類等。 可=用此等光増敏劑的丨種或2種以上之組合。光增敏劑 的含量,並無特別的限定,惟相對於硬化性組成物整體, 例如大約為0.1至5重量%。 至於可添加在本發明的硬化性組成物中之添加劑,可 舉例如·有機石夕氧烧化合物、金屬氧化物粒子、橡膠粒子、 矽鲖類或氟類消泡劑、矽烷耦合劑、充填劑、塑化劑、流 =4丨、抗靜電劑、脫模劑、難燃劑、著色劑、抗氧化劑、 紫外線吸收劑、離子吸附體、顏料等。相對於硬化性組成 物整體,此等各種添加劑的調配量例如為5重量%以下。 發明的硬化性組成物雖可含有溶劑,但因其量過多時可 =在硬化樹脂中產生氣泡,故相對於硬化性組成物整體, 宜為10重量%以下,尤其宜為1重量%以下。 23 322757 201144349 1 本發明的硬化性組成物在調配例如上述(A)、(B)及 5 (C)成分、以及配合需求而加入的陽離子聚合起始劑、 硬化劑、硬化促進劑、自由基聚合起始劑、光增敏劑、各 種添加劑等後,配合要求於真空下一邊排除氣泡,一邊攪 拌、混合後而調製成。攪拌、混合時的溫度例如大約為10 至60°c。在攪拌、混合中,可使用周知的設備,例如自轉 公轉型攪拌機、單軸或多軸擠壓機、行星式攪拌機 (planetary mixer)、捏合機、溶解器(dissolver)等。 應用本發明的硬化性組成物,即可得光學特性、物理 特性倶優的硬化樹脂。所得的硬化樹脂之透光率(400nm) 例如為80%以上(並以85%以上為佳)、内部透過率 (400nm)例如為85%以上(並以90%以上為佳)、折射 率(589nm)例如為1.45以上(並以1.50以上為佳)、阿 貝數例如為45以上(並以50以上為佳),可作成具有高的 透明性及解析度的優異光學特性之硬化樹脂。同時,吸水 率例如為2重量%以下(並以1重量%以下為佳)、玻璃轉 移溫度例如為100°C以上(並以12(TC以上為佳)、線膨脹 係數例如為120ppm/K以下(並以100ppm/K以下為 佳)、硬化收縮率例如為10%以下(並以8%以下為佳), 即使就成形性或耐濕性之觀點而言,也是優異的硬化樹 脂。同時,即使將此硬化樹脂置於高溫條件下(例如大約 260°C ),其透光率、折射率、Abbe數幾乎不變,形狀也不 變化。 本發明的陽離子硬化性組成物’即使在經硬化的高溫 24 322757 201144349 下也可得光學特性或物理特性不易變化的硬化樹脂,故尤 其可適用於光學用途(光學材料用途)、光學裝置用途、顯 示器用途、電氣電子元件材料用途等。 鏡片的折射率因光之波長而異,而發生像上形成偏移 (滲透或模糊)的現象(色差:Chromatic aberration)。為 了減少此色差的影響,一般鏡片是將高阿貝數的鏡片樹脂 與低阿貝數的鏡片樹脂組合,而形成可修正色差的結構。 相機中所使用鏡片的玻璃,可依阿貝數而分成2種玻璃, 一般是將阿貝數50以下的玻璃稱為燧石玻璃(flint glass ),將50以上的玻璃稱為冕牌玻璃(crown glass )。由 本發明的硬化性組成物而得的硬化樹脂,可適用作為高阿 貝數的鏡片用樹脂。 本發明的硬化物可藉由將上述硬化性組成物進行硬 化而得。至於硬化的方法’可配合硬化性組成物中的硬化 性化合物之種類等,而在周知的硬化法中選擇適當的方 法。例如,將上述硬化性組成物放入適合硬化物形狀的模 具中,照射活性能量線(例如,紫外線)使其硬化,再加 熱後即可得目的物的硬化物。同時,也可僅以加熱而得目 的物的硬化物。而且,在使用紫外線作為活性能量線時, 其照射量例如大約是1,〇〇〇至4,000mJ/cm2。同時,加熱 溫度可依硬化性化合物之種類而異,惟例如為8〇至2〇〇 C,以大約110至160。(:時為佳。而且,亦可將硬化物從 模具中取出之後進行後硬化(postcure )(烘烤)。 如前述,由於本發明的硬化物即使在大約26〇t>c的高 322757 25 201144349 ,溫下,也不會使其光學特性或物理特性變化,故可適用作 為光學構件。至於光學構件,例如可舉出:相機(車用相 機、數位相機、PC用相機、手機用相機、監視器相機等) 的照相用鏡片、眼鏡鏡片、濾光片、繞射光柵、棱鏡、導 光板(lightguide)、光束集光鏡片、光擴散用鏡片、顯示器 用遮罩玻璃、感光器、光開關、led、發光元件、光波導、 光分割器、光纖接著劑、顯示元件用基板、彩色濾光片用 基板、觸控面板用基板、顯示器保護膜、顯示器背光、導 光板、抗反射膜等。 [實施例] 以下,依照實施例及比較例以更詳細說明本發明,但 本發明並不侷限於該等實施例的範圍。 (實施例1 ) 將環氧化合物[2,2—雙(羥基甲基)—1—丁醇的 一環氧基一4— (2—環氧乙烷基)環己烷加成物(包含在前 述式(A—2)表示的化合物中;Daicel化學工業社製,商 品名「=PE3150」)]30重量份、(甲基)丙稀酸醋[三環 [5.2.1.02,6]癸烷二曱醇二丙烯酸酯(包含在前述式〇 表不的化合物中;Daicel Cytec社製,商品名r IRR2 j 4K」)]5〇 重1份、具有環氧基的(甲基)丙烯酸酯[環氧化的二環戊 烯基丙烯酸酯(=3,4—環氧基三環[5.21 〇2,6]癸烷_8—基 丙稀酸酉旨及3,4-環氧基三環[mp6]癸燒基丙二 酸酉旨(包含在前述式(C-D表示的化合物中;Daicd化學 工業社製,商品名「E-DCPA」))20重量份、氧氣產生 322757 26 201144349 ,劑(芳基硫鏽鹽類氧氣產生劑;San-apro杜製,商品名「cpi ,—100P」)1重量份、自由基產生劑(苯乙酮類自由基產生 劑;CibaGeigy公司製,商品名「Irgacurel84」)i重量份 的比例進行調配後,以自轉公轉型攪拌器攪拌混合後,^ 得均勻且透明的硬化性組成物(光學材料組成液)。接著, 將所得的光學材料組成液澆注至玻璃製模中,該模已預先 塗布脫模劑後蒸鍍成〇.5mm的厚度。 接著,使澆注後的光學材料組成液照射紫外線(照射 量.2,600mJ/cm2),製作成硬化樹脂後,在大氣環境下, 再將製作成的硬化物以160 C進行加熱1小時後,可得均 勻且透明之厚度0.5mm的板狀硬化樹脂。此硬化樹脂可輕 易地從玻璃模中脫離。將所得的硬化樹脂提供後述的評估。 (實施例2) 除了使用縮水甘油曱基丙烯酸酯作為具有環氧基的 (曱基)丙烯酸酯之外’其餘進行與實施例1相同的操作, 可得硬化樹脂。 (比較例1) 除了硬化性化合物係使用環氧化合物[2,2—雙(羥基 甲基)一1一丁醇的1,2—環氧基一 4— (2 —環氧乙烷基) 環己烷加成物(包含在前述式(A —2)表示的化合物中; Daicel化學工業社製,商品名「EHPE3150」)]30重量份、 (甲基)丙烯酸酯[三環[5.2.1.02,6]癸烷二甲醇二丙烯酸酯 (包含在前述式(B—1)表示的化合物中;DaicelCytec杜 製,商品名「IRR214K」)]70重量份,且不調配具有環氧 27 322757 201144349 , 基的(曱基)丙烯酸酯之外,其餘進行與實施例1相同的 操作,可得硬化樹脂。 在以下的方法及條件下,進行實施例及比較例中所得 硬化樹脂的諸特性、耐熱試驗(回流焊條件下的耐黃變性 評估)。結果如表1中所示。 表1 實施例1 實施例2 比較例1 樹脂表面有無痕紋 無 無 無 内部透過率(400nm) (%) 98.3 98.6 97.6 而十熱5式驗月IJ 的硬化樹脂 折射率(589nm) 1.5245 1.5212 1.5292 阿貝數 53.9 54.0 51.4 吸水率(%) 1.1 1.4 1.1 玻璃轉移溫度(°C) 122 123 105 線膨張係數(ppm/K) 97 104 97 彈性率(GPa) 2.9 2.8 3.1 财熱試驗後 的硬化樹脂 内部透過率(400nm) (%) 87.0 91.9 82.8 黃變率(%) 11.5 6.8 15.1 (1)樹脂表面的形狀 以目視檢測硬化樹脂的表面有無痕紋(striae)。同時, 條紋表示光學性不均質的狀態,是指硬化樹脂表面觀測到 的皺紋、起伏。 28 322757 201144349 (2 )内部透過率 硬化樹脂的内部透過率,可以下述式計算出。 内部透過率(400nm) =400nm中的透光率/(1 一 r)2 r={ (η—1) / (n+i) }2 n是400nm中的折射率。400nin中的透光率是使用分 光光度計(曰立High Technologies社製,商品名「U — 3900」)測定’折射率是使用以下述(3 )的方法測定4〇〇nm 中的折射率之值。 (3) 折射率 硬化樹脂的折射率,是以遵照jIS K7142之方法,使 用折射率計(Metricon公司製,商品名「Model 2010」)測 定25 C時589nm的折射率。 (4) 線膨脹係數In the above formula, R3 and Y4 are the same as described above. More specific examples of the (meth) acrylate having a glycidyl group include glycidyl (mercapto) acrylate and the like. The ratio of the (fluorenyl) acrylate (C) having an epoxy group in the molecule in the curable composition of the present invention is, for example, 1 to 1 with respect to the entire curable composition (or the total amount of the curable compound). 5 % by weight, preferably 5 to 40% by weight, and preferably about 1 to 3 % by weight. When the amount of the (meth) acrylate (c) having an epoxy group in the molecule is within the above range, it is possible to maintain the advantages of the respective hardening resins of the cationic hardening resin and the radical hardening resin by the above (C The crosslinking agent of the component acts to improve the heat resistance of the hardening resin. [Other components] The curable composition of the present invention may contain other curable compounds (cations other than the above components (A), (B), and (C) without impairing the optical properties and physical properties of the cured resin. A polymerizable compound, a radically polymerizable compound, or the like). Meanwhile, the curable composition of the present invention may contain a cationic polymerization initiator, a hardener, a hardening accelerator, a radical polymerization initiator, and photosensitization according to the type of the curable compound used in 322757 19 201144349, and the like. Agents, various additives. The ratio of the total amount of the components (A), (B), and (C) to the total amount of the curable compound in the curable composition of the present invention is, for example, 60% by weight or more, preferably 80% by weight or more. More preferably, it is 90% by weight or more. Meanwhile, the ratio of the total amount of the components (A), (B), and (C) to the total amount of the curable composition of the present invention is, for example, 60% by weight or more, preferably 80% by weight or more. More preferably, it is 90% by weight or more. The cationic polymerization initiator is an initiator (hardening catalyst; oxygen generator) which is a substance which initiates cationic polymerization by heating or light. The cationic polymerization initiator is preferably a thermal cationic polymerization initiator. The compounding amount of the cationic polymerization initiator is, for example, from 0 to 15% by weight, preferably from 0.01 to 10% by weight, based on the whole of the hardening composition. By blending in this range, a cured product having good heat, transparency, weather resistance, and the like can be obtained. Examples of the above cationic polymerization initiator include an aryldiazonium salt [for example, PP-33, manufactured by Asahi Kasei Kogyo Co., Ltd.], an aryldiiodide salt, an aryldithizone salt [for example, FC- 509, 3M company, UVE1014 [GE], CP-66, CP-77 [made by Asahi Kasei Kogyo Co., Ltd.], SI-60L, SI-80L, SI-100L, SI-110L [Sanshin Chemical Industry Co., Ltd.], an aromatic hydrocarbon (arene) ion-missing salt [for example, CG-24-61, manufactured by Ciba Geigy Co., Ltd.]. Further, a series of a metal such as aluminum or titanium, a chelate compound of acetamidine acetate or a diketone, and a sterol or a phenol may be used. Chelating compounds have 20 322757 201144349 Ming San Yi 醯 醯 醯 、 铭 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 Examples of the triterpene alcohol or bisphenol s. An acid anhydride can be used as the hardener. As the acid anhydride, an acid anhydride used for curing a general epoxy compound can be used, but it is preferably an acid anhydride which is liquid at normal temperature, and specific examples thereof include methyltetrahydrophthalic anhydride, mercaptohexahydrophthalic anhydride, and twelve. Dilute succinic anhydride, methyl terminal mercaptotetrahydrouric anhydride, and the like. Meanwhile, in the range which does not adversely affect the impregnation property of the hardenable composition of the present invention, an acid anhydride which is solid at normal temperature, for example, a citric acid needle, a tetrahydrophthalic anhydride, a hexahydrophthalic anhydride, or a methylcyclohexene can be used. Dicarboxylic anhydride and the like. When an acid anhydride which is solid at normal temperature is used, it is preferably dissolved in a liquid acid anhydride at normal temperature, and used as a liquid mixture at normal temperature. The amount of the curing agent to be added may vary depending on the type and amount of the cationically curable compound in the curable composition, but is, for example, from 〇 to 60% by weight and from about 5 to 40 with respect to the entire curable composition. The weight % is preferred. When an acid anhydride is used as the hardener, the hardening accelerator is a compound having a function of promoting the hardening reaction. The hardening accelerator is not particularly limited, and may be a hardening accelerator generally used, and for example, a diazabicycloundecene hardening accelerator (1,8-diazabicyclo[5.4.0] Tertiary (DBU) or its salt), benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, tertiary amine, 2-ethyl-4-methyl Imidazoles such as imidazole, anthracene, ethyl 2-ethyl- 4-methylimidazole, organic phosphine compounds such as triphenylphosphine, tertiary amine salts, quaternary ammonium salts, phosphonium salts, tin octoate, octyl金属 and other metal salts. Among these compounds, a diazabicyclo-l-zinc hardening accelerator is preferred. The compounding amount of the hardening accelerator 322757 21 201144349 is, for example, 〇 to 5% by weight, preferably about 5% to 3% by weight, based on the entire curable composition. If the amount of the formulation is too small, there may be a case where the hardening promoting effect is insufficient, and if the amount is too large, the hue of the hardened material may be deteriorated. As the radical polymerizable initiator (free radical generator), a known conventional initiator as a photoradical or thermal radical polymerization initiator can be used. As representative examples of the photoradical polymerization-based initiator, benzoin, benzoin ethers such as benzoin, benzoin ether, benzoin ethyl ether, and benzoin isopropyl ether; acetophenone, 2,2-dioxyl group 2-phenylacetophenone, 2,2-diethoxy-2-phenylacetophenone, dichloroacetophenone, 2-mercapto-purine-^-(fluorenylthio)phenyl] —2-—Folinin—propane—! - ketone, 2-benzylidene-2-dimethylammonium_ι_(4_morphinylphenyl)-butane-1-ketone and other acetophenones; 2-mercaptopurine, 2_ Ethyl hydrazine, 2-t-butyl hydrazine, 1-chloroindole, 2-pentyl hydrazine and the like; 2,4-dimethyl thioxanthone, 2,4-diethyl thiophene Thioxanone such as ketone, 2-chlorothioxanthone, 2,4-isopropylthioxanthone, ketal such as acetophenone didecyl ketal and benzoyl dimethyl ketal; diphenyl Benzophenones such as ketones; xanthone; I?-bis(9-acridinyl)heptane. Examples of the thermal radical polymerizable initiator include, for example, disturbate peroxides, peroxydicarbonates, alkyl peresters, dialkyl peroxides, peracetones, and ketones. An organic peroxide in the form of an oxide or an alkyl hydroperoxide. Specific examples of such thermal polymerization initiators include benzoyl peroxide, butyl perbenzoate, and azobisisobutyronitrile. In a commercial product of a radical polymerization initiator, for example, photoradical polymerization is 22 322757 201144349. For example, Irgacure (registered trademark) 184 (1 - cyclyl phenyl hydrazine), Irgacure, available from Ciba Corporation (registered trademark) 5〇〇( 1 —ylcyclohexylphenyl-, dibenzophenone) and other photopolymerization initiators of Irgacure (registered trademark) type; Darocur (registered trademark) 1173, 1116, 1398, 1174 And 1〇2〇 (available from Merck) and so on. The amount of the radical polymerization initiator to be added may vary depending on the kind and amount of the radical polymerizable compound in the curable composition, but is, for example, about 0.1 to 20% by weight based on the total amount of the curable composition. The photosensitizer is preferably used in combination with a photopolymerization initiator. As the photosensitizer, a conventionally known photo sensitizer can be used. For example, ethyl N,N-didecylaminobenzoate, isoamyl N,N-dimethylaminobenzoate, pentyl-4-didecylaminobenzoic acid, triethylamine, A tertiary amine such as triethanolamine. It is possible to use such a sensitizer or a combination of two or more kinds thereof. The content of the photosensitizer is not particularly limited, but is, for example, about 0.1 to 5% by weight based on the entire curable composition. As the additive which can be added to the curable composition of the present invention, for example, an organic cerium oxide compound, metal oxide particles, rubber particles, an anthraquinone or a fluorine-based antifoaming agent, a decane coupling agent, and a filler can be mentioned. , plasticizer, flow = 4 丨, antistatic agent, mold release agent, flame retardant, colorant, antioxidant, ultraviolet absorber, ion adsorbent, pigment, etc. The blending amount of these various additives is, for example, 5% by weight or less based on the entire curable composition. The curable composition of the present invention may contain a solvent. However, when the amount is too large, bubbles may be formed in the cured resin. Therefore, the curable composition is preferably 10% by weight or less, and particularly preferably 1% by weight or less based on the total amount of the curable composition. 23 322757 201144349 1 The curable composition of the present invention is prepared by blending, for example, the above (A), (B) and 5 (C) components, and a cationic polymerization initiator, a hardener, a hardening accelerator, and a radical. After the polymerization initiator, the photosensitizer, various additives, and the like, the mixture is stirred and mixed under vacuum to remove the bubbles, and then prepared. The temperature at the time of stirring and mixing is, for example, about 10 to 60 ° C. In stirring and mixing, well-known equipment such as a self-rotating mixer, a single-shaft or multi-axis extruder, a planetary mixer, a kneader, a dissolver, or the like can be used. By using the curable composition of the present invention, a cured resin having excellent optical properties and physical properties can be obtained. The light transmittance (400 nm) of the obtained cured resin is, for example, 80% or more (more preferably 85% or more), and the internal transmittance (400 nm) is, for example, 85% or more (and preferably 90% or more), and refractive index ( 589 nm) is, for example, 1.45 or more (and preferably 1.50 or more), and an Abbe number of 45 or more (and preferably 50 or more), and can be used as a cured resin having excellent optical properties of high transparency and resolution. Meanwhile, the water absorption rate is, for example, 2% by weight or less (and preferably 1% by weight or less), and the glass transition temperature is, for example, 100° C. or higher (and preferably 12 (TC or more), and the linear expansion coefficient is, for example, 120 ppm/K or less). (it is preferably 100 ppm/K or less), and the curing shrinkage ratio is, for example, 10% or less (and preferably 8% or less), and is excellent in curing properties from the viewpoint of moldability and moisture resistance. Even if the hardening resin is placed under a high temperature condition (for example, about 260 ° C), the light transmittance, the refractive index, and the Abbe number are hardly changed, and the shape does not change. The cationic hardening composition of the present invention is hardened even if it is hardened. The high temperature 24 322757 201144349 can also be obtained with hardened resins whose optical properties or physical properties are not easily changed, so it is especially suitable for optical applications (optical materials), optical devices, display applications, electrical and electronic components, etc. The rate varies depending on the wavelength of the light, and a phenomenon of aberration (permeation or blurring) occurs on the image. Chromatic aberration is used to reduce the influence of the chromatic aberration. It is a combination of a high Abbe number lens resin and a low Abbe number lens resin to form a structure that corrects chromatic aberration. The glass of the lens used in the camera can be divided into two types of glass according to the Abbe number, generally The glass having a shell number of 50 or less is called flint glass, and the glass of 50 or more is called crown glass. The hardened resin obtained from the curable composition of the present invention can be applied as a high Abbe number. The cured resin of the present invention can be obtained by curing the curable composition. The method of curing can be combined with the type of the curable compound in the curable composition, and the like. For example, the curable composition is placed in a mold suitable for the shape of the cured product, and is irradiated with an active energy ray (for example, ultraviolet ray) to be hardened, and then heated to obtain a cured product of the object. It is also possible to obtain a cured product of the object by heating only. Moreover, when ultraviolet rays are used as the active energy ray, the irradiation amount is, for example, about 1, 〇〇〇 to 4,000 mJ/cm 2 . Meanwhile, the heating temperature may vary depending on the kind of the hardening compound, but is, for example, 8 Torr to 2 Torr C, and is preferably about 110 to 160. (: It is preferable. Further, the cured product may be taken out from the mold. Postcure (baking). As described above, since the cured product of the present invention does not change its optical characteristics or physical properties even at a temperature of about 322757 25 201144349, which is about 26 〇t>c, it can be changed. Applicable as an optical member. As the optical member, for example, a photographic lens, a spectacle lens, a filter, and a diffraction of a camera (a camera for a car, a digital camera, a camera for a PC, a camera for a mobile phone, a monitor camera, etc.) can be cited. Grating, prism, light guide, beam collecting lens, light diffusing lens, mask glass for display, photoreceptor, optical switch, led, light emitting element, optical waveguide, optical splitter, optical fiber adhesive, display element The substrate, the color filter substrate, the touch panel substrate, the display protective film, the display backlight, the light guide plate, the anti-reflection film, and the like. [Examples] Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited to the scope of the Examples. (Example 1) an epoxy-[2,2-bis(hydroxymethyl)-1-butanol monoepoxy-4-(2-oxiranyl)cyclohexane adduct (including In the compound represented by the above formula (A-2); manufactured by Daicel Chemical Industry Co., Ltd., trade name "=PE3150")] 30 parts by weight, (meth)acrylic acid vinegar [tricyclic [5.2.1.02,6]癸Alkyl decyl alcohol diacrylate (included in the compound of the above formula; manufactured by Daicel Cytec Co., Ltd., trade name r IRR2 j 4K)] 5 parts by weight, (meth) acrylate having an epoxy group [Epoxidized dicyclopentenyl acrylate (=3,4-epoxytricyclo[5.21 〇2,6]decane-8-acrylic acid and 3,4-epoxytricyclic [mp6] anthracyl malonate (containing 20 parts by weight of the above formula (a compound represented by CD; manufactured by Daicd Chemical Industry Co., Ltd., trade name "E-DCPA"), and oxygen generation 322757 26 201144349, an agent ( Aryl sulfide salt-based oxygen generator; San-apro DuPont, trade name "cpi, -100P") 1 part by weight, a radical generator (acetophenone radical generator; manufactured by Ciba Geigy Co., Ltd., trade name " Irgacurel 84") The ratio of the parts by weight of i is mixed, and after mixing and mixing with a self-rotating public-type agitator, a uniform and transparent curable composition (optical material composition liquid) is obtained. Next, the obtained optical material composition liquid is poured to In the glass mold, the mold is preliminarily coated with a release agent and then vapor-deposited to a thickness of 〇5 mm. Next, the optical material composition after casting is irradiated with ultraviolet rays (irradiation amount: 2,600 mJ/cm 2 ) to prepare a cured resin. In the atmosphere, the cured product was heated at 160 C for 1 hour to obtain a uniform and transparent plate-shaped cured resin having a thickness of 0.5 mm. This hardened resin can be easily detached from the glass mold. The obtained hardened resin provides the evaluation described later. (Example 2) The same operation as in Example 1 was carried out except that glycidyl methacrylate was used as the (fluorenyl) acrylate having an epoxy group, and hardening was obtained. Resin. (Comparative Example 1) In addition to the curable compound, 1,2-epoxy 4-(2-oxirane) of the epoxy compound [2,2-bis(hydroxymethyl)-1-butanol was used. Base) cyclohexane plus The product (included in the compound represented by the above formula (A-2); manufactured by Daicel Chemical Industry Co., Ltd., trade name "EHPE3150")] 30 parts by weight, (meth) acrylate [tricyclic [5.2.1.02, 6] Decane dimethanol diacrylate (comprised in the compound represented by the above formula (B-1); DaicelCytec Dufa, trade name "IRR214K")] 70 parts by weight, and not formulated with epoxy 27 322757 201144349, A hardening resin was obtained in the same manner as in Example 1 except for the fluorenyl) acrylate. The properties of the cured resin obtained in the examples and the comparative examples and the heat resistance test (evaluation of yellowing resistance under reflow conditions) were carried out under the following methods and conditions. The results are shown in Table 1. Table 1 Example 1 Example 2 Comparative Example 1 Resin surface with or without traces No internal transmittance (400 nm) (%) 98.3 98.6 97.6 and ten heat 5 type test IJ hardened resin refractive index (589 nm) 1.5245 1.5212 1.5292 Abbe number 53.9 54.0 51.4 Water absorption (%) 1.1 1.4 1.1 Glass transition temperature (°C) 122 123 105 Linear expansion coefficient (ppm/K) 97 104 97 Elasticity (GPa) 2.9 2.8 3.1 Hardened resin after the heat test Internal transmittance (400 nm) (%) 87.0 91.9 82.8 Yellowing rate (%) 11.5 6.8 15.1 (1) Shape of resin surface The surface of the cured resin was visually inspected for streace. Meanwhile, the streaks indicate optically inhomogeneous states, and refer to wrinkles and undulations observed on the surface of the cured resin. 28 322757 201144349 (2) Internal transmittance The internal transmittance of the hardened resin can be calculated by the following formula. Internal transmittance (400 nm) = transmittance in 400 nm / (1 - r) 2 r = { (η - 1) / (n + i) } 2 n is a refractive index in 400 nm. The light transmittance in 400 nin is measured by using a spectrophotometer (trade name "U-3900", manufactured by High Technology Co., Ltd.). The refractive index is measured by using the method of the following (3) to measure the refractive index at 4 〇〇 nm. value. (3) Refractive index The refractive index of the cured resin is a refractive index of 589 nm at 25 C measured by a refractometer (manufactured by Metricon Co., Ltd., "Model 2010") in accordance with the method of JIS K7142. (4) Linear expansion coefficient

硬化樹脂的線膨脹係數,是使用TMA測定設備(SIIThe linear expansion coefficient of the hardened resin is the use of TMA measuring equipment (SII

Nanotechnology公司製,商品名「tmA/SS100」),以昇 溫速度5°C/分鐘、測定溫度範圍30°C至25(TC,測定熱 膨脹率後’將低溫部份的直線坡度表示線膨脹係數。 (5) 吸水率 硬化樹脂的吸水率,是以遵照JIS K7209的方法測定。 (6) 彈性率 硬化樹脂的彈性率,是使用固體黏彈性測定裝置(TA Instrument公司製,商品名rRSAni」),以昇溫速度5°c/ 分鐘、測定溫度範圍—扣艽至270°C,測定動態黏彈性特 性後,讀取25°C時的彈性率。 29 322757 201144349 , (7)玻璃轉移溫度 ; 硬化樹脂的玻璃轉移溫度,是使用示差掃描熱量測定 裝置(TA Instrument公司製,商品名「Q2000」),經事先 處理(以昇溫速度20°C/分鐘,從一50°C加熱至250°C, 並以冷卻速度20°C/分鐘,從250°C冷卻至一50°C )之後, 以昇溫速度20°C/分鐘、在測定溫度範圍一50°C至250°C 中進行測定。 (8) 阿貝數 硬化樹脂的阿貝數是以下述式計算。 阿貝數=(nd — 1 ) / ( nF + nc ) 式中,nd是表示589.2nm中的折射率,nF是表示 486.1 nm中的折射率,nc是表示656.3nm中的折射率。同 時,折射率是使用以上述(3)的方法所測定各別波長中的 折射率之值。 (9) 耐熱性試驗(回焊條件下的耐黃變性評估) 於大氣環境下,使硬化樹脂在預先已加熱至270°C的 爐中連續進行3次維持1分鐘的耐熱試驗,然後測定已供 而才熱試驗的硬化樹脂之400nm中的透過率及400nm中的折 射率後,計算出内部透過率。 將以下述式算出的内部透過率之減少率作為黃變 率,評估回焊條件下的耐黃變性。The product name "tmA/SS100" manufactured by Nanotechnology Co., Ltd., at a temperature increase rate of 5 ° C / min, and a measurement temperature range of 30 ° C to 25 (TC, after measuring the coefficient of thermal expansion, 'the linear slope of the low temperature portion indicates the coefficient of linear expansion. (5) The water absorption rate of the water-absorbent-hardening resin is measured by the method according to JIS K7209. (6) The elastic modulus of the elastic modulus-hardening resin is a solid viscoelasticity measuring device (trade name: rRSAni, manufactured by TA Instrument Co., Ltd.). The temperature is 25 ° C / min, the temperature range is measured - 艽 艽 to 270 ° C, and the dynamic viscoelastic properties are measured, and the elastic modulus at 25 ° C is read. 29 322757 201144349 , (7) Glass transition temperature; Hardened resin The glass transition temperature is measured by a differential scanning calorimeter (manufactured by TA Instrument Co., Ltd., trade name "Q2000"), and heated at a temperature increase rate of 20 ° C / min from 50 ° C to 250 ° C, and After cooling at 250 ° C to 50 ° C at a cooling rate of 20 ° C / min, the measurement was carried out at a temperature increase rate of 20 ° C / min in the measurement temperature range of 50 ° C to 250 ° C. (8) The Abbe number of the Abbe number hardening resin is Calculated by the following formula: Abbe number = (nd - 1 ) / ( nF + nc ) where nd is the refractive index in 589.2 nm, nF is the refractive index in 486.1 nm, and nc is in the 656.3 nm At the same time, the refractive index is the value of the refractive index at each wavelength measured by the method of the above (3). (9) Heat resistance test (evaluation of yellowing resistance under reflow conditions) Under atmospheric conditions, The hardened resin was continuously subjected to a heat resistance test for 3 minutes in an oven heated to 270 ° C in advance, and then the transmittance in 400 nm of the cured resin which was supplied for thermal test and the refractive index in 400 nm were measured. The internal transmittance was calculated. The reduction rate of the internal transmittance calculated by the following formula was used as the yellowing rate, and the yellowing resistance under the reflow condition was evaluated.

内部透過率之減少率(%) = (耐熱試驗前之内部透 過率一耐熱試驗後之内部透過率)/(耐熱試驗前之内部 透過率)xlOO 30 322757 201144349 使用具有脂環的環氧化合物、具有脂環的(曱基)丙 烯酸酯與具有環氧基的(曱基)丙烯酸酯化合物之實施例 1、2的硬化性組成物,在與不使用具有環氧基的(曱基) 丙稀酸g旨化合物之比較例1的硬化性組成物比較後,前者 可得玻璃轉移溫度極高的硬化樹脂,耐熱試驗後也可得維 持較高的透光率等之财熱性高之硬化樹脂。因此,由使用 具有脂環的環氧化合物、具有脂環的(曱基)丙烯酸酯與 具有環氧基的(甲基)丙烯酸酯化合物之硬化性組成物而 付的硬化樹脂’因耐熱性面且具有南透明性’故可適用於 鏡頭單元(lens unit)等光學用途或光學元件用途等各式 各樣的用途上。 【圖式簡單說明】 無。 【主要元件符號說明】 無0 31 322757Reduction rate of internal transmittance (%) = (internal transmittance before heat resistance test - internal transmittance after heat resistance test) / (internal transmittance before heat resistance test) xlOO 30 322757 201144349 Using an epoxy compound having an alicyclic ring, The curable composition of Examples 1 and 2 having an alicyclic (fluorenyl) acrylate and a (fluorenyl) acrylate compound having an epoxy group, and without using an epoxy group-containing (fluorenyl) propylene When the curable composition of Comparative Example 1 of the acid-based compound was compared, the former obtained a cured resin having an extremely high glass transition temperature, and a cured resin having a high heat transmittance such as a high light transmittance after the heat resistance test was obtained. Therefore, a hardened resin which is made of a hardening composition using an epoxy compound having an alicyclic ring, a (fluorenyl) acrylate having an alicyclic ring, and a (meth) acrylate compound having an epoxy group is formed by a heat-resistant surface. Moreover, it has a south transparency. Therefore, it can be applied to various applications such as optical applications such as lens units and optical component applications. [Simple description of the diagram] None. [Main component symbol description] None 0 31 322757

Claims (1)

201144349 七、申請專利範圍: 1. 一種硬化性組成物,其特徵是:包含分子内具有脂環的 環氧化合物(A)、分子内具有脂環的(曱基)丙烯酸 酯(B)與分子内具有環氧基的(曱基)丙烯酸酯(C)。 2. 如申請專利範圍第1項所述之硬化性組成物,其中分子 内具有環氧基的(甲基)丙烯酸酯(C),為選自具有脂 環環氧基之(甲基)丙烯酸酯及具有縮水甘油基之(甲 基)丙烯酸酯中的至少一種化合物。 3. 如申請專利範圍第1或2項所述之硬化性組成物,其中 分子内具有脂環的環氧化合物(A),為選自具有脂環 環氧基之環氧化合物、環氧基直接以單鍵鍵結脂環的環 氧化合物,及具有脂環與縮水甘油醚基的環氧化合物之 中的至少一種環氧化合物。 4. 如申請專利範圍第1至3項中任一項所述之硬化性組成 物,其中分子内具有脂環的(甲基)丙烯酸酯(B),為 分子内具有脂環的多官能之(曱基)丙稀酸酯。 5. —種硬化樹脂,其是使申請專利範圍第1至4項中任一 項所述之硬化性組成物硬化而得者。 6. —種光學構件,其是由申請專利範圍第5項所述之硬化 樹脂而成者。 322757 201144349 . 四、指定代表圖:本案無圖式。 ; (一)本案指定代表圖為:無。 (二)本代表圖之元件符號簡單說明:無。 五、本案若有化學式時,請揭示最能顯示發明特徵的化學式:201144349 VII. Patent application scope: 1. A curable composition characterized by comprising an epoxy compound (A) having an alicyclic ring in the molecule, and a (fluorenyl) acrylate (B) having an alicyclic ring and a molecule. (Mercapto) acrylate (C) having an epoxy group. 2. The curable composition according to claim 1, wherein the (meth) acrylate (C) having an epoxy group in the molecule is selected from (meth)acrylic acid having an alicyclic epoxy group. At least one compound of an ester and a (meth) acrylate having a glycidyl group. 3. The curable composition according to claim 1 or 2, wherein the epoxy compound (A) having an alicyclic ring in the molecule is an epoxy compound selected from the group consisting of an epoxy group having an alicyclic epoxy group, and an epoxy group. An epoxy compound which directly bonds an alicyclic ring with a single bond, and at least one epoxy compound which has an epoxy compound having an alicyclic ring and a glycidyl ether group. 4. The curable composition according to any one of claims 1 to 3, wherein the (meth) acrylate (B) having an alicyclic ring in the molecule is a polyfunctional one having an alicyclic ring in the molecule. (fluorenyl) acrylate. A hardening resin obtained by curing the curable composition according to any one of claims 1 to 4. An optical member which is obtained by the hardening resin described in claim 5 of the patent application. 322757 201144349 . IV. Designated representative map: There is no schema in this case. (1) The representative representative of the case is: No. (2) A brief description of the symbol of the representative figure: None. 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: (A-1) 3 322757(A-1) 3 322757
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