TW201144265A - Compound, polymer comprising the compound, and chemically amplified resist composition comprising the polymer - Google Patents
Compound, polymer comprising the compound, and chemically amplified resist composition comprising the polymer Download PDFInfo
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/38—Esters containing sulfur
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
Abstract
Description
201144265 jo jplf 六、發明說明: 【發明所屬之技術領域】 本發明關於-種新穎化合物、含有該化合物之聚合物 及含有該聚合物之化學放大型光阻組成物,其使用該化人 物及由使該化合物料單體聚合而產生之聚合物,使得二 成物^分散且適祕形成精細_,其具有諸如高黏著 力、局敏感性及高熱穩定性㈣氣體產生量減少的特徵, 且可改善解析度及線邊祕度。更特定而言,本發明關於 -種新穎化合物,其可祕製造光阻,該光阻能夠在使用 各種輻射(如KrF準分子雷射、ArF準分子雷射及其類似 物之退紅外輻射,X射線(如同步輻射),及帶電粒子輻射 (如電子束))下形成圖案,因此可用於微處理;以此化合 物為單體聚合而得之聚合物;以及含有此聚合物之化學放 大型光阻組成物。 【先前技術】 由於用於半導體產業及類似產業中之微影技術最近 已由次50奈米技術所替代,所以預期將出現更新穎且經改 良之技術。儘管使用遠紫外輻射之微影技術為一種能夠進 行此種圖案化之重要技術,但實現次32奈米圖案之技術需 要很困難之製私。使用193奈米波長的微影技術被認為是 將來實現製造次32奈米圖案之技術的重要方式,且此技術 可藉由增加數值孔徑(NA)而成為可能。 根據Rayleigh’s方程式,可增加數值孔徑以增加浸沒 〉现體(immersion fluid )或次〉又光阻之折射率,且解析产可 4 201144265 38535pif 同時增加。此外,折射率增加可使聚焦深度(D〇F)增加。 Κ=(Κ1·/1)/(ΝΑ),NA=72sin0, R=解析度,2=波長’ NA=數值孔徑,^折射率,扣入射角。 λ可改善如解析度、敏感度、折射率及線邊粗糙度(LER ) 等特性的新穎光阻組成物之需求一直存在’且對增加現用 光阻之折射率及獲得較高敏感度之光阻技術之研究已在進 行。然而,這些研究之結果在實現較精細半導體積體電路 方面不令人滿意,且有感光速度降低之問題。 再者,對容許在光酸產生劑中引入光酸產生劑,具較 高敏感度及較高穩定性同時氣體排放量減少,且具高&析 度及低線邊粗糙度之化學放大型光阻組成物之。 【發明内容】 本發明之一目的在提供可在化學放大型光阻中用作 光酸產生劑或單體之新穎化合物。本發明另一目的在提供 含有上述化合物作為單體之聚合物,其可用於化學放大型 光阻組成物中。此化學放大型光阻組成物具有優良之敏感 度及較高之穩定性同時氣體排放量減少,且亦具有高解析 度及低線邊粗輪度。 為達上述目的,本發明一態樣之化合物由式(1)表示:201144265 jo jplf VI. Description of the Invention: [Technical Field] The present invention relates to a novel compound, a polymer containing the same, and a chemically amplified resist composition containing the same, which uses the character and The polymer produced by polymerizing the compound monomer causes the two components to be dispersed and conformed to form a fine _, which has characteristics such as high adhesion, local sensitivity, and high thermal stability (IV) reduction in gas generation amount, and Improve resolution and edge margin. More particularly, the present invention relates to novel compounds which are capable of producing photoresists which are capable of using various radiations such as KrF excimer lasers, ArF excimer lasers and the like, and infrared radiation, Forming a pattern under X-rays (such as synchrotron radiation) and charged particle radiation (such as electron beam), so it can be used for micro-processing; a polymer obtained by polymerizing a compound as a monomer; and a chemical amplification type containing the polymer Photoresist composition. [Prior Art] Since lithography used in the semiconductor industry and similar industries has recently been replaced by the next 50 nm technology, it is expected that new and improved technologies will emerge. Although lithography using far ultraviolet radiation is an important technique for such patterning, the technique of achieving a sub-32 nm pattern requires very difficult manufacturing. The use of a 193 nm wavelength lithography technique is considered to be an important way to implement the technique of manufacturing a sub-32 nm pattern in the future, and this technique can be made possible by increasing the numerical aperture (NA). According to Rayleigh's equation, the numerical aperture can be increased to increase the refractive index of the immersion immersion fluid or sub->resistance, and the analytical yield can be increased simultaneously with the 4 201144265 38535pif. In addition, an increase in refractive index can increase the depth of focus (D〇F). Κ = (Κ1·/1)/(ΝΑ), NA=72sin0, R=resolution, 2=wavelength 'NA=numerical aperture, ^refractive index, buckle incident angle. λ improves the demand for novel photoresist compositions such as resolution, sensitivity, refractive index, and line edge roughness (LER). There is always a need to increase the refractive index of the active photoresist and obtain higher sensitivity. Research on resistance technology is already underway. However, the results of these studies are unsatisfactory in achieving a finer semiconductor integrated circuit, and there is a problem that the speed of light is lowered. Furthermore, it is a chemical amplification type that allows the introduction of a photoacid generator into a photoacid generator with high sensitivity and high stability while reducing gas emissions, and having high & resolution and low line edge roughness. Photoresist composition. SUMMARY OF THE INVENTION An object of the present invention is to provide a novel compound which can be used as a photoacid generator or monomer in a chemically amplified photoresist. Another object of the present invention is to provide a polymer containing the above compound as a monomer which can be used in a chemically amplified resist composition. The chemically amplified photoresist composition has excellent sensitivity and high stability while reducing gas emissions, and also has high resolution and low line edge roundness. In order to achieve the above object, a compound of one aspect of the present invention is represented by the formula (1):
ojcQ1 5 (1) 201144265 38535pif 其中在式(丨)中,R"表示由氫原子、碳數1〜10之烷基、碳 數1〜10之全I院基及壤數1〜10之烷氧基所組成之族群中 選出的任一者;(^及Q2各自獨立表示由氫原子及鹵素原 子所組成之族群中選出的任一者;且A+表示有機對離子。 本發明另一態樣之聚合物含有式(2)表示之重複單元:ojcQ1 5 (1) 201144265 38535pif In the formula (丨), R" denotes an alkoxy group consisting of a hydrogen atom, an alkyl group having a carbon number of 1 to 10, a carbon number of 1 to 10, and a soil number of 1 to 10. Any one selected from the group consisting of: (^ and Q2 each independently represent any one selected from the group consisting of a hydrogen atom and a halogen atom; and A+ represents an organic counter ion. Another aspect of the present invention The polymer contains a repeating unit represented by the formula (2):
其中在式(2)中,Rll、r41及r42各自獨立表示由氫原子、 碳數1〜10之烷基、碳數1〜1〇之全氟烷基及碳數1〜10之 烷氧基所組成之族群中選出的任一者;q〗及^各自獨立 表示由氫原子及齒素原子所組成之族群中選出的任一者; 且A+表示有機對離子。 聚合物可為由下式(3)表示之聚合物:In the formula (2), R11, r41 and r42 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a perfluoroalkyl group having 1 to 1 carbon number, and an alkoxy group having 1 to 10 carbon atoms. Any one selected from the group consisting of; q and ^ each independently represent any one selected from the group consisting of a hydrogen atom and a dentate atom; and A+ represents an organic counter ion. The polymer may be a polymer represented by the following formula (3):
其中在式(3)中’ R】i、〜、心3、R14、R41、R42、R43、R44、 R46、R47及R48各自獨立表示由氫原子、碳數丨〜1〇 6 201144265 38535pif 之烷基、碳數1〜10之全氟烷基及碳數1〜10之烷氧基所組 成之族群中選出的任一者;Qi& &各自獨立表示由氣原 子及S素原子所組成之族群中選出的任一者;r21、r22及 R23各自,立表示由氫原子、錄、雜絲、環絲、雜環 烷基γ芳基、雜芳基及其組合所組成之族群中選出的任一 者’ A表示有機對離子;X表示源自烯烴單體之聚合單元; 且卜m、n、0及P分別處於以下範圍内:0<1幼.4,0<mS0.5, 把1^0.5 ’ 0%0·5 及 0<pS0.2,同時 l+m+n+〇+p=l。 曰上述聚合物可具有2,〇〇〇〜1〇〇,〇〇〇之重量平均分子 罝,且可具有1〜5之分子量分佈。 本發明另一態樣之化學放大型光阻組成物包含含有 式(2)之重複單元的聚合物。 【實施方式】 下文將更詳細描述本發明。 本發明說明書中所用之術語定義如下。 ^除非本文另外特定說明,否則鹵素原子意指由氟、 氯、溴及碘所組成之族群中選出的任一者。 除非本文另外特定說明,否則炫基之實例包含一級燒 基、一級烷基及三級烷基。 除非本文另外特定說明,否則全氟烧基意指部分氫原 子或所有氫原子經氟原子取代之烷基。 除非本文另外特定說明,否則全氟烷氧基意指部分氫 原子或所有錢子經氣原子喊之烧氧基。 除非本文另外特定說明,否則所有化合物及取代基可 201144265 38535pif 經取代或未峰代。本文中,經取代意指氫原子已由下列 基團所f成之族群中選出之任-者置換:i素原子、經基、 ,基、硝基、胺基、硫基、甲硫基、烧氧基、猜基、 酸,、%氧基、喊基、g旨基、幾基、縮酸基、酮基、烧基、 全士燒基、環貌基、雜環院基、稀丙基、苯甲基、芳基、 雜芳基,其衍生物及其組合。 -除非本文另外特定說明,否則字首「雜」意指碳原子 、-二1 3個由:N、〇、S及p所組成之族群中選出之雜原子 取代。舉例而言’雜燒基意指烷基之碳原子中的1〜3個碳 原子經雜原子取代。 除非本文另外特定說明,否則烷基意指碳數1〜30之 具支鏈院基;雜烧*指碳數1〜3之雜烧基;烧氧基 曰厌t 1〜10之烧氧基;全氟烧基指碳數1〜1〇之全氟烧 =全氟絲基指碳數L之全氟絲基;槪基指碳 之環烷基;雜環烷基指碳數2〜32之雜環烷基;芳 土曰衩數6〜30之芳基;且雜芳基指碳數2〜30之雜芳基。 s除非本文另外特定說明,否則環烷基之實例包含單 環、雙環、三環及四環觀基。環絲之實例亦包含金剛 烷基、降冰片基及含有降冰片基之多環環烷基。 除非本文另外特定說明,否則芳基意指含苯環之化合 物或其衍生物,且芳基之實例包含甲苯及二甲苯,其中烷 ^側鏈連接至苯環;聯苯,其中兩個以上苯環以單鍵連結; 芴、咕噸(xanthene)及蒽醌,其中兩個以上笨環以環烷 基或雜環烷基連結;以及萘及蒽,其中兩個以上苯環併合。 8 201144265 38535pif 除非本文另外特定說明,否則烯烴意指含雙鍵之不飽 和烴化合物,其實例包含(但不限於)烯類、丙婦酸醋、 苯乙稀、降冰稀、茚(indene)、苊及咳〇南二顯j。 本發明一態樣之化合物由下式(1)表示。 =〇 0 P1 0- ⑴ 在式⑴中, 表示由氫原子、碳數1〜10之烷基、碳數i〜1〇之 全氟烷基及碳數1〜10之烷氧基所組成之族群中選出的名 一者,且可較佳為由氫原子、三氟甲基、碳數丨〜5之烷』 及碳數1〜5之院氧基中選出之任一者; j …^及Q2各自獨立表示㈣原子及鹵素原子所 私群中選出之任一者,且可較佳為氟原子.且 之基^示有機對離子,其可較佳為由下式(5)或⑹^ R2Wherein in the formula (3), 'R}i, ~, core 3, R14, R41, R42, R43, R44, R46, R47 and R48 each independently represent a hydrogen atom, a carbon number 丨~1〇6 201144265 38535pif alkane Any one selected from the group consisting of a perfluoroalkyl group having 1 to 10 carbon atoms and an alkoxy group having 1 to 10 carbon atoms; Qi&& each independently representing a gas atom and a S atom Any one selected from the group; r21, r22, and R23 each independently represent a group consisting of a hydrogen atom, a nucleus, a heterofilament, a cyclofilament, a heterocycloalkyl aryl group, a heteroaryl group, and combinations thereof. Either 'A denotes an organic counter ion; X denotes a polymer unit derived from an olefin monomer; and m, n, 0 and P are respectively in the following ranges: 0 < 1 young. 4, 0 < mS 0.5, 1^0.5 '0%0·5 and 00<pS0.2, while l+m+n+〇+p=l. The above polymer may have a weight average molecular weight of 2, 〇〇〇~1 〇〇, and may have a molecular weight distribution of 1 to 5. Another chemically amplified photoresist composition of the present invention comprises a polymer comprising a repeating unit of the formula (2). [Embodiment] Hereinafter, the present invention will be described in more detail. The terms used in the description of the present invention are defined as follows. ^ Unless otherwise specifically stated herein, a halogen atom means any one selected from the group consisting of fluorine, chlorine, bromine and iodine. Unless otherwise specifically stated herein, examples of leuco bases include a primary alkyl group, a primary alkyl group, and a tertiary alkyl group. Unless otherwise specifically stated herein, a perfluoroalkyl group means an alkyl group in which a part of a hydrogen atom or all hydrogen atoms are replaced by a fluorine atom. Unless otherwise specifically stated herein, perfluoroalkoxy means that a portion of a hydrogen atom or all of the money is alkoxylated by a gas atom. Unless otherwise specifically stated herein, all compounds and substituents may be substituted or not peaked by 201144265 38535pif. Herein, substituted means that the hydrogen atom has been replaced by any one selected from the group consisting of: an atom, a thiol group, a nitro group, an amine group, a thio group, a methylthio group, Alkoxy, guess, acid, % oxy, ketone, g-, benzyl, acetyl, ketone, alkyl, valence, ring, heterocyclic, propylene Base, benzyl, aryl, heteroaryl, derivatives thereof, and combinations thereof. - Unless otherwise specifically stated herein, the word "hetero" means a carbon atom, - a hetero atom substitution of -1 selected from the group consisting of: N, 〇, S, and p. By way of example, "heteroalkyl" means that one to three carbon atoms in the carbon atom of the alkyl group are substituted with a hetero atom. Unless otherwise specified herein, alkyl means a branched group having a carbon number of 1 to 30; miscellaneous * means a heteroalkyl group having a carbon number of 1 to 3; Perfluoroalkyl group means a perfluoro group having a carbon number of 1 to 1 = = a perfluorosilyl group means a perfluorosilyl group having a carbon number L; a fluorenyl group means a cycloalkyl group of carbon; and a heterocycloalkyl group means a carbon number of 2 to 32. a heterocycloalkyl group; an aryl group having a carboxyl group number of 6 to 30; and a heteroaryl group means a heteroaryl group having 2 to 30 carbon atoms. Unless otherwise specifically stated herein, examples of cycloalkyl groups include monocyclic, bicyclic, tricyclic, and tetracyclic groups. Examples of the loop filament also include an adamantyl group, a norbornyl group, and a polycyclic cycloalkyl group having a norbornyl group. Unless otherwise specifically stated herein, aryl means a benzene ring-containing compound or a derivative thereof, and examples of the aryl group include toluene and xylene, wherein the alkane side chain is bonded to a benzene ring; biphenyl, wherein two or more benzenes thereof The ring is linked by a single bond; xanthene and anthracene, wherein two or more of the stupid rings are linked by a cycloalkyl or heterocycloalkyl group; and naphthalene and an anthracene, wherein two or more benzene rings are combined. 8 201144265 38535pif Unless otherwise specifically stated herein, an olefin means an unsaturated hydrocarbon compound containing a double bond, and examples thereof include, but are not limited to, an alkene, a acetoacetate, a styrene, an ice thinner, an indene.苊, 苊 and cough South two show j. The compound of one aspect of the present invention is represented by the following formula (1). = 〇 0 P1 0- (1) In the formula (1), it represents a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a perfluoroalkyl group having a carbon number of i to 1 fluorene, and an alkoxy group having 1 to 10 carbon atoms. Any one of the selected ones of the group, and preferably one selected from the group consisting of a hydrogen atom, a trifluoromethyl group, a carbon number of 碳5 and an alkyl group having a carbon number of 1 to 5; j ...^ And Q2 each independently represent (4) any one selected from the group of atoms and halogen atoms, and may preferably be a fluorine atom, and the base thereof is an organic counter ion, which may preferably be represented by the following formula (5) or (6) ^ R2
:丨 S—R (5 雜炫 八中在式(5)中,Rl、R2及〜各自獨立表示由燒基、 201144265 基、全亂烧基、炫•氧基、芳基及雜芳基所組成之族群中選 出的任一者; ' R4—丨―R5 (6) 各自獨立表示自絲、減基、讀烧基、 '、芳基及雜芳基所組成之族群中選出的任一者。 任一 f(5)可為由下式(5_i)〜(5_uii)所組成之族群中選出的:丨S—R (5 杂 八 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中 中Any one of the selected ethnic groups; 'R4—丨-R5 (6) each independently represents any one selected from the group consisting of silk, substrate, read burn, ', aryl and heteroaryl Any f(5) may be selected from the group consisting of the following formulas (5_i) to (5_uii)
[5-i][5-i]
〇CH3 [5-v]〇CH3 [5-v]
F [5-ίχ]F [5-ίχ]
D, I [5-xi 】 [5-xii ] 201144265 38535pifD, I [5-xi 】 [5-xii ] 201144265 38535pif
OO
[5-xvi 1[5-xvi 1
[5-xxi ][5-xxi ]
〇, ;5-xxii ] 式(6)可為由下式(6-i)〜(6-ix)所組成之族群中選出的任 者: 〇·|+_Ο~0εΗ3 [6-1] [6-iii ] 〇-'+ [6-iv ] [6-v] [6-vi ]〇, ;5-xxii ] Equation (6) can be selected from the group consisting of the following formulas (6-i) to (6-ix): 〇·|+_Ο~0εΗ3 [6-1] [ 6-iii ] 〇-'+ [6-iv ] [6-v] [6-vi ]
[6-vii ] [6-viii ] [6-ix] 11 201144265 式⑴化合物充當單體以及光酸產生劑。在此狀況下, 析度及LER之特彳柯藉由以下方式來改良:調節化合物 主鏈之碳數’從而確保以化合物⑴為單體聚合所得之聚 =物經曝光而產生酸之空間,同時亦調節適用於圖案化的 酸擴散距離。 本發明另-態樣之聚合物含有下式(2)所表重複單元。[6-vii ] [6-viii ] [6-ix] 11 201144265 The compound of the formula (1) functions as a monomer and a photoacid generator. Under this circumstance, the degree of cleavage and LER is improved by adjusting the carbon number of the main chain of the compound to ensure that the poly(polymer) obtained by polymerizing the compound (1) is exposed to generate an acid space. It also adjusts the acid diffusion distance suitable for patterning. The polymer of another aspect of the present invention contains a repeating unit represented by the following formula (2).
(2) 在式(2)中, _ Rii、及R42各自獨立表示由氫原子、碳數1〜1〇之 境基、碳數1〜10之全氟院基及碳數1~1〇之烧氧基所組成 之族群中選出的任一者,且可較佳為由氫原子、三氟曱基、 碳數1〜5之烷基及碳數1〜5之烷氧基中選出之任一者; ^ Qi及Q2各自獨立表示由氫原子及鹵素原子所組成之 族群中選出之任一者,且可較佳為氟原子;且 A+表示有機對離子,其定義與關於式(丨)所述者相同, 因此不再重複作進一步描述。 聚合物藉由使式(1)化合物直接聚合而產生,此式(1) 化合物在聚合物中有光酸產生劑之作用,而使光酸產生劑 大量引入。㈣,可產生使含有其之光阻機高曝光敏感 12 201144265 38535pif 度與較高穩定性,且具有低LER同時曝光後所產生之排放 氣體量減少的聚合物。 聚合物為多組分共聚物’且可為嵌段共聚物、雜亂共 聚物或接枝共聚物。此外,含有由式(2)表示之重複單元的 聚合物可為含有由下列重複單元所組成之族群中選出之任 一重複單元的聚合物:具有酸不穩定性基團之重複單元、 含羥基之重複單元、含有内酯環之黏接基團(adhesive group)的重複單元’以及其組合。 更特定而言’聚合物可為由下式(3)表示之聚合物:(2) In the formula (2), _ Rii and R42 each independently represent a hydrogen atom, a carbon number of 1 to 1 Å, a perfluorocarbon group having a carbon number of 1 to 10, and a carbon number of 1 to 1 Å. Any one selected from the group consisting of alkoxy groups, and preferably selected from the group consisting of a hydrogen atom, a trifluoromethyl group, an alkyl group having 1 to 5 carbon atoms, and an alkoxy group having 1 to 5 carbon atoms. One; Qi and Q2 each independently represent any one selected from the group consisting of a hydrogen atom and a halogen atom, and may preferably be a fluorine atom; and A+ represents an organic counter ion, and its definition and formula (丨) The same is true and therefore will not be repeated for further description. The polymer is produced by directly polymerizing a compound of the formula (1) which has a photoacid generator in the polymer to introduce a large amount of the photoacid generator. (d), can produce a high exposure sensitivity of the photoresist containing it 12 201144265 38535pif degree and higher stability, and a low LER simultaneous exposure after the amount of emission of gas produced by the reduction of the amount of gas. The polymer is a multicomponent copolymer' and may be a block copolymer, a scrambled copolymer or a graft copolymer. Further, the polymer containing the repeating unit represented by the formula (2) may be a polymer having any one selected from the group consisting of the following repeating units: a repeating unit having an acid labile group, and a hydroxyl group a repeating unit, a repeating unit comprising an adhesive group of a lactone ring, and combinations thereof. More specifically, the polymer may be a polymer represented by the following formula (3):
在式(3)中, R"、R12、R13、R14、R41、R42、r43、r44、r45、R奸、 R47及R48各自獨立表示由氫原子、碳數1〜l〇之燒基、碳 數1〜10之全氟烷基及碳數1〜10之烷氧基所組成之族群中 選出的任一者,且可較佳為由氫原子、三氟曱基、碳數^ 之烧基及碳數1〜5之烧氧基中選出之任一者; (^及Q2各自獨立表示由氫原子及鹵素原子所纟且 族群中選出之任—者,且可較佳為氟原子; ' A表不有機對離子’由於其定義與關於式⑴中之 所述者相同,所以不再重複作進一步描述; 13 201144265 38535pif 符號卜m、n、o及p分處以下範圍:〇<κ〇 4,〇<η^〇 5, 0<η<0.5,(Κ〇<0.5 及 0<pS0.2,同時 1+m+n+〇+p=1 ;且 X表示源自烯烴單體之聚合單元。 烯烴單體可較佳為由丙烯酸酯、苯乙烯、降冰片烯、 茚、苊、呋喃二酮及其衍生物組成之族群中選出的任一者。 X可較佳為由下式(3-a)〜(3-f)中之一表示的聚合單元:In the formula (3), R", R12, R13, R14, R41, R42, r43, r44, r45, R, R47 and R48 each independently represent a hydrogen atom, a carbon number of 1 to 10 Å, and carbon. Any one selected from the group consisting of a perfluoroalkyl group having 1 to 10 and an alkoxy group having 1 to 10 carbon atoms, and preferably a hydrogen atom, a trifluoromethyl group or a carbon number. And any one selected from the group consisting of alkoxy groups having 1 to 5 carbon atoms; (^ and Q2 each independently represent a hydrogen atom and a halogen atom and are selected from the group, and may preferably be a fluorine atom; A is not an organic counterion' because its definition is the same as that described in the formula (1), so it will not be repeated for further description; 13 201144265 38535pif Symbols m, n, o and p are divided into the following ranges: 〇 < κ 〇4, 〇<η^〇5, 0<η<0.5, (Κ〇<0.5 and 0 < pS0.2, while 1+m+n+〇+p=1; and X represents an olefin monomer derived from The olefin monomer may preferably be any one selected from the group consisting of acrylate, styrene, norbornene, hydrazine, hydrazine, furanedione and derivatives thereof. Formula (3-a) Polymerized units of one of (3-f) represented by:
在式(3-a)至式(3-f)中, R15、R49及尺5〇各自獨立表示由氫原子、碳數1〜1〇之 烷基、碳數1〜10之全氟烷基及碳數1〜10之烷氧基組成之 族群中選出的任一者,且各自可較佳為由氫原子、三說甲 基、碳數1〜5之烷基及碳數1〜5之烷氧基中選出之任—者; R3i及R32各自獨立表示由以下者所組成之族群中選 出的任一者:鹵素原子、經基、氰基、叛基、腈基、趁基、 環氧基、硝基、胺基、硫基、甲硫基、烷基、烷氧基、全 氟烧氧基、經烧基、環烧基、雜環烧基、芳基、雜芳基、 COOR'及COR· ’其中R·表示由烧基、全氟烧基、環燒基、 201144265 38535pif 芳基及環芳基所組成之族群中選出的任一者; 表示〇 5之整數’b表〇〜5之整數,c表〇〜§之整數, 表0〜4之整數,e表〇〜3之整數,且f表示 0〜3之整數。 在式(3)中, ^21 R22及反23各自獨立表示由氫原子、烷基、雜炫* %烷基、雜環烷基、芳基、雜芳基及其組合所組成之 =群中選丨的任—者,且可較佳為由下式㈣〜㈣)所組 成之族群中選出的任一者:In the formulae (3-a) to (3-f), R15, R49 and 5'' each independently represent a perfluoroalkyl group having a hydrogen atom, an alkyl group having 1 to 1 carbon number, and a carbon number of 1 to 10. And any one selected from the group consisting of alkoxy groups having a carbon number of 1 to 10, and each of them may preferably be a hydrogen atom, a trimethyl group, an alkyl group having 1 to 5 carbon atoms, and a carbon number of 1 to 5. Any one selected from the group consisting of alkoxy groups; R3i and R32 each independently represent any one selected from the group consisting of a halogen atom, a thiol group, a cyano group, a thiol group, a nitrile group, a fluorenyl group, and an epoxy group. Base, nitro, amine, thio, methylthio, alkyl, alkoxy, perfluoroalkoxy, alkyl, cycloalkyl, heterocycloalkyl, aryl, heteroaryl, COOR' And COR· 'where R· represents any one selected from the group consisting of an alkyl group, a perfluoroalkyl group, a cycloalkyl group, a 201144265 38535pif aryl group and a cyclic aryl group; an integer representing the number of 〇5'b 〇~ An integer of 5, an integer of c 〇 § §, an integer of Table 0 to 4, an integer of e 〇 〜3, and f represents an integer of 0 to 3. In the formula (3), ^21 R22 and trans 23 each independently represent a group consisting of a hydrogen atom, an alkyl group, a heterodyne*% alkyl group, a heterocycloalkyl group, an aryl group, a heteroaryl group, and a combination thereof. Any one selected from the group, and preferably selected from the group consisting of the following formulas (4) to (4):
KIKI
'(r33>h /、 '(^33)h (3-i) (3-ϋ) /\/ /—i^(R33)i Ό'(r33>h /, '(^33)h (3-i) (3-ϋ) /\/ /—i^(R33)i Ό
(3-iv)(3-iv)
v=° 0 (R33)k (3-V) R35 R34 (3-vi)v=° 0 (R33)k (3-V) R35 R34 (3-vi)
-OH 入R33 35 R34 (3-vii) (¾¾-OH into R33 35 R34 (3-vii) (3⁄43⁄4
(3-viii)(3-viii)
33 J, (3-ix) 在式(3-i)至(3-ix)中, 出的獨立表示由以下者所組成之族群中選 氧基、外a ίΓ燒基、魏基、全氟絲、全氟烧 礼丞匕说基、鹵素原子、靭其Λ, «· 基、甲硫基、鳴及甲氧Α,工土、鼠基、硝基、胺基、硫 獨立為由以下者所組成^群^較佳是,R33至心可各自 紙之族群中選出的任-者:氫原子、 15 201144265 38535pif 碳數1〜6之烷基、碳數1〜6之烷氧基、碳數1〜4之全氟烷 基、碳數1〜4之全氟烷氧基、碳數1〜6之羥烷基、鹵素原 子、經基、氰基、硝基、胺基、硫基、甲硫基及甲氧基。 符號g表示0〜9之整數,h表示〇〜9之整數,i表示 0〜5之整數,j表示0〜15之整數,k表示〇〜15之整數,q 表示0〜17之整數,且!·表示〇〜11之整數。 聚合物可較佳為由下式(4)表示之聚合物:33 J, (3-ix) In the formulae (3-i) to (3-ix), the independent representation of the group consisting of the following groups is selected from the group consisting of an oxy group, an a Γ Γ group, a wei group, and a perfluoro group. Silk, perfluorinated ruthenium, halogen atom, toughness, «· base, methylthio, methoxy, methoxy, work soil, murine, nitro, amine, sulfur independent Preferably, the composition is preferably any one selected from the group consisting of R33 to the heart of each paper: hydrogen atom, 15 201144265 38535pif alkyl group having 1 to 6 carbon atoms, alkoxy group having 1 to 6 carbon atoms, carbon a perfluoroalkyl group having 1 to 4, a perfluoroalkoxy group having 1 to 4 carbon atoms, a hydroxyalkyl group having 1 to 6 carbon atoms, a halogen atom, a trans group, a cyano group, a nitro group, an amine group, a sulfur group, Methylthio and methoxy. The symbol g represents an integer of 0 to 9, h represents an integer of 〇~9, i represents an integer of 0 to 5, j represents an integer of 0 to 15, k represents an integer of 〇15, and q represents an integer of 0-17, and ! · Indicates an integer from 〇 to 11. The polymer may preferably be a polymer represented by the following formula (4):
,R13 [R43 ,R12 / \ / ►QvwVWV' W\AAJ ΛΑ.0—*0·ΛΛΛΛΛ/' R 么—Ο Ίη Ο、 '22 23 44 / Ο R21,R13 [R43 ,R12 / \ / ►QvwVWV' W\AAJ ΛΑ.0—*0·ΛΛΛΛΛ/' R 么—Ο Ίη Ο, '22 23 44 / Ο R21
其中在式(4)中,Rn、R12、Rl3、R14、R41、R42、r43、 R44、R45、R46、r47、r48 ' Qi、q2、A+、R21、R22、r23、1、 m、n、〇及p的定義分別與關於式(3)所述者相同,因此不 再重複作進一步描述。 在式(4)中,b表示0〜5之整數,且c表示〇〜8之整數。 在式(4)中’ R1S及R49各自獨立表示由氫原子、碳數 1〜10之烷基、碳數1〜1〇之全氟烷基及碳數丨〜:^之院氧基 所組成之族群中選出的任一者,且較佳是,R〗5及r49可各 自獨立為由氫原子、三氟曱基、碳數1〜5之院基及碳數j〜5 之烷氧基所組成之族群中選出的任一者。 在式(4)中,Ru表示由以下者所組成之族群中選出的 任一者:卣素原子、羥基、氰基、羧基、腈基、醛基、環 16 201144265 38535pif 氧基、確基、胺基、硫基、甲硫基、絲 入# =基、舰基、環烧基、雜躲基、芳基 OR ’其巾R’表不由燒基、全氟絲、環燒美 及核^•基所組成之族群令選出的任一者。 土方基 碳數成之族群中選出的任-者: 6之絲、石反數卜6之炫氧基、碳數η 基、石厌數1〜4之全氟烷氧基、碳數 = :、經基、氛基,基、胺基、硫基及=且=Wherein in the formula (4), Rn, R12, Rl3, R14, R41, R42, r43, R44, R45, R46, r47, r48 'Q, q2, A+, R21, R22, r23, 1, m, n, The definitions of 〇 and p are the same as those described for the formula (3), respectively, and therefore will not be further described. In the formula (4), b represents an integer of 0 to 5, and c represents an integer of 〇8. In the formula (4), 'R1S and R49 each independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, a perfluoroalkyl group having 1 to 1 carbon number, and a oxy group having a carbon number of :~:^. Any one selected from the group, and preferably R R 5 and r 49 may each independently be a hydrogen atom, a trifluoromethyl group, a carbon number of 1 to 5, and an alkoxy group having a carbon number of j 5 . Any one of the selected ethnic groups. In the formula (4), Ru represents any one selected from the group consisting of a halogen atom, a hydroxyl group, a cyano group, a carboxyl group, a nitrile group, an aldehyde group, and a ring 16 201144265 38535 pif oxy group, an exact group, Amine, thio, methylthio, silk into # = base, ship base, cycloalkyl, hetero-enzyme, aryl OR 'the towel R' is not from the base, perfluoro-wire, ring burned and nuclear ^ • Any of the selected ethnic groups. Any one selected from the group consisting of the carbon number of the earth's base: 6th wire, stone inverse number 6 decyloxy group, carbon number η base, stone anomaly number 1 to 4 perfluoroalkoxy group, carbon number =: , warp group, aryl group, base, amine group, sulfur group and = and =
佳可為由氫原子及下式3_χ域之族群帽出的任一L -ΟΗ =0 〇 λτ (3-χ) 光吸含Γ基)_酸聚合物之聚合物製造光阻時, =主二甲基)丙稀酸聚合物之 烤)酸補纽部分甚絲顏理(軟供 光時由汽化且部分保留於光阻膜中。因此,曝 案化特徵流動性得到改良,且因此使圖 Κ 5物可為式(4-aH4-l)組成之族群中 選出的任 '—者: 17 201144265 38535pifJiake is a polymer produced by a hydrogen atom and a group of the 3_χ domain of the following formula: L-ΟΗ =0 〇λτ (3-χ) light-absorbing thiol-containing polymer) The dimethyl methacrylate polymer is roasted. The acid-filling part is very silky (the vaporization is softened and partially retained in the photoresist film. Therefore, the fluidity of the exposed features is improved, and thus Figure Κ 5 can be selected from the group consisting of the formula (4-aH4-l): 17 201144265 38535pif
(4-a)(4-a)
(4-b)(4-b)
(4-c)(4-c)
(4-d)(4-d)
(4-e) (4-f) 18 201144265 38535pif(4-e) (4-f) 18 201144265 38535pif
(4-h) (4-i) (4-j) (4-k) (4-g) (4-1)。 19 201144265 38535pif 在式(4-a)至(4_1}中, η η 〇及P分別處於以下範圍内:〇<丨<〇4, A表干^ ; 所述⑴中“ 句刀子1,以及1〜5之分子量分佈’且更佳呈有 3,_二30,_之重量平均分子量及i 5〇〜3之分子量分佈有 右重置平均分子量纽_,_,财將聚合物用於光阻 Ϊ^。f平均分子量小於2,嶋,則樹脂之機械強 度不,,而可此不能令人滿意地形成圖案(圖案破幻。此 外,右分子1分佈大於5,則線邊粗糙度可能不良。因此, 當在光阻域物巾❹重量平均好量及分子量分佈處於 上述範_之聚合物時,光阻組成物在可顯影性、可塗佈 性及耐熱性方面可展現適當特性。 土 由式(1)表示之化合物可II由如下所述之方法來產生。 由式(1)表示之化合物可以含以下步驟之方法產生:使 下式⑺表示之化合物與下式⑻表示之化合物反應之第一 步驟,以及使第一步驟中產生之反應產物與下式(9)表示之 化合物進行取代反應之第二步驟。 20 201144265 38535pif(4-h) (4-i) (4-j) (4-k) (4-g) (4-1). 19 201144265 38535pif In the formulae (4-a) to (4_1}, η η 〇 and P are respectively in the following ranges: 〇 < 丨 < 〇 4, A table dry ^; in the (1) "sentence knife 1, And a molecular weight distribution of 1 to 5 and more preferably a weight average molecular weight of 3, _30, _ and a molecular weight distribution of i 5 〇 〜 3 have a right reset average molecular weight _, _, a polymer used for When the average molecular weight of the photoresist is less than 2, 嶋, the mechanical strength of the resin is not, and the pattern cannot be satisfactorily formed (pattern is broken. In addition, the distribution of the right molecule 1 is greater than 5, and the line edge roughness is It may be defective. Therefore, when the average weight of the object in the photoresist region and the molecular weight distribution are in the above-mentioned range, the photoresist composition exhibits appropriate characteristics in terms of developability, coatability, and heat resistance. The compound represented by the formula (1) can be produced by the method described below. The compound represented by the formula (1) can be produced by the method of the following step: the compound represented by the following formula (7) is represented by the following formula (8). The first step of the compound reaction, and the reaction produced in the first step The compound represented by the composition formula (9) of the second step substitution reaction. 20 201144265 38535pif
O Cl ⑺ M + - O-S-C- ΌΗ ⑻O Cl (7) M + - O-S-C- ΌΗ (8)
II 〇 A+Z- (9)。 在式(7)至式(9)中, M+表示由Ll+、NaiK+組成之族群中選出的任一韵 Z表不由以下者所組成之族群中選出的任一 (oso2CF3)-、(os〇2c4F9)_、(〇s〇2c8F . (K(C^ - (Ncc4F9)2) , (C(CF3)3)., (C((!2F5;);>;; (c(C=3、>、F_、C1_、Br_、卜 BF4_、AsF6 及 % ;且 n、Q!及Q2之定義分別與關於式 合物所述者相同,因此不再重複作進—步^()表不之化 第:7之反應可在溶射進行,二使用 =二酮、醯胺、醇及其組合所級成 任一者作為溶劑。較佳可使用二氯 =出的 乙腈1苯、苯m歧其類似物讀—乳乙燒、 第—步驟之反應可在鹼性催化劑存 催化劑可為由三乙胺、二乙胺、下^丁,且驗性 胺、二以紅胺及―合触叙⑽、苯 者。當第-步驟之反應在驗性催化劑存在^出的任= 紐反應時間,可增加轉化比,且、 仃時,可縮 式⑻表示之化合物可由下式⑽原而得: 21 201144265 38535pifII 〇 A+Z- (9). In the formulas (7) to (9), M+ represents any one selected from the group consisting of L1+ and NaiK+, and any one selected from the group consisting of (oso2CF3)-, (os〇2c4F9) )_,(〇s〇2c8F . (K(C^ - (Ncc4F9)2) , (C(CF3)3)., (C((!2F5;);>;; (c(C=3, >, F_, C1_, Br_, BF4_, AsF6, and %; and the definitions of n, Q!, and Q2 are the same as those described above with respect to the formula, so the process is not repeated. The reaction of 7: can be carried out by spraying, and the use of either diketone, decylamine, alcohol and a combination thereof can be used as a solvent. It is preferred to use dichlorobenzene = acetonitrile 1 benzene, benzene m The analog reading-emulsion, the first step of the reaction can be carried out in the alkaline catalyst catalyst can be triethylamine, diethylamine, lower, and the test amine, di-erythramine and "combination" (10) Benzene. When the reaction of the first step is carried out in the presence of the test catalyst, the conversion ratio can be increased, and when 仃, the compound represented by the formula (8) can be obtained by the following formula (10): 21 201144265 38535pif
(10) ο 在式(10)中, 成之族-中選出的任一者; 子、ϊίΓΓ下Γ組成之族群中選出的任-者:氳肩 子經㈣原子取代的雜基,騎為1〜3個風房 群中選出的任—者.好、m為由者所組成之游 反數1〜5之烧基、三氟甲基, 一虱Τ基、三溴甲基及三碘曱基;且 趣Q=Q2之定義分触_式(1)絲之化合物所述者 同因此不再重複作進一步描述。 ,式⑽絲之化合_原得式⑻表枕化合物的製 ΐ: 也包含以下步驟:將式(8)之化合物溶於四氫吱喃 ^合晰;在冰浴中將還原劑緩慢逐滴添加至溶液中; 在元成逐滴添加後,使溫度升高至40〜100〇c以製備反庳 混合物㈣;在解下使反纽合物㈣反應;隨後終止 3混合物液體之反應;鑛溶劑;及使反應產物結晶。 曰曰之方法,可使用習用之任何結晶方法,但特定而言, 可=用包含以下步驟之方法:用強酸將已移除溶劑之反應 混合物液體酸化至pH 5〜6 ;濃縮所得混合物;隨後添加醇 1將所得濃縮物製成漿料;過濾漿料,並使用己烷再次洗 滌濾液;隨後再次濃縮濾液;以及使產物自乙醚中結晶。 含式(2)之重複單元之聚合物可以習知產生聚合物之 22 201144265 38535pif 方法來聚合’但較佳可用自由基聚合法。自由基聚合用之 聚合起始劑可使用由偶氮二異丁腈(AIBN)、過氧化苯曱 酿(BK))、過氧化月桂基、偶氮二異己腈、偶氮二異戊猜、 氫過氧化二級丁基及其組合所組成之族群中選出的任一 者。聚合反應可藉由如本體聚合、溶液聚合、懸浮聚合、 本體懸洋聚合及乳㈣合等方絲實現。聚合用之溶劑可 使用由本、曱本、二曱苯、鹵化苯、乙鱗、四氫。夫喃、1,2_ —氣乙烷、酯、醚、内酯、酮及醯胺中選出之一或多者。 來合反應完成後,殘留於反應混合物液體中之未反應單體 及田〗產物可藉由習知用於移除這些單體及副產物之方法移 除且較佳可藉由沈殿法,使用溶劑來移除這些物質。 本發明另一態樣之化學放大型光阻組成物包含含有 式(2)之重複單兀之聚合物,其中式⑴表示之單體之使用量 才=對於loo重量份之聚合物之總固體含量可為〇 5〜15重量 伤。右式(1)表不之單體的使用量在上述範圍内,則可獲得 車又佺敏感度及較尚穩定性,同時氣體排放量可減少。 、光阻組成物可包含相對於光阻組成物之總量為 3 wt% 且較佳為5 Wt%以上的含式(2)之重複單元的聚合物。 右來合物之含f為3 wt%以下’則包含聚合物之效果未必 ,刀顯現。絲組成物除聚合物之外亦可包含構成光阻組 、物之習知構成要素,如添加劑或溶劑。 包含式(2)之4複單元之光阻組成物可用於 圖案之形 ’其11案形成方法包含:將光阻組成物塗布於基板上之 v驟;對所塗布之光阻組成物進行加熱處理 ’並以南能量 23 201144265 38535pif 射線使光阻組成物曝光之步驟;以及使用顯影液使光阻組 成物顯影之步驟。 較佳使用波長13.5〜250奈米之範圍内的較高能量射 線,因為如此可增加解析度,同時降低LER。 當在化學放大型光阻組成物中使用本發明之新穎化 合物及含有此化合物之聚合物時,光阻組成物可具有良好 之敏感度及較高之穩定性同時氣體排放量減少,且可具有 較高之解析度及較低之線邊粗縫度。 [較佳實施形態] 下文將詳細描述本發明,以便於所屬技術領域中具通 常知識者可容易地實施本發明。然而,本發明可以各種不 同實施例實現’不限於以下所述之實例。 化合物之合成實例 1)二氟裂基丙烧續酸鈉鹽之合成 在冰浴中將83克3,3-二氟-3-磺基丙酸乙酯鈉鹽溶於 160毫升曱醇及ι·2公升四氫呋喃(THF)中,且將44克 蝴氫化納緩慢逐滴添加至溶液中。完成逐滴添加後自冰浴 中移出反應混合液,且加熱至6〇°C。在相同溫度下攪拌反 應混合液約4小時。 用蒸餾水淬滅如此攪拌之反應混合物液體’再移除溶 劑。將移除浴劑後所得之反應混合物再次溶於蒸餾水中, 且用濃鹽酸將所得溶液酸化至pH 5〜6。 再次濃縮酸化之反應混合液,且向其中添加甲醇以得 聚料。過濾衆料以移除無機鹽,再用己院洗滌滤液兩次。 24 201144265 38535pif 再次濃縮曱醇層,接著使用乙醚使其進行結晶。 在真空中乾燥結晶所得之白色固體,且藉由1H_NMR 確定固體之結構。因此,獲得68.5克(產率95%)之在下 列反應流程(1)中由式[A]表示之二氟羥基丙烷磺酸鈉鹽(3_ 乙氧基-1,1-二氟-3-側氧基丙烷小項酸鈉)。 h-NMR (氣仿-d3,内標:四甲基矽烷):5 (ppm) 3 3 (t, 2H), 4.58-4,68 (t,2H)。 [反應流程1 ](10) ο In formula (10), any one of the selected ones of the family; the selected one of the groups consisting of the ϊ ϊ ΓΓ ΓΓ 氲 氲 氲 氲 氲 氲 氲 氲 氲 氲 四 四 四 四 四 四 四 四 四 四 四Any one selected from 1 to 3 wind room groups. Good, m is the atomic group of 1 to 5, trifluoromethyl, monodecyl, tribromomethyl and triiod. The thiol group; and the definition of the interesting Q=Q2 is divided into the compounds of the formula (1), and the description thereof will not be repeated for further description. The compound of the formula (10) is prepared by the following steps: the compound of the formula (8) is dissolved in tetrahydrofuran; the reducing agent is slowly dropped in an ice bath. Adding to the solution; after the dropwise addition of the element, increasing the temperature to 40~100〇c to prepare the ruthenium mixture (4); reacting the reverse complex (4) under the solution; then terminating the reaction of the 3 mixture liquid; a solvent; and crystallizing the reaction product. For the method of hydrazine, any crystallization method conventionally used may be used, but specifically, a method comprising the steps of: acidifying the reaction mixture of the removed solvent with a strong acid to pH 5 to 6; concentrating the resulting mixture; The resulting concentrate was made into a slurry by the addition of alcohol 1; the slurry was filtered, and the filtrate was washed again with hexane; then the filtrate was concentrated again; and the product was crystallized from diethyl ether. The polymer containing the repeating unit of the formula (2) can be polymerized by a method of producing a polymer 22 201144265 38535pif ', but a free radical polymerization method is preferred. The polymerization initiator for radical polymerization can be used from azobisisobutyronitrile (AIBN), benzoquinone benzoate (BK), ruthenium peroxide, azobisisohexanenitrile, azobisisopentazole, Any of the selected groups of hydrogen peroxide secondary butyl groups and combinations thereof. The polymerization can be achieved by a square wire such as bulk polymerization, solution polymerization, suspension polymerization, bulk suspension polymerization, and milk (tetra). The solvent for polymerization can be used from the present, transcripts, diphenylbenzene, halogenated benzene, ethyl scale, and tetrahydrogen. One or more of fulc, 1,2_-ethane, ester, ether, lactone, ketone and decylamine are selected. After the completion of the reaction, the unreacted monomer and the product remaining in the liquid of the reaction mixture can be removed by a conventional method for removing these monomers and by-products, and can preferably be used by the method of Solvent to remove these substances. A chemically amplified photoresist composition according to another aspect of the present invention comprises a polymer comprising a repeating monomethane of the formula (2), wherein the amount of the monomer represented by the formula (1) is = the total solid of the polymer for the loo by weight The content can be 〇5~15 weight injury. If the amount of monomer used in the right formula (1) is within the above range, the vehicle sensitivity and stability are obtained, and the gas emission can be reduced. The photoresist composition may comprise a polymer containing a repeating unit of the formula (2) in an amount of 3 wt% and preferably 5 Wt% or more based on the total amount of the photoresist composition. When the f content of the right-handed compound is 3 wt% or less, the effect of containing a polymer is not necessarily the case, and the knife appears. The silk composition may contain, in addition to the polymer, conventional constituents constituting the photoresist group, such as additives or solvents. The photoresist composition comprising the complex unit of the formula (2) can be used for the pattern shape. The method for forming the method includes: coating the photoresist composition on the substrate; and heating the applied photoresist composition. The step of treating 'and south energy 23 201144265 38535pif rays to expose the photoresist composition; and the step of developing the photoresist composition using a developer. Higher energy ray in the range of 13.5 to 250 nm is preferred because it increases resolution while reducing LER. When the novel compound of the present invention and a polymer containing the same are used in a chemically amplified photoresist composition, the photoresist composition can have good sensitivity and high stability while reducing gas emissions, and can have Higher resolution and lower edge seam. BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail so that those skilled in the art can easily implement the present invention. However, the invention may be embodied in various different embodiments and is not limited to the examples described below. Synthesis of the compound Example 1) Synthesis of difluoro-propyl propyl sulfonate sodium salt 83 g of sodium 3,3-difluoro-3-sulfopropionate sodium salt was dissolved in 160 ml of decyl alcohol and ι in an ice bath. • 2 liters of tetrahydrofuran (THF), and 44 grams of butterfly hydrogen hydride was slowly added dropwise to the solution. After completion of the dropwise addition, the reaction mixture was removed from the ice bath and heated to 6 °C. The reaction mixture was stirred at the same temperature for about 4 hours. The thus stirred reaction mixture liquid was quenched with distilled water to remove the solvent. The reaction mixture obtained after removing the bath was again dissolved in distilled water, and the resulting solution was acidified to pH 5-6 with concentrated hydrochloric acid. The acidified reaction mixture was concentrated again, and methanol was added thereto to obtain a polymer. The bulk material was filtered to remove the inorganic salts, and the filtrate was washed twice with the house. 24 201144265 38535pif The sterol layer was again concentrated, followed by crystallization using diethyl ether. The white solid obtained by crystallization was dried in vacuo, and the structure of the solid was determined by 1H_NMR. Thus, 68.5 g (yield 95%) of difluorohydroxypropane sulfonate sodium salt represented by the formula [A] in the following reaction scheme (1) (3_ethoxy-1,1-difluoro-3-) was obtained. Sodium oxypropane small sodium). h-NMR (gas-d3, internal standard: tetramethyl decane): 5 (ppm) 3 3 (t, 2H), 4.58-4, 68 (t, 2H). [Reaction Scheme 1]
NaBH4NaBH4
THF,MeOHTHF, MeOH
Naofg 八vOH +Et〇HNaofg eight vOH +Et〇H
[A] 其中在反應流程1中,Me表示曱基,且Et表示乙基。 2) 2-曱基丙炸酸-2,2-二氟-2-石黃基丙醋納鹽之合成 將68克在化合物之合成實例1)中產生之在反應流程 (1)中由式[A]表示之二氟羥基丙烷磺酸鈉鹽(3_乙氧基^,卜 二氟-3-側氧基丙院-1-石黃酸鈉)及54.6毫升曱基丙稀醯氣 與500毫升二氯曱烷(MC)混合,攪拌所得混合物。隨 後在15〜25°C下將3.2克N,N’-二曱基胺基吡啶(DMAP) 及50毫克聚合阻止劑(氫醌單甲醚(MEHQ))添加至混 合物中,混合所得混合物。在15〜25°C下將置於滴液漏斗 中之104毫升三乙胺(Et^N)缓慢逐滴添加至混合物中, 從而製得反應混合液。在15〜25°C下攢;拌反應混合物液體 3小時’隨後藉由NMR確定反應程度,且終止反應。 25 201144265 38535pif 在終止反應混合液之反應後,在減壓下蒸餾以移除作 為反應溶劑之二氣曱烧,且向其中添加300毫升蒸鶴水。 隨後,將碳酸鉀添加至反應混合液中而得飽和溶液。攪拌 飽和溶液2小時後’過濾由此產生之固體而得81克(產率: 86% )之在反應流程2中由式[B]表不之2-甲基-丙稀酸_2,2_ 二氟-2-磺基·丙酯鈉鹽(1,1-二氟-3·(曱基丙烯醯氧基)丙烷 -1-磺酸鈉)。藉由1H-NMR確定鹽之結構。 b-NMR (DMSO,内標:四曱基石夕烧):5 (ppm) 1.91 (s, 3H),3.3 (t,2H),4.57-4.67 (t,2H),5.77 (s,1H),6.11 (s,1H)。 [反應流程2][A] wherein in Reaction Scheme 1, Me represents a thiol group, and Et represents an ethyl group. 2) Synthesis of 2-mercaptopropanuric acid-2,2-difluoro-2-stone base propyl acetate salt 68 g of the compound produced in the synthesis example 1) of the compound in the reaction scheme (1) [A] represents difluorohydroxypropane sulfonate sodium salt (3_ethoxy^, bdifluoro-3-isooxypropyl-1-hetate sodium) and 54.6 ml of mercapto propylene xenon 500 ml of dichlorodecane (MC) were mixed and the resulting mixture was stirred. Then, 3.2 g of N,N'-didecylaminopyridine (DMAP) and 50 mg of a polymerization inhibitor (hydroquinone monomethyl ether (MEHQ)) were added to the mixture at 15 to 25 ° C, and the resulting mixture was mixed. 104 ml of triethylamine (Et^N) placed in a dropping funnel was slowly added dropwise to the mixture at 15 to 25 ° C to prepare a reaction mixture. The mixture was stirred at 15 to 25 ° C; the reaction mixture was mixed for 3 hours' and then the degree of reaction was confirmed by NMR, and the reaction was terminated. 25 201144265 38535pif After the reaction of the reaction mixture was terminated, distillation under reduced pressure was carried out to remove the second gas calcination as a reaction solvent, and 300 ml of steamed crane water was added thereto. Subsequently, potassium carbonate was added to the reaction mixture to obtain a saturated solution. After stirring the saturated solution for 2 hours, 'the solid thus produced was filtered to obtain 81 g (yield: 86%) of 2-methyl-acrylic acid 2,2_ represented by the formula [B] in the reaction scheme 2. Sodium difluoro-2-sulfopropyl ester (sodium 1,1-difluoro-3.(decyl propylene decyloxy)propane-1-sulfonate). The structure of the salt was determined by 1 H-NMR. b-NMR (DMSO, internal standard: tetradecyl sulphate): 5 (ppm) 1.91 (s, 3H), 3.3 (t, 2H), 4.57-4.67 (t, 2H), 5.77 (s, 1H), 6.11 (s, 1H). [Reaction Scheme 2]
NaO-S'CF2CH2CH2OHNaO-S'CF2CH2CH2OH
1) Et3N, 2) DMAP 3) MEHQ1) Et3N, 2) DMAP 3) MEHQ
MCMC
Na〇-S-CF2CH2CH2〇Na〇-S-CF2CH2CH2〇
[B] 其中在反應流程2中,玢表示乙基。 3 )2-曱基丙烯酸-2,2-二氟_2_磺基丙酯二苯甲基苯基銕鹽之 合成 將31克在化合物之合成實例2)中產生之2_甲基丙烯 酸-2,2-二氟-2-磺基丙酯鈉鹽(込丨·二氟_3_(曱基丙烯醯氧基) 丙烧-1-石黃酸納)及35克在下列反應流程3中由式[c:|表示 之二苯曱基苯基疏三氟曱烷锍鹽溶於3〇〇毫升二氯曱烷 (MC)及300毫升蒸餾水中,製得反應混合物,且在劇烈 攪拌下使反應混合物進行雙層反應達3小時。 在凡成授拌後’獲得有機層之等分試樣(aliqU〇t)以 26 201144265 38535pif 藉由19f-nmr檢驗反應程度,且終止反應。坎 / 收集反應混合液之有機層,且移除溶劑。使友反應後 良好溶劑)及己院(為不良溶劑)洗财機(為 劑而得晶體。 _,再移除溶 在減壓下乾燥如此所得之晶體,而獲得4 96〇/〇)之在下列反應流程3中由式[D]表示之 酸 -2,2-二氟-2-績基丙醋二笨甲基苯基疏鹽。藉由 定鹽之結構。 W-NMR (氯仿-d3,内標:四曱基石夕淀):^卯 % (s, 3H),2.43 (s,3H),3.3 (t,2H),4.82 (t,2H),5 6 6.22 (s,1H),7.43-7.80 (m,14H)。 ’ ’ [反應流程3] [Β] II Na〇j、g〆 0 F2[B] wherein in Reaction Scheme 2, hydrazine represents an ethyl group. 3) Synthesis of 2-mercaptoacrylic acid-2,2-difluoro-2-sulfopropyl ester benzhydryl phenyl sulfonium salt 31 g of 2-methacrylic acid produced in Synthesis Example 2) of the compound 2,2-Difluoro-2-sulfopropyl ester sodium salt (込丨·Difluoro_3_(mercaptopropenyloxy)propen-1-nart naphthalate) and 35 g in the following Reaction Scheme 3 The diphenyl phenyl phenyl trifluorodecane sulfonium salt represented by the formula [c:| is dissolved in 3 ml of dichloromethane (MC) and 300 ml of distilled water to prepare a reaction mixture under vigorous stirring. The reaction mixture was subjected to a two-layer reaction for 3 hours. An aliquot of the organic layer (aliqU〇t) was obtained after the mixing was carried out to determine the degree of reaction by 19f-nmr at 26 201144265 38535pif, and the reaction was terminated. The organic layer of the reaction mixture was collected and the solvent was removed. A good solvent after the reaction of the friend) and a hospital (which is a poor solvent) washing machine (crystals obtained as a solvent. _, and then remove the crystals obtained by drying under reduced pressure to obtain 4 96 〇 / 〇) In the following Reaction Scheme 3, the acid-2,2-difluoro-2-hydroxypropyl acetoacetate diphenylmethylphenyl salt represented by the formula [D]. By setting the structure of the salt. W-NMR (chloroform-d3, internal standard: tetradecyl sulphate): ^卯% (s, 3H), 2.43 (s, 3H), 3.3 (t, 2H), 4.82 (t, 2H), 5 6 6.22 (s, 1H), 7.43-7.80 (m, 14H). ’ ” [Reaction Scheme 3] [Β] II Na〇j, g〆 0 F2
聚合物之合成實例 (實例1) 作為用於聚合之單體’將13克丙稀酸2-曱基-2-金剛 烷酯、8.4克Γ丁内酯基甲基丙烯酸酯、11.6克曱基丙烯酸 3-經基-1-金剛烧酯及1克在上述反應流程3中由式[D]表示 之2-曱基丙稀酸-2,2_二氟-2-續基丙酯二苯甲基苯基銃鹽 溶於58克1,2-二氯乙烷中,由此製得單體混合液。 27 201144265 38535pif 將3.7克降冰片烯、2·5克偶氮二異丁腈(AIBN)(作 為聚合起始劑)及117克1,2-二氣乙烷(作為聚合溶劑) 添加至250毫升燒瓶中以提供反應浴,且將氮氣引入此反 應浴中。攪拌混合物1小時,同時將溫度維持在15〜25。〇 在反應浴之溫度處於65°C時,用1小時將上述單體 混合液緩慢逐滴添加至反應浴中,製得反應混合液,且使 反應混合液反應16小時。聚合反應完成後’將反應混合液 冷卻至15〜25°C,用己烷使反應產物沈澱,再過濾沈澱物。 用與過濾製程期間相同的溶劑洗滌沈澱物幾次,且在減壓 下乾餘由此所得之晶體’而得37克(產率:79¾)之 (11)表示之實例1之聚合物。在下式(11)表示之實例丨1 = 合物中,1=0.24,m=0.25,η=0·30,〇=0.20 且 p=〇 〇1。Λ人 實例1之聚合物具有1,190之聚苯乙烯換算重量 分子量(Mw)及1.57之分子量分佈(重量平均分子θ盥 數目平均分子量之比值,Mw/Mn)。 董〃、Synthesis Example of Polymer (Example 1) As a monomer for polymerization '13 g of 2-mercapto-2-adamantyl acrylate, 8.4 g of azlactone methacrylate, 11.6 g of fluorenyl group 3-Acetyl-1-adamantyl acrylate and 1 gram of 2-mercaptopropionic acid-2,2-difluoro-2-reverse propyl diphenyl represented by the formula [D] in the above Reaction Scheme 3 The methylphenylphosphonium salt was dissolved in 58 g of 1,2-dichloroethane, thereby preparing a monomer mixture. 27 201144265 38535pif Add 3.7 g of norbornene, 2.5 g of azobisisobutyronitrile (AIBN) as a polymerization initiator and 117 g of 1,2-diethane (as a polymerization solvent) to 250 ml A flask was provided to provide a reaction bath, and nitrogen gas was introduced into the reaction bath. The mixture was stirred for 1 hour while maintaining the temperature at 15 to 25. 〇 When the temperature of the reaction bath was 65 ° C, the above monomer mixture was slowly added dropwise to the reaction bath over 1 hour to prepare a reaction mixture, and the reaction mixture was allowed to react for 16 hours. After completion of the polymerization reaction, the reaction mixture was cooled to 15 to 25 ° C, and the reaction product was precipitated with hexane, and the precipitate was filtered. The precipitate was washed several times with the same solvent as during the filtration process, and the thus obtained crystal was dried under reduced pressure to give 37 g (yield: 793⁄4) of the polymer of Example 1 represented by (11). In the example 丨1 = compound represented by the following formula (11), 1 = 0.24, m = 0.25, η = 0.30, 〇 = 0.20, and p = 〇 〇1. The polymer of Example 1 has a polystyrene equivalent weight of 1,190, a molecular weight (Mw) and a molecular weight distribution of 1.57 (weight average molecular θ 数目 number average molecular weight ratio, Mw / Mn). Dong Wei,
(實例2) m 除了調整用於聚合之單體的個別用量來改變式(ι 、η、〇及p之值以外,以與實例丨相同之方^製造聚 28 201144265 38535pif 合物。實例2之聚合物之式(11)中丨、m yT 1 m、n、〇及p之值如 下:1=0.24,m=0.25,n=0.30,㈣s 0 υ.18 且 p=0.03。 (實例3) 除了調整用於聚合之單體的個別用量來改變式(⑴中 bm、η、。及p之值以外,以與實例i相同之方式製造聚 合物。實例3之聚合物之式⑼中i、m、n、〇及p之值如 下:1=0.24,m=0.25,η=0·30,〇=016 且 p==〇 〇5。 (實例4) ' 除了調整用於聚合之單體的個別用量來改變式(丨丨)中 1、m、η、〇及p之值以外’以與實例i相同之方式製造聚 合物。實例4之聚合物之式(11)中丨、m、n、〇及p之值如 下:1=0.24 ’ m=0.25,η=0.30,〇=〇·14 且 p==〇 〇7。 (比較例) 作為用於聚合之單體’混合10.0克甲基丙烯酸2_曱基 -2-金剛烧S曰、7.3克y-丁内S旨基曱基丙歸酸自旨及1〇 1克曱 基丙烯酸3-羥基-1-金剛烧酯,將混合物溶於克丨冬二 α惡烧中而製付早體混合液。將洛溫緩慢升至65〇C。 將3.7克降冰片稀、2.5克偶氮二異丁腈(aibn)(作 為聚合起始劑)及117克1,2-二氣乙院(作為聚合溶劑) 添加至250毫升燒瓶中來提供反應浴,且將氮氣引入此反 應浴中。攪拌混合物1小時,同時將溫度維持在15〜25°C。 在反應浴之溫度處於65°C時,用1小時將上述單體 混合液緩慢逐滴添加至反應浴中,而製得反應混合液,再 使反應混合液反應16小時。聚合反應完成後,將反應混合 29 201144265 38535pif 液冷卻至15〜25。(:,用己烷使反應產物沈澱,再過濾沈澱 物。用與過濾製程期間相同的溶劑洗滌沈澱物幾次,且^ 減壓下乾燥由此所得之晶體而得25克(產率:91%)之由 下式(12)表不之聚合物。 在下式(12)中,1=0.28,m=0.24,n=0.24 且 〇=〇 24。 下式(12)表示之聚合物具有1780之聚苯乙烯換算重 量平均分子量(Mw)及1.68之分子量分佈(Mw/Mn^*。(Example 2) m Poly 28 201144265 38535 pif was produced in the same manner as in Example 除了 except that the individual amounts of the monomers used for the polymerization were adjusted to change the values of the formulas (ι, η, 〇, and p). The values of 丨, m yT 1 m, n, 〇 and p in the formula (11) of the polymer are as follows: 1 = 0.24, m = 0.25, n = 0.30, (iv) s 0 υ.18 and p = 0.03. (Example 3) The polymer was produced in the same manner as in Example i except that the individual amounts of the monomers used for the polymerization were adjusted to change the values of bm, η, . and p in the formula (1). In the formula (9) of the polymer of Example 3, The values of m, n, 〇 and p are as follows: 1 = 0.24, m = 0.25, η = 0.30, 〇 = 016 and p = = 〇〇 5. (Example 4) 'In addition to adjusting the monomer used for polymerization The polymer was produced in the same manner as in Example i by varying the amount of 1, m, η, 〇 and p in the formula (丨丨). The polymer of the example 4 was in the formula (11), m, m, n The values of 〇, 〇 and p are as follows: 1 = 0.24 ' m = 0.25, η = 0.30, 〇 = 〇 · 14 and p = = 〇〇 7. (Comparative Example) As a monomer for polymerization 'mix 10.0 g of methyl group Acrylic acid 2_mercapto-2-golden S S, 7.3 g y-butyl The purpose of the S is to base the amino acid from the purpose and 1 〇 1 gram of 3-hydroxy-1-carbobutyl acrylate, the mixture is dissolved in the gram of the ketone, and the early mixture is prepared. The temperature is slowly increased to 65 ° C. 3.7 g of norbornene, 2.5 g of azobisisobutyronitrile (aibn) (as a polymerization initiator) and 117 g of 1,2-digas (as a polymerization solvent) are added. The reaction bath was supplied to a 250 ml flask, and nitrogen was introduced into the reaction bath. The mixture was stirred for 1 hour while maintaining the temperature at 15 to 25 ° C. When the temperature of the reaction bath was at 65 ° C, it was used for 1 hour. The above monomer mixture is slowly added dropwise to the reaction bath to prepare a reaction mixture, and the reaction mixture is reacted for 16 hours. After the polymerization is completed, the reaction mixture 29 201144265 38535 pif liquid is cooled to 15 to 25. (: The reaction product was precipitated with hexane, and the precipitate was filtered. The precipitate was washed several times with the same solvent as in the filtration process, and the crystals thus obtained were dried under reduced pressure to give 25 g (yield: 91%). In the following formula (12), 1 = 0.28, m = 0.24, n = 0. 24 and 〇 = 〇 24. The polymer represented by the following formula (12) has a polystyrene-equivalent weight average molecular weight (Mw) of 1780 and a molecular weight distribution of 1.68 (Mw/Mn^*).
製備光阻及特性評估 (實例1) 將每100重量份實例i之聚合物〇 75重量份之氮氧化 四曱銨作為鹼性添加劑溶於1000重量份丙二醇曱醚乙酸 酯,再以0.2微米膜濾器過濾溶液,而製得光阻液。 使用旋轉器將光阻液塗布至基板上,且在11〇C3C下乾 燥90秒’形成厚度〇.2微米之薄膜。使用ArF準分子雷射 步進器(透舰值孔徑:〇.75)使如此形成之薄膜曝光, 35在12〇〇C下對薄膜進行熱處理90秒。用2.38 wt%之 氫氧=四f财溶較軸處理之基錢影4()秒,並洗務 及乾燥基板。由此,即在基板均成了光阻圖案。 (實例2〜4) 201144265 38535pif 除了使用在聚合物之合成實例2〜4中合成之1〇〇重旦 份各聚合婦代製備組及特性評狀實例1之100重ί 份聚合物以外’以與製備光阻及特性評估之實例1中相^ 之方式形成光阻圖案,並評估光阻圖案之特性。 (比較例1〜3) 除了使用上式(12)表示之比較例之聚合物產生具有下 士 1所示組成的光阻液以外,以與製備光阻及特性評估之 貫例1相同之方式形成光阻圖案,並評估光阻圖案之特性。 [表1] 一 聚合物 酸產生劑(1) 驗性添加劑(2) 比較例1 100 3 1 _比較例2 100 5 1 比較例3 100 7 1 (含量:重量份數) 酸產生劑:九氟丁磺酸三苯基錡 C2)驗性添加劑:氫氧化四曱敍 在敏感度、解析度及LER方面對實例1〜4及比較例 1〜3之特性進行評估,結果列於下表2中。 在評估敏感度時,將能夠在顯影後形成具有1:1線寬 = 0.10微米線/間隔(L/S)圖案的曝光量定義為最佳曝光 里,且將最佳曝光量定義為敏感度。將此時解析出之最小 圖案尺寸定義為解析度。 藉由臨界尺寸掃描電子顯微法(CD SEM)量測LER, 且基於5個等級(例如1 (極差)、2 (差)、3 (中等)、4 31 201144265 38535pif (佳)及5 (極佳))來對評估結果進行評級。 [表2] 敏感度(毫焦耳/平方公分) 解析度(奈米) LER 實例1 15 70 4 實例2 18 70 4 實例3 15 90 4 實例4 13 70 5 比較例1 19 90 2 比較例2 17 80 3 比較例3 16 90 3 根據表2,實例1〜4相較於比較例1〜3 —般展現較佳 之敏感度,且亦展現較佳之解析度。尤其在LER之狀況 下,實例1〜4相較於比較例展現出優良得多之結果。 因而,已詳細描述本發明之較佳實施例,但本發明之 範疇不意欲限於此,且可由一般技術者使用如下列申請專 利範圍中所定義之本發明基本概念作出之各種修改及改良 亦包含於本發明之範疇内。 32Preparation of photoresist and property evaluation (Example 1) Each 100 parts by weight of the polymer of Example i, 75 parts by weight of tetraammonium oxynitride was dissolved as a basic additive in 1000 parts by weight of propylene glycol oxime ether acetate, and then 0.2 micron. A membrane filter was used to filter the solution to prepare a photoresist. The photoresist was applied to the substrate using a spinner and dried at 11 ° C 3 C for 90 seconds to form a film having a thickness of 2 2 μm. The film thus formed was exposed using an ArF excimer laser stepper (transparent aperture: 〇.75), and the film was heat treated at 12 ° C for 90 seconds. The substrate was treated with 2.38 wt% of hydrogen and oxygen = 4% of the solvent, and the substrate was washed and dried. Thus, the substrate is a photoresist pattern. (Examples 2 to 4) 201144265 38535pif In addition to the use of the polymer synthesized in Examples 2 to 4 of the polymer synthesis, each of the polymeric maternal preparation groups and the characteristics of the sample 1 of 100 weights of the polymer were A photoresist pattern was formed in the same manner as in Example 1 for preparing photoresist and property evaluation, and the characteristics of the photoresist pattern were evaluated. (Comparative Examples 1 to 3) The same procedure as in Example 1 for preparing photoresist and property evaluation was carried out except that the polymer of the comparative example represented by the above formula (12) was used to produce a photoresist having the composition shown in Corporal 1. The photoresist pattern is evaluated and the characteristics of the photoresist pattern are evaluated. [Table 1] A polymer acid generator (1) Ancillary additive (2) Comparative Example 1 100 3 1 - Comparative Example 2 100 5 1 Comparative Example 3 100 7 1 (content: parts by weight) Acid generator: Nine Triphenyl sulfonium fluorobutane C2) Ingredient Additive: The characteristics of Examples 1 to 4 and Comparative Examples 1 to 3 were evaluated in terms of sensitivity, resolution and LER. The results are shown in Table 2 below. in. When evaluating sensitivity, it is possible to define an exposure amount with a 1:1 line width = 0.10 μm line/space (L/S) pattern after development as the optimum exposure, and define the optimum exposure amount as the sensitivity. . The minimum pattern size resolved at this time is defined as the resolution. LER is measured by critical dimension scanning electron microscopy (CD SEM) and is based on 5 grades (eg 1 (very poor), 2 (poor), 3 (medium), 4 31 201144265 38535pif (good) and 5 ( Excellent)) to rate the results of the assessment. [Table 2] Sensitivity (mJ/cm^2) Resolution (nano) LER Example 1 15 70 4 Example 2 18 70 4 Example 3 15 90 4 Example 4 13 70 5 Comparative Example 1 19 90 2 Comparative Example 2 17 80 3 Comparative Example 3 16 90 3 According to Table 2, Examples 1 to 4 exhibited better sensitivity than Comparative Examples 1 to 3, and also exhibited better resolution. Particularly in the case of LER, Examples 1 to 4 exhibited much superior results compared to the comparative examples. Therefore, the preferred embodiments of the present invention have been described in detail, but the scope of the present invention is not intended to be limited thereto, and various modifications and improvements may be made by those skilled in the art using the basic concepts of the invention as defined in the following claims. Within the scope of the invention. 32
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KR100823058B1 (en) * | 2006-11-15 | 2008-04-18 | 금호석유화학 주식회사 | Polymer for chemical-amplified photoresist, chemical-amplified photoresist composition containing it, and patterning method of chemical-amplified photoresist using the composition |
KR101378765B1 (en) * | 2007-05-30 | 2014-03-28 | 주식회사 동진쎄미켐 | Monomer for photoresist having photoacid generator, polymer thereof and photoresist composition including the same |
JP5201363B2 (en) * | 2008-08-28 | 2013-06-05 | 信越化学工業株式会社 | Sulfonium salt and polymer compound having polymerizable anion, resist material and pattern forming method |
JP5841707B2 (en) * | 2008-09-05 | 2016-01-13 | 富士フイルム株式会社 | Positive resist composition, pattern forming method using the composition, and resin used in the composition |
KR101054485B1 (en) * | 2008-09-23 | 2011-08-04 | 금호석유화학 주식회사 | Onium salt compound, a polymer compound comprising the same, a chemically amplified resist composition comprising the polymer compound and a pattern forming method using the composition |
KR20100036827A (en) * | 2008-09-30 | 2010-04-08 | 금호석유화학 주식회사 | Polymer for resist and resist composition manufactured by using the same |
JP5415982B2 (en) * | 2010-02-09 | 2014-02-12 | 信越化学工業株式会社 | Resist underlayer film material, pattern formation method |
-
2010
- 2010-06-10 KR KR1020100054762A patent/KR101184901B1/en active IP Right Grant
-
2011
- 2011-06-08 SG SG2011041647A patent/SG177080A1/en unknown
- 2011-06-08 TW TW100119974A patent/TWI465418B/en active
- 2011-06-09 JP JP2011128891A patent/JP5576829B2/en active Active
- 2011-06-10 CN CN201110165111.4A patent/CN102311371B/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI636974B (en) * | 2012-10-17 | 2018-10-01 | 錦湖石油化學股份有限公司 | Onium salt compound, acid amplifier derived therefrom, resist composition comprising same and method for forming resist pattern |
Also Published As
Publication number | Publication date |
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KR101184901B1 (en) | 2012-09-20 |
JP2011256390A (en) | 2011-12-22 |
SG177080A1 (en) | 2012-01-30 |
KR20110135049A (en) | 2011-12-16 |
TWI465418B (en) | 2014-12-21 |
CN102311371A (en) | 2012-01-11 |
CN102311371B (en) | 2014-12-10 |
JP5576829B2 (en) | 2014-08-20 |
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