201142413 . 六、發明說明： 【發明所屬之技術領域】 ' 本發明係有關於一種觸控面板，特別是關於一種加強 觸控面板接合強度的堆疊結構及其製造方法。 【先前技術】 觸控顯示器逐漸普遍應用於各類電子裝置中，例如可 攜式或掌上型電子裝置。觸控顯示器是將觸控技術（例如 ® 電阻式、電容式觸控技術）與顯示器予以結合的一種應用 技術。由於近年來液晶顯示器（LCD)技術的成熟發展， 因此將觸控技術結合於液晶顯示器乃成為一種趨勢。 在觸控顯示器中，除了上述的液晶顯示器外，尚需一 觸控面板的配合，藉此組立而形成所謂的觸控顯示器。常 見的觸控面板包含一支撐感測電極用的基板以及一可提 供防刮、防眩光或防反射等功能的保護基板。製造此類觸 φ 控面板時，需於兩片基板上分別配置些許觸控組件再予以 結合，例如，在支撐基板上尚需配置導電線路與軟性電路 板，而在保護基板上則會塗上遮蔽材料，以遮蔽該些導電 線路與軟性電路板。 而在結合上述的支撐基板與保護基板時，會使用一種 液態膠進行黏結工作，但因保護基板上具有遮蔽材料，而 無法由保護基板的正面照射液態膠進行固化，而從支撐基 板的背面照射液態膠，則因導電線路與軟性電路板的遮蔽 而無法固化，因此造成部分的液態膠無法固化，不僅降低 iS] 3 201142413 . 支撐基板與保護基板的接合強度，且造成液態膠中的酸性 物質腐蝕掉上述的觸控組件。 4 因此，亟需提出一種可以加強觸控面板接合強度的堆 ' 疊結構。 【發明内容】 鑒於上述，本發明實施例的目的之一在於提出一種加 強觸控面板接合強度的堆疊結構及其製造方法，不僅可加 強觸控面板内部的接合強度，且可使液態黏結材料固化而 不具酸性腐蚀性。 根據本發明實施例所揭露之一種加強觸控面板接合 強度的堆疊結構，其包括：一觸控基板、一鏡面基板、一 反射層與一黏結層。其中，該觸控基板具有一接合區，在 該接合區設置有一電性組件；該鏡面基板與該觸控基板相 對間隔設置且具有一第一周邊區，該第一周邊區對應於該 籲接合區，且在該第一周邊區形成有一第一遮蔽層；該反射 層在相對於該電性組件的位置形成於該第一遮蔽層上；以 及該黏結層是分佈形成於該電性組件與該反射層之間，該 黏結層的形成，是由液態黏結材料從液態轉化為固態而形 成，並在固態的狀況下加強該鏡面基板與該觸控基板的結 合強度。 根據本發明實施例所揭露之一種加強觸控面板接合 強度的堆疊結構的製造方法，包括如下步驟：提供一具有 一第一周邊區的鏡面基板，在該第一周邊區上形成一第一 [S] 4 201142413 、遮蔽層’在該第-遮蔽層上形成一反射層。提供一具有〆 •與鮮-周邊區對應的接合區的觸控基板，且該接合區設 有電性、"且件0將該觸控基板與該鏡面基板相對間隔設 置’並使該反射層與該電性組件的位置對應。至少在該反 射層與電性組件之間佈設液態黏結材料，使用外部光源從 觸控基板外側照射該反射層’利用反射光使液態黏結材料 固化而形成一黏結層。 _ 本發明的黏結層的材料在通常情況下為液態，經過反 射層的光照射後’會使得原本遭遮蔽的液態黏結材料呈現 固化’進一步使得該鏡面基板與該觸控基板結合時，達到 充分的接合強度，且液態黏結材料在固化後不致腐蝕遮蔽 層與電性組件等觸控組件。 【實施方式】 圖1與圖2分別顯示本發明第一實施例之加強觸控面 _板接合強度的部份堆疊結構，其中圖1是顯示堆疊結構中 的鏡面基板10上視圖，而圖2是堆疊結構中的觸控基板 20上視圖。 由於需分別在鏡面基板10與觸控基板20上配置些許 觸控組件以達到觸控與外型美觀功能，因此在本實施例之 堆疊結構中所包括的觸控基板20,其具有一接合’在 該接合區F間設置有一電性組件210，該電性組件210包 括一導電層212與一軟性電路板214，且該導電層212與 該軟性電路板214彼此電性連接。另外，在觸控顯示區D 151 5 201142413 中則佈設複數個感測電極（未繪示以簡化圖式），該些感測 電極會與該電性紅件21〇電性連接，以作為觸控訊號感測 後傳輸之用，進而達到觸控功能。 在本實施例之堆疊結構中所包括的鏡面基板10,該 鏡面基板10與觸控基板20相對間隔設置且具有一第一厨 邊區A，該第一周邊區A對應於上述的接合區F，且在第 一周邊區A形成有ϋ㈣12G(以左上右下的斜線 表示），該第一遮蔽層120從使用者的使用角度，會遮蔽 觸控基板20的接合區F，藉此遮蔽該些電性元件（如電 性組件210等）而達到外型美觀功能。該鏡面基板的 外表面（即接爻使用者觸碰的表面）尚可以塗佈形成防 刮、防眩光及/或防反射層之保護I藉此形成具有保護 功能的基板。 、在鏡面基板10上且相對於電性組件210的位置，形 成了反射層no於第一遮蔽層120上，其中該反射層ιι〇 可以蒸鍍、濺鍍、電鍍或印刷製程方式形成。 在組立過程十，需利用一液態黏結材料的黏性，使其 轉變成固態的狀況下形成黏結層，加強該鏡面基板 :觸 =板的結合強度，且不致腐钱遮蔽層與電性組件 等觸控組件。以下將會詳加揭露黏結層的佈設與作用。 圖3與圖4分別顯示本發明第一 堆疊結構的組立上視圖與:二：強：： 圖4疋依據圖3的G1-G2剖面線而繪示。 、 201142413 在貼合組立過程中，所使用的黏結層30，是分佈形 成於電性組件210與反射層Π0之間，由於本發明所揭露 之黏結層3 0可以是由·一種光固化型的液態黏結材料形 成，因此黏結層30的固化作業，是反射層11〇藉由—具 有激發固化能量的外部光源4 0照射而將該外部光源4 〇反 射入黏結層30所在位置’進而使液態黏結材料從液態轉 變成固態’不僅加強原本在鏡面基板10與觸控基板20之 間被遮蔽區域的結合強度，且使黏結層30本身在固化狀 態下不具酸性腐餘性。亦即透過反射層11〇的形成，可以 擴大外部光源的照射範圍’進而使被第一遮蔽層120與電 性組件210遮蔽的黏結層30達到固化黏結的目的。 其中圖3與圖4是從觸控面板的底面依序纷示，因此 在鏡面基板10的第一周邊區Α中，由上而下的組立結構 層為觸控基板20、電性組件210、黏結層30、反射層11〇、 第一遮蔽層120以及鏡面基板10。 請再次合併參考圖1〜圖4 ’除上述（鏡面基板1〇的） 第一周邊區A及其所涵蓋的（觸控基板20的）接合區F 外’鏡面基板10尚具有一第二周邊區B，是相對於觸控 基板20的非接合區E。由於在非接合區E的部分，亦會 有佈設導電層的可能性’因此在該第二周邊區B亦會形成 有一第二遮蔽層130(如圖中右上左下的斜線區域所表示） 來進行遮蔽。該第二遮蔽層130可以與該第一遮蔽層12〇 同時形成於鏡面基板10上，且液態黏結材料在該第二周 邊區B是分佈形成於第二遮蔽層13〇與觸控基板2〇之間 r 7 201142413 . 並進行固化而形成黏結層30。另外，鏡面基板ι〇尚具有 一觸控顯示區C，是相對於觸控基板20的觸控顯示區D， 液態黏結材料在觸控顯示區C與觸控顯示區D的位置是分 ' 佈形成於觸控基板20與鏡面基板1〇之間並進行固化而形 成黏結層30。 在上述第二周邊區B與觸控顯示區c所涵蓋的觸控基 板20範圍，由於少有遮蔽組件，因此可從觸控基板2〇上 籲方直接以外部光源40對液態黏結材料進行光固化作業而 形成黏結層30。另外，在觸控基板2〇的接合區f中未被 電性組件210所遮蔽的區域，亦因少有遮蔽元件而使得液 態黏結材料在此區域可分佈形成於第一遮蔽層12〇與觸 控基板20之間並進行固化黏結而形成黏結層3〇。201142413. VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a touch panel, and more particularly to a stacked structure for enhancing the bonding strength of a touch panel and a method of fabricating the same. [Prior Art] Touch displays are increasingly used in various types of electronic devices, such as portable or handheld electronic devices. A touch display is an application technology that combines touch technology (such as ® resistive and capacitive touch technology) with a display. Due to the mature development of liquid crystal display (LCD) technology in recent years, the integration of touch technology into liquid crystal displays has become a trend. In the touch display, in addition to the liquid crystal display described above, a touch panel is required to form a so-called touch display. A commonly used touch panel includes a substrate for supporting a sensing electrode and a protective substrate that provides functions such as scratch resistance, glare prevention, or anti-reflection. When manufacturing such a touch panel, a plurality of touch components are separately disposed on the two substrates, for example, a conductive circuit and a flexible circuit board are required on the support substrate, and the protective substrate is coated on the protective substrate. Masking material to shield the conductive lines from the flexible circuit board. When the support substrate and the protective substrate are combined, a liquid glue is used for bonding work. However, since the protective substrate has a shielding material, the liquid substrate cannot be cured by the front surface of the protective substrate, and the back surface of the support substrate is irradiated. The liquid glue cannot be cured due to the shielding of the conductive circuit and the flexible circuit board, so that some of the liquid glue cannot be cured, which not only reduces the iS] 3 201142413. The bonding strength between the support substrate and the protective substrate, and the acidic substance in the liquid glue Corroding the above touch components. 4 Therefore, it is urgent to propose a stack structure that can enhance the bonding strength of the touch panel. SUMMARY OF THE INVENTION In view of the above, one of the objects of the embodiments of the present invention is to provide a stacked structure for enhancing the bonding strength of a touch panel and a manufacturing method thereof, which not only can strengthen the bonding strength inside the touch panel, but also can cure the liquid bonding material. Not acidic and corrosive. A stack structure for enhancing the bonding strength of a touch panel according to an embodiment of the invention includes: a touch substrate, a mirror substrate, a reflective layer and a bonding layer. The touch substrate has a bonding region, and an electrical component is disposed in the bonding region; the mirror substrate is spaced apart from the touch substrate and has a first peripheral region, wherein the first peripheral region corresponds to the bonding a first shielding layer is formed on the first peripheral region; the reflective layer is formed on the first shielding layer at a position relative to the electrical component; and the bonding layer is distributed on the electrical component and Between the reflective layers, the formation of the adhesive layer is formed by converting the liquid bonding material from a liquid state to a solid state, and strengthening the bonding strength between the mirror substrate and the touch substrate in a solid state. A method for fabricating a stacked structure for enhancing joint strength of a touch panel according to an embodiment of the invention includes the steps of: providing a mirror substrate having a first peripheral region, and forming a first surface on the first peripheral region [ S] 4 201142413, the shielding layer 'forms a reflective layer on the first shielding layer. Providing a touch substrate having a bonding area corresponding to the surrounding area, and the bonding area is provided with an electrical property, and the component 0 is disposed opposite to the mirror substrate and making the reflection The layer corresponds to the location of the electrical component. At least a liquid bonding material is disposed between the reflective layer and the electrical component, and the reflective layer is irradiated from the outside of the touch substrate using an external light source. The liquid bonding material is cured by the reflected light to form a bonding layer. _ The material of the adhesive layer of the present invention is normally liquid, and after the light of the reflective layer is irradiated, the liquid conductive material which is originally shielded is cured, and the mirror substrate is fully combined with the touch substrate. The bonding strength, and the liquid bonding material does not corrode the touch component such as the shielding layer and the electrical component after curing. 1 and 2 respectively show a partial stacking structure of a reinforced surface of a touch panel and a panel according to a first embodiment of the present invention, wherein FIG. 1 is a top view showing a mirror substrate 10 in a stacked structure, and FIG. 2 It is a top view of the touch substrate 20 in the stacked structure. Therefore, the touch substrate 20 included in the stacked structure of the embodiment has a bonding function because a plurality of touch components are disposed on the mirror substrate 10 and the touch substrate 20 to achieve a touch and appearance function. An electrical component 210 is disposed between the junction regions F. The electrical component 210 includes a conductive layer 212 and a flexible circuit board 214, and the conductive layer 212 and the flexible circuit board 214 are electrically connected to each other. In addition, a plurality of sensing electrodes (not shown to simplify the drawing) are disposed in the touch display area D 151 5 201142413, and the sensing electrodes are electrically connected to the electrical red piece 21 to serve as a touch The control signal is transmitted after sensing, and then the touch function is achieved. The mirror substrate 10 is included in the stack structure of the present embodiment. The mirror substrate 10 is spaced apart from the touch substrate 20 and has a first kitchen edge area A. The first peripheral area A corresponds to the above-mentioned joint area F. And forming a 四 (4) 12G (indicated by a diagonal line on the upper left and the lower right) in the first peripheral area A, the first shielding layer 120 shielding the junction area F of the touch substrate 20 from the use angle of the user, thereby shielding the electricity Sexual components (such as electrical components 210, etc.) to achieve a beautiful appearance. The outer surface of the mirror substrate (i.e., the surface that is in contact with the user) can be coated with a protective layer of a scratch-resistant, anti-glare, and/or anti-reflective layer to form a substrate having a protective function. On the mirror substrate 10 and relative to the position of the electrical component 210, a reflective layer no is formed on the first shielding layer 120, wherein the reflective layer is formed by evaporation, sputtering, electroplating or printing. In the assembly process ten, it is necessary to utilize the viscosity of a liquid bonding material to form a bonding layer under the condition of being transformed into a solid state, and to strengthen the bonding strength of the mirror substrate: the touch panel, and the corrosion-free shielding layer and electrical components are not required. Touch component. The layout and function of the bonding layer will be disclosed in detail below. 3 and 4 respectively show the assembled upper view of the first stacked structure of the present invention and the following: 2: Strong:: Figure 4 is shown in accordance with the G1-G2 hatching of Figure 3. 201142413 In the process of bonding assembly, the bonding layer 30 used is distributed between the electrical component 210 and the reflective layer ,0. The bonding layer 30 disclosed in the present invention may be a photocurable type. The liquid bonding material is formed. Therefore, the curing operation of the bonding layer 30 is performed by the reflective layer 11 being irradiated by the external light source 40 having the excitation curing energy to reflect the external light source 4 into the position of the bonding layer 30. The transition of the material from a liquid state to a solid state not only enhances the bonding strength of the masked region between the mirror substrate 10 and the touch substrate 20, but also makes the bonding layer 30 itself not have an acidic rot in the cured state. That is, through the formation of the reflective layer 11A, the irradiation range of the external light source can be enlarged, and the bonding layer 30 shielded by the first shielding layer 120 and the electrical component 210 can be cured and bonded. 3 and FIG. 4 are sequentially arranged from the bottom surface of the touch panel. Therefore, in the first peripheral region of the mirror substrate 10, the upper and lower assembled structural layers are the touch substrate 20 and the electrical component 210. The bonding layer 30, the reflective layer 11A, the first shielding layer 120, and the mirror substrate 10. Please refer to FIG. 1 to FIG. 4 again. In addition to the above (the mirror substrate 1) first peripheral area A and the covered area (of the touch substrate 20), the mirror substrate 10 has a second periphery. The area B is a non-joining area E with respect to the touch substrate 20. Since there is a possibility of arranging a conductive layer in the portion of the non-joining region E, a second shielding layer 130 (shown as a diagonal line in the upper right and lower left in the figure) is also formed in the second peripheral region B. Shaded. The second shielding layer 130 can be formed on the mirror substrate 10 simultaneously with the first shielding layer 12 , and the liquid bonding material is distributed on the second shielding layer 13 and the touch substrate 2 . The adhesive layer 30 is formed by curing between r 7 201142413 . In addition, the mirror substrate ι has a touch display area C, which is relative to the touch display area D of the touch substrate 20, and the position of the liquid bonding material in the touch display area C and the touch display area D is divided into The touch substrate 30 is formed between the touch substrate 20 and the mirror substrate 1A to form a bonding layer 30. In the range of the touch substrate 20 covered by the second peripheral area B and the touch display area c, since there is little shielding component, the liquid bonding material can be directly lighted by the external light source 40 from the touch substrate 2 The bonding layer 30 is formed by a curing operation. In addition, in the area of the bonding area f of the touch substrate 2 that is not covered by the electrical component 210, the liquid bonding material is distributed in the first shielding layer 12 and the touch in this area due to the lack of shielding elements. The control substrates 20 are cured and bonded to form a bonding layer 3 .
{ SI 圖5顯示本發明第二實施例之加強觸控面板接合強 度的堆疊結構的剖面示意圖，其是依據類似圖3的G1_G2. 剖面線而繪示。與第一實施例（圖4所示）的差異在於本實 鲁施例之鏡面基板1〇上所形成的反射層11〇，是全面分佈 形成於第一遮蔽層12〇與第二遮蔽層13〇上，因此黏結層 30在本實施例中會在第—周邊區A巾相對於該電性組件 210的位置是分佈形成於電性組件21〇與反射層11〇之 間’在非相對於該電性組件210的位置是分佈形成於反射 層110’與觸控基板20之間；在第二周邊區B _分佈形 成於觸控基板20與反射層11〇，之間；鏡面基板1〇尚具 有-觸控顯示區C，是相對於觸控基板2〇的觸控顯示區 D’黏結層30在觸控顯示區c與觸控顯示區D的位置是分 8 201142413 佈形成於觸控基板20與鏡面基板ι〇之間，在這些區域 中，黏結層30的形成，是同時對液態黏結材料進行固化 作業，而使液態黏結材料從液態轉化為固態而形成黏結層 30。 以上圖式所揭露的元件尺寸，乃為方便解說而有異於 實際產品，實際尺寸仍以產品設計為主，例如鏡面基板 10的第一周邊區A與觸控基板20的接合區F範圍，會因 應產品設計而小於圖示所揭露，而鏡面基板1〇的觸控顯 籲示區C亦會因應產品設計上的方便，而小於觸控基板20 的觸控顯示區D。 在上述實施例中所提及之觸控基板20與鏡面基板1〇 的構成材料’可包括玻璃材質或其他可提供類似功能的材 質。另，上述所使用的外部光源40可以是一種紫外光（UV light)或是具有足夠激發固化能量之其他光源，因此上述 之黏結層30可由一種紫外光型的光固化液態黏結材料形 肇成，或是由因應其他光源的光固化液態黏結材料形成，且 黏結層30可以是以膠體的形式形成。而在上述實施例中 形成的反射層材料可包括鋁、鉻、銀或鈦等金屬，或是與 該些金屬類似性質的材料，也可以是與該些金屬相對應的 氧化物或氮化物’或是與該些氧化物或氮化物類似的化合 物。 以下以一個實施例的完整流程說明製造該堆疊結構 的方法，包括如下步驟：提供一具有一第一周邊區的鏡面 基板；在該第一周邊區上形成一第一遮蔽層；在該第一遮[ς] 9 201142413 . 蔽層上形成一反射層；提供一具有一與該第一周邊區對應 的接合區的觸控基板，且該接合區設有一電性組件；將該 • 觸控基板與該鏡面基板相對間隔設置’並使該反射層與該 • 電性組件的位置對應；至少在該反射層與電性組件之間佈 設液態黏結材料；使用外部光源從觸控基板外侧照射該反 射層，利用反射光使液態黏結材料固化而形成一黏結層。 其中，反射層可以蒸鍍、濺鍍、電鍍或印刷製程方式形成。 反射層的材料可包括銘、絡、銀或欽等金屬’或是與該些 _ 金屬類似性質的材料，也可以是與該些金屬相對應的氧化 物或氮化物，或是與該些氧化物或氮化物類似的化合物。 在一較佳實施例中，上述之外部光源是一種紫外光或 具有足夠激發固化能量之其他光源。而液態黏結材料是因 應該紫外光或其他光源而固化的材料。 在該第一周邊區上形成一第一遮蔽層的同時，還包括 在第二周邊區上形成一第二遮蔽層，並且在該第二遮蔽層 Φ與觸控基板之間佈設液態黏結材料，同樣利用外部光源從 觸控基板外側照射而進一步固化為黏結層。 在另一較佳實施例中，在該第一遮蔽層上形成一反射 層的同時，還在該第二遮蔽層上形成反射層。此外，在非 相對於該電性組件的位置，在該第一遮蔽層的與觸控基板 之間一併佈設液態黏結材料同樣利用外部光源從觸控基 板外侧照射而進一步固化為黏結層。 該製造方法還可進一步包括：在該鏡面基板的外表面 ' 形成一透明的保護層。 10 201142413 以上所述僅為本發明之較佳實施例而已，並非用以限 定本發明之申請專利範圍；凡其它未脫離發明所揭示之精 神下所完成之等效改變或修飾，均應包含在下述之申請專 利範圍内。 【圖式簡單說明】 圖1顯示本發明第一實施例之加強觸控面板接合強 度的堆疊結構的鏡面基板上視圖。 圖2顯示本發明第一實施例之加強觸控面板接合強 度的堆疊結構的觸控基板上視圖。 圖3顯示本發明第一實施例之加強觸控面板接合強 度的堆疊結構的組立上視圖。 圖4顯示本發明第一實施例之加強觸控面板接合強 度的堆疊結構的剖面示意圖，其是依據圖3的G卜G2剖面 線而纟會示。 圖5顯示本發明第二實施例之加強觸控面板接合強 度的堆疊結構的剖面示意圖，其是依據類似圖3的G1-G2 剖面線而繪示。 【主要元件符號說明】 10:鏡面基板 110、110’ ：反射層 [S] 120:第一遮蔽層 130:第二遮蔽層 11 201142413 . 20:觸控面板 210:電性組件 ' 212:導電層 ' 214:軟性電路板 30:黏結層 40:外部光源 A:(鏡面基板的）第一周邊區 B··(鏡面基板的）第二周邊區 ® C:(鏡面基板的）觸控顯示區 D:(觸控基板的）觸控顯示區 E:(觸控基板的）非接合區 F:(觸控基板的）接合區 [si 12{SI Figure 5 is a cross-sectional view showing a stacked structure for enhancing the bonding strength of the touch panel according to the second embodiment of the present invention, which is shown in a line similar to the G1_G2. The difference from the first embodiment (shown in FIG. 4 ) is that the reflective layer 11 形成 formed on the mirror substrate 1 本 of the embodiment of the present invention is integrally distributed on the first shielding layer 12 〇 and the second shielding layer 13 . In the present embodiment, the bonding layer 30 is distributed between the electrical component 21 and the reflective layer 11 在 in the position of the first peripheral region A relative to the electrical component 210 in this embodiment. The position of the electrical component 210 is distributed between the reflective layer 110 ′ and the touch substrate 20 ; the second peripheral region B _ is distributed between the touch substrate 20 and the reflective layer 11 ;; the mirror substrate 1 〇 The touch display area C is a touch display area D relative to the touch substrate 2 ′. The position of the adhesive layer 30 in the touch display area c and the touch display area D is 8 201142413. Between the substrate 20 and the mirror substrate ι, in these regions, the adhesive layer 30 is formed by simultaneously curing the liquid bonding material, and converting the liquid bonding material from a liquid state to a solid state to form the bonding layer 30. The dimensions of the components disclosed in the above figures are different from actual products for convenience of explanation, and the actual dimensions are still mainly based on product design, for example, the range of the bonding area F of the first peripheral area A of the mirror substrate 10 and the touch substrate 20, In view of the product design, the touch display area C of the mirror substrate 1 is smaller than the touch display area D of the touch substrate 20 in response to the convenience of product design. The constituent material ' of the touch substrate 20 and the mirror substrate 1 提及 mentioned in the above embodiments may include a glass material or other material which can provide a similar function. In addition, the external light source 40 used above may be a kind of ultraviolet light or other light source having sufficient excitation curing energy, so that the above-mentioned adhesive layer 30 may be formed by an ultraviolet light type photocurable liquid bonding material. Or formed by a photocurable liquid bonding material in response to other light sources, and the bonding layer 30 may be formed in the form of a colloid. The reflective layer material formed in the above embodiments may include metals such as aluminum, chromium, silver or titanium, or materials having properties similar to those of the metals, or oxides or nitrides corresponding to the metals. Or a compound similar to the oxides or nitrides. The method for fabricating the stacked structure is described below in a complete flow of an embodiment, comprising the steps of: providing a mirror substrate having a first peripheral region; forming a first shielding layer on the first peripheral region; a cover layer is formed on the cover layer; a touch substrate having a joint area corresponding to the first peripheral area is provided, and the joint area is provided with an electrical component; the touch substrate is Oppositely spaced from the mirror substrate, and corresponding to the position of the reflective layer and the electrical component; at least a liquid bonding material is disposed between the reflective layer and the electrical component; and the external light source is used to illuminate the reflection from the outside of the touch substrate The layer uses the reflected light to solidify the liquid bonding material to form a bonding layer. Wherein, the reflective layer can be formed by evaporation, sputtering, electroplating or printing process. The material of the reflective layer may include metals such as Ming, Luo, Yin or Qin, or materials having properties similar to those of the metal, or oxides or nitrides corresponding to the metals, or with the oxidation. A compound similar to a nitride or a nitride. In a preferred embodiment, the external source is an ultraviolet light or other source having sufficient excitation energy for excitation. Liquid bonding materials are materials that cure due to UV light or other light sources. Forming a first shielding layer on the first peripheral region, further comprising forming a second shielding layer on the second peripheral region, and arranging a liquid bonding material between the second shielding layer Φ and the touch substrate. The external light source is also irradiated from the outside of the touch substrate to further cure into a bonding layer. In another preferred embodiment, a reflective layer is formed on the first shielding layer while a reflective layer is formed on the second shielding layer. In addition, the liquid bonding material disposed between the first shielding layer and the touch substrate is also irradiated from the outside of the touch substrate by the external light source to further solidify into a bonding layer at a position other than the electrical component. The manufacturing method may further include: forming a transparent protective layer on the outer surface of the mirror substrate. 10 201142413 The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention; all other equivalent changes or modifications which are not departing from the spirit of the invention should be included. Within the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a top plan view showing a mirror substrate of a stacked structure for enhancing the bonding strength of a touch panel according to a first embodiment of the present invention. 2 is a top view of a touch substrate of a stacked structure for enhancing the bonding strength of a touch panel according to a first embodiment of the present invention. Fig. 3 is a view showing a stacked upper view of a stacking structure for reinforcing the bonding strength of the touch panel according to the first embodiment of the present invention. Fig. 4 is a cross-sectional view showing the stacking structure for enhancing the bonding strength of the touch panel according to the first embodiment of the present invention, which is shown in accordance with the Gb G2 cross-section of Fig. 3. Fig. 5 is a cross-sectional view showing a stacking structure for reinforcing the bonding strength of a touch panel according to a second embodiment of the present invention, which is shown in a line similar to the G1-G2 hatching of Fig. 3. [Major component symbol description] 10: Mirror substrate 110, 110': reflective layer [S] 120: first shielding layer 130: second shielding layer 11 201142413 . 20: touch panel 210: electrical component '212: conductive layer ' 214: Flexible circuit board 30: Bonding layer 40: External light source A: First peripheral area B (of the mirror substrate) B. (of the mirror substrate) Second peripheral area C: (Mirror substrate) Touch display area D : (touch substrate) touch display area E: (touch substrate) non-joining area F: (touch substrate) joint area [si 12