201141645 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種對被加工物照射雷射光，而對被加 、 工物進行開孔加工的雷射加工方法及雷射加工機。 【先前技術】 * 雷射加工機係例如對被加工物照射雷射光，而對被加 工物進行開孔加工的裝置。就藉由雷射加工機予以開孔的 被加工物而言，有一種係為具有銅箔（導體層）、樹脂（絕緣 層）、銅箔（導體層）的三層構造的印刷線路板。在對如此的 印刷線路板進行貫通孔加工時，若僅從印刷線路板的表面 側（單面）照射雷射光，則無法使雷射光到達印刷線路板的 背面側的銅箔。因此，要對印刷線路板進行穩定的貫通孔 加工甚為困難。 就對印刷線路板進行穩定的雷射加工的方法而言，有 從表面及背面兩面進行雷射光照射的方法。於該雷射加工 方法中，係對於印刷線路板從表面照射雷射光而形成到達 半途的孔，並在之後從印刷線路板的背面照射雷射光以形 成貫通孔（參照例如專利文獻1)。 (先前技術文獻） (專利文獻） 專利文獻1 :日本特開2003-218539號公報 【發明内容】 (發明所欲解決之課題） 然而，於上述習知的技術中，在從表面（一邊的主面 4 322483 201141645 側）照射雷射光之後，從背面（另一邊的主面側）照射雷射光 時，無法將背面側的銅箔（導體層）穩定的加以去除。 本發明係有鑑於前述之問題所開發者.，其目的為得到 - 一種用以對被加工物穩定的形成貫通孔的雷射加工方法及 „ 雷射加工機。 (解決課題的手段） 為解決上述的課題並達成目的，本發明的雷射加工方 法係於具有絕緣層、隔著該絕緣層而層積的表面之導體 層、以及背面之導體層的層積材料的被加工物照射雷射 光，而將前述表面之導體層、前述絕緣層及前述背面之導 體層予以去除，以對前述被加工物進行貫通孔加工之層積 材料的雷射加工方法中，包含下列步驟：第一加工步驟， 係從前述被加工物的一邊的主面側以第一能量密度照射雷 射光，以將前述一邊的主面側之導體層予以去除，而形成 加工孔直到前述絕緣層的厚度方向的中途位置；以及第二 加工步驟，從前述被加工物的另一邊的主面侧對前述加工 孔的位置以第二能量密度照射雷射光，以將前述另一邊的 主面侧的導體層及於前述第一步驟所殘留的絕緣層予以去 除，而於前述加工孔的位置形成貫通孔；並且前述第二能 量密度較前述第一能量密度更大。 (發明的效果） 依據本發明，達到能穩定地對被加工物形成貫通孔的 效果。 【實施方式】 322483 201141645 以下依據圖式詳細地說明本發明實施形態的雷射加 工方法及雷射加工機。此外，本發明並不受本實施形態之 限定。 • (實施形態） • 第1圖係顯示本發明實施形態之雷射加工機的構成圖。 雷射加工機100係為藉由照射雷射光L(脈衝雷射（pulsed laser)光）而於被加工物（w〇rk)4進行開孔加工的裝置。雷 射加工機100係具備有：將雷射光L加以振盪的雷射振遭 器1 ;進行被加工物4的雷射加工的雷射加工部3 ;以及加 工控制裝置（控制部）2。 雷射振盪器1係將雷射光L振盪，並送出至雷射加工 部3。本實施形態的雷射加工機1 〇〇係以按照來自加工控 制裝置2的指示的脈衝能量（雷射光l的每一脈衝之能量） 將雷射光L予以送出。雷射加工部3係具備有：照射面積 控制部31 ;電流鏡（gaivano mirror)35X、35Y ;電流掃推 器（galvano scanner)36X、36Y ;聚光透鏡（f 0 透鏡）34 ; XY台（加工台）30 ;以及位置檢測部39。 照射面積控制部31係配置於例如較電流鏡35X、35Y 更前段側（雷射振盪器1側）的光路上。照射面積控制部31 係例如由兩片透鏡（準直透鏡（collimate lens)等）所構 成。雷射光（laser beam)L係藉由通過兩片透鏡而調整為 相應於兩片透鏡的射束系統。 雷射加工部3係配置有相應對被加工物4照射雷射光 L的照射面積（雷射光照射面積）之照射面積控制部31。具 6 322483 201141645 體而言。於本替 制部3卜例/施形射，預林備了複數㈣射面積控 組由兩片透 — Γ照射面積控㈣&而言，準備有複數 物4的表面時，成的透鏡組。接著，在雷射加工被加工 於雷射加X#/、、相應於表面㈣射面積控制部31配置 4 3的光路上，並於雷射加工被加工物4的背 ==背面的照射面積控制…置於雷射力= “、、射面積控制部31亦可為如用以調整雷射光[ 的射束直&的光圈（aperture)等透鏡以外的手段。此情形 時，在雷射加工被加工物4的表面之際，係將相應於表面 的光圈加以配置在雷射加工部3的光路上，而在雷射加工 被加工物4的背面之際，係將相應於背面的光圈加以配置 在雷射加工部3的光路上。 電流掃描器36X、36Y係具有使雷射光L的執道變化 而使朝被加工物4的照射位置移動的功能，且使雷射光L 在設定於被加工物4的各加工區域内二維地掃瞄^電流掃 描器36X、36Y係為了使雷射光L往X_Y方向掃目苗，而使電 流鏡35Χ、35Υ(後文所述之偏向鏡33)朝預定的角度旋轉。 電流鏡35Χ、35Υ係將雷射光L反射並使其偏向至預 定的角度。電流鏡35Χ係使雷射光L朝X方向偏向，而電 流鏡35Υ係使雷射光L朝Υ方向偏向。 聚光透鏡34係為具有遠心（telecentric)性的聚光透 鏡。聚光透鏡34係使雷射光L相對於被加工物4的主面朝 垂直的方向偏向，並且使雷射光L朝被加工物4的加工位 7 322483 201141645 置（孔位置Hx)聚光（照射）。 被加工物4係為印刷線路板等’從屬於一側主面的表 面及屬於另一侧主面的背面的兩表面進行複數次開孔加 以形成貫通孔。被加工物4係呈例如銅箔（導體層）、樹月匕 (絕緣層）、銅箔（導體層）的三層構造。 XY台30係用以載置被加工物4 ’並且藉由未圖示的 軸馬達及Y轴馬達的驅動而在XY平面内移動。雜此 台30即可使被加工物4於面内方向移動。 不使XY台30移動而藉由電性機構的運作（電流掃^ 器36X、36Y的移動）時，雷射加工所能進行的範圍（可掃瞄 區域）即為加工區域（掃瞄區域）。於雷射加工機1〇〇中使 ΧΥ σ 30在Χγ平面内移動後，藉由電流掃描器、gey 將雷射光L予以二維掃瞄。χγ台30係以各加工區域的中 心成為聚光透鏡34的中心正下方（電性原點）的方式順序 地移動。電性機構係以設定於加工區域内的各孔位置Ηχ 續序地成為雷射光L的照射位置的方式運作。利用χγ台 3〇所做的加工區域間的移動，以及利用電性機構所進行的 於加工區域内的雷射光L之二維掃瞄，係在被加工物4内 序地進行。藉此，被加工物4内的全部的孔位置jjx皆得 以全部受到雷射加工。 白 位置檢挪部39係檢測出預先言史置於被加工物4的定 2用貝通孔（未圖示）的位置，並將檢測結果傳送至加工控 3置=加工控制裝置2係依據加工程式及位置檢測部 斤獲得的位置的檢測檢果，而控制被加工物4的雷射加 322483 8 201141645 工位置。於加工控制裝置2係輸入有用以雷射加工被加工 物4的表面的加工程式以及用以雷射加工被加工物4的背 面的加工程式。 加工控制裝置2係連接至雷射振盪器1及雷射加工部 3(未圖示）’以控制雷射振盪器1及雷射加工部3。本實施 八二的雷射加工機1 〇 〇係以設定於被加工物4的表面（一邊 的主面侧）的雷射光照射條件進行對被加工物4表面的雷 射Λ ' σ工，並以設定於被加工物4的背面（另一邊的主面側） 的雷射光照射條件進行對被加工物4背面的雷射加工。 針尉於被加工物4 係為對·被加工物4的雷 對於被加 的表面所設定的雷射光照射條件， 射光照射面積及脈衝能量。同樣地， 工物4的背面所設定的雷射光照射條件，係為對 、皮力ϋ工物4的雷射光照射面積及脈衝能量（pulse energy)。 針對被加工物4的表面所設定的雷射光照射條件，係 可叹定於用以雷射加工被加工物4的表面的加工程式内， 並亦可設定於加工控制裝置2内。同樣地，針對被加工物 4的背面所設定的雷射光照射條件，係可設定於用以雷射 加工被加工物4的背面的加工程式内，並亦可設定於加工 控制裝置2内。 加工控制裝置2係在雷射加工被加工物4的表面之際 將斜斜表面所設定的雷射光照射條件指示到雷射振盪器1 及雷射加工部3，並於雷射加工被加工物4的背面之際將 斜斟背面設定的雷射光照射條件指示到雷射振盪器1及雷 射加工部3。於本實施形態中，於雷射加工被加工物4的 322483 9 201141645 表面之際，加工控制裝置2以對應於針對表面的雷射光昭 射條件的脈誠㈣射雷射光的方式，將指令傳送至雷射 振盪器卜同樣地，於雷射加工被加工物4的背面之際， -加工控制裝置2以對應於針對背面的雷射光照射條件的脈 $ 衝能量照射雷射光的方式，將指令傳送至雷射振盪器j。 加工控制裝置2係由電腦等所構成，並藉由姒數值 控制（Numerical Control))控制等對雷射振盪器】、雷射 加工部3來進行控制。加工控制裝置2係具備有cpu(中央 處理單元 ’ Central Processing Unit)、R〇M(唯讀記憶體， Readonly Memory)、RAM(隨機存取記憶體，Rand〇mAccess Memory)等而構成。在加工控制裝置2控制雷射加工之際， CPU係依據使用者從輸入部（未圖示）進行的輸入，讀取儲 存於ROM内的加工程式，並於RAM内的程式儲存區域展開 以執行各種的處理。當在該處理時所產生的各種資料，係 暫時儲存在形成於RAM内的資料儲存區域。加工控制裝置 2係藉此控制雷射振盪器1及雷射加工部3。 雷射加工機l〇Q係藉由此構成而將從雷射振盈器1射 出的雷射光L，利用電流鏡35X、35Y偏向至任意的角度， 透過聚光透鏡34成像並照射至被加工物4上的預定位置。 藉此，被加工物4即受到雷射加工，並於被加工物4形成 貫通孔。 本實施形態之雷射加工機100係於對被加工物4的表 面照射带斛、 田射光之後、將被加工物4予以翻轉並對被加工物 4的煮面照射雷射光，藉以從被加工物4的兩表面照射雷 322483 10 201141645 射光，並藉此於被加工物4形成貫通孔。 ^接著，說明關於本實施形態的開孔加工方法。第2圖 係用以說明對表面的開孔加工方法之圖。於第2圖中顯 '不從被加工物4的表面2〇A照射了雷射光L時所形成的加 . 工孔（未貫通的孔）的剖面圖。 此被加工物4係於表面20A侧形成有銅箔21A，並且於BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser processing method and a laser processing machine for irradiating a workpiece with laser light and performing drilling processing on the workpiece. [Prior Art] * A laser processing machine is a device that performs laser processing on a workpiece, for example, by irradiating laser light onto a workpiece. As for the workpiece to be opened by the laser processing machine, there is a printed wiring board having a three-layer structure of a copper foil (conductor layer), a resin (insulating layer), and a copper foil (conductor layer). When the through hole processing is performed on such a printed wiring board, if the laser light is irradiated only from the surface side (single side) of the printed wiring board, the laser light cannot be reached to the copper foil on the back side of the printed wiring board. Therefore, it is difficult to perform stable through-hole processing on a printed wiring board. As for the method of performing stable laser processing on a printed wiring board, there is a method of irradiating laser light from both the front and back sides. In the laser processing method, the printed wiring board is irradiated with laser light from the surface to form a hole that reaches halfway, and then the laser beam is irradiated from the back surface of the printed wiring board to form a through hole (see, for example, Patent Document 1). (Prior Art Document) (Patent Document) Patent Document 1: JP-A-2003-218539 (Summary of the Invention) However, in the above-described conventional technique, the surface (the main side) When the laser beam is irradiated from the back surface (the main surface side of the other side) after the laser beam is irradiated on the surface 4 322483 201141645 side, the copper foil (conductor layer) on the back side cannot be stably removed. The present invention has been made in view of the above problems, and an object thereof is to provide a laser processing method and a laser processing method for forming a through hole for stabilizing a workpiece. (Means for solving the problem) In order to achieve the above object, the laser processing method of the present invention is to irradiate a laser beam with a workpiece having a layer of a conductor layer laminated on the insulating layer and a conductor layer laminated on the back surface of the conductor layer. The laser processing method of removing the conductor layer on the surface, the insulating layer, and the conductor layer on the back surface to form a laminated material for through-hole processing on the workpiece includes the following steps: First processing step Laser light is irradiated from the main surface side of one side of the workpiece at a first energy density to remove the conductor layer on the main surface side of the one side to form a machined hole until a midway position in the thickness direction of the insulating layer And a second processing step of irradiating the laser light with a second energy density from a position of the processing hole from a main surface side of the other side of the workpiece Removing the conductor layer on the main surface side of the other side and the insulating layer remaining in the first step, and forming a through hole at the position of the processing hole; and the second energy density is greater than the first energy density (Effect of the Invention) According to the present invention, the effect of stably forming a through hole in a workpiece is achieved. [Embodiment] 322483 201141645 Hereinafter, a laser processing method and laser processing according to an embodiment of the present invention will be described in detail based on the drawings. The present invention is not limited to the embodiment. • (Embodiment) • Fig. 1 is a view showing a configuration of a laser processing machine according to an embodiment of the present invention. The laser processing machine 100 is irradiated with a thunder. A device that performs a drilling process on a workpiece (w〇rk) 4 by emitting light L (pulsed laser light). The laser processing machine 100 includes a laser beam that oscillates the laser beam L. The laser processing unit 3 that performs laser processing of the workpiece 4 and the machining control device (control unit) 2. The laser oscillator 1 oscillates the laser light L and sends it to the laser processing unit 3. The laser processing machine 1 according to the embodiment transmits the laser light L in accordance with the pulse energy (energy of each pulse of the laser light 1) in accordance with an instruction from the processing control device 2. The laser processing unit 3 is provided with: Irradiation area control unit 31; gaivano mirror 35X, 35Y; galvano scanner 36X, 36Y; concentrating lens (f 0 lens) 34; XY stage (processing table) 30; and position detecting unit 39. The irradiation area control unit 31 is disposed, for example, on the optical path of the front side (the laser oscillator 1 side) of the current mirrors 35X and 35Y. The irradiation area control unit 31 is, for example, a two-lens lens (collimating lens) ), etc.). The laser beam L is adjusted to correspond to the beam system of the two lenses by passing through two lenses. The laser processing unit 3 is provided with an irradiation area control unit 31 that illuminates an irradiation area (a laser light irradiation area) of the laser beam L with respect to the workpiece 4. With 6 322483 201141645 body. In the case of this part of the substitution department 3, the form of the lens, the pre-forest preparation of the complex (four) shot area control group by two pieces of transparent - Γ irradiation area control (four) &, when preparing the surface of the plurality of objects 4, into a lens group . Next, the laser processing is performed on the laser beam X#/, and the optical path is arranged corresponding to the surface (four) radiation area control unit 31, and the irradiation area of the back surface of the laser processing workpiece 4 is corrected. ...disposed to the laser force = ", the shot area control unit 31 may be a means other than a lens for adjusting the laser beam of the laser beam. In this case, in the laser processing On the surface of the workpiece 4, the aperture corresponding to the surface is placed on the optical path of the laser processing unit 3, and when the back surface of the workpiece 4 is laser-processed, the aperture corresponding to the back surface is applied. It is disposed on the optical path of the laser processing unit 3. The current scanners 36X and 36Y have a function of changing the irradiation of the laser light L to move the irradiation position of the workpiece 4, and the laser light L is set to be The current scanners 36X and 36Y are scanned two-dimensionally in the respective processing regions of the workpiece 4 so that the laser beams 35 are scanned in the X_Y direction, and the current mirrors 35Χ, 35Υ are used (the deflection mirror 33 will be described later). Rotating toward a predetermined angle. The current mirrors 35Χ, 35Υ reflect the laser light L and The current mirror 35 is configured to deflect the laser light L in the X direction, and the current mirror 35 is configured to deflect the laser light L in the x direction. The collecting lens 34 is a telecentric lens having a telecentricity. The condensing lens 34 deflects the laser light L in a direction perpendicular to the main surface of the workpiece 4, and condenses the laser light L toward the processing position 7 322483 201141645 (hole position Hx) of the workpiece 4. The workpiece 4 is a printed circuit board or the like, and the two surfaces of the surface belonging to the one main surface and the back surface belonging to the other main surface are subjected to a plurality of openings to form a through hole. The workpiece 4 is, for example, A three-layer structure of a copper foil (conductor layer), a tree raft (insulation layer), and a copper foil (conductor layer). The XY stage 30 is used to mount a workpiece 4' and is provided by a shaft motor and Y (not shown). The shaft motor is driven to move in the XY plane. The workpiece 30 can move the workpiece 4 in the in-plane direction. The operation of the electrical mechanism is not performed by moving the XY stage 30 (current sweepers 36X, 36Y) Range of laser processing (scanning area) That is, the processing area (scanning area). After the ΧΥ σ 30 is moved in the Χγ plane in the laser processing machine 1 , the laser light L is scanned two-dimensionally by the current scanner and gey. The center of each processing region is sequentially moved so as to be directly below the center of the collecting lens 34 (electrical origin). The electric mechanism is laser light L in the order of the holes set in the processing region. The operation of the irradiation position. The movement between the processing regions by the χγ table 3〇 and the two-dimensional scanning of the laser light L in the processing region by the electrical mechanism are in the workpiece 4 Conducted in sequence. Thereby, all the hole positions jjx in the workpiece 4 are all subjected to laser processing. The white position detecting unit 39 detects that the predetermined history is placed in the position of the beacon hole (not shown) for the workpiece 4, and transmits the detection result to the processing control unit 3; the processing control device 2 is based on The processing program and the detection position of the position detection unit are detected, and the laser of the workpiece 4 is controlled to add the position of 322483 8 201141645. In the machining control device 2, a machining program for processing the surface of the workpiece 4 by laser and a machining program for laser processing the back surface of the workpiece 4 are input. The machining control device 2 is connected to the laser oscillator 1 and the laser processing unit 3 (not shown) to control the laser oscillator 1 and the laser processing unit 3. The laser processing machine 1 according to the eighth embodiment of the present invention performs laser Λ σ 对 on the surface of the workpiece 4 by laser light irradiation conditions set on the surface (the main surface side of the one surface) of the workpiece 4, and The laser processing on the back surface of the workpiece 4 is performed under the laser light irradiation conditions set on the back surface (the main surface side of the other side) of the workpiece 4. The object to be processed 4 is a pair of lasers for the workpiece 4, the laser light irradiation conditions set for the surface to be applied, the irradiation area and the pulse energy. Similarly, the laser light irradiation conditions set on the back surface of the workpiece 4 are the laser light irradiation area and the pulse energy of the pair of the skin force artifacts 4. The laser light irradiation conditions set for the surface of the workpiece 4 are stipulated in the processing program for laser processing the surface of the workpiece 4, and may be set in the processing control device 2. Similarly, the laser light irradiation conditions set for the back surface of the workpiece 4 can be set in a processing program for laser processing the back surface of the workpiece 4, or can be set in the processing control device 2. The processing control device 2 instructs the laser beam irradiation conditions set by the oblique surface to the laser oscillator 1 and the laser processing unit 3 when laser processing the surface of the workpiece 4, and processes the workpiece by laser processing. At the back of the 4, the laser light irradiation conditions set on the back of the slant are indicated to the laser oscillator 1 and the laser processing unit 3. In the present embodiment, when the surface of the 322483 9 201141645 of the workpiece 4 is laser-processed, the processing control device 2 transmits the command in a manner corresponding to the pulse of the laser light (4) corresponding to the laser light emission condition of the surface. In the same manner as the laser oscillator, when the laser processing the back surface of the workpiece 4, the processing control device 2 irradiates the laser light with a pulse energy corresponding to the laser light irradiation condition for the back surface. Transfer to the laser oscillator j. The processing control device 2 is composed of a computer or the like, and is controlled by a laser oscillator or a laser processing unit 3 by a numerical control (Numerical Control) control or the like. The processing control device 2 is configured to include a CPU (Central Processing Unit), R〇M (Read Only Memory), RAM (Rand〇m Access Memory), and the like. When the machining control device 2 controls the laser processing, the CPU reads the machining program stored in the ROM based on the input from the input unit (not shown), and expands the program in the program storage area in the RAM to execute. Various treatments. The various materials generated at the time of this processing are temporarily stored in a data storage area formed in the RAM. The machining control device 2 controls the laser oscillator 1 and the laser processing unit 3 by this. The laser processing machine l〇Q is configured such that the laser light L emitted from the laser vibrator 1 is deflected to an arbitrary angle by the current mirrors 35X and 35Y, and is imaged by the collecting lens 34 and irradiated to be processed. The predetermined position on the object 4. Thereby, the workpiece 4 is subjected to laser processing, and a through hole is formed in the workpiece 4. In the laser processing machine 100 of the present embodiment, after the surface of the workpiece 4 is irradiated with the belt and the field light, the workpiece 4 is turned over, and the cooking surface of the workpiece 4 is irradiated with the laser light, thereby being processed. Both surfaces of the object 4 are irradiated with Ray 324883 10 201141645, and a through hole is formed in the workpiece 4. Next, the hole drilling method of this embodiment will be described. Fig. 2 is a view for explaining a method of processing the opening of the surface. In Fig. 2, a cross-sectional view of a hole (a hole that is not penetrated) formed when the laser beam L is not irradiated from the surface 2A of the workpiece 4 is shown. The workpiece 4 is formed with a copper foil 21A on the side of the surface 20A, and
月側开》成有銅箔21B。而且，於銅箔21A及銅箔21BThe side of the moon is opened with copper foil 21B. Moreover, in the copper foil 21A and the copper foil 21B
之間形成有樹脂22。換言之，被加工物4係從背面2〇B 側朝表面2〇A侧，以銅箔21B、樹脂22、21A的順序層積 有該等材料所構成。 字表面20A予以雷射加工時，被加工物4係以表面2〇a 朝向上面側的方式載置於XY台30上。於第2圖中，顯示 透過偏向鏡33、聚光透鏡34，對屬於被加工物4的表面 侧之孔的表面孔HA進行雷射加工的情形。 、田射加工機100係對各孔位置Ηχ進行從被加工物4 的表面20Α側照射雷射光L並到達被加工物4的厚度方向 的中途位置的雷射加工。此時，加工控制裝置2係將位於 f為貫通孔的預定的各孔位置Ηχ的下部（被加工物4内） 樹知22以預先設定的預定量予以去除的方式，依據針斜 表面20Α的雷射光照射條件，控制雷射振盪器丨及雷 工部3。捸—♦ > 、s之’各表面孔ΗΑ係進行雷射加工到相應於雷 照射條件的預錢度。於本實施形態中，各表面孔Ha 樹脂22係被去除1/2以上，且以產生僅預定殘留量的樹月旨 的方式進行雷射加工。例如，對各表面孔HA以雷射光照射 11 322483 201141645 面積5024/zm2(直徑0 =80/zm的雷射光L)，且脈衝能量為 10mJ(能量密度=1. 99J/ m2)的雷射光L對表面20A僅做單 次的照射（shot)。 ^ 於此，說明關於雷射加工表面之際的加工深度。第3 - 圖係用以說明利用雷射光進行的開孔加工的加工原理圖。 當從被加工物4的表面20A侧照射雷射光L時（ST1)，表面 20A側的銅箔21A熔融（ST2)，進一步樹脂22熔融（ST3)。 此時，銅箔21A只熔融而未蒸發。 銅箔21A及樹脂22熔融之後，樹脂22蒸發（ST4)。 接著，因為樹脂22的蒸發壓力，使樹脂22被吹飛至加工 孔的外側。藉此，熔融狀態的銅箔21A會與樹脂22 —起往 加工孔的外侧飛散（ST5)。 如此，藉由雷射光L對具有銅箔21A及樹脂22的複 合材料進行開孔加工時，需要只夠使銅箔21A飛散的適量 樹脂22。從而，藉由雷射光L從背面20B側進行開孔加工 時，亦需要只夠使銅箔21B飛散的適量樹脂22。因此，於 本實施例中，以在銅箔21B側殘留有預定量以上的樹脂22 的方式，從表面20A側開始進行開孔加工。 結束對表面20A的雷射加工後，被加工物4係以背面 20B朝向上面側的方式載置於XY台30上，並進行對各孔 位置Hx的雷射加工。雷射加工機10 0係對形成有加工至中 途的加工孔的各孔位置Hx，從被加工物4的背面20B側照 射雷射光L以朝孔位置Hx形成貫通孔。 第4圖係用以說明對背面的開孔進行加工方法之圖。 12 322483 201141645 於第4圖中，係顯示從被加工物4的表面20A側及背面20B 側照射雷射光L時所形成的加工孔（貫通孔）的剖面圖。 雷射加工係從被加工物4的背面20B侧，經由偏向鏡 - 33、聚光透鏡34，朝屬於背面20B側之孔的背面孔HB進 . 行。背面孔HB係為與表面孔HA相同孔位的孔，且從表面 20A側觀視，係形成於表面孔HA的下部的孔。 雷射加工機100係對於各孔位置Hx從被加工物4的 背面20B側照射雷射光L以進行被加工物4的背面20B側 的雷射加工。此時，本實施形態的加工控制裝置2係依據 針對於背面20B設定的雷射光照射條件控制雷射振盪器1 及雷射加工部3。針對背面20B設定的雷射光照射條件， 係為可將銅箔21B、以及於從表面20A側進行開孔加工之 際所殘留的樹脂22予以去除的條件。 從表面20A側進行開孔加工後的樹脂22，係於貫通孔 内僅殘留1/2以下的厚度份量。又，殘留在形成貫通孔的 位置的樹脂22的量較少時，樹脂22的蒸發壓力變小。因 此，在從背面20B側進行開孔加工之際，係以較從表面20A 側進行開孔加工時更大的脈衝能量照射雷射光L。換言 之，雷射加工機100於將照射的雷射光L的面積（雷射光照 射面積）予以設為固定時，係將從背面20B照射雷射光L 之際的脈衝能量設為相較於從表面20A照射雷射光L之際 的脈衝能量更大。例如，如第4圖所示，雷射加工機10 0 係於各背面孔HB以雷射光照射面積為5024//m2(直徑0 =80/zm的雷射光L)，且脈衝能量為15mJ的雷射光L僅作 13 322483 201141645 單次照射的方式進行照射。 具體來說’加工控制裝置2係對於雷射振盪器丨以射 出脈衝能量為15m〗的雷射光L的方式送出指令。雷射振盈 器1係依照來自加工控制裝置2的指示，射出脈衝能量為 15mJ的雷射光L。 藉此，對各表面孔HA及各背面孔hb的雷射光照射面 積’係成為40x40x3. 14=5024# m2。此外，相較於從表面 20A照射雷射光L時的脈衝能量（i〇mJ)，從背面2〇B照射 雷射光L時的脈衝能量（i5mJ)增高了 1〇%以上。 如此，於本實施形態中，係在表面2〇A及背面2〇b將 雷射光照射面積予以設為相同’並且，相較於對表面2 〇 a 的雷射光L的脈衝能量，將對背面20B的雷射光[的脈衝 能量增高例如10%以上。 於雷射加工背面20B之際，因為從表面2〇A開始的雷 射加工使得樹脂22的量減少，然由於在雷射加工背面2〇b 之際照射較表面20A更尚10%以上的脈衝能量，故樹脂22 的蒸發壓力增加。從而，能穩定地去除銅箔2ΐβ。如此， 由於在雷射加工背面20Β之際以較表面2〇Α更高的脈衝能 量照射雷射光L，故能穩定地加工貫通孔。 此外，亦可在將表面20Α或背面20Β予以雷射加工之 際’與雷射光L的照射同時地往表面20Α或背面2〇Β吹送 氣體。精此，利用氣體的運動能量能輕易地去除銅箱21 a 或銅箔21B。 此外’於背面20B進行雷射加工時，亦可將雷射光照 322483 14 201141645 射面積設為較表面20A進行雷射加工時更大。第5圖係用 以說明對背面進行的開孔加工方法的其他例圖。於第5圖 中，顯示從被加工物4的表面20A側及背面20B側照射雷 射光L時所形成的加工孔（貫通孔）的剖面圖。 . 雷射加工機100係對於各孔位置Hx從被加工物4的 背面20B側照射雷射光L以進行被加工物4的背面20B側 雷射加工。此時，從表面2 0 A側進行開孔加工後的殘留樹 脂，在貫通孔内只殘留1/2以下。因此，雷射加工機100 係將在表面20A及背面20B所照射的雷射光L的脈衝能量 密度設為大約固定，且相較於從表面20A照射雷射光L時 的雷射光照射面積，將從背面20B照射雷射光L時的雷射 光照射面積設為更大。 例如，如第5圖所示，雷射加工機10 0係對各背面孔 HC以雷射光照射面積7850 //m2(直徑¢=100//m的雷射光 L)且脈衝能量為15mJ的雷射光L僅作單次照射。具體而 言，將照射面積控制部31交換為相應於表面20A的雷射加 工條件的照射面積控制部31後，進行對被加工物4的雷射 加工。 藉此，對各表面孔HA及各背面孔HB照射的雷射光L 的脈衝能量係大約成為相同。此外，相較於從表面20A照 射雷射光L時的雷射光照射面積（40x40x3. 14=5024μ m2)， 從背面20B照射雷射光L時的雷射光照射面積（50x40x 3. 14=7850 /zm2)增大了 10%。 在雷射加工背面20B之際，由於從表面20A的雷射加 15 322483 201141645 工，使樹脂22的深度方向的量有所減少。於本實施形態 中，在雷射加工背面20B之際，係以較雷射加工表面20A 時大10%以上的雷射光照射面積照射雷射光L，故藉由從 背面20B照射雷射光所去除的樹脂22的體積，係相應雷射 光照射面積的增加而增加其量。藉此，用以吹散經炼融的 銅箔21B的樹脂22蒸發壓力增加。從而，能將銅箔21B 予以穩定的去除。如此，由於在雷射加工背面20B之際以 較表面20A更大的雷射光照射面積照射雷射光L，故能穩 定地加工貫通孔。 接著，說明關於表面20A與背面20B之間的雷射加工 條件與貫通孔的完成效果的關係。於此，係說明雷射加工 條件為背面20B相對於表面20A的雷射光照射面積的比 率，與背面20B相對於表面20A的能量密度予以相組合的 情形。 第6圖係顯示表面及背面之間的雷射加工條件與貫通 孔的完成效果之關係的一例圖。顯示於第6圖的橫軸的雷 射光照射面積，係顯示照射於背面20B的雷射光L的雷射 光照射面積。此外，顯示於第6圖的橫軸的比率，係顯示 照射在背面20B的雷射光照射面積相對於照射在表面20A 的雷射光照射面積的比率。此外，顯示於第6圖的縱軸的 比率，係顯示照射在背面20B的能量密度相對於照射在表 面20A的能量密度的比率。 此外，顯示於第6圖的〇記號，係為可穩定地加工貫 通孔的雷射加工條件。顯示於第6圖的X記號，係為無法 16 322483 201141645 穩疋地加工貫通孔的雷射加工條件。 背面20B相對於表面2〇A的能量密度的比率為1〇 以上時，可穩定地加工貫通孔。此外，表面20A及背面20B - 的能量密度的比率為相同時，或背面20B的能量密度較表 面2〇A的能量密度更大時（比率為1. 〇〇以上時），只要背面 20B相對於表面20A的雷射光照射面積的比率為丨.1〇以 上’即可穩定地加工貫通孔。 此外，背面20B相對於表面20A的能量密度的比率為 0.95以上時，只要背面2〇B相對於表面2〇a的雷射光照射 面積的比率為1.15以上’即可穩定地加工貫通孔。 另一方面，背面2〇b相對於表面20A的能量密度的比 率為未滿1. 10時，若背面20B相對於表面20A的雷射光照 射面積的比率為未滿1. 10，則無法穩定地加工貫通孔。 此外，背面20B的能量密度較表面2〇A的能量密度為 小時（比率未滿1.00時），若背面2〇B相對於表面2〇A的雷 射光照射面積的比率未滿L15,則無法穩定地加工貫通 孔。此外，背面20B相對於表面20A的能量密度的比率未 滿0. 95時’無法穩定地加工貫通孔。 此外，背面20B相對於表面2〇a的雷射光照射面積的 比率為1· 10以上時’即使在穿通了表面孔^後沒有在表 面孔HA的下部殘留有樹脂22亦無妨。此外，亦可依據對 背面20B進行了開孔加工時所去除的樹脂22的體積（預測 值），來決定將背面2GB予以開孔之際的雷射光照射面積及 能董密度。藉it匕’即能設定相應在背面2〇B進行開孔加工 322483 201141645 時所去除的樹脂22的體積的適切雷 射加工背自_之際的雷射光照射面射藉力二條田件。從而，雷 要無謂地增大，並能以良好效率進行開夏禮度能不需 此外，被加工物4不限於印刷線 σ 。 的構件。例如亦可使用對被加卫物4昭^ ’而亦可為其他 熔融而不會蒸發的其他種類的層來取#、、雷射光之際僅會 代鋼 21A、21Β。此 外，亦可使用對被加工物4照射雷射杏 自此 &之際會炫:融並基發 的其他種類的層來取代樹脂22。 τ言各喊亚疾、發 此外’於本實施形態中，雖說明 j在雷射加工被加工 物4的表面20A後再雷射加工背面2〇b的& 的情形，然亦可在 雷射加工被加工物4的背面20B後再蝥紅 又丹由射加工表面20A。A resin 22 is formed between them. In other words, the workpiece 4 is formed by laminating these materials in the order of the copper foil 21B, the resin 22, and the 21A from the back surface 2〇B side toward the surface 2〇A side. When the word surface 20A is subjected to laser processing, the workpiece 4 is placed on the XY stage 30 such that the surface 2〇a faces the upper surface side. In the second embodiment, the surface hole HA belonging to the hole on the surface side of the workpiece 4 is subjected to laser processing through the deflecting mirror 33 and the collecting lens 34. The field processing machine 100 performs laser processing for irradiating the laser beam L from the side of the surface 20 of the workpiece 4 to the intermediate position in the thickness direction of the workpiece 4 at each hole position 。. At this time, the machining control device 2 sets the lower portion (in the workpiece 4) at a predetermined hole position f where f is a through hole to be removed by a predetermined amount in advance, depending on the inclined surface of the needle 20 Laser light irradiation conditions, control of the laser oscillator and the Department of Mines 3.捸—♦ >, s' each surface hole system is subjected to laser processing to a pre-money level corresponding to the lightning exposure condition. In the present embodiment, each surface hole Ha resin 22 is removed by 1/2 or more, and laser processing is performed so as to produce only a predetermined residual amount. For example, each surface hole HA is irradiated with laser light 11 322483 201141645 area 5024/zm 2 (diameter 0 = 80 / zm laser light L), and the laser light having a pulse energy of 10 mJ (energy density = 1.99 J / m 2 ) Only a single shot of the surface 20A is performed. ^ Here, the processing depth at the time of laser processing of the surface is explained. Fig. 3 - Fig. is a schematic diagram for explaining the processing of the drilling using the laser light. When the laser beam L is irradiated from the surface 20A side of the workpiece 4 (ST1), the copper foil 21A on the surface 20A side is melted (ST2), and the resin 22 is further melted (ST3). At this time, the copper foil 21A was only melted and did not evaporate. After the copper foil 21A and the resin 22 are melted, the resin 22 is evaporated (ST4). Next, the resin 22 is blown to the outside of the processing hole due to the evaporation pressure of the resin 22. Thereby, the molten copper foil 21A is scattered with the resin 22 toward the outside of the processing hole (ST5). As described above, when the composite material having the copper foil 21A and the resin 22 is subjected to the drilling process by the laser light L, an appropriate amount of the resin 22 which is sufficient to scatter the copper foil 21A is required. Therefore, when the laser light L is subjected to the drilling process from the side of the back surface 20B, an appropriate amount of the resin 22 which is sufficient to scatter the copper foil 21B is also required. Therefore, in the present embodiment, the opening process is performed from the side of the surface 20A so that the resin 22 of a predetermined amount or more remains on the side of the copper foil 21B. After the laser processing on the surface 20A is completed, the workpiece 4 is placed on the XY stage 30 so that the back surface 20B faces the upper surface side, and laser processing is performed on each hole position Hx. The laser processing machine 100 is configured to irradiate the laser light L from the back surface 20B side of the workpiece 4 to each hole position Hx in which the machining hole is formed in the middle, and to form a through hole toward the hole position Hx. Fig. 4 is a view for explaining a method of processing the opening of the back surface. 12 322483 201141645 FIG. 4 is a cross-sectional view showing a machined hole (through hole) formed when the laser beam L is irradiated from the surface 20A side and the back surface 20B side of the workpiece 4. The laser processing is performed from the back surface 20B side of the workpiece 4 via the deflecting mirror - 33 and the collecting lens 34 toward the back hole HB of the hole belonging to the back surface 20B side. The back hole HB is a hole having the same hole position as the surface hole HA, and is formed in the lower portion of the surface hole HA from the side of the surface 20A. The laser processing machine 100 irradiates the laser beam L from the side of the back surface 20B of the workpiece 4 at each hole position Hx to perform laser processing on the back surface 20B side of the workpiece 4. At this time, the processing control device 2 of the present embodiment controls the laser oscillator 1 and the laser processing unit 3 in accordance with the laser light irradiation conditions set for the back surface 20B. The conditions of the laser light irradiation set for the back surface 20B are such that the copper foil 21B and the resin 22 remaining after the hole processing is performed from the surface 20A side can be removed. The resin 22 which has been subjected to the drilling process from the surface 20A side has a thickness of only 1/2 or less remaining in the through hole. Further, when the amount of the resin 22 remaining at the position where the through hole is formed is small, the evaporation pressure of the resin 22 becomes small. Therefore, when the drilling process is performed from the back surface 20B side, the laser light L is irradiated with a larger pulse energy than when the hole processing is performed from the surface 20A side. In other words, when the area of the laser light L to be irradiated (the area of the laser light irradiation) is fixed, the laser processing device 100 sets the pulse energy from the back surface 20B to the laser light L to be compared with the surface 20A. The pulse energy at the time of illuminating the laser light L is larger. For example, as shown in Fig. 4, the laser processing machine 100 is attached to each of the back holes HB with a laser light irradiation area of 5024 / / m 2 (diameter 0 = 80 / zm laser light L), and the pulse energy is 15 mJ The laser light L is irradiated only by a single irradiation of 13 322483 201141645. Specifically, the processing control device 2 sends a command to the laser oscillator L for laser light having an emission pulse energy of 15 m. The laser vibrator 1 emits laser light L having a pulse energy of 15 mJ in accordance with an instruction from the processing control device 2. Thereby, the laser light irradiation area of each of the surface holes HA and each of the back holes hb is 40x40x3. 14 = 5024# m2. Further, the pulse energy (i5mJ) when the laser light L is irradiated from the back surface 2〇B is increased by 1% or more as compared with the pulse energy (i〇mJ) when the laser light L is irradiated from the surface 20A. As described above, in the present embodiment, the irradiation area of the laser light is set to be the same on the surface 2A and the rear surface 2〇b, and the pulse energy of the laser light L to the surface 2 〇a is opposite to the back surface. The pulse energy of 20B is increased by, for example, 10% or more. At the time of laser processing of the back surface 20B, since the laser processing from the surface 2A causes the amount of the resin 22 to be reduced, since the laser is irradiated on the back surface 2〇b, more than 10% of the pulse is irradiated on the surface 20A. The energy, so the evaporation pressure of the resin 22 increases. Thereby, the copper foil 2ΐβ can be stably removed. In this manner, since the laser beam L is irradiated with a higher pulse energy than the surface 2 在 at the time of the back surface of the laser processing, the through hole can be stably processed. Further, it is also possible to blow the gas toward the surface 20 Α or the back surface 2 at the same time as the irradiation of the laser light L while the surface 20 Α or the back surface 20 Β is subjected to laser processing. In this case, the copper box 21a or the copper foil 21B can be easily removed by the kinetic energy of the gas. In addition, when performing laser processing on the back surface 20B, it is also possible to set the laser light 322483 14 201141645 to be larger than the surface 20A for laser processing. Fig. 5 is a view showing another example of the method of drilling the back surface. In Fig. 5, a cross-sectional view of a machined hole (through hole) formed when the laser beam L is irradiated from the surface 20A side and the back surface 20B side of the workpiece 4 is shown. The laser processing machine 100 irradiates the laser beam L from the side of the back surface 20B of the workpiece 4 at each hole position Hx to perform laser processing on the back surface 20B side of the workpiece 4. At this time, the residual resin after the hole drilling from the surface 20 A side remains only 1/2 or less in the through hole. Therefore, the laser processing machine 100 sets the pulse energy density of the laser light L irradiated on the front surface 20A and the back surface 20B to be approximately constant, and will be compared with the laser light irradiation area when the laser light L is irradiated from the surface 20A. The area of the laser light irradiation when the back surface 20B is irradiated with the laser light L is set to be larger. For example, as shown in Fig. 5, the laser processing machine 100 is a laser that irradiates an area of 7,850 // m 2 (diameter light ¢ = 100 / / m of laser light L) with a laser beam of 15 mJ to each of the back holes HC. The light L is only used for a single shot. Specifically, the irradiation area control unit 31 exchanges the irradiation area control unit 31 corresponding to the laser processing conditions of the surface 20A, and then performs laser processing on the workpiece 4. Thereby, the pulse energy of the laser light L irradiated to each of the surface hole HA and each of the back surface holes HB is approximately the same. Further, the area of the laser light irradiated with the laser light L from the back surface 20B is compared with the area of the laser light irradiation (40x40x3.14=5024 μm 2 ) when the laser light L is irradiated from the surface 20A (50×40× 3. 14=7850 /zm 2 ) Increased by 10%. At the time of the laser processing of the back surface 20B, the amount of the resin 22 in the depth direction is reduced by the laser from the surface 20A plus 15 322483 201141645. In the present embodiment, when the laser-processed back surface 20B is irradiated with the laser light irradiation area of 10% or more larger than that of the laser-processed surface 20A, the laser beam L is irradiated from the back surface 20B. The volume of the resin 22 is increased by an increase in the area irradiated by the corresponding laser light. Thereby, the evaporation pressure of the resin 22 for blowing the fused molten copper foil 21B is increased. Thereby, the copper foil 21B can be stably removed. As described above, since the laser beam L is irradiated with a larger area of the laser light irradiation surface than the surface 20A at the time of the laser-processed back surface 20B, the through-hole can be stably processed. Next, the relationship between the laser processing conditions between the surface 20A and the back surface 20B and the completion effect of the through holes will be described. Here, the case where the laser processing conditions are the ratio of the surface of the back surface 20B to the laser light irradiation surface of the surface 20A and the energy density of the back surface 20B with respect to the surface 20A are described. Fig. 6 is a view showing an example of the relationship between the laser processing conditions between the front surface and the back surface and the completion effect of the through holes. The area of the laser beam that is displayed on the horizontal axis of Fig. 6 indicates the area of the laser beam that is irradiated onto the back surface 20B. Further, the ratio of the horizontal axis shown in Fig. 6 shows the ratio of the area of the laser light irradiated on the back surface 20B to the area irradiated with the laser light irradiated on the surface 20A. Further, the ratio shown on the vertical axis of Fig. 6 shows the ratio of the energy density irradiated on the back surface 20B to the energy density irradiated on the surface 20A. Further, the 〇 mark shown in Fig. 6 is a laser processing condition in which the through hole can be stably processed. The X mark shown in Fig. 6 is a laser processing condition in which the through hole can be smoothly processed by 16 322483 201141645. When the ratio of the energy density of the back surface 20B to the surface 2A is 1 Torr or more, the through hole can be stably processed. Further, when the ratio of the energy density of the surface 20A and the back surface 20B - is the same, or when the energy density of the back surface 20B is larger than the energy density of the surface 2 〇 A (when the ratio is 1. 〇〇 or more), as long as the back surface 20B is opposite to The through hole can be stably processed by the ratio of the area of the laser light irradiation surface of the surface 20A of 丨.1〇 or more. Further, when the ratio of the energy density of the back surface 20B to the surface 20A is 0.95 or more, the through hole can be stably processed as long as the ratio of the surface of the back surface 2B to the laser light irradiation area of the surface 2a is 1.15 or more. On the other hand, when the ratio of the energy density of the back surface 2〇b to the surface 20A is less than 1.0, the ratio of the area of the back surface 20B to the surface of the laser light irradiated to the surface 20A is less than 1.0, which is not stable. Machine through holes. Further, the energy density of the back surface 20B is smaller than the energy density of the surface 2A (the ratio is less than 1.00), and if the ratio of the surface 2〇B to the laser light irradiation area of the surface 2A is less than L15, it is not stable. The through hole is machined. Further, the ratio of the energy density of the back surface 20B to the surface 20A is less than 0.95', and the through hole cannot be stably processed. Further, when the ratio of the surface of the back surface 20B to the irradiation area of the laser light of the surface 2a is 1·10 or more, the resin 22 may not remain in the lower portion of the surface HA even after the surface hole is punched. Further, it is also possible to determine the area of the laser light irradiation and the energy density at the time of opening the back surface 2 GB based on the volume (predicted value) of the resin 22 removed during the drilling of the back surface 20B. By the use of it匕, it is possible to set the appropriate amount of the resin 22 to be removed at the back side 2〇B. The volume of the resin 22 removed by the 322483 201141645 is laser-irradiated from the surface of the laser beam. Therefore, the lightning is unnecessarily increased, and the summer ritual can be performed with good efficiency. In addition, the workpiece 4 is not limited to the printing line σ. Components. For example, it is also possible to use the other types of layers which are added to the object to be cured, and which may be melted without evaporating, and the lasers 21A and 21Β. Further, it is also possible to use the other type of layer which irradiates the workpiece 4 with the laser apricot from the time of this & In the present embodiment, it is described that j is laser-processed on the surface 20A of the workpiece 4 and then laser-processed the back surface 2〇b. After the back surface 20B of the workpiece 4 is processed, the surface 20A is processed by the blush and the dan.
此時，對背面20B運用前文所述對表面9nA 双匈Z〇A的雷射加工條 件，並對表面20A運用前文所述對背面 月®1 Z〇B的雷射加工條 件。 此外’顯示於第6圖的表面20A與背面2〇B之間的雷 射加工條件與貫通孔的完成效果的關係係為一例示性，亦 能以第6圖所示的◦記號以外的雷射加工條件對背面2〇b 照射雷射光L。例如，將雷射加工背面2〇b之際的能量密 度，設為較雷射加工表面20A之際的能量密度更大，藉此 可穩定地加工貫通孔。此外，將雷射加工背面2〇B之際的 雷射光照射面積’設為較雷射加工表面2〇a之際的雷射光 照射面積更大，藉此可穩定的加工貫通孔。 依據如此的實施形態’由於將雷射加工被加工物4的 背面20B之際的也董雄·度’设為較雷射加工被加工物4的 322483 18 201141645 表面20A之際的能量密度更大，故能將構成被加工物4的 銅箔21B予以從被加工物4穩定的去除。此外，由於將雷 射加工被加工物4的背面20B之際的雷射光照射面積，設 為較雷射加工表面20A之際的雷射光照射面積更大，故能 將構成被加工物4的銅箔21B從被加工物4予以穩定的去 除。從而，能對被加工物4穩定的形成貫通孔。 (產業上的利用可能性） 如上文所述，本發明的雷射加工方法及雷射加工機甚 適於利用雷射光對被加工物的開孔加工。 【圖式簡單說明】 第1圖係顯示本發明實施形態之雷射加工機的構成 圖。 第2圖係用以說明對表面的開孔加工方法之圖。 第3圖係用以說明利用雷射光進行的開孔加工的加工 原理圖。 第4圖係用以說明對背面的開孔加工方法之圖。 第5圖係用以說明對背面的開孔加工方法的其他例 圖。 第6圖係顯示表面及背面之間的雷射加工條件與貫通 孔的完成效果之關係的一例圖。 【主要元件符號說明】 1 雷射振盪器 2 加工控制裝置 3 雷射加工部 4 被加工物 20A 表面 20B 背面 19 322483 201141645 21A、 21B 銅箔 22 樹脂 30 XY台 31 照射面積控制部 33 偏向鏡 34 聚光透鏡 35X、 35Υ 電流鏡 36Χ 、36Υ 電流掃描器 39 位置檢測部 100 雷射加工機 HA 表面孔 ΗΒ ' HC 背面孔 Hx 孔位置 L 雷射光 20 322483At this time, the laser processing conditions of the surface 9nA double Hung Z〇A are applied to the back surface 20B, and the laser processing conditions of the back side month 1 Z 〇 B described above are applied to the surface 20A. Further, the relationship between the laser processing conditions between the surface 20A and the back surface 2B shown in Fig. 6 and the completion effect of the through holes is an example, and it is possible to use a mine other than the ◦ mark shown in Fig. 6. The laser processing conditions irradiate the laser light L to the back surface 2〇b. For example, when the energy density of the laser-processed back surface 2〇b is set to be larger than the energy density of the laser-processed surface 20A, the through-hole can be stably processed. Further, the area of the laser light irradiation area when the laser processing back surface 2 is B is set to be larger than the area of the laser light irradiation surface 2a, so that the through hole can be stably processed. According to the embodiment, the "Dongxiong degree" of the back surface 20B of the laser processed workpiece 4 is set to be larger than the energy density of the 322483 18 201141645 surface 20A of the laser processed workpiece 4. Therefore, the copper foil 21B constituting the workpiece 4 can be stably removed from the workpiece 4. In addition, since the area of the laser light irradiation when the back surface 20B of the workpiece 4 is laser-processed is set to be larger than the area of the laser light irradiation of the laser-processed surface 20A, the copper constituting the workpiece 4 can be formed. The foil 21B is stably removed from the workpiece 4. Therefore, the through hole can be formed stably with respect to the workpiece 4. (Industrial Applicability) As described above, the laser processing method and the laser processing machine of the present invention are highly suitable for the hole processing of the workpiece by the laser light. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the configuration of a laser processing machine according to an embodiment of the present invention. Fig. 2 is a view for explaining a method of processing the opening of the surface. Fig. 3 is a schematic view for explaining the processing of the drilling process using laser light. Fig. 4 is a view for explaining a method of processing the opening on the back side. Fig. 5 is a view for explaining another example of the method of processing the opening on the back side. Fig. 6 is a view showing an example of the relationship between the laser processing conditions between the front surface and the back surface and the completion effect of the through holes. [Description of main components] 1 Laser oscillator 2 Processing control device 3 Laser processing unit 4 Work object 20A Surface 20B Back surface 19 322483 201141645 21A, 21B Copper foil 22 Resin 30 XY stage 31 Irradiation area control unit 33 Deflection mirror 34 Condenser lens 35X, 35Υ Current mirror 36Χ, 36Υ Current scanner 39 Position detection unit 100 Laser processing machine HA surface hole HC 'HC Rear hole Hx Hole position L Laser light 20 322483