TW201134982A - Surface treatment agent for metal - Google Patents
Surface treatment agent for metal Download PDFInfo
- Publication number
- TW201134982A TW201134982A TW100101203A TW100101203A TW201134982A TW 201134982 A TW201134982 A TW 201134982A TW 100101203 A TW100101203 A TW 100101203A TW 100101203 A TW100101203 A TW 100101203A TW 201134982 A TW201134982 A TW 201134982A
- Authority
- TW
- Taiwan
- Prior art keywords
- metal
- surface treatment
- treatment agent
- silver
- group
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 45
- 239000002184 metal Substances 0.000 title claims abstract description 45
- 239000012756 surface treatment agent Substances 0.000 title claims abstract description 33
- 238000010438 heat treatment Methods 0.000 claims abstract description 22
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 24
- 229910052709 silver Inorganic materials 0.000 claims description 24
- 239000004332 silver Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 18
- 125000000217 alkyl group Chemical group 0.000 claims description 16
- 239000003112 inhibitor Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 229910052739 hydrogen Inorganic materials 0.000 claims description 13
- 239000001257 hydrogen Substances 0.000 claims description 13
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 8
- 238000004649 discoloration prevention Methods 0.000 claims description 8
- 150000002431 hydrogen Chemical class 0.000 claims description 7
- 229910052783 alkali metal Inorganic materials 0.000 claims description 6
- 150000001340 alkali metals Chemical class 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 125000003277 amino group Chemical group 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 244000028419 Styrax benzoin Species 0.000 claims 1
- 235000000126 Styrax benzoin Nutrition 0.000 claims 1
- 235000008411 Sumatra benzointree Nutrition 0.000 claims 1
- 229960002130 benzoin Drugs 0.000 claims 1
- 235000019382 gum benzoic Nutrition 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 125000004076 pyridyl group Chemical group 0.000 claims 1
- 150000003852 triazoles Chemical class 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 abstract description 16
- 238000002845 discoloration Methods 0.000 abstract description 12
- 238000000034 method Methods 0.000 abstract description 9
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical class C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000203 mixture Substances 0.000 abstract description 3
- OWQPOVKKUWUEKE-UHFFFAOYSA-N 1,2,3-benzotriazine Chemical class N1=NN=CC2=CC=CC=C21 OWQPOVKKUWUEKE-UHFFFAOYSA-N 0.000 abstract 1
- 150000003918 triazines Chemical class 0.000 abstract 1
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 18
- 230000000694 effects Effects 0.000 description 14
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 10
- 230000000052 comparative effect Effects 0.000 description 9
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- -1 benzotriazine compound Chemical class 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- 235000015165 citric acid Nutrition 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 5
- 238000007747 plating Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 description 4
- 235000019800 disodium phosphate Nutrition 0.000 description 4
- 229910000397 disodium phosphate Inorganic materials 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000000314 lubricant Substances 0.000 description 4
- 235000011007 phosphoric acid Nutrition 0.000 description 4
- 159000000000 sodium salts Chemical class 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 239000007864 aqueous solution Substances 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000006174 pH buffer Substances 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 239000001632 sodium acetate Substances 0.000 description 3
- 235000017281 sodium acetate Nutrition 0.000 description 3
- 239000001509 sodium citrate Substances 0.000 description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- FEWJPZIEWOKRBE-JCYAYHJZSA-N Dextrotartaric acid Chemical compound OC(=O)[C@H](O)[C@@H](O)C(O)=O FEWJPZIEWOKRBE-JCYAYHJZSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- FEWJPZIEWOKRBE-UHFFFAOYSA-N Tartaric acid Natural products [H+].[H+].[O-]C(=O)C(O)C(O)C([O-])=O FEWJPZIEWOKRBE-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 150000002009 diols Chemical class 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- 231100000989 no adverse effect Toxicity 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000003002 pH adjusting agent Substances 0.000 description 2
- 239000006179 pH buffering agent Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- HELHAJAZNSDZJO-OLXYHTOASA-L sodium L-tartrate Chemical compound [Na+].[Na+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O HELHAJAZNSDZJO-OLXYHTOASA-L 0.000 description 2
- 239000001433 sodium tartrate Substances 0.000 description 2
- 229960002167 sodium tartrate Drugs 0.000 description 2
- 235000011004 sodium tartrates Nutrition 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 239000011975 tartaric acid Substances 0.000 description 2
- 235000002906 tartaric acid Nutrition 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- 238000003971 tillage Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000000870 ultraviolet spectroscopy Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 description 1
- HXQHRUJXQJEGER-UHFFFAOYSA-N 1-methylbenzotriazole Chemical compound C1=CC=C2N(C)N=NC2=C1 HXQHRUJXQJEGER-UHFFFAOYSA-N 0.000 description 1
- QEQMGPQHHWLTHV-UHFFFAOYSA-N 1-sulfanylbenzotriazole Chemical compound C1=CC=C2N(S)N=NC2=C1 QEQMGPQHHWLTHV-UHFFFAOYSA-N 0.000 description 1
- GLGIHGJHHSONCV-UHFFFAOYSA-N 1-sulfanylpropane-1,2-diol Chemical compound CC(O)C(O)S GLGIHGJHHSONCV-UHFFFAOYSA-N 0.000 description 1
- JMEVHYCNAPFOAB-UHFFFAOYSA-N 2-(3-hydroxy-5-sulfo-1H-indol-2-yl)-3-oxoindole-5-sulfonic acid Chemical compound Oc1c([nH]c2ccc(cc12)S(O)(=O)=O)C1=Nc2ccc(cc2C1=O)S(O)(=O)=O JMEVHYCNAPFOAB-UHFFFAOYSA-N 0.000 description 1
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 description 1
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 241000238631 Hexapoda Species 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 1
- 239000013543 active substance Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- DKQVJMREABFYNT-UHFFFAOYSA-N ethene Chemical group C=C.C=C DKQVJMREABFYNT-UHFFFAOYSA-N 0.000 description 1
- BQBKYSPXQYHTIP-UHFFFAOYSA-N ethyl n-butylcarbamate Chemical compound CCCCNC(=O)OCC BQBKYSPXQYHTIP-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009313 farming Methods 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- VUVZASHBYYMLRC-UHFFFAOYSA-N heptane-2,3-diol Chemical compound CCCCC(O)C(C)O VUVZASHBYYMLRC-UHFFFAOYSA-N 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000001630 malic acid Substances 0.000 description 1
- 235000011090 malic acid Nutrition 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 238000010979 pH adjustment Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/16—Sulfur-containing compounds
- C23F11/165—Heterocyclic compounds containing sulfur as hetero atom
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Led Device Packages (AREA)
Abstract
Description
201134982 六、發明說明: 【發明所屬之技術領域】 本發明有關金屬,特別是銀或銀合金的表面處理劑 (surface treatment agent) ° 【先前技術】 為作為電子㈣料接零件之連接器(⑶nnec t 〇r),多 ❹經於黃銅或μ銅的表面施加銅或鎳的底基電鍵,並 於其上施加有鑛銀之材料。由於銀為一種電及熱的良導體 (good conductor)之故,銀即如上所述,為連接器或引線 框架(lead f麗)等的電錄所使用。但,錄銀材料卻有容 易在空氣中變色,特別是在含有硫之氛圍中即受腐姓而變 色為茶褐色或青黑色,以致有電氣接觸變差之問題。 作為解決此種問題之方法之一種,有表面處理法。亦 即,使用處理液以處理鍍銀表面,藉以防止因變色所引起 之外觀的劣化或接觸電阻的升高者。作為鑛銀材料的以往 的表面處理法而言,例如,專利文獻丨所示,係於含有抑 制劑(inhibitor)之溶液中處理鍍銀材料之方法。依此方 法,雖然可確認能防止因鍍銀的腐蝕所引起之效果,惟其 防止效果並不完全,視氛圍之不同,仍有一部分會變色之 問題。 又,於專利文獻2中,記載有一種能防止因鍍銀材料 的腐蝕所引起之變色,更能對電鍍表面賦與潤滑性之表面 處理液及表面處理方法。該表面處理液,作為抑制劑而含 有選自特定的苯并三咪系化合物、酼基笨并噻唑系化合物、 322696 4 201134982 以及三哄系化合物所成群之1種或2種以上,再含有潤滑 劑、及乳化劑。由於該表面處理液並未實施pH調整之故, 可認為係在pH8. 9至8. 9之間實施表面處理者。當作為連 接器使用時,其能防止變色之同時,能賦與潤滑性者,惟 其防止變色之效果並非充分者,又就财熱性而言,亦並不 足夠者。 另一方面’發光二極體(LED)裝置,係對半導體的pn 接合(junction)流通正向電流(forward current),並在接 合區域使電子與電洞複合(recombination)藉以使其發光 之二極體(diode),而由於構造單純且能使電能量直接變換 為光能量之故’變換效率及可靠性高,現已廣泛被實用化。 近年來,從省能源、以及環境保護的觀點來看,作為 替代至今所用的白熾電泡或螢光燈之新光源、新照明器具 之白光發光二極體的利用正受瞻目。 此種發光二極體裝置,係作成將引線框架的底座加以 加工,於被反射部所包圍之位置載置LED晶片,並在反射 部有效釋出LED晶 >;的發光之設計。又需要時作成使用環 氧樹脂等樹脂而將前述LED晶片加以密封之構成。 此種發光二極體裝置,亦已作為光源而實用化者,惟 尚有種種待改善之問題。其中之—有提升反射㈣反射率 之課題。 至今,作為光反射率優異的材料而言,已知銀 或者金的薄膜係為有用的材料(專利文獻3、4)。复、 知銀係光澤度、反射率均高,為反射材料最合適的材料已 322696 5 201134982 然而,銀有活性,銀膜表面會因氧化而容易變色並 影響銀膜的光反射性,以致降低其性能。特別是,因乙肋 製造過程的加熱處理所引起之變色’使用時所處的高溫環 境下的變色所引起的光反射性的低落會成為問題。 衣 但,對銀膜的光反射性能的改善,或者因氧化所引起 之變色,特別是因高溫環境下之變色所引起之光反射性能 的低落之對策而言,至今尚無有效的技術開發,特別是利 用為車用、照明用4需要咼亮度之作為白色光源的促進利 用上有所貢獻而盼望有此種改善。 亦即,盼望開發一種即使被暴露在LED製造過程等中 的加熱處理,或使用時所處之高溫環境下仍然變色防止效 果高、銲線(wire bonding)特性優異,不會有因表面處理 所引起之反射率的劣化之金屬的表面處理劑。 [先前技術文獻] [專利文獻] 專利文獻1:日本特開平5-311492號公報 專利文獻2:日本特開平9-249977號公報 專利文獻3 :日本特開2005-56941號公報 專利文獻4:日本特開平9-293904號公報 【發明内容】 [發明所欲解決之課題] 本發明之目的在於提供一種即使被暴露在led製造過 程中的加熱處理’或使用時所處之高溫環境下仍然變色防 止效果高、銲線特性優異’不會有因表面處理所引起之反 6 322696 201134982 射率的劣化之金屬的表面處理劑。 [用以課題之手段] 本發明人為解決上述問題點而專心研究之結果,終於 達成如下所求之表面處理劑之發明。 亦即,本發明為: (1)一種金屬的表面處理劑,其特徵為:使作為抑制劑 之選自下述一般式(1)所示之苯并三唑系化合物、下述一般 式(2)所示之Μ基苯并噻唑系化合物、以及下述一般式(3) 所示之三畊系化合物所成群之1種或2種以上的化合物溶 解或分散於水中,並調整pH為4至7者。201134982 VI. Description of the Invention: [Technical Field] The present invention relates to a surface treatment agent for a metal, particularly a silver or a silver alloy. [Prior Art] A connector for an electronic (four) material connection part ((3)nnec t 〇r), a copper or nickel substrate bond is applied to the surface of brass or μ copper, and a material of mineral silver is applied thereto. Since silver is a good conductor of electricity and heat, silver is used as described above for connectors such as connectors or lead frames. However, the silver-recording material is liable to change color in the air, especially in the atmosphere containing sulfur, which is changed to brown or blue-black due to the rot, so that the electrical contact is deteriorated. As one of the methods for solving such a problem, there is a surface treatment method. That is, the treatment liquid is used to treat the silver-plated surface, thereby preventing deterioration of the appearance due to discoloration or an increase in contact resistance. As a conventional surface treatment method of a mineral silver material, for example, as shown in the patent document, a method of treating a silver plating material in a solution containing an inhibitor is used. According to this method, although it is confirmed that the effect caused by the corrosion of silver plating can be prevented, the prevention effect is not complete, and depending on the atmosphere, there is still a problem that some of them may be discolored. Further, Patent Document 2 describes a surface treatment liquid and a surface treatment method capable of preventing discoloration due to corrosion of a silver plating material and imparting lubricity to the plating surface. The surface treatment liquid contains, as an inhibitor, one or more selected from the group consisting of a specific benzotriazine compound, a decyl benzothiazole compound, a 322696 4 201134982, and a triterpenoid compound, and further contains Lubricants, and emulsifiers. The surface treatment is carried out between pH 8.9 and 8.9, as the surface treatment liquid is not subjected to pH adjustment. When used as a connector, it can prevent discoloration while imparting lubricity. However, the effect of preventing discoloration is not sufficient, and it is not sufficient for financial efficiency. On the other hand, a 'light-emitting diode (LED) device circulates a forward current to a pn junction of a semiconductor, and combines electrons and holes in a junction region to illuminate it. The diode is widely used because of its simple structure and ability to directly convert electrical energy into light energy, which has high conversion efficiency and high reliability. In recent years, from the viewpoints of energy saving and environmental protection, the use of white light-emitting diodes as a new light source for new incandescent bulbs or fluorescent lamps and new lighting fixtures has been attracting attention. Such a light-emitting diode device is designed such that the base of the lead frame is processed, and the LED chip is placed at a position surrounded by the reflecting portion, and the LED crystal is efficiently released in the reflecting portion. Further, when necessary, a resin such as an epoxy resin is used to seal the LED wafer. Such a light-emitting diode device has also been put to practical use as a light source, but there are still various problems to be improved. Among them - there is the problem of improving the reflectivity of the reflection (four). A material having excellent light reflectance is known as a material of silver or gold (Patent Documents 3 and 4). The complex and known silver have high gloss and reflectivity, and are the most suitable materials for reflective materials. 322696 5 201134982 However, silver is active, and the surface of silver film will easily change color due to oxidation and affect the light reflectivity of silver film, so as to reduce Its performance. In particular, the discoloration caused by the heat treatment of the manufacturing process of the rib ribs, the deterioration of the light reflectance caused by the discoloration in the high temperature environment at the time of use, becomes a problem. However, there is no effective technology development for improving the light reflection performance of the silver film or the discoloration caused by oxidation, especially the low light reflection performance caused by discoloration in a high temperature environment. In particular, it is expected to have such an improvement by contributing to the promotion of use as a white light source for lighting for vehicles and lighting. In other words, it is expected to develop a heat treatment which is exposed to an LED manufacturing process or the like, or has a high discoloration prevention effect and excellent wire bonding characteristics in a high temperature environment at the time of use, and there is no possibility of surface treatment. A surface treatment agent for a metal that causes deterioration in reflectance. [PRIOR ART DOCUMENT] [Patent Document 1] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. SUMMARY OF THE INVENTION [Problem to be Solved by the Invention] An object of the present invention is to provide a discoloration prevention even in a high-temperature environment in which a heat treatment is performed during exposure to a LED manufacturing process. High effect and excellent weld line characteristics 'There is no surface treatment agent for metal which is deteriorated by the surface treatment caused by the surface treatment. [Means for the problem] The inventors have intensively studied the results to solve the above problems, and finally achieved the invention of the surface treatment agent as follows. That is, the present invention is: (1) A surface treatment agent for a metal characterized by using a benzotriazole-based compound represented by the following general formula (1) as an inhibitor, and the following general formula ( 2) One or two or more compounds of the above-described mercaptobenzothiazole-based compound and the three-tillage compound represented by the following general formula (3) are dissolved or dispersed in water, and the pH is adjusted to 4 to 7 people.
RiRi
(1) (式中,Ri表示氫、取代或無取代之烧基,R2表示驗金 屬、氫、取代或無取代之烷基。) (2) (式中,R3表示鹼金屬或氫。)(1) (wherein Ri represents hydrogen, a substituted or unsubstituted alkyl group, and R2 represents a metal, hydrogen, substituted or unsubstituted alkyl group.) (2) (wherein R3 represents an alkali metal or hydrogen.)
(3) [式中’ R4表不經-SH、烧基、稀基或芳基取代之胺基、 或炫基取代味嗤基烧基’ R5、R6表不-NH2、-SH或-SM(M表 示驗金屬)。] 7 322696 201134982 (2)如前述(1)記載之金屬的表面處理劑,其中, 有表面活性劑。 3 ⑶如前述⑴或⑵記載之金屬的表面處理劑,其中, 前述金屬為銀或銀合金。 ⑷如前述⑴至⑶之任一項所記载之金屬的表面處 理劑’其係使用於表面具有銀或銀合金之⑽反㈣ ⑸-種表面具有金屬之基材’其特徵為:經使用前述 (1)至(3)之任一項所記載之金屬的表面處理劑處理者。 (6) 如前述(5)記載之表面具有金屬之基材,其中,經 使用前述表面處理劑處理之金屬的表面,係在2〇(rc實施 1 〇刀知的熱處理,再在12〇°C實施6小時的熱處理後變色 防止性仍然優異者。 (7) 如前述(5)或(6)記載之表面具有金屬之基材,其 中’前述基材係表面具有銀或銀合金之LED反射材料。 [發明之效果] 經以本發明之表面處理劑處理之金屬表面,係加熱處 理後變色防止效果仍高,銲線特性優異,不會有因表面處 理所引起之反射率的變化。又,本發明之表面處理劑係水 溶性者,而由於未含有機溶劑或或重金屬之故,安全性亦 優異,不會發生處理不均或斑點的外觀不良。又,接觸電 阻較低、鮮劑沾濕性(solder wettability)亦良好。 【實施方式】 [發明之最佳實施形態] 本發明之表面處理劑中所含有之抑制劑,係下述中所 322696 201134982 示之化合物,即選自苯并三唾系化合物、疏基苯并翻系 化合物、三畊系化合物之中之i種或2種以上。此等抑制 劑’係由於與金屬進行反應並於金屬表面生成薄的保護膜, 並藉由該膜而保護金屬内部之故,其結果,金屬表面的耐 I虫性(耐變色性)即獲提升。 本發明中所使用之笨并三0坐系化合物,可以一般式(1) 表不 R2(3) [In the formula, R4 represents an amine group which is not substituted with -SH, an alkyl group, a dilute group or an aryl group, or a thiol group substituted for a miscible group. R5, R6 represents -NH2, -SH or -SM (M indicates metal inspection). (2) The surface treatment agent for a metal according to the above (1), which has a surfactant. (3) The surface treatment agent for a metal according to the above (1) or (2), wherein the metal is silver or a silver alloy. (4) A surface treatment agent for a metal according to any one of the above (1) to (3), which is used for (10) a (4) (5)-type substrate having a metal surface having silver or a silver alloy on the surface, which is characterized by: The surface treatment agent of the metal described in any one of the above (1) to (3). (6) The substrate having a metal surface as described in the above (5), wherein the surface of the metal treated with the surface treatment agent is 2 〇 (rc is subjected to a heat treatment of 1 knives, and then at 12 〇 (C) The substrate having a metal surface as described in the above (5) or (6), wherein the surface of the substrate has silver or silver alloy LED reflection. [Effects of the Invention] The surface of the metal treated with the surface treatment agent of the present invention has a high discoloration prevention effect after heat treatment, and has excellent weld line characteristics, and does not have a change in reflectance due to surface treatment. The surface treatment agent of the present invention is water-soluble, and since it does not contain an organic solvent or a heavy metal, it is excellent in safety, and does not cause uneven appearance or uneven appearance of spots. Further, the contact resistance is low and the freshener [Embodiment of the Invention] [Embodiment of the Invention] The inhibitor contained in the surface treatment agent of the present invention is a compound of the following 322696 201134982, which is selected Any one or two or more of a benzotris-based compound, a thiol-benzoate compound, and a tri-farming compound. These inhibitors are formed by reacting with a metal to form a thin protective film on the metal surface. And the inside of the metal is protected by the film, and as a result, the insect resistance (discoloration resistance) of the metal surface is improved. The stupid ternary compound used in the present invention can be of a general formula ( 1) Table does not R2
(式中,Rl表示氫、取代或無取代之烷基,匕表示鹼金 屬、氫、取代或無取代之烷基。) 一般式(1)中的R,所表示之取代或無取代之烷基而 言,較佳為碳數1至24的烷基,又R2所表示之取代或無 取代之烷基而言,較佳者亦為碳數1至24的烷基。又,前 述取代基而言’較佳為絲、錄、減等。前述胺基亦 可為以碳數1至24的烧基所取代基。 可以該一般式(1)表示之化合物之中,較佳者可例舉苯 并二唑(Ri、R2均為氫)、14一甲基苯并三唑(Ri為氫、匕為 甲基)、甲苯基三唑(Rl為甲基、匕為氫)、二辛基 胺甲基)笨并二唑(r,為氫、1為N,N_二辛基胺甲基)等。 本發明中所使用之酼基苯并嗟峻系化合物,可以一般 式(2)表示 322696 9 201134982(wherein R1 represents hydrogen, a substituted or unsubstituted alkyl group, and 匕 represents an alkali metal, hydrogen, substituted or unsubstituted alkyl group.) R in the general formula (1), a substituted or unsubstituted alkane represented by The alkyl group is preferably an alkyl group having 1 to 24 carbon atoms, and a substituted or unsubstituted alkyl group represented by R2 is preferably an alkyl group having 1 to 24 carbon atoms. Further, the term "substituent" is preferably silk, recorded, reduced or the like. The aforementioned amine group may also be substituted with a carbon group of 1 to 24 carbon atoms. Among the compounds represented by the general formula (1), preferred are benzobisazole (Ri and R2 are both hydrogen) and 14-methylbenzotriazole (Ri is hydrogen and hydrazine is methyl). And tolyltriazole (Rl is methyl, hydrazine is hydrogen), dioctylamine methyl) benzobisazole (r, hydrogen, 1 is N, N-dioctylaminemethyl) and the like. The mercaptobenzoxanthene compound used in the present invention can be represented by the general formula (2) 322696 9 201134982
C-S-r3 (2) (式中,R3表示鹼金屬或氫。) 以該一般式⑵表示之化合物之中,較佳者可例舉毓 二本、嗟唾、巯基苯并㈣的鈉鹽、疏基苯㈣嗤的卸鹽 等。於-般式⑵巾’ # r3秘金屬的情形 射系化合姆杨轉衫為以。 邊土本并 三畊系化合物,可以一般式(3)表示 (3)CS-r3 (2) (wherein R3 represents an alkali metal or hydrogen.) Among the compounds represented by the general formula (2), preferred are exemplified by the sodium salt of bismuth, hydrazine, decyl benzo (tetra), Unsalted salt of sulfhydryl benzene (tetra) hydrazine. In the case of the general-style (2) towel' #r3 secret metal. The compound of the three soils, which can be expressed by the general formula (3) (3)
Re / [式中,R4表示經-SH、烷基、烯基或芳基取代之胺基、 或垸基取代㈣基縣,R5、Re表*_腦、—sh或领 示鹼金屬)。] 前述烷基 1而芳基而 一般式(3)中的R4所表示之胺基的取代基之 f稀基而言’較佳為碳數1至24的烷基、婦基 言’較佳為笨基。 土 可以該一 下所述者。 般式(3)表示之化合物之中較佳者可例舉如 322696 10 201134982Re / [wherein R4 represents an amine group substituted with -SH, an alkyl group, an alkenyl group or an aryl group, or a thiol group substituted with a (4)yl group, R5, Re table *_brain, -sh or an alkali metal). The alkyl group and the aryl group are preferably an alkyl group having a carbon number of 1 to 24, preferably a carbon group of 1 to 24, which is preferably an alkyl group of the substituent of the amine group represented by R4 in the formula (3). For the stupid base. The soil can be described below. Preferred among the compounds represented by the general formula (3) can be exemplified as 322696 10 201134982
或者,有此等的Na或K等的驗金屬鹽。如一般式(3) 中,R5、Re為-SM之情形,則三畊系化合物對水的溶解將成 為容易。 抑制劑,會被水所溶解或分解。抑制劑的添加量係在 11 322696 201134982 0. 001至lwt(重量)%的範圍’較佳為〇 〇〇1至〇· lwt%。如 在O.OOlwt%以下時,則難於確認處理效果,而如在lwt% 以上時,則會顯現對接觸電阻之不良影響。 水,較佳為採用純水,並使抑制劑溶解或分散後,調 整pH為4至7。作為PH調整劑,較佳為採用磷酸、醋酸、 檸檬酸、酒石酸、草酸、蘋果酸、號酸等有機酸等曰。 如pH低時,則變色防止效果會增高,惟液的穩定 不佳。又,抑制劑的溶解性亦會不佳。相反地 會 則雖然液的穩定性會良好,惟變色防止效果 巧時’ 色防止效果與液的穩定性來看,邱為4至 民。從變Alternatively, there are such metal salts as Na or K. In the case of the general formula (3), when R5 and Re are -SM, it is easy to dissolve the water by the three tillage compounds. The inhibitor will be dissolved or decomposed by water. The amount of the inhibitor added is in the range of 11 322696 201134982 0. 001 to 1 wt% by weight, preferably 〇 〇 1 to 〇 · lwt%. When it is below O.OOlwt%, it is difficult to confirm the treatment effect, and if it is more than 1 wt%, the adverse effect on the contact resistance is exhibited. The water, preferably using pure water, and allowing the inhibitor to dissolve or disperse, adjusts the pH to 4 to 7. As the pH adjuster, hydrazine such as phosphoric acid, acetic acid, citric acid, tartaric acid, oxalic acid, malic acid, or citric acid is preferably used. If the pH is low, the discoloration prevention effect will increase, but the liquid is not stable. Also, the solubility of the inhibitor may be poor. On the contrary, although the stability of the liquid will be good, but the effect of discoloration prevention is good, the color prevention effect and the stability of the liquid are considered, Qiu is 4 to the people. Change from
為5至6。 而較佳PH 再者’本發明之表面處理劑中,可以使 水溶液中’提高金屬表面的_、性以使溶奸溶解於 洗滌金屬表面等目的而含有表面活性劑。& ^易渗透, 面處理劑,為使抑制劑溶解於水溶液中之目本發明之表 溶解助劑(dissolution aids)。 ’而可含有 表面活性劑而言,心天_系表面活 解性優異,對環境之不良影響少之故較宜。^為生物分 解較少的絲苯紛環氧乙燒加成物或高級醇2或驗之分 物很適合使用。 长乙烷力口成 溶解助劑而言,甲基二醇、異丙基二醇 二醇系醚,或曱基丙二醇、内基丙二醇、丁烏基二醇等 二醇系醚等很適合使用。 土内二醇等丙 又,4再含有之成分而言,可例舉 322696 12 201134982 pH緩衝劑,可發揮使溶液的pH為一定,以控制抑制 劑的吸附性之作用。pH緩衝劑而言,可例舉磷酸氫鈉、醋 酸、醋酸鈉、擰檬酸、擰檬酸、酒石酸、酒石酸鈉等。如 考慮成本及使用性等時,較佳為檸檬酸、醋酸納等。 本發明之表面處理劑中,不含有潤滑劑。如使用於電 子設備用連接零件之連接器用途之表面處理劑的情形,需 要對金屬表面賦與潤滑性之故使其含有潤滑劑,惟非連接 器用途,而使用於LED反射材料等之本發明之表面處埋 劑,則並不需要賦與潤滑性,又由於因賦與潤滑性之結果 可能對銲線特性有不良影響之故,並不含有潤滑劑。 處理方法而言,將被處理材浸潰於表面處理劑中,或 將表面處理劑加以喷霧(spray)或塗佈等,任一方法均可採 用,惟較佳為浸潰。浸潰條件而言,在溫度15至60°C、5 秒鐘以上,例如浸潰5秒鐘至1分鐘左右即可,然後水洗 務,並乾燥。 水洗滌之結果,處理不均或斑點等的外觀不良即消失。 該處理材,係於表面具有金屬之基材,而金屬而言, 可例舉銀、銀合金、銅、黃銅、填青銅、鐵等。特別是作 為容易變色之銀及銀合金的表面處理劑很適合使用。銀合 金而言,可例舉銀與金、始、銅、lG(Pd)、銦(In)、錫、 鋅、釕(Ru)、錄(Rh)、絲(Bi)等之合金。 如此方式使用本發明之表面處理劑以處理於表面具有 金屬之基材,則可於金屬表面形成由表面處理劑所成之膜。 本發明之表面處理劑係水溶液,而由於未含有機溶劑 13 322696 201134982 或重金屬之故,穩定性優異者。χ,使用本發明 理劑處理後所得之具心表域關所成之膜之 处 面,例如’在2,C 1〇分鐘的熱處理,在12 : 熱處理後不僅變色防止性仍紐異,賴電劑、 反射率的劣化。触良好’亦無因表*處理㈣起之 因而本發明之金屬的表面處理劑,可適合使用作為 表面具有銀或銀合金之LED的反射材料的表面處 ·、'、 [實施例] 以下,舉出實施例以詳細說明本發明。 (實施例1) 作為被處理基材’使用經於純銅基板實施4^m厚的鍍 銀者,於下述所示之表面處理劑中在4(rc浸潰3〇秒鐘, 然後水洗滌並使用乾燥器使其溫風乾燥,以實施表面處理。 (表面處理劑組成) 〇. 01 wt% 〇· 01 wt% 1 wt% 抑制劑:三哄-2, 4, 6-三硫醇 表面活性劑:油醇羥乙氧基酯 1 wt% 調整為pH5. 5。 溶解助劑:丁基丙二醇 pH緩衝劑:磷酸氫鈉 作為pH調整劑而使用磷酸, 就實施例1的表面處理後的基材,在未經熱處理之 下’依據JIS H8502,實施硫化氫氣體試驗(硫化氫濃度: 3ppm,溫度:40°C,濕度80%RH(相對濕度),試驗時間:4 小時)’進行外觀肉眼觀察。又’利用熱風循環式乾燥機以 322696 14 201134982 實施200°Cxl0分鐘的加熱處理後,再進行120°Cx6小時的 加熱處理,並就加熱處理後的基材進行與不實施熱處理之 情形同樣的硫化氫試驗,再進行外觀的肉眼觀察。 (評價基準) 〇:依肉眼觀察,無電鍍表面的變色 △:依肉眼觀察,電鍍表面變色為淡薄的藍色 X:依肉眼觀察,電鍍表面變色為濃厚的藍黑色 將結果表示於表1中。 (實施例2至8、比較例1至8) 除將實施例1中之抑制劑及pH緩衝劑變更為表1所記 載的化合物及濃度,並使用磷酸將pH作成表1中所示之值 以外,其餘則按與實施例1同樣方式以實施被處理材的表 面處理,並按與實施例1同樣方式加以評價。 將結果表示於表1中。 15 322696 201134982 [表l] 表面處理液之組成 試驗結果 抑制劑及其濃度(wt%) pH緩衝劑 及其濃度 (wt%) pH 硫化氫氣體試 驗後之外觀 熱處理及硫 化氫氣體試 驗後之外觀 實施例1 三畊-2,4, 6-三硫醇 0.01 磷酸 氣納 1 5.5 〇 〇 實施例2 三畊-2,4, 6-三硫醇的 納鹽 0.01 檸檬 酸鈉 1 6.0 〇 〇 實施例3 2-苯胺基三畊-4, 6-二 硫醇 0.01 磷酸 氫納 1 6.5 〇 〇 實施例4 2-二乙基胺基三哄 -4, 6-二硫醇 0.005 檸檬 酸鈉 1 5.5 〇 〇 實施例5 2-二丁基胺基三啡 -4, 6-二硫醇的鈉鹽 0.01 醋酸 鈉 1 6.0 〇 〇 實施例6 2-二己基胺基三哄 -4, 6-二硫醇 0.01 酒石 酸鈉 1 5.5 〇 〇 實施例7 1-曱基苯并三唑 0.01 磷酸 氫鈉 1 6.5 〇 〇 實施例8 疏基苯并噻唑的鈉鹽 0.005 檸檬 酸鈉 1 5.5 〇 〇 比較例1 未處理 — — — — X X 比較例2 2-苯胺基三畊-4, 6-二 硫醇 0.01 — — 7.5 Δ Δ 比較例3 2-苯胺基三哄-4, 6-二 硫醇 0.005 — — 7.5 Δ Δ 比較例4 2-二丁基胺基三畊 -4, 6-二硫醇 0.01 氫氧 化納 1 9.0 Δ Δ 比較例5 2-二丁基胺基三哄 -4, 6-二硫醇的鈉鹽 0.005 檸檬 酸 1 3.0 Δ Δ 比較例6 三畊-2,4, 6-三硫醇 0.01 — — 7.5 △ Δ 比較例7 巯基苯并噻唑的鈉鹽 0.005 — — 7.5 Δ Δ 比較例8 1-甲基苯并三唑 0.01 氫氧 化鈉 1 9.0 Δ Δ 使用實施例1、2、7以及比較例1之表面處理後的基 材,如下述方式進行接觸電阻、鮮劑沾濕性、鲜線特性、 反射率的評估。將結果表示於表2中。 (1)接觸電阻 16 322696 201134982 接觸電阻,係依直流7.4mA、開路電壓20mV、荷重2. 5 至50g之條件下測定者。接觸電阻的判斷基準為如下所示。 〇:接觸電阻在〇. 02Ω以下 x :接觸電阻在0.02Ω以上 (2) 銲劑沾濕性 銲劑沾濕性,係於265。(:的錫-銀-銅合金之銲劑槽内 浸潰熱處理前後之試樣,並測定浮力成為零止所需要之時 間後加以評價。熱處理係在20(TC實施10分鐘之後,再在 120 C實施6小時。銲劑沾濕性的判斷基準為如下所示。 〇 :浮力成為零止所需要之時間在0. 2秒以下 x ·浮力成為零止所需要之時間在〇. 2秒以上 (3) 銲線特性 鲜線特性,係將線(Wire)加以銲接後依5〇〇# m/秒之 速度杈彳丨線使其切斷 ,按線的切斷位置加以評價。銲線特 性的判斷基準為如下所示。 〇.線發生切斷 X =在線與試樣的接合面發生剝離 (4) 反射率 反射率,係使用紫外線可見分光光度計(ultraviolet visible spectro-photometer)測定熱處理前後的試樣在 450至900nm波長下的反射率藉以評價。熱處理係在200 °C實施1〇分鐘之後,再在12〇。(:實施6小時。反射率的判 斷基準為如下所示。 〇:在450至900nm的波長下,所有反射率成為90% 17 322696 201134982It is 5 to 6. Further, in the surface treatment agent of the present invention, it is preferable to contain a surfactant in the aqueous solution to improve the surface of the metal to dissolve the plaque on the surface of the washing metal. & ^Infiltration, surface treatment agent, the dissolution aids of the present invention for dissolving the inhibitor in an aqueous solution. Further, in the case where a surfactant is contained, it is preferable that the surface of the heart is excellent in surface activity and has little adverse effect on the environment. ^The fraction of the benzene-containing Ethylene Ethylene Additive or the Higher Alcohol 2 or the test which is less biodegradable is suitable for use. Methyl diol, isopropyl glycol diol ether, or diol ether such as mercapto propylene glycol, internal propylene glycol, and butyl urethane are suitable for use as a dissolution aid. . For example, 322696 12 201134982 pH buffering agent can be used to control the adsorbing property of the inhibitor. The pH buffering agent may, for example, be sodium hydrogen phosphate, acetic acid, sodium acetate, citric acid, citric acid, tartaric acid or sodium tartrate. When considering cost and usability, etc., citric acid, sodium acetate, etc. are preferable. The surface treatment agent of the present invention does not contain a lubricant. In the case of a surface treatment agent used for a connector for connecting parts for electronic equipment, it is necessary to impart lubricity to the metal surface to contain a lubricant, but it is not used for a connector, but is used for an LED reflective material or the like. The surface burying agent of the invention does not need to impart lubricity, and may not contain a lubricant because it may adversely affect the characteristics of the wire due to the imparting of lubricity. In the treatment method, the material to be treated is impregnated into the surface treatment agent, or the surface treatment agent is sprayed or coated, and any method may be employed, but it is preferably impregnated. For the impregnation conditions, the temperature is 15 to 60 ° C for 5 seconds or more, for example, for 5 seconds to 1 minute, and then water is washed and dried. As a result of water washing, the appearance defects such as uneven processing or spots are lost. The treatment material is a substrate having a metal on the surface, and the metal may, for example, be silver, silver alloy, copper, brass, bronze, iron or the like. In particular, a surface treatment agent which is easy to discolor silver and a silver alloy is suitable for use. The silver alloy may, for example, be an alloy of silver and gold, tin, copper, lG (Pd), indium (In), tin, zinc, ruthenium (Ru), rhenium (Rh) or silk (Bi). When the surface treating agent of the present invention is used in such a manner to treat a substrate having a metal on the surface, a film formed of a surface treating agent can be formed on the surface of the metal. The surface treatment agent of the present invention is an aqueous solution, and since it does not contain an organic solvent 13 322696 201134982 or a heavy metal, the stability is excellent. χ, using the treatment agent of the present invention, the surface of the film obtained by the treatment of the core surface, such as 'heat treatment at 2, C 1 〇 minutes, at 12: heat treatment, not only discoloration prevention is still different, Lai Electrochemical, deterioration of reflectivity. The surface treatment agent of the metal of the present invention can be suitably used as a surface of a reflective material having an LED having a silver or a silver alloy on its surface, and is not suitable for the treatment of (4). The examples are given to illustrate the invention in detail. (Example 1) As a substrate to be treated, a silver plating having a thickness of 4 μm on a pure copper substrate was used, and 4 (rc was immersed for 3 sec in the surface treatment agent shown below, and then washed with water. It is dried by warm air using a drier to carry out surface treatment. (Composition of surface treatment agent) 〇. 01 wt% 〇· 01 wt% 1 wt% Inhibitor: Triterpenic-2, 4, 6-trithiol surface The active agent: oleyl hydroxyethoxylate 1 wt% adjusted to pH 5. 5. Dissolving aid: butyl propylene glycol pH buffer: sodium hydrogen phosphate as a pH adjuster using phosphoric acid, after surface treatment of Example 1. The substrate was subjected to a hydrogen sulfide gas test (hydrogen sulfide concentration: 3 ppm, temperature: 40 ° C, humidity 80% RH (relative humidity), test time: 4 hours) according to JIS H8502 without heat treatment. Observed with the naked eye. In addition, heat treatment was carried out at 322696 14 201134982 by a hot air circulation dryer at 200 ° C for 10 minutes, followed by heat treatment at 120 ° C for 6 hours, and the heat treatment was performed on the substrate after heat treatment. The same hydrogen sulfide test, and then the appearance of the naked eye (Evaluation Criteria) 〇: According to the naked eye, the discoloration of the electroless plating surface △: According to the naked eye, the electroplated surface is discolored to a light blue X: According to the naked eye, the electroplated surface is discolored to a thick blue black. The results are shown in Table 1. (Examples 2 to 8 and Comparative Examples 1 to 8) The inhibitors and pH buffers of Example 1 were changed to the compounds and concentrations shown in Table 1, and the pH was made using phosphoric acid as shown in Table 1. The surface of the material to be treated was subjected to surface treatment in the same manner as in Example 1 and evaluated in the same manner as in Example 1. The results are shown in Table 1. 15 322696 201134982 [Table 1] Surface treatment Liquid composition test results inhibitor and its concentration (wt%) pH buffer and its concentration (wt%) pH hydrogen sulfide gas after the appearance of heat treatment and hydrogen sulfide gas test appearance Example 1 San Geng-2,4 , 6-trithiol 0.01 phosphoric acid gas 1 5.5 〇〇 Example 2 Sangen-2,4,6-trithiol sodium salt 0.01 Sodium citrate 1 6.0 〇〇 Example 3 2-aniline-based three-ploughing- 4, 6-dithiol 0.01 sodium hydrogen phosphate 1 6.5 〇〇 implementation 4 2-Diethylaminotrim-4,6-dithiol 0.005 Sodium citrate 1 5.5 〇〇 Example 5 Sodium salt of 2-dibutylaminotrimenen-4,6-dithiol 0.01 Sodium acetate 1 6.0 〇〇 Example 6 2-Dihexylaminotrim-4,6-dithiol 0.01 Sodium tartrate 1 5.5 〇〇 Example 7 1-Mercaptobenzotriazole 0.01 Sodium hydrogen phosphate 1 6.5 〇 〇 Example 8 Sodium benzothiazole sodium salt 0.005 Sodium citrate 1 5.5 〇〇 Comparative Example 1 Untreated — — — XX Comparative Example 2 2-Anilinotrid-4,6-dithiol 0.01 — 7.5 Δ Δ Comparative Example 3 2-anilinotriterpene-4,6-dithiol 0.005 — — 7.5 Δ Δ Comparative Example 4 2-Dibutylamine-based three-till-4,6-dithiol 0.01 1 9.0 Δ Δ Comparative Example 5 Sodium salt of 2-dibutylaminotrimethylene-4,6-dithiol 0.005 Citric acid 1 3.0 Δ Δ Comparative Example 6 Sangen-2,4,6-trithiol 0.01 — 7.5 Δ Δ Comparative Example 7 Sodium salt of mercaptobenzothiazole 0.005 — — 7.5 Δ Δ Comparative Example 8 1-Methylbenzotriazole 0.01 Sodium hydroxide 1 9.0 Δ Δ Using Examples 1, 2, 7 and comparison Surface treated sample of Example 1 The material was evaluated for contact resistance, freshness wettability, fresh line characteristics, and reflectance as follows. The results are shown in Table 2. (1) Contact resistance 16 322696 201134982 Contact resistance, measured according to DC 7.4mA, open circuit voltage 20mV, load 2. 5 to 50g. The criterion for determining the contact resistance is as follows. 〇: Contact resistance is 〇. 02Ω or less x: Contact resistance is 0.02Ω or more (2) Solder wettability Solder wettability is 265. (: The tin-silver-copper alloy flux bath is dipped in the sample before and after the heat treatment, and the time required for the buoyancy to become zero is measured. The heat treatment is performed at 20 (after 10 minutes of TC, then at 120 C). 6 hours of implementation. The criteria for determining the wettability of the solder are as follows: 〇: The time required for buoyancy to become zero is less than 0.2 seconds. x The time required for buoyancy to become zero is 〇. 2 seconds or more (3 The characteristic of the fresh wire characteristics of the wire is that after the wire is welded, it is cut at a speed of 5 〇〇 # m/sec, and is evaluated according to the cutting position of the wire. The reference is as follows: 〇. Line breakage X = peeling of the joint surface between the wire and the sample (4) Reflectance reflectance is measured by ultraviolet visible spectrophotometer (ultraviolet visible spectrophotometer) The reflectance at a wavelength of 450 to 900 nm was evaluated. The heat treatment was carried out at 200 ° C for 1 〇 and then at 12 〇. (: 6 hours was carried out. The reflectance was judged as follows. 〇: at 450 All reflections up to 900nm It is 90% 17 322,696,201,134,982
以上。 χ:存在有在450至900nm的波長下反射率成為90%以 下之波長。 [表2] 接觸電阻 熱處理前之 銲劑沾濕性 熱處理後之 銲劑沾濕性 銲線特性 熱處理前之 反射率 熱處理後之 反射率 實施例1 〇 〇 〇 〇 〇 〇 實施例2 〇 〇 〇 〇 〇 〇 實施例7 〇 〇 〇 〇 〇 〇 比較例1 〇 〇 X 〇 〇 X 由於實施例1、2、7中,並未顯示接觸電阻之上升、 銲劑沾濕性之劣化、反射率之劣化之故可知,並無因變色 防止處理所引起之對接觸電阻、銲劑沾濕性、反射率的不 良影響。又,由於實施例1、2、7中,並未發生在線與試 樣的接合面之剝離之故可知,並無因變色防止處理所引起 之對銲線特性的不良影響。 【圖式簡單說明】 無 【主要元件符號說明】 無 18 322696the above. χ: There is a wavelength at which the reflectance becomes 90% or less at a wavelength of 450 to 900 nm. [Table 2] Flux after wettability after contact resistance heat treatment Wet solder wire characteristics after heat treatment Reflectance after heat treatment Reflectance after heat treatment Example 1 〇〇〇〇〇〇 Example 2 〇〇〇〇〇 〇Example 7 〇〇〇〇〇〇Comparative Example 1 〇〇X 〇〇X Since Examples 1, 2, and 7 did not show an increase in contact resistance, deterioration in solder wettability, and deterioration in reflectance. It is understood that there is no adverse effect on contact resistance, flux wettability, and reflectance due to the discoloration prevention treatment. Further, in Examples 1, 2, and 7, the peeling of the bonding surface between the wire and the sample did not occur, and it was found that there was no adverse effect on the wire bonding characteristics due to the discoloration preventing treatment. [Simple diagram description] None [Main component symbol description] None 18 322696
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JP (1) | JP5995305B2 (en) |
CN (2) | CN102713007A (en) |
TW (1) | TWI537422B (en) |
WO (1) | WO2011089943A1 (en) |
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JP6209996B2 (en) * | 2014-03-11 | 2017-10-11 | 住友金属鉱山株式会社 | Metal surface treatment method |
JP6149811B2 (en) * | 2014-06-27 | 2017-06-21 | 住友金属鉱山株式会社 | Method for manufacturing metal member for LED package |
CN113403652B (en) * | 2021-06-17 | 2022-01-14 | 深圳市联合蓝海黄金材料科技股份有限公司 | Protective film electrolyte, gold-plated silver ornament and preparation method thereof |
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JPS6043493A (en) * | 1983-08-19 | 1985-03-08 | Chiyoda Kagaku Kenkyusho:Kk | Discoloration inhibitor for copper |
JP2550436B2 (en) * | 1990-10-23 | 1996-11-06 | 株式会社ジャパンエナジー | Anti-tarnish solution for copper |
JPH09249977A (en) * | 1996-03-13 | 1997-09-22 | Nikko Kinzoku Kk | Surface treatment liquid for silver plated material and surface treatment using the same |
JP2008045215A (en) * | 1999-01-25 | 2008-02-28 | Chemical Denshi:Kk | Metal surface treatment agent, and surface treatment method for metallic layer |
JP4078044B2 (en) * | 2001-06-26 | 2008-04-23 | 日本パーカライジング株式会社 | Metal surface treatment agent, surface treatment method of metal material, and surface treatment metal material |
JP2004169157A (en) * | 2002-11-22 | 2004-06-17 | Mitsubishi Paper Mills Ltd | Process and liquid for treating silver-plated layer |
JP4740754B2 (en) * | 2006-01-27 | 2011-08-03 | 株式会社大和化成研究所 | Anti-discoloration composition |
JP2007266343A (en) * | 2006-03-29 | 2007-10-11 | Toyoda Gosei Co Ltd | Light emitting device |
JP2007266349A (en) * | 2006-03-29 | 2007-10-11 | Matsushita Electric Ind Co Ltd | Conductive member for semiconductor device, package for semiconductor device, and manufacturing method of them |
JP2009120437A (en) * | 2007-11-14 | 2009-06-04 | Niigata Univ | Siloxane-grafted silica, highly transparent silicone composition, and light-emitting semiconductor device sealed with the composition |
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2011
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- 2011-01-11 WO PCT/JP2011/050242 patent/WO2011089943A1/en active Application Filing
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WO2011089943A1 (en) | 2011-07-28 |
CN103789772B (en) | 2016-04-27 |
CN102713007A (en) | 2012-10-03 |
TWI537422B (en) | 2016-06-11 |
JPWO2011089943A1 (en) | 2013-05-23 |
CN103789772A (en) | 2014-05-14 |
JP5995305B2 (en) | 2016-09-21 |
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