201132911 六、發明說明： 【發明所屬之技術領域】 本發明有關於一種背光模組，特別是有關於一種具銀 漿電路之背光模組、其製法及採用此背光模組之電子裝置。 【先前技術】 傳統薄膜鍵盤是將銀漿電路塗佈於導光板之一表面， 藉由光源從導光板之側邊入光，利用導光板現有之導光特 性，將光線朝導光板塗佈有銀漿電路之表面出光，以使薄 膜鍵盤可對外提供光源。 然而，由於銀漿電路本身對於所輸入之光源有高吸收 率與低反射率，且破壞導光板内部之全反射角度，如此， 當光源之光線於導光板中朝銀漿電路出光時，光線不僅會 被銀漿電路所吸收且僅有少部分的光線被反射回來，而無 法對外提供光線與導致光線無法有效在導光板中傳輸，此 外，導光板之表面將呈現色偏，以致降低光源之光利用率。 有鑑於此，如何提出一種解決方案，可有效改善上述 所帶來的缺失及不便，實乃相關業者目前刻不容緩之一重 要課題。 【發明内容】 本發明揭露一種背光模組、其製法及採用此背光模組 之電子裝置，用以提高光線反射率、降低光線被銀漿電路 所吸收之機會，進而提高光源之利用率。 本發明揭露一種背光模組、其製法及採用此背光模組 201132911 之電子裝置，用以減少導光板出光時所呈現色偏之機率， 提高背光模組之出光品質。 此種背光模組、其製法及採用此背光模組之電子裝 置。背光模組包括一導光板、一光源、一反射層及一銀聚 電路層。導光板具有一入光面及一出光面。光源位於導光 板之入光面。反射層具一第一圖案，設於導光板之出光面 上。銀漿電路層具一第二圖案，且設於第一圖案上。 本發明之一實施例中，銀漿電路層之第二圖案之圖形 範圍小於、大於或等於反射層之第一圖案之圖形範圍。 本發明之一實施例中，反射層包括樹脂材料。 本發明之一實施例中，反射層呈白色或銀色。 本發明之一實施例中，反射層呈透明狀，且反射層之 折射率小於導光板之折射率。 本發明之一實施例中，導光板為一軟性電路基板，此 基板具有多個光學微結構，分別位於其入光面、基板相對 出光面之另面，或同時位於其入光面及基板相對出光面之 另面。 本發明之一實施例中，此種電子裝置為一滑鼠、鍵盤、 手機、攝影機、照相機、遊戲機、手錶、音樂播放器、 電子信件收發器、地圖導航器或數位相框。 本發明之另一態樣中，此種背光模組之製法，包含步 驟為：提供一導光板，其中導光板具有一出光面，之後， 依據一第一圖案，將一反射層形成於導光板之出光面上， 之後，依據一第二圖案，將一銀漿電路層形成於第一圖案 201132911 如此，藉由介於銀漿電路層與導光板之間的反射層， 導光板中之光線朝出光面具銀漿電路層之區域時，可被反 射層反射回到導光板後’再由出光面不具反射層或銀毅電 路層之區域出光’如此，便可增加更多出光機會，提供發 光亮及光源之利用率。 【實施方式】 以下將以圖示及詳細說明清楚說明本發明之精神，如 φ 熟悉此技術之人員在瞭解本發明之實施例後，當可由本發 明所教示之技術，加以改變及修飾，其並不脫離本發明之 精神與範圍。 本發明係提供一種背光模組、其製法及採用此背光模 組之電子裝置，係於導光板上製作銀漿電路之前，在銀漿 電路將設置的對應位置先行形成一反射層。如此，當光線 被引導至銀漿電路之前，即被反射層反射回導光板中，以 提高光線反射率，降低光線被銀漿電路所吸收之機會，進 # 而減緩導光板產生非預期色偏之問題，藉此提高光源之利 用率及出光品質。 請參閱第1圖至第3圖所示，第1圖纟會示本發明背光 模組100於一實施例下之俯視圖。第2圖繪示第1圖沿剖 面線2-2之剖面圖暨光線運動圖。第3圖繪示第1圖沿剖 面線3-3之剖面圖暨光線運動圖。 此種背光模組100包括一導光板200、一光源300、一 反射層400及一銀漿電路層500。導光板200具有一入光 面210及一出光面220。此光源300，例如是冷陰極燈管 201132911 (Cold Cathode Fluorescent Lamp，CCFL)或發光二極體 (light-emitting diode，LED)，大致位於導光板200之入光 面210，並朝入光面210發光。反射層400係以一第一圖 案呈現於出光面220之表面。銀漿電路層500係以一第二 圖案呈現於反射層400之第一圖案上，此第二圖案即為一 電路分布圖。電路分布圖分別可對外進行電性連接，並 進行特定功能之運作。 如此，當光源300之光線進入導光板200後，光線可 由出光面220不具反射層400或銀漿電路層500之區域222 進行出光；或者，由於反射層400位於銀漿電路層500與 導光板200之間，當光源300之光線於導光板200中行進 至反射層400時’光線可被反射層400反射回導光板200 中，再由出光面220不具反射層400或銀漿電路層500之 區域222出光。 故，導光板200中朝銀漿電路層500之方向行進之光 線便不會被銀漿電路層500所吸收，進而輾轉地提供更多 的光線至出光面220’以提供更高之發光亮度並提升光源 300之利用率。 本發明之一實施例中’參見第1圖及第3圖所示，第 二圖案之圖形輪廓與第一圖案之圖形輪廓完全相同，且第 二圖案之圖形範圍等於第一圖案之圖形範圍。舉例而言， 第一圖案係由一或多個第一線條401所組成。此第二圖案 係由一或多個第二線條501所組成。第二圖案之第二線條 501之線條寬度502與第一圖案之第一線條4〇1之線條寬 度402相等（如第3圖所示）。 m 6 201132911 或者，第一圖案及第二圖案亦可包括幾何圖形，例如 圓形（圖未示） 換句話說，反射層400完全介於銀漿電路層500與該 導光板200之間，意即透過俯視圖無法由導光板200觀察 到反射層400之第一圖案。如此，當第二圖案完全地疊設 於反射層400表面時，第二圖案完全覆蓋於第一圖案上， 以提供更多出光面220不具反射層400或銀漿電路層500 之區域222，進而提供更高的發光亮度及光源300之利用 率〇 參見第4圖及第5圖所示，第4圖繪示本發明背光模 組於另一實施例下之俯視圖。第5圖繪示第4圖沿剖面線 5-5之剖面圖暨光線運動圖。 本發明背光模組101之另一實施例中，第二圖案之圖 形與第一圖案之圖形輪廓基本上相同，只是第二圖案之圖 形範圍小於第一圖案之圖形範圍。舉上例而言，第一圖案 係由一或多個第一線條401所組成。此第二圖案係由一或 多個第二線條501所組成。第二圖案之第二線條501之線 條寬度502小於第一圖案之第一線條401之線條寬度402 (第5圖）。或者，第一圖案及第二圖案亦可包括幾何圖 形（例如圓形）所組成。（圖未示） 換句話說’當第二圖案疊設於反射層400表面時，第 二圖案無法完全覆蓋第一圖案。如此，由於銀漿電路層500 之第二圖案之圖形範圍小於反射層400之第一圖案之圖形 範圍，第二圖案便可提供更多受到反射的機會，進而提高 光線自出光面220不具反射層400或銀漿電路層500之區 201132911 域222出光的機會。 參見第6圖所示，第6圖繪示本發明背光模組於又一 實j例下之剖视圖暨光線運動圖。本發明背光模組102之 又實施例中’第二圖案之圖形與第一圖案之圖形輪廓基 本上相同， /、疋第二圖案之圖形範圍大於第一圖案之圖形 範圍。舉上仓,丨& _ 牛工例而言，第一圖案係由一或多個第一線條4〇1 所組成。此第二圖案係由-或多個第二線條501所組成。 第二圖幸$笛、 _ 弟二線條501之線條寬度502大於第一圖案之 • 401之線條寬度402，使得第二圖案之第二線條 蓋於第〜圖案之第一線條401及出光面220上。或 者，第一·圖安· η M系及第二圖案亦可包括幾何圖形（例如圓形） 所組成（圖未示）。 換句話說’銀漿電路層500同時覆蓋於反射層400及 出光面220 I- 工°如此，由於反射層400仍位於銀漿電路層 5〇〇與出光面 70161 220之間，反射層400仍可將光線反射至出 220 yC ^ 不具反射層400或銀漿電路層500之區域222。 •本發明之其他實施例中 ，導光板200，例如可為一厚 度均勻之矩形板或一厚度由大至小之楔形板，具有相對之 正面及反面，以及環繞其正面與反面之四個侧面，其正面 或反面的面積均大於其中任一侧面的面積。導光板2〇〇之 任一個侧面皆為入光面210，用以導引入光線進入導光板 200。導光板200之正面即為出光面220，用以送出光線至 外部。 此實施例中，導光板200之材質為透明塑膠材質，例 如為聚對苯二曱酸乙二酯（polyethylene Terephthalate， 201132911 PET)或聚碳酸醋（polycarbonate，PC)。研發人員可依實 際需求或限制加以選擇導光板200之材質。 本發明之又一實施例中，導光板200亦可為一軟式印 刷電路基板（flexible printed circuit board，FPC)。此基板 具有多個光學微結構（圖中未示），可分別位於入光面210、 基板相對出光面220之另面或同時位於入光面210及基板 相對出光面220之另面。本發明並不限制光學微結構之形 式，例如可為凸出狀、凹入狀、球面狀或鋸齒狀等等，以 將光源300所發出之光線產生更多之折射，而更均勻地運 動於導光板200中即可。研發人員可依實際需求或限制加 以調整。 本發明之又一實施例中’反射層400係由具樹脂材料 之膠料’經塗佈或印刷至導光板2 0 0之正面，以便迎合銀 漿電路層500之第二圖案。此外’反射層400較佳可呈白 色或銀色等較佳反射效果之顏色。研發人員可依實際需求 或限制加以調整反射層400之顏色。 此外’反射層400亦可以由一種透明膠材（例如uv膠） 所製成，其中反射層呈透明（或至少半透明），且其（光）折 射率小於導光板之（光）折射率。 請參閱第7圖所示，第7圖繪示本發明電子裝置於一 實施例下之方塊圖。本發明之又一實施例中，上述之此種 背光模組100、101、102之其中之一可應用於一電子裝置 10中β本發明之電子裝置10並不限為滑鼠、鍵盤、手機、 攝影機、照相機、遊戲機、手錶、音樂播放器、電子信 件收發器、地圖導航器及數位相框其中之一。 201132911 第8圖繪示本發明背光模組之製法之流程圖。本發明 之另一態樣係提供一種背光模組，如上述背光模組1〇〇、 101或102之其中之一的製法，係用以提高光源之利 用率及出光品質，其大致步驟至少包含： 步驟801 :提供一上述之導光板2〇〇，由上可知，導光 板200可為具壓克力材質之導光板2〇〇，或軟式印刷電路 基板。 步驟802 ··依據一預設之第一圖案，將一反射層4〇〇 形成於導光板200之一出光面220上。其中反射層4〇〇可 以印刷、轉印、塗佈或平貼等方式，將與上述第二圖案（例 如電路分布圖）相同之圖案輪廓製作於出光面220上。 步驟803 :將具上述第二圖案之銀漿電路層5〇0形成 於反射層400之第一圖案上。此步驟中，研發人員可依實 際需求或限制’選擇讓銀漿電路層5〇〇之第二圖案之圖案 範圍小於（第5圖）、大於（第6圖）或等於（第3圖）反 射層400之第一圖案之圖案範圍。 其中銀漿·電路層500可藉由蒸鑛（evap〇rati〇n)、電 鍍（electroplating)、印刷（printing)、轉移焊錫（s〇ider transfer)等方式，製作於反射層400上。 步驟804 :將一光源300，例如是冷陰極燈管（Cold Cathode Fluorescent Lamp，CCFL )或發光二極體 (light-emitting diode，LED)，設至於導光板 200 之入 光面210，使其可朝入光面210發光。 綜上所述，藉由銀漿電路層500與導光板200之間的 反射層400，本發明不僅克服光線被銀漿電路吸收之問題， 201132911 反而提高出光面220之出光亮度，進而增加光源300之利 用率。 本發明所揭露如上之各實施例中，並非用以限定本發 明，任何熟習此技藝者，在不脫離本發明之精神和範圍内， 當可作各種之更動與潤飾，因此本發明之保護範圍當視後 附之申請專利範圍所界定者為準。 【圖式簡單說明】 為讓本發明之上述和其他目的、特徵、優點與實施例 能更明顯易懂，所附圖式之詳細說明如下： 第1圖繪示本發明背光模組於一實施例下之俯視圖。 第2圖繪示第1圖沿剖面線2-2之剖面圖暨光線運動 圖。 第3圖繪示第1圖沿剖面線3-3之剖面圖暨光線運動 圖。 第4圖繪示本發明背光模組於另一實施例下之俯視 圖。 第5圖繪示第4圖沿剖面線5-5之剖面圖暨光線運動 圖。 第6圖繪示本發明背光模組於又一實施例下之剖視圖 暨光線運動圖。 第7圖繪示本發明電子裝置於一實施例下之方塊圖。 第8圖繪示本發明背光模組之製法之流程圖。 【主要元件符號說明】 11 m 201132911 10 :電子裝置 400 :反射層 100、101、102 :背光模組401 :第一線條 200 :導光板 402 :第一線條寬度 210 :入光面 500 :銀漿電路層 220 :出光面 501 :第二線條 222 :出光面不具反射層或502 :第二線條寬度 銀漿電路層之區域 2-2、3-3、5-5 :剖面線 300 :光源 801-804 :步驟201132911 VI. Description of the Invention: [Technical Field] The present invention relates to a backlight module, and more particularly to a backlight module having a silver paste circuit, a method of fabricating the same, and an electronic device using the backlight module. [Prior Art] A conventional thin film keyboard is formed by applying a silver paste circuit to one surface of a light guide plate, and light is incident from the side of the light guide plate by a light source, and the light guide is applied to the light guide plate by using the existing light guiding property of the light guide plate. The surface of the silver paste circuit is lighted so that the membrane keyboard can provide a light source to the outside. However, since the silver paste circuit itself has high absorption rate and low reflectance for the input light source, and destroys the total reflection angle inside the light guide plate, when the light of the light source is emitted toward the silver paste circuit in the light guide plate, the light is not only Will be absorbed by the silver paste circuit and only a small part of the light is reflected back, and can not provide external light and cause the light can not be effectively transmitted in the light guide plate. In addition, the surface of the light guide plate will be colored, so that the light of the light source is reduced. Utilization rate. In view of this, how to propose a solution that can effectively improve the above-mentioned shortcomings and inconveniences is an important issue for the relevant industry. SUMMARY OF THE INVENTION The present invention discloses a backlight module, a method for fabricating the same, and an electronic device using the same, which are used to improve the light reflectivity and reduce the chance of light being absorbed by the silver paste circuit, thereby improving the utilization of the light source. The invention discloses a backlight module, a method for manufacturing the same, and an electronic device using the backlight module 201132911, which is used for reducing the probability of color deviation when the light guide plate emits light, and improving the light output quality of the backlight module. The backlight module, the method of manufacturing the same, and the electronic device using the backlight module. The backlight module includes a light guide plate, a light source, a reflective layer and a silver poly circuit layer. The light guide plate has a light incident surface and a light exit surface. The light source is located on the light incident side of the light guide plate. The reflective layer has a first pattern disposed on the light exit surface of the light guide plate. The silver paste circuit layer has a second pattern and is disposed on the first pattern. In one embodiment of the invention, the second pattern of the silver paste circuit layer has a pattern range that is less than, greater than or equal to, the pattern range of the first pattern of the reflective layer. In an embodiment of the invention, the reflective layer comprises a resin material. In one embodiment of the invention, the reflective layer is white or silver. In one embodiment of the invention, the reflective layer is transparent and the refractive index of the reflective layer is less than the refractive index of the light guide plate. In one embodiment of the present invention, the light guide plate is a flexible circuit substrate having a plurality of optical microstructures respectively located on the light incident surface thereof, the other surface of the substrate opposite to the light exit surface, or both of the light incident surface and the substrate opposite to each other. The other side of the light surface. In an embodiment of the invention, the electronic device is a mouse, a keyboard, a mobile phone, a camera, a camera, a game machine, a watch, a music player, an electronic mail transceiver, a map navigator or a digital photo frame. In another aspect of the present invention, the method of manufacturing the backlight module includes the steps of: providing a light guide plate, wherein the light guide plate has a light exiting surface, and then forming a reflective layer on the light guide plate according to a first pattern. a light-emitting surface, and then, according to a second pattern, a silver paste circuit layer is formed in the first pattern 201132911. By the reflective layer between the silver paste circuit layer and the light guide plate, the light in the light guide plate is directed toward the light. When the area of the silver paste circuit layer is reflected back to the light guide plate by the reflective layer, 'the light exits the area without the reflective layer or the Yinyi circuit layer', so that more light-emitting opportunities can be added, and the light can be brightened. The utilization of the light source. BRIEF DESCRIPTION OF THE DRAWINGS The spirit and scope of the present invention will be apparent from the following description of the embodiments of the invention. The spirit and scope of the invention are not departed. The present invention provides a backlight module, a method for fabricating the same, and an electronic device using the same. Before the silver paste circuit is fabricated on the light guide plate, a reflective layer is formed at a corresponding position to be set in the silver paste circuit. In this way, before the light is guided to the silver paste circuit, it is reflected back into the light guide plate by the reflective layer to improve the light reflectivity and reduce the chance of the light being absorbed by the silver paste circuit, thereby slowing the undesired color shift of the light guide plate. The problem is to improve the utilization of the light source and the light quality. Referring to FIG. 1 to FIG. 3, FIG. 1 is a plan view showing the backlight module 100 of the present invention in an embodiment. Fig. 2 is a cross-sectional view along the line 2-2 of Fig. 1 and a ray motion diagram. Fig. 3 is a cross-sectional view along the line 3-3 of Fig. 1 and a ray motion diagram. The backlight module 100 includes a light guide plate 200, a light source 300, a reflective layer 400, and a silver paste circuit layer 500. The light guide plate 200 has a light incident surface 210 and a light exit surface 220. The light source 300 is, for example, a cold cathode fluorescent lamp (LED) or a light-emitting diode (LED), which is located substantially on the light incident surface 210 of the light guide plate 200 and faces the light incident surface 210. Glowing. The reflective layer 400 is presented on the surface of the light exit surface 220 in a first pattern. The silver paste circuit layer 500 is presented in a second pattern on the first pattern of the reflective layer 400. The second pattern is a circuit pattern. The circuit maps can be electrically connected externally and operate for specific functions. Thus, when the light of the light source 300 enters the light guide plate 200, the light may be emitted from the light exit surface 220 without the reflective layer 400 or the region 222 of the silver paste circuit layer 500; or, because the reflective layer 400 is located at the silver paste circuit layer 500 and the light guide plate 200. Between when the light of the light source 300 travels to the reflective layer 400 in the light guide plate 200, the light can be reflected back into the light guide plate 200 by the reflective layer 400, and the light exiting surface 220 does not have the reflective layer 400 or the region of the silver paste circuit layer 500. 222 light. Therefore, the light traveling in the direction of the silver paste circuit layer 500 in the light guide plate 200 is not absorbed by the silver paste circuit layer 500, thereby providing more light to the light exit surface 220' to provide higher light emission brightness. Increase the utilization of the light source 300. In one embodiment of the present invention, as shown in Figures 1 and 3, the pattern outline of the second pattern is identical to the pattern outline of the first pattern, and the pattern range of the second pattern is equal to the pattern range of the first pattern. For example, the first pattern is composed of one or more first lines 401. This second pattern is composed of one or more second lines 501. The line width 502 of the second line 501 of the second pattern is equal to the line width 402 of the first line 4〇1 of the first pattern (as shown in Fig. 3). m 6 201132911 Alternatively, the first pattern and the second pattern may also include a geometric figure, such as a circular shape (not shown). In other words, the reflective layer 400 is completely interposed between the silver paste circuit layer 500 and the light guide plate 200, That is, the first pattern of the reflective layer 400 cannot be observed by the light guide plate 200 through the top view. As such, when the second pattern is completely superposed on the surface of the reflective layer 400, the second pattern completely covers the first pattern to provide more regions 222 of the light exit surface 220 without the reflective layer 400 or the silver paste circuit layer 500. The higher illumination brightness and the utilization of the light source 300 are provided. Referring to FIGS. 4 and 5, FIG. 4 is a plan view of the backlight module of the present invention in another embodiment. Figure 5 is a cross-sectional view taken along line 5-5 of Figure 4 and a ray motion diagram. In another embodiment of the backlight module 101 of the present invention, the pattern of the second pattern is substantially the same as the pattern of the first pattern, except that the pattern of the second pattern is smaller than the pattern of the first pattern. For the above example, the first pattern consists of one or more first lines 401. This second pattern is composed of one or more second lines 501. The line width 502 of the second line 501 of the second pattern is smaller than the line width 402 of the first line 401 of the first pattern (Fig. 5). Alternatively, the first pattern and the second pattern may also comprise geometric figures (e.g., circles). (not shown) In other words, when the second pattern is superposed on the surface of the reflective layer 400, the second pattern cannot completely cover the first pattern. Thus, since the pattern range of the second pattern of the silver paste circuit layer 500 is smaller than the pattern range of the first pattern of the reflective layer 400, the second pattern can provide more opportunities for reflection, thereby improving the light from the light exit surface 220 without a reflective layer. 400 or silver paste circuit layer 500 area 201132911 domain 222 light opportunities. Referring to FIG. 6, FIG. 6 is a cross-sectional view and a ray motion diagram of the backlight module of the present invention in another example. In still another embodiment of the backlight module 102 of the present invention, the pattern of the second pattern is substantially the same as the pattern of the first pattern, and the pattern of the second pattern is larger than the pattern of the first pattern. For example, the first pattern is composed of one or more first lines 4〇1. This second pattern consists of - or a plurality of second lines 501. In the second figure, the line width 502 of the flute, the second line 501 is larger than the line width 402 of the first pattern 401, so that the second line of the second pattern covers the first line 401 and the light exit surface 220 of the first pattern. on. Alternatively, the first·Tian·η M system and the second pattern may also be composed of geometric figures (for example, circular shapes) (not shown). In other words, the silver paste circuit layer 500 covers the reflective layer 400 and the light-emitting surface 220 I. Thus, since the reflective layer 400 is still located between the silver paste circuit layer 5 and the light-emitting surface 70161 220, the reflective layer 400 remains Light can be reflected to a region 222 of 220 yC ^ without reflective layer 400 or silver paste circuit layer 500. In other embodiments of the present invention, the light guide plate 200 may be, for example, a rectangular plate of uniform thickness or a wedge plate having a thickness from large to small, having opposite front and back sides, and four sides surrounding the front and back sides thereof. The area of the front or back side is larger than the area of either side. Any one of the sides of the light guide plate 2 is a light incident surface 210 for guiding light into the light guide plate 200. The front side of the light guide plate 200 is a light exit surface 220 for emitting light to the outside. In this embodiment, the material of the light guide plate 200 is made of a transparent plastic material, such as polyethylene terephthalate (201132911 PET) or polycarbonate (PC). The developer can select the material of the light guide plate 200 according to actual needs or restrictions. In another embodiment of the present invention, the light guide plate 200 can also be a flexible printed circuit board (FPC). The substrate has a plurality of optical microstructures (not shown), which may be located on the other side of the light-incident surface 210, the substrate opposite to the light-emitting surface 220, or the other side of the light-incident surface 210 and the substrate-relative light-emitting surface 220. The invention does not limit the form of the optical microstructure, and may be, for example, convex, concave, spherical or serrated, etc., to generate more refraction of the light emitted by the light source 300, and to move more uniformly. The light guide plate 200 can be used. R&D personnel can adjust to actual needs or constraints. In still another embodiment of the present invention, the 'reflective layer 400 is coated or printed from the resin material' to the front side of the light guide plate 200 to conform to the second pattern of the silver paste circuit layer 500. Further, the reflective layer 400 preferably has a color of a preferred reflection effect such as white or silver. The developer can adjust the color of the reflective layer 400 according to actual needs or limitations. Further, the reflective layer 400 may also be made of a transparent adhesive material such as uv glue, wherein the reflective layer is transparent (or at least translucent) and its (light) refractive index is less than the (light) refractive index of the light guide plate. Referring to FIG. 7, FIG. 7 is a block diagram of an electronic device according to an embodiment of the present invention. In another embodiment of the present invention, one of the backlight modules 100, 101, and 102 can be applied to an electronic device 10 of the present invention, and is not limited to a mouse, a keyboard, or a mobile phone. One of the cameras, cameras, game consoles, watches, music players, e-mail transceivers, map navigators and digital photo frames. 201132911 FIG. 8 is a flow chart showing the manufacturing method of the backlight module of the present invention. Another aspect of the present invention provides a backlight module, such as one of the backlight modules 1 101, 101, or 102, for improving the utilization rate and light quality of the light source, and the general steps include at least Step 801: A light guide plate 2 is provided. As can be seen from the above, the light guide plate 200 can be a light guide plate with an acrylic material or a flexible printed circuit board. Step 802: A reflective layer 4 is formed on one of the light-emitting surfaces 220 of the light guide plate 200 according to a predetermined first pattern. The reflective layer 4 can be formed on the light-emitting surface 220 by printing, transferring, coating or flattening, and the same pattern contour as the second pattern (for example, circuit pattern). Step 803: Forming a silver paste circuit layer 5?0 having the above second pattern on the first pattern of the reflective layer 400. In this step, the developer can select the second pattern of the silver paste circuit layer to have a smaller pattern range (Fig. 5), greater than (Fig. 6) or equal to (Fig. 3) reflection according to actual needs or limitations. The pattern range of the first pattern of layer 400. The silver paste circuit layer 500 can be formed on the reflective layer 400 by means of evaporating, electroplating, printing, transfer, or the like. Step 804: A light source 300, such as a Cold Cathode Fluorescent Lamp (CCFL) or a light-emitting diode (LED), is disposed on the light incident surface 210 of the light guide plate 200 to make it Lights up toward the light surface 210. In summary, the present invention not only overcomes the problem that light is absorbed by the silver paste circuit by the reflective layer 400 between the silver paste circuit layer 500 and the light guide plate 200, but also increases the light output brightness of the light exit surface 220, thereby increasing the light source 300. Utilization rate. The present invention is not limited to the embodiments of the present invention, and various modifications and refinements may be made without departing from the spirit and scope of the present invention. This is subject to the definition of the scope of the patent application. BRIEF DESCRIPTION OF THE DRAWINGS In order to make the above and other objects, features, advantages and embodiments of the present invention more obvious, the detailed description of the drawings is as follows: FIG. 1 illustrates a backlight module of the present invention. A top view of the example. Figure 2 is a cross-sectional view along line 2-2 of Figure 1 and a ray motion diagram. Figure 3 is a cross-sectional view along line 3-3 of Figure 1 and a ray motion diagram. Fig. 4 is a plan view showing a backlight module of the present invention in another embodiment. Figure 5 is a cross-sectional view along line 5-5 of Fig. 4 and a ray motion diagram. FIG. 6 is a cross-sectional view and a ray motion diagram of the backlight module of the present invention in another embodiment. FIG. 7 is a block diagram of an electronic device of the present invention in an embodiment. FIG. 8 is a flow chart showing the manufacturing method of the backlight module of the present invention. [Main component symbol description] 11 m 201132911 10: electronic device 400: reflective layer 100, 101, 102: backlight module 401: first line 200: light guide plate 402: first line width 210: light-incident surface 500: silver paste Circuit layer 220: light exit surface 501: second line 222: light exit surface without reflective layer or 502: second line width silver paste circuit layer area 2-2, 3-3, 5-5: section line 300: light source 801- 804: Step
12 m12 m