TW201131302A - Radiation-sensitive composition, cured film and forming methods thereof - Google Patents

Abstract

The purpose of the present invention is to provide a polysiloxane-based radiation-sensitive composition which has high coatablilty and pattern-formability, while the obtained cured article has high refractivity besides transparency and adhesiveness, and may has positive radiation-sensitive characteristics, and a patterned cured film formed by this composition, and forming methods thereof. The solution means of the present invention is a radiation-sensitive composition which contains [A] siloxane polymer, [B] metal oxide particles, and [C] radiation-sensitive acid-producing agent or radiation-sensitive base-producing agent, wherein the aforementioned [B] metal oxide particles are oxide particles of at least one species of metals selected from a group consisted of aluminium, zirconium, titanium, zinc, indium, tin, antimony, and cerium. The radiation-sensitive composition is preferred to further containing dispersant.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radiation sensitive composition, a cured film formed of the composition, and a method of forming the cured film. [Prior Art] A liquid crystal display element or the like is subjected to an immersion treatment by a solvent, an acid or an alkaline solution or the like in the course of its preparation. Further, when the liquid crystal display element forms a wiring electrode layer by sputtering, the surface of the element is locally exposed to a high temperature. Therefore, in order to prevent the liquid crystal display element from being deteriorated or damaged by the immersion treatment or the high-temperature treatment using the solvent or the like, a protective film having resistance to these treatments is provided on the surface of the element. Further, in the liquid crystal display element or the like, an interlayer insulating film which is usually provided in a layer shape for insulating between lines or a spacer for stabilizing the interval (cell spacing) between the two substrates is provided. It is preferable that the number of steps for obtaining a desired pattern shape is small in the material of the protective film, the interlayer insulating film, the spacer, and the like (hereinafter also referred to as a protective film or the like), and that there is sufficient flatness. Therefore, a radiation sensitive composition is widely used. The material such as the protective film is required to have a substrate or a primer layer on which the protective film or the like is to be formed, and a layer formed on each layer or the like has high adhesion at the time of curing, has transparency, and is excellent in coatability and pattern formation property. performance. For the material for forming a protective film or the like which satisfies these characteristics, an acrylate-based resin is mainly used. In contrast, attempts have been made to use a polyoxyalkylene-based material which is superior in heat resistance and transparency to a acrylate-based resin as a component of the radiation-sensitive composition of 201131302 (see Japanese Patent Laid-Open Publication No. 2000-1648). Japanese Patent Laid-Open No. 2 006-178436). However, since the polyoxyalkylene-based material has a lower refractive index than the acrylate-based resin, when coated on the surface of another layer such as an ITO (indium tin oxide) transparent conductive film pattern, the refractive index difference becomes large, so that it exists. It is easy to see the ITO pattern, and the visibility of the liquid crystal display screen is lowered. Further, it is preferable to use a positive-type radiation-curable composition from the viewpoint of the advantage of forming a contact hole in the interlayer insulating film, for example. However, in the case of a positive-type radiation-sensitive linear composition in a polyoxyalkylene-based material, since a pattern formation property is high, a composition using a quinonediazide compound is generally used as a radiation-sensitive linear acid generator, but it is used. The nitrogen compound is the main reason for the high cost. In addition, 'material for semiconductor sealing, material for semiconductor underlayer material', material for semiconductor protective film, material for semiconductor interlayer insulating film, material for circuit substrate, planarizing material, material for circuit substrate protection, material for resist, The material for the plating resist, the material for liquid crystal sealing or the material for sealing the light-emitting diode, does not have a radiation-sensitive composition that can obtain a cured film excellent in heat resistance and electrical insulation for a short period of time (refer to US5385955A). ). PRIOR ART DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT PATENT DOCUMENT The object of the present invention is to provide a pattern forming property which is necessary for a material having a protective film or the like which forms a target, and the obtained cured product has a high refractive index in addition to transparency and adhesion, and has a positive-type radiation linearity. A polyoxyalkylene-based radiation-sensitive composition, a cured product formed from the composition, and a method for forming the same. Further, the object of the invention is to provide a material for semiconductor sealing, a material for a semiconductor underlayer, a material for a semiconductor protective film, a material for a semiconductor interlayer insulating film, a material for a circuit substrate, a planarizing material, and a circuit substrate. The material, the material for the resist, the material for the anti-scraping agent, the material for liquid crystal sealing, or the material for sealing the light-emitting diode element can be excellent in heat resistance, adhesion, electrical insulation, etc. in a short time. A radiation sensitive composition of the cured film. The invention for solving the above problems is a radiation sensitive composition comprising: [A] a siloxane polymer, [B] metal oxide particles, and [C] a radioactive acid generator or a radiation-sensitive linear base. The generating agent, the above [B] metal oxide particles are oxide particles of at least one metal selected from the group consisting of Ming, Pin, Tantalum, Dry, Marriage, Tin, Antimony and Bismuth. The radiation sensitive composition has high pattern formability by containing the above respective components, and the obtained cured product can have high transparency and adhesion 201131302. In particular, according to the radiation sensitive composition, the refractive index of the obtained cured product can be improved by containing the metal oxide particles of the above kind as the component [B]. In addition, the radiation sensitive composition can exhibit positive radiation characteristics having high pattern formability by using the above oxide particles as the metal oxide particles of the [B] component. [A] The aerobics polymer may be a hydrolyzed condensate of a hydrolyzable sand compound represented by the following formula (1). (R 1 ) n — S i — ( 0 R 2 ) 4 - η . (1) In the formula (1), 'R1 is each independently hydrogen or a non-hydrolyzable organic group having 1 to 20 carbon atoms. R2 is each independently hydrogen, a carbon number of 1 to 6, a phenyl group having 1 to 6 carbon atoms or an aryl group having 6 to 15 carbon atoms. η is an integer of 〇~3. [Α] The oxime polymer is a hydrolysis condensate of the hydrolyzable decane compound represented by the above formula, and thus the radiation-sensitive composition has high coatability, radiation sensitivity, and pattern formability, and the obtained cured product can have Higher transparency and adhesion. The radiation sensitive composition may further contain a [D] dispersant. The radiation-induced twin composition can uniformly disperse the metal oxide particles of the [β] component by containing the [D] dispersant, further improve the coating property, and further improve the adhesion property of the obtained cured film, and the refractive index becomes uniform. mother. The [D] dispersant is preferably a compound represented by the following formula (2) '(3) or (4), a polyoxyethylidene ether, a polyoxyethylidene ether, an alkyl glucoside, Polyoxyethylene ethyl ester, sucrose fatty acid ester, sorbitan fatty acid vinegar, polyoxyethylene ethyl sorbitan fatty acid ester or fatty acid alkanol 201131302 amine \) / 2 ✓ -\

R3< 独ΙΗ)自ΟΜΠΡ——ο 丨 each 3 R (2) Η Q C is the ground 〇 2 Η (CH2CH2〇) p-CH2CH2O-. P is 8 to 10, q is 12 to 16, and x is an integer from 1 to 3. ——(CH2CH2NCH2CH2NH)r—— (3) ch2ch2nh——(cch2ch2Ch2ch2ch2)s—9

11 I Ο 〇 CC-|〇H2〇CHC6Hi3

OH In the formula (3) and the s system, the polystyrene-converted number average molecular weight determined by gel permeation chromatography is from 00 to 4,000. H—(OH4C2)u—(OH6C3)t .(C3H6〇)t—(C2H40)u—Η \ / M, N—C2H4-N. (4)

H—(OH4C2)u—(〇H6C3)t (C3H60)t—(C2H40)u—H (In formula (4), t and u are selected to make polyphenylene obtained by gel permeation chromatography The number-average molecular weight in terms of ethylene is from 1,000 to 30,000. According to the radiation-sensitive composition, the dispersant of the component [D] is a compound having a positive radiation characteristic, thereby exhibiting higher pattern formation. The radiation sensitive composition of the present invention is preferably used as a protective film for a liquid crystal display element, an interlayer insulating film or a separator, a protective film for a semiconductor, or an interlayer insulating film to form a patterned cured film, and the formation of these cured films. The method includes: 201131302 (1) a step of forming a coating film of a radiation-sensitive composition on a substrate, (2) a step of irradiating radiation in at least a part of the coating film formed in the step (1), and (3) performing the step (2) a step of developing a coating film irradiated with radiation, and (4) a step of heating the coating film developed in the step (3). In the method, the above-described radiation-sensitive composition having excellent pattern formability is used. By using a radiation-sensitive exposure By forming a pattern, each of the cured films having a fine and fine pattern can be easily formed. Therefore, the cured film formed by the pattern formed of the radiation sensitive composition of the present invention has a high refractive index in addition to transparency and adhesion, and thus can The visual confirmation of the liquid crystal display screen can be suitably used as a material of a liquid crystal display element, etc. Further, the patterned cured film formed of the radiation sensitive composition of the present invention has high transparency, adhesion, and high refraction. It is also suitable as a material for a protective film or an interlayer insulating film for semiconductors, etc. Further, 'the radiation sensitive composition of the present invention is used as a material for semiconductor sealing, a material for semiconductor underlayer coating, and a circuit base. Materials for materials, planarizing materials, materials for protecting circuit boards, materials for resists, materials for plating resists, materials for liquid crystal sealing, etc., so that heat resistance, adhesion, electrical insulation, etc. can be obtained in a short time. Excellent cured film. As described above, the radiation sensitive linear composition of the present invention contains the above [A] to [C] In addition to having a high patterning property, the cured product obtained from the composition has a high refractive index 201131302 in addition to high transparency and adhesion. Further, the radiation sensitive composition of the present invention contains The dispersant of the component [D] can further improve the coating property and the positive radiation sensitivity. Therefore, the patterned cured film formed of the radiation sensitive composition of the present invention has high transparency and adhesion. The refractive index is suitable for each material such as a cured film for a liquid crystal display device, a cured film for a semiconductor, and a lens for an LED. Further, the radiation sensitive composition of the present invention is used as a material for semiconductor sealing. , semiconductor underlayer materials, circuit substrate materials, planarizing materials, circuit board protective materials, resist materials, anti-keying materials, liquid crystal sealing materials, etc., so that they can be obtained in a short time. A cured film excellent in heat resistance, adhesion, and electrical insulation. [Embodiment] The radiation sensitive composition of the present invention contains [A] decane polymer, [B] metal oxide particles, [C] sensitizing radioactive acid generator or sensitizing radioactive base generator, as needed. Also contains [D] dispersant and other optional ingredients. [A] component: the siloxane polymer of the [A] component is not particularly limited as long as it is a polymer of a compound having a siloxane bond. This component [A] is hydrolyzed and condensed to form a cured product. The oxime polymer of the component [A] is preferably a hydrolysis condensate of the hydrolyzable decane compound represented by the above formula (1). The hydrolyzable decane compound in the present case generally means that it is heated at room temperature (about 25 t: a temperature of about 10 〇 crc - 10 201131302 in the presence of no catalyst or excess water, thereby hydrolyzing to produce stanol a group of a group, or a compound having a "hydrolyzable group" capable of forming a hydrazine condensate. Further, the term "non-hydrolyzable group" means that under the hydrolysis conditions, 'no hydrolysis is caused or Condensation, a group which is stably present. In the hydrolysis reaction of the hydrolyzable decane compound represented by the above formula U), the partially hydrolyzable group may remain in an unhydrolyzed state. The "hydrolyzed condensate of a hydrolyzable decane compound" is a hydrolysis condensate which reacts and condenses between a partial stanol group of a hydrolyzed decane compound. The non-hydrolyzable organic group 'having a carbon number of 1 to 20 represented by the above R1' may be unsubstituted or substituted by one or more vinyl groups, (meth) acrylonitrile groups or epoxy groups. An alkyl group, an aryl group having 6 to 20 carbon atoms, an aralkyl group having 7 to 20 carbon atoms, and the like. These groups may be linear, branched or cyclic. When a plurality of R1 are present in the same molecule, they may also be a combination thereof. Further, 'R1 may further contain a structural unit having a hetero atom. The term "organic unit" may, for example, be an ether, an ester, a thioether or the like. The group represented by the above R2 is preferably hydrogen or an alkyl group having 1 to 6 carbon atoms, particularly preferably hydrogen, methyl or ethyl, from the viewpoint of easiness of hydrolysis. Further, the subscript n is an integer of 0 to 3, but more preferably an integer of 〇 〜 2, particularly preferably 0 or 1' is preferably 1. When η is an integer of 〇 〜 2, the hydrolysis and condensation reaction can be more easily performed, and as a result, the rate of the [Α] component hardening reaction is further improved, and "the addition" can improve the resistance of the composition in the heating step after development. Meltability. The hydrolyzable decane compound represented by the above formula (1) includes a decane compound substituted with 4 -11 to 201131302 hydrolyzable groups, and a sand courtyard substituted with one non-hydrolyzable group g Μ 3 hydrolyzable groups. A compound, a decane compound substituted with two non-hydrolyzed twin groups and two hydrolyzable groups, a decane compound substituted with three non-hydrolyzed, a neoplastic group and one hydrolyzable group, or a mixture thereof. In the specific example of the hydrolyzable decane compound represented by the above formula (1), a decane compound substituted with four hydrolyzable groups may, for example, be tetramethoxy decane or tetraethoxy decane. Tetrabutoxy decane, tetraphenoxydecane, tetrabenzyloxydecane, tetra-n-propoxy decane, tetraisopropoxy sulane, etc.; as a non-hydrolyzable group and three hydrolyzable groups The substituted squalane compound 'is exemplified by methyl trimethoxy decane 'methyl triethoxy octane, methyl triisopropoxy decane, methyl tributoxy decane, ethyl trimethoxy decane, ethyl Triethoxy decane, ethyl triisopropoxy decane, ethyl tributoxy decane, butyl trimethoxy decane, phenyl trimethoxy decane, phenyl triethoxy decane, vinyl trimethoxy矽, vinyl triethoxy sand, ethylene tri-n-propoxy decane, 3-methyl propylene methoxy propyl trimethoxy sand, 3-methyl propylene methoxy propyl triethoxy Base decane, 3- propylene methoxy propyl trimethoxy decane, 3- propylene methoxy propyl triethoxy sand , r-glycidoxypropyltrimethoxydecane, 7-glycidoxypropyltriethoxydecane' $ _(3,4-epoxycyclohexyl)ethyltrimethoxydecane, etc.; In the case of a decane-12-201131302 compound substituted with two non-hydrolyzable groups and two hydrolyzable groups, 'dimethyl dimethyl decane, diphenyl dimethoxy cetane, and dibutyl can be cited. a dimethoxy oxane or the like; a decane compound substituted with three non-hydrolyzable groups and one hydrolyzable group, which may be exemplified by tributyl methoxy decane, trimethyl methoxy sand, and top three Ethyl ethoxy decane, tributyl ethoxy decane, and the like. In the hydrolyzable decane compound represented by the above formula (1), a decane compound (n = fluorene) substituted with four hydrolyzable groups and one non-hydrolyzable group and three hydrolyzable groups are preferable. a group-substituted decane compound (n=1), particularly preferably a decane compound substituted with one non-hydrolyzable group and three hydrolyzable groups (n = 1) ° as a specific of the preferred hydrolyzable decane compound For example, tetraethoxy decane, methyl trimethoxy decane, methyl triethoxy decane, methyl triisopropoxy decane, methyl tributoxy decane, phenyl trimethoxy decane, and B may be mentioned. Trimethoxy decane, ethyl triethoxy decane, ethyl diisopropoxy decane, ethyl tributyl decane, butyl trimethoxy decane, r - glycidoxypropyl trimethoxy decane , 3-methacryloxypropyldimethoxydecane, 3-methylpropenyloxypropyltriethoxydecane. The k-hydrolyzed broth compound may be used singly or in combination of two or more. The conditions for hydrolyzing and condensing the hydrolyzable decane compound represented by the above formula (1) are as long as at least a part of the hydrolyzable decane compound represented by the above formula U) is hydrolyzed, and the hydrolyzable group is converted into stanol S to cause a condensation reaction. There is no particular limitation 'as an example, it can be implemented as follows. In the hydrolysis and condensation of the hydrolyzable decane compound represented by the above formula (1), water for use in -13 to 201131302 is preferably purified water by a method such as reverse osmosis membrane treatment, ion exchange treatment or distillation. borrow. By using this purified water, it is possible to suppress the reaction of the secondary g and improve the hydrolysis. The amount of water used is preferably 0. The total amount of the hydrolyzable group (_OR2) of the hydrolyzable decane compound represented by the above formula (1) is preferably 0. 1 to 3 mol, more preferably 0. 3~2mol, further better for 〇, 5~ 1. Amount of 5 mol. By using this amount of water, the reaction rate of hydrolysis and condensation can be optimized. The solvent to be used in the hydrolysis and condensation of the hydrolyzable decane compound represented by the above formula (1) is not particularly limited, and examples thereof include ethylene glycol monoalkyl ether acetate and diethylene glycol. Alkyl ether, propylene glycol monoalkyl ether, propylene glycol monoalkyl ether acetate, propionate. Among these solvents, particularly preferred are diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monomethyl ether acetate or 3-methoxypropane. Methyl ester. The hydrolysis and condensation reaction of the hydrolyzable decane compound represented by the above formula (1) is preferably carried out in an acid catalyst (for example, hydrochloric acid, sulfuric acid, nitric acid, formic acid, oxalic acid, acetic acid, trifluoroacetic acid, trifluoromethanesulfonic acid, phosphoric acid, acidity). Ion exchange resin, various Lewis acids), alkali catalysts (such as ammonia, primary amines, secondary amines, tertiary amines, pyridine and other nitrogen-containing compounds; basic ion exchange resins; hydroxides such as sodium hydroxide ; a carbonate such as potassium carbonate; a carboxylate such as sodium acetate; a variety of Lewis bases; or an alkoxide (for example, a zirconium alkoxide, a titanium alkoxide 'aluminum alkoxide) or the like. For example, in the case of an aluminoxane, aluminum tetraisopropoxide can be used. In terms of the amount of the catalyst to be used, from the viewpoint of the hydrolysis and the condensation reaction, the monomer of the 1 mol hydrolyzable sand compound is preferably from 10 to 6 mol to 0. 2mol, more preferably qqoooi~ 0 · 1 m 〇1. The reaction temperature and reaction time in the hydrolysis and condensation of the hydrolyzable decane compound represented by the above formula (1) can be appropriately set. For example, the following conditions can be applied. The reaction temperature is preferably from 40 to 20 (TC, more preferably from 50 to i5 Torr. The reaction time is preferably from 30 minutes to 24 hours, more preferably from 1 to 12 hours. By using the reaction temperature and reaction time The hydrolysis and condensation reaction can be carried out most efficiently. In the hydrolysis and condensation, the hydrolyzable decane compound, water and catalyst can be added in one reaction in the reaction system in one stage, or can be divided into multiple reaction systems. Hydrolyzing decane compound, water and catalyst are added to carry out hydrolysis and condensation reaction in multiple stages. In addition, after hydrolysis and condensation reaction, 'dehydrating agent is added, and then placed in an evaporator to remove water from the reaction system and The molecular weight of the hydrolyzed condensate of the hydrolyzable decane compound represented by the above formula (1) is in the form of a polystyrene-equivalent number average molecular weight of G PC (gel permeation chromatography) using tetrahydrofuran in the mobile phase. Further, the number average molecular weight of the 'hydrolysis condensate is usually preferably set to 値 in the range of 500 to 10,000, and more preferably set to be in the range of 1 〇〇〇 to 5 〇〇〇.成. By making the number average molecular weight of the hydrolysis condensate 500 500 or more ′, the film formation property of the coating film of the positive sensitizing radiation composition can be improved. On the other hand, by the number average molecular weight of the hydrolysis condensate When the enthalpy is 10000 or less, the radiation-induced linearity of the radiation-sensitive composition can be prevented from being lowered. -15- 201131302 [B] Component: Metal oxide particles by containing the metal oxide particles of the [B] component in the composition of the present invention Thereby, the refractive index of the obtained cured product can be increased. The metal oxide particles of the [B] component may be selected from the group consisting of aluminum, zirconium, titanium, zinc, indium, tin, antimony and bismuth. At least one metal oxide particle, wherein 'preferably an oxide particle of a surface, titanium or zinc, particularly preferably an oxide particle of chromium or titanium. These may be used singly or in combination of two or more. Further, in the case of the metal oxide particles, 'the composite oxide particles of the above metals may be used. Examples of the composite oxide particles include ruthenium (锑-tin oxide) and ΙΤ0 (indium- Oxide), ΙΖ0 (indium-zinc-oxide), etc. in terms of the metal oxide particles, for example, a commercially available C.  I. Huacheng Co., Ltd. Nanotek and so on. By using the above-described kinds of particles as the metal oxide particles of the [B] component, the radiation-sensitive composition can exhibit positive-type radiation characteristics having high pattern formability. The reason why the positive-type radiation characteristics are used by using the above-described metal oxide particles is not determined. However, it is considered that the surface of the metal oxide particles acts as a photocatalyst, for example, by irradiation with radiation such as ultraviolet rays. The helium oxide polymer or the like of the [A] component of the metal oxide particles is decomposed, and the composition is melted. Further, in the case where the above preferred oxide particles (zirconium, titanium, and zinc) are used, the reason why the positive pattern formation property can be further improved is not determined, but is considered to be the light of these metal oxides. The high catalytic capacity is affected by -161-331. Further, in the case where chromium or titanium is used as the particularly preferable metal, a higher refractive index can be obtained, and positive pattern formation property can be improved. The reason why the refractive index can be further increased by using zirconium or titanium' is not determined, but it is considered that since the negative electrical property is low, the polarization in the particles is high, and as a result, the refractive index is improved. Therefore, it is preferable that the metal oxide particles of the [B] component have a cathode electrical property of 1. The metal oxide particles below 7 are particularly good for the cathode electrical property. 6 or less metal oxide particles. In addition, the negative electrical use of Pauling. The shape of the metal oxide particles is not particularly limited and may be spherical or amorphous, and may be hollow particles, porous particles, core-shell particles or the like. Further, the number average particle diameter of the metal oxide particles determined by the dynamic light scattering method is preferably from 5 nm to 200 nm, more preferably from 5 nm to 100 nm, particularly preferably from 10 nm to 80 nm. If the number average particle diameter of the metal oxide particles is less than 5 n m, the hardness of the cured film may be lowered. If it exceeds 200 nm, the turbidity of the cured film may increase. The amount of the metal oxide particles to be mixed is not particularly limited, but is preferably 0.% with respect to 100 parts by mass of the [A] component. 1 part by mass to 50 parts by mass, particularly preferably 1 part by mass to 20 parts by mass. If the amount of metal oxide particles is 0. When the amount is 1 part by mass or less, the refractive index of the obtained cured product is not high. On the other hand, when the amount of the metal oxide particles to be mixed exceeds 100 parts by mass, the coatability is lowered, and the turbidity of the obtained hardened film may be increased. The specific surface area of the metal oxide particles (the BET ratio -17 to 201131302 surface area measurement using nitrogen) is preferably 10 m 2 /g to 1 〇〇〇 m 2 /g, more preferably 1 〇〇 m 2 /g 〜 5 00 m 2 . /g. By making the specific surface area of the metal oxide particles within the above range, the action of the photocatalyst can be effectively exhibited, and a higher desired radiation characteristic can be exhibited. [C] component: a radiation sensitive acid generator or a radiation sensitive linear generator which is a radioactive acid generator or a radiation sensitive alkali generator [C] is defined as being irradiated with radiation, thereby serving as [A] A compound in which a component of a pyrithione polymer is condensed or a catalyst in a hardening reaction, and an acidic active material or a basic active material is released. In addition, as the radiation to be irradiated with an anion of the acidic active material or an anion of the basic active material in order to decompose the [C] component, visible light, ultraviolet light, infrared light, X-ray, krypton: ray, /3 ray, 7 Rays, etc. Among these rays, ultraviolet rays are preferably used because of a certain energy level, a fast hardening speed can be achieved, and the irradiation device is relatively inexpensive and small. Further, according to the radiation-sensitive linear composition, by using the above-mentioned substance as the metal oxide particles of the [B] component, it is not necessary to use a specific substance as the radiation-sensitive acid generator or the radiation-sensitive linear base of the [C] component. The agent 'is able to play a positive pattern. In particular, in the case of a positive-type polyoxyalkylene type radiation-sensitive linear composition, an acid generator tends to use a quinonediazide according to the radiation-sensitive composition, as described above by using a predetermined substance. The metal oxide particles of the component [B] can exhibit a positive pattern formation property without using a specific substance as a radiation sensitive acid generator or a radiation sensitive alkali generator of the [C] component. -18- 201131302 In the case of a sensory radioactive acid generator of the component [c], a diphenyliodonium salt, a triphenylsulfonium salt, a phosphonium salt, a benzothiazole key salt, an ammonium salt, a money salt, or a tetrahydrogen can be cited. A sulfonium salt such as a thiophene salt or a thiopurine compound. Further, quinonediazide is also a sensitizing radioactive acid generator which generates an acid by radiation. However, the acid produced is a carboxylic acid having a low acidity, and is insufficient in the case of a catalyst for condensation and hardening reaction. Therefore, the radiation-sensitive acid generator of the component [C] is preferably a substance other than quinonediazide. Examples of the diphenyliodonium salt include diphenyliodonium tetrafluoroborate, diphenyliodonium hexafluorophosphonate, diphenyliodonium hexafluoroarsenate, and diphenyliodotrifluoromethanesulfonate. Acid salt, diphenyliodotrifluoroacetate, diphenyliodo-p-toluenesulfonate, diphenyliodobutyl ginseng (2,6-difluorophenyl)borate, 4-methoxyphenylbenzene Tetrafluoroborate, bis(4-tert-butylphenyl) tetrafluoroborate, bis(4-terphenylphenyl)iodohexafluoroarsenate, bis(4-tertiary butyl) Phenyl)iodotrifluoromethanesulfonate, bis(4-tributylphenyl)iodotrifluoroacetate, bis(4-tributylphenyl)iodo-p-toluenesulfonate, bis(4- Tertiary butyl phenyl) iodonium sulfonic acid and the like. Examples of the triphenylsulfonium salt include triphenylsulfonium trifluoromethanesulfonate, triphenyl camphorsulfonic acid, triphenylsulfonium tetrafluoroborate, and triphenylsulfonium trifluoroacetate. Triphenylphosphonium p-toluenesulfonate, triphenylphosphonium butyl (2,6-difluorophenyl) borate, and the like. Examples of the onium salt include an alkyl phosphonium salt, a benzyl phosphonium salt, a dibenzyl phosphonium salt, a substituted benzyl phosphonium salt, and the like. In the case of these mirror salts, -19 - 201131302, as the alkyl phosphonium salt, for example, 4-ethoxyphenoxy phenyl dimethyl hexafluoroantimonate, 4-ethyl methoxy phenyl dimethyl hydride Base hexafluoroarsenate, dimethyl-4-(benzyloxycarbonyloxy)phenylphosphonium hexafluoroantimonate, dimethyl-4-isobenzoyloxy)phenylphosphonium Fluoride, dimethyl 4-(benzhydryloxy)phenylphosphonium hexafluoroarsenate, dimethyl-3-chloro-tetramethyloxyphenyl hexafluoroantimonate And the benzyl sulfonium salt, for example, benzyl-4-hydroxyphenylmethyl sulfonium hexafluoroantimonate, benzyl-4-hydroxyphenylmethyl sulfonium hexafluorophosphonate, 4-B醯Phenylphenylbenzylmethyl hexafluoroantimonate, benzyl-4-methoxyphenylmethyl hexafluoroantimonate, benzyl- 2-methyl-4-hydroxyphenylmethyl hydrazine Hexafluoroantimonate, benzyl-3-chloro-4-hydroxyphenylmethylphosphonium hexafluoroarsenate, 4-methoxybenzyl-4-hydroxyphenylmethylphosphonium hexafluorophosphonate, etc.; Examples of the dibenzyl sulfonium salt include dibenzyl-4-hydroxyphenyl hexafluoroantimonate and dibenzyl. 4 monohydroxyphenyl sulfonium hexafluorophosphonate, 4-ethoxycarbonyl phenyl dibenzyl hexafluoroantimonate, dibenzyl-4-methoxyphenyl hexafluoroantimonate, dibenzyl 3-3-chloro-4-hydroxyphenyl hydrazine hexafluoroarsenate, dibenzyl _3_methyl-4 hydroxy- 5-tert-butylphenyl hexafluoroantimonate, benzyl-4- Methoxybenzyl-4-hydroxyphenylphosphonium hexafluorophosphonate; and the substituted benzyl sulfonium salt, for example, p-chlorobenzyl-4-hydroxyphenylmethyl hexafluoroantimonate, p-Nitrobenzyl-4-hydroxyphenylmethylphosphonium hexafluoroantimonate, p-chlorobenzyl-4-hydroxyphenylmethylphosphonium hexafluorophosphonate, p-chlorobenzyl-3-methyl- 4 -hydroxyphenylmethyl hexafluoroantimonic acid-20- 201131302 salt, 3,5-dichlorobenzyl-4-hydroxyphenylmethyl hexafluoroantimonate, o-chlorobenzyl-3-chloro- 4 Once the phenylmethyl mirror hexafluorochain acid salt and the like. Examples of the benzothiazole moieties include 3-benzylbenzothiazole hexafluoroantimonate, 3-benzylbenzothiazole hexafluorophosphonate, and 3-benzylbenzothiazole. Fluoroborate, 3-(p-methoxybenzyl)benzothiazole hexafluoroantimonate, 3-benzyl-2-methylthiobenzothiazole gun hexafluoroantimonate, 3-benzyl- 5-Chlorothiobenzothiazolium hexafluoroantimonate. Examples of the tetrahydrothiophene key salt include fluorene-(4-n-butoxynaphthalen-1-yl)tetrahydrothiophene trifluoromethanesulfonate and 1-(4-n-butoxynaphthalene). 1 yl) tetrahydrothiophene hexafluoro-n-butyl sulfonate, 1 -(4 _-n-butoxynaphthalenyl-1 yl) tetrahydrothiophene- 1,1,2,2-tetrafluoro-2-(莰 莰 2-base) ethanesulfonate, 1-(4_n-butoxynaphthalene-1-yl)tetrahydrothiophene-2—(5-tris-butoxycarbonyloxybicyclo[2. 2. 1]heptane-2-yl)-M,2,2-tetrafluoroethanesulfonate, 1-(4-n-butoxynaphthalene-1-yl)tetrahydrothiophene _ 2 — (6 - tertiary Butoxy-oxyloxybicyclo[2. 2. 1]Gengyuan-2-1-yl)_ 1,1,2,2-tetrafluoroethanesulfonate, 1-(4,7-dibutoxy-1-naphthenyl)tetrahydrothiophene trifluoromethanesulfonate Examples of the sulfonimide compound such as an acid salt or the like include, for example, N-(trifluoromethylsulfonyloxy)butaneimine (trade name "SI-105" (manufactured by Midon Chemical Co., Ltd.). ), N -( camphorsulfonyloxy)butanediimide (trade name "SI-106" (manufactured by Midori Chemical Co., Ltd.)), N _(4-methylphenylsulfonyloxy) butyl Yttrium (trade name "SI-101" (manufactured by Midori Chemical Co., Ltd.)), N_(2_trifluoromethylphenyl-21 - 201131302, decyloxy) butadiene imine, N - (4 -Fluorophenylsulfonyloxy)butanediamine, N_(difluoromethylanthraceneoxy)phthaleneimide, n_(camphorsulfonyloxy) phthalimide, N- (2~Trifluoromethylphenylsulfonyloxy)-o-phenylenedi-imine, N-(2-fluorophenyl-propenyloxy)-o-phenylenediamine, n-(trifluoromethyl) Oxy)diphenylmaleimide (trade name "PI — 1〇5" (Mi Made by Dori Chemical Co., Ltd.)), N-(camphorsulfonyloxy)diphenylmaleimide, 4-methylphenylsulfonyloxydiphenylmaleimide, N — (2 _Trifluoromethylphenylsulfonyloxy)diphenylmaleimide, n_(4-fluorophenylsulfonyloxy)diphenylmaleimide, N-(phenylsulfonate) Base) double ring [2. 2. 1] Gly-5-ene-2,3-dicarboxylic acid quinone imine (trade name "NDI-100" (manufactured by Midori Chemical Co., Ltd.)), N - (4-methylphenylsulfonyloxy) Double loop [2. 2. 1] Gino-5-ene-2,3-dicarboxylic acid quinone imine (trade name "NDI-101" (manufactured by Midori Chemical Co., Ltd.)), N-(trifluoromethanesulfonyloxy)bicyclo[2 . 2. 1] Glyon-5-ene-2,3-dicarboxylic acid quinone imine (trade name "NDI-105" (manufactured by Midori Chemical Co., Ltd.)), N-(nonafluorobutanesulfonyloxy)bicyclo[ 2. 2. 1] Gino-5-ene-2,3-dicarboxylic acid quinone imine (trade name "NDI-109" (manufactured by Midori Chemical Co., Ltd.)), N-(camphorsulfonyloxy)bicyclo[2. 2. 1] Glycine-5-ene-2,3-dicarboxylic acid quinone imine (trade name "NDI-106" (manufactured by Midori Chemical Co., Ltd.)), N-(camphorsulfonyloxy)-7-oxa Double loop [2. 2. 1] Gino-5-ene-2,3-dicarboxylic acid quinone imine, ^-(trifluoromethylsulfonyloxy)-7-oxabicyclo[2. 2. 1] Gh-5-ene-2,3-dicarboxylate imine, N-(4-methylphenylsulfonyloxy)bicyclo[2. 2. 1] Geng-5-ene--22-201131302 2,3_ quinone diamine, N-(4-methylphenylsulfonyloxy)-7-oxabicyclo[2. 2. 1] Geng-5-ene-2,3-dicarboxylic acid quinone imine, N-(2-trifluoromethylphenyl fluorenyloxy)bicyclo[2. 2. 1] hept-5-ene-2,3-didentate quinone imine, N-(2-trifluoromethylphenylsulfonyloxy)-7-oxabicyclo [2. 2. 1] Glycerol-5-ene-2,3-dicarboxylic acid quinone imine, N-(4-fluorophenylsulfonyloxy)bicyclo[2. 2. 1] Gg-5-ene-2,3-dicarboxylic acid quinone imine, N-(4-fluorophenylsulfonyloxy)-7-oxabicyclo[2. 2. 1] hept-5-ene~ 2,3-dicarboxylic acid quinone imine 'N-(trifluoromethylsulfonyloxy)bicyclo[2. 2•丨]heptane —5,6-oxy-2,3-di-bisphosphonium imine, N—(camphorsulfonyloxy)bicyclo[2. 2. 1] heptane-5,6-oxy-2,3-dicarboxylic acid quinone imine, N-(4~methylphenylsulfonyloxy)bicyclo[2. 2. 1] heptane _ 5,6-oxy-2,3-dicarboxylic acid quinone imine, N-(2-trifluoromethylphenylsulfonyloxy)bicyclo[2. 2,1;] heptane-5,6-oxy-2'3-dicarboxylic acid quinone imine, N-(4-fluorophenyl schistosyloxy)bicyclo[2. 2. 1] Gengyuan - 5,6-oxy-2,3-dinonionimide, N-(trifluoromethylsulfonyloxy)naphthyldicarboxylic acid quinone imine (trade name "NAI- 105" (manufactured by Midori Chemical Co., Ltd.), N - (camphorsulfonyloxy) naphthyldicarboxylic acid quinone imine (trade name "ΝΑΙ-106" (Mid〇ri Chemical Co., Ltd.)), N - (4-methylphenylsulfonyloxy) decyl dicarboxylic acid quinone imine (trade name "ΝΑΙ 10 Γ (Midori Chemicals Co., Ltd.)) N-(phenylsulfonyloxy) ) naphthyldicarboxylic acid quinone imine (trade name "NAI-100" (manufactured by Midori Chemical Co., Ltd.)), n~(2_trifluoromethylphenylsulfonyloxy)naphthyldicarboxylic acid quinone imine , N—(4~Gasylsulfonyloxy)naphthyldicarboxylic acid quinone imine, N-(pentafluoroethylsulfonyloxy) -23- 201131302 Naphthyldicarboxylic acid quinone imine, N — (heptafluoropropylsulfonyloxy)naphthalene, N-(nonafluorobenzenesulfonyloxy)naphthyldicarboxylate S " ΝΑΙ - 109" (Midori Chemical Co., Ltd.): sulfonium oxide Yttrium naphthyldicarboxylate N-(butylsulfonium I carboxylic acid quinone imine (trade name "NAI-1 004 (manufactured by Midori Chemicals)), N-(pentylsulfonyloxy)naphthyldicarboxylic acid sulfonium sulfonate Nylidene naphthyldicarboxylate, N-(heptylsulfonate I bismuthimide, N-(octylsulfonyloxy)naphthyldicarboxyl-(indolylsulfonyloxy)naphthalene Among these sensitizing radioactive acid generators, triphenylsulfonium salts, sulfonium salts, and benzoquinones are preferably used from the viewpoint of improving the sensitivities of the sensitizing materials and the adhesion of the obtained cured products. a thiazole gun salt, a tetralinium imine compound, particularly preferably a triphenylsulfonium salt, a triphenyl camphorsulfonic acid, a 4-ethoxylated phenyl dicarboxylate, a benzyl group _4_ Hydroxyphenylmethyl sulfonium hexafluoroantimonate phenyl benzyl hydrazine hexafluoroantimonate, bis- benzyl 4- fluoro phthalate, 4 ethoxy phenyl benzyl hydrazide Hexafluoro | benzyl benzothiazole hexafluoroantimonate, benzyl-4-pyridyl fluorophosphonate, 1-(4-n-butoxynaphthalene-1-yl) tetrasulphate, 1 — (4,7-dibutoxy-oxime-naphthyl)tetrahydromethanesulfonic acid , N_(trifluoromethylsulfonyloxy)naphthyldicarboxylic acid, in the case of a radioactive linear base generator, can be used to form a metal complex, o-nitrobenzyl carbamic acid, biscarboxylic acid醯5 amine (trade name |, N-(ethyl I)) naphthyl di-fedamine, N-(hexyloxy)naphthyl t-imine, N radioactive group point, compare, thiophene Key salt, trifluoromethanesulfonic acid-based hexafluoroarsenic > 4 _ ethoxylated phenyl sulfonate, 3-methylmethyl hexafluorocyclotrifluoro thiophene trifluoride. Examples include cobalt, etc., α,α-dimethyl-24-201131302 3,5-dimethoxybenzylaminocarboxylic acid, decyloxyimine, and the like. Examples of transition metal complexes include bromopentaamine cobalt perchlorate 'bromopentaamine cobalt perchlorate, bromopentaamine cobalt perchlorate, hexaammine perchlorate 'hexa Amine cobalt perchlorate, hexapropylamine cobalt perchlorate, and the like. Examples of the m-nitrobenzylaminoformate include [[(2-nitrobenzyl)oxy]carbonyl]methylamine, [[(2-nitrobenzyl)oxy]carbonyl) ] propylamine, [[(2-nitrobenzyl)oxy]carbonyl]hexylamine, [[(2-nitrobenzyl)oxy]carbonyl]cyclohexylamine, [[(2-nitrobenzyl) Alkyl]carbonyl]aniline, [[(2-nitrobenzyl)oxy]carbonyl]piperidine, bis[[(2-nitrobenzyl)oxy]methylene]hexamethylenediamine, double [[(2-Nitrobenzyl)oxy]carbonyl]phenylenediamine, bis[[(2~nitrobenzyl)oxy]carbonyl]toluenediamine, bis[[(2-nitro]] Oxy]carbonyl]diaminodiphenylmethane, bis[[(2-nitrobenzyl)oxy]carbonyl]piperazine, [[(2,6-dinitrobenzyl)oxy]carbonyl] Methylamine, [[(2,6-dinitrobenzyl)oxy]carbonyl]propylamine, [[(2,6-dinitrobenzyl)oxy]]yl]hexylamine, [[(2, 6-Dinitrobenzyl)oxy]carbonyl]cyclohexylamine '[[(2,6-dinitrobenzyl)oxy]carbonyl]aniline, [[(2,6-dinitrobenzyl)) Oxy] nucleophilic] piperidine, bis[[(2,6-dinitrobenzyl)oxy]carbonyl]hexamethylenediamine, bis[[(2,6-di) Benzyl)oxy]carbonyl]phenylenediamine, bis[[(2,6-mononitro)oxy]peptidyl]toluenediamine, bis[[(2,6-dinitro) Oxy]carbonyl]diaminodiphenylmethane, bis[[(2,6-dinitrobenzyl)oxycarbonyl]piperidin or the like. In the case of -dimethyl-3,5-dimethoxybenzylaminocarboxylic acid, '[[α,α-dimethyl-3,5-dimethoxy--25-- 201131302 yloxy]carbonyl]methylamine, [[(α,α-dimethyl-3,5-dimethoxybenzyl)oxy]carbonyl]propylamine, [[(α,α:—dimethyl —-3,5-dimethoxybenzyl)oxy]carbonyl]hexylamine, [[(〇:,〇:-dimethyl-3,5-dimethoxybenzyl)oxy]carbonyl] Cyclohexylamine, [[(α,α-dimethyl-3,5-dimethoxybenzyl)oxy]carbonyl]aniline, [[(α,α-dimethyl-3,5-dimethyl Oxybenzyl)oxy]carbonyl]piperidine, bis[[(α,α-dimethyl-3,5-dimethoxybenzyl)oxy]]pyridyl]hexamethylenediamine, double [[(α,α-dimethyl-3,5-dimethoxybenzyl)oxy]carbonyl]phenylenediamine, bis[[(α,α-dimethyl-3,5-dimethoxy) Benzyl)oxy]carbonyl]toluenediamine, bis[[(α,α-dimethyl-3,5-dimethoxybenzyl)oxy]carbonyl]diaminodiphenylmethane' double [[(α,α _dimethyl-3,5-dimethoxybenzyl)oxy]carbonyl]] pipe trap and the like. Examples of the oxime imines include propyl acetophenone oxime, propyl ketone benzophenone oxime, propyl acetonide oxime, butyl acetophenone oxime, butyl benzophenone oxime, and butyl fluorenyl acetonide. Hexamethylene acetophenone oxime, hexamethylene benzophenone oxime, hexamethylene acetoacetone oxime, acrylonitrile acetophenone oxime, acryl fluorenyl benzene ketone, propylene decyl acetonide oxime, and the like. Other examples of the radiation sensitive alkali generating agent include 2-nitrobenzylcyclohexylaminocarboxylic acid, 0-aminomethylmercaptohydroxyguanamine, and the like. The radiation-sensitive acid generator or the radiation-sensitive linear base generator of the component [C] may be used singly or in combination of two or more. The amount of the component [C] used is preferably 0% with respect to 100 parts by mass of the [Α] component. 1 part by mass to 20 parts by mass, more preferably 1 part by mass to -26-201131302 10 parts by mass. By making the amount of [c] component 0. 1 part by mass to 20 parts by mass, and a good balance between the radiation sensitivity and the formed cured product adhesion property can be obtained, and an excellent radiation-sensitive composition can be obtained 'in addition, the generation of precipitates can be prevented in the step of forming the coating film' The coating film can be easily formed. [D] component: dispersant In the radiation sensitive composition of the present invention, in addition to the components [A] to [C], a dispersant of the component [D] is preferably contained. By further containing the [D] dispersant, the radiation-sensitive linear composition can uniformly disperse the [B] metal oxide particles, improve the coating property, and improve the adhesion of the obtained cured product, and the refractive index can be uniformly increased without variation. Examples of the dispersant of the component [D] include a nonionic dispersant, a cationic dispersant, and an anionic dispersant. From the viewpoint of improving the linear characteristics of the positive feeling radiation and the pattern formability, a nonionic dispersant is preferred. The reason why the radiation-sensitive composition is a dispersant of the [D] component by using a nonionic dispersant, thereby improving the positive-type radiation linear characteristics and pattern formability, has not been determined, but it is considered as follows. The nonionic dispersant has a polarized covalent bond moiety. It is considered that the metal oxide particles of the [B] component are easily broken by the photocatalytic action of the radiation and the metal oxide due to the polarization of the non-ionic dispersant, and therefore, when irradiated with radiation, it is positive. The exposed portion of the composition was partially melted, showing high pattern formability. In the nonionic dispersant, polyoxyethylene alkyl phosphate, guanamine amine salt of high molecular weight polycarboxylic acid, ethylenediamine PO-EO condensation -27-201131302, polyoxyethylene alkyl group is preferred. Ether, polyoxyethylene alkylphenyl ether, alkyl glucoside, polyoxyethylene fatty acid ester, sucrose fatty acid ester, sorbitan fatty acid ester, polyoxyethylene sorbitan fatty acid ester or fatty acid alkanol Guanamine. As the polyoxyethylene-based phosphoric acid vinegar, a substance represented by the above formula (2) is preferable. As a commercial product of the dispersing agent represented by the above formula (2), PLAADED 151 manufactured by Kuipan Chemical Co., Ltd., and the like can be mentioned. The uniform dispersibility of the metal oxide particles can be further improved by the polyoxyethylene alkyl phosphate. The guanamine amine salt of the high molecular weight polycarboxylic acid is preferably a compound represented by the above formula (3). For the commercial product of the dispersant represented by the above formula (3), PL A ad ED21 1 manufactured by Kuipan Chemicals Co., Ltd., or the like can be cited. The uniform dispersibility of the metal oxide particles can be further improved by the amide amine salt of the high molecular weight polycarboxylic acid. In the case of the ethylenediamine P〇-EO condensate, the substance represented by the above formula (4) is preferred. As a commercial product of the dispersing agent represented by the above formula (4), ADEKA PLURONIC TR-701, TR-702, TR-704, etc. manufactured by Asahi Kasei Kogyo Co., Ltd. may be mentioned. With the ethylenediamine PO-EO condensate, the silo g further increases the uniform dispersibility of the metal oxide particles. The polyoxyethylene alkyl ether is preferably a compound represented by the following formula (5). R4 - CH(CH2CH20)v - Η (5) In the formula (5), 'R4 is an alkyl group having 1 to 20 carbon atoms. ν is an integer from 1〇 to 300. In the case of R4, an alkyl group having 1 to 12 carbon atoms is particularly preferred. The commercial product of the dispersant represented by the above formula (5) is exemplified by the ADEKATOL TN/SO/UA series manufactured by ADEKA Co., Ltd. -28- 201131302 In terms of polyoxyethylene alkylphenyl ether, a substance represented by the following formula (6) is preferred.

0s (CH2CH20) w - an alkyl group of 12 . W is 10 to 300. In the formula (6), R5 is a carbon number of 1 integer. The commercial product of the dispersing agent represented by the above formula (6) may, for example, be an atekATOL SP/PC series manufactured by ADEKA Co., Ltd., or the like. The decyl glucoside is preferably a substance represented by the following formula (7).

In the formula (7), R, R7, r*, R9 and R|° each independently represent hydrogen or an alkyl group having 1 to 12 carbon atoms. The polyoxyethylene fatty acid ester is preferably a substance represented by the following formula (8). R11—COO—(CH 2 CH 20 ) y — R 12 (8) In the formula (8), R 11 is an alkyl group having 1 to 20 carbon atoms. R12 is hydrogen or a fluorenyl group having 2 to 13 carbon atoms. y is an integer from 10 to 300. In the case of Rn, an alkyl group having 1 to 12 carbon atoms is particularly preferred. The commercially available product of the dispersant represented by the above formula (8) may be, for example, ADEKAESTOL OEG system 歹丨J, ADEKAESTOL TL system 歹IJ manufactured by ADEKA Co., Ltd., etc., in the case of sucrose ester, preferably lower The substance represented by the formula (9). -29- 201131302

Each is independently hydrogen or a fluorenyl group having 2 to 13 carbon atoms. The sorbitan fatty acid ester is preferably a compound represented by the following formula (10). Eight 21 CH〇 CH——CH2——OCOR21

I I H0~C^ /CH2 (10)

CH

I

OH In the formula (10), R21 is a group represented by -(CH2CH2〇)z-H. z is an integer from 10 to 300. The commercially available product of the dispersant represented by the above formula (10) is ADEKAESTOLS series manufactured by ADEKA Co., Ltd., and the like. The polyoxyethylene sorbitan fatty acid ester is preferably a compound represented by the following formula (1 1). CH2 CH—CH2—OCOR22

R230——CH €H〇 \ / 2 CH OR24 30- (11) 201131302 In the formula (11), R22, R23 and R24 each independently represent a hydrogen or a group represented by —(CH2CH2〇)k—Η. k is an integer of 10 to 300. The fatty acid alkanol ester is preferably a compound represented by the following formula (12). R25—CON(CH2CH2OH) 2 (12) In the formula (12), R25 is an alkyl group having 1 to 20 carbon atoms. In the case of R25, the tetramethyl group has an alkyl group having 1 to 12 carbon atoms. The commercial product of the dispersant represented by the above formula (12) is ADEKASOL system IJ manufactured by ADEKA Co., Ltd., and the like. The amount of the component (D) component dispersant is not particularly limited, but is preferably 0.1 part by mass to 100 parts by mass, more preferably 10% by mass based on 100 parts by mass of the metal oxide particles of the [B] component. Parts ~ 60 parts by mass. If the amount of the dispersant of the component [D] is less than 0.1 part by mass, the dispersibility of the metal particles may be lowered, resulting in a decrease in coatability of the composition and a decrease in pattern formability. On the contrary, if the mixing amount exceeds 1 〇〇 by mass, the radiation characteristics of the positive type may be lowered. Further, it is feared that excessive mixing of the dispersant leads to a decrease in the adhesion of the resulting cured product. Other optional components The radiation sensitive composition of the present invention may further contain [E] dispersion medium, [F] interface activity, in addition to the above [A] to [D] components, within a range not impairing the effects of the present invention. The agent acts as an optional ingredient. [E] Component: Dispersing medium The dispersion medium of the [E] component is not particularly limited as long as it can uniformly disperse the metal oxide particles of the component [B]. The dispersion medium of the component [E] enables the nonionic dispersant of the component [C] -31 - 201131302 to effectively act, uniformly disperses the metal oxide particles of the component [B], and can be used as other according to the classification of the dispersion medium. [A] Solvents such as ingredients. In terms of dispersion medium, alcohols such as methanol, ethanol, isopropanol, butanol, and octanol can be used; ethyl acetate, butyl acetate, ethyl lactate, butyrolactone, propylene glycol monomethyl ether acetate, and propylene glycol. Esters such as monoethyl ether acetate; ethers such as ethylene glycol monomethyl ether, propylene glycol monomethyl ether, diethylene glycol monobutyl ether; dimethylformamide, N,N-dimethylacetamidine Amidoxines such as amines and N-methylpyrrolidone; ketones such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; and aromatic hydrocarbons such as benzene, toluene, xylene, and ethylbenzene. Among them, acetone, methyl ethyl ketone, methyl isobutyl ketone, benzene, toluene, xylene, methanol, isopropanol, propylene glycol monomethyl ether, and more preferably methyl ethyl ketone or propylene glycol monomethyl ether are preferable. The dispersion medium may be used alone or in combination of two or more. The amount of the dispersion medium of the component [E] can be appropriately set according to the use, but it is preferably 100 parts by mass to 100,000 parts by mass based on 100 parts by mass of the metal oxide particles of the component [B]. 200 parts by mass to 10,000 parts by mass. [F] component: surfactant The surfactant of the [F] component can be added for the purpose of improving the coating property of the radiation sensitive composition, reducing coating unevenness, and improving the developability of the radiation-irradiated portion. Further, in the surfactant of the component [F], a nonionic dispersant containing the [C] component is not contained. Examples of preferred surfactants include fluorine-based surfactants and polyoxon-based surfactants. -32- 201131302 In terms of a fluorine-based surfactant, for example, 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl)ether, 1,1,2, 2-tetrafluorooctylhexyl ether, octaethylene glycol bis(1,1,2,2-tetrafluorobutyl)ether, hexaethylene glycol (1,1,2,2,3,3_hexafluoroheptane a fluoroether such as an ether, octapropylene glycol bis(1,1,2,2-tetrafluorobutyl)ether or hexapropylene glycol bis(1,1,2,2,3,3-hexafluoroheptyl) ether; Sodium perfluorododecylsulfonate: 1,1,2,2,8,8,9,9,10,10-decafluorodecane, 1,1,2,2,3,3-hexafluorodecane Isofluoroalkanes; sodium fluoroalkylbenzenesulfonates; fluoroalkyl oxyethylene ethers; fluoroalkylammonium iodides; fluoroalkyl polyoxyethylene ethers; perfluoroalkyl polyoxyethylenes; perfluoro Alkyl alkoxylates; fluorine-based alkyl esters. For the commercial products of these fluorine-based surfactants, EFTOP EF301, 303, 352 (manufactured by New Akita Chemicals Co., Ltd.), Megafac F171, 172, 173 (manufactured by Dainippon Ink Co., Ltd.), and FLUORAD FC430 can be cited. , 43 1 (manufactured by Sumitomo 3Μ Co., Ltd.), Asahi Guard AG710, SurflonS-382, SC-101, 102, 103, 104, 105, 106 (manufactured by Asahi Glass Co., Ltd.), FTX-218 (manufactured by NEOS Co., Ltd.) Wait. As an example of a quinone type surfactant, a commercially available product name is exemplified by SH200-100cs, SH28PA, SH30PA, ST89PA, SH190, SH8 400 FLUID (made by Toray dowcorning silicone Co., Ltd.), Organosiloxane. Polymer KP341 (manufactured by Shin-Etsu Chemical Co., Ltd.) and the like. The amount of the [F] surfactant used is preferably from 0.01 part by mass to 10 parts by mass, more preferably from 0.05 part by mass to from -33 to 201131302 to 5 parts by mass, per 100 parts by mass of the [Α] component. By using the amount of the [F] surfactant in an amount of from 0.01 part by mass to 10 parts by mass, the coating property of the radiation sensitive composition can be optimized. Radiation-sensitive composition The radiation-sensitive composition of the present invention has a feeling of the above-described [A] component of a cerium oxide polymer, a [B] component metal oxide particle, and a [C] component in a predetermined ratio. It is prepared by mixing a radioactive acid generator or a radiation sensitive alkali generator 'and a dispersing agent of the [D] component and other optional components. In general, the radiation sensitive composition can be formed by mixing the metal oxide particles of the [B] component and the dispersing agent of the [D] component and the dispersion medium of the [E] component in a predetermined ratio to form a dispersion liquid. The liquid is mixed with a siloxane polymer of the [A] component, a radiation-sensitive acid generator of the [C] component, or a radiation-sensitive alkali generating agent, and an optional component as needed to prepare a radiation-induced linear composition of the dispersion state. Things. Further, the dispersion in the preparation of the above dispersion may be carried out using a paint shaker, an SC mill, a ring mill, a needle mill or the like, usually at a peripheral speed of 5 to 15 m/s, until the observation is not observed. The diameter is reduced. In this duration, it is usually a few hours. Further, at the time of the dispersion, it is preferred to use dispersed beads such as glass beads. The bead diameter is not particularly limited, but is preferably 0.05 to 0.5 mm, more preferably 〇.〇8 to 0.5 mm, and particularly preferably 0.08 to 0.2 mm. Formation of a cured film (protective film for liquid crystal display element, interlayer insulating film or spacer, protective film for semiconductor or interlayer insulating film, or lens material for LED), and then using the above-described radiation sensitive composition on the substrate A method of forming a transparent cured film (a protective film for a liquid crystal display element, an interlayer insulating film or a separator, a protective film for an semiconductor or an interlayer insulating film, or a lens material for LED) of the present invention will be described. The method includes the following steps. (1) a step of forming a coating film of the radiation sensitive composition of the present invention on a substrate, (2) a step of irradiating radiation in at least a part of the coating film formed in the step (1), and (3) making the step (2) a step of developing a coating film irradiated with radiation, and (4) a step of heating the coating film developed in the step (3) (1), forming a coating film of the radiation-sensitive composition on the substrate, In the step (1), after the radiation sensitive composition of the present invention is applied onto a substrate, it is preferred to form a coating film by heating (prebaking) the coated surface to remove the solvent. Examples of the substrate that can be used include glass, quartz, rhodium, resin, and the like. Specific examples of the resin include open-loop polymers of polyethylene terephthalate, polybutylene terephthalate, polyether oxime, polycarbonate, polyimide, and cyclic olefin. Its hydrogenated product and the like. The coating method of the composition dispersion liquid is not particularly limited, and an appropriate method such as a spray coating method, a roll coating method, a spin coating method (spin coating method), a slit die coating method, or a bar coating method can be employed. Among these coating methods, a spin coating method or a slit die coating method is particularly preferred. The prebaking conditions vary depending on the type of the components, the mixing ratio, etc., but it is preferably about 1 to 10 minutes at 7 Torr to 1 2 〇 °C. -35- 201131302 (2) a step of irradiating radiation in at least a part of the coating film, in the above step (2), 'exposing at least a part of the formed coating film in this case', when the partial coating film is exposed, usually by having The exposed mask is exposed. For the radiation used in the exposure, for example, visible light, ultraviolet light, far ultraviolet light, electron beam, or X-ray may be used in these radiations, preferably in the range of 19 〇 to 450 nm, and the radiation is particularly preferably 3 6 5 .纳米 ultraviolet radiation. The amount of exposure in this step is to use an illuminometer (〇Ai model356,

Optical Associates Inc. manufactured by measuring the intensity of radiation at a wavelength of 365 nm. It is preferably 1 00 to 1 0000 〗/m2, more preferably 500 to J/m2. (3) Developing step In the above step (3), 'by developing the exposed coating film from the unnecessary portion (in the case of a positive type, the irradiation portion of the radiation is in the negative type) The non-irradiated portion of the radiation) forms an established case. The developer used in the developing step is preferably an aqueous solution of a base (alkali). Examples of the base include quaternary ammonium salts such as sodium oxysulfate, sodium carbonate, sodium citrate, sodium metasilicate, and aqueous ammonia, such as tetramethylammonium oxide or tetraethylammonium hydroxide. Further, in the alkaline aqueous solution, a water-soluble organic solvent such as methanol or a surfactant may be added in an appropriate amount. The concentration in the aqueous solution is preferably from 属1 to 5% by mass from the viewpoint of obtaining appropriate developability. As the developing method, a liquid pool method or a dipping method can be used. Pattern to make etc. Put 6000 under 0AI and divide. The patterning, hydrogen: hydrogen, B, alkali 1%, shake -36-201131302 dynamic dipping method, spray method, etc. The development time varies depending on the composition of the radiation sensitive composition, and is preferably about 10 to 180 seconds. After the development treatment, for example, it is washed with running water for 30 to 90 seconds, and then air-dried with, for example, compressed air or compressed nitrogen gas, whereby a desired pattern can be formed. (4) Heating step In the above step (4), the patterned film is heated at a relatively high temperature by using a heating means such as a hot plate or an oven, thereby promoting the condensation reaction of the above [A] component and obtaining a cured product. . The heating temperature in this step is, for example, 1 20 to 2 50 °C. The heating time varies depending on the type of the heater. For example, in the case of performing the heating step on the hot plate, it may be 5 to 30 minutes, and in the case of performing the heating step in the oven, it may be 30 to 90 minutes. A stepwise baking method or the like which performs two or more heating steps may also be used. Thereby, a pattern-like film corresponding to the target cured product can be formed on the surface of the substrate. The cured film (protective film for liquid crystal display element, interlayer insulating film or spacer, protective film for semiconductor or interlayer insulating film) or lens material for LED, etc.) The cured film thus formed has high transparency and high refractive index. . The refractive index of the cured film obtained from the composition of the present invention differs depending on the blending ratio of each component, etc., but has a higher enthalpy of 1.5 or more and further 1.6 or more. Further, the cured film thus formed is preferably used as a protective film for an liquid crystal display element, an interlayer insulating film or a separator, a protective film for a semiconductor or a layer-37201131302 insulating film, or a lens material for an LED or the like. The thickness of the film of the cured film is preferably 0_1 to 8 #m, more preferably 〇1 to 6 " m, still more preferably 0. 1 to 4 # m. These cured films formed of the radiation sensitive composition of the present invention have transparency and adhesion as shown in the following examples, and have a high refractive index. Further, the radiation sensitive composition of the present invention is not limited to the use of the patterned cured film, and can be used, for example, as a semiconductor sealing material, a semiconductor underlayer material, a circuit substrate material, a planarization material, The material for protecting a circuit board is a material for a resist, a material for a plating resist, or a material for a liquid crystal sealing. These cured films can be obtained in a short time by the formation of the radiation-sensitive composition of the present invention, and are excellent in heat resistance, adhesion, electrical insulation, and the like. EXAMPLES Hereinafter, the present invention will be specifically described by showing Synthesis Examples and Examples, but the present invention is not limited to the following examples. The number average molecular weight (??) and the weight average molecular weight (Mw) of the hydrolysis condensate obtained by the following synthesis examples were determined by gel permeation chromatography (GPC) as described below. Device: GPC-101 (manufactured by Showa Denko Co., Ltd.) Pipe column: a combination of GPC-KF-801, GPC-KF-802, GPC-KF-803 and GPC-KF-804 (manufactured by Showa Denko Co., Ltd.) Mobile phase: tetrahydrofuran-38-201131302 [Synthesis Example 1] In a vessel having a stirrer, 144 parts by mass of propylene glycol monomethyl ether was added, followed by addition of 13 parts by mass of methyltrimethoxydecane (MTMS), 5 parts by mass of 7 - Glycidoxypropyltrimethoxydecane (GPTMS) and 6 parts by mass of phenyltrimethoxydecane (PTMS) were heated until the solution temperature reached 6 °C. After the temperature of the gluten solution reached 60 ° C, 7 parts by mass of ion-exchanged water was added and heated to 75 ° C for 3 hours. Next, 25 parts by mass of methyl orthoformate was added as a dehydrating agent, and the mixture was stirred for 1 hour. The solution temperature was further brought to 40. (:, maintaining the temperature and evaporating) to remove water and an alcohol formed by hydrolysis condensation. The oxirane polymer (A-1) is obtained by the above procedure. The number average molecular weight (??) of the obtained hydrolysis condensate is 2,500. The molecular weight distribution (Mw/Mn) was 2. [Synthesis Example 2] In a vessel having a stirrer, 144 parts by mass of propylene glycol monomethyl ether was added, followed by 13 parts by mass of methyltrimethoxy sand (MTMS), 11 mass. The tetramethoxy decane (T Μ 0 S )' is heated until the temperature of the solution reaches 60 ΐ: After the solution temperature reaches 60 ° C, 7 parts by mass of ion-exchanged water is added and heated to 75 ° C. Then, adding 25 parts by mass of methyl orthoformate as a dehydrating agent' was stirred for 1 hour. Further, the temperature of the solution was brought to 4 〇t:, and the temperature was maintained and evaporated to remove water and an alcohol formed by hydrolysis condensation. The step of obtaining a siloxane polymer (A-2). The obtained hydrolysis condensate has a number average molecular weight (?η) of 2500' and a molecular weight distribution (Mw/Mn) of 2. Preparation of a radiation sensitive composition -39-201131302 Example 1] 3 parts by mass (D-1) polyoxyethylene alkyl phosphate as a dispersing agent of the component [D], 90 parts by mass of methyl ethyl ketone as a dispersion medium of the [E] component, and stirred in a homogenizer for about 10 minutes. 7 parts by mass of (B-1) zirconium oxide particles (ZrCh particles) as metal oxide particles of the [B] component were added, and the mixture was stirred for about 15 minutes after the addition of the particles. The resulting slurry was dispersed using an SC mill to obtain a dispersion. In the solution containing the azoxyalkyl polymer obtained in the synthesis example (corresponding to 100 parts by mass of the siloxane polymer (solid content)) as the component [A], 100 parts by mass of the above dispersion is added, 6 mass A (C-1) photoacid generator as a component [C], and 0.3 parts by mass of a terpene surfactant SH8400 FLUID (manufactured by Toray Dow Corning Co., Ltd.) as a component [F] were prepared to prepare a radiation sensitive composition. [Examples 2 to 18 and Comparative Examples 1 to 4] The radiation sensitive composition was prepared in the same manner as in Example 1 except that the types and amounts of the components [A] to [F] were as described in Tables 1 and 2. In addition, the components in Tables 1 and 2 are as follows. C-1) Photoacid generator: 1-(4-n-butoxynaphthalene-1-yl)tetrahydrothiophene trifluoromethanesulfonate (C-2) photobase generator: 2-nitrobenzyl Cyclohexylcarbamate (D-1) polyoxyethylene alkyl phosphate: a compound (D-2) in the above formula (2) where 'P = about 9' q = about 1 3 and X = about 3 Amidoxime amine salt: a guanamine amine salt of a high molecular polycarboxylic acid having a number average molecular weight of -40 to 201131302 of the above formula (3) (PLAAD ED21 1 manufactured by Nanben Chemical Co., Ltd.) (D-3 Ethylenediamine PO - EO condensate: Ethylenediamine PO-EO condensate of the above formula (4) (ADEKA PLURONIC TR-702 manufactured by Asahi Kasei Kogyo Co., Ltd.) (D-4) Polyoxyethylene alkyl ether: In the above formula (5), the compound (D-5) polyoxyethylene alkylphenyl ether wherein R4 is a methyl group and v = about 200: in the above formula (6), R5 is a methyl group, and n = about 200. Compound (D-6) alkyl glucoside: in the above formula (7), R6, R7, R8, R9 and Rl() are n-butyl compound (D-7) polyoxyethylene fatty acid ester: In the above formula (8), R11 is an ethyl group, R12 is an ethylidene group, and y=about 200 Composition (D-8) Sucrose fatty acid ester: In the above formula (9), R13~R2 ° compound is ethyl. (D-9) sorbitan fatty acid ester: in the above formula (1), z = about 100 compound (D-10) polyoxyethylene sorbitan fatty acid ester: in the above formula (11) A compound (D-11) fatty acid alkanolamine in which R22 is H, R23 and R24 are groups having a k = about 100: in the above formula (12), a compound having R25 is a hexyl group is evaluated and used as described above. The radiation-sensitive linear composition was evaluated as various properties of the composition of the -41-201131302 and the cured film as follows. The results are shown in Tables 1 and 2. [Evaluation of coating property of radiation sensitive composition] The prepared composition solution was applied onto a ceria substrate by a spin coater, and then prebaked on a hot plate at 100 ° C for 2 minutes to form a coating film. A film having a film thickness of 4 // m from the substrate. The surface of the film was irradiated with a sodium lamp to visually confirm the surface of the coated film. The case where the strip shape is uneven, the mistiness is uneven (cloud unevenness) is clearly indicated as X, the case where it can be slightly confirmed is denoted by Δ, and the case where it is completely unrecognizable is denoted by 〇. [Evaluation of pattern formation property of the radiation-sensitive composition] For the coating film obtained above, a PLA-501F exposure machine (ultra-high pressure mercury lamp) manufactured by Cannon Co., Ltd. was used, and a line-to-space ratio of 6.0/zm was passed. The mask of the pattern of 1) was exposed to light by changing the exposure time, and then developed with a 2.38 mass% aqueous solution of tetramethylammonium hydroxide at 25 ° C for 80 seconds by a liquid pool method. Then, it was washed with ultrapure water for 1 minute, and dried to form a pattern on the crucible substrate. After the pattern is formed, if the exposed portion is patterned, it is judged to be negative, and if the unexposed portion is patterned, it is judged to be positive. Further, the case where the pattern was formed very clearly was evaluated as pattern formation ◎, and the case where it was clear was evaluated as 〇', and the case where it was slightly unclear was evaluated as Δ, and the case where it was clear and bright was evaluated as X. In addition, in the case where the pattern is unclear and bright, when it is not possible to evaluate whether it is a positive type or a negative type, it is represented by "". [Evaluation of Light Transmittance (Transparency) of the Cured Film] The above-mentioned "Evaluation of Pattern Formability" was carried out in the same manner as in the case of using a glass substrate - 42 · 201131302 ("Corning 7059" Corning Co., Ltd.) instead of the ruthenium substrate. 'Form a coating film on a glass substrate. Then, it was heated at 220 ° C for 1 hour in a cleaning oven to obtain a cured film. The light transmittance of the glass substrate on which the cured film was formed was measured by a spectrophotometer "150 - 20 type double beam" (manufactured by Hitachi, Ltd.) at a wavelength in the range of 400 to 800 nm. When the minimum light transmittance is above 92%, the light transmittance can be said to be good. Further, in the evaluation of the light transmittance, since it is not necessary to form the formed film, the development step is omitted, and only the coating film forming step, the radiation irradiation step, and the heating step are performed for evaluation. [Evaluation of refractive index of cured film] The cured film obtained by the method of "evaluation of light transmittance (transparency) of the cured film" by an Abbe refractometer was used at 25 ° C at 6 3 3 nm. The refractive index in the light. [Evaluation of adhesion of cured film to ITO (indium tin oxide) substrate] A cured film was formed in the same manner as in the "evaluation of light transmittance" except for using a substrate having ITO, and a pressure cooker test was performed (1 20 °c 'humidity). 100%, 4 hours). Then, the amount of the checkerboard remaining in one of the checkerboards was determined according to JIS K-5400-1 990's 8.5.3 attached checkerboard tape method, and the ITO adhesion of the protective film was evaluated. In the case where the number of remaining checkerboards in one of the checkerboards is 80 or less, the adhesion of IT0 is not good. -43- 201131302 7—I撇

Example 10 100.0 1 〇1 1 ο νο 1 1 1 1 1 Ο rn 1 1 1 1 1 1 90.0 0.30 〇 ◎ Ό On g 100/100 Example 9 100.0 1 ^ ^ ^ 1 1 1 Ο 'Ο 1 1 1 1 〇rn 1 1 1 1 1 I 1 ! 90.0 0.30 〇 ◎ 1 v〇Os s 100/100 00 100.0 1 P 1 1 1 5 1 1 1 ο rn 1 1 » 1 1 1 1 1 90.0 0.30 〇 ◎ 1 Ό 〇\s 100/100 Example 7 100.0 t 〇1 » 1 ο 1 1 〇1 1 1 1 1 1 1 1 1 90.0 0.30 〇◎ © Η v〇Os § 100/100 〇m Series im 100.0 1 p 〆 1 1 1 I Ο ο ΓΛ t 1 1 1 1 1 1 1 1 1 90.0 0.30 〇 ◎ © Ό Os s 100/100 Example 5 100.0 1 1 1 ο Γ*^ 1 Ο 1 Ο ... i 1 1 1 1 1 1 1 1 1 90.0 0.30 〇© On 00 »〇100/100 Example 4 100.0 1 1 14.0 1 1 ο ν〇1 Ο 'Ο 1 1 1 1 1 • 1 1 1 r 180.0 0.30 〇◎ 爵 η: (N Os 1.73 100/100 m 闺Wei 100.0 1 1 ο 1 1 ο ν〇1 ο rS 1 1 r 1 1 1 1 1 1 1 ! 90.0 0.30 〇◎ 苳1.68 100/100 Example 2 100.0 1 14.0 1 1 1 Ο \ό 1 Ο 1 1 1 1 1 1 1 1 1 1 180.0 0.30 〇 ◎ yn 〇 \ m vq 100/100 Example 1 100.0 1 ρ Bu: 1 1 1 ο νο 1 Ο rn 1 1 1 1 1 1 1 1 1 1 90.0 0.30 〇© 爵Os 1.60 100/100 _ 堪<ίπ 嵌 SS 嫲1 <<Π 嘁 嘁 is 1 < Cao 〇 1 Μ 醍 (Ν 〇Ν /*—S ώ I Ο Μ Μ 鼹 Ν Ν j j j j j j j j j j j j * * * 鸥 鸥 & & & & & & & & & & & & & & & & & & & & ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' '氍ό s 逻 f f ΰ am ) SH 氍sm 遁 κ) m embedded 1 Q (D-2) guanamine amine salt (D-3) ethylenediamine PO - EO condensate 〇 > 4) polyoxyethylene Alkyl ether (D-5) polyoxyethylene alkylphenyl ether (D-6) alkyl glucoside (D-7) polyoxyethylene fatty acid ester am )Sn 氍am αχ» m 雔0? ά (D -9) sorbitan fatty acid ester (D-10) polyoxyethylene sorbitan fatty acid ester (D-11) fatty acid alkanolamine dispersion medium surfactant <characteristic of cured product> 1 coating Pattern formation 丨 light transmittance (%) 丨 refractive index (® 633 nm) adhesion g W - inch inch -

5C ) 2 1 〇 1 1 1 ο VO 1 ο cn t I 1 1 • 1 1 1 1 1 90.0 0.30 XX 1 g 1.70 0/100 Comparative Example 3 100.0 1 1 1 1 ο Ο 1 Ο ΓΠ 1 1 1 t 1 1 1 1 I 1 90.0 0.30 〇〇 • η Os 00 100/100 Comparative Example 2 100.0 1 p 1 ί 1 1 1 Ο rS 1 1 1 1 1 • 1 1 1 1 I 90.0 | 丨0.30 〇X t οο ο · ν 00 0/100 Comparative Example 1 100.0 1 I 1 1 1 ο 1 1 1 1 1 1 1 1 1 1 1 1 90.0 0.30 〇C © Light 00 On 1.48 100/100 Example 18 100.0 1 Ο 1 1 1 Ο 'Ο 1 1 1 1 1 1 1 1 1 1 1 1 90.0 Π 0.30 <Characteristics of hardened matter> &lt; C δ ν〇On $ 95/100 Example 17 1 100.0 ο 1 1 1 ο ν〇1 Ο rn 1 1 1 l 1 1 t 1 1 1 90.0 0.30 〇© v〇Os 〇〇100/100 Example 16 100.0 1 ρ 1 1 1 Ο 1 1 1 1 1 1 1 1 1 1 1 〇cn 90.0 0.30 〇◎ 爵 VO On 1.60 100/100 Example 15 100.0 ! 1 ο ι&gt; 1 1 1 ο νο 1 1 1 1 1 1 1 1 1 1 〇rS t 90.0 0.30 〇 ◎ © On 1.60 100/100 Example 14 100.0 1 ο 1 1 1 ο 1 1 1 1 1 1 1 1 1 〇ro ( 1 1 90.0 0.30 〇© © VO 〇\ 100/100 Example 13 100.0 1 ο 1 t 1 ο 1 1 1 1 1 1 1 1 〇Γ Ο 1 1 1 90.0 0.30 〇© v〇On 1.60 100/100 Example 12 100.0 1 ρ 〆1 1 1 ο νο 1 1 1 1 1 1 1 〇cn 1 1 1 1 90.0 0.30 〇© © Η Ό On s 100 /100 Example 11 100.0 1 ο 1 1 1 ο ν〇1 1 1 1 1 1 〇cn 1 1 1 1 1 90.0 1 0.30 〇© © Os 1.60 100/100 Composition (parts by mass) Embedded /-&lt;&lt;Π秘&lt; /*-S 1 ο 1 I 龈ίΝ 9 Ν ώ I ο 7 i 颙 Η (Ν Η Η &lt;Ν ώ ϊ ο 1 I 颙ο a Ν ρ 1 /-SI ο 1 I 鼹fN ο £ 蘅廿1 氍 氍 /·-V ΰ 盘 c c t ΰ am sn 氍 稍 稍 秘 秘 秘 ( ( Q (D-2) 醯 基 amine (D-3) ethylene diamine Ρ0-Ε0 condensate J (D-4) polyoxyethylene alkyl ether (D-5) polyoxyethylene alkyl phenyl ether (D-6) alkyl glucoside (D-7) polyoxyethylene fatty acid ester (D-8) sucrose fatty acid ester (D-9) sorbitan fatty acid ester (D-10) polyoxyethylene sorbitan fatty acid ester (D-11) fatty acid alkanolamine dispersion medium interface activity Agent 1 coatability pattern formation Zhi If M 骧 m m m ΓΛ v〇@ if 志 adhesion g W - ς inch - 201131302 As shown in Table 1 and Table 2 results The radiation-sensitive linear compositions of Examples 1 to 18 are positive in the sense of radiation characteristics, in addition to the rate and adhesion. In particular, the compositions containing nonionics from Examples 1 to 17 have extremely high differences. Industrial Applicability As described above, the radiation sensitivity and pattern formability of the present invention have a high refractive index in addition to the obtained cured product. Therefore, the material can be used as a protective film for a semiconductor display element or an interlayer insulating film. 'The radiation-sensitive constituent material of the present invention' is a semiconductor underlayer material, a material, a circuit board protective material, and a fullness resistance. Material, liquid crystal sealing material or light-emitting diode [Simple description of the drawing] ΑτΓ. That 0 [Main component symbol description] None. The pattern containing the [Α] to [C] component is excellent in pattern formability, and the obtained cured film has a high refractive index dispersant as a solid pattern formability of the [D] component, and the coatability is also excellent. The linear composition has a high coating property. The high transparency and adhesion are the radiation sensitive composition film, the interlayer insulating film or the separator of the present invention, the lens material for LED, and the like. This can also be used as a material for a semiconductor substrate for sealing materials, a material for a flattening material, and a material for sealing a member for a plating resist. -46-

Claims (1)

201131302 VII. Patent application scope: 1. A positive-type radiation-linear composition containing: [A] a siloxane polymer, [B] metal oxide particles, and [C] a radioactive acid generator or a sensation The above [B] metal oxide particles are irradiated with at least one kind of pine selected from the group consisting of aluminum, tin, antimony and bismuth. 2. The positive-type radiation of the first aspect of the patent application [A] siloxane polymer is a hydrolytic hydrolysis condensate represented by the following formula (1), (R')n - Si - (OR2) 4.n ( 1) In the formula (1), R1 is each independently hydrogen or a carbon-soluble organic group, and R2 is each independently hydrogen, a fluorenyl group having 1 to 6 carbon atoms or an aryl group having 6 to 15 carbon atoms, e 3. The positive-type radiation of claim 1 of the patent application further contains a [D] dispersant. 4. The positive-type radiation linear alkali generator according to item 3 of the patent application, the oxide composition of titanium, zinc, indium and metal, wherein the non-aqueous number of the decane compound is 1 to 2 0 The alkyl group of 1 to 6 and carbon i are integers of 〇~3. a composition, wherein, a composition, a compound, a polyoxyethylene derivative, a polyoxyalkylene fatty acid ester, a fatty acid alkanolamine, a [D] dispersant is the following formula (2) , (3) or (4) represented by alkyl alkyl ether, polyoxyethylidene ethyl phenyl ether, alkyl ethyl fatty acid ester, sucrose fatty acid ester, dehydrated mountain sulphate Sugar alcohol fatty acid ester or fat -47- 201131302 In the formula 2 R ο=ΓΟΗ is the ground 3RX alone J from each (2) (C Η 2 C Η 2 Ο ) p - C Η 2 C Η 2 Ο -, ρ An integer of 8 to 10 1 to 3, -(CH2CH2NCH2CH2NH)r - C q Η 2 q + 1 - C Η 2 〇 - 'q is 12~16, x is CH2CH2NH-(jjCH2CH2CH2CH2CH2)s-Ο (3) 〇CC-|〇H2〇CHC6H-|3 I OH In the formula (3), the r and s are selected such that the polystyrene-converted number average molecular weight determined by gel permeation chromatography is 10,000 to 40000. H—(OH4C2)u—(〇H6C3)t (C3H6〇)t—(C2H40)u—Η—C2H4 (4) H—(OH4C2)u—(OH6C&lt; '(C3H60)t—(C2H40)u— H In formula (4), t and ii are selected to be determined by gel permeation chromatography. The polystyrene-equivalent number average molecular weight is from 1000 to 30,000. The positive-type radiation-sensitive composition according to any one of claims 1 to 4, which is used for forming a cured film. A method for forming a cured film, comprising: (1) a step of forming a coating film of a radiation sensitive composition of claim 5 on a substrate, and (2) at least a coating film formed in the step (1) a step of irradiating a part of the radiation, • 48-201131302 (3) a step of developing a coating film irradiated with radiation in the step (2), and (4) a step of heating the coating film developed in the step (3). A kind of hardened film, which is formed by the radiation-sensitive linear composition of claim 5 of the patent application. -49- 201131302 IV. Designation of representative drawings: (1) The representative representative of the case is: No. (2) Representative figure A brief description of the component symbol: te j. w 5. If there is a chemical formula in this case, please reveal the chemical formula that best shows the characteristics of the invention: