201126099 六、發明說明： 【明戶斤屬彳，好>%員】 本發明係有關於使行動電話、資訊行動末端裝置 (PDA:個人數位助理）、個人電腦等等之操作鍵容易觀看之 照明所使用之適宜的面狀發光裝置及其製造方法。 I：先前技術3 為了明亮地照明行動電話等之按鍵，係使用面狀發光 裝置。作為面狀發光裝置，係廣泛地使用薄板狀、在薄膜 狀導光體之一端側上具備有光源之側面發光方式的裝置 (例如，參照專利文獻1)。 舉例而言，如第6圖所示之面狀發光裝置係於由上殼 101與下殼102所構成之殼體中配置有基板1〇3。於該基板 103上方係配置有鍵盤1〇5,該鍵盤1〇5係配置有複數個操 作鍵104。 如第6圖與第7圖所示，於該鍵盤1〇5之操作鍵ι〇4 下方，對應於各別操作鍵104之複數個開闢元件107係透 過導光體106而被保持在基板1〇3上❶再者，設置在鍵盤 • 105上之操作鍵104係插通設置在上殼ι〇1之插通孔i〇ia 而突出於上殼101之表面。 基板103係設置有液晶顯示裝置1〇9，該液晶顯示裝 置109係透過設置在上殼1之顯示窗i〇lb而成為可目視確 認。 於鍵盤105與基板3上之開關元件107間，作為自内 側照明配置在鍵盤105之操作鍵104的照明裝置，係設置 201126099 有導光體106。該導光體106係以透明且具可撓性之材料所 形成’而自具有線狀或複數個點狀發光體之光源1〇8入射 之光係投射在鍵盤105的下面。 如第8圖所示，於上述結構之面狀發光裝置中，自光 源108入射至導光體1〇6之一側端的光係一邊於導光體1〇6 之表裏面與其周圍之空氣層的界面反射，一邊沿著導光體 106傳遞。傳遞於導光體1〇6内之光係藉由於導光體 之背面側中’於設置在對應於各操作鍵1〇4之位置上的光 取出部106A進行散射，並作為漏光射出至外部，而使對應 於各操作鍵104之位置成為發光的狀態。 導光體106與基板1〇3係分別為諸如呈矩形之薄膜 狀、薄板狀、片狀’且於其等相互相對向的狀態下，藉由 黏著材90而接著(例如，參照專利文獻2、3、4)。 近年，為了提高具備此種面狀發光裝置之行動電話等 之電子機器的機械強度，係有將以黏著材90接著導光體 106與基板103之區域擴大的需求。 該黏著材90之厚度通常為0.05rnm左右，並具有將黏 著層設置於聚酯系透明樹脂基材之上下兩面的構成。 先行技術文獻 專利文獻 專利文獻1 特開第 專利文獻2 特開第 專利文獻3 特開第 專利文獻4 特開第 2001—167655 號公報 2007 —53063 號公報 2007— 305313 號公報 2008— 60058 號公報 201126099 【屬^明内】 本發明所欲解決之課題 於前述面狀發光裝置之製造中，由於黏著材90係裁切 成預定形狀再藉由人工作業設置於導光體106上，在考量 裁切的容易性或處理性下，係使用將黏著層形成於作為支 持材料之前述透明樹脂基材的兩面上者。 λ 然而，由於黏著材90的設置係以人工作業進行，因而 係有黏著材90的位置偏移、彎折、皺摺等情況產生。 再者，於前述構造之面狀發光裝置中，係有起因於黏 著材90中之光吸收等，而使形成有黏著材9〇之部分局部 性地亮度變高，進而使全體亮度之均勻性降低的問題。 於面狀發光裝置中，雖然考量全體亮度的均衡而預先 進行模擬，然而，前述黏著材90中之光吸收等係造成模擬 •結果與實際裝置之亮度分佈差異的原因。如上所述，倘若 將黏著材90之形成區域變大，則實際裝置與模擬的差異將 變得更大。 再者，由於行動電話等之電子機器的小型化需求，雖 «要求面狀發光裝置薄型化’然而，要在不降低黏著力 下使黏著材_型化係困難的，且裝置之薄型化並不容易。 本發明係基於此等技術課題而完成者，目的在於提供 -種面狀發絲置及其製造方法，其可防止㈣材的形成 不良’且不產生亮度均句性的降低，同時可實現裝置之薄 型化。 用以解決課題之手段 201126099 本發明之面狀發光裝置係具備有光源；片狀導光體’ 係配置接近前述光源，且將來自前述光源之光自其一端緣 導入’並將前述光沿著其面方向導光；薄片開關，係與前 述導光體相對向而配置於前述導光體之一方的面側；以及 黏著材’係將前述導光體與前述薄片開關予以接著；且前 述黏著材係為1層構造之面狀發光裝置。 前述黏著材可使用具有光反射機能者。 前述黏著材可使用呈黑色者。 前述黏著材可使用較前述導光體在折射率上為低者° 前述黏著材與前述導光體之折射率的差以0.05以上為 佳。 前述導光體係由丙烯酸系或胺曱酸酯系之樹脂材料所 構成者為佳。 月1J述點著材之厚度以0.1mm以下為佳。 述本發明之面狀發光裝置係可具有如下構成：以橫跨前 :光源之~面側與前料紐之另—面的方式設置旦有遮 尤性之遮光構件。 ’、 佈於ί㈣之面狀發光裝置的製造方法係藉由將原料液塗 裝置二使其乾燥而形成前述點著材之面狀發光 於本發明之面狀發光裝置的製造方法 刷而谁哝肀，係可藉由印 丁月述原料液之塗佈。 以下且10分鐘 液。 作為前述原料液，可使用包含在12〇。 以内之体姓 tUT- '、件下乾燥之低沸點溶劑之黏著材料的溶 201126099 於本發明之面狀發光裝置的贺、生 π裂造方法中，可於形成前 述黏著材前，先進行前述導光體之退火處理。 前述退火處理之溫度以較前 佳 平乂則述乾紐時之溫度高者為 發明效果 於本發明中，由於使黏著材成為ι層構造，與使用3 層構造之黏著㈣習知品相較，可減少減材巾之光的吸 收’而使亮度提高。又，可抑_著材形成部分之亮度局 部性地變高的情形。 曰藉由使用ι層構造之黏著材而減少光之吸收，被認為 疋因不使用基材*使黏著材之折射率變低等等所造成。 由於不產生冗度下降或局部地提高，而可獲得與模擬 結果一致、均勻性高之亮度分佈。 再者，由於黏著材為1層構造，而可藉由塗佈形成， 與需要以人工作業設置黏著材之習知品相較，不容易產生 黏著材之形成不良(位置偏移、彎折等）。因此，可提高製造 產率，達成製造花費減少。 再者’由於不使用基材，因此，可在不降低黏著力下， 形成薄黏著材。因此，可對面狀發光裝置之薄型化、小型 化有所貢獻。 圖式簡單說明 第1圖係顯示本發明面狀發光裝置之一實施形態的平 面圖。 第2圖係沿著第ι圖所示之a-A線的截面圖σ 201126099 第3圖係顯示黏著材之厚度與黏著力的關係圖。 第4圖係顯示光吸收率測定裝置之構成圖。 第5圖係顯示實施例與比較例之亮度分佈與試験結果 圖。 第6圖係顯示具有面狀發光裝置之行動電話之習知構 造之一例的斜視展開圖。 第7圖係顯示習知之面狀發光裝置之一例的平面圖。 第8圖係顯示習知之面狀發光裝置之一例的截面圖。 【實施方式3 用以實施本發明之最佳形態 以下就有關本發明之面狀發光裝置的實施形態作一說 明。 又，以下之實施形態係用於能更充分瞭解本發明之主 旨而具體説明者，除非特別指定，非用以限定本發明者。 第1圖與第2圖係顯示本發明之面狀發光裝置之一實 施形態的概略圖；第1圖係平面圖、第2圖係沿著第1圖 之A-A線的截面圖。 此實施形態之面狀發光裝置10，舉例而言，係於行動 電話中，安裝於複數個操作鍵所排列之部分上者，且概略 係由光源Η、接近光源11之出射面11a而配置之平面觀看 呈長方形片狀導光體13，以及配置於導光體13之一面（下 面）13a侧上的薄片開關20所構成。 薄片開關20係透過黏著材15而接著於導光體13。藉 由此構造，於導光體13與薄片開關20之間係設置間隙18。 8 201126099 亦即，導光體13與薄片開關20並未相接，而係隔著因應 黏著材15厚度之間隙18而使兩者成對向配置。 導光體13與薄片開關20之間所設置之間隙18的厚 度，亦即，導光體13與薄片開關20之距離並未特別限定’ 於使用面狀發光裝置10之情況中，只要導光體13與薄片 開關20不會相接之程度即可，但為了使面狀發光裝置1〇 之整體薄裂化，以0· 1mm以下為佳。舉例而言，若為0.01mm 以上且0.1mm以下時，不會產生導光體13與薄片開關20 之接觸，或導光體13與薄片開關20之黏著力降低，而可 實現面狀發光裝置10之薄型化。 於配置有導光體13之薄片開關20側的面（亦即，導光 體13之一面13a)，係於對應於行動電話各操作鍵50之預 定位置上，形成有複數個光取出部19。又，導光體13之另 一面13b係成為面狀發光裝置1〇的上面（表面、發光面）。 光取出部19係可採用在構成導光體13之片狀樹脂片 之一面的必要領域上形成印刷圖案19P等等的構造。 於導光體13中，倘若相對於其一端面13e(端緣）而入 射自光源11的出射光，該入射光將於導光體13之一面13a 與另一面13b間反復進行反射同時而傳遞於導光體13之内 部。 傳遞於導光體13内部的光係於印刷圖案19p進行散 射，並漏出至外部。藉此，可將光自形成有印刷圖案i9p 之領域（即，對應於各操作鍵5〇之領域)射出至外側。 構成光取出部19之印刷圖案19P係藉由網版印刷法 201126099 (screen printing)、凹版印刷法(gravure printing)、移印印刷 法(pad printing)等等之印刷法而形成於導光體13之—面 13a上的微小點（dot)。 所謂網版印刷法係利用伸展於作為孔版印刷之版上之 化學纖維的網版，將該網版作成光學式版膜，並將所需晝 線以外之洞堵塞而製作版，藉由透過該版膜之孔而塗印 墨’而進行設置於版下之被印刷物之印刷面印刷的方法。 由於印墨係通過網版之版膜孔而被壓出至被印刷面而進行 印刷，故可形成所需大小之印刷圖案i9P。 凹版印刷係將欲進行印刷之凸起等部分使用凹陷版， 以適當方法於該凹部填入印墨而使版全體沾染印墨，一邊 以稱為刮刀之裝置到拭表面，一邊將多餘之印墨刮除’僅 留下填入凹部之印墨，而後將該印墨按壓並移轉至被印刷 面，藉由形成印墨之隆起部分而形成凹凸部的印刷方法。 由於印刷的濃淡可藉由凹部的寬度與印墨的厚度來表現， 故可形成精細的凹凸形狀，而可形成導光體13所期望之印 刷圖案19P。 移印印刷係於凹版板之凹部裝入印墨，以刀片刮除凹 部以外之部分的印墨，將矽樹脂製等之襯墊按壓於凹版而 將印墨轉印於襯墊，藉由將該襯墊按壓於被印刷物之印刷 面而形成凹凸部的方法。又，移印係可適用球狀或筒狀等 種種形成。藉由該方法，即使是3次元形狀亦可正確地進 行轉印’因而可於導光體13上形成所期望之印刷圖案19P。 藉由此等印刷法所形成之印刷圖案19P(光取出部19) 201126099 由於亦可認知為數字或文字，故亦有不需於導光體13上另 外設置具備有操作鍵之鍵盤等的情況。在此情況下，可進 一步使面狀發光裝置1〇薄型化，進而可使適用該面狀發光 裝置10之電子機器進一步薄型化。 於此等複數個光取出部19中，組入薄片開關20之複 數個感壓型開關元件30係配合平面觀看位置，如第2圖所 示，而配置成光取出部19與開關元件3〇呈上下相對向的 方式。 於薄片開關 20 係由 PCB(Printed Circuit Board)或 FPC(Hexible Printed Circuit)等等之印刷配線基板所構成之 基板21中’於與導光體13相對向之面（以下，稱為「一 面」）21a上，係設置有複數個開關元件30，此等開關元件 30係具有被按壓薄片25覆蓋的構成。 各開關元件30係由在基板21之一面21a上以預定間 隔設置之導電性材料所構成的接點部22，以及以覆蓋接點 部22的方式’用於切換與接點部22之導通、非導通的圓 頂狀金屬板23所構成。 金屬板23係具有可與接點部22接離之可撓性，而構 成為與基板21之一面21a為反對側上形成凸狀之碗型金屬 板。該金屬板23係藉由未圖示之黏著材層而連接於按壓薄 片25。 當操作者以手指或筆等之操作件按壓導光體13之部 分操作鍵50時，金屬板23之凸狀面23a係透過導光體13 與按壓薄片25而被按壓。如此一來，該凸狀面23&係朝向 11 201126099 基板21之一面21a側f曲的方式變形而與接點部22相接， 並可與接點部22導通。 因此’藉由自各光取出部19之漏光可顯示設置有金屬 板23之操作鍵5〇的存在位置，並可藉由手指等等之操作 件按C操作鍵5G使金屬板23變形，切換與接點部22之導 通，而進行各開關元件30之開關（導通、非導通)操作。 作為光源11，係可使用發光二極體(Light Emitting Diode LED)等之發光元件、冷陰極管等之發光料等所構 f者1光源11係由LED所構紐，係具有如下構成： 狀成體内部係内裝有發光元件晶片而可將該發光元件 射出之光自光源11之殼體側面之射出面lla射出。 再者，光源11係藉由焊料29而設置成連接於基板21 之面21a上（圖示省略）的電氣電路。 導光體13係由片狀樹脂所構成，例如，形成平面觀看 呈長方形者。 作為構成導光體13之樹脂係透光性之樹脂，且，只要 可彈11變形即可而未有特別限定，較佳為選自於由丙烯酸 条去士士日匕 ’、3 9、胺甲酸酯系樹脂、聚碳酸酯系樹脂、聚矽氧烷系 樹月曰(石夕系樹脂）、聚苯乙稀系樹脂、聚醯亞胺系樹脂、聚甲 基丙稀酸甲隨(Polymethylmethacrylate、PMMA)之彈性體、 胺甲酸丙烯酸酯所構成之組群中所選出之任一者。 其中特別以丙烯酸系樹脂或胺曱酸酯系樹脂因具有彈 陡而不易損傷、耐久性的點而較為出色。 導光體13之厚度並未特別限定，由於自光源11之射 12 201126099 出光的透過率高，在操作者以手指或筆等之操作件按壓操 作鍵50時，雖可使金屬板23向下彎曲變形而導通接點部 22 ’在不按壓操作鍵50時’只要可將導光體13與薄片開 關20間所設置之間隙18的寬度保持在一定（亦即，可使導 光體13與薄片開關20不相接）即可’為了使面狀發光带置 1〇薄型化’可使厚度為0.01mm以上、〇_5mm以下，較佳 為0.1mm以上、0.2mm以下。 黏著材15係形成1層構造(單層構造）。亦即，黏著材 15係未使用基材，整體皆由黏著材料所形成。黏著材15 較佳為由1種類之黏著材料均一地形成者。 作為如此之黏著材料，可列舉有丙烯酸系樹脂、聚矽 氧貌系樹脂(矽系樹脂）、聚胺甲酸酯系樹脂、環氧系樹脂、 天然橡膠系黏著劑、合成橡膠系黏著劑等等。 黏著材15可為透明或亦可為不透明。 黏著材15可為無色，但亦可使用呈現黑、白等等之任 意顏色者。 倘若使用呈現黑色之黏著材15，由於容易吸收光且放 出較少’不容易發生黏著材15形成部分之亮度局部變高的 現象，而可獲得均勻性高之亮度分佈。 在使黏著材15著色變黑時，只要使黏著材15含有黑 色色素(顏料或染料)即可色色素係有碳黑等等。、 在獲得均勻之亮度分佈上，於點著材15賦予光反射機 能（即反射來自外部光之機能）亦為有效。 舉例而言，藉由於前述黏著材料上添加含有銘粉末、 13 201126099 銀粉末等之金屬的填料，可於黏著材 藉由於黏料, 反射機喊。 中之光的⑽ ·’予献射舰’可減條著材15 先的錄，而可獲得均勻性高之亮度分佈。 率αΓ者1^使㈣材15之折射率較導絲13之折射 率為低，由於可抑制斤射 進亮度分佈的均句性。 的及收，亦可達成増 、在獲得折射率較導細13為低之㈣材15上， 低折射率之黏者材料形成黏著材15即可。具體而言，可 用丙烯酸系樹脂、聚石夕氧院系樹脂(石夕系樹脂）。 再者，藉由在點著材料添加具有使折射率降低之作 的材料，亦可調整黏著材15之折射率。作為具有使折射率 降低之作用的材料，係有聚石夕魏系填料(㈣填料)等等， 藉由將該填料添加於前述黏著材料(例如丙稀酸系樹脂），可 降低黏著材15之折射率。 折射率差（將導絲讀射㈣絲著㈣之折射率 後的値）以〇·〇5以上為佳。藉由使折射率差落於此範圍可 防止光的吸收，而可獲得均勻性高之亮度分佈。 再者，亦可使用兼具有前述光反射機能與較前述導光 體13為低之折射率的黏著材料。 如第1圖所示，黏著材15可設置在框狀部15Α以及 帶狀部15Β上，框狀部15Α係沿著導光體13之一面na 之外周緣部而設置，而帶狀部15B係設置在行動電話中相 互間隔開來且配置成複數列之各操作鍵（即，光取出部19) 的列之間。 14 201126099 於圖示例中，框狀部15A係為矩形狀。於構成框狀部 15A之4個邊部I5a~i5c(上邊部I5a、側邊部15b、15b以 及下邊部15c)上，亦可分別使用任意顏色之黏著材15。舉 例而言，4個邊部15a〜15c中，可僅於最靠近光源n之下 邊部15c使用黑色黏著材15，而於其他邊部15a、i5b則使 用其他顏色之黏著材15(例如無色透明）。 依據此構成，由於容易發生點著材15形成部分之亮度 局部變高現象之光源n附近，係使用容易產生光吸收之黑 ，點著材15，而可防止前述局部之亮度上昇，且於其他邊 部15a、15b中，可抑制光之損失。 黏著材15之厚度並未特別限定，倘若為〇1咖以下， 以使面狀發光裝置10薄型化之觀點來看係為適宜。舉例而 吕，倘若為請職以上、αι_以下，不會產生導光體 開關2〇之接觸’且可實現面狀發光裝置10之薄 ---- * ^ ^ ^ 附近，係設置有片狀之遮光構件4〇 -遮光構件4〇係由具有遮光性之材料所構成，舉例而 ^可使用由聚胺甲_系樹脂、聚碳酸㈣樹脂、聚碎 ^糸樹脂(㈣、樹脂）、聚苯乙烯系樹脂等之樹脂以及各種 金屬所構成之組群中所選出的任一者。 ^提冑継，酬顧_蝴料，靜 由该卓材制構紅薄片表面塗佈㈣。 、 充分之遮光性即可而未特別限定，雖白色等二= 15 201126099 會吸收光且遮光性高之黑色為佳。 再者，亦可對遮光構件40賦予光反射機能。 在此情況下，係藉由於表面蒸汽沈積或塗佈諸如鋁或 銀等之金屬而可於遮光構件40之表面上形成反射層。再 者，藉由以前述鋁等之金屬形成遮光構件40，亦可對遮光 構件40賦予光反射機能。 其次，就有關第1圖與第2圖所示之面狀發光裝置10 之製造方法的一例進行説明。 較佳地，係於形成黏著材15前，先進行導光體13之 退火處理。 退火處理步驟之溫度條件以設定超過100°C之溫度（例 如超過120°C之溫度）為佳。且該溫度以140°C以下為佳。 退火處理步驟係以較後述乾燥步驟中之溫度為高的溫度進 行者為佳。在導光體13為具有熱收縮之性質者時，係藉由 退火處理進行熱收縮。 其次，於導光體13之一面13a上，係藉由上述印刷方 法而形成印刷圖案19P 1成為光取出部19。 其次，於導光體13之另一面13b上，塗佈黏著材15 之原料液。該原料液係含有為黏者材15之構成材料的前述 黏著材料，例如，前述黏著材料與溶劑所構成之溶液。 作為溶劑，於後述之乾燥步驟中，以在120°C以下（較 佳為100°C以下）且10分鐘以内（較佳為5分鐘以内）之條件 下進行乾燥之低沸點溶劑為佳。作為低沸點溶劑，可例示 有水、醇類（乙醇、曱醇）。特別地，由於水在低温亦容易乾 16 201126099 燥，且對於導光體13的影響較小的緣故，因而較為適宜。 作為原料液，可使用含有諸如丙烯酸系樹脂與水之乳 化劑。由乳化劑構成之原料液中，係藉由使其含有界面活 性劑而可提高樹脂之分散性。將水作為溶劑之乳化劑，係 具有因溶劑為水而導光體13不會劣化，且不會產生亮度降 低的優點。 再者，作為原料液，亦可使用包含丙烯酸系樹脂與醇 類(例如乙醇)者。 又，作為原料液，亦可使用液狀硬化型樹脂，例如紫 外線硬化型樹脂(胺甲酸酯丙烯酸酯、環氧丙烯酸酯等）、熱 硬化型樹脂等等。液狀硬化型樹脂係藉由塗佈於導光體 .後，使其硬化(乾燥）而可作為黏著材。 原料液之塗佈係可藉由印刷來進行。雖塗佈方法亦可 為轉印、喷霧等，但從原料液之塗佈量或塗佈位置的正確 性專點來看’以印刷為最適宜。 作為印刷方法’並未特別限定，雖可採用前述之網版 印刷法、凹版印刷法、移印印刷法等等之印刷法，在該等 之中，以黏著材15之厚度容易調整的網版印刷最為通宜。 其次’使塗佈有原料液進行乾燥而使溶劑蒸發，作為 由前述黏著材料所構成之黏著材15。 如上所述’於以較乾燥步驟為高之溫度進行退火處理 時，由於乾燥步驟係於較退火處理為低溫下進行的緣故， 因而不會產生導光體13之熱收縮等等。 此乾燥步驟之溫度條件可設定為12〇〇c以下（較佳為 17 201126099 1〇〇°C以下）’例如6〇〜80。〇乾燥步驟之時間，以1〜5分鑓 為佳藉由將乾燥步驟之溫度條件設定於此範圍，可抑制 對導光體13之不m響(熱收縮等）。 舉例而言，使用由含有丙烯酸系樹脂與水之乳化劑所 構成之原料液，可將退火處理條件設定為溫度11G°C(處理 時間3分鐘），而乾燥條件設定為溫度60°C(處理時間i分 鐘）。再者’使用含有丙稀酸系樹脂與乙醇之原料液時，可 將退火處理條件設定為溫度U(rc(處理時間3分鐘），而乾 燥條件5又疋為溫度80°C (處理時間5分鐘）。 其-人，藉由於導光體13之下面侧，透過黏著材15而 貼合薄片開關20 ’而獲得第1圖與第2圖所示之面狀發 裝置10。 疋 5述構成之面狀發光裝置10中，倘若相對於導光體 13之-端面l3e而自光源u射入出射光’該入射光係於‘ 光體13之一面13a與另一面13b間反射的同時傳遞於導光 體13之内部，其一部係於光取出部19散射而漏出至外部。 於面狀發光裝置1〇令，由於係以黏著材Μ作為】層 ^造，相對於使用3層構錄著材， =中之光的吸收，並提高亮度。再者，可_光的： 斤導致之點考材15形成部分亮度局部變高的情形。 :由使用丨層構造之黏著材15而可減少光的吸收係可 ^董為因不使用基材而使黏著材15之折射率變低造 成的緣故。 由於不會發生亮度降低或局部上昇，而可獲得與模擬 18 201126099 結果一致，且均勻性高之亮度分佈。 再者，由於黏著材15係為1層構造，而可藉由塗佈形 成，與需以人工作業設置黏著材之習知品相比，不容易發 生黏著材15之形成不良(位置偏移、彎折等）。因此，可實 現提高製造率並降低製造花費。 再者，由於黏著材15不使用基材，就可在不使黏著力 降低下而可形成薄的點，係較習知品優異。 此一事實可由顯示黏著材之厚度與黏著力之相關關係 的第3圖得以清楚瞭解。亦即，於習知3層構造之黏著材 中，倘若為了抑制整體厚度而形成薄黏著層，將無法避免 黏著力的降低，然而，於1層構造之黏著材15中，由於整 體皆為黏著材的緣故，而可在幾乎不使黏著力降低下抑制 整體厚度。 因此，可達成面狀發光裝置10之薄型化、小型化。 再者，於面狀發光裝置10中，藉由具備部分覆蓋光源 11之上面lib以及橫跨導光體13之一面13b的遮光構件 40，可防止自光源11與導光體13之間隙部分的漏光。 藉此，可實現在照明配置有操作鍵50之導光體13時， 亮度分佈更均勻化。 又，於上述實施形態中，雖例示了於導光體13設置有 由印刷圖案19P所構成之光取出部19的面狀發光裝置10, 但本發明之面狀發光裝置並非限定於此。於本發明之面狀 發光裝置中，亦可於導光體13之另一面13b，即，所謂與 導光體13之薄片開關20相對向之面的反對側面上設置光 19 201126099 取出部。 在此情況下，亦可以覆蓋設置於導光體13之另一面 13b之光取出部19的方式，設置由透光性樹脂所構成之保 護膜。藉此，可使光取出部變得難以受到損傷。 再者，作為黏著材15，雖列舉了設置於沿著導光體i 3 之一面13a之外周緣部所設置之框狀部15A，以及於光取 出部19列之間設置之帶狀部15B的例子，但並非限定於 此，黏著材15之設置設計如何皆可。 本實施形態中所例示以外，只要在不偏離本發明之主 旨下’可適宜地變更其他構成。 實施例 (實施例1、比較例1、2) 使用第4圖所示之光吸收率測定裝置，而測定黏著材 之光吸收率。 於寬度10mm、深度50mm、厚度200// m之薄長方形 狀之導光體33的上下面，設置由白色PET(聚對苯二甲酸 乙二酯）所構成之遮蔽材34、34，並於上面側之遮蔽材34 與導光體33之間設置寬度imm之黏著材35。將自光源31 通過導光體33而到達發光二極體32之光的強度，藉由以 下所示之通式而算出黏著材35之光吸收率（％)。並將結果 顯示於表1。 黏著材35之光吸收率=設置有黏著材35之光強度變 化量/未有黏著材35時之光強度 所謂「設置有黏著材35之光強度變化量」係指未有黏 20 201126099 著材35時之光強度與存有黏著材35時之光強度的差。 於實施例1中，係使用由丙烯酸系樹脂所構成之1層 構造的黏著材(折射率1.474)。 於比較例1中，係使用3層構造之黏著材（基材為聚酯 系樹脂 '黏著層為丙烯酸系樹脂、黏著材整體之折射率為 i.488)。 於比較例2中，係使用3層構造之黏著材(基材為聚酯 系樹脂、黏著層為丙烯酸系樹脂、黏著材整體之折射率為 1.488)。 【表1】 ΙΕ較你ΤΤ 基材 ΙΓ 黏著材 折射率 一1.474 黏著材 厚度 (# m) ~30~ 一導光 1.457 吸收率 體的折身 1.656 ί率 1.488 1?7〇3% 5.00% 14.02% 有 1.488 30 16.14% 5.20% 15.40% 彡匕較例1 一有 1.488 50 20.37% 6-43% 21.74% 依據表1可知，相較於3層構造之黏著材（比較例1、 2)，1層構造之黏著材（實施例1}係玎降低光吸收率。 再者，係有導光體之折射率相較黏著材之折射率愈大 者’光吸收率變小的傾向。 再者’係有黏著材愈薄者，光吸收率變小的傾向。 再者，係有黏著材之折射率愈低者，光吸收率變小的 傾向。 (實施例2) 使用與在實施例1中所用之同様的黏著材，製作第i 21 201126099 圖與第2圖所示之構造的面狀發光裝置。 (比較例3) 使用與在比較例1中所用之同様的黏著材，製作第1 圖與第2圖所示之構造的面狀發光裝置。 (比較例4) 使用與在比較例2中所用之同様的黏著材，製作第1 圖與第2圖所示之構造的面狀發光裝置。 將有關各實施例與比較例之面狀發光裝置之亮度分佈 與平均亮度的調查結果顯示於第5圖。 該面狀發光裝置係於下部具有光源（可看出白色部 分，請參照第7圖）。平均亮度係裝置上部（以符號36所示 之框所圍的部分）中之亮度的平均値。 依據第5圖可確認：相較於使用3層構造之黏著材的 比較例3、4，於使用1層構造之黏著材的實施例2中，即 使是在遠離光源之位置亦可獲得高亮度。 【圖式簡單說明】 第1圖係顯示本發明面狀發光裝置之一實施形態的平 面圖。 第2圖係沿著第1圖所示之A-A線的截面圖。 第3圖係顯示黏著材之厚度與黏著力的關係圖。 第4圖係顯示光吸收率測定裝置之構成圖。 第5圖係顯示實施例與比較例之亮度分佈與試驗結果 圖。 第6圖係顯示具有面狀發光裝置之行動電話之習知構 201126099 造之一例的斜視展開圖。 第7圖係顯示習知之面狀發光裝置之一例的平面圖。 第8圖係顯示習知之面狀發光裝置之一例的截面圖。 【主要元件符號說明】 10 面狀發光裝置 22 接點部 11 光源 23 金屬板 11a 出射面 23a 凸狀面 lib 上面 25 按壓薄片 13 導光體 29 焊料 13a 一面 30 感壓型開關元件 13b 另一面 31 光源 13e 端面(端緣） 32 發光二極體 15 黏著材 33 導光體 15a 上邊部 34 遮蔽材 15b 側邊部 35 黏著材 15c 下邊部 40 遮光構件 15A 框狀部 50 操作鍵 15B 帶狀部 90 黏著材 18 間隙 101 上殼 19 光取出部 101a 插通孔 19P 印刷圖案 101b顯示窗 20 薄片開關 102 下殼 21 基板 103 基板 21a 一面 104 操作鍵 23 201126099 105鍵盤 106 導光體 106A光取出部 107開闢元件 108 光源 109液晶顯示裝置 24201126099 VI. Description of the invention: [Ming hu 彳 彳 好 好 好 好 好 好 好 】 】 】 】 】 】 】 】 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本A suitable planar light-emitting device for use in illumination and a method of manufacturing the same. I: Prior Art 3 In order to brightly illuminate a button such as a mobile phone, a planar light-emitting device is used. As the planar light-emitting device, a device having a thin-plate shape and a side-light-emitting type having a light source on one end side of the film-shaped light guide is widely used (for example, see Patent Document 1). For example, the planar light-emitting device shown in Fig. 6 is provided with a substrate 1?3 in a casing composed of an upper casing 101 and a lower casing 102. A keyboard 1〇5 is disposed above the substrate 103, and the keyboard 1〇5 is provided with a plurality of operation keys 104. As shown in FIGS. 6 and 7 , under the operation keys ι 4 of the keyboard 1 〇 5 , a plurality of development elements 107 corresponding to the respective operation keys 104 are held by the light guide body 106 on the substrate 1 . Further, the operation key 104 provided on the keyboard 105 is inserted through the insertion hole i〇ia of the upper casing ι1 to protrude from the surface of the upper casing 101. The substrate 103 is provided with a liquid crystal display device 1〇9 which is visually identifiable by being transmitted through the display window i〇lb provided in the upper casing 1. Between the keyboard 105 and the switching element 107 on the substrate 3, as the illumination device disposed on the operation key 104 of the keyboard 105 from the inner side illumination, the light guide 106 is provided in 201126099. The light guide body 106 is formed of a transparent and flexible material and is incident on the lower surface of the keyboard 105 from light having a linear or a plurality of light-emitting elements 1 to 8 of the point-like light-emitting body. As shown in Fig. 8, in the planar light-emitting device of the above configuration, the light system incident from one side of the light guide body 1〇6 from the light source 108 is on the inside of the surface of the light guide body 〇6 and the air layer around it. The interface is reflected and transmitted along the light guide 106. The light transmitted through the light guide body 〇6 is scattered by the light extraction portion 106A provided at the position corresponding to each of the operation keys 1〇4 on the back side of the light guide body, and is emitted as a leak light to the outside. And the position corresponding to each operation key 104 becomes a state of light emission. The light guide body 106 and the substrate 1 〇 3 are respectively in a state of a film shape, a thin plate shape, a sheet shape, and the like, which are rectangular, and are adhered to each other by the adhesive material 90 (for example, refer to Patent Document 2) , 3, 4). In recent years, in order to improve the mechanical strength of an electronic device such as a cellular phone having such a planar light-emitting device, there has been a demand for expanding the region of the adhesive member 90 and the substrate 103 with the adhesive member 90. The thickness of the adhesive 90 is usually about 0.05 rnm, and has a configuration in which an adhesive layer is provided on the lower surface of the polyester-based transparent resin substrate. For the prior art, the patent document, the patent document, the patent document, the patent document, the patent document, the patent document, the patent document, the patent document, In the manufacture of the above-mentioned planar light-emitting device, since the adhesive material 90 is cut into a predetermined shape and then placed on the light guide body 106 by manual work, it is considered to be cut. In the easiness or handling property, the adhesive layer is formed on both sides of the aforementioned transparent resin substrate as a supporting material. λ However, since the arrangement of the adhesive material 90 is performed by manual work, the positional deviation, bending, wrinkles, and the like of the adhesive material 90 are caused. Further, in the planar light-emitting device having the above-described structure, light absorption or the like in the adhesive member 90 is caused, and the portion where the adhesive material 9 is formed is partially increased in brightness, and the uniformity of the entire brightness is further improved. Reduced problems. In the planar light-emitting device, although the simulation is performed in advance in consideration of the balance of the entire brightness, the light absorption or the like in the above-mentioned adhesive material 90 causes a difference between the simulation result and the luminance distribution of the actual device. As described above, if the formation area of the adhesive 90 is made larger, the difference between the actual device and the simulation becomes larger. In addition, due to the miniaturization of electronic devices such as mobile phones, "the planar light-emitting device is required to be thinned", however, it is difficult to make the adhesive-type system difficult to reduce the adhesive force, and the device is thinned. not easy. The present invention has been made in view of such technical problems, and an object of the present invention is to provide a planar hairline and a method of manufacturing the same, which can prevent formation of a defective material, and which does not cause a decrease in brightness uniformity, and can realize a device. Thinner. Means for Solving the Problem 201126099 The planar light-emitting device of the present invention is provided with a light source; the sheet-shaped light guide body is disposed close to the light source, and the light from the light source is introduced from the one end edge thereof and the light is along The surface switch is guided to light; the sheet switch is disposed on a surface side of the light guide body opposite to the light guide body; and the adhesive material is followed by the light guide body and the sheet switch; and the adhesive is adhered The material is a planar light-emitting device having a one-layer structure. The aforementioned adhesive material can be used with a light reflecting function. The aforementioned adhesive material can be used in the form of black. The adhesive material may be used in a lower refractive index than the light guide. The difference between the refractive index of the adhesive and the light guide is preferably 0.05 or more. The light guiding system is preferably composed of an acrylic or amine phthalate resin material. The thickness of the material reported in the month 1J is preferably 0.1 mm or less. The planar light-emitting device of the present invention may have a configuration in which a light-shielding member having a masking property is provided so as to straddle the front surface of the light source and the other surface of the front material. The manufacturing method of the planar light-emitting device of the present invention is a method of manufacturing the planar light-emitting device of the present invention by drying the raw material liquid coating device 2 to form a planar light-emitting device of the present invention.哝肀, can be coated by the raw material liquid of the seal. The following and 10 minutes liquid. As the raw material liquid, it can be used at 12 〇. The inside of the body name tUT-', the dry material of the low boiling point solvent of the material is dissolved 201126099 in the method of the surface light emitting device of the present invention, in the method of forming a gamma crack, before the formation of the aforementioned adhesive material, the aforementioned Annealing treatment of the light guide. In the present invention, the temperature of the annealing treatment is higher than the temperature at the time when the dryness is higher than that of the prior art. Since the adhesive material is a ι layer structure, compared with the adhesive (4) conventional product using the three-layer structure, The light absorption of the reduced material towel is reduced to increase the brightness. Further, it is possible to suppress the case where the brightness of the material forming portion is locally increased.减少 Reducing the absorption of light by using an adhesive layer of ι layer structure is considered to be caused by not using the substrate* to lower the refractive index of the adhesive material. Since no redundancy is reduced or locally increased, a luminance distribution which is consistent with the simulation result and has high uniformity can be obtained. Further, since the adhesive material has a one-layer structure and can be formed by coating, it is less likely to cause poor formation of the adhesive material (positional deviation, bending, etc.) as compared with the conventional product in which the adhesive material is required to be manually worked. Therefore, the manufacturing yield can be improved and the manufacturing cost can be reduced. Furthermore, since the substrate is not used, a thin adhesive can be formed without lowering the adhesive force. Therefore, it contributes to thinning and miniaturization of the planar light-emitting device. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an embodiment of a planar light-emitting device of the present invention. Fig. 2 is a cross-sectional view along the a-A line shown in Fig. ι 201126099. Fig. 3 shows the relationship between the thickness of the adhesive and the adhesion. Fig. 4 is a view showing the configuration of a light absorptivity measuring apparatus. Fig. 5 is a graph showing the luminance distribution and test results of the examples and comparative examples. Fig. 6 is a perspective exploded view showing an example of a conventional configuration of a mobile phone having a planar light-emitting device. Fig. 7 is a plan view showing an example of a conventional planar light-emitting device. Fig. 8 is a cross-sectional view showing an example of a conventional planar light-emitting device. [Embodiment 3] BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment of a planar light-emitting device according to the present invention will be described. In addition, the following embodiments are specifically described for the purpose of fully understanding the present invention, and are not intended to limit the invention unless otherwise specified. Fig. 1 and Fig. 2 are schematic views showing an embodiment of a planar light-emitting device of the present invention; Fig. 1 is a plan view and Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1; The planar light-emitting device 10 of this embodiment is, for example, attached to a portion of a plurality of operation keys arranged in a mobile phone, and is schematically disposed by the light source Η and the exit surface 11a of the light source 11 The rectangular sheet-shaped light guide body 13 and the sheet switch 20 disposed on the one side (lower surface) 13a side of the light guide body 13 are viewed in plan. The sheet switch 20 is passed through the adhesive 15 and then adhered to the light guide 13. With this configuration, a gap 18 is provided between the light guide body 13 and the sheet switch 20. 8 201126099 That is, the light guide body 13 is not in contact with the sheet switch 20, but is disposed opposite to each other with a gap 18 corresponding to the thickness of the adhesive material 15. The thickness of the gap 18 provided between the light guide body 13 and the sheet switch 20, that is, the distance between the light guide body 13 and the sheet switch 20 is not particularly limited. In the case where the planar light-emitting device 10 is used, as long as the light guide is used The body 13 and the sheet switch 20 may not be in contact with each other. However, in order to cause the entire planar light-emitting device 1 to be thinly cracked, it is preferably 0·1 mm or less. For example, when it is 0.01 mm or more and 0.1 mm or less, the contact between the light guide body 13 and the sheet switch 20 is not generated, or the adhesion between the light guide body 13 and the sheet switch 20 is lowered, and the planar light-emitting device can be realized. 10 is thinner. The surface on the side of the sheet switch 20 on which the light guide body 13 is disposed (that is, the one surface 13a of the light guide body 13) is formed at a predetermined position corresponding to each operation key 50 of the mobile phone, and a plurality of light extraction portions 19 are formed. . Further, the other surface 13b of the light guide body 13 is an upper surface (surface, light-emitting surface) of the planar light-emitting device 1A. The light extraction portion 19 can have a configuration in which a printed pattern 19P or the like is formed on a necessary field of one surface of the sheet-like resin sheet constituting the light guide body 13. In the light guide body 13, if the light emitted from the light source 11 is incident on the one end surface 13e (end edge), the incident light is repeatedly reflected and transmitted between the one surface 13a and the other surface 13b of the light guide body 13 Inside the light guide body 13. The light transmitted to the inside of the light guide body 13 is scattered by the printed pattern 19p and leaks to the outside. Thereby, light can be emitted from the field in which the printed pattern i9p is formed (that is, the field corresponding to each of the operation keys 5) to the outside. The print pattern 19P constituting the light extraction portion 19 is formed on the light guide body 13 by a printing method such as screen printing method, screen printing, gravure printing, pad printing, or the like. The tiny dots on the face 13a. The screen printing method utilizes a screen stretched on a chemical fiber as a plate for stencil printing, and the screen is made into an optical plate, and a hole other than the desired rifling is clogged to make a plate. A method of printing on a printing surface of a printed matter placed under a plate by printing ink on the hole of the film. Since the ink is printed by being pressed out onto the surface to be printed by the plate hole of the screen, a printing pattern i9P of a desired size can be formed. In gravure printing, a concave plate is used for a portion such as a projection to be printed, and an ink is filled in the concave portion by an appropriate method to cause the entire printing plate to be stained with ink, and the excess printing is performed on the wiping surface by a device called a doctor blade. The ink scraping method is a printing method in which only the ink filled in the concave portion is left, and then the ink is pressed and transferred to the surface to be printed, and the uneven portion is formed by forming the raised portion of the ink. Since the shading of the printing can be expressed by the width of the concave portion and the thickness of the ink, a fine uneven shape can be formed, and the desired printing pattern 19P of the light guiding body 13 can be formed. The pad printing is performed by inserting an ink into a concave portion of the intaglio plate, scraping the ink of a portion other than the concave portion with a blade, pressing a pad made of a resin or the like against the intaglio plate, and transferring the ink to the pad by using The method in which the spacer is pressed against the printing surface of the printed matter to form the uneven portion. Further, the pad printing system can be applied to various types such as a spherical shape or a cylindrical shape. According to this method, even if the three-dimensional shape is correctly transferred, the desired printed pattern 19P can be formed on the light guide 13. The printing pattern 19P (light extraction unit 19) formed by the printing method is also known as a number or a character. Therefore, it is not necessary to separately provide a keyboard or the like having an operation key on the light guide body 13. . In this case, the planar light-emitting device 1 can be further reduced in thickness, and the electronic device to which the planar light-emitting device 10 is applied can be further thinned. In the plurality of light extracting portions 19, the plurality of pressure sensitive switching elements 30 incorporated in the sheet switch 20 are fitted to the planar viewing position, and as shown in Fig. 2, the light extracting portion 19 and the switching element 3 are disposed. In a way that is up and down. The sheet switch 20 is formed on the substrate 21 composed of a printed wiring board such as a printed circuit board (PCB) or a FPC (Hexible Printed Circuit), and is opposed to the light guide body 13 (hereinafter referred to as "one side"). In FIG. 21a, a plurality of switching elements 30 are provided, and these switching elements 30 have a configuration covered by a pressing sheet 25. Each of the switching elements 30 is a contact portion 22 made of a conductive material provided at a predetermined interval on one surface 21a of the substrate 21, and is used to switch between the contact portion 22 and the contact portion 22, A non-conducting dome-shaped metal plate 23 is formed. The metal plate 23 has flexibility to be detached from the contact portion 22, and is formed into a bowl-shaped metal plate which is convex on the opposite side from the one surface 21a of the substrate 21. The metal plate 23 is connected to the pressing sheet 25 by an adhesive layer (not shown). When the operator presses the partial operation key 50 of the light guide body 13 with an operation member such as a finger or a pen, the convex surface 23a of the metal plate 23 is pressed by the light guide body 13 and the pressing sheet 25 to be pressed. In this manner, the convex surface 23& is deformed so as to be curved toward the surface 21a of the substrate 21, and is in contact with the contact portion 22, and can be electrically connected to the contact portion 22. Therefore, by the light leakage from the respective light extraction portions 19, the existence position of the operation key 5〇 provided with the metal plate 23 can be displayed, and the metal plate 23 can be deformed by the operation member of the finger or the like by the C operation key 5G, and the switching is performed. The contact portion 22 is turned on to perform switching (conduction, non-conduction) operation of each switching element 30. As the light source 11, a light-emitting element such as a light-emitting diode (LED) or a light-emitting material such as a cold cathode tube can be used. The light source 11 is composed of an LED, and has the following configuration: A light-emitting element wafer is mounted in the body interior, and light emitted from the light-emitting element can be emitted from the exit surface 11a of the side surface of the light source 11. Further, the light source 11 is provided as an electric circuit connected to the surface 21a of the substrate 21 (not shown) by the solder 29. The light guide body 13 is made of a sheet-like resin, for example, formed in a rectangular shape when viewed in plan. The resin-transmitting resin constituting the light guide body 13 is not particularly limited as long as it can be deformed by the elastic member 11, and is preferably selected from the group consisting of acrylic strips, scorpio, and sulphate. a formate resin, a polycarbonate resin, a polyoxyalkylene tree, a ruthenium resin, a polystyrene resin, a polyamidene resin, and a polymethyl methacrylate Any one selected from the group consisting of an elastomer of Polymethylmethacrylate, PMMA) and a urethane acrylate. Among them, an acrylic resin or an amine phthalate-based resin is particularly excellent in that it is less susceptible to damage and durability due to its sharpness. The thickness of the light guide body 13 is not particularly limited. Since the transmittance of the light emitted from the light source 11 is high, when the operator presses the operation key 50 with an operation member such as a finger or a pen, the metal plate 23 can be lowered. The bending deformation and the conduction contact portion 22' does not press the operation key 50 as long as the width of the gap 18 provided between the light guide body 13 and the sheet switch 20 can be kept constant (that is, the light guide body 13 can be made When the sheet switches 20 are not in contact with each other, the thickness can be 0.01 mm or more and 〇 5 mm or less, preferably 0.1 mm or more and 0.2 mm or less, in order to reduce the thickness of the planar light-emitting strip. The adhesive 15 is formed into a one-layer structure (single layer structure). That is, the adhesive material 15 is not used as a substrate, and the whole is formed of an adhesive material. The adhesive 15 is preferably formed uniformly from one type of adhesive material. Examples of such an adhesive material include an acrylic resin, a polyfluorene-based resin (lanthanide resin), a polyurethane resin, an epoxy resin, a natural rubber adhesive, and a synthetic rubber adhesive. Wait. The adhesive 15 can be transparent or opaque. The adhesive material 15 may be colorless, but any color that exhibits black, white, or the like may also be used. When the adhesive material 15 which exhibits black color is used, since the light is easily absorbed and released less, the brightness of the portion where the adhesive material 15 is formed is locally high, and a uniform brightness distribution can be obtained. When the adhesive 15 is colored and blackened, the coloring matter may be carbon black or the like as long as the adhesive 15 contains a black pigment (pigment or dye). It is also effective to impart a light reflecting function to the spot material 15 (i.e., to reflect the function from external light) in obtaining a uniform brightness distribution. For example, by adding a filler containing a metal such as Ming powder, 13 201126099 silver powder or the like to the above-mentioned adhesive material, the adhesive can be shouted by the reflector due to the binder. In the light of (10) · 'Special Ships' can reduce the first 15 records, and obtain a uniform brightness distribution. The rate α is such that the refractive index of the (four) material 15 is lower than that of the guide wire 13 because the uniformity of the intensity distribution of the pound is suppressed. In the case of obtaining the (four) material 15 having a lower refractive index than the guide 13 , the adhesive material having a low refractive index may form the adhesive material 15 . Specifically, an acrylic resin or a polysulfide resin (Shishi resin) can be used. Further, the refractive index of the adhesive 15 can be adjusted by adding a material having a refractive index lowering to the material. As a material having a function of lowering the refractive index, there is a polysulfide-based filler ((four) filler) or the like, and by adding the filler to the above-mentioned adhesive material (for example, an acrylic resin), the adhesive 15 can be lowered. Refractive index. The refractive index difference (値 after reading the guide wire (4) and the refractive index of (4) is preferably 〇·〇5 or more. By making the refractive index difference fall within this range, absorption of light can be prevented, and a uniformity of luminance distribution can be obtained. Further, an adhesive material having both the above-described light reflection function and a refractive index lower than that of the light guide body 13 can be used. As shown in Fig. 1, the adhesive member 15 can be disposed on the frame portion 15A and the band portion 15A, and the frame portion 15 can be disposed along the outer peripheral portion of the face na of the light guide body 13, and the band portion 15B It is disposed between the columns of the operation keys (that is, the light extraction portion 19) which are spaced apart from each other in the mobile phone and are arranged in a plurality of columns. 14 201126099 In the illustrated example, the frame portion 15A is rectangular. The adhesive material 15 of any color may be used for each of the four side portions I5a to i5c (the upper side portion I5a, the side portions 15b and 15b, and the lower side portion 15c) constituting the frame portion 15A. For example, among the four side portions 15a to 15c, the black adhesive material 15 may be used only for the side portion 15c closest to the light source n, and the adhesive material 15 of other colors may be used for the other side portions 15a, i5b (for example, colorless and transparent) ). According to this configuration, it is easy to cause the vicinity of the light source n where the brightness of the portion where the dot material 15 is partially formed is high, and the black material which is likely to generate light absorption is used, and the material 15 is prevented from being raised, and the brightness of the portion is prevented from rising. In the side portions 15a and 15b, loss of light can be suppressed. The thickness of the adhesive material 15 is not particularly limited, and it is preferably from the viewpoint of making the planar light-emitting device 10 thinner if it is 〇1 coffee or less. For example, if it is above the job, αι_ or below, the contact of the light guide switch 2〇 will not be generated, and the thinness of the planar light-emitting device 10 can be realized----* ^ ^ ^ The light-shielding member 4 - the light-shielding member 4 is made of a material having a light-shielding property, and for example, a polyamine-based resin, a polycarbonate (tetra) resin, a poly-ruthenium resin ((4), a resin), Any one selected from the group consisting of a resin such as a polystyrene resin and various metals. ^ Raise, pay _ _ _ material, static by the material of the red sheet surface coating (four). It is not particularly limited as long as the light-shielding property is sufficient, and it is preferable that white, etc. 2 = 15 201126099 absorbs light and has a high light-shielding property. Further, the light shielding function can be imparted to the light shielding member 40. In this case, a reflective layer can be formed on the surface of the light shielding member 40 by surface vapor deposition or coating of a metal such as aluminum or silver. Further, by forming the light shielding member 40 with the metal such as aluminum described above, the light shielding function can be imparted to the light shielding member 40. Next, an example of a method of manufacturing the planar light-emitting device 10 shown in Figs. 1 and 2 will be described. Preferably, the annealing process of the light guide body 13 is performed before the formation of the adhesive member 15. The temperature condition of the annealing treatment step is preferably set to a temperature exceeding 100 ° C (e.g., a temperature exceeding 120 ° C). And the temperature is preferably 140 ° C or less. The annealing treatment step is preferably carried out at a temperature higher than the temperature in the drying step described later. When the light guide body 13 has a property of heat shrinkage, heat shrinkage is performed by an annealing treatment. Next, on one surface 13a of the light guide body 13, the printing pattern 19P1 is formed as the light extraction portion 19 by the above printing method. Next, a raw material liquid of the adhesive 15 is applied onto the other surface 13b of the light guide 13. The raw material liquid contains the above-mentioned adhesive material which is a constituent material of the adhesive material 15, for example, a solution composed of the above-mentioned adhesive material and a solvent. The solvent is preferably a low boiling point solvent which is dried at 120 ° C or lower (preferably 100 ° C or lower) and within 10 minutes (preferably within 5 minutes) in the drying step described later. The low boiling point solvent may, for example, be water or an alcohol (ethanol or decyl alcohol). In particular, since water is easily dried at a low temperature, it is preferable because it is dry and has little influence on the light guide body 13. As the raw material liquid, an emulsifier containing, for example, an acrylic resin and water can be used. In the raw material liquid composed of the emulsifier, the dispersibility of the resin can be improved by including the interface active agent. The emulsifier using water as a solvent has an advantage that the light guide 13 does not deteriorate because the solvent is water, and the brightness is not lowered. Further, as the raw material liquid, those containing an acrylic resin and an alcohol (e.g., ethanol) can also be used. Further, as the raw material liquid, a liquid curable resin such as an ultraviolet curable resin (urethane acrylate or epoxy acrylate), a thermosetting resin or the like can be used. The liquid-curable resin is applied to the light guide body, and then cured (dried) to serve as an adhesive. The coating of the raw material liquid can be carried out by printing. Although the coating method may be transfer, spraying, etc., it is most suitable from the viewpoint of the correctness of the coating amount or the coating position of the raw material liquid. The printing method is not particularly limited, and a printing method such as the above-described screen printing method, gravure printing method, pad printing method, or the like may be employed, in which the screen is easily adjusted by the thickness of the adhesive material 15. Printing is the most appropriate. Next, the raw material liquid is dried and the solvent is evaporated to form an adhesive 15 composed of the above-mentioned adhesive material. As described above, when the annealing treatment is performed at a temperature higher than the drying step, since the drying step is performed at a lower temperature than the annealing treatment, heat shrinkage of the light guide body 13 or the like is not caused. The temperature condition of this drying step can be set to 12 〇〇c or less (preferably 17 201126099 1 〇〇 ° C or less), for example, 6 〇 80 80. In the case of the drying step, it is preferable to set the temperature condition of the drying step to the range of 1 to 5 minutes, thereby suppressing the ringing of the light guide body 13 (heat shrinkage or the like). For example, using a raw material liquid composed of an emulsifier containing an acrylic resin and water, the annealing treatment condition can be set to a temperature of 11 G ° C (treatment time: 3 minutes), and the drying condition is set to a temperature of 60 ° C (treatment) Time i minutes). In addition, when using a raw material liquid containing an acrylic resin and ethanol, the annealing treatment conditions can be set to a temperature U (rc (processing time: 3 minutes), and the drying condition 5 is again changed to a temperature of 80 ° C (processing time 5) In the case of the person, the surface switch device 10 shown in Figs. 1 and 2 is obtained by bonding the sheet switch 20' through the adhesive 15 by the lower side of the light guide body 13. In the planar light-emitting device 10, the incident light is emitted from the light source u with respect to the end surface l3e of the light guide body 13. The incident light is transmitted while being reflected between the one surface 13a of the light body 13 and the other surface 13b. One of the inside of the light guide body 13 is scattered by the light extraction portion 19 and leaks to the outside. In the case of the planar light-emitting device 1 , since the adhesive material is used as a layer, the three-layer structure is used. Material, = absorption of light in the middle, and increase the brightness. In addition, can be _ light: jin caused the point of the material 15 to form part of the brightness of the local high. : by the use of the layer of the structure of the adhesive 15 The light absorption system can reduce the refractive index of the adhesive material 15 due to the absence of the substrate. For this reason, since the brightness reduction or local rise does not occur, the brightness distribution which is consistent with the result of the simulation 18 201126099 and which has high uniformity can be obtained. Furthermore, since the adhesive material 15 is a one-layer structure, it can be formed by coating. Compared with the conventional product in which the adhesive material is required to be manually set, the formation of the adhesive material 15 is not likely to occur (positional deviation, bending, etc.). Therefore, the manufacturing rate can be improved and the manufacturing cost can be reduced. The material 15 can be formed into a thin point without lowering the adhesion without using a substrate, which is superior to conventional products. This fact can be clearly understood from Fig. 3 showing the relationship between the thickness of the adhesive and the adhesive force. That is, in the adhesive material of the conventional three-layer structure, if a thin adhesive layer is formed in order to suppress the overall thickness, the adhesion can be prevented from being lowered. However, in the adhesive material 15 of the one-layer structure, In the case of the adhesive material, the overall thickness can be suppressed without substantially lowering the adhesive force. Therefore, the thickness and size of the planar light-emitting device 10 can be reduced. In the light-emitting device 10, by providing the upper surface lib partially covering the light source 11 and the light shielding member 40 that straddles the one surface 13b of the light guide body 13, light leakage from the gap portion between the light source 11 and the light guide body 13 can be prevented. When the light guide body 13 of the operation key 50 is disposed in the illumination, the brightness distribution is more uniform. In the above embodiment, the light extraction unit 19 including the print pattern 19P is provided in the light guide body 13 as an example. The planar light-emitting device 10, but the planar light-emitting device of the present invention is not limited thereto. In the planar light-emitting device of the present invention, the other surface 13b of the light guide body 13, that is, the light guide body 13 may be used. The sheet switch 20 is provided with light 19 201126099 on the opposite side of the opposite side. In this case, a protective film made of a translucent resin may be provided so as to cover the light extracting portion 19 provided on the other surface 13b of the light guide body 13. Thereby, the light extraction portion can be made less susceptible to damage. Further, as the adhesive member 15, a frame-like portion 15A provided along the peripheral edge portion of the one surface 13a of the light guide body i3 and a band portion 15B provided between the rows of the light extraction portion 19 are exemplified. For example, but not limited to, the design of the adhesive material 15 can be designed. Other configurations than those exemplified in the present embodiment can be appropriately changed as long as they do not deviate from the gist of the present invention. Examples (Example 1, Comparative Examples 1, 2) The light absorptivity of the adhesive was measured using the light absorptivity measuring apparatus shown in Fig. 4. A masking material 34, 34 made of white PET (polyethylene terephthalate) is provided on the upper and lower surfaces of a thin rectangular light guide body 33 having a width of 10 mm, a depth of 50 mm, and a thickness of 200//m. An adhesive material 35 having a width imm is disposed between the masking member 34 on the upper side and the light guide body 33. The intensity of light reaching the light-emitting diode 32 from the light source 31 through the light guide 33 is calculated, and the light absorptivity (%) of the adhesive 35 is calculated by the following formula. The results are shown in Table 1. The light absorptivity of the adhesive material 35 = the amount of change in the light intensity of the adhesive material 35 / the light intensity when the adhesive material 35 is not present, the "change in the light intensity of the adhesive material 35 is provided" means that the adhesive material is not sticky 20 201126099 The difference between the light intensity at 35 o'clock and the light intensity at which the adhesive material 35 is present. In Example 1, an adhesive material having a one-layer structure composed of an acrylic resin (refractive index: 1.474) was used. In Comparative Example 1, an adhesive material having a three-layer structure was used (the base material was a polyester resin), the adhesive layer was an acrylic resin, and the refractive index of the entire adhesive material was i.488. In Comparative Example 2, an adhesive material having a three-layer structure was used (the base material was a polyester resin, the adhesive layer was an acrylic resin, and the refractive index of the entire adhesive material was 1.488). [Table 1] ΙΕ Relative to you ΤΤ Substrate ΙΓ Adhesive refractive index 1.74 Adhesive thickness (# m) ~30~ One light 1.457 Absorption body 1.560 ί rate 1.488 1?7〇3% 5.00% 14.02 % 1.488 30 16.14% 5.20% 15.40% 彡匕Comparative Example 1 1.48 50 20.37% 6-43% 21.74% According to Table 1, it can be seen that compared with the three-layer structure of the adhesive (Comparative Examples 1, 2), 1 The adhesive material of the layer structure (Example 1} is used to reduce the light absorptivity. Further, the refractive index of the light guide body tends to be smaller than the refractive index of the adhesive material. In the case where the adhesive material is thinner, the light absorptivity tends to be smaller. Further, the lower the refractive index of the adhesive material, the smaller the light absorptivity is. (Example 2) Use and in Example 1. The same type of adhesive material was used to produce the planar light-emitting device of the structure shown in Fig. 21 201126099 and Fig. 2. (Comparative Example 3) The first figure was produced using the same adhesive material as used in Comparative Example 1. The planar light-emitting device having the structure shown in Fig. 2. (Comparative Example 4) Using the same adhesive material as used in Comparative Example 2, The planar light-emitting device having the structure shown in Fig. 1 and Fig. 2 shows the results of investigation of the luminance distribution and the average luminance of the planar light-emitting devices of the respective examples and comparative examples in Fig. 5. The planar light-emitting device There is a light source in the lower part (see the white part, see Figure 7). The average brightness is the average 亮度 of the brightness in the upper part of the device (the part enclosed by the frame indicated by symbol 36). It can be confirmed according to Figure 5. Compared with the comparative examples 3 and 4 using the adhesive material of the three-layer structure, in the second embodiment using the adhesive material of the one-layer structure, high brightness can be obtained even at a position away from the light source. Fig. 1 is a plan view showing an embodiment of a planar light-emitting device of the present invention. Fig. 2 is a cross-sectional view taken along line AA shown in Fig. 1. Fig. 3 is a view showing thickness and adhesion of an adhesive. Fig. 4 is a view showing a configuration of a light absorptivity measuring device. Fig. 5 is a view showing a luminance distribution and a test result of the embodiment and the comparative example. Fig. 6 is a view showing a mobile phone having a planar light emitting device. Knowledge structure 201126099 made Fig. 7 is a plan view showing an example of a conventional planar light-emitting device. Fig. 8 is a cross-sectional view showing an example of a conventional planar light-emitting device. [Description of main components] 10 planar light-emitting device 22 Contact portion 11 Light source 23 Metal plate 11a Exit surface 23a Convex surface lib Upper surface 25 Pressing sheet 13 Light guide body 29 Solder 13a One side 30 Pressure-sensitive switching element 13b The other side 31 Light source 13e End surface (end edge) 32 Light-emitting diode Body 15 Adhesive material 33 Light guide body 15a Upper side portion 34 Masking material 15b Side portion 35 Adhesive material 15c Lower side portion 40 Light blocking member 15A Frame portion 50 Operation key 15B Band portion 90 Adhesive material 18 Gap 101 Upper case 19 Light extraction portion 101a insertion hole 19P printing pattern 101b display window 20 sheet switch 102 lower case 21 substrate 103 substrate 21a one side 104 operation key 23 201126099 105 keyboard 106 light guide 106A light extraction portion 107 development element 108 light source 109 liquid crystal display device 24