TW201123386A - Chip module sharing the same PCB - Google Patents

Abstract

A chip module sharing the same PCB includes a chip unit and a conductive unit. The chip unit has at least one chip body and a plurality of conductive pads electrically disposed as a matrix shape on a bottom side of the chip body. The conductive unit has a plurality of conductive elements selectively electrically disposed on the conductive pads of the chip unit. Each conductive element has a geometric center and a radius, and the distance between the two geometric centers of every two conductive elements is equal to the length of the radius of the conductive element plus 0.15 to 0.25 μ m. The chip body is electrically disposed above the PCB via the conductive elements.

Description

201123386 VI. Description of the Invention: [Technical Jaw Domain of the Invention] The present invention relates to a wafer module, and more particularly to a wafer module that can share the same motherboard. [Prior Art] In the modern and progressive information society, the computer system composed of integrated circuits has been widely used in all aspects of life. For household appliances, mobile communication devices, and personal computers, there is no trace of the circuit, and the main body of the integrated circuit is the die produced by the conventional semiconductor. The process of fabricating a die begins with the production of a wafer, which distinguishes multiple regions on a wafer, and in each region, uses a semi-system process to form various circuits, and finally wafers. Each of the upper regions is cut into individual crystal grains. After obtaining the crystal grains, the granules must be electrically connected to the circuit board, for example, a printed circuit board (4) café board (PCB), so that the daily granules can pass through. The circuit board obtains the required operating voltage for performing a predetermined operation. For example, the die is an encoder circuit. When the voltage required for the operation of the encoding circuit is provided, the die can be targeted. The data signal input by the circuit board is input and encoded, and the encoded signal is outputted to the circuit board. Generally speaking, the method of electrically connecting the chip to the circuit board can be a bare chip configuration method of directly connecting the crystal to the circuit board, or encapsulating the wafer through a ii2aekage, and then passing through the county body. The internal electrical and electrical connection to the circuit board to receive power and transmission signals. The main function of the substitute body is to provide the purpose of transferring between the chip and the circuit board, such as tiger transmission; 丨© and 倾 ^, and because the current electronic 201123386 product is gradually moving toward the trend of light, thin, short and high computing speed, it is required by the package. The number of input/output pins (package pinc〇u is also increased, and the thickness must be thinner and thinner, and the area must be smaller and smaller. In the past, pin-on-pin (ΡΤΉ) packaging technology was used. Due to the size limitation of the corresponding insertion holes on the board, the size of the package cannot be further reduced, and the number of input/output pins is also limited by a, so the surface is attached (surface mount techn〇I〇gy, SM Ding)'s seal ^

The technology gradually replaces the (10) plug-in packaging technology to reduce the package size. w (four) pin insertion and surface adhesion packaging technology are all I / HenPhei > a) package, the purpose of the package volume reduction and wheel There is still an innate limit on the increase in the number of output pins. For example, if the number of pins arranged in the periphery increases, the number of pins in the periphery increases, because the distance between adjacent pins is too short, the matrix is one chest: the grid/column (10) 丨 咖 咖 y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y y Can be greatly increased. According to the joint (four) one grid; the grid array package. j can be loaded with limbs and flip chip bonding balls to make her wafer size

Level Chip Scale Package, 5 201123386 Process 'Therefore, the size of the finished product is on the same function, which is unfavorable for the interaction of the back-end module factory, thus increasing the inventory of the motherboard (also increasing the inventory). The cost of new motherboards developed for different sizes. 3曰/缘是' The inventor can improve the above-mentioned defects, and based on years of experience in this aspect, learn and research, and with the use of academics, propose a reasonable design and effectively improve the above Missing = invention. SUMMARY OF THE INVENTION The technical problem to be solved by the present invention is to provide a wafer module that can share a wafer module of the same motherboard. In order to solve the above technical problems, according to one of the embodiments of the present invention, there is provided a wafer module which can share the same motherboard, comprising: a wafer unit and a conductive unit. The wafer unit has at least one wafer body and a conductive pad disposed on the bottom of the U body and arranged in a matrix shape. The conductive unit is composed of a plurality of conductors electrically connected to the conductive pads of the wafer unit. Each of the conductive systems has a geometric center and a radius, and two of each of the two conductors The spacing of the film is based on the radius of the conductor plus G.15 mm to G.25 mm. The wafer system is electrically disposed above the motherboard through the conductors. In order to solve the above technical problem, according to one aspect of the present invention, a wafer module that can share the same motherboard includes: a wafer unit, a first conductive unit, a transfer substrate unit, and a second conductive unit. The ms chip unit has at least a wafer body and a plurality of conductive pads electrically disposed at the bottom of the at least the wafer body and arranged in a matrix 201123386 (matrix) shape. The first conductive unit has a plurality of first conductive bodies selectively electrically disposed on the conductive pads of the wafer unit, each of the first conductive systems having a geometric center and a radius.

And the distance between the two geometric centers of the two first conductors is equal to the radius of the first conductor plus 0.15 mm to 〇.25 mm. The interposer substrate unit has a transit circuit board, a plurality of layer pads disposed on the upper surface of the interposer circuit board, and a plurality of lower surfaces disposed on the interposer circuit board and electrically connected to the interposer substrate Wait for the underlying pads to be soldered. The second conductive unit has a plurality of second electrical conductors selectively electrically disposed on the underlying solder pads of the interposer substrate unit. The transit circuit board is electrically disposed through the second electrical conductors. Above the motherboard. Therefore, the present invention has the beneficial effects that the present invention sets the existing wafers of similar size in a targeted pin-up manner, and adds the same crystals and can also reduce the host generated by different wafers. The development cost of the motherboard. For a more detailed understanding of the techniques and functions of the present invention for achieving the intended purpose, please refer to the following: (4) The detailed description of the present invention is in accordance with the purpose, features and features of the present invention. It is specifically understood that the (4) _ formula is only for reference and not to limit the invention. [Embodiment] Please refer to FIGS. 1A to 1B to provide a wafer unit 1 and a conductive unit 2 which can share the same motherboard. a first embodiment of the present invention, comprising:

It can be seen from the above figure that the body 10 and a plurality of conductive pads are electrically disposed on the at least one chip unit 1 having at least the bottom portion 201123386 of the wafer book and a wafer book 10 and arranged in a matrix shape. Hey. Wherein, at least the wafer body 10 can be a semiconductor wafer which is formed by processing a 曰曰 circle, and the semiconductor wafer has a predetermined information processing function. Furthermore, the conductive unit 2 has a plurality of electrical conductors 2 选择性 selectively electrically disposed on the conductive 烊 M i of the wafer unit i, and each of the electrical conductors 2 has a geometric center 2 ◦ 〇 and - radius r, and the two geometries of the two conductors 2 Q of the parent $Qq qq are equal to the radius of the conductor 2 Q plus G.15 mm to 〇·25 mm, depending on the Design requirements, each conductor 2 can be a solder ball or a gold ball (g〇id bump). Further, the wafer body 1 is electrically connected to the upper side of the money board 4 through the conductors 20. In the example of the first embodiment of the present invention, the upper surface of the motherboard 4 has a plurality of motherboard pads 0' and the conductors 20 are selectively electrically connected to the main 4 These motherboard solder pads are 4 turns. Referring to the second embodiment, a second embodiment of the present invention provides a chip module that can share the same motherboard, and includes: a wafer unit 1, a first conductive vehicle element 2a, a switching substrate unit 3, and A second guide 2b. As can be seen from the above figures, the wafer unit 1 has at least one wafer body 10 and a plurality of conductive pads arranged electrically in the bottom of the at least one wafer body i 且 and arranged in a matrix shape. . The at least one wafer body 1 can be a semiconductor wafer which is formed by processing a wafer, and the semiconductor wafer has a predetermined processing function. Further, the first conductive unit 2a has a plurality of first conductive bodies 20a selectively electrically disposed on the conductive pads of the wafer unit 1, each of the first conductive bodies 2a The system has a geometric center 200 and a radius r, and the two geometric centers 2 Q 0 of each two first conductors 2〇3 are equal to the radius r of the first conductor 2 Q a plus 0.15 From millimeters to 0.25 mm. According to different design requirements, each of the first electrical conductors and each of the second electrical conductors are s〇丨 balls or g bumpid bumps.

In addition, the 泫-transfer substrate unit 3 has a transit circuit board 3 〇, a plurality of layer pads 3 1 disposed on the upper surface of the arranging circuit board 30 , and a plurality of the layout pads 3 1 . The lower surface is electrically connected to the lower pad 3 2 of the upper pad 3 1 , and the plurality of conductive lines electrically connected between the upper pad 3 1 and the lower pad 3 2 3 3, wherein the upper pads 3 _ and the lower pads 3 2 are offset from each other, that is, each of the upper pads 3 i corresponds to each of the lower pads, but not on the same vertical line. In addition, the first-class electric soap b has a plurality of first guides selectively disposed on the underlying pads 3 2 of the interposer substrate unit 3. The body 2 0 b, wherein the transit circuit board 3 is electrically disposed above the motherboard 4 through the first mail 202. In the second embodiment of the present invention, the domain board 4 has a plurality of main = pads 40' and the second conductors 2 Qb are selectively electrically connected to the motherboards. Pad 40. ? In summary, the similarly-sized wafers are arranged in a fixed-foot arrangement to increase the versatility of the same functional chip, and the stock and the new master of the motherboard produced by the different crystals can be reduced. g Development cost of 201123386. However, all the scope of the present invention should be based on the following spirits: the spirit of the application of the invention = patent $1«, which should be included in the towel of the present invention, and any cooked change Variations or modifications can be easily considered in the field of the invention. The artist's patent scope in the following case. The first A is a schematic side view of an embodiment of a wafer in which the same motherboard can be shared by the present invention; the first B diagram is the same as the invention A schematic bottom view of a wafer unit of a wafer slab embodiment of the motherboard; and, '' 苐 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 侧 侧 侧 + 侧 + + Figure. , the first real chip body 1 〇 conductive pad 1 1 conductor 2 〇 geometric center 2 〇 0 radius Γ spacing d first conductor 2 0 a second conductor 2 〇 b transit circuit board 3 〇 upper pad 3 1 Lower layer Tan 3 2 conductive line [Main component symbol description] Wafer unit 1 Conductive unit 2 First conductive unit 2a Second conductive unit 2b Transfer substrate unit 3 201123386 Motherboard 4 Motherboard pad

Claims (1)

201123386 VII 1 Shenqing Patent Range: A wafer module that can share the same motherboard, comprising: = early 7C, having at least a wafer body and a plurality of electrical components disposed at the bottom of the at least - wafer body and arranged a conductive pad; and a single-conductor, a single 7G having a plurality of electrically conductive bodies selectively electrically disposed on the conductive pads of the wafer sheet 70, each of the conductive systems having a geometrical center a radius, and the spacing between the two geometric centers of each of the two conductors is equal to the radius of the conductor plus OW mm to Q.25 t. wherein the wafer system is electrically disposed through the conductors. Above the motherboard. 2, such as the scope of patents! The chip module of the same motherboard may be shared by the same motherboard, wherein the at least one wafer system is a semiconductor chip, and the chip module sharing the same motherboard as described in claim 1 of the patent application scope, wherein each One conductive system is a solder ball. Β θ 4, as described in claim i of the patent scope, can share a wafer module of the same motherboard, wherein each conductive system is a gold ball. 5. The wafer module of the same motherboard as described in claim 1 wherein the upper surface of the motherboard has a plurality of motherboard pads, and the conductive systems are selectively electrically connected. The motherboard pads of the motherboard. a wafer module that can share the same motherboard, comprising: a wafer unit having at least one wafer body and a plurality of conductive pads electrically disposed at the bottom of the at least one wafer body and arranged in a matrix shape; a first conductive unit having a plurality of first electrical conductors selectively electrically disposed on 12 201123386, each of the conductive systems having a geometric center and a switching substrate unit, and an ancient, Γ-transfer circuit a plate, a plurality of electrodes disposed on the top layer of the transfer layer, and a plurality of upper layers of the upper layer and the second layer of the substrate are respectively electrically connected to the circuit Second power: = ' which is above the motherboard. The at least one wafer system is a semiconductor wafer. The master/seat is electrically connected to the crystal board of the same motherboard as described in item 6 of the seventh paragraph. mouth? Special: The sixth unit of the same host and the second conductor, each of the second conductors, and the crystal of the same motherboard as described in item 6 of the patent scope can be shared as described in item 6 of the scope. And 'each of the first-conductors and each of the second conductors are white gold balls. 0/4, please refer to the two-piece board group of the same motherboard as described in the sixth item of the patent scope, wherein the upper layer pads and the lower layer pads are mutually erected and the adapter substrate has a plurality of S-systems The strip is electrically connected to the upper layer of the pad and the conductive line between the underlying pads. 1: The chip module of the motherboard of the same type as claimed in claim 6 of the patent scope, wherein the motherboard has a plurality of motherboard solder pads, 13 201123386 and the second conductive system selects the ground Sexually connected to the motherboard pads. 14