TW201121352A - Heating system in the form of a multi-layer panel - Google Patents

Heating system in the form of a multi-layer panel Download PDF

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Publication number
TW201121352A
TW201121352A TW99113657A TW99113657A TW201121352A TW 201121352 A TW201121352 A TW 201121352A TW 99113657 A TW99113657 A TW 99113657A TW 99113657 A TW99113657 A TW 99113657A TW 201121352 A TW201121352 A TW 201121352A
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Taiwan
Prior art keywords
layer
conductive
electrical
insulating layer
impedance
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TW99113657A
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Chinese (zh)
Inventor
Ashish Dubey
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United States Gypsum Co
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Publication of TW201121352A publication Critical patent/TW201121352A/en

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Abstract

A heating system in the form of a multi-layer, yet relatively thin and flexible panel. The panel contains a number of layers including first, second and third electrically insulating layers. A first electrically conductive resistive layer (heater layer) is sandwiched between the first and second insulating layers. A second electrically conductive resistive layer (resistive neutral plane layer) is sandwiched between the second and third insulating layers. The heater layer has a neutral electrical connection and a live electrical connection. The neutral and live electrical connections are electrically connected to each other at the panel only by electrically resistive material of the heater layer extending between the neutral and live electrical connections. The resistive neutral plane layer has a neutral electrical connection electrically connected with the neutral connection of the heater layer. The resistive neutral plane layer is electrically isolated from the live connection of the heater layer by the second insulating layer.

Description

201121352 4 六、發明說明: 本申請案主張優先於2008年9月16曰提出申請之臨時申請案 第61/097,323號以及2009年5月8日提出申請之臨時申請案第 61/176,787號,該二臨時申請案出於所有目的而以引用方式全文倂 入本文中。與本案同時提出申請且包含相關之標的物之專利申請 案「加熱系統(Heating System )」亦出於所有目的而以引用方式 全文倂入本文中。 【發明所屬之技術領域】 本發明係關於加熱系統,具體而言,係關於包含於一多層面板 (multi-ply panel )中之加熱系統,該多層面板相對薄且呈撓性、 並可於一建築環境中包含於諸如地板、牆壁或天花板等其它物體 中或可包含於諸如反射鏡(mirror )、相框(picture frame )等其它 非建築物體中。 【先前技術】 薄型加熱系統已為人們所知。已製成不具有匯流排之編織金屬 絲網加熱器(woven wire mesh heater ),其中將細金屬絲編織成一 網墊(mesh mat )。該網墊可置於一積層式地板(laminate floor ) 之下或一底層地板(subfloor )之下,抑或置於非建築環境中。然 而,此等網墊必須定製以適合於具有奇特尺寸之空間,且無法於 工作現場予以修改。此會增加加熱器成本及安裝成本,並使在安 裝期間更改加熱器佈局之過程明顯更加困難。 目前,已利用電性阻抗塑膠(electrically resistive plastics )製成 基於聚合物之加熱器。由阻抗加熱器二側中任一側上之一導電匯 201121352 流排接通電路。姓里 具有較大之厚度 可切割之加熱表面,·然而,現有產品 (resistive jnk) ^ 電墨水之加熱器。由阻抗加熱 ' v 排接通電路。然後,放置一第,片Γ 之一導電匯流 熱元件。結果得到電路上’以保護加 果仔到一潯、撓性且可切割之加埶表 2墨:之器用於積層式地板之τ,其中該等加熱器二= '中鋪::地板板材與底層地板間之空間中,或者在改建之情形 ,鋪6又於地板板材與一舊地板間 y 該等塑膠片材提供-不利於黏合:£碑之表1面中。用於保賴裝置之 於形成於塑膠片材上之加熱元件中,由於片材 由於電容效應,存在草此雷泣^ 貝以及 室及冉居步 在某二”及路。在潮濕之環境中,例如在浴 至^射巾之地㈣設助情形卜絲電流之大何 接又之南位準。特別是在加熱元件可能會經受高之 ° :應用中,控制此種電嶋可變得很成問題止水= 露2電子技術及電子加熱器技術尚未解決潮濕應用中之電流, 材之㈣可料造成某絲流元相之電性短路,此 成—不可接受之狀態,例如電擊(如⑽sh。⑷或因電 桃大而造成加熱元件或塑膠片材過熱。 【發明内容】 =本發明之-實施射,提供—㈣、重量輕且為撓性 加熱器,其剌於乾燥環境及_環境,該電子加㈣在一乾燥 5 201121352 毫安、更佳地小 表面或一潮濕表面上所測得之一洩漏電流小於 於2.5毫安、且尤其更佳地小於1 〇毫安。 在本發明之另一實施例中,提供一益、吞m 知仏種適用於乾燥環境及 境之電子加_,《子加_所具有之1蓋面積大於25平: 英尺、更佳地大於50平方英尺、更佳地大於75平方英尺 地大於⑽平方英尺、更佳地大於125平方英尺、尤並更佳地: 於15〇平方英尺,同時仍保持前段所述之㈣電流值。 在本發明之另-實施例中,提供一種適用於乾燥環境及潮 境之電子加熱器,該電子加熱器可盥一接 ‘、、、衣 ^接地故P早斷路器(ground fault circuit interrupter ; GFCI )结人估田 斗, σ使用,该接地故障斷路器具有 一為5毫安之斷開極限值(cut_offHmit)。 在本發明之另一實施例中,提供—種 迥用於乾燥環境及潮渴環 境之電子加熱器,該電子加熱器之—功率密度為約5Q,_瓦/平方义 米加熱器面積、或者約50(H)瓦/平方米加熱器面積、或者約2鳩 瓦/平方米加熱器面積、或者約麵瓦/平方米加_面積、或者 約500瓦/平方米加熱器面積、或者約25〇瓦/平方米加熱器面積。 在本發明之另一實施例中,提供一種適用於乾燥環境及潮濕環 支兄中之建築及地板鋪設應用之電子加熱器,該電子加熱器所具有 之一功率密度為約500瓦/平方米加熱器面積、或者約3〇〇瓦/平方 米加熱器面積、或者約200瓦/平方米加熱器面積、或者約15〇瓦/ 平方米加熱器面積、或者約100瓦/平方米加熱器面積。 在本發明之另一實施例中,提供一種適用於乾燥環境及潮濕環 e 6 201121352 加熱器,該電子加熱11將使加熱器之導電元件在極端工 =件?彳如在發生—意外短路之情形中)所產生之局部熱通 里(ocal heat flux )低於5千瓦/平方半^ 方未 '更佳地低於4.0千瓦/ 千方未、甚至更佳地低於2〇千瓦/平方米。 境==一實施例中,提供-種適用於乾燥環境及潮濕環 音外破二㈣電子加熱器連接至地,俾當產品完整性受到 : 由此發生任何m树,其對於❹者是完全安全 子=Γ:Γ實施例中’提供—種薄、重量輕且為撓性之電 交流ϋη;乾職境及_環境,該電子加熱器可使用 電流工作抑⑽;AC)電流或直流⑹⑽ 在本發明之另一實施例中,提供_ 境之電子加熱器,該電子加熱器係為繞_ ;^^^濕環 英对、更佳地不超過12英 、喝至不超過2〇 更佳地不超過6英奴—直徑。 在本發明之另一實施例中提供— 境之電子加熱器,該電子加埶 =☆乾燥環境及潮濕環 超過…、更佳地小於。:英:為有之-總厚度不 更佳地小於0.125英吋。 土小於〇·25英吋、甚至 在本發明之另_實施例中,提供 境之電子加熱器,該電子加熱器重量二=燥環境及潮濕環 不超過3.0#/平方英尺、更佳 ς之一總產品重量 巧2.0#/平方英尺、更佳地不 201121352 2 k5#/平方英尺、更佳地不超過⑽ 不超過G.5#/平方英尺。 、尺*至更佳地 境中之建筑:另'施例中’提供-種適用於乾燥環境及潮濕環 薄、重量輕、撓性、可捲IS 熱器,該電子加熱器係為 me_y)。 了捲起的,且於展開時不具有回捲記憶一k 在本發明之另一實施例中, t '、種適用於乾燥環境及潮濕環 建杀及地板鋪設應用之電子加埶 胩 ,、'、裔D哀ί子加熱斋可供安 衣竞磚及天然石’俾使加熱器與 ,次天然石之男切結合強度201121352 4 VI. INSTRUCTIONS: This application claims priority to the provisional application No. 61/097,323, filed on September 16, 2008, and the provisional application No. 61/176,787, which was filed on May 8, 2009. The second provisional application is hereby incorporated by reference in its entirety for all purposes. The patent application "Heating System", which is filed at the same time as the present application and contains the relevant subject matter, is hereby incorporated by reference in its entirety for all purposes. TECHNICAL FIELD OF THE INVENTION The present invention relates to a heating system, and more particularly to a heating system included in a multi-ply panel that is relatively thin and flexible and An architectural environment is included in other objects such as floors, walls or ceilings or may be included in other non-buildings such as mirrors, picture frames, and the like. [Prior Art] A thin heating system is known. A woven wire mesh heater having no bus bar has been produced in which a fine wire is woven into a mesh mat. The mat can be placed under a laminate floor or under a subfloor or in a non-building environment. However, these mats must be customized to fit in a space of peculiar size and cannot be modified at the job site. This increases heater costs and installation costs and makes it significantly more difficult to change the heater layout during installation. Currently, polymer based heaters have been fabricated using electrically resistive plastics. The circuit is connected by one of the two sides of the two sides of the impedance heater. The surname has a large thickness to cut the heated surface, however, the existing product (resistive jnk) ^ electric ink heater. The circuit is connected by the impedance heating 'v row. Then, place a first, one of the sheets of conductive confluent thermal elements. The result is obtained on the circuit 'protecting the fruit to a sturdy, flexible and severable crowning table 2 ink: the device is used for the laminated floor τ, where the heater 2 = '中铺:: floor sheet and In the space between the subfloors, or in the case of alteration, the shop 6 is between the floor board and an old floor. These plastic sheets are provided - not conducive to bonding: in the surface of the monument. The device for protecting the device from being formed on the plastic sheet, because of the capacitive effect of the sheet, there is a grass and a room and a step in the second and the road. In a humid environment, For example, in the bath to the area of the towel (4), the situation of the wire current should be adjusted to the south level. Especially in the heating element may be subjected to high °: in the application, the control of this type of electricity can become very Problematic water stop = Dew 2 electronic technology and electronic heater technology have not solved the current in wet applications, material (4) can cause an electrical short circuit of a filament flow element, this into an unacceptable state, such as electric shock (such as (10) sh. (4) or the heating element or the plastic sheet is overheated due to the large electric peach. [Summary of the Invention] - The present invention - the implementation of the shot, provides - (d), light weight and a flexible heater, which is in a dry environment and Environment, the electron plus (d) one of the leakage currents measured on a dry 5 201121352 mA, preferably a small surface or a wet surface is less than 2.5 mA, and more preferably less than 1 〇 mA. In another embodiment of the invention, a吞 仏 适用 适用 适用 适用 适用 适用 适用 适用 适用 适用 适用 适用 适用 适用 适用 适用 适用 适用 适用 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子 子(10) square feet, more preferably greater than 125 square feet, and more preferably: 15 square feet while still maintaining the current value of (iv) as described in the preceding paragraph. In another embodiment of the invention, a suitable drying method is provided. Environmental and tide electronic heaters, the electronic heater can be connected to the ',,, clothing, grounding, ground fault circuit interrupter (GFCI), the estimated use of the field, σ use, the ground fault circuit breaker There is a cutoff value (cut_offHmit) of 5 mA. In another embodiment of the present invention, there is provided an electronic heater for use in a dry environment and a thirsty environment, the power density of the electronic heater being about 5Q, _ watt / square ami heater area, or about 50 (H) watts / square meter of heater area, or about 2 watts / square meter of heater area, or about tile / square meter plus _ area, or About 500 watts / square meter heating An area, or a heater area of about 25 watts per square meter. In another embodiment of the invention, an electronic heater suitable for use in a dry environment and a building and floor covering application in a wet ring brother is provided. The device has a power density of about 500 watts per square meter of heater area, or about 3 watts per square meter of heater area, or about 200 watts per square meter of heater area, or about 15 watts per square meter. Heater area, or about 100 watts per square meter of heater area. In another embodiment of the invention, a heater is provided that is suitable for use in a dry environment and a wet ring e 6 201121352, which will electrically conduct the heater Components in extreme work = pieces? For example, in the event of an accidental short circuit, the local ocal heat flux is less than 5 kW/sq ft ^ not better than 4.0 kW / thousand watts, or even better. Less than 2 〇 kW / square meter. Environment == In one embodiment, a type that is suitable for use in a dry environment and a wet ring to break the two (four) electronic heaters is connected to the ground, and the integrity of the product is affected by: Any m tree that occurs, which is complete for the latter Safety sub = Γ: In the example, 'providing a thin, lightweight and flexible electrical AC ;; dry environment and environment, the electric heater can use current work (10); AC) current or direct current (6) (10) In another embodiment of the present invention, an electronic heater is provided, which is a wraparound ring, preferably no more than 12 inches, and no more than 2 inches. The best place is no more than 6 British slaves - diameter. In another embodiment of the invention, an electronic heater is provided, the electronic twisting = ☆ dry environment and wet ring exceeding ..., more preferably less than. : English: Yes - the total thickness is not better than 0.125 inches. The soil is less than 〇·25 inches, and even in another embodiment of the present invention, the electronic heater is provided. The weight of the electronic heater is 2, the dry environment and the wet ring are not more than 3.0#/square foot, and more preferably A total product weight is 2.0#/square foot, preferably not 201121352 2 k5#/square foot, more preferably no more than (10) no more than G.5#/square foot. Buildings from the ruler* to the better environment: another 'in the example' provides a kind of suitable for dry environment and wet ring, light weight, flexible, rollable IS heat exchanger, the electronic heater is me_y) . Rolled up, and does not have a rewind memory when unfolded. In another embodiment of the present invention, t ', the type is suitable for use in dry environments and electronic ringing of wet ring building and floor laying applications, ', d d ί ί 加热 加热 加热 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供 可供

Uhear bond strength)大於 50 磅/平 • 十方央才(pound per square inch ’ psi)、更佳地大於1〇〇磅/ Α/τ 央寸、甚至更佳地大於150 碎/平方英11寸。 在本發明之另一實施例中,提 — 種適用於乾燥環境及潮濕環 境之電子加熱器,可利用諸如剪刀或劃刀u細y )等常用 工具在現場容易地對該電子加熱器進行切割、形成及成型。 在本發明之另-實施例中,提供—種適用於乾燥環境及潮渴環 境中之建築及地板鋪設應用之電子加熱器,該電子加熱器在暴露 於腐飯性祕條件(例如㈣結性㈣(薄的凝結錢及貼碑泥 漿)所提供之腐蝕性鹼性條件)時是化學穩定的。 在本發明之另一實施例中,提佴_ 仏種適用於乾燥環境及潮濕環 境中之建築及地板鋪設應用之電子加熱器,該電子加熱器可利用 包括勝結性灰渡在内之常用黏合劑結合至各種基板例如混凝 201121352 土、膠合板(ply wood )、0SB、水泥板、石膏板(gyp_ b〇ard )、 石膏及膠結性淹注襯塾層(辦識and cementki〇us卩㈣以 underlayment)等 ° 在本月之丨貝施例中,提供一種適用於乾燥環境及潮濕環 境中之建築及地板鋪設應用之電子加熱器,其中該電子加熱器無 需使用機械扣件便可快速地安裝。 在本么月之Λ把例中,提供_種加熱系統,該加熱系統呈一 夕層C相對薄且撓性之面板形式。該面板包含複數個層,包括 第電性'、.巴'.彖層、-第二電性絕緣層及一第三電性絕緣層。一 第—導電性阻抗層夹於該第一電性絕緣層與該第二電性絕緣層之 間’例如藉由印刷於該等電性絕緣層其中之—上。—第二 Ζ抗層夹於該第二電性絕緣層與該第三電性絕緣層之間,例如科 :刷於該等電性絕緣層其中之-上。該第—導電性阻抗層具有曰 第-電及該第二電二二接(帶電連接)。該 該㈣處彼此二:第二電,之-電性阻·於 接(令性連接)嗜抗層具有-第一電性連 之第—電性連接^^電性連接係電性連接該第一導電性阻抗層 連接。忒弟二導電性阻抗層係 而與該第一導電性阻抗層之第二電性連接紐隔_;絕緣層 第—電性_,例如藉的刷 9 201121352 上),並具有一第一電性連接(中性連接),該第一電性連接係電 性連接該第一導電性阻抗層之第一電性連接。此外,該第三導電 性阻抗層藉由該第一電性絕緣層而與該第一導電性阻抗層之第二 電性連接電性隔離開。 在一實施例中,該加熱系統更包含至少一導電性低阻抗層,該 至少一導電性低阻抗層具有一電性連接(接地連接(ground connection或earth connection ))。該導電性低阻抗層及其電性連接 係藉由該等電性絕緣層其中之一而與.該第一導電性阻抗層及該第 二導電性阻抗層電性隔離開。 在一實施例中,該加熱系統更包含一第四電性絕緣層,覆蓋該 至少一導電性低阻抗層。 在一實施例中,該加熱系統更包含一膠結性貼片膜(cementitious tile membrane ),覆蓋該第一電性絕緣層與該第三電性絕緣層其中 之一° 在一實施例中,該加熱系統更包含一底墊層(basemat layer), 覆蓋於該第一電性絕緣層與該第三電性絕緣層其中之一未被該膠 結性貼片膜覆蓋者上。 - 在一實施例中,該第二導電性阻抗層之阻抗材料具有一橫向範 圍及一縱向範圍,該橫向範圍及該縱向範圍大於該第一電性阻抗 層之阻抗材料之橫向範圍及縱向範圍。 在一實施例中,提供一種地板,該地板包括一基板、一加熱系 統及一裝飾性地板表面。該加熱系統包括一第一電性絕緣層、一 201121352 第二電性絕緣層、—M _ 該第二電性絕緣層間::Γ=、夾於該第一電性絕緣層與 絕緣層與該層、及夾於該第二電性 電性阻广岸 曰0之第—導電性阻抗層。該第一導 几曰八有一第—電性連接及一第二電性連接。咳 連接及該第二電性連接 "電’ -電性連接與該由“―料性阻抗層延伸於該第 接。該第二㈣,w Γ接間之—電性阻抗材料而彼此電性連 " 卩'^層具有—第—電性連接,該第-電性連接 料㈣料第—導電性阻抗層之第—電性連接。該第二導2 阻抗層係错由該第二電性絕緣層而與該第_導電性阻抗層之第二 電性連接電性隔離開。 在一貫施例中,該裝舞性地板表面係為積層式地板或木地板。 在-貫施例中,該裝飾性地板表面係為究碑或天然石,且該地 板更G 3 #合劑及—灰漿’該黏合劑位於該基板與該加熱系統 之間’該灰漿則位於該加熱系統與該£磚或天然石之間。 在一實施例中,該基板係為木材、水泥、域(—Ο、瓷 磚或天然石、或其組合。 【實施方式】 在本發明之一實施例中,如第1圖至第4圖所示,提供一加熱 系統2 0 ’加熱系統2 〇係呈一多層、但薄且撓性之面板2 2之形式。 面板22包含複數個層,包括第一電性絕緣層24、第二電性絕緣層 2 6及第二電性絕緣層2 8。該等絕緣層較佳係由具有一低介電常數 (dielectric constant)之一聚合物形成,例如由聚酯(p〇iyester )、 聚丙烯(polypropylene)、聚乙烯(polyethylene)、奈綸(nyi〇n) 201121352 或其它聚合物形成。一第一導電性阻抗層30夾於第一電性絕緣層 24與第二電性絕緣層26之間。一第二導電性阻抗層32夾於第二 電性絕緣層26與第三電性絕緣層28之間。導電性阻抗層30、32 係用作電性阻抗器,其於一電流流過時產生熱量。 第一導電性阻抗層30具有一第一電性連接(中性連接)34與一 第二電性連接(帶電連接)36。第一電性連接34可包含一匯流排, 該匯流排沿第二電性絕緣層26之長度之大部延伸、終止於距第二 電性絕緣層之每一端38、40不遠處並與第二電性絕緣層之一第一 縱向邊緣42平行排列但向内間隔開。第二電性連接36可包含一 匯流排,該匯流排沿第二電性絕緣層26之長度之大部延伸、終止 於距第二電性絕緣層之每一端38、40不遠處並與第二電性絕緣層 之一第二縱向邊緣44平行排列但向内間隔開。第一電性連接34 與第二電性連接36係僅藉由第一導電性阻抗層30延伸於第一電 性連接與第二電性連接間之一電性阻抗材料而於面板2 2處相互電 性連接。於某些實施例中,第一導電性阻抗層30可係為一基於導 電墨水之輪射式加熱器(radiant heater),其包含印刷於第一電性絕 緣層24或第二電性絕緣層26上之複數基於電性阻抗墨水之條帶 46 ° 有數種不同類型之基於導電墨水之輻射式加熱器30在市面有 售。一種類型之基於導電墨水之輻射式加熱器30係使用具有各種 各樣電阻之基於碳之墨水印刷而成。另一類型之基於導電墨水之 輻射式加熱器30係使用具有各種各樣電阻之含銀墨水印刷而成。 再一種基於導電墨水之輻射式加熱器30係為印刷於一聚酯薄膜上 12 201121352 之電路。 對於第一導電性阻抗層30,一種較佳之基於導電墨水之輻射式 加熱器係類似於由Calesco Norrels公司(位於美國IL州Elgin ) 出售者。加熱係由第一電性絕緣層24或第二電性絕緣層26上所 印刷之墨水阻抗條帶46提供,其中第一電性絕緣層24或第二電 性絕緣層26可係為一聚合物片材。阻抗條帶46係利用任何已知 方法置於聚合物片材24、26上。一種置放阻抗條帶46之技術係 以一基於碳之墨水印刷之。該導電墨水經選擇以於乾燥時形成一 阻抗材料並黏著至第一聚合物片材24、26上,俾當基於導電墨水 之輻射式加熱器30彎曲時導電墨水不會剝落(flake off)或以其 它方式分離。於一實施例中,聚合物片材24、26可由聚酯製成。 第一導電性阻抗層30之電性阻抗條帶46可相互平行地排列, 並可終止於端部48、50處,端部48、50係與第一電性絕緣層24 或第二電性絕緣層26之第一縱向邊緣42及第二縱向邊緣44間隔 開。於其它實施例中,條帶46可相互交叉(criss-cross ),或者其 可具有一蛇形(serpentine)或其它非線性形狀。.. 阻抗條帶46係利用至少第一電性連接34及第二電性連接36之 該二匯流排而包含於一電子電路52中,如第5圖所示。其中之一 匯流排34、36係於阻抗條帶46的與該等條帶所應用至之第一電 性絕緣層24或第二電性絕緣層26相對之側上置於阻抗條帶46之 每一端部48、50處或附近。如此一來,該等條帶46藉由第一電 性連接34及第二電性連接36之匯流排而相互平行地連接。 可視需要增加額外匯流排53,例如連接該等阻抗條帶46之中點 13 201121352 之匯流排53(參見第6圖)。以此種方式使用額外匯流排可使當一 匯流排之一部分於安裝期間如下文所述被切除時,片材22中不提 供熱量之區域最小化。當使用一額外匯流排53時,中央匯流排53 應連接至電路52之帶電連接L,且外側匯流排34、36皆應連接 至中性連接N。一較佳匯流排之一實例係為由銅箔或其它導電材 料形成之一條帶。於一實施例中,匯流排34、36之一端54可一 直延伸至第一電性絕緣層24或第二電性絕緣層26之端部38,以 充當一導體。 若需要,可放置一薄導電材料56於阻抗條帶46與第一電性連 接34及第二電性連接36之間、其相互交叉之位置處,以提升其 間之良好導電率。較佳地,導電材料56係為一導電聚合物。常用 種類之有機導電聚合物包括聚乙炔(poly(acetylene)s )、聚°比略 (poly(pyrrole)s )、聚0塞吩(poly(thiophene)s )、多苯胺 (poly(aniline)s )、聚芴(poly(fluorene)s )、聚(3-烧基。塞吩) (poly(3-alkylthiophene)s ) 聚四硫 富瓦稀 (polytetrathiafulvalenes)、聚萘(polynaphthalenes)、聚對苯硫醚 (poly(p-phenylene sulfide))及聚對苯撐乙稀(poly(para-phenylene vinylene)s ) ° - 第一電性連接34及第二電性連接36與導電材料56可結合至第 一電性絕緣層24或第二電性絕緣層26中未被應用第一導電性阻 抗層30之另一者。 諸如金屬絲等電性導體58可自第一電性連接34及第二電性連 接36延伸至面板22之至少端部38或者延伸超出面板。導體58 201121352 亦可係為電性連接34、36之延伸部或者除金屬絲或匯流排以外之 導體。 第二導電性阻抗層32具有一第一電性連接60 (中性連接),該 第一電性連接60係電性連接第一導電性阻抗層30之第一電性連 接34。第二導電性阻抗層32係藉由第二電性絕緣層26而與第一 導電性阻抗層30之第二電性連接36電性隔離開。第二導電性阻 抗層32可被構造成實質類似於第一導電性阻抗層30,包括由印刷 條帶61形成,但通常所具有之一阻抗等於或高於第一導電性阻抗 層之阻抗。在所有其它態樣中,例如使用一匯流排作為第一電性 連接60、使用一導電墨水以及在導電性阻抗層與第一電性連接之 間使用一導電材料皆可與在第一導電性阻抗層30中相同。 如第5圖之電路圖所示,第一導電性阻抗層30之第一電性連接 34與第二導電性阻抗層32之第一電性連接60係連接至電路52 之一中性連接N,同時第一導電性阻抗層32之第二電性連接36 連接至電路之一帶電或熱連接(liveor hot connection) L。藉由此 連接,電流自一電路電源供應器透過第二電性連接36供應至第一 導電性阻抗層30,該電路電源供應器可係為一建築物之一主配電 屏(main electrical panel )。然而,電流不會自該電路電源彳共應器 供應至第二導電性阻抗層32。若有任何電流自第一導電性阻抗層 30洩露並被第二導電性阻抗層32攔截,則洩露電流將被以不會造 成一高漏電流及一過量熱通量積聚之方式引導至中性連接60,乃 因第二導電性阻抗層將具有一顯著之阻抗。因此,第二導電性阻 抗層32在本申請案中被稱作阻抗中性平面(resistive neutral 15 201121352 η使隸抗中性平面32使得有機會利用—寬廣範圍之導電 1來設計加減件,俾使該等墨水提供_更寬廣範圍之表面電 阻率以及-更大之可印刷覆蓋面積, 火安全之目標。 心备“,控制及防 阻抗中性平面32制於減小總體茂漏電流及防止在出現—音外 紐路時有過量之熱量積聚於面板22 ^ 贷3 & 丨且柷中性平面32可位於 冷電性阻抗層3〇之上或之下。阻抗中性平s u 高雷咀至夕柷节性千面32可由具有一 2科之-導電墨水構成。由碳微粒構成之導電墨水即為較佳 土之霄例。導t墨水包含諸如以下之微粒:銀、錄、紹 、 或此等微粒其中之二或更多者之一組合。 反 φ 管电 ° 几中性平面條帶61之 、寬度、厚度及長度係轉門設計,以 全性。藉由使導電墨水條帶61所產生 及防人女 定限值來確保防火安全性。T產生之取大熱通罝保持低於一預 較佳係使第一導電性阻抗層(加熱元件)3〇之條帶46之寬戶等 ^、於物信抗中性平面32之條帶6丨之寬度。此外= ^吏主電路之所印刷導電墨水加熱元件3〇與阻抗申性平面%重 ;並:皮阻抗中性平面32完全覆蓋。換言之,於-實施例中, 弟一 V電性阻抗層30之導電材料在第一電性絕緣層μ 性絕緣層26之間呈有一护&浐岡a /、 一电 …:、有&向乾圍及-縱向範圍’且第二導電性阻 '之阻抗材料所具有之—橫向㈣及—縱向範圍與第 性阻杬層之阻抗材料之橫向範圍及縱向範圍一樣大。 :第:導電性阻抗層3〇之第一導電墨水 '用於第二導電性阻 抗層32之第二導電,累欢、贫 第一導電性阻抗層(加熱器)之寬度以 201121352 及弟二導電性阻抗層(中 卞由)之覓度被選擇成使加熱系統20 所產生之最大熱通量小於相 1面之臨界幸I射熱通量或加熱系統 之任何組成材料之最低臨界輻射熱通量。 力,、、、系、.錢A建㈣建造時例如用於—地板鋪設應用 時,必須考㈣漏電流及意外短路之影響。阻抗中性平面層32係 為一導電面,近似平行於加埶号 、 …斋層30疋位。該阻抗中性平面積聚 成漏電流並容許其流至中性端子。 阻抗中性平面層32之相對電阻率及加熱器層30之電阻率被設 計成使在阻抗中性平面層與加熱器層之間發生短路時之電流、功 率及熱通量最小化1中性平面層32被設計成具有低之表面電阻 率(㈣咖⑽如吻),則若在電流源附近發生短路,可形以 之熱通量。在某些情況下,此可導致聚合物膜其中之—或多者溶 化及/或相鄰表面(例如硬木地板或木基底層地板)被引燃。該等 問題鋪由將加熱线2G設計成所具有之-最大熱通量小於任一 加熱器組件之臨界熱通量或相鄰表面之臨界熱通量而加以克服。 根據本發明,較佳係使阻抗中性平面之表面電阻率大於3〇歐姆/ 平方、更佳係大於60歐姆/平方、更佳係大於1〇〇歐姆/平方尤 其更佳係大於2GG歐姆/平方。提供高達2_歐姆/平方之表面電 阻率之導電墨水可有效地用於印刷本發明之阻抗_性平面。當期 望將非常寬之阻抗中性平面印刷於加熱器上時,可使用表面電阻 率高達2,GG_G歐姆/平方之導電墨水來印刷本㈣之阻抗中性平 面。 撓性面板22可如第1圖所示形成有—矩形周邊,或者可視需要 17 201121352 具有其它形狀。若形成為一 1 t ,則端視面板之應用而定, 其可具有各種不同尺寸並中夕一 ”中之一。舉例而言,可提供寬度為12英 寸或夬寸或12英吋或18英忖 寬度為25公分或25公分之數之面板,或者可提供 Dm,” 面板。此外,可提供長度為 去1 、或12英对或18英对之一倍數之面板22,或 者可提供長度為25公分或25公分之_ : 視面板22之特定應用而選取其它更小或更大之尺寸。μ 於霄施例令,第7圖及第8圖所示之加熱系統可更包含一 第四電性絕緣層62及_筮二道 弟二導電性阻抗層64。第三導電 -係夹於第四電性絕緣層62與第一電性絕緣層24之間,且= 一第一電性連接06,第一雷枓γ 弟電丨生連接66係電性連接第一導 ㈣之第-電性連接34。此外,第三導電性 二= 一電性絕緣層2 4而與第一導雷性pH / s π f错由第 ¥ ^队層3 G之第二電性連接3 6電 從而亦使其成為—阻抗令性平面。第三導電性阻抗層-貫目同於苐二導電性阻抗層32加以構造。藉由使用第三導電 性阻抗層64’沿與第二導電性阻抗層%相反之_方向之任何電、古 邊露皆將被第三導電性阻抗層64攔截,且將 2 顯著之阻抗。巾㈣接乃因弟二導電性阻抗層亦將具有- 於W 9圖所不之一實施例中,加熱系統2〇更包含具一電性連 70之至少—導電性低阻抗層68 (接地平面^導電性低阻抗声 可由堵如銅、銀'銘等具高導電率(低電性阻抗)之材料製成。 性低阻抗廣68及其電性連接70係藉由電性絕緣層24、%、 18 201121352 28其中之一而與第一導電性阻抗層30及第二導電性阻抗層32電 性隔離。加熱系統20可更包含一第四電性絕緣層72,第四電性絕 緣層72覆蓋該至少一導電性低阻抗層68。電性連接70將被連接 至一接地連接G (第5圖),俾使若存在流至導電性低阻抗層68 之任何電流洩露,該電流皆被直接引導至地面。因導電性低阻抗 層68所將具有之一阻抗實質小於第一導電性阻抗層30或第二導 電性阻抗層32之阻抗,故流經導電性低阻抗層68之電流可高得 多,致使可存在於電路52中之任何斷路器(circuit breaker)或接 地故障斷路器(ground fault interrupter)跳閘。導電性低阻抗層 68被設計成攔截因面板22之各層中之嚴重故障而洩露之電流,且 通常將需要更換該特定面板。導電性低阻抗層68可類似於導電性 阻抗層30、32加以構造,例如藉由印刷一墨水於該等電性絕緣層 其中之一上;然而,形成該層之墨水之阻抗應遠小於導電性阻抗 層所用之墨水。另一選擇為,層壓於聚合物片材上之薄金屬箔材 料(鋁、銅、銀等)可用作一導電性低阻抗層(接地平面),該導 電性低阻抗層(接地平面)接地以提供電性安全性。 導電性低阻抗層68可僅置於面板22之一側(端視安裝詳情而 位於第一導電性阻抗層30及第二導電性阻抗層32二者之上方或 下方),或者一導電性低阻抗層68可置於面板22之二側(同時位 於第一導電性阻抗層30及第二導電性阻抗層32之上方及下方) (第10圖)。導電性低阻抗層68可設置成一覆蓋面板整個表面之 寬片材形式或者一單一或複數窄帶之形式,該單一或複數窄帶以 類似於電性匯流排之方式沿面板22之長度延伸。 19 201121352 於如第11圖所示之一實施例中,加熱系統20更包含一膠結性 貼片膜(cementitious tile membrane) 74’覆蓋於第一電性絕緣層 24與第三電性絕緣層28其中之一上並藉由一黏合劑75固定至該 其中之一上。 一較佳之膠結性貼片膜74闡述於2008年3月23日頒予且名稱 為「撓性水硬性合成物(Flexible Hydrau丨Compositions)」之美 國專利第7,347,895號、歐洲專利第Π9179號以及2006年3約16 日公佈且名稱為「撓性且可捲動之膠結性膜及其製造方法 (Flexible and Rollable Cementitious Membrane and Method of Manufacturing It)」之待決美國專利申請案第US2006/0054059號 中,上述各篇出於所有目的而以引用方式全文倂入本文中。 包含至少55%飛灰(fly ash)之任何水硬性組分皆可適用於膜 74。C類(Class C)水硬性飛灰或其等同物係為最佳之水硬性組 分。此種類型之飛灰係為藉由處理某些煤而得到之高石灰含量之 飛灰。ASTM標記C-618即描述C類飛灰(Bayou Ash有限公司, Big Cajun, II, LA)之特性,其以引用方式倂入本文中。類似於水 泥或石膏,當與水混合時,飛灰會凝固。設想將其它水硬性組分 與飛灰結合使用,包括:水泥,包括高鋁水泥(high alumina cement);硫酸約,包括無水硫酸弼(calcium sulfate anhydrite)、 半水硫酸鈣(calcium sulfate hemihydrate)或二水硫酸鈣(calcium sulfate dihydrate );其它水硬性組分;及其組合。亦設想使用飛灰 之混合物。石夕灰(silica fume)(由位於加拿大魁北克St. Laurent 之SKW Silicium Becancour製造)係為另一種較佳材料。總成分 20 201121352 幸父佳包含按重量計約25%至約92.5%之水硬性組分。 "玄t S物係為一水溶性、成膜聚合物(丨叫p〇丨ymer), 車父佳係為乳膠聚合物(丨p〇丨。該聚合物可以一液體形式 使用或作為可再分散之粉末(redispersible powder)使用。一特 Η之乳心♦ 5物係為丙稀酸(扣巧丨jc )與乙酸丁醋(butyi acetate )之一m . , , , 甲&丙稀酸曱酉旨共聚物(1Tiethyl methacrylate copolymer X由位於伊利諾伊州Mareng〇之EPS公司製造之Forton VF 774聚合物)。儘管該聚合物係以任意適用之量添加,然較佳係 以一乾態固體物計以約5%至35%之量添加。 為开v成—聯鎖基質結構(丨加打丨爪也丨χ structure ),必須存 在水以形成此合成物。當添加水至該體系時,應考量合成物中之 ^若以水性懸浮液之形式提供乳膠聚合物,則於合成 物水中應包含用於使該聚合物分散之水。可使用會形成—可流動 混合物之任何量之水。較佳地,於該合成物中使用按重量計約5 %至約35%之水。 水尼或聚合物水泥之任何眾所習知之添加劑皆可用於本合成物 之任-實施财,以針對—特定制用途而使該合成物改性。出 於各種原因而添加有填料。若添加諸如膨脹珍珠岩(〒心 perhte)、其它膨脹材料抑或玻璃、陶£或塑勝微球體等輕質填料, 則可使合成物或最終產品之重量更輕。微球體藉由將氣態材料囊 封於合成物t所包含之微氣㈣而減小產品密度,進而減小整個 產品之重量。以傳統量使用之發泡劑亦適用於減小產品密度。 傳統之無機填料及聚集體(aggregate)亦適用於降低成本及減 21 201121352 少收縮開裂(shrinkage cracking)。典型之填料包括沙、滑石、雲 母、碳酸鈣、煆燒黏土( calcined clay) '浮石(pumice)、粉碎或 膨脹珍珠岩、火山灰(volcanic ash)、米糠灰(rice husk ash)、矽 澡土( diatomaceous earth )、k >查(slag )、偏高嶺土( metakaolin )、 及其它泥硬性材料(pozzolanic material )。該等材料之量應不超過 會不利地影響諸如強度等特性之程度。當製備極薄之膜或襯墊層 時,較佳使用諸如沙或微球體等極小之填料。 視需要添加著色劑’以改變成品膜74之合成物之顏色。飛灰通 常為灰色,且C類飛灰一般淺於F類飛灰。可使用任何與該合成 物相容之染料或顏料。視需要’使用二氧化鈦作為漂白劑。一種 較佳之者色劑係為由位於美國肯塔基州Cynthiana之Solution Dispersions公司製造之Ajack Black著色劑。 設想在該等合成物中使用用於加速或延緩水硬性組分之凝固時 間之凝固控制添加劑。確切之添加劑將取決於所用之水硬性組分 以及凝固時間之改變程度。 可使用加強材料來增加膜74之強度。視需要添加纖維或網狀物 (mesh )會有助於將合成物保持於一起。推薦使用鋼纖維、塑膠 纖維(例如聚丙烯纖維及聚乙烯醇纖維)及玻璃纖維,但加強材 料之範圍並非僅限於此。 已知強塑劑添加劑(superplasticizer additive )能提高水硬性聚 液之流動性。強塑劑添加劑使分子分散於溶液中,俾使分子更輕 易地相對於彼此移動,進而提面整個锻液之流動性。已知聚叛酸 酯(polycarboxylate)、磺化三聚氰胺(sulfonatecimeiamine)及績 22 201121352 化萘(sulfonated naphthalene )為強塑劑。較佳之強塑劑包括由位 於美國馬薩諸塞州 Cambridge 之 Grace Construction Products 公司 製造之ADVA Cast以及由位於美國喬治亞州Cedartown之Geo Specialty Chemicals公司製造之Dilflo GW強塑劑。添加該等材料 使得使用者能夠針對特定應用調節漿液之流動性。 減縮劑(shrinkage reducing agent)有助於在膜74之塗層乾燥時 減少塑性收縮開裂。該等減縮劑一般用於改變表面張力,以使漿 液在其乾燥時一倂流動。乙二醇(glycols)係為較佳之減縮劑。 於一實施例中’加熱系統20更包含一底墊層76,底墊層76覆 蓋第一電性絕緣層24與第三電性絕緣層28其中之一未被膠結性 貼片膜74覆蓋者。 加熱系統20之一較佳底墊層76可包含至少一第一紡黏薄片 (spimbondlamina) Μ (第13圖)。第一紡黏薄片78係視需要直 接結合至加熱系統面板22。於其它實施例中,一可選之熔喷薄片 (meltbl〇wnlamina)80阻止液體遷移穿過底聲層76,進而增加對 水或其它液體流過底墊層76之阻力。第一紡黏薄片78置於熔喷 溥片80之頂側上,以於底墊層76之至少一表面上提供高之孔隙 率。若面板係包含於一貼有貼片之地板中,則紡黏材料之孔隙率 容許良好地滲透及吸收灰漿。大之纖維會包含於灰漿之晶體基質 中而形成一強之結合。 視需要,一第二紡黏薄片82存在於熔喷薄片8〇之與面向第一 纺黏薄片78之表面相對之表面上。於該實施例中,熔喷薄片8〇 失於第一紡黏薄片78與第二紡黏薄片82之間。該實施例具有以 23 201121352 下優點:其於兩側具有相同之表面,因而哪一表面被應用於加熱 器面板22、哪一表面面對一新之裝飾地板或其它表面無關緊要。 薄片78、80、82藉由任何適宜之手段相互結合。此種類型之三 層式複合體可作為一 S-M-S積層體自位於喬治亞州Roswel丨之 Kimberly-Clark公司購得。該產品係由聚丙烯纖維製成。在提供一 阻擋液體之屏障之同時,該材料仍可呼吸,進而容許水蒸汽穿過 該材料。端視最終應用及效能要求而定,其它薄片可能更適合於 一特定應用。美國專利第4,041,203號全面闡述一種S-M-S積層體 及其製造方法,該美國專利以引用方式倂入本文中。 該加熱系統之一替代實施例顯示於第14圖中。於該實施例中, 存在如上所述之複數個層,且提供一新功能層84,該新功能層84 透過一黏合層86黏附至面板22並可提供一單一功能或複數種功 能。 舉例而言,層84可具有聲音抑制特性,其可包含隔熱,其可包 含電絕緣,其可提供防水性,並且其可提供增強之裂紋隔離。此 外,該層84可藉由複數個單獨組成層而提供多於一種上述特性, 或者可於一單一層中提供多於一種此等特性。 作為構成功能層84之可能組分之實例,可使用一層低密度泡 沫、橡膠或塑膠獲得聲音抑制特性,尤其是對於衝擊噪聲。用於 將功能層84緊固至面板22之黏合層86可係為壓敏黏合劑轉移膠 帶(pressure sensitive adhesive transfer tape)或壓敏雙面黏合膠帶 (pressure sensitive double sided adhesive tape )或甚至喷施或液態 施用之黏合劑。當期望得到增強之裂紋隔離及防水效能時,較佳 24 201121352 使用雙面黏合膠帶。低密度泡沫亦可提供隔熱及/或電性絕緣,其 可包括:聚乙稀(polyethylene)泡沫,例如3M聚乙稀泡沫膠帶 4462或4466 ;聚氨基曱酸酯(polyurethane)泡沫,例如3M氨基 甲酸酯泡沫膠帶4004或4008 ;聚乙烯基(polyvinyl)泡沫,例如 3M聚乙細基泡泳膠帶4408或4416 ;乙稀-醋酸乙稀g旨(ethylene vinyl acetate )泡珠,例如international Tape公司之聚乙烯泡沐膠 帶316或332 ;丙烯酸(acrync)泡沫,例如3M VHB 4941閉孔 丙烯酸泡沫膠帶系列;以及乙烯-丙烯-二烯單體(ethylene propylene diene monomer ; EPDM)泡沫,例如 Permacel EE1010 閉孔EPDM泡沫膠帶。聚矽氧(sincone)泡沫包括Saint-Gobain 512AV.062及512AF.094泡沫膠帶。橡膠泡沫包括3M 500 Impact 脫模膠帶(stripping tape)及 510 Stencil 膠帶。彈性體(elastomeric) 泡沫包括3M 4921彈性體泡沫膠帶及Avery Dennison XHA 9500 泡冰腾。橡膠或再生橡膠片材(reCyCied rubber sheet)可自Uhear bond strength) is greater than 50 lbs/flat • pound per square inch psi, more preferably greater than 1 lb / Α / τ, or even more preferably greater than 150 s. In another embodiment of the present invention, an electronic heater suitable for use in a dry environment and a humid environment can be easily cut on site by using a common tool such as scissors or a knife y). Forming and forming. In another embodiment of the present invention, there is provided an electronic heater suitable for use in a building and floor laying application in a dry environment and in a thirsty environment, the electronic heater being exposed to a succulent condition (eg, (4) knotty (4) (corrosive alkaline conditions provided by thin condensed money and paste mud) are chemically stable. In another embodiment of the present invention, an electronic heater suitable for use in a building and floor laying application in a dry environment and a humid environment, the electronic heater can be utilized in a general use including a smashing ash crossing Adhesive bonding to various substrates such as coagulation 201121352 soil, ply wood, 0SB, cement board, gypsum board (gyp_ b〇ard), gypsum and cementitious flooding lining layer (organic and cementki〇us卩 (4) Underlayment) etc. In this month's mussel application, an electronic heater is provided for use in building and floor covering applications in dry and humid environments, where the electronic heater can be quickly and without the use of mechanical fasteners. installation. In the case of this month, a heating system is provided which is in the form of a relatively thin and flexible panel of the overnight layer C. The panel comprises a plurality of layers including a first electrical property, a barrier layer, a second electrical insulating layer and a third electrically insulating layer. A first conductive resistive layer is sandwiched between the first electrically insulating layer and the second electrically insulating layer, for example by being printed on the electrically insulating layer. The second anti-layer is sandwiched between the second electrically insulating layer and the third electrically insulating layer, for example, brushed onto the electrically insulating layer. The first conductive resistive layer has a first electrical connection and a second electrical second electrical connection (electrical connection). The (four) is in two: the second electric, the electric resistance, the connection (the connection), the resistance layer, the first electrical connection, the electrical connection, the electrical connection, the electrical connection The first conductive impedance layer is connected. The second conductive impedance layer is connected to the second electrical connection layer of the first conductive impedance layer _; the insulating layer first-electricity _, for example, the borrowed brush 9 201121352), and has a first electric The first electrical connection is electrically connected to the first electrical connection of the first conductive impedance layer. In addition, the third conductive resistive layer is electrically isolated from the second electrical connection of the first conductive resistive layer by the first electrically insulating layer. In one embodiment, the heating system further includes at least one electrically conductive low resistance layer, the at least one electrically conductive low resistance layer having an electrical connection (ground connection or earth connection). The conductive low-resistance layer and its electrical connection are electrically isolated from the first conductive resistive layer and the second conductive resistive layer by one of the electrically insulating layers. In one embodiment, the heating system further includes a fourth electrically insulating layer covering the at least one electrically conductive low resistance layer. In one embodiment, the heating system further includes a cementitious tile membrane covering one of the first electrically insulating layer and the third electrically insulating layer. In an embodiment, the The heating system further includes a base mat layer covering one of the first electrically insulating layer and the third electrically insulating layer not covered by the cementitious patch film. In one embodiment, the impedance material of the second conductive impedance layer has a lateral extent and a longitudinal extent, and the lateral extent and the longitudinal extent are greater than a lateral extent and a longitudinal extent of the impedance material of the first electrical impedance layer . In one embodiment, a floor is provided that includes a substrate, a heating system, and a decorative floor surface. The heating system includes a first electrical insulating layer, a 201121352 second electrical insulating layer, -M _ the second electrically insulating layer: Γ =, sandwiched between the first electrically insulating layer and the insulating layer and the a layer and a first conductive-impedance layer sandwiched between the second electrical and electrical barriers. The first guide has a first electrical connection and a second electrical connection. The cough connection and the second electrical connection "electrical' electrical connection with the electrical impedance material extending from the first to the second (four), the second electrical connection The second layer has a first-electrical connection, and the second conductive layer is electrically connected The second electrically insulating layer is electrically isolated from the second electrical connection of the first conductive impedance layer. In a consistent embodiment, the floor of the dance floor is a laminated floor or a wooden floor. In the example, the decorative floor surface is a monument or a natural stone, and the floor is more G 3 #mixture and - mortar 'the adhesive is located between the substrate and the heating system'. The mortar is located in the heating system and the Between the bricks or the natural stone. In one embodiment, the substrate is wood, cement, domain (-Ο, tile or natural stone, or a combination thereof. [Embodiment] In an embodiment of the invention, as in Figure 1. As shown in Figure 4, a heating system 20' heating system 2 is provided in a multi-layer, but The flexible panel 2 is in the form of a plurality of layers, including a first electrical insulating layer 24, a second electrically insulating layer 26, and a second electrically insulating layer 28. The insulating layers are preferably preferred. It is formed of a polymer having a low dielectric constant, such as polyester (polypropylene), polyethylene, polyethylene, nylon 212011352 or other A first conductive resistive layer 30 is sandwiched between the first electrically insulating layer 24 and the second electrically insulating layer 26. A second electrically conductive resistive layer 32 is sandwiched between the second electrically insulating layer 26 and The third conductive insulating layer 30 is used as an electrical resistor to generate heat when a current flows. The first conductive resistive layer 30 has a first electrical connection (middle And a second electrical connection (electrical connection) 36. The first electrical connection 34 can include a bus bar that extends along a majority of the length of the second electrically insulating layer 26 and terminates at a distance Each end 38, 40 of the second electrically insulating layer is not far away and is electrically connected to the second electrically insulating layer The first longitudinal edges 42 are arranged in parallel but spaced apart inwardly. The second electrical connection 36 can include a bus bar that extends along a majority of the length of the second electrically insulating layer 26 and terminates in a second electrical distance. Each end 38, 40 of the insulating layer is not far away and is arranged in parallel with the second longitudinal edge 44 of the second electrically insulating layer but is spaced inwardly. The first electrical connection 34 and the second electrical connection 36 are only borrowed. The first conductive resistive layer 30 extends from one of the first electrical connection and the second electrical connection to be electrically connected to the panel 2 2 . In some embodiments, the first conductivity The resistive layer 30 can be a radiant heater based on conductive ink, which comprises a plurality of strips based on electrical impedance ink printed on the first electrically insulating layer 24 or the second electrically insulating layer 26. There are several different types of radiant heaters based on conductive inks available in 46 °. One type of conductive ink based radiant heater 30 is printed using a carbon based ink having a variety of electrical resistances. Another type of radiant heater 30 based on conductive ink is printed using silver-containing inks having various electrical resistances. Another radiant heater 30 based on conductive ink is a circuit printed on a polyester film 12 201121352. For the first conductive resistive layer 30, a preferred conductive ink based radiant heater is similar to that sold by Calesco Norrels, Inc. (Elgin, IL, USA). The heating is provided by the ink resist strip 46 printed on the first electrically insulating layer 24 or the second electrically insulating layer 26, wherein the first electrically insulating layer 24 or the second electrically insulating layer 26 can be an aggregate. Sheet of matter. Impedance strip 46 is placed on polymer sheets 24, 26 by any known method. One technique for placing impedance strips 46 is to print on a carbon based ink. The conductive ink is selected to form an impedance material upon drying and adhere to the first polymer sheet 24, 26, such that the conductive ink does not flake off when the radiant heater 30 based on the conductive ink is bent Separated in other ways. In one embodiment, the polymeric sheets 24, 26 can be made from polyester. The electrically resistive strips 46 of the first electrically conductive resistive layer 30 may be arranged in parallel with one another and may terminate at ends 48, 50, the ends 48, 50 being associated with the first electrically insulating layer 24 or the second electrical The first longitudinal edge 42 and the second longitudinal edge 44 of the insulating layer 26 are spaced apart. In other embodiments, the strips 46 may be criss-crossed, or they may have a serpentine or other non-linear shape. The impedance strip 46 is included in an electronic circuit 52 by using at least two of the first electrical connection 34 and the second electrical connection 36, as shown in FIG. One of the bus bars 34, 36 is disposed on the opposite side of the impedance strip 46 opposite the first electrically insulating layer 24 or the second electrically insulating layer 26 to which the strips are applied. At or near each end 48, 50. In this manner, the strips 46 are connected to each other in parallel by the bus bars of the first electrical connection 34 and the second electrical connection 36. Additional bus bars 53 may be added as needed, such as bus bars 53 connecting points 13 201121352 of the impedance strips 46 (see Figure 6). Using the additional busbars in this manner minimizes the area of the sheet 22 where no heat is provided when a portion of a busbar is removed during installation as described below. When an additional bus bar 53 is used, the central bus bar 53 should be connected to the live connection L of the circuit 52, and the outer bus bars 34, 36 should be connected to the neutral connection N. An example of a preferred bus bar is a strip formed from copper foil or other electrically conductive material. In one embodiment, one end 54 of the busbars 34, 36 can extend straight to the end 38 of the first electrically insulating layer 24 or the second electrically insulating layer 26 to act as a conductor. If desired, a thin conductive material 56 can be placed between the impedance strips 46 and the first electrical connections 34 and the second electrical connections 36 at locations where they intersect each other to enhance good electrical conductivity therebetween. Preferably, the electrically conductive material 56 is a conductive polymer. Commonly used types of organic conductive polymers include polyacetylene (poly(acetylene)s), poly(pyrrole)s, poly(thiophene)s, poly(aniline)s ), poly(fluorene)s, poly(3-alkylthiophene)s, polytetrathiafulvalenes, polynaphthalenes, polyparaphenylene Poly(p-phenylene sulfide) and poly(para-phenylene vinylenes) ° - the first electrical connection 34 and the second electrical connection 36 and the conductive material 56 can be bonded to The other of the first electrically conductive resistive layer 30 is not applied to the first electrically insulating layer 24 or the second electrically insulating layer 26. Electrical conductors 58 such as wires may extend from the first electrical connection 34 and the second electrical connection 36 to at least the end 38 of the panel 22 or extend beyond the panel. The conductor 58 201121352 can also be an extension of the electrical connections 34, 36 or a conductor other than a wire or busbar. The second conductive resistive layer 32 has a first electrical connection 60 (neutral connection), and the first electrical connection 60 is electrically connected to the first electrical connection 34 of the first conductive impedance layer 30. The second conductive resistive layer 32 is electrically isolated from the second electrical connection 36 of the first conductive resistive layer 30 by the second electrically insulating layer 26. The second conductive resistive layer 32 can be constructed to be substantially similar to the first conductive resistive layer 30, including formed by the printed strip 61, but typically has an impedance equal to or higher than the impedance of the first conductive resistive layer. In all other aspects, for example, using a bus bar as the first electrical connection 60, using a conductive ink, and using a conductive material between the conductive impedance layer and the first electrical connection can be used with the first conductivity. The same in the impedance layer 30. As shown in the circuit diagram of FIG. 5, the first electrical connection 34 of the first conductive resistive layer 30 and the first electrical connection 60 of the second conductive resistive layer 32 are connected to one of the circuits 52 to be neutrally connected to N, At the same time, the second electrical connection 36 of the first conductive impedance layer 32 is connected to one of the circuits of the live or hot connection L. By this connection, current is supplied from a circuit power supply to the first conductive impedance layer 30 through the second electrical connection 36, which may be a main electrical panel of a building. . However, current is not supplied from the circuit power supply cascode to the second conductive impedance layer 32. If any current leaks from the first conductive resistive layer 30 and is intercepted by the second conductive resistive layer 32, the leakage current will be directed to neutral without causing a high leakage current and an excessive heat flux accumulation. Connection 60 is due to the fact that the second conductive impedance layer will have a significant impedance. Therefore, the second conductive resistive layer 32 is referred to as an impedance neutral plane in the present application (resistive neutral 15 201121352 η enables the neutral plane 32 to have an opportunity to utilize a wide range of conductive 1 to design the addition and subtraction, 俾These inks provide a wider range of surface resistivities and - larger printable footprints, fire safety goals. "Precision, control and anti-impedance neutral plane 32 is designed to reduce overall leakage current and prevent Excessive heat accumulates on the panel 22 ^ 3 & 丨 and the neutral plane 32 can be located above or below the cold resistive layer 3 。. The nozzle can be composed of a conductive ink having a base of 2. A conductive ink composed of carbon particles is an example of a preferred soil. The conductive ink contains particles such as silver, silver, and , or a combination of two or more of these particles. Anti-φ tube electricity ° Several neutral plane strips 61, width, thickness and length are designed to be fully functional. By making conductive ink strips With 61 generated and anti-human limit To ensure fire safety, the heat generated by T is kept lower than a pre-preferred system, so that the strip of the first conductive resistive layer (heating element) 3 is wide, etc. The strip of the plane 32 has a width of 6 。. In addition, the printed conductive ink heating element 3 所 of the main circuit of the main circuit is heavier than the impedance plane, and the skin impedance neutral plane 32 is completely covered. In other words, the embodiment In the middle, the conductive material of the V-electrical impedance layer 30 is provided between the first electrically insulating layer and the insulating layer 26 with a protective & 浐 a a /, an electric ...:, &&; The longitudinal range 'and the second conductivity resistance' of the impedance material has - the lateral direction (four) and - the longitudinal extent is as large as the lateral extent and the longitudinal extent of the impedance material of the first barrier layer. :: Conductive impedance layer 3〇 The first conductive ink 'is used for the second conductive of the second conductive resistive layer 32, and the width of the first conductive resistive layer (heater) is the same as 201121352 and the second conductive resistive layer (in the middle) The temperature is selected such that the maximum heat flux generated by the heating system 20 is less than that of the phase 1 The minimum critical radiant heat flux of any constituent material of the heat flux or heating system. Force,,,, system, and money A. (4) When building, for example, for floor laying applications, it is necessary to test (4) leakage current and The effect of an accidental short circuit is that the impedance neutral plane layer 32 is a conductive surface that is approximately parallel to the twisted, 30-inch layer. The impedance of the neutral flat area is concentrated into a leakage current and allowed to flow to the neutral terminal. The relative resistivity of the neutral planar layer 32 and the resistivity of the heater layer 30 are designed to minimize current, power and heat flux when a short circuit occurs between the impedance neutral plane layer and the heater layer. 1 Neutral plane Layer 32 is designed to have a low surface resistivity ((4) coffee (10) such as a kiss), and if a short circuit occurs near the current source, the heat flux can be shaped. In some cases, this can result in - or more of the polymer film being melted and/or adjacent surfaces (e.g., hardwood floors or wood substrate floors) being ignited. These problems are overcome by designing the heater wire 2G to have a maximum heat flux that is less than the critical heat flux of either heater component or the critical heat flux of an adjacent surface. In accordance with the present invention, it is preferred that the surface resistivity of the impedance neutral plane is greater than 3 ohms/square, more preferably greater than 60 ohms/square, more preferably greater than 1 ohm/square, and more preferably greater than 2 GG ohms. square. Conductive inks providing a surface resistivity of up to 2 ohms/square are effective for printing the impedance-sex plane of the present invention. When it is desired to print a very wide impedance neutral plane on the heater, the conductive neutral ink with a surface resistivity of up to 2, GG_G ohms/square can be used to print the impedance neutral plane of (4). The flexible panel 22 can be formed as a rectangular perimeter as shown in Fig. 1, or can have other shapes as desired. If formed as a 1 t, depending on the application of the end view panel, it may have one of a variety of different sizes and one or the middle. For example, a width of 12 inches or inches or 12 inches or 18 may be provided. A panel with a width of 25 cm or 25 cm, or a Dm, panel. In addition, panels 22 may be provided in a length of one, or 12 inches, or a multiple of 18 inches, or may be provided in lengths of 25 cm or 25 cm: depending on the particular application of the panel 22, other smaller or more Large size. In the embodiment, the heating system shown in FIGS. 7 and 8 may further include a fourth electrically insulating layer 62 and a second electrically conductive resistive layer 64. The third conductive-type is sandwiched between the fourth electrically insulating layer 62 and the first electrically insulating layer 24, and = a first electrical connection 06, the first Thunder γ 丨 丨 连接 连接 66 connection 66 electrically connected The first electrical connection 34 of the first (four). In addition, the third conductivity two = an electrically insulating layer 24 and the first lightning conductivity pH / s π f is electrically connected by the second electrical connection of the third layer 3 G to thereby make it - Impedance makes the plane. The third conductive resistive layer is constructed in the same manner as the second conductive resistive layer 32. Any electrical or ancient dew that is in the opposite direction to the second conductive resistive layer by using the third conductive resistive layer 64' will be intercepted by the third conductive resistive layer 64, and will have a significant impedance. The towel (four) is also the second conductive impedance layer of the second embodiment. In the embodiment of the invention, the heating system 2 includes at least a conductive low-resistance layer 68 (grounded). Plane ^ Conductive low-impedance sound can be made of materials with high electrical conductivity (low electrical impedance) such as copper and silver. The low-impedance wide 68 and its electrical connection 70 are made of electrically insulating layer 24. The first conductive impedance layer 30 and the second conductive impedance layer 32 are electrically isolated from each other. The heating system 20 further includes a fourth electrical insulating layer 72, and a fourth electrical insulating layer. A layer 72 covers the at least one electrically conductive low resistance layer 68. The electrical connection 70 will be connected to a ground connection G (Fig. 5) such that if any current flowing to the electrically conductive low resistance layer 68 is present, the current All of them are directly guided to the ground. Since the conductive low-resistance layer 68 will have one impedance substantially smaller than the impedance of the first conductive resistive layer 30 or the second conductive resistive layer 32, it flows through the conductive low-resistance layer 68. The current can be much higher, resulting in any circuit breakers that can be present in circuit 52 (circui The t breaker) or the ground fault interrupter trips. The conductive low-impedance layer 68 is designed to intercept currents that are leaking due to severe faults in the various layers of the panel 22, and will typically require replacement of the particular panel. The low-resistance layer 68 can be constructed similar to the conductive resistive layers 30, 32, such as by printing an ink onto one of the electrically insulating layers; however, the impedance of the ink forming the layer should be much less than the conductive impedance. The ink used for the layer. Alternatively, a thin metal foil material (aluminum, copper, silver, etc.) laminated on the polymer sheet can be used as a conductive low-impedance layer (ground plane), which is low in electrical conductivity. The layer (ground plane) is grounded to provide electrical safety. The conductive low-resistance layer 68 can be placed only on one side of the panel 22 (at the first conductive resistive layer 30 and the second conductive resistive layer 32, depending on mounting details) Above or below the two, or a conductive low-resistance layer 68 can be placed on both sides of the panel 22 (at the same time above and below the first conductive resistive layer 30 and the second conductive resistive layer 32) (10th) The electrically conductive low resistance layer 68 can be provided in the form of a wide sheet covering the entire surface of the panel or in the form of a single or multiple narrow strips extending along the length of the panel 22 in a manner similar to an electrical bus bar. 19 201121352 In an embodiment as shown in FIG. 11 , the heating system 20 further includes a cementitious tile membrane 74 ′ covering the first electrically insulating layer 24 and the third electrically insulating layer 28 . One of them is attached to one of the adhesives by a binder 75. A preferred cementitious patch film 74 is set forth on March 23, 2008 and is entitled "Flexible Hydraulic Composite (Flexible) Hydrau丨Compositions), U.S. Patent No. 7,347,895, European Patent No. 9179, and June 3, 2006, entitled "Flexible and Rollable Cementitious Membrane and The above-mentioned articles are hereby incorporated by reference in their entirety for all purposes for all purposes. Any hydraulic component comprising at least 55% fly ash can be applied to film 74. Class C hydraulic fly ash or its equivalent is the best hydraulic component. This type of fly ash is a high lime content fly ash obtained by treating certain coals. ASTM Mark C-618 describes the properties of Class C fly ash (Bayou Ash Co., Ltd., Big Cajun, II, LA), which is incorporated herein by reference. Similar to cement or gypsum, fly ash solidifies when mixed with water. It is envisaged to use other hydraulic components in combination with fly ash, including: cement, including high alumina cement; sulfuric acid, including anhydrous sulfate anhydrite, calcium sulfate hemihydrate or Calcium sulfate dihydrate; other hydraulic components; and combinations thereof. It is also envisaged to use a mixture of fly ash. Silica fume (manufactured by SKW Silicium Becancour, St. Laurent, Quebec, Canada) is another preferred material. Total Ingredients 20 201121352 The company contains about 25% to about 92.5% by weight of hydraulic components. "Xuant S is a water-soluble, film-forming polymer (called p〇丨ymer), and the car is a latex polymer (丨p〇丨. The polymer can be used in a liquid form or as a Redispersible powder is used. A special milky heart ♦ 5 system is one of acrylic acid (Lucky 丨jc) and butyl vinegar (butyi acetate) m , , , A & 1 Tiethyl methacrylate copolymer X (Forton VF 774 polymer manufactured by EPS Company, Mareng, Ill.). Although the polymer is added in any suitable amount, it is preferably a dry solid. It is added in an amount of about 5% to 35%. In order to open the v-interlocking matrix structure, water must be present to form the composition. When water is added to the system, If the latex polymer is to be provided in the form of an aqueous suspension, the water used to disperse the polymer should be included in the composition water. Any amount of water that will form a flowable mixture can be used. Preferably, the composition is used by weight From about 5% to about 35% water. Any of the well-known additives of water or polymer cement can be used in any of the present compositions to modify the composition for specific applications. Fillers are added for a variety of reasons. Adding lightweight fillers such as expanded perlite, other intumescent materials, or glass, ceramic or plastic microspheres can make the weight of the composite or final product lighter. The microspheres reduce the product density by encapsulating the gaseous material in the micro gas (4) contained in the composition t, thereby reducing the weight of the entire product. The foaming agent used in the conventional amount is also suitable for reducing the product density. Conventional inorganic fillers and aggregates are also suitable for reducing costs and reducing shrinkage cracking. Typical fillers include sand, talc, mica, calcium carbonate, calcined clay, pumice ( Pumice), crushed or expanded perlite, volcanic ash, rice husk ash, diatomaceous earth, k > slag, metakaolin And other pozzolanic materials. The amount of such materials should not exceed the extent that adversely affects properties such as strength. When preparing very thin films or liners, it is preferred to use such as sand or micro A very small filler such as a sphere. A colorant is added as needed to change the color of the composition of the finished film 74. Fly ash is usually gray, and Class C fly ash is generally shallower than Class F fly ash. Any dye or pigment compatible with the composition can be used. Use titanium dioxide as a bleaching agent as needed. A preferred colorant is Ajack Black colorant manufactured by Solution Dispersions, Inc. of Cynthiana, Kentucky, USA. It is envisaged to use a setting control additive for accelerating or retarding the setting time of the hydraulic component in the compositions. The exact additive will depend on the hydraulic component used and the extent to which the setting time changes. A reinforcing material can be used to increase the strength of the film 74. Adding fibers or mesh as needed will help keep the composition together. Steel fiber, plastic fiber (such as polypropylene fiber and polyvinyl alcohol fiber) and glass fiber are recommended, but the range of reinforcing materials is not limited to this. It is known that a superplasticizer additive can improve the fluidity of a hydraulic polymer. The strong plasticizer additive disperses the molecules in the solution, allowing the molecules to move more easily relative to each other, thereby enhancing the fluidity of the entire forging. It is known that polycarboxylate, sulfonate cimelamine and sulfonated naphthalene are strong plasticizers. Preferred plasticizers include ADVA Cast manufactured by Grace Construction Products, Inc. of Cambridge, Massachusetts, USA, and Dilflo GW, a plasticizer manufactured by Geo Specialty Chemicals, Inc. of Cedartown, Georgia, USA. The addition of such materials allows the user to adjust the fluidity of the slurry for a particular application. The shrinkage reducing agent helps to reduce plastic shrinkage cracking as the coating of film 74 dries. These shrinkage reducing agents are generally used to modify the surface tension so that the slurry flows as it dries. Glycols are preferred shrinkage reducing agents. In one embodiment, the heating system 20 further includes a bottom pad layer 76. The bottom pad layer 76 covers one of the first electrically insulating layer 24 and the third electrically insulating layer 28 and is not covered by the cementitious patch film 74. . Preferably, one of the bottom layers 76 of the heating system 20 can comprise at least one first spunbondlamina (Fig. 13). The first spunbond sheet 78 is bonded directly to the heating system panel 22 as needed. In other embodiments, an optional meltblown sheet 80 prevents liquid from migrating through the bottom acoustic layer 76, thereby increasing the resistance to water or other liquid flowing through the underlayer 76. A first spunbond sheet 78 is placed on the top side of the meltblown web 80 to provide a high porosity on at least one surface of the underlayer 76. If the panel is contained in a floor to which the patch is attached, the porosity of the spunbond material allows for good penetration and absorption of the mortar. The large fibers are contained in the crystal matrix of the mortar to form a strong bond. A second spunbond sheet 82 is present on the surface of the meltblown sheet 8 which faces the surface facing the first spunbond sheet 78, as needed. In this embodiment, the meltblown sheet 8 is lost between the first spunbond sheet 78 and the second spunbond sheet 82. This embodiment has the advantage of 23 201121352: it has the same surface on both sides, so it does not matter which surface is applied to the heater panel 22, which surface faces a new decorative floor or other surface. The sheets 78, 80, 82 are joined to each other by any suitable means. A three-layer composite of this type is commercially available as an S-M-S laminate from Kimberly-Clark Corporation of Roswel, Georgia. This product is made of polypropylene fiber. While providing a barrier to the liquid, the material is still breathable, allowing water vapor to pass through the material. Depending on the final application and performance requirements, other sheets may be more suitable for a particular application. An S-M-S laminate and a method for its manufacture are fully described in U.S. Patent No. 4,041,203, the disclosure of which is incorporated herein by reference. An alternative embodiment of the heating system is shown in Figure 14. In this embodiment, there are a plurality of layers as described above, and a new functional layer 84 is provided which is adhered to the panel 22 through an adhesive layer 86 and which provides a single function or a plurality of functions. For example, layer 84 can have sound-suppressing properties, which can include thermal insulation, which can include electrical insulation, which can provide water repellency, and which can provide enhanced crack isolation. In addition, the layer 84 can provide more than one of the above characteristics by a plurality of individual constituent layers, or can provide more than one of such characteristics in a single layer. As an example of a possible component constituting the functional layer 84, a layer of low density foam, rubber or plastic can be used to obtain sound suppression characteristics, especially for impact noise. The adhesive layer 86 for fastening the functional layer 84 to the panel 22 may be a pressure sensitive adhesive transfer tape or a pressure sensitive double sided adhesive tape or even a spray. Or a binder applied in liquid form. When it is desired to obtain enhanced crack isolation and water resistance, it is preferred to use a double-sided adhesive tape for 24 201121352. The low density foam may also provide thermal and/or electrical insulation, which may include: polyethylene foam, such as 3M polyethylene foam tape 4462 or 4466; polyurethane foam, such as 3M. Urethane foam tape 4004 or 4008; polyvinyl foam, such as 3M polyethylene fine bubble bath tape 4408 or 4416; ethylene vinyl acetate beads, such as international tape The company's polyethylene foam tape 316 or 332; acrylic (acrync) foam, such as 3M VHB 4941 closed-cell acrylic foam tape series; and ethylene-propylene-diene monomer (EPDM) foam, such as Permacel EE1010 Closed cell EPDM foam tape. The sincone foam includes Saint-Gobain 512AV.062 and 512AF.094 foam tape. Rubber foam includes 3M 500 Impact stripping tape and 510 Stencil tape. The elastomeric (elastomeric) foam includes 3M 4921 elastomer foam tape and Avery Dennison XHA 9500. Rubber or recycled rubber sheet (reCyCied rubber sheet)

Amorim Industrial Solutions 或 IRP industrial Rubber 公司獲得。 黏合層88及一喊型片材(reiease sheet ) 90之使用使得面板 22月b夠以即剝即貼之配置(peel and stick arrangement)性質自 黏附(self-adhermg)至一所需之基板表面。此容許安裝者迅速將 面板放置於其所期望之位置而無需混合或施用黏合材料’並確保 黏合劑充分地覆蓋面板並施用正確之量。 本發明之又一實施例顯示於第15圖中,其具有參照第14圖所 述之所有層(離型片材90除外)。此外,該實施例包含一剛性面 板複合層92 ’加熱系統20藉由剛性面板複合層92設置於一建築 25 201121352 面板中,該建築面板可包含於一建築物之地板、牆壁、天花板或 其匕結構組件中。剛性面板複合層92可包含經鋼絲網加強之水泥 板、經纖維加強之水泥板、石膏面板、石膏纖維面板、膠合板、 定向粒片板(oriented strand board )或其它類型之木基面板、塑膠 面板以及其它類型之剛性面板複合體。面板厚度可介於〇 125英叶 至1 〇英对之間’較佳介於〇·250英吋至2英吋之間,最佳介於〇 25〇 英吋至1英吋之間。 於第16圖所示之一實施例中,提供一地板94,其包含一基板 96 加熱系統20及一裝飾性地板表面98。加熱系統20係如上 所述。裝飾性地板表面98可係為積層式地板、木地板、瓷碑或天 然石。地板更包含一黏合劑及一灰漿102,黏合劑1〇〇位於基 板96與加熱系統2〇之間,黏合劑1 〇〇位於加熱系統與究磚或天 然石之間。基板96可係為木材、水泥、油氈、瓷磚、天然石或其 組合。 設想加熱系統2〇被製作成某些標準尺寸。對於大於最大可得加 熱糸統尺寸之區域,可將二或更多個面板22相互附連,使得一個 加熱器之帶電匯流排連接36供應電流至一或多個相鄰面板之帶電 匯排連接。各自之中性連接34、60係類似地彼此電性連通。該 技術能夠為實際任意大小之相職-加熱表面。 本毛月加熱器之一優點在於,其可在安裝地板系統時在現場切 j及成里。加熱系統2〇之面板22可被修剪成適合於任意形狀之 區戍且不而定製。在安農時,加熱器可被切割以容納例如各種 形狀之加熱及冷卻通氣口、水管固定裝置及地櫃(base cabinet)。 26 201121352 儘官某些早獨之加熱條帶46將不能提供熱量,然未被切割之加献 條帶將繼續加熱相鄰表面。在其令各個阻抗條帶%彼此間隔開且 彼此平行之實施财,若面板22需要切割成適合於一特定安裝要 求,則沿-條平行於阻抗條帶46之線(例如第6圖中之線⑽) 切割面板。此將形成匯流排34、36之二暴露部分,該等暴露部分 將需要例如使用、絕緣膠帶、液態非導電性聚合物或其它已知之電 性絕緣方法與面板之_邊緣進行絕緣及隔離。若安裝尺寸要求 面板22之長度切割面板22 (切斷所有阻抗條帶46),則較佳係 獲得-更窄之預製面板,或限制設置有加熱器之地板之下之面 積’藉以避免須對被切割條帶之大量暴露端部進行電性絕緣。因 面板22將藉由並聯連接而相互接合成一電路(參見第5圖),故 可視需要增加額外面板。 藉由以不同於上文所述之其它組合形式使用上述不同層令之各 種層’可開發出面板22之許多變型。儘管上文將某些層顯示成僅 與單-加熱層30及阻抗帽平面32 _起❹,㈣亦可與上述 其它層相結合以提供具有所期望功能之特定面板。 儘管上文顯示及闡述具有一阻抗中性平面之加熱器之特定實施 例,然熟習此項技術者將瞭解,可在不背離本發明之更廣態樣之 條件下對其作出各種修改及修飾。除非另外指明,本文所揭露之 任何選項及層皆可與任何其它選項或層一起使用。 【圖式簡單說明】 第1圖係為體現本發明原理之一加熱系統之一立體分解圖; 第2圖係為第1圖所示加熱系統之三個層之一平面圖; 27 201121352 第3圖係為第j. 面圖; 圖所示加熱系統之— 共用層及二額外層之—平 第4圖係為第】圖所示加熱 不忍性側視剖面圖; 第5圖係為本發明之加熱系統於 格〒之一電性原理圖; 第6圖係為加熱面板22之—示意性平面圓; 第7圖係為體現本發明原理之一加 a ^ …、系、,先之另一貫施例之一立 體刀角午圖,其顯不一第二阻抗中性平面; 弟8圖係為弟7圖所示加轨率统之—+立以/ ,、.、示次义不意性側視剖面圖; 第9、圖係為體現本發明原理之一加熱系統之另一實施例之一示 思性側視剖面圖’其顯示一接地平面; 第10圖係為體現本發明原理之一加熱系統之另一實施例之一示 思性側視剖面圖’其顯示二接地平面; 第11圖係、為體現本發明原理之―加熱系統之另―實施例之一示 意性側視剖面圖,其顯示一膠結性層; 第12圖係為體現本發明原理之一加熱系統之另一實施例之一示 意性側視剖面圖’其顯示一膠結性層及一底塾層; 第13圖係為第12圖所示實施例之一示意性側視剖面圖,其顯 示底墊層之細部; 第14圖係為體現本發明原理之一加熱系統之另一實施例之一示 意性側視剖面圖’其顯示一功能層及一自黏性點合層; 28 201121352 第15圖係為體現本發明原理之一加熱系統之另一實施例之一示 意性側視剖面圖,其顯示一剛性面板複合層;以及 第16圖係為使用本發明加熱系統之一加熱式地板之一示意性側 視剖面圖。 【主要元件符號說明】 20 :加熱系統 22 :面板 24 :第一電性絕緣層 26 :第二電性絕緣層 28 :第三電性絕緣層 30 :第一導電性阻抗層 32 :第二導電性阻抗層 34 :第一電性連接 36 :第二電性連接 38 :端部 40 :端部 4 2 :第一縱向邊緣 44 :第二縱向邊緣 46 :阻抗條帶 48 :端部 50 :端部 52 :電子電路 53 :匯流排 54 : —端 56 .導電材料 58 :電性導體 60 :第一電性連接 61 :阻抗中性平面條帶 62 :第四電性絕緣層 64 :第三導電性阻抗層 66 :第一電性連接 68 :導電性低阻抗層 70 :電性連接 29 201121352 72 :第四電性絕緣層 74 :膠結性貼片膜 75 :黏合劑 76 :底墊層 78 :第一紡黏薄片 80 :熔喷薄片 82 :第二紡黏薄片 84 :新功能層 86 :黏合層 88 :黏合層 90 :離型片材 92 :剛性面板複合層 94 :地板 96 :基板 .. 98:裝飾性地板表面 100 :黏合劑 102 :灰漿 104 :線 G :接地連接 N:中性連接 L:帶電連接 30Acquired by Amorim Industrial Solutions or IRP industrial Rubber. The use of the adhesive layer 88 and a reiease sheet 90 allows the panel 22 to self-adhermg to a desired substrate surface in a peel and stick arrangement. . This allows the installer to quickly place the panel in its desired position without the need to mix or apply the adhesive material' and to ensure that the adhesive adequately covers the panel and applies the correct amount. Still another embodiment of the present invention is shown in Fig. 15, which has all of the layers (except for the release sheet 90) described with reference to Fig. 14. In addition, the embodiment includes a rigid panel composite layer 92. The heating system 20 is disposed in a building 25 201121352 panel by a rigid panel composite layer 92, which may be included in a floor, wall, ceiling or raft of a building. In the structural component. The rigid panel composite layer 92 may comprise a steel mesh reinforced cement board, a fiber reinforced cement board, a gypsum panel, a gypsum fiber panel, a plywood, an oriented strand board or other type of wood based panel, a plastic panel. And other types of rigid panel composites. The thickness of the panel can range from 英 125 英 to 1 〇 ′′, preferably between 吋·250 ft and 2 ,, optimally between 〇 25 〇 and 1 mile. In one embodiment of the sixteenth embodiment, a floor 94 is provided that includes a substrate 96 heating system 20 and a decorative floor surface 98. The heating system 20 is as described above. The decorative floor surface 98 can be a laminate floor, a wood floor, a porcelain monument or a natural stone. The floor further comprises a binder and a mortar 102, the binder 1 is located between the substrate 96 and the heating system 2, and the adhesive 1 is located between the heating system and the brick or the natural stone. Substrate 96 can be wood, cement, linoleum, tile, natural stone, or combinations thereof. It is envisaged that the heating system 2〇 is made to some standard size. For regions larger than the maximum available heating system size, two or more panels 22 may be attached to one another such that a heated busbar connection 36 of one heater supplies current to one or more adjacent panels of live electrical connections. . The respective neutral connections 34, 60 are similarly electrically connected to one another. This technology can be used for virtually any size of the job-heating surface. One of the advantages of this Maoyue heater is that it can be cut and finished in the field when the floor system is installed. The panel 22 of the heating system 2 can be trimmed to fit any shape and is not customized. At Annon, the heater can be cut to accommodate, for example, various shapes of heating and cooling vents, water pipe fixtures, and base cabinets. 26 201121352 Some of the early heating strips 46 will not provide heat, but the uncut strip will continue to heat adjacent surfaces. In the case where the individual impedance strips are spaced apart from each other and parallel to each other, if the panel 22 needs to be cut to fit a particular mounting requirement, the along-strip is parallel to the line of the impedance strip 46 (eg, in FIG. 6) Line (10)) Cutting the panel. This will form two exposed portions of the busbars 34, 36 which will require insulation and isolation from the edge of the panel, for example, using, insulating tape, liquid non-conductive polymer or other known electrical insulation methods. If the length is required to cut the panel 22 of the panel 22 (cutting off all of the impedance strips 46), it is preferred to obtain a narrower prefabricated panel or to limit the area under the floor provided with a heater to avoid the need to A large number of exposed ends of the strip being cut are electrically insulated. Since the panels 22 will be joined to each other by a parallel connection into a circuit (see Figure 5), additional panels may be added as needed. Many variations of panel 22 can be developed by using various layers of the various layers described above in other combinations than those described above. Although some of the layers are shown above as being only associated with the single-heating layer 30 and the impedance cap plane 32, (d) may be combined with the other layers described above to provide a particular panel having the desired function. Although a particular embodiment of a heater having an impedance neutral plane is shown and described above, it will be apparent to those skilled in the art that various modifications and changes can be made thereto without departing from the broader aspects of the invention. . Any of the options and layers disclosed herein may be used with any other option or layer, unless otherwise indicated. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded perspective view of one of the heating systems embodying the principles of the present invention; FIG. 2 is a plan view of one of the three layers of the heating system shown in FIG. 1; 27 201121352 FIG. The figure is the jth side view; the heating system of the figure - the common layer and the two additional layers - the flat figure 4 is the heating inferior side view of the figure shown in Fig. 5; The heating system is an electrical schematic diagram of the grid; the sixth diagram is the schematic plane circle of the heating panel 22; the seventh diagram is one of the principles of the invention plus a ^ ..., system, and the first another One of the three-dimensional knife corner maps of the example, which is different from the second impedance neutral plane; the younger figure 8 is the addition rate shown in the figure of the brother 7 - + to / /,. Figure 9 is a schematic side cross-sectional view of another embodiment of a heating system embodying the principles of the present invention. It shows a ground plane; Figure 10 is a schematic representation of the principles of the present invention. A schematic side cross-sectional view of another embodiment of a heating system that displays two ground planes; A schematic side cross-sectional view of another embodiment of a "heating system" embodying the principles of the present invention, showing a cementitious layer; FIG. 12 is a schematic representation of another embodiment of a heating system embodying the principles of the present invention A side view of a profile showing a cementitious layer and a bottom layer; Figure 13 is a schematic side cross-sectional view of one of the embodiments shown in Figure 12, showing a detail of the underlayer; Figure 14 A schematic side cross-sectional view of another embodiment of a heating system embodying the principles of the present invention, which shows a functional layer and a self-adhesive punctuation layer; 28 201121352 Figure 15 is a representation of the principles of the present invention. A schematic side cross-sectional view of another embodiment of a heating system showing a rigid panel composite layer; and Fig. 16 is a schematic side cross-sectional view of one of the heated floors using the heating system of the present invention. [Main component symbol description] 20: heating system 22: panel 24: first electrically insulating layer 26: second electrically insulating layer 28: third electrically insulating layer 30: first electrically conductive resistive layer 32: second electrically conductive Sexual resistance layer 34: first electrical connection 36: second electrical connection 38: end 40: end 4 2: first longitudinal edge 44: second longitudinal edge 46: impedance strip 48: end 50: end Portion 52: Electronic Circuit 53: Bus Bar 54: - End 56. Conductive Material 58: Electrical Conductor 60: First Electrical Connection 61: Impedance Neutral Plane Strip 62: Fourth Electrically Insulating Layer 64: Third Conductive The impedance layer 66: the first electrical connection 68: the conductive low-resistance layer 70: the electrical connection 29 201121352 72: the fourth electrical insulation layer 74: the cementitious patch film 75: the adhesive 76: the underlayer 78: First spunbonded sheet 80: meltblown sheet 82: second spunbonded sheet 84: new functional layer 86: adhesive layer 88: adhesive layer 90: release sheet 92: rigid panel composite layer 94: floor 96: substrate.. 98: Decorative floor surface 100: Adhesive 102: Mortar 104: Line G: Ground connection N: Neutral connection L: Live connection 30

Claims (1)

201121352 七、申請專利範圍·· 包含 1•-種加熱系統’呈—多層面板之形式, 一第一電性絕緣層; —第二電性絕緣層; —第三電性絕緣層; 夾灰5亥第-電性絕緣層與該第二 夾方。亥第二電性絕緣層與該第三 一第—導電性阻抗層, 電性絕緣層之間; —第二導電性阻抗層, 電性絕緣層之間; 電性V電性阻抗層具有—第—電性連接及—第_ 妾,料-f性連接與該第二電性 二::抗層延伸於該第-電性連接與該第::: 電性阻抗材料而相互電性連接; 該第二導電性阻抗層具有—第— A 性連接係、電性連接㈣—導電 ’7—電 接,·以及 柷層之忒弟一電性連 2. 驾該::導電性阻抗層係藉由該第二電性絕緣層而與 如Μ 阻抗層之該第二電性連接電性隔離開。 第1雷力述之加㈣統’更包含—第時11絕緣層及― 二:1 層’該第三導電性阻抗層係夹於該第四電性 2曰與該第-電性絕緣層之間並具有—第—電性連接,該 電性連接係電性連接該第—導電性阻抗層之該第-電性 且該第三導電性阻抗層係藉由該第-電性絕緣層而與 V導電性阻抗層之該第二電性連接電性隔離開。 31 201121352 3. 4. 5. 6. 1員1所述之加熱系統,更包含具有一電性連接之至少 j電&低叫層’該導電性低阻抗層及其電性連接係藉由 :*、電I巴、、彖層其中之—而與該第一導電性阻抗層及該第二 導電性阻抗層電性隔離開。 員1所述之加熱系統,更包含一膠結性貼片膜 ^ ltlous t丨1e membrane),覆蓋於該第一電性絕緣層與 /第一電性絕緣層其中之一上。 '托員4所述之加熱系統,更包含一底塾層(bas_t —)I蓋方H電性絕緣層與該第三電性絕緣層其中之 未被該膠結性貼片膜覆蓋者上。 :长項1所述之加熱系統,其中各該第-、第二及第三電 S卩及°亥第-導電性阻抗層及該第二導電性阻抗層 策屬且^性的,俾#結合成該多層面板時,該面板本身係 马溥且撓性的。 :求項1所述之加熱系統’其中該第一導電性阻抗層包含 ^第—電性絕緣層與該第二電性絕緣層其中之-上之 於該第^阻抗墨水條帶,且該第二導電性阻抗層包含印刷 列電性阻抗墨水條帶。 緣層其中之一上之-系 1所述之加熱系統,其中該第二導電性阻抗層之一 抗係大於該第—導電性阻抗層之一阻抗。 ==1所述之加熱系統,其中該第-電性絕緣層、該第 ::。絕緣層及該第三電性絕緣層包含聚合物u(p〇iymer 32 9· 201121352 10.如請求項1所述之加熱系統,更包含一多功能層,該多功能 層利用一黏合劑黏合至該多層面板,該多功能層包含由以下 組成之群組其中之一:一低密度泡沫、一聚合物片材、一橡 膠片材及其組合。 33201121352 VII. Scope of application for patents··Including 1•-type heating system' in the form of multi-layer panel, a first electrical insulating layer; - second electrical insulating layer; - third electrical insulating layer; Haidi-electrical insulation layer and the second clamping side. Between the second electrical insulating layer and the third first conductive resistive layer, the electrically insulating layer; - the second conductive resistive layer, between the electrically insulating layers; the electrical V electrical resistive layer has - The first electrical connection and the first electrical connection and the second electrical second: the anti-layer is electrically connected to the first electrical connection and the first::: electrical impedance material The second conductive impedance layer has a -A-type connection system, an electrical connection (4)-conductive '7-electric connection, and a 柷 layer of the electrical connection. 2. Driving the:: Conductive impedance layer The second electrical connection is electrically isolated from the second electrical connection such as the 阻抗 resistance layer by the second electrically insulating layer. The first Lei Li said that the addition of (four) system 'more includes - the first 11 insulation layer and - two: 1 layer 'the third conductive impedance layer is sandwiched between the fourth electrical 2 曰 and the first electrical insulation layer And having a first-electrical connection electrically connected to the first electrical property of the first conductive impedance layer and the third conductive resistive layer is provided by the first electrical insulating layer The second electrical connection of the V conductive impedance layer is electrically isolated. 31 201121352 3. 4. 5. 6. The heating system described in 1 member 1 further comprises at least j electrically & low-lying layer having an electrical connection, the electrically conductive low-impedance layer and its electrical connection are :*, the electric I bar, and the germanium layer are electrically isolated from the first conductive resistive layer and the second conductive resistive layer. The heating system of claim 1 further comprising a cementitious patch film covering one of the first electrically insulating layer and the first electrically insulating layer. The heating system of the '4' further includes a bottom layer (bas_t -) I cover H electrically insulating layer and the third electrical insulating layer is not covered by the cementitious patch film. The heating system of claim 1, wherein each of the first, second, and third electric S and the first electro-conductive impedance layer and the second conductive impedance layer are related to each other, When incorporated into the multi-layer panel, the panel itself is stable and flexible. The heating system of claim 1, wherein the first conductive impedance layer comprises a first electrical insulating layer and the second electrical insulating layer is on the first resistive ink strip, and the The second conductive impedance layer includes a printed column of electrically resistive ink strips. In one of the edge layers, the heating system of claim 1, wherein one of the second conductive impedance layers is greater than one of the first conductive impedance layers. ==1 The heating system, wherein the first electrical insulating layer, the ::. The insulating layer and the third electrically insulating layer comprise a polymer u (p〇iymer 32 9 201121352 10. The heating system according to claim 1 further comprising a multifunctional layer bonded by an adhesive To the multilayer panel, the multifunctional layer comprises one of the group consisting of: a low density foam, a polymer sheet, a rubber sheet, and combinations thereof.
TW99113657A 2009-05-08 2010-04-29 Heating system in the form of a multi-layer panel TW201121352A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109068414A (en) * 2018-06-08 2018-12-21 中北大学 Thick-film hybrid integration heating device and preparation method towards miniature atomic air chamber
TWI786749B (en) * 2020-07-31 2022-12-11 日商高周波熱鍊股份有限公司 power supply unit

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109068414A (en) * 2018-06-08 2018-12-21 中北大学 Thick-film hybrid integration heating device and preparation method towards miniature atomic air chamber
CN109068414B (en) * 2018-06-08 2022-03-25 中北大学 Thick film hybrid integrated heating device for micro atomic gas chamber and preparation method
TWI786749B (en) * 2020-07-31 2022-12-11 日商高周波熱鍊股份有限公司 power supply unit

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AR076554A1 (en) 2011-06-22

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