TW201114517A - Processing method applicable to positioning replaceable stamping mould - Google Patents

Processing method applicable to positioning replaceable stamping mould Download PDF

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Publication number
TW201114517A
TW201114517A TW98136597A TW98136597A TW201114517A TW 201114517 A TW201114517 A TW 201114517A TW 98136597 A TW98136597 A TW 98136597A TW 98136597 A TW98136597 A TW 98136597A TW 201114517 A TW201114517 A TW 201114517A
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TW
Taiwan
Prior art keywords
stamping
positioning
punching
hole
mould
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TW98136597A
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Chinese (zh)
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TWI466738B (en
Inventor
Jun-Rong Ke
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Hsin Pao Co Ltd
Jun-Rong Ke
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Priority to TW98136597A priority Critical patent/TW201114517A/en
Publication of TW201114517A publication Critical patent/TW201114517A/en
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Publication of TWI466738B publication Critical patent/TWI466738B/zh

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Abstract

This invention is a processing method applicable to a positioning replaceable stamping mould, comprising: A. a material preparation primary positioning step in which a positioning replaceable mould which has a top mould and a corresponding bottom mould are prepared, wherein at least one stamping column is formed at the top mould and at least one stamping hole is formed at the bottom mould corresponding to the stamping column, the stamping column of the top mould being positioned relative to the stamping hole at the bottom mould, such that when the stamping column is stamped into the stamping hole, the exterior wall of the stamping column and the interior wall of the stamping hole will form an offset gap; and B. a stamping secondary positioning step in which an adhesive piece is adhered to cover the surface of the bottom mould which allows one end of the stamping hole of the lower mould to be covered by the adhesive piece, and the top mould is driven and displaced downward by a power source such that the stamping column of the top mould will stamp and form at least one positing hole on the adhesive piece to allow secondary positioning.

Description

201114517 六、發明說明: 【發明所屬之技術領威】 本發明係關於一種模具加工方法,特別是指—種定位 替換式沖壓模具加工方法° 【先前技術】 目前常見的沖壓模具(10,請參閱第一圖所示)具有一 上模(11)及一下模(12),該上模(11)相對該下模(12)往復 • 位移進行沖壓,該上模(11) 一侧間隔成型複數個衝柱 (111) ’該下模(12)相對該上模(11)之衝柱(丨丨丨)成型複數 個衝孔(121) ’將欲加工物放置於該下模〇2),當該上模 (11)相對該下模(12)位移時,一旦該衝柱(in)與該衝孔 (121)彼此互不相對’造成該衝柱(in)衝壞該衝孔 (121),加工物也同時遭殃,此時該衝孔(121)必須進行修 復才得以使用’該沖壓模具(1〇)修復成本甚高,不僅要重 ® 新對該沖壓模具(10)進行鑽孔、熱處理、線切割及研磨, 一再的損毀修復也將是一沈重的負擔。 【發明内容】 本發明係一種定位替換式沖壓模具加工方法,其目的 在於提升沖壓的準確性及提供沖壓材料的重複性。 為達成上述目的,本發明定位替換式沖壓模具加工方 法,包含: 201114517 A. 備料一次定位步驟:準備一具有一上模及—相對該 上模之下模的定位替換式模具,該上模受動力源驅動可位 移的設置於該下模-侧,該上模成型至少―衝柱,該下模 相對該衝柱成型至少-衝孔,該上模的衝柱與該下模的衝 孔相對作一次定位,當該衝柱衝入該衝孔時,該衝柱的外 壁與該衝孔的内壁將形成一偏移間隙;以及 B. 沖壓二次定位步驟:該下模的表面貼覆一貼合片, 使該下模的衝孔一端受談貼合片覆蓋,該上模受動力源驅 動朝該下模位移,使該上模的衝柱對該貼合片沖壓成型至 少一定位孔作二次定位。 刖述該上模之衝柱的外徑小於該下模之衝孔的外徑。 則述該貼合片之定位孔的内獲等於該上模之衝柱的 外徑。 藉由前述進一步分析將可獲得下述功效: 1. 本發明透過貼合片提供使用者快速更換加快加工 速度,且利用貼合片精準定位提升咖工效率,更避免加工 物衝毁提升生產良率。 2. 本發明利用前述該上模之衝栓的外徑小於該下模 之衝孔的外徑’使該衝柱與該衝孔之間透過偏移間隙容許 位移偏差,降低彼此衝撞的機會減少維修成本。 有關本發明為達成上述目的,所採用之技術、手段及 其他功效,兹列舉實施例並配合圖式詳細說明如後,相信 201114517 本發明之目的、特徵及其他優點,當可由之得一深入而具 體之瞭解。 【實施方式】 本發明實施例請參閱第二〜八圖所示: 本發明定位替換式沖壓模具加工方法包含(請參閱第 二圖所示): A. 備料一次定位步驟(請參閱第二、三及四圖所示): :準備一定位替換式模具(20)具有一上模(21)及一相 對該上模(21)的下模(22),該上模(21)為活動式,該下模 (22)為固定式,該上模(21)受動力源驅動可位移的設置於 該下模(22)—侧彼此相對,該上模(21)成型至少一衝柱 (211) ’該下模(22)相對該衝柱(211)成型至少一衝孔 (221) ’該上模(21)的衝柱(.211)與該下模(22)的衝孔(221) 相對作一次定位’該上模(21)的衝柱(211)截面積小於該 下模(22)的衝孔(221)截面積,當該衝柱(211)衝入該衝孔 (221)時,該衝柱(211)的外壁與該衝孔(221)的内壁將形 成一偏移間隙(A),讓該衝柱(211)不會衝擊到該衝孔 (221)。 B. 沖壓二次定位步驟(請參閱第五及六圖所示):該下 模(22)的表面(222)貼覆一貼合(23),使該下模(22)的 衝孔(221) —端受該貼合片(23)覆蓋,該上模(21)受動力 201114517 源驅動朝該下模(22)位移,使該上模(21)的衝柱(211)對 該貼合片(23)沖壓成型至少一定位孔(231)作二次定位, 二次定位要比一次定位來的精準,是因為該上模(21)的衝 柱(211)直接對該貼合片(23)沖壓,所以使該貼合片(23) 的定位孔(231)的内控與該衝柱(211)的外徑吻合,且該貼 合片(23)的定位孔(231)恰位於該衝柱(2Π)的位移路徑 上,藉此,只要將加工物(B,請參閱第七圖所示)放置於 該貼合片(23)上,因著該貼合片(23)的定位孔(231)與該 上模(21)的衝柱(211)精準定位,使上模(21,請參閱第八 圖所示)的衝柱(211)能精準的對加工物(B)所要的位置進 行冲孔,該貼合片(23)能提供使用者視需求替換,無需將 整個下模(22)拆除進行破損修復。 【圖式簡單說明】 第一圖習用之立體示意圖。 第二圖本發明步驟示意圖。 第三圖本發明立體示意圖。 第四圖本發明第三圖之平面示意圖。 第五圖本發明第四圖之動作示意圖。 第六圖本發邮五圖之動作絲示意圖。 第七圖本發明第六®增加加工物之平面示意圖。 第八圖本發明第七圖之動作示意圖。 201114517 【主要元件符號說明】 10… …沖壓模具 1卜· …上模 111- …··衝柱' 12… …下模 121- .....衝孔 20':.· …定位替換式模具 2卜. …上模 211.. …· ·衝柱 22… …下模 221·. .....衝孔 222- .....表面 A…·. > •偏移間隙 23… …貼合片 231.. •…·定位孔 B..… _ •加工物201114517 VI. Description of the Invention: [Technology Leading Technology of the Invention] The present invention relates to a method for processing a mold, in particular to a method for processing a positioning and replacing stamping die. [Prior Art] A common stamping die (10, see The first figure shows an upper mold (11) and a lower mold (12). The upper mold (11) is stamped with respect to the lower mold (12) by reciprocation and displacement, and the upper mold (11) is formed on one side by a plurality of moldings. a punch (111) 'the lower mold (12) is formed with a plurality of punches (121) relative to the punch (丨丨丨) of the upper mold (11), and the workpiece is placed in the lower mold 2, When the upper mold (11) is displaced relative to the lower mold (12), once the punch (in) and the punch (121) are not opposite each other, the punch (in) is damaged (121). ), the workpiece is also smashed at the same time. At this time, the punching (121) must be repaired before it can be used. 'The stamping die (1〇) is very expensive to repair, not only to re-drill the stamping die (10) Heat treatment, wire cutting and grinding, repeated damage repair will also be a heavy burden. SUMMARY OF THE INVENTION The present invention is a method for processing a positioning and replacement stamping die, the purpose of which is to improve the accuracy of stamping and to provide repeatability of stamping materials. In order to achieve the above object, the present invention locates a replacement stamping die processing method, comprising: 201114517 A. Preparing a positioning step: preparing a positioning replacement mold having an upper mold and a mold opposite to the upper mold, the upper mold is subjected to The power source is driven to be displaceably disposed on the lower mold side, the upper mold molding at least a punching column, and the lower mold is shaped at least with respect to the punching column, and the punching pole of the upper mold is opposite to the punching hole of the lower mold Positioning, when the punching column is punched into the punching hole, the outer wall of the punching column and the inner wall of the punching hole will form an offset gap; and B. the second step of punching: the surface of the lower die is attached Laminating the sheet, the punching end of the lower mold is covered by the contact sheet, and the upper mold is driven by the power source to be displaced toward the lower mold, so that the punching portion of the upper mold stamps and forms at least one positioning hole for the bonding sheet For secondary positioning. The outer diameter of the punch of the upper mold is smaller than the outer diameter of the punch of the lower mold. The inner diameter of the positioning hole of the bonding piece is equal to the outer diameter of the punching column of the upper mold. Through the above further analysis, the following effects can be obtained: 1. The present invention provides a quick change of the user through the bonding sheet to speed up the processing, and utilizes the precise positioning of the bonding sheet to improve the efficiency of the coffee machine, and avoids the destruction of the processed product. rate. 2. The present invention utilizes the outer diameter of the punch of the upper mold to be smaller than the outer diameter of the punch of the lower mold to allow the displacement gap between the punch and the punch to be offset by the offset gap, thereby reducing the chance of collision with each other. Maintenance costs. The present invention has been described with reference to the embodiments and the detailed description of the present invention, and the objects, features and other advantages of the present invention are believed to be Specific understanding. [Embodiment] Please refer to the second to eighth figures of the embodiment of the present invention: The positioning and replacement stamping die processing method of the present invention comprises (see the second figure): A. Preparing a positioning step (refer to the second, 3 and 4): preparing a positioning replacement mold (20) having an upper mold (21) and a lower mold (22) opposite to the upper mold (21), the upper mold (21) being movable The lower mold (22) is of a fixed type, and the upper mold (21) is driven to be displaceably disposed opposite to the lower mold (22) by a power source, and the upper mold (21) is formed by at least one punch (211). The lower mold (22) forms at least one punch (221) with respect to the punch (211) 'the punch (.211) of the upper mold (21) and the punch (221) of the lower mold (22) The cross-sectional area of the punch (211) of the upper mold (21) is smaller than the cross-sectional area of the punch (221) of the lower mold (22) when the punch (211) punches into the punch (221). When the outer wall of the punching column (211) and the inner wall of the punching hole (221) will form an offset gap (A), the punching column (211) will not impact the punching hole (221). B. Stamping secondary positioning step (refer to Figures 5 and 6): the surface (222) of the lower mold (22) is pasted with a fit (23) to punch the lower mold (22) ( 221) The end is covered by the bonding piece (23), and the upper die (21) is driven by the power source 201114517 to be displaced toward the lower die (22), so that the punching (211) of the upper die (21) is attached to the die The splicing piece (23) is stamped and formed into at least one positioning hole (231) for secondary positioning, and the secondary positioning is more precise than the one positioning, because the punching column (211) of the upper mold (21) directly directly aligns the aligning piece (23) stamping, so that the internal control of the positioning hole (231) of the bonding piece (23) coincides with the outer diameter of the punching column (211), and the positioning hole (231) of the bonding piece (23) is located On the displacement path of the punching column (2Π), the workpiece (B, see FIG. 7) is placed on the bonding piece (23), because of the bonding piece (23) The positioning hole (231) and the punching rod (211) of the upper mold (21) are accurately positioned, so that the punching rod (211) of the upper mold (21, see FIG. 8) can accurately process the workpiece (B). Punching at the desired position, the fit piece 23) can provide users depending on the needs replacing, without taking the entire lower mold (22) removed for damage repair. [Simple diagram of the diagram] The first diagram is a three-dimensional diagram. The second figure is a schematic diagram of the steps of the invention. The third figure is a perspective view of the invention. Figure 4 is a plan view of the third diagram of the present invention. Figure 5 is a schematic view showing the operation of the fourth figure of the present invention. The sixth picture is a schematic diagram of the action wire of the five pictures. Figure 7 is a plan view showing the sixth embodiment of the present invention for increasing the workpiece. Figure 8 is a schematic view showing the operation of the seventh drawing of the present invention. 201114517 [Description of main component symbols] 10... ... stamping die 1 b ... upper die 111 - ... · · punching column ' 12... lower die 121 - ..... punching 20': .... ... positioning replacement die 2 Bu. ...Upper mold 211.....··Pushing column 22... Lower die 221·...... Punching 222- ..... Surface A...·. > Offset gap 23... Fitting piece 231.. •...·Positioning hole B..... _ •Processing

Claims (1)

201114517 七、申請專利範圍: 1. 一種定位替換式沖壓模具加工方法,包含: ^備料-次定位步驟:準備—具有—上模及一相对讀 上模之下模的定位替換式模具,該上模受動力源驅動可位 移的設置於該下模一侧’該上模成型至少一衝柱,該下模 相對讓衝柱成型至少—衝孔,該上模的衝柱與該下模的衝 孔相對作-次定位,t該衝柱衝域衝孔時,該衝柱的外 壁與該衝孔的内壁將形成一偏移間隙;'以及 b.沖壓二次^位步驟:該下模的表面貼覆-貼合片, ^下模_孔-端受該貼合片覆蓋,該上模受動力源驅 、朝該下模位移,使該上模的衝㈣該貼合片沖歷成型至 ^ 一定位孔作二次定位。 工2 ·如巾4專利範g第丨項所述定位替換式沖壓模具如 斤去其中該上杈之衝柱的外徑小於該下模之衝孔的 3·如申請專利範圍第1項所述定位替換式沖壓模具加 之衝 方法其中’該貼合片之定位孔的内徑等於該上模 柱的外徑。 、201114517 VII. Patent application scope: 1. A positioning replacement stamping die processing method, comprising: ^ stocking-sub-positioning step: preparing-having-upper die and a positioning replacement die corresponding to the upper die of the upper die, the upper part The mold is driven by the power source to be displaceably disposed on the side of the lower mold. The upper mold is formed by molding at least one punch, and the lower mold is formed by at least punching the punch, and the punch of the upper mold and the punch of the lower mold The hole is opposite to the secondary positioning, and when the punching column is punched, the outer wall of the punching column and the inner wall of the punching hole will form an offset gap; and b. the second step of stamping: the lower die Surface-mounting-bonding sheet, ^ lower mold_hole-end is covered by the bonding sheet, the upper mold is driven by the power source, and is displaced toward the lower mold, so that the upper mold is punched (4) the bonding sheet is formed by punching To ^ a positioning hole for secondary positioning. 2, as in the case of the towel 4 patent, the positional replacement stamping die, as described in the item, the outer diameter of the punching column of the upper jaw is smaller than the punching of the lower die. The positioning replacement stamping die and the punching method are described in which the inner diameter of the positioning hole of the bonding piece is equal to the outer diameter of the upper mold column. ,
TW98136597A 2009-10-29 2009-10-29 Processing method applicable to positioning replaceable stamping mould TW201114517A (en)

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CN2355830Y (en) * 1999-01-08 1999-12-29 徐福川 Improved cushion ring mould
JP4522366B2 (en) * 2003-06-10 2010-08-11 株式会社 ベアック Drilling device
TWM365823U (en) * 2009-06-05 2009-10-01 Meng Sheng Helting Co Ltd Hole punching jig for plastic film

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