TW201111696A - Customizable, long lasting, thermally efficient, environmentally friendly, solid-state lighting apparatuses - Google Patents

Abstract

The invention provides lighting apparatuses which are power efficient, environment friendly and long lasting and can be manufactured with high degree of speed, accuracy and flexibility. The lighting apparatuses are easily serviceable and can be produced, transported economically and have higher economical value even on completion of life term of the lighting apparatuses. The present invention reduce the waste of raw material thereby utilizing maximum percentage raw material for produce solid state lighting fixtures using CAD and CNC process and provides retrofitting lighting apparatuses which can be replaced without making considerable changes in existing infrastructure.

Description

201111696 VI. INSTRUCTIONS OF THE INVENTION: FIELD OF THE INVENTION The present invention relates to a general illumination device that is environmentally friendly. The present invention is particularly directed to loyal, long lasting, high energy efficiency, solid state lighting. BACKGROUND OF THE INVENTION The power consumption of incandescent lamps and high pressure sodium vapor lamps used today, including, in addition, the amount of atmospheric C〇2 released by this power consumption, has caused global concern. Moreover, incandescent lamps have a short life span and use hazardous materials, resulting in high maintenance costs and are not friendly to the ecosystem and are inherently non-sustainable. Therefore, solid-based irradiation technology has attracted attention as a light source of optimal energy conservation and ecological friendliness in the future. To overcome the economic, environmental and health issues associated with incandescent luminaires and CFLs, dense alternatives for illuminating applications are environmentally friendly general-purpose illuminators based on intelligent use of solid-state lighting devices. Solid-state lighting has the potential to revolutionize the lighting industry. Light-emitting diodes (LEDs)—used in slogans, signals, and displays—are rapidly evolving to provide a source of general illumination. This technology is promising for lower energy consumption and reduced maintenance. The characteristics of solid-state lighting include: 1. Long-life LEDs can provide 50 hours or more of life. In comparison, an incandescent bulb lasts about 1,000 hours. 201111696 2. Energy Saving One of the best commercial white LED lighting systems offers more than twice the luminous efficacy of incandescent lighting (lumen per watt). Colored LEDs are especially advantageous for colored lighting applications because filters are not required. 3. Better quality light output - LED has minimum UV and IR radiation. 4. Essentially safe - An LED system is low voltage and is generally cool for touch. 5. Smaller flexible lamp equipment The smaller size of an LED makes it possible to illuminate tight spaces. 6. Durable One LED does not have a filament that can rupture and can withstand vibration. More durable than any light source. 7. Reduced maintenance costs and energy costs. 8. Focused illumination-guided light for increased system efficiency and directionality results in a highly controllable optical system. 9. There are no moving parts and will not break, break, break, leak or pollute the environment. 10. Green Technology does not emit ultraviolet light, infrared heat, and does not contain mercury or fault. 11. Its long life and small size represent less waste. 12. Low voltage current driven solid state devices operate at voltages as low as 3 VDC. 13. It can be cold started, and there is no ignition problem in a cold environment, even if it is as low as -40 °C. The SSL device is based on a semiconductor diode. When the diode is positively biased (cut-off), electrons can be combined in the hole and release energy in the form of light. This 欵 should be called electroluminescence, and the color of the light depends on the energy gap of the semiconductor. One of the main challenges in using SSL is the management of heat dissipated from the junction diode. The efficiency of LEDs is roughly based on their heat dissipation. The ambient temperature of the surrounding environment has an effect on LED performance due to its self-heating. If it is overloaded at a high-ring temperature, it may have an adverse effect on its luminous capacity. When the semiconductor die in the LED heats up, the LED's light wheel is reduced, thereby reducing its efficiency. Therefore, overheating of the LED may cause device failure. A possible way to compensate for the self-heating effect of the LED is to design the body P of the device panel of the LED lighting device in such a way as to dissipate as much heat as possible. The maximum heat dissipation can be achieved by the material and design of the luminaire panel on which the solid state lighting device is mounted. SUMMARY OF THE INVENTION The main purpose of this month is to provide a lighting solution that is highly power efficient, environmentally friendly, and durable, and that can be customized to a high degree of speed, precision, and flexibility. Another significant object of the present invention is to provide a solid state lighting device that can utilize a power supply to achieve a power factor ratio of > 98 to reduce reactive power. Another object of the present invention is to provide a solid state lighting device that can achieve greater than 90% of the light in a desired area by mounting a lens on a solid state illumination source to thereby prevent light scattering in the unwanted area. The amount of light entering the unwanted plane is as small as 0.01 to 20%. 201111696 Another object of the present invention is to provide a high degree of flexibility to utilize CAD and CNC processes to tailor the design of the device to its effectiveness. Another object of the invention is to reduce waste of raw materials by using CAD and CNC processes to produce solid state lighting using a maximum percentage of raw materials. Still another object of the present invention is to provide a lightweight lighting device that can be economically produced and shipped and that has a high economic waste value even when the life of the lighting device is completed. Still another object of the present invention is to provide a solid state lighting device that can be easily overhauled, wherein the power supply unit is a separate component and can be replaced in the event of a failure. Another object of the present invention is to design such devices in such a way that the overall body of the device is used as a high efficiency heatsink, wherein the device is on the side of the device due to the thickness (2 axes) of the device in the range from 0.5 to 6 mm. The direction has a maximum heat dissipation in the x,y coordinates, and the device is made of at least one thermally conductive metal sheet and the sheet metal material is selected from the group consisting of aluminum, iron, steel, copper or alloys or combinations thereof. . Still another object of the present invention is to correct the heat in a domain sinusoidal solid state lighting device by exposing the maximum filament Φ product on the bottom and top sides of the device in the x&y-axis. Still another object of the present invention is to achieve an optimum j> by one or more planes of the apparatus, including the base plane of the apparatus, at a desired angle, which may range from 0 to 360 degrees. Qualitative photometric measurement 0 Another aspect of the present invention is to provide a light sensor component that is coupled to an AC or DC input. 201111696 For the power input of solid state lighting devices, the light sensor component can be a neon sensor or a south precision chamber light sensor. Still another object of the present invention is to provide a refurbished lighting device in which the town is replaced and the existing infrastructure does not need to be significantly changed. Its design does not require the creation of special enclosures for physical infrastructure. Taking streetlights as an example, the retrofit design built by the customer does not need to be changed, but the retrofit design of the proposed lighting device can replace the existing cover. Still another object of the present invention is to provide a lighting device that can withstand extreme weather conditions including rain, sandstorms, snowfall, wind and heat. Another object of the present invention is to provide the lighting device with a desired level of waterproofing (intrusion protection) that is designed by its design. Still another object of the present invention is to provide an illumination device having an anodized body portion for achieving a non-corrosive and scratched surface for smoothing heat flow. Another object of the present invention is to protect the top side heat dissipating area of the apparatus, including the main heat dissipator and the secondary heat dissipator, and the heat dissipating panel from any type of faeces and/or any other droppings. Before the present invention is described, it is to be understood that the present invention is not limited to the particular device and methodologies described. The invention may have various possible embodiments and is not shown in the present disclosure or the drawings. It is also understood that the terminology of the present invention is intended to be limited to the specific embodiments or embodiments, and is not intended to limit the scope of the invention The present invention provides a high power efficiency 'environmentally friendly and long lasting lighting solution, and it can be customized with a high degree of speed, precision and flexibility. The lighting device of the present invention is also easy to overhaul. 201111696 According to an embodiment of the invention, a durable, high energy efficient, solid state lighting device having a custom design, wherein the device comprises a device having a mounting surface that is reduced, optionally - or a plurality of slits, holes Or the chip, which is selectively punched on the mounting surface of the device to achieve additional heat dissipation and minimize the resistance to wind. The 〆 or plurality of planar systems of the device comprising the base plane of the device can be adjusted to achieve the desired photometry. The apparatus described above is made of at least one thermally conductive metal sheet, wherein the thermally conductive metal sheet is selected from the group consisting of: 35, iron, steel, copper or alloys or combinations thereof. The equipment is manufactured by a computer numerical control (CNC) process; the device is characterized by: I. The entire body of the device acts as the primary heat sink, which is maintained at a position due to the optimum thickness of the device (z-axis) 〇5 to 6111 in the range of the claws so that the heat dissipation is designed to maximize the X,y coordinates in the lateral direction of the device; II. Used to prevent corrosion and scratching anodization, thereby increasing the thermal conductivity; ill.—Power supply a supply unit that is enclosed in a housing of the device, wherein the power supply unit provides the required DC or AC voltage to one or more solid cancer, illumination sources. The DC or AC voltage required therein can be from AC or DC Input power generation; ιν·Optimization design is capable of having maximum light dispersion in the desired area. At least one metal core printed circuit board (MCPCB) is mounted on the mounting surface' and at least one solid state light source is mounted on the MCPCB. Optionally, one or more lens systems are mounted on one or more solid state light sources to prevent light scattering in unwanted areas and thereby direct light into the desired area. 8 201111696 Optionally, one or more protective transparent or translucent sheets cover - or a plurality of solid state light sources to prevent insects from entering the illumination device, wherein the protective transparent or translucent sheet material may be selected from glass and/or Colorless polycarbonate. Optionally, the coated/coated copper is sandwiched between the primary heat sink and the mpcb, wherein the layer further has a component for preventing corrosion. The solid state light source can be selected from the group consisting of low power or high power LEDs including LEDs, OLEDs, PLEDs. One or more layers of thermal interface material (such as ruthenium rubber) are placed between the primary heat sink and the MCPCB and the primary heat eliminator and the secondary heat eliminator and two or more secondary heat eliminators. The illuminating device further includes one or more heat dissipating panels as a secondary heat dissipator mounted on the front or the opposite side of the device, optionally having - or a plurality of slitted holes or fins, selectively slid over The secondary heat exchanger is used to achieve additional heat dissipation and minimize the resistance to wind, and wherein the heat exchanger is made of at least one heat conductive material selected from the group consisting of aluminum, iron, steel, Copper or a combination or alloy thereof. - or multiple layers of thermal interface materials (such as Shi Xi rubber placed between the main heat exchanger and MCPCB and the main heat exchanger and secondary heat exchanger and two or more secondary heat exchangers. And 'lighting device When used for public lighting purposes, there is a light perception, then two pieces and/or motion sensor parts' - light sensor parts and / or action sense i:. The pieces are lightly coupled to AC or DC input A power or power supply unit that is configured to selectively control power input to the solid state lighting device, wherein the light sensor component can: a neon sensor Or a high-accuracy toroidal light sensor. Moreover, the lighting device can meet the protection standards for human intrusion, the standard can be ιρ65, ιρ66, and (4) 201111696 or the European Committee for Electrotechnical Standardization (Eur〇pean plus hr

Any other intrusion protection standards promulgated by Electro Technical Standardization). Further, in accordance with another embodiment of the present invention, a durable, high energy efficient, solid state lighting device has a customizable design, wherein the device includes a singer having at least one of a women's surface, optionally one or more Slit, hole or Korean piece, selectively punched onto the mounting surface of the device to achieve additional heat dissipation and minimize resistance to wind. The device is made of at least one thermally conductive metal sheet, wherein the thermally conductive metal sheet is selected from A group consisting of: aluminum, iron, steel, copper or bismuth alloy or combination thereof. The equipment is manufactured by computer numerical control (CNC); the device is characterized by; The entire body of the device acts as the first primary heatsink, with the maximum in the x,y coordinates of the lateral direction of the device due to the optimum thickness (z-axis) of the device being maintained in the range from 〇5 to 6 mm Ways to design equipment; II.  It is used to prevent the anodization of the surname and the scratch, thereby increasing the thermal conductivity; III.  a power supply unit enclosed in a housing of the device, wherein the power supply unit provides the required DC or AC voltage to one or more solid state illumination sources; iv. The optimized design is capable of having maximum light dispersion in the desired area. At least one metal core printed circuit board (MCPCB) is mounted on the mounting surface, and at least one solid state light source is mounted on the group: and the solid state light source may be selected from the group consisting of the following: Group: Low-power or high-power LEDs, including LEDs, 〇LEDs, PLEDs, a second main heat extractor with thermal insulation sheets and/or buffering 201111696 spacers placed on the back side of the device and from the first main heat rejection At least one solid state light source of the MCPCB mounted on the device is thermally coupled to the heat dissipator via a metallic thermal interface and an insulator through a cut-out opening provided in the first main heat extractor. It is manufactured using a CNC process that includes the following steps: a.  Selecting a metal sheet, wherein the metal sheet may be selected from the group consisting of aluminum, iron, steel, copper or a combination or alloy thereof; b.  The metal piece is inserted into a CNC machine, wherein the programmed instructions enable the processor in the CNC machine to stamp the metal piece and c. according to the feed design of one or more devices.  Optionally, the C N C machine is used to bend the stamped equipment in one or more places. A method for fabricating a durable, high energy efficient, solid state lighting device having a custom design comprises the following steps: a.  Feeding at least one design of the device to a CNC machine with the same piece of metal; b.  Stamping a sheet of metal according to the design to achieve one or more devices; c.  Optionally bending the stamped device in one or more places; d.  Anode the device to achieve a non-corrosive and scratched surface; e.  Pneumatically secure the nut/insert/rivet nut (hardware) into the device; f.  Mounting at least one metal core printed circuit board (MCPCB) on which at least one solid state light source has been mounted on the device; and 11 201111696 g. One or more power supply units are mounted in a housing of the device. The method further includes placing a second primary heat extractor having a thermally insulating sheet and/or a buffer spacer on the rear side of the apparatus, and passing through the metallic thermal interface and passing through the first main heat extractor The open-out insulator thermally connects at least one solid-state light source from the MCPCB mounted on the first main heat-dissipator to the second main heat-dissipator; placing the coated copper on the main heat-dissipator & MCPCB In this case, the coated layer may further have a component for preventing corrosion; and one or more heat dissipation panels (secondary heat exchangers) are mounted on the front or the opposite side of the device. And the method includes selectively mounting a light sensor component and/or a motion sensor in the front and/or rear side of the device; selectively mounting one or more lenses to one or more solid state light sources Sourcely; selectively covering one or more protective transparent or translucent sheets on one or more solid state light sources; and placing a layer of thermal interface material in the main heat extractor & MCPCB & main heat extractor and Between the heat exchangers and between two or more secondary heat exchangers. BRIEF DESCRIPTION OF THE DRAWINGS The above summary, as well as the following detailed description of the preferred embodiments, In order to demonstrate the invention, the exemplary construction of the invention is shown; however, the invention is not limited to the specific apparatus and method disclosed. In the drawings: Figure 1 shows a front view of a solid state lighting device for use in a streetlight application, in accordance with an exemplary embodiment of the present invention; Figure 2 shows solid state lighting for a streetlight application, in accordance with an exemplary embodiment of the present invention. Rear view of the device; 12 201111696 FIG. 3 shows an isometric front view of a solid state lighting device for use in a streetlight application in accordance with an exemplary embodiment of the present invention; FIG. 4 shows use in accordance with another exemplary embodiment of the present invention. A top view of a solid state lighting device for a bay light application; FIG. 5 is a bottom plan view of a solid state lighting device for use in a shed light application in accordance with another exemplary embodiment of the present invention; A top view of a solid state lighting device for a shed light application of an exemplary embodiment; FIG. 7 shows an isometric front of a solid state lighting device for use in a flood light application, in accordance with an exemplary embodiment of the present invention Figure 8 shows an isometric front view of a solid state lighting device for use in a High Mast application, according to another exemplary embodiment of the present invention; An isometric rear view of a solid state lighting device for use in a high mast application is shown in accordance with another exemplary embodiment of the present invention; FIG. 10 shows an indoor down light for use in an indoor downlight in accordance with an exemplary embodiment of the present invention. An isometric front view of a solid state lighting device for use; Figure 11 shows an isometric rear view of a solid state lighting device for use in an indoor downlight application, in accordance with an exemplary embodiment of the present invention; A cross-sectional view of a solid state lighting device having a first level of thermal management system of an embodiment; FIG. 13 is a cross-sectional view of a solid state lighting device having a second level of thermal management system in accordance with another embodiment of the present invention Figure 14 shows a cross-sectional view of a solid state lighting device having a thermally managed third level 201111696 level thermal management system in accordance with an embodiment of the present invention; Figure 15 shows an enhanced first embodiment in accordance with another embodiment of the present invention. A cross-sectional view of a solid state lighting fixture with a four-level thermal management system; Figure 16 shows the light of an IES LM 79-08 based on solid state lighting And electrically experimental data; Flux of FIG IESNA solid state lighting device to a lighting fixture in accordance with the classification system based on display 17 in FIG. I: Embodiment 3 Detailed Description of the Invention A part of the embodiment of the present invention in which all of its features are shown will now be discussed in detail. "Include", "have", "include" and "including" terms and other forms are intended to be equal and open for the following reasons: one or more items located after any of these terms may not be the same An exhaustive list of items or items, or only one or more items listed. It must also be noted that the singular forms "a", "," "an" and "the" are meant to include the plural referents. While any apparatus or method or equivalents described herein can be used to carry out or test embodiments of the present invention, a preferred apparatus will now be described. And a heat exchanger: a component designed to reduce the temperature of an electronic/semiconductor device connected thereto by dissipating excess heat generated at its junction. It is often fin-shaped and is cooled by heat such as aluminum or copper. Made of faster metal. In today's case, the overall body of the device acts as a heat sink and the heat extractor is used in the form of metal 14 201111696. Equipment: Unless otherwise defined in the present invention, "equipment, A means comprising a plurality of solid state lighting device or the system is connected to the metal framework mounted with other electrical Shu ± / electronic components and non Niuzi. Solid-state light source (SSL): A type of low-power or high-power illumination using a light-emitting diode (LED), an organic light-emitting diode (OLED), or a polymer light-emitting diode (pLED) as one of the illumination sources. Device. The present invention provides a south power efficiency, a friendly and durable environment that can be customized with high speed, accuracy and flexibility. The lighting device of the present invention is also easy to overhaul. Figures 2 and 3 show front, back and isometric front views of a solid state lighting device for streetlight applications having durable, high energy efficiency, solid state lighting with customizable design, in accordance with an exemplary embodiment of the present invention. The device, wherein the device comprises a device 1〇2 having two mounting surfaces 1〇4, namely a left mounting surface 104a and a right mounting surface 1〇4b, optionally one or more slits 108, holes 110 Or the Korean piece 112, which is selectively punched on the mounting surface 1〇4 of the device 102 to achieve additional heat dissipation and minimize the resistance to wind. The slit 108, aperture 110 or fin 112 can have any shape on demand. One or more planes of device 102, including the base plane of the device, are tiltably tilted to a desired angle to achieve the desired photometry; the angle can be in the range from 0 to 360 degrees. The apparatus 102 described above is made of at least one thermally conductive metal sheet, wherein the thermally conductive metal sheet is selected from the group consisting of aluminum 'iron, steel, copper, or a combination or alloy thereof. The device 102 is manufactured by a computer numerical control (CNC) process; the 15 201111696 device is characterized by: i.  The entire body of device 102 acts as the primary heat sink, with the thickness of the device 102 (z-axis) being located from 0. In the range of 5 to 6 mm, the heat dissipation is designed in such a way that the x, y coordinates of the lateral direction of the device are the maximum; ii.  Used to prevent corrosion and scratching anodization, thereby increasing thermal conductivity; iii.  A power supply unit 116 (not shown) that is enclosed in a housing 114 of the device 102, wherein the power supply unit 116 provides the required DC or AC voltage to one or more solid state illumination sources; iv.  The optimized design has maximum light dispersion in the desired area. The base plane of device 102 supports the components of solid state lighting device 100. A metal core printed circuit board (MCPCB) 118 is mounted on the central mounting surface of device 102, and selectively coated copper 168 (not shown) is embedded in primary heat sink 102 and MCPCB 118. Between the two high-intensity solid state light sources 120 are mounted on the MCPCB 118 and its edges, with a central mounting surface 104 secured thereto, and the solid state light source 120 can be selected from the group consisting of: Low power or high power LEDs, including LEDs, OLEDs, and PLEDs, wherein a protective transparent sheet 124 or lens 122 (not shown) is mounted on the high intensity solid state light source 120 to prevent light scattering in unwanted areas. Thereby, the light is guided into the desired area. Two MCPCBs 118 are mounted on the left and right sides of the mounting surfaces 104a and 104b, and an array of solid state lighting sources 120 are mounted on the MCPCB 118. Two protective transparent sheets 124 are used to cover the solid state light source 120 to prevent insects from entering the illumination device. According to an embodiment of the invention, the protective transparent 16 201111696 sheet 124 may be selected from glass and/or colorless polycarbonate. . The MCPCB 118 described above comprises three layers, namely a bottom layer, an intermediate (insulating) layer and a top layer (not shown). The bottom layer is composed of at least one thermally conductive material selected from the group consisting of aluminum, iron, steel, copper or combinations or alloys thereof. The bottom layer is attached to the mounting surface 104 of the device 1〇2 with a thermal interface layer. The intermediate layer is made of an electrically insulating material and is used to conduct heat from the top layer of the MCPCB 118 and does not allow power to be conducted from the top layer to the bottom layer. The top layer consists of copper or any other metal that has better thermal and electrical conductivity than copper, such as gold in gold. At least one solid state light source 12 is mounted with a top layer of MCPCB 118. The two sides (left and right, respectively) of the two heat dissipation panels 126 (not shown) are mounted on the opposite side of the device 1〇2, wherein the secondary heat exchanger 126 is At least one thermally conductive material selected from the group consisting of aluminum, iron, steel, copper, or a combination or alloy thereof. Optionally, one or more slits 108, holes 110 or fins 112 are selectively punched onto the mounting surface 1〇4 of the apparatus 102 for additional heat dissipation and minimizing resistance to wind. The slit 108, the aperture 11 or the fin 112 may have any shape on demand. The secondary heat extractor 126 on the top side heat dissipating area is covered by a metal cover 128. The device 102 is attached to protect the underlying components and the metal cover 128 prevents the coating on the upper heat dissipating area. Affected by bird wings and any other droppings, these droppings reduce the heat dissipation capability of the topside heat sink of the device (10). A housing 114 is secured to the distal end of the device 1〇2. A power supply unit 17 201111696 is installed inside the housing 114, and the solid state lighting unit 1 can be easily inspected, wherein the power supply unit is a separate component and can be replaced in the event of a failure. The power supply unit 116 is electrically connected to each of the solid-state light sources (10) by a connecting wire extending from the power supply unit [16] to the solid-state light source 120. The power supply unit 116 achieves a reduction in the reactivity power of >G_98. The required DC or AC voltage can be generated from the AC4DC input supply. The AC/DC input power supply can be converted to the required sink power supply for operation of the solid state light source 120 using an AC to DC converter, or a DC to DC converter, as desired. Further solid state lighting device 100 is provided with a light sensor component 134 and/or motion sensor component 172 (not shown) for use in public lighting applications. A light sensor component 134 and/or motion The sensor component 172 is coupled to an AC or DC input power or power supply unit that is configured to selectively control power input to the solid state lighting device 1 Wherein the photo sensor component 134 can be a neon sensor or a high precision toroidal photosensor. The motion sensor component 172 can operate in two ways to conserve energy, and an operational mode is based on sensing motion, wherein the motion sensor component is configured to control the power input to cut the solid state lighting device 100 into an ON (ON). If the motion sensor component I72 is not sensible, the 丨 action, thereby configuring the solid state lighting device 1 to be turned off (〇FF). The second mode of operation is based on the sensing action. When the action is detected, the motion sensor component 172 is configured to allow 100% power to be input to the solid state light source 12 to improve the light intensity, and the column yield is 100%. If the motion sensor component 172 does not sense the motion, the power input to the fixture light source 120 is reduced to reduce the light intensity by up to 9%. In accordance with an embodiment of the present invention, the solid state lighting device 1 is provided with a timer 174 (not shown) that is consuming AC or DC input power, the timer component being configured to selectively control the solid state Power input to the lighting unit. The timer 174 can operate in a number of ways to selectively control the power supply to the solid state lighting device 100 to be turned "on" or "off" and to control the intensity of light by controlling the power supplied to the device 100. A device engagement component 136 having two apertures in the c-pathway 138 provides photometric capability for angular adjustment of the device 102 to adjust the light along the width of the road. And the device 100 is capable of achieving intrusion protection standards, wherein the standards may be IP65, IP66, and IP67. Figure 4 shows a top view of a solid state lighting device for use in a high bay light application in accordance with another exemplary embodiment of the present invention. The solid state lighting device 200 has five separate devices 202 that are connected by screws 250 as auxiliary to form a device 200 using connection members 256a, 256b. Apparatus 202 is made of at least one thermally conductive material and the thermally conductive material is selected from the group consisting of aluminum, iron, steel, copper, or combinations or alloys thereof. Each device has one or more slits 208 (not shown) or a rotor 212 that is selectively slid over the mounting surface 204 of each device 202 to achieve additional heat dissipation and minimize resistance to wind. The slit 208 or fin 212 can have any shape based on the needs. The apparatus 202 described above is made of at least one thermally conductive metal sheet, wherein the thermally conductive metal sheet is selected from the group consisting of aluminum, iron, steel, copper, or a combination or alloy thereof. The equipment is manufactured by computer numerical control (CNC) process; the statement is 19 201111696. The characteristics are: 丄. Four separate devices 202 are connected to form a device view, thereby achieving a (four) quantity management system for each of the four devices and the towel device; ii. The entire body of device 202 acts as the primary heat sink, with the optimum thickness (4) due to the device 202 being located from the top. In the range of 5 to 6_, the heat dissipation is designed in such a way that the x, y coordinates of the lateral direction of the device are the maximum; Used to prevent corrosion and scratching anodization, thereby increasing thermal conductivity; iv.  The optimized design is capable of having maximum light dispersion in the desired area; v.  One or more planes of device 202, including the base plane of the device, can be adjustably tilted to a desired angle to achieve a desired photometry; the angle can be in a range from 0 to 360 degrees; Light dispersion/projection is selectively achieved with a combination of different lenses placed on a solid state light source. A hook 258 is attached to the top of the device 202 to secure the illumination device 200 to the desired object. Figure 5 shows a bottom view of a solid state lighting device for use in a shed light application in accordance with another exemplary embodiment of the present invention. Five metal core printed circuit boards (MCPCB) 218 (not shown) are mounted on each mounting surface of five devices 202, optionally coated with a layer of copper 268 (not shown) Sandwiched between the primary heat sink 202 and the MCPCB 218, an array of solid state light sources 220 are mounted on the MCPCB 218. The solid state light source 220 is covered by a transparent sheet 224 to prevent insects from entering the illumination device. According to an embodiment of the invention, the material of the protective transparent sheet may be selected from the group consisting of glass and/or colorless polycarbonate. The MCPCB 218 described above comprises three layers, namely a bottom layer, an intermediate (insulating) layer and a top layer (not shown). The bottom layer is composed of at least one thermally conductive material selected from the group consisting of aluminum, iron, steel, copper or combinations or alloys thereof. The bottom layer is attached to the mounting surface 204 of the device 202 (not shown) with a thermal interface layer. The intermediate layer is made of an electrically insulating material and is used to conduct heat from the top layer of the MCpcb 218 and does not allow power to be conducted from the top layer to the bottom layer. The top layer consists of copper or any other metal that has better thermal and electrical conductivity than copper, such as copper. A top layer of the MCPCB 218 is mounted on at least one of the solid state light sources 220. The five heat dissipation panels 226 (not shown) that are selectively used as secondary heat sinks are mounted with the opposite side of the device 202, wherein the heat dissipation panel 226 is at least one thermally conductive from the group consisting of the following: Made of materials: aluminum, iron, steel, copper or a combination or alloy thereof. Optionally, one or more slits 2, 8, or fins 212 are selectively applied to the mounting surface 2〇4 of the device 2〇2 to achieve additional heat dissipation and minimize resistance to wind. The slit 208, or fin 212, can have any shape on demand. Two layers of thermal interface material (not shown) 270 are placed between the primary heat exchanger 202 and the MCPCB 218 and the primary heat extractor 202 and the secondary heat extractor 226 to conduct heat from the primary heat rejection port 202 to the secondary Heater 226 is required. The thermal interface material of this layer can be a ruthenium rubber film. A power supply unit 216 (not shown) is mounted on the inside of the solid state lighting device 200, which is easily accessible, wherein the power supply unit is a separate component and can be replaced in the event of a failure. The power supply unit 216 achieves >0. A power factor of 98 is used to reduce the reactive power of 21 201111696. The required DC or AC voltage can be generated from eight (: or £) (: input power. AC/DC input power can be converted according to demand using eight (: to::) (: converter, or DC to DC converter The DC power supply is supplied for operation of the solid state light source. Moreover, the device 200 can achieve intrusion protection standards, wherein the standards can be IP54, IP65, IP66, IP67, etc. Figure 6 shows an exemplary embodiment in accordance with the present invention. A front view of a solid state lighting device for use in a floodlight application. The solid state lighting device 3A includes - device 302. The substrate plane of the device 3〇2, or a plurality of planes, including the device, can be adjustably tilted to The desired angle is achieved to achieve the desired photometry, which may be in the range from 〇 to 360. The device 3〇2 comprises two power supply units 360. The device 302 described above is made of at least one thermally conductive metal sheet Wherein the thermally conductive metal sheet is selected from the group consisting of aluminum, iron, steel, copper, and combinations or alloys thereof. The apparatus is manufactured by a computer numerical control (CNC) process; the apparatus is characterized by: .  The entire body of the device 302 acts as a primary heat sink, with the way that the thickness of the device 302 (z-axis) is in the range from 2 to 6 mm such that the heat dissipation is at the maximum in the x, y coordinates of the lateral direction of the device. Design equipment; ii.  Used to prevent corrosion of the surname and scratch, in order to increase the thermal conductivity; iii.  One or more power supply units 36 of device 302, wherein power supply unit 360 provides the required DC or AC voltage to one or more solid state light sources; iv.  The optimized design is capable of having a maximum dispersion/projection in the desired region; 22 201111696 ν. Selectively combines the different lenses placed on the solid state illumination source 320 to achieve light dispersion/projection. The base plane of the solid state lighting device 300, a metal core printed circuit board (MCPCB) is mounted on the base plane of the device 302, and the selectively coated copper 368 (not shown) is lost to the substrate. A planar (primary heat extractor) 302 and MCPCB 318 are mounted, and an array of solid state light sources 32A are mounted on the MCPCB 318. The solid state light source 320 is covered with a protective transparent sheet 324. According to an embodiment of the invention, the material of the transparent sheet may be selected from the group consisting of glass and/or colorless polycarbonate. The solid-state, #光源 320 used in the solid-state lighting device 300 can be selected from the group consisting of high-power LEDs including LEDs, OLEDs, and PLEDs. The MCPCB 318 described above comprises three layers, namely an underlying layer, an intermediate (insulating) layer and a top layer (not shown). The bottom layer is composed of at least one thermally conductive material selected from the group consisting of: iron, steel, copper or a combination or alloy thereof. The bottom layer is attached to the mounting surface of the device. The intermediate layer is made of an insulating material and is used to conduct heat from the top layer of the MCPCB 318 and does not allow power to be conducted from the top layer to the bottom layer. The top layer consists of copper or any other metal that has better thermal and electrical conductivity than copper, such as gold-plated copper. At least one solid state light source 32 is mounted with a top layer of MCPCB 318. The power supply unit 360 is mounted _ inside the device 3〇2, and the solid-state lighting device 300 is easily accessible, wherein the power supply unit is an independent unit and can be replaced when it fails. The device 3〇2 is covered by a cover plate 328. The power supply unit 360 achieves a power factor of > 0·98 to reduce the reactive power. The required DC or AC voltage can be generated from an AC or DC input power source 23 201111696. The AC/DC input power source can be converted to a DC power supply for operation of the solid state lighting source using an AC to DC converter, or a DC to DC converter, as desired. 0, according to an exemplary embodiment of the present invention, the overlay 328 (display) Figure 7) is placed on the top side heat sink area of device 302 to protect it from any type of bird droppings and/or any other droppings. Figure 7 shows an isometric front view of a solid state lighting device for use in a floodlight application, in accordance with an exemplary embodiment of the present invention. Figure 8 shows an isometric front view of a solid state lighting device for use in a high mast application, in accordance with another exemplary embodiment of the present invention. The solid state lighting device 4 includes a device 402. Optionally, one or more slits 408 are selectively punched onto the device 402 to achieve additional heat dissipation and minimize resistance to wind. The slit 408 can have any shape on a demand basis. One or more planes, including the base plane of device 402, can be adjustably tilted to a desired angle to achieve the desired photometry; the angle can be in the range from 〇 to 360 degrees. The apparatus 402 described above is made of at least one thermally conductive metal sheet, wherein the thermally conductive metal sheet is selected from the group consisting of aluminum, iron, steel, copper, or a combination or alloy thereof. Device 402 is manufactured by a computer numerical control (CNC) process; the device is characterized by: i.  The entire body of device 402 acts as a primary heat sink, with the thickness (z-axis) of device 402 being located from the top. The device is designed in such a way that the heat dissipation is in the range of the x, y coordinates of the lateral direction of the device in the range of 5 to 6 mm; ii.  Used to prevent corrosion of the surname and scratch, in order to increase the thermal conductivity; 24 201111696 m. - or a plurality of power supply units 416 (not shown) are affixed to the inside of device 402 where power supply unit 416 provides the required Dc or AC voltage to one or more solid state illumination sources; iv.  The optimal design is capable of having maximum light dispersion/throwing in the desired area; v.  Optical dispersion/projection is selectively achieved by a combination of different lenses placed on solid state light source 420; vi.  The combination of the short range light throwing plane 456a and the long range light throwing plane 456b will achieve the desired photometry and coverage on the ground. At least one metal core printed circuit board (MCPCB) is mounted on the short range light throwing plane 456a and an array of solid state light source 420 is mounted on the MCPCB 418. A protective transparent sheet 424 (not shown) is employed to cover the solid state light source 420. According to an embodiment of the invention, the material of the transparent sheet may be selected from glass and/or colorless polycarbonate. The solid state light source 420 can be selected from the group consisting of high power LEDs including LEDs, OLEDs, and PLEDs. At least one metal core printed circuit board (MCPCB) 418 is mounted on the long range light throwing plane 456b and a high power solid state light source 420 (not shown) is mounted on the MCPCB 418 'where the lens 422 is mounted at high power The solid state light source 420 is placed to prevent light scattering in unwanted areas and thereby direct light into the desired area. The MCPCB 418 described above comprises three layers, namely a bottom layer, an intermediate (insulating) layer and a top layer (not shown). The bottom layer is composed of at least one thermally conductive material selected from the group consisting of aluminum, iron ' steel, copper or combinations or alloys thereof. 25 201111696 The bottom layer is attached to the mounting surface of the device. The intermediate layer is made of an insulating material and is used to conduct heat from the top layer of the MCPCB 418 and does not allow power to be conducted from the top layer to the bottom layer. The top layer consists of copper or any other metal that has better thermal and electrical conductivity than copper, such as copper. At least one solid state light source 420 is mounted with a top layer of MCPCB 418. A power supply unit 416 (not shown) is mounted inside the device 4〇2, and the solid state lighting device 400 is easily accessible, wherein the power supply unit 416 is a separate component and can be replaced in the event of a failure. Device 402 is covered by a cover 428 (shown in Figure 9). The power supply unit 416 reaches >0. A power factor of 98 is used to reduce the reactive power. The required DC or AC voltage can be generated from an AC or DC input source. The AC/DC input power supply can be converted to a Dc power supply for operation of the solid state light source using an AC to DC converter or a DC to DC converter as needed. A device engagement component 436 is a device that provides angular adjustment of the device 402 to adjust the photometry of the light on the ground, wherein the device engagement component 436 is attached to the device 402 with the pin 450 as an aid (shown in Figure 9). ). The device engagement member 436 is attached to the mast column via a hole 454 with the aid of a bolt. Moreover, the device 400 can meet the intrusion protection standard, and the standards can be IP65, IP66, and IP67. Figure 9 shows an isometric rear view of a solid state lighting device for use in a high mast application, in accordance with another exemplary embodiment of the present invention. Covering plate 428 is disposed on the top side of the heat dissipating region of device 402 to protect it from any type of bird droppings and/or any other dung, which will reduce the ability to dissipate heat from the top side heat dissipating region of device 4〇2. 26 201111696 A first perspective view shows an isometric front view of a solid state lighting device for use in an indoor downlight application, in accordance with an exemplary embodiment of the present invention. A durable, high energy efficiency, solid state lighting device has a customizable design wherein the device includes a device 502 with at least one mounting surface 504. The apparatus 502 described above is made of at least one thermally conductive metal sheet, wherein the thermally conductive metal sheet is selected from the group consisting of aluminum, iron, steel, copper, or a combination or alloy thereof. The device 502 is manufactured by a computer numerical control (CNC) process; the device is characterized by: i.  The entire body of device 502 acts as a primary heat sink with a maximum of x,y coordinates in the lateral direction of the device due to the thickness (z-axis) of device 502 being in the range from 〇·5 to 6 mm. Way to design equipment; ii.  Used to prevent corrosion and scratching anodization, thereby increasing thermal conductivity; iii. Power supply unit 516 (not shown) is attached to the opposite side of device 5 〇 2, where power supply unit 516 will be needed DC or AC voltage is provided to one or more solid state light sources; W. The optimized design is capable of having maximum light dispersion in the desired area; v. Mounting surface 504 can be bent to the desired tilt along a specified bend line to achieve the desired photometry. The base plane of device 502 supports the components of solid state lighting device 5〇〇. At least one metal core printed circuit board (MCPCB) 518 is mounted on the mounting surface 504 of the device 502 and at least one solid state light source 520 is mounted on the MCPCB 518. The solid state light source 52 can be selected from the group consisting of low power or high power LEDs including LEDs, OLEDs, and PLEDs. 27 201111696 A separate/common protective transparent or translucent sheet 524 (not shown) may be employed to cover the solid state light source 520 to prevent insects from entering the lighting device. According to an embodiment of the invention, the material of the protective transparent or translucent sheet 524 may be selected from the group consisting of glass filled, colorless polycarbonate or any other material. The MCPCB 518 described above comprises three layers, namely an underlying layer, an intermediate (insulating) layer and a top layer (not shown). The bottom layer is composed of at least one thermally conductive material selected from the group consisting of aluminum, iron, steel, copper or combinations or alloys thereof. The bottom layer is attached to the mounting surface of the device. The intermediate layer is made of an insulating material and is used to conduct heat from the top layer of the MCPCB 518 and does not allow power to be conducted from the top layer to the bottom layer. The top layer consists of copper or any other metal that has better thermal and electrical conductivity than steel, such as gold-plated copper. A top layer of the MCPCB 518 is mounted on at least one of the solid state light sources 520. A power supply unit 516 is mounted on the opposite side of the device 5〇2 in the protective cassette 528 (shown in Figure 11), and the solid state lighting unit 5 can be easily overhauled. The power supply unit 516 is a separate component and can be replaced when it fails. The power supply unit 516 achieves a power factor of > 〇 98 to reduce the reactive power. The required DC or AC voltage can be generated from an AC or DC turn-in power supply. The AC/DC input power supply can utilize an AC to DC converter or 〇 (: to 1) as needed (:: the converter is converted to a DC power supply for operation of the solid state light source 52A. Moreover, the device can All levels of intrusion protection criteria are achieved. Figure 11 shows an isometric rear view of a solid state lighting device for use in an indoor downlight application, in accordance with an exemplary embodiment of the present invention. Figure 12 shows an embodiment in accordance with the present invention. A cross-sectional view of a first level solid state lighting device having a thermal management system 28 201111696. A device as a primary heat sink 602 has a front side and a back side. On the front side, McpcB Mg is attached using a thermal interface 622 Further enhancing the heat dissipation; the underheater 626 is disposed on the back side of the main heat exhauster 6〇2 for the MCpCB 6丨8 to be exactly oppositely disposed. Alternatively, the secondary heat extractor 626 may also be installed in the main row. The heater 602 is on the side as shown in Fig. 12. The secondary heat extractor 626 can also be operated on both sides of the main heat extractor 602 on the basis of demand. Also, a well-designed clip 624 is used. 628 and isolation liner The 630 clamps the MCPCB 618 and the secondary heat extractor 626 to the primary heat extractor 6〇2 to achieve the desired intrusion protection. At least one solid state light source 62 is mounted on the MCpCB 6 i 8 . A cross-sectional view of an enhanced second level solid state lighting device having a thermal management system in accordance with another embodiment of the present invention is shown. A device as the primary heat extractor 702 has a front side and a back side, and the front side is a metallurgical cover / coated with copper metal 732 or any other metal conductor having a better thermal conductivity than copper, and this copper or any other metal is further plated by a suitable corrosion-resistant thermally conductive metal 734 (eg, TIN plating on copper) On the front side, the MCPCB 718 is attached using a thermal interface 722. To further enhance heat dissipation, the secondary heatsink 726 is present on the back side of the primary heat sink 702 for the exact relative placement of the MCPCB 718. The secondary heat exchanger 726 can also be mounted on the front side of the main heat extractor 7〇2, as shown in Fig. 13. And, in one embodiment, the secondary heat extractor 726 can also be based on the demand while being in the main row. The heater 702 operates on both sides. Moreover, a well-designed clip 724 is used to screw the MCPCB 718 and the secondary heat sink 726 to the main heat extractor 702 with screws 728 and spacer liners 73 to achieve the desired intrusion protection. A solid state light source 720 is mounted on the MCPCB 718. Figure 14 shows a cross-sectional view of an enhanced third level solid state lighting device having a thermal management system in accordance with an embodiment of the present invention. A large concentration of illumination sources is achieved in a minimum possible area of the device. A device as the first primary heat extractor 802 has a front side and a back side. On the front side, the MCPCB 818 is attached with a thermal interface 822 'multiple number of solid state light sources are mounted on the MCPCB 818, at which point a portion of the thermally isolated second primary heat extractor 83 is attached via the thermal interface 822 to The first main heat extractor 802. The first primary heatsink 802 on which the MCPCB 818 is mounted has all of the openings of the proper size proportional to the area of the MCPCB 818, so that a portion of the area of the MCPCB 818 is not in contact with the first primary heat extractor 802. A metallic thermal interface 832 is inserted into the cutout opening of the first primary heat handler 802; the metallic thermal interface 832 connects the region of the MCPCB 818 that is not connected to the first primary heat exchanger 802 via the thermal interface 822 to The second main heat extractor 83 is thermally isolated from the first main heat extractor 8〇2, thereby achieving a certain percentage of heat transfer from the MCPCB 818 to the second main heat extractor 830. A goal is achieved in which the solid state light source 82 is concentrated in a minimum possible area without concentrating heat on the area. The secondary heat exchanger 826 utilizes the thermal interface 822 to present an exact relative arrangement for the MCPCB 818 on the back side of the second primary heat sink 830. Moreover, the MCPCB 818 and the secondary heat exchanger 826 are respectively clamped to the first and second main heat exhaustors 30 201111696 802 and 830 by using a well-designed clip 824 with screws 828 and spacer 830 respectively, thereby achieving an invasion. protection. Figure 15 shows a cross-sectional view of an enhanced fourth level solid state lighting device with a thermal management system in accordance with another embodiment of the present invention. According to this embodiment of the invention, a large concentration of light sources is achieved in a minimum possible area of the device. A device as the first main heat extractor 9〇2 has a front side and a back side. On the front side, the MCPCB 918 is attached with a plurality of solid state light sources mounted on the MCPCB 918 by means of a thermal interface 922, in which case the second main heat extractor 930, which is completely thermally isolated, is passed through the thermal isolator 934 and/or the buffer space. Attached to the first main heat extractor 9〇2. The first primary heatsink 902 having the MCPCB 918 mounted thereon has a suitably sized cut-out opening that is proportional to the area of the MCPCB 918 such that a portion of the percentage area of the MCPCB 918 is not in direct contact with the first primary heat extractor 902. A metallic thermal interface 932 is inserted into the cutout opening of the first primary heat sink 902; the metallic thermal interface 932 connects the region of the MCPCB 918 that is not connected to the first primary heat exchanger 902 via the thermal interface 922 to a second primary heat vent 930 that is thermally isolated from the first primary heat vent 902 to thereby achieve a solid state transfer of a specified percentage of heat from the MCPCB 918 to the second primary heat ejector 930 The light source 920 concentrates on a minimum possible area without the purpose of concentrating heat on the area. The secondary heat exchanger 926 is disposed opposite the MCPCB 918 on the back side of the second primary heat sink 930 using the thermal interface 922. Moreover, the MCPCB 918 and the secondary heat extractor 926 are clamped to the first and second main heat exhausters 902 and 903 by screws 928 and spacer 938, respectively, using a well-designed clip 924, thereby achieving the desired Intrusion protection. 31 201111696 In one embodiment, the apparatus for mounting the solid state lighting source of the present invention is manufactured by a computer numerical control process (CNC). The CNC process provides precision and consumes less time and power for the design of the device. Moreover, CNC processes enable producers to significantly increase productivity and quickly adapt to changes in equipment design to create custom lighting. This CNC process produces a high level of productivity, so that products can be burdened by a larger segment of society in a short period of time, helping to ensure that we are fighting the global warming threat in a shorter period of time. The CNC machine uses an AC servo motor to drive the hammer (except for the hydraulic power supply and cooler p CNC process benefits are as follows: a) The power consumption is less than half of the similar hydraulic machine b) Higher positioning speed improves productivity Space-saving design saves the cost of valuable floor space d) Provides significantly faster stamping speed than mechanical turrets e) Brush table design provides no-scratch treatment, and also minimizes noise during stamping f) Free standing PC-based network CNC control system allows for flexible layout g) immediate access to component programs, multimedia system for file and production scheduling h) Powerful vacuum pellet pull system for physically eliminating pellets QUESTION OF THE INVENTION The present invention utilizes a CNC process as a core manufacturing process for a complete body for the production of high thermal efficiency equipment wherein the thickness of the apparatus is optimized to achieve a maximum thermal conductivity. One of the main advantages that can be achieved with the CNC process is the elimination of the investment required to make the stamp (which is required for die casting components). In order to create a number of different components that are part of the equipment, the process family needs to produce a variety of different die castings and the amount of financial investment will become unreasonable. In a preferred embodiment, the solid state lighting device of the present invention is manufactured by a CNC process that provides a degree of flexibility to adapt the design to the needs without unnecessarily investing in generating casting molds and stamps for extrusion. . It may have a high degree of customization. Another benefit of the CNC process is that it utilizes almost 100% of the metal sheets (raw materials) that are fed into the CNC machine in some cases. Therefore, the waste that is left is minimal and recyclable, and is different from the hard-to-recycle waste of a casting process. In another embodiment, the thickness of the metal sheet that is fed into the CNC machine to produce the illumination device is optimized to achieve the maximum possible thermal conductivity. The equipment of the above devices is manufactured by a CNC process comprising the following steps: a.  Selecting a metal sheet, wherein the metal sheet may be selected from the group consisting of aluminum, iron, steel, copper or a combination or alloy thereof; b.  The metal piece is inserted into a CNC machine, wherein the programmed instructions enable the processor in the C N C machine to stamp the metal piece and c. according to the design fed by one or more devices.  The CNC machine is used to selectively bend the stamped equipment in one or more places. A method for manufacturing a durable, high energy efficiency, solid state illumination device having a custom design comprising the following steps: a.  Feeding at least one design of the device to a CNC machine with the same piece of metal; b.  Stamping a sheet of metal in accordance with the design to achieve one or more devices; c.  Optionally bending the stamped device in one or more places; d.  Anode the device to achieve a non-corrosive and scratched surface; e.  Secure the nut/insert/rivet nut (hardware) to the device; f.  Mounting at least one metal core printed circuit board (MCPCB) on which at least one solid state light source has been mounted on the device; and g.  One or more power supply units are mounted in a housing of the device. The method further includes placing the second primary heat sink on the rear side of the device with a thermal insulation sheet and/or a buffer interval and through a metallic thermal interface and through a cut-out opening disposed in the first primary heat sink The isolator heats at least one solid-state illumination source from the Mcpc B mounted on the first main heat-dissipator to the second main heat-dissipator; selectively places the coated copper on the main heat-dissipator Between the MCPCB and the MCPCB, wherein the coated layer may further have - a component for preventing the immersion; and mounting _ or a plurality of heat dissipating panels (secondary heat extractors) on the front or the opposite side of the device.

The progressive means includes selectively mounting a light sensor component and/or a motion sensor on the rear/front side of the device; selectively mounting one or more lenses to - or a plurality of solid state systems Selectively cover—or multiple solid-state light sources—or multiple protective transparent or translucent sheets and selectively place—or multiple layers of thermal interface materials in the main (four) heat exchanger and McpcB 34 201111696 cum main row Between the heat exchanger and the secondary heat exchanger and two or more secondary heat exchangers. Test Results and Experimental Data Example 1 The specifications for solid-state lighting devices used in streetlight applications are as follows: Model SL001A032 AL SL001B 036 AL SL001C040 AL SL001D48 AL Parameter input voltage 85-265 VAC Frequency range 47-63 Hz Power factor >0.98 Total Harmonic Distortion (THD) <15% Power Efficiency 85% LED Consumption 32W 36W 40W 48W Total Power Consumption 37W 42W 46W 56W LED Brightness Efficiency 112 lm/w to 130 lm/w Color Temperature (CCT) Ultra White: 6500K Color Index (CRI) 0.8 Light source 1 watt LED Maximum light intensity angle 120 degree horizontal axis; 70 degree vertical axis junction temperature (Tj) 60 °C + 10% (Ta = 25 °C) / 140 °F ± 10% (Ta=77〇F) Operating temperature -40°C to +55°C/-40°F to 131°F Operating humidity 10% to 90% RH Working oddity> 50,000 hours Lamp housing material Aluminum dimension (mm 435(L)x453(W) x84(H) 435(L)x453(W) x84(H) 435(L)x453(W) x84(H) 435(L)x453(W) x84(H) Net weight 4.5Kg 4.5Kg 5.5Kg 5.5Kg IP rating ΙΡ65/ΓΡ66/ΙΡ67 35 201111696 Features and advantages of solid-state lighting devices for shed light applications and floodlight applications and street lighting applications The same thing is that there is no twist-lock photocell for automatic ΟΝ/OFF and it has all the other features and advantages of solid state lighting for streetlight applications. The following table shows the comparison between high pressure sodium lamps (HPS) and the solid state lighting devices used in streetlight applications of the present invention: Project high pressure sodium lamp LED street light metering performance is poor: horse a round lamp, generating lumens $2/3 via reflection The device falls on the ground causing a lower lux (luxj. It also has a lower color temperature. This leads to poor visibility and a dark neighborhood between the two. The high-efficiency LED driver supports the excellent taxi system to ensure the light of the sentence Decentralized service center focus. Excellent metering performance. Radiator performance is poor: HPS lamps generate more than 572F. HPS chromatograms generate UV/red ring radiation · _竽艮, (LED chromatography does not radiate UV $ ' no infrared Radiation, no heat, and no radiation.) Electrical efficiency is small: South loss 'low power factor, high distortion 馒艮: high power ^ factor system to eliminate loss, low distortion < Short life (<5,000 hours) Very good (> 50,000 hours) Operating voltage range is narrow (±7%) Width (±45%) Power consumption is very low (80% to 90% power saving) Starting speed is quite slow (exceed 10 minutes) Immediately stroboscopic (power supply) AC drive DC drive is low in optical efficiency (<60%) (>90%) Color index/differentiation feature is poorly constructed, Ra<35 (object color looks dim, Uninteresting and bad) 'Ra>8〇(The object color is fresh, clearly identifiable and has a cool table) The color temperature is quite low (yellow or amber, dull) 2000K ideal color temperature between 5500 and 6500kK cold white glare strong glare Glare (cold and comfortable) Light pollution ^ High pollution & Contamination heat generation is high (>572 °F) Cold light source (<140°1 〇 lampshade turns dark High vacuuming easily changes lamp shade color# Electricity does not accumulate dust Lamps keep fresh lampshade aging turn yellow report fast need no lampshade shockproof performance error / gasoline pollution no pollution maintenance cost is high 'frequent replacement of lamps, rectifier circuit and cleaning / removal of dead insects from the lampshade is very low, LED life> 50,000 hours The kED spectrum will drive out insects, and the luminaires will always look like the size of the product. The cost-effective maintenance and high power consumption make HPS With more than 10 years of expensive proposals, very low dimensionality and low power consumption make ^ED a cost-effective lighting solution. Switching to solar street lights is not likely to be possible. Overall poor performance 36 201111696 Example 2 The following table shows high pressure sodium lamps Cost analysis and energy savings comparison between (HPS) and solid state lighting devices used in streetlight applications of the present invention: 250 watt HPS street light vs. 68 watt solid state street light. Light source/project HPSV street light LED street light with attached light source (Watt) 250 68 Power consumption lamp power consumption (8) (Watt) 250 76.16 Electrical distribution (b) (Watt) Rectifier based SMPS-based switching power 0 11.424 Comprehensive cable loss (6%)(c)(Watt) 15 4.5696 International Standard: 5% Transformer Loss (3%) (9) (Watt) 7.5 2.2848 The lowest level for 100KVA transformer is 3% Reactive Power Compensation (e) (PF) 0.7 Power consumption of 0.997 subtotal luminaires 0) (Watt) 389.286 (a+b+c+d)/(e)=f 94.72 (a+b+c+d)/(e)=f 12 Consumption per ton (Kwh) 4.67 1.137 (=f/1000x above) Calculated in hours of daily use 10 years of consumption (subtotal) (Kwh) 17050.71429 4148.848465 10 years of power savings (Kwh) 12901.86582 Percentage of energy savings 75.67 *Saving savings not considered , * did not consider the surplus through the carbon credit. Example 3 150 watt HPS street light vs. 48 watt solid state street light. 37 201111696 Light source/project HPSV street light LED street light with attached light source (Watt) 150 48 Power consumption lamp power consumption (a) (Watt) 150 53.76 Electrical distribution (b) (W) Rectifier based SMPS-based switching power 0 8.064 Full Cable loss (6%Kc) (Watt) 9 3,2256 International standard: 5% Transformer loss (3%) (d) (Watt) 4.5 1.6128 For the 100KVA transformer, the lowest level is 3% Reactive power compensation ( e) (PF) 0.7 0.997 Subtotal luminaire power consumption (0 (Watt) 233.571 (a+b+c+d)/(e)=f 66.86 (a+b+c+d)/(e)=f 12 Consumption per ton (Kwh) 2.80 0.802 (=t/1000x above) Calculated by the number of hours of daily use 1 year of consumption (subtotal) (Kwh) 17050.71429 2928.598917 10 years of power savings (Kwh) - 7301.829655 Energy saving Percentage 71.37 *The maintenance savings are not considered, *The surplus through the carbon credit is not considered. Example 4 The experimental results performed on the flux distribution in the up and down directions are as follows. Watt LED street lighting fixture: shaped and machined case , colorless glass envelops. Lamps: 62 white LEDs - 60 with colorless plastic optics and 2 with colorless glass optics located below the LED power supply: one SSL/DR/01/80W Electrical value: 120.0VAC, 0.7302 A, 87.53W, PF=0.999 38 201111696 Lighting Effectiveness: 64.3 lumens/watt Please note: This test is performed using a calibrated photodetector method with absolute photometry* * Calibrated optical detection using absolute photometry The detector method is used to obtain the data. A UDT model #211 photodetector and udt model #S370 dynamometer combination are used as the standard. Based on the spectral responsivity of the photodetector and the spectral power distribution of the test subject. Use a spectrum mismatch correction factor. Flux distribution lumens down to the total house side 2397.72 0.01 2397.73 Street side 3218.86 15.85 3234.71 Total 5616.58 15.86 5632.44 Example 5 Lighting equipment test specifications and report catalog number: 68 watt LED street lighting: Extruded and machined aluminum housing with colorless glass surround. Lamps: 62 white LEDs - 60 with colorless plastic optics and 2 with colorless glass optics. LED Power Supply: One SSL/DR/01/80W Lighting Effectiveness: 66.0 lumens/watt Other details are shown in Figures 16 and 17. 39 201111696

Luminaire Lighting Lumens Lumens Front Light 3219 57.1 FL (0° to 30°) 773 13.7 FM (30° to 60°) 1647 29.2 FH (60° to 80°) 688 12.2 FVH (80° to 90°) 111 2.0 Backlight 2398 42.6 BL (0° to 30°) 847 15.0 BM (30 to 60.) 1217 21.6 BH (60° to 80°) 326 5.8 BVH (80° to 90°) 9 0.2 Polishing 16 0.3 UL (90 ° to 100.) 16 0.3 UH (100. to 180.) 0 0.0

Trapped light ΝΑ NA

Example 6 A Another experiment performed showed a comparison of the luminous efficiency of a 20 watt LED lighting device and a 40 watt tube lamp at different angles.

20 watt LED street light with 40 watt tube light matching angle 3 meters distance 6 meters distance 10 meters distance 3 meters distance 6 meters distance 10 meters distance straight line connection 14 lux (lux) 7 lux 3 lux 6 lux 3 lux 1 lux 45 degree with 11 lux 7 lux 3 lux NA NA NA 90 degree with 11 lux 7 lux 3 lux NA NA NA 40 201111696

Another experiment performed in Example 6B shows a comparison of the luminous efficiency of a 45 watt LED lighting device and a 250 watt sodium lamp at different angles. 45 watt LED street light with 250 watt sodium lamp with angle 3 meters distance 6 meters distance 10 meters distance 3 meters distance 6 meters distance 10 meters distance straight line connection 26 lux (lux) 17 lux 6 lux 22 Lux 13 Lux 6 Lux 45 degrees with 26 Lux 14 Lux 5 Lux 6 Lux 13 Lux 5 Lux 90 degrees with 10 Lux 8 Lux 3 Lux 6 Lux 5 Lux Financial Benefits: 1. 67% to 72% power saving. 2. Minimum maintenance cost. It has been estimated that if LED street lights are implemented in all parts of the world, the benefits will be as follows: 1) Power saving 1. 9χ1〇2〇 Joule 2) Significantly reduce power consumption 3) Financial savings of 1.83 trillion 4) Preventing the environment Increasing 10.68 billion Gigaton carbon dioxide 5) The electricity generated by about 280 power generation centers used in lighting streetlights can be used for other purposes. Example 7 performs another f蟀, which shows the comparison of the high pressure sodium lamp (HPS) and our solid state sensing device. 41 201111696 Model 48 watt LED street light vs. 255 HP sodium vapor lamp reference test procedure T-EQP/035 Test facility used: Name Manufacturer / Model SI. Number 1) Single and three phase analyzer Infratek ) /106A_3/0.05 01054012 2) Power quality analyzer Fluke / 434 DM910008 3) Digital illuminator Yogogawa / 510 02 020191 Test result number Test parameter Test method / requirement observation 1 Power consumption when LED When the lamp is operated with a rated voltage of 230 volts AC and a rated frequency of 50 Hz, the total power consumption will be measured at 50.04 watts. 2 The input power factor will be measured at a rated voltage of 230 volts AC and a nominal frequency of 50 Hz. The input power factor is 0.997. 3 Input voltage range when the LED light is The input voltage range from minimum to maximum operating range will be measured at approximately 5 sag heights and output lux 45 volts - 200 lux 96 volts - 550 lux 230 volts - 560 lux 263 volts - 560 lux 4 distortion level (input current) Total harmonic distortion) When the LED lamp is operated at its rated voltage of 230 volts AC and rated frequency 50 Hz, Measuring the total harmonic distortion of the input current 18.2% No. Test parameter test method / requirement observation 1 Power consumption When the HPS lamp is operated with a rated voltage of 230 volts AC and a rated frequency of 5 Hz, the total power consumption of the wave is 255 watts 2 input power Factor Jiang at rated voltage 23 volts AC and rated frequency 50 Hz measurement input 4 rate factor 0.395 3 Input voltage range When the HPS lamp is operated with an input voltage range from the minimum to the maximum operating range, the output will be measured at approximately 5 呎 height Lux 183 volts - 326 lux 230 volts - 1800 lux 258 volts - 2600 lux 4 distortion level (total harmonic distortion of the input current) ^HPS lamp will measure input when its rated voltage is 30 volts AC and rated frequency 50Hz operation The total harmonic distortion of the current is 13.0%. Example 8 Another field installation experimental data is as follows: 42 201111696 Voltage: 120 Installation data location SL# Existing G Fix. Type G load only G Fc RPL FIX. Type POST RPL load POST~~ RPLFc Sidney St. 31442 150 watt HPS 2.63a 2.43 48 watt LED 0.52a 3.33 Sidney St. 21592 150 watt HPS 2.58a 2.14 48 watt LED 0.52a 2.62 Sidney St. 25339 150 watt HPS 2.10a 2.76 48 watt LED 0.52a 2.63 Solid state lighting system of the present invention Can be used in, but not limited to, stand-alone lighting applications, industrial indoor lighting applications, indoor consumer and commercial applications, street lighting applications, floodlight applications, high mast applications, competition venues and other public spaces such as airport equivalents and Customized. The foregoing description has been provided with reference to various embodiments of the invention. Those skilled in the art will appreciate that alternatives and variations of the described apparatus and methods of operation may be made without departing from the spirit, scope and scope of the invention. Advantages of the Invention The solid-state lighting device of the proposed invention has the following advantages: a) Helps to save power. b) High input power factor (0·98) is exempt from electrical losses. Low spectral distortion (referred to as <15%): Eliminates cable heating due to spectral distortion of the high level of the lamp. ...High Color Rendering Index (CRIM80): The white (four) street light of the present invention. This increases nighttime security and also has a more (four) video image from the security camera system. 43 201111696 e) Long life (> 50,000 hours): Although most of the conventional gas discharge lamps can be used for 5,000 hours, the LED street lamps of the present invention have an average life length of more than 50,000 hours. f) Low heat emission and ultra-low carbon footprint: There is an urgent need to reduce the carbon footprint. The decades to come are critical to the survival of the planet. The introduction and implementation of high energy efficiency projects is an absolutely necessary mission. More than 80% of energy can be saved by introducing LEDs into the field of illumination. The light seen has produced a lot of heat', so the air conditioner is subjected to more load and the compressor is operated for a longer period of time. LEDs help to reduce heat and thus save the air conditioner's operating time. In turn, grounding in the middle of this case saves energy (indoor applications). g) Environmentally friendly and recognized green technology: The LED street light of the present invention is environmentally friendly from the selection of raw materials, the manufacturing process, the energy-saving function on the components, and the long life, and 99% of the equipment can be after the length of life. Be recycled. The LED lamp system is recognized worldwide as a green technology product. h) No light pollution: Since the LED street lamp of the present invention can be precisely guided, 'light pollution is extremely small. This not only helps astronomers observe the night sky, but also protects many animals and human health, and i) insect friendliness: since the LED street lamp of the present invention does not attract many nocturnal insects, almost no insects die in the lamp. It also significantly reduces cleaning and maintenance costs. j) The end of life cycle has a significant waste value k) A fusion operation is achieved to minimize the disruption of the metal particle structure. 44 201111696 [Simultaneous Description of the Drawings] Fig. 1 shows a front view of a solid state lighting device for use in a streetlight application according to an exemplary embodiment of the present invention; Fig. 2 shows a use according to an exemplary embodiment of the present invention. A rear view of a solid state lighting device for a streetlight application; FIG. 3 shows an isometric front view of a solid state lighting device for a streetlight application in accordance with an exemplary embodiment of the present invention; FIG. 4 shows another exemplary implementation in accordance with the present invention. A top view of a solid state lighting device for use in a bay light application; FIG. 5 is a bottom plan view of a solid state lighting device for use in a bezel light application in accordance with another exemplary embodiment of the present invention; A top view of a solid state lighting device for use in a ceiling light application in accordance with another exemplary embodiment of the present invention; FIG. 7 illustrates a solid state lighting device for use in a flood light application, in accordance with an exemplary embodiment of the present invention. An isometric front view; Figure 8 shows an isometric front of a solid state lighting device for use in a High Mast application in accordance with another exemplary embodiment of the present invention. Figure 9 shows an isometric rear view of a solid state lighting device for use in a high mast application in accordance with another exemplary embodiment of the present invention; Figure 10 shows an indoor downlight used in accordance with an exemplary embodiment of the present invention. (Indoor down light) isometric front view of a solid state lighting device; Figure 11 shows an isometric rear view of a solid state lighting device for indoor downlight applications in accordance with an exemplary embodiment of the present invention; 45 201111696 12th The figure shows a transverse brake view of a HI state lighting device having a first level thermal management system according to an embodiment of the invention. FIG. 13 shows a heat having an enhanced first level according to another embodiment of the present invention. (4) view of a solid state lighting device of a management system, FIG. 14 shows a cross-sectional view of a solid state lighting device having an enhanced second level thermal management system in accordance with an embodiment of the present invention. FIG. 15 shows another A (four) view of a solid state lighting device with an enhanced (four) level thermal management system of the embodiment 'Figure 16 shows an IES LM 79-08 according to solid state lighting equipment Optical and electrical experimental data; Figure 17 shows the flux distribution map based on solid-state lighting devices based on _A «' system [main component symbol description 100,200,300,400,500...solid state lighting devices 102,202,302,402,502...device 104,504...installation Surface 104a.··Left mounting surface 104b...Right mounting surface 108,208,408...Slit 110... Hole 112, 212···Fin 114... Housing 116, 216, 360, 416, 516 ... Power supply unit 118, 218, 318, 418, 518, 618, 718, 8 18, 918... Metal core printed circuit board (MCPCB) 120... Highly intense solid state light source 122...lens 124,324,424...protective transparent sheet 126,226...heat sink panel, secondary heat sink 128...metal cover 134...light sensor component 136,436._·device joint component 138"*c - passage 168, 268, 368... coated steel 46 201111696 172... motion sensor component 174... timer 220, 320, 420, 520, 620 ... solid state light source 224... transparent sheet 250, 628, 728, 828, 928 ... screw 256a, 256b... connecting member 258... hook 270 · · · thermal interface Material 328, 428... cover plate 450···pin 456a... short range light throwing 456b...long range light throwing plane 524...protective transparent or translucent sheet 528···protective box with heat extractor 602,702...main heat extractor 622,722,822,922...heat interface 624,724,824,924 ...clamp 626,726,826,926...secondary heat extractor 630,730,830,938···Isolation pad 732...copper metal 734...corrosion-proof heat-conducting metal 802,902...first main heat extractor 830,930."second main heat extractor 832,932...metal thermal interface 934.··thermal isolator 47

Claims (1)

201111696 VII. Patent application scope: 1. A durable, high energy efficiency, solid state lighting device comprising: a device having a mounting surface, the device being made of a thermally conductive metal sheet, the device further configured as a row of heat Where the apparatus has a thickness of between 0.5 and 6.0 mm; an anodized coating covering the apparatus, the anodized coating being configured to prevent corrosion and increase thermal conductivity; a metal core printed circuit board (MCPCB) mounted on the mounting surface; a power supply unit enclosed in a housing in the apparatus, the power supply unit configured to generate an output voltage; A solid state light source mounted on the MCPCB coupled to the power supply unit. 2. The illumination device of claim 1, further comprising a coated layer of copper disposed between the device and the MCPCB, wherein the coated layer is configured to prevent corrosion. 3. The lighting device of claim 1, wherein the output voltage is generated from an AC or DC input power source. 4. The lighting device of claim 1, further comprising at least one heat dissipating panel mounted on the device, the panel being configured as a primary heat dissipator, wherein the panel is selected from the group consisting of aluminum and iron Made of a thermally conductive material of at least one of a combination of steel, copper, and copper. 5. The illuminating device of claim 1, wherein the mounting surface comprises a hole configured to provide heat dissipation and wind resistance. 48 201111696 6. The illuminating device of claim 4, wherein the panel comprises a hole '3" hole structure to provide heat dissipation and wind resistance. 7. The illuminating device of claim 3, wherein the device comprises a base plane having an adjustable slope. 8. The illumination device of claim 3, further comprising a light sensor coupled to the input power source or the power supply unit, the light sensing system configured to selectively control the solid state light source The power is delivered. 9. The illumination device of claim 3, further comprising a motion sensor coupled to the input power source or the power supply unit, the motion sensor configured to selectively control illumination for the solid state Source power delivery. 10. The illuminating device of claim 2, further comprising a lens mounted on the solid state light source, the lens is configured to focus light output from the solid state light source, and the lens is further configured as Prevent light scattering. 11. The illumination device of claim i, further comprising a protective transparent sheet covering the solid state light source, the sheet being made of glass or plastic. 12. The illumination device of claim i, wherein the solid state light source is an LED, an OLED, or a PLED. 13. The lighting device of claim 1, wherein the lighting device is configured to achieve an entry protection standard. 14. The lighting device of claim 3, wherein the power supply unit 49 201111696 is configured to achieve a power factor greater than 0.98. 15. The lighting device of claim 1, wherein the thermally conductive metal sheet is sinter, iron, steel, or copper. 16. The illumination device of claim 1, wherein a thermal interface material is placed between the device and the MCPCB. 17. A durable, high energy efficiency, solid state lighting device comprising: a device having a mounting surface, the device being fabricated from a first thermally conductive metal sheet fabricated from a computer numerical control process, the device further As a first heat extractor, wherein the apparatus has a thickness of between 0.5 and 6.0 mm; an anodized coating covering the apparatus, the anodized coating system Constructed to prevent corrosion and increase thermal conductivity; a metal core printed circuit board (MCPCB) mounted on the mounting surface; a power supply unit surrounded by a housing in the device, the power supply unit Constructing to generate an output voltage; a solid state light source mounted on the MCPCB, the solid state light source coupled to the power supply unit; and a second heat sink disposed on the device, the second row The heat engine is configured to dissipate heat from the solid state light source. 18. A method for manufacturing a durable, high energy efficient, solid state lighting device comprising the steps of: receiving a device design and a metal sheet in a computer numerically controlled process tool, 50 201111696 using the tool to stamp according to the device design The metal sheet is bent by the machine; an anodized coating is applied to the metal sheet; a metal core printed circuit board (MCPCB) having a solid state light source is applied to the metal sheet; and the mounting A power supply unit to the metal sheet. The step to the metal sheet. Copper between the metal sheet and the MCPCB further includes the step of applying a layer. 51