TW201109158A - Method for manufacturing micro/nano three-dimensional structure - Google Patents

Abstract

A method for manufacturing a micro/nano three-dimensional structure comprising the following steps is described. A moldis provided, and a pattern structure comprising a plurality of convex portions and a plurality of concave portions is set in a surface of the mold. A transfer material layer including a first portion on the convex portions and a second portion on the concave portions is formed. A flexible substrate is disposed on the mold, wherein a surface of the flexible substrate contacts with the first portion of the transfer material layer. A heating step is performed to partially heat the flexible substrate through the first portion of the transfer material layer. A pressure is applied on the flexible substrate to make the first portion of the transfer material layer be adhered to or be pressed into the surface of the flexible substrate. The mold is removed. An etching step is performed on the flexible substrate by using the first portion of the transfer material layer as a mask to form a micro/nano three-dimensional structure in the surface of the flexible substrate.

Description

201109158 VI. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a micro-printing process, and in particular to a process for transferring a micro-nano structure by a micro/nano method. The use of micro-nano transfer technology [prior art] With the size of electronic components 曰 κ _ is facing a serious test. In the current electronic components, the pattern definition of two pieces is also used in optical lithography technology for component feature patterns. Optical diffraction _ limit, optical "彡 technology can be set.", is limited by also severely limited. ^ Jin this pattern of feature size in view of this, developed in recent years (Micro / Nano-impriming Technology) Has been printed technology can be super: And, the traditional micro-nano first learn micro-shadow system 7. In the currently developed imprint technology, contact two-print technology is a recent common imprint technology. The transfer material layer is disposed on the pattern structure of the mold core: == The pattern structure is relatively pressed so that the layer of the P material on the convex portion of the pattern structure is bonded to the surface of the substrate, and then the layer of the transfer material layer is heated. The adhesion material layer on the convex portion of the mold pattern structure is transferred to the surface of the substrate by increasing the adhesion between the transfer material layer on the convex portion of the mold core and the surface of the substrate, and then removing the mold core. However, the transfer of the micro-nano pattern is completed. However, the size of the transfer pattern is actually reduced to the micro-nano ruler 201109158: the height difference between the convex portions of the pattern structure of the figure macro 35 will be greatly reduced on the plate. Uniformity, accuracy, and reliability of shifting. Especially for flexible bases, the micro-nano pattern must overcome the temperature of the flexible substrate and the two-dimensional or flexible substrate in the optical lithography process. At the time of development, the substrate is damaged by the etching.

吉吉^This i need a novel and simple micro-nano pattern transfer technology, uniform, due to the difference in the pattern structure of the mold, the pattern transfer process can be; accuracy, reliability and success rate The negative effects, at the same time, make micro-nano patterns on the flexible substrate, thermal deformation due to temperature or substrate damage caused by development and chemical etching. SUMMARY OF THE INVENTION Accordingly, one aspect of the present invention provides a method for fabricating a micro-nanoscopic structure in which a transfer layer having a micro-nano pattern can be transferred to a flexible state by direct contact imprint technique. On the substrate, the transfer layer can be used to cover the etched flexible substrate, and the micro-nano structure can be formed smoothly on the flexible substrate. According to the above embodiments, another aspect of the present invention provides a method for manufacturing a microscopic three-dimensional structure, which can be transferred by using a transfer layer transferred onto a flexible substrate as an etching mask. A mask is formed in addition to the portion not covered by the transfer layer, and the mask can be used as a mask for the electron beam lithography process or a mask required for forming a micro-nano pattern by vapor deposition. Another aspect of the present invention provides a method of fabricating a microscopic three-dimensional structure which can be used to press and mold a 201109158 core and a flexible substrate by means of a roll or a uniform pressure. Therefore, there may be a difference in height between the contact surfaces, which solves the reliability of the transfer process of the mold core and the flexible substrate, thereby facilitating the problem of the degree of sentence, and improving the transfer to the flexibility. On the substrate. The printing process of the micro-nano pattern in accordance with another aspect of the invention is a method for making a micro-nano structure in connection with &#,,#·, ^, which can utilize lifting (Lift-〇 flexibility) Formed in the recessed portion of the three-dimensional structure of the substrate; = layer =

By using the further transfer layer as an etch mask, the convex shape of the three-dimensional structure is removed and the micro-nano structure complementary to the pattern of the mold core can be smoothly formed. The re-state of the present invention provides a method for manufacturing a micro-nanoscopic three-dimensional structure, which locally contacts a rich flexible substrate to effectively solve the thermal deformation of the substrate due to temperature, and further utilizes a transfer system (four) micro-nano The pattern is smoothly transferred to the flexible substrate.

According to the above object of the present invention, a method of manufacturing a micro-nanoscopic structure is proposed, which comprises the following steps. A mold core is provided, wherein the mold core has a first surface and a second surface, and the first surface is provided with a pattern structure comprising a plurality of first convex portions and a plurality of first concave portions. The anti-adhesion layer is selectively formed on the first surface of the mold core according to the anti-adhesion property of the surface of the mold core, and then the transfer material layer is formed, wherein the transfer material layer comprises the first portion located at the first convex shape The portion and the second portion are located on the first recess. A flexible substrate is disposed on the mold core, wherein the flexible substrate has opposing first and second surfaces, and the first surface of the flexible substrate is in contact with the first portion of the transfer material layer. A heating step is performed from the second surface of the mold core to locally heat the flexible substrate via the first portion of the transfer material layer. Pressure is applied to the second surface of the flexible substrate such that the first portion of the transfer material 201109158 is adhered or pressed onto the first surface of the flexible substrate. Remove the mold kernel. The first substrate of the transfer material layer is used as a mask, and the flexible substrate is subjected to an etching step to form a first micro-nano structure in the first surface of the flexible substrate. According to a preferred embodiment of the present invention, the method for fabricating the above-described microscopic three-dimensional structure further comprises the following steps after the etching step. A mask layer is formed, wherein the mask layer comprises a first portion on the first portion of the transfer material layer and a second portion on the plurality of second recess portions of the first micro-nano structure. A lift-off step is performed to remove the first portion of the transfer material layer and the first portion of the mask layer. With the first portion of the mask layer as a mask, another etching step is performed to remove the flexible substrate that is not covered by the mask layer to form a second micro-nano structure. [Embodiment] Referring to Figures 1 to 7, there is shown a process cross-sectional view of a micro-nanoscopic structure according to an embodiment of the present invention. In the present embodiment, when the microscopic three-dimensional structure is formed, the mold core for transfer can be provided first, wherein the mold core 100 has opposing surfaces 102 and 104. As shown in Fig. 1, the surface 102 of the mold core 100 is preliminarily provided with a pattern structure 110 to be transferred, wherein the pattern structure 110 includes a plurality of convex portions 108 and a plurality of concave portions 106. In the present invention, the pattern size of the pattern structure 110 is preferably on the order of micrometers or nanometers. In an embodiment, the material of the mold core 100 can be, for example, Si Xi (Si), polymer series materials, organic materials, plastic materials, semiconductor materials, metal materials, quartz, glass materials, ceramic materials, An inorganic material, or a material synthesized by any one or both of the above materials, 201109158. Next, as shown in Figure 2, optional

For example, the fluorine-containing polymer (PGlymer) having an anti-sticking effect, the example material, ', can selectively utilize, for example, a hot-steamed adhesive layer 112, wherein the anti-adhesion film layer structure 110 is used. The material of another embodiment itself has anti-adhesive properties, and the material of the above-described anti-adhesive mold core 100 may be additionally provided, for example, without the need for the surface layer 112 of the mold core 100. In another embodiment, any one or both of a metal, an inorganic material, a p〇lymer series material, a ceramic material, a semiconductor material, an organic material or the above materials having an anti-sticking effect The materials synthesized above. In one example, the anti-adhesive fluoropolymer series material may be ethylene tetrafluoroethylene, such as the uterus-tetrafluoroethylene hydrazine produced by DuPont. Copolymer. Next, a transfer material layer 114 is formed on the anti-adhesion film layer 112 by, for example, hot steam or electron beam evaporation, or chemical vapor deposition or physical vapor deposition, in conjunction with general pattern definition techniques. As recalled in Fig. 2, the transfer material layer 114 includes two portions 114a and 114b. Wherein, a portion 114a of the transfer material layer 114 covers the anti-adhesion layer 112 in the recess portion 1〇6 of the pattern structure 11〇, and a portion 114b of the transfer material layer 114 covers the convex portion of the pattern structure 110. The top of the 108 is on the anti-adhesion layer 112. In some embodiments, the transfer material layer 114 can be directly overlaid on the pattern structure I10 of the mold core when the material of the mold core 100 itself has anti-stick properties. Wherein, the portion 114a of the transfer material layer U4 directly covers the bottom surface of the recess portion 106 of the pattern structure 110, and the other portion 114b of the transfer material 201109158' layer 114 directly covers the top of the convex portion 108 of the pattern structure 110. On the surface. The material of the transfer material layer 114 has a large etch selectivity ratio between the material of the subsequently provided flexible substrate 116 (please refer to Figure 3 first). The material of the transfer material layer 114 may generally be, for example, an inorganic material ceramic material, a metal material, a polymer material series, an organic material, a plastic material, a semiconductor material, or both or both of the above materials. The materials synthesized above. In one embodiment, the material of the transfer material layer 114 can be, for example, a metal such as chromium (Cr) metal. • The embossing portion 108 of the mold core 100 can be placed in the subsequent transfer process by the setting of the anti-adhesion film layer U2 or by the use of the material itself to have the anti-adhesive property of the mold core 1〇〇. The portion 114b of the transfer material layer 114 is smoothly separated from the convex portion of the mold core 1〇〇. Next, a flexible substrate 116 is provided. The flexible substrate 116 has opposing surfaces 118 and 120. In one embodiment, the material of the flexible substrate 116 may be, for example, an organic material, a plastic material, a polymer material, or a material synthesized by any two or more of the above materials. In an exemplary embodiment, the material of the flexible substrate 11 can be, for example, polyethylene terephthalate. Next, referring to FIG. 3, the flexible substrate U6 is placed on the surface 102 of the mold core 100, and the surface U8 of the flexible substrate 116 is opposed to the surface 102 of the mold core 100, and the flexible substrate is made. The surface 118 of the 116 is in contact with the portion 114b of the transfer material layer 114 on the convex portion 1〇8 of the pattern structure 110 of the mold core 100. Subsequently, referring to 帛4 η, a heating source 122 is provided, and the heating source 122 is used to perform a heating step from the surface 104 of the mold core 100. In this heating step, the heating source 122 heats the mold core 100 from the surface 104 of the mold core 100 to 201109158. The portion (10) of the transfer material layer 114 on the convex (four) 108 of the other surface 102 of the mold core 1 is heated by the heat conduction and heat radiation effects. The portion U4b of the transfer material layer m is partially heated to the surface 118 of the contactable substrate 116 in contact therewith. In this manner, the flexible substrate 116' can be partially twisted to form the heating portion 124 on a partial region of the flexible substrate 116 that is in contact with the portion (10) of the transitional portion 114. In an exemplary embodiment, the heating step includes controlling the heating temperature such that the flexible substrate 116 (four) hot portion 124 in contact with the portion 1Mb of the transfer material layer on the convex portion 108 of the mold core 100 reaches the glass transition. The temperature (10) is in a hot-melt state, and the temperature is controlled to prevent or reduce the softening and melting phenomenon of the portion other than the heat-receiving portion 124 of the flexible substrate 116, and the heat-receiving portion 124 of the flexible substrate 116 is softened. Therefore, the portion 114b of the transfer material layer 114 which is pressed against the heated portion 124 of the flexible substrate 116 can be adhered or pressed into the softened and melted i-heat portion 124 of the flexible substrate 116. In some embodiments, the heating source 122 used in the heating step may be, for example, a laser light heating source, a light source illumination source, a thermal resistance heating source, an eddy current heating source, a microwave heating heating source, or Ultrasonic heated heating source. In one embodiment, as shown in FIG. 5A, when the flexible substrate 116 is locally heated, a roller 126 can be provided and the roller 126 can be disposed on the surface 120 of the slidable substrate 116 for flexibility. The surface 120 of the substrate 116 is used to press the flexible substrate 116. The material of the roller 126 can be a light transmissive material or an opaque material. The material of the roller 126 can be, for example, a glass, a metal, a plastic, a polymer series material, an inorganic material, a ceramic material, a semiconductor material, an organic material or any of the above materials or a combination of any of the above-mentioned materials. Material. Referring to FIG. 5A, the roller 126 is used to perform a roll printing step on the surface 120 of the flexible substrate 116, so that the transfer material layer 114 on all the convex portions 108 in the pattern structure 110 of the mold core can be made. Portions 114b are in closer contact with surface 118 of flexible substrate 116. In another embodiment, as shown in FIG. 5B, a uniformly distributed uniform pressure 'for example, air pressure is applied to the flexible substrate 116 from the surface 12 of the flexible substrate 116, and the pattern of the mold 100 can also be obtained. Portions 114b of the transfer material layer 114 on the embossed portion 108 of the structure 110 are in closer contact with the surface 118 of the flexible substrate 116. At this time, since the heated portion 124 of the flexible substrate 116 has been softened and melted, the portion n4b of the transfer material layer 114 on all the convex portions 1〇8 can be completely transferred after the printing or applying the uniform pressure. On the surface 118 of the flexible substrate 116. Therefore, by scrolling or applying a uniform pressure, the possible difference between the portion 114b of the transfer material layer 114 on the convex portion 108 of the mold core 100 and the contact surface of the flexible substrate 116 can be effectively solved. The problem of uniformity of φ compensates for the lack of flatness of the contact surface, which improves the reliability of the transfer process. In an exemplary embodiment, the material of the mold core 100 may be, for example, a stone eve, and the material of the flexible substrate 116 may be, for example, polyethylene to stearic acid, and the heating source 122 used in the heating step may be, for example, For the infrared new source rail. Since the infrared light has a high transmittance to the mold core of Shi Xi, because of the indirect heat conduction heating, the infrared light can directly directly on the transfer material layer on the other surface 102 of the mold core. The heating of 114 can effectively transfer the energy of the heating source 122, thereby improving the process efficiency. In this exemplary embodiment 201109158. The heating temperature of the heating step of the upper middle can be controlled, for example, between the substantial 80 and the substantial 110. The portion where the flexible substrate 116 is in contact with the transfer material layer 114 is thermally melted. Then, the roller 126 f is removed from the surface 120 of the flexible substrate 116 to release the application of the uniform pressure, and the mold core 100 is separated from the flexible substrate II6. At this time, since the anti-adhesion layer 112 is provided between the mold core 1 and the transfer material layer 114, or the material of the mold core itself has anti-stick property. Further, the portion 114b of the transfer enamel material layer 114 on the convex portion 108 of the pattern structure 110 of the mold core 10 is adhered or pressed into the heated portion 124 of the flexible substrate 116 which is heated and partially softened and melted. Therefore, the portion 11 of the transfer material layer I" on the shape of the mold 100 can be smoothly removed from the convex portion 1〇8' of the mold 100 and smoothly transferred or pressed into the flexible substrate 116. On the surface 118, a transferred micro-nano pattern is formed on the surface 118 of the flexible substrate 116, as shown in FIG. Thus, the procedure for directly transferring the pattern of the pattern structure u〇 of the mold core 10 to the flexible substrate 116 has been completed. • The flexible substrate 116 is then exposed by the portion 114b of the transfer layer 114 transferred to the surface 118 of the flexible substrate 116 as a mask. P points are engraved. As shown in FIG. 7, in the step of engraving, the portion of the exposed portion of the H substrate 116 is moved, and the pattern of the micro-nano pattern 128 is transferred to the flexible substrate 116. Further, the microscopic three-dimensional structure 130 is formed in the flexible substrate 116. Wherein, the micro-nine; 'body 丨 structure 3 〇 includes a plurality of convex portions 136 and a plurality of concave portions 134. • In the present embodiment, since the pattern of the micro-nano-stereo structure 130 is transferred. Since the micro 'τ, mitu & structure 128 ', thus the pattern of the micro-nano-stereostructure 13 () 12 201109158 and the micro-nano pattern structure The pattern of 128 is the same. When the exposed portion of the flexible substrate 116 is etched, a dry etching method or a wet etching method may be employed. In an exemplary embodiment, the flexible substrate 116 can be etched using, for example, a reactive ion etch, and an oxygen plasma can be utilized as an etchant, for example. As shown in Fig. 8, in another embodiment, after the micro-nanostructure 130 is formed in the flexible substrate 116, the portion 114b of the transfer material layer 114 is removed. As shown in FIG. 9, in another embodiment, when the exposed portion of the flexible substrate 116 is etched by using the portion 114b of the transfer material layer ι14 as a mask, the flexible substrate can be completely removed and etched through. The portion of 116 that is not covered by portion 114b of transfer material layer 114 forms a micro-nanostructure. 132. As shown in Fig. 10, in another embodiment, the portion 114b of the transfer material layer 114 can be removed after the micro-nanostructure 132 is formed in the flexible substrate 116. In another embodiment, the mask layer 138 may be formed by, for example, vapor deposition after forming the structure as shown in Fig. 7. The exhibition has two parts H0舆M2. Wherein, the mask layer 138

The portion 114b of the transfer material layer and the other portion 142 of the mask layer ι38 are located on the recess 134 of the micro-nanostructure 13 , as shown in the figure. The material of the mask layer 138 can be, for example, an inorganic material, a ceramic material, a metal material, a polymer series material, an organic material plastic material, a semiconductor material or any one or more of the above materials. material. 13 201109158 Next, the convex portion 136 of the micro-nanostructure 130 is exposed by removing portions 114b of the upper mask layer 138 by removing portions 114b of the transfer material layer 114, for example, by lift-off. 'As shown in Figure 12. In one embodiment, the material of the transfer material layer 114 is metal. Therefore, in this lifting step, since the transfer material layer 114 and the mask layer 138 are significantly different from the flexible substrate 116, the portion 114b of the transfer material layer 114 is etched away to lift away from the mask layer 138. At portion 140, the etchant employed can be prevented from damaging the flexible substrate 116.

The portion 142 of the mask layer 138 that is positioned over the recess i34 of the micro-nano-stereostructure 130 is then masked, and the fully etch-removed flexible substrate 116 is unmasked by the portion 142 of the mask layer 138. The portion of the micro-nano structure 144 is formed as shown in FIG. Therefore, the pattern of the micro-nano structure 144 is complementary to the pattern of the micro-nano structure 13〇. In the embodiment, when the exposed portion of the flexible substrate 116 is exposed, the dry (four) mode or the wet (four) mode q is used in the exemplary embodiment, and the reactive ion can be used as the reactive ion. 116, and for example, an oxygen plasma can be utilized as an etchant. As shown in FIG. 14, in another embodiment, the transfer substrate can be printed on a flexible substrate on a transfer substrate, and the flexible substrate can be read on the I substrate. According to the above embodiments, another advantage of the present invention is that the manufacturing method of the micro-nano structure of the present invention can be pressed by means of printing or applying uniform pressure. Ben and flexible substrates. Therefore, 'the problem of the height difference and uniformity between the contact surface of the mold core and the flexible substrate can be effectively solved, and the reliability of the transfer process can be improved', and the micro-nano pattern can be smoothly processed by the imprint process. Transfer to the flexible substrate. According to the above embodiments, another advantage of the present invention is that the manufacturing method of the microscopic three-dimensional structure of the present invention can be smoothly performed on a flexible substrate by means of lifting (1^ smelting the transfer layer) The recessed portion of the three-dimensional structure is shaped into another transfer layer. Therefore, the other transfer layer can be used as an etch mask to remove the convex portion of the three-dimensional structure, and the micro-complementary pattern can be smoothly formed. Nanoscopic structure. According to the above embodiments, another advantage of the present invention is that the manufacturing method of the microscopic three-dimensional structure of the present invention can utilize the transfer layer transferred onto the flexible substrate as a mask. By removing the portion not covered by the transfer layer and forming a mask, the mask can be used as a mask for the electron beam lithography process or a vapor deposition method to form a cover for the micro-nano graph.罩. The second advantage of the invention is that the manufacturing method of the structure uses the local contact plus the cation base to generate thermal deformation of the substrate, and the waste printing process can be used to smooth the micro-nano pattern. Transfer to flexibility Although the present invention has been disclosed in the above-mentioned fields, it has the usual knowledge that it does not: from the spirit and scope of the present invention, the singer can make various changes and refinements, as a result of the protection scope of the present invention. The above-mentioned and other objects and features of the present invention can be more clearly understood. The description of the closed type is as follows: Implementing your first to seventh embodiments The figure rides a process sectional view of a micro-nano structure according to the present invention. >

Fig. 8 is a cross-sectional view showing a three-dimensional knot in accordance with the present invention. : 9 _ A cross-sectional view of the three-dimensional structure of the micro-nano water of the embodiment of the present invention. Figure 10 is a cross-sectional view showing a microscopic three-dimensional structure according to still another embodiment of the present invention. 11 to 13 are schematic cross-sectional views showing a process of a micro-nano structure according to still another embodiment of the present invention.

Figure 14 is a cross-sectional view showing a microscopic three-dimensional structure according to still another embodiment of the present invention. 102: surface 106: depressed portion 110: pattern structure 114: transfer material layer 114b: part [main element symbol description] 1 〇〇: mold core 104 · surface 108: convex portion 112. anti-stick layer 114a: part 201109158 116: flexible substrate 118 120: surface 122 124: heating portion 126 128: micronial pattern structure 130 132: micronanoscopic structure 134 136: convex portion 138 140: portion 142 144: micronial solid structure surface Heating source roller micro-nano three-dimensional structure depressed portion of the mask layer

17

Claims (1)

201109158 VII. Patent application scope: 1. A manufacturing method of micro-nano three-dimensional structure, comprising: providing a mold core, wherein the mold core has a first surface and a second surface, and the first surface is provided a pattern structure comprising a plurality of first convex portions and a plurality of first concave portions; forming a transfer material layer, wherein the transfer material layer comprises a first portion located at the first convex portions, and a second portion is disposed on the first recesses; _ a flexible substrate is disposed on the mold core, wherein the flexible substrate has a first surface and a second surface, and the flexible portion The first surface of the substrate is in contact with the first portion of the transfer material layer; a heating step is performed from the second surface of the mold core to locally heat the flexible substrate via the first portion of the transfer material layer; Applying a pressure to the second surface of the flexible substrate such that the first portion of the transfer material layer is affixed to the first surface of the flexible substrate: and # removing the mold; The flexible substrate is subjected to an etching step by using the first portion of the transfer material layer as a mask to form a first micro-nano structure in the first surface of the flexible substrate. 2. The method of manufacturing a micro-nanostructure according to claim 1, wherein the etching step completely removes a portion of the flexible substrate that is not covered by the first portion. The method of manufacturing the micro-nano structure according to claim 1, further comprising removing the first portion of the transfer material layer after the etching step. 4. The manufacturing method of the micro-nano structure according to claim 1, after the step of etching, further comprising: forming a mask layer, wherein the mask layer comprises a first portion located in the transfer material layer The first portion and the second portion are located on the plurality of second recesses of the first micro-nano structure; φ performing a Lift-off step to remove the layer of the transfer material layer a portion of the first portion of the mask layer; and the first portion of the mask layer is a mask, and another step is performed to remove the flexible substrate that is not covered by the mask layer. And forming a second micro-nano structure. 5. The method of manufacturing a microscopic three-dimensional structure according to claim 4, wherein the material of the transfer material layer is an inorganic material, a ceramic material, a metal material, a φ polymer series material, an organic material, A material synthesized from a plastic material, a semiconductor material, or any two or more of the above materials. 6. The method for manufacturing a microscopic three-dimensional structure according to claim 4, wherein the material of the mask layer is an inorganic material, a ceramic material, a metal material, a polymer series material, an organic material, a plastic material. A material synthesized by any one or more of a semiconductor material or the above materials. The method of manufacturing a micro-nanostructure according to claim 4, wherein the pattern of the second micro-nano structure is complementary to the pattern of the first micro-nano structure. 8. The method of fabricating a micro-nanostructure according to claim 4, further comprising removing the first portion of the mask layer after the further etching step. 9. The method of fabricating a micro-nanostructure according to claim 4, wherein the another etching step utilizes a dry etching method or a wet etching method. 10. The method of fabricating a micro-nanostructure as claimed in claim 4, wherein the another etching step utilizes a reactive ion etching method. 11. The method of fabricating a micro-nanostructure as claimed in claim 10, wherein the another etching step utilizes an oxygen plasma. 12. The method of manufacturing a microscopic three-dimensional structure according to claim 1, wherein the material of the flexible substrate is an organic material, a plastic material, a polymer material, or any two or more of the above materials. Synthetic material. 13. The method for manufacturing a microscopic three-dimensional structure according to claim 1, wherein the material of the mold core is a stone (Si), a polymer series material, an organic material, a plastic material, a semiconductor material, Metal material, quartz, 20 201109158 glass material, ceramic material, inorganic material, or any of the above materials or materials synthesized by either or both. 14. The method for manufacturing a microscopic three-dimensional structure according to claim 1, wherein the material of the transfer material layer is an inorganic material, a ceramic material, a metal material, a polymer series material, an organic material, and a plastic material. A material, a semiconductor material, or a material synthesized from any two or more of the above materials. 15. The method of manufacturing the micro-nano structure according to claim 1, wherein the heating step is a laser light heating source, a light source illumination heating source, a thermal resistance heating source, and an eddy current type. A heating source, a microwave heating source or an ultrasonic heating source. 16. The method of manufacturing a microscopic three-dimensional structure according to claim 1, wherein the heating step comprises at least a portion where the flexible substrate is in contact with the transfer material layer φ to reach a glass transition temperature (Tg). The method of producing a microscopic three-dimensional structure according to claim 1, wherein the heating step comprises at least a portion in which the flexible substrate and the transfer material layer are brought into a molten state. 18. The method of fabricating a micro-nanostructure according to claim 1, wherein the step of disposing the flexible substrate further comprises at least applying a pre-mould from the second surface of the flexible substrate. The pressure is such that the first surface of the flexible substrate r 21 201109158 is in intimate contact with the first portion of the transfer material layer. 19. The method for manufacturing a microscopic three-dimensional structure according to claim 1, wherein the material of the roller is a light transmissive material or an opaque material. 20. The method for manufacturing a microscopic three-dimensional structure according to claim 1, wherein the material of the roller is glass, metal, plastic, polymer series material, inorganic material, ceramic material, semiconductor material. , an organic material or a material synthesized by any two or more of the above materials. 21. The method of manufacturing a micro-nanostructure according to claim 1, wherein the material of the mold core is ruthenium; the material of the flexible substrate is polyethylene versus stearate (PET); An infrared light source heater is used. 22. The method of fabricating a micro-nanostructure according to claim 21, wherein the heating step has a heating temperature between substantially 80° and substantially 110°. 23. The method for producing a micro-nanostructure according to claim 1, wherein the material of the mold is ethylene tetrafluoroethylene (22), and the micro-nano as described in claim 1 The manufacturing method of the three-dimensional structure, wherein the material of the mold core is a fluorine-containing polymer series material having an anti-sticking effect. 25. The method for manufacturing a microscopic three-dimensional structure according to claim 1, wherein the material of the mold core is a metal, an inorganic material, a polymer material series, a ceramic material, a semiconductor material having an anti-sticking effect. , an organic material or a material synthesized by any two or more of the above materials. 26. The method of fabricating a micro-nanostructure according to claim 1, wherein the step of applying the pressure comprises performing a roll printing step on the flexible substrate using a roller. 27. The method of fabricating a micro-nanostructure according to claim 1, wherein the step of applying the force comprises applying a uniform pressure. 28. The method of fabricating a microscopic three-dimensional structure according to claim 1, further comprising forming an anti-adhesion layer on the first convex portions and the first portions before the step of forming the transfer material layer On the depression. twenty three