201105128 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種影像擷取裝置，尤其涉及一種能夠擷取 物體之空間位置之影像操取裝置。 【先前技術】 [0002] 影像擷取裝置已經廣泛應用於光學式定位物體，例如光 學觸控面板之觸控物定位。 [0003] 傳統的採用單一鏡頭模組之影像擷取裝置通常只能獲取 〇 物體之平面影像’即只能二維定位物體e為了三維定位 物體，即獲知物艘之空間位置，現有技術之一係使用單 一鏡頭加上周邊之反射鏡’以產生虛擬相機之多視角’ 然後藉由影像處理之方法建立出物體之三維資訊，然此 方法需在使用者或物體周邊架設反射鏡’使得該結構較 為複雜、成本較高。還有一種方法係通過兩個相機從不 同角度分別拍攝被攝物以獲得兩個二維影像。該兩個相 機通常相對固定，當被攝物之兩個二维影像被重新組合 Q 後，通過兩相機之位置關係，:，將此二維影像組合成三維 影像。通過這種方式亦可獲得物體之空間位置，然’該 方法需要兩個包括透鏡組、感測元件之相機本體，成本 高、體積大且攜帶不便。 【發明内容】 [0004] 有鑑於此，有必要提供一種結構簡單、成本低廉且能夠 擷取物體空間位置之影像擷取裝置。 [0005] 一種影像擷取裝置，用於擷取物體之空間位置，其包括 :鏡頭模組，該鏡頭模組具有若干鏡片；影像感測器， 098124984 表單編號A0101 第3頁/共13頁 0982042726-0 201105128 该影像感測1§所在平面與該鏡頭模 ^ Λ . 、〜尤軸之垂直面相 乂且成-銳角’該影像感測器具有多個像平面，當該被 挪物體處於與該影像梅取裝置距離不同之位置時，直 像於該影像感測H之不同像平面、及影像處理單^成 根據該影像感測器上該被測物體影像所處於之像平面之 位置判斷被測物體與該影像感測器之距離。 [0006] [0007] [0008] [0009] 相較於先前技術’本發明實施例之影像操取裝置只需要 -個鏡頭模組及-個傾斜設置之影像感㈣，該傾斜設 置之影像感測器相當於具有多個不同賢直位置之像平面 ，不同距離之物艘之光經該鏡頭模組會聚後將聚焦於影 像感測器之不同像平面，根據影像感測器上物體影像所 處於之像平面之位置即可確定物截與影像感測 器之距離 。因此，該影像擷取裝置可以獲得物體之空間位置，且 具有結構簡單、成本低廉之優點。 【實施方式】 下面將結合附圖，對本發明實施例作進一步之詳細說明 〇 如圖1所示’本發明第一實施例提供之影像擷取裝置100 包括鏡頭模組10、鏡座20、設置在鏡座20内之影像感測 器30、楔形底板21及設置於楔形底板21上之影像處理晶 片22。 鏡頭模組1〇包括鏡筒11及設置於鏡筒11内之多個鏡片12 。該多個鏡片12組成之光學系統之光軸為201105128 VI. Description of the Invention: [Technical Field] The present invention relates to an image capturing device, and more particularly to an image capturing device capable of capturing a spatial position of an object. [Prior Art] [0002] Image capturing devices have been widely used for optical positioning objects such as touch object positioning of optical touch panels. [0003] The conventional image capturing device using a single lens module can only obtain a planar image of a 〇 object, that is, only two-dimensionally locating the object e to locate the object in three dimensions, that is, to obtain the spatial position of the object vessel, one of the prior art Use a single lens plus a peripheral mirror 'to create a multi-view of the virtual camera' and then create a three-dimensional image of the object by image processing. However, this method requires a mirror to be placed around the user or object to make the structure More complicated and costly. Still another method is to separately capture a subject from different angles by two cameras to obtain two two-dimensional images. The two cameras are usually relatively fixed. When the two two-dimensional images of the subject are recombined Q, the two-dimensional images are combined into a three-dimensional image by the positional relationship between the two cameras. In this way, the spatial position of the object can also be obtained. However, the method requires two camera bodies including a lens group and a sensing element, which are high in cost, bulky, and inconvenient to carry. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide an image capturing device that is simple in structure, low in cost, and capable of capturing the spatial position of an object. [0005] An image capturing device for capturing a spatial position of an object, comprising: a lens module having a plurality of lenses; an image sensor, 098124984, a form number A0101, a third page, a total of 13 pages, 10,082,224,726 -0 201105128 The image sensing 1 § plane is opposite to the vertical surface of the lens module 〜, ～ 尤 axis, and becomes an acute angle. The image sensor has a plurality of image planes, when the object being moved is When the image capturing device is at a different distance from the image, the image plane of the image sensing H is directly imaged, and the image processing unit is determined according to the position of the image plane of the image of the object to be measured on the image sensor. The distance between the object and the image sensor. [0009] [0009] [0009] Compared with the prior art, the image manipulation device of the embodiment of the present invention only needs a lens module and a tilted image sense (four), the image sense of the tilt setting The detector is equivalent to an image plane having a plurality of different positions, and the light of the different distances of the object is concentrated by the lens module to focus on different image planes of the image sensor, according to the image of the object on the image sensor. The position of the image plane determines the distance between the object and the image sensor. Therefore, the image capturing device can obtain the spatial position of the object, and has the advantages of simple structure and low cost. The embodiment of the present invention will be further described in detail with reference to the accompanying drawings. The image capturing device 100 according to the first embodiment of the present invention includes a lens module 10, a lens holder 20, and a setting. The image sensor 30 in the lens holder 20, the wedge-shaped bottom plate 21, and the image processing wafer 22 disposed on the wedge-shaped bottom plate 21. The lens module 1 includes a lens barrel 11 and a plurality of lenses 12 disposed in the lens barrel 11. The optical axis of the optical system composed of the plurality of lenses 12 is
L 098124984 表單編號Α0101 第4頁/共13頁 0982042726-0 201105128 Ο [0010] [0011] ❹ [0012] 098124984 ，亦即所述鏡頭模組10的光軸為L 。作所述光軸 L ' 的一個垂直面Μ 。鏡頭模組10固定於鏡座20上。 鏡座2 0具有一内部空間用於收容影像感測器30、楔形底 板21及影像處f里晶片22。該鏡座20之内壁與鏡筒11之外 壁粘合固定β當然，鏡筒11與鏡座20亦可採用螺紋方式 固定。 模形底板21底面為平面，上表面211相對底面傾斜。該上 表面211具有一向内凹陷之收容部212 ,該影像處理晶片 22即固定於該收容部212内。當然收容部212並非必要， 影像處理晶片22亦可直接固定於楔形底板21之上表面2ΐι ，即楔形底板21之上表面211為平面即可。 影像感測器30固定於影像處理晶片22上，且影像感測器 30與影像處理晶片22電連接。該影像感測器3〇所在之平 面 Ν 與垂直面Μ 表單編號Α0101 第5頁/共13頁 0982042726-0 201105128 不平行^即平面L 098124984 Form No. Α0101 Page 4 of 13 0982042726-0 201105128 Ο [0011] [0012] 098124984, that is, the optical axis of the lens module 10 is L. A vertical plane Μ of the optical axis L ' is made. The lens module 10 is fixed to the lens holder 20. The lens holder 20 has an internal space for accommodating the image sensor 30, the wedge-shaped bottom plate 21, and the wafer 22 in the image portion f. The inner wall of the lens holder 20 is bonded to the outer wall of the lens barrel 11. Of course, the lens barrel 11 and the lens holder 20 can also be screwed. The bottom surface of the mold bottom plate 21 is a flat surface, and the upper surface 211 is inclined with respect to the bottom surface. The upper surface 211 has an inwardly recessed receiving portion 212, and the image processing wafer 22 is fixed in the receiving portion 212. Of course, the accommodating portion 212 is not necessary, and the image processing wafer 22 may be directly fixed to the upper surface 2 of the wedge-shaped bottom plate 21, that is, the upper surface 211 of the wedge-shaped bottom plate 21 may be a flat surface. The image sensor 30 is fixed to the image processing wafer 22, and the image sensor 30 is electrically connected to the image processing wafer 22. The plane Ν and vertical plane of the image sensor 3〇 Form No. 1010101 Page 5 of 13 0982042726-0 201105128 Non-parallel ^ ie plane
N 與垂直面 Μ 相交成一銳角 Θ 。優選的，該銳角 9 之角度範圍大於0度而小於45度。更優的，銳角 Θ 之角度範圍在15度至30度之間。於本實施例中，該銳角 Θ 為30度。 [0013] 如圖2所示，該影像感測器30相對於鏡頭模組10係傾斜設 置，則影像感測器30相當於具有多個像平面。舉例說明 ，物體50分別位於位置Al、Α2及A3時，物體50之光經過 鏡頭模組10會聚後分別成像於像平面Bl、Β2及Β3。該像 平面Bl、Β2及Β3均為條狀。位置Al、Α2及A3相對影像感 測器30之距離為由遠至近，而物體50於不同距離下其所 成之清晰之圖像亦分別位於不同之像平面。根據此原理 ，當影像感測器30之傾斜角度為一定值，則根據物體50 所成之清晰圖像之位於之像平面之位置，即可推算出物 098124984 表單編號Α0101 第6頁/共13頁 0982042726-0 201105128 體50與影像感測器30之距離。 [0014] 影像處理晶片2 2用於根據影像感測器3 0上清晰物體影像 所處於之像平面之位置判斷物體50與影像感測器3〇之距 離0 [0015] 例如，於位置A1，第一像平面B1處可得到位於A1點之物 體50之清晰影像P1，影像處理晶片22根據第一像平面Μ 之位置可計算出物體50之最佳物平面位置，該位置即A1 點所在之位置；在位置A2，第二像平面B2處可得到位於 〇 A2點之物體50之清晰影像P2，影像處理晶片22根據第二 像平面B2之位置可以計算出物體5〇之最佳物平面位置， v If - 1,1 < 該位置即A2點所在之位置。而物體5〇之水平及垂直座標 之感測係影像感測器30所具備之基本功能，由此，即可 三維定位物體50，即獲知物體5〇之空間位置。 [〇〇16]如圖3所示，本發明提供之第二實施例與第一實施例基本 相同，其主要區別在於，影像-感測器3〇直接設置在一個 q 傾斜設置之電路板24上。電路'板.24與緯座20底面傾斜一 疋角度β則，影像感測器3〇與鏡頭模組1〇之間即為傾斜 一定角度。 剛該影像感測器30為面型電荷輕合感測器或面型互補金屬 氧化物半導體感測器。 [0018] [0019] 該鏡片12可為球面鏡片或者非球面鏡片。 本發明所提供之料錄裝置⑽僅制—個鏡頭模組及 個傾斜。又置之衫像感測器，印可三維定位物體，採用 098124984 該影像擷取裝置 表單編號A0101 1〇0可在獲取物體之二維圖像之同時，獲 0982042726-0 201105128 得該物體之距離遠近資訊，該影像擷取裝置1〇〇可應用於 光學式多點觸控面板等領域中’可以進行三維之觸控定 位。 [0020] [0021] [0022] [0023] [0024] 综上所述’本發明確已符合發明專利之要件，遂依法提 出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本 案技藝之人士援依本發明之精神所作之等效修飾或變化 ，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本發明第一實施例提供之影像擷取裝置之剖示圖。 圖2係圖1中影像揭取裝置之工作原理示意圖。 圖3係本發明第二實施例提供之影像操取裝置之剖示圖。 【主要元件符號說明】 影像擷取裝置 100 鏡頭模組 *~r—.—... L10 ------ 鏡筒 ;:ΓίΓ、 鏡月 ，+ " .V 12 鏡座 20 底板 21 上表面 211 收容部 --— ~~——~~~~— 212 影像處理晶片 - ——- ' ____ 22 電路板 —--—^ —.~~~--- 24 影像感測器 ---——^ --~~~----- 30 表單編號 第8頁/共13頁 0982042726-0 098124984N intersects with the vertical plane 成 to form an acute angle Θ . Preferably, the acute angle 9 has an angular extent greater than 0 degrees and less than 45 degrees. More preferably, the acute angle Θ angle ranges from 15 degrees to 30 degrees. In the present embodiment, the acute angle Θ is 30 degrees. As shown in FIG. 2, the image sensor 30 is disposed obliquely with respect to the lens module 10, and the image sensor 30 corresponds to a plurality of image planes. For example, when the objects 50 are located at the positions A1, Α2, and A3, respectively, the light of the object 50 is concentrated by the lens module 10 and imaged on the image planes B1, Β2, and Β3, respectively. The image planes Bl, Β2, and Β3 are strip-shaped. The distances of the positions A1, Α2 and A3 from the image sensor 30 are from far to near, and the sharp images of the objects 50 at different distances are also located in different image planes. According to this principle, when the tilt angle of the image sensor 30 is a certain value, according to the position of the image plane formed by the object 50, the object 098124984 can be inferred. Form number Α0101 Page 6 of 13 Page 098042726-0 201105128 The distance between body 50 and image sensor 30. [0014] The image processing chip 2 2 is configured to determine the distance between the object 50 and the image sensor 3 according to the position of the image plane on which the clear object image is located on the image sensor 30. [0015] For example, at the position A1, A clear image P1 of the object 50 at the point A1 is obtained at the first image plane B1, and the image processing wafer 22 can calculate the optimal object plane position of the object 50 according to the position of the first image plane ,, which is the position of the A1 point. Position; at the position A2, the second image plane B2 can obtain the clear image P2 of the object 50 located at the point A2, and the image processing wafer 22 can calculate the optimal object plane position of the object 5 according to the position of the second image plane B2. , v If - 1,1 < This position is the location of the A2 point. The sensing function of the horizontal and vertical coordinates of the object 5 is a basic function of the image sensor 30, whereby the object 50 can be positioned three-dimensionally, that is, the spatial position of the object 5 is obtained. [〇〇16] As shown in FIG. 3, the second embodiment provided by the present invention is basically the same as the first embodiment, and the main difference is that the image-sensor 3〇 is directly disposed on a circuit board 24 with a q-tilt setting. on. The circuit 'board' 24 is inclined at an angle β with the bottom surface of the weft base 20, and the image sensor 3〇 is inclined at a certain angle with the lens module 1〇. The image sensor 30 is just a surface charge light sensor or a surface complementary metal oxide semiconductor sensor. [0019] The lens 12 can be a spherical lens or an aspherical lens. The recording device (10) provided by the present invention only makes one lens module and one tilt. Another set of shirt-like sensor, printed three-dimensional positioning object, using 098124984 The image capturing device form number A0101 1〇0 can obtain the two-dimensional image of the object, get 9808222726-0 201105128 Information, the image capturing device 1 can be applied to fields such as optical multi-touch panels, which can perform three-dimensional touch positioning. [0024] [0024] In summary, the present invention has indeed met the requirements of the invention patent, and the patent application is filed according to law. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view of an image capturing device according to a first embodiment of the present invention. FIG. 2 is a schematic diagram showing the working principle of the image uncovering device of FIG. 1. 3 is a cross-sectional view of an image manipulation device according to a second embodiment of the present invention. [Main component symbol description] Image capture device 100 Lens module *~r—..... L10 ------ Lens barrel;:ΓίΓ, Mirror Moon, + " .V 12 Mirror base 20 Base plate 21 Upper surface 211 accommodating part --- ~~——~~~~- 212 Image processing chip - ——- ' ____ 22 Circuit board —---^ —.~~~--- 24 Image sensor -- -——^ --~~~----- 30 Form No. Page 8 / Total 13 Page 0982042726-0 098124984