201104580 六、發明說明： 【發明所屬之技術領域】 —— 本發明係揭露一種具有安全防護介面之複合式晶片卡 結構及控制方法，尤指一種結合感應線圈、晶片模組與安 全防護介面之複合式晶片卡結構及其控制.方法。 【先前技術】 隨著世界經濟的全面前進與高度競爭，塑膠貨幣已經 疋所有先進地區及開發國家的民眾進行消費、付款及各項 商業父易所廣泛使用的必備工具，其重要性早已與實質貨 幣不相上下。 近年來，由於積體電路不斷的演進及微型化，塑膠貨 幣亦蒙受其利，為了增加塑膠貨幣的功能及應用性，晚近 遂與微型積體電路結合，產生了晶片卡；而晶片卡的運用， 隨著消費者的需求，亦不斷的進步，從接觸式的卡片，例 如信用卡、提款卡及健保卡等進步到非接觸式的卡片，例 如悠遊卡、感應門禁卡等，如今更有複合式的卡片問世， 例如VISA組織發行的Visa Wave卡、智慧識別1〇卡及電 子錢包等。 這類非接觸式卡片使用之技術原理為無線射頻辨識 (Radio Frequency Identification，以下皆簡稱 Rfid)技 術，RFID的動作原理請參照如第一圖所示，系统組成中主 要包括至少一標籤A10、一讀取器八2〇及一主機八3 *該 201104580 標藏A10用來存放使用者之各種資訊，該讀取器A20則是 從標籤A10中讀取資訊或將資訊存放到、標屬A1 0内之工 具’讀取器A20將讀取之資料傳送至該主機::A30中，使用 不同之應用程式來解讀資訊’以協助使用者:噠成迅速正確 的決策。標籤A10更包含由一無線射頻模組、一微處 理器A12及一電子可讀寫可編程唯讀記憶體（£16(^1*4&11丫-Erasable Programmable Read-Only Memory，以下簡稱 EEPROM) A13 ’當標籤A10感應到讀取器Α2Ό所發射之 無線電波時會產生「交變磁場」，使標籤Α10之該無線射頻 模組All與該微處理器 Α12作動，而將標籤内之該 EEPROM A13資訊傳回讀取器A20，讀取器:A20再透過線 路或網路將資料傳至主機A30端。 標籤A1 0可區分為主動式與被動式.兩種主動式標蕺 A10内含電池’可隨時傳送資訊給讀取器A20，並有較長 的通訊距離，可儲存較大的記憶體，但價格較高；被動式 標籤A10之電源來自讀取器A20所發出之電波對標籤A10 產生感應微電流來供應其電源動力，再利用電波將其資訊 傳回讀取器A20’故通訊距離較短。被動式標籤Αίο好處 在於不需外加電池，可達到體積小、價格便宜、壽命長以 及數位資訊可攜性等優點。被動式標籤A10之天線為内建 的’用以感應和產生無線射頻電波，以收發資料。 讀取器A20亦包含一無線射頻模組A2 1和一微處理器 201104580 A22 ’主機A30與應用程式之功能則^經制^讀取器A2〇資 料收發、辨識與管理之工作。 _ _二一 目前RFID業界通用的iso標準有汗没❾^4443「近旁型201104580 VI. Description of the Invention: [Technical Field of the Invention] The present invention discloses a composite wafer card structure and control method with a security protection interface, in particular, a combination of an induction coil, a chip module and a security protection interface. Wafer card structure and its control method. [Prior Art] With the overall advancement and high competition of the world economy, the importance of plastic money in the consumption and payment of all the advanced regions and developing countries, and the necessary tools widely used by various business fathers, has long been important. The currency is comparable. In recent years, due to the continuous evolution and miniaturization of integrated circuits, plastic money has also benefited. In order to increase the function and applicability of plastic money, the combination of late-night and micro-integrated circuits has produced wafer cards; With the needs of consumers, and continuous improvement, from contact cards, such as credit cards, ATM cards and health insurance cards, to non-contact cards, such as leisure cards, sensory access cards, etc., now more complex Cards are available, such as Visa Wave cards issued by VISA, Smart ID 1 cards and e-wallets. The technical principle of the use of such contactless cards is Radio Frequency Identification (hereinafter referred to as Rfid) technology. The operation principle of RFID is as shown in the first figure. The system consists mainly of at least one tag A10 and one. Reader 8 2〇 and a host 8 3 * The 201104580 standard A10 is used to store various information of the user. The reader A20 reads information from the label A10 or stores the information to the A1 0 The tool 'Reader A20 transmits the read data to the host: A30, using different applications to interpret the information' to assist the user: making a quick and correct decision. The tag A10 further includes a radio frequency module, a microprocessor A12 and an electronically readable and writable programmable read-only memory (£16(^1*4&11丫-Erasable Programmable Read-Only Memory, hereinafter referred to as EEPROM). A13 'When the tag A10 senses the radio wave emitted by the reader Α2Ό, an "alternating magnetic field" is generated, so that the radio frequency module All of the tag Α10 and the microprocessor Α12 act, and the tag The EEPROM A13 information is sent back to the reader A20. The reader: A20 transmits the data to the host A30 through the line or the network. The label A1 0 can be divided into active and passive. Two active standard A10 batteries are included. 'You can send information to the reader A20 at any time, and have a long communication distance, can store larger memory, but the price is higher; the power of the passive tag A10 comes from the wave generated by the reader A20 to the tag A10 Inductive micro-current to supply its power, and then use radio waves to transmit its information back to the reader A20', so the communication distance is short. The passive label Αίο has the advantage of not requiring an external battery, which can achieve small size, low price and long life. The advantages of digital information portability, etc. The antenna of the passive tag A10 is built-in to sense and generate radio frequency waves for transmitting and receiving data. The reader A20 also includes a radio frequency module A2 1 and a microprocessor 201104580. A22 'The function of the host A30 and the application program ^ is the work of the reader A2 〇 data transmission, identification and management. _ _ _ The current ISO standard for the RFID industry is sweaty ^4443 "Near-type
智慧卡（Proximity Coupling Smart CandsJ衰標準和 ISO 15693 近距型智慧卡（Vicinity Coupling Siffar.t Cards )」 標準。ISO 14443界定在l〇cm内的距離以非:接觸式的方式 讀取智慧卡運作標準，一般之大眾運輸票價卡皆為此類； ISO 15 693規定讀取距離為長達1公尺之運作標準，一般之 門禁卡即為此類規格之產品。以上兩種標準:規‘:範應用領域 白用於曰慧卡上為居多’表1為兩種規範的特性比較。 表 1. ISO 14443 與 ISO 15693.特性比較 功能 ISO 14443 ISO 15693 操作頻率 13.56MHz 13.56MHz 讀取距離 近旁型智慧卡 (Proximity Cards ) 近距型 (Vicinity Cards ) 晶片類型 微控制器（MCU)或記 憶體佈線邏輯（一種無 MCU的電子電路） 記憶體佈線邏輯 記憶體容量 64〜64K 256〜2KB 讀寫能力 可讀取和寫入資料 可讀取和寫入資料 資料傳輸率 (k bps ) 高達106,可提高至848 高達106 反碰撞功能 有 有 201104580 另外，ISO 18000 Series Item Management 則為物流系 統無線通信技術的首項國際標準.，有夂鑒於供應鏈管理 (Supply Chain Management )的重要牲於 JS0 特別由 iso /IEC小組規劃了一系列的18000標準以r規定. .itemSmart card (Proximity Coupling Smart CandsJ failure standard and ISO 15693 Vicinity Coupling Siffar.t Cards) standard. ISO 14443 defines the distance within l〇cm to read the smart card operation in a non-contact manner Standards, general public transport fare cards are all such; ISO 15 693 specifies reading standards of up to 1 meter, and general access cards are products of this type. The above two standards: : Fan application field white is used for the majority of the card. Table 1 compares the characteristics of the two specifications. Table 1. ISO 14443 and ISO 15693. Feature comparison function ISO 14443 ISO 15693 Operating frequency 13.56MHz 13.56MHz Reading distance near Proximity Cards Proximity Cards Chip type microcontroller (MCU) or memory wiring logic (an electronic circuit without MCU) Memory wiring logic memory capacity 64~64K 256~2KB literacy Capability of reading and writing data can be read and written data transfer rate (k bps ) up to 106, can be increased to 848 up to 106 anti-collision function there is 201104580 In addition, ISO 18000 Series Item Management is the first international standard for wireless communication technology in logistics systems. In view of the importance of Supply Chain Management, JS0 has specially planned a series of 18000 standards by iso / IEC team. Regulation. .item
Management 之 RFID Air interface 準則。目前TJSO 18000 系列包含以下幾項重要之標準如表2所示·，其-中最重要的 是18000-6之規定，其規範之頻率860〜930 MHZ為 Logistic Management之最佳選擇，已成為國際Supply Chain RFID應用技術的重要標準。 表2. ISO 18000系列之標準Management's RFID Air interface guidelines. At present, the TJSO 18000 series contains the following important criteria as shown in Table 2. The most important of them is the 18000-6 specification. The frequency of the specification is 860~930 MHZ, which is the best choice for Logistic Management. Supply Chain An important standard for RFID application technology. Table 2. Standards for the ISO 18000 series
Part 規定内容 應用領域範圍 18000-1 全球可接受頻率之Air Interface Communication (AIC) —般參數 18000-2 135MHz以下之AIC參數 適合短距離之紙類標簽， 如門禁卡 18000-3 13.56MHz 之 AIC 參數 記憶體佈線邏輯 18000-4 2.456GHz 之 AIC 參數 長距離之讀取範圍應用， 如 Real-time Locating system 18000-5 5.8GHz之AIC參數 審議中止 18000-6 860〜930MHz 之 AIC 參 數 適用於 Logistic 及 Asset Mgt之最佳方案 18000-7 433.92 MHz 之 AIC 參數 與18000-6相識唯獨速度 慢且易受其他電訊器材 干擾 201104580 接著提到VISA WAVE之交易規範Wave交易金 額在新台幣3000元以下「免簽名」”加速〔_—人在小額通 路消費時的便捷。其次Visa Wave-發以根據風險 控管需求，決定visa Wave交易的處理隹养為一般的「連 線又易」或是快速的「離線交易」。離線交易與谴線交易的 安全性相同，因為每一張Visa Wave卡都，設有「風險額度 累a十」的功能，在超過一定的交易總累計金額後，商家在 執行父易時，系統會轉為連線交易，_透過終端機與發卡行 做確認程序’加強持卡人的支付安全。 〆 連線交易為目前主要的交易模式，每一筆交易需透過 終端機回傳至發卡銀行，並在得到銀行確認及授權後，才 能完成該筆交易；因此每筆交易速度約為30秒。離線交易 疋針對小額交易或是需要快速結帳的商家所設計的交易模 式，持卡人在進行離線交易時，該筆交易無需回傳至發卡 銀行得到授權即可完成交易，因此交易速度較快約為2〜5 秒0 現行的複合式晶片卡雖已在晶片卡内建立多項先進的 加密機制，並採用動態交易認證（DynamicDataPart stipulates content application area 18000-1 Air Interface Communication (AIC) with global acceptable frequency. General parameters 18000-2 AIC parameters below 135MHz are suitable for short-distance paper labels, such as access control card 18000-3 13.56MHz AIC parameters Memory wiring logic 18000-4 2.456GHz AIC parameter Long range read range application, such as Real-time Locating system 18000-5 5.8GHz AIC parameter review suspension 18000-6 860~930MHz AIC parameters apply to Logistic and Asset Mgt's best solution 18000-7 433.92 MHz AIC parameters and 18000-6 know that the speed is slow and vulnerable to interference from other telecommunications equipment 201104580 Then mention the VISA WAVE transaction specification Wave transaction amount below NT$3,000 "free signature "Accelerate [_ - the convenience of people in the small-scale channel consumption. Secondly, Visa Wave- is based on the risk control needs, decided to deal with the visa wave transaction is generally "connected and easy" or fast "offline" transaction". The security of offline transactions and squad transactions is the same, because each Visa Wave card has the function of “risk amount a ten”. After the total accumulated amount of transactions exceeds a certain amount, the merchant is in the process of executing the parent. Will be converted into a connection transaction, _ through the terminal and the issuing bank to confirm the program 'strengthen the cardholder's payment security.连 The connection transaction is currently the main transaction mode. Each transaction needs to be sent back to the issuing bank through the terminal, and the bank can confirm and authorize the transaction before completing the transaction; therefore, the transaction speed is about 30 seconds. Offline transaction 疋 For a small transaction or a transaction mode designed by a merchant that needs quick checkout, when the cardholder conducts an offline transaction, the transaction does not need to be returned to the issuing bank to be authorized to complete the transaction, so the transaction speed is faster. About 2~5 seconds 0 The current composite chip card has established several advanced encryption mechanisms in the chip card and uses dynamic transaction authentication (DynamicData).
Authentlcatlon，DDA )功能，提高了交易及資料傳輸過程 中的安全性，有效防止交易時資料被竊取及侧錄的可能 性，但是一般消費者通常均隨身攜帶該卡片，以求使用上 的便利性，而且由於複合式晶片卡亦可利用無線訊號感 201104580 應遂已引起不肖之徒以無線發射與感鲁器，藉機搁取其 中資料，實在難以防範，如何防止複合魏射的資料被 盜取而導致其被盜用’已是-嚴肅而義鱗題。 本發明即針對此-需求’提出一簡單崎效的安全防 護介面裝置及方法， 藉此降低消費者資枓被盡:取及晶片卡Authentlcatlon, DDA) enhances the security of transactions and data transmission, and effectively prevents the possibility of data being stolen and recorded during the transaction, but the average consumer usually carries the card with him for ease of use. And because the composite chip card can also use the wireless signal sense 201104580, it has caused the unscrupulous to wirelessly launch and sense the device, taking the opportunity to take the information, it is difficult to prevent, how to prevent the composite Wei-ray data from being stolen And it has led to its being stolen 'already - serious and righteous. The present invention proposes a simple and effective security protection interface device and method for this-demand, thereby reducing the consumer's assets: taking the wafer card
被盜刷的風險，以其提高福人彳B 死门设。式晶片卡在攜帶.及使用時的 安全性。The risk of being stolen is to raise the door to death. The safety of the wafer card during carrying and use.
【發明内容】 故，有鑑於前述之問題與需求’發明人以多年之經驗 累積，並發揮想像力與創造力，在不斷試作與修改之後， 始有本發明之-種具有安全防護介面之複合式晶片卡結構 及控制方法。 本發明.之第一目的传描租_ g . θ N你杈供種具有安全防護介面 合式晶片卡結構，該複合式晶片卡結構包括至少一感應 : '至少-晶片模組及至少一安全防護介面，該安全防 介面更包括一感應式安全防護模組及一控制單元，該感 :女全防蠖模組可藉由感應方式啟動安全防護機制而進 乂易，以提高複合式晶片卡使用上之安全性。 本發明之第二目的係提供一種具有安全防護介面之4 合式晶片卡結構，該複合式晶片卡結構包括至少一感應$ ^、Μ -晶片模組及至少—安全防護介面，該安全防讀 介面更包括-機械式安全防護模組及一控制單元，該機柄 201104580 式安全防護模組可藉由機械結構改變:弊否^以每制交易之進 行，以提高複合式晶片卡使用上之安全性 本發明之第三目的係提供一種具有:安®防護介面之複 合式晶片卡之控制方法，該具有安全-P方:護:斧面之複合式晶 片卡在進行交易時，須先啟動複合式晶片卡:之τ.安全防護介 面，才能進行交易之動作，以提高複合式晶片卡使用上之 安全性。 本發明係揭露一種具有安全介面之複合式晶片卡的裝 置，包括一載體、至少一具有電波收發功能'之感應線圈、 至少一晶片模組以及至少一安全防護介面6 · 感應線圈係設置於載體；晶片模組-亦-設置於該載體 上，電性連接於感應線圈。 安全防護介面也設置在載體上，談安全防護介面更包 括連結於晶片模組之一安全防護模組及一控制單元連接在 上述的安全防護模組，其中該安全防護模組可為一感應式 安全防護模組或一機械式安全防護結構。 本發明另揭示一種使用一具有安全防護介面之複合式 晶片卡的方法，應用於一無接觸交易時，該方法之步驟首 先令一使用者聯繫複合式晶片卡之一發行相關系統，啟用 該複合式晶片卡，其中更包括認證使用者相關資料及設定 複合式晶片卡之動態資料認證功能之步驟；其次啟動複合 式晶片卡之一安全防護介面，其中包括設定及儲存安全防 201104580 護介面作動的條件及開啟其功能之步·驟後藉由複合式 晶片卡與一無接觸付款系統之一營利單位趣行一無接觸付 款交易’其中包括中止安全防護介面、先利用^接觸付款系 統之一終端裝置感應、接收及認證使用v者與β交易之各項資 訊，進一步產生一交易認證而完成該交易.，翁後在重啟複 合式晶片卡之安全防護介面。 因此，經由本發明之具有安全防護介面之複合式晶片 卡結構及控制方法，降低了複合式晶片卡在攥帶及使用時 防止被側錄或盜用的可能性，以提升其使用土之安全性。 關於本發明之優點與精神，可藉由以下的發明詳述及 所附圖式得到進-步的了解，然而圖式僅供參考與說 明’非以對本發明加以限制。 有關本發明之詳細内容及技術”，.茲就配合圖式說明如 下： . 【實施方式】 始知到本發明之一種具有安全防護介 為達前述之目的與功效 知之感應式晶片卡做結合， 提升安全防護程度 ，發明人將安全防護介面與習 並構想出多種安全防護機制與 面之複合式晶片卡結構及㈣m分別林發明之一 第較佳實施例之具有安全防護介面之複合式晶片卡結 構'-第二較佳實施例之具有安全防護介面之複合式晶片 卡結構以及一種具有安全防護介面之複合式晶片卡控制方 11 201104580 法，對本發明之系統結構以及控制方法游c詳細之介紹。茲 配合圖示將本發明之較佳實施例加以.詳細說賴如下。 β月參閱第二A圖及第二b圖’係、分別r為^本發明一種具 有安全防護介面之複合式晶片卡結構之該、第^較佳實施例 之不思圖及元件關係方塊圖。如圖所示，該.具^有安全防護 介面之複合式晶片卡結構1〇包括一載體1〇〇 —而於該載體 100上設置有一感應線圈11〇、一晶片模組12〇及一安全防 護介面13 0。 該感應線圈110具有無線電波收發功能:；該晶片模組 係電|·生連接感應線圈丨丨〇 ;該安全防護介面1 3 〇包括一 感應式安全防護模組132及一控制單元13杯該感應式安 全防護模組132連結於晶片模、组120，以控制晶片模組120 '之開啟及作動；該控制單元134則連接於感應式安全防護 椒組132，用以控制感應式安全防護模組⑴之作動；而 該感應式安全防護模組132可選擇為光感應式、熱感應 式、人體電阻感應模式或指紋感應式之安全防護模組132, 立由控制早7° 134的設定及儲存啟用條件，並利用控制單 凡134加以開啟或關閉安全防護之功能。 ，感應式女全防護模組丨3 2可選 、人體電阻感應模式或指紋感應 以下分別對於這些感應方式之原 在第一較佳實施例中 擇為光感應式、熱感應式 式之安全防護模組132， 理及實施方式做介紹。 .12 201104580 首先為光感應式安全防護模組般常用之光感應方 式為可見光感應式及紅外光感應式。其中树見光感應式 來說由於可見光為自然之發射源，·因:此只:要可見光感應 弋之安全防6蔓模組曝露於可見光之下，^即库:開啟安全防護 機制而進行交易。使用可見光感應式安销翁模組之好處 為，晶片卡10平常收納在錢包或口袋時，由於光源被阻 擋，光感應式之安全防護模組在無接觸可見光之情形下無 法進行交易，必須將晶片卡丨〇由錢包或口袋中拿出並接觸 到可見光才有進行交易之可能，因此晶片卡10被側錄或經 破解盜用之可能性便大幅下降。.._一 — 另外，在紅外光感應式之安全防護模組_來說，由於紅 外光具光的直線方向性，也具有不可見咣的〜隱密性因此 只要遗過適當的調變，紅外光有優良:的抗雜訊干擾。利用 紅外光感應式之安全防護模組之好處為，晶片卡丨〇不論有 無接觸到可見光，只要沒有紅外光之照射，安全防護模組 便不會開啟交易之進行，因此紅外光感應式之安全防護模 組又比可見光感應式安全防護模組之安全性來的更高。 接著為熱感應式安全防護模組_，由於一般.人體之體溫 為35°c〜38°c，因此只要經由控制單元134設定及儲存使 用者正常情形下之體溫，當使用者經由皮膚接觸熱感應式 安全防護模組時’若偵測到之體溫符合控制單元丨34儲存 之資訊，則安全防護模組便會開啟交易之進行，增加使用 13 201104580 上之文王丨生避免晶片卡10被側錄或經Λ·部盜用。 再者為人體電阻感應式安全防護.模_組^备正常人體皮膚 之電阻值為一萬至一百萬歐姆，同樣的^，七^經由控制單 元134設定及儲存使用者正常情形下之^^阻，當使用 者經由皮膚接觸人體電阻感應式安全防護模齡時，若偵測 到之電阻符合控制單A 134冑存之資.訊，則.安全防護模組 便會開啟交易之進行，增加使用上之安全性避免晶片卡 10被側錄或經破解盜用。 = 最後，為指紋感應式安全防護模組，經由控制單元i34 設定及儲存使用者之指紋，當使甩春經由手指接觸指紋感 應式安全防護模組時，若偵測到之指欲符哈控制單元134 儲存之資訊，則安全防護模組便會開啟交易之進行，增加 使用上之安全性’避免晶片卡丨〇被侧綠或：經破解盜用。 請參閱第三A圖及第三B圖，係分別為本發明一種具 有安全防護介面之複合式晶片卡結構之該第二較佳實施例 之示意圖及元件關係方塊圖。如圖所示，該具有安全防護 介面之複合式晶片卡結構2〇包括一載體200，而於該載體 200上設置有一感應線圈2 1 0、一晶片模組220及一安全防 護介面2 3 0。 同樣地，該感應線圈2 10具有無線電波收發功能；該 晶片模組220係電性連接感應線圈210 ;該安全防護介面 230包括一機械式安全防護模組232及一控制單元234 ;該 201104580 機械式安全防護模組232連接於該晶片22()，以控制 該晶片模組220之開啟及作動；控制單則連接或覆 蓋於機械式安全防護模組232之上，用'以控制機械式安全 防護模組232之作動；而該機械式安全鞭護:模钮232可選 擇為按壓式及壓力量測式之安全防護模組聪，經由控制 單元234加以開啟關閉或控制其安全防護之功能。 在第二較佳實施例中，機械式安全防護模組232可選 擇為按壓式式安全防護模組232'及壓办量測安.全防護模組 232''，以下分別對於這些機械作用方式.之原理及實施方式 做介紹^ 首先為按壓式安全防護模組· 232'，請.參照如第四圖所 不’控制單元234'覆蓋於按壓式安全防護模愈232'之上， 平常在未進行交易之情況下’按壓式安全防護模組23 2'並 未與晶片模組220'產生電路連結，接-著對於控制單元234' 施以一外力時，按壓式安全防護模組232'便會因外力而產 生機械式之位置改變，因此與晶片模組220'產生電路連 結’藉此得以開啟安全防護機制而進行交易。 接著為壓力量測式安全防護模組232' '，請參照如第五 圖所示’控制單元234''覆蓋於壓力量測式安全防護模組 232之上，並且壓力量測式安全防護模組232''更含有一 壓力量測單元233，當對於控制單元234''施以一外力時， 壓力量測式安全防護模組232''之該壓力量測單元233便會 15 201104580 接收到外來之壓力，當壓力值超過壓力:」,量球_安全防護模 組232'、預設值時，壓力量測式安全防:錢秦-232'、便會與 bb片模組220產生電路連結，藉此得以開啟^麥γ全防護機制 而進行交易。 -. ^ 此外，由於複合式晶片卡20通常係被置毛故於在皮夾 中，且皮夾係置放於使用者之口袋中，故噹使:用者於移動 或手插口帶時，很可能會誤觸機械式安全防護模組232而 開啟安全防護機制，此時複合式晶片卡2〇被盜刷或侧錄的 機會就會大增。為避免此現象發生，晶片模組;220可與一 感應式安全防護模組（如第二A圖與第二B圖中之132) 連結。該控制單元234則連接於談感應式安=全防護模組， 用以控制感應式安全防護模組之作動_。而該感—應式安全防 模、且可選擇.為光感應式、熱感應式、人體電阻感應模式 或扣紋感應式之安全防護模組，經由控制單元234的設定 及儲存啟用條件，並利用控制單& 234加以開啟或關閉安 全防護之功能。 如此一來，在具有二道安全防護的機制下，儘管機械 式安全防濩模組232被誤觸而開啟安全防護機制，但感應 式文全防護模組仍然會禁止開啟安全防護機制，有效降低 複合式晶片卡2〇被盜刷或側錄的機會。 對應上述具有安全防護介面之複合式晶片卡的裝置， 本發明亦揭不—種具有安全防護介面之複合式晶片卡控制 ,16 201104580 方法，晴參閱第六圖所示，針對該方法_較佳^實施利之主要 步驟予以詳述。 . 如圖所示’複合式晶片卡的裝置—應用於為接觸交易 時如步驟3〇1所示，首片卡之__使用者 筇繫複。式aa片卡之一發行相關系統，申請啟用-該複合式 晶片卡 · 甘φ 09 ’，、中包括步驟302所示，認證該使用:者之相關資 料，及步驟303所示之設定複合式晶片卡之一-動態資料認 證功能。 *進行步驟401所示，啟動複合式晶...片卡'上之一機 械式t全防護介面；其中包含步驟所示，先行設定該 複〇式晶片卡上之該機械式安全防護介面的作r動條件（如 對機械式安全防護介面按壓一次或施加一定-壓力等）；接 著如步驟403所示’儲存該機械式安全防護;介面作動條 件；之後，如步驟404所示，開啟機械式安全防護介面之 功能。 此外，在步驟403後，更包含一啟動複合式晶片卡上 之一感應式安全防護介面的步驟，該步驟包含先行設定該 複合式晶片卡上之該感應式安全防護介面的作動條件（如 環境光源感測、環境溫度感測、人體電阻感測及指紋偵測 等），並於儲存該感應式安全防護介面作動條件後，開啟 感應式安全防護介面之功能。 然後如步驟500所示，藉由複合式晶月卡與一無接觸 17 201104580 付款系統相關之一營利單位進行一-無接:觸I款交易；如步 驟501所示先中止複合晶片卡之該安全防護介面；接著， 如步驟502所示，利用無接觸付款系.統^ ^終l端裝置感應 並接收該複合晶片卡之相關資訊，名嵌^‘複用者之各項個 人相關資訊及該無接觸付款交易之各項湘關::參訊；再如步 驟50 3所示，藉由無接觸付款系統認證上述，各項資訊；如 步驟504所示，判斷使用者之各項個人相關資訊及該無接 .觸付款交易之各項相關資訊之正確性m關資訊完全 正確時，接受該相關資訊值，進行下—步驟505-;當該相 關資訊中任一項不正確時，直接進行最終步騾。 二〜如步驟505所示，運用動態資料謖證功|為無接觸付 款交易產生-交易認證，該交易認證為革一獨立之交易認 °五 此乂易*忍5登可選擇利用無接觸系統之終端裝置顯示 或直接歹J印，再來，則如步驟5〇6所示，完成該筆無接觸 付τ交易，最後，如步驟5〇7所示，重新啟動該複合晶片 卡之安全防護介面。 綜上所述，當知本案之發明已具有產業利用性、新穎 挫進步眭，符合發明專利要件。惟以上所述者，僅為本 發明之較佳實施例而已，並非用來限定本發明實施之範 圍 凡本發明申請專利範圍所做的均等變化與修飾，皆 為本發明專利範圍所涵蓋。 發明人經過不斷的構想與修改，最終得到本發明之設 201104580 、'擁有上述之諸多優點，實為〜優秦避發明’應符合 申請發明專利之要件，特提Μ請，:盼‘·查委員能早 曰賜與發明專利，以保障發明人之 ― 【圖式簡單說明】 第一圖 第二Α圖 係為習知之RFID動作厚理； 係為本發明一種具有安全防護介面之複合式 日曰片卡結構之-第〜較隹實施例.《#意圖； 係為本發明-種具有芳全防護介面之複合式 晶片卡結構之該第1佳實施例之元件關係 方塊圖； 第三A圖 第四圖 第五圖 第六圖 • . ~ .. "Ί . 係為本發明一種具有安全〖方乘介面之複合式 曰曰片卡結構之一第二舞隹實施例之示意圖； • · · . » . ·» 係為本發明一種具有专全防護介面之複合式 晶片卡結構之該第二較佳實施例之元件關係 方塊圖； 係為按壓式安全防護模組之結構示意圖； 係為一壓力量測式安全防護模組之結構示意 圖，及 係為本發明一種具有安全防護介面之複合式 晶片卡控制方法流韃圖。 19 201104580 【主要元件符號說明】 10 ' 20 100、200、200'、200'' 1 10、210、210'、210'' 120 > 220 ' 220' ' 220'' 130 、 230 132 134 ' 234 ' 234' > 234'' 232 232' 232'' 233 301 〜303 ' 401〜404 ' 500 複合式晶\片1卡— 載體 —'-η. 感應線圈 晶片相：~組 安全防護介面'“ 感應式安全防護模組 控制單元 機械式安全防護模組-按壓式安全防護模組 壓力量測式安全防護模組 壓力量測單元 〜5 0 7 " 使用安全防護介面之複合示晶 片卡的方法之實施步驟SUMMARY OF THE INVENTION Therefore, in view of the aforementioned problems and needs, the inventor has accumulated years of experience, and exerted imagination and creativity. After continuous trial and modification, the invention has a combination of security protection interfaces. Wafer card structure and control method. The first object of the present invention is to provide a security-protected interface wafer card structure, the composite wafer card structure comprising at least one sensing: 'at least a wafer module and at least one security protection The interface, the security interface includes an inductive security module and a control unit. The sensor: the female anti-tamper module can activate the security protection mechanism by sensing to improve the use of the composite chip card. Security. A second object of the present invention is to provide a 4-pack type wafer card structure having a security protection interface, the composite wafer card structure comprising at least one sensing $^, Μ-wafer module and at least a security protection interface, the security anti-read interface In addition, it includes a mechanical safety protection module and a control unit. The 201104580 safety protection module can be changed by mechanical structure: the disadvantages are caused by the transaction of each system to improve the safety of the composite wafer card. The third object of the present invention is to provide a method for controlling a composite wafer card having an security-protection interface, which has a safety-P-side: axe-faced composite wafer card, which must be started before being traded. Wafer card: τ. Security interface, in order to carry out the transaction action, to improve the security of the use of composite wafer card. The present invention discloses a device for a composite wafer card having a secure interface, comprising a carrier, at least one induction coil having an electric wave transmitting and receiving function, at least one wafer module, and at least one safety protection interface 6. The induction coil system is disposed on the carrier The chip module is also disposed on the carrier and electrically connected to the induction coil. The security protection interface is also disposed on the carrier. The security protection interface further includes a security protection module connected to the chip module and a control unit connected to the security protection module, wherein the security protection module can be an inductive Safety protection module or a mechanical safety protection structure. The present invention further discloses a method for using a composite wafer card having a security protection interface. When applied to a contactless transaction, the method firstly causes a user to contact a composite wafer card to issue a related system to enable the composite. The wafer card further includes the steps of authenticating the user-related information and setting the dynamic data authentication function of the composite wafer card; secondly, starting a security protection interface of the composite wafer card, including setting and storing the security anti-201104580 protection interface actuation Conditions and the steps to open their functions. After the composite chip card and a contactless payment system, a profit-free unit has a contactless payment transaction, which includes a suspension of the security interface, and the use of a contact payment system. The device senses, receives and authenticates the information of the v and beta transactions, and further generates a transaction authentication to complete the transaction. Weng Hou restarts the security protection interface of the composite chip card. Therefore, the composite wafer card structure and the control method with the security protection interface of the invention reduce the possibility that the composite wafer card can be prevented from being side-recorded or stolen during the slinging and use, thereby improving the safety of the soil used. . The advantages and spirits of the present invention are to be understood by the following detailed description and the appended claims. The details and the technology of the present invention are described as follows: [Embodiment] It is known that the present invention has a combination of an inductive wafer card having the safety protection and the purpose of achieving the aforementioned purpose and effect. To enhance the degree of security protection, the inventors have integrated the security protection interface with a plurality of security protection mechanisms and a composite wafer card structure, and (4) a composite wafer card with a security protection interface according to a preferred embodiment of the invention. Structure--the composite wafer card structure with security protection interface of the second preferred embodiment and the composite wafer card controller 11 with security protection interface 11 201104580 method, the system structure and control method of the invention are described in detail The preferred embodiment of the present invention will be described in detail with reference to the following drawings. Refer to the second A and second b diagrams, respectively, for a composite wafer having a security protection interface according to the present invention. The card structure, the non-thinking of the preferred embodiment, and the block diagram of the component relationship. As shown in the figure, the device has a security protection interface. The integrated chip card structure 1 includes a carrier 1 - and the carrier 100 is provided with an induction coil 11 , a chip module 12 , and a security protection interface 130 . The induction coil 110 has a radio wave transceiver function: The chip module is electrically connected to the induction coil 丨丨〇; the security interface 13 includes an inductive security module 132 and a control unit 13 cup. The inductive security module 132 is coupled to the chip. The module 120 is configured to control the opening and actuation of the wafer module 120'; the control unit 134 is connected to the inductive safety protection pepper set 132 for controlling the operation of the inductive safety protection module (1); and the inductive safety The protection module 132 can be selected as a light-sensing type, a heat-sensing type, a human body resistance sensing mode or a fingerprint-sensing safety protection module 132, and the setting and storage enabling conditions of the early 7° 134 are controlled, and the control unit 134 is utilized. Turn on or turn off the security protection function. Inductive female full protection module 丨3 2 optional, human body resistance sensing mode or fingerprint sensing, respectively, for the original of these sensing methods In the preferred embodiment, the light-sensing and heat-sensitive security protection module 132 is selected, and the implementation and implementation are introduced. .12 201104580 Firstly, the light-sensing method commonly used for the light-sensing security protection module is visible light sensing. Infrared light-sensing type, in which the tree sees light-sensing, because visible light is a natural source of radiation, because: this only: to be visible light-sensitive 弋 security to prevent the vine module from being exposed to visible light, ^ ie library: The security protection mechanism is opened for trading. The advantage of using the visible light sensor type is that when the chip card 10 is normally stored in the wallet or pocket, the light-sensitive security module is in contactless visible light because the light source is blocked. In this case, the transaction cannot be carried out, and the wafer cassette must be taken out of the wallet or pocket and exposed to visible light to be traded. Therefore, the possibility that the wafer card 10 is side-recorded or cracked and stolen is greatly reduced. .._一— In addition, in the infrared light-sensing safety protection module _, due to the linear directivity of the infrared light, it also has an invisible 隐-hiddenness, so as long as the appropriate modulation is left, Infrared light has excellent: anti-noise interference. The advantage of using the infrared light-sensing security protection module is that the wafer card is in contact with visible light, and as long as there is no infrared light, the security protection module will not open the transaction, so the infrared light-sensing security The protection module is more secure than the visible-sensing safety protection module. Followed by the heat-sensitive safety protection module _, since the body temperature of the human body is generally 35 ° c ~ 38 ° c, so as long as the body temperature under normal conditions of the user is set and stored via the control unit 134, when the user contacts the heat through the skin Inductive safety protection module 'If the detected body temperature meets the information stored in the control unit 丨34, the safety protection module will open the transaction, and increase the use of the 13 Wang Yunsheng on the 201104580 to avoid the wafer card 10 being side Recorded or used by the Ministry of the Ministry of theft. In addition, it is a human body resistance-inductive safety protection. The __ group is equipped with normal human skin resistance value of 10,000 to 1 million ohms, the same ^, seven ^ via the control unit 134 to set and store the user under normal circumstances ^ ^Resistance, when the user touches the human body through the skin to inductive safety protection mode, if the detected resistance meets the control information of the control unit A 134, the security protection module will start the transaction. Increased security in use to prevent wafer card 10 from being skimmed or compromised. = Finally, for the fingerprint-sensing security protection module, the user's fingerprint is set and stored via the control unit i34. When the Hunchun touches the fingerprint-sensing security protection module via a finger, if the fingerprint is detected, Unit 134 stores the information, then the security protection module will open the transaction, increase the security of use 'avoid the chip card is side green or: cracked and stolen. Please refer to FIG. 3A and FIG. 3B, respectively, which are schematic diagrams of the second preferred embodiment of the composite wafer card structure having a security protection interface according to the present invention. As shown in the figure, the composite wafer card structure 2 having a security protection interface includes a carrier 200, and an inductive coil 210, a wafer module 220 and a security protection interface 2 3 0 are disposed on the carrier 200. . Similarly, the induction coil 2 10 has a radio wave transceiving function; the chip module 220 is electrically connected to the induction coil 210; the security protection interface 230 includes a mechanical security protection module 232 and a control unit 234; The safety protection module 232 is connected to the wafer 22 () to control the opening and actuation of the wafer module 220; the control unit is connected or overlaid on the mechanical safety protection module 232, and is used to control mechanical safety. The protective module 232 is activated; and the mechanical safety guard: the mold button 232 can be selected as a push-type and pressure-measuring safety protection module, and can be turned on or off or controlled by the control unit 234. In the second preferred embodiment, the mechanical safety protection module 232 can be selected as a push-type safety protection module 232' and a pressure-measuring safety protection module. The full protection module 232'', respectively, for these mechanical action modes The principle and implementation of the method are introduced ^ First, the push-type safety protection module · 232', please refer to the fourth figure, the control unit 234 is covered by the push-type safety protection module 232', usually When the transaction is not performed, the push-type security module 23 2 is not electrically connected to the chip module 220 ′, and when the external force is applied to the control unit 234 ′, the push-type security module 232 ′ In this case, a mechanical position change is generated due to an external force, so that a circuit connection is generated with the wafer module 220', thereby enabling the security protection mechanism to be opened for trading. Next, the pressure measurement type safety protection module 232'', please refer to the 'control unit 234'' as shown in the fifth figure over the pressure measurement type safety protection module 232, and the pressure measurement type safety protection mode The group 232 ′′ further includes a pressure measuring unit 233 , and when an external force is applied to the control unit 234 ′′, the pressure measuring unit 233 of the pressure measuring safety protection module 232 ′′ will receive 15 201104580 External pressure, when the pressure value exceeds the pressure:", the ball _ safety protection module 232', the preset value, the pressure measurement type safety defense: Qian Qin-232', will generate circuit with the bb chip module 220 Linking, in order to open the ^ gamma full protection mechanism for trading. -. ^ In addition, since the composite wafer card 20 is usually placed in the wallet and the wallet is placed in the user's pocket, when the user uses the mobile or hand strap, It is very likely that the mechanical safety protection module 232 is accidentally touched and the safety protection mechanism is turned on. At this time, the chance of the composite wafer card 2 being stolen or side recorded is greatly increased. To avoid this, the wafer module 220 can be coupled to an inductive security module (such as 132 in the second A and second B). The control unit 234 is connected to the inductive safety module to control the actuation of the inductive safety protection module. And the sense--safety anti-moulding, and can be selected as a light-sensing type, a heat-sensing type, a human body resistance sensing mode or a buckle-sensing type safety protection module, through the setting and storage activation conditions of the control unit 234, and Use Control Ticket & 234 to turn security protection on or off. In this way, under the mechanism with two safety protections, although the mechanical safety anti-smashing module 232 is accidentally touched to open the safety protection mechanism, the inductive full protection module will still prohibit the opening of the safety protection mechanism, effectively reducing The composite wafer card 2 is stolen or partially recorded. Corresponding to the above-mentioned device with a composite chip card having a security protection interface, the present invention also discloses a composite wafer card control with a security protection interface, 16 201104580 method, as shown in the sixth figure, for the method _ ^ The main steps of implementation are detailed. As shown in the figure, the device of the composite wafer card is applied to the contact transaction as shown in step 3〇1, and the user of the first card is restored. One of the aa chip cards is issued with a related system, and the application is enabled - the composite wafer card 甘 φ 09 ', includes the step 302, the relevant information of the user is authenticated, and the setting compound shown in step 303 is One of the chip cards - dynamic data authentication. * Performing step 401, starting a mechanical t-protection interface on the composite crystal chip card; wherein the mechanical security protection interface on the retort wafer card is set first, as shown in the step The r-condition (such as pressing the mechanical safety protection interface once or applying a certain pressure, etc.); then storing the mechanical safety protection as shown in step 403; the interface actuation condition; thereafter, as shown in step 404, opening the machine The function of the security interface. In addition, after step 403, the method further includes the step of initiating an inductive security interface on the composite wafer card, the step comprising first setting an operating condition of the inductive security interface on the composite wafer card (eg, an environment) Light source sensing, ambient temperature sensing, human body resistance sensing and fingerprint detection, etc., and the function of the inductive safety protection interface is activated after storing the inductive safety protection interface. Then, as shown in step 500, the composite crystal card is connected to a non-contact 17 201104580 payment system for a profit-making unit: a touch-free transaction; as shown in step 501, the composite wafer card is first suspended. The security protection interface; then, as shown in step 502, the contactless payment system is used to sense and receive the relevant information of the composite chip card, and the personal information related to the name of the multiplexer is The various contacts of the contactless payment transaction:: participation; and as shown in step 503, the above information is authenticated by the contactless payment system; as shown in step 504, the personal correlation of the user is determined. The information and the correctness of the relevant information of the non-contact payment transaction, when the information is completely correct, accept the relevant information value, proceed to the next step 505-; when any of the relevant information is incorrect, directly Carry out the final step. Second, as shown in step 505, using the dynamic data to prove the merits | for the contactless payment transaction generation - transaction authentication, the transaction certification for the independent transaction of the transaction - five easy to use 5 to choose to use the contactless system The terminal device displays or directly prints the J, and then, as shown in step 5〇6, completes the contactless payment τ transaction, and finally, as shown in step 5〇7, restarts the security protection of the composite wafer card. interface. In summary, when the invention of the case has been industrially useful, novel and frustrating, it meets the requirements of the invention patent. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the invention. The equivalent variations and modifications of the scope of the invention are covered by the scope of the invention. After inventor's constant envisioning and modification, the inventor finally got the 201104580 of the present invention, 'has possessed many of the above advantages, and the fact that ~Yu Qin avoids invention' should meet the requirements of applying for invention patents, and specially asks: The committee can give the invention patent as early as possible to protect the inventor. [Simplified description of the drawing] The second picture of the first picture is the conventional RFID action; it is a compound day with a security interface.曰 卡 结构 . 第 第 . . # # # # # # # # # # # # # # # # # # # # # # # 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三 第三Figure 4 is a fifth diagram, a sixth diagram, and a schematic diagram of a second embodiment of a composite cymbal card structure with a safe 〖square multi-interface; </ RTI> is a block diagram of the component of the second preferred embodiment of the composite wafer card structure having a dedicated protection interface; and is a schematic structural diagram of the push-type security protection module; a pressure amount The structural schematic diagram of the test security protection module is a flow diagram of a composite wafer card control method with a security protection interface according to the present invention. 19 201104580 [Description of main component symbols] 10 ' 20 100, 200, 200', 200'' 1 10, 210, 210', 210'' 120 > 220 '220' '220'' 130 , 230 132 134 ' 234 '234' > 234'' 232 232' 232'' 233 301 ~ 303 ' 401 ~ 404 ' 500 composite crystal \ chip 1 card - carrier - '-η. Induction coil wafer phase: ~ group security interface ' Inductive safety protection module control unit mechanical safety protection module - push type safety protection module pressure measurement type safety protection module pressure measurement unit ~ 5 0 7 " method of using composite security chip to display wafer card Implementation steps
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