201103660 六、發明說明： 【發明所屬之技術領域】 特別是一種鎂鋰合金組件 本發明係關於一種組裝加工手段， 之組裝加工方法。 【先前技術】 目前各家製造廠商皆積極朝向筆記型電腦_積_ 質輕之設計領域開發，所以通常會_較質輕的材料做為製造機 设的原料，例如選用碳纖維材料、鎂合金材料或是塑膠材料等 藉由上述的材料來搭配設計成機殼的構件，而_的材料特性亦 直接影響筆記型電腦的機殼結構強度。 為符合筆記型電腦質㈣需求及高強度結構，以及回收、再 利用的環保觀念，便有相關製造廠商⑽合金（magnesiumaii〇y) 材料製成筆記型電腦之機殼。由於鎮合金的優點在於具有跟鋼 (steel) -樣的強度和硬度’但重量卻接近於塑膠。再加上金屬延 展性的優勢，使得鎮合金製成的機殼厚度可以為鳴〜罐毫求 (mm)甚至更溥，相較於塑膠機殼的〇丨毫米(mm)厚度鎂合金的 機殼更加堅固及輕薄化。另外，鎮合金更具有良好的熱傳導能力 以及遮蔽電磁波干擾等特性，因此不論從重量、厚度或使用特性 來說，鎂合金的機殼已經逐漸取代傳統塑膠機殼。 然而，目前應用於沖壓製程之鎮合金板件係以八231規格為 主，因其鎂合金的原子結構屬於六方緊密堆積結晶結構(hexag〇nal closest packed crystal structure; h.c.p.) ’ 而被視為具缺乏成形加工 201103660 性。所關合金在常溫加工的成形性甚差，必須加溫至細。c以上 方具備良好之成形性。舉例來說，鎂合金在機械加工時，壓 fo她g)必須在經選擇的溫度下(如赋至靴)才能成形。是 以’賴合金材料在成形過財，必·製程上的操作性安全 性以及其製造成本作一考量。 另外’還需考量如何賴合金㈣在室溫巾絲，以此快速 _定料侧合金板魏合在ϋ取說，絲製造薇商 仏用關合金製成筆記型電腦之齡金機殼後，又因各家製造 廒商所制定出來的機殼厚度及尺寸皆不同，勢必需要將二個或二 個以上鎂齡金驗依尺寸厚度_互結合，_要如何快速的 將二個或二個以上的鎂合金機殼在室溫中快速結合在一起即為 從事此行業者所亟欲改善之課題。 【發明内容】 本發明的主要目的在於提供一種脑合金組件之組裝加工方 法’係以驗合金製成工件後’依照筆記型電腦的機殼厚度尺寸， 而將二個或二似上的鎂齡金功快速、翻的相互結合在— 起。 根據本發明所揭露之鎮鐘合金組件之組裝加工方法，其包括 以下的步驟。提供-第-驗合金件，具有—第—接合面；提供 ~第二鎂鋰合金板，具有一第二接合面；將第一鎂鋰合金件定位 在第二鎂鋰合金板上，使第一接合面與第二接合面相互接觸；對 第鎮鐘合金件及第《一鎮链合金板進行壓合，以令第一錤鐘合金 201103660 件與第—鎮鐘合金板相互結合。 本發明之功效在於，先將第一鎂鋰合金件與第二鎂鋰合金板 定位接觸，並以沖壓加工、锻造加工、雷射焊接或黏合加工等方 弋而得以快速的將二鎂鐘合金件結合在一起，以此在室溫中成 形，進而節省製造成本及減少製程加工程序。 乂下在實施方式中詳細敘述本發明之詳細特徵以及優點，其 :容足以使任何熟習侧技藝者了解本發明之技術内容並據以實 知’且根據本說明書所揭露之内容、申請專利範圍及圖式，任何 熟習相關技藝者可輕易地理解本發明前述之目的及優點。 【實施方式】 為使對本發明的目的、構造、特徵、及其功能有進一步的瞭 解，茲配合實施例詳細說明如下。 如第1圖」及「第2A圖」至「第2C圖」所示，其中「第 1圖」係為«本發明-實施例之製作流程示意圖，「第2A圖」 至第2C圖」係為根據本發明一實施例之步驟流程示意圖。 根據本創作所揭露一實施例之驗合金組件之組裝加工方 ^ ’至少包含有下咐驟··提供―第-驗合金件H)，具有一第 接。面11 (步驟卿）。提供_第二驗合金板Μ，具有一第二 接合面21 (步驟11〇)。 _第2Α圖」所不’在本發明之實施例中，第-驗合金件 去及第二_合金板2〇的材料成份包括有鎮、鐘及鋅，其中綠元 素的原子百分比為合金總組成的a%⑻㈣ι%·)，鐘元素 201103660 的原子百分比為合金總組成的收⑻％规观），辞元素的原 子百分比為合金總組成的c%⑷％^%幻％)，而麟％+你 S 100〇/〇 〇 將第一_合金件1G粒在第二馳合敍20之上，並使201103660 VI. Description of the invention: [Technical field to which the invention pertains] In particular, a magnesium-lithium alloy assembly The present invention relates to an assembly processing method, an assembly processing method. [Prior Art] At present, all manufacturers are actively developing towards the notebook computer _ product _ quality design field, so usually _ lighter materials as raw materials for manufacturing equipment, such as carbon fiber materials, magnesium alloy materials Or the plastic material and the like are matched with the components designed as the casing by the above materials, and the material characteristics of the _ also directly affect the structural strength of the casing of the notebook computer. In order to meet the requirements of notebook computer (4) and high-strength structure, as well as the environmental concept of recycling and reuse, there is a manufacturer's (10) alloy (magnesiumaii〇y) material made into the notebook computer case. Since the town alloy has the advantage of having steel-like strength and hardness, the weight is close to that of plastic. Coupled with the advantages of metal ductility, the thickness of the shell made of Zhen alloy can be 〜~ cans (mm) or even more 溥, compared to the thickness of the plastic case 〇丨 mm (mm) thickness of magnesium alloy machine The shell is stronger and lighter. In addition, the town alloy has better thermal conductivity and shielding electromagnetic interference, so the magnesium alloy casing has gradually replaced the traditional plastic casing regardless of weight, thickness or use characteristics. However, the alloy sheet used in the stamping process is mainly based on the eight 231 specification, because the atomic structure of the magnesium alloy belongs to the hexag〇nal closest packed crystal structure (hcp)' Lack of forming processing 201103660 sex. The formability of the alloy to be treated at room temperature is very poor, and it must be heated to fineness. Above c has good formability. For example, magnesium alloys must be formed at a selected temperature (eg, to a boot) during machining. It is considered to be based on the operational safety of the alloy material, the operational safety of the process, and the manufacturing cost. In addition, it is also necessary to consider how to rely on the alloy (4) at room temperature, so that the fast-fixed side alloy sheet Weihe is said to be drawn. After the silk is made, the Weishang alloy is made of a notebook computer. Moreover, due to the different thickness and size of the casings developed by various manufacturers, it is necessary to combine two or more magnesia ages according to the size and thickness _ mutual combination, _ how to quickly two or two The rapid integration of more than one magnesium alloy casing at room temperature is a problem that is desired for those in this industry. SUMMARY OF THE INVENTION The main object of the present invention is to provide a method for assembling and processing a brain alloy component, which is based on the thickness of the casing of the notebook computer, and the magnesium age of two or two. Jingong's fast and turn-over is combined with each other. The method of assembling and processing a ball-and-ring alloy assembly according to the present invention comprises the following steps. Providing a first-test alloy piece having a - joint surface; providing a second magnesium-lithium alloy plate having a second joint surface; positioning the first magnesium-lithium alloy member on the second magnesium-lithium alloy plate A joint surface and a second joint surface are in contact with each other; the first bell alloy member and the first "strength chain alloy sheet are pressed together, so that the first cesium alloy 201103660 piece and the first town bell alloy sheet are combined with each other. The utility model has the advantages that the first magnesium-lithium alloy member is firstly in contact with the second magnesium-lithium alloy plate, and the two-magnesium alloy is quickly obtained by pressing, forging, laser welding or bonding processing. The pieces are combined to form at room temperature, thereby saving manufacturing costs and reducing process procedures. The detailed features and advantages of the present invention are described in detail in the embodiments of the present invention, which are to be understood by those skilled in the art to understand the technical contents of the present invention. The above objects and advantages of the present invention will be readily understood by those skilled in the art. [Embodiment] In order to further understand the objects, structures, features, and functions of the present invention, the embodiments will be described in detail below. As shown in Fig. 1 and "2A" to "2C", "1" is a schematic diagram of the production process of the present invention - the embodiment, "2A to 2C" A schematic diagram of the flow of steps in accordance with an embodiment of the present invention. According to an embodiment of the present invention, the assembly process of the alloy component has at least a lower step, and a "first-test alloy member H" is provided, having a first connection. Face 11 (steps). A second alloy plate 提供 is provided having a second joint surface 21 (step 11 〇). In the embodiment of the present invention, the material composition of the first alloy member and the second alloy plate 2 includes a town, a bell, and a zinc, wherein the atomic percentage of the green element is the total alloy. The composition of a% (8) (four) ι% ·), the atomic percentage of the clock element 201103660 is the total composition of the alloy (8)% of the rule), the atomic percentage of the element is the total composition of the alloy c% (4)% ^% illusion %), and Lin% +You S 100〇/〇〇 will be the first _ alloy piece 1G grain on the second merging 20, and
第接。面11與第一接合面21相互接觸（步驟120)。如「第2B 圖」所示，係將第一鎂鐘合金件10疊置在第二雜合金板20上 方，並使第-鎂鐘合金件1〇的第一接合面U貼附在第二雜合 金板20的第二接合面2〗上。 子第鎮鐘。金件1〇及第二鎮鐘合金板2〇進行壓合而將 第:鎂鐘合金件1G與第二顧合金板2G相互結合（步驟⑽）。 如「第2C圖」所示，在此實施例中，先將第一鎮鐘合金件⑴及 第二_合金板20之成型溫度提高到25(TC至30(TC之高溫，再 以機械加工之處理方式，例如財M加工方錢鍛造加工方式， 在第-鎂齡金件1〇的上方施以―約屬侧衝擊力量，使得 第鎂鐘合金件10與第二鎂鐘合金板20在壓合過程中，因為第 接合面11與第二接合面21之間相互劇烈摩擦而產生一熱力， 使得第-接合面U與第二接合面21之間產生摩擦鱗作用而形 成一結合部位A，促使第-紐合金件1〇與第二驗合金板2〇 凝結為一體而成為永久性的結合狀態。 此外，上述以沖壓加工或鍛造加工方式將第一鎂鋰合金件1〇 ，第二鎂鐘合金板20結合在-起，此僅作為一較佳實施例之說 明’並非關在本發明之專娜護範_，另—個較佳實施例， 201103660 亦可以-黏著劑設置在第一接合面π與第二接合面2i之間，使 得第-賴合金件1〇與第二鎂鐘合金板2〇相互結合。或是，再 -較佳實補，似-雷贿接方式對第—接合面u與第二接合 面21焊接，進而將第-鎮鐘合金件1〇與第二鎮鐘合金板汾相互 結合。 特別值得注意的是，上述之實關巾，储第―脑合金件 10製成板件型態’並以上述的步驟·至步驟12〇將二雜合金 籲板相互結合。或者是在另一實施例中，將第一驗合金件10製成 -鎮鐘合金螺柱，並以上述的步驟應至步驟120將_合金螺 柱與顧合金板相互結合，當然本發明之保護翻砂上述之鎮 鋰合金板及鎂鋰合金螺柱的實施例為限。 另外，第-驗合金件10與第二鎂鐘合金板20不限制為一 方形板件，其亦可將第-鎂鐘合金件10與第二鎂鐘合金板20設 計成-圓柱形板件，是以，第一鎮鐘合金件10與第二_合金板 • 20的截面形狀可選自於圓柱形(cylinders)、立方體形(⑶㈣及長方 體形扣加㈣顺紅縣之—或其任纽合，但不並以此為限。 基於上述的技術，更可以製作一筆記型電腦的機殼外蓋(lcd Rear Cabinet ’ -般業界俗稱為A件）。請參閱「第3A圖」至「第 3E圖」所示，係為根據本發明之第一鎂鐘合金件一實施例之設置 • 有螺柱的流程示意圖。 如第3A圖」所示，第一鎮鐘合金件1〇主要將一鎮裡合金 板10a與-驗合金塊1〇b組裝在一起且鎮鐘合金板咖具有 201103660 一加工部1 la’其加工部1 la指的是在鎂鋰合金板1〇a上設有可供 進行機械加工的一區域部位，而加工部lla最佳位置是設置在鎂 鋰合金板10a的邊緣表面，但並不以此為限。 接著，將鎂鋰合金塊i〇b組裝在鎂鋰合金板10a之加工部lla 上，且鎂鋰合金塊10b的厚度係大於鎂鋰合金板1〇a的厚度，並 以較厚的鎂鋰合金塊l〇b組裝在較薄的鎂鋰合金板10a之加工部 lla上（如「第3B圖」所示）。因為鎂鋰合金塊1〇b結合在鎂鋰合 金板l〇a後具有一厚度’藉由此厚度以利於機械加工。舉例來說， 機械加工處理方式係可以沖壓或锻造之方式對設置在加工部lla 上的鎂鋰合金塊l〇b進行壓合，並透過壓合的力量，使得鎂鋰合 金板10a與鎂鐘合金塊10b結合成一鎂鐘合金板塊10c，並在鎂鐘 合金板塊10c上構成一螺柱12 (如「第3C圖」所示）。之後，便 可於螺柱12内部以攻牙或切削的方式形成有一螺孔121 (如「第 3E圖」所示）’使得第一鎂鋰合金件1〇藉由螺柱12進一步提供 鎖固使用。 接著，同步在螺柱12的一側邊加壓成型一側板13，藉由上述 鍛造或沖壓方式對鎂鋰合金板l〇a與鎂鋰合金塊l〇b進行壓合 時，因為模具形狀的設計，使得鎂鋰合金板與鎂鋰合金塊i〇b 受擠壓後，一部份的結構形成較厚的螺柱12，而另一部份的結構 則形成一側板13，並使側板13厚度約與鎂鋰合金板i〇a厚度大致 相同。之後’再將側板13折彎一角度，使側板13構成第一鎂鋰 合金件10的一側牆結構（如「第3D圖」所示），使得折彎的侧板 201103660 13豎立在雜合金板i0a側邊，以此構成側牆結構。若鎮鐘合金 板10a四周邊緣同時製作出側板n時，則可使得第一鎮鐘 ίο構成一框架結構。 13 如此-來，便可將第一馳合金件1〇製成筆記型電腦機殼的 外蓋(即A件），使得第一鎂鐘合金件1〇可同步一體成型有鎖固結 構及框架結構。是以，在製成筆記型電腦機殼的外蓋(即A件)、，° 可依照使用需求献寸規格*適時的增加外蓋厚度，主要以上述 •步驟100至步驟120的方式，將第一驗合金件1〇與第二脑合 金板2〇結合在_可崎擇性的增加筆記魏職殼的夕°卜 蓋厚度。 另外，如「第4A圖」所示之示意圖，係魏據本發明之第一 馳合金件另一實施例之設置有螺柱的流程示意圖。係提供一鎮 鐘合金螺柱30，驗合金 3〇内部具有—螺孔3卜並於雜 合金螺柱30底部設有-貼合面32。將龜合金螺柱％的貼合面 3^貼附在第-_合金件10上，並以雷射焊接、缺氧膠黏合、沖 堡加工的熔财式聽造加玉翁接方式，將馳合金螺柱知斑 第-馳合金件1G結合在—起，使得第—_合金㈣具有一 鎖固結構。並以上述步驟觸至步驟12〇的方式，將第一雜人 金件1〇與第二顧合錢2〇相題合，_構成筆記型電腦機 设之外蓋(即A件）。 係為根據本發明之第一鎂鋰合 "*、〜'圖。係提供一鎮鐘合金螺 如「第4B圖」所示之示意圖， 金件再一實施例之製造螺柱的流程 201103660 柱30，賴合金螺柱30内部具有一螺孔31，並於鍾合金螺柱 職部設有-插接部33。而第—馳合金件〗Q對應插接部％的 位置設有-插接孔14。並以雷射烊接、缺氧膠黏合、賴加工的 嫁接方式或鍛造加工·接方式，將驗合金· 3g的插接部^ 對應插設在第-馳合金件1G的插接孔14内，㈣驗合金螺 柱30與第-驗合金件1G結合在—起，使得第—_合金㈣ 具有-鎖固結構。並以上述步驟雇至步驟12〇的方式將第一 脑合金件K)與第二駿合金板勒互結合，進而構成筆記型 電腦機殼之外蓋(即A件）。 如第4C圖」所不之示意圖’係為根據本發明之第一•合 金件又-實施例之製造螺柱的流程示意圖。係提供—鎮鐘合金螺 柱3〇，紐合金螺柱30内部具有一螺孔3卜並於螺孔31 一側設 有-組裝孔34，組袋孔34係開設在驗合金螺柱3〇表面，並^ 組裝孔34的形狀朝向螺孔31方向概呈一漸縮狀。而第一驗合 金件1〇對應組裝孔34的位置設有一凸塊15,凸塊15的尺寸係2 配裝孔34的尺寸，並以並以雷射焊接、缺氧膠黏合方式，將鎮 鋰合金螺柱30與第一驗合金件10結合在-起。 、 另外，亦可將凸塊15的尺寸設計成略大於組裝子L %的尺寸， 並以機械加工處理方式，例如沖壓加工或鍛造加工等方式，將凸 塊15迫人組裝孔34内，並使凸塊15產生—型變，而將凸塊μ 結合在組裝孔34内’以此將鎂經合金螺柱30與第-鎂鍾合金件 10結合在一起。如此一來，便可藉由上述步驟100至步驟120的 201103660 方式，將第一鎂鋰合金件ίο與第二鎂鋰合金板2〇相互結合，進 而構成筆記型電腦機殼之外蓋(即A件）。 基於上述的技術，在壓合第一鎂鋰合金件與第二鎂鋰合金板 之前，更可包括以下一實施例的步驟：如「第5A圖」、「第5B圖」 所示，第一鎂鋰合金件10貫穿有至少一結合孔16，而第二鎂鋰合 金板20對應結合孔16位置設有至少一結合柱22，並使結合孔 的尺寸匹配於結合柱22的尺寸，再將結合柱22穿設在結合孔％ • 内，使得第一鎂鋰合金件與第二鎂鋰合金板20之間相互緊迫 結合。 另外，結合柱22係為一圓柱體並對插設在結合孔16，並於結 合孔16的末端具有一漸縮孔161，而結合柱22對應漸縮孔161 的一側設有一結合塊221 (如「第5C圖」所示），並使結合塊221 尺寸略大於漸縮孔161尺寸。以機械加工方式，例如沖壓或鍛造 方式，將結合柱22插設結合孔16，結合塊221會因壓合的應力作 • 用而擠入漸縮孔161内部，使得結合塊221產生一型變，令結合 柱22緊迫在結合孔16内部。 另外，結合柱22亦可為一圓錐體（如「第5D圖」所示），同 樣於結合柱22的一侧設有一結合塊221，並以機械加工方式，例 如沖壓或鍛造方式，將圓錐狀的結合柱22插設在結合孔16，並使 •圓錐狀的結合柱22受結合孔16的形狀限制，而將結合柱22擠入 .結合孔16内’同樣的，結合塊221亦擠入漸縮孔161内部，藉由 結合柱22的擠壓型變，使得結合柱22緊迫在結合孔16内部。 11 201103660 再者，基於上述的技術，在壓合第一鎂鋰合金件與第二鎂鋰 合金板之前，更可包括以下另一實施例的步驟：如「第6A圖」至 「第6C圖」所示，第一鎂鋰合金件1〇貫穿有至少一結合孔16, 而第二鎂鋰合金板20對應結合孔16位置設有至少一結合柱22， 並使結合柱22的尚度大於結合孔16的高度，再將結合柱22穿設 在結合孔16内，使得結合柱22露出於第一鎂鋰合金件1〇之上(如 「第6A圖」所示）。 之後，以機械加工處理方式，如沖壓或鍛造方式，對露出於 第-鎂縣金件ίο上的結錄22進行鉚合，使得結合柱22柳接 在第-鎂鐘合金件10上（如「第6B圖」所示）。再於結合柱 内部以攻牙或切削方式形成有一螺孔222 (如「第6C圖」所示）。 如此一來，便可藉由上述步驟100至步驟12〇的方式，將第一鎂 鋰合金件10與第二鎂鋰合金板20相互結合，進而構成筆記型電 腦機殼之外蓋(即A件）。 本發明之功效在於快速的將二鎂鋰合金件結合在一起，主要 依照筆記型電腦的機殼厚度尺寸，以沖壓加工、鍛造加工、雷射 焊接或黏合加工等方式，將二個或二似上的驗合金工件快 速、穩固的相互結合在一起。 雖然本發明以前述之實施例揭露如上，然其並非用以限定本 發明。在不脫離本發明之精神和範_，所為之更動與潤飾，均 屬本發明之專利傾範圍。關於本發明所界定之賴範圍請參考 所附之申請專利範圍。 > 12 201103660 【圖式簡單說明】 第1圖係為根據本發明_實施例之製作流程示意圖； 第圖至第2c圖係為根據本發明一實施例之步驟流程示意圖； 第圖至第3E圖係為根據本發明之第-鎮鐘合金件-實施例之 設置有螺桎的流程示意圖； 第4A ®係為根據本發明之第一賴合金件另一實施例之設置有 螺柱的流程示意圖； 第B圖係為根據本發明之第一鎮裡合金件再一實施例之設置有 螺柱的流程示意圖； 第4C圖係為根據本發明之第—雜合金件又—實施例之設置有 螺柱的流程示意圖； 第A圖及第SB gj係為根據本發明一實施例的第一錢經合金件與 第一鎂鐘合金板相互定位的流程示意圖； 第5C圖係為根據本發明之結餘-實關的示意圖； 第5D圖係為根據本發明之結合柱另一實施例的示意圖；以及 第6A圖及第6C圖係為根據本發明另一實施例的第一鎂鋰合金件 與第一鎂鐘合金板相互定位的流程示意圖。 【主要元件符號說明】 10 第一鎂裡合金件 10a 鎮鐘合金板 l〇b 鎂鐘合金塊 l〇c 鎂鋰合金板塊 13 201103660 11 第一接合面 11a 加工部 12 螺柱 121 螺孔 13 側板 14 插接孔 15 凸塊 16 結合孔 161 漸縮孔 20 第二鎂鋰合金板 21 第二接合面 22 結合柱 221 結合塊 222 螺孔 30 鎂鋰合金螺柱 31 螺孔 32 貼合面 33 插接部 34 組裝孔 A 結合部位First. The face 11 and the first joint face 21 are in contact with each other (step 120). As shown in the "Fig. 2B", the first magnesium alloy member 10 is placed over the second miscellaneous alloy sheet 20, and the first joint surface U of the first magnesium alloy member 1 is attached to the second The second joint surface 2 of the miscellaneous alloy sheet 20 is on. Zizhen Town Clock. The gold member 1〇 and the second ball alloy plate 2 are pressed together to bond the first magnesium alloy member 1G and the second alloy plate 2G to each other (step (10)). As shown in FIG. 2C, in this embodiment, the molding temperature of the first town alloy member (1) and the second alloy plate 20 is first increased to 25 (TC to 30 (TC high temperature, and then machined). The processing method, for example, the forging processing method of the money processing method, applies a “about side impact force” above the first magnesium-magnesium piece, so that the magnesium alloy part 10 and the second magnesium alloy sheet 20 are During the pressing process, a frictional force is generated between the first joint surface 11 and the second joint surface 21 to cause a frictional force between the first joint surface U and the second joint surface 21 to form a joint portion A. The first neo-alloy piece 1 〇 is condensed with the second alloy plate 2 而 to form a permanent joint state. Further, the first magnesium-lithium alloy part is firstly punctured by a press working or a forging process, and the second The magnesium alloy alloy plate 20 is incorporated in the same manner as the description of the preferred embodiment. It is not related to the present invention. Another preferred embodiment, 201103660 can also be used - the adhesive is set in the first Between the joint surface π and the second joint surface 2i, the first-lower alloy member 1〇 The second magnesium alloy plate 2 is combined with each other. Or, preferably, the squeezing method is used to weld the first joint surface u with the second joint surface 21, and then the first-town alloy piece 1 〇 and the second town bell alloy plate 汾 汾 汾 。 。 。 。 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二 第二The miscellaneous alloy plate is combined with each other. Or in another embodiment, the first alloy member 10 is made into a - bell alloy stud, and the above steps are to go to step 120 to form the alloy stud and the alloy plate. In combination with each other, of course, the embodiment of the present invention for protecting the sand-plated lithium alloy plate and the magnesium-lithium alloy stud is limited. In addition, the first-test alloy member 10 and the second magnesium alloy plate 20 are not limited to one square plate. The first magnesium alloy piece 10 and the second magnesium alloy plate 20 can also be designed as a cylindrical plate member, so that the cross-sectional shape of the first town ring alloy member 10 and the second alloy plate 20 can be Selected from cylinders, cubes ((3) (four) and cuboids plus (four) Shunhong County - or its new However, it is not limited to this. Based on the above technology, it is also possible to make a case cover for a notebook computer (lcd Rear Cabinet ' - commonly known as A piece in the industry). Please refer to "3A" to " 3E is a schematic view of a first embodiment of the first magnesium alloy member according to the present invention. The flow pattern of the stud is shown in Fig. 3A. The town alloy plate 10a is assembled with the --test alloy block 1〇b and the town clock alloy plate has 201103660. The processing part 1 la' has its processing part 1 la which is provided on the magnesium-lithium alloy plate 1〇a. An area for machining, and the optimum position of the processing portion 11a is provided on the edge surface of the magnesium-lithium alloy plate 10a, but is not limited thereto. Next, the magnesium-lithium alloy block i〇b is assembled on the processed portion 11a of the magnesium-lithium alloy plate 10a, and the thickness of the magnesium-lithium alloy block 10b is larger than the thickness of the magnesium-lithium alloy plate 1〇a, and the thick magnesium lithium is thicker. The alloy block l〇b is assembled on the processed portion 11a of the thin magnesium-lithium alloy plate 10a (as shown in "Fig. 3B"). Since the magnesium-lithium alloy block 1〇b is bonded to the magnesium-lithium alloy plate l〇a, it has a thickness by which the thickness is facilitated for mechanical processing. For example, the machining process can press or forge the magnesium-lithium alloy block 10b disposed on the processing portion 11a, and pass the force of the pressing, so that the magnesium-lithium alloy plate 10a and the magnesium clock The alloy block 10b is combined into a magnesium alloy plate 10c, and a stud 12 is formed on the magnesium alloy plate 10c (as shown in "Fig. 3C"). Thereafter, a screw hole 121 (shown in FIG. 3E) can be formed in the inside of the stud 12 by tapping or cutting to make the first magnesium-lithium alloy member 1 further securely locked by the stud 12. use. Then, the one side plate 13 is press-formed on one side of the stud 12, and the magnesium-lithium alloy plate 10a and the magnesium-lithium alloy block l〇b are pressed by the above-mentioned forging or punching, because of the shape of the mold. The design is such that after the magnesium-lithium alloy plate and the magnesium-lithium alloy block i〇b are extruded, a part of the structure forms a thick stud 12, and the other part of the structure forms a side plate 13 and the side plate 13 is formed. The thickness is approximately the same as the thickness of the magnesium-lithium alloy plate i〇a. Then, the side plate 13 is bent at an angle so that the side plate 13 constitutes a side wall structure of the first magnesium-lithium alloy member 10 (as shown in "3D"), so that the bent side plate 201103660 13 is erected in the heteroalloy. The side of the board i0a forms the side wall structure. If the side plate n is simultaneously formed at the peripheral edge of the town ring alloy plate 10a, the first town clock ίο can constitute a frame structure. 13 So, the first alloy parts can be made into the outer cover of the notebook computer case (ie, A piece), so that the first magnesium alloy part 1 can be synchronously integrally formed with the locking structure and the frame. structure. Therefore, in the cover of the notebook computer case (ie, A piece), ° can be increased according to the use requirements * timely increase the thickness of the cover, mainly in the above steps • Step 100 to step 120, The first alloy part 1〇 is combined with the second brain alloy plate 2〇 in the _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ Further, a schematic view as shown in Fig. 4A is a flow chart showing the arrangement of a stud according to another embodiment of the first alloy member according to the present invention. A town alloy stud 30 is provided, and the alloy has a screw hole 3 inside and a fitting surface 32 at the bottom of the miscellaneous alloy stud 30. The bonding surface 3^ of the turtle alloy stud is attached to the first-metal alloy 10, and is welded by a laser welding, an anoxic glue, and a punching-forward processing method. The alloy studs are known to be bonded to the first component, so that the first alloy has a locking structure. And in the above step, the method of step 12〇 is touched, and the first miscellaneous gold piece 1〇 is combined with the second muffin 2 piece, and the _ constitutes a cover of the notebook computer device (ie, A piece). It is the first magnesium-lithium "*,~' figure according to the present invention. A schematic diagram of a town bell alloy screw as shown in "Fig. 4B" is provided. The gold member is further illustrated in the embodiment of the manufacturing process of the stud column 201103660. The column 30 has a screw hole 31 inside the alloy stud 30 and is alloyed with a bell. The stud portion is provided with a plug portion 33. On the other hand, the first-stage alloy member Q is provided with a - insertion hole 14 at a position corresponding to the plug portion %. And in the laser splicing, the anoxic glue bonding, the grafting method of the processing or the forging processing and connection method, the plugging portion of the alloy 3g is correspondingly inserted into the insertion hole 14 of the first-speed alloy member 1G. (4) The alloy stud 30 is combined with the first alloy member 1G so that the first alloy (4) has a -locking structure. The first brain alloy member K) and the second alloy plate are combined with each other in the manner of the above steps, thereby forming a cover of the notebook computer casing (i.e., the A piece). Fig. 4C is a schematic view showing the flow of a stud according to a first embodiment of the present invention. The system provides the alloy bell 3 〇, the new alloy stud 30 has a screw hole 3 inside and is provided with an assembly hole 34 on the side of the screw hole 31, and the group hole 34 is opened in the alloy stud 3〇 The shape of the surface, and the assembly hole 34, is tapered toward the direction of the screw hole 31. The first inspection alloy member 1 is provided with a protrusion 15 corresponding to the position of the assembly hole 34. The size of the protrusion 15 is the size of the fitting hole 34, and is bonded by laser welding and anoxic glue. The lithium alloy stud 30 is combined with the first alloy member 10. In addition, the size of the bump 15 may be designed to be slightly larger than the size of the assembly L %, and the bump 15 is forced into the hole 34 by a mechanical processing method such as press processing or forging processing, and The bump 15 is deformed and the bump μ is incorporated in the assembly hole 34, thereby bonding the magnesium through the alloy stud 30 to the first magnesium alloy member 10. In this way, the first magnesium-lithium alloy member ίο and the second magnesium-lithium alloy plate 2〇 can be combined with each other by the method of 201103660 in the above steps 100 to 120 to form a cover of the notebook computer case (ie, A piece). Based on the above-mentioned technology, before the first magnesium-lithium alloy member and the second magnesium-lithium alloy plate are pressed together, the steps of the following embodiment may be further included: as shown in "5A" and "5B", first The magnesium-lithium alloy member 10 is inserted through at least one bonding hole 16 , and the second magnesium-lithium alloy plate 20 is provided with at least one bonding post 22 corresponding to the bonding hole 16 , and the size of the bonding hole is matched with the size of the bonding post 22 , and then The bonding post 22 is bored in the bonding hole %• such that the first magnesium-lithium alloy member and the second magnesium-lithium alloy plate 20 are tightly coupled to each other. In addition, the binding post 22 is a cylinder and is inserted into the coupling hole 16 and has a tapered hole 161 at the end of the coupling hole 16 , and a coupling block 221 is provided on the side of the coupling post 22 corresponding to the tapered hole 161 . (as shown in "Fig. 5C"), and the size of the bonding block 221 is slightly larger than the size of the tapered hole 161. The bonding post 22 is inserted into the coupling hole 16 by mechanical processing, such as stamping or forging, and the bonding block 221 is pressed into the inside of the tapered hole 161 by the pressing stress, so that the bonding block 221 generates a type change. The binding post 22 is urged inside the bonding hole 16. In addition, the binding post 22 can also be a cone (as shown in FIG. 5D), and a coupling block 221 is also provided on one side of the coupling post 22, and the cone is machined, such as stamping or forging. The binding post 22 is inserted into the coupling hole 16, and the conical coupling column 22 is restricted by the shape of the coupling hole 16, and the bonding column 22 is squeezed into the coupling hole 16. In the same way, the bonding block 221 is also squeezed. Inside the tapered hole 161, the bonding post 22 is pressed inside the bonding hole 16 by the extrusion deformation of the bonding post 22. 11 201103660 Furthermore, based on the above-mentioned technology, before pressing the first magnesium-lithium alloy member and the second magnesium-lithium alloy plate, the steps of another embodiment may be included: such as "6A" to "6C" As shown, the first magnesium-lithium alloy member 1 has at least one bonding hole 16 therethrough, and the second magnesium-lithium alloy plate 20 is provided with at least one bonding post 22 corresponding to the bonding hole 16 , and the bonding column 22 is greater than In conjunction with the height of the hole 16, the bonding post 22 is passed through the bonding hole 16 such that the bonding post 22 is exposed above the first magnesium-lithium alloy member 1 (as shown in FIG. 6A). Thereafter, the inspection 22 is stamped or forged, and the label 22 exposed on the first magnesium sheet is riveted so that the joint column 22 is joined to the first magnesium alloy member 10 (eg, "Figure 6B"). Further, a screw hole 222 is formed in the bonding column by tapping or cutting (as shown in "Fig. 6C"). In this way, the first magnesium-lithium alloy member 10 and the second magnesium-lithium alloy plate 20 can be combined with each other by the above steps 100 to 12, thereby forming a cover of the notebook computer case (ie, A). Pieces). The effect of the invention is to quickly combine the two magnesium lithium alloy parts, mainly according to the thickness of the casing of the notebook computer, by means of stamping, forging processing, laser welding or bonding processing, etc., two or two The upper alloy workpieces are quickly and firmly combined with each other. Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is to be understood that the modifications and refinements of the present invention are within the scope of the invention. Please refer to the attached patent application scope for the scope defined by the present invention. < 12 201103660 [Simplified Schematic Description] Fig. 1 is a schematic diagram showing a manufacturing process according to an embodiment of the present invention; and Fig. 2 to Fig. 2c are schematic flowcharts showing steps according to an embodiment of the present invention; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 4A is a schematic flow diagram of a first-lasting alloy member according to the present invention, in which a screw is provided; BRIEF DESCRIPTION OF THE DRAWINGS Fig. B is a schematic flow diagram of a stud provided with a first embodiment of the first inner alloy member according to the present invention; and Fig. 4C is a view of the first and second alloy members according to the present invention. Schematic diagram of the flow of the stud; FIG. A and the SB gj are schematic diagrams of the mutual positioning of the first carbon alloy piece and the first magnesium alloy plate according to an embodiment of the present invention; FIG. 5C is a diagram according to the present invention FIG. 5D is a schematic view of another embodiment of a bonded column according to the present invention; and FIGS. 6A and 6C are first magnesium-lithium alloy parts according to another embodiment of the present invention; With the first magnesium alloy plate Positioning a schematic flow chart. [Main component symbol description] 10 First magnesium alloy part 10a Town clock alloy plate l〇b Magnesium alloy block l〇c Magnesium lithium alloy plate 13 201103660 11 First joint surface 11a Processing part 12 Stud 121 Screw hole 13 Side plate 14 Inserting hole 15 Bump 16 Bonding hole 161 Reducing hole 20 Second magnesium-lithium alloy plate 21 Second joint surface 22 Bonding column 221 Bonding block 222 Screw hole 30 Magnesium-lithium alloy stud 31 Screw hole 32 Fitting surface 33 Insert Joint 34 assembly hole A joint portion