201100923 六、發明說明： 【發明所屬之技術領域】 本發明疋關於一種光源模組，且特別是關於一種應用於液晶顯示 器（liquid crystal display’ LCD)作為面光源的背光模組（back丨jght module) ° 【先前技術】 〇 〇 液晶顯示器主要包括液晶面板及背光模組，其中背光模組是 設置於液晶面板後方的面光源。依照光源組件，例如冷陰極射線 ^或發光二極體，的配置不同，背光模組可分為直下式背光模組 與側光式背光模組。側光式背絲組是將光馳件設置於導光板 的=邊，使得光源組件所發出的光束可從導光㈣·入射 從導光板的出光面出射。 A圖1A為習知之一種背光模組的爆炸圖，圖1B為圖1A之背光 模組於組裝後的局部剖面圖，請參考圖彳A及圖1B，習知的背光 核組10◦包括-導光板11Q、二光源組件12Q、二散孰板伽、 -反射片112、複數個光學膜片15〇以及一框架14〇。背光模组 ===从㈣雛，嶋·件12◦與散熱 ，130之數1白為二。此二光源組件12〇由一對冷陰極射線管或 -對發光二極體燈條構成，且分別設置於這對散熱板咖内。 導光板110具有_出光面11〇a、一相對於出光面勵的底 =110b、-連接出光面110a與底面11〇b的第—侧面徽及二 連接^光面110a、底面11(3b與第—側面㈣c的第二側面侧。 每^熱板130具有—支撐壁132、一第—導熱部134以及 弟一導熱部136,這對光源組件12〇分別配置於這對支樓壁 二、的支撐壁132的’延伸至導“11〇 的底面110b。第一導熱部136從對應的第一導熱部134延伸至導 4 201100923 光板110的第二侧面110d。此散熱板13〇的結構有助於增加光源 組件120的導熱途徑。 反射片112配設於導光板11〇的底面11〇b。這對支撐壁132 夾持導光板110及反射片112。 複數個光學膜片15〇,例如擴散片及增光片等，疊置於導光 板110的出光面11 〇a上。這些光學膜片15〇限位於框架“ο與 導光板110之間。 ~ 此值得注意的是’由於導光板110容易受到外界濕氣或光源組 η、#、，Q運作時產生的熱而產生膨脹變形，因此習知技術通常會在 導光板110與光源組件12〇之間保留一間隙D，以避免導光板11〇 在膨脹後因為膨張空間受限’使得整個導光板110勉曲變形，而 推擠到上方的液晶面板，造成顯示品質受損。 然而，上述之間隙D也相對使得導光板11〇與光源組件12〇 之間無法緊密配合’因此在導光板11Q與光源組件12Q組立之後， ，可此由於外力而使知導光板11Q產生晃動，並因為導光板 /、光源組件120相互撞擊而產生異音，且導光板n◦與光源组件 120亦可能因此受到磨損或損壞。此外，f光模组⑽的輝度也 因為導光板110與光源組件110之間的間隙D而降低。 〇 、嫩，了解決上述的問題，已有一些習知技術相繼被提出。舉凡 台4專利公告號M270369以及台灣專利公開號2〇〇72〇768，這些 習知技術採用在背光模組的框架上設置彈性裝置，由彈性妒置直 接推抵發光二極體，以使發光二極體緊靠至導光板。然而Γ彈性 裝置直接推抵發光二極體可能造成發光二極體的散熱不良，以 於發光二極體的使用壽命縮短甚至因溫度過高而損壞。 【發明内容】 提供_種背光模組，可使燈條抵接於導光板的人光面，並 可對導光板可能產生之膨脹提供適當之膨脹空間。 本發明的其他目的和優點可以從本發明所揭露的技術特徵中得 5 201100923 到進一步的了解。 為達上述之一或部份或全部目的或是其他目的，本發明之一 例提出-種背光模組，包括—背板、一導光板、至少—光源組件、至 少一散熱板以及至少一彈性裝置。導光板設置於背板上， 出光面、相對於出光面的—底面、連接出光面與底面的一第一二 二η連接底面、出光面及第_人光面的—側面。光源組件鄰近導 to面’光源組件包括—燈條，且燈條設置於散熱板上， 位於政熱減第-人絲之間。雜裝置設置於散與背板之間。 Ο201100923 VI. Description of the Invention: [Technical Field] The present invention relates to a light source module, and more particularly to a backlight module (back丨jght module) for use as a liquid crystal display (LCD) as a surface light source ° [Prior Art] 〇〇The liquid crystal display mainly includes a liquid crystal panel and a backlight module, wherein the backlight module is a surface light source disposed behind the liquid crystal panel. According to the configuration of the light source component, such as a cold cathode ray or a light emitting diode, the backlight module can be divided into a direct type backlight module and an edge light type backlight module. The edge-light backing wire set is such that the light-emitting member is disposed on the = side of the light guide plate, so that the light beam emitted from the light source assembly can be emitted from the light-emitting surface of the light guide plate from the light guide (four). 1A is an exploded view of a conventional backlight module, and FIG. 1B is a partial cross-sectional view of the backlight module of FIG. 1A after assembly. Referring to FIG. A and FIG. 1B, the conventional backlight core group 10A includes - The light guide plate 11Q, the two light source assemblies 12Q, the two diffuser plates, the reflective sheet 112, the plurality of optical films 15A, and a frame 14A. Backlight module === From (four) chick, 嶋·piece 12◦ and heat dissipation, 130 number 1 white is two. The two light source assemblies 12 are composed of a pair of cold cathode ray tubes or - pair of light emitting diode strips, and are respectively disposed in the pair of heat sinks. The light guide plate 110 has a _light-emitting surface 11〇a, a bottom =110b with respect to the light-emitting surface, a first-side surface emblem connecting the light-emitting surface 110a and the bottom surface 11〇b, and a second connection surface 110a and a bottom surface 11 (3b and The second side of the first side (four) c. Each of the hot plates 130 has a support wall 132, a first heat conducting portion 134, and a heat conducting portion 136. The pair of light source assemblies 12 are respectively disposed on the pair of wall walls. The support wall 132 extends to the bottom surface 110b of the guide 11. The first heat conduction portion 136 extends from the corresponding first heat conduction portion 134 to the second side surface 110d of the light guide plate 110 201100923. The structure of the heat dissipation plate 13 is The reflective sheet 112 is disposed on the bottom surface 11〇b of the light guide plate 11〇. The pair of support walls 132 sandwich the light guide plate 110 and the reflective sheet 112. The plurality of optical films 15〇, for example The diffusion sheet, the brightness enhancement sheet, and the like are stacked on the light-emitting surface 11 〇a of the light guide plate 110. These optical films 15 are limited to be located between the frame “o and the light guide plate 110. ~ It is worth noting that the light guide plate 110 is It is easy to be generated by the heat generated by external moisture or light source groups η, #, and Q. Inflated deformation, so the conventional technique generally maintains a gap D between the light guide plate 110 and the light source assembly 12〇 to prevent the entire light guide plate 110 from being distorted and deformed due to the limited expansion space of the light guide plate 11 after expansion. Pushing to the upper liquid crystal panel causes damage to the display quality. However, the gap D described above also makes the light guide plate 11〇 and the light source assembly 12〇 incapable of being closely matched. Therefore, after the light guide plate 11Q and the light source assembly 12Q are assembled, Therefore, the light guide plate 11Q is shaken due to an external force, and the light guide plate/light source assembly 120 is caused to collide with each other to generate an abnormal sound, and the light guide plate n◦ and the light source assembly 120 may be worn or damaged as a result. The brightness of the optical module (10) is also reduced by the gap D between the light guide plate 110 and the light source assembly 110. The above problems have been solved, and some conventional techniques have been proposed. The No. 4 Patent Publication No. M270369 And Taiwan Patent Publication No. 2〇〇72〇768, these conventional techniques employ an elastic device on the frame of the backlight module, and the elastic device directly pushes the light-emitting diode In order to make the light-emitting diode abut against the light guide plate. However, the elastic device directly pushing against the light-emitting diode may cause poor heat dissipation of the light-emitting diode, so that the service life of the light-emitting diode is shortened or even due to excessive temperature. The invention provides a backlight module, which can make the light bar abut against the human light surface of the light guide plate, and can provide a suitable expansion space for the expansion of the light guide plate. Other objects and advantages of the present invention can be From the technical features disclosed in the present invention, 5 201100923 is further understood. In order to achieve one or a part or all of the above or other purposes, an embodiment of the present invention provides a backlight module including a backplane and a a light guide plate, at least a light source assembly, at least one heat dissipation plate, and at least one elastic device. The light guide plate is disposed on the back plate, and the light emitting surface, the bottom surface of the light emitting surface, the first and second η connecting bottom surfaces connecting the light emitting surface and the bottom surface, the light emitting surface and the side surface of the _ human light surface. The light source assembly is adjacent to the guide surface. The light source assembly includes a light bar, and the light bar is disposed on the heat dissipation plate and located between the political heat minus the human filament. The miscellaneous device is disposed between the dispersion and the backboard. Ο
一々在本發明之一實施例中，導光板更包括相對於第一入光面之 一第二^光面，第二入光面連接出光面與底面，且此至少一光源組 件包含二光源組件’分別鄰近導光板之第一入光面及導光板之第二入 光面。 在本發明之一實施例中，背光模組更包括一框架、一反射片、 學膜片組。框架設置於背板上，導光板位於框架與背板之間，框 ^提供一開口，暴露出導光板。反射片設置於背板與導光板的底面之 抵接巾，雜__板而使燈條 ，在本發明之一實施例中，散熱板包括一支撐壁，支撐壁與第一 入光面相對，燈條設置於支撐壁上，且彈性裝置設置於支撐壁與背板 之間。 /' 在本發明之一實施例中，散熱板更包括連接支撐壁的一第一導 ，。卩」第一導熱部從支撐壁的一侧延伸至導光板的底面，且支撐壁與 弟‘熱部構成一 L字形的截面外形。此外，反射片設置於第一導熱 部與導光板之底面之間。 ”、、 一★在本發明之一實施例中，散熱板更包括連接第一導熱部的至少 一第二導熱部，且第二導熱部從第一導熱部的一側延伸至導光板的側 面。 a 在本發明之一實施例中，至少一第二導熱部包含二第二導熱 ^支撐2與這些弟一導熱部構成一门字形的截面外形，且彈性裝置 6 201100923 設置於第二導熱部與背板之間。 在本發明之一實施例中，散熱板更包括連接支撐壁的至少一第 三導熱部，且第三導熱部從支撐壁延伸至導光板之側面。 在本發明之一實施例中，至少一第三導熱部包含二第三導熱 4，支撐壁與這些第二導熱部構成一门字形的截面外形，且彈性裝置 設置於第三導熱部與背板之間。 在本發明之一實施例中，彈性裝置包括高導熱係數的材質。 在本發明之一實施例中，彈性裝置包括一彈簧、一彈片及一拉 簧的其中之一。 Ο 在本發明之一實施例中，彈性裝置與散熱板為一體成形。 相較於習知技術，在本發明之實施例之背光模組中，由於在 巧板與背板之間設置彈雜置’彈性s置於組裝後施力於散熱板而 使=組件接觸縣板之人光面，藉此可提高背光馳出光的輝度， 且‘光板受熱或文潮而產生膨脹時，彈性裝置可適當地被且 背板之間的赚可提供導缺的膨脹㈣，藉聽止導光板鲤 曲變形之問題發生。 ，讓本發明之上述特徵和優點能更_祕，下文特舉實施例， 並配&所附圖式作詳細說明如下。 〇 【實施方式】 ，關本發明之前述及其他技_容、特點與功效，在以下配合參 例的詳細說明中，將可清楚的呈現。以下實施例 附加例如：上、下、左、右、前或後等，僅是參考 = 此’使_方向聽是用來說·_來限制本 為太明之第一實施例的一種背光模組的爆炸圖，圖2Β 7 201100923 散熱板230、一背板260、至少一彈性裝置27〇及一框架24〇。於本 實施例中’背光模組2QQ係為雙邊侧邊人光式之絲模組，因此至少 一光源組件220的數量以二為例。這對光源組件22〇中的每一光源組 件220包括一燈條222，燈條222包括設置於燈條222表面的至少一 發光一極體224(圖2A例示為複數個）’且這對光源组件220的其中之 -的燈條222設置於散熱板230上，在本實施例中，另一光^组件 220可不設置於散熱板230上。導光板21〇具有一出光面21〇a、一 相對於出光面210a的底面210b、一連接出光面21〇a與底面21 〇b 的第一入光面210c及一連接出光面21〇a、底面21〇b與第一入光面 210c的側面210d。這對光源組件220的其中之一設置;;鄰近導光板 210的第一入光面21 〇c之位置處，位於散熱板230與第一入光面2i〇c 之間。框架240設置於背板260上，導光板21〇位於框架240與背 板260之間，且框架24〇提供一開口，暴露出導光板21〇。、 —在本實施例中，導光板210更包括相對於第一入光面21〇c之一 第二入光面210e，第二入光面210e連接出光面210a與底面210b， 且這對光源組件220的其中之另一鄰近導光板21〇之第二入光面 210e。 彈性裝置270设置於散熱板230與背板260之間，且彈性裝置 270適於施力於散熱板230而使燈條222的發光二極體224抵接於導 ❹光板210的第一入光面21〇c。在本實施例中，彈性裝置27〇例如為 彈簧。彈簧270適於對散熱板230施加彈力，使設置於散熱板230上 的燈條222受-朝向導光板210之第一入光面2i〇c的力，在本實施 例，，彈簧270施力於散熱板230而使燈條222抵接於導光板210 的第一入光面210c ;在另一實施例中，燈條222可不抵接於導光板 210的第一入光面21〇c ’且與導光板21〇的第一入光面21〇c維持一 間隔。在本實施例中，彈簧270之未受力前的長度大於散熱板23〇至 背板260之間的距離’當彈簧27〇裝置於散熱板230與背板26〇之 間而受力變形後，彈簧270可對散熱板230施加彈力，將光源組件 220朝導光板210推近’且藉由此彈力使發光組件22〇之出光面與導 光板210之第一入光面21〇c接觸，從而提高背光模組2〇〇的出光輝 8 201100923 度；此外，由於彈簧270具有彈性且散熱板230至背板260之間具有 一間隙，所以當導光板210受熱或受潮後產生膨脹時，彈簧270可適 當地被壓縮，且散熱板230至背板260之間的間隙可提供導光板210 的膨脹空間，以避免導光板210在膨脹後因為膨漲空間受限，使 得導光板210翹曲變形，而推擠到上方的光學膜片或液晶面板， 造成顯示品質受損的情況發生。 由於運作中的發光二極體224會發熱，為了散逸這些熱能來降低 溫度’散熱板230包括一支撐壁232及連接支撐壁232的一第一導熱 部234 ’支撐壁232與第一導熱部234構成L字形的截面外形，支撐 壁232與第一入光面210c相對，燈條222設置於支撐壁232上，第 〇 —導熱部234從對應的支撐壁232的一侧延伸至導光板210的底面 210b，且接觸背板260，因而增加導熱途徑；此外，在本實施例中， 彈簧270係設置於支撐壁232與背板260之間，且彈簧270具有高 ，熱係數的材質，可更進一步提高導熱的效率。依本實施例之設計， 當第一導熱部234與支撐壁232以一體成形方式製造時，也可以提高 導熱效果。 一在本實施例中，每個散熱板230更可具有至少一第二導熱部(未 繪示）’第二導熱部從對應的第一導熱部234延伸至導光板21〇的側 面210d，其中，每個散熱板230例如具有二第二導熱部，位於支撐 〇壁232的相對兩侧，使支撐壁232與這對第二導熱部構成一门字形的 截面外形’藉以進一步增加光源組件22〇的導熱途徑。在本實施 彈簧270與散熱板230亦可以為一體成形。 承上’背光模組200更可包括一反射片212,以提高光利用效率。 反射片212設置於背板26〇與導光板21〇的底面2·之間；於 施例中反射片212更設置於導光板21〇的底面2i〇b與第一導熱部234 括去之實施例外，在本發明之另—實施例中，散熱板230包 乂及至少一第三導熱部(未繪示），支樓壁232與第-入 。2相Ϊ，第三導熱部從支樓壁的—侧延伸至導光板之側面 其中’散熱板230例如具有二第三導熱部，位於支擇壁232 9 201100923 $相對兩侧’使支撐壁232與這對第三導熱部構成—n字形的截面外 在本實施例中，背光模組200更可包括一光學膜片組， 光2?，出光面210a上’且光學膜片組包括複數個光 予膜片250，运些光學膜片25〇包括一擴散膜、一稜鏡片 祕 的至少其中之…絲則25Q疊置於導絲21Q的出絲21曰如的 上方。在本實施例中，這些光學膜片25〇被限位於框架24〇與導光板 21〇之間。具體而言’這些光學膜片250的邊緣受到框架240的限位。 圖3A為本發明之第一實施例之背光模組300的示意圖，圖3B 為，3A之背光模組3〇〇的局部放大圖。請同時參考圖3A及圖3B， 本貝知例中之者光模組3〇〇與背光模組2〇〇相似，為方便說明，類 似的構件均以相同標號繪示，但光學膜片250在此未繪示。本實施 ^之背光模組300與上述背光模組200的差異為背光模組3〇〇的 彈性裝置370係為彈片，彈片37〇在受力變形後可容置於散熱板23〇 之支撐壁232與背板260之間的間隙，本實施例之背光模組3〇〇具 有與上述为光模組200(如圖2所繪示)類似的功效，在此不再重述。 圖4A為本發明之第三實施例之背光模組4〇〇的示意圖，圖4B 為圖4A之背光模組400的局部放大圖。請同時參考圖4A及圖4B， 本實施例中之背光模組400與背光模組2〇〇相似，為方便說明，類 〇似的構件均以相同標號繪示’但光學膜片25〇在此未繪示。本實施 例之背光模組400與上述背光模組2〇〇的差異為背光模組4〇〇的 彈性裝置470係為拉簧。在本實施例中具有二拉簧。這對拉簧47〇 係分別設置於散熱板230之相對兩侧，每一拉簧470的一端與散 熱板230連接，且每一拉簧470的另一端與背板260之與導光板 210的側面210d平行的邊框連接’使這對拉簧47〇得以拉住散熱板 230。每一拉簧470未受力的長度小於此拉簧470與散熱板230固接 的位置至此拉簧470與背板260固接的位置間的距離。因為拉簧470 連接於散熱板230與背板260之間，拉簧470提供拉力使散熱板230 上的燈條222受一朝向導光板210之第一入光面21〇c的力；在本實 施例中，散熱板230受拉簧470的拉力而使燈條222抵接於導光板 201100923 210的第一入光面210c，從而提高背光模組400的出光輝度，在另一 實施例中，燈條222可不抵接於導光板210的第一入光面21〇c，且 與導光板210的第一入光面210c維持一間隔。此外，由於拉簧47〇 具有彈力，所以當導光板210受熱或受潮後產生膨脹時，拉簧47〇可 適當地被拉伸，且散熱板230至背板260之間的間隙可提供導光板 210的膨脹空間’以避免導光板21〇翹曲變形。 具體來說，在本實施例中，這對拉簧470係分別勾設於散熱板 230的支撐壁232的相對兩側以及背板26〇之與導光板21〇的側面 2i〇d平彳的相對兩邊框之間，但拉簧47〇的設置方式不以此為限。 ο 值得注意的是，除上所述之實施例外’在本發明之另一實施例 中’政熱板230為上述之包括支撐壁232以及連接於支稽·壁232之相 對兩侧的二第三導熱部之形式，這對拉簧47〇之一的一端與這對第三 導熱部之-連接，這對拉簧470之-的另一端與背板26〇之與導^ 板210的側面21〇d平行的邊框連接；這對拉簧47〇之另一的一 之另一連接，這對拉簧470之另一的另-端與背； 260之〔與導光板21 〇的側面21 〇d平行的另一邊框連接。 Ο 綜上所述，在本發明之上述實施例中，光源組件設置於散埶板 ϋ在散熱板與f板之間設置彈性襄置。相較於習知技術，本&明 %赦二ί組?'以避免因為彈性裝置直接推抵光源組件而使光源組件因 ；此外’彈性裝置於組裝後施力於散熱板而使 产：、另外導光板之入光面的力，可有效提高背光模組出光的輝 二j，光板產生膨麟，彈性裝置可適當地獅變且散熱板至 可提供導光板的膨脹空間，避免導光板_變形之問 通發生，而使本發日月之背光她具有較佳之可靠度。 本發本㈣讀佳實細Μ，當錢以此限定 作之簡單Μ_ 17大凡依本發明申請專利範圍及發明說明内容所 的或優點倾=申凊專利範圍不須達成本發明所揭露之全部目 之======僅是用來辅助專利文件搜尋 11 201100923 【圖式簡單說明】 圖1A為習知之—種背光模組的爆炸圖。 圖1B為圖1A之背光模組於組合後 圖圖實施例的-種背 圖B為本發月之弟一實施例之背光模組的局部放大 圖2C為本發明之第_實施例之背光模組的俯視圖。、思 圖2D為圖2C之背光模組沿A_A線的剖面圖。 圖3A為本發明之第二實施例之背光模組的示意圖。 ❹ 圖3B為圖3A之背光模組的局部放大圖。 圖4A為本發明之第三實施例之背光模組的示意圖。 圖4B為圖4A之背光模組的局部放大圖。 【主要元件符號說明】 100、200、300、400 :背光模組 110、210:導光板 110a、210a :出光面 110b、210b :底面 〇 110c :第一側面 110d :第二側面 112、212 :反射片 120、220 :光源組件 130、230 :散熱板 132、232 :支撐壁 134、234 :第一導熱部 136、236 :第二導熱部 140、240 :框架 150、250 :光學膜片 12 201100923 D :間隙 210c :第一入光面 210d :側面 210e :第二入光面 222 :燈條 224 :發光二極體 260 :背板 270 :彈簧 370 :彈片 470 :拉簧In an embodiment of the invention, the light guide plate further includes a second light surface opposite to the first light incident surface, the second light incident surface is connected to the light surface and the bottom surface, and the at least one light source component comprises two light source components. 'Belong to the first light incident surface of the light guide plate and the second light incident surface of the light guide plate respectively. In an embodiment of the invention, the backlight module further includes a frame, a reflective sheet, and a film set. The frame is disposed on the back plate, and the light guide plate is located between the frame and the back plate, and the frame provides an opening to expose the light guide plate. The reflector is disposed on the back surface of the backboard and the bottom surface of the light guide plate, and the light strip is used in the embodiment. In one embodiment of the invention, the heat sink includes a support wall, and the support wall is opposite to the first light incident surface. The light bar is disposed on the support wall, and the elastic device is disposed between the support wall and the back plate. In one embodiment of the invention, the heat sink further includes a first guide connecting the support walls. The first heat transfer portion extends from one side of the support wall to the bottom surface of the light guide plate, and the support wall and the hot portion form an L-shaped cross-sectional shape. Further, the reflection sheet is disposed between the first heat transfer portion and the bottom surface of the light guide plate. In one embodiment of the invention, the heat dissipation plate further includes at least one second heat conduction portion connecting the first heat conduction portion, and the second heat conduction portion extends from one side of the first heat conduction portion to the side of the light guide plate In one embodiment of the present invention, the at least one second heat conducting portion includes two second heat conducting supports 2 and the heat conducting portions forming a cross-sectional shape of the gate shape, and the elastic device 6 201100923 is disposed on the second heat conducting portion. In an embodiment of the invention, the heat dissipation plate further comprises at least one third heat conduction portion connecting the support walls, and the third heat conduction portion extends from the support wall to the side of the light guide plate. In an embodiment, the at least one third heat conducting portion includes two third heat conducting portions 4, and the supporting wall and the second heat conducting portions form a cross-sectional shape of a gate shape, and the elastic device is disposed between the third heat conducting portion and the back plate. In one embodiment of the invention, the elastic means comprises a material having a high thermal conductivity. In an embodiment of the invention, the elastic means comprises one of a spring, a spring and a tension spring. Ο In an embodiment of the invention The elastic device is integrally formed with the heat dissipating plate. Compared with the prior art, in the backlight module of the embodiment of the present invention, since the elastic layer is disposed between the skill plate and the back plate, the elastic s is placed after assembly. Force the heat sink to make the component contact the smooth surface of the county board, thereby improving the brightness of the light emitted by the backlight, and when the light board is heated by the heat or the tide, the elastic device can be properly and between the back plates. Earning the expansion of the guideline (4), the problem of the distortion of the guide light plate occurs. The above features and advantages of the present invention can be made more succinct, the following specific embodiments, and the accompanying drawings The following is a description of the present invention and other features, features, and effects of the present invention, which will be clearly described in the following detailed description of the reference examples. , left, right, front or back, etc., only reference = this 'make the _ direction to use the _ to limit the explosion of the backlight module of the first embodiment of the present invention, Figure 2Β 7 201100923 Plate 230, a back plate 260, at least one bullet In the embodiment, the backlight module 2QQ is a bilateral side human light type silk module, so the number of at least one light source assembly 220 is exemplified by two. The pair of light source assemblies 22 Each of the light source assemblies 220 includes a light bar 222, and the light bar 222 includes at least one light emitting body 224 (illustrated as a plurality of FIG. 2A) disposed on the surface of the light bar 222 and the light source assembly 220 The light bar 222 is disposed on the heat sink 230. In this embodiment, the other light module 220 is not disposed on the heat sink 230. The light guide plate 21 has a light emitting surface 21〇a and a light emitting surface 210a. The bottom surface 210b, a first light incident surface 210c connecting the light emitting surface 21a and the bottom surface 21b, and a side surface 210d connecting the light emitting surface 21a, the bottom surface 21b and the first light incident surface 210c. The pair of light source assemblies 220 are disposed at a position adjacent to the first light incident surface 21 〇c of the light guide plate 210 between the heat dissipation plate 230 and the first light incident surface 2i 〇c. The frame 240 is disposed on the back plate 260, and the light guide plate 21 is located between the frame 240 and the back plate 260, and the frame 24 is provided with an opening to expose the light guide plate 21A. In this embodiment, the light guide plate 210 further includes a second light incident surface 210e opposite to the first light incident surface 21〇c, and the second light incident surface 210e is connected to the light surface 210a and the bottom surface 210b, and the pair of light sources The other of the components 220 is adjacent to the second light incident surface 210e of the light guide plate 21〇. The elastic device 270 is disposed between the heat dissipation plate 230 and the back plate 260, and the elastic device 270 is adapted to apply the force to the heat dissipation plate 230 to cause the light-emitting diode 224 of the light bar 222 to abut the first light entering the light guide plate 210. Face 21〇c. In the present embodiment, the elastic means 27 is, for example, a spring. The spring 270 is adapted to apply an elastic force to the heat dissipation plate 230 to bias the light bar 222 disposed on the heat dissipation plate 230 toward the first light incident surface 2i 〇c of the light guide plate 210. In this embodiment, the spring 270 applies a force. The light strip 222 is abutted on the first light incident surface 210c of the light guide plate 210 in the heat sink 230. In another embodiment, the light strip 222 may not abut the first light incident surface 21〇c' of the light guide plate 210. And maintaining a gap with the first light incident surface 21〇c of the light guide plate 21〇. In this embodiment, the length of the spring 270 before the unstressed force is greater than the distance between the heat dissipation plate 23〇 and the back plate 260. When the spring 27 is placed between the heat dissipation plate 230 and the back plate 26〇, the force is deformed. The spring 270 can apply an elastic force to the heat dissipation plate 230 to push the light source assembly 220 toward the light guide plate 210, and thereby the light-emitting surface of the light-emitting assembly 22 is brought into contact with the first light-incident surface 21〇c of the light guide plate 210 by the elastic force. Therefore, the brightness of the backlight module 2 is increased by 8 201100923 degrees. In addition, since the spring 270 has elasticity and a gap is provided between the heat dissipation plate 230 and the back plate 260, when the light guide plate 210 is heated or damp, the spring is generated. 270 can be properly compressed, and the gap between the heat dissipation plate 230 and the back plate 260 can provide an expansion space of the light guide plate 210 to prevent the light guide plate 210 from being warped and deformed due to the expansion space after the expansion of the light guide plate 210. And pushing the optical film or the liquid crystal panel to the top causes damage to the display quality. Since the operating LED 224 generates heat, in order to dissipate the thermal energy to lower the temperature, the heat sink 230 includes a supporting wall 232 and a first heat conducting portion 234 ′ connecting the support wall 232 to support the wall 232 and the first heat conducting portion 234. The cross-sectional shape of the L-shaped portion is formed. The support wall 232 is opposite to the first light-incident surface 210c, the light bar 222 is disposed on the support wall 232, and the second heat-conducting portion 234 extends from one side of the corresponding support wall 232 to the light guide plate 210. The bottom surface 210b is in contact with the back plate 260, thereby increasing the heat conduction path. Further, in the embodiment, the spring 270 is disposed between the support wall 232 and the back plate 260, and the spring 270 has a high thermal coefficient material. Further improve the efficiency of heat conduction. According to the design of the embodiment, when the first heat transfer portion 234 and the support wall 232 are integrally formed, the heat conduction effect can also be improved. In this embodiment, each of the heat dissipation plates 230 further has at least one second heat conducting portion (not shown). The second heat conducting portion extends from the corresponding first heat conducting portion 234 to the side surface 210d of the light guide plate 21A, wherein Each heat sink 230 has, for example, two second heat conducting portions on opposite sides of the supporting jaw wall 232, such that the supporting wall 232 and the pair of second heat conducting portions form a cross-sectional shape of the gate shape to further increase the light source assembly 22〇 Thermal conduction path. In the present embodiment, the spring 270 and the heat dissipation plate 230 may be integrally formed. The backlight module 200 can further include a reflective sheet 212 to improve light utilization efficiency. The reflective sheet 212 is disposed between the back plate 26A and the bottom surface 2· of the light guide plate 21〇. In the embodiment, the reflective sheet 212 is further disposed on the bottom surface 2i〇b of the light guide plate 21〇 and the first heat conducting portion 234. Exceptionally, in another embodiment of the present invention, the heat sink 230 encloses and at least a third heat conducting portion (not shown), the wall 232 and the first inlet. 2, the third heat conducting portion extends from the side of the wall of the branch to the side of the light guide plate, wherein the 'heat sink 230 has, for example, two third heat conducting portions, located on the opposite sides of the supporting wall 232 9 201100923 $ to make the supporting wall 232 In the present embodiment, the backlight module 200 further includes an optical film set, the light 2?, and the optical film set includes a plurality of optical film groups. The light is applied to the film 250, and the optical film 25 includes a diffusion film and at least one of the pieces of the film. The wire 25Q is stacked on top of the wire 21 of the wire 21Q. In the present embodiment, these optical films 25 are limited to be positioned between the frame 24A and the light guide plate 21A. In particular, the edges of these optical films 250 are constrained by the frame 240. 3A is a schematic view of a backlight module 300 according to a first embodiment of the present invention, and FIG. 3B is a partial enlarged view of a backlight module 3A of 3A. Please refer to FIG. 3A and FIG. 3B at the same time. The optical module 3 本 in the example of the present disclosure is similar to the backlight module 2 ,. For convenience of description, similar components are all shown with the same reference numerals, but the optical film 250 Not shown here. The difference between the backlight module 300 of the present embodiment and the backlight module 200 is that the elastic device 370 of the backlight module 3 is a spring piece, and the elastic piece 37 can be accommodated on the support wall of the heat dissipation plate 23 after being deformed by force. Between the 232 and the backplane 260, the backlight module 3 of the present embodiment has similar functions as the optical module 200 (shown in FIG. 2), and will not be repeated here. 4A is a schematic view of a backlight module 4A according to a third embodiment of the present invention, and FIG. 4B is a partial enlarged view of the backlight module 400 of FIG. 4A. Referring to FIG. 4A and FIG. 4B at the same time, the backlight module 400 in this embodiment is similar to the backlight module 2 ,. For convenience of description, similar components are shown with the same reference numerals, but the optical film 25 is present. This is not shown. The difference between the backlight module 400 of the present embodiment and the backlight module 2 is that the elastic device 470 of the backlight module 4 is a tension spring. In this embodiment, there are two tension springs. The pair of tension springs 47 are respectively disposed on opposite sides of the heat dissipation plate 230. One end of each tension spring 470 is connected to the heat dissipation plate 230, and the other end of each tension spring 470 and the back plate 260 are opposite to the light guide plate 210. The side frame 210d has a parallel frame connection 'to enable the pair of tension springs 47 to pull the heat sink 230. The length of each tension spring 470 that is unstressed is less than the distance between the position where the tension spring 470 is fixed to the heat sink 230 and the position where the tension spring 470 is fixed to the back plate 260. Because the tension spring 470 is connected between the heat dissipation plate 230 and the back plate 260, the tension spring 470 provides a pulling force to cause the light bar 222 on the heat dissipation plate 230 to receive a force toward the first light incident surface 21〇c of the light guide plate 210; In an embodiment, the heat dissipation plate 230 is biased by the tension spring 470 to abut the light-emitting plate 222 against the first light-incident surface 210c of the light guide plate 201100923 210, thereby improving the light-emitting brightness of the backlight module 400. In another embodiment, The light bar 222 may not abut the first light incident surface 21 〇 c of the light guide plate 210 and maintain a gap with the first light incident surface 210 c of the light guide plate 210 . In addition, since the tension spring 47 has an elastic force, when the light guide plate 210 is expanded by being heated or damp, the tension spring 47〇 can be appropriately stretched, and a gap between the heat dissipation plate 230 and the back plate 260 can provide a light guide plate. The expansion space of 210 'to prevent the light guide plate 21 from warping deformation. Specifically, in the embodiment, the pair of tension springs 470 are respectively disposed on opposite sides of the support wall 232 of the heat dissipation plate 230 and the side surface 2i 〇d of the back plate 26 与 and the light guide plate 21〇. Between the two frames, but the way of setting the tension spring 47〇 is not limited to this. ο. It is noted that, in addition to the above-described implementation exceptions, in another embodiment of the present invention, the hot plate 230 includes the support wall 232 and the two sides connected to opposite sides of the branch wall 232. In the form of three heat conducting portions, one end of one of the pair of tension springs 47 is connected to the pair of third heat conducting portions, and the other end of the pair of tension springs 470 and the side of the back plate 26 and the side of the guide plate 210 21〇d parallel frame connection; another connection of the other of the pair of tension springs 47〇, the other end of the pair of tension springs 470 and the back; 260 [with the side 21 of the light guide plate 21另一d parallel to another frame connection. In summary, in the above embodiment of the invention, the light source assembly is disposed on the diffuser plate, and an elastic device is disposed between the heat sink plate and the f plate. Compared with the prior art, this & 赦 赦 ί ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' In addition, the force of the light-incident surface of the light guide plate can effectively improve the light output of the backlight module, and the light plate generates the swelling. The elastic device can appropriately change the lion and the heat dissipation plate can provide the expansion space of the light guide plate to avoid the light guide plate. The _ deformation of the problem occurs, so that the backlight of the sun and the moon has better reliability. This book (4) read the fine details, when the money is limited by this _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The purpose of ====== is only used to assist patent file search 11 201100923 [Simple description of the figure] Figure 1A is an exploded view of a conventional backlight module. FIG. 1B is a partial enlarged view of a backlight module of the embodiment of the backlight module of FIG. 1A. FIG. 1B is a backlight of the embodiment of the present invention. FIG. Top view of the module. Figure 2D is a cross-sectional view of the backlight module of Figure 2C along line A_A. 3A is a schematic view of a backlight module according to a second embodiment of the present invention. 3B is a partial enlarged view of the backlight module of FIG. 3A. 4A is a schematic view of a backlight module according to a third embodiment of the present invention. 4B is a partial enlarged view of the backlight module of FIG. 4A. [Main component symbol description] 100, 200, 300, 400: backlight module 110, 210: light guide plate 110a, 210a: light emitting surface 110b, 210b: bottom surface 〇 110c: first side surface 110d: second side surface 112, 212: reflection Sheets 120, 220: light source assemblies 130, 230: heat dissipation plates 132, 232: support walls 134, 234: first heat transfer portions 136, 236: second heat transfer portions 140, 240: frames 150, 250: optical film 12 201100923 D : gap 210c: first light incident surface 210d: side surface 210e: second light incident surface 222: light strip 224: light emitting diode 260: back plate 270: spring 370: elastic piece 470: tension spring