TW201044942A - Housing, electronic device using the housing, and manufacturing method thereof - Google Patents

Housing, electronic device using the housing, and manufacturing method thereof Download PDF

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Publication number
TW201044942A
TW201044942A TW98118713A TW98118713A TW201044942A TW 201044942 A TW201044942 A TW 201044942A TW 98118713 A TW98118713 A TW 98118713A TW 98118713 A TW98118713 A TW 98118713A TW 201044942 A TW201044942 A TW 201044942A
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Taiwan
Prior art keywords
layer
photoelectric conversion
conversion layer
casing
substrate
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TW98118713A
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Chinese (zh)
Inventor
Chin-Hsien Liang
Ben-Ding Tsao
Wen-Lin Xiong
Dian-Ming Zhu
Jiang-Ying Hu
xian-ming Wu
yue-jun He
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Fih Hong Kong Ltd
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Priority to TW98118713A priority Critical patent/TW201044942A/en
Publication of TW201044942A publication Critical patent/TW201044942A/en

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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy

Abstract

The present disclosure provides a housing. The housing includes a transparent exterior coating and a substrate. The housing further includes a light-electricity changing coating set between the transparent exterior coating and the substrate. The light-electricity is used to change the luminous energy to electrical energy. The light-electricity changing coating is set with electrode interfaces. The present disclosure also provides an electronic device using the housing and manufacturing method thereof.

Description

201044942 四、指定代表圖: (一)本案指定代表圖為:第(1 )圖。 (二)本代表圖之元件符號簡單說明: 殼體 10 外表層 11 黏合層 12 光電轉化層 13 保護層 15 基體 17201044942 IV. Designated representative map: (1) The representative representative of the case is: (1). (2) Brief description of the symbol of the representative figure: Shell 10 Outer layer 11 Adhesive layer 12 Photoelectric conversion layer 13 Protective layer 15 Substrate 17

五、本案若有化學式時,請揭示最能顯示發明特徵之化 學式: 無 六、發明說明: 【發明所屬之技術領域】 本發明涉及一種殼體、應用該殼體之電子裝置及該殼 體之製作方法,特別涉及一種具光電轉化功能之殼體、應 ® 用該殼體之電子裝置及該殼體之製作方法。 【先前技術】 隨著消費水準之提高,通訊工具之數量及普及率越來 越高。目前,通訊工具之供電方式通常係充電電池,電池 中以鋰電池、鋰離子電池及鎳氳電池為主。這些充電電池 在其生產過程中對環境會產生污染。同時,由於充電電池 具有一定之使用壽命,當該充電電池使用一定時間後,就 會被廢棄,該廢棄之充電電池難以降解。故,幕多之廢棄 201044942 電池對環境造成之污染更加嚴重。另外,眾多充電電池之 使用會加大日趨緊張之能源供應壓力。 為此,人們開始利用太陽能或光能來輔助或取代充電 電池以提供給通訊工具或其他電子裝置之電能。太陽能或 光能係一種清潔、安全之天然能源,利用太陽能或光能為 通訊工具或電子裝置提供電能,將不失為一環保、節能、 經濟之選擇,同時可以缓解日趨緊張之能源供應壓力。 習知之以太陽能或光能輔助供電之通訊工具中,通常 0 係將太陽能電池板貼附或可拆卸地安裝於產品之殼體上, 這種貼附或安裝之方法容易使得太陽能電池板移位及被磨 損,從而影響其使用效果,且需要在殼體上預留必須之安 裝空間來容置該太陽能電池,致使殼體之結構變得複雜, 殼體之厚度變大。 【發明内容】 鑒於此,有必要提供一種不易移位、不被磨損、使用 效果穩定、佔用空間小之具光電轉化功能之殼體。 Q 另,還有必要提供一種應用上述具光電轉化功能之殼 體之電子裝置。 另,還有必要提供一種上述具光電轉化功能之殼體之 製作方法。 一種殼體,其包括一透明外表層及一基體,該殼體還 包括一夾設於透明外表層與基體之間之光電轉化層,該光 電轉化層用以將光能轉換為電能,所述光電轉化層上設置 有正負電極接口。 一種電子裝置,其包括一本體及一殼體,所述本體設 3 201044942 置有主板及蓄電池,主板上集成安裝有供電控製單元,所 述蓄電池供給電子裝置以電能;所述殼體包括一透明外表 層及一基體,該殼體還包括一夾設於透明外表層與基體之 間之光電轉化層,該光電轉化層用以將光能轉換為電能, 所述光電轉化層上設置有正負電極接口,該光電轉化層藉 由該二正負電極接口與所述主板之供電控製單元電性連 接,該光電轉化層吸收之光能藉由該供電控製單元轉化為 電能提供給所述蓄電池。 0 —種殼體之製作方法,其包括如下步驟: 注塑一透明外表層.; 製作一光電轉化層,並將該光電轉化層粘附於所述透 明外表層上; 於所述光電轉化層上注塑一基體。 相較於習知技術,本發明殼體之光電轉化層固定於外 表層與基體之間,使得本發明電子裝置在使用過程中,光 電轉化層吸收太陽光或燈光等可見光後進行光電轉換供給 Q 蓄電池以電能,實現隨時隨地自動充電,為該電子裝置提 供輔助電能,達到省電、節能、環保之目的;同時,光電 轉化層在使用過程中不易移位、不被磨損,使用效果穩定, 且該光電轉化層在殼體中之佔用空間小。 【實施方式】 請參閱圖1所示,本發明較佳實施方式之殼體10包括 一外表層11、形成於外表層11上之枯合層12、形成於米占 合層12上之光電轉化層13、形成於光電轉化層13上之保 護層15及注塑結合於保護層15上之基體17。 4 201044942 外表層11為透明塑膠層,該塑膠可選自為聚丙烯 (PP)、聚醯胺(PA)、聚碳酸酯(PC)、聚對苯二甲酸乙 二酯(PET)及聚曱基丙烯酸曱酯(PMMA)中之任一種。 該外表層11可經硬化處理,以使其表面光滑、防刮。外表 層之厚度約為0.175mm。 粘合層12為以塗覆之方式形成於外表層U 一表面之 粘膠層。該粘合層12起到將光電轉化層13粘附於外表層 11之作用。 ❹ 光電轉化層13為半導體PN結多晶矽片。在該光電轉 化層13上設置有正負電極接口(圖未示出),該正負電極 接口可為以印刷之方式分別形成於光電轉化層13相對二 表面之導電銀漿或鋁漿引腳。該光電轉化層13可吸收光 月匕’從而激發半導體PN結多晶矽片之電子發生越遷,成 為自由電子在PN結兩側集聚形成電位差(或電壓),當該 光電轉化層13之正負電極接口與外部電路接通時,在該電 壓之作用下’將會有電流流過外部電路產生電能。所述光 電轉化層13之厚度可在〇.i5-〇.25mm之間。 保護層15為以噴塗之方式形成於光電轉化層上之 粘合劑。該粘合劑之主要成分為合成樹脂。所述^護層= 之厚度在0.02-0.03mm之間。 °曰 基體17為一注塑塑膠層。形成基體之 ^ (叫、聚碳戲旨(PC)、_腈_苯乙豕丁二料$ 物(ABS)、聚甲基丙烯酸甲酯(ΡΜΜΑ)及聚 乙二醋(PET)等塑膠中之任-種。 …本-f酸 請結合參閱圖1及圖2所示,本發明較佳實施方式之 5 201044942 電子裝置20包括,本體21及裝設於本體21上之殼體1()。 所述本體21中設置有主板及蓄電池(圖未示),主板上集 成安裝有供電控製單元(圖未示)’所述蓄電池供給電子裝 置20以電能。所述殼體1〇包括一外表層11、形成於外表 層11上之粘合層12、形成於粘合層12上之光電轉化層 13、形成於光電轉化層13上之保護層15及注塑結合於保 護層15上之基體17。所述光電轉化層13為半導體pN結 多晶矽片,該半導體PN結多晶矽片上設置有正負電極接 0 口。該光電轉化層13藉由該二正負電極接口可與所述主板 之供電控製單元電性連接。所述光電轉化層13可吸收光 能,從而激發半導體PN結多晶矽片之電子發生越遷,成 為自由電子在PN結兩侧集聚形成電位差(即電壓)。當該 光電轉化層13之正負電極接口與本體21之供電控製單元 電性連接時,在所述電位差之作用下,將會有電流流過外 部電路產生電能’該電能將被存儲於所述蓄電池中以供給 所述電子裝置20以電能。所述電子裳置20之本體21可為 Q子機PDA、照相機、MP3或MP4之本體。 本發明較佳實施方式殼體10之製作方法包括如下步 m : 月參閱圖1所示’注塑成型-透明外表層11。注塑外 表層11之塑膠可為聚碳酸_ (pc)、聚對苯二曱酸乙二醋 (PET)、聚丙埽(pp)、聚醯胺(pA)及聚曱基丙稀酸甲 細# i MA)中之任一種。對該外表層11進行硬化處理, 使其表面光滑、可防刮。 在所述外表層11之一表面上用枯膠進行塗覆以形成 201044942 一枯合層12。 製作一光電轉化層13。 結多晶石夕片,其可以常規之;^轉化層13為半導體ΡΝ 方法製作形成。所述半導體ρΝ 日結多晶♦片之製作 外表層11之面積相當。將所述;;::片與所述 12枯附於外表層u上,獻八义化層13藉由點合層 9〇-1〇〇。(:之間。 ,5錢行乾燥,賴之溫度在 Ο 於所述光電轉化層13上#里 15可以喷塗之方式形成於光⑴該保護層 可為粘合劑’該枯合劑之主要 s ^塗用材料 塗有保護層15之絲層以^ °成_。將所述喷 具中,使其成型為殼體10之形狀 θ 13置於—成型模 將所述成型後之外表層tr及部分進行修剪。 塑模具中注塑-基體17於所述^2轉化層13置於一注 之材料可為聚乙烯(ΡΕ)、聚碳酸 烯-丁二烯共聚合物(ABSh ()、丙歸猜-苯乙 及聚對苯二甲酸乙一醋(二甲基丙婦酸甲醋(她) T夂乙一自“pET)塑膠中之任一種。 H賴佳實施方式之光電轉化層13較於外 光電H17rFaW附發明電子m在㈣過程中, 換4 3吸收场光或燈料可見光後進行光電轉 裝電能,實現隨時隨地自動充電,為該電子 哀置20棱供輔助電能,達到省電、 時’光電轉化層13在使用過栽Φ犯、衣保之目的’同 用效° 不易移位、不被磨損,使 Γ果穩疋,且在殼體10中之佔用空間小。 【圖式簡單說明】 7 201044942 圖1係本發明較佳實施方式殼體之剖視示意圖。 圖2係本發明較佳實施方式電子裝置之立體示意圖。 【主要元件符號說明】 殼體 10 外表層 11 黏合層 12 光電轉化層 13 保護層 15 基體 17 電子裝置 20 本體 21 〇 七、申請專利範圍: 1. 一種殼體,其包括一透明外表層及一基體,其中該殼 體還包括一夾設於透明外表層與基體之間之光電轉 化層,該光電轉化層用以將光能轉換為電能,所述光 電轉化層上設置有正負電極接口。 2. 如申請專利範圍第1項所述之殼體,其中所述光電轉 化層為半導體PN結多晶矽片,該光電轉化層上設置 有正負電極接口。 〇 3. 如申請專利範圍第2項所述之殼體,其中所述光電轉 化層之厚度在0.15-0.25mm之間。 4. 如申請專利範圍第1項所述之殼體,其中所述外表層 上塗覆有一钻合層,所述光電轉化層藉由該枯合層钻 附於外表層上。 5. 如申請專利範圍第4項所述之殼體,其中所述光電轉 化層上設置有一保護層,該保護層為以喷塗之方式形 成之枯合劑層,該點合劑層之厚度在0.02-0.03mm之 85. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: No. 6. Description of the invention: The present invention relates to a housing, an electronic device using the same, and the housing The manufacturing method relates to a housing with photoelectric conversion function, an electronic device for using the housing, and a manufacturing method of the housing. [Prior Art] With the increase in consumption levels, the number and popularity of communication tools are increasing. At present, the power supply method of communication tools is usually a rechargeable battery, and the battery is mainly composed of a lithium battery, a lithium ion battery, and a nickel-niobium battery. These rechargeable batteries can cause environmental pollution during their production. At the same time, since the rechargeable battery has a certain service life, when the rechargeable battery is used for a certain period of time, it is discarded, and the discarded rechargeable battery is difficult to degrade. Therefore, the obsolescence of the curtain is more serious. 201044942 The pollution caused by the battery is more serious. In addition, the use of many rechargeable batteries will increase the pressure on the increasingly tight energy supply. To this end, people have begun to use solar or light energy to assist or replace rechargeable batteries to provide power to communication tools or other electronic devices. Solar energy or light energy is a clean and safe natural energy source. Using solar energy or light energy to provide power for communication tools or electronic devices will be an environmentally friendly, energy-saving and economical choice, while at the same time alleviating the increasingly tight energy supply pressure. Conventionally, in a communication tool that is powered by solar energy or light energy, the solar panel is usually attached or detachably mounted on the casing of the product, and the method of attaching or installing is easy to shift the solar panel. And it is worn, thereby affecting the use effect thereof, and it is necessary to reserve a necessary installation space on the casing to accommodate the solar cell, so that the structure of the casing becomes complicated, and the thickness of the casing becomes large. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a housing having a photoelectric conversion function that is not easily displaced, is not worn, has a stable use effect, and has a small footprint. Q Further, it is also necessary to provide an electronic device using the above-described housing having photoelectric conversion function. Further, it is also necessary to provide a method of manufacturing the above-described housing having photoelectric conversion function. A casing comprising a transparent outer skin and a substrate, the casing further comprising a photoelectric conversion layer sandwiched between the transparent outer skin and the substrate, the photoelectric conversion layer for converting light energy into electrical energy Positive and negative electrode interfaces are disposed on the photoelectric conversion layer. An electronic device includes a body and a casing. The body device 3 201044942 is provided with a main board and a battery. The main board is integrally equipped with a power supply control unit, and the battery supplies electrical power to the electronic device; the housing includes a transparent An outer surface layer and a substrate, the housing further comprising a photoelectric conversion layer sandwiched between the transparent outer surface layer and the substrate, the photoelectric conversion layer for converting light energy into electrical energy, wherein the photoelectric conversion layer is provided with positive and negative electrodes The photoelectric conversion layer is electrically connected to the power supply control unit of the main board through the two positive and negative electrode interfaces, and the light energy absorbed by the photoelectric conversion layer is converted into electric energy by the power supply control unit to be supplied to the battery. 0 — a method of fabricating a shell, comprising the steps of: injecting a transparent outer skin layer; forming a photoelectric conversion layer, and adhering the photoelectric conversion layer to the transparent outer skin layer; on the photoelectric conversion layer Injection molding a substrate. Compared with the prior art, the photoelectric conversion layer of the casing of the present invention is fixed between the outer surface layer and the substrate, so that the photoelectric conversion layer absorbs visible light such as sunlight or light during the use of the electronic device of the present invention, and then photoelectrically converts and supplies Q. The battery uses electric energy to realize automatic charging anytime and anywhere, providing auxiliary energy for the electronic device, achieving the purpose of saving electricity, energy saving and environmental protection; meanwhile, the photoelectric conversion layer is not easy to be displaced or worn during use, and the use effect is stable, and The photoelectric conversion layer has a small footprint in the housing. [Embodiment] Referring to FIG. 1, a housing 10 according to a preferred embodiment of the present invention includes an outer skin layer 11, a dry layer 12 formed on the outer skin layer 11, and a photoelectric conversion formed on the rice occupying layer 12. The layer 13, the protective layer 15 formed on the photoelectric conversion layer 13, and the substrate 17 injection-molded to the protective layer 15. 4 201044942 The outer layer 11 is a transparent plastic layer, which may be selected from the group consisting of polypropylene (PP), polyamine (PA), polycarbonate (PC), polyethylene terephthalate (PET) and polyfluorene. Any of decyl acrylate (PMMA). The outer skin 11 can be hardened to make the surface smooth and scratch resistant. The outer layer has a thickness of about 0.175 mm. The adhesive layer 12 is an adhesive layer formed on the surface of the outer skin U by coating. This adhesive layer 12 serves to adhere the photoelectric conversion layer 13 to the outer surface layer 11.光电 The photoelectric conversion layer 13 is a semiconductor PN junction polycrystalline wafer. Positive and negative electrode interfaces (not shown) are disposed on the photoelectric conversion layer 13, and the positive and negative electrode interfaces may be conductive silver paste or aluminum paste pins respectively formed on opposite surfaces of the photoelectric conversion layer 13 by printing. The photoelectric conversion layer 13 can absorb the light moon 匕 ', thereby exciting the electrons of the semiconductor PN junction polycrystalline silicon wafer to move, and the free electrons are concentrated on both sides of the PN junction to form a potential difference (or voltage), when the positive and negative electrode interfaces of the photoelectric conversion layer 13 When connected to an external circuit, under the action of this voltage, a current will flow through the external circuit to generate electrical energy. The thickness of the photoelectric conversion layer 13 may be between 〇.i5 - 〇.25 mm. The protective layer 15 is an adhesive which is formed by spraying on the photoelectric conversion layer. The main component of the binder is a synthetic resin. The thickness of the layer is between 0.02 and 0.03 mm. ° The base 17 is an injection molded plastic layer. Forming the matrix ^ (called, polycarbon play (PC), _ nitrile _ benzopyrene two materials (ABS), polymethyl methacrylate (ΡΜΜΑ) and polyethylene vinegar (PET) and other plastics The present invention is described in conjunction with FIG. 1 and FIG. 2, and the preferred embodiment of the present invention 5 201044942 electronic device 20 includes a body 21 and a housing 1 () mounted on the body 21 () The main body 21 is provided with a main board and a battery (not shown), and the main board is integrally equipped with a power supply control unit (not shown). The battery is supplied to the electronic device 20 for electric energy. The housing 1 includes an outer casing. The surface layer 11, the adhesive layer 12 formed on the outer surface layer 11, the photoelectric conversion layer 13 formed on the adhesive layer 12, the protective layer 15 formed on the photoelectric conversion layer 13, and the substrate 17 injection-molded on the protective layer 15 The photoelectric conversion layer 13 is a semiconductor pN junction polysilicon wafer, and the semiconductor PN junction polysilicon wafer is provided with positive and negative electrode terminals. The photoelectric conversion layer 13 can be electrically connected to the power supply control unit of the main board through the two positive and negative electrode interfaces. Sexual connection. The photoelectric conversion layer 13 can absorb light energy, thereby exciting half The electrons of the conductive PN junction polycrystalline silicon wafer move more and more, and the free electrons accumulate on both sides of the PN junction to form a potential difference (ie, voltage). When the positive and negative electrode interfaces of the photoelectric conversion layer 13 are electrically connected to the power supply control unit of the body 21, Under the action of the potential difference, a current will flow through the external circuit to generate electrical energy. The electrical energy will be stored in the battery to supply power to the electronic device 20. The body 21 of the electronic skirt 20 may be Q. The main body of the PDA, the camera, the MP3 or the MP4. The manufacturing method of the housing 10 comprises the following steps: m: see the injection molding-transparent outer layer 11 shown in Fig. 1. The plastic of the outer surface 11 is injection molded. It can be any of polycarbonate_(pc), polyethylene terephthalate (PET), polypropylene (pp), polyamine (pA) and polymethyl methacrylate # i MA) One. The outer skin layer 11 is subjected to a hardening treatment to make the surface smooth and scratch-resistant. Coating on the surface of one of the outer skin layers 11 with a sizing gel to form a dry layer 12 of 201044942. A photoelectric conversion layer 13 is produced. A polycrystalline lithi piece can be conventionally formed; the conversion layer 13 is formed by a semiconductor germanium method. The surface of the semiconductor layer 11 is made of the outer layer 11. The ;;:: and the 12 are attached to the outer layer u, and the octagonal layer 13 is provided by the point layer 9〇-1〇〇. (: Between., 5 money drying, depending on the temperature on the photoelectric conversion layer 13 can be sprayed in the form of light (1) the protective layer can be the binder 'the main cause of the dry agent The coating material is coated with a silk layer of the protective layer 15 to form a shape of the casing 10, and the shape of the casing 10 is formed into a shape θ 13 placed on the outer surface of the forming mold. The tr and the part are trimmed. The injection molding-substrate 17 in the mold is placed on the conversion layer 13 and the material may be polyethylene (ΡΕ), polycarbonate-butadiene copolymer (ABSh (),乙归猜- Benzene and polyethylene terephthalate vinegar (dimethyl ketone methyl vinegar (her) T 夂 B one from the "pET" plastic. H Lai Jia implementation of the photoelectric conversion layer 13 In the process of (4), the external photoelectric H17rFaW is invented with electrons in the process of (4), and the photoelectric light is transferred to the light after the absorption of the field light or the visible light of the lamp, so that the electric charge can be automatically charged anytime and anywhere, and the electrons are provided for the auxiliary energy of the 20 ridges to save power. When the 'photoelectric conversion layer 13 is used in the use of Φ, the purpose of clothing insurance' is the same effect. It is not easy to shift, not worn, so that Fig. 1 is a schematic cross-sectional view of a preferred embodiment of the present invention. Fig. 2 is a schematic view of a preferred embodiment of the present invention. 3D schematic view of the device. [Main component symbol description] Shell 10 Outer layer 11 Adhesive layer 12 Photoelectric conversion layer 13 Protective layer 15 Substrate 17 Electronic device 20 Body 21 申请7. Patent application scope: 1. A housing comprising a a transparent outer surface layer and a substrate, wherein the housing further comprises a photoelectric conversion layer sandwiched between the transparent outer surface layer and the substrate, wherein the photoelectric conversion layer is used for converting light energy into electrical energy, and the photoelectric conversion layer is provided with 2. The casing of claim 1, wherein the photoelectric conversion layer is a semiconductor PN junction polycrystalline silicon wafer, and the photoelectric conversion layer is provided with positive and negative electrode interfaces. 〇3. The casing of claim 2, wherein the thickness of the photoelectric conversion layer is between 0.15 and 0.25 mm. 4. The casing of claim 1, wherein the outer layer is coated The casing is coated with a drilled layer, and the photoelectric conversion layer is attached to the outer surface layer by the dry layer. 5. The casing according to claim 4, wherein the photoelectric conversion layer is provided with a protective layer. The protective layer is a layer of a dry agent formed by spraying, and the thickness of the point mixture layer is 0.02-0.03 mm.

Claims (1)

201044942 圖1係本發明較佳實施方式殼體之剖視示意圖。 圖2係本發明較佳實施方式電子裝置之立體示意圖。 【主要元件符號說明】 殼體 10 外表層 11 黏合層 12 光電轉化層 13 保護層 15 基體 17 電子裝置 20 本體 21 〇 七、申請專利範圍: 1. 一種殼體,其包括一透明外表層及一基體,其中該殼 體還包括一夾設於透明外表層與基體之間之光電轉 化層,該光電轉化層用以將光能轉換為電能,所述光 電轉化層上設置有正負電極接口。 2. 如申請專利範圍第1項所述之殼體,其中所述光電轉 化層為半導體PN結多晶矽片,該光電轉化層上設置 有正負電極接口。 〇 3. 如申請專利範圍第2項所述之殼體,其中所述光電轉 化層之厚度在0.15-0.25mm之間。 4. 如申請專利範圍第1項所述之殼體,其中所述外表層 上塗覆有一钻合層,所述光電轉化層藉由該枯合層钻 附於外表層上。 5. 如申請專利範圍第4項所述之殼體,其中所述光電轉 化層上設置有一保護層,該保護層為以喷塗之方式形 成之枯合劑層,該點合劑層之厚度在0.02-0.03mm之 8 201044942 間。 6. 如申請專利範圍第5項所述之殼體,其中所述基體以 注塑成型之方式結合於保護層上,形成基體之材料為 聚乙烯、聚碳酸酯、丙烯腈-苯乙烯-丁二烯共聚合物、 聚曱基丙烯酸曱酯及聚對苯二甲酸乙二酯塑膠中之 任一種。 7. 一種電子裝置,其包括一本體及一殼體,所述本體設 置有主板及蓄電池,主板上集成安裝有供電控製單 Q 元,所述蓄電池供給電子裝置以電能;所述殼體包括 一透明外.表層及一基體,其中該殼體還包括一夾設於 透明外表層與基體之間之光電轉化層,該光電轉化層 用以將光能轉換為電能,所述光電轉化層上設置有正 負電極接口,該光電轉化層藉由該二正負電極接口與 所述主板之供電控製單元電性連接,該光電轉化層吸 收之光能藉由該供電控製單元轉化為電能提供給所 述蓄電池。 Q 8. 一種殼體之製作方法,其包括如下步驟: 注塑一透明外表層; 製作一光電轉化層,並將該光電轉化層粘附於所述 透明外表層上; 於所述光電轉化層上注塑一基體。 9. 如申請專利範圍第8項所述之殼體之製作方法,其中 所述光電轉化層為半導體PN結多晶矽片,該光電轉 化層上設置有正負電極接口。 10. 如申請專利範圍第8項所述之殼體之製作方法,其中 9 201044942 所述外表層注塑成型後在其一表面上塗覆一粘合 層,所述光電轉化層藉由該粘合層粘附於外表層上。 11.如申請專利範圍第8項所述之殼體之製作方法,其中 注塑基體前在所述光電轉化層上設置一保護層,該保 護層為以喷塗之方式形成之粘合劑。201044942 Figure 1 is a schematic cross-sectional view of a housing in accordance with a preferred embodiment of the present invention. 2 is a perspective view of an electronic device according to a preferred embodiment of the present invention. [Major component symbol description] Shell 10 Outer layer 11 Adhesive layer 12 Photoelectric conversion layer 13 Protective layer 15 Substrate 17 Electronic device 20 Body 21 〇 7. Patent application scope: 1. A casing comprising a transparent outer skin and a The substrate, wherein the housing further comprises a photoelectric conversion layer sandwiched between the transparent outer surface layer and the substrate, the photoelectric conversion layer is for converting light energy into electrical energy, and the photoelectric conversion layer is provided with positive and negative electrode interfaces. 2. The casing of claim 1, wherein the photoelectric conversion layer is a semiconductor PN junction polycrystalline silicon wafer, and the photoelectric conversion layer is provided with positive and negative electrode interfaces. 3. The casing of claim 2, wherein the photoelectric conversion layer has a thickness of between 0.15 and 0.25 mm. 4. The casing of claim 1, wherein the outer skin is coated with a drilled layer, the photoelectric conversion layer being attached to the outer skin layer by the dry layer. 5. The casing of claim 4, wherein the photoelectric conversion layer is provided with a protective layer, the protective layer is a layer of a dry agent formed by spraying, and the thickness of the point compound layer is 0.02. -0.03mm of 8 between 201044942. 6. The casing of claim 5, wherein the substrate is bonded to the protective layer by injection molding, and the material forming the substrate is polyethylene, polycarbonate, acrylonitrile-styrene-butyl Any of an olefinic copolymer, a polydecyl methacrylate, and a polyethylene terephthalate plastic. An electronic device comprising a body and a casing, the body is provided with a main board and a battery, and a power supply control unit Q is integrally mounted on the main board, and the battery supplies power to the electronic device; the housing includes a a transparent outer surface layer and a substrate, wherein the housing further comprises a photoelectric conversion layer sandwiched between the transparent outer surface layer and the substrate, the photoelectric conversion layer for converting light energy into electrical energy, and the photoelectric conversion layer is disposed The photoelectric conversion layer is electrically connected to the power supply control unit of the main board by the two positive and negative electrode interfaces, and the light absorbed by the photoelectric conversion layer can be converted into electric energy by the power supply control unit to be supplied to the battery. . Q 8. A method of fabricating a casing, comprising the steps of: injecting a transparent outer skin layer; preparing a photoelectric conversion layer, and adhering the photoelectric conversion layer to the transparent outer skin layer; on the photoelectric conversion layer Injection molding a substrate. 9. The method of fabricating a casing according to claim 8, wherein the photoelectric conversion layer is a semiconductor PN junction polycrystalline silicon wafer, and the photoelectric conversion layer is provided with positive and negative electrode interfaces. 10. The method of manufacturing the casing of claim 8, wherein the outer layer is injection-molded and coated on one surface thereof with an adhesive layer, the photoelectric conversion layer by the adhesive layer Adhered to the outer layer. 11. The method of manufacturing a casing according to claim 8, wherein a protective layer is disposed on the photoelectric conversion layer before the injection molding substrate, and the protective layer is an adhesive formed by spraying.
TW98118713A 2009-06-05 2009-06-05 Housing, electronic device using the housing, and manufacturing method thereof TW201044942A (en)

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Application Number Priority Date Filing Date Title
TW98118713A TW201044942A (en) 2009-06-05 2009-06-05 Housing, electronic device using the housing, and manufacturing method thereof

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TW201044942A true TW201044942A (en) 2010-12-16

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