TW201038186A - Microscale heat transfer systems - Google Patents

Abstract

This disclosure concerns micro-scale heat transfer systems. Some systems relate to electronics cooling. As a example, a microscale heat transfer system can comprise a microchannel heat exchanger defin ing a plurality of flow microchannels fluidicly coupled to each other by a plurality of cross-connect channels. The cross-connect channels can be spaced apart along a streamwise flow direction defined by the flow microchannels. Such a configuration of flow microchannels and cross-connect channels can enable the microchannel heat exchanger to stably vaporize a portion of a working fluid when the microchannel heat exchanger is thermally coupled to a heat source. Microscale heat transfer systems can also comprise a condenser fluidicly coupled to the microchannel heat exchanger and configured to condenser the vaporized portion of the working fluid. A pump can circulate the working fluid between the microchannel heat exchanger and the condenser.

Description

201038186 VI. INSTRUCTIONS: CROSS-REFERENCE TO RELATED APPLICATIONS This application is a continuation-in-part application and claim application for the US non-provisional patent application filed on July 29, 2009 Νο·12/511,945. U.S. Provisional Patent Application No. 61/156,465, filed on Aug. 27, 2009, U.S. Provisional Patent Application No. 61/233,090, filed on Aug. 11, 2009, U.S. Provisional Patent Application Serial No. 61/250, 511, filed on Jan. 1, 2009, and the priority of U.S. Provisional Patent Application No. 61/250,516, filed on Jan. The contents of each of the above-identified applications are hereby incorporated by reference. [Technical field to which the invention pertains] For example, a system for sub-cooling, which is installed in a supplementary application on a micro-scale heat transfer system, as an example, an add-in card is cooled. Electronic parts on. [Prior Art]

The heat transfer rate, the instrument) is placed with such parts and thereby maintains the 201038186 part/JSL degree at or above the upper critical temperature during operation. Referring to Figure iA, a plurality of electronic components 42, 44 and - or more substrates - can be electrically coupled to each other in an operational configuration 5 (). The operative configuration 5 can include a motherboard for a general purpose computing device, an add-on card for providing certain functions to a computing device, a logic board for a particular computing device, and the like. As an example, the operational configuration 5() can include a display card constructed to provide image processing and output. Referring to FIG. 1B, two or more electronic components 42, 44 may be mounted to the side of the substrate 46 using various conventional techniques, such as, for example, soldering. In the case of a = operational configuration, the substrate 46 is a laminated substrate comprising to Ζ and at least one corresponding dielectric layer. The layered substrate may comprise a Ui via layer - or more layers of dielectric material from adjacent sources - an example of a printed circuit board (PCB) being such a laminate substrate. During the manufacturing period, the 'following the selected design can be produced in individual singles: wide physical differences. For example, 'the material properties can vary with each-batch, and the part 42, 44 f $f is thin, a high-volume one measured from the adjacent surface of the substrate 46 to an upper surface of the part: or 疋&; degree") can vary with each batch, and even between single and early yuan. The camera between these and other objects 42, 44 left/, j V is twisted on the part even with the corresponding difference of z_shang (eg 'Z2 - Z】). For example, a relatively 2_high pair, or more, between the parts 42, 44 can be operatively constructed even with a well-controlled system. & individual process units can vary up to +/- 〇.020. Furthermore, when electronic part design evolves to achieve higher levels of performance, 5 201038186 integrated circuit operation incorporates more transistors at higher frequencies And occupy less physical space, @ leads to higher operating power, higher heat flux or both. While some parts have been designed to exceed the cooling capacity of conventional cooling systems, they are expected to continue to move toward increased power and heat flux. The relentless pursuit of new cooling technology has traditionally only resulted in an increase in cooling capacity. For example, a cooling device achieves a temperature improvement compared to another cooling device, when 150 watts (W) is emitted (for example, from a semiconductor modulus of about 1 square centimeter) even if it is only 3 or 4 degrees fc) It is considered as a significantly improved cooling device. Some failed attempts have used microchannel heat exchangers to combine the latent heat of phase change, and in particular, the latent heat of evaporation, some of the coolant (e.g., boiling) to cool the high power (and high heat flux) device. In previous attempts, a common disadvantage of using a boiling through a microchannel heat sink to remove waste heat from, for example, an electronic component is the unstable fluctuations in coolant flow rate and corresponding fluctuations in coolant temperature and pressure. SUMMARY OF THE INVENTION The present disclosure is directed to a microscale heat transfer system. Some systems are about electronic cooling. For example, a micro-scale heat transfer system can include a microchannel heat exchanger that defines a plurality of microchannels that are fluidly coupled to each other by a plurality of cross-connect channels. The cross-connect channels may be spaced apart along the direction of flow defined by the microchannels. This configuration of the microchannels and cross-connect channels allows the microchannel heat exchanger to vaporize a portion of a working fluid stably as the microchannel heat exchanger is thermally coupled to a heat source. The micro-scale 201038186 heat transfer system can also include a condensation crying, ώΛ Λ μ 动 至 至 至 至 至 至 至 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 A pump can circulate the working fluid between the microchannel heat exchanger and the condenser. Microchannel heat exchangers and Condensation Cry I - Human & People Condensation can include a part of the integrated subassembly. For example, a first plate can define the opposing inner and outer major surfaces. The inner main surface of the first plate can define a 散热 疋 a heat dissipation area is constructed to accommodate

The microchannel is hot and versatile. A second panel can define opposing interior and exterior major surfaces: the interior major surface of the second panel can define a lid region and a condenser region. The first plate and the second plate can be fixedly locked in the opposite direction of the jade, so that the individual inner main faces face each other. The microchannel heat exchanger can be disposed between the first plate and the second plate. The microchannel heat exchanger is thermally coupled to the heat sink region. The lid region can be placed over a plurality of microchannels to define a flow boundary of the microchannel. The condenser zone of the second plate and the corresponding, opposite zone of the first plate may define at least one condenser flow path. The condenser region of the second plate may define a plurality of fins extending from an inner major surface of the second plate and the plurality of fins are spaced apart from each other along a flow direction defined by the at least one condenser flow path . In some examples, at least one of the plurality of extended surfaces is a corresponding portion that is welded to the interior surface of the first panel. An integrated subassembly can further include a plurality of fins extending from an outer major surface of the first panel, the second panel, or both. In some micro-scale heat transfer systems, the outer major surface of the first panel defines an elevated surface that is substantially opposite the heat sink region defined by the inner major surface of the first panel 7 201038186 And positioning. The microchannel heat exchanger can include a first microchannel heat exchanger and a second microchannel heat exchanger. The heat sink region can include a first heat sink region and a first heat sink region. The first heat sink region can be configured to receive the first microchannel heat sink, and the second heat sink region can be configured to receive the second microchannel heat sink. In some examples, the lid region includes a first lid region and a second lid region. The first lid region can be placed on the first heat exchanger and the second lid region can be placed on the second microchannel heat exchanger. The condenser zone can include a first condenser zone and a second condenser zone. The first microchannel heat sink and the first condenser region can be fluidly coupled in series to the second microchannel heat sink and the second condenser region. In other examples, the first microchannel heat sink and the first condenser region can be fluidly coupled in parallel to the second microchannel heat sink and the second condenser region. A pump housing manifold can define an interior chamber that is configured to receive a pump, an inlet opening and an outlet opening. The pump can be positioned at least partially within the interior chamber of the outer cover manifold. The pump defines an inlet and a pump outlet. The pump inlet can be fluidly coupled to an inlet opening of the pump housing manifold and the pump outlet can be fluidly coupled to an outlet opening of the pump housing manifold. The flow cross section of one or more microchannels may define an aspect ratio greater than about 1 〇: 1, such as an aspect ratio of 'e' Additional cards for computer systems are also disclosed. Some of the disclosed add-on cards 8 201038186 comprise a substrate 'the substrate comprising a plurality of circuit parts electrically ground circuit portions' and at least - an example of coupling to the circuit blocks, the integrated body when operating ^ At least - the ° in the majority - the cooling system can contain a work ~ part of the government fever. For additional cards The evaporator can be positioned adjacent to the integrated body; Circuit parts. The evaporation n can define a plurality of intersections and join micro-edge complexes Ο 0 = ΓΓ evaporation... the body-parts are two-two = radiated heat. The condenser can be supported by the substrate in part by the flowing light cattle. - Chestnut method I ... the benefit and at least the condenser 'for an operable cycle between the benefit and the condenser. The portion of the condenser and the evaporator that can include an integrated subassembly includes opposing first and second plates. For example, (4) the transmitter 'includes - the microchannel heat sink is disposed between the first and second plates. The plurality of fins may extend outwardly from the first panel, the second panel, or both. In some examples, the evaporator comprises a first evaporator and a second evaporator. The first hair expander and the second evaporator are fluidly coupled to each other in series. The first evaporator and the second evaporator are flowably coupled in parallel with one another: In some examples, the helium condenser also includes a plurality of fins extending outwardly. The add-on card may also include a shroud disposed on the fins and a blower constructed to pass air over the fins such as § hai. In addition, when evaporators, condensers, pumps, fins, and blowers are operatively positioned relative to one another and integrated circuit components, the evaporator 'condenser, pump' fins and blowers may, in some instances, 9 201038186 , fit in the volume of 1 broken fine A leaf multiplied by the shot. The poly can be positioned relative to other parts of the add-on card to at least partially direct air from the blower between the fins. The chassis member can be placed on a portion of the substrate and snapped over at least a portion of the substrate. The condenser can be (4) attached to the chassis member such that the chassis selects the condenser. Accordingly, the crucible, the feed 1 can be at least partially supported by the substrate. Methods of cooling electronic components are also disclosed. For example, a method of cooling an electronic component can include a working fluid flowing into a plurality of microchannels in a majority liquid phase. The working fluid is absorbed by the heat dissipated by the electronic components. In some examples, a portion of the working fluid evaporates within the microchannel. The integrated working fluid can flow from one of the microchannels to the other of the microchannels at or more along the flow direction of the microchannels. This flow balances the pressure between the microchannels at least partially in the flow direction. The vaporized working fluid can be condensed in a condenser. The act of condensing the vaporized working fluid in the condenser can include flowing air across a plurality of fins extending from the surface of the condenser. In some embodiments, the electronic component includes a first packaged integrated circuit die and a second packaged integrated circuit die. The plurality of microchannels can include a first plurality of microchannels positioned adjacent to the first integrated circuit mode and a second plurality of microchannels positioned adjacent to the second integrated circuit mode. The act of flowing the working fluid from one of the microchannels to the other of the microchannels can include flowing the working fluid from one of the microchannels of the first plurality of microchannels to the other of the microchannels of the first plurality of microchannels, and Flowing from one of the microchannels of the second plurality of microchannels 10 201038186 to the other of the microchannels of the second plurality of microchannels. In this example, 'the working fluid is evaporated in the microchannel = microfluid-fluid. The microchannel can also be enclosed in a second plurality of microchannel evaporation working fluids. The condenser may comprise a first condenser portion and a second condenser portion. Cooling in condensing II; the behavior of the vaporized working fluid is suspected to include the first plurality of channels in the first condensing portion 11 condensing the vaporized working fluid.

The above and other features and advantages will become more apparent from the following description of the drawings. The following description will be continued with reference to the accompanying drawings. [Embodiment] Various principles regarding a micro-scale heat transfer system are described below by referring to an exemplary system. One or more of the disclosed principles can be incorporated into various system configurations to achieve various micro-scale heat transfer system features. The system for cooling one or more electronic components is only an example of a micro-scale heat transfer system and will be described below to illustrate various aspects of the principles disclosed herein. In a sense, a microscale heat transfer system can include a first heat exchanger configured to allow a working fluid to absorb heat from a heat source (eg, by evaporation), and a second heat exchanger configured to allow the The working fluid removes the absorbed heat to an environmental medium (e.g., by condensation) and a pump is constructed to circulate the working fluid between the first and second heat exchangers. In another sense, the microscale heat transfer system includes a method of dissipating heat from a high heat flux region across a low temperature gradient. Principles of such a microscale heat transfer system 11 201038186 The coupling system (also referred to herein as a "cooling system") is constructed to cool the mounting to the add-on card - or more electronic components - some cooling system definition - integrated cooling A system that is sized to fit within a small 'tight volume, such as, for example, a physical size that is compatible with cardiac specifications (phy(10)丨f(mn faet. (10). For example, for the largest application of some applications) The thickness (including the thickness of a printed circuit board and the height of any part mounted on the printed circuit board) can be about 1 375 leaves (eg, a "double slot" PCIe card) and about 0.57 pairs for other applications (eg, "Single-slot" PCIe card. This cooling system can include an included, driven, two-phase fluid circuit' which will be described more fully below. Additional aspects of the cooling system will also be described. Some cooling systems 1 〇〇, 2 〇〇, 3 〇〇, 4 〇〇 can be combined with a volume measurement of about 1 〇 % 吋 multiplied by ^ / 8 吋 multiplied by about (10) 吋, and can cool the first and the first Two parts, each of which is continuous Dissipates approximately 15 watts (w) (300W total), a temperature difference of approximately 35 degrees Celsius between a maximum part temperature (eg, a cabinet temperature) and an ambient air temperature. Other cooling systems (including this cooling system) Some working embodiments) can sufficiently cool the first and second parts, each of which emits about 200 W (400 W total). Some of the disclosed cooling systems can simultaneously accommodate the z_ between the parts. The height varies by more than 0.020 inches, such as up to about 〇3 〇. As used herein, "microchannel" means that a channel has at least one major dimension (eg, a channel width) measured to be less than about 丨. Millimeter, such as, for example, 'about 0.1 mm, or tens of millimeters. As used herein, 'flowing' means either a fluid (example 12 201038186, for example, a mixture of gas, liquid, liquid or gas phase). Therefore, the two regions are "fluidly coupled" to each other to allow a fluid to flow from the region to other regions to reflect the pressure gradient between the regions. As used herein, the term "working fluid"; and "cold "The agent" is interchangeable. Referring to Figure 2, a cooling system 100 can include one or more microchannel heat sinks 110, 120 (e.g., a first heat exchanger, also referred to as an "evaporator") constructed Cooling one or more individual electronic components 42, 44 (Fig. i, Fig. 4A), such as by a working fluid (not shown) through the heat sink, promoting the heat dissipated by the individual electronic components, Q2 absorption In some systems, the liquid phase or a saturated mixture of liquid and gas can enter the evaporator 丨丨〇, 丨 2 〇. When the heat Q!, Q2 is exchanged to the working fluid, the liquid portion can be in the individual evaporator 110 Evaporation in '120. Since the latent heat of evaporation (or condensation) is typically much greater than the specific heat of a given fluid, more heat can usually be absorbed by subjecting the fluid to a phase change than a change in temperature alone. Or remove. System 100 can also include one or more condensers 130 (e.g., a second heat exchanger) configured to facilitate the removal of heat, Q2, absorbed by the working fluid in individual evaporators 110'120. In some systems, a gas phase or a saturated mixture of liquid and gas can enter the condenser 13 after passing through the evaporators 110,120. When the thermal Q〇ut is exchanged from the working fluid and the condenser 1 30, a vapor portion of the working fluid can condense. A pump 150 can circulate a working fluid between the radiator 110' 120 and the condenser 130. The pump 1 5 can be fluidly stalked to a manifold 152 to distribute the working fluid between the various parts of the fluid circuit defined by the cooling system 1 2010. As described more fully below, the outer cover 155 for the pump 15A can define a manifold 152 (also referred to herein as a "pump-cover manifold"). The condenser 130 can be configured to remove absorbed heat Q 1 ' out ' Q2 . out to a local fluid (eg, air μ 〇 i from a local environment. For example, as described more fully below, a cooler 160 may be thermally consumed to condense 130 to remove heat absorbed from the fluid. In this embodiment, an air-cooled heat sink 162 may be thermally coupled to the condenser 13 〇 < 3 in some examples The 'condenser 130 supports the extended heat transfer surface, or the fins, which are positioned on an outer surface of the condenser' to provide an integrated condenser and heat sink subassembly (eg, a single configuration). The accumulation of heat, carrying and removing can improve the cooling of electronic components (eg, heat transfer rates from electronic components) compared to conventional cooling systems that have been used to cool electronic components. Improved heat transfer rates allow electronic components 42, 44 For more than a given temperature difference between the part and the environment, it allows the β-flat electronic parts to achieve a higher level of performance without improving the environment (for example, reducing the ambient temperature) or improving the electronic parts. The critical temperature is set (e.g., the upper critical temperature is increased). As indicated in Figure 3, the disclosed cooling system can cool more than about 70 watts per square centimeter of heat flux (w/cm2) and up to about 200 W/cm2, such as For example, 'between about 80 W/cm 2 and about 190 W/cm 2 , having a working fluid flow rate of less than about 400 ml per minute (ml/min), such as, for example, between about 75 ml/min and about 300 ml/min. The disclosed cooling system incorporates a fruit that is constructed to distribute working fluid between various system components. Conversely, a passive two-phase system (also known as a "heat pipe cooling" system or 14 201038186 is a "hot siphon officer". The system can cool down to only about 6 〇 w/cm 2. This passive two-phase system relies on surface tension and boiling to "pump" a working fluid through the system. Although some single-phase cooling systems may be able to cool up to about 200W/cm2, this single-phase cooling system requires very large working fluid flow rates (eg 'between about 700 ml/min and about i500 ml/min) and correspondingly large parts are constructed to accommodate the bulk of the coolant. One operating system 'This large' oversized part will not fit into a tight volume, as defined by the PCIe specification. For example, conventional single-phase cooling systems require a large 'distance heat exchanger' or heat dissipation. Radi〇r (like a car radiator) 'separated from the electronic components to be cooled. Although the radiator is placed on the back panel of a computer system, or placed in Covering the exterior of the housing to be cooled, not all of the components of the conventional single-phase cooling system can be mounted to an add-on card that is quite different from the disclosed system. Compared to conventional passive two-phase cooling systems and conventional singles Phase cooling system, the cooling system iOO, 200 ' 300, 400 disclosed in the first one can emit high heat flux (as noted above and shown in Figure 3) 'which can still be integrated into a compact system that fits into a small volume (such as, for example, a volume measurement of about 1 〇 % 吋 multiplied by about / 3 / 8 吋 multiplied by about 33⁄4 吋. It is possible to make such a compact cooling system, in part because the disclosed system requires substantially less working fluid than a single phase system and can cool high heat flux, in part because of pumping (or driving) "IL body circuits The recyclable working fluid passes through the cooling system at a higher flow rate than the hot siphon circulating coolant. 15 201038186 Tight's 'cooling system overview, although initially, specific embodiments of integrated cooling systems and related instruments are constructed to fit in the small details of the small details are described below, Township Chart 4A '4B and 4C Provide a short summary of this system. The exploded view shown in FIG. 4A depicts a cooling system (described above), generally referring to a close embodiment of FIG. 2), a computer attached + 50, a floor member (or a sill member 60' and a retaining clip 7 i '72 is constructed to maintain the laminated assembly of the cooling system card and the support member by the cooling system 100 and the holding unit. The additional card 5〇 can be an efficient monthly display card constructed according to the pcie specification. The card 5 can include a printed circuit board (PCB) substrate. An edge connector 51 and a back-panel interface region 52, the back-panel interface region including a plurality of connectors constructed to interface with one or more external attachments (not shown). The card 5 can have two image processing units (GPUs) 42, 44 women's to the substrate 46. The pCB can define one or more electrical circuit files, and each of the & GPUs 42, 44 can be electrically coupled to an individual electrical circuit portion. The edge connector 51 can be constructed and can transmit electrical signals and power to the circuit portion within the pCB according to the pcie specification. As indicated by the schematic diagram of the cooling system 1A of Figure 2, the system shown in Figures 4A' 4B and 4C includes first and second microchannel heat sinks 11 , 1 20 grippingly coupled to the condenser i 3 Hey. A heat exchanger 16 〇 (e.g., air-cooled radiator 162) promotes heat transfer Q_ from condenser 13 to ambient 〇1. A centrifugal blower or pump (or other fluid-moving device) 丨7 〇 can be constructed to cause (eg, force) ambient fluid to pass through the radiator l62A, and the heat σ 201038186 σ Q knife Q°ut, 1 can be Removal to ambient fluid (eg, air as it passes between the Korean plates of the heat sink 162). A escort, or conduit, passage 164 or passage or conduit, is constructed to direct air from the blower impeller 17 之间 between the extended surfaces (fins) of the heat sink 162. In the absence of the conduit 164, a portion of the air flow emanating from the blower m may otherwise bypass (e.g., 'bypass') the passage defined between the tabs of the heat sink 162. In some examples, a plastic shield can form a conduit 164. One

The system 1 shown in Figures 4A, 4B and 4C also includes an integrated pump _ and - manifold tube assembly 155 (since it is covered by conduit 164 and guard I 163

(4)® 4A'4B^4C visible) is constructed to circulate the working fluid between the radiator 1 12〇 and the chiller. The system 100 shown in Figures 4A, 4B and 4C can include a "closed system", meaning that a large amount of working fluid remains constant or at least substantially constant within the system 100 during operation.

The position of the pump and manifold assembly 155 is similar to that of the pump manifold assemblies 155, and 255, respectively, illustrated in Figures 17 and 25. Referring additionally to Figures 2, 4A' 4B and 4C, and noted above, the pump 15 〇 (not shown) delivers a working fluid (not shown) to a manifold 152 (not shown) that is configured for dispensing work. Fluid to each radiator i 1 〇, 1 2〇 (Fig. 4c) Ο individual conduits, or fluid connections, ΐθ2' ΐ θ3 (not shown) fluidly coupled to the corresponding outlet of the manifold 152 and the corresponding radiator η Hey, ι2〇. Each of the heat sinks 11 〇 ' 120 can be fluidly coupled to individual condenser portions 132 134 (not shown) 'the individual condensed gas portions are passed through a separate conduit by a condenser ι3 ,, or The fluid connections 1 〇 4, 1 〇 5 are defined. A conduit, or fluid connection 106, is fluidly coupled to the condenser portion 32, 134 17 201038186 to the inlet of the pump 150. As noted above, the catheter, 戎4 诚, by && ^ 6 take the fluid connection, 102, 103, 104, 105, 106, 107a, l 〇 7b. / b mother can be Constructed to transport working fluids (in a gas phase, a liquid phase, Jixian; upper 7 l, a saturated mixture of both )) in individual system parts 110, 120, 130, 150, day, 152, 155. The conduit, or fluid connection, may comprise, for example, a conventional tube or tubing formed from an aluminum alloy. In other implementations, the "catheter, or sputum fluid connection, may include adjacent openings, as in the case of inflammation, as follows, the g-tack contains - or more manifold systems are more thoroughly described . Referring to Figure 2, heat sink 12A and condenser portion 134 can be fluidly coupled in parallel to heat sink 11 and condenser portion 132 as indicated by dashed lines 102 and 1 〜. Alternatively, as indicated by the dashed line 1 〇 7b, the heat sink 120 and the condenser portion 134 may be fluidly coupled in series to the heat sink 11 冷凝器 and the condenser portion 132 (eg, by eliminating the pump 15 〇 and the heat sink) 11〇 connection 1 02). Each of the parallel and series configurations described in conjunction with the schematic of Figure 2 can be incorporated into the system embodiment ι shown in Figures 4A, 4B and 4C. The parallel coupling of the microchannel heatsinks 丨i 〇, 丨2〇, as described, can be described in some examples as if the heat sinks were coupled in series to supply a lower temperature working fluid to the microchannel heat sink. For example, if the heat sinks are fluidly coupled in series, the heat sink will otherwise contain a preheating working fluid. If the heat sinks are flow-connected in parallel, the heat sink can accommodate unheated working fluid. Applicants have found that, in some instances, such as in applications that provide a limited physical volume for a cooling system, such as a computer add-on card (eg, display 18 201038186 not card), heat between the condenser 130 and the environment Exchange (eg, "air_side heat exchange") can limit the overall performance of the cooling system. Applicants have also found that the effect of this "bottleneck" of performance can be mitigated, at least in part, by providing as much air-side as possible by the given volume limit imposed on the cold heading system 1 Heat transfer surface. The method of improving air side heat transfer in a system 100 is to provide fins that are as long as possible, and the fins here can be fitted into a limited physical volume. 〇 At least in some instances, if the condenser 130 and the heat sink 162 are '°' such that the fins extend from the condenser body (as in Figures 16 and 17), such as being thermally coupled to one another The heat sink bore 62 (e.g., a base member having fins extending therefrom) to the condenser (as in Figure 15) achieves a substantially larger seam surface area. Referring to FIG. 4A, the cooling system 1A can be held in close proximity to the add-on card, such as the retaining clip 71' 72, such that the features 280a-d (FIG. 4C) extending through each of the heat sinks 11 120, 120 and through the pCB 46 and The chassis member Q 6 is forced to compress the additional card between the chassis member and the cooling system 1〇〇. For example, the couplers 71a-d can engage the individual features 280a-d extending from the heat sink 11A, and the couplers 72a-d can engage the individual features 28A-d extending from the heat sink 12A. Each of the heat sinks 11 〇, 12 〇 may comprise a portion defining a mating surface extending through an opening in the chassis member such that each of the individual mating surfaces is in direct contact with a corresponding electronic component 42, 44 or The locating is adjacent to the corresponding electronic components 42, 44 whereby the each heat sink is thermally coupled to one of the other components 42, 44. These and other features and principles of the cooling system are more fully described below in connection with the specific embodiments of the cooling element, such as image parts mounted to a display card, in conjunction with 19 201038186. Pumps and Manifolds Manifolds and pump-outer manifolds will now be described. As indicated in Figure 2, the cooling system 100 includes a pump-cover manifold 155 constructed to cover the pump 15 and distribute the working fluid to individual radiators, 丨2 〇. Referring to Figures 5 and 6, the pump 250a can propel a working fluid (e.g., can cause a working fluid to circulate) between various portions of a cooling system. One or more manifolds 252a, 252b (and/or one or more pump-cap manifolds 155' (FIG. 7) may be used to dispense a working fluid between one or more other portions of the cooling system In order to remove or reduce conventional pipes or pipes from conduits (or fluid connections) in the cooling system. Such manifolds 252a, 252 can include a copper block that defines a plurality of internal passages that are constructed as one or more plenums or flow paths within the block. For example, one or more intersecting holes (e.g., drill holes) within the block may define such a flow path within the manifold 25 2a. Still referring to Figures 5 and 6, the pump 250a can be fluidly coupled to the individual microchannel heatsinks 21a, 22a and the condensers 23a, 23a, 230b by the manifolds 252a, 252b. 230b,. For example, pump outlet 257a can be fluidly coupled (e.g., by a tube) to an inlet coupler 257b of manifold 252a. The manifold 252a defines an internal passage (not shown) that is configured to dispense a working fluid to a manifold outlet (not shown) from a manifold inlet defined by the inlet coupler 257b, The sequence is fluidly coupled to the heat sink 220a. An outlet (not shown) from the heat sink 22A can be fluidly coupled = 20 201038186 to the condenser 230a', and the manifold 252a causes a portion of the working fluid that has passed through the radiator to flow through the manifold 252a and into the first Two condensers 230a. In a similar manner, manifold 252b fluidly couples heat sink 210a to condensers 230b, 230b'. The outlets (not shown) of the condensers 230b, 230b, flow to the manifold outlet 253a, which are sequentially flowably coupled to an inlet 256a to the pump 250a. Thus, pump 250a and manifolds 252a, 252b are configured to circulate working fluid through a closed flow path between the radiator and the condenser. Referring now to Figure 7, a portion of a pump-outer manifold 155, and a pump 150, are illustrated. The outer cover 155' defines a pump receiving opening (not shown) that is configured to receive a portion of the pump 150' such that the outer cover 155 is placed on the pump. The outer cover 155 can also define one or more internal chambers (e.g., diffusers) (not shown) that together form a manifold incorporating the outer casing, thereby forming a pump-cover ambiguity. The pump outlet, inlet, or both can be fluidly coupled to one or more internal chambers. The pump-housing manifold may define an internal passage (not shown) configured to carry a working fluid such that the pump inlet is fluidly coupled to the inlet of the pump/cover manifold 155' and the pump outlet is fluidly coupled to Pump-outer manifold outlet (1), and 154'. The pump-housing-manifold 155 can dispense working fluid from one or more inlets 156 to various outlets 153|, 154. For example, from the pump-outer 歧^55'----out Η3, the microchannel heatsink can be fluidly coupled to δ by a conduit (in some instances, a length of tubing or tube), and from the pump - a second outlet _ of the outer cover manifold 155' and a second 21 201038186. The channel heater can be hunted by a second conduit. Although Figure 7 shows the two outlets 153, 154 from the pump-housing manifold 155', it is contemplated that the pump-cap manifold has more or less than two outlets and is within the scope of the present disclosure. For example, some embodiments of the cooling system include two 'four or more microchannel heat sinks that are fluidly coupled to a single pump _ housing manifold. In other embodiments, more than one outlet may carry working fluid from a pump-housing manifold to a given heat sink. As described more fully below, some pump-cap manifolds have a single outlet and a single inlet (which may be the case when the radiators 110, 120 are fluidly coupled in series). The pump 150 can be sized to provide sufficient head water (2) to circulate the working fluid throughout a cooling system. In some instances, such as when the temperature of the working fluid is near the phase transition temperature of the fluid, even a slight pressure drop can cause a portion of the fluid to evaporate (or form a cavitation). Some pumps are more susceptible to such localized evaporation or air pockets than other Us. Forward-stage displacement pumps such as 'some piezoelectric pumps, reciprocating piston systems and gear pumps' are generally not subject to such localized evaporation. In some instances, the effect 150, T includes a system containing a reciprocating piston, and the # piston reciprocates (four), along each stroke of the piston, advances the portion of the working fluid abutting the piston, A commercially available linear electromagnetic pump. Referring now to Figures 7A and 7B, a two-piece "w" (four) pump housing manifold 255 is illustrated. The manifold 255 has a mountain π plus, a fruit outlet portion 255a and a pump inlet portion 255b. The outlet portion 255a defines an inner (four) 25 inch, which is sized to accommodate the pump-outlet end, «similar to the load 150' shown in Figure 7 22 201038186. The chamber 250a' is constructed to be compatible with a pump having one end of the pump outlet positioned rather than as shown in Figure 7 on the side wall of the pump. For example, the 'outlet portion 255a defines a manifold inlet 257 that is positioned at the end of the chamber 250a. The outlet portion 255a defines a manifold outlet 254 that defines a recessed opening or aperture 254a that intersects a laterally oriented aperture 254b that defines the manifold inlet 257. The intersecting apertures 254a, 254b fluidly couple the manifold inlet 257 and the manifold outlet 254. The chamber 250a' is recessed into one end of the outlet portion 255a as described and one half of the length of the corresponding pump, measured at a distance, extends a depth into the outlet portion. The chamber also defines a recessed portion 258a that extends around (e.g., circumferentially around) an opening around the chamber 250a. The recessed portion 258& is configured to receive a shoulder 258b (Fig. 7B) extending from the inlet portion 25b of the pump-cover manifold 255.

The illustrated inlet portion 250b defines a recessed chamber 25〇b that is configured to receive an inlet end of a corresponding pump (not shown). The inlet portion also defines a manifold inlet 256 that is configured to receive a working fluid from a condenser (e.g., a condenser in system 200, shown in Figures 17-24). - a recessed opening or hole, 256a extending inwardly from the inlet ... and laterally intersecting by a hole 256b which extends to the chamber 25 and opens to the side of the chamber 2. The flow consuming to the aperture 256a is a fill tube 259. The fill tube 259 can be used to fill the assembled cooling system with a fluid. For example, once the cooling system has been assembled, the supply of the working fluid, the stomach tube, and the m gas (e.g., 'air) can be released from the system using conventional techniques. - But already supplied - the required volume, or the quality of the work 23 201038186 Fluid to the cooling system, the filling ® 259 can be sealed. Each of the portions 255a, 25 5b can define an individual pair of recessed η π 9l (eg, a threaded opening 弋碉 J, which is constructed to lock _ & _ μ $ Tube 255 to individual components of the assembled pump-part system. In some examples, threaded fasteners, 4 t 91. F 4 such as screws, can be snapped into the opening

As described above, Station L has reduced the possibility of parental leakage, improving the structural integrity of the system and reducing it by a cooling system (for example, allowing a cooling system to be fitted with a smaller "package coverage area" (paekaglng fGGtpdnt )") The volume occupied. Furthermore, this manifold can define one or more faces, and the beans can provide - a sufficiently large surface for bonding (eg, welding, brazing or welding; conventional fluid conduit to manifold inlet and/or outlet) Microchannel Heatsink Overview The microchannel heatsink configuration will now be described with reference to Figure 2 of the accompanying drawings, and Figures 8A through 12B. In a sense, a microchannel heat exchanger ιι〇, 120 (Figure 2 ) can contain two parts: (1) an external heat transfer surface ma, 12ia (Fig. 2' 5' 6 and 10) 'through the surface heat (^, q2 (Fig. 2) can be associated with an external fluid or object (such as For example, an electronic component 42, 44 (Fig. 2) is exchanged; (2) an internal heat transfer surface 112 (Fig. 9, 9A and 1) through which heat can be passed from an external fluid or object. Exchange with a working fluid; and (3) a working fluid (not shown) in the heat exchanger. As shown in Figures 5, 6 and 1 , an external heat transfer surface 111a, 121a can define a flat surface, when individually The microchannel heat exchanger 1 1 0 ' 1 20,11 〇a,1 20a is operatively positioned 24 201038186 when the flat surface is built To fit a corresponding flat surface of an electronic component 42, 44. Referring to Figures 9, 9A and 10, a microchannel heat sink, such as a microchannel heat sink Π0, 12A (Fig. 2), can include a first substrate 113, A unitary construction is included. The substrate can define an internal heat transfer surface 丄 and an external heat transfer surface 111a. The first substrate 113 can comprise a material having a high thermal conductivity, such as a copper alloy or a Main material. The internal heat transfer surface 112 can be defined by an internal flow channel 复 119 between the plurality of fins 118. The microchannel substrate 113 can comprise a material having a relatively high thermal conductivity, except for materials such as copper alloys and tantalum. In addition to materials, other materials such as diamonds can be used. Materials with anisotropic thermal conductivity can also be used. This material has a low heat transfer force in one direction, but has a high heat transfer force in the other. For example, 'can use such as GrafTech, Intenmi嶋i

The eGRAF® material eeGRAFTM has a thermal conductivity that is high in two dimensions (eg, in a plane) and low in a third direction (Example 2, perpendicular to the plane typically uses eGRAFTM to spread the heat cross The higher the plane of the thermal mask while maintaining the low temperature of the plane of the vertical thermal mask. Materials such as eGRAF- can be used for the heat sink. For example, this material can be used to provide high thermal conductivity perpendicular to the base of the heat sink. In other words, there may be a high thermal conduction force perpendicular to the base. Port ^ ^ j, ^ ^ · In this embodiment, heat dissipation "improves the ability to exchange heat through the surface in contact with the coolant. As a result, this - heat dissipation The device can preferably exchange heat to the cold 25 201038186 through the microchannel. Referring additionally to Figures 9' 9A and 10', the internal thermal_transmission surface ι 2 can be defined - the outwardly extending features 118, 118a of the array, such as fins (or Is a channel wall), which defines a channel (eg, microchannel 119 and cross_connect microchannel 122). In other words, internal heat transfer surface 112 can define an array of (four) wall regions (eg, channels 119, 122). , The walls ii8, u8a are defined therebetween. The fins and channel features of the internal heat transfer surface 112 are coupled to the microchannel heat sinks 110, 12A having a typical length scale of about ten microns to one thousand microns, and can be used Various material removal techniques are formed, such as chemical etching, micromachining, laser ablation, and others, or material deposition techniques, such as vapor or helium, deposition techniques. Other microchannel and/or fin forming techniques can be used. , such as skiving and/or micro-deformation techniques, as described in, for example, U.S. Patent Application Serial No. 61/308,936, filed on Feb. 27, 2010, and assigned to Figures 1 and 12' will be discussed more fully below, showing schematic diagrams of fin and channel features formed using this cutting and micro-deformation technique. Many configurations of internal flow channels are possible. For example, apply for 2009 U.S. Non-Provisional Patent Application No. 12/5 11,945 of July 29, entitled MICROSCALE COOLING APPARATUS AND MEHTOD, Reveals Operation with Single-Phase and Two-Phase Operation Compatible with the configuration of several internal flow paths. A cover plate (or cover) 114 (Fig. 10) can in addition cover the open top plane of the channel Π 9 ' 1 22 to define a closed micro Channel passage 'a working fluid can pass through this passage. 26 201038186 Cover

As shown in the side views of Figures 8A, 8B and 8C, and Figure ι, a second substrate can be bound to the cover plate, or cover, 114, U4a (e.g., comprising a tin-plated aluminum Alloy), which is constructed to cover a "top" of the channels ιΐ9, M2, which are defined by an internal heat transfer surface! 12. As shown in Figures 8A, 8B and 8C, the cover U4a defines the fluid transfer. The connector ιΐ5 is constructed to flow (four) _ split the microchannel heat sink to other parts of the cooling system. For example, the cover "4a can define an inlet coupler"6 and an exit face connector 117 (Fig. 8A) - The cover n4a and the microchannel heat sink substrate 113 (Fig. 9) may also be defined - or more internal inflatable ports 123, 124 (Fig. 9) flowably adjacent - or two (four) devices 116, 117. The inflator can be configured to dispense a work between the plurality of internal flow passages i. 9. For example, the cover 114a defines an inlet inflation portion U6a and an outlet inflation portion η"" by dissipating heat through a microchannel incorporated into the cover 114a The working fluid, in general, flows from an inlet coupler 116 to the inlet plenum U6a through the microfluid Lane 119, through outlet plenum U7a, and to outlet coupler ΐ7. Microchannel Heatsink Operation Overview As noted above, during operation, a microchannel heatsink 11 〇, 12 〇 can be thermally coupled (eg, positioned adjacent or alternatively, combined)—heat-distribution A device, such as an electronic component 42, 44 (Fig. 2). By means of the heat Q emitted by the heat-spraying device, Q2 (Fig. 2) can pass through the internal heat transfer surface 112 and through an external heat transfer surface 111, 121 (Fig. 2) of the heat sink i 1 , 12 A working fluid (eg, a coolant) that flows through the microchannel heat sink. When the working fluid passes through the flow channel 丨19 and flows through the fin 丨18, the working fluid (Example 27 201038186 is transparent, and the heat transfer mode heats up from the inside heat transfer (for example, advection and evangelism, and the shovel 112) And conduction). Examples of working fluids are water, sulphide coolant, NovecTM, p" 违 „ , Rl34a, R22, and / or other chilling clocks, 匕 containing pressure refrigerant. Choice 7, contempt from mm, depends on the particular pump (not shown). Alternatively, the workflow depends on the nature of the fluid material, such as, for example, a phase change and a fluid phase change. How the temperature changes with pressure. For example, when the fluid is steamed, it can increase an internal pressure in a closed cooling system. According to this, the phase change temperature with pressure can be a factor for selecting a working fluid. In the case of a wide pressure range, it is possible to have a fluid having a phase transition temperature of less than eighty-five degrees. For example, this fluid is surrounded by a wide pressure (for example, about 1 atmosphere, plus or minus twenty percent). ), its phase change temperature Greater than about 40 degrees Celsius and less than about 45 degrees Celsius. When cooling an electronic device at less than the upper critical temperature of the device, the fluid can be more similar to boiling. Thus 'can change the specific cooling used in conjunction with a given cooling system. HFE7000 boils at approximately 35 degrees Celsius (at i atmosphere absolute pressure) and between approximately 5 degrees Celsius and approximately 6 degrees Celsius (between approximately 1.2 and approximately 1.6 atmosphere absolute pressure). An evaporation latent heat is measured at about 14 gK. Other working fluids can be used in conjunction with the disclosed microchannel heat sink 'such as ', for example, a working fluid, when it passes from a microchannel heat exchanger 110, 120, carries it from Internal heat transfer: heat absorbed by face 112, as described above. Heat absorbed by the working fluid in microchannel heat exchangers 110, 12 can be removed from stream 28 201038186 in another portion of the cooling system (eg, Continuous cooling is continued from a condenser 130' (Fig. 2)) and thus provides a set of 44. 2, the large heat can be absorbed by many working fluids 'when the heat ^, q' is absorbed by the skin, Waiting for work + finding L in the liquid phase. However, many fluids can turn heat (that is, the energy required for a unit mass of fluid from the liquid w9 state (vapor) at a specific dust force), or latent heat of condensation. (i.e., the energy required to convert a specific mass of fluid from a gaseous state (vapor) to a liquid state) is collectively referred to herein as ", latent heat or phase change", 苴2 fluid Specific heat (i.e., the energy required to change a unit temperature in a unit mass of a specific temperature and plant strength). Since many fluids change from a liquid to a gas phase at a constant temperature on a solid two, there is a high Latent heat or phase change fluids can absorb energy at a relatively high rate while maintaining a temperature that is substantially ambiguous. When the evaporating fluid condenses, the internal energy of the fluid drops according to the latent heat of condensation of the fluid. Accordingly, the heat collected during the evaporation can be removed by the condensing fluid. A microchannel heat sink in which at least some of the working fluid evaporates during normal operation is referred to herein as a "two phase" microchannel heat sink. The heat sink, in which there is no (or insignificant amount) of working fluid, is referred to as a "single phase" heat sink during normal operation. ... As noted above, the microchannel heatsinks 110, 120 can operate in a two-phase "mode". Although referred to as the "two-phase" heatsink, these microchannels can be operated in a single-phase or two-phase mode. In the case of a mouth, a coolant may be maintained in its liquid phase at a relatively high coolant flow rate and/or when exposed to a relatively low dispersion heat flux. In this case, the microchannel heat sink (10), 29 201038186 120 operates as a single phase heat sink. If the coolant flow rate is sufficiently low and / 戋 the heat flux to be dissipated is sufficiently large, the liquid coolant can reach its point of view while still flowing through the radiators 110, 120, and flow boiling occurs. This causes the heat sinks 110, 120 to operate as a two-phase heat sink. During operation, in this two-phase mode, latent heat exchange associated with the transition of the coolant from liquid to gas can more efficiently remove heat from the two-phase microchannel heat sink. Two-phase microchannel heat sinks can be used to achieve various advantages. The latent heat due to the liquid-to-gas phase transition allows for efficient cooling by evaporating the liquid within the liquid to absorb a large amount of heat at a low temperature gradient. Fin Configuration The microchannels 119 can be a series of parallel, symmetrical, rectangular cross-sections, or recesses formed in a base. The microchannel turns 19 have a width and are defined by opposing channel walls 118' 118a, and the opposing channel walls also have a width and height. The microchannels 119 may not be larger than the microscale scale. For example, for certain embodiments, the microchannel width can range from tens to thousands of microns. Smaller widths are also possible. The channel niche 18 can have a thickness in the range of - hundred micro-requisites - the height is in the range of hundreds of micrometers. However, for microchannels 119 other channel sections, widths, heights, channel directions are possible. Although the microchannels 119 shown in Figures 9, 9A and 1 are substantially planar and symmetrical (e.g., having a rectangular cross section), the microchannels are not parallel, = sex: symmetrical 'and/or rectangular. For example, a microchannel 122 may have a change in flow direction length along the microchannel or more cross-sectional dimensions. Furthermore, in the same substrate, (four) device, or in the cooling system, one micro-channel can be 30 201038186 than the other micro-channel is not (4). In other embodiments, the microchannels may be curved and/or not perpendicular to the inlet or outlet. Although Figure 24 depicts the condenser channel, the microchannel 119 can be bent through—or more turns and/or can taper along the flow direction.

In addition to the microchannels 119, the internal heat transfer table φ 112 can define - or more cross-connect channels 22 (Fig. 9, 9A * 1G) n (d) boil in the microchannel H9 (eg, from liquid to gas) The phase change channel, the cross-connect channel 122 can at least partially balance a pressure field within the working fluid. The cross-connect channel 122 allows helium and/or liquid to flow between adjacent microchannels 119 (e.g., transverse to the direction of flow direction). This localized lateral flow can substantially balance a coolant pressure between the microchannels 119. The result is that the 'working fluid m port 123 enters the microchannel 119' in a substantially uniform manner rather than entering the microchannel in a non-uniform manner, such as in the absence of a crossover and the connecting channel 114 may occur. In other words, in the absence of the cross-connect channel 122, the working fluid will tend to enter a low pressure gradient microchannel (such as those in the microchannel that are not boiled) better than an adjacent microchannel having a length along its length. Higher pressure gradients (such as can cause boiling). This non-uniform flow field through the hydraulically parallel microchannels can cause the microchannel dry and/or unstable flow to fluctuate between the various microchannels and thereby reduce the cooling effectiveness of the microchannel heat sink. Providing cross-connected microchannels or other pressure-balancing features can alleviate (or eliminate) dry and unstable flow fluctuations (and their detrimental effects in performance). This stable performance is indicated by the graph shown in Figure 32 and will be discussed more thoroughly below. The cross-connect channel 122 can have a feature size of about 1 micron to a large 31 201038186 of about 1000 micron. Smaller feature lengths are also possible. It is also possible to deviate from the illustrated cross-connection channel geometry. For example, the cross-connect channel can have a varying cross-sectional area and can be bent. The cross-connect channel 122 can be partially covered by a cover m, as shown in the isometric view of Figure 1. As seen in Figures 9, 9A and 1B, the cross-connect channel 122 can be oriented transversely substantially perpendicular to the general flow direction 241 of the working fluid (Fig. 9A) (eg, the working fluid generally flows through the microfluidic channel). 9 defined and the first-class flow path indicated by arrow 241). Some of the cross-connect channels 122, such as the channels 122a', extend partially across the width W1 of the internal heat transfer surface m (Figs. 9 and 10) and/or are interleaved with portions of the microchannels 11 9 rather than all. Other cross-connect channels 122 extend across the width Wi and/or are interlaced with all of the micro-runners n9. In some of the microchannel heat sinks 11, 12, all of the cross-connect channels 1 22 extend across the width w. In other examples, no cross-connect channels extend across the width W1. The cross-connect channels 122, 122A may be evenly spaced (e.g., at intervals of about one millimeter) along a flow direction 241 (Fig. 9A) defined by the microchannels 119, or may be non-flow along the flow direction. Evenly spaced (eg, substantially randomly). Inlet 123 and outlet 124 correspond to individual plenums 116a, 117a and adjacent inlet and outlet couplers 116, 117 (Fig. 8C) at the respective inlet and outlet ends of the two phase microchannel heat sink. The inlet 123 and the outlet 124 are separately constructed to separately introduce the coolant to the microchannels 9 and to discharge the coolant from the microchannels 11 9 . Therefore, the coolant flows from the inlet 1 23 along the microchannel 119 to the outlet 124. In other words, the microchannel 119 is constructed to carry a coolant, 32 201038186 which may be present between the inlet 123 and the outlet 124 - or two phases. The two-phase microchannel heat sinks 110, 12A can also define cross-connect channels 122, i22a. In some examples, the cross-connect channel 122 may be no longer than the micro-scale level. For example, in some embodiments, the cross-connect channel 122 can have a width ranging from ten to one thousand microns. Smaller widths are also possible. Although shown to have the same width and a rectangular cross-section, it is also possible to cross-connect the other channels, widths, heights, and channel directions of the microchannels 122. In some embodiments, the cross-connect channels may be non-parallel, linear, symmetrical, and/or rectangular. Similarly, in some embodiments, the cross-connect channel 122 can have a varying width. For example, a particular cross-connect channel can have a width that varies along the length of the cross-connect channel. Additionally, a cross-connect channel 122 may not have the same width as another cross-connect channel. The cross-connect channel 122 can be closed using the cover panel 114 or the cover 114a. The cold pack is generally maneuvered from the inlet 123 ◎ to the outlet 124 in a first direction flow direction 241 (Fig. 9A). As noted above, the cross-connect channel 122 can be used to at least partially balance a pressure field for boiling of a portion of the coolant across a plurality of microchannels. The cross-connect channel 122 allows gas and/or liquid communication between the microchannels 122. When the two-phase microchannel heat sinks 110, 120 operate in a phase mode, the boiling coolant pressure can be balanced along each cross-connect channel 122 @. In other words, the pressure can be substantially uniform along each cross-connect channel 122. As a result, the pressure of the cold agent flowing through the microchannel 1^9 traverses the width of the two-phase microchannel heat sink (Fig. 9), and the portion of W1 is balanced. For a cross-connect channel, such as pass 33 201038186 track 1 22a 'the eton coolant's pressure traverses only a portion of the width of the two-phase microchannel heat sink to be balanced. Thus, a cross-connect channel 122a on one side of a channel wall 118a can have a different pressure than the parent-connection channel 122 on the opposite side of the channel wall 18a. As discussed above, the cross-connect channels 122 can be spaced apart at various intervals and can be constructed to balance pressure along their respective lengths. The position 'length' of the cross-connect channel 122 and other features may vary depending on the implementation. In some embodiments, the cross-connect channels 122 may be spaced apart by a relatively large spacing as long as the cross-connect channels 22 are sufficiently close such that unstable fluctuations in the operating range of the heat sink are reduced or eliminated. In other embodiments, the cross-connect channels 122 can be more closely spaced. However, in this particular embodiment, it is desirable to provide the cross-connect channel 122 sufficiently far apart that the desired flow of coolant through the microchannel 丨丨9 can be maintained. High Aspect Ratio Features As used herein, "aspect ratio (aSl) ect rati〇)" means the ratio of the first dimension to the second dimension. For example, a first-class track (or channel) can define a rectangular section having a height and a width. Accordingly, the aspect ratio of the flow channel can be the ratio of the height of the microchannel to the width of the microchannel. As used herein, "high aspect ratio" means that the aspect ratio is measured to be at least 10:1. As used herein, the term "high aspect ratio microchannel" means that the microchannel defining the flow section has a measured height and a measured width, wherein the measured height has a ratio of the measured width to at least one. 〇: 1. For example, a microchannel having a rectangular flow profile measured at 34 201038186 having a width of ο. 1 mm wide and a height of 丨〇 mm has a 10:1 aspect ratio, and thus is considered a high aspect ratio microchannel. The fins 118 of some microchannel heat sinks define high aspect ratio microchannels. As with the microchannels of the heat sink as described above, each of the high aspect ratio microchannels may be on the opposite side of the flow perimeter by abutting the fins 8 on the bottom side by a base 123 (eg, a substrate Part of 113) and a cover 114 are delimited. Referring to Figures 11A, 11B, 12A and 12B, a schematic view of a working microchannel heat sink 110a, u〇b comprising high aspect ratio microchannels is shown. As described above for the microchannels 119, each of the microchannels 119a, 119b of the individual heat sinks 1 i 〇 a, 11 〇 b can extend longitudinally between an inlet end and an outlet end. The general flow direction of the flow defined by the high aspect ratio microchannel. At least some of the fins 118'a, 11 8b define a corresponding cross-connect opening (not shown) extending between them. The cross-connect openings can be constructed to fluidly couple adjacent micro flow channels 119a, 119b to one another as described above. The cross-connect opening or cross-connecting channel may extend laterally relative to the flow direction defined by the microchannel. Q In some instances, a cross-connect opening, for example, a cross-connect channel, may have a longitudinal dimension (eg, in a first-rate flow direction) measured between about 1 and about 3 times a width w ( Figure u & 12) A high aspect ratio microchannel 119a, U9b. A cross-connect opening (not shown) may extend downwardly from a distal end of the fin toward the base 123a, i23b. Some of the cross-connect openings extend downwardly through the entire fins n8a, 118b to the individual bases 23a 123b and the parent fork connection openings extend downwardly through less than the entire fin, such as, for example, 'about 25 〇/〇 through the fins, About 5% or 35 201038186 is about 75%. Some of the cross-connect openings define an aperture through the fin such that the distal end of the fin defines a continuous edge 'and the cross-connect opening extends through a portion of the fin 118a ' 118b at the base 123a, 123b and the distal end of the fin between. As with other microchannel heat spreaders disclosed herein, the bases 123a, 123b of a high aspect ratio microchannel heat sink can define a substantially planar surface 111a, 111b that is configured to be thermally coupled to a packaged electronic component, A corresponding substantially planar surface, such as defined by a packaged semiconductor die. The fins 118a' 118b and the bases 123a, 123b can be formed in a single configuration and can be formed from a single substrate 113a, 113b, as described below with reference to the working sample of the high aspect ratio microchannel heat sink. Working Sample - High Aspect Ratio Microchannel Heatsink In some operational embodiments of a two phase microchannel heat sink, microchannels 119, 119a '119b (Figs. 8, 9, 11 and 12) are defined to be formed in a substrate 113. A series of substantially parallel, symmetrical, rectangular cross-section micro-grooves, or recessed channels. The microchannels 119' 119a, 119b can have a width W and individual heights h! 'hz (Figs. 11 and 12) and are defined by individual channel walls (or fins) 118' 118a, 118b, which Define a corresponding height and fin thickness. Channel walls I18, 118a' 118b can have a fin thickness of about one hundred microns and a height of hundreds of microns. 11 and 12 show schematic views of individual working samples of high aspect ratio microchannel heat sinks i〇a, n 〇b 'The high aspect ratio microchannel heat sink has a plurality of spaced cross connectors 122 that are fluidly coupled to adjacent microchannels 118a, 118b, as described above. In each working sample, each error 36 201038186 piece 118a, 118b is measured to be approximately loo microns (or approximately 0.1 mm) thick and approximately 1 · 2 homes south (ie, each piece has approximately 12: 1 aspect ratio). Each of the microchannels 119a, 119b between the individual fins 118a, 118b has a width w measuring approximately 〇. 1 mm and a height h! measuring approximately 1.2 mm, thus defining a high aspect ratio microchannel having Approximately ·2·_1 aspect ratio. The fins 118a are formed using a micro-deformation process. The fins 118b are formed using a skiving process.

A plurality of interconnecting members 122 extend between adjacent microchannels 119a, 119b, whereby the adjacent microchannels are fluidly coupled to one another. The cross-connecting member 122 of the working sample is transected into pre-existing fins (e.g., fins formed from a cutting technique). In other words, after the fins 11 8a, 11 8b are formed, a micromachining process is performed to mill the cross-connect openings (not shown, but similar to the channels 122) through the fins 11 8a, 11 8b. Nonetheless, as disclosed in U.S. Patent Application Serial No. 61/308,936, the entire disclosure of which is incorporated herein by reference in its entirety, the entire entire entire entire entire entire entire entire disclosure Forming fins 11 8b and corresponding intersections and connections. Referring to FIG. 12A', each fin 118b is approximately 1 μm (or approximately 0.1 mm) thick and approximately 1.2 mm (ie, extending a length from the base i23b). h! The measurement is about ι·2 mm. Each microchannel i19t) has a width w measured as approximately 〇·1 mm and a h度 h measured as approximately ..2 mm, defining a south aspect ratio micro The channel has an aspect ratio of approximately 12:1. The fins n8b are shown to have a micro-curvature caused by the cutting process. The microchannels n 9b have a corresponding slightly curved cross section. The arc length h2 is approximately the same as the height hl of the micro-curvature for the working sample 37 201038186. In some instances, the cross section of the microchannel 丨丨9b can have more curvature and arc length! ^ can be substantially greater than height ^. In these examples, the microchannel aspect ratio can be defined by the arc length h. Mounting Features As shown in Figures 8A, 8B and 8C, a portion of a microchannel heat sink, such as cover 114a', can define one or more pins 28〇 that are configured to lock the microchannel heat sink to a cooling system The chassis 6A (Fig. 4A) and/or operatively positions the microchannel heatsinks 110, 120 relative to a substrate 46 (Fig. 4a) and the electronic components 42, 44 mounted thereto. Referring to Figure 8C, pin 280 can include a narrow portion 281 that is configured to extend through chassis 24() and/or substrate 46. The pin 280 can also define one or more shoulders 282 that are configured to snap or rest against the chassis 240 and/or the substrate 46, thereby limiting the narrow portion 281 of the pin 280. The extent to which this extension is passed. The distal end portion 283 of each pin 280 (relative to the body of the microchannel heat sink) can define an opening 284 and a corresponding recessed opening 285 extending in the length direction of the pin (eg, a portion of the length of the pin) ). The recessed opening 285 can be mated with a bolt, a screw or other fastening means having a head such as a headed stud extending through a retainer clip 71, 72 (Fig. 4A). The fasteners 71a-d, 72a-d can hold the pins 28A relative to the chassis 60 and/or the substrate 46 through which the pins extend. In some embodiments, the recessed opening 285 can be threaded to threadably engage a corresponding thread of the body of the screw. Summary of the microchannel heat sink In addition, the microchannel 119 (Fig. 9) and the cross-connect channel 122 allow for reduced pressure fluctuations and stable flow of boiling liquid coolant. These characteristics enable the two-phase microchannel heat sink 11 to stably and repeatedly emit high heat fluxes as indicated in Figure 3, particularly from a small area. The two-phase microchannel heat sink 110' 120 can also have low thermal resistance to heat dissipation 'large surface area to volume ratio, small heat sink weight and volume, small liquid coolant inventory, and a small flow rate requirement. It is also possible to achieve a more uniform temperature change in the flow direction and a higher convective heat transfer coefficient. Therefore, the two-phase microchannel heatsink can be applied to the thermal management of high-powered electronic devices 'including but not limited to devices such as high-performance 0 microprocessors, laser diode arrays, high-power parts in radar systems 'Switching parts in power electronics, x-ray monochromator crystals, avionics modules, and spacecraft power parts. Condenser As noted above with reference to Figure 2, a cooling system 1 can include a condenser 1300 constructed to remove heat from the working fluid to a fluid in the environment. In some instances, the condenser removes heat q to 空气 air from the ring brother. In other examples, the 'condenser can remove heat Q to another cooling system, such as, for example, a gas-compression refrigeration cycle, a single-phase cooling cycle (eg, a water freezer can supply frozen water to thermally coupled) A cold plate to the condenser, or even a second two-phase cooling cycle with an evaporator heat to the condenser. As described more fully below, the condenser 〇3〇 can accommodate heated working fluids from - or more of the microchannel heat sinks 110, 12 (eg, in a sub-cooled liquid phase, at A saturated liquid phase and a gas phase, or a gas phase in a 39 201038186 is another part (for example, a manifold) flowing between the micro-channel radiator and the condenser. As shown in Figure 13 By way of example, a condenser u〇a may comprise a laminated structure. For example, the first substrate 131 may define an internal heat transfer surface 13 2 a through which heat from a working fluid (not shown) is transmitted. The heat transfer surface passes through the - external heat transfer surface 133 through which the thermal Q_ can be transferred to the environment (eg, an ambient fluid or another object such as, for example, a heat having an air cooled radiator 162) The exchanger, as an example. The inner surface 132a can define a _ or more money zone that defines one or more flow paths through which the working fluid can pass through the internal heat transfer surface 132a to remove heat. (for example, convection). Internal surface n2a is delimited A plurality of splicing pieces, such as the condenser plate 23A shown in Fig. 24. A second substrate, or cover, 135 can cooperatively engage the first substrate 131 to cover the recessed area 132a and define the cladding The condenser flow path. The cover 135 can also define an internal heat transfer surface 136 through which heat from the working fluid can be transferred to an external heat transfer surface 137. In some instances, heat can pass through the surface i 37 Transfer to the environment (eg, to a heat sink or other cooling system). As with surface 133, the outer heat transfer surface 137 of cover 135 can be directly exposed to an ambient fluid, such as air a!, or a heat handle A heat exchanger, such as an air-cooled heat sink 162 (as shown, for example, in Figure 15). The cover 135 can include a heat sink base, and fins or other extended surfaces (not shown). The extension serves to promote heat exchange with the ambient fluid 101 (as described more fully below with reference to Figure 16 for example, 'the ambient fluid can pass between this extended surface and absorb heat removed by the wise fluid 201038186. Internally, the condenser 130a Definable The inlet plenum 138 and/or an outlet plenum 13 9 respectively fluidly couple the flow passage with one or more inlets 141a and/or outlets 141b. The plenums 138, 139 can distribute the working fluid to The working fluid is collected between the plurality of flow paths or from the plurality of flow paths, and it is supplied to a flow transition zone between the flow path and the inlet and/or outlet light connectors 1 4 1 a, 141b. A condenser can define a single continuous flow A channel, such as a bypass channel, is turbulently coupled to a plurality of microchannel heat sinks. Alternatively, as indicated in Figure 2, a condenser can define a plurality of flow channel regions 1 32, 1 34 for each individual micro. Channel radiators 110, 120. For example, referring to FIG. 2, the condenser 130 can define a first flow path region 132 corresponding to the first microchannel heat sink 11() and a second flow channel region 134 corresponding to the second microchannel heat sink 12A. In this embodiment, although a nominal (n〇minal) net heat exchange may occur between the flow regions, such as by conduction through the condenser plate, a primary heat transfer path for each flow channel region may be Working fluid in each zone 1 3 2, 1 3 4 to the environment. Figure 14 schematically shows two alternative configurations for the relative arrangement of the first flow path region (or condenser portion) 13 2 and the second flow channel region 1 34. In the "System A" configuration, the flow path regions 132, 134 are cooled in series (as shown in the configurations of Figures 15 and 16). In other words, an ambient fluid 1 〇 1 (labeled "air flow" in FIG. 14A) may abut the first runner region 132 through the heat exchanger before passing through a portion of the second runner region 134 through the heat exchanger 16 2 2 portion. As a result, in the configuration of system a of Figure 14A, second runner region 41 201038186 region 134 is exposed to an ambient fluid (e.g., air) heated by first runner region 132. This series cooling of the condenser sections 132, 134 in some instances provides insufficient cooling for downstream (e. g., 'secondary) runner zones 134. In the "System B" configuration shown in Figure 14A, the runner regions 1 3 2, Π 4 are cooled in parallel. In other words, the first flow path region 132 is adjacent to a heat exchanger, or a first portion of the cooler and the second flow path region 134 are adjacent a second portion of the heat exchanger. The first and second portions of the cooler are fluidly coupled in parallel with each other. With this configuration, the first stage of the ambient fluid passes through a second portion of the adjacent cooler and a second stream of ambient fluid that abuts the second portion of the cooler. The first stream and the second stream may remain substantially isolated from each other as they pass through the individual heat exchanger portions. In this configuration, since the first flow of the ring fluid and the second flow of the ambient fluid remain substantially isolated, the flow path regions 132' 134 are not substantially exposed to one that has been preheated by other flow channel regions. Environmental flow field. This parallel cooling can be used to balance the cold two = and system (four) shapes between the first flow path region 132 and the third flow channel region 134 (e.g., to provide similar heat transfer rates) using an early heat exchanger (or cooler). In the 'condenser 130 and the radiator 162 (the flow side == reverse · flow heat exchange P in other words, a field of environmental fluid 132, 13 4 is opposite to the condenser (10) (for example, through the flow zone converter) The normal flow direction of the working fluid. This - reverse flow heat transfer improves the heat transfer rate between the working fluid and the ambient flow (8) with gas, in the example. In other words, to provide the Guardian Working fluid to 42 201038186

The high overall heat transfer rate of the ambient fluid, the flow direction of the working fluid through the flow channel regions (1) and 134 may be opposite to the flow direction of the air flow (eg 'working fluid can flow from right to left and air flow can be left from left Flow to the right, as indicated by the arrows shown in the "A and System B configurations of Figure 14. Referring to Figures 15 and 16, an alternative condenser and cooler (heat exchanger) configuration is shown. Referring to Figure 15, - The condenser plate i can be in thermal contact with a cooler component (eg, an air-cooled heat sink (10)). For example, as shown in FIG. 15, a base member i6ib of the radiator 162b and a first condenser The substrate 13ib (similar to the layer plate ΐ3ι shown in Fig. 13) may be thermally coupled to each other (e.g., a film having a thermal interface material (e.g., 'thermal grease, solder #) 142b disposed therebetween) The base member 161b of the air-cooled diffuser 162b can include a first surface 164b for matingly engaging a corresponding opposing surface 264 of the condenser plate 130b, for example, each surface 164b, 264 can be substantially Flat. A thermal interface material M2c (for example, Thermally conductive grease or paste 'solder or a synthetic material, such

For example, a conventional grease or paste' having suspended thermally conductive particles, or "filler material" can be applied to the face between the mating surfaces 164b, 264 to improve heat dissipation between the surfaces. Still referring to the figures, the first and second flow channel regions 35132b' 134b are each-corresponding to individual microchannel heat sinks, and can be fluidly coupled to a further microchannel heat sink, for example, similar to that described above. Refer to the way of Figure 2. In addition to this, a cover 135b may cover the open top portion of the flow area 1 32b ' 1 34b. As shown in Figure 16, a condenser 130c can be combined with a cooler 16A. For example, a base 13c of a heat sink can define a separate flow region 43 201038186 132c' 134c' similar to the flow regions 132b, 134b described above with reference to FIG. The recessed flow channels 132c, 134c are flowably slidably coupled to individual microchannel heat sinks 丨1, 丨2〇 (Fig. 2) in a single configuration 131c. The condenser configuration 130c shown in Fig. i 6 eliminates a separate condenser substrate 丨3 lb and a radiator base 164b (Fig. 15) and further reduces the condenser passage 13 2c ' 134c and the cooler subassembly. The overall thickness between the fins 162c. For a fixed overall south condenser and fin assembly 13Ab, and 130c62c, this design allows the Korean piece 162c to increase in length compared to the fin 162b shown in FIG. In some examples, the fins 16A may increase in length as compared to the fins 162b to a total of the thickness of the base 1611) and the thermal interface material 142b. This-single-structure 131c can thus allow for a reduction in air-side thermal resistance, thereby significantly improving the overall cooling performance of the cooling system. Some of the covers 135b, l35c (Figs. H, 16) may comprise one or more walls 136c substantially perpendicular to the condenser, 13 〇 c of the first substrate ΐ 3.13k extending and positioned in the condenser i bird, For example, one or more such walls 13 6c may partially define an environmental fluid conduit, or a shield, 163 (illustrated that it is constructed to direct environmental fluids) when the environment The fluid passes through the cooler, extending between the surface 162C (eg, to reduce or eliminate a flow bypass that may occur otherwise, as described above with reference to Figure 4B). Some covers (10) 135C includes - a thermally conductive material (eg, an alloy of sinter or copper). The cover can be exposed to ambient fluid and provide - an additional heat transfer path for removing heat from the condenser _, _ (eg, = from ”, 'W ' 〇ut (Fig. 2)) to ambient flow 44 201038186 Cooling system An example of a compact microscale heat transfer system incorporating the features as described above will now be described. In particular, the following three system integrations Each of the examples can be constructed to match the definition by the PCIe specification Within the physical volume. System Integration - Example 1 Referring now to the drawings shown in Figures 17 through 24, a first compact, micro-scale heat transfer system, or cooling system, will now be described. The cooling system 1 'cooling system 2' of FIG. 2 includes first and second microchannel heat sinks 210, 220 (FIG. 22) fluidly coupled to individual condenser portions 232, 234 (FIG. 18, 20). -24). A pump is similar to the pump 150 shown in Figure 7 and the pump 250a shown in Figure 5 and constructed such that it is housed within the two-piece pump-closure manifolds 255a and 255b (Figures 7A and 7B), A sufficient pressure head is applied to a working fluid to circulate the working fluid between the radiators 210, 220 and the individual condenser portions 232, 234. As described more fully below, the radiators 21, 22 and condenser Portions 232, 234 are integrated into a laminated subassembly 230 (Fig. 20) to provide a very low profile (l〇W-pr0file) fluid circuit configuration. Fins 262 from the heat sink-and-condenser subassembly A first surface 235 of 230 (Figs. 17 and 2) extends. This integrated configuration allows for rotation Sheet 262 is longer than fins in other embodiments, similar to the discussion of fins i62b, 16 显示 shown in Figures 15 and 16. A second opposing surface 215 (Figure 18) of subassembly 230 defines heat transfer. Surface 21 1,221 'The heat transfer surfaces correspond to individual microchannel heat sinks 210' 220 and electronic component locations such that surface 2 i ^ 丄 is operatively positioned. 45 201038186 As herein, "operating "Located" means being positioned (eg, oriented) in a manner to enable a desired or specific function to be achieved. For example, an operatively positioned microchannel heat sink can be positioned relative to the corresponding electronic component to be thermally coupled to the electronic component, in part, by using conventional thermal interface processing, such as thermally conductive polymer, lubrication Lipids, compounds, adhesives, solders and the like. A centrifugal blower 1 70 is thus positioned relative to the fins 262 to enable air flow through the fins (Fig. 17). Pump_outer manifold 255&, 25 5b, microchannel radiator and condenser subassembly 23〇 (Fig. 2〇), and centrifugal blower 170 are supported by individual chassis members 24 (Figs. 17 and 19) Operating position. An electric power cable 171 has a power connector extending from an electric motor of the blower 170. A shroud (Fig. 18) containing various features (e.g., the duct extending from the blower i7〇 and a fin π) on the heat transfer surface as described above can be placed in various types of cooling system 2〇〇 On the part. Accordingly, the cooling system 200 can have an external appearance similar to the cooling system 100 depicted in Figures 4A and 4B. Referring to FIG. 18', the heat transfer surface 211 n defined by the "bottom side" or the second surface 215 of the laminated heat sink_and_condenser subassembly can be seen, and the 221 is extended by the second surface 215. Individual elevations: the face defined 'and each of the surfaces 211, 221' have a generally rectangular circumference (around the square in some instances). The best picture is as shown in Fig. 2. When a = 4 42 '44 (Fig. υ is mounted to its individual substrate μ, the individual circumferences of _221 can be oriented to correspond to the direction of the electronic package. For example As shown in Figure 18, the heat transfer surface 2ιι, 22ι of the individual 46 201038186 can be around a longitudinal line of the cooling system 200 (for example, relative to, for example, ~ between the various H slices 262 (Figure 17) - The flow direction of the air flow path extends about 45 degrees. ^ Also visible in Figure 18 is a chassis member 24A defining an opening 241. The π surface 211 '221 is from the heat sink and condenser subassembly 23 The surface 215 is raised sufficiently to extend through the opening 241 and to be thermally coupled (e.g., 'contacted) to the individual electronic components 42, 44. In Figure 18, a "bottom side" of the chassis member 24 is visible. Reference Mode 'The first end region 242 of the chassis member 240 is placed under the blower 17 and supports the blower 170 (Fig. 17). An opposite end region of the chassis member 24 defines a discharge end region 243 placed from Sewing off (Figure (7) under the exhaust. Shown in the cold of Figures 18 and 21 The "bottom side" of the system 2 is constructed to be placed on an electronic component of an add-on card 5 (Fig. 4A). In Fig. 19, a "top side" of the chassis member 24 is shown. The chassis shown in Fig. 19 is shown. The top side of member 24G is the part that is constructed to be placed under the components of the cooling system and supports the cooling system 2〇〇. Figure 2〇 depicts the laminated microchannel heat sink-and-condenser subassembly. 230 defines an outer perimeter 241 that is configured to be received in the corresponding opening 240 of the chassis member 24 (FIG. 19), the recessed portion or both such that the heat transfer surface 211 '221 extends through the chassis member - the opening 241 'and the "upper" surface are positioned substantially parallel to the back facing chassis member. Alignment features, such as tabs, may be defined by the perimeter (4) to assist the assembly 230 and the chassis member, or the tray, The 24" pallet means that the corresponding alignment feature can be mated with the component pair 201038186. The "upper" surface 235 of the subassembly 23 0 can be constructed to be thermally coupled to a cooler (eg, a separate Radiator to a similar In the manner of the condenser 130b (Fig. 15) 'or a fin, which is fixedly fixed directly to the surface 235' in a manner similar to the condenser 130c (Fig. 16). 'providing fins 2 6 2 extending from the condensing surface 2 3 5 and eliminating an intermediate heat sink base (eg, by soldering the wound or stacked fins directly to the surface) can be provided for larger Fin 262. In other words, 'eliminating a part having a measurable thickness allows for longer fins 262 to be placed within a volume that has a _limited "height" limit, such as specified by the PCIe specification. The laminated subassembly 23 provides a low profile and a thin construction that provides additional "direction" for the fins 262 (Fig. 17). Referring now to Figure 22, a major surface 215' of a heat sink plate 230b is shown. The heat sink plate 230b also defines a major surface 215 (Fig. 21) on an opposite side of the heat sink plate shown on the major surface 215 of Fig. 22. As noted above, the primary surface 215 defines an elevated heat transfer surface 211, 221' that is configured to be thermally coupled to individual electronic components. The major surface 215 of the heat sink plate 230b defines an interior surface of the heat sink_and condenser subassembly. The major surface 215, which also defines the recessed areas 2ΐ, 221 ', respectively, corresponds to the elevated heat transfer surface 2 1 1, 22 1 . In other words, the surfaces 211 and 2 U are placed on the opposite faces of the plate 23〇b and separated by the thickness of the plates. Similarly, surfaces 221 and 221 are placed on opposite faces of plate 230b and separated by thickness of plate 23'. 48 201038186 As indicated in Figure 22, the recessed surfaces 211, 22! of the plate 230b can accommodate individual microchannel heat exchangers 2 10, 220 formed from individual single substrates. Each of the heat sinks 210, 220 can be constructed as described above. For example, each of the microchannel heat sinks 210, 220 can define a high aspect ratio microchannel 'definable cross-connect channel, or both. A surface of the base of each heat sink (not shown, but similar to, for example, the bases 12 3 a, 123b (Figs. 11A to 12B)) can be welded to (or otherwise fixedly locked and thermally Coupled to) individual recessed surfaces 2 1 1, 22 1 . The lowermost wall of the microchannel defined by the individual heat sinks 210' 220 (e.g., a wall of a microchannel 119a, 119b defined by the bases 123a, 123b (Figs. 11A through 12B) may be substantially The ground and surface 215 are coplanar such that a working fluid can flow across the surface 215' and into another microchannel (e.g., a microchannel 119a (Fig. 11A)) without flowing over a "hierarchy." A condenser plate 230a', as shown in Figures 23 and 24, can be placed on the heat sink plate 230b in a mating engagement with the heat sink plate 23b to form, for example, the subassembly 230 of Figure 20. In other words, the surfaces 215, (Fig. 22) and 235 (Fig. β 1 23) can be brought into relative alignment with each other and fixedly locked to each other. For example, an outer peripheral portion 241a' of the plate 230a (Fig. 22) can be welded to a corresponding outer peripheral portion 241b of the plate 23b (Fig. 21). The condenser plate 230a defines individual cover portions 2 14a ' 2 14b, when the individual microchannel heat sinks 2 1 , 220 are locked to the recessed surfaces 211, 221, (Fig. 22), individual cover portions It is constructed to be placed on individual microchannel heatsinks 2, 22 。. The lid portion 214a' 214b can be a recessed portion in the panel 23A and an upper wall of the microchannel that can define the individual heat sinks 210, 220, as shown in Fig. 10, similar to the display 49 201038186 The way the view of the lid 114 is. The condenser plate 230a defines a recessed condenser portion 232, 234 that corresponds to the respective cover portions 214a, 214b and the microchannel heat sinks 210, 220. Further, the condenser plate 230a defines an inlet opening 205 and a corresponding in-line conduit portion extending between the opening 205 and the recessed cover portion 214b (corresponding to the heat sink 22). The condenser portion 234 extends back from the recessed cover portion 214b to a recessed conduit portion 2〇7. The recessed conduit portion 207 extends back from the condenser portion 234 to the in-line cover portion 214a. The turning vane 2〇2 is positioned "upstream" of the lid portion 214a and is configured to function as an inlet manifold to the microchannel' microchannel defined by the heat sink 210 and the lid portion 214a. The condenser portion 232 of the corresponding heat sink substrate 210 extends from the cover portion 214a to an outlet conduit that is fluidly coupled to a condenser plate outlet 2〇6. As shown in Figure 24, the condenser plate 230a can define a condenser flow path between the extended heat transfer surface ' or the fins 238. The condenser flow path can be measured to be about 0.635 millimeters (mm) wide and about 2 millimeters deep, giving a condenser flow path an aspect ratio, in some instances, about 3:1 (height: width). In some embodiments, the condenser flow path can have a larger or smaller aspect ratio. The fins defining the condenser flow path can be measured to be between about 25 mm and about 1.0 mm wide (and about 23⁄4 m deep). In addition, the fins 238 can be interrupted in varying length intervals by the parent connection channel 236. As described above in the cross-connect channel connecting the microchannel heat exchangers, the cross-connect channels 236 extending between the various condenser channels can be balanced against pressure changes between adjacent flow channels. When the fluid removes heat, phase changes, or both, the pressure balance of the 2010 201018 can improve the flow consistency of a working fluid. Ο

With further reference to Figure 24, the illustrated condenser plate 23A defines a row of fins 238a' which have a greater cross-sectional thickness (e.g., approximately twice) than fins 238. The fins 23 8a may provide sufficient contact area to solder or otherwise attach the individual distal ends of the fins 238a to the heat sink plates 23A (Fig. 22). This attachment is along the approximate centerline of the condenser portions 232, 234 which provides additional rigidity to the subassembly 230 and can alleviate or eliminate any outward bending, or bulging, etc. Outside may begin with high internal pressure, which may result in high internal pressure when the cooling system 200 is operating. When the illustrated condenser plate 230a and the illustrated radiator plate 23〇b are brought into a relative alignment state, the individual main surfaces 215, 235 are engaged with each other in the & inlet 205, the heat exchanger 21〇, 220 and the cover portion. 214a, 214b, condenser sections 232, 234' and outlets 2〇6 (and associated conduit sections) are fluidly coupled in series. In other sub-component embodiments, the heat sinks 21, 220 and the condenser portions 232, 234 are fluidly coupled in parallel. This laminated subassembly 23, as illustrated, provides a thin configuration for a plurality of microchannel heat sinks and condensers. This...the thin sub-assembly 23〇 is smaller than the microchannel heat sink and other configurations of the condenser, leaving a large volume for the fins 262' and thus allowing more surface area for "air side" heat than other configurations. exchange. Referring again to Figure 17, subassembly 23 and 262 may be supported by chassis member 240. The outlet 254 of the pump housing manifold f 255a, 255b can be fluidly coupled to the inlet 2〇5 of the subassembly 230. For example, a 〇-shaped ring can extend around the opening 205, 254 in a conventional manner between the outer cover manifold 255a, 25 51 201038186 and the subassembly 230. Similarly, the inlet 256 of the pump housing manifold 255a, 255b can be fluidly coupled to the outlet 206 from the subassembly 230. As a result, the laminated construction of subassembly 230 is combined with pump housing manifold 255 to provide a very tight two phase working fluid circuit that leaves a significant volume of crucibles 262 of dense array of fins 262. This dense array of fins can be reduced or mitigated, the effect of the "air side" heat exchange "bottleneck", allowing the ’ system to be implemented as indicated in the diagram shown in Figure 3. This cooling system, 200 is a very suitable space-constrained application, which requires the name of high heat flux electrical parts, such as computer add-on cards, automotive electronics and other applications. ~ System Integration - Example 2 In some systems, each material ·] g; first, "- "channel heat release can be relative to the cooling system," he is next to each other (that is, independently of each other Descriptor. When the adjacent electronic parts are:: this movement), as described below, the gi, , ^ ^ tolerances have varying heights, and this contamination can be ideal. In other words, 120 can be operatively relative to 110' Fen gu ~ corresponding electronic parts 42, 44 (Fig. υ positioning and being clamped throughout the other parts of the cooling-(10)(10)? The chassis accommodates electronic components, the substrate and its group & aligning with each other so that changes may occur during manufacturing. The change in B dimension 'this dimension

The cooling system shown in Figure 25, in which the integration is described above, will now be described. As described by Ray + f Du μ 糸, " 300 can be used to remove the removed precision parts emitted by electronic parts 42, 44 (Figure 2), ® _ machine Q2 and hunting this maintenance The critical temperature on a special/tank is below the upper critical temperature. 52 201038186 The cooling system 300 includes two independently floating microchannel heat sinks 310, 320 supported by a chassis 34 that operatively position the heat sink relative to the individual electronic components 42, 44 while accommodating changes in z_height between the parts . Chassis 340 is a component that is constructed to mount and/or support cooling system 300 relative to substrate 46 (Fig. 1) and other cooling system components, such as radiator 162c, condenser 131c, pump 15A, and corresponding pump housing-discrimination Tubes 155', 155a', blower wheel 170 (and its outer cover (1 64)) and shroud 163' are substantially independent of floating microchannel heat sinks 31, 32. This separate mounting allows heat sink 310, 32〇 maintains operational positioning relative to individual electronic components 42, 44, and other cooling system components while accommodating changes in z-height between the parts. As described herein, the centrifugal blower i 7〇, the illustrated blower impeller can be driven An ambient fluid (e.g., 'air) is between the extended surfaces 162c of the remote heat exchanger. In the cooling system 3, a ^ ^ ^ is passed from a blower inlet to the impeller 170' which gives a moving 茗μ 洛(dynamic head) in the air.

The outer cover of the machine 1 6 4 defines a private time m 'political interest is used to decelerate the air discharged from the impeller and restore the dynamic drop to the pressure drop. The blower cover usually also defines a blower outlet for connection to a guide type 3#, etc. Other guides 163' are used to guide the air g hood provided by the blower, or a duct, which can define a first-class road Between the blower wheel and the flow path between the extended slabs 162c. In the described cooling system 300 (and Nong Xian, Ren,, clock 浐 Μ / 〇 郃 郃 100 100 100 100 100 100 100 , , 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 叶轮 ( ( ( ( ( ( ( The airflow emitted by the attendant impeller and the blower outlet (not even paged) is in a field (Wuyi 15η, Η* hot father exchanges the entrance (adjacent blower) from the pump 50 dare to the right area - 4 In other words, in each of the systems shown in the disclosure No. 53 201038186, the pump is positioned in a "dead zone" where little or no air flow occurs. In other embodiments, the impeller reversible clock Rotating, causing the region with the highest dynamic drop to be in the region currently shown by pump 丨 50'. In this embodiment, the pump can be positioned relative to its position (relative to the heat exchanger) to allow for high motion The area of the drop is connected to the heat exchanger fins and occupies the "dead zone". There is no or a small amount of air flow. In some cooling systems, the blower outlet can be -., one, 曰u 'mouth , a 八w to heat exchanger 1 62c. For example The blower cover can be snap-fitted (for example, "seamlessly") with a shield 163 formed by a condenser cover, excluding a separate shield or other air duct to engage the blower and extend over the distance The need for a heat exchanger for m. Eliminating separate shrouds or other venting tubes and their corresponding thicknesses allows remote heat exchangers to have longer extended heat transfer surfaces within a given space-constrained volume. It has been found that the performance of the cooling system 200 can be found by heat exchange between the heat exchanger 260 and the environment 1 (i.e., "air_side heat exchange"). Eliminating the thinner parts such as the venting tube and the corresponding thickness 'and lengthening the extended surface (eg, fins) by a corresponding distance 'even if it is quite right, can improve the air_side heat exchange to improve the cooling system 丨. 0,2. Cooling of 300 and 4, for increasing the available volume for increasing the surface area of the surface, but the system 300 can contain a metal ^, 7 匕 3 genus 5 蒦 cover part 163 , was constructed to pass 埶_ 4 points Q〇u&quot To the environment, the metal shield portion 163, if constructed in the system 3〇0, is thermally grounded to the condenser. As discussed in connection with Figures 15 and 16 54 201038186, the shield can form a "cover" 'It partially encloses a flow channel in the condenser that carries the worker, the + body, and thus can be placed in direct contact with the working fluid. Although the brother of the brother 300 contains a metal shield' In some examples, the shield 163 J includes a plastic shield extending from the conduit 164. In this embodiment, most of the thermal Q〇ut is removed from the heat sink 162.

Furthermore, the shield 163 shown in Fig. 3, A contains a thermally conductive material and is in thermal contact with the condenser 131c for lifting

〇 An additional heat transfer path is used to remove the heat absorbed by the cooling system 从, 兄弟 300 from the electronic components 42, 44 to the environment 1 (Η. Applicants found this extra etched through the shield y The pass path can further improve the air-side heat exchange and substantially increase the overall efficiency of the cooling system. The chassis 340 defines two main openings 31〇, 32〇 for providing the microchannel heat sink 310. , 320 and the corresponding thermal contact between the electronic components 42, 44. The chassis 240 also defines four pin openings around each of the main openings 310', 320', the microchannel heatsink 31, 32 The pins 28 of the crucible can extend through the pin openings as described above. Referring to Figures 4A, 8C, 2S and 26, a substrate 46 can be positioned in a substantially parallel alignment with the chassis 340 and in microchannels. The heat sink 3 1 〇, 32 〇 pin 280 extends through the substrate and is fastened to the chassis 34 〇 ^ Once the substrate 46 and the chassis 340 are fixedly attached to each other, the microchannel heat sink 3 丨〇, 3 〇〇 can be opposite Moving on the substrate, as it can be relative to the chassis. The range of this motion can depend on 'Partially, the length and material selected for the fluid conduits 316, 317, the fluid conduits combine the microchannel radiators 3 10, 320 to other parts of the cooling system (eg, condenser 1 3 1 c.) 3 10,320 can be moved 55 201038186 by a sufficient distance to operatively position it relative to each of the individual electronic components 42, 44. For example, fasteners (not shown) cooperatively engage each of the pins 28〇 The wall void (Fig. 8C) can be tensioned against the substrate 46 and the microchannel heat sinks 310, 320 are oriented toward the substrate, advancing each of the microchannel heat sinks against a corresponding sub-piece 7 44. In this manner, the microchannels The heat sink can be operatively positioned relative to the corresponding electronic component regardless of, for example, a change in the Z-rfj degrees (Z!-Z2) relative to the part between the additional cards. With further reference to Figure 25, the illustrated heat exchanger 162c is an air cooled The chemist has a base member comprising a single configuration having a condenser substrate 131c (Fig. 16) and a plurality of extended heat transfer surfaces (e.g., fins) i62c extending substantially perpendicularly toward the q condenser substrate. In the example The fins are slaved fins, and in other embodiments, the fins are stacked rotators. The base member 13 1 c is positioned substantially parallel to the chassis 34 〇, and when the system 300 is as shown in FIG. 25 When assembled as indicated, it is spaced apart from the microchannel heat sink 3 10 '320. The plurality of extended heat transfer surfaces 162c extend substantially perpendicularly relative to the base member 丨3丨c and down into the base member 丨3 ic And the space between the microchannel heat sinks 3 10, 320. The distal end of the fins (relative to the base member) is typically adjacent to the microchannel heat sink and spaced apart from the microchannel by a conventional, stationary position . Depending on, for example, the range of z-height variations between the electronic components 42'44, when the cooling system 3〇〇 is operatively positioned, one or more distal ends can be closely positioned adjacent to each other or even Touch, one or two microchannel heatsinks 31〇, 32〇. To further increase the available volume for increased fin surface area, cold 56 201038186 but system 300 can include a metal shield portion 163 that is configured to transfer heat

Part of Qout Qc^t, 2 to the environment. Metal shield portion 163', as constructed in system 300, is thermally coupled to the condenser. As described more fully below, the shield can form a "lid" that partially encloses a flow passage within the condenser that carries the working fluid and, therefore, can be placed in direct contact with the working fluid. Although the illustrated system 3 includes a metal shield, in some examples, the shield 163 can include a plastic shield extending from the conduit 164. In this embodiment, most of the thermal Qc > ut & heat sink 162 is removed. Referring to Figure 26, an alternate configuration for the heat sink and condenser is shown. The configuration shown in Fig. 26 is similar to that shown in Fig. 5, and is linked to Fig. 15. System Integration - Example 3 Another cooling system 4 will be described with reference to Figs. 27 to 3 1 '. Cooling system 400 (Fig. 31) includes first and second heat sink subassemblies 26A & 26b. Each of the subassemblies 26A' 260b includes a further microchannel heat sink fluid 〇 coupled to a pair of condenser plates (e.g., plates 23〇b, 23〇b, as shown in Figure 27). As described above, the subassembly 26A can be supported by a chassis member, partially cooled by a flow of air that is driven by a fan and surrounded by a blower. Referring to Figure 27', the heat sink assembly can include a microchannel heat sink substrate as described above. Thus, the microchannel heatsink _ (which may include a cross-connect channel other than the microchannel described above. The microchannel heatsink may thus operate as a - single phase early phase C, eg liquid) heat sink Or a two-phase heat sink, as described above. 57 201038186 The microchannel heatsink 2丨0a can be fluidly coupled between each of the 23〇b, 230b, and the 7 snail components and the chilled fins 262b can be extended. This is especially useful when air side heat exchange is not the main system bottleneck. In other words, in the example, when the film is heated from the early-end (such as in the season: first 00, 3〇〇) 'where the heat sink fin 262b has low fin efficiency, place a second The condenser assembly 2 I·" /... 妾 (4) W placed remotely from the assembly) thermal contact can increase the fin efficiency of the 262b and thus dissipate at a higher rate. The condenser assembly 2 birds, 2 inches, have characteristics similar to those described above. The condenser assembly can be fluidly coupled using a manifold, as described above and shown in, for example, Figures 5 and 6. The components = to f 11 depict various features, which may be displayed on the heat sink, 'thousands,' body embodiment. Figure 9 7 Valley q+ sake, scattered... For the sake of brevity to 3 i omitted. D. As shown, more parts may be available from one or more of the 27 subassemblies (the sub-components may include one or for the sake of brevity: rr=b in the specific embodiment, and a blower. However, in For other concise reasons, J makes == and / or multiple blowers. Also for sub-components. For example =::.: and 'can use other quantities of multi-sub-components. Use self-early-sub-components, or It is three or more. In addition, the displayed sub-plants are substantially similar (Figures 27 to 31). However, in 4b and I*眚M h + all can not be seven of each of the seven pieces. The portion or the plate of the sub-assembly 260b may be larger than the plate of the sub-assembly 26〇a 58 201038186. The individual micro-channel heat sinks 210a, 21 are also different between the components. For each sub-assembly, use There are two plates that have a force between the two plates, however 'in another embodiment' may employ other numbers of plates, which may or may not use the same configuration of the fins. It is desirable to couple the cold electrical parts. This electrical part is not shown. For example, in some embodiments, it can be used This component uses a cooling-display card.

Referring to Figure 27, each sub-assembly includes, by way of example, a microchannel heat sink 210a, a bottom plate 230b'' - a top plate 23b, a rotor 262b, and at least one manifold 252b. Heat is exchanged from the device to be cooled to the microchannel heat sink. The heat from the microchannel heatsink is exchanged with the bottom and top plates of each sub-assembly. The heat from the bottom plate and the top plate through the use of two cooling plates having internal cooling passages (i.e., fins) is also supplied to the two gases generated by the blower. Therefore, the heat of the parts to be cooled can be removed from the system. Referring to Figures 5, 6 and 29, in general, the fluid can be saturated into the microchannel heat sink 210a. In one embodiment, the liquid from pump 250a, through manifold 252b to bottom plate 230b, passes through an inlet or outlet adapter 215 (Fig. 29), and then to microchannel radiator 2 10a. The fluid flows through the micro-sized channels in the heat sink and absorbs heat. The fluid can change phase (boiling) if sufficient heat is exchanged and/or a sufficiently low flow rate is used. The two-phase fluid can exit the microchannel heat sink 210a and the passage 232b that enters the bottom cooling plate 230b. In the bottom plate 230b, one or more fluid passages 232b are configured in a pattern, such as a pattern. Channel 232b can cover the area of bottom plate 230b. This allows the hot fluid to spread heat over the area of the bottom plate. In one embodiment, heat may be substantially spread throughout the bottom plate to create a platform area that is larger than the size of the 2010 2010 186 微 (microchannel heat sink) to exchange heat to the air. The heat is directed into the air heat exchange fins and then to the air flowing through the assembly. From the bottom plate 230b, the fluid travels to the top cooling plate 23b, (Fig. 2 is. In one embodiment, fluid travels from the bottom plate 23b through the manifold 252b to the top plate 230b. The fluid traverses within the top plate The heat may be spread to the bottom plate 230b in a similar manner. Although the fluid flow is described as traversing the series sub-assembly, the heat sink assembly may be constructed such that the sub-components are fluidly coupled in parallel. The top and bottom cooling plates and heat are removed to the air, vapor condensed and a saturated fluid, or slightly subcooled (Sub_C〇〇led) fluid, leaving the top plate 230b'. Fluid from the top plate of the sub-assembly 26〇b 230b flows to the bottom plate 23A of the sub-assembly 26A. In one embodiment, the manifold 252b transfers fluid from the top plate to a cross-tube 258 or other mechanism for providing fluid to the sub-assembly 260a. In another embodiment, the fluid can pass to another pump, which in turn draws fluid to the sub-assembly 26A. The fluid then travels from the bottom plate 230a' into the inlet of the microchannel heat sink 22(R). Follow a class The path of the (including the same) sub-assembly 26〇b. The sub-assembly 260a acts in a manner similar to the sub-assembly 26〇b. The fluid exchanges heat into the air heat exchange fins 262a, 262b and to a shroud 463 (Fig. 31) to remove heat to the face just outside the cooling system 400. When leaving the top plate 230a 'the fluid is then returned to the pump 25A. This heat sink assembly 260a, 260b, as shown in Figure 30, Various advantages such as systems 100, 200 and 300 are provided. Phase changes can occur without a substantial temperature gradient in the fluid change state. For cooling applications, the use of boiling 60 201038186 3 provides the advantage of a uniform temperature 'this temperature provides cold :: degrees relative to the boiling surface and - the changed heat input can be a uniform hook == lend!!, the parts to be cooled can have - more uniform ancient ... the latent heat phase is the same as the change in fluid temperature The channel heatsink is capable of dissipating a greater amount of heat. As described above, the direct finder is constructed A.,,,,..., and the assembly 260a, 260b can be constructed as a directional heat exchanger. c ^ VU general flow of working fluid Ding opposite to the ambient fluid into, for example, * # ^ ^^ ^ square work roll extending through a heat exchanger between the condenser fin plate member,, and - as the flow direction). In addition, the use of each sub-component package is applied to the two plates with / / fins in /. The two plates are used: double the contact surface area for heat transfer between the fluid and the Korean film. == is attached to both the top plate and the bottom plate. This allows heat to be transferred from the Ί, used for > 1 into the Korean film. The heat transfer from both ends effectively reduces the heat transfer path for the parent The fin length. This improves the fin efficiency. The efficiency of the cymbal is inversely proportional to the fin length. The m-changing & cooling at the end of the fin is '" because the ends of the slab are fully attached. Connected to a board. In addition, the pump position w..^. can be selected to improve the efficiency of the political heating component. As in the text, the Sw, the air flow, the Axu from the sub-component 260a to the sub-, And the piece 260b. However, in the concrete implementation, the air flow can have one or more M parts for its universal movement. The air flow from the air blower does not flow uniformly and linearly from the blast, ώ M buckles a few / claws. Alternatively, the circular motion of the blower impeller gives a channel formed by an air flow coffee. The result is a two-way non-quantitative The ground parallel to the area of the heat sink assembly by the wrong piece can have a lower air flow. For the old days, a dead zone can exist in the air flow. 61 201038186 The pump is placed in The heat sink assembly is dead. Because of the pump, it does not require the direct exchange of heat to the air" as the desired effect, the pump is placed in the dead, the area of the heat sink assembly that maintains an air flow, The use of air flow for the parent heat transfer can remain effective. As a result, the efficiency of the heat sink assembly can be improved. Furthermore, the use of a manifold can also improve the heat sink assembly. The heat sink sub-assembly can utilize a manifold for guiding the fluid Entering and exiting the top and bottom panels, and entering and leaving the sub-assembly. The manifold is solid, such as formed from a copper block having holes drilled therein to control fluid flow. In some embodiments, an inertial guiding fluid The inlet-sub-assembly to the bottom plate directs fluid from the bottom plate to the top plate and directs fluid from the top plate to a cross-over tube to another sub-assembly or back to the pump. A manifold can be used at the tube to direct fluid flow. This problem, such as leakage 'lack of stability, and increased coverage of the system, can be avoided. Further, because the manifold can be a large piece of copper, the manifold can provide a larger footprint to weld to the floor or maintain Sub-component parts. Therefore, the manifold can also improve stability, reduce leakage, and improve the efficiency of the heat sink assembly. The heat sink assembly can also be improved through the use of dummy channels. Cooling efficiency. The bottom plate may include a dummy channel and channel to the microchannel heat sink and a dummy channel and channel from the microchannel heat sink. Note that the specific configuration of the channel and the dummy channel may be changed. Further, additional The channel and/or the additional dummy channel are in another embodiment. A dummy channel can be used to isolate fluid from entering the microchannel heat sink. In an embodiment, the dummy channel is formed in the bottom plate. When a cover member is provided on the bottom plate, an air 62-filled false passage is formed. Alternatively, the cover may be provided in another atmosphere and sealed, or the passage may be filled in another manner. Fluid enters the microchannel from the bottom plate of the sub-assembly. This fluid is slightly cold. The fluid leaving the microchannel heat sink traverses the bottom plate. The fluid from the microchannel heat sink is relatively geothermal and has heat received from the microchannel heat sink. False channel

He is a thermal isolator, or a vacuum. As a result, the false channel is = away: because the dummy channel is essentially isolated. The false channel helps to thermally isolate the channel into the microchannel heat sink. As a result, the fluid to the microchannel heatsink can be kept cold. This can improve the efficiency of the microchannel heat sink. The heat sink assembly described herein may share some or all of the advantages discussed above. For example, the heat sink assembly may employ one or more of the following features: a microchannel heat sink, the liquid flows in the opposite direction of the air flow, a plurality of cooling plates, each of which is connected to the fins for air flow in a dead zone Pump, manifold, and / or false passage. Thus, the assembly can have improved efficiency, improved stability, improved cooling, and/or other previously described advantages. As shown in the figures, the heat sink assembly, 2_ can be fluidly coupled to each other and supported by a chassis structure #44, similar to the chassis member described above. The chassis member 44A can support the blower 17 and the can cover can be placed on the blower 170, and a conduit (6) can be placed on the individual: heat sink and the member 60a 260b. The thermal contact surface 21 ia, 221a can extend sufficiently through the chassis member to be thermally coupled to a component microscale heat transfer system that is mounted, for example, to an add-on card. Figure 32 shows a two phase "passed as disclosed herein. - Microchannel cooling 63 201038186 Benefits of the test data obtained from a working sample of a closed circuit cooling circuit. Figure 32 shows that the inlet pressure Pin and the outlet pressure PDUt change much less than if the flow field through the microchannel heat sink is unstable. Accordingly, it is shown in Figure 32 that substantially uniform inlet pressure and outlet pressure indicate that the two-phase flow remains stable through the microchannel heat sink, although relatively high heat flux will result in first-class passage through having continuous scales (i.e., 'not as here A microchannel heat sink of the disclosed cross-connector is unstable. The data shown in Figure 32 shows an amazing increase in heat sink performance by including cross-connects compared to a microchannel heat release without cross-connects. Figure 33 shows a graph of the predicted change in heat sink temperature versus microchannel aspect ratio. Figure 33 indicates that for hypothetical cooling systems and environmental conditions, doubling the channel aspect ratio from 6:1 to 12:1 is predicted to reduce the heat sink temperature rise above the environment, Τ, when about 15 watts (W) is emitted, About 12 degrees Celsius (t). & Figure 3 4 shows a graph of predicted changes in pump backpressure versus microchannel aspect ratio. Figure 16 indicates that for hypothetical cooling systems and environmental conditions, the double microchannel long-term ratio is predicted to reduce the millet back pressure p by a factor of about 4.1 from 6:1 to 12:1. Figure 35 shows a comparison of the temperature rise of the microchannel heatsink over ambient temperature. 'A microchannel heat dissipation with a 6:1 aspect ratio for a defined cross-connect microchannel|§ (Working Sample 1) and a working microchannel heat sink definition High aspect ratio (12:1) and cross-connected microchannels (Working Sample 2), as disclosed herein. The radiator with the old aspect ratio microchannel is provided - amazing 7. The generation is lower than the 6:1 aspect ratio micro pass 64 201038186 The heat sink exceeds the ring ρ, ra dangerous π production, over % soil brother temperature The temperature rises. This 7 4. It’s surprisingly more than expected, and the singularity of the singularity of the singularity of the singularity of the singularity of the slogan (for example, far better than the predicted 1.2. (: improvement, not in Figure 33). Other specific examples ο ο Narrative feature, which is possible in many embodiments, with a tight volume of cooling system with a σ of + (eg, a volumetric specification and measurement of approximately (10) 吋 multiplied by approximately 13/8 吋 times The large part of the cold part of the electrical parts is distributed up to 150 watts (continuously) and has as little as about the grab-inhibited part temperature rise exceeds the local ambient temperature. The inner valley reference of the stomach is part of the disclosure. The same reference numerals are used to refer to the same elements throughout the drawings. The drawings illustrate the specific embodiments, but may form other specific embodiments and changeable configurations without departing from the scope of the present disclosure. , top, bottom, left, right, backward, forward, etc.) can be used to facilitate the discussion of the schema but is not meant to limit the mouth. Use: terms such as "upper", "lower", "above", " Below," ' "Vertical", "left", "right" and the like. These terms are used, where appropriate, to provide a clear description of the relative relationship, particularly with respect to the specific embodiments made. Certain terms, however, are not intended to imply absolute relationships, positions, and/or orientations. For example, an "upper" surface can be changed to a "lower" surface by simply flipping the object relative to the object Β σ. However, it remains the same for the same surface and article. For the purposes of this user, "and/or" means "and" and "and" and "or". Accordingly, this detailed description is not to be construed as a limited limitation, and 65 201038186 The following is a general knowledge of the disclosure of the present disclosure. Those skilled in the art will appreciate the variety of cooling systems that can be used herein. The various concepts described are designed and constructed. In addition, those skilled in the art will appreciate that the exemplary embodiments disclosed herein may be embodied in various embodiments without departing from the disclosed concepts. Therefore, the specific embodiments disclosed herein are to be considered as illustrative and not restrictive. Therefore, we advocate our king of the moon. The bag 3 is in the scope and spirit of the patent scope below. [Simple description of the map]

Figure 1A depicts a schematic plan view of an abbreviated AA suspension configuration including first and second electronic components, and a substrate with an attached Leica (add) -in card) ° ® 1B depicts a side view of the operational configuration shown in Figure 1. Figure 1C depicts a side view of a portion of the operative configuration shown in Figure 1A. FIG. 2 depicts a schematic diagram of an example of a cooling system disclosed herein. Figure 3 contains a graph comparing the performance of the cooling system disclosed herein with the performance of prior art cooling systems. Figure 4A shows a cross-sectional view of the assembly of the display card and the chassis member, including an embodiment of the cooling system disclosed herein. Figure 4B shows an isometric view of the cooling system of Figure 4A. Figure 4C shows a bottom plan view of the cooling system of Figures 4A and 4B. Figure 5 shows an exploded isometric view of a partially assembled cooling system of a partially assembled second embodiment of a cooling system 66 201038186. Figure 7 illustrates an exploded view of a portion of the pump-housing manifold and pump assembly. Figures 7A and 7B show portions of another pump-housing manifold. Figures 8A, 8B and 8C depict various isometric views of an embodiment of a microchannel heat exchanger cover incorporating inlet and outlet adapters.

Figure 9 shows a top plan view of an array of interconnected microchannels in a microchannel heat sink substrate. Figure 9A shows a portion of the array of Figure 9. Figure 10 shows a top view, an end view, a side view and an isometric view of the cross-connect microchannels. 11A and 11B are schematic views of a working sample for forming a microchannel heat sink using a micro-deformation technique. 12A and 12B are schematic views of a working sample for forming a microchannel heat sink using a skiving technique.

Figure 6 shows the view in the figure. Figure 13 is an exploded view of a condenser. Figure 14 shows two schematic views of a possible condenser configuration. Figure 15 shows an exploded view of a condenser and heat sink assembly. Figure 16 shows an exploded view of a condenser containing fins extending from an outer surface of the condenser. Figure 17 shows an isometric view of the compact cooling system disclosed herein. Figure 18 shows an isometric view of the bottom side of the cooling system of Figure 17. Figure 19 shows a tray, or chassis member, which is constructed to support the components of the cooling system shown in Figure 17. 67 201038186 Figure 20 shows an isometric view of the integrated radiator and condenser subassembly. Figure 21 shows an isometric view of the bottom side of the integrated heat sink and condenser subassembly of Figure 20. Figure 22 shows an isometric view of the heat sink portion of the subassembly of Figure 20. Figure 23 shows an isometric view of the condenser portion of the subassembly of Figure 20. Figure 24 shows a top view of another embodiment of a condenser portion for the subassembly of Figure 20. Figure 25 shows an exploded view of a second embodiment of a cooling system. Figure 26 depicts an exploded view of a portion of the assembly shown in Figure 25. Figure 27 depicts a heat sink subassembly. Figure 2 8 depicts another heat sink subassembly. Figure 29 shows an exploded isometric view of the subassembly of Figure 27 as seen from below the condenser. Figure 30 shows a pair of heat sink subassemblies. Figure 31 shows an exploded view of the cooling system including the heat sink subassembly shown in Figure 3A. Figure 3 2 shows the time-dependent fluctuations in fluid pressure caused by a stable two-phase flow as disclosed by a microchannel monthly heat sink. Figure 3 3 shows a graph of predicted heat sink temperature versus microchannel aspect ratio for the systems disclosed herein. Figure 34 shows a graph of pump backpressure versus microchannel aspect ratio predicted for the system disclosed herein. Figure 35 shows a comparison of the temperature of a microchannel heatsink that rises above atmospheric temperature. The microchannel heatsinks that define the microchannels with an aspect ratio of 6:丨 and the microchannels of the microchannels with an aspect ratio of 12:1,2010. heat sink. [Main component symbol description] None

Ο 69

Claims (1)

201038186 VII. Patent Application Range: 1. A micro-scale heat transfer system comprising: a microchannel heat exchanger defining a plurality of microchannels coupled to each other by a plurality of cross-connect channels, the cross-connect channels along - the flow direction is spaced apart, the flow direction being defined by the microchannels such that when the microchannel heat exchanger is thermally coupled to a heat source, the microchannel heat master is constructed to stably evaporate a working fluid a portion; a condenser 'which is fluidly coupled to the microchannel heat exchanger and configured to condense the vaporized portion of the working fluid; and a pump fluidly coupled to the condenser and the microchannel heat exchanger to be constructed The circulating working fluid is between the microchannel heat exchanger and the condenser. 2. The microscale heat transfer system of claim 1, wherein the microchannel heat exchanger and the condenser comprise a portion of an integrated subassembly comprising: a first plate defining an opposing interior And an outer major surface, wherein an inner major surface of the first panel defines a heat sink region configured to receive the microchannel heat exchanger; and a second panel defining opposing inner and outer major surfaces, wherein the second panel The inner main surface defines a cover area and a condenser area, wherein the first plate and the second plate are fixedly locked together in opposite opposite sides such that the individual inner main surfaces face each other, and the microchannel heat exchange therebetween The device is disposed between the first plate and the second plate. 3. The microscale heat transfer system of claim 2, wherein the microchannel heat exchanger is thermally coupled to the heat sink region, and wherein the cover region 70 201038186 is placed on the plurality of microchannels for 4. The third boundary of the patent scope is the boundary of Huguang Road. The condenser zone of the second plate and the microscale heat transfer system of the first plate define at least a condenser flow path. - Corresponding, relative regional boundaries 5 · The micro-scale heat transfer system described in the 4th Flute of the patent application scope, the condenser area of the first plate in i, the middle extension film and the continuous film heart t The inner main surface of the second plate is 1 square/L. The flow is separated from each other by at least _ ά Ο Ο flow direction. The micro-scale heat transfer system of claim 5, wherein at least one of the plurality of extended surfaces in the basin is welded to a corresponding portion of the inner surface of the first plate. The micro-scale heat transfer system of claim 2, wherein the integration sub-assembly further comprises a plurality of (four) sheets extending from the outer major surface of the first, second, or both. 8. The microscale heat transfer system of claim 2, wherein the outer major surface of the first panel defines a raised surface that is positioned substantially relative to the inner major surface of the first panel Defined radiator area. 9. The micro-scale heat transfer system of claim 2, wherein the microchannel heat exchanger comprises a first microchannel heat exchanger and a second microchannel heat exchanger and the heat sink region thereof comprises A first heat sink region and a second heat sink region 'where the first heat sink region is configured to receive the first microchannel heat sink and the second heat sink region is configured to receive the second microchannel heat sink. The micro-scale heat transfer system of claim 9, wherein the cover area comprises a first cover area and a second cover area, wherein the first cover area is placed on the first heat exchanger and The second cover area is placed on the second microchannel heat exchanger. The micro-scale heat transfer system of claim 9, wherein the condenser region comprises a first condenser region and a second condenser region 0. 12. The micro-process described in claim 11 A scale heat transfer system, wherein the first microchannel heat sink and the first condenser region are fluidly coupled in series to the second microchannel heat sink and the second condenser region. The micro-scale heat transfer system of claim 1, wherein the first-microchannel heat sink and the first-condenser region are fluidly coupled in parallel to the second microchannel heat sink and the second condenser region. 14. The micro-scale heat transfer system described in the second paragraph of the patent application, the inlet step comprises a spring cover manifold, which defines an internal chamber, and the internal chamber is configured to accommodate the pump, an inlet opening The month and the outlet opening, wherein the pump is positioned at least partially at the manifold of the pump housing.丨 4 chambers. 15. A microscale heat transfer system as claimed in claim 14 wherein the pump defines a pump inlet and a pump outlet, and wherein the pump inlet is fluidly coupled to the inlet of the pump housing manifold. The opening and the outlet of the pumping out of the garment are opened σ. ^Lightly combined to the outer cover manifold Item Description Flow Wear 16. A 10:1 of the first or more microchannels in the scope of the patent application. The micro-scale heat transfer system, which defines an aspect ratio greater than a large 72 201038186 add-in card for a computer system, the add-on card comprises: a substrate comprising a plurality of circuit parts; The integrated circuit component is electrically coupled to at least one of the circuit portions. When operating, the integrated circuit component dissipates heat; a working fluid; the component f, , , X, /, is clamped adjacent and thermally coupled to the integrated body Circuit zero Ο G wherein the evaporator defines a plurality of interconnected and connected microchannels that are configured to evaporate a portion of the working fluid corresponding to heat emanating from the part; a condenser that is fluidly coupled to a portion of the evaporator Supported by the substrate; 7 suspected to be selected, it is fluidly coupled to the evaporator and to the condenser so that the working fluid can be used between the evaporator and the condenser. 18. As claimed in claim 17, the steaming device comprises a portion of the integrated subassembly comprising relatively Si: wherein the evaporator comprises - the microchannel heat sink is arranged in the first and the 19th. The add-on card assembly of claim 18 further includes a plurality of fins extending from the first plate, the middle and the lower portion. The first plate, or both, is outwardly included as described in claim 18, and includes a first-evaporator and a second evaporator. U. Evaporation is an add-on card as described in item 2 of the benefit range, wherein the fourth test state and the first tester are fluidly coupled to each other in series A.弟... 73 201038186 22. The generator and the second evaporator as described in the application of the patent _ 2 流动 are fluidly connected in parallel with each other. ...... 23. As mentioned in the scope of claim 17: a 'containing a plurality of Zhao pieces extending outward from the condenser... additional cards are included... the hood is placed on the fins and a blower is constructed When the air is delivered over the fins "Nakada evaporator" condenser, the pump, the H-piece and the blower are operatively positioned relative to each other and the integrated circuit components are positioned, the evaporator, condenser, fruit, Korean and blower are matched - multiplied The 13/8 hour multiplied by the volume of the shot. 附加 The add-on card of claim 23, wherein the pump is positioned to at least partially direct air from the blower between the fins. The add-on card of item 17, further comprising a chassis member disposed on at least a portion of the substrate and at least one portion of the engaging substrate, wherein the condenser is fixedly attached to the chassis member such that the chassis supports the condenser 'by the condenser At least partially supported by the substrate. 26. A method of cooling an electronic component comprising an integrated circuit mold, the method comprising: flowing a working fluid in a majority of the liquid phase into the plurality of microchannels; Absorbing heat by the working fluid by the working fluid to thereby evaporate at least a portion of the working fluid within the microchannel; flowing from one of the microchannels at one or more flow locations along the microchannel to the volume of working fluid to Another microchannel, thereby at least partially balancing the pressure between the microchannels in the flow direction; 74 201038186 Condensing the evaporated working fluid in a condenser. 27. As claimed in the patent 帛26 households_method, condensation evaporation The behavior of the working fluid comprises flowing air over a plurality of fins extending from the condensing surface. 28. The method of claim 26, wherein the electronic component comprises a first packaged integrated circuit module and a first = packaged product The body circuit mode, the complex number of # channels includes a plurality of microchannels; the t bit adjacent to the first integrated circuit mode and a second plurality of microchannels are positioned adjacent to the second integrated circuit mode; ' a Flowing a volume of working fluid from one of the microchannels to another microchannel comprising another microchannel from the first plurality of microchannels to the microchannel and the flow of working fluid from the first plurality of microchannels One microchannel of the plurality of microchannels to another microchannel of the second plurality of microchannels. 29. The method of claim 28, wherein the act of evaporating the working fluid at the micropass i comprises the first plurality of microchannel evaporation working fluids. The method of claim 28, wherein the act of evaporating the working fluid in the microchannel comprises a second plurality of microchannel evaporation working fluids. 3. The method of claim 29, wherein the condenser comprises a first condenser portion and a second condenser portion, wherein the act of condensing the evaporating working fluid in the condenser is included in the first condenser The portion of the condensation evaporates into the vaporizing working fluid of the first plurality of microchannels. 75 201038186 f VII. Patent application scope: 1. A micro-scale heat transfer system comprises: a microchannel heat exchanger, wherein a plurality of microchannels are defined to be fluidly coupled to each other by a plurality of cross-connect channels, the cross-connect channels Separated along the flow direction, the flow direction is defined by the microchannels such that when the microchannel heat exchanger is thermally coupled to a heat source, the microchannel heat exchanger is configured to stably evaporate a working fluid a portion of a condenser that is fluidly coupled to the microchannel heat exchanger and configured to condense the vaporized portion of the working fluid; and a pump that is fluidly coupled to the condenser and the microchannel heat exchanger to be Constructed with a circulating working fluid between the microchannel heat exchanger and the condenser. 2. The microscale heat transfer system of claim 1, wherein the microchannel heat exchanger and the condenser comprise a portion of an integrated subassembly comprising: a first plate defining an opposing interior And an outer major surface, wherein the inner major surface of the first plate defines a heat sink region that is configured to accommodate the cannulated microchannel heat exchanger; and a first plate that defines opposing inner and outer major surfaces, wherein The inner main surface of the second plate defines a cover area and a condenser area, wherein the first plate and the second plate are fixedly locked together in a relative alignment to make the individual inner main surfaces face each other, and The channel hot parent converter 疋 is disposed between the first board and the second board. 3. The micro-scale heat transfer system of claim 2, wherein the central microchannel heat exchanger is thermally coupled to the heat sink region, and wherein the cover region 79 201038186 is placed on the plurality of microchannels to define the microflow A flowing boundary of the road. 4. The micro-scale heat transfer system of claim 3, wherein the condenser region of the second plate and a corresponding, opposite region of the first plate define at least one condenser flow path. 5. The micro-scale heat transfer system of claim 4, wherein the condenser region of the second plate defines a plurality of Korean and fins extending from the inner major surface of the second plate along with at least one The first-class flow direction defined by the condenser flow path is spaced apart from each other. 6. The microscale heat transfer system of claim 5, wherein at least one of the plurality of extended surfaces is welded to a corresponding portion of the interior surface of the first panel. 7. The microscale heat transfer system of claim 2, wherein the positron assembly further comprises a plurality of fins extending from the outer major surface of the first panel, the second panel, or both. 8. The microscale heat transfer system of claim 2, wherein the outer major surface of the first panel defines an elevated surface that is positioned substantially relative to the interior of the board by @, Tiandi Radiator area D defined by the main surface. 9. The micro-scale heat transfer system according to claim 2, wherein the micro-channel heat transfer drags 4 people, and the 乂 益 benefits include a first micro-channel heat exchanger and a The second microchannel heat exchange, the heat sink region in jR # ° includes a first heat sink region and a first heat sink region 'where the first heat sink region is constructed to accommodate the microchannel heat exchanger and the second heat sink region Constructed to accommodate the second microchannel heat sink. The micro-scale heat transfer system of claim 9, wherein the cover area comprises a first cover area and a second cover area, wherein the first cover area is placed on the first heat exchanger and The two cover areas are placed on the first microchannel heat exchanger. 11. The micro-scale heat transfer system of claim 9, wherein the condenser region comprises a first condenser region and a second condenser region. The micro-scale heat transfer system of claim 1, wherein the first microchannel heat sink and the first condenser region are fluidly coupled in series to the second microchannel heat sink and the second condenser region. 13. The micro-scale heat transfer system of claim 1, wherein the microchannel heat sink and the first-condenser region are flowably connected in parallel to the second microchannel heat sink and the second condenser region. . 14. The micro-scale heat transfer system of claim 2, further comprising: a pump cover squad, a sigh, an internal chamber, the internal chamber being constructed to accommodate the chestnut, an entry gateway ;j. Eight opening and - outlet openings, wherein the pump is positioned at least partially within the interior chamber of the pump housing manifold. 15 · The micro-scale heat transfer system constructed according to item 14 of the patent application scope, wherein the pump defines the pump inlet and the first, and the pump inlet is fluidly coupled to the inlet of the pump cover manifold and It is shown that a is fluidly coupled to the outlet opening of the pump housing manifold. 16. A 10:1 of the first or more microchannels in the scope of the patent application. In the micro-scale heat transfer system described in Item 81, the 2 flow cross-section defines an aspect ratio greater than approximately 201038186. The card package 1 contains 7 "additional card for the computer system (add'in coffee d), the additional A substrate includes a plurality of circuit portions; the plenum circuit components are electrically integrated into the circuit, wherein when operating, the integrated circuit components dissipate heat; to a working fluid; the device is positioned to be adjacent to each other The orbital narrator is connected to the ruling, which is called Wu W An and ',, and the ground is coupled to the integrated circuit zero, 11, and the plurality of intersections are connected to the microchannel, which is constructed by 零件w corresponding to the part of the tour. From the branch, constructing, s..., steadily evaporating a portion of the working fluid; the condenser 'which is fluidly coupled to a small portion supported by the substrate; the middle condenser to 1 is fluidly hybridized to the base The $3 $ > 3g operation of the cycle works... the condenser is used as a carcass between the heat generator and the condenser. 8. As claimed in item 17 and the evaporator contains _ single; " Add-on card in which the second plate portion of the condenser 'which contains Between the first and second plates, the device includes - the microchannel heatsink is arranged in the first and the first. 9. The component of the 18th component of the patent application scope, the add-on card of the fan, and the integrated component In addition, a plurality of binding pieces are extended from the first-plate mouth. The two-plates, or the two sides are outwardly disposed 2, as described in the 18th item of the patent application, including the additional card described in the item - Among them, the evaporator is a 4-hair device and a second evaporator. 21. For example, the second item of the patent application and the _$ spoon-added card, wherein the first steaming one The add-on card of claim 20, wherein the first evaporator and the second evaporator are fluidly coupled in parallel with each other. 23. The add-on card of claim 17 Wherein the condenser further comprises a plurality of fins extending outwardly from the condenser, wherein the additional card further comprises a shroud disposed on the fin and a blower is constructed to deliver air over the fins, wherein the evaporator, the condenser, the pump , fins and blowers are operatively operated relative to each other and When the integrated circuit components are positioned, the evaporator, condenser, pump, θ, fins, and blower are matched in a 1〇yz leaf multiplied by η, 吋 multiplied by the volume of the 吋 。. 24_ patent application scope 23 The add-on card described in the item is positioned to at least partially direct air from the blower between the fins. 25. Additional + as described in claim 17 of the patent application, & At least a portion of the upper and at least a portion of the carding substrate, wherein the condenser is fixedly attached to the bottom of the ice plate, such that the chassis supports the condenser 'by virtue of the condenser being at least partially supported by the substrate. 26. A method of cooling an electronic component comprising a snail body of a sacred body, the method comprising: flowing a liquid phase in a majority, the wind body entering a plurality of microchannels; Absorbing heat by emanating the heat of the thousands of parts, thereby evaporating at least a portion of the working fluid in the microchannel; ft the micro-channels of the micro-channels in one or the evening, One of the microchannels flows a volume of working fluid to another, bitter, and clawed channel, thereby at least partially balancing the pressure between the microchannels. /; IL 83 201038186 Condensation evaporation in the condenser fluid. 27. The method of claim 26, wherein the condensing of the working fluid body in the condenser condenses a plurality of fins comprising flowing air over the surface of the condenser. The method of claim 5, wherein the electronic component 3 is a first block circuit module and a second package integrated circuit mode, wherein the plurality of channels comprise a first plurality of microchannels Positioning adjacent to the first integrated circuit mode and - the second plurality of germanium channels are positioned adjacent to the second integrated circuit mode; flowing one volume of working fluid from one of the microchannels to the other containing the flowing working fluid from the first One microchannel of the plurality of microchannels to the other microchannel of the first plurality of microchannels and the flow working fluid from one microchannel of the second plurality of microchannels to another microchannel of the second plurality of microchannels. 29. The method of claim 28, wherein the act of evaporating the working fluid in the microchannel comprises the first plurality of microchannel evaporation working fluids. 30. The method of claim 28, wherein the act of evaporating the working fluid in the microchannel comprises a second plurality of microchannel evaporation working fluids. The method of claim 29, wherein the condenser comprises a first condenser portion and a second condenser portion, wherein the act of condensing and evaporating the working fluid in the condenser is included in the first condensation The evaporative working fluid is condensed and evaporated in the first plurality of microchannels. 84