30683twf.doc/n 201035644 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種背光模組及光電裝置，且特別是 關於一種能夠精準定位組裝的背光模組以及組裝程序簡單 的光電裝置。 s 【先前技術】 Ο ❹ 在一般液晶顯示器中’由於液晶顯示面板（Liquid crystal diSplaypanel)並不具有主動發光的功能，因此液晶 顯不面板必祕§&背光統柯進行影像的顯示。 圖1A及圖1B為習知—種側向式背光模組1〇〇的示意 圖。請^照圖1A ’在習知技術中，是使用黏膠(未標示)將 的電路板110固定在膠框130或是 ¥先板上。但疋，上述以黏膠 =二移在或二其他因素而導致導先板 光=二 匕外因蛤先板14〇與發光元件120 估道丄=又 二制，因此以黏膠來固定上述组件也不易 使導光板140與發来云# 个Μ <工4汲仟也不易 1 件12〇能夠精準對位。另外，當需 要對月先模組1〇〇進扞 騎田而 必須要克職踢的黏』殘時’還 進行。 ^殘留的問碭，因此重工程序不易 【發明内容】 本發明提出一種昔本士 本發明又提出一錄北止、、且，可提咼組裝定位精度。 種月光模組，可減低光源毁損的風 3 30683twf.d〇c/n 201035644 險。 本發明再提出一種光電裝置，具有上述的背光模組， 可簡化組裝程序以及重工程序。 本發明提出一種背光模組，其包含一發光裝置，所述 發光裝置包含光學板以及至少一發光元件。光學板包括入 光面與出光面。發光元件設置於電路板上，且發光元件面 對於入光面，其中’發光元件是_設置於光學板及電路 板其中至少一者之上之至少一磁吸件而磁吸於光學板上。 本發明又提出一種背光模組，包含光學板、背板、至 少=燈管以及多健管固定裝置。光學板包括人光面以及 出光面月板位於光學板的入光面的下方。燈管設置於背 板，光學板的人光面之間。多個燈管固絲置分別包覆於 燈官的末端，並且光學板設置於燈管固定裝置上，其中每 -燈管©定裝置包括雜域、埋於_主翻的磁吸件 以及埋於彈性主體内且與燈管的末端電性連接的電極，其 中埋設於多健管S]定裝置㈣磁吸件磁吸於背板或光^ 板之入光面上。 本發明再提出一種光電裝置，其包括上述之背光模 組。 、 由於本發明所提出的背賴組是使用觀件進行組 ^因^可提高組裝定位精度、並可減低光源毀損的風險。 1匕外，由於本發_光雜置具有上述背絲組，因此可 間化組裝及重工程序。 為讓本發明之上料徵和優點能更魏祕，下文特 舉實施例，並配合所關式作詳細說明如下。 201035644 1^,6 30683twf.doc/n 【實施方式】 圖2為本發明較佳實施例之背光模組200的分解示意 圖。圖3A為圖2之背光模組的局部構件示意圖。圖3B ^ 圖3A的侧視示意圖。在此實施例中，背光模組2〇〇為侧 向式背光模組’且圖3A與圖3B為圖2之發光裝置3〇〇中 的導光板與電路板組立之前的示意圖。 請參照圖2、圖3A及圖3B，背光模組2〇〇包括發光 〇 裝置300，較佳的是，背光模組200更包括反射板21〇、光 學片組220以及框架230。反射板210設置於發光裝置3〇〇 之下。光學片組220設置於發光裝置300的上方。框架230 的容納側邊232定義出一容納空間232a，以容納發光裝置 300、反射板210以及光學片組220。 具體而言’設置於發光裝置300底下的反射板21〇可 將發光裝置300所產生的光線反射，以使光線往特定方向 射出。另外，設置於發光裝置300上方的光學片組220例 如可使用擴散片（Diffuser)、增亮片（Brightness Enhancement ❹ film，BEF)、偏極轉換片（DBEF)、或其它合適的膜片，其 中，光學片組220是由至少一種以上選自上述的光學膜片 所搭配而成，以使光線均勻且集中。此處要注意的是，本 發明並不限定反射板210的設置，在其他實施例中，亦可 在光學板310的底面310c上設置一塗層或圖案以取代反射 板210的配置。 發光裝置300包含光學板310以及至少一發光元件 320，如圖3A及圖3B所示。 5 201035644 30683twf.doc/n 在此實施例中，光學板310例如為一導光板。光學板 310包括入光面310a與出光面31%。所謂入光面恤指 的是光線射人光學板310之處，而&絲通則是光線自 光學板310射出之處。而光學板31〇除了入光面31〇&以及 出光面310b以外的表面(例如是底面31〇c以及其他側表 面）’可設計成反射面，進而提高光學板31〇的出光效率。 光學板310的材質可為透明聚合物材質，例如聚曱基丙醯 酸曱酯類(PMMA)、聚碳酸酯類(PC)、聚苯乙烯類、全氟 樹脂類、環氧樹脂類、或其它合適的材料。 發光元件320設置於電路板330上。在本實施例中， 電路板330上具有電路設計，因此設置於電路板33()上的 發光元件320便可透過電路板330上的電路而與外部電路 或電源電性連接。此外，在本實施例中，發光元件32〇例 如是以發光二極體來描述說明。特別是，本實施例之發光 元件320如圖4所示。請參照圖4，發光元件320包括容 置槽322、發光二極體晶片324以及光學膠326。發光二極 體晶片324位於容置槽322内，而光學膠326填滿容置槽 322、並覆蓋發光二極體晶片324以阻隔水氣或其他外力對 發光二極體晶片324造成影響。光學膠326例如包含聚甲 基丙醯酸甲酯類(PMMA)、聚碳酸酯類(PC)、聚苯乙烯類、 全氟樹脂類、環氧樹脂類、或其它合適的材料。 值得一提的是，請參照圖3A及圖3B，設置於電路板 330上的發光元件320是面對於光學板310的入光面 310a，因此發光元件320所發出的光線會直接射向光學板 201035644, “一„ 6 3〇683twf.doc/n 310的入光面31〇a。特別是，發光元件320是利用設置於 光學板310及電路板330其中至少一者之上之至少一磁吸 件340而磁吸於光學板31〇上。 詳細地說，在本實施例之發光裝置3〇〇中，於光學板 310的入光面310a上可設置磁吸件34〇，並且在相對的電 路板330上則設置有至少一被磁吸件35〇，由圖3B可知， 此時磁吸件34〇是突出於光學板310的入光面310a。在其 0 他實施例中，磁吸件34〇更佳可嵌入光學板310的入光面 31〇a中，此時，磁吸件34〇之表面34〇a可切齊於光學板 310的入光面310a、或内陷於光學板31〇的入光面31如 中:以節省組裝時所需空間。當將電路板33〇與光學板31〇 進行組立時，如圖2所示，由於被磁吸件35〇的表面35〇& 與磁吸件340的表面340a會因磁力吸引而相互緊靠，進而 使電路板33G上的發光元件32〇與光學板31()的入光面 310a相互緊靠。此時，一部分的電路板33〇會貼合在光學 板310的底面310c。 ❹ ，纽實關巾’是在t路板该置被磁吸件，並且在 光學板上設置磁吸件。然而，在其他實施例中，亦可在電 路，上設置磁吸件’並且在光學板上設置被磁吸件。舉例 而言’磁吸件與被磁吸件的組合可以是磁化金屬-可被磁化 =屬所吸附的金屬，或是魏件與被磁吸件兩者皆為磁化 至屬。磁化金屬例如為磁鐵，此外，亦可將磁鐵與聚合物 混合而形成軟性磁鐵，以形成上述磁吸件。 另外’本發明不限定磁吸件34〇與被磁吸件35〇的數 7 201035644 30683twf.doc/n 量。事實上，磁吸件340與被磁吸件350可以設置一組、 兩組或以上。本發明也不限定磁吸件340與被磁吸件350 的位置，其也可以僅設置在導光板31〇與電路板330的兩 處、三處或以上位置。 由於上述的發光裝置300是利用磁吸件340進行發光 元件320與光學板310的定位組裝，因此可以確保發光元 件320與光學板310的組裝對位精準、且確實緊靠而不產 生漏光。此外，由於不需要先將光學板31〇緊壓發光元件 320即可完成組裝對位，因此可以減低發光元件損毁 的風險。 另外，在其他實施例中，背光模組200的發光裝置300 還可以使用不同設計的發光裝置加以取代，以下將舉數個 實施例加以說明。 圖5A為本發明另一較佳實施例之發光裝置4〇〇組立 之前的侧視示意圖。圖5B為發光裝置400组立後的側視 示思圖。睛參照圖5A及圖5B，發光裝置400具有與圖3A 及圖3B所述之發光裝置300相似的構件，因此相同或相 似的構件以相同的標號表示，並可對應於先前之說明，於 此並不再贅述。發光裝置400與發光裝置300的不同之處 在於，發光裝置400的電路板330是面對光學板31〇的入 光面310a配置。而設置於電路板330上的被磁吸件350 與光學板310上的磁吸件340相互吸引而使得發光元件 320得以緊靠光學板310的入光面31〇a。 圖6A為根據本發明又一較佳實施例之發光裂置5〇〇 30683twf.doc/n 201035644 乂 X W tr v> w 〆▲知 Ο 組立之前的示意圖。圖6B為發光裝置500組立之後的上 視示意圖。圖6C為發光裝置500組立後的側視示意圖。 凊參照圖6A、圖6B及圖6C ’發光裝置500與圖3A及圖 3B之發光裝置300相同的構件以相同的標號表示，並可參 照先前之說明，於此不再贅述。發光裝置500與發光裝置 300不同之處在於’在發光裝置5〇〇中’光學板51〇具有 多個凹槽(未標示）’且光學板510具有入光面51〇a、出光 〇 面510b以及底面510c。另外，在發光裝置5〇〇中，磁吸 件340是被設置在光學板510的底面510c上，且電路板 330鄰近於光學板510的底面510c的一部分，因此當電路 板330上的被磁吸件350與光學板510上的磁吸件34〇彼 此磁吸在一起之後，有一部分的電路板33〇會貼附在光學 板510的底面510c。在其他實施例中，磁吸件340更佳可 嵌入光學板510中，以節省組裝時所需空間。此時，由圖 6C可知，磁吸件340之側面可切齊於光學板51〇的入光面 510a、或内陷在光學板510的入光面51〇a中，或磁吸件 ❹ 340之側面可切齊於光學板510的的底面51〇c，或磁吸件 340之侧面内陷於光學板510的底面51〇c。這裡要強調的 是’本發明並不限制光學板與磁吸件的形狀、以及磁吸件 與被磁吸件的個數與位置。 上述的各實施例中的發光裝置3〇〇、400及500中的 發光元件320均為以發光二極體為例來說明，但本發明不 限於此。在本發明的其他實施例中，亦可使用陰極燈管、 外部電極燈管、或其它合適的燈管作為側向式背光模組的 9 JU683twf.doc/n 201035644 光源，換言之，對於使用陰極燈管、外部電極燈管、或其 它合適的燈管的側向式背光模組中亦可以採用本發明所述 的磁吸件與被磁吸件的方式，來達成光源與光學板對位以 及組立之目的。 此外’本發明亦可應用在直下式的背光模組上。 圖7A為本發明較佳實施例之背光模組6〇〇，的分解示 意圖。圖7B為圖7A之發光裝置600組立之前的側視示意 圖。圖7C為發光裝置6〇〇組立後的側視示意圖。請參照 圖7A、圖7B及圖7C，背光模組600,包括發光裝置600， 較佳的是’背光模組600,更包括背板61〇,、反射板62〇，以 及光學片組630’。背板610,位於反射板620,之下且面對光 學板610的入光面61〇a以容納發光裝置6〇〇及反射板 620’，而反射板62〇,設置於發光裝置6〇〇之下。光學片組 630’設置於發光裝置6〇〇的上方。 發光裝置600包含光學板610以及多個發光元件 620，如圖7B及圖7C所示。光學板61〇包括入光面61加 與出光面610b。發光元件620設置於電路板630上，且發 光元件620面對於光學板61〇的入光面6i〇a。在本實施例 中，光學义板610例如為一擴散板。 在發光裝置600中，多個發光元件62〇例如可直接使 用白光發光二極體、或多種不同色光的發光二極體混光以 產生白光。詳言之，當發光讀㈣使好種不同色光的 發光二極體時’發光元件_與光學板61G之間可具有一 間隙d以進行混光，此間隙d可藉由調整磁吸件640以及 30683twf.doc/n 201035644 ________ ο 被磁吸件650的厚度來達到理想的混光距離。本實施例之 發光元件620亦可以採用如圖4所示之發光二極體結構。 請繼續參考圖7B及圖7C，特別是，在光學板610的 四個角落各配置有一個磁吸件64〇，且在電路板63〇的四 個對應於磁吸件640的位置各配置有一個被磁吸件65〇。 光學板610以及多個發光元件62〇可藉由磁吸件64〇以及 被磁吸件650的磁吸而緊靠。於其他實施例中，為了讓光 ❹學板610與發光元件62〇更加緊靠，則光學板61〇上之磁 吸件640或被磁吸件650之數目及其位置可加以變更之。 例如：於電路板630的四個角落之間再加入至少一個磁吸 件640或被磁吸件65〇，或是於電路板63〇的中央區域再 加入至少一個磁吸件64〇或被磁吸件65〇，或是於電路板 630的合適位置上再加入至少一個磁吸件64〇或被磁吸 650。 、在本實施例中，發光裝置600的電路板630為一連續 的平板。而在其他實施例中，電路板也可以是由多個條狀 © 電路板所制而成，^每-條狀電路板上至少^置有一磁 吸件或是被磁吸件，此時，光學板61〇上相對應於每一條 ^電路，之磁吸件歧被磁吸件，亦會設置至少—組磁吸 、，是被磁吸件。此外，被磁吸件與磁吸件的相關設計 、員明參照上述圖4〜圖6之說明，於此不再重述。 在上述的實施例中，由於皆使用磁性吸附的方式進行 ^板與發航件的定位組裝，因此不會有習知技術中魏 夕^附面積不足、或疋位不易的問題，而本發明的背光模 11 201035644 ----------3U683twf.doc/n 組均可精準定位組裝。 此外’本發明的發光裝置600除了可以使用發光二極 體作為光源之外，在其他實施例中，也可以使用陰極燈管、 外部電極燈管、或其它合適的燈管作為光源。 上述幾個實施例都是將磁吸件與被磁吸件設計於電 路板以及光學板上，然，本發明不限於此。在本發明之其 他實施例中，還可將磁吸件以及被磁吸件設計在其他的構 件上’如下述實施例之說明。 圖8A為本發明較佳實施例之背光模組7〇〇組立之前 ❹ 的側視示意圖。圖8B為背光模組700組立後的側視示意 圖。請參照圖8A及圖8B ’背光模組7〇〇包含光學板、 背板720、至少一燈管730以及多個燈管固定屐置74〇。 光學板710包括入光面710a以及出光面。在本 實施例中，光學板710為一擴散板。另外，除了入光面71〇& 以及出光面710b之外’光學板710的四個侧表面較佳的是 反射面。30683twf.doc/n 201035644 VI. Description of the Invention: [Technical Field] The present invention relates to a backlight module and an optoelectronic device, and more particularly to a backlight module capable of accurately positioning and assembling, and a simple assembly process Device. s [Prior Art] Ο ❹ In general liquid crystal displays ‘Since the liquid crystal display panel (Liquid crystal diSplaypanel) does not have the function of active illumination, the LCD display panel must be secured and the backlight is displayed. 1A and 1B are schematic views of a conventional lateral backlight module 1A. Please refer to Fig. 1A'. In the prior art, the circuit board 110 is glued (not labeled) to the plastic frame 130 or the first plate. However, the above-mentioned adhesive = two shifts or two other factors lead to the lead light = two external causes of the first plate 14 〇 and the light-emitting element 120 estimated 丄 = two systems, so the above components are fixed with glue It is also difficult to make the light guide plate 140 and the hair cloud # Μ 工 工 工 工 工 工 工 工 工 工 工 工 工 工 。 。 。 。 。 。 。 In addition, when it is necessary to carry out the squad, the smashing of the squad is required. ^Residual questioning, so the rework procedure is not easy. [Summary of the Invention] The present invention proposes a shovel. The present invention further proposes a recording of the north end, and the assembly positioning accuracy can be improved. A moonlight module can reduce the wind damage caused by the light source 3 30683twf.d〇c/n 201035644 Risk. The present invention further provides an optoelectronic device having the above-described backlight module, which simplifies assembly procedures and rework procedures. The invention provides a backlight module comprising a light emitting device, the light emitting device comprising an optical plate and at least one light emitting element. The optical plate includes a light incident surface and a light exit surface. The illuminating element is disposed on the circuit board, and the illuminating element faces the light incident surface, wherein the illuminating element is at least one magnetic member disposed on at least one of the optical plate and the circuit board and is magnetically attracted to the optical plate. The invention further provides a backlight module comprising an optical plate, a back plate, at least a lamp tube and a multi-stub tube fixing device. The optical plate includes a human face and a light exit faceplate located below the light incident surface of the optical plate. The tube is placed on the back plate between the human face of the optical plate. a plurality of lamp tube fixing wires are respectively wrapped around the ends of the lamp holders, and the optical plates are disposed on the lamp tube fixing device, wherein each of the lamp tube fixing devices includes a miscellaneous region, a magnetic member buried in the main flip, and buried An electrode electrically connected to the end of the lamp tube and electrically connected to the end of the lamp tube, wherein the magnetic device is embedded in the light-incident surface of the back plate or the optical plate. The present invention further provides an optoelectronic device comprising the above-described backlight module. Because the back-and-forth group proposed by the present invention uses the viewing unit to perform the grouping, the assembly positioning accuracy can be improved, and the risk of light source damage can be reduced. In addition, since the present invention has the above-mentioned backing wire group, the assembly and rework procedures can be performed. In order to make the present invention more advantageous and advantageous, the following embodiments are described in detail with reference to the following description. 201035644 1^, 6 30683twf.doc/n Embodiments FIG. 2 is an exploded perspective view of a backlight module 200 according to a preferred embodiment of the present invention. 3A is a partial structural view of the backlight module of FIG. 2. Figure 3B is a side elevational view of Figure 3A. In this embodiment, the backlight module 2 is a lateral backlight module' and FIGS. 3A and 3B are schematic views of the light guide plate and the circuit board in the light-emitting device 3 of FIG. Referring to FIG. 2, FIG. 3A and FIG. 3B, the backlight module 2 includes a light-emitting device 300. Preferably, the backlight module 200 further includes a reflective plate 21, an optical sheet set 220, and a frame 230. The reflecting plate 210 is disposed under the light emitting device 3A. The optical sheet set 220 is disposed above the light emitting device 300. The receiving side 232 of the frame 230 defines a receiving space 232a for accommodating the light emitting device 300, the reflecting plate 210, and the optical sheet group 220. Specifically, the reflecting plate 21 disposed under the light-emitting device 300 can reflect the light generated by the light-emitting device 300 to cause the light to be emitted in a specific direction. In addition, the optical sheet set 220 disposed above the light-emitting device 300 may use, for example, a diffuser, a brightness enhancement film (BEF), a polarized transfer film (DBEF), or other suitable film. The optical sheet set 220 is formed by combining at least one of the optical films selected from the above to make the light uniform and concentrated. It should be noted here that the present invention does not limit the arrangement of the reflecting plate 210. In other embodiments, a coating or pattern may be disposed on the bottom surface 310c of the optical plate 310 instead of the configuration of the reflecting plate 210. The light emitting device 300 includes an optical plate 310 and at least one light emitting element 320, as shown in Figs. 3A and 3B. 5 201035644 30683twf.doc/n In this embodiment, the optical plate 310 is, for example, a light guide plate. The optical plate 310 includes a light incident surface 310a and a light exit surface 31%. The so-called lighted t-shirt refers to where the light hits the optical plate 310, and the & silk pass is where the light exits from the optical plate 310. On the other hand, the surface of the optical plate 31 excluding the light-incident surface 31〇& and the light-emitting surface 310b (e.g., the bottom surface 31〇c and other side surfaces) can be designed as a reflecting surface, thereby improving the light-emitting efficiency of the optical plate 31. The material of the optical plate 310 may be a transparent polymer material such as polyacrylonitrile phthalate (PMMA), polycarbonate (PC), polystyrene, perfluororesin, epoxy resin, or Other suitable materials. The light emitting element 320 is disposed on the circuit board 330. In this embodiment, the circuit board 330 has a circuit design. Therefore, the light-emitting element 320 disposed on the circuit board 33 can be electrically connected to an external circuit or a power source through a circuit on the circuit board 330. Further, in the present embodiment, the light-emitting element 32 is exemplified by a light-emitting diode, for example. In particular, the light-emitting element 320 of the present embodiment is as shown in FIG. Referring to FIG. 4, the light-emitting element 320 includes a receiving groove 322, a light-emitting diode wafer 324, and an optical adhesive 326. The illuminating diode 324 is disposed in the accommodating groove 322, and the optical adhesive 326 fills the accommodating groove 322 and covers the illuminating diode 324 to block moisture or other external force from affecting the LED 324. The optical adhesive 326 includes, for example, polymethylmethacrylate (PMMA), polycarbonate (PC), polystyrene, perfluororesin, epoxy resin, or other suitable materials. It should be noted that, referring to FIG. 3A and FIG. 3B, the light-emitting element 320 disposed on the circuit board 330 is incident on the light-incident surface 310a of the optical plate 310, so that the light emitted by the light-emitting element 320 is directly directed to the optical plate. 201035644, "A „6 3〇683twf.doc/n 310 entrance surface 31〇a. In particular, the light-emitting element 320 is magnetically attracted to the optical plate 31 by at least one magnetic member 340 disposed on at least one of the optical plate 310 and the circuit board 330. In detail, in the light-emitting device 3 of the embodiment, a magnetic member 34 is disposed on the light-incident surface 310a of the optical plate 310, and at least one magnetic attraction is disposed on the opposite circuit board 330. As shown in Fig. 3B, at this time, the magnetic member 34A protrudes from the light incident surface 310a of the optical plate 310. In the other embodiment, the magnetic member 34 is preferably embedded in the light incident surface 31〇a of the optical plate 310. At this time, the surface 34〇a of the magnetic member 34 can be aligned with the optical plate 310. The light incident surface 310a or the light incident surface 31 that is trapped in the optical plate 31A is as follows: to save space required for assembly. When the circuit board 33 is assembled with the optical plate 31, as shown in FIG. 2, the surface 35 〇 & of the magnetic member 35 与 and the surface 340 a of the magnetic member 340 are attracted to each other by magnetic attraction. Further, the light-emitting elements 32A on the circuit board 33G and the light-incident surface 310a of the optical plate 31 () are abutted against each other. At this time, a part of the circuit board 33 is attached to the bottom surface 310c of the optical plate 310. ❹ ,纽实关巾' is a magnetic member placed on the t-board, and a magnetic member is disposed on the optical plate. However, in other embodiments, a magnetic member 'on the circuit, and a magnetic member may be disposed on the optical plate. For example, the combination of the magnetic member and the magnetized member may be a magnetized metal - a metal that can be magnetized = adsorbed, or a magnetized member that is both magnetized and magnetized. The magnetized metal is, for example, a magnet, and a magnet may be mixed with a polymer to form a soft magnet to form the magnetic member. Further, the present invention does not limit the number of magnetic members 34 〇 and the magnetic members 35 2010 30 201035644 30683 twf.doc/n. In fact, the magnetic member 340 and the magnetically attracted member 350 may be provided in one set, two or more sets. The present invention is also not limited to the position of the magnetic member 340 and the magnetic member 350, and it may be provided only at two, three or more positions of the light guide plate 31 and the circuit board 330. Since the above-described illuminating device 300 performs positioning and assembly of the illuminating element 320 and the optical plate 310 by the magnetic member 340, it is ensured that the assembly of the illuminating element 320 and the optical plate 310 is accurately aligned and does not cause light leakage. In addition, since it is not necessary to first press the optical plate 31 to press the light-emitting element 320 to complete the assembly alignment, the risk of damage of the light-emitting element can be reduced. In addition, in other embodiments, the light-emitting device 300 of the backlight module 200 can also be replaced with a differently designed light-emitting device, which will be described below in several embodiments. Fig. 5A is a side elevational view showing the light-emitting device 4 according to another preferred embodiment of the present invention. Fig. 5B is a side view of the illuminating device 400 after being assembled. 5A and 5B, the light-emitting device 400 has components similar to those of the light-emitting device 300 illustrated in FIGS. 3A and 3B, and thus the same or similar components are denoted by the same reference numerals and may correspond to the previous description. I will not repeat them. The light-emitting device 400 is different from the light-emitting device 300 in that the circuit board 330 of the light-emitting device 400 is disposed to face the light-incident surface 310a of the optical plate 31A. The magnetic member 350 disposed on the circuit board 330 and the magnetic member 340 on the optical plate 310 are attracted to each other such that the light-emitting element 320 abuts against the light-incident surface 31A of the optical plate 310. 6A is a schematic view of a light-emitting slit 5 〇〇 30683 twf.doc/n 201035644 乂 X W tr v> w 〆 知 知 知 Ο 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Fig. 6B is a schematic top view of the illuminating device 500 after being assembled. FIG. 6C is a schematic side view of the illuminating device 500 after being assembled. Referring to Figs. 6A, 6B, and 6C, the same components as those of the illuminating device 300 of Figs. 3A and 3B are denoted by the same reference numerals, and the description thereof will be omitted. The light-emitting device 500 is different from the light-emitting device 300 in that 'in the light-emitting device 5', the optical plate 51 has a plurality of grooves (not shown) and the optical plate 510 has a light-incident surface 51A and a light-emitting surface 510b. And a bottom surface 510c. Further, in the light-emitting device 5, the magnetic member 340 is disposed on the bottom surface 510c of the optical plate 510, and the circuit board 330 is adjacent to a portion of the bottom surface 510c of the optical plate 510, and thus is magnetized on the circuit board 330. After the suction member 350 and the magnetic member 34 on the optical plate 510 are magnetically attracted to each other, a part of the circuit board 33 is attached to the bottom surface 510c of the optical plate 510. In other embodiments, the magnetic member 340 is preferably embedded in the optical plate 510 to save space required for assembly. At this time, as can be seen from FIG. 6C, the side surface of the magnetic member 340 can be aligned with the light incident surface 510a of the optical plate 51A, or recessed in the light incident surface 51a of the optical plate 510, or the magnetic member 340. The side surface may be aligned with the bottom surface 51〇c of the optical plate 510, or the side surface of the magnetic member 340 may be recessed in the bottom surface 51〇c of the optical plate 510. It is emphasized here that the present invention does not limit the shape of the optical plate and the magnetic member, and the number and position of the magnetic member and the magnetic member to be magnetic. The light-emitting elements 320 of the light-emitting devices 3, 400, and 500 in the respective embodiments described above are all exemplified by the light-emitting diodes, but the present invention is not limited thereto. In other embodiments of the present invention, a cathode lamp, an external electrode tube, or other suitable tube may be used as the 9 JU683twf.doc/n 201035644 light source of the lateral backlight module, in other words, for the use of the cathode lamp The magnetic member and the magnetic member of the present invention can also be used in the lateral backlight module of the tube, the external electrode tube, or other suitable tube to achieve the alignment and assembly of the light source and the optical plate. The purpose. Further, the present invention can also be applied to a direct type backlight module. FIG. 7A is an exploded perspective view of a backlight module 6A according to a preferred embodiment of the present invention. Figure 7B is a side elevational view of the illuminating device 600 of Figure 7A prior to assembly. Fig. 7C is a side view showing the assembly of the light-emitting device 6〇〇. Referring to FIG. 7A, FIG. 7B and FIG. 7C, the backlight module 600 includes a light-emitting device 600, preferably a 'backlight module 600, and further includes a back plate 61A, a reflection plate 62A, and an optical sheet group 630'. . The backing plate 610 is located below the reflecting plate 620 and faces the light incident surface 61〇a of the optical plate 610 to accommodate the light emitting device 6〇〇 and the reflecting plate 620′, and the reflecting plate 62〇 is disposed on the light emitting device 6〇〇. under. The optical sheet group 630' is disposed above the light-emitting device 6A. The light emitting device 600 includes an optical plate 610 and a plurality of light emitting elements 620 as shown in Figs. 7B and 7C. The optical plate 61 includes a light incident surface 61 and a light emitting surface 610b. The light-emitting element 620 is disposed on the circuit board 630, and the light-emitting element 620 faces the light-incident surface 6i〇a of the optical plate 61〇. In the present embodiment, the optical plate 610 is, for example, a diffuser plate. In the light-emitting device 600, a plurality of light-emitting elements 62, for example, can directly use a white light-emitting diode or a plurality of light-emitting diodes of different color lights to mix light to generate white light. In detail, when the light-emitting reading (4) enables a light-emitting diode of different color light, the light-emitting element _ and the optical plate 61G may have a gap d for mixing light, and the gap d may be adjusted by the magnetic member 640. And 30683twf.doc/n 201035644 ________ ο The thickness of the magnetic member 650 is used to achieve the desired light mixing distance. The light-emitting element 620 of this embodiment can also adopt a light-emitting diode structure as shown in FIG. Referring to FIG. 7B and FIG. 7C, in particular, one magnetic member 64 is disposed at each of the four corners of the optical plate 610, and four positions corresponding to the magnetic member 640 are disposed on the four sides of the circuit board 63. One is attracted by the magnetic member 65. The optical plate 610 and the plurality of light-emitting elements 62A can be abutted by the magnetic attraction 64 〇 and by the magnetic attraction of the magnetic member 650. In other embodiments, in order to make the optical slab 610 and the illuminating element 62 〇 more closely, the number of the magnetic absorbing members 640 or the magnetic members 650 on the optical plate 61 and their positions can be changed. For example, at least one magnetic member 640 or the magnetic member 65 is added between the four corners of the circuit board 630, or at least one magnetic member 64 is added or magnetically added to the central portion of the circuit board 63. The suction member 65 〇 or the at least one magnetic member 64 〇 or the magnetic 650 is added to a suitable position of the circuit board 630. In this embodiment, the circuit board 630 of the light-emitting device 600 is a continuous flat plate. In other embodiments, the circuit board may also be made of a plurality of strips, and at least one magnetic member or a magnetic member is disposed on each of the strips. The optical plate 61 is corresponding to each of the circuits, and the magnetic members are separated by the magnetic members, and at least a set of magnetic attraction is also provided, which is a magnetic member. In addition, the design of the magnetic member and the magnetic member will be described with reference to FIG. 4 to FIG. 6 and will not be repeated here. In the above embodiments, since the positioning and assembly of the board and the launching member are performed by magnetic adsorption, there is no problem that the area of the Wei Xi ^ attachment area is insufficient or the position is not easy in the prior art, and the present invention The backlight module 11 201035644 ---------- 3U683twf.doc/n group can be accurately positioned and assembled. Further, the light-emitting device 600 of the present invention may use a light-emitting diode as a light source, and in other embodiments, a cathode light tube, an external electrode tube, or other suitable tube may be used as the light source. In the above embodiments, the magnetic member and the magnetic member are designed on the circuit board and the optical plate. However, the present invention is not limited thereto. In other embodiments of the invention, the magnetic member and the magnetic member may also be designed on other members as described in the following embodiments. FIG. 8A is a side elevational view of the front side of the backlight module 7 before being assembled according to a preferred embodiment of the present invention. FIG. FIG. 8B is a side view showing the backlight module 700 assembled. Referring to FIGS. 8A and 8B, the backlight module 7A includes an optical plate, a back plate 720, at least one lamp tube 730, and a plurality of lamp tube fixing devices 74A. The optical plate 710 includes a light incident surface 710a and a light exit surface. In the present embodiment, the optical plate 710 is a diffusion plate. Further, in addition to the light incident surface 71 〇 & and the light exiting surface 710 b, the four side surfaces of the optical plate 710 are preferably reflective surfaces.
背板720位於光學板710的入光面71〇a的下方。在 本實施例中，背板720之材質較佳的是金屬。 U 燈管730設置於背板720與光學板71〇的入光面71加 之間。在本實施例中，燈管730例如是陰極燈管、外部 極燈官或其它合適的燈官。本發明不限制燈管的數量以及 形狀。-般而言，燈官的數量會與背光模組的尺寸有關。 而燈管730可以是直式燈管或是彎曲式燈管。 燈管固定裝置740分別包覆於燈管73q的末端爪， 12 201035644 0 30683twf.doc/n 並且光學板710設置於燈管固定裝置74〇上。特別是，每 一燈管固定裝置740包括彈性主體742、埋於彈性主體742 内的磁吸件744以及埋於彈性主體742内且與燈管73〇的 末端732電性連接的電極E1。埋設於多個燈管固定裝置 740内的磁吸件744磁吸於光學板71〇之入光面上。 這裡要說明的是，在背光模組700中，光學板71〇之 入光面710a上相對於磁吸件744之處設置有另一被磁吸件 ❹ 75〇，以使燈管固定裝置740與光學;^ 710緊靠而使燈管 730疋位。此時，由圖8B可知，被磁吸件75〇是突出於光 學板710的入光面710a。在其他實施例中，被磁吸件75〇 更佳可嵌入光學板71G的入光面71〇a中，以使被磁吸件 750之下表面切齊於光學板71〇的入光面71〇&、或内陷於 於光學板710的入光面71Ga中，以節省組裝時所需空間。 此外，在其他實施例中，磁吸件744之上表面亦可突出於 彈性主體742之表面，亦即磁吸件744之上表面高於彈性 主體742之上表面。於其他實施财，磁吸件744與被磁 ❹吸件㈣讀置與其材t可參虹述圖4〜圖6之說明。另 外，在背板720上對應於電極E1的位置還設置有電極£2, 電極E2可與電極£1電性連接使外部電祕舰導通燈管 730之電極E卜進而使燈管咖發光。此外，燈管固定裝 置74〇所使用彈性主體742例如為橡膠材料。 另外，藉由磁吸件744與被磁吸件75〇的高度設計， 可以控制燈管730與光學板71〇之間的距離，以達到理想 光均勻射出光學板710之目的。 201035644 ----------3〇683twf.doc/n 在本實施例中’由於背光模組700是透過磁吸件744 與被磁吸件750的磁吸以使燈管與光學板定位， 因此光學板710與燈管730的定位簡單且精準，光學板71〇 不易位移。當燈管730或其他構件故障而需要重工時，僅 需克服磁吸件744與被磁吸件744之間的磁力即可將光學 請與燈管730分離以完成重工程序的細 700組立也相當方便。 圖9A為本發明另一較佳實施例之背光模組7〇〇，組立 之前的侧視示意圖。圖9B為背光模組7〇〇,組立後的側視 示意圖。請參照圖9A及圖9B，背光模組700,具有與圖8A 及圖8B所述之背光模組700相似的構件，因此相同或相 似的構件以相同的標號表示’請參閱上述說明，於此不再 贅述。背光模組700’與背光模組7〇〇的不同之處在於，背 光模組700’的背板720’是由可被磁吸件744磁吸的金屬所 構成’而磁吸件744的位置較靠近背板720,以與背板720, 磁吸。在背光模組700’中，由於僅需克服磁吸件744與背 板720’間的磁力即可將燈管730與背板720,分離，當再次 進行背光模組700,的組裝時，僅需將電極E1與電極E2對 位而不需重新焊接以使電極E1與電極E2電性連接，因此 背光模組700’的組裝相當簡便。 圖10A為本發明又一較佳實施例之背光模組700”組 立之前的側視示意圖。圖10B為背光模組700,，组立後的側 視示意圖。請參照圖10A及圖10B，背光模組700,具有與 圖9A及圖9B所述之背光模組700,相似的構件，因此相同 14 30683twf.doc/n 201035644 :〇 或相似的構件以相同的標號表示，請參照上述說明，於此 不再贅述。背光模組700”與背光模組700,的不同之處在 於’背光模組700”的背板720”不具有磁性而無法與磁=件 744磁吸，此時，可藉由在背板72〇，，上相對於磁吸件744 之處設置另一被磁吸件750以使燈管730定位於背板72〇” 上。 此外，在本發明的其他實施例中，還可將圖8B之實 〇 施例與圖9或圖10B之實施例組合，也就是將磁吸件744 或被磁吸件750同時設置於光學板71〇、背板72〇及燈管 固定裝置740上，以使光學板71〇、背板72〇及燈管73〇 皆使用磁吸方式固定。於其他實施财，磁吸件7私盘被 磁吸件750之位置與其材質可參照圖4~圖6之說明。 因此，由上述的所有實施例可知磁吸件或被磁吸件之 位置及數目，可以相互對調之，或是磁吸件或被磁吸件可 同時出現於-個物件上，例如：光學板上，或背板上，或 電路板上、或燈管固定裝置上。 ◎ « 11為本發明較佳實施例的顯示模!且800示意圖。 請參照® 11’舉例來說’顯示裝£ 800可具有顯示面板81〇 及背光模組820 ’而背光模組82〇例如可具有上述發光裝 置300、400、500、細的其中任何—種或是背光模組·、 700’及700”的其中任何一種。 顯示面板810可為半穿透半反射式顯示面板、反射型 顯不面板、彩色渡光片於主動膚上（c〇1〇r斷⑽酿丫） 之顯示面板、主動層於彩色渡光片上（_ Qn Μα fife ) 15 j 0683twf.doc/n 201035644 之顯示面板、垂直配向型（VA)顯示面板、水平切換型（IPS) 顯示面板、多域垂直配向型（MVA)顯示面板、扭曲向列 型（TN)顯示面板、超扭曲向列型（STN) 顯示面板、 圖案垂直配向型（PVA)顯示面板、超級圖案垂直配向型 (S-PVA)顯示面板、先進大視角型（ASV)顯示面板、 邊緣電場切換型（FFS)顯示面板、連續焰火狀排列型The back plate 720 is located below the light incident surface 71A of the optical plate 710. In this embodiment, the material of the back plate 720 is preferably metal. The U lamp 730 is disposed between the back plate 720 and the light incident surface 71 of the optical plate 71A. In the present embodiment, the tube 730 is, for example, a cathode tube, an external lamp or other suitable lamp. The invention does not limit the number and shape of the tubes. In general, the number of light officials will be related to the size of the backlight module. The tube 730 can be a straight tube or a curved tube. The lamp fixing device 740 is respectively wrapped around the end claw of the lamp tube 73q, 12 201035644 0 30683twf.doc/n and the optical plate 710 is disposed on the lamp fixing device 74. In particular, each of the tube fixtures 740 includes an elastic body 742, a magnetic member 744 embedded in the elastic body 742, and an electrode E1 embedded in the elastic body 742 and electrically connected to the end 732 of the tube 73A. The magnetic member 744 embedded in the plurality of lamp fixing devices 740 is magnetically attracted to the light incident surface of the optical plate 71. It is to be noted that, in the backlight module 700, another light-receiving member 〇 75 设置 is disposed on the light-incident surface 710a of the optical plate 71 opposite to the magnetic member 744, so that the lamp fixing device 740 With the optical; ^ 710 abuts the lamp 730 clamped. At this time, as is clear from Fig. 8B, the magnetic attraction member 75A protrudes from the light incident surface 710a of the optical plate 710. In other embodiments, the magnetic member 75 is preferably embedded in the light incident surface 71A of the optical plate 71G so that the lower surface of the magnetic member 750 is aligned with the light incident surface 71 of the optical plate 71A. 〇&, or trapped in the light incident surface 71Ga of the optical plate 710 to save space required for assembly. In addition, in other embodiments, the upper surface of the magnetic member 744 may protrude from the surface of the elastic body 742, that is, the upper surface of the magnetic member 744 is higher than the upper surface of the elastic body 742. For other implementations, the magnetic member 744 and the magnetically sucked member (4) are read and the material t can be described in the description of FIGS. 4 to 6. In addition, an electrode £2 is disposed on the back plate 720 corresponding to the position of the electrode E1, and the electrode E2 is electrically connected to the electrode £1 to cause the external electric ship to conduct the electrode E of the lamp 730 to further illuminate the lamp. Further, the elastic body 742 used for the lamp fixing device 74 is, for example, a rubber material. In addition, by the height design of the magnetic member 744 and the magnetic member 75, the distance between the bulb 730 and the optical plate 71 can be controlled to achieve the purpose of uniformly emitting the optical plate 710. 201035644 ----------3〇 683twf.doc/n In the present embodiment, 'because the backlight module 700 is magnetically attracted by the magnetic member 744 and the magnetic member 750 to make the tube and the optical The plate is positioned so that the positioning of the optical plate 710 and the lamp tube 730 is simple and precise, and the optical plate 71 is not easily displaced. When the lamp 730 or other components are faulty and need to be reworked, it is only necessary to overcome the magnetic force between the magnetic member 744 and the magnetic member 744 to separate the optical light from the lamp 730 to complete the rework process. Convenience. FIG. 9A is a side elevational view of a backlight module 7〇〇 according to another preferred embodiment of the present invention. Fig. 9B is a side view of the backlight module 7〇〇 after being assembled. Referring to FIG. 9A and FIG. 9B, the backlight module 700 has the same components as the backlight module 700 described in FIG. 8A and FIG. 8B, and therefore the same or similar components are denoted by the same reference numerals. Please refer to the above description. No longer. The backlight module 700' is different from the backlight module 7' in that the back plate 720' of the backlight module 700' is made of metal that can be magnetically attracted by the magnetic member 744' and the position of the magnetic member 744 is Closer to the backing plate 720, and the backing plate 720, magnetically. In the backlight module 700', the lamp tube 730 and the back plate 720 can be separated only by the magnetic force between the magnetic member 744 and the back plate 720'. When the backlight module 700 is assembled again, only The electrode E1 and the electrode E2 need to be aligned without re-welding to electrically connect the electrode E1 and the electrode E2, so the assembly of the backlight module 700' is relatively simple. 10A is a side view of a backlight module 700 ′′ according to another embodiment of the present invention. FIG. 10B is a schematic side view of the backlight module 700. Referring to FIG. 10A and FIG. 10B , the backlight is shown in FIG. The module 700 has similar components as the backlight module 700 described in FIG. 9A and FIG. 9B, and thus the same 14 30683 twf.doc/n 201035644: 〇 or similar components are denoted by the same reference numerals, please refer to the above description, Therefore, the backlight module 700" is different from the backlight module 700 in that the back plate 720" of the "backlight module 700" is not magnetic and cannot be magnetically attracted to the magnetic device 744. Another magnetic member 750 is disposed on the back plate 72A from the magnetic member 744 to position the lamp tube 730 on the back plate 72"". Further, in other embodiments of the present invention, The embodiment of FIG. 8B can also be combined with the embodiment of FIG. 9 or FIG. 10B, that is, the magnetic member 744 or the magnetic member 750 is simultaneously disposed on the optical plate 71, the back plate 72, and the lamp tube. The device 740 is configured such that the optical plate 71, the back plate 72, and the tube 73 are fixed by magnetic means. For the implementation, the position of the magnetic member 7 of the magnetic member 7 and the material thereof can be described with reference to Figures 4 to 6. Therefore, the position and number of the magnetic member or the magnetic member can be known from all the above embodiments. It can be adjusted to each other, or the magnetic or magnetic parts can appear on one object at the same time, for example: on the optical board, or on the back board, or on the circuit board, or on the lamp fixture. ◎ « 11 For a preferred embodiment of the present invention, a display mode and a schematic diagram of 800. Please refer to the "11" for example, the display device 800 can have a display panel 81A and a backlight module 820', and the backlight module 82 can have the above. Any of the light-emitting devices 300, 400, 500, any of the thin ones, or the backlight module, 700' and 700". The display panel 810 can be a transflective display panel, a reflective display panel, a color light-emitting sheet on the active skin (c〇1〇r (10) brewing) display panel, and an active layer on the color light-emitting sheet. (_ Qn Μα fife ) 15 j 0683twf.doc/n 201035644 Display panel, vertical alignment type (VA) display panel, horizontal switching type (IPS) display panel, multi-domain vertical alignment type (MVA) display panel, twisted nematic Type (TN) display panel, super twisted nematic (STN) display panel, pattern vertical alignment type (PVA) display panel, super pattern vertical alignment type (S-PVA) display panel, advanced large viewing angle (ASV) display panel , fringe field switching type (FFS) display panel, continuous flame-like arrangement
(CPA)顯示面板、軸對稱排列微胞型（ASM)顯示面 板、光學補償彎曲排列型（OCB)顯示面板、超級水平 切換型（S-IPS)顯示面板、先進超級水平切換型（AS-IPS) 顯示面板、極端邊緣電場切換型（UFFS)顯示面板、藍相 顯示面板(Blue phase display panel)、高分子穩定配向型顯 示面板、雙視角型（dual-view )顯示面板、電泳型顯示面 板、藍相顯示面板(Blue Phase )、三視角型（tripie_view) 顯示面板、三維顯示面板（three-dimensional)或其它型面 板0(CPA) display panel, axisymmetric array microcell (ASM) display panel, optically compensated curved alignment (OCB) display panel, super horizontal switching (S-IPS) display panel, advanced super level switching type (AS-IPS) Display panel, extreme edge electric field switching type (UFFS) display panel, blue phase display panel, polymer stable alignment display panel, dual-view display panel, electrophoresis display panel, Blue phase display panel, triple view (tripie_view) display panel, three-dimensional display panel (three-dimensional) or other type of panel 0
圖_12為本發明較佳實施例的光電裝置的示意圖。圖 11之顯示模組800可以跟電子元件9〇0電連接而組合成一 光電裝置950。電子元件900包括如：控制元件、^作夭 件、處理70件、輸人元件、記憶元件、驅動元件、發光天 件、保護元件、感測元件、彳貞測元件、或其它功能元件、 或前达之組合。而光電裝置挪之類型包 照相機、筆記型電腦、遊戲 類似之i。^子^件收發器、地圖導航^、數位相片、^ ’、 、f>音產品（如影音放映器或類似之產品） 16 201035644 o 30683twf.doc/n 螢幕、電視、看板、投影機内之面板等。 综上所述，由於本發明所提出的背光模組是使用磁吸 件進行組裝，因此可提高崎定_度、減低光源毁損的 風險、並可節省組斜間。此外，由於本發崎提出的光 電裝置具有上述的背光模組，因此可簡化組裝及重 以減少製造成本。 —雖然本發明已以實施方式揭露如上，然其並非用以限 Ο 定本發明，何所屬技術領域_具有通常知識者，在不脫 離本發明之精神和範圍内’當可作些許之更動與潤飾，故 本發明之保護範m當視後附之巾請專利範圍所界定者為 準。 【圖式簡單說明】 圖 圖1A及圖1B為習知一種側向式背光模組1〇〇的示意 圖 圖 ❹ 17 30683twf.doc/n 201035644 圖6C為發光裝置5〇〇組立後的側視示意圖。 圖7A為本發明較佳實施例之背光模組6〇〇，的分解示 意圖。 圖7B為圖7A之發光裝置600組立之前的側視示意 圖。 圖7C為發光裝置6〇〇組立後的側視示意圖。 圖8A為本發明較佳實施例之背光模組700組立之前 的側視示意圖。 圖8B為背光模組700組立後的侧視示意圖。 〇 圖9A為本發明另一較佳實施例之背光模組7〇〇，組立 之前的側視示意圖。 圖9B為背光模組700’組立後的侧視示意圖。 圖10A為本發明又一較佳實施例之背光模組7〇〇，，組 立之前的侧視示意圖。 圖10B為背光模組700”組立後的側視示意圖。 圖11為根據本發明之實施例之顯示模組的示意圖。 圖12為根據本發明之實施例之光電裝置的示意圖。 ◎ 【主要元件符號說明】 100、200、600’、820、700、700’、700” ：背光模組 110、330、630 :電路板 '' 120、320、620 :發光元件 130 :膠框 140 :導光板 210、62(Τ :反射板 220、630’ ：光學片組 18 201035644：ϋ 30683twf.doc/n 230 :框架 232 :容納側邊 300、400、500、600 :發光裝置 310、510、610、710 :光學板 310c、510c :底面 310a、510a、610a、710a :入光面 310b、510b、610b、710b :出光面 322、容置槽 Ο 324:發光二極體晶片 326 :光學膠 340、640、744 :磁吸件 340a :磁吸件340的表面 350a :被磁吸件350的表面 350、650、750 :被磁吸件 610,、720、720,、720” ：背板 730 :燈管 732 :末端 ❹ 740:燈管固定裝置 742 :彈性主體 800 :顯示模組 810 :顯示面板 900 :電子元件 950:光電裝置 d :間隙 El、E2 :電極 19Figure 12 is a schematic illustration of an optoelectronic device in accordance with a preferred embodiment of the present invention. The display module 800 of Figure 11 can be electrically coupled to the electronic component 910 to be combined into a photovoltaic device 950. The electronic component 900 includes, for example, a control component, a component, a process 70, an input component, a memory component, a driving component, a lighting component, a protection component, a sensing component, a sensing component, or other functional component, or The combination of the former. The types of optoelectronic devices are similar to cameras, notebooks, and games. ^Sub-device transceiver, map navigation^, digital photo, ^ ', , f> audio products (such as video projectors or similar products) 16 201035644 o 30683twf.doc/n Screen, TV, Kanban, projector panel Wait. In summary, since the backlight module proposed by the present invention is assembled by using a magnetic member, the risk of deterioration of the light source can be improved, and the skew of the group can be saved. In addition, since the photovoltaic device proposed by the present invention has the backlight module described above, assembly can be simplified and manufacturing costs can be reduced. </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> <RTIgt; Therefore, the protection scope of the present invention is subject to the scope defined by the patent scope attached to the attached towel. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A and FIG. 1B are schematic diagrams of a conventional side-lit backlight module 1 ❹ 17 30683 twf.doc/n 201035644 FIG. 6C is a side view of the illuminating device 5 〇〇 assembled . FIG. 7A is an exploded perspective view of a backlight module 6A according to a preferred embodiment of the present invention. Figure 7B is a side elevational view of the illuminating device 600 of Figure 7A prior to assembly. Fig. 7C is a side view showing the assembly of the light-emitting device 6〇〇. FIG. 8A is a side elevational view of the backlight module 700 before being assembled according to a preferred embodiment of the present invention. FIG. 8B is a side view of the backlight module 700 after being assembled. 9A is a side view of a backlight module 7A according to another preferred embodiment of the present invention, before being assembled. FIG. 9B is a side view of the backlight module 700' after being assembled. FIG. 10A is a side elevational view of a backlight module 7A according to still another preferred embodiment of the present invention. Figure 10B is a side view of the backlight module 700". Figure 11 is a schematic view of a display module in accordance with an embodiment of the present invention. Figure 12 is a schematic diagram of a photovoltaic device in accordance with an embodiment of the present invention. DESCRIPTION OF SYMBOLS 100, 200, 600', 820, 700, 700', 700": backlight module 110, 330, 630: circuit board '' 120, 320, 620: light-emitting element 130: plastic frame 140: light guide plate 210 62 (Τ: reflecting plate 220, 630': optical sheet set 18 201035644: ϋ 30683 twf. doc / n 230: frame 232: accommodating sides 300, 400, 500, 600: illuminating devices 310, 510, 610, 710: Optical plates 310c, 510c: bottom surface 310a, 510a, 610a, 710a: light-incident surface 310b, 510b, 610b, 710b: light-emitting surface 322, receiving groove 324: light-emitting diode wafer 326: optical glue 340, 640, 744 : Magnetic member 340a: surface 350a of magnetic member 340: surface 350, 650, 750 of magnetic member 350: magnetic member 610, 720, 720, 720": back plate 730: tube 732: End ❹ 740: Lamp Fixing Device 742: Elastic Body 800: Display Module 810: Display Panel 900: Electronic Component 950: Light Means d: space El, E2: electrode 19