201035240 r 六、發明說明： C 明所屬系餘々貝j 本發明關於一種聚合物光學連線(ρ〇υ組件。本發明也 關於一種基於或適於與光學連線技術結合的電子裝置，其 包括下述組件：光源、光感測器及光學連線組件，更特別 地關於一種電子裝置，其中光學連線組件為聚合物光學連 線(POI)組件。 t ^tr ]3 〇 改善產品的表現是任何產業所面對的挑戰而且挑戰永 遠不會止歇。對於電子產業而言更是如此，從其早期創立 以來即一直面對挑戰。改善電子裝置（如電腦系統）的表現大 ， 部分係藉由讓這些裝置使用之積體電路(1C)中之特徵部件 ‘ 的最小尺寸變小而達成。這讓基本IC建構單位（電晶體) 可以較高頻率運作，每秒執行更多運算。電氣連線正達到 其等根本的限制並在數據通訊中變成速度瓶頸。使最小特 0 徵部件的尺寸變小也導致晶片上線路的更緊密配置而接近 它的限制極限，並且引發其他問題。 為了防止這些問題以及克服限制，混合光學/電子連線 甚或完全光學連線正被用於取代使用金屬導體的電氣連 線。光學解決方案已經被用於廣泛及局部區域網路(WAN & L A N)達一段時間了。現在在晶片至晶片或晶片上的連線中 也漸漸要求短距(如在背板、電路板及模組中）的解決方案。 由於技術較昂責而且技術尚未完全成熟，光學技術還沒廣 泛使用於短距通訊中。由於光學連線從電腦網路應用走向 201035240 晶片等級連線(如晶片至晶片或晶片上連線），所以高連接密 度及對準可靠性的新需求對於這些連接的有效利用而言已 經變成關鍵。在整合性光學及電子技術上依然存有許多材 料、製造及封裝上的挑戰。 典型上光學連線裝置中的光學連線將包括⑴連接至遠 端光源的光源或光傳送器’ 一起稱作光源’（ii)接收器，其 可為光感測器或連接至遠端光感測器的光傳送器，一起稱 作光感測器，及(iii)光學連線組件。光源以及光感測器個別 或兩者可為晶片。光學連線組件，其本身也是光傳送器， 可由不同材料製成。當它由熱塑性聚合物組成物製成，它 通常被稱作聚合物光學連線組件。術語”聚合物光學連線組 件”此處將簡稱為POI-組件。 儘管就長距通訊而言，玻璃係最廣泛使用的材料，但 就晶片等級連線的短距通訊而言，仍在探測新的材料，其 結合必要的透明度及透光度與形塑能力、尺寸穩定性及低 熱膨脹性、高熱及任意地抗濕性。與稍早相關的誤解相反， 在短距上光學通訊裝置典型上將比電氣裝置使用更多的電 力。更多的電力結合上小尺寸的組件導致更高的溫度。不 同的聚合物，像聚曱基丙烯酸酯（PMMA)、環稀烴共聚物 (COC)、聚降莰烯(PNB)被使用。這些材料不是奇異的及昂 貴的（PNB)就是熱穩定性不足以應付電子總成之組件在組 合過程中必須歷經的製程。 3C轉換持續推動在超級有限空間應用内部之其他功 能的整合。期待的是，光學連線將替代電氣連線而成長， 201035240 而且對於透明高溫塑膠的需求也會成長。 需要一種適用於作為光學連線技術必要部分之電子裝 置的POI-組件，以及用於該組件的材料，該材料係抗熱的 並且能夠提供POI-組件必要的透明性、尺寸穩定性與熱穩 定性。 【明内溶1】 聚合物光學連線(POI)組件包括可透光部，<透光部由 熱塑性聚合物組成物，其中 -熱塑性聚合物組成物包括聚合材料，該聚合材料包含 化溫度(Tm-A)至少260〇C的半晶質半芳香族聚醯胺(A)， -半晶質半芳香族聚醯胺(A)存在量相對於聚合材料總 重至少50wt.%， -熱塑性聚合物組成物的熔化溫度(Tm_c)至少260〇C， 及 -可透光部的透光度依據ASTM D1003A方法測定至少 60 %。 已經發現具有此種透光度的P 〇〗組件可以由熱塑性聚 合物組成物製成，該熱塑性聚合物組成物包括半晶質半芳 香族聚胺’即使此種組成物含有類似玻璃填充物及/或玻 璃纖維的其他組份。製成的POI組件可具有相當高的結晶 度，同時保留良好的透光度。鑑於晶質聚醯胺於模製時容 易變得混濁及霧狀(特別是在其他組份存在時），而且通常需 要與相當大量的非晶質聚醯胺摻合來變成半透明或透明 狀，這是特別令人驚訝的。由該熱塑性聚合物組成物組成 201035240 的POI組件的優點包括該半晶質半芳香族聚酿胺係高抗 熱、高尺寸穩定性及具有良好的抗濕性。當組成物包括玻 璃填充物及/或纖維時，這些效果中的數者會進一步增強。 術語“可透光部”中之“可透光，，意指該部分可以至少某種程 度地傳送光線。於本發明中，此最小的程度界定為依據 ASTM D1003A的方法測量透光度至少60 %。依據這些術 s吾之每一個的定義以及可透光部之真正透光度的不同，此 種透光度可被認為係半透明或透明的。 術語透光度此處應了解為在可透光部上依據ASTM D1003之方法測量的光線傳送。此處透光度係與入射於樣 本上的光通量相較，穿過樣本傳送之光通量的百分比。並 未就該部的厚度為任何校正。 術語熔化溫度此處應了解為依據ASTM D3418-97方 法在加熱速率l〇°C/min的第二加熱循環以DSC測量的熔 化溫度。此處溶融吸熱線的最大峰值被認作是炼化溫度。 術語熔融焓此處應了解為依據ASTM D3418-97方法 在加熱速率10°C/min的第二加熱循環以DSC測量的放熱 能量。此處熔融吸熱線下方的面積被認作是熔融焓。 半晶質聚合物此處應了解為熔融焓至少5 /J/g的聚合 物。與此相符者’非晶質聚合物此處應了解為熔融焓少於5 J/g的聚合物。 術語玻璃轉換溫度（Tg)此處應了解為依據ASTM D1356-91方法在加熱速率l〇〇c/min的第二加熱循環以 DSC測量的溫度，其落在玻璃轉換範圍且顯示最高玻璃轉 201035240 換速率。顯示最高玻璃轉換速率的溫度被決定為符合原始 熱曲線回折點之原始熱曲線首次變異（關於時間）之峰值的 溫度。 熔化點至少260。(：的半晶質半芳香族聚醯胺此處也稱 作聚醯胺(A)。 此處提及之組成物的炼化溫度(稱作Tm-C)係針對POI 組件的組成物測定，儘管半晶質聚醯胺的熔化溫度（稱作 Tm-A)係針對聚合物測定。 半晶質半芳香族聚醯胺典型上具有玻璃轉換溫度（稱 作 Tg-A)。 POI組件可由射出模製方法製作。可透光部可由與本 發明POI組件之其餘部分不同的組成物組成，該多組成P0I 組件因此可由2K射出模製方法製作，但較佳地，可透光部 為POI組件的併合部分及POI組件由射出模製方法組 合地製作。已經發現熔化溫度(Tm_C)至少26(Γ(：的熱塑性 聚合物組成物且其包括半晶質半芳香族聚醯胺(A),甚至當 包括玻璃填充物及/或玻璃纖維時，可以射出模製以形成模 製產品，至少一部分的模製產品具有至少6〇 %的透光度。 這可由包括下述步驟的射出模製方法製成，其中包括 半晶質半芳香族聚醯胺(A)的高熔化熱塑性聚合物組成物 被熔化處理並射入模具空腔中，其中模具溫度(Tm〇)至少低 於Tg-A(聚醯胺(A)的玻璃轉換溫度）2〇。(：。另一優點為如 此由包括玻璃纖維之組成物得到的p〇I組件具有良好表面 〇〇貝，如果有的話也僅有有限的玻璃纖維透印 201035240 (print-through)。為了防止光線散射及傳送光線量的降低， 良好表面品質係P0I組件的關鍵性質。Tmo越低，聚合物 淬火冷卻越快而且透明性越好。 較佳地，Tmo低於Tg-A至少30。〇更佳地至少4〇。〇 要被施用的Tmo值依靠聚醯胺(A)使用的真正Tg不同而不 同。Tmo的典型值係l00〇C或更低，或甚至8〇〇(：以下。 關於透光度的結果更依據PPA類型及模製部厚度(特 別是可透光部厚度）不同而不同。當模具溫度進一步低於 Tg-A及/或可透光部具有較低厚度時，透明度更佳。 可透光部的厚度可在大範圍内變化。合適地，該部分 的厚度為2-3 mm，或特別在玻璃纖維及玻璃填充物的案例 中甚至可以不須具備。較佳地，厚度最多2 mm，更佳的最 多1 mm，更佳的落在範圍5〇 - 5〇(nimR，最佳地在範圍 100 - 200μιη内。即使當具有相當小尺寸時，控制這種薄部 分也是容易的，特別當可透光部係ρ〇Ι組件的併入部時， 該POI組件具有較大尺寸的其他部分，例如，具有形成圍 繞窗螢幕之一種窗框的較厚部分。此種p〇I組件係具有光 學貫穿孔之三維光學連線的典型例子。 依據薄部分的尺寸，生產本發明p〇I組件之射出模製 方法所用的模具空腔，較佳地包括壁至壁距離少於3mm的 部分，或依據所要可透光部之厚度為比3mm還少的部分。 本發明POI-組件中之可透光部的透光度，依據astm D1003A測量，為至少6〇%而且可在大範圍間變化。合適 地’透光度在60-95%的範圍，雖然甚至可以更高。在1〇〇μηι 201035240 的厚度，低至零的玻璃填充物及纖維含量，及/或存在一些 ' 次於聚醯胺(A)的非晶質聚醯胺下，透光度可較90%為高， 在特別的案例中甚至高到約92-94%。較佳地，透光度為至 少65 - 90%，較佳地至少75%及甚至至少85 %。 合適地，65-95 %範圍的透光度可由依據本發明的POI_ 組件獲得，其中半晶質半芳香族聚醯胺（A)的熔化温度 (Tm-A)為至少270°C，半晶質半芳香族聚醯胺(A)的存在量 ^ 相對於聚合材料總重為至少75wt.%，熱塑性聚合物組成物 的溶化溫度(Tm-C)為270-340°C範圍，及可透光部的厚度 最多2mm。 上述射出模製方法所得的模製產品可為僅部分晶質或 甚至是貫質上非晶質。產品可在升高溫度下退火，或另外 進行熱處理，其中射出模製產品在介於半晶質聚醯胺的Tg 及Tm之間的溫度下處理。於此種熱處理下，會引發結晶 化及/或進一步增加結晶。儘管可能由於此種熱處理之故， 〇 結晶度顯著地增加，但是已經發現模製產品在產品被加熱 至升咼溫度之後仍然保留它大部分的透光性質。使模製產 進仃如此熱處理步驟的進一步優點為水分吸收顯著地降 低’而且尺寸穩定性及抗濕性更為增強。 ，結晶的程度以及於退火或其他熱處理時結晶度的増加 通常藉由炼融给反應。結晶度越高，炫融給也越高。 熱塑性聚合物組成物的熔融焓可在大範圍之間變化。 較仏地，熱塑性聚合物組成物的熔融焓相對於熱塑性聚合 物組成物中聚合材料的重量為至少20 J/g，更佳地至少二 9 201035240 J/g，再佳地至少40 J/g。熔融焓可達到頗高於7〇 J/g的數 值，甚至高至80 J/g以上，同時依然具有可透光的產品。 熔融焓也將依照玻璃纖維及玻璃填充物含量的不同而 不同。合適地，就包含玻璃纖維及/或破璃填充物的組成物 (例如其數量相對於組成物的總重為20-40wt.%)而言，溶融 給相對於熱塑性聚合物組成物總重合適地落在15_6〇 J/g的 範圍内。 半晶質半芳香族聚醯胺(A)可以為任何溶化溫度(Tm_A) 至少260。(：的半晶質半芳香族聚醯胺。較佳地，Tm_a以及 類似的Tm-C落在270-340。(：的範圍内，更佳地 290-330°C，或再佳的310-330。(：。合適地，該半晶質半芳 香族聚醯胺為不同半晶質聚醯胺的摻合物。在案例中，摻 合物的熔化溫度應該依然為至少260°C，較佳地落在 270-340°C的範圍内。 半晶質半芳香族聚醯胺可為具有重複單元的聚醯胺， 重複單元來自二羧酸及二胺，其中不論二羧酸或二胺或兩 者包括芳香族組份，而其餘組份包括脂肪族二羧酸及/或二 胺，其等可為線性、分枝或環狀，及/或芳基脂肪族二羧酸 及二胺。 適合的芳香族二羧酸之例為對苯二曱酸及間苯二甲 酸。 較佳地，半晶質半芳香族聚醯胺包括來自作為二羧酸 之對苯二甲酸的重複單元。適合的芳香族二胺之例為間-苯 二曱基二胺及對-笨二甲基二胺。 201035240 適合的半晶質半芳香族聚醯胺的例子包括如PA7T、 PA9T、PA10T及PA12T之具有熔化溫度範圍為270-350°C 的均聚醯胺，及PA4T、PA5T ' PA6T及/或PA8T與例如 PA7T、PA9T、PA10T、PA11T、PA12T、PA6、PA66 及/或 PMXD6的共聚醯胺。PA4T、PA5T、PA6T及PA8T均聚物 具有高於340°C的熔化溫度，但共聚物可被調製使得其具 有低於340°C的熔化溫度。適合的共聚醯胺包括 PA10T/6T、PA9T/M8T(其中 M8 =2-甲基伸辛基二胺）、 PA6T/5T、PA6T/M5T(其中 M5 =2-甲基戊二胺），及 PA6T/10T。僅次於以上共聚醯胺中所提到者，聚醯胺可包 括其他二胺與二酸的其他重複單元，因此形成更加複雜的 共聚醯胺。適合的半晶質半芳香族共聚醯胺的進—步例子 請參見 Kunststoff Handbuch (Carl Hanser Verlagl998)Band3/4 聚醯胺第 6 章。 較佳地，半晶質半芳香族聚醯胺的熔化溫度範圍為 290-335。(：，更佳地，範圍為31〇_33〇〇c。具有較高的最小 熔化溫度，則該膜具有較佳的熱及尺寸性質。具有較低的 最大熔化溫度’則聚合物組成物可更容易加工成為透明膜 或饋出產物。較高職溫度可例如藉由使用較高量的對苯 二曱酸及/或脂環或芳香族二胺，或短鏈線性脂肪族二胺而 達成。習於此藝者可·—般知識及例行實驗而改變—融點。 於依據本發明透明膜及饋出產物的一實施例中，半晶 質聚醯胺(A)係由重複單元組成的半晶質半芳香族此 胺(A-X)，該重複單元來自： 、/、聚醯 11 201035240 ⑻25-45莫耳％的對笨二甲酸， (b) 5-25莫耳％之不同於對苯二甲酸的芳香族二減，及/ 或脂肪族二羧酸， ⑷5-30莫耳％的二胺，其選自由乙二胺、丙二胺、丁二胺 及戊二胺組成的群組， (d) 20-45%之包括至少6C原子的二胺，與任意地， (e) 0-10莫耳％的一或多種胺基羧酸及/或内醯胺與 (f) 0-3莫耳％之在胺基及/或羧酸基團中係單官能性或三官 能性的化合物； 其中各a-f的莫耳％係相對於總a_f。 已經發現依據此實施例的半透明的或透明產品可被容 易地生產，使用中等熱水模製狀況，即模具的溫度由熱但 未沸騰的水控制，因而去除了施用高壓的必要。即使該半 晶質聚醯胺的熔化溫度高至325°C，以及以相當大的量被 用於包括玻璃纖維的組成物中，但是不需第二聚合物（諸如 非晶質聚醯胺），仍然可得到透明或半透明產品。儘管於加 熱時引起及發生結晶化’但疋透光度在產品加熱之後(例如 在通過3次的無鉛迴流焊接曲線之後)依然維持在很高的程 度。 較佳地，在半晶質聚酿胺(A)之炼化溫度（Tm-A)範圍 290-335°C的實施例中，更佳地’範圍310-330°C的實施例 中。例如藉由使用較高數量之上述實施例之半晶質半芳香 族共聚醯胺中的組份(a)及/或組份(c)，可以達到較高的熔化 溫度。 12 201035240 實施例中組份a-f的存在量（個別的或彼此組合的量）較 佳為：（a)35-45 莫耳％ ; (b)5-15 莫耳％ ; (c)10-25 莫耳％ ; (d)15-25莫耳％ ; (e)〇-5莫耳％ ;及(〇0-1莫耳％，其中各個 a-f的莫耳％相對於總a_f。分別相對於⑻及(c)，較多量的 (a)及（d)，導致聚合物較佳的加工處理以及較佳的高溫性 質。 於另一較佳的實施例中，半晶質半芳香族共聚醯胺聚 0 合物的密度為至少1.15，較佳地至少1.20或甚至1.25。較 高密度造成較高的折射率，當POI-組件被用作例如鏡片時 這是一個優點。特別地，不含玻璃纖維及填充物的組成物 適於製備鏡片。 « , 相類似的，就直接接觸玻璃纖維以連接至遠端光源及/ 或光感測器的POI組件而言，較佳地係讓熱塑性聚合物組 成物具有至少1.20的密度，較佳地至少13〇或甚至是 1·40。較高密度的優點為在ρ〇【組件_玻璃纖維界面的光漏 Ο 失會減少。此種較高密度可以較高含量的玻璃纖維及填充 物以及特別地以較高密度的半晶質半芳香族共聚醯胺聚合 物而達成。 用於POI組件的熱塑性聚合物組成物可包括次於半晶 只半芳香族聚醢胺的第二聚合物。第二聚合物可為任何聚 合物或聚合物的組合，假若第二聚合物及半晶質半芳香族 聚酿胺之間的重量比例最多為i的話，及第二聚合物的量 進-步文限’使付熱塑性聚合物組成物的溶化溫度(TgC) 保持至少270。〇及P0I組件可透光部的透光度依據a· 201035240 D1003A的方法測量保持至少6〇 %。 較佳地’第二聚合物選自溶於聚臨胺的聚合物諸如 其他聚醯胺，除此之外，如果有的話，其使用之量較佳地 係受限的。 第二聚合物⑻合適地包括，或甚至是由非晶質半芳香 族聚醯胺及/祕化溫度低於27(rc的半U脂肪族或半二 香族聚醯胺組成。 使用此種非晶質或低炼化半晶質聚醯胺具有與半晶質 聚醯胺(A)相容良好’ _在溫度高於製造本發明⑽組件 〇 的溶化溫度時，容易加工半晶質聚酶胺的優點。非晶質聚 醯胺更具有透光度將被增強的優點。此種可合適地用於本 發明之低熔化半晶質聚醯胺的例子為聚醯胺_6或聚醯胺 66。適合的非晶質聚醯胺包括非晶質聚醯胺6I/6T共聚醯 ' 胺。201035240 r VI. Description of the invention: C. The present invention relates to a polymer optical connection (ρ〇υ component. The invention also relates to an electronic device based on or adapted to be combined with optical connection technology, The invention includes the following components: a light source, a photo sensor, and an optical wiring assembly, and more particularly, an electronic device in which the optical wiring assembly is a polymer optical wiring (POI) component. t ^tr ]3 〇 Performance is the challenge of any industry and the challenge will never stop. This is especially true for the electronics industry, which has been facing challenges since its inception. Improving the performance of electronic devices (such as computer systems), part of it This is achieved by making the minimum size of the feature 'in the integrated circuit (1C) used by these devices small. This allows the basic IC construction unit (transistor) to operate at a higher frequency and perform more operations per second. Electrical wiring is reaching its fundamental limits and becoming a speed bottleneck in data communications. Minimizing the size of the smallest components also leads to tighter configuration of the lines on the wafer. It limits the limits and raises other issues. To prevent these problems and overcome the limitations, hybrid optical/electronic wiring or even complete optical wiring is being used to replace electrical wiring using metal conductors. Optical solutions have been used extensively. And local area networks (WAN & LAN) have been around for a while. Solutions for short-range (such as in backplanes, boards, and modules) are now increasingly required in wafer-to-wafer or wafer-to-wafer wiring. Optical technology has not been widely used in short-range communications due to the high level of technology and the technology is not yet fully mature. As optical wiring moves from computer network applications to 201035240 wafer-level wiring (such as wafer-to-wafer or wafer-on-line), Therefore, new demands for high connection density and alignment reliability have become critical for the efficient use of these connections. There are still many material, manufacturing and packaging challenges in integrated optics and electronics. Typical optical connections The optical connections in the device will include (1) a light source or optical transmitter connected to the remote source 'collectively referred to as a light source' (ii) receiving , which may be a light sensor or an optical transmitter connected to a remote light sensor, collectively referred to as a light sensor, and (iii) an optical wiring assembly. The light source and the light sensor individually or both It can be a wafer. The optical wiring assembly, which is itself an optical transmitter, can be made of different materials. When it is made of a thermoplastic polymer composition, it is commonly referred to as a polymer optical wiring assembly. The term "polymer optics" "Connecting components" will be referred to herein as POI-components. Although glass is the most widely used material for long-distance communication, new materials are still being detected for short-range communication of wafer-level wiring. Combines the necessary transparency and transparency with plasticity, dimensional stability and low thermal expansion, high heat and arbitrarily moisture resistance. Contrary to earlier misunderstandings, optical communication devices on short distances typically have electrical devices Use more power. More power combined with smaller size components results in higher temperatures. Different polymers, such as polydecyl acrylate (PMMA), cycloaliphatic copolymer (COC), polypyrene (PNB), are used. These materials are not singular and expensive (PNB) or thermal stability is not sufficient to cope with the processes that must be experienced in the assembly process of the components of the electronics assembly. The 3C transformation continues to drive the integration of other functions within the Super Limited Space application. It is expected that optical wiring will grow in place of electrical wiring, 201035240 and the demand for transparent high-temperature plastics will grow. There is a need for a POI-component suitable for use as an electronic device as an essential part of optical wiring technology, as well as materials for the assembly that are resistant to heat and that provide the necessary transparency, dimensional stability and thermal stability of the POI-component. Sex. [Metal Dissolution 1] The polymer optical wiring (POI) component includes a light transmissive portion, and the light transmissive portion is composed of a thermoplastic polymer, wherein the thermoplastic polymer composition includes a polymeric material, and the polymeric material contains a chemical temperature. (Tm-A) at least 260 ° C of semi-crystalline semi-aromatic polyamine (A), - semi-crystalline semi-aromatic polyamine (A) is present in an amount of at least 50 wt.%, based on the total weight of the polymeric material, - The thermoplastic polymer composition has a melting temperature (Tm_c) of at least 260 ° C, and - the light transmissive portion has a transmittance of at least 60% according to the ASTM D1003A method. It has been found that a P 〇 component having such a transmittance can be made of a thermoplastic polymer composition comprising a semi-crystalline semi-aromatic polyamine even though such a composition contains a similar glass filler and / or other components of fiberglass. The resulting POI assembly can have a relatively high degree of crystallinity while retaining good light transmission. In view of the fact that crystalline polyamines tend to become turbid and hazy during molding (especially in the presence of other components), and usually need to be blended with a relatively large amount of amorphous polyamine to become translucent or transparent. This is especially surprising. Advantages of the POI module of the composition of the thermoplastic polymer composition of 201035240 include the high heat resistance, high dimensional stability and good moisture resistance of the semicrystalline semi-aromatic polyamine. When the composition includes a glass filler and/or fiber, several of these effects are further enhanced. The term "transmissive" in the term "transmissive portion" means that the portion can transmit light at least to some extent. In the present invention, this minimum degree is defined as measuring at least 60 transmittance according to the method of ASTM D1003A. %. According to the definition of each of these techniques and the true transmittance of the permeable portion, such transmittance can be considered to be translucent or transparent. The term transmittance should be understood here as Light transmission measured on the permeable portion in accordance with the method of ASTM D1003. Here the transmittance is the percentage of the luminous flux transmitted through the sample as compared to the luminous flux incident on the sample. No correction is made for the thickness of the portion. The term melting temperature is understood here to mean the melting temperature measured by DSC in the second heating cycle at a heating rate of 10 ° C/min according to the method of ASTM D3418-97. The maximum peak of the melting endotherm here is considered to be refining. The term "melting enthalpy" is understood herein to mean the exothermic energy measured by DSC in a second heating cycle at a heating rate of 10 ° C/min in accordance with ASTM D3418-97. The area below the melting endotherm is considered to be melting enthalpy. . Semi-crystalline polymers are to be understood herein as polymers having a melting enthalpy of at least 5 /J/g. In accordance with this, 'amorphous polymers are to be understood herein as polymers having a melting enthalpy of less than 5 J/g. The glass transition temperature (Tg) should be understood here as the temperature measured by DSC in the second heating cycle of the heating rate l〇〇c/min according to the ASTM D1356-91 method, which falls within the glass conversion range and shows the highest glass to change 201035240 Rate. The temperature at which the highest glass transition rate is displayed is determined as the temperature at which the peak of the original thermal curve at the original thermal curve inflection point is the first variation (with respect to time). The melting point is at least 260. (: semi-crystalline semi-aromatic polyamide) Also referred to herein as polyamine (A). The refining temperature of the composition referred to herein (referred to as Tm-C) is determined for the composition of the POI component, despite the melting temperature of the semi-crystalline polyamine ( The term "Tm-A" is determined for the polymer. Semi-crystalline semi-aromatic polyamides typically have a glass transition temperature (referred to as Tg-A). The POI assembly can be fabricated by an injection molding process. Different components of the remainder of the POI assembly of the present invention Thus, the multi-component PON assembly can be fabricated by a 2K injection molding method, but preferably, the permeable portion is a merging portion of the POI assembly and the POI assembly is fabricated by an injection molding method. The melting temperature (Tm_C) has been found. At least 26 (a thermoplastic polymer composition and comprising a semi-crystalline semi-aromatic polyamide (A), even when comprising glass fillers and/or glass fibers, may be injection molded to form a molded product At least a portion of the molded product has a transmittance of at least 6%. This can be made by an injection molding process comprising the following steps, including high melting thermoplastic polymerization of the semicrystalline semi-aromatic polyamide (A). The composition is melt processed and injected into the mold cavity, wherein the mold temperature (Tm 〇) is at least lower than Tg-A (glass transition temperature of polyamine (A)) 2 〇. (: Another advantage is that the p〇I component obtained from the composition comprising glass fibers has good surface mussels, if any, only limited glass fiber printthrough 201035240 (print-through). Light scattering and the reduction of the amount of transmitted light, good surface quality is a key property of the P0I component. The lower the Tmo, the faster the quenching of the polymer and the better the transparency. Preferably, the Tmo is at least 30 below Tg-A. Preferably, the Tmo value to be applied varies depending on the true Tg used by the polyamine (A). The typical value of Tmo is 100 ° C or lower, or even 8 〇〇 (: below. The result of transmittance is different depending on the type of PPA and the thickness of the molded part (especially the thickness of the permeable portion). When the mold temperature is further lower than Tg-A and/or the permeable portion has a lower thickness, transparency More preferably, the thickness of the permeable portion can vary over a wide range. Suitably, the thickness of the portion is 2-3 mm, or even in the case of glass fibers and glass fillers, it may not even be necessary. , up to 2 mm thick, more preferably up to 1 mm More preferably, it falls within the range of 5 〇 - 5 〇 (nimR, preferably in the range of 100 - 200 μηη. Even when it has a relatively small size, it is easy to control such a thin portion, especially when the permeable portion is 〇 The POI component has other portions of larger size, for example, having a thicker portion that forms a sash surrounding the window screen. Such a pII component is a three-dimensional optical connection with optical through-holes. A typical example of the mold cavity used in the injection molding method for producing the p〇I component of the present invention, preferably including a wall-to-wall distance of less than 3 mm, or depending on the desired light transmissive portion, depending on the size of the thin portion. The thickness is less than 3 mm. The transmittance of the permeable portion of the POI-assembly of the present invention is at least 6 〇% according to astm D1003A and can vary over a wide range. Suitably, the transmittance is 60-95% range, although even higher. Thickness at 1〇〇μηι 201035240, glass filler and fiber content as low as zero, and/or presence of some amorphous than polyamine (A) Under the condition of polyamine, the transmittance can be higher than 90%. In particular cases it is even as high as about 92-94%. Preferably, the transmittance is at least 65 - 90%, preferably at least 75% and even at least 85%. Suitably, the range of 65-95% is transparent The luminosity can be obtained from a POI_ component according to the invention, wherein the semicrystalline semi-aromatic polyamine (A) has a melting temperature (Tm-A) of at least 270 ° C, semi-crystalline semi-aromatic polyamine (A) The amount of presence is at least 75 wt.% with respect to the total weight of the polymeric material, the melting temperature (Tm-C) of the thermoplastic polymer composition is in the range of 270-340 ° C, and the thickness of the permeable portion is at most 2 mm. The molded product obtained by the above injection molding method may be only partially crystalline or even substantially amorphous. The product may be annealed at elevated temperatures or otherwise heat treated wherein the injection molded product is treated at a temperature between the Tg and Tm of the semicrystalline polyamine. Under such heat treatment, crystallization is caused and/or crystallization is further increased. Although the crystallinity of ruthenium may increase significantly due to such heat treatment, it has been found that the molded product retains most of its light transmitting properties after the product is heated to the elevated temperature. A further advantage of the molding process for the heat treatment step is that the moisture absorption is significantly reduced' and the dimensional stability and moisture resistance are further enhanced. The degree of crystallization and the increase in crystallinity during annealing or other heat treatment are usually given by smelting. The higher the crystallinity, the higher the smelting. The melting enthalpy of the thermoplastic polymer composition can vary over a wide range. More preferably, the thermoplastic polymer composition has a melting enthalpy of at least 20 J/g, more preferably at least two 9 201035240 J/g, and even more preferably at least 40 J/g, relative to the weight of the polymeric material in the thermoplastic polymer composition. . Melting enthalpy can reach values well above 7 〇 J/g, even up to 80 J/g, while still having a light permeable product. The melting enthalpy will also vary depending on the content of the glass fiber and the glass filler. Suitably, the melt is suitably applied to the total weight of the thermoplastic polymer composition insofar as the composition comprising the glass fibers and/or the glass filler is, for example, 20-40 wt.%, based on the total weight of the composition. It falls within the range of 15_6〇J/g. The semicrystalline semi-aromatic polyamide (A) may have a melting temperature (Tm_A) of at least 260. (: semi-crystalline semi-aromatic polyamine. Preferably, Tm_a and similar Tm-C fall within the range of 270-340. (:, more preferably 290-330 ° C, or even better 310 -330. (: suitably, the semi-crystalline semi-aromatic polyamine is a blend of different semi-crystalline polyamines. In the case, the blend should still have a melting temperature of at least 260 ° C, Preferably, it falls within the range of 270-340 ° C. The semi-crystalline semi-aromatic polyamine can be a polyamine having a repeating unit derived from a dicarboxylic acid and a diamine, wherein the dicarboxylic acid or the second The amine or both include an aromatic component, while the remaining components include aliphatic dicarboxylic acids and/or diamines, which may be linear, branched or cyclic, and/or arylaliphatic dicarboxylic acids and Examples of suitable aromatic dicarboxylic acids are terephthalic acid and isophthalic acid. Preferably, the semicrystalline semi-aromatic polyamine comprises repeating units derived from terephthalic acid as a dicarboxylic acid. Examples of suitable aromatic diamines are m-phenylenediamine diamine and p-stact dimethyldiamine. 201035240 Examples of suitable semi-crystalline semi-aromatic polyamines Examples include PA7T, PA9T, PA10T, and PA12T, homopolyamides having a melting temperature range of 270-350 ° C, and PA4T, PA5T 'PA6T and/or PA8T and, for example, PA7T, PA9T, PA10T, PA11T, PA12T, PA6, Copolyamide of PA66 and/or PMXD6. PA4T, PA5T, PA6T and PA8T homopolymers have a melting temperature above 340 ° C, but the copolymer can be prepared such that it has a melting temperature below 340 ° C. Suitable Copolyamines include PA10T/6T, PA9T/M8T (where M8 = 2-methyl octyldiamine), PA6T/5T, PA6T/M5T (where M5 = 2-methylpentanediamine), and PA6T/10T Next to the above-mentioned copolyamines, polyamines can include other repeating units of other diamines and diacids, thus forming more complex copolyamines. Suitable semi-crystalline semi-aromatic copolyamides. For an example of further steps, see Kunststoff Handbuch (Carl Hanser Verlagl 998) Band 3/4 Polyamide. Chapter 6. Preferably, the semi-crystalline semi-aromatic polyamide has a melting temperature in the range of 290-335. (:, more Preferably, the range is 31〇_33〇〇c. With a higher minimum melting temperature, the film has better heat. Size properties. With a lower maximum melting temperature 'the polymer composition can be more easily processed into a transparent film or a feed product. Higher temperatures can be used, for example, by using higher amounts of terephthalic acid and/or fat. Ring or aromatic diamine, or short-chain linear aliphatic diamine. This art can be changed by general knowledge and routine experiments - melting point. In the embodiment, the semicrystalline polyamine (A) is a semicrystalline semiaromatic amine (AX) consisting of repeating units derived from: , /, polyfluorene 11 201035240 (8) 25-45 mol% For stupi dicarboxylic acid, (b) 5-25 mol% of an aromatic dihalide different from terephthalic acid, and/or an aliphatic dicarboxylic acid, (4) 5-30 mol% of a diamine selected from B a group consisting of diamine, propylenediamine, butanediamine, and pentanediamine, (d) 20-45% of a diamine including at least 6C atoms, and optionally, (e) 0-10% by mole Or a compound having a monofunctional or trifunctional nature in the amine group and/or the carboxylic acid group; or a plurality of amine carboxylic acids and/or decylamine and (f) 0-3 mole %; Each of a-f relative to the total mole% based a_f. It has been found that translucent or transparent products according to this embodiment can be easily produced using moderate hot water molding conditions, i.e., the temperature of the mold is controlled by hot but not boiling water, thus eliminating the need to apply high pressure. Even if the semicrystalline polyamide has a melting temperature as high as 325 ° C and is used in a considerable amount in a composition including glass fibers, a second polymer (such as amorphous polyamine) is not required. , still available in transparent or translucent products. Despite the crystallization and crystallization caused by heating, the 疋 transmittance is maintained to a high degree after the product is heated (for example, after passing through three lead-free reflow soldering curves). Preferably, in the embodiment wherein the semi-crystalline polyamine (A) has a refining temperature (Tm-A) in the range of 290-335 ° C, more preferably in the range of 310-330 ° C. A higher melting temperature can be achieved, for example, by using a higher amount of component (a) and/or component (c) in the semicrystalline semiaromatic copolyamine of the above embodiment. 12 201035240 The amount of component af present in the examples (individually or in combination with each other) is preferably: (a) 35-45 mole %; (b) 5-15 mole %; (c) 10-25 Mole%; (d) 15-25 mol%; (e) 〇-5 mol%; and (〇0-1 mol%, wherein each af molar % relative to total a_f. respectively relative to (8) And (c), a greater amount of (a) and (d) results in better processing of the polymer and better high temperature properties. In another preferred embodiment, the semi-crystalline semi-aromatic copolyamide The polycarboxylate has a density of at least 1.15, preferably at least 1.20 or even 1.25. Higher density results in a higher refractive index, which is an advantage when the POI-assembly is used, for example, as a lens. In particular, no glass The composition of the fibers and fillers is suitable for the preparation of lenses. « , similarly, in the case of POI components that are in direct contact with the glass fibers for attachment to the remote source and/or photosensor, preferably the thermoplastic polymer is The composition has a density of at least 1.20, preferably at least 13 or even 1.40. The advantage of higher density is the light leakage at the interface of the component_glass fiber. This higher density can be achieved with higher levels of glass fibers and fillers and especially with higher density semi-crystalline semi-aromatic copolyamine polymers. Thermoplastic polymer compositions for POI modules A second polymer may be included which is next to the semi-crystalline semi-aromatic polyamine. The second polymer may be any polymer or combination of polymers, if the second polymer and the semi-crystalline semi-aromatic polyamine If the weight ratio is at most i, and the amount of the second polymer is further, the melting temperature (TgC) of the thermoplastic polymer composition is maintained at least 270. The light transmission of the transparent portion of the P0I component is maintained. The degree is maintained at least 6% by weight according to the method of a. 201035240 D1003A. Preferably, the second polymer is selected from the group consisting of polyamine-soluble polymers such as other polyamines, and if so, The amount used is preferably limited. The second polymer (8) suitably comprises, or even consists of, an amorphous semi-aromatic polyamine and/or a semi-U aliphatic or semi-secreting temperature below 27 (rc) Di-sweet polyamine composition. Use of this amorphous or low-grade The semi-crystalline polyamine has good compatibility with the semi-crystalline polyamine (A). _ The advantage of easy processing of the semi-crystalline polyamine amine at a temperature higher than the melting temperature at which the component (10) of the present invention is produced. The polyamidamine has an advantage that the light transmittance will be enhanced. An example of such a low-melting semi-crystalline polyamine which can be suitably used in the present invention is polyamine-6 or polyamine 66. Suitable non- Crystalline polyamines include amorphous polyamine 6I/6T copolymers' amines.
可以使用之第二聚合物（Β)的量根據半晶質半芳香族 聚醯胺(Α)及第二聚合物(β)的性質，兩者皆為半晶質或是一 者為半晶質而另一者為非晶質，半晶質聚合物的熔化溫度 U 及兩聚合物之間的相容性不同而不同。 特別地，與較高融點（例如與Tm-a在300-340°C範圍）The amount of the second polymer (Β) that can be used depends on the nature of the semi-crystalline semi-aromatic polyamide (Α) and the second polymer (β), both of which are semi-crystalline or one is semi-crystalline. The other is amorphous, and the melting temperature U of the semi-crystalline polymer and the compatibility between the two polymers are different. In particular, with higher melting points (eg with Tm-a in the range of 300-340 ° C)
的半晶質聚醯胺結合，第二聚合物(B)的量可較多，而依然 保持具有良好的產品性質。與較低融點（例如與Tm-A在 280-300°C範圍）的半晶質聚醯胺(A)結合，該可使用但依然 為具體的數量同時維持熱塑性聚合物組成物的熔化溫度 Tm-C在270-340°C的範圍。於半晶質聚醢胺(A)的Tm-A 14 201035240 在27〇-280 C跑圍下’弟一聚合物的存在對於熱塑性聚合 物組成物的熔化溫度Tm-C將是關鍵的，而且第二聚合物 的量較佳地係非常的低，如果不是完全欠缺的話。 合適地，第二聚合物存在的量為l_4〇wt.%或更嚴格的 10-25wt·%。第二聚合物較佳的量為，若有的話，落在〇 -25wt.%的範圍，更佳的，〇-i〇wt %，此處重量百分比，如 通篇說明書所示，係相對於熱塑性聚合物組成物的總重， 除非另有清楚說明。 低篁的第一聚合物的優點為更佳的機械及熱性質。較 佳的性質在升高的溫度及/或在潮濕狀況下會具有更加的 抗蠕變性、較高機械強度與更佳的尺寸穩定性。 用於POI組件的組成物可包括玻璃纖維及玻璃填充 物。玻璃纖維可為用於聚醯胺模製組成物的任何辅助玻璃 纖維。玻璃填充物可包括玻璃球及/或玻璃片兩者。只要適 用於模製組成物，也可為任何的修改。合適地，這些纖維 及填充物的橫切面具有最多20μπι的最大厚度，較佳地最 多15μηι ’及合適的至少1〇〇 nm，較佳地至少ιμιη。 玻璃纖維及玻璃填充物的存在量可在大範圍内變化， 其可相對於熱塑性聚合物組成物總重高至5〇wt %，或甚至 較高。較佳地，該數量最多為40wt·%，及較佳地在5_3〇wt % 範圍内。 用於POI組件的組成物可包括其他添加劑，其可為任 何用在1酿胺換製組成物上的輔助添加劑，只要選擇的添 加劑等級及其使用的數量使得POI組件之可透光部的透光 201035240 度依據ASTMD1003A的方法測量保持於至少6〇%即可。 合適的，熱塑性聚合物組成物包括至少一添加劑，其 選自由塑化劑、穩定劑、染料、光學增亮劑、著色劑、潤 滑劑、奈米等級的填充劑組成的群組，較佳地添加劑包括 熱穩定劑及/或奈米等級的填充劑。 合適地，添加劑組合的存在數量落在〇_1〇加％的範圍 内。較佳地該數量落在〇 〇i_2wt %範圍内，更佳地 O.l-l.Owt.%。此處的wt.%為相對於組成物的總重。 於一依據本發明之P0I_組件的合適實施例中，熱塑性 聚合物組成物由下述組成： (A) 40-95wt.%的半晶質半芳香族聚醯胺， (B) 〇-40wt.%的第二聚合物 (C) 5-40wt.%的玻璃填充物及/或纖維 (D) 0.01-lOwt·%的至少一添加劑 其中wt.%為相對於熱塑性聚合物組成物的總重（而且A、B 及C組合的數量為1〇〇%)。 此實施例可與任何的其他特性結合，依據本發明之p 〇】 組件的較佳特性為此處描述者。 本發明也關於製備依據本發明之POI-組件的方法，或 其車X佳的實施例。此方法包括數個步驟，其中熱塑性聚合 物組成物包括熔化溫度(Tm_A)至少27〇〇c與玻璃轉換溫度 (Tg-A)的半晶質半芳香族聚醯胺(A)，該熱塑性聚合物組成 物被、熔融加工並射入模具空腔中，其中空腔包括具有最大 寬度3 mm的斷面，而且模具的溫度(Tm〇)低於Tg A至少 201035240 20°C。 • 該方法可典型上包括脫模步驟，其中如此形成的射出 模製部由模具中取出。 該方法可有利地包括另一步驟，其中射出的模製產 品，在脫模之後，被置於半晶質半芳香族聚醯胺玻璃轉換 溫度Tg及熔化溫度Tm之間的温度中，藉此弓丨發結晶化及 /或更形增加結晶度。 0 此方法不僅適於製備POI組件，也適於製備包括透光 度至少60 %之部件的任何射出模製產品。 該方法也可用於將POI組件直接模製在想要用於光學 連線裝置的另一組件上。 ， 本發明也關於該方法可獲得的射出模製產品。 射出模製產品可具有任何進一步的特性或這些特性的 組合，如上述POI組件及其任一較佳實施例所專有者。 本發明POI組件的使用不限於特別的用途。它可用於 Q 光學連線技術，其中發送器組件位於光源與光感測器之 間。POI也可用作LED指示器的外殼或行動電話及其他應 用中之LCD顯示器的屏蔽蓋板。 匕可用於元全光學連線以及用於光學/電子混合連 線。在電子系統(諸如PCB)中，常常應用牵涉熱焊接使用 的表面安裝技術(SMT)。依據本發明的POI組件具有在此 種SMT方法中所使用的升高溫度下仍能維持良好的優點。 據此，POI組件也可為連接器或插座或其等的部件。 POI組件也可用於晶片至晶片以及晶片上連線。 201035240 它也可適合為具有-或多個光學貫穿孔的立體連線。 立體連線可非«合構成晶片❹數^之-的外殼，其 具有直接向刚面向光傳送器頻道或光傳送器接收器的光學 貫穿孔，即可透光部。本發明卿組件的良好尺寸穩定性 也有助於光學連線總成中各類組件的精確對準。 POI組件也可时使光學波導(諸如光纖)與另一光學 波導、光二極體或光學感測器連接的光學連接器。 包括依據本發明POI組件的光學連線總成或裝置可用 於例如光學數位電腦、開關、中繼設備、印刷板。 依據本發明之具有可透光部的射出模製產品或依據本 發明方法所製造的射出模製產品也可用於光學感測器。射 出模製產品也可用於任何發光應用中，其中光源為可透光 護罩所保護。合適地，射出模製產品用於發光元件中，諸 如LED反射器、外殼、擾頻器、led光源的初級或次級光 學元件、燈基座、LED基板、LED外殼或模組 '燈安裝元 件、反射器板、自動發光系統的反射器，感測器外殼。The semi-crystalline polyamine binds, and the amount of the second polymer (B) is large, while still maintaining good product properties. In combination with a semi-crystalline polyamine (A) having a lower melting point (for example, in the range of 280-300 ° C with Tm-A), which can be used but still in a specific amount while maintaining the melting temperature of the thermoplastic polymer composition Tm-C is in the range of 270-340 °C. Tm-A 14 of semi-crystalline polyamine (A) 201035240 The presence of a polymer in the range of 27〇-280 C will be critical for the melting temperature Tm-C of the thermoplastic polymer composition, and The amount of the second polymer is preferably very low, if not completely lacking. Suitably, the second polymer is present in an amount of from 1 to 4% by weight or more preferably from 10 to 25 % by weight. The preferred amount of the second polymer, if any, falls within the range of 〇-25 wt.%, more preferably 〇-i〇wt%, where the weight percentage, as indicated throughout the specification, is relative The total weight of the thermoplastic polymer composition, unless explicitly stated otherwise. The advantage of a low enthalpy first polymer is better mechanical and thermal properties. The preferred properties will have greater creep resistance, higher mechanical strength and better dimensional stability at elevated temperatures and/or under wet conditions. Compositions for the POI assembly can include fiberglass and glass fillers. The glass fiber can be any auxiliary glass fiber used in the polyimide molding composition. The glass filler can include both glass spheres and/or glass sheets. Any modification can be made as long as it is suitable for molding the composition. Suitably, the cross-sections of the fibers and filler have a maximum thickness of at most 20 μm, preferably at most 15 μm and preferably at least 1 μm, preferably at least 1 μm. The amount of glass fiber and glass filler present can vary over a wide range, which can be as high as 5 〇 wt %, or even higher, relative to the total weight of the thermoplastic polymer composition. Preferably, the amount is at most 40 wt.%, and preferably in the range of 5 to 3 wt%. The composition for the POI component may include other additives, which may be any auxiliary additive used on the 1 amine-substituted composition, as long as the selected additive grade and the amount thereof are used to make the permeable portion of the POI component transparent. The light 201035240 degree can be kept at least 6〇% according to the method of ASTM D1003A. Suitably, the thermoplastic polymer composition comprises at least one additive selected from the group consisting of plasticizers, stabilizers, dyes, optical brighteners, colorants, lubricants, nanoscale fillers, preferably Additives include heat stabilizers and/or nanoscale fillers. Suitably, the amount of additive combination present falls within the range of 〇_1〇 plus %. Preferably, the amount falls within the range of 〇 〇 i_2 wt %, more preferably O.l-l.Owt.%. The wt.% here is the total weight relative to the composition. In a suitable embodiment of the POI_assembly according to the invention, the thermoplastic polymer composition consists of: (A) 40-95 wt.% of semi-crystalline semi-aromatic polyamide, (B) 〇-40 wt .% of the second polymer (C) 5-40 wt.% of glass filler and / or fiber (D) 0.01 - 10 wt% of at least one additive wherein wt.% is relative to the total weight of the thermoplastic polymer composition (And the number of combinations of A, B, and C is 1%). This embodiment can be combined with any of the other features, and preferred features of the components in accordance with the present invention are described herein. The invention is also directed to a method of making a POI-assembly according to the invention, or a preferred embodiment thereof. The method comprises several steps wherein the thermoplastic polymer composition comprises a semicrystalline semi-aromatic polyamine (A) having a melting temperature (Tm_A) of at least 27 〇〇c and a glass transition temperature (Tg-A), the thermoplastic polymerization The composition is melt processed and injected into the mold cavity, wherein the cavity comprises a section having a maximum width of 3 mm and the temperature of the mold (Tm 〇) is lower than Tg A by at least 201035240 by 20 °C. • The method can typically include a demolding step wherein the injection molding portion thus formed is removed from the mold. The method may advantageously comprise the further step wherein the injected molded product, after demolding, is placed in a temperature between the semi-crystalline semi-aromatic polyamide glass transition temperature Tg and the melting temperature Tm, whereby The bow bursts crystallize and/or increases the crystallinity. 0 This method is not only suitable for the preparation of POI components, but is also suitable for the preparation of any injection molded product comprising parts having a transmittance of at least 60%. This method can also be used to mold a POI component directly onto another component that is intended for use in an optical wiring device. The invention also relates to an injection molded product obtainable by the method. The injection molded product can have any further characteristics or a combination of these characteristics, such as those described above for the POI assembly and any of its preferred embodiments. The use of the POI assembly of the present invention is not limited to a particular use. It can be used in Q optical wiring technology where the transmitter component is located between the light source and the light sensor. The POI can also be used as a housing for LED indicators or as a shield for LCD displays in mobile phones and other applications.匕 can be used for all-optical optical wiring and for optical/electronic hybrid wiring. In electronic systems such as PCBs, surface mount technology (SMT) involving the use of heat soldering is often applied. The POI assembly in accordance with the present invention has the advantage of still maintaining good temperatures at the elevated temperatures used in such SMT processes. Accordingly, the POI component can also be a component of a connector or socket or the like. POI components can also be used for wafer-to-wafer and on-wafer wiring. 201035240 It can also be adapted as a stereo connection with - or multiple optical through holes. The three-dimensional connection may not be an outer casing that constitutes a number of wafers, and has an optical through-hole directly facing the optical transmitter channel or the optical transmitter receiver, that is, a light-transmitting portion. The good dimensional stability of the inventive assembly also contributes to the precise alignment of the various components of the optical wiring assembly. The POI component can also be an optical connector that connects an optical waveguide, such as an optical fiber, to another optical waveguide, optical diode, or optical sensor. Optical wiring assemblies or devices including POI assemblies in accordance with the present invention can be used, for example, in optical digital computers, switches, relay devices, printed boards. The injection molded product having the light permeable portion according to the present invention or the injection molded product manufactured according to the method of the present invention can also be used for an optical sensor. Injection molded products can also be used in any lighting application where the light source is protected by a light transmissive shield. Suitably, the injection molded product is used in a light-emitting element, such as an LED reflector, a housing, a scrambler, a primary or secondary optical component of a led light source, a lamp base, an LED substrate, an LED housing or a module 'light mounting component , reflector plate, reflector of automatic illumination system, sensor housing.
【實施方式J 本發明以下述實例進一步說明。 材料 由半芳香族共聚醯胺(69.5wt.%)、玻璃纖維(30wt.%)與 添加劑組成物(〇.5wt·%)組成的聚醯胺組成物。 半芳香族共聚醯胺為聚醯胺6T/46，比例約75/25、Tm 305°C、Tg 117°C、RV 1.9。玻璃纖維為用於聚醯胺的標準 類型玻璃纖維。添加劑組成物包括輔助的加工助劑及熱穩 18 201035240 定劑。 模製 聚醯胺組成物加進饋出器中，加熱及在溫度330°C下 熔融加工並射入用於製造開關罩殼的模具空腔中。模具溫 度為70°C。空腔及對應的罩殼具有約5x5 mm的側面尺寸， 厚度約1 mm的平面部分及厚度約2 mm的側面部分。罩 殼由模具中取下並冷卻至室溫。 性質 所得的罩殼係半透明的，而平面部分的透光度約70%。 I：圖式簡單說明3 (無） 【主要元件符號說明】[Embodiment J] The present invention is further illustrated by the following examples. Material Polyamine composition consisting of a semi-aromatic copolymerized decylamine (69.5 wt.%), glass fiber (30 wt.%) and an additive composition (〇.5 wt.%). The semi-aromatic copolyamine was polyamine 6T/46 in a ratio of about 75/25, Tm 305 ° C, Tg 117 ° C, and RV 1.9. Glass fiber is the standard type of glass fiber used in polyamines. The additive composition includes an auxiliary processing aid and heat stabilizer 18 201035240. The molded polyamine composition was introduced into a feeder, heated and melt processed at a temperature of 330 ° C and injected into a mold cavity for manufacturing the switch housing. The mold temperature was 70 °C. The cavity and corresponding casing have a side dimension of about 5 x 5 mm, a planar portion having a thickness of about 1 mm, and a side portion having a thickness of about 2 mm. The casing is removed from the mold and cooled to room temperature. The resulting shell is translucent and the flat portion has a light transmission of about 70%. I: Simple description of the diagram 3 (none) [Explanation of main component symbols]