TW201035168A - Aromatic polyester amide copolymer, polymer film, prepreg, prepreg laminate, metal clad laminate and printed circuit board - Google Patents

Aromatic polyester amide copolymer, polymer film, prepreg, prepreg laminate, metal clad laminate and printed circuit board Download PDF

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Publication number
TW201035168A
TW201035168A TW98145785A TW98145785A TW201035168A TW 201035168 A TW201035168 A TW 201035168A TW 98145785 A TW98145785 A TW 98145785A TW 98145785 A TW98145785 A TW 98145785A TW 201035168 A TW201035168 A TW 201035168A
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Taiwan
Prior art keywords
prepreg
repeating unit
copolymer
aromatic polyester
aromatic
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TW98145785A
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Chinese (zh)
Inventor
Bon-Hyeok Gu
Tae-Jun Ok
Chung-Won Park
Young-Taek Oh
Dmitry N Kravchuk
Mahn-Jong Kim
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Samsung Fine Chemicals Co Ltd
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Publication of TW201035168A publication Critical patent/TW201035168A/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44Polyester-amides
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/0145Polyester, e.g. polyethylene terephthalate [PET], polyethylene naphthalate [PEN]

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Polyamides (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

An aromatic polyester amide copolymer, a polymer film, a prepreg, a prepreg laminate, a metal clad laminate, and a printed circuit board. The aromatic polyester amide copolymer including 20 to 25 mol% of a repeat unit A derived from an aromatic diol based on the total repeat units therein, wherein the repeat unit A comprises a repeat unit RCN derived from resorcinol and a repeat unit HQ derived from at least one of biphenol and hydroquinone.

Description

201035168 J342ipif.doc 六、發明說明: 【相關申請案】 本申請案主張2008年12月31曰於韓國智慧財產局 提出申請之韓國專利申請案第1〇_2〇〇8-〇138702號的權 益,此案之全文併入本案供參考。 【發明所屬之技術領域】 本發明是有關於一種芳香族聚酯醯胺共聚合物、聚合 物膜、預浸體、預浸積層板、金屬包層積層板以及印刷電 路板’且特別是有關於一種芳香族聚酯醯胺共聚合物、包 括所述芳香族聚酯醯胺共聚合物的聚合物膜、預浸體及預 浸積層板以及包括所述預浸體或所述預浸積層板的金屬包 層積層板及印刷電路板,其中所述芳香族聚酯醯胺共聚合 物基於其中所有重複單元包括約20莫耳百分比至約25莫 耳百分比的重複單元A,所述重複單元A衍生自芳香族二 醇,且所述重複單元A包括衍生自間苯二酚的重複單元 RCN及衍生自二酚及對苯二酚中至少一者的重複單元 HQ。 【先前技術】 根據近來電子設備的微型化(miniaturization)和多功能 化(multifunctionalization),目前已積極研究印刷電路板的 高緻密化(densification)以及微型化。由於銅包層積層板 (copper clad laminates)具有優良的衝壓加工性(stamping processability)、鑽孔加工性(drill processability)以及低成 本,銅包層積層板被普遍用作電子設備的印刷電路板的基 201035168 xpif.doc 材。 在用於印刷電路板的鋼包層積層板中,所使用的預浸 體應具有以下重要特性,以達到良好的半導體性能 (performances)以及符合半導體封裝製造條件(package manufacturing conditions) ° (1) 相對於金屬(積體電路(1C)晶片)的熱膨脹係數,其 具有低熱膨脹係數; (2) 在1GHz或更大的高頻範圍中,其具有低介電特性 ® 以及介電穩定性;以及 (3) 對於在大約270 °C時進行的回流焊接製程(refl〇w process)的耐熱性(heat resistance)。 預汉體疋藉由使用衍生自環氧類樹脂(ep〇Xy)或雙順 丁烯二酸醯亞胺-三氮雜苯(bismaieimidetriazine)的樹脂 (resin)來浸潰玻璃布(glass fabric)及接著對此樹脂進行半硬 化而製備的。然後,將銅包層堆疊在預浸體上以及將樹脂 完全硬化,以形成銅包層積層板。此銅包層積層板會形成 Ο 為一薄層,然後經受高溫製程,諸如在27(TC進行的回流 焊接製程。當對薄層形式的銅包層積層板進行高溫製程 時,因為預浸體的熱膨脹係數與銅包層積層板的熱膨脹係 數不同,因此銅包層積層板可能會熱變形而導致產量減 少。此外,衍生自環氧類樹脂或雙順丁烯二酸醯亞胺·三氮 雜苯的樹脂的高吸濕性(hygroscopicity)會被降低。特別 是,樹脂在1GHz或更大的高頻範圍時具有較差的介電特 性(即在尚頻範圍内具有咼介電常數)。由於印刷電路板需 201035168 ^*^42 ipif.doc 進行向頻率及冑速製程,目此難㈣此細旨應肖於半導體 封裝的印刷電路板。因此,需要開發出具有低介電常數的 預浸體。 近來使用芳香族聚醋樹月旨(作為衍生自環氧類樹脂或 雙:,丁烯二魏亞胺_三氮雜笨的細旨的另―轉)來製備 預浸體。此職體可以藉由❹㈣族㈣觸來浸潰有 機的或無機的織物(fabrie)來製備。且特別是,芳香族聚醋 預浸體可以使料香絲輯脂以及㈣族聚§旨織物來製 備詳《之,使芳香族聚酯樹脂溶解於包含鹵族元素(諸如 C1)的/谷劑中,以製備洛液組成物c〇mp沉^〇η),接 著以此溶賴成物來浸潰㈣族聚g|織物,錢使所產生 的產物(resulting product)乾燥以製備芳香族聚酯預浸體。 然而’在此方》中,難以完全移除包含齒族元素的溶劑, 因而鹵族it素會腐钱銅包層。因此,需要開發—種使用非 鹵素溶劑來製備芳香族聚酯預浸體的方法。 【發明内容】 本發明提供一種芳香族聚酯醯胺共聚合物,具有低熱 膨脹係數、低介電常數以及低介電損耗。 ”' 本發明亦提供一種預浸體及一種預浸積層板,其包括 所述芳香族聚酯醢胺共聚合物。 八 本發明亦提供一種金屬包層積層板及一種印刷電路 板’其包括所述預浸體或所述預浸積層板。 根據本發明之-方面,提供-種芳香族聚g旨醯胺共聚 合物。此芳香族聚酯醯胺共聚合物基於其中所有重複& = j^Hzipif*d〇c 201035168 包括約20莫耳百分比至約25莫耳百分比的重複單元a, 所述重複單元A衍生自芳香族二醇(ar〇matic diol),且所述 重複單元A包括衍生自間苯二齡(resorcin〇i)的重複單元 RCN及竹生自二紛(biphenol)及對苯二盼(hydroquinone)中 至少一者的重複單元HQ。 所述重複單元RCN及所述重複單元HQ的量可符合 以下條件: 〇 < n(RCN)/[n(RCN)+n(HQ)] < 1 , 〇 其中n(RCN)及n(HQ)分別代表所述芳香族聚g旨酿胺 共聚合物的所述重複單元RCN及所述重複單元HQ的莫耳 數。 芳香族聚酯醯胺共聚合物基於所有重複單元可更包 括約2莫耳百分比至約25莫耳百分比的重複單元b,所述 重複單元B衍生自芳香族經敌酸(ar〇matic hydroxy carboxylic acid) ° 芳香族聚酯醯胺共聚合物基於所有重複單元可更包 〇 括約20莫耳百分比至約25莫耳百分比的至少一重複單 元’所述至少一重複單元選自由重複單元C及重複單元c, 所組成之族群,其中所述重複單元C衍生自具有酚性羥基 (phenolic hydroxyl group)的芳香族胺(aromatic amine),以 及所述重複單元C’衍生自方香族二胺(aromatic diamine)。 芳香族聚酯醯胺共聚合物可更包括約35莫耳百分比 至約48莫耳百分比的重複單元D,所述重複單元D衍生 自芳香族二竣酸(aromatic dicarboxylic acid)。 201035168 334Zlpif.doc 根據本發明之另一方面,提供一種包括所述芳香族聚 酯醯胺共聚合物的聚合物膜。 根據本發明之另一方面,提供一種預浸體,其包括浸 潰有所述芳香族聚酯醯胺共聚合物的基材。 根據本發明之另一方面,提供一種預浸積層板,其包 括至少二所述預浸體。 根據本發明之另一方面,提供一種金屬包層積層板, 其包括預浸體以及配置於所述預浸體之至少一表面上的至 少一金屬薄膜。 根據本發明之另一方面,提供一種印刷電路板,藉由 姓刻所述金屬包層積層板的所述金屬薄膜來製備。 根據本發明之另一方面’提供一種印刷電路板,藉由 將金屬電路圖案印刷於所述聚合物膜的至少一表面上來製 備。 為讓本發明之上述特徵和優點能更明顯易懂,下文特 舉實施例’並配合所附圖式作詳細說明如下。 【實施方式】 以下,將詳述根據本發明之一實施例的芳香族聚酯醯 胺共聚合物以及包括浸潰有芳香族聚酯醯胺共聚合物的基 材的預浸體。 根據本發明之一實施例,芳香族聚酯醯胺共聚合物基 於其中所S重複單元包括、約20莫耳百分比至約μ莫耳百 分比的重複單元A,重複單元A衍生自芳香族二醇,且曹 複單元A包括衍生自間苯二酚的重複單元rcn及衍生自 ipif.doc ❹ ❹ 201035168 I酚及對苯—时至少—者的錢單元201035168 J342ipif.doc VI. Description of the invention: [Related application] This application claims the rights of Korean Patent Application No. 1〇_2〇〇8-〇138702, filed on December 31, 2008 by the Korea Intellectual Property Office. The full text of this case is incorporated into this case for reference. TECHNICAL FIELD OF THE INVENTION The present invention relates to an aromatic polyester guanamine copolymer, a polymer film, a prepreg, a prepreg, a metal clad laminate, and a printed circuit board, and in particular An aromatic polyester guanamine copolymer, a polymer film comprising the aromatic polyester guanamine copolymer, a prepreg and a prepreg, and the prepreg or the prepreg layer a metal clad laminate of a board and a printed circuit board, wherein the aromatic polyester guanamine copolymer comprises repeating units A based on all of the repeating units comprising from about 20 mole percent to about 25 mole percent, the repeating unit A is derived from an aromatic diol, and the repeating unit A includes a repeating unit RCN derived from resorcinol and a repeating unit HQ derived from at least one of diphenol and hydroquinone. [Prior Art] According to recent miniaturization and multifunctionalization of electronic devices, high densification and miniaturization of printed circuit boards have been actively studied. Copper clad laminates are commonly used as printed circuit boards for electronic devices because of the excellent stamping processability, drill processability, and low cost of copper clad laminates. Base 201035168 xpif.doc material. In ladle laminates for printed circuit boards, the prepregs used should have the following important characteristics to achieve good semiconductor performance and compliance with package manufacturing conditions (1) Relative to the coefficient of thermal expansion of the metal (integrated circuit (1C) wafer), which has a low coefficient of thermal expansion; (2) it has low dielectric properties® and dielectric stability in the high frequency range of 1 GHz or more; (3) Heat resistance for a reflow process at about 270 °C. The precursor is impregnated with a glass fabric by using a resin derived from an epoxy resin (ep〇Xy) or a bismaieimidetriazine (bismaieimidetriazine). And then prepared by semi-hardening the resin. Then, a copper clad layer was stacked on the prepreg and the resin was completely hardened to form a copper clad laminate. The copper clad laminate will be formed into a thin layer and then subjected to a high temperature process, such as a reflow soldering process at 27 (TC). When the copper clad laminate in the form of a thin layer is subjected to a high temperature process, the prepreg is used. The coefficient of thermal expansion is different from the coefficient of thermal expansion of the copper clad laminate, so the copper clad laminate may be thermally deformed to cause a decrease in yield. Further, it is derived from an epoxy resin or bismuthimide and trisodium sulfoxide. The hygroscopicity of the resin of the heterobenzene is lowered. In particular, the resin has poor dielectric properties at a high frequency range of 1 GHz or more (i.e., has a 咼 dielectric constant in a frequency range). Since the printed circuit board needs 201035168 ^*^42 ipif.doc for the frequency and idle process, it is difficult. (4) This purpose should be applied to the printed circuit board of the semiconductor package. Therefore, it is necessary to develop a pre-dielectric constant. Dip. Recently, a prepreg has been prepared using an aromatic polyacetate (as a derivative derived from an epoxy resin or a double:, butene diimine-triazole). The body can be touched by the 四(四)族(四) It is prepared by impregnating organic or inorganic fabrics. In particular, the aromatic polyacetal prepreg can be prepared by using a scented silk and a (four) family of fabrics to prepare the aromatic poly The ester resin is dissolved in a granule containing a halogen element (such as C1) to prepare a liquid composition c〇mp 〇 〇 )), and then the lyophilized product is used to impregnate the (four) group poly g | fabric, The resulting product is dried to prepare an aromatic polyester prepreg. However, in the "in this side", it is difficult to completely remove the solvent containing the tooth element, and thus the halogenated itin will rot the copper cladding. Therefore, there is a need to develop a process for preparing an aromatic polyester prepreg using a non-halogen solvent. SUMMARY OF THE INVENTION The present invention provides an aromatic polyester guanamine copolymer having a low coefficient of thermal expansion, a low dielectric constant, and a low dielectric loss. The present invention also provides a prepreg and a prepreg laminate comprising the aromatic polyester guanamine copolymer. The invention also provides a metal clad laminate and a printed circuit board. The prepreg or the prepreg layer. According to an aspect of the invention, there is provided an aromatic polyglycol amine copolymer. The aromatic polyester guanamine copolymer is based on all repeats & = j^Hzipif*d〇c 201035168 comprising from about 20 mole percent to about 25 mole percent of repeating unit a, said repeating unit A being derived from an aromatic diol (ar〇matic diol), and said repeating unit A A repeating unit HQ derived from resorcin〇i and a repeating unit HQ derived from at least one of biphenol and hydroquinone. The repeating unit RCN and the repeat The amount of the unit HQ may satisfy the following conditions: 〇 < n(RCN) / [n(RCN) + n(HQ)] < 1 , 〇 where n(RCN) and n(HQ) respectively represent the aromatic poly g The number of moles of the repeating unit RCN of the amine copolymer and the repeating unit HQ. The amine copolymer may further comprise from about 2 mole percent to about 25 mole percent of repeating unit b based on all repeating units derived from aromatic ar 〇 hydroxy carboxylic acid ° aromatic The polyester guanamine copolymer may further comprise at least one repeating unit based on all repeating units from about 20 mole percent to about 25 mole percent. The at least one repeating unit is selected from the group consisting of repeating unit C and repeating unit c. a group of constituents wherein the repeating unit C is derived from an aromatic amine having a phenolic hydroxyl group, and the repeating unit C' is derived from an aromatic diamine. The family polyester guanamine copolymer may further comprise from about 35 mole percent to about 48 mole percent of repeating unit D derived from aromatic dicarboxylic acid. 201035168 334Zlpif.doc In another aspect of the invention, there is provided a polymer film comprising the aromatic polyester guanamine copolymer. According to another aspect of the invention, a prepreg is provided It comprises a substrate impregnated with the aromatic polyester guanamine copolymer. According to another aspect of the invention, there is provided a prepreg layer comprising at least two of said prepregs. In one aspect, a metal clad laminate is provided that includes a prepreg and at least one metal film disposed on at least one surface of the prepreg. According to another aspect of the present invention, there is provided a printed circuit board prepared by casting the metal thin film of the metal clad laminate. According to another aspect of the present invention, a printed circuit board is provided which is prepared by printing a metal circuit pattern on at least one surface of the polymer film. The above described features and advantages of the present invention will become more apparent from the description of the appended claims. [Embodiment] Hereinafter, an aromatic polyester phthalamide copolymer according to an embodiment of the present invention and a prepreg comprising a substrate impregnated with an aromatic polyester decylamine copolymer will be described in detail. According to an embodiment of the present invention, the aromatic polyester guanamine copolymer is based on repeating unit A in which the S repeating unit comprises, about 20 mole percent to about μ molar percentage, and repeating unit A is derived from aromatic diol And Caofu unit A includes a repeating unit rcn derived from resorcinol and a money unit derived from ipif.doc ❹ ❹ 201035168 I phenol and benzene-at least

物、於㈣耳百綱,芳香IS Λ劑中的溶解度會降低。在另-方面, ^複皁兀Α基於所有重複單元的含量大於25 比% ’ Μ族聚_胺共聚合物的熔點會變得過高。 此外’在方香族聚醋醯胺共聚 :耳一及重複單元Η轉耳數二:= 〇 < n(RCN)/[n(RCN)+n(HQ)] < \. — 聚共聚合物基於其f所有重複單 B重糾簡25料百分㈣重複單= 重複早TO B衍生自芳香族羥羧酸。 分比5重^以基於所有重複單元的含量少於2莫耳百 =叫’方香族聚醋醯胺共聚合物的機械強度會降低。在 方面’當重複單元B基於所有重複單元的含量大於U 、=比時,芳香族聚酯醯胺共聚合物的熱特性會降低。 朴元B可包括衍生自龜基苯甲酸咖 ::二=ΐ 甲酸(2_hyd~^^ 旨雜共聚合物基於所有重複單元可更包 一 '、'、、耳百分比至約25莫耳百分比的至少一重複單 所组成~重複單兀選自由4複單元C及重複單元C’ 群’其中所述重複單μ衍生自具有盼性減 的方香族胺,以及所述重複單it C,衍生自芳香族二胺。 201035168 334/ipif.doc 人曰,重複單元C及重複單元C,基於所有重複單元的總 含里少於20莫耳百分比時,芳香族聚酯醯胺共聚合物在溶 劑中的溶解度會降低。在另一方面,當當重複單元c及重 複單元C’基於所有重複單元的總含量大於25莫耳百分比 時,芳香族聚酯醯胺共聚合物的溶點會變得過高。 重複單元C可包括衍生自選自由3_胺苯酚 (3-aminophenol)、4-胺苯酚(4-aminophenol)及 2-胺基-6-奈 酚(2-amino-6_naphthol)所組成之族群中的至少一化合物的 重複單元。重複單元C,可包括衍生自選自由i,4_苯二胺 (1,4 phenylene diamine)、1,3-笨二胺(i,3-phenylene diamine) 及2,6·奈一胺(2,6_naphthalene diamine)所組成之族群中的 至少一化合物的重複單元。 芳香族聚酯醯胺共聚合物基於所有重複單元可更包 括約35莫耳百分比至約48莫耳百分比的重複單元D,重 複單元D衍生自芳香族二羧酸。 當重複單元D基於中所有重複單元的含量少於%莫 耳百为比%•,方香族聚醋酿胺共聚合物在溶劑中的溶解度 會降低。在另一方面,當重複單元D基於所有重複單元的 含量大於48莫耳百分比時’芳香族聚酯醯胺共聚合物的抗 熱性(heat resistance)、低熱膨脹特性以及低介電特性會被 破壞。 重複單元D可包括衍生自選自由異笨二曱酸 (isophthalic acid)、奈系二羧酸(naphthalene acid)及對苯二曱酸(terephthalic acid)所組成之族群中的至 10 201035168 ipif.doc 少一化合物的重複單元。 特別是,芳香族聚酯醯胺共聚合物的每一重複單元可 用下式之一來表示: (1)衍生自芳香族二醇的重複單元A : <式1>The solubility of the substance in the (four) ear formula, the aromatic IS tincture will be reduced. In another aspect, the saponin is based on the content of all repeating units greater than 25% by mole. The melting point of the steroidal poly-amine copolymer may become too high. In addition, 'in the fragrant aromatic vinegar copolymerization: ear one and repeating unit Η rotating ear number two: = 〇 < n (RCN) / [n (RCN) + n (HQ)] < \. — The polymer is based on its f repeating single B weight correction 25 percent material (four) repeating single = repeating early TO B derived from aromatic hydroxycarboxylic acid. The fractional ratio of 5 is based on the fact that the content of all repeating units is less than 2 moles. The mechanical strength of the square aromatic polyacetamide copolymer is lowered. In the aspect, when the repeating unit B is based on the content of all the repeating units being greater than the U, = ratio, the thermal properties of the aromatic polyester decylamine copolymer may be lowered. Park Yuan B may include a derivative derived from a tortophenone benzoic acid coffee::2=ΐ formic acid (2_hyd~^^) The heteropolypolymer may be further packaged based on all repeating units, ', ', ear percentage to about 25 mole percentage At least one repeating unit composition - repeating unit is selected from the group consisting of 4 complex units C and repeating unit C' group, wherein the repeating single μ is derived from a square aromatic amine having a decrease in hope, and the repeating single it C is derived. From aromatic diamines 201035168 334/ipif.doc Human 曰, repeat unit C and repeat unit C, based on the total content of all repeat units less than 20 mole percent, aromatic polyester guanamine copolymer in solvent The solubility in the medium will decrease. On the other hand, when the repeating unit c and the repeating unit C' are based on the total content of all the repeating units being more than 25 mol%, the melting point of the aromatic polyester guanamine copolymer becomes The repeating unit C may include a group derived from a group selected from the group consisting of 3-aminophenol, 4-aminophenol, and 2-amino-6-naphthol. a repeating unit of at least one compound. The repeating unit C may be derived from Choose from the group consisting of 1,4 phenylene diamine, 1,3-phenylene diamine and 2,6-naphthalene diamine a repeating unit of at least one compound. The aromatic polyester guanamine copolymer may further comprise from about 35 mole percent to about 48 mole percent of repeat unit D based on all repeat units, and repeat unit D is derived from aromatic dicarboxyl Acid. When the repeating unit D is based on the content of all repeating units less than % Mohr%, the solubility of the Fangxiang polyacetic acid amine copolymer in the solvent is reduced. On the other hand, when the unit is repeated D. The heat resistance, low thermal expansion characteristics, and low dielectric properties of the 'aromatic polyester decylamine copolymer' may be destroyed based on the content of all repeating units being greater than 48 mole percent. The repeating unit D may include derivatization Repeat units of one compound less than 10 201035168 ipif.doc in the group consisting of isophthalic acid, naphthalene acid and terephthalic acid. Yes, aromatic Each repeating unit of the polyester amide amine copolymer can be represented by one of the following formulas: (1) Repeating unit A derived from an aromatic diol: <Formula 1>

Ο <式2>Ο <式2>

〇—-〇—

Ri <式3>Ri <式3>

〈式4&gt;<Formula 4>

11 201035168 ipif.doc (2)衍生自芳香族羥羧酸的重複單元B &lt;式5&gt; -C- Ο &lt;式6&gt; -0— &lt;式7&gt;11 201035168 ipif.doc (2) Repeating unit B derived from aromatic hydroxycarboxylic acid &lt;Formula 5&gt; -C- Ο &lt;Formula 6&gt; -0 - &lt;Formula 7&gt;

12 201035168 ο Ο &lt;式9&gt;•ο—12 201035168 ο Ο &lt;式9&gt;•ο—

Rt R2 -C-IIο (3)衍生自具有酚性羥基的芳香族胺的重複單元C &lt;式 10&gt; -HN- &lt;式 11&gt; -HN- &lt;式 12&gt; -ΗΝ—Rt R2 -C-IIο (3) a repeating unit derived from an aromatic amine having a phenolic hydroxyl group C &lt; Formula 10&gt; -HN- &lt; Formula 11&gt; -HN- &lt;Formula 12&gt;

Ri ——0- R1 R2 13 201035168 (4)衍生自芳香族二胺的重複單元C’ : 〈式 13&gt;Ri ——0- R1 R2 13 201035168 (4) Repeating unit C' derived from aromatic diamine: <Formula 13>

HNHN

NH Ri 〈式 14&gt; -HN- -NH- 〈式 15&gt;NH Ri <Formula 14> -HN- -NH- <Formula 15>

r2 (5)衍生自芳香族二羧酸的重複單元D : 〈式 16&gt; -C- II 0 €--R2 (5) Repeating unit D derived from aromatic dicarboxylic acid: <Formula 16> -C-II 0 €--

RiRi

II 0 14 201035168 ipif.docII 0 14 201035168 ipif.doc

15 201035168 ipn.doc &lt; 式 21&gt;15 201035168 ipn.doc &lt; Equation 21&gt;

〈式 22&gt;<Formula 22>

其中心及R2各自是鹵素原子、綾基、氨基、硝基、 氰基、被取代或未被取代的烷基、被取代或未^取 代的crC2〇烷氧基、被取代或未被取代的C2_C2〇烯基、被 取代或未被取代的CVC^炔基、被取代或未被取代的 CVQo異烷基、被取代或未被取代的q_C3g芳基、被取代 或未被取代的CVQo芳基烧基(aryiaikyi group)、被取代或 未被取代的Cs-C3。異芳基(heteroaryl group)、或被取代或未 被取代的CVCso異芳基烧基(heter〇arylalkyl group)。此處 的“被取代的’’是表示氫原子被鹵素基、羥基、烷基、烷氧 16 201035168 ipif.doc 基、,基或上述基團巾的至少兩者取代。 方香族聚S識胺共聚合物可藉由聚合下列 =)包括卩絲讀、對苯二糾/或二賴料族二醇或其 酉曰^何生物㈣^賴㈣細赠㈣:⑺芳香族經叛酸 i酿:::衍ΐ:;(3)選自由具有盼性羥基的芳香族胺或 切生物、以及芳香族二胺或其醢胺形成衍生物 中的至少一者;以及⑷芳香族二魏或其醋The center and R2 are each a halogen atom, a fluorenyl group, an amino group, a nitro group, a cyano group, a substituted or unsubstituted alkyl group, a substituted or unsubstituted crC2 nonyloxy group, a substituted or unsubstituted C2_C2 Decyl, substituted or unsubstituted CVC alkynyl, substituted or unsubstituted CVQo isoalkyl, substituted or unsubstituted q_C3g aryl, substituted or unsubstituted CVQo aryl An aryiaikyi group, a substituted or unsubstituted Cs-C3. A heteroaryl group, or a substituted or unsubstituted CVCso heteroaryl group. The term "substituted" as used herein means that a hydrogen atom is substituted with at least two of a halogen group, a hydroxyl group, an alkyl group, an alkoxy group, a hydroxy group, an alkoxy group, a radical, or a group of the above-mentioned radicals. The amine copolymer can be polymerized by the following =) including 卩 silk reading, benzoquinone diol or diol diol or its ( 何 organism (four) 赖 四 (four) fine gift (four): (7) aromatic by acid t Brewing::: ΐ:: (3) at least one selected from the group consisting of an aromatic amine or a cut organism having a desired hydroxyl group, and an aromatic diamine or a guanamine derivative thereof; and (4) an aromatic diwei or Vinegar

开&gt; 成何生物。 在方香族二醇的_形成衍生物中,其經基可與羧酸反 應而形成酯鍵。 ,外,芳香族羥羧酸或芳香族二羧酸的酯形成衍生物 可以是高反應性衍生物,諸如酸氯(acidchloride)及酸酐, 或者是,芳香族羥羧酸或芳香族二羧酸的酯形成衍生物可 以與醇類或乙二醇(ethyleneglyc〇1)形成酯鍵。 在芳香族胺或芳香族二胺的醯胺形成衍生物中,其胺 基可以與羧酸形成醯胺鍵。 如上述製備的芳香族聚酯醯胺共聚合物可以溶解於 溶劑中’且其可以是熱向型液晶聚酯醯胺共聚合物,詳言 之,其可在400。(:或更低的溫度範圍下形成光學異向性熔 融(optically anisotropic melt)。特定言之’芳香族聚酯醯胺 共聚合物的熔點可以在約25〇。〇至約400°C的範圍内,以及 其數目平均分子量可以在約1,〇〇〇至約2〇,〇〇〇的範圍内。 芳香族聚酯醯胺共聚合物可以藉由使用製備一般芳 香族聚酯的方法來製備。舉例來說,可以使用過量的脂肪 17 201035168 ipif.doc 酸酐對芳香族二醇的酚性羥基(對應於重複單元RCN及/或 重複單元HQ)、芳香族羥羧酸的酚性羥基(對應於重複單元 B)以及芳香族胺的酚性羥基或胺基(對應於重複單元c)及/ 或务香族二胺的胺基(對應於重複單元C’)進行醯化,以得 到醯基化合物,以及接著使用芳香族二羧酸對所得的醯基 化合物進行轉酯化使其被溶融聚合(melt_P〇lymerized)。 在酿化反應中’就化學當!(chemical equivalent)而 吕,脂肪酸酐的含量可以是大於紛性經基及胺基的含量的 約1.0至約1.2倍,諸如大於約ι·〇4至約107倍的範圍。 〇 當脂肪酸酐的量高於上述範圍時,芳香族聚酯醯胺共聚合 物的著色可能是顯著的。在另一方面,當脂肪酸酐的量低 於上述範圍時,所使用的一些單體可能會昇華或可能產生 大量的酚類氣體。 醯化反應可以在約130°C至約170。(:的溫度範圍下進 行30分鐘至約8小時,諸如在約14〇它至約16〇〇c的溫度 範圍下進行約2小時至約4小時。 在醯化反應中所使用的脂肪酸酐的實例包括(但不限 於)乙酸酐、丙酸酐、異丁酸酐、正戊酸酐(valeric ^ anhydnde)、特戊酸酐(Pivalic anhydride)、丁酸酐、或者它 們的組合物。就成本以及處理方便而言,可使用乙酸酐。 轉酯化以及轉醯胺化可以在約13〇4〇〇它的溫度,當 反應溫度增加約(U_2t:/分鐘時進行,例如,在約14〇_35田〇 。(:的溫度,當反應溫度增加約〇 3_rc/分鐘時進行。 為推動化學平衡狀態,當進行經醯化的脂肪酸醋與羧 18 201035168 jjHzipif.doc 酸的轉醋化或者轉醯胺化時,所產生的脂肪酸副產物以及 未反應的脂肪酸酐可以藉由蒸發或蒸餾而被排除出反應系 統。 酿化反應、轉酯化反應以及轉醯胺反應可以於存在有 催化劑時進行。催化劑可以是任何用於製備聚酯的催化 劑。舉例來說’催化劑可以是乙酸鎂(magnesium acetate)、 乙酸錫(tin acetate)、四丁基鈦酸鹽(tetrabutyl titanate)、乙 ❹酸鉛(lead acetate)、乙酸納(sodium acetate)、乙酸卸 (potassium acetate)、三氧化二録(antimony trioxide)、N,N- 一甲胺0比咬(N,N-dimethylaminapyridine)以及 N-甲 σ米0坐 (N-methylimidazole)。通常會同時添加催化劑以及單體,並 且在催化劑存在下進行醯化反應以及轉酯化反應。 藉由轉酯化以及轉醯胺化來進行的聚合縮合反應可以 藉由溶融聚合反應(melt polymerization reaction),或是溶融 聚合反應及隨後的固相聚合反應(s〇lid state polymerization reaction)來進行。 〇 未特別限制熔融聚合反應中所使用的反應器,且反應 器可以是配備有通常用於高黏度反應的攪拌設備(stirring device)的反應器。就此點來看,酸化反應以及溶融聚合反 應中可使用同一反應器或不同的反應器。 固相聚合反應可以由以下方法進行,其中將由溶融聚 合反應獲得的預聚合物碾磨成像薄片或像粉末的聚合物, 然後藉由固相聚合反應聚合之。固相聚合反應可以由以下 方式進行,藉由在約20(TC至約35(TC的溫度範圍持續約i 19 201035168 33421pif.doc 小時至'約30小時情況下,在固相下且在諸 氛(inert atmosphere)下對經碾磨的預聚合物 、月虱 相聚合反應可以在授拌或未授拌經礙 ;^^理。固 下進行。熔融聚合反應以及固相聚合摩來σ的情況 當的擾拌設備的反應器中進行。反應可以在配備有適 如上述製制芳錢聚騎料聚 脹係數為3 ppm/K或更小。 奶』具有熱膨 所獲得的㈣騎|旨_轉合物可 狀且接著以已知方法來進行模製,或者是 球 2維化_latiGn)。或者’可以將芳香族聚義胺= β物溶解在溶射,將溶·佈至金屬軸上 j 物進行加献錢㈣鮮合物膜。再者, \ t 或非織物巾使时魏聚g旨軸共聚合物。衣備織物 根據本發明之-實施例的預浸體包 聚酯醯胺共聚合物的基材。 貫有方香私 將芳香族聚騎胺絲合物簡在_ 成溶液,紐將組成歸浸潰或錄至機織 物及/或非織物及移除溶劑,以製備預浸體。; 浸潰法(solution impregnati〇n)或漆浸、主 g ’合、= impregnation)來進行浸潰。 ㊉、(varnish ^於重量份的料錄㈣胺共聚合物,用來溶 解方香族聚酯醯胺共聚合物的溶劑的含 的 100-100,_ $量份的範圍。基於⑽重量 = 醯胺共聚合物,當溶劑的含量小於1。。重量 20 201035168 ipif.doc 黏性會增加以及在處理上可能會有問題。在另一方面,基 於100重量份的芳香族聚酯醯胺共聚合物,當溶劑的含量 大於100,000重量份時,芳香族聚酯醯胺共聚合物的含量 會過少而使預浸體的生產率降低。 用來溶解芳香族聚酯醯胺共聚合物的溶劑可以是非鹵 素溶劑,但不限定於此。例如’溶劑可以是極性非質子基 化合物(polar non-piOton based compound)、鹵化盼 (hal〇genated phenol)、鄰二氯苯(0_dichlorobenzene)、三氯 曱烧(chloroform)、二氯曱燒(methylene chloride)、四氯曱 烧(tetrachloroethane)、或者它們的組合物。特別是,由於 务香族聚醋酿胺共聚合物甚至在非鹵素溶劑中也可以溶 解,因此可以避免使用含有鹵素的溶劑。由於使用含有鹵 素的溶劑可能會腐蝕金屬包層,故避免使用含有鹵素的溶 劑可以避免包括預浸體的金屬包層積層板或印刷電路板的 金屬包層被腐蝕。 基材可以是織物及/或非織物,諸如芳族聚酯纖維、玻 〇 璃織維、碳織維、玻璃紙、或者它們的組合物。 當在預浸體的製備過程中使用浸潰方法時,以在溶劑 中洛解芳香族聚酯醯胺共聚合物的組成溶液來浸潰基材, 其中浸潰時間通常是約0.001分鐘至約i小時。當浸潰時 ^於_ι分鐘時,芳香騎g|_共聚合物可能無法 均勻地浸潰。在另一方面,當浸潰時間大於1小時時,預 浸體的生產率可能會降低。 此外,以組成溶液浸潰基材時,浸潰溫度可以是在約 201035168 33421pii.doc 20°C至約190°C的範圍内,諸如室溫。 另外,當基材具有約5 m至約2〇〇_的厚度時,每單 位面積的基材的料騎g旨吨共聚合物的輯量可以是 在約0.1 g/m2至約l,_ g/m2的範_。當芳香族聚醋酿 ,共聚合物的浸潰量小於(U咖2時,預浸_生產率可 能^降低。在另-方面,當芳香族聚g旨醯胺共聚合物的浸 潰S大於l,GGGg/m2時,不適用於印刷電路板的微型化。 不背離本發明範圍的情況下,為了控制介電常數以及 熱膨脹係數,藉由在溶射溶解料族聚賴胺共聚合物 以製備的組合溶液可以進-步包括:無機填料,諸如二氧 化石夕(silica)、氫氧化鋁(aiuminum ¥職此)或碳酸約 (calcmm carbonate);或有機填料,諸如固化的環氧類樹脂 (cured epoxy)或父聯的丙細樹脂(acryiic 。特別是,可 以將具有高介電常數的無機填料加至組合溶液。無機填料 可以是鈦酸鹽(titanate),諸如鈦酸鋇(bariumtitanate)或鈦酸 锶(strontium titanate),或者是藉由以其他金屬取代鈦酸鋇 的部分鈦或鋇而獲得的填料。基於1〇〇重量份的芳香族聚 麵胺共聚合物’無機填料或有機填料的含量可以是在約 〇.〇(|〇1重量份至約100重量份的範圍内。基於100重量份 的芳香族聚酯醯胺共聚合物,當無機填料或有機填料的含 量小於α_ι重量料,難㈣分地提高碰翻介電常 數或降低預浸體的熱膨脹係數。在另—方面,基於1〇〇重 量份的芳香族《醯胺共聚合物,當錢填料或有機填料 的含量大於重量份時,芳香族聚随胺共聚合物可能 22 201035168 ipif.doc 無法作為黏合劑(binder)。 根據本發明之實施例,由於預浸體包括具有低吸濕性 以及低介電常數的芳香族聚酯醯胺共聚合物以及具有優 '良 的機械強度的有機的或無機的織物及/或非織物,因此預^ 體具有優良的尺寸穩定性(dimensi〇nai stability)、遇熱時不 容易變形,並且是硬的。這些特性使預浸體適合進行通孔 ❹Open &gt; into a creature. In the _ forming derivative of the scented diol, the carbyl group can react with the carboxylic acid to form an ester bond. Further, the ester-forming derivative of the aromatic hydroxycarboxylic acid or the aromatic dicarboxylic acid may be a highly reactive derivative such as an acid chloride and an acid anhydride, or an aromatic hydroxycarboxylic acid or an aromatic dicarboxylic acid. The ester-forming derivative can form an ester bond with an alcohol or ethylene glycol (ethyleneglyc〇1). In the amide-forming derivative of an aromatic amine or an aromatic diamine, the amine group may form a guanamine bond with the carboxylic acid. The aromatic polyester guanamine copolymer prepared as described above may be dissolved in a solvent' and may be a heat-oriented liquid crystal polyester guanamine copolymer, in particular, it may be at 400. An optically anisotropic melt is formed at a temperature range of (or lower). In particular, the melting point of the 'aromatic polyester guanamine copolymer may range from about 25 〇 to about 400 ° C. And, the number average molecular weight thereof may range from about 1, 〇〇〇 to about 2 〇, 〇〇〇. The aromatic polyester guanamine copolymer can be prepared by using a method for preparing a general aromatic polyester. For example, an excess of fat 17 201035168 ipif.doc anhydride can be used to phenolic hydroxyl groups of aromatic diols (corresponding to repeating unit RCN and/or repeating unit HQ), phenolic hydroxyl groups of aromatic hydroxycarboxylic acids (corresponding Deuteration is carried out in repeating unit B) together with the phenolic hydroxyl or amine group of the aromatic amine (corresponding to repeating unit c) and/or the amine group of the aromatic diamine (corresponding to repeating unit C') to obtain a mercapto group. The compound, and then the transesterification of the obtained mercapto compound with an aromatic dicarboxylic acid, is melted and polymerized (melt_P〇lymerized). In the brewing reaction, 'chemical equivalent' (lu) Content can be greater than The content of the divalent base and the amine group is from about 1.0 to about 1.2 times, such as in the range of from about 1⁄4 to about 107 times. When the amount of the fatty acid anhydride is higher than the above range, the aromatic polyester decylamine is altogether. The coloring of the polymer may be significant. On the other hand, when the amount of the fatty acid anhydride is lower than the above range, some of the monomers used may sublime or may generate a large amount of phenolic gas. The oximation reaction may be about 130. From °C to about 170. (: a temperature range of from 30 minutes to about 8 hours, such as from about 14 Torr to about 16 〇〇c for about 2 hours to about 4 hours. In the oximation reaction Examples of the fatty acid anhydride to be used include, but are not limited to, acetic anhydride, propionic anhydride, isobutyric anhydride, valeric anhydride, Pivalic anhydride, butyric anhydride, or a combination thereof. Acetic anhydride can be used in terms of cost and convenience of handling. The transesterification and transamination can be carried out at a temperature of about 13 Torr, and when the reaction temperature is increased by about (U_2t:/min, for example, at about 14 〇 _35 〇 〇. (: temperature, when When the temperature is increased by about _3_rc/min, in order to promote the chemical equilibrium state, when the fatty acid vinegar and the carboxylic acid are trans-acetated or transaminated, the fatty acid by-products are produced. And the unreacted fatty acid anhydride can be excluded from the reaction system by evaporation or distillation. The brewing reaction, the transesterification reaction and the transamidation reaction can be carried out in the presence of a catalyst. The catalyst can be any used for the preparation of polyester. Catalyst. For example, the catalyst may be magnesium acetate, tin acetate, tetrabutyl titanate, lead acetate, sodium acetate, Potassium acetate, antimony trioxide, N,N-dimethylaminapyridine, and N-methylimidazole. The catalyst and the monomer are usually added at the same time, and the deuteration reaction and the transesterification reaction are carried out in the presence of a catalyst. The polymerization condensation reaction by transesterification and transamination can be carried out by a melt polymerization reaction, or a melt polymerization reaction and a subsequent s〇lid state polymerization reaction. . The reactor used in the melt polymerization reaction is not particularly limited, and the reactor may be a reactor equipped with a stirring device generally used for a high viscosity reaction. In this regard, the same reactor or a different reactor may be used in the acidification reaction and the melt polymerization reaction. The solid phase polymerization can be carried out by subjecting a prepolymer obtained by a melt polymerization reaction to an image forming sheet or a polymer like a powder, followed by polymerization by solid phase polymerization. The solid phase polymerization can be carried out in the following manner, at about 20 (TC to about 35 (the temperature range of TC lasts for about i 19 201035168 33421 pif. doc hours to 'about 30 hours), under the solid phase and in the atmosphere The polymerization of the milled prepolymer and the menstrual phase under the inert atmosphere can be carried out under the conditions of mixing or unstraining; solidification and solid phase polymerization of the σ When the scrambling equipment is carried out in the reactor, the reaction can be equipped with a suitable expansion coefficient of 3 ppm/K or less for the aromatics. The milk has the thermal expansion (four) riding. The _transformer can be shaped and then molded by known methods, or the ball can be double-dimensionalized _latiGn). Alternatively, the aromatic polysamine can be dissolved in the solvent, and the solution can be dissolved to the metal axis. Adding money to the material (4) fresh film. Further, \t or non-fabric towel makes the eutectic copolymer. The woven fabric is prepreg polyester according to the embodiment of the present invention. A substrate of a guanamine copolymer. The scented aromatic scented aromatic amine compound is in solution, Dipping or recording onto woven fabrics and/or non-woven fabrics and removing solvents to prepare prepregs.; impregnation method (solution impregnati〇n) or paint immersion, main g 'combination, = impregnation) for dip Crush. X. (varnish ^ in parts by weight (4) amine copolymer, the range of 100-100, _ $ parts of the solvent used to dissolve the scented polyester phthalamide copolymer. Based on (10) weight = Amidoxime copolymer, when the content of the solvent is less than 1. Weight 20 201035168 ipif.doc Viscosity will increase and there may be problems in handling. On the other hand, based on 100 parts by weight of aromatic polyester amide When the content of the solvent is more than 100,000 parts by weight, the content of the aromatic polyester guanamine copolymer is too small to lower the productivity of the prepreg. The solvent for dissolving the aromatic polyester guanamine copolymer can be It is a non-halogen solvent, but is not limited thereto. For example, 'the solvent may be a polar non-piOton based compound, a hal〇genated phenol, an o-dichlorobenzene, or a triclosan. (chloroform), methylene chloride, tetrachloroethane, or a combination thereof. In particular, since the scented polyacetal amine copolymer can be dissolved even in a non-halogen solvent. Solvent, therefore, the use of solvents containing halogens can be avoided. Since the use of halogen-containing solvents may corrode the metal cladding, avoiding the use of halogen-containing solvents can avoid metal clad laminates or printed circuit boards including prepregs. The layer is etched. The substrate may be woven and/or non-woven, such as aramid fiber, glass woven, carbon woven, cellophane, or combinations thereof. When used in the preparation of prepregs In the impregnation method, the substrate is impregnated with a composition solution of the aromatic polyester guanamine copolymer in a solvent, wherein the impregnation time is usually from about 0.001 minutes to about i hours. At ι min, the aromatic ride g|_copolymer may not be uniformly impregnated. On the other hand, when the impregnation time is more than 1 hour, the productivity of the prepreg may be lowered. In the case of a material, the impregnation temperature may be in the range of about 201035168 33421 pii.doc 20 ° C to about 190 ° C, such as room temperature. In addition, when the substrate has a thickness of about 5 m to about 2 Å, each Base per unit area The amount of the copolymer can be from about 0.1 g/m2 to about 1, _g/m2. When aromatic vinegar is brewed, the amount of impregnation of the copolymer is less than (U coffee) At 2 o'clock, the prepreg_productivity may be lowered. On the other hand, when the impregnation S of the aromatic polyglycol amine copolymer is greater than 1, GGGg/m2, it is not suitable for miniaturization of printed circuit boards. In the case of deviating from the scope of the present invention, in order to control the dielectric constant and the coefficient of thermal expansion, the combined solution prepared by dissolving the dissolved family of polylysine copolymers may further comprise: an inorganic filler such as a dioxide dioxide ( Silica), aluminum hydroxide (aiuminum) or calcmm carbonate; or an organic filler such as a cured epoxy or a parent-linked acrylic resin (acryiic). In particular, an inorganic filler having a high dielectric constant can be added to the combined solution. The inorganic filler may be a titanate such as bariumtitanate or strontium titanate, or a filler obtained by substituting a part of titanium or lanthanum of barium titanate with other metals. The content of the aromatic polyamine amine copolymer 'inorganic filler or organic filler based on 1 part by weight may be in the range of from about 1 part by weight to about 100 parts by weight. Based on 100 parts by weight Aromatic polyester guanamine copolymer, when the content of inorganic filler or organic filler is less than α_ι weight, it is difficult to increase the dielectric constant or reduce the thermal expansion coefficient of the prepreg. In other respects, based on 1〇 〇 By weight of the aromatic "melamine copolymer, when the content of the money filler or organic filler is greater than the weight, the aromatic poly-alcoholic copolymer may be 22 201035168 ipif.doc can not be used as a binder (binder). Embodiments of the invention, since the prepreg comprises an aromatic polyester guanamine copolymer having low hygroscopicity and low dielectric constant, and an organic or inorganic woven fabric and/or non-woven fabric having excellent mechanical strength. Therefore, the pre-form has excellent dimensional stability (dimensi〇nai stability), is not easily deformed when heated, and is hard. These characteristics make the prepreg suitable for through-hole ❹

G 鑽孔處理(Via-h〇le drill processing)以及堆疊處理㈣ processing) ° &amp; 一 f製備預浸體的浸潰製程巾,在基材被藉由在溶劑中 溶解芳香族聚騎胺共聚合物而製備的纟且成溶液浸潰或塗 抹之後’接著移除溶劑。未特別限制移除溶劑的方法,可 以藉,溶賴發來進行移除,諸如熱祕、真空蒸發 =蒸發。_是’就f知_浸體的製造餘、生產效 ΐϋΓ便利而言,熱蒸發的使用,特別是通風熱蒸發, 在移除溶劑的製程中,芳香族聚酯醯丘 至約19。。。的溫度範圍:持“1:: 可以先賴,錢使職生的組成溶液 1〇小時下進行熱rrc的溫度範圍及持續約1分鐘至約 根據本發明的預浸體的厚度 的内’諸如在㈣ 浸體在一方向上之埶膨脹係數'預 預浸體齡疋1(&gt;1)1)滅或更小, 、㊉數可以是3.5或更小,以及預浸體的介電 23 201035168 33421pii.doc 損耗可以是_錢小。此處,介f損耗表4交 施加至介電材_,介電材财賴形式散失之能量 J合^,的_脹係數大於丨。獅/κ時,預浸體可 月匕會剝洛。當預浸體的介電常數大於3 5式人爺4 0.01時,預浸體可能不適合在高頻簡中。“基γ 此外’預浸積層板可以藉由堆疊預定數量的預浸體且 接著加熱並壓縮所堆疊的預浸體而製備。 再者,金屬包層積層板可以藉由將金屬薄膜(諸如銅 膜、銀膜或賴)定位在預趙或制板的至少一個表 面上來製備。 藉/金&quot;1⑽制板+,未特職制每個駿體或預浸 積層板以及金屬薄_厚度,但討以在纟⑷⑽至約300 =範圍内。當預浸體或預浸積層㈣厚度小於時, 進行滾軋製程時預浸體或預浸積層板可能容易破 心士在另-方面,當預浸體或預浸積層板的厚度大於卿 2 ’可以堆疊的預浸體的數量受到限制。當金屬薄膜的 於(U _,金屬薄膜被堆疊在預浸體或預浸積層 板上柃’金屬薄膜可能較易破裂。在另一方面, =的厚度大於3GG卿時,可以被堆疊的預浸體的數量受到 在製備金屬包層積層板巾’加熱以及壓縮製程可以在 、’、勺:50 C至約180 C的溫度範圍内及約9 MPa至約20 MPa 的墨力範_進行。㈣,加熱溫度以及壓力並不限定於 此。換句話說,可騎慮賴體㈣性、芳香族聚酿酿胺 24 201035168 共聚合物的組合溶液的反應性、壓縮設備的性能、金屬包 層積層板的所要厚度或者類似因素之後恰當地決定加熱溫 度以及壓力。 根據本實施例,金屬包層積層板更包括位於預浸積層 板與金屬薄膜之間的接著層(adhesiVe iayer)以增加預浸積 層板與金屬薄膜之間的黏著強度。接著層可以由熱塑性樹 月曰合成物或熱固性樹脂合成物來形成。接著層的厚度可以 是在約0.1 /ΖΠ1至約100娜的範圍内。當接著層的厚度小於 〇.1聊時,預浸積層板與金屬薄膜之間的黏著強度減少。在 另一方面,當接著層的厚度大於1〇〇柳時,金屬包層積層 板會太厚。 ' 此外,印刷電路板可以藉由侧金屬包層積層板的金 屬薄膜及於金屬薄财形成電路來製備。或者,印刷電路 板也可以藉由將金屬電路圖案印刷至聚合物膜㈣少一矣G-drilling treatment (Via-h〇le drill processing) and stacking treatment (4) processing) ° &amp; a preparation of prepreg impregnation process towel, in the substrate is dissolved in the solvent by aromatic polyamine The hydrazine prepared from the polymer is then subjected to solution impregnation or smearing followed by 'solvent removal. The method of removing the solvent is not particularly limited, and the removal may be carried out by immersion, such as heat, vacuum evaporation = evaporation. _Yes, the use of thermal evaporation, especially the ventilating thermal evaporation, in the process of solvent removal, the aromatic polyester deciduous to about 19. . . Temperature range: Hold "1:: can be used first, the money makes the composition of the active ingredient 1 hour to carry out the temperature range of the hot rrc and lasts about 1 minute to about the thickness of the prepreg according to the invention" such as In (iv) the dip body in one direction, the coefficient of expansion of the 'prepreg body age 疋 1 (&gt; 1) 1) is extinguished or smaller, the number of tens may be 3.5 or less, and the dielectric of the prepreg 23 201035168 33421pii.doc Loss can be _ money is small. Here, the f loss table 4 is applied to the dielectric material _, the dielectric energy lost in the form of dielectric material J is ^, the expansion coefficient is greater than 丨. 狮 / κ The prepreg can be peeled off at the new moon. When the dielectric constant of the prepreg is greater than 3 5, the prepreg may not be suitable for high frequency simplicity. "Base γ in addition to the 'pre-impregnated laminate can It is prepared by stacking a predetermined number of prepregs and then heating and compressing the stacked prepregs. Further, the metal clad laminate can be prepared by positioning a metal film such as a copper film, a silver film or a lamella on at least one surface of the pre-Zhao or the board. Borrow / Gold &quot; 1 (10) board +, no special system for each body or prepreg and metal thin _ thickness, but in the range of 纟 (4) (10) to about 300 =. When the thickness of the prepreg or prepreg (4) is less than that, the prepreg or prepreg may be easily broken when performing the rolling process. When the thickness of the prepreg or prepreg is greater than 2 'The number of prepregs that can be stacked is limited. When the metal film is (U _, the metal film is stacked on the prepreg or the prepreg layer, the metal film may be more susceptible to cracking. On the other hand, when the thickness of = is greater than 3 GG, the stack can be pre-stacked The amount of the dip is carried out in a temperature range of from 50 C to about 180 C and from about 9 MPa to about 20 MPa in the preparation of the metal clad laminate 'heating and compression process. (4) The heating temperature and pressure are not limited thereto. In other words, the reactivity of the combined solution of the copolymer, the compression equipment, and the metal clad layer of the tetracycline (A), aromatic polystyrene 24 201035168 copolymer. The desired thickness or the like of the laminate is then appropriately determined by the heating temperature and pressure. According to the embodiment, the metal clad laminate further includes an adhesive layer between the prepreg and the metal film to increase the prepreg. The adhesion strength between the laminate and the metal film. The subsequent layer may be formed of a thermoplastic tree ore composite or a thermosetting resin composition. The thickness of the layer may be from about 0.1 / ΖΠ 1 to about 100. Within the range of Na. When the thickness of the adhesive layer is less than 〇.1, the adhesion strength between the prepreg and the metal film is reduced. On the other hand, when the thickness of the adhesive layer is greater than 1 〇〇, the metal package The laminated board will be too thick. 'In addition, the printed circuit board can be prepared by forming a metal film of a side metal clad laminate and forming a circuit for metal thinning. Alternatively, the printed circuit board can also be printed by printing a metal circuit pattern to Polymer film (four) one less

壓縮條件可以與製備金屬 包層積層板中的條件相同。内基 、金屬包層積層板 兩者可以作為内基 材可以是用作電絕緣材料的預浸積層板 或印刷電路板’以及這些材料中的至少 材。 曰月之一或多個實施 ’而並不是用來限定 將參照以下的實例來詳述本發£ 例。但是這些實例只是用作舉例說明, 25 201035168 3342ipif.doc 本發明的範圍。 實例1 138· 1 g(l.0莫耳)的對羥基苯曱酸(para hydroxy benzoic add)、245.54 g(2.3 莫耳)的 4-胺苯酚、185.8 g(1.7 莫耳)的對苯二紛、61.9 g(0.6莫耳)的間苯二酴、747.6 g(4.5 莫耳)的異苯二曱酸以及1,123 g(ii莫耳)的乙酸酐被添加 進裝備有擾拌器、轉矩計(t〇rqUe meter)、氮氣進口、溫度 計以及回流冷凝器的反應器。The compression conditions can be the same as those in the preparation of the metal clad laminate. Both the inner base and the metal clad laminate may be used as the inner base material, or may be a prepreg ply or printed circuit board ' used as an electrically insulating material, and at least one of these materials. One or more implementations of the month are not intended to be limiting. The examples will be described in detail with reference to the following examples. However, these examples are for illustrative purposes only, 25 201035168 3342ipif.doc. Example 1 138·1 g (1.00 mol) of parahydroxy benzoic acid, 245.54 g (2.3 mol) of 4-aminophenol, 185.8 g (1.7 mol) of p-phenylene 61.9 g (0.6 m) of meta-benzoic acid, 747.6 g (4.5 m) of isophthalic acid and 1,123 g (ii mol) of acetic anhydride were added to the device equipped with a scrambler and torque. A reactor (t〇rqUe meter), a nitrogen inlet, a thermometer, and a reflux condenser.

反應器被氮氣充分地清洗’並且在氮氣氣氛下,將反 應器的溫度增加至150T:達30分鐘。當溫度被保持在150 °C時,對反應器進行回流達3小時。The reactor was thoroughly purged with nitrogen' and the temperature of the reactor was increased to 150 T under a nitrogen atmosphere for 30 minutes. The reactor was refluxed for 3 hours while the temperature was maintained at 150 °C.

然後’在藉由蒸餾移除流出的乙酸以及未反應的乙酸 軒日t,將反應器的溫度增加至32〇°c達18〇分鐘。當扭矩 由0.5增加至1.5 N*m時,也就是當反應停止時,獲得反 應產物。所獲得的固態粉末被冷卻至室溫,然後用磨粉機 filler)粉碎。然後,在氮氣氣氛及26〇乞下,進行固相聚 。反應達5小時,以獲得芳香族聚酯醯胺共聚合物粉末。 _ g的所獲得的芳香族聚醋醯胺共聚合物粉末被添 口至_ g的N•甲基対細(NMp),然後混合物在室溫 :被授拌4小時以獲得芳香族㈣醯胺絲合物的組成溶 在室溫(約25°C)以組成溶液浸潰玻璃編織布(IPC )’錄通1§魏移除過量軸成料謂 又。然後所產生的_編織布被放人高溫減絲機(馬西 26 201035168 ipif.doc 斯。水平式乾燥機(Mathis,Horizontal Type Dryer))中以在 150 C移除/谷劑。然後’所產生的結構在·被熱處理達 60分鐘,以獲得預浸體,其巾紐體是藉由經芳香族聚醋 醯胺共聚合物浸潰的玻璃編織布所製備的。 比較實例1 除了完全不使用作為芳香族二醇的對苯二酚以及僅 使用253.23 g(2.3莫耳)的間笨二酴以外,使用如實例i同 〇 樣的方法製備芳香族聚酯醯胺共聚合物。此外,芳香族聚 酯醯胺共聚合物的組成溶液及預浸體是使用如實例1同樣 的方法來製備。 比較實例2 除了完全不使用作為芳香族二醇的間苯二酚以及僅 使用253.23 g(2.3莫耳)的對苯二齡以外,使用如實例】同 樣的方法製備芳香族聚酯醯胺共聚合物。此外,芳香族聚 酯醯胺共聚合物的組成溶液及預浸體是使用如實例丨同樣 的方法來製備。 7 Ο 比較實例3 除了使用138.1g(l.〇莫耳)的對羥基苯甲酸、1〇9 lg(^ 〇 莫耳)的4-胺笨酚、289.6 g (2.63莫耳)的對苯二酚、95.8 g(0.87莫耳)的間笨二酚、747·6 g (4 5莫耳)的異苯二曱酸 以及1,123 g(ll莫耳)的乙酸酐以外,使用如實例1同樣的 方法製備芳香族聚酯醯胺共聚合物。此外,芳香族聚酯醯 胺共聚合物的組成溶液及預浸體是使用如實例1同樣的方 法來製備。 27 201035168 33421pif.doc 依照以下方式來評估實例1之預浸體的表面狀態及電 特性並與比,貫例丨至比較實例3的賴體比較。 +首先’將。λ例1與比較實例i至比較實例3的預浸體 a二有 C的&amp;接溫度的焊接槽(s〇idering bath)中三 次,每次1G秒鐘,然後觀察每個預浸體的表面狀態。實例 1的預次體科變形或械’而比較實例1至tb較實例3 的各個預浸體的部分表面會變形。 另卜使用阻抗分析儀(impedance analyzer)來測量實 例1。與比較實例1至比較實例3的預浸體的介電常數及介 電祕。測量結果為實例1的預紐的介電常數為3.0(1 GHz)及介電損耗為〇〇〇5,這表示其在高頻範圍中具有低 ”電系數及低介電損耗。在另—方面,比較實例i的預浸 體的介電常數為3.4(1 GHz)及介電損耗為〇·〇〇7,比較實例 2的預浸體的介電常數為3 6(1 GHz)及介電損耗為〇._, =及比較實例3的預浸體的介電常數為3.4(1 GHz)及介電 知耗為0.0〇7,這表示相較於實例1 #預浸體,這些預浸 體具有較高的介電f數及較高的介電損耗。 β再者’使用熱機械分析儀(由ΤΜΑ製造,Q400)來測 量只例1與比較實例1至比較實例3的每-預浸體的熱膨 脹係數。缝結果為在5Gd12Gt的溫度範圍内,實例 ^的預浸體的熱膨脹係、數為9.2 ppm/Κ。在另-方面,比較 只例1的預浸體的熱膨脹係數為14 5 ppm/K,比較實例2 的預/文體的熱膨脹係數為115 ppm/K,以及比較實例3的 預/又體的熱膨脹係數為〗2.4 ppm/K,這表示相較於實例】 28 201035168 jJ4Zipif.doc 的預浸體,這些預浸體且 10ppm/K) 〇 X篮&quot;有輕向的熱膨脹係數(&gt; 同時,如上辦·、+、 Ο 本發明之精神和範圍内,當可你此吊知識者,在不脫離 發明之保護範圍當視後附 更動與潤飾,故本 【圖式簡單說明】 °&quot;專利乾圍所界定者為準。 無。 【主要元件符號說明】 nt、Then, the temperature of the reactor was increased to 32 ° C for 18 minutes by removing the effluent acetic acid and unreacted acetic acid by distillation. When the torque is increased from 0.5 to 1.5 N*m, that is, when the reaction is stopped, the reaction product is obtained. The obtained solid powder was cooled to room temperature and then pulverized with a mill filler. Then, solid phase polymerization was carried out under a nitrogen atmosphere at 26 Torr. The reaction was carried out for 5 hours to obtain an aromatic polyester decylamine copolymer powder. The obtained aromatic polyacetamide copolymer powder was added to _g of N•methyl quinone (NMp), and then the mixture was stirred at room temperature for 4 hours to obtain an aromatic (tetra) 醯The composition of the amine silk compound is dissolved at room temperature (about 25 ° C) to form a solution impregnated glass woven fabric (IPC) 'recording 1 § Wei remove excess shaft material. The resulting woven fabric was then placed in a high temperature wire reduction machine (Masis 26, 2010 pp ipif. doc. Horizontal Type Dryer) to remove/treat at 150 C. The resulting structure was then heat treated for 60 minutes to obtain a prepreg prepared by glass woven cloth impregnated with an aromatic polyester phthalamide copolymer. Comparative Example 1 An aromatic polyester decylamine was prepared by the same method as in Example i except that hydroquinone as an aromatic diol was not used at all and only 253.23 g (2.3 mol) of stigma was used. Copolymer. Further, a composition solution and a prepreg of the aromatic polyester decylamine copolymer were prepared in the same manner as in Example 1. Comparative Example 2 Aromatic polyester decylamine copolymerization was carried out in the same manner as in Example except that resorcinol as an aromatic diol was not used at all and only 253.23 g (2.3 mol) of benzoquinone was used. Things. Further, a composition solution and a prepreg of the aromatic polyester decylamine copolymer were prepared in the same manner as in Example 丨. 7 Ο Comparative Example 3 In addition to the use of 138.1 g (l. mol) of p-hydroxybenzoic acid, 1 〇 9 lg (^ 〇 mol) of 4-amine phenol, 289.6 g (2.63 mol) of p-phenylene The same as in Example 1 except that phenol, 95.8 g (0.87 mol) of m-diphenol, 747·6 g (45 mol) of isophthalic acid, and 1,123 g (ll mol) of acetic anhydride were used. Method An aromatic polyester guanamine copolymer was prepared. Further, a composition solution and a prepreg of the aromatic polyester guanamine copolymer were prepared in the same manner as in Example 1. 27 201035168 33421pif.doc The surface state and electrical characteristics of the prepreg of Example 1 were evaluated in the following manner and compared with the ratio of the comparative example to the comparative example 3. + First, 'will. λ Example 1 and Comparative Example i to Comparative Example 3, Prepreg a, C, & temperature s〇idering bath three times, each 1 Gsec, and then observed for each prepreg surface condition. The pre-subfamily deformation or mechanical&apos; of Example 1 and Comparative Examples 1 to tb were deformed compared to the partial surface of each of the prepregs of Example 3. An example 1 was measured using an impedance analyzer. The dielectric constant and dielectric secret of the prepreg of Comparative Example 1 to Comparative Example 3. The measurement result is that the dielectric constant of Example 1 is 3.0 (1 GHz) and the dielectric loss is 〇〇〇5, which means that it has a low electric coefficient and low dielectric loss in the high frequency range. In comparison, the dielectric constant of the prepreg of Comparative Example i was 3.4 (1 GHz) and the dielectric loss was 〇·〇〇7, and the dielectric constant of the prepreg of Comparative Example 2 was 3 6 (1 GHz). The electrical loss is 〇._, = and the dielectric constant of the prepreg of Comparative Example 3 is 3.4 (1 GHz) and the dielectric knowance is 0.0〇7, which means that compared to the example 1 #prepreg, these pre-pregs The dip has a higher dielectric f-number and a higher dielectric loss. β further uses a thermomechanical analyzer (manufactured by ΤΜΑ, Q400) to measure only each of Example 1 and Comparative Example 1 to Comparative Example 3. The thermal expansion coefficient of the prepreg. The result of the slit is the temperature expansion range of 5Gd12Gt, and the thermal expansion coefficient of the prepreg of the example is 9.2 ppm/Κ. On the other hand, the thermal expansion coefficient of the prepreg of only the first example is compared. For the 14 5 ppm/K, the thermal expansion coefficient of the pre/texture of Comparative Example 2 was 115 ppm/K, and the coefficient of thermal expansion of the pre/seam of Comparative Example 3 was 2.4 ppm/K. Compared with the examples] 28 201035168 jJ4Zipif.doc prepreg, these prepregs and 10ppm/K) 〇X basket&quot; has a light thermal expansion coefficient (&gt; at the same time, as described above, +, Ο In the spirit and scope, when you can hang the knowledge, you can attach and modify the decoration without departing from the scope of protection of the invention. Therefore, the definition of "Picture" is subject to the definition of "Patent Circumference." [Main component symbol description] nt,

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Claims (1)

201035168 3342ipit-d〇c 七、申請專利範圍: 1. 一種芳香族聚酯醯胺共聚合物,基於其中所有重複 單元’包括20莫耳百分比至25莫耳百分比的重複單元a, 所述重複單元A衍生自芳香族二醇’且所述重複單元a包 括衍生自間苯二酚的重複單元RCN及衍生自二紛及對笨 二酚中至少一者的重複單元HQ。 2. 如申請專利範圍第1項所述之芳香族聚酯醯胺共聚 合物,其中所述重複單元RCN及所述重複單元HQ的^符 合以下條件: 〇 &lt; n(RCN)/[n(RCN)+n(HQ)]〈卜 其中n(RCN)及n(HQ)分別代表所述芳香族聚酯醯胺 共聚合物的所述重複單元RCN及所述重複單sHQ的莫耳 數。 3. 如申請專利範圍第1項所述之芳香族聚祕胺共聚 合物,基於所有重複單元,更包括2莫耳百分比至25莫耳 百分比的重複單元B,所述重複單元B衍生自芳香族鐵 酸。 4. 如申明專利範圍第3項所述之芳香族聚酯醯胺共聚 合物,其中所述重複單元㈣生自選自由對經基苯甲酸及 2-羥基-6-萘曱酸所組成之族群中的至少一化合物。 5. 如申明專利範圍第丨項所述之芳香族聚酯醯胺共聚 合物’基於所有重複單元,更包括2〇莫耳百分比至Μ莫 耳百Ϊ比的至少—重複單元,所述至少一重複單元選自由 重複單元C及重複單元c,所組成之族群,其中所述重複單 30 201035168 ipif.doc 元c衍生自具有酚性羥基 C,衍生自料族二胺。方私胺’以及所述重複單元 合物,其中所述重芳香族聚酯酸胺共聚 苯驗及2-胺基-6-奈·斤組成: Ο G 合::=====; 2分比的重複單Μ,所述重複單元D触自芳香族二 人物Hi專利乾圍第7項所述之芳香族聚醋醯胺共聚 合物’其中所述重複單元D衍生自選自由異苯二甲酸、夺 糸-瘦酸及對苯二甲酸所組成之族群中的至少—化合物。 人申請專利範圍第1項所述之芳香族聚㈣胺共聚 :物〜、數目平均分子量介於1,000至20,000的範圍内, 以及其熔點介於25〇t至400。(:的範圍内。 1〇.種聚合物膜,包括如申請專利範圍第1項至第9 項中任一項所述之芳香族聚酯醯胺共聚合物。 产U.一種預浸體,包括浸潰有如申請專利範圍第1項至 第9項中任一項所述之芳香族聚酯醯胺共聚合物的基材。 12.如申請專利範圍第u項所述之預浸體,其中所述 基材的$度介於5卿至2〇〇卿,且每單位面積的所述基材 的所述芳香族聚酯醯胺共聚合物的浸潰量介於0.1 g/m2至 31 201035168 pit; doc 1,000 g/m2。 美翻範㈣11項所述之預浸體,其中所述 二'、選自由芳族聚酯纖維、玻璃織維、碳織維及玻璃 紙所組成之族群中的至少一者。 14·如申請專利範圍第11項所述之預浸體,基於100 所述芳香族聚酯醯胺共聚合物,更包括添加至所 ^ 6、G.GGG1重!份至重量份的有機填料或無機填 15.如申請專利範圍第u項所述之預浸體, 向上的熱膨脹係數為10 ppm/K或更小。 ’、 16·如申請專利範圍帛u項所述之預浸體,其 數為3.5或更小’以及其介電損耗為〇.〇1或更小了 π.種預浸積層板,包括如申請專利範圍 述之預浸體巾的至少二者。 Μ Π項所 18.—種金屬包層積層板,包括: 如申请專利範Uf U項所述之預浸體;以及 定位於所述預浸體之至少一表面上的至少一金屬薄 板 ^中如所申18顿狀㈣㈣包層積層 斤述預次體包括至少二預浸體的積層板。 20.-種印刷電路板,藉祕刻如申請專利 項所述之金屬包層積層板的所述金屬薄膜來製備。 圍,藉由將金屬電路圖案印刷於如申 —第ι〇項所述之聚合物膜的至少-表面上來: 32 201035168 J^H-Z ipif.doC 201035168 HZ ipif.doc 四、指定代表圖: (一) 本案之指定代表圖:無。 (二) 本代表圖之元件符號簡單說明: 無。 五、本案若有化學式時,請揭示最能顯示發明特徵 的化學式:201035168 3342ipit-d〇c VII. Patent Application Range: 1. An aromatic polyester guanamine copolymer based on repeating unit a in which all repeating units 'comprise 20 mole percent to 25 mole percent, said repeating unit A is derived from an aromatic diol' and the repeating unit a comprises a repeating unit RCN derived from resorcinol and a repeating unit HQ derived from at least one of dioxon and p-diphenol. 2. The aromatic polyester guanamine copolymer according to claim 1, wherein the repeating unit RCN and the repeating unit HQ satisfy the following conditions: 〇 &lt; n(RCN)/[n (RCN)+n(HQ)] wherein n(RCN) and n(HQ) respectively represent the repeating unit RCN of the aromatic polyester guanamine copolymer and the number of moles of the repeating single sHQ . 3. The aromatic polymyramine copolymer according to claim 1, wherein the repeating unit B is derived from aroma based on all repeating units, and further comprises from 2 mole percent to 25 mole percent of repeating unit B. Family ferric acid. 4. The aromatic polyester guanamine copolymer according to claim 3, wherein the repeating unit (IV) is derived from a group selected from the group consisting of p-benzoic acid and 2-hydroxy-6-naphthoic acid. At least one compound. 5. The aromatic polyester guanamine copolymer as described in the scope of claim 2, based on all repeating units, further comprising at least a repeating unit of 2% molar percentage to Μ molar ratio, said at least A repeat unit is selected from the group consisting of repeat unit C and repeat unit c, wherein the repeat unit 30 201035168 ipif.doc element c is derived from a phenolic hydroxyl group C derived from a feed group diamine. a squaraamine' and the repeating unit compound, wherein the heavy aromatic polyester amide copolymer is exemplified by 2-amino-6-na·kg composition: Ο G combination::=====; a repeating unit of 2, which is derived from the aromatic polyacetamide copolymer described in the seventh paragraph of the patent of the second patent, wherein the repeating unit D is derived from an isophthalic acid selected from the group consisting of At least a compound of a group consisting of dicarboxylic acid, scorpion-skin acid, and terephthalic acid. The aromatic poly(tetra)amine copolymer described in claim 1 has a number average molecular weight ranging from 1,000 to 20,000, and a melting point of from 25 〇t to 400. In the range of (1), a polymer film comprising the aromatic polyester guanamine copolymer as described in any one of claims 1 to 9. U. A prepreg And a substrate for impregnating the aromatic polyester amide copolymer according to any one of claims 1 to 9. 12. The prepreg according to claim 5 Wherein the substrate has a degree of between 5 and 2 cm, and the amount of impregnation of the aromatic polyester indole copolymer per unit area of the substrate is between 0.1 g/m2 To 31 201035168 pit; doc 1,000 g/m2. The prepreg according to item 11, wherein the two ', selected from the group consisting of aromatic polyester fiber, glass woven fabric, carbon woven and cellophane At least one of the prepregs according to claim 11 of the invention, based on 100 of the aromatic polyester guanamine copolymer, further comprising adding to the weight of the G.GGG1 To the parts by weight of the organic filler or inorganic filler. 15. The prepreg according to the scope of claim 5, having an upward thermal expansion coefficient of 10 ppm/K or less. ', 16 · The prepreg according to the scope of patent application , u, the number of which is 3.5 or less' and its dielectric loss is 〇.〇1 or less π. Prepreg laminate, including At least two of the prepreg towels of the patent application scope. 18 所 18 18 — — — — — — — — — — — — — — — — 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 18 At least one metal sheet on at least one surface of the prepreg is as described in the above-mentioned 18-fold (four) (four) cladding layer, and the pre-substrate comprises at least two prepreg laminate sheets. The metal thin film of the metal clad laminate according to the patent application is prepared by printing a metal circuit pattern on at least the surface of the polymer film as described in the application of the first item: 32 201035168 J^HZ ipif.doC 201035168 HZ ipif.doc IV. Designation of representative drawings: (1) The representative representative of the case: No. (2) Simple description of the symbol of the representative figure: None. 5. If there is a chemical formula in this case When revealing the chemical formula that best shows the characteristics of the invention: &lt;式1&gt; 〇&lt;Formula 1&gt; 〇
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