TW201034558A - Thermal control system for an electronic display - Google Patents

Thermal control system for an electronic display Download PDF

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Publication number
TW201034558A
TW201034558A TW098143574A TW98143574A TW201034558A TW 201034558 A TW201034558 A TW 201034558A TW 098143574 A TW098143574 A TW 098143574A TW 98143574 A TW98143574 A TW 98143574A TW 201034558 A TW201034558 A TW 201034558A
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TW
Taiwan
Prior art keywords
assembly
display
electronic
channel
gas
Prior art date
Application number
TW098143574A
Other languages
Chinese (zh)
Inventor
William Dunn
Tim Hubbard
Ware Bedell
Original Assignee
Mri Inc
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Publication of TW201034558A publication Critical patent/TW201034558A/en

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    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133382Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell
    • G02F1/133385Heating or cooling of liquid crystal cells other than for activation, e.g. circuits or arrangements for temperature control, stabilisation or uniform distribution over the cell with cooling means, e.g. fans
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133628Illuminating devices with cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136Forced ventilation, e.g. by fans
    • H05K7/20154Heat dissipaters coupled to components
    • H05K7/20163Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20963Heat transfer by conduction from internal heat source to heat radiating structure
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20972Forced ventilation, e.g. on heat dissipaters coupled to components
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/36Airflow channels, e.g. constructional arrangements facilitating the flow of air

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Nonlinear Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Liquid Crystal (AREA)

Abstract

A cooling assembly for an electronic image assembly and a display assembly containing the same. Some embodiments use ambient gas to cool power modules and/or an image assembly (sometimes backlight). Other embodiments use a closed loop of circulating gas which passes across the front surface of an image assembly and through a heat exchanger. An open loop passes through the heat exchanger and extracts heat from the circulating gas. Ambient air may be used as the ambient gas. An optional additional channel may be used to cool the back portion of the image assembly or backlight with ambient gas. Some embodiments also use thermally conductive plates and ribs to distribute the heat and avoid hot spots in the display. The cooling assembly can be used with any type of electronic assembly for producing an image.

Description

201034558 六、發明說明: 【發明所屬之技術領域】 說明性的實例大體上係相關於冷卻系統,且特別是相 關於用於電子顯示器的冷卻系統。 【先前技術】 用於電子顯示器的傳導式以及對流式熱傳導系統大體 ^係嘗試著要透過盡可能多的顯示器側壁來將熱量從在顯 =為之中的電子組件加以移除。為了要這樣子做,過去的 不統已經主要仰賴風扇,用於將在殼體之内的内部空氣移 動經過要被冷卻的組件以及離開顯示器。這些組件一般來 力提供動力的。某些情況之中,l經加熱的空氣 ,移動而與風扇以對流的方式熱連通。 雖然如此的熱傳導系統在過去 功,對於is _ m 方匕!旱有某種程度的成 的冷新式顯示器應用的改良需要甚至更大 大體上已罐使用子顯Μ的冷卻裝置在過去 上已經使用了對流散熱系統, 的後方内部部位。办在"Η日“用僅冷卻了顯示器 1 m 田在戶外或是在其他溫隐Μ 日守’特別是者决6、、 皿故環境之中使用 田來自於太%而通過前方顯千。0 傳導變成—’’、裔表面的輻射敎 击成項主要因素時,這樣是不夠的。h 中’有200瓦特志B 、在§午多應用之 目t 特或疋更多的動力通過前方酞 ^的。再者’市場上係需要更大尺寸營:顯示器表面是常 電子顯示器螢幕尺寸以及對應前方顯,:顯示器。隨著 口,將會產生更多的埶量 、不盗表面尺寸的增 又夕的熱里以及更多的熱 聊會破傳送到顯示 201034558 . 器之尹。而且,當顯+ w n 糾介a ‘、、y、益疋在戶外的環境中使用時 …的空氣可能含有污染物 兄中使用^ ^兄 .皐灰塵、砂子、煙氣等”、斤物、花粉、水蒸氣、煞 示器之中來進行内部冷卻睹:::果此等污染物被吸收到顯 件的損傷。 ,可硓會造成對於顯示器内部組 現代的顯示器(特日 經變得越來越明亮,而#此=外使用的那些顯示器)已 的幕H B审夕 ☆方光源係產生1,000到2,000 nits ❹置,像是crFr " 生^種程度的亮度,照明裝 直像疋CCFL組件、LEDs、 產吐姑去J-Ah 機LEDS以及電漿組件可以 產生相备大的熱量。此外,照 , 衣夏而要相當大量的動力, 以便於產生所需要程度的亮度。 在,#4種大里的動力一般來說 係透過一個或多個用於顯示器的電源爽徂$ 电原來供應。這些電源對 於顯不器來說也可能變成顯著的熱的來源。 ^去的裝置使用在戶外的環境、直接受到太陽 線或疋其他困難的熱環境之中時,溫度的波動很大是很常 ❹見的。此種溫度的波動會不利地影響在這些裝置之 子組件的使用壽命以及性能。 广 U 容 内 明 發 ;阶遇古的糸統已經f试者要僅透過電子顯示哭 顯示器側以及後方組件來移除熱,—項較佳實例也 造成從影像組合件的正面(面對著預期觀眾的側邊) 流熱傳導。這些較隹實例可以包含有二個分開的流 徑’用於通過電子顯示器的氣體。—個第—流動路: 5 201034558 疋開迴路以及一個第二流動 動路位可以是閉迴路。該閉 路徑係前進越過影像組合件 、路 刖方表面,繼續到顯示& 後方,在此處其可以進入一 ^的 個熱父換器之中,最後返回到 影像組合件的前方表面。 司 開沿路路徑係透過顯示器的後 (有可能通過一個熱交換g、 又換益)抽出氣體(例如,環境 氣)且然後將該氣體描ψ齡_ 、 孔體排出顯不器殼體之外。-個熱交換考 可以被用來將熱從閉细攸絲必, ' 。。 、路轉移到開迴路並且將其排出顯示 之外。選擇地,聞 1、路也可以被迫而位於影像組合件( 時候是背光源’其他時候是〇Led或是其他類型產生 的組合件)後方,以便於冷卻影像組合件及/或背光源組合 中(士果對方、戶斤使用之特殊類型的顯示器來說需要背光源 的活)。一個父又流動的熱交換器可以使用在說明性 施例之中。 立其他貫施 <列係相_於一種用力冷卻t子顯#器之以下 f5位不^這些部位是單獨的或是組合的情況下的系統: ()動力杈組、(2 )背光源,以及⑴前方顯示器表面。 =有散熱組件(例如,冷板件及/或熱沉)的動力模组可以 與一些其令動力模組含有散熱組合件的側邊係放置在環境 乳體之路徑之中,而動力模組含有敏感的電氣組件的側邊 係繼續=在分開的環境之中的實例一起使用。一個隔離結 構可以提供所需要之介於動力模組的二個側邊之間的氣體 (X及有時候是微粒/污染物)隔離。當以一種開迴路的周 圍氣體冷部動力模組時,可以使用或是可以不使用閉迴路。 具有一個前方以及後方側邊的背光源可以與一些用於 201034558 LCD顯示器的實例一起使 以及後方側邊含有-個敎傳導表^用方側邊含有照明裝置 Μ Φ…,相“’,‘、傳導表面,用於將熱從照明裝置 … 疋在背光源的前方側邊以及後方 侧邊之間應該有低程度的熱阻力。 實以將動力模組放置成與複數個熱傳導肋以 才目…連通,其中所述肋部係放置在冷卻空氣(有時候是周 圍的氣體)的路徑之中。來自 τ來自於動力模組的熱係分佈在整 ❿ ㈣部各處^由冷卻空氣所移除。已經發現的I,迫使空 氣通過由該等肋部所界定出之 1田狄乍的通道可以增進蔣 熱從動力模組移除的能力。 在另貝實例之中,動力模組以及顯示器背光源(或 是影像組合件):者均與肋部以熱相連通。以這種方式, 冷卻空氣(有時候是周圍氣體)@單—路徑可以被用來冷 卻-個典型電子顯示器的其中二個最溫暖的組件。舉例來 說’且不是以限制的方式’LED陣列t被用來當做用於咖 顯示器的照明裝置。已經發現的是,LEDS(以及其他昭明 裝置)的光學性質可以視溫度而定而變化。因此,當咖 暴露於室溫之下時’其可以輸出具有某明視度、波長及/或 色溫的光線'然而’當相同的LED暴露於高溫時,明視卢、 波長、色溫以及其他性質可能會產生變化省,當:度 的變化係跨越LED昔# :琢f# r- L 又 穹九源(某些區域係處於比其他區域更 高的溫度下)%發生時’可能會有對於觀察者來說是可以 看見的跨越背光源的光學易變性。藉著使用本文的實例, 熱的增長可以均勻地分佈在肋部各處以及從顯示器移除。 7 201034558 這樣可以防止任何可能之在背井 月九源之中的‘熱點(hot spots) ’其係因為照明裝置(有护仪a v B τΕΤΛ、 4 4候是’但是並不總是201034558 VI. DESCRIPTION OF THE INVENTION: TECHNICAL FIELD OF THE INVENTION The illustrative examples are generally related to cooling systems, and in particular to cooling systems for electronic displays. [Prior Art] Conductive and convective heat transfer systems for electronic displays have generally attempted to remove heat from electronic components in the display by as many display side walls as possible. In order to do this, the past has relied primarily on fans to move the internal air within the housing through the components to be cooled and out of the display. These components are generally powered. In some cases, the heated air moves to communicate with the fan in a convective manner. Although such a heat transfer system has been used in the past, for the is _ m square! The improvement of the cold-new display application with a certain degree of drought requires even greater. In general, the cooling device that has been used in the tank has used the rear internal part of the convection cooling system. In the "Holiday", only the display is cooled down. 1 m. The field is outdoors or in other warmth. The Japanese Guardian’s use of the field is too much. 0. Conduction becomes-'', the radiation slamming on the surface of the sniper is the main factor. This is not enough. In h, there is 200 watts of B, and in §, the application of the target t or more power is passed. In the front of the 酞 ^. In addition, the market needs a larger size camp: the display surface is the size of the screen of the common electronic display and the corresponding front display: display. With the mouth, will produce more volume, not stealing surface size The enthusiasm of the eve and the more hot chat will be transmitted to the display 201034558. In addition, when the display + wn corrects a ', y, Yi 疋 in the outdoor environment... May contain pollutants in the brothers ^ ^ brother. 皋 dust, sand, smoke, etc.", pounds, pollen, water vapor, sputum for internal cooling :::: These pollutants are absorbed into Damage to the display.硓 硓 硓 现代 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于 对于The device, such as crFr " the brightness of the degree of production, the lighting installed directly like the CCFL components, LEDs, the production of the J-Ah LEDS and the plasma components can produce a large amount of heat. In addition, the clothes and clothing have a considerable amount of power in order to produce the required degree of brightness. In the case of #4大大, the power is generally supplied through one or more power supplies for the display. These power supplies can also become a significant source of heat for the display. When the device to be used is used in an outdoor environment, directly exposed to the sun or other difficult thermal environment, it is very common for the temperature to fluctuate greatly. Such temperature fluctuations can adversely affect the service life and performance of the sub-assemblies of these devices.广U 容内明发; The ancient 糸 已经 已经 f f f 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者 者It is expected that the side of the audience will flow heat. These relatively simple examples may include two separate flow paths 'for gases passing through the electronic display. - a first - flow path: 5 201034558 Open circuit and a second flow path can be closed loop. The closed path advances past the image assembly, the surface of the road, and continues to the rear of the display & where it can enter one of the hot parent converters and finally return to the front surface of the image assembly. The route along the road is drawn through the display (possibly through a heat exchange g, and then exchange) gas (for example, ambient gas) and then the gas is drawn _, the hole is discharged outside the display housing . - A heat exchange test can be used to heat the heat from the closed wire, '. . The road is transferred to the open circuit and discharged out of the display. Alternatively, the 1st, the road can also be forced to be behind the image assembly (when the backlight is 'other times 〇Led or other type of assembly) to cool the image assembly and / or backlight combination In the middle of the special type of display used by the scholars and the households, it is necessary to use a backlight. A parent and flow heat exchanger can be used in the illustrative example. Other systems are used to cool the following sub-f5 positions. The system is either alone or in combination: () power 杈 group, (2) backlight And (1) the front display surface. = The power module with heat dissipation components (for example, cold plate and/or heat sink) can be placed in the path of the environmental emulsion with some of the side systems that make the power module contain the heat sink assembly, and the power module Side systems containing sensitive electrical components continue to be used together with instances in separate environments. An isolation structure provides the required isolation of gas (X and sometimes particulates/contaminants) between the two sides of the power module. When using a closed loop gas cooling power module, the closed loop may or may not be used. A backlight with a front and rear side can be used with some examples for the 201034558 LCD display and the rear side contains a 敎 conduction meter. The side of the side contains the illumination device Φ Φ..., "', ', Conductive surface, used to heat from the lighting device... There should be a low degree of thermal resistance between the front side and the rear side of the backlight. The power module is placed in a plurality of heat-conducting ribs... Connected, wherein the ribs are placed in the path of cooling air (sometimes the surrounding gas). The heat from the τ from the power module is distributed throughout the entire (four) section ^ is removed by the cooling air I have been found to force air through the passage of the 1st floor defined by the ribs to enhance the ability of the heat to remove from the power module. In another example, the power module and the display backlight Source (or image assembly): both are in thermal communication with the ribs. In this way, cooling air (sometimes ambient gas) @单-path can be used to cool - a typical electronic display Two of the warmest components. For example, 'and not in a limiting manner' LED arrays t are used as lighting fixtures for coffee displays. It has been found that the optical properties of LEDS (and other ambiguous devices) It can vary depending on the temperature. Therefore, when the coffee is exposed to room temperature, it can output light with a certain brightness, wavelength and/or color temperature. However, when the same LED is exposed to high temperatures, the brightness is clear. Lu, wavelength, color temperature, and other properties may change, when: the change in degree is across the LEDs #:琢f# r- L and the other sources (some regions are at a higher temperature than other regions)% When present, 'there may be optical variability across the backlight that is visible to the viewer. By using the examples herein, heat growth can be evenly distributed throughout the ribs and removed from the display. 7 201034558 This will prevent any 'hot spots' that may be in the source of the wells. Because of the lighting device (there are av b τΕΤΛ, 4 4 is 'but not always

LbDs )之光學性質的改變而對 K觀察者來說是可以看見 的。在其他實施例之中,影像組 ^ A 口件(而不是背光源)係 與肋。卩以熱相連通。所述影像組合 0件可以包含有任何形式 用於產生影像的電子組合件,包括有、但是不限於:LCD、 發先二極體(LED)、有機發光二極體(〇LED)、場發射 式平板顯示器(刚)、發光聚合物(LEp)、電毀顯示器 以及任何其他平坦/薄型的面板顯示器。 …:述肋部可以提供一個隔離纟室,其係與其他部分的 頒不器隔離開,使得周圍的空氣可以被吸收以及用來冷卻 肋部。這對於其中顯示器係在戶外的環境中使用以及被吸 收的空氣可能含有會傷害顯示器敏感 (花粉、污物、灰塵、水、煙氣等等)的情況是有^ 。如果—個背光源與特殊的顯示器應用一起使用的話, 可以使用一個具有前方以及後方側邊的背光源,其中前方 侧邊含有照明裝置以及後方側邊含有一個熱傳導表面,用 :將熱從照明裝置散發出去。理想的情況是,纟背光源的 別^以及後方側邊之間的熱阻力的程度應該是报低的。一 項說明性實例含有一個金屬肖心、PCB,纟在前方側邊上具 有LEDs以及在後方側邊上具有一個金屬表面。 藉著下文所描述的觀點,本文的說明性實例已經使得 ^對大型電子顯不器的前後一致的冷卻成為可能的,即便 疋在炎熱的氣候以及放置在直接陽光罩設下也是如此。該 201034558 等實例也不需要任何形式的空氣調節裝置(雖 要的話可以使用),而降低 有而 需求。 f低了對於顯示器的空間以及能量 S兑明性實施例的以上及其 上及异他特點以及優點從以 fk附圖式中說明之本發明特殊資 在 个货β狩琛霄施例的更加 會變得更加明白。 β h迷將 ❹ ❹ 【實施方式】 圓1說明了典型的動力模組7的-項實施例,該動力 =可以與本文所描述的一些實例一起使用 = 電路板6可以被接附到該動力模組7以及可以含有摔作: 及控制動力模組7可能需要的複數個電子組件卜 :件5可以包括有’但是不限制於電阻器、電容器:運曾 放大益、電線車、連接器以及誘導器。—個基部板件^ 以接附到該動力模、组7且可以作用如同用於動力模組7的 :文熱組合件,使得由動力模、组7所產生的熱可以轉移 到基。P板件8。在一些實施例之中,可以使用更多的,且件 像是-個定位在動力模組與基部板件8之間的導電襯塾: 而且,如在下文之中進-步討論的,任何類型的 縛片組合件可以與縣部板彳8-起使用,以便二進^ :進其熱力性質。也可以有導電襯塾放置在該基部 與一個熱沉組合件之間。 8 圖2顯示出二個動力模組安裝在—個隔離結構9之 隔離結…致上防止介於該動力模組之二個側邊 9 201034558 之間的氣體及污染連通。所 在該隔離結構9的側邊上' ^ 且的基部板件8係 係被設計㈣㈣财卻空氣4 來猶Si 件8而通過,塾&quot;可以被用 挺i、』|方;動力模組與隔離 污毕)密私Λ 稱9之間的—個氣體(及/或 y染)在封。冷卻空氣4 卢址u山 于悮係從圍繞者顯示器的環境 處被抽出。這個環境可能含有有 物可能舍#宝+ s ) /卞物,·而此種巧染 傷害到在顯示器之中的各種電氣組件。這此有宝 的污染物包括彳' 但是不 “有害 γ名甘〇 ㈣於·灰塵、煙氣、花粉、水 有害的微粒以及其他有害氣體。因此,隔離社 構9的其中一項目沾曰西„ h離釔 、〜要防止包圍的環境冷卻空氣4接觸 到顯不器的一些敏感的電 ^ π , 电于,、且件,包括有、但是不限制於 細作以及控制動力模組所需 、、所某要的電子組件5 (顯示在圖i之 )。藉著將動力模組裝設在隔離結構9之内,包圍的環 f冷卻空氣4可以被抽到顯示器殼體之内以及被迫越過基 «件8 (广及選擇的越過熱沉以及,鰭板),以便於冷卻動 ◎ 力模組。這可以在沒有將敏感的電子組件暴露於潛在有害 的包圍的環境冷卻空氣4的情況下達成。 圖3以及圖4顯示出可以被用來冷卻動力模組以及背 光源組口 # 1 40之冷卻空氣4的實例。這些實施例顯示出 個月光源、’且。# 140 ’其係含有裝設於個印刷電路板 (PCB)的複數個照明裝置(例如,職)i4i。一項說明 性實施例係使用-個金屬核心pcB或是任何其他具有相當 低程度之熱阻力的裝設結構,使得熱可以從照明裝置 轉移到背光源組合件140的後方表面處,在該後方表面處, 10 201034558 熱可以被冷卻空氣4所移除。所述的照明裝置1 4】π 5 1 Η 1 以是 LED、鹵素、CCFL或是其他任何智產生光線的裝置。此外’ 對於某些實例來說,像是電漿、〇LED、Lep或是F 器來說,甚至可能不需要背光源組合件。然而,這此顯厂、 益類型亦已知會產生熱,並且當在本申請案中描述背光源 的冷卻時,也可以應用這些方法來冷卻這些電子影像組件' 的後方表面。因此,當顯示出背光源組件時’ d Μ取代電The optical properties of LbDs) are visible to K observers. In other embodiments, the image group (i.e., the backlight) is attached to the rib.卩 Connected by heat. The image assembly 0 may include any form of electronic assembly for generating images, including, but not limited to, an LCD, a first LED (LED), an organic light emitting diode (〇LED), and field emission. Flat panel display (ganger), luminescent polymer (LEp), electrosurgical display, and any other flat/thin panel display. ...: The ribs can provide an isolation chamber that is isolated from the other parts of the luminaire so that ambient air can be absorbed and used to cool the ribs. This is the case where the display is used in an outdoor environment and the absorbed air may contain conditions that can damage the display (pollen, dirt, dust, water, smoke, etc.). If a backlight is used with a particular display application, a backlight with front and rear sides can be used, with the front side containing the illumination and the rear side containing a heat transfer surface for: heat from the illumination Dissipated. Ideally, the degree of thermal resistance between the backlight and the rear side of the backlight should be low. An illustrative example includes a metal core, a PCB with LEDs on the front side and a metal surface on the rear side. By way of the following description, the illustrative examples herein have made it possible to achieve consistent cooling of large electronic displays, even in hot climates and under direct sunlight. The examples such as 201034558 also do not require any form of air conditioning unit (although it can be used), but there is a need to reduce it. f is lower for the space of the display and the above and above and other characteristics of the energy S-definition embodiment and the advantages from the invention described in the fk figure is more special in the cargo beta hunting example Will become more understandable. [Embodiment] Circle 1 illustrates an embodiment of a typical power module 7 that can be used with some of the examples described herein = the circuit board 6 can be attached to the power The module 7 and the plurality of electronic components that may be included in the control and power module 7 may include: but not limited to resistors, capacitors: Inducer. A base plate member ^ is attached to the power module, the group 7 and functions as the heat module for the power module 7, so that the heat generated by the power module and the group 7 can be transferred to the base. P plate 8. In some embodiments, more can be used, and the pieces are like a conductive backing positioned between the power module and the base panel 8: and, as discussed further below, any Types of the tab assembly can be used with the county board to make it into thermal properties. A conductive backing may also be placed between the base and a heat sink assembly. 8 Figure 2 shows the installation of two power modules in an isolation structure 9 to prevent gas and contamination between the two sides of the power module 9 201034558. The base plate member 8 on the side of the isolation structure 9 is designed (4) (4) The financial air 4 is passed through, and the 塾&quot; can be used as the i, 』| square; power module A gas (and/or y dye) between the segregation and the segregation is called a seal. Cooling air 4 The location of the mountain is extracted from the environment of the surround monitor. This environment may contain objects that may be #宝+ s ) / stolen goods, and this kind of coincidence damages various electrical components in the display. The pollutants of this treasure include 彳' but not “harmful γ 〇 〇 四 四 四 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 灰尘 。 。 。 。 。 „ h 钇 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , the desired electronic component 5 (shown in Figure i). By arranging the power module assembly within the isolation structure 9, the enclosed ring f cooling air 4 can be drawn into the display housing and forced to pass over the base 8 (the wider the selection and the overheating, the fins) Board), in order to cool the power module. This can be achieved without exposing sensitive electronic components to potentially harmful surrounding ambient cooling air 4. Figures 3 and 4 show an example of cooling air 4 that can be used to cool the power module and back light source port #1 40. These examples show a monthly light source, 'and. #140 </ </ RTI> It contains a plurality of lighting devices (e.g., jobs) i4i mounted on a printed circuit board (PCB). An illustrative embodiment uses a metal core pcB or any other mounting structure having a relatively low degree of thermal resistance such that heat can be transferred from the illumination device to the rear surface of the backlight assembly 140, at the rear. At the surface, 10 201034558 heat can be removed by the cooling air 4. The illumination device 1 4] π 5 1 Η 1 is an LED, a halogen, a CCFL or any other device that generates light. Furthermore, for some examples, such as plasma, 〇LED, Lep or F, a backlight assembly may not even be required. However, this type of plant and benefit type is also known to generate heat, and these methods can also be applied to cool the rear surface of these electronic image components when the backlight is cooled as described in this application. Therefore, when the backlight assembly is displayed, 'd Μ replaces the electricity

漿、OLED、FED或是LEp影像組合件。電子組件$可以科 著使用隔離結構9而與冷卻空氣4隔離。 耗 …不出-項實例,除了 一個熱沉12現在 =組以熱相連通,以便於進—步促進將熱從動組 =之外,該實例係相似於如圖3所示者。當然應該^ /意到的是,可以獲得以許多不同材料製造且具 同幾何類型的許多類祀丨沾 。午夕不 夕頰生的熱》几。任何形式的熱沉係 於各種實例且可以用來滿足不同的操作條件。 :5說明了另—項實施例,其中複數個通道] 在奇光源組合件1 4〇與隔M ,、建立 h離結構之間。通道分隔器I 6 ~τ ^用來分關每個料Μ以提供 6可 件。該等通道分隔琴丨# y+ 、口 ^祖的組合 巧^ ° 6較佳地係由熱傳導材料f造的 得它們也可以在背光湄知入守砰卄“的,使 y '、、,且5件14〇與隔離結構9之n 熱。一個熱傳導通道分 再之間轉移 或是隔離結構9任—者;;取教也可以從f光源组合件U0 通過通道15的空氣…以及可以將熱發散到移動 J工花之中。因此,—此 抑 含有鰭片或是熱沉,以便-…“16可以 便於促進到達移動通過通道ΜPulp, OLED, FED or LEp image assembly. The electronic component $ can be isolated from the cooling air 4 by the use of the isolation structure 9. In the case of a heat sink 12, except that a heat sink 12 is now connected to the heat phase in order to facilitate the step of promoting the heat slave group, the example is similar to that shown in FIG. Of course, it should be possible to obtain many types of defects that are manufactured in many different materials and of the same geometry. The heat of the midnight eve is a few. Any form of heat sink is used in various examples and can be used to meet different operating conditions. : 5 illustrates another embodiment in which a plurality of channels are between the odd light source assembly 14 and the partition M, and the h is separated from the structure. Channel dividers I 6 ~ τ ^ are used to separate each magazine to provide 6 components. The channels are separated by the 丨 、 、 、 、 ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° ° 5 pieces of 14 〇 and n of the isolation structure 9 heat. A heat conduction channel is transferred between the two or the isolation structure 9;; the teaching can also be from the f light source assembly U0 through the air of the channel 15 ... and can be hot Divergence to the mobile J-worker. Therefore, this contains fins or heat sinks so that -... "16 can facilitate the arrival of moving through the channel.

II 201034558 氣的熱傳導。 圖6顯示出向下看到 含有熱沉12,用於裝設,視圖’該通道15 '又。亥隔離結構9之内的—個動力模 組。一些通道15可以含有動力模組,而其他通道可以不含 有動力模組。一個通道風扇17可以被用來將空氣抽過該通 道…以便於冷卻該熱沉12(如果使用的話^及該㈣II 201034558 Heat transfer of gas. Figure 6 shows the downward view of the heat sink 12, which is used to mount the view 'the channel 15' again. A dynamic model within the isolation structure 9 of the sea. Some channels 15 may contain power modules, while other channels may not include power modules. A passage fan 17 can be used to draw air through the passage ... to cool the heat sink 12 (if used) and (4)

道分搞器16 (如果是熱傳導的話)與背光源140 (或是用 於led顯示器的LED組合件)。每個通道15可以含有一 個或多個通道風扇17。某些通道可以不含有風扇,但是可 以單獨地仰賴自然對流來容許熱可以上升並且離開通道。 士在下文中最後Θ論到%,所述風扇可以放置在顯示器組 合件之中的任何處以及可以㈣來將空氣抽過通道、將空 氣推過通道'或是以上二者的組合。The splitter 16 (if it is thermally conductive) and the backlight 140 (or LED assembly for a led display). Each channel 15 can contain one or more channel fans 17. Some channels may not contain a fan, but may rely solely on natural convection to allow heat to rise and exit the channel. In the following, at %, the fan can be placed anywhere in the display assembly and can (4) pump air through the channel, push air through the channel', or a combination of the two.

田顯示器處於操作申的同時,所述通道風扇1 7可以連 續地運轉。或者,溫度感測裝置(未顯示於圖中)可以放 置在每個通道之中且被用來測量在該通道或是任何通道組 件(背光源或是顯示器組合件、隔離結構、或是通道分隔 器)之内的溫度。根據從這些溫度感測裝置所接收到的數 據,視哪個通道需要冷卻而定,各種風扇可以用選擇的方 式卡合。因此’由於來自於動力模組的熱量更多,將空氣 抽吸通過含有動力模組之通道15的風扇17可以更加經常 的或是以較高的速度運轉。而且,含有動力模組的通道可 以合有較大型的風扇或是複數個風扇,以便於冷卻該通道。 圖7說明了使用一個熱傳導板件1 〇以及多個肋部18 12 201034558 的另-項實例。在一項實例之中,動 係與熱傳導板件10以為^ $土核件8 逋在其他實例之中,可w π 使用-個基部板件8,反而是該動力模組7係 = ;〇直接以熱相連通。由於板件!。以及肋部;== 性以及介於板件丨。以及肋部18之間的,動:本 所^生的熱將會分佈在遍及板件1〇以及肋部 = ❹ Ο 實例之中,冷卻空氣2。(周圍氣體)二: ::被用來移除已經累積在板件1〇以及肋部〗8上的敎。 7者’可以使用自㈣對流程序1以容 10以及肋部18逸出。 伋仟 複數個裝设柱可以被用來裝設電子組件,像是PCB、 :式磁碟機、計時以及控制板、導流片以及如果需要的話 至-動力模組。該等裝設柱也可以是可以熱傳導的,使 …電子組件所產生的熱也可以轉移到板件1〇以及肋部 18 U及由冷卻空氣2〇所移除。 在一項說明性實例之中’板件1〇會在含有肋部18 (以 及冷卻空,氣20)的側邊與含有褒設柱、動力模組以及任何 &quot;他電子組件的側邊之間提供氣體及污染物的障礙。如果 板件10提供了足夠的障礙’周圍空氣可以如同冷卻空氣2〇 破吸收’以及可以降低或消除污染物進入含有敏感電子組 板件10之側邊的風險。一個入口開孔2 5玎以被用來接 收冷郃空氣20以及沿著該等肋部i 8引導該空氣。 顯不在這項實例之中的肋部18含有一個中空的矩形剖 面仁疋埯並不是必要的。其他實例可以含有具有丨形樑剖 13 201034558 面、中空方形剖面、實心矩形或是實心方形剖面、‘τ,形 剖面、‘z,形剖面 '波狀或是蜂寫狀剖面、或是以上這些 剖面之任何組合或混合的肋部。較佳的是,該等肋部a: 可以熱傳導的。在-些實例之中,可以使用金屬來製造肋 部1 8。 〇 圖8顯示出另-項實例’其中肋部⑴系用來將敎從一 個背光源組合件分散出來以及冷卻該背光源組合件。在這 項實例之中的背光源組合件包括有裝設在_個熱傳導基板 上的複數個照明裝置32。在這項說明性實例之中,照明 裳置32會是LEDs&amp;及熱傳導基板3〇會是一個pcB,且更 佳的是-個金屬核心PCB。在熱傳導基板3〇面對著肋部Η 勺表面上可以有-個熱傳導表面35。在—項說明性實例之 中’該熱傳導表面35係金屬的,且更㈣是紹。較佳的是, 肋部18係與後方表面35以熱相連通且該後方表面μ則與 '、、、傳穿基板3G以熱相連通。然而,在—些實例之中,該熱 傳V基板30可以包含有傳統式pcB材料而不是金屬核心 PCB或是任何高度熱傳導的材料。最佳的是,在該等照明While the field display is in operation, the channel fan 17 can be operated continuously. Alternatively, a temperature sensing device (not shown) can be placed in each channel and used to measure the channel or any channel component (backlight or display assembly, isolation structure, or channel separation) The temperature within the device). Depending on which data is received from these temperature sensing devices, depending on which channel requires cooling, the various fans can be snapped in a selected manner. Therefore, due to the greater heat from the power module, the fan 17 that draws air through the passage 15 containing the power module can operate more often or at a higher speed. Moreover, the channel containing the power module can be combined with a larger fan or a plurality of fans to facilitate cooling of the channel. Figure 7 illustrates another example of the use of one thermally conductive plate member 1 and a plurality of ribs 18 12 201034558. In one example, the kinetic system and the heat conducting plate member 10 are considered to be in the other examples, and the base plate member 8 can be used for the π, but the power module 7 system = 〇 Directly connected by heat. Thanks to the board! And ribs; == sex and between the plates. And between the ribs 18, the heat generated by the body will be distributed throughout the panel 1 〇 and the rib = ❹ Ο example, cooling the air 2. (Environmental Gases) II: :: is used to remove the enthalpy that has accumulated on the panel 1 and the ribs 8 . The 7th can be used to escape from the (4) convection program 1 and the rib 18.汲仟 A number of mounting posts can be used to mount electronic components such as PCBs, :Disk drives, timing and control panels, baffles and, if necessary, to-power modules. The mounting posts can also be thermally conductive so that the heat generated by the electronic components can also be transferred to the panel 1 and the ribs 18 U and removed by the cooling air 2 . In an illustrative example, the 'plate 1' will be on the side containing the rib 18 (and the cooling air, gas 20) and the side containing the column, the power module, and any &quot;his electronic components. Provide barriers to gases and contaminants. If the panel 10 provides sufficient obstruction 'the ambient air can be absorbed as the cooling air 2' and the risk of contaminants entering the side containing the sensitive electronic panel 10 can be reduced or eliminated. An inlet opening 25 is used to receive the cold air 20 and to direct the air along the ribs i 8 . It is not necessary that the ribs 18 not shown in this example contain a hollow rectangular section. Other examples may include a cross-section 13 201034558 face, a hollow square profile, a solid rectangle or a solid square profile, 'τ, a profile, a 'z, a profile' wave or a bee-like profile, or more Any combination or mixed rib of the profile. Preferably, the ribs a: are thermally transmissive. Among the examples, the ribs 18 can be made of metal. 〇 Figure 8 shows another example where the ribs (1) are used to disperse the crucible from a backlight assembly and to cool the backlight assembly. The backlight assembly of this example includes a plurality of illumination devices 32 mounted on a thermally conductive substrate. In this illustrative example, the illumination strip 32 would be a LEDs &amp; and the thermally conductive substrate 3 would be a pcB, and more preferably a metal core PCB. There may be a heat conducting surface 35 on the surface of the heat conducting substrate 3 facing the ribs. In the illustrative example, the heat conducting surface 35 is metallic and more (four) is. Preferably, the rib 18 is in thermal communication with the rear surface 35 and the rear surface μ is in thermal communication with the ',, and the transmissive substrate 3G. However, among these examples, the heat transfer V substrate 30 may comprise a conventional pcB material instead of a metal core PCB or any highly thermally conductive material. Best of all, in such lighting

裝置3 2與肋都1 2 h A 之間的熱阻的程度很低。冷卻空氣2〇可 以再次被迫沿著狀! q 者肋。卩1 8 ’以便於將熱從背光源組合件移 除。當這種情況也可以透過自然的對流而發生,但是 率的Q部—般來說是透過非自然的對流而發生的。The degree of thermal resistance between the device 3 2 and the ribs of 1 2 h A is very low. Cooling air 2〇 can be forced to follow again! q ribs.卩1 8 ' to facilitate removal of heat from the backlight assembly. This can also happen through natural convection, but the Q part of the rate generally occurs through unnatural convection.

HiT/吏-用。一個影像組合件(像是可以不使用背光源的 ’、貝不為)來取代背光源組合件,以便於冷卻該影组 合件。 14 201034558 如在以上所注意到的,許多照明裝 及OL£D)可以具有取決於、w 、以 乃#冰孓恤度而變化的性能 〆 光源或是照明組合件之内存在有‘熱點,日夺,、”:广 能會在所產生的影像之中造成可能 化二…點可 观·」此I被最終消費 不平整。因此,藉著本文所描述的 人放私立丄l J秀匕由背光源組 δ件所產生的熱可以分佈在各種肋部及熱 以便於移除熱點以及冷卻背光源。 地’ 、在-項說明性實例之中’肋部18可以被用來冷 源組合件以及動力模組二者。在一 中,狀邱】〇 “ 貝另外的况明性實例之 中肋。卩18也可以藉著將它們放置在與熱傳導板件丨〇的 熱連通之中而被用來冷卻任何另外的電 , 、、’且1干。因此,藉 者在中央位置之中的肋部18, ‘正面,合县鉗 猫〜^ θ疋朝向顯示器的 預疋硯察者,@ ‘背面,|會是在預定觀察 邊卜。m 相對的側 瓊上因此,肋部18的前方側邊將會是與— 杜 U牙九源组合 (或是其他照明或是產生影像的組合件)以熱相連通, 以及肋部的後方側邊將會是與一個後方板件(亦即,=傳 導板件10) u熱㈣通。f 一路徑的冷卻空氣因此可:被 用來冷卻顯示器的内部,而各種熱點可以將熱分佈在肋部 乂及其他熱傳導表面各處,以提供最有效率的 4 情、、&quot;τ、 1。種 σ以在不需要將敏感的電氣組件暴露於周 一 染物及/或微粒的情況下達成。 &quot;&quot; 圖9顯示出示例性電子顯示器1 0 〇的後側,复HiT / 吏 - use. An image assembly (such as a backlight that can be used without backlighting) is used in place of the backlight assembly to facilitate cooling of the shadow assembly. 14 201034558 As noted above, many lighting fixtures and OL£D) can have a performance that depends on, w, or the degree of ice hickey, or that there is a 'hot spot' in the lighting assembly. Days, ": Guangneng will make a possible difference in the images produced... a considerable point." This I was eventually consumed unevenly. Therefore, the heat generated by the backlight group δ can be distributed over various ribs and heat by means of the human liberation described herein to facilitate removal of the hot spot and cooling of the backlight. The ribs 18 can be used in both the cold source assembly and the power module. In one case, the ribs of the shells are also used to cool any additional electricity by placing them in thermal communication with the heat transfer plates. , , , 'and 1 dry. Therefore, the borrower in the central position of the rib 18, 'front, Hexian pliers cat ~ ^ θ 疋 toward the monitor's pre-viewer, @ 'back, | will be in The front side of the rib 18 will be in thermal communication with the combination of the other elements (or other illumination or image-forming assembly), and The rear side of the rib will be hot (four) with a rear panel (ie, = conductive panel 10). The cooling air of a path can thus be used to cool the interior of the display, while various hotspots can Distribute heat throughout the ribs and other thermally conductive surfaces to provide the most efficient, &quot;τ, 1. σ to eliminate the need to expose sensitive electrical components to Mondays and/or particulates. In the case of a situation. &quot;&quot; Figure 9 shows an exemplary electronic display 10 The back side of the cockroach

Bg 一 /、丁用於&quot; ’不器殼體的後方蓋子已經移除,以便於顯示出内部的組 件。在這項實例之中,用於閉迴路循環氣體的風扇組件10且2 15 201034558 以及 1 0 3 可以Jrn A1 了 乂 /口者一個熱交換器1〇1的二 放置。較佳地’風扇組合件1〇2係用於熱交換琴的緣而 =扇組合件103係用於熱交換器ι〇ι的出口。‘口 : 1組件可以選擇地顛倒放 -,裢 口而風扇級合# 1〇2… 扇組合件1〇3係為入 二去、, 係為出口。此外,組件102以及1(n 亚不疋必要的。一些實例可以 件用於閉迴路的描η 史用”有-個風扇組合 的話,較佳的是二果使用只有-個風扇組合件The rear cover of the Bg I/, for the &quot;' housing is removed to facilitate the display of the internal components. In this example, the fan assembly 10 for the closed loop gas and 2 15 201034558 and 1 0 3 can be placed in the second of the heat exchanger 1〇1 of the rn / mouth. Preferably, the fan assembly 1〇2 is used for the edge of the heat exchange piano = the fan assembly 103 is used for the outlet of the heat exchanger ι〇ι. ‘Mouth: 1 component can be selectively reversed -, 裢 mouth and fan grading # 1〇2... Fan assembly 1〇3 is for entering, and is for export. In addition, components 102 and 1 are not necessary. Some examples can be used for closed loops. If there is a fan combination, it is better to use only one fan assembly.

風扇組合件放置在熱交換器1G 〇 處,使仔可以‘㈣,#環氣體越過影像組 及將該循環氣體推過熱交一。然而, :::其他實例可以將隔離的氣體拉過熱交換器HH。:; 歹了以將隔離的氣體拉過影像組合件的前方。用於門,口故 二個相對的邊缘丄: 著顯示器殼體的 均非必Μ 1^^ ,組件1G4以及1〇5二者 因為有些貫例可以使用只有一個組合件以及 ❹ 1。使用推動或是拉動設計的開迴路風扇組件。因此,各 參照各種風扇《且件的妨嬰、士 田 使用用詞‘動/時’將可以用交換的方式來 、推動、拉動、‘用力推進,以及‘抽 。並且任何的定向可以與本文的各種實例一起使用。 达—可X被閉迴路風扇組件所用力推進的循環氣體主要係 1顯不益而循環。舉例來說,循;裒氣體係在一個迴路之 中則進,在該迴路處,循環氣體係接觸影像組合件的前方 ,參見圖1 〇 A到圖1 〇B )以及將熱從影像組合件轉移 到4 體。所述循環氣體因此較佳地係被引導(或被用 16 201034558 力推進、拉動等等)進人熱交換$ 1Q1之中1便 ;循環氣體轉移到周圍氣體。在此之後,循環氣體係離開 '、、、父換器101且可以回到影像組合件的前方表面1 體也可以越過數個電子組件110’以便於也將熱從這些裝: 2取出來。該等電子組件110可以是任何用來操作顯:器 、組件或是組合件,包括有、但是不限於 阻器、電容器、電池、動力模組、馬達、感應I路 裝置、線材以及線束、光源、熱電氣裝置以及開關。 t-些實例之中,當顯示器組合件可以使用在天氣冷的環 境之中日夺,電氣組件i 10也可以包括有加熱器。 衣 _為了要冷卻循環氣體(以及選擇性地冷卻如上文所教 =的背光源組合件或影像組合件),周圍氣體係被開迴路 虫4組合件104及/或丨05吸收到顯示器殼體之中。周圍氣 體可以完全是圍繞著顯示器100的周圍空氣。在—些實例 中,周圍氣體可以在被抽到顯示器中之前藉著_個戋多 :空氣調節組合件(未顯示於圖中)而受到空氣調節。: f周圍氣體被吸收到顯示器之中,該氣體可以被引導(或 =用力推進)通過熱交換器1〇1 ’以及選擇地亦橫跨背光源 ,合件或影像組合件(參見圖10A到1〇B)的後方表面或、 疋通過如圖所示的上述肋部/通道或是越過如圖所示的上 模組。藉著使用熱交換器101,熱係從循環氣體轉移到 α圍氣體。已加熱的周圍氣體接著係被排出顯示器殼體之 外0 雖然並非必要的,循環氣體以及周圍氣體較佳的是不 17 201034558 會混合。在一項較佳實例之中,熱交換器1〇1會是一個交 叉流動的熱交換器。然而,已知有許多類型的熱交換器且 這些熱交換器可以與本文的任何實例一起使用。該熱交換 器101可以是一種交叉流動式、平行流動式或是逆流動式 (管中有管(tube-within-a-tube )或是其他類形)熱交換器。 在一項說明性實例之中,熱交換器1〇1會是交又流動式且 會包含有複數個堆疊層的薄板件。該等板件可以具有一種 波狀或是蜂窩式設計,纟中複數個通道或是路徑係沿著板 件長度向下刖進。所述板件可以被堆疊起來,使得該等路❹ 徑的方向係與每個相鄰的板件交錯,以致於每個板件的路 徑大致上係垂直於相鄰板件的路徑。因此,氣體可以僅通 過其通道或是路徑係平行於氣體路徑而前進的板件而進入 熱又換器之中。因為該等板件係交錯的,閉迴路以及周圍 氣體可以在彼此相鄰的板件之中行進,並且熱可以在二種 ,體之間轉移,而所述氣體本身係不會混合(如果熱交換 器被適w地密封的話,這係較佳的但是不是必要的)。 在選擇的設計之中,一個開放的空隙可以安置在成對⑬ =具=通道或是蜂窩式板件之間。開放的空隙可以在一個 二直 '板件通道的方向之中延伸。這個開放空隙可以藉著 条材料或是帶子(特別是超強黏性(very ) (V H B ^ -HH: \ ^而在垂直於相鄰板件中之通道方向的方向 之中建立在板件的二個相對邊緣之間。因此,氣體可以行 、開放空隙(平行於條帶或是帶子),但是不會在垂 直 &gt;5^ 慨 、、f或是帶子(平行於相鄰板件的通道)的方向中 18 201034558 通過開放空隙。 其他=型的交又流動式熱交換器玎以包括有複數個管 件,所述管件含有第一氣體且垂直於第二氣體的路徑而= 進。隨著第二氣體流動越過含有第一氣體的營 &quot; 产 s 1千,熱係在 所述二種氣體之間交換。很明顯的’有許多 _ 〇〇 胡&amp;的交叉流 動式熱交換器,且任何類型的交叉流動式熱 、又換益可以鱼 本文的實例一起運作。 ❺ Ο 、, a ιτ,其中侧壁 係相當薄,使得熱可以輕易地在所述的二個氣體路徑 交換。可以使用複數種材料來創造出熱交換器。較佳地: 所使用的材料應該是可以抵抗侵#、抵抗腐爛、重量 不昂貴的。金屬係因為它們的熱傳導性高而常使用 換益。然而,已經發現到塑膠以及複合材料也可、 於電子顯示器的熱條件。一項說明性實例係利: 做用於建造用於熱交換器之板件的材料。 μ丙烯虽The fan assembly is placed at the heat exchanger 1G , so that the ‘(四), #环环 gas passes over the image group and pushes the circulating gas overheated. However, ::: Other examples can pull the isolated gas through the heat exchanger HH. :; 歹 以 to pull the isolated gas through the front of the image assembly. For the door, the mouth, the two opposite edges 丄: the display housing is not necessary 1 ^ ^, the components 1G4 and 1 〇 5 because there are some examples can use only one assembly and ❹ 1. Use an open circuit fan assembly that pushes or pulls the design. Therefore, each of the various fans can be used to refer to, push, pull, ‘force push, and ‘pump. And any orientation can be used with various examples herein. The cycle gas that is promoted by the force of the closed-loop fan assembly is mainly circulated. For example, the helium system enters in a loop where the circulating gas system contacts the front of the image assembly, see Figure 1 〇A to Figure 1 〇B) and the heat from the image assembly Transfer to 4 bodies. The recycle gas is therefore preferably guided (or pushed, pulled, etc. by force) into the human heat exchange $1Q1; the recycle gas is transferred to the surrounding gas. Thereafter, the recycle gas system exits the ',, parent switch 101 and can be returned to the front surface of the image assembly. The body can also pass over several electronic components 110' to facilitate the removal of heat from these packages. The electronic component 110 can be any device, component or assembly, including but not limited to a resistor, a capacitor, a battery, a power module, a motor, an inductive I-way device, a wire, and a wire harness, a light source. , thermoelectric devices and switches. Among the examples, the electrical component i 10 may also include a heater when the display assembly can be used in a cold weather environment. Apparel_To cool the recycle gas (and selectively cool the backlight assembly or image assembly as taught above), the ambient gas system is absorbed into the display housing by the open loop 4 assembly 104 and/or 丨05. Among them. The surrounding gas may be completely surrounding the ambient air of the display 100. In some instances, the ambient gas may be air conditioned by the air conditioning assembly (not shown) before being drawn into the display. : f The surrounding gas is absorbed into the display, which can be guided (or = forced) through the heat exchanger 1〇1' and optionally across the backlight, assembly or image assembly (see Figure 10A The rear surface of 1〇B) or 疋 passes through the above mentioned ribs/channels as shown or over the upper module as shown. By using the heat exchanger 101, the heat is transferred from the recycle gas to the alpha gas. The heated ambient gas is then discharged out of the display housing. Although it is not necessary, the circulating gas and the surrounding gas are preferably mixed. In a preferred embodiment, heat exchanger 1〇1 will be a cross-flowing heat exchanger. However, many types of heat exchangers are known and these heat exchangers can be used with any of the examples herein. The heat exchanger 101 can be a cross-flow, parallel flow or reverse flow (tube-within-a-tube or other type) heat exchanger. In an illustrative example, heat exchanger 1〇1 would be a thin plate member that would be cross-flowing and would contain a plurality of stacked layers. The panels may have a wavy or honeycomb design with a plurality of channels or paths extending downwardly along the length of the panel. The panels may be stacked such that the directions of the runners are staggered with each adjacent panel such that the path of each panel is substantially perpendicular to the path of the adjacent panel. Therefore, the gas can enter the heat exchanger only through its passage or the plate whose path is parallel to the gas path. Because the plates are staggered, the closed circuit and the surrounding gas can travel among the plates adjacent to each other, and heat can be transferred between the two, and the gas itself does not mix (if hot This is preferred but not necessary if the exchanger is properly sealed. Among the selected designs, an open gap can be placed between the paired 13==channels or the honeycomb panel. The open gap can extend in the direction of a two straight 'plate passage. This open void can be created in the panel by strip material or tape (especially super strong (very) (VHB ^ -HH: \ ^ in the direction perpendicular to the direction of the channel in the adjacent panel Between the two opposite edges. Therefore, the gas can travel, open the gap (parallel to the strip or the strip), but not in the vertical &gt;5^, f, or the strap (parallel to the channel of the adjacent panel) In the direction of 18 201034558 through the open gap. Other = type of cross-flow heat exchanger 玎 to include a plurality of tubes, the tube containing the first gas and perpendicular to the path of the second gas = into. The second gas flows over the camp containing the first gas, and the heat is exchanged between the two gases. It is obvious that there are many cross-flow heat exchangers of 〇〇 & Hu &amp; And any type of cross-flowing heat, which can be operated together with the example of this article, ❺ Ο , , a ιτ, where the sidewall system is quite thin, so that heat can be easily exchanged between the two gas paths. Use multiple materials Create a heat exchanger. Preferably: the materials used should be resistant to intrusion, resistant to decay, and inexpensive. Metals are often used because of their high thermal conductivity. However, plastics have been discovered. Composite materials are also available for thermal conditions in electronic displays. An illustrative example is the use of materials for the construction of panels for heat exchangers.

Cj經發現的I 雖然聚丙烯好像是一種很差的導熱體,相 ’ 度而為大量的表面積係產生很低的整體熱阻力。的材料厚 種說明性的熱交換器係以塑膠製成且因此合 2此丄— 重量輕的顯示器組合件。具體地規、θ -種薄且 體而使用波狀或是蜂寓狀塑膝U ^針對每個板件層 如上文提及的’入口以及出口的風扇 實例並非必要的。或者,對於每個 :口-者對於 -的風扇組合件。目此,只有一個入兄可以只使用單 閉迴路一起使用以及只有一個 ,扇組合件可以與 風肩級合件可以與開迴 19 201034558 具有入口以及出口 入口或是出口組合 路起使用。或者,其中一個迴路可以 風扇組合件二者’而另一個迴路僅具有 件其中之一。 ΊΚ. m ί± ,,.. t 〜1数目的軋筱 物貝。在一些貫例之中’可以使用 ^ ^ , 使用工乳當做用於二個迴路 的机脱。較佳地,行進通過閉迴路的 、乂 u + 扪札體應該是大致上潔 净的,使得當該氣體通過影像組合 本也_⑽人 千則方時’其對於觀察 者來况將不會影響到影像的外觀。 ^ ^ B L 订進通過閉迴路的氣體 線疋大致上沒有污染物及/或微粒(例如,灰塵、污物、 花粉、水蒸氣、煙等等),以便於防μ t „ _ 使万、防止對於影像品質的不 利影I*以及對於内部電子組件的任 N场¥。亦可能較佳的 是將在開迴路之内的氣體保持在 卜兴有,可染物的狀態。一 種選擇的過濾器(未顯示於圖中) -0 θ „ . h Y J 了以破用來確保空氣(閉 路或疋開迴路任一者之中)繼續 ..妙而如 匿',只保持在不具有污染物的 狀悲。然而,在-項說明性實例之中,開迴路可以設計成 使得π染物有可能存在於周圍氣 , ^ η 但疋廷樣將不會 ❹ 員害‘“器。在這些實例之中,熱交換器“ 合件或背光源後方或是通過肋部的選擇路徑)係經過^ 的密封’使得在周圍氣體之中的任 田 τ «7仕何巧染物不會進入 器的敏感部位之中。因此,在這 ’ ’ 块-說明性實例之中,即佶 周圍空氣含有污染物,吸入用於周 扣化周圍氣體的周圍空氣將 會損害顯示器。當顯示器係使用在 甘巧染物係存在於周圍六 氣之中的戶外環境或是室内環境 _ 二 益的。 U中時4可能是特別有 20 201034558 ❹ ❹ 圖10A說明了顯示器200之另一項實例的剖面。在這 個圖之中,係顯示出後方蓋子250以及側邊蓋子25丨及 252,以便於說明用於密封整個顯示器2〇〇的方法。所示的 景〉像組合件220係靠近顯示器200的前方。如以上所討論 的,影像組合件220可以包含有任何形式之用於產生影像 的電子組合件,包括有、但是不限於·· LCD、發光二極體 (LED )、有機發光二極體(0LED )、場發射式平板顯示 器(FED)、發光聚合物(LEP)、電聚顯示器以及任何其 他平坦/薄型的面板顯示器。前方顯示器表面221係放置在 影像组合件220的前方之中,界定出一個通道29〇,循環氣 體可以流動通過該通道。前方顯示器表面221可以是任何 透明材料(玻璃、塑膠或是複合材料)’且可以包=有= 個用於偏A、減少眩光或是反射、以及保護内部顯示^且 件的層體。在一項說明性實例之中,前方顯示器表面2幻 係包含有二個長方格的玻璃,此匕等玻璃係用光學黏著劑(較 佳的是折射率匹配)而層疊在一起,,一個偏光層可 以附著於其中一個個長方格玻璃,以便於減少内部的反射 以及負載在影像組合件220上的太陽光。最佳的是,該偏 光層係接附到前方顯示器表Φ 221的内部表面(面向閉迴 路通道290的那個表面)以及亦含有一個抗反射( 塗層。 、 對於圖10Α所示的實例來說,影像組合件22〇可以曰 具有一個背光源組合件222的—4咖…些背光源可= 使用冷陰極營光燈(CCFLs),用於製造出產生影像所需要 21 201034558 的照明。在—項說明性實施例之中,背光源組合件222係 包含有一個印刷電路板(PCB ),其在前方表面上具有複數 個LEDs (發光二極體)。如上文討論的,一項說明性實例 在背光源組合件222的前方表面與背光源的後方表面223 之間具有彳艮低程度的熱阻力。可以針對這項目的而使用一 個金屬PCB。背光源的後方表面⑵可以含有—種導熱材 料’像是金屬。鋁可以是一種用於後方表自223 _示;性 材料。-個第二表面(或是板件)224可以放置成緊密地接I found in Cj. Although polypropylene appears to be a poor thermal conductor, it produces a very low overall thermal resistance for a large number of surface areas. The thick material of the illustrated heat exchanger is made of plastic and is therefore a lightweight display assembly. Specifically, the θ-type is thin and the body is wavy or the bee-like plastic knee U ^ is not necessary for each of the plate layers. The fan instances of the inlet and the outlet mentioned above are not necessary. Or, for each: mouth-to-fan assembly. In this way, only one brother can use only one closed loop and only one, and the fan assembly can be used with the wind shoulder splicing unit with the inlet and outlet inlet or outlet combination. Alternatively, one of the loops may have both the fan assembly and the other loop has only one of the components. ΊΚ. m ί± , ,.. t 〜1 number of rolled 筱. In some cases, '^ can be used, using the working milk as the machine for the two circuits. Preferably, the 乂u + 扪 行进 body that travels through the closed loop should be substantially clean so that when the gas passes through the image combination, the _(10) person is a thousand squares, and it will not be for the observer. Affects the appearance of the image. ^ ^ BL is ordered to pass through the closed loop gas line 疋 substantially free of contaminants and/or particulates (eg, dust, dirt, pollen, water vapor, smoke, etc.) in order to prevent μ t „ _ 10,000 For the adverse effect of image quality I* and for any internal field of electronic components, it may also be preferable to keep the gas in the open circuit in the state of the dyed object. A selected filter ( Not shown in the figure) -0 θ „ . h YJ is used to ensure that the air (either in the closed circuit or in the open circuit) continues. It is wonderful, only in the absence of pollutants. sad. However, in the illustrative example, the open circuit can be designed such that the π dye is likely to be present in the surrounding gas, ^ η but the sample will not be a member of the device. Among these examples, heat exchange The device "closed or behind the backlight or through the rib's choice path" is sealed by ^' so that the Rentian τ in the surrounding gas will not enter the sensitive part of the device. Thus, in this 'block'-illustrative example, where the surrounding air contains contaminants, inhaling ambient air for circumferentially decoupling the surrounding gas will damage the display. When the display is used in an outdoor environment or indoor environment in which the smudged dye system is present in the surrounding six atmospheres. U Medium 4 may be particularly 20 201034558 ❹ ❹ FIG. 10A illustrates a cross section of another example of display 200. In this figure, the rear cover 250 and the side covers 25A and 252 are shown to facilitate the description of the method for sealing the entire display. The illustrated image assembly 220 is adjacent to the front of the display 200. As discussed above, the image assembly 220 can include any form of electronic assembly for generating images, including, but not limited to, an LCD, a light emitting diode (LED), an organic light emitting diode (0 LED). ), Field Emission Flat Panel Display (FED), Luminescent Polymer (LEP), Electro-Polymerized Display, and any other flat/thin panel display. The front display surface 221 is placed in front of the image assembly 220 to define a channel 29 through which the circulating gas can flow. The front display surface 221 can be any transparent material (glass, plastic or composite) and can include a layer of layers for biasing A, reducing glare or reflection, and protecting the internal display. In an illustrative example, the front display surface 2 is comprised of two long squares of glass that are laminated together with an optical adhesive (preferably refractive index matching), one The polarizing layer can be attached to one of the long square glasses to reduce internal reflections and sunlight loaded on the image assembly 220. Most preferably, the polarizing layer is attached to the inner surface of the front display meter Φ 221 (the surface facing the closed loop channel 290) and also contains an anti-reflection (coating. For the example shown in Figure 10) The image assembly 22 can be equipped with a backlight assembly 222. The backlights can be used to produce illumination for the 21 201034558 required to produce images. In an illustrative embodiment, backlight assembly 222 includes a printed circuit board (PCB) having a plurality of LEDs (light emitting diodes) on the front surface. As discussed above, an illustrative example There is a low degree of thermal resistance between the front surface of the backlight assembly 222 and the rear surface 223 of the backlight. A metal PCB can be used for this purpose. The rear surface (2) of the backlight can contain a kind of thermal material. 'Like metal. Aluminum can be used for rear view from 223 _; material. - A second surface (or plate) 224 can be placed in close contact

近背光源組合# 222之後方表面223的後方。介於背光源 的後方表® 223與第二表面224之間的空間可以界定出一 個另外的選擇性開迴路通道225,周圍氣體可以行進通過該 通道,以便於冷卻背光源組合件222。除了開迴路通道225 可以更窄之外,這個開迴路通道225以 示的通道1 5。 工又所 ❹ =顯示出與圖10A相同的剖面,為了解釋的目的, 側邊蓋子Μ…52係被移除,並且顯 202係被用路的空就流動。該閉迴路風扇組合件 開迴路風扇組合件2。3可以被用 的周圍氣體叫。或者,一個第二:迴=熱交換器抓 以被用來將周圍氣體212抽吸C扇組合件204可Near backlight assembly # 222 is behind the square surface 223. The space between the rear table® 223 and the second surface 224 of the backlight can define an additional selective open circuit path 225 through which ambient gas can travel to facilitate cooling of the backlight assembly 222. This open circuit channel 225 is shown as channel 15 except that the open circuit channel 225 can be narrower. The same section as Fig. 10A is shown. For the purpose of explanation, the side cover 52...52 is removed, and the display 202 is flowed by the empty space. The closed loop fan assembly is open loop fan assembly 2. 3 can be used for surrounding gas. Alternatively, a second: back = heat exchanger grip is used to draw the ambient gas 212 to the C-fan assembly 204.

沖呰*、κ , 過選擇的通道225,用於A 卻是先源組合件222。選擇的第 、25用於冷 可以被用來排出已經行進通料交路⑽组合件綱也 225的周圍氣體。如果沒有使用繁、2〇1以及通過通道 乐〜開迴路風扇組合件204 22 201034558 的話,第一開迴路風扇祖人 °件203可以被用來排出已經行 進通過熱交換器201的周圍氣體211。 如上文所注意到的,扃 J 在一項明性實例之中,周圍氣體 不會與循環氣體混合。對於影像品f來說可能很重要的 是,當循環氣體在影像組切⑽的前方行進時,此氣體 係繼續保持在沒有微粒以及污染物的狀態。由於用於開迴 路的氣體可能含有各種污染4勿,較佳的實例應該被充分地 ❹ 饴封(來u便於防止來自於二個迴路的氣體混合。然而, 坆亚非必要的’因為可以使用過濾器(可移除式的或是永 久式的)纟將微粒對於開迴路及閉迴路二者的影響降低到 最小的程度。 圖11係顯不器組合件600之另—項實例的立體剖面 圖,其係說明了用於周圍氣體20的入口開孔60以及排出 開孔65。該入口開孔6〇可以含有一個篩子或是過濾器(可 私除式的或是永久式的)來移除任何微粒(雖然這可能是 不必要的)。可以使用一個或多個風扇5〇來將周圍氣體2〇 抽入入口開孔60之中以及通過該熱交換器20 1。在這項實 例之中’周圍氣體20僅被抽吸通過熱交換器20 1,並且不 會穿過任何另外選擇的通道或是肋部。當顯示器組合件8〇 (或背光源組合件)不需要額外地冷卻額外的通道時,可 以使用這項實例。舉例來說,並且不是以限制的方式,當 使用OLED當做影像組合件go時,可以使用這項實例6〇〇。 此外’當LCD背光源因為不需要極度地明亮(或許是因為 其並不是在直接太陽光之下使用)而不會產生大量的熱 23 201034558 時’可以使用這項實施分&quot;00。又進一步地,當周圍氣體 2 0 含右 1 — 犯會知害顯示器的微粒或是污染物時,可以使用 _ :實丨在廷些情況之下,可能需要的是限制顯示器暴 硌周圍氣體2〇。因此,在這些情況之中,可能僅需要將 周圍氣體20吸入熱交換器2〇1之中,且不會通過任何另外 的冷卻通道。 ❹ 些實例之中,周圍氣體2〇在被引導到熱交換器2〇ι 义則可以文到空氣調節(或是受到冷卻)。可以使用一 個:方顯示器表面221來創造出通道290的前側(前方) 壁2及7或保護影像組合件80使其不受到傷害。一項示例性 示器表面22丨可以是玻璃。用於前方顯示器表面 項實施例可以是二個長方格的玻璃,此 劑而層壓在-起。太陽貞“來自太陽Π ❹ J ’、、、不杰表面221的輻射熱傳導)可能會在影像組人 件8〇旦(例如’ 〇LED或是LCD組合件)上產生熱的增二 此熱里可以轉移到循環氣體’其中此熱量可以接著 到周圍氣體2〇以及從顯示器排出。該影像組合件可以、、 下的任何其中之—:LCD、電魏顯示器組合件、〇LED疋 光聚合物(LEP )組合件、有機電激發光(〇EL )組合 或是LED顯示器組合件。 η 、 圖12顯示出一項說明性實例,其中一循環氣體切〇 在一個前方顯示器表面221與一個影像組合件8〇之 ’、 力推動且接著通過一個熱交換器2〇丨,以便於移除從5被用 合件8 0以及前方顯示器表面22丨吸收的至少—八象、且 刀的熱。 24 201034558 循環氣體400可以被一個閉迴路風扇会— 該熱交換器20 1可以在一個方向之中件4 I 〇所推進。 ‘時在-個大致上垂直的方向之中接受周3環氣體彻’同 可以在所述二氣體之間轉移。 。氣肢3丨〇 ’使得熱 在這項實例之中,一項選擇的另外 係透過入口開孔350而被接受且沿著通、。軋體300流 便於冷卻影像組合件80 (有可能是225被引導,以 位。這項實例使用了一組肋部18,14月光源)的後方部 m 其相似於上文顧示扁圖 7及圖8之中的設計。這項實例亦使用—個埶: 其相似於圖7所示者。當使用此選擇 ’、’、 反件1 〇 从μα μ ^ θ 遇擇的另外之周圍氣體300 的流動時,較佳的是通道225的前側( 熱傳導的,且較佳地與影像組合件 5〇0 ^ U的至少一個部位(較 •佳的是後方部位)以熱相連通。入口開 „ 网孔350可以接受周 圍氣體310以及300二者,或曰叮”各 或疋可以有用於每個氣體31〇 以及300流動之分開的入口開孔。 ❹ 與一些先前描述之實例相似的,循環氣體4〇〇也會通 過電子組件’以便於接受來自於這些電子組件的熱。在這 項明性實例之中,電子板件p 。 件已絰被熱父換器201分隔成二 個群組。第一群組的電子纟# 卞、,且件900可以被視為高動力组件 且可以包括有、但是不限制於.紅丄 、 . 疋不限制於·動力模組、感應器、變壓The punctured *, κ, over-selected channel 225, for A is the pre-source assembly 222. The selected No. 25 for cold can be used to discharge the surrounding gas that has traveled through the junction (10) assembly. The first open circuit fan ancestor 203 can be used to vent ambient gas 211 that has passed through the heat exchanger 201 if it is not used, 2, 1 and through the channel to open circuit fan assembly 204 22 201034558. As noted above, 扃 J In an illustrative example, the surrounding gas does not mix with the circulating gas. It may be important for the image material f that the gas system remains in the absence of particulates and contaminants as the circulating gas travels in front of the image cut (10). Since the gas used to open the circuit may contain various contaminations, the preferred example should be adequately sealed (to facilitate the mixing of gases from the two circuits. However, it is necessary to use it because it can be used) The filter (removable or permanent) reduces the effect of the particles on both the open circuit and the closed circuit to a minimum. Figure 11 is a perspective view of another example of the display assembly 600. Figure, which illustrates an inlet opening 60 for a surrounding gas 20 and a discharge opening 65. The inlet opening 6 can contain a screen or a filter (private or permanent) to move In addition to any particles (although this may be unnecessary), one or more fans 5〇 may be used to draw ambient gas 2〇 into the inlet opening 60 and through the heat exchanger 20 1 . The ambient gas 20 is only drawn through the heat exchanger 20 1 and does not pass through any otherwise selected channels or ribs. When the display assembly 8 (or backlight assembly) does not require additional cooling additional Channel time This example can be used. For example, and not by way of limitation, this example can be used when using OLED as the image assembly go. Also 'when the LCD backlight does not need to be extremely bright (maybe Because it is not used under direct sunlight) and does not generate a lot of heat 23 201034558 'can use this implementation point' 00. Further, when the surrounding gas 2 0 contains the right 1 - will know When it is harmful to the particles or contaminants of the display, you can use _: In some cases, it may be necessary to limit the exposure of the display to the surrounding gas. Therefore, in these cases, only the surrounding gas may be needed. 20 is sucked into the heat exchanger 2〇1 and does not pass through any additional cooling passages. ❹ In some examples, the ambient gas 2〇 is guided to the heat exchanger 2〇ι to the air conditioning (or It is cooled.) A square display surface 221 can be used to create the front (front) walls 2 and 7 of the channel 290 or to protect the image assembly 80 from damage. An exemplary The surface 22 of the device may be glass. The embodiment for the front display surface item may be two long squares of glass which are laminated to each other. The sun 贞 "from the sun ❹ ' J ', ,, 221 radiant heat conduction) may generate heat in the image group 8 (for example, '〇LED or LCD assembly). This heat can be transferred to the circulating gas 'where the heat can be passed to the surrounding gas 2〇 And discharging from the display. The image assembly can be any of the following: LCD, electrical display assembly, 疋LED phosphorescent polymer (LEP) assembly, organic electroluminescent (〇EL) combination or LED display assembly. η, Figure 12 shows an illustrative example in which a circulating gas is cut at a front display surface 221 and an image assembly 8', force pushed and then passed through a heat exchanger 2 That is, in order to remove the heat of at least the eight-image and the knives absorbed from the five used components 80 and the front display surface 22A. 24 201034558 The recycle gas 400 can be held by a closed loop fan - the heat exchanger 20 1 can be advanced in one direction. ‘When accepting a 3 ring gas in a substantially vertical direction, the gas can be transferred between the two gases. . The airlift 3' makes heat. In this example, another option is accepted through the inlet opening 350 and along the passage. The flow of the body 300 facilitates cooling of the image assembly 80 (possibly 225 is guided in place. This example uses a set of ribs 18, the light source of the 14th month). The rear portion is similar to the above diagram. And the design in Figure 8. This example also uses a single: it is similar to the one shown in Figure 7. When using this selection ',', the flow of the other ambient gas 300 that is selected from μα μ ^ θ, preferably the front side of the channel 225 (thermally conductive, and preferably with the image assembly 5 At least one portion of 〇0 ^ U (more preferably the rear portion) is in thermal communication. The inlet opening „ mesh 350 can accept both surrounding gases 310 and 300, or 曰叮” each 疋 can be used for each Gas 31〇 and 300 separate inlet openings. ❹ Similar to some of the previously described examples, the recycle gas 4〇〇 also passes through the electronic components' to facilitate the acceptance of heat from these electronic components. In the example, the electronic board p has been separated into two groups by the hot parent converter 201. The first group of electronic 纟# 卞, and the piece 900 can be regarded as a high power component and can include , but not limited to. Red 丄, 疋 is not limited to · power module, sensor, transformer

益、以及其他動力相關的裝置。第二群組的電子組件91〇 可以被視為低動力虹件且可以包括有、但是不限制於:計 ^以及控制板、硬式磁碟機及其他儲存裝置、視訊 .體驅動器、微處理器以及其他控制裝置。所屬技術領域I 25 201034558 有通常知識者已經知道的係—些高動力的電子組合件可㊣ 會與可能對於電的干擾敏感的其他電子組合件造成電干 擾因此,在所式的說明性實例之中,熱交換器2〇1係被· 用來將較低動力的電子組合件91〇從高動力電子組合件· 處分開,用以確保在二者之間的干擾量是最小的。此外, 已經知道的是有些動力電子組件900也會產生熱。此熱可 以在將此氣體導入熱交換器2〇1之中前被轉移到循環氣體 I00;〗在所示的說明性實例之中,周圍空氣可以當做周圍氣 被吸入,且傷害到電組合件910以及900的風險很 © 這疋因為周圍氣體310較佳地永不會接觸這些電組合 牛…、而,因為來自於循環氣體400的交又流動,電組合 牛910以及9〇〇將會繼續保持在冷的狀況(以及 乾燥的)。 η祀,寺i _ 本文描述的冷卻系統可以連續地運作。然而,如果有 需要的治,可以將溫度感測裝置(未顯示於圖中)結人在 電子題旨.-〒-〇〇 〇 杇......。之内,用以檢測何時溫度已經達到了預定的門Benefits, as well as other power related devices. The second group of electronic components 91 can be considered as low power rainbows and can include, but is not limited to, control panels, hard drives and other storage devices, video drives, microprocessors And other controls. TECHNICAL FIELD I 25 201034558 It is known to those skilled in the art that some highly powered electronic assemblies can be electrically disturbed with other electronic assemblies that may be sensitive to electrical interference. Thus, in the illustrative examples The heat exchanger 2〇1 is used to separate the lower power electronic assembly 91〇 from the high power electronic assembly to ensure that the amount of interference between the two is minimal. In addition, it is known that some power electronics assemblies 900 also generate heat. This heat can be transferred to the recycle gas I00 before introducing this gas into the heat exchanger 2〇1; in the illustrative example shown, ambient air can be drawn in as ambient gas and damage the electrical assembly The risks of 910 and 900 are very high. This is because the surrounding gas 310 preferably never touches these electric combination cows... and because the flow from the circulating gas 400 flows again, the electric combination of the cattle 910 and 9 will continue. Keep it in a cold condition (as well as dry).祀祀,寺i _ The cooling system described in this paper can operate continuously. However, if there is a need for treatment, a temperature sensing device (not shown) can be used in the electronic subject. -〒-〇〇 〇 杇. Within the door to detect when the temperature has reached the predetermined threshold

肢值。在此種狀況下,當在顯示器之中的溫度達 Q 值時,夂托、人&quot; *识疋数 — 々却風扇可以用選擇的方式卡合。可以選擇預 持。 丑遠系統可以被建構成有利地將該顯示器保 可接又的溫度範圍之内。典型的自動調溫組 用來達成' 1卞』以被 置 &amp;項任務。熱耦器可以被用來當做溫度感測裝 度而2風扇纟且件的速度也可以根據在該顯示器之内的溫 應該特別、'主九 4思、到的是,所揭示實例的精神以及範圍係 26 201034558 針對任何類型電子顯示器的冷卻而提供。藉著舉例的方 且非以限制的方式,實例可以與下列任一者結合^ 所有類型)、發光二極體(LED)、有機發光_ 極體(OLED )、場發射式平板顯示器(FED )、發光聚人 物(LEP )、有機電激發光(〇EL)、電聚顯示器以及任和 ’、他平坦/溥型的面板顯示器。再者,實例可以與其他類型 ,顯示器-起使用’包括有那些尚未發現的顯示器 疋’可以構想出的是,該系統可以相當良好地適用於 !的LED背景光、高晝質(1〇8〇i或是ι〇8〇ρ或是更大 晶顯示器(LCD)-起使用。雖然本文所描述的實例可以= f良好地適用於戶外的環境、它們也可以適用於其中顯厂目 器的熱穩定性可能楚於危險中的室内應用(例如,工廠、广 業環境、礦泉浴場、更衣室、廚房、浴室)。 &quot;工 也應該注意到的县,__ θ ·、、'貝不在圖中的各種冷卻通道可〜 疋以水平或是垂直的配置顯 月匕 条構想出的是,這可以根…來:但疋可以拫清楚地 ❿ 康特殊的實例而顛倒配置或是 變。因此,閉迴路可以水平 疋改 時針方向之中延伸。此外, 才十次疋圯 的,且可以從左側延伸到 疋ί直 夂狎到右側、從右側延伸到左 從頂部延伸到底部哎是踨总 乂及 J κ丨-飞疋攸底部延伸到頂部。 在已經顯示以及描述過較 1古、s杳Α 實例之後’所屬技術領竹 具有通常知識者將會了解到可 τ項域 參麼已缚耖、f沾π 進订坪夕改變以及修改來 元i已田述的發明且仍 水 .内。除此之外μ 仍…、洛入所主張之發明的範圍之 ^ 除此之外,上文指出的 叫又 泎夕几件可以改變或是以不同 27 201034558 的元件來取代’所述不同的元件將會提供 入所主張發明的精神之内。因此,本發明僅受到落 範圍之範圍所指出者的限制。 申明專利 l園式間单說明】 從閱讀以下㈣細說明以及隨附的圖式,將可 清楚地了解說明性實施例,其 ^ 干相η其中相同的兀件參考符號係 不相问的兀件,以及在其中:Limb value. In this case, when the temperature in the display reaches the Q value, the 夂, 人 &; 疋 — 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇 风扇You can choose to hold it. The ugly system can be constructed to advantageously maintain the display within a temperature range. A typical auto-tuning group is used to achieve '1卞' to be set to &amp; task. The thermocoupler can be used as a temperature sensing device and the fan speed can also be based on the temperature within the display. "The main idea is that the spirit of the disclosed example is as well Range 26 201034558 is provided for cooling of any type of electronic display. By way of example and not limitation, examples may be combined with any of the following types: light emitting diodes (LEDs), organic light emitting bodies (OLEDs), field emission flat panel displays (FEDs). , LED (LEP), organic electro-optic (〇EL), electro-concentration display and Renhe', his flat / 面板 type panel display. Furthermore, examples can be used with other types, displays - including those that have not yet been discovered 疋 ' It is conceivable that the system can be applied quite well to! LED backlight, high quality (1〇8 〇i or ι〇8〇ρ or larger crystal display (LCD) - although the examples described in this article can be well applied to outdoor environments, they can also be applied to the display factory. Thermal stability may be dangerous in indoor applications (eg, factories, wide-ranging environments, mineral baths, changing rooms, kitchens, bathrooms). &quot;Counties should also be aware of the county, __ θ ·,, 'Bei is not in the map The various cooling channels in the system can be ~ 构想 疋 疋 疋 水平 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想 构想The closed loop can be extended horizontally in the direction of the hour hand. In addition, it is only ten times, and can extend from the left side to the right side, from the right side to the left side from the top to the bottom. The bottom of J 丨 丨 疋攸 延伸 延伸 。 。 。 。 。 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在 在In the case of the invention of the invention, it is still in the water. In addition, the μ is still... </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; The description of the patents is the same as the accompanying drawings, which will clearly understand the illustrative embodiments, in which the same components are not in question. Software, as well as in it:

圖1係典型動力模組的立體視圖; 圖2係安裝在—個隔離結構之内之二個動力模 體視圖; 圖3係工員實例的立體視圖,其中冷卻空氣可以被用 來冷卻動力模組以及一個背光源組合件; 圖4係一項實例的立體視圖,除了現在一個熱沉係與 動力模組一起使用之外,該實例係相似於如圖3所示者;Figure 1 is a perspective view of a typical power module; Figure 2 is a view of two power phantoms mounted within an isolation structure; Figure 3 is a perspective view of an example of an engineer in which cooling air can be used to cool a power module And a backlight assembly; FIG. 4 is a perspective view of an example, except that a heat sink system is now used with the power module, the example is similar to that shown in FIG. 3;

圖5顯示出一項實例的立體視圖,其中複數個通道係 建立在背光源組合件與隔離結構之間; 圖7顯示出另一項實例的立體視圖,其係使用—個熱 傳導板件以及數個熱傳導肋部; 圖8顯示出另一項實例的立體視圖,其中所述肋部係 被用來將熱從一個背光源組合件分佈出來及冷卻該背光源 組合件; 圖9係一項實例的後方立體視圖,其中已經移除顯示 器後側的蓋子; 28 201034558 圖1 0 A係另一項實例的立體剖面圖,其係顯示出閉迴 路以及開迴路通道; 圖1 0B係相似於如圖1 0A所示之視圖的立體剖面圖, 其中已經儀除了後側以及側邊的蓋子; 圖1 1係另一項實例的立體剖面圖,其係顯示出用於周 圍氣體的入口以及出口開孔,所述周圍氣體係只有在該熱 交換器之内使用並且不具有另外的選擇性通道;以及 圖1 2係一項說明性實例的立體剖面圖,其中一個交叉 © 流動式熱交換器係被用來分隔開高動力以及低動力的電組 合件。 【主要元件符號說明】 4 - 冷卻空氣 5 - 電子組件 6 - 印刷電路板 7 - 動力模組 8 - 基部板件 9 _ 隔離結構 10 -熱傳導板件 11 -襯墊 12 -熱沉 15 -通道 16 -通道分隔器 17 -通道風扇 29 201034558 18 -肋部 2 0 -冷卻空氣 25 -入口開孔 30 -熱傳導基板 32 -照明裝置 35 -熱傳導表面 5 0 -風扇 5 5 -熱傳導表面Figure 5 shows a perspective view of an example in which a plurality of channels are established between the backlight assembly and the isolation structure; Figure 7 shows a perspective view of another example using a thermally conductive plate and a number a thermally conductive rib; Figure 8 shows a perspective view of another example in which the ribs are used to distribute heat from a backlight assembly and to cool the backlight assembly; Figure 9 is an example Rear stereo view, in which the cover on the back side of the display has been removed; 28 201034558 Figure 1 0 is a perspective view of another example of the A system showing closed loop and open loop channels; Figure 1 0B is similar to the figure A perspective view of the view shown in FIG. 10A, in which the rear side and the side cover are removed; FIG. 11 is a perspective cross-sectional view showing another example showing the inlet for the surrounding gas and the outlet opening. The ambient gas system is used only within the heat exchanger and has no additional selective passages; and Figure 12 is a perspective cross-sectional view of an illustrative example in which a cross-flow Heat exchangers spaced apart lines were used for high power and low power electrical combination member. [Main component symbol description] 4 - Cooling air 5 - Electronic component 6 - Printed circuit board 7 - Power module 8 - Base plate 9 - Isolation structure 10 - Heat conduction plate 11 - Liner 12 - Heat sink 15 - Channel 16 - Channel divider 17 - Channel fan 29 201034558 18 - Rib 2 0 - Cooling air 25 - Inlet opening 30 - Thermally conductive substrate 32 - Illumination device 35 - Heat conducting surface 5 0 - Fan 5 5 - Heat conducting surface

60 -入口開孔 65 -出口開孔 80 -影像組合件 100 -電子顯示器 1 0 1 -熱交換器 1 0 2 -閉迴路風扇組合件 1 0 3 -閉迴路風扇組合件 104 -開迴路風扇組合件60 - inlet opening 65 - outlet opening 80 - image assembly 100 - electronic display 1 0 1 - heat exchanger 1 0 2 - closed circuit fan assembly 1 0 3 - closed circuit fan assembly 104 - open circuit fan combination Piece

1 0 5 -開迴路風扇組合件 1 1 0 -電子組件 140 -背光源組合件 1 4 1 -照明裝置 200 -顯示器 201 -熱交換器 2 0 2 -閉迴路風扇組合件 203 -第一開迴路風扇組合件 30 201034558 - 204 -第二開迴路風扇組合件 — 2 10 -循環氣體 211 -周圍氣體 212 -周圍氣體 220 -影像組合件 221 -前方顯示器表面 222 -背光源組合件 223 -背光源的後方表面(開迴路通道的第一表面) © 224 -開迴路通道的第二表面 225 -開迴路通道 250 -後方蓋子 251 -側邊蓋子 252 -側邊蓋子 290 -閉迴路通道 300 -選擇的另外的周圍氣體 310 -周圍氣體 ® 350 -入口開孔 400 -循環氣體 410 -閉迴路風扇組合件 500 -開迴路通道的前側表面 600 -顯示器組合件 900 -第一組電子組件(高動力組件) 9 1 0 -第二組電子組件(低動力組件) 311 0 5 - open circuit fan assembly 1 1 0 - electronic assembly 140 - backlight assembly 1 4 1 - illumination device 200 - display 201 - heat exchanger 2 0 2 - closed circuit fan assembly 203 - first open circuit Fan assembly 30 201034558 - 204 - second open circuit fan assembly - 2 10 - cycle gas 211 - ambient gas 212 - ambient gas 220 - image assembly 221 - front display surface 222 - backlight assembly 223 - backlight Rear surface (first surface of the open circuit channel) © 224 - second surface of the open circuit channel 225 - open circuit channel 250 - rear cover 251 - side cover 252 - side cover 290 - closed circuit channel 300 - selected additional Ambient gas 310 - ambient gas ® 350 - inlet opening 400 - cycle gas 410 - closed circuit fan assembly 500 - front side surface of the open circuit channel 600 - display assembly 900 - first set of electronic components (high power components) 9 1 0 - second set of electronic components (low power components) 31

Claims (1)

201034558 七 、申請專利範圍·· -傻:·:種用於具有一個前側部位及一個後侧部位之電子 衫像組合件的冷卻系統,所述系統包含有: 一個前方顯示器表面,甘a $ π 部位分„; Μ與電子影像組合件的前側 合件其係由介於前方顯示器表面與電子影像組 :個熱交換器,其係與所述二體相連 ❿ 徑係與所述通道以氣體相連通; 彳之弟乳體路 個第-風扇组合件,其係定位 動㈣㈣述通道以及第一氣體路徑;以及盾錢體用力推 個第二風扇組合件,I 動而通過所述第二氣體路徑:、位成將周圍氣體用力推 =請專利範圍第1項所述的冷卻系統,其中. ❹ :::::器係—個交又流動式熱交換器。 含有…利範圍第1項所述的冷卻系統,其進—步包 一個板件,其係與電 -個第二通道,其二像、、且合件的後侧部位分隔開; 後側部位之間的空間所界心:板件與電子影像組合件的 其令所述第二風戶出來’、及 弟一風扇組合件係進— 用力推過所述第二通道。 V定位成將周圍氣體 (如申請專利範圍第 &amp;的冷郃系統,其進—步包 32 201034558 含有: 個動力模組,其係與所述電子影像組合件以電相 通;以及 個熱沉,其係與所述動力模組以熱相連通且放置在 所述第—通道之内。 5·如申請專利範圍帛3或4項所述的冷卻系统,其進〜 步包含有:201034558 VII. Patent Application Range·· - Stupid: · A cooling system for an electronic shirt assembly having a front side portion and a rear side portion, the system comprising: a front display surface, Gan a $ π The front side of the electronic image assembly is composed of a front display surface and an electronic image set: a heat exchanger connected to the two bodies and connected to the channel by gas. a young fan-fan assembly, which is positioned to move (4) (4) the passage and the first gas path; and the shield body pushes a second fan assembly, and moves through the second gas Path: The position is to force the surrounding gas to push = please refer to the cooling system described in item 1 of the patent scope, where ❹ ::::: is a system of cross-flow and flow heat exchangers. The cooling system of the present invention further comprises a plate member which is separated from the second channel of the electric, the second image, and the rear side portion of the fitting; the space between the rear side portions Boundary: plate and electronic image assembly It causes the second wind generator to come out, and the fan-fan assembly is pushed into the second passage. The V is positioned to surround the gas (such as the cold heading system of the patent application scope &amp; The advance package 32 201034558 includes: a power module electrically connected to the electronic image assembly; and a heat sink connected to the power module and placed in the first - within the channel. 5. If the cooling system described in Scope 3 or 4 is applied, the following steps include: 置在所述第二通道之内的複數個 6·-種電子顯示器組合件,其係包含有: 一個電子影像組合件; 一個隔離結構,其係與所述電子y 卞〜像組合件分隔開; 個通道’其係由介於卩晶雜 丁街Μ孓U離結構與電子影 間的空間所界定出來; ,、《件之a plurality of 6-type electronic display assemblies disposed within the second channel, comprising: an electronic image assembly; an isolation structure separated from the electronic y 卞 ~ image assembly Open; a channel 'defined by the space between the structure and the electronic shadow between the 卩 杂 杂 Μ孓 ; ; ; ; ; ; ; ; ; ; 一個動力模組,其在—個第— 件以及在第二側邊上具有—個熱沉 於隔離結構,使得所述熱沉係在所 子組件係在所述通道外側;以及 側邊上具有數個電子、誕 ’所述動力模組係接附 述通道之内以及所述電 一個風扇,其係被位成將 7.如申請專利範圍第6項 進一步包含有: 周圍氣體抽 所述的電子 吸通過所述通道。 顯示器組合件,其 一個肋部,其係放置在所述通道之 結構以熱相連通。 ' 及與所述隔離 8.如申請專利範圍第7項所述 進一步包含有: 的電子顯示器組合件,其 33 201034558 -個表面’其錢1在所㈣道q且 像組合件以及肋部以熱相連通。 、厅述電子影 9_如申請專利範圍第6、7及8項其中任 子顯示器組合件,其中: 喝所述的電 所述電子影像組合件係一個液晶顯示器。 1 〇·如申請專利範圍第6 ' 7及8項其 — 子顯示器組合件,其中: 、 —項所述的電 所述電子景〉像組合件係一個0LE ❿ 11·-種電子顯示器組合件,其係包=。 -個電子影像組合件,其具有 部位; 側以及一個後側 一個表面’其係在所述電子影 且與所述電子影像6人 ’、、’ 5件的後側部位上 像 '、且合件以熱相連通; 一個板件,其係從所述表面分隔開; -個第-通道’其係由介於 間的空間所界定出來. 板件以及所述表面之 φ 個動力杈組,其係與所述電子 連通以及與所过^ 知像組合件以電軋相 興所4板件以熱相it通;以及 一個第一風扇,其 第一通道。 其係疋位成將周圍氣體柚吸通過所述 12.如_請專利範圍第n 件,其進一步包含有· 項所述的電子顯示器組合 一個肋部’其係放置在所述第 板件以及所诚矣二 通道之内以及與所述 叮述表面以熱相連通。 34 通道’其係由介於所述a power module having a heat sinking on the first member and a second side, such that the heat sink is attached to the outer side of the channel; and the side has a plurality of electronic, "the power module is connected within the attached channel and the electric fan is set to be 7. The patent application scope 6 further includes: the surrounding gas pumping Electron is drawn through the channel. A display assembly, a rib that is placed in thermal communication with the structure of the channel. And the isolation as described in claim 7, further comprising: an electronic display assembly, 33, 33,034,558 - a surface of which the money 1 is in the (four) way and like the assembly and the ribs The heat is connected. The electronic image 9 of the invention is as claimed in claim 6, wherein the electronic display assembly is a liquid crystal display. 1 如·If you apply for the patent range 6' 7 and 8 of its sub-display assembly, where: the electric electronic image of the item described in the item is an 0LE ❿ 11·-electronic display assembly , its package =. An electronic image assembly having a portion; a side and a back side surface 'which are attached to the electronic image and are imaged on the back side of the electronic image 6 people', '5' The pieces are in thermal communication; a plate member is separated from the surface; a first channel - defined by the intervening space. The plate member and the surface of the surface It is in thermal communication with the electronic component and the electronic component of the image forming assembly, and a first fan, the first channel thereof. The system is clamped to draw the surrounding gas pomelo through the 12. The electronic display of the invention includes a rib that is placed on the first plate and It is believed that the two channels are in thermal communication with the surface of the description. 34 channels' 201034558 U•如申請專利範圍第12項所述的 件,其進一步包含有: 、,一個别方顯示器表面,其係與所述電 前側部位分隔開; … 叫 ,| /j’、 厂,| 地厂rj 述電子衫像組合件之前側部位之間的空間 個熱交換器,其係與所述第二通3 所述熱交換ϋ具有第—以及第二氣體路名 路徑係與所述第:通道以氣體相連通; 第1::「風扇’其係定位成將周圍1 第一氣體路役;以及 一個第三風扇,其 笛——帛、t ,、; 、”疋位成將循環| 弟一通道以及所述第一氣體路徑。 14. 如申請專利範圍第U到13項1, 子顯示器組合件,其中: ’、 所述電子影像組合件係—個吻。 15. 如申請專利範圍第11到13項 子顯示器組合件,其中: ” 所述電子影像組合件係一個oled。 八、圖式: (如次頁) 電子顯示器組合 子影像組合件的 顯示器表面與Μ 听界定出來; 以氣體相連通’ ,所述第一氣雜 體用力推過所述 體用力推過所述 任/項所述的電 任/項所述的電 35201034558 U. The article of claim 12, further comprising:, a peripheral display surface separated from the electrical front side; ..., | /j', factory, The ground factory rj describes a space heat exchanger between the front side portions of the electronic shirt image assembly, and the heat exchange port of the second pass 3 has a first and a second gas path name path system and the The first channel: the channel is connected by gas; the first: "fan" is positioned to circulate the first gas around the first; and a third fan, the flute - 帛, t, ,; Loop | a channel and the first gas path. 14. The sub-display assembly, wherein: ’, the electronic image assembly is a kiss, as claimed in claim U. 15. For the sub-display assembly of claim 11 to 13, wherein: ” the electronic image assembly is an oled. VIII. Schema: (such as the next page) The display surface of the electronic display combined sub-image assembly Μ 界定 界定 ; ; ; ; ; ; ; ; ; 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以 以
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI693448B (en) * 2018-07-04 2020-05-11 光遠科技股份有限公司 Heat exchange device and display device

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8854595B2 (en) 2008-03-03 2014-10-07 Manufacturing Resources International, Inc. Constricted convection cooling system for an electronic display
US8497972B2 (en) 2009-11-13 2013-07-30 Manufacturing Resources International, Inc. Thermal plate with optional cooling loop in electronic display
US8654302B2 (en) 2008-03-03 2014-02-18 Manufacturing Resources International, Inc. Heat exchanger for an electronic display
US8773633B2 (en) 2008-03-03 2014-07-08 Manufacturing Resources International, Inc. Expanded heat sink for electronic displays
US8749749B2 (en) 2008-12-18 2014-06-10 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with manifolds and ambient gas
US10827656B2 (en) 2008-12-18 2020-11-03 Manufacturing Resources International, Inc. System for cooling an electronic image assembly with circulating gas and ambient gas
EP2438588A4 (en) 2009-06-03 2013-01-16 Mri Inc Dynamic dimming led backlight
US8804091B2 (en) * 2010-08-20 2014-08-12 Manufacturing Resources International, Inc. System and method for thermally controlling an electronic display with reduced noise emissions
CA2888494C (en) 2012-10-16 2019-09-24 Manufacturing Resources International, Inc. Back pan cooling assembly for electronic display
WO2014158642A1 (en) * 2013-03-14 2014-10-02 Manufacturing Resources International, Inc. Rigid lcd assembly
US9648790B2 (en) 2013-03-15 2017-05-09 Manufacturing Resources International, Inc. Heat exchanger assembly for an electronic display
US10524384B2 (en) 2013-03-15 2019-12-31 Manufacturing Resources International, Inc. Cooling assembly for an electronic display
US9690137B2 (en) 2013-07-03 2017-06-27 Manufacturing Resources International, Inc. Airguide backlight assembly
KR101894027B1 (en) 2013-07-08 2018-08-31 매뉴팩처링 리소시스 인터내셔널 인코포레이티드 Figure eight closed loop cooling system for electronic display
US10191212B2 (en) 2013-12-02 2019-01-29 Manufacturing Resources International, Inc. Expandable light guide for backlight
EP3468321B1 (en) * 2014-03-11 2021-04-28 Manufacturing Resources International, Inc. Method for mounting a display to a wall
US10527276B2 (en) 2014-04-17 2020-01-07 Manufacturing Resources International, Inc. Rod as a lens element for light emitting diodes
KR101885884B1 (en) 2014-04-30 2018-08-07 매뉴팩처링 리소시스 인터내셔널 인코포레이티드 Back to back electronic display assembly
US10649273B2 (en) 2014-10-08 2020-05-12 Manufacturing Resources International, Inc. LED assembly for transparent liquid crystal display and static graphic
US9723765B2 (en) 2015-02-17 2017-08-01 Manufacturing Resources International, Inc. Perimeter ventilation system for electronic display
US10261362B2 (en) 2015-09-01 2019-04-16 Manufacturing Resources International, Inc. Optical sheet tensioner
KR102104342B1 (en) 2016-03-04 2020-04-24 매뉴팩처링 리소시스 인터내셔널 인코포레이티드 Cooling system for double-sided display assembly
KR102347941B1 (en) * 2016-05-20 2022-01-07 엘지전자 주식회사 A cooling apparatus for display and a display device using the same
KR20170131095A (en) 2016-05-20 2017-11-29 엘지전자 주식회사 A cooling apparatus for display and a display device using the same
RU168792U1 (en) * 2016-06-02 2017-02-21 Акционерное общество "РТСофт" Universal computing platform with heat dissipation from heat-generating components
KR102236771B1 (en) * 2016-12-02 2021-04-06 삼성전자주식회사 Outdoor display apparatus
CN110573946B (en) 2017-04-23 2022-03-04 Lg电子株式会社 Display device
KR102037323B1 (en) * 2017-04-23 2019-10-28 엘지전자 주식회사 Display device
WO2018200905A1 (en) 2017-04-27 2018-11-01 Manufacturing Resources International, Inc. System and method for preventing display bowing
US10485113B2 (en) 2017-04-27 2019-11-19 Manufacturing Resources International, Inc. Field serviceable and replaceable display
GB2565997B (en) * 2017-04-28 2019-10-16 Amscreen Group Ltd Crossflow heat-exchangers
KR102193772B1 (en) * 2017-07-14 2020-12-22 삼성전자주식회사 Display apparatus and controlling method thereof
CN107393423A (en) * 2017-09-12 2017-11-24 南京宝丽晶电子科技有限公司 A kind of heat dissipation type panel display screen
US10559965B2 (en) 2017-09-21 2020-02-11 Manufacturing Resources International, Inc. Display assembly having multiple charging ports
KR102052706B1 (en) * 2017-12-04 2019-12-05 엘지전자 주식회사 A Cooler for Display Device
US10602626B2 (en) 2018-07-30 2020-03-24 Manufacturing Resources International, Inc. Housing assembly for an integrated display unit
US11096317B2 (en) 2019-02-26 2021-08-17 Manufacturing Resources International, Inc. Display assembly with loopback cooling
US10795413B1 (en) 2019-04-03 2020-10-06 Manufacturing Resources International, Inc. Electronic display assembly with a channel for ambient air in an access panel
CN110850619A (en) * 2019-11-07 2020-02-28 深圳市华星光电半导体显示技术有限公司 Display device
CN111006362B (en) * 2019-12-11 2021-07-23 珠海格力电器股份有限公司 Air conditioner
RU199413U1 (en) * 2020-04-30 2020-08-31 Общество с ограниченной ответственностью «Системы накопления энергии» Battery storage rack
US11477923B2 (en) 2020-10-02 2022-10-18 Manufacturing Resources International, Inc. Field customizable airflow system for a communications box
US11778757B2 (en) 2020-10-23 2023-10-03 Manufacturing Resources International, Inc. Display assemblies incorporating electric vehicle charging equipment
US11470749B2 (en) 2020-10-23 2022-10-11 Manufacturing Resources International, Inc. Forced air cooling for display assemblies using centrifugal fans
US11966263B2 (en) 2021-07-28 2024-04-23 Manufacturing Resources International, Inc. Display assemblies for providing compressive forces at electronic display layers
US11919393B2 (en) 2021-08-23 2024-03-05 Manufacturing Resources International, Inc. Display assemblies inducing relatively turbulent flow and integrating electric vehicle charging equipment
US11744054B2 (en) 2021-08-23 2023-08-29 Manufacturing Resources International, Inc. Fan unit for providing improved airflow within display assemblies
US11762231B2 (en) 2021-08-23 2023-09-19 Manufacturing Resources International, Inc. Display assemblies inducing turbulent flow
US11968813B2 (en) 2021-11-23 2024-04-23 Manufacturing Resources International, Inc. Display assembly with divided interior space
US12010813B2 (en) 2022-07-22 2024-06-11 Manufacturing Resources International, Inc. Self-contained electronic display assembly, mounting structure and methods for the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU815980A1 (en) * 1977-05-20 1981-03-23 Предприятие П/Я В-8872 Optic projection system
SE505272C2 (en) * 1994-12-14 1997-07-28 Ericsson Telefon Ab L M Cooling system for telecommunications equipment
US5991153A (en) * 1997-10-31 1999-11-23 Lacerta Enterprises, Inc. Heat transfer system and method for electronic displays
EP1408476B1 (en) * 2002-10-10 2014-10-15 Barco N.V. Light emission display arrangements
GB2402205A (en) * 2003-05-20 2004-12-01 Densitron Technologies Plc A display system cabinet and display system including heat removal means
KR20060070176A (en) * 2004-12-20 2006-06-23 삼성전자주식회사 Cooling apparatus and liquid crystal display device having the same
JP4227969B2 (en) * 2005-03-17 2009-02-18 Necディスプレイソリューションズ株式会社 Projection display
KR100949501B1 (en) * 2005-12-29 2010-03-24 엘지디스플레이 주식회사 Apparatus of cooling bonded substrates and Method of fabricating Liquid Crystal Display Device using the same
EP1951020A1 (en) * 2007-01-26 2008-07-30 ISL media Singapore PTE LTD Casing to install electric or electronic instruments
JP4516582B2 (en) * 2007-05-15 2010-08-04 株式会社日立製作所 Liquid crystal display

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI693448B (en) * 2018-07-04 2020-05-11 光遠科技股份有限公司 Heat exchange device and display device

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