201032285 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種對位方法及裝置，特別是指一種 可以定位微小元件的非接觸式對位方法及裝置。 【先前技術】 由於人類對微小化元件的殷切需求，目前國内產業已 由微米（1(Γ 6 m)科技領域進入了奈米（10 _ 9 m)科技領域， 在面臨21世紀高科技發展的競爭中，奈米技術將是國家高 φ 科技發展政策中不可或缺的一環。 以半導體產業為例，諸如靜態隨機儲存器（Static Random-Access Memory, SRAM )、磁性隨機記憶體（ magnetic random access memory, MRAM)、場效電晶電體（ Field-Effect Transistor, FET )等元件尺寸，都已能小至 90nm ° 惟，前述微小元件並不適用於一般傳統的定位平台控 制系統，因此，目前主要的作業方式，仍然是以人工或以 Φ 機械手臂逐一夾取微小元件定位在預設的位置，再進行後 續的加工處理，不但耗費時間、耗用人力，且產量受限於 逐一夾取的動作，而無法提升產量，有成本較高、不符合 產業需求的缺失。 【發明内容】 因此，本發明之目的，即在提供一種創新的定位方式 ，可以簡化對位程序、大幅提昇產量，並有效降低成本的 非接觸式對位方法及裝置。 201032285 於是，本發明非接觸式對位方法是以—基板為載體 乂該基板上的焊劑為黏結刺，包含下列步驟··步驟^ ·· 使該元件散落在焊劑上。步驟2:使該元件受—磁性扭矩作 用’在焊劑上旋動，錢_增與㈣的重合區域。步驟3 •該元件完全覆蓋於焊劑，且獲得定位。 本發明非接觸式對位裝置，包含一第一磁力組，是可 旋動歧置在該基板-側，絲對該元件產生磁性扭矩， 使該元件逐漸擴增與烊劑的重合區域，至完全覆蓋於焊劍 而獲得定位。 本發明的功效是能藉由磁性扭矩旋動元件至與焊劑重 合，達到自動化對位的目的。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中將可 清楚的呈現。 參閱圖1、圖2,本發明對位裝置的一較佳實施例，是 以一基板1為載體，及以該基板1上的焊劑2固結一微小 元件3(如晶片）。該基板1具有塗佈在一外表面的一疏水層 11 ’及界定在該疏水層11間且供焊劑2塗佈的一親水區12 。該疏水層Π是以链鎮或鑛銅方式形成，除了可以疏離焊 劑2外’更兼具有良好的磁力穿透性。焊劑2在本較佳實 施例是一種熔點約為72 °C的焊錫材料。該對位裝置包含— 第一磁力組4、一第二磁力組5，及一溫控單元6。 該第一磁力組4具有位於該基板1 一下方侧的一第— 201032285 磁塊41，及驅動該第一磁塊41旋轉的一馬達42。 該第二磁力組5具有固定在該基板i 一上方侧的一第 二磁塊51。 該溫控單元6具有與該基板丨疊合且用於㈣該基板i 溫度的一電熱板61。 參閱圖1、® 2’及圖3’以下即針對本發明使用該對 位裝置定位該微小元件i的方法並結合實施例步驟說明如 后： 步驟71 :於該基板1外表面塗佈該疏水層u，及形成 有界定在該疏水層11間的親水區丨2。 步驟72 :塗佈焊劑2於該基板1的親水區12。 步驟73 :透過該電熱板61加熱該基板丨， 上的焊齊"熔化’且受限於該疏水層U的材料特性，而匯 聚在該親水區12内。 步驟74:參閱圖3、圖4,使該微小元件3隨機的散落 在焊劑2上，此時’該微小元件3是以任意角“與浑劑2 交疊，且與焊劑2間形成有相互黏滯的表面作用力。 參閱圖4、圖5,以垂直通過焊劑2的_ γ轴（9〇度）為 中心，可以看ώ，該微小元件3與焊劑2間的表面能是隨 著交叠角度Θ增加而提升’當該微小元件3與焊劑2的交 叠角度㈣近0度時，表面能最小，當交叠角度趨近9〇度 時，表面能最大。 步驟75:參閱圖i、圖3’以該第二磁塊51產生的磁 場吸引該微小元件3 ’使該微小^件3受前述磁性吸力作用 201032285 可以克服部份表面能，使該微小 浮貼於焊劑2上，藉此， 元件3容易被旋動。 步驟76 :以該馬達42驅動該第一磁塊41旋動，使該 第一磁塊41相對該微小元件3產生—磁性扭矩，使該微= 元件3受前述磁性扭矩作用，在焊齊丨2上旋動，逐漸擴增 與焊劑2的重合區域，及降低系統總表面能。 、θ 參閱圖6、圖7,可以看出，該微小元件3被旋動所需 的扭力，大致上是隨著交疊角度0減小而提升該第—磁 塊41相對該微小元件3產生的磁性扭矩，是隨著旋轉角度 ’及該微小元# 3與焊劑2的交疊角度0變化，在任意^ 疊角度Θ的情形下，該微小元件3都可以受正轉或逆轉之 磁性扭矩作用在焊劑2上旋動。 步驟77:參閱圖3、圖8’當該微小元件3完全覆蓋於 焊劑2時’該第一磁塊41產生的磁性扭矩，已無法再旋動 該微小7G件3 ’使該微小元件3穩定於焊劑2上，完成對位 程序。 參閱圖1、圖4’值得一提的是，本發明也可以透過一 監控裝置（圖未示），辨識該微小元件3與該焊劑2的交疊角 度與方向是位於(Χ、Υ)象限内，或位於(-X、Υ)象限内，藉 此，控制該馬達42選擇性正、逆向媒動該第-磁塊41，使 該微小元件3能以最小角度旋轉至完全對位。 參閱圖9，及附件1、附件2，以交叠角度0 =45度為 例’該微小元件3旋動至完全與焊劑2重合，大約費時 私萬父疊角度(9 =90度，該微小元件3旋動至完全與 201032285 焊劑2重合，大約費時26.5秒。 據上所述可知，本發明之非接觸式對位方法及裝置具 有下列優點及功效： 、 本發明是藉由磁力，在不接觸微小元件3的情形下， 達到自動對位的目的。由於本發明對位裝置的特殊結構與 -· 定位方法，可配合該微小元件3縮小尺寸或大量複製，因 此，設備成本低，不但能節省對位時間、人力及成本，且 ^ 能大幅提昇產量，使本發明更具有經濟效益》 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾皆仍 屬本發明專利涵蓋之範圍内。 附件1:該微小元件的與焊劑交#角度卜45度時 位照片。 φ 附件2 :該微小元件的與焊劑交#角度0=9G度時的對 【圖式簡單說明】 圖1是J0L體圖，說明本發明一非接觸式對位裝置的 一較佳實施例； .圖2疋該較佳實施例中一基板塗佈有谭劑的—立趙圖 f 圖3是本發明—非接觸式對位方法的—流程圖； 7 201032285 圖4是該較佳實施例中一元件與焊劑交疊的一示意圖 圖5是該較佳實施例中交疊角度與表面能的一曲線圖 9 圖6是該較佳實施例中交疊角度與所需扭矩的一曲線 圖， 圖7是該較佳實施例中一第一磁塊旋轉角度與磁性扭 矩的一曲線圖； 圖8是該較佳實施例中該元件與焊劑重合的一立體圖 ;及 圖9是該較佳實施例中該元件的交疊角度與重合時間 的一曲線圖。 201032285 【主要元件符號說明】 1 ..........基板 11 .........疏水層 12 .........親水區 2 ..........焊劑 3 ..........微小元件 第一磁力組 41 42 5 . 51 4 6 · 61 61 第一磁塊 馬達 第二磁力組 第二磁塊 溫控單元 電熱板201032285 VI. Description of the Invention: [Technical Field] The present invention relates to a aligning method and apparatus, and more particularly to a non-contact aligning method and apparatus capable of locating minute components. [Prior Art] Due to the ardent demand for miniaturized components by humans, the domestic industry has entered the nanometer (10 _ 9 m) technology field by micron (1 (Γ 6 m) technology field, facing the 21st century high-tech development. In the competition, nanotechnology will be an indispensable part of the national high-tech development policy. Take the semiconductor industry as an example, such as Static Random-Access Memory (SRAM), magnetic random memory (magnetic random Access memory, MRAM), Field-Effect Transistor (FET) and other component sizes can be as small as 90nm °. However, the above-mentioned tiny components are not suitable for the conventional positioning platform control system. At present, the main mode of operation is still to manually or manually grasp the tiny components in the Φ mechanical arm to locate the preset position, and then carry out the subsequent processing, which not only takes time and labor, but also the output is limited to one by one. The action does not increase the output, and there is a high cost and does not meet the lack of industrial demand. [Invention] Therefore, the object of the present invention is A non-contact alignment method and device for simplifying the alignment procedure, greatly increasing the yield, and effectively reducing the cost. 201032285 Thus, the non-contact alignment method of the present invention is based on the substrate. The flux on the substrate is a viscous thorn, which includes the following steps: ·························································································· Zone 3. Step 3 • The component is completely covered with flux and is positioned. The non-contact alignment device of the present invention comprises a first magnetic group that is rotatably dislocated on the substrate side, and the wire generates magnetism to the component. The torque causes the component to gradually amplify the overlap region with the tincture to completely cover the welding sword to obtain the positioning. The effect of the invention is that the magnetic torque can be rotated to coincide with the flux to achieve the purpose of automatic alignment. [Embodiment] The foregoing and other technical contents, features and effects of the present invention will be described in the following detailed description of a preferred embodiment with reference to the drawings. Referring to FIG. 1 and FIG. 2, a preferred embodiment of the alignment device of the present invention is a substrate 1 as a carrier, and a small component 3 (such as a wafer) is fixed by the solder 2 on the substrate 1. The substrate 1 has a hydrophobic layer 11' coated on an outer surface and a hydrophilic region 12 defined between the hydrophobic layers 11 and coated with a flux 2. The hydrophobic layer is formed by chain or copper. In addition to being able to alienate the flux 2, it has better magnetic permeability. The flux 2 is a solder material having a melting point of about 72 ° C in the preferred embodiment. The alignment device includes - the first magnetic group 4 a second magnetic force group 5 and a temperature control unit 6. The first magnetic group 4 has a first - 201032285 magnetic block 41 on a lower side of the substrate 1, and a motor 42 for driving the first magnetic block 41 to rotate. The second magnetic group 5 has a second magnetic block 51 fixed to an upper side of the substrate i. The temperature control unit 6 has a hot plate 61 that is superposed on the substrate and used for (d) the temperature of the substrate i. Referring to FIG. 1, FIG. 2' and FIG. 3', the method for positioning the micro-element i using the alignment device according to the present invention and the steps of the embodiment are as follows: Step 71: coating the hydrophobic surface on the outer surface of the substrate 1. The layer u is formed with a hydrophilic region 界定2 defined between the hydrophobic layers 11. Step 72: Applying flux 2 to the hydrophilic region 12 of the substrate 1. Step 73: The substrate 丨 is heated by the hot plate 61, and is soldered & melted and confined to the material property of the hydrophobic layer U to be concentrated in the hydrophilic region 12. Step 74: Referring to FIG. 3 and FIG. 4, the micro-elements 3 are randomly scattered on the flux 2, and the micro-element 3 overlaps with the sputum 2 at any angle, and forms a mutual relationship with the flux 2. The surface force of the viscous surface. Referring to Fig. 4 and Fig. 5, the γ axis (9 〇 degree) perpendicular to the flux 2 is taken as the center, and the surface energy between the minute element 3 and the flux 2 is observed. The stacking angle Θ increases and increases. When the overlapping angle (4) of the minute element 3 and the flux 2 is nearly 0 degrees, the surface energy is the smallest, and when the overlapping angle approaches 9 degrees, the surface energy is maximum. Step 75: Refer to Figure i 3, the magnetic field generated by the second magnetic block 51 attracts the micro-element 3', so that the micro-component 3 is subjected to the magnetic attraction force 201032285 to overcome part of the surface energy, so that the micro-float is attached to the flux 2, Therefore, the component 3 is easily rotated. Step 76: The motor 42 drives the first magnetic block 41 to rotate, so that the first magnetic block 41 generates a magnetic torque relative to the micro-component 3, so that the micro-element 3 is subjected to The magnetic torque acts on the welding 丨2, gradually amplifying the overlapping area with the flux 2, and lowering Referring to Fig. 6 and Fig. 7, it can be seen that the torsion force required for the micro element 3 to be rotated is substantially the relative increase of the first magnet block 41 as the overlap angle 0 is decreased. The magnetic torque generated by the minute element 3 varies with the angle of rotation 'and the overlapping angle 0 of the minute element #3 and the flux 2, and the minute element 3 can be forwarded at any arbitrary angle Θ. Or the reversed magnetic torque acts on the flux 2. Step 77: Referring to FIG. 3 and FIG. 8 'When the minute element 3 completely covers the flux 2, the magnetic torque generated by the first magnetic block 41 can no longer be rotated. The micro 7G member 3' is stabilized on the flux 2 to complete the alignment process. Referring to Figures 1 and 4, it is worth mentioning that the present invention can also be transmitted through a monitoring device (not shown). Recognizing that the overlapping angle and direction of the micro-element 3 and the solder 2 are located in the (Χ, Υ) quadrant, or in the (-X, Υ) quadrant, thereby controlling the selective and reverse mediation of the motor 42 The first magnetic block 41 enables the minute element 3 to be rotated to a full alignment with a minimum angle. 9, and Annex 1, Annex 2, taking the overlap angle 0 = 45 degrees as an example 'The tiny element 3 is rotated to completely coincide with the flux 2, about a time-consuming private stack angle (9 = 90 degrees, the tiny element 3 Rotating to completely coincide with 201032285 flux 2, which takes about 26.5 seconds. According to the above description, the non-contact alignment method and device of the present invention have the following advantages and effects: The present invention is magnetically contacted without contact In the case of the component 3, the purpose of the automatic alignment is achieved. Due to the special structure and the positioning method of the alignment device of the present invention, the micro component 3 can be reduced in size or copied in a large amount, so that the equipment cost is low, and not only the pair can be saved. The time, manpower, and cost, and the ability to substantially increase the output, make the present invention more economical. The above is only the preferred embodiment of the present invention, and the scope of the present invention cannot be limited thereto. That is, the simple equivalent changes and modifications made by the present invention in the scope of the invention and the scope of the invention are still within the scope of the invention. Attachment 1: The photo of the tiny component is 45 degrees with the flux. φ Annex 2: the intersection of the micro-element and the flux # angle 0 = 9G degrees [simplified description of the drawings] Figure 1 is a J0L body diagram illustrating a preferred embodiment of a non-contact alignment device of the present invention; Figure 2 is a flow chart of a substrate coated with a tantalum agent in the preferred embodiment - Figure 3 is a flow chart of the present invention - a non-contact alignment method; 7 201032285 Figure 4 is a preferred embodiment FIG. 5 is a graph showing the overlap angle and surface energy in the preferred embodiment. FIG. 6 is a graph of the overlap angle and the required torque in the preferred embodiment. FIG. 7 is a graph of a first magnetic block rotation angle and magnetic torque in the preferred embodiment; FIG. 8 is a perspective view of the component in the preferred embodiment in which the component is in contact with the flux; and FIG. A graph of the overlap angle and coincidence time of the component in the embodiment. 201032285 [Description of main component symbols] 1 ..........substrate 11 .........hydrophobic layer 12 ......... hydrophilic zone 2 ... ....flux 3 .......... tiny element first magnetic group 41 42 5 . 51 4 6 · 61 61 first magnetic block motor second magnetic group second magnetic block temperature control unit electric heating plate