201031971 t 六、發明說明： 【發明所屬之技術領域】 本發明係有關於一種顯示器之技術領域，尤指〜種可 改善發光元件組裝對位公差’提升背光模組輝度及均句性 等光學特性，且不會造成錫裂之背光模組發光元件定位結 構。 、’201031971 t VI. Description of the invention: [Technical field of the invention] The present invention relates to the technical field of a display, in particular, to improve the alignment tolerance of a light-emitting component, and to improve the optical characteristics such as luminance and uniformity of the backlight module. And does not cause the tin-cracked backlight module light-emitting component positioning structure. ,’
【先前技術】 、，針對採用發光二極體為光源之背光模組，必須先將發 光二極體焊接於電路板（通常為軟性印刷電路板）上構成一 光源組件，再將該光源組件組裝於背光模組。 、請參閱第-圖及第二圖所示習知光源組件之俯視及正 視結構示意圖，該光源組件係由—發光二極體1〇及一 板20組成，該發光二極體10包括一本體n，於該本體n :側分別設有-焊腳12，該兩焊腳12之外侧壁之間形成 一=一寬度W1，透過該焊腳12與電路板2〇之焊墊21相 ，焊接，可將發光二極體10定位於該電路板2〇，而於設 計該烊墊21時，該焊墊21之分佈面積必須大於該焊腳12, 同時容許將該發光二極體10置放於焊墊21時具有一定公 差範圍，因此該焊墊21之外側緣之間之寬度為一第二寬度 W2 ’且該第二寬度W2大於該第—寬度wi。 “請同時參閱第三圖至第五圖，於一框架31内設有一導 光板32，該導光板32底部側邊與該框架31之間設有定位 孔33，該疋位孔33係用以容置該發光二極體丨〇。如第五 3 201031971 圖所示，將焊接有發光二極體10之電路板20設置於框架 31(以及該導光板32)底面，該發光二極體10容置於該定 位孔33内，於電路板20底部設置反射片34，於導光板32 上表面設置有至少一光學片35,再於光學片35上表面設 有液晶面板36，藉由該框架31、導光板32、反射片34、 光學片35及液晶面板36構成一完整之顯示器30。 請參閱第四圖及第五圖所示，該發光二極體10朝向導 光板32之面為出光面，而導光板32朝向發光二極體10之 ⑩ 面為入光面，於該入光面設有導光結構321，該定位孔33 之寬度為一寬度W33，該寬度W33除了能夠容置該發光二 極體10之外，亦必須避免與焊墊21接觸或壓制於該焊墊 21而造成錫裂，因此，該寬度W33必須大於該第二寬度W2, 且具有一定容許公差；一般而言，若第一寬度W1為3. 8mm 時，該第二寬度W2約為5. 1mm，而定位孔33寬度W33約 為6mm，因此，將發光二極體10焊設於電路板20時，容 易產生發光二極體10位置偏移，而當焊設有發光二極體 Φ 10之電路板20組裝於該導光板32時，又容易產生發光二 極體10與導光結構321對位困難之問題，影響背光模組之 輝度及均勻性，換言之，為顧及組裝公差及能力，將定位 孔33加大設計，雖然可改善錫裂問題，但卻犧牲背光模組 之輝度及均勻性，無法兩者兼顧。 請同時參閱第六圖至第八圖，其顯示構成另一種背光 模組之框架41及導光板42,該導光板42設置於該框架41 内，該導光板42之一側邊斜向開設有一定位孔43，該定 位孔43係用以容置該發光二極體10。如第八圖所示，該 4 201031971 焊接有發光二極體10之電路板20設置於導光板42底面’ 該發光二極體10容置於該定位孔43内’同樣的’於電路 板20底部設置反射片44，於導光板42上表面依序設置有 至少一光學片45、液晶面板46，藉由該框架41(顯示於第 六圖）、導光板42、反射片44、光學片45及液晶面板46 構成一完整之顯示器40。 請參閱第七圖及第八圖所示’該定位孔43仍必須依循 習知設計原則，亦即，第二寬度W2大於第一寬度W1，定 • 位孔43寬度W43大於第二寬度W2，因此同樣存在發光二 極體10與導光結構421對位困難、影響背光模組輝度及均 勻性等問題。 【發明内容】 有鑑於習知技術之缺失，本發明之目的在於提出一種 背光模組之發光元件定位結構，可改善發光元件組裝對位 公差’提升背光模組輝度及均勻性等光學特性，且不會造 ❹ 成錫裂。 為達到上述目的，本發明提出一種背光模組之發光元 件定位結構，其包含一光源組件、一框架及一導光板，該 光源組件由至少一發光元件與一電路板構成，該發光元件 之I度為一第一寬度，該電路板具有兩焊墊，該兩焊塾外 側緣間形成一第二寬度，於該導光板與該框架間設有至少 一定位孔，該定位孔係用以定位該光源組件，該定位孔兩 側分別設有至少一凸簷，該定位孔之寬度為一第三寬度， 該兩凸簷内側緣間形成一第四寬度；該第一寬度小於該第 201031971 二寬度，該第一寬度及第四寬度均小於該第二寬度及第三 寬度，該第四寬度大於該第一寬度，該第三寬度大於該第 二寬度。 為使貴審查委員對於本發明之結構目的和功效有更 進一步之了解與認同，茲配合圖示詳細說明如后。 【實施方式】 以下將參照隨附之圖式來描述本發明為達成目的所使 • 用的技術手段與功效，而以下圖式所列舉之實施例僅為輔 助說明，以利貴審查委員瞭解，但本案之技術手段並不限 於所列舉圖式。 請參閱第九圖至第十一圖所示本發明第一實施例結構 示意圖，其包含： 一框架51，該框架51内設有一導光板52，該導光板 52底部側邊與該框架51之間設有二定位孔53 ,該定位孔 53之寬度為一第三寬度W53，且框架51於該定位孔53兩 ❹ 側分別延伸設有至少一凸簷531，該凸簷531之内侧緣之 間形成一第四寬度W531，且該定位孔53係用以容置一光 源組件，光源組件包括一電路板20，於該電路板上設有至 少一發光元件，於本實施例中，該發光元件為發光二極體 10，該發光二極體10包括一本體11，於該本體11兩側分 別設有一焊腳12，該兩焊腳12之外側壁之間形成一第一 寬度W1，透過該焊腳12與電路板20之焊墊21相互焊接， 可將發光二極體10定位於該電路板20，而於設計該焊墊 21時，該焊墊21之分佈面積必須大於該焊腳12，同時容 201031971 許將該發光二極體10置放於焊墊21時具有一定公差範 圍’因此該焊塾21之外侧緣之間之寬度為一第二寬度W2， 該第二寬度W2大於該第一寬度W1 ;前述該第三寬度评53 必須能夠容置該發光二極體10且避免接觸或壓制於該焊 墊21’因此’該第三寬度W53大於該第二寬度W2，而該第 四寬度W531係用以容置該發光二極體1〇之本體丨丨及該本 體11兩侧之焊腳12 ’因此該第四寬度W531大於該第一寬 度W1，但該第四寬度W531小於該第二寬度货2及第三寬度 φ W53 ;該發光二極體10朝向導光板52之面為出光面，而導 光板52朝向發光二極體10之面為入光面，於該導光板52 之入光面設有導光結構521(如第十圖所示）„至於該凸第 531底面與該定位孔53所形成之空間高度fjl(如第十一圖 所示）’係搭配該焊墊21及焊接時所形成之銲錫高度而設 計’並無一定限制。 本發.明所提供之發光元件定位結構之特點在於，利用 該兩階段式之定位孔53及凸簷531設計，使凸詹531分別 ❿ 遮蔽該電路板20之兩焊墊21部份位置，而限位該發光二 極體10設於該第四寬度W531之間，且透過該定位孔53可 避免焊塾造成錫裂，該凸詹531則可改善發光元件組裝對 位公差’進而提升背光模組輝度及均勻性等光學特性。 δ月參閱第十·一圖所不，該電路板2 0係貼靠於框架 51(以及該導光板52)底面，該發光二極體1〇容置於該定 位孔53内，於電路板20底部設置反射片54，於導光板52 上表面依序設置有至少一光學片55及液晶面板56,藉由 該框架51、導光板52、反射片54、光學片55及液晶面板 201031971 56構成一完整之顯示器50。 如第十圖所示，該實施例之定位孔53及凸簷531係設 置於該導光板52底部側邊與該框架51之間，且該定位孔 53及凸簷531係設於框架51，除此之外，亦可將該定位孔 53及凸簷531設置於該導光板52，亦即，該定位孔53及 凸簷531之位置型態無一定限制，與該導光板52之導光結 構521相對應設置即可。此外，本實施例之定位孔53係矩 形孔洞，該凸簷531係由該定位孔53兩側水平朝向該定位 ❿ 孔53延伸一定長度之矩形片體，均係為了配合該發光二極 體10略呈矩形之外型，但定位孔53及凸簷531之形狀並 不以矩形為限，其重點在於形成一兩階段式之定位結構， 可分別對發光元件之本體與焊腳，以及發光元件與電路板 之焊墊分別產生定位作用即可。 請參閱第十二圖至第十四圖所示本發明第二實施例結 構示意圖，其於一框架61内設有一導光板62，本實施例 之不同點在於，該導光板62 —側邊傾斜一定角度開設有一 ❿ 定位孔63，該導光板62於該定位孔63兩側分別設有至少 一凸簷631，於本實施例，係由該導光板62延伸一定長度 而形成該凸簷631，且該發光二極體10朝向導光板62之 面為出光面，而導光板62朝向發光二極體10之面為入光 面，並於該導光板62之入光面設有一導光結構621(如第 十三圖所示）。 請參閱第十四圖所示，將電路板20貼靠於導光板62 底面，該發光二極體10容置於該定位孔63内，同樣的， 於電路板20底部設置反射片64，於導光板62上表面依序 201031971 設置有至少一光學片65、液晶面板66，藉由該框架61(顯 示於第十二圖）、導光板62、反射片64、光學片65及液晶 面板66構成一完整之顯示器60。 請參閱第十三圖及第十四圖所示，本實施例之定位孔 63之設置型態雖然與第十圖所示該定位孔53略有不同， 但設計原則相同，如圖所示，該發光二極體10之兩焊腳 12之外側壁之間形成一第一寬度W1，電路板20兩焊墊21 之外側緣之間形成一第二寬度W2，該第一寬度W1小於該 • 第二寬度W2，該定位孔63之寬度為一第三寬度W63，該第 三寬度W63大於該第二寬度W2 ;而該定位孔63兩側之凸 簷631之内側緣之間形成一第四寬度W631，該第四寬度 W631大於該第一寬度W1，但該第四寬度W531小於該第二 寬度W2及第三寬度W53。同樣地，凸簷631底面與該定位 孔63所形成之空間高度H2係搭配該焊墊21及焊接時所形 成之銲錫高度而設計，並無一定限制。 此外，就第九圖至第十一圖所示該實施例而言，其係 ❿ 由該框架51延伸一定長度形成該凸簷531，該凸簷531係 位於該定位孔53内侧壁之頂部，而第十二圖至第十四圖所 示該實施例係由該導光板62延伸一定長度形成該凸簷 631，且該凸簷631係位於該定位孔63内側壁之頂部，因 此於安裝該光源組件時，係將電路板貼靠於框架51或導光 板62下表面，將發光二極體10由下而上容置於對應之定 位孔53、63内，除此之外，請參閱第十五圖所示本發明第 三實施例之剖面結構不意圖’該實施例係以第九圖至第十 一圖實施例為基礎，其不同點在於，該凸簷531A係位於該 201031971 定位孔53A内侧壁之底部，同理，如第十六圖所示本發明 第四實施例之剖面結構示意圖，該實施例係以第十二圖至 第十四圖實施例為基礎，其不同點在於，該凸簷631A係位 於該定位孔63A内側壁之底部，因此，就第十五圖及第十 六圖所示實施例而言，於安裝該光源組件時，係將電路板 貼靠於框架51A或導光板62A上表面，將發光二極體10由 上而下容置於對應之定位孔53A、63A内。 綜上所述可知，本發明提供之背光模組之發光元件定 ❹ 位結構，可適用於不同型態之背光模組，確實可改善發光 元件組裝對位公差，提升背光模組輝度及均勻性等光學特 性，且不會造成錫裂。 惟以上所述者，僅為本發明之實施例而已，當不能以 之限定本發明所實施之範圍。即大凡依本發明申請專利範 圍所作之均等變化與修飾，皆應仍屬於本發明專利涵蓋之 範圍内，謹請貴審查委員明鑑，並祈惠准，是所至禱。 201031971 【圖式簡單說明】 第圖係習知發光二極體之俯視結構示意圖。 第二圖係習知發光二極體之正視結構示意圖。 第三圖係習知背光模組第一實施例之結構示意圖。 第四圖係第三圖之A部放大圖。 第五圖係第四圖之B-B剖面結構示意圖。 第六圖係習知背光模組第二實施例之結構示意圖。 第七圖係第六圖之C部放大圖。 第八圖係第七圖之D-D剖面結構示意圖。 第九圖係本發明第一實施例之結構示意圖。 第十圖係第九圖之E部放大圖。 第十一圖係第十圖之F-F剖面結構示意圖。 第十二圖係本發明第二實施例之結構示意圖。 第十三圖係第十二圖之G部放大圖。 第十四圖係第十三圖之H-H剖面結構示意圖。 第十五圖係本發明第三實_之剖面結構示意圖。 弟十六圖係本發明第四實施例之剖面結構示意圖。 【主要元件符號說明】 先前技術： 10- 發光二極體 11- 本體 12-焊腳 201031971 w卜第一寬度 2 0 _電路板 21-焊墊 W2-第二寬度 30、 40-顯示器 31、 41-框架 32、 42-導光板 0 33、43-定位孔 34、 44-反射片 35、 45-光學片 36、 46-液晶面板 W33、W43-定位孔寬度 本發明： 50、50Α、60、60Α-顯示器 ❿ 51、51A、61-框架 52、 62、62A-導光板 521、621-導光結構 53、 53A、63、63A-定位孔 531、531A、631、631A-凸簷 54、 54A、64、64A-反射片 55、 55A、65、65A-光學片 56、 56A、66、66A-液晶面板 12 201031971 HI、H2-空間高度 W53、W53A、W63、W63A-第三寬度 W53卜 W531A、W631、W631A-第四寬度[Prior Art] For a backlight module using a light-emitting diode as a light source, a light-emitting diode must be soldered to a circuit board (usually a flexible printed circuit board) to form a light source component, and then the light source component is assembled. In the backlight module. Referring to the top view and the front view of the conventional light source assembly shown in the first and second figures, the light source assembly is composed of a light-emitting diode 1 〇 and a plate 20, and the light-emitting diode 10 includes a body. n, the soldering leg 12 is respectively disposed on the body n: side, and a width W1 is formed between the outer sidewalls of the two soldering legs 12, and the soldering pad 12 is connected to the bonding pad 21 of the circuit board 2, and soldered. The light emitting diode 10 can be positioned on the circuit board 2, and when the mat 21 is designed, the soldering surface of the soldering pad 21 must be larger than the soldering leg 12, and the light emitting diode 10 can be placed. The pad 21 has a certain tolerance range, so the width between the outer side edges of the pad 21 is a second width W2 ′ and the second width W2 is greater than the first width wi. Please also refer to the third to fifth figures. A light guide plate 32 is disposed in a frame 31. A positioning hole 33 is defined between the bottom side of the light guide plate 32 and the frame 31. The clamp hole 33 is used for The light-emitting diode 丨〇 is accommodated. As shown in FIG. 3, 201031971, the circuit board 20 soldered with the light-emitting diode 10 is disposed on the bottom surface of the frame 31 (and the light guide plate 32), and the light-emitting diode 10 is disposed. The lens is disposed in the positioning hole 33, and is provided with a reflection sheet 34 on the bottom of the circuit board 20. The upper surface of the light guide plate 32 is provided with at least one optical sheet 35, and the upper surface of the optical sheet 35 is provided with a liquid crystal panel 36. 31. The light guide plate 32, the reflection sheet 34, the optical sheet 35, and the liquid crystal panel 36 constitute a complete display 30. Referring to the fourth and fifth figures, the light emitting diode 10 faces the light guide plate 32 to emit light. The light guide plate 32 faces the light-emitting surface of the light-emitting diode 10 as a light-incident surface, and the light-incident surface is provided with a light-guiding structure 321 . The width of the positioning hole 33 is a width W33, and the width W33 can be accommodated. In addition to the light-emitting diode 10, it is also necessary to avoid contact with the solder pad 21 or press on the solder pad 21 The first width W2 is about 5. 1 mm, and the width W2 is about 5. 1 mm, and the second width W2 is about 5. 1 mm, and the second width W2 is about 5. 1 mm. The width W33 of the positioning hole 33 is about 6 mm. Therefore, when the light emitting diode 10 is soldered to the circuit board 20, the positional displacement of the light emitting diode 10 is easily generated, and when the circuit board of the light emitting diode Φ 10 is soldered, When assembled on the light guide plate 32, the problem that the alignment between the light-emitting diode 10 and the light-guiding structure 321 is difficult to occur, affecting the brightness and uniformity of the backlight module, in other words, the positioning hole is considered in consideration of assembly tolerances and capabilities. 33 increase the design, although it can improve the problem of tin cracking, but sacrifice the brightness and uniformity of the backlight module, can not take both into consideration. Please also refer to the sixth figure to the eighth figure, which shows the frame of another backlight module The light guide plate 42 is disposed in the frame 41. One side of the light guide plate 42 is obliquely disposed with a positioning hole 43 for receiving the light emitting diode 10. As shown in the eighth figure, the 4 201031971 is welded with a light-emitting diode 10 The circuit board 20 is disposed on the bottom surface of the light guide plate 42. The light-emitting diode 10 is received in the positioning hole 43. The same is disposed on the bottom of the circuit board 20, and the reflective sheet 44 is disposed on the upper surface of the light guide plate 42. An optical sheet 45 and a liquid crystal panel 46 form a complete display 40 by the frame 41 (shown in FIG. 6), the light guide plate 42, the reflection sheet 44, the optical sheet 45, and the liquid crystal panel 46. As shown in the eighth figure, the positioning hole 43 still has to follow the conventional design principle, that is, the second width W2 is larger than the first width W1, and the width W43 of the fixed hole 43 is larger than the second width W2, so that the light-emitting diode is also present. The alignment of the body 10 and the light guiding structure 421 is difficult, which affects the brightness and uniformity of the backlight module. SUMMARY OF THE INVENTION In view of the deficiencies of the prior art, the object of the present invention is to provide a light-emitting component positioning structure of a backlight module, which can improve the optical characteristics of the light-emitting component assembly alignment tolerance, such as improving the brightness and uniformity of the backlight module, and Will not be smashed into a crack. In order to achieve the above object, the present invention provides a light-emitting component positioning structure of a backlight module, which comprises a light source component, a frame and a light guide plate. The light source component is composed of at least one light-emitting component and a circuit board. The first width is a first width, the circuit board has two pads, and a second width is formed between the outer edges of the two soldering holes. At least one positioning hole is disposed between the light guide plate and the frame, and the positioning hole is used for positioning. The light source assembly has at least one protrusion on each side of the positioning hole, the width of the positioning hole is a third width, and a fourth width is formed between the inner edges of the two protrusions; the first width is smaller than the 201031971 The width, the first width and the fourth width are both smaller than the second width and the third width, the fourth width is greater than the first width, and the third width is greater than the second width. In order to enable the reviewing committee to have a better understanding and approval of the structural purpose and efficacy of the present invention, the detailed description is as follows. [Embodiment] Hereinafter, the technical means and effects of the present invention for achieving the object will be described with reference to the accompanying drawings, and the embodiments listed in the following drawings are only for the purpose of explanation, but are appreciated by the reviewing committee, but The technical means of this case are not limited to the illustrated figures. Referring to FIG. 9 to FIG. 11 , a schematic structural view of a first embodiment of the present invention includes: a frame 51 , a light guide plate 52 is disposed in the frame 51 , and a bottom side of the light guide plate 52 and the frame 51 are Two locating holes 53 are defined, and the width of the locating hole 53 is a third width W53, and the frame 51 extends at least two ridges 531 on the two sides of the locating hole 53, and the inner edge of the ridge 531 A fourth width W531 is formed, and the positioning hole 53 is configured to receive a light source assembly. The light source assembly includes a circuit board 20 on which at least one light emitting element is disposed. In the embodiment, the light is emitted. The light-emitting diode 10 includes a body 11 , and a soldering leg 12 is disposed on each side of the body 11 . A first width W1 is formed between the outer sidewalls of the soldering legs 12 . The soldering leg 12 and the soldering pad 21 of the circuit board 20 are soldered to each other, and the light emitting diode 10 can be positioned on the circuit board 20. When the soldering pad 21 is designed, the soldering pad 21 must have a larger distribution area than the soldering leg. 12, at the same time 201031971, when the light-emitting diode 10 is placed on the pad 21 a certain tolerance range 'so that the width between the outer side edges of the solder fillet 21 is a second width W2, the second width W2 being greater than the first width W1; the third width rating 53 must be capable of accommodating the light emitting diode And the third width W53 is greater than the second width W2, and the fourth width W531 is for accommodating the body of the light-emitting diode 1 The soldering legs 12' on both sides of the body 11 are thus greater than the first width W1, but the fourth width W531 is smaller than the second width 2 and the third width φ W53; the LEDs 10 are oriented The surface of the light guide plate 52 is a light-emitting surface, and the surface of the light guide plate 52 facing the light-emitting diode 10 is a light-incident surface, and the light-incident surface of the light guide plate 52 is provided with a light-guiding structure 521 (as shown in FIG. 10). The space height fjl (shown in FIG. 11) formed by the bottom surface of the convex portion 531 and the positioning hole 53 is not limited to the design of the solder pad 21 and the solder height formed during soldering. The feature of the light-emitting component positioning structure provided by the company is that the two-stage type is utilized. The position of the hole 53 and the protrusion 531 are such that the position of the two pads 21 of the circuit board 20 are respectively shielded, and the LEDs 10 are disposed between the fourth width W531. The positioning hole 53 can prevent the solder from cracking, and the convex 531 can improve the alignment tolerance of the light-emitting component and further improve the optical characteristics such as brightness and uniformity of the backlight module. The circuit board 20 is disposed on the bottom surface of the frame 51 (and the light guide plate 52). The light-emitting diode 1 is disposed in the positioning hole 53. A reflective sheet 54 is disposed on the bottom of the circuit board 20, and the light guide plate 52 is disposed on the light guide plate 52. At least one optical sheet 55 and a liquid crystal panel 56 are sequentially disposed on the upper surface, and the frame 51, the light guide plate 52, the reflection sheet 54, the optical sheet 55, and the liquid crystal panel 201031971 56 constitute a complete display 50. As shown in FIG. 10 , the positioning hole 53 and the protrusion 531 of the embodiment are disposed between the bottom side of the light guide plate 52 and the frame 51 , and the positioning hole 53 and the protrusion 531 are disposed on the frame 51 . In addition, the positioning hole 53 and the protrusion 531 may be disposed on the light guide plate 52, that is, the positional shape of the positioning hole 53 and the protrusion 531 are not limited, and the light guide plate 52 is guided by the light guide plate 52. The structure 521 can be set correspondingly. In addition, the positioning hole 53 of the embodiment is a rectangular hole, and the protrusion 531 is a rectangular piece extending horizontally from the positioning hole 53 to the positioning hole 53 to be matched with the light emitting diode 10 . The shape of the positioning hole 53 and the protrusion 531 is not limited to a rectangle, and the focus is on forming a two-stage positioning structure, which can respectively respectively relate to the body and the soldering leg of the light-emitting element, and the light-emitting element. It can be separately positioned with the solder pads of the circuit board. Referring to the second embodiment of the present invention, a second embodiment of the present invention is shown in FIG. 12, which is provided with a light guide plate 62 in a frame 61. The difference in this embodiment is that the light guide plate 62 is inclined at the side. A positioning hole 63 is defined at a certain angle, and the light guiding plate 62 is respectively provided with at least one protrusion 631 on both sides of the positioning hole 63. In this embodiment, the light guiding plate 62 extends a certain length to form the protrusion 631. The surface of the light-emitting diodes 62 facing the light-guide plate 62 is a light-emitting surface, and the surface of the light-guiding plate 62 facing the light-emitting diode 10 is a light-incident surface, and a light-guiding structure 621 is disposed on the light-incident surface of the light guide plate 62. (as shown in the thirteenth figure). Referring to FIG. 14 , the circuit board 20 is placed on the bottom surface of the light guide plate 62 , and the light emitting diode 10 is received in the positioning hole 63 . Similarly, the reflective sheet 64 is disposed on the bottom of the circuit board 20 . The upper surface of the light guide plate 62 is provided with at least one optical sheet 65 and a liquid crystal panel 66 in the order 201031971, and the frame 61 (shown in the twelfth figure), the light guide plate 62, the reflection sheet 64, the optical sheet 65, and the liquid crystal panel 66 are formed. A complete display 60. Referring to the thirteenth and fourteenth drawings, the positioning shape of the positioning hole 63 of the embodiment is slightly different from the positioning hole 53 shown in the tenth figure, but the design principle is the same, as shown in the figure. A first width W1 is formed between the outer sidewalls of the two soldering legs 12 of the LED body 10. A second width W2 is formed between the outer edges of the solder pads 21 of the circuit board 20. The first width W1 is smaller than the The second width W2, the width of the positioning hole 63 is a third width W63, and the third width W63 is greater than the second width W2; and a fourth edge is formed between the inner edges of the protrusions 631 on both sides of the positioning hole 63. The width W631 is greater than the first width W1, but the fourth width W531 is smaller than the second width W2 and the third width W53. Similarly, the space height H2 formed by the bottom surface of the tenon 631 and the positioning hole 63 is designed to match the solder pad 21 and the solder height formed during soldering, and is not limited. In addition, in the embodiment shown in the ninth to eleventh drawings, the frame 延伸 is extended by the frame 51 to form the tenon 531, and the tenon 531 is located at the top of the inner side wall of the positioning hole 53. And the embodiment shown in the twelfth to fourteenth drawings is formed by the light guide plate 62 extending a certain length to form the tenon 631, and the tenon 631 is located at the top of the inner side wall of the positioning hole 63, so In the case of the light source assembly, the circuit board is placed against the lower surface of the frame 51 or the light guide plate 62, and the light-emitting diodes 10 are placed from the bottom to the corresponding positioning holes 53, 63, in addition, please refer to The cross-sectional structure of the third embodiment of the present invention shown in the fifteenth embodiment is not intended to be based on the ninth to eleventh embodiment, except that the tenon 531A is located in the positioning hole of 201031971. The bottom of the inner side wall of the 53A, similarly, the cross-sectional structure diagram of the fourth embodiment of the present invention as shown in the sixteenth embodiment, which is based on the twelfth to fourteenth embodiment, and the difference is that The tenon 631A is located at the bottom of the inner side wall of the positioning hole 63A. Therefore, in the embodiment shown in the fifteenth and sixteenth embodiments, when the light source assembly is mounted, the circuit board is placed against the upper surface of the frame 51A or the light guide plate 62A, and the light emitting diode 10 is placed thereon. The lower portion is placed in the corresponding positioning holes 53A, 63A. In summary, the backlight module of the backlight module of the present invention can be applied to different types of backlight modules, which can improve the alignment tolerance of the light-emitting components and improve the brightness and uniformity of the backlight module. It is optical in nature and does not cause tin cracking. However, the above description is only for the embodiments of the present invention, and the scope of the invention is not limited thereto. That is to say, the equivalent changes and modifications made by the applicant in accordance with the scope of application of the present invention should still fall within the scope covered by the patent of the present invention. I would like to ask your reviewing committee to give a clear understanding and pray for it. 201031971 [Simple description of the figure] The figure is a schematic view of the top view of the conventional light-emitting diode. The second figure is a schematic view of the front view of a conventional light-emitting diode. The third figure is a schematic structural view of a first embodiment of a conventional backlight module. The fourth figure is an enlarged view of Part A of the third figure. The fifth figure is a schematic view of the B-B cross-sectional structure of the fourth figure. The sixth figure is a schematic structural view of a second embodiment of a conventional backlight module. The seventh figure is an enlarged view of part C of the sixth figure. The eighth figure is a schematic view of the D-D cross-sectional structure of the seventh figure. The ninth drawing is a schematic view showing the structure of the first embodiment of the present invention. The tenth figure is an enlarged view of the E of the ninth figure. The eleventh figure is a schematic view of the F-F cross-sectional structure of the tenth figure. Figure 12 is a schematic view showing the structure of a second embodiment of the present invention. The thirteenth picture is an enlarged view of the G portion of the twelfth figure. The fourteenth figure is a schematic view of the H-H cross-sectional structure of the thirteenth figure. The fifteenth diagram is a schematic cross-sectional view of the third embodiment of the present invention. Figure 16 is a schematic cross-sectional view showing a fourth embodiment of the present invention. [Major component symbol description] Prior art: 10-LED diode 11- body 12-soldering foot 201031971 wb first width 2 0 _ circuit board 21-pad W2-second width 30, 40-display 31, 41 - frame 32, 42 - light guide plate 0 33, 43 - positioning hole 34, 44 - reflection sheet 35, 45 - optical sheet 36, 46 - liquid crystal panel W33, W43 - positioning hole width. The present invention: 50, 50 Α, 60, 60 Α - display ❿ 51, 51A, 61 - frame 52, 62, 62A - light guide plate 521, 621 - light guiding structure 53, 53A, 63, 63A - positioning holes 531, 531A, 631, 631A - tenons 54, 54A, 64 64A-reflecting sheet 55, 55A, 65, 65A-optical sheet 56, 56A, 66, 66A-liquid crystal panel 12 201031971 HI, H2-space height W53, W53A, W63, W63A-third width W53, W531A, W631, W631A - fourth width
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