201030692 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種顯示介質模組的製造方法，且特別是 有關於一種可撓式彩色顯示介質模組及使用其之顯示面板的 製造方法。 【先前技術】 隨著平面顯示技術的進步，愈來愈多的電子產品皆搭載有 顯示面板’尤其是可攜式電子產品（portable eiectrical product) ’ 例如行動電話（mobile phone )、電子書（e-book )、 • 數位相機（digital camera)及個人數位助理（personal digital assistant，PDA)等。由於可攜式電子產品是朝向重量輕且厚度 薄的趨勢發展，所以應用在可攜式電子產品的顯示面板也需具 備重量輕且厚度薄的優點。 承上述，由於可撓式顯示面板不但具有重量輕且厚度薄的 優點，還具有可撓曲且摔不破的優點，因此可撓式顯示面板已 成為面板業重要的發展趨勢。目前的可撓式顯示面板大多以電 泳顯示面板(electro-phoretic display panel，EPD panel)為主，而 _ 習知彩色電泳顯示面板的製造方法是先將電泳薄片配置於形 成有主動式或被動式之元件陣列的基板上，然後再將彩色濾光 片（color filter)組立於電泳薄片上。 然而，在彩色濾光片的組立過程中，往往會因為其與電泳 薄片之間的對位不準確而導致光線通過彩色光阻層與顯示介 質層後產生視差’進而降低顯示面板所顯示的影像品質。 【發明内容】 ' 有鑑於此’本發明的目的是提供一種可撓式彩色顯示介質 模組的製造方法，以提高彩色光阻層與顯示介質層之間的對位 準確度。 201030692 本發明的另一目的是提供一種可撓式彩色顯示介質模 組’以減少光線通過彩色光阻層與顯示介質層後所產生的視差 現象。 本發明的再-目的是提供-種顯示面板的製造方法，以增 加顯示面板之可撓式彩色顯示介龍組與控制树陣列基板 的對位精準度，進而提高顯示面板的製程良率。201030692 6. Technical Field of the Invention The present invention relates to a method of manufacturing a display medium module, and more particularly to a flexible color display medium module and a method of manufacturing a display panel using the same . [Prior Art] With the advancement of flat display technology, more and more electronic products are equipped with display panels 'especially portable eiectrical products' such as mobile phones, e-books (e -book ), • digital camera and personal digital assistant (PDA). Since portable electronic products are trending toward light weight and thin thickness, display panels for portable electronic products also need to have the advantages of light weight and thin thickness. In view of the above, since the flexible display panel not only has the advantages of light weight and thin thickness, but also has the advantages of being flexible and unbreakable, the flexible display panel has become an important development trend of the panel industry. Most of the current flexible display panels are mainly electro-phoretic display panels (EPD panels), and the conventional method for manufacturing color electrophoretic display panels is to first configure the electrophoretic sheets to be active or passive. On the substrate of the array of elements, a color filter is then placed on the electrophoretic sheet. However, during the assembly process of the color filter, the parallax caused by the light passing through the color photoresist layer and the display medium layer is often caused by the inaccuracy of the alignment between the color filter and the display layer, thereby reducing the image displayed by the display panel. quality. SUMMARY OF THE INVENTION The present invention has been made in an effort to provide a method of fabricating a flexible color display medium module to improve the alignment accuracy between a color photoresist layer and a display medium layer. 201030692 Another object of the present invention is to provide a flexible color display medium module ' to reduce parallax caused by light passing through the color photoresist layer and the display medium layer. A further object of the present invention is to provide a method of manufacturing a display panel for increasing the alignment accuracy of a flexible color display medium display group and a control tree array substrate of a display panel, thereby improving the process yield of the display panel.
/本發明提出-種可撓式彩色顯示介質模組的製造方法，其 ，先提供-剛性基板，接著在剛性基板上形成可撓基板。再 在可撓基板上形成多個彩色光阻層，並且在這些彩色光阻 層上形成顯示介㈣’紐再將可撓基板朗性基板分離。 本發明提出-種顯示面板的製造方法，其係_上述步驟 ，成可撓式彩色顯示介質模組，並形成具有顯示區與周邊電路 2控制讀陣列紐。缝，將可撓縣色顯示介質模組組 =控制70件_基板上方’贿顯科㈣位於控制元件陣 列基板上。再來，於控制元件陣列基板上配置—驅動電路，而 此驅動電路係位於周邊電路區内。 發明之—實施例中，將可撓基板與·基板分離的方 法包括雷射分離法。 實施例中，其中在上述可撓基板上形成這些 之别更包括在可撓基板上形成—遮光層。此遮光 層八有夕個開口，而這些彩色光阻層係形成於開口内。 之實施财，也可以在形成㈣元件陣列基板 剛性基板，而該控制元件陣列基板係形成於 基板上。待形成卿電路之後，更包括將第二剛性基 、二制7G件陣列基板分離。在此，其例如 將彼此分離。 由耵刀離凌 201030692 在本發明之一實施例中，上述這些彩色光阻層可以包括紅 色、綠色、藍色滤光光阻。而且，在另一實施例中，這些彩色 光阻層更可以包括白色濾光光阻。 在本發明之一實施例中’上述之可撓基板的材質可以是聚 亞醯胺（polyimide, PI)、聚對苯二曱酸二乙酯（polyethylene terephathalate，PET)、聚芳醚_(p〇iyether ether ketone, PEEK) 或^^茶一曱酸乙二醋(polyethylene naphthalene，PEN)。 本發明提出一種可撓式彩色顯示介質模組，主要是由可撓 ❹基板、多個彩色光阻層以及顯示介質層所構成。其中，彩色光 阻層係配置於可撓基板上，而顯示介質層則是配置於這些彩色 光阻層上。 在本發明之一實施例中，上述之可撓式彩色顯示介質模組 更包括一遮光層，配置於可撓基板上。遮光層具有多個開口， 且上述彩色光阻層係填於這些開口内。 在本發明之一實施例中，上述之彩色光阻層包括紅色濾光 光阻、綠色濾光光阻以及藍色濾光光阻。而且，在另一實施例 中，這些彩色光阻層更可以包括白色濾光光阻。 藝 在本發明之一實施例中，上述之可撓基板的材質可以是聚 亞醯胺、聚對苯二曱酸二乙酯、聚芳醚酮或聚萘二甲酸乙二酯。 在本發明之一實施例中，上述之顯示介質層可以是電泳薄 片（electro-ph〇retic plate)或電濕潤薄片（dectr〇_wetting plate)。 …本發明係先在形成於剛性基板上的可撓基板上依序形成 彩色光阻層與顯示介質層，之後才將可撓基板與剛性基板分 離，因此本發明能夠大幅提昇可撓式彩色顯示介質模組及使用 ，之顯示面板的製程良率與產能。而且，本發明係直接將顯示 介質層配置於彩色光阻層上，因此不但可以改善顯示介質層與 5 201030692 彩色光阻層之間的對位準確度，更可以減少光線在通過顯示介 質層與彩色光阻層後所產生的視差現象。 為讓本發明之上述和其他目的、特徵和優點能更明顯易 懂’下文特舉較佳實施例，並配合所附圖式’作詳細說明如下。 【實施方式】 圖1A至圖id繪示為本發明之一實施例中可撓式彩色顯 示介質模組的製程剖面示意圖。請參照圖1A，首先在剛性基 板110上形成可撓基板12〇，其中剛性基板11〇的材質例如是 ❹ 玻璃或不銹鋼，而可撓基板120的材質則可以是聚亞醯胺 (polyimide, PI)、聚對苯二甲酸二乙酯（Polyethylene terephathalate，PET)、聚芳謎酮(p〇lyether ether ketone，PEEK) 或聚萘二曱酸乙二S旨(polyethylene naphthalene，PEN) 0 請參照圖IB，接著在可撓基板120上形成多個彩色光阻 層130。值得一提的是，彩色光阻層13〇可以利用微影蝕刻製 程製作而成，且彩色光阻層13〇可以包括紅色濾光光阻R、綠 色濾光光阻G及藍色濾光光阻B。在其他實施例中，如圖2 所示’形成於可撓基板120上的這些彩色光阻層130也可以包 ⑩ 括白色濾光光阻W，以提高顯示亮度。 而且’為了增加顯示晝面的對比，並避免發生混光的現 象’本發明在另一實施例中還可以先在可撓基板120上形成遮 光層140 ’如圖3所示。其中，遮光層140的材質例如是樹脂 或其他不透光的材料’且其具有多個開口 142，而彩色光阻層 130即是填於這些開口 142内。 請參照圖1C，在彩色光阻層130上形成顯示介質層150。 在本實施例中，顯示介質層150可以是電泳薄片 (electro-phoretic plate)或電濕潤薄片（electro-wetting plate)。具 6 201030692 體來說’顯示介質層150例如是將電泳層或電濕潤層配置於兩 片塑膠基板中而得，且此電泳層可以是微杯(miCr〇_eup)型或微 膠囊型(micro-capsule)的電泳層，但本發明並不以此為限。 請參照圖1D所示，將可撓基板120與剛性基板11〇分離， 以形成可撓式彩色顯示介質模組100。其中，本實施例係以雷 射分離法(laser release)將可撓基板120與剛性基板110分離。 由於本發明係將顯示介質層150直接配置於彩色光阻層 130上’因此可避免顯示介質層15〇與彩色光阻層13〇對位不 良的問題，並且降低光線在通過顯示介質層150及彩色光阻層 130時因折射光程差所產生的視差(parallax)。 此外’本發明係在完成所有欲配置於可撓基板120上之所 有元件的製程後’才將可撓基板12〇與剛性基板110分離，因 而月b夠大幅提昇可撓式彩色顯示介質模組1〇〇的良率與產 量。以下將舉實施例說明本發明之可撓式彩色顯示介質模組 1〇〇的應用，但其並非用以限定本發明。 ，圖4A至圖4D分別繪示為本發明之一實施例中顯示面板 的製作流程剖面圖。請參照圖4A，首先形成控制元件陣列基 ©板210。射，控制元件陣列基板21〇具有顯示區2i〇a及周 邊電路區21〇b。詳細來說，本實施例例如是在基板212上形 成夕個晝素單元214,而基板212與這些畫素單元214即構成 控制tl件陣列基板210，且這些畫素單元214所在之處即為控 制元件陣列基板210的顯示區21〇a。 值知的疋’本實施例之控制元件陣列基板可以且 f可撓性，且其製程係先在剛性基板2〇1上形成具可挽性的£ _ 212,其中基板212的材質與前述之可撓基板12〇的材質相 同或相似，此處不再贅述。接著，在基板212上形成畫素單元 201030692 214。也就是說，本發明係先將控制元件陣列基板形成於 剛性基板201上。 圖5緣示為本發明之一實施例中控制元件陣列基板的示 意圖。請參照圖5，承上所述’各畫素單元2丨4是由掃瞄線(s c姐 line)215、資料線(data line)216、薄膜電晶體(thin fUm transistor， TFT)217以及晝素電極218所構成。其中，各薄膜電晶體217 係電性連接至對應之掃瞄線215與資料線216，而各畫素電極 2j8則是透過薄膜電晶體217而與資料線216電性連接。也就 是說，本實施例係利用薄膜電晶體陣列(thin film transistor array，TFT array)作為控制元件。 值彳于注意的是，雖然本實施例係以主動式的控制元件為例 做說明’但其並非用以限定本發明。熟習此技藝者應該知道， 本發，之顯不面板也可以是藉由被動式控制元件陣列來控制。 明參照圖4B ’形成可撓式彩色顯示介質模組·，然後 再將可撓式彩色顯示介質模組1〇〇與控制元件陣列基板21〇組 立於彼此’以使可撓式彩色顯示介質模組100的顯示介質層 H0位於控制元件陣列基板21〇的顯示區21〇&内。其中可挽 ❿ 式彩色顯示介質模組100的匍叙丄、_________/ The present invention proposes a method of manufacturing a flexible color display medium module, which first provides a rigid substrate, and then forms a flexible substrate on the rigid substrate. A plurality of color photoresist layers are formed on the flexible substrate, and a display medium (4) is formed on the color photoresist layers to separate the flexible substrate. The invention provides a method for manufacturing a display panel, which is a step of forming a flexible color display medium module and forming a display readout array with a display area and a peripheral circuit 2. Sew, the flexible color display medium module group = control 70 pieces _ above the substrate 'Bai Xianke (4) is located on the control element array substrate. Further, a driving circuit is disposed on the control element array substrate, and the driving circuit is located in the peripheral circuit region. In an embodiment of the invention, the method of separating the flexible substrate from the substrate comprises a laser separation method. In an embodiment, wherein forming the same on the flexible substrate further comprises forming a light shielding layer on the flexible substrate. The light-shielding layer has an opening, and the colored photoresist layers are formed in the opening. In the implementation, the (four) element array substrate rigid substrate may be formed, and the control element array substrate may be formed on the substrate. After the formation of the circuit, the second rigid base and the second 7G array substrate are further separated. Here, they are, for example, separated from each other. By boring 201030692 In one embodiment of the invention, the color photoresist layers described above may comprise red, green, and blue filter photoresists. Moreover, in another embodiment, the color photoresist layers may further comprise white filter photoresist. In one embodiment of the present invention, the material of the flexible substrate may be polyimide (PI), polyethylene terephathalate (PET), polyarylene ether (p). 〇iyether ether ketone, PEEK) or ^^ tea phthalic acid (ethylene naphthalene, PEN). The invention provides a flexible color display medium module, which is mainly composed of a flexible substrate, a plurality of color photoresist layers and a display medium layer. The color photoresist layer is disposed on the flexible substrate, and the display dielectric layer is disposed on the color photoresist layers. In an embodiment of the invention, the flexible color display medium module further includes a light shielding layer disposed on the flexible substrate. The light shielding layer has a plurality of openings, and the color photoresist layer is filled in the openings. In an embodiment of the invention, the color photoresist layer comprises a red filter photoresist, a green filter photoresist, and a blue filter photoresist. Moreover, in another embodiment, the colored photoresist layers may further comprise white filter photoresist. In one embodiment of the present invention, the material of the flexible substrate may be polyamidamine, polyethylene terephthalate, polyaryletherketone or polyethylene naphthalate. In an embodiment of the invention, the display medium layer may be an electro-ph〇retic plate or a dectr〇-wetting plate. In the present invention, the color resist layer and the display medium layer are sequentially formed on the flexible substrate formed on the rigid substrate, and then the flexible substrate is separated from the rigid substrate, so that the present invention can greatly enhance the flexible color display. The process yield and capacity of the display panel of the media module and the use. Moreover, the present invention directly disposes the display medium layer on the color photoresist layer, thereby improving the alignment accuracy between the display medium layer and the 5 201030692 color photoresist layer, and reducing the light passing through the display medium layer. Parallax phenomenon after the color photoresist layer. The above and other objects, features and advantages of the present invention will become more <RTIgt; 1A to 1D are schematic cross-sectional views showing a process of a flexible color display medium module according to an embodiment of the present invention. Referring to FIG. 1A, a flexible substrate 12 is first formed on the rigid substrate 110. The material of the rigid substrate 11 is, for example, bismuth glass or stainless steel, and the material of the flexible substrate 120 is polyimide (PI). ), Polyethylene terephathalate (PET), polyfluorene ketone (PEEK) or polyethylene naphthalene (PEN) 0 Please refer to the figure IB, then a plurality of colored photoresist layers 130 are formed on the flexible substrate 120. It is worth mentioning that the color photoresist layer 13 can be fabricated by a photolithography process, and the color photoresist layer 13 can include a red filter photoresist R, a green filter photoresist G, and a blue filter light. Block B. In other embodiments, the color photoresist layers 130 formed on the flexible substrate 120 as shown in FIG. 2 may also include a white filter photoresist W to improve display brightness. Moreover, in order to increase the contrast of the display face and avoid the occurrence of light mixing, the present invention may further form a light shielding layer 140 on the flexible substrate 120 as shown in Fig. 3 in another embodiment. The material of the light shielding layer 140 is, for example, a resin or other opaque material ′ and has a plurality of openings 142, and the color photoresist layer 130 is filled in the openings 142. Referring to FIG. 1C, a display medium layer 150 is formed on the color photoresist layer 130. In the present embodiment, the display medium layer 150 may be an electro-phoretic plate or an electro-wetting plate. 6 201030692 The display medium layer 150 is obtained by disposing an electrophoretic layer or an electrowetting layer in two plastic substrates, and the electrophoretic layer may be a microcup (miCr〇_eup) type or a microcapsule type ( Electrophoretic layer of micro-capsule), but the invention is not limited thereto. Referring to FIG. 1D, the flexible substrate 120 and the rigid substrate 11 are separated to form a flexible color display medium module 100. Here, in the present embodiment, the flexible substrate 120 is separated from the rigid substrate 110 by a laser release method. Since the present invention directly disposes the display dielectric layer 150 on the color photoresist layer 130, the problem of poor alignment between the display dielectric layer 15 and the color photoresist layer 13 can be avoided, and the light is reduced through the display medium layer 150 and The color resist layer 130 is parallax due to the refracted optical path difference. In addition, the present invention separates the flexible substrate 12A from the rigid substrate 110 after completing all the processes of all the components to be disposed on the flexible substrate 120, thereby greatly increasing the flexible color display medium module. 1〇〇 yield and yield. The application of the flexible color display medium module of the present invention will be described below by way of examples, but it is not intended to limit the present invention. 4A to 4D are cross-sectional views showing the manufacturing process of the display panel in one embodiment of the present invention. Referring to FIG. 4A, a control element array substrate © plate 210 is first formed. The control element array substrate 21 has a display area 2i 〇 a and a peripheral circuit area 21 〇 b. In detail, in this embodiment, for example, the unit cell 214 is formed on the substrate 212, and the substrate 212 and the pixel units 214 constitute the control array substrate 210, and the pixel unit 214 is located. The display area 21〇a of the element array substrate 210 is controlled. It is known that the control element array substrate of the present embodiment can be flexible and the process is first formed on the rigid substrate 2〇1 with a chargeability of _212, wherein the material of the substrate 212 and the foregoing The materials of the flexible substrate 12A are the same or similar, and are not described herein again. Next, a pixel unit 201030692 214 is formed on the substrate 212. That is, the present invention first forms the control element array substrate on the rigid substrate 201. Figure 5 is a schematic illustration of a control element array substrate in one embodiment of the present invention. Referring to FIG. 5, the 'different pixels unit 2丨4' is composed of a scan line (sc sister line) 215, a data line 216, a thin film transistor (TFT) 217, and a thin film transistor (TFT) 217. The element electrode 218 is formed. Each of the pixel transistors 217 is electrically connected to the corresponding scan line 215 and the data line 216, and each of the pixel electrodes 2j8 is electrically connected to the data line 216 through the thin film transistor 217. That is to say, this embodiment uses a thin film transistor array (TFT array) as a control element. It is to be noted that although the present embodiment is described by taking an active control element as an example, it is not intended to limit the present invention. Those skilled in the art will appreciate that the display panel of the present invention can also be controlled by an array of passive control elements. Referring to FIG. 4B', a flexible color display medium module is formed, and then the flexible color display medium module 1A and the control element array substrate 21 are assembled to each other' to make the flexible color display medium mode The display medium layer H0 of the group 100 is located in the display area 21〇& of the control element array substrate 21A. Among them, the 彩色 丄 彩色 color display medium module 100 匍 丄, _________
电格⑽包括1C電路232與軟性電路柘rf|MHhlenr;ntpHThe battery (10) includes a 1C circuit 232 and a soft circuit 柘rf|MHhlenr; ntpH
8 201030692 藉由晶粒-玻璃接合（Chip on Glass, COG)、晶粒-薄膜接合 (Chip on Film, COF)或軟片自動貼合(Tape Automatic Bonding， TAB)的方式配置於控制元件陣列基板21〇上’並與顯示區 210b内的晝素單元214電性連接。 特別的是’控制元件陣列基板21〇係在完成驅動電路230 的配置之後，才與剛性基板201分離，以製成圖41)所示之顯 示面板200。在此，同樣可以使用雷射分離法來令基板212與 剛性基板201分離。 由於本發明之可撓式彩色顯示介質模組的製造流程係先 在剛性基板上形成可撓基板，並且在可撓基板上依序形成彩色 光阻層與顯示介質層之後，才將可撓基板與剛性基板分離，因 此與習知利用捲軸式印刷製程直接將彩色光阻層印製在可撓 基板上的方法相較之下，本發明之可撓式彩色顯示介質模組可 具有較佳的解析度及製程良率與產量。 而且，由於本發明係直接將顯示介質層配置於彩色光阻層 上，因此不但可以改善顯示介質層與彩色光阻層之間的對位準 確度更可以避免光線在通過顯示介質層與彩色光阻層時，因 ❿折射光程差而生成有視差的影像。 另外，在本發明所揭露的顯示面板中，除了包括上述之可 挽式彩色顯不介質模組之外，更可以包括有具可撓性的控制元 件陣列基板。而且，本發明係先將控制元件陣列基板形成在剛 性基板上，並在完成驅動電路的配置後，再將剛性基板與具可 換性的控制元件陣列基板分離。因此，本發明不但可以利用解 t最ΐ可達1微米的多道光罩製程在具可撓性的基板上形 主旦素單元，更可以避免在具可撓性的基板上配置驅動電路 日’因基板党壓變形而影響驅動電路的配置良率。 201030692 紅上所述，本發騎揭叙㈣式耗_ 具可量產性’且能夠有效地提升可撓式彩色顯示介質 用其之顯示面板㈣程良率’並改善可撓 乂暂 =面，度。此外，本發明之可撓式彩 、、且更可以改。顯示面板所顯示之影像的視差問題。 、 雖然本發明已以較佳實施例揭露如上，然其並非用以限定 本發明’任何熟習此技藝者，在不脫離本發明之精神和範圍 内’當可作些許之更動與潤飾，因此本發明之保護範圍當視後 附之申請專利範圍所界定者為準。 【圖式簡單說明】 圖1A至圖1D分別續·示為本發明之一實施例中可撓式彩 色顯示介質模組的製程剖面示意圖。 圖2繪示為本發明之另一實施例中彩色光阻層形成於可 挽基板上的剖面示意圖。 圖3繪示為本發明之另一實施例中遮光層與彩色光阻層 形成於可撓基板上的剖面示意圖。8 201030692 is disposed on the control element array substrate 21 by chip-on-glass (COG), chip-on-film (COF) or tape automatic bonding (TAB). It is electrically connected to the pixel unit 214 in the display area 210b. Specifically, the control element array substrate 21 is separated from the rigid substrate 201 after completion of the configuration of the driving circuit 230 to form the display panel 200 shown in Fig. 41). Here, the laser separation method can also be used to separate the substrate 212 from the rigid substrate 201. Since the manufacturing process of the flexible color display medium module of the present invention first forms a flexible substrate on a rigid substrate, and sequentially forms a color photoresist layer and a display medium layer on the flexible substrate, the flexible substrate is formed. Separating from the rigid substrate, the flexible color display medium module of the present invention can be preferably compared with the conventional method of directly printing the color photoresist layer on the flexible substrate by a roll printing process. Resolution and process yield and yield. Moreover, since the present invention directly disposes the display medium layer on the color photoresist layer, not only the alignment accuracy between the display medium layer and the color photoresist layer can be improved, but also the light passing through the display medium layer and the colored light can be avoided. In the case of the resist layer, a parallax image is generated due to the refracted optical path difference. In addition, in the display panel disclosed in the present invention, in addition to the above-mentioned portable color display medium module, a flexible control element array substrate may be further included. Further, in the present invention, the control element array substrate is first formed on the rigid substrate, and after the arrangement of the drive circuit is completed, the rigid substrate is separated from the control element array substrate having the replaceability. Therefore, the present invention can not only use the multi-pass mask process with a solution of up to 1 micron to form a main-half element on a flexible substrate, but also avoid configuring a driving circuit on a flexible substrate. The layout yield of the driving circuit is affected by the deformation of the substrate party pressure. 201030692 Red said, this hair ride reveals (four) consumption _ with mass production' and can effectively improve the display panel of the flexible color display medium (four) yield rate and improve the flexible temporary surface ,degree. In addition, the flexible color of the present invention can be modified. The parallax problem of the image displayed on the display panel. The present invention has been disclosed in the above preferred embodiments, and is not intended to limit the invention, and it is intended that the invention may be modified and modified without departing from the spirit and scope of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1A to FIG. 1D are respectively schematic cross-sectional views showing a process of a flexible color display medium module according to an embodiment of the present invention. 2 is a cross-sectional view showing a color photoresist layer formed on a removable substrate in another embodiment of the present invention. 3 is a cross-sectional view showing a light shielding layer and a color photoresist layer formed on a flexible substrate according to another embodiment of the present invention.
圖4Α至圖4D分別繪示為本發明之一實施例中顧示面板 的製作流程剖面圖。 圖5綠示為本發明之一實施例中控制元件陣列基板的元 件配置示意圖。 【主要元件符號說明】 100 .可撓式彩色顯示介質模組 110 ' 201 :剛性基板 120 :可撓基板 130 :彩色光阻層 140 I遮光層 201030692 142 :開口 150 :顯示介質層 200 :顯示面板 210 :控制元件陣列基板 210a .顯不區 210b :周邊電路區 212 :基板 214 :晝素單元 215 :掃瞄線 ® 216 :資料線 217 :薄膜電晶體 218 :晝素電極 230 :驅動電路 232 : 1C電路 234 :軟性電路板 R:紅色濾光光阻 G :綠色濾光光阻 ⑩ B:藍色濾光光阻 W :白色濾光光阻 114A to 4D are respectively cross-sectional views showing a manufacturing process of the viewing panel according to an embodiment of the present invention. Figure 5 is a schematic view showing the arrangement of components of the control element array substrate in one embodiment of the present invention. [Description of main component symbols] 100. Flexible color display medium module 110' 201: rigid substrate 120: flexible substrate 130: color photoresist layer 140 I light shielding layer 201030692 142: opening 150: display medium layer 200: display panel 210: control element array substrate 210a. display area 210b: peripheral circuit area 212: substrate 214: pixel unit 215: scan line® 216: data line 217: thin film transistor 218: germanium electrode 230: drive circuit 232: 1C circuit 234: flexible circuit board R: red filter photoresist G: green filter photoresist 10 B: blue filter photoresist W: white filter photoresist 11