201028609 六、發明說明： 【發明所屬之技術領域】 本發明係涉及一種半導體照明裝置，尤係關於一種 發光二極體燈具及其光引擎。 【先前技術】 人們由於長期過度依賴石化燃料，除造成能源短缺 及石油價格高漲而牽動經濟發展，更使全球二氧化碳與 ❹有害氣體的排放濃度日益增加，導致地球暖化所引起的 氣候反常、生態環境的破壞、以及對人類生存的危害日 益顯現，為永續經營賴以生存的地球生態環境，必須同 時解決能源危機與環境污染問題，開發新能源及再生能 源是推動節約能源及高效率使用能源最重要的策略，而 傳統照明所消耗的能源極為可觀，發展照明節能將是最 重要的新能源科技，而半導體照明採用高功率高亮度的 發光一極體（LED)為光源，該新光源以其高發光效率、 ©節能、長壽、環保（不含汞）、啟動快、指向性等優點， 具有廣泛取代傳統照明光源的潛力。 LED由於輸入電能的8〇%〜9〇%轉變成為熱量，只 有10%〜20%轉化為光能，且由於LED芯片面積小，因 此心片散熱是LED封裝必須解決的關鍵問題；優良的 散熱系統可在同等輸入功率下得到較低的工作溫度，延 長LED的使用壽命，或在同樣的溫度限制範圍内，增 加輸入功率或芯片密度，從而增加LED燈的亮度；^ 點溫度（Junction temperature)是衡量LED封裴散^性= 201028609 的重要技術指標，由於散熱不良導致的結點溫度升高， 將嚴重衫響到發光波長、光強、光效和使用壽命。 應用高功率高亮度LED在照明的新光源上，必須 配合高效率的散熱機構以儘量降低LED的結點溫度， 才能發揮上述諸多優點，否則發光二極體燈具的發光亮 度、使用壽命將大打折扣，影響所及將使該發光二極體 燈具的節能效果不彰，並直接衝擊該發光二極體燈具的 可罪度’引發嚴重的光衰甚至使發光二極體燈具失效。 ❷ 日光灯主要由灯管、整流器和啟動器组成，因發光 效率約為鎢絲燈泡的兩倍，已成為目前最普遍使用的發 光二極體燈具，其發光係利用密閉的氣體放電原理，具 體結構包括於真空的玻璃管内壁鍍以螢光物質，並於其 内充入惰性氣體（例如氬（Argon)、氖（Neon)或氪 (Krypton))及汞蒸汽，藉由能產生高電壓的整流器使管 内導通的電流激發采原子產生氣體放電，並在過程中釋 ❹放出紫外光及熱量，藉由所述螢光物質吸收紫外光後釋 放出可見光，不同的螢光物質會發出不同的可見光； 惟，曰光灯的主要氣體放電物質為具有毒性的汞及螢光 物質，長年大量使用日光灯所累積的廢棄物將使環境受 到嚴重污染。 【發明内容】 有鑒於此，有必要提供一種具有高散熱效率的全方 位的發光二極體燈具及其光引擎。 種發光一極體燈具，包括：一光學部，包括一發 201028609 光二極體光源及一出光通道’用以提供所需的照明亮度 與發光特性及對發光二極體光源保護；一電氣部，包括 ' 至少一電路板’用以提供發光二極體光源所需要之驅動 電源、控制電路及電源管理；及一散熱部，包括一向内 凹陷的散熱基體及該散熱基體外周面延伸形成的複數 鰭片’該散熱基體内周面縱向圍繞延伸形成一腔體，該 腔體内至少設有一吸熱面及一出光窗口，該出光窗口形 成在該散熱基體沿縱向的兩側端緣之間，所述發光二極 ⑩體光源设於該吸熱面上並與該吸熱面緊密熱接觸，以傳 輸及移除發光二極體光源發光時所釋放之熱量。 一種光引擎’包括：至少一發光二極體光源及一散 熱部；其中該散熱部包括一向内凹陷的散熱基體及該散 熱基體外周面延伸形成的複數鰭片，該散熱基體内周面 縱向圍繞延伸形成一腔體，該腔體内至少設有一吸熱面 及一出光窗口 ’該出光窗口形成在該散熱基體沿縱向的 ❹兩侧端緣之間’所述發光二極體光源設於該吸熱面上並 與該吸熱面緊密熱接觸，以傳輸及移除發光二極體光源 發光時所释放之熱量。 作為該發光二極體燈具及其光引擎之進一步改 進’該吸熱面兩侧向外傾斜廷伸設有二擴散面。 作為該發光二極體燈具及其光引擎之進一步改 進’該出光窗口處的散熱基體兩側端緣向外翻折並縱向 延伸分別形成一托架，一與散熱基體的形狀相匹配的透 明導光罩縱向延伸並固定至散熱基體之出光窗口處，與 6 201028609 腔體組合形成出光通道。 作為該發光二極體燈具及其光引擎之進一步改 進，該導光罩靠近散熱基體的兩側緣分別沿縱向間隔設 置氣孔。 作為該發光二極體燈具及其光引擎之進一步改 進，該散熱基體靠近光源之吸熱面上沿縱向間隔設置氣 孔。 ' 本發明具有如下優點： ❹ 本發明提供一種具有複數鰭片及散熱基體的發光 二極體燈具及其光引擎，該散熱基體於靠近光源的一侧 向内凹陷形成一腔體，且在腔體内的兩擴散斜面形成一 擴增的散熱面積，達到輕化光引擎並強化散熱之功效。 本發明提供一種具有複數鰭片及散熱基體的發光 二極體燈具及其光引擎，該散熱基體的腔體内由兩擴散 斜面形成一光杯，且在對應於該光杯位置的腔體外壁所 ❹設置的鰭片形成另一擴增的散熱面積，達到簡化照明配 光並強化散熱之功效。 本發明運用在照明裝置中建立一新的低流阻冷卻 氣流散熱通道之技術手段，除透過氣流溫差所產生的熱 浮力導引氣流進入各鰭片之間，並導引另一股新增的氣 流通過該腔體内，進一步強化光引擎的散熱效率。 【實施方式】 以下參照圖1至圖10,對本發明發光二極體燈具予 以進一步說明。 7 201028609 . 圖1係本發明發光二極體燈具第一實施例之（去除 導光罩之後）立體組裝示意圖，圖2係本發明發光二極體 ' 燈具第一實施例之與圖1相反視角之立體組裝示意圖， 圖3係本發明發光二極體燈具第一實施例中燈盤之立體 不意圖，圖4係本發明發光二極體燈具第一實施例中光 引擎之立體組裝示意圖，圖5係圖4之立體分解示意 圖，圖6係圖4之橫向剖面示意圖。該發光二極體燈具 主要包括一散熱部1〇、一光學部2〇及一電氣部3〇。其 © 中： ’、 光學部10係貼設於散熱部20上，其包括至少一發 光二極體光源11及一出光通道12。該發光二極體光源 11包括一導熱基板lu、設於該導熱基板U1上的至少 發光體112及複數電極（圖未示），其中所述發光體 112係由至少一發光二極體晶片經透明封裝所形成；所 述發光二極體光源11之導熱基板ηι與散熱部2〇的一 ❹吸熱面262的表面之間的緊密熱接觸，可先在其間塗抹 層熱界面材料（TIM )，再將已套裝電絕緣墊片的複 數螺絲（圖未示）分別穿過導熱基板ln上的複數固定 孔（圖未示），以便鎖固於散熱部2〇之吸熱面262上 對應所設螺孔（圖未示），亦可藉由迴焊方式將導熱基 板111直接黏貼（SMT)於該吸熱面262上，以傳輸及移 除該發光二極體光源U發光時釋出的熱量。該發光二 極體光源11的發光可藉由電線114連接發光二極體光 源11之電極與電氣部30中的一電路板31以及藉由電 8 201028609 • 線311連接電路板31與外部電源達成。 所述發光一極體光源11與吸熱面262之間的緊密 熱接觸還可藉由先對吸熱面262之表面進行電絕緣處 理然後在經電絕緣處理的該吸熱面262之表面上鋪設 基板電路如銅鉑基板電路，再將至少一發光二極體晶片 與所述基板電路電連接並於發光二極體晶片外包覆一 透明封裝體而達成，採用此種方式之發光二極體光源不 包含導熱基板111 ’從而避免導熱基板111與吸熱面262 之間接觸熱阻的産生，發光二極體光源u所産生的熱 里可直接由吸熱面262吸收並予以快速散發，可進一步 提升散熱效率；為方便敍述，本實施例及以下實施例皆 僅以包含有導熱基板U1之發光二極體光源u予以說 明，實際上，各實施例中之發光二極體光源u皆可用 上述不含導熱基板111之發光二極體光源替代。 出光通道12為導引該光源向外射出光線的通 ❿道，其包括一光杯121及一導光罩122。其中，該光杯 121用於規範該光源11向外射出光線的方向，具有增加 出光利用率之功效，該光杯121係由散熱部2〇組合而 成’因此下面有關出光通道12的說明結合散熱部一 併予以說明。 散熱部20包括一橫截面呈内凹的長條狀散熱基體 22，該散熱基體22外周面縱向並列佈設有複數鰭片 24。該散熱基體22的内周面縱向延伸圍成一内凹腔體 26，該腔體26包括一位於頂部的吸熱面262以及該吸 9 201028609 熱面262兩側緣分別以一定角度向外傾斜延伸形成的擴 散斜面264。該散熱基體22沿縱向延伸的兩側端緣之間 具有一定間隔，從而形成出光窗口，並自該兩側端緣向 外翻折形成托架226以及靠近托架226的外周面上向外 水平延伸出具有固定孔2 2 9的凸緣2 2 8，該托架内側設 有卡槽225。其中，該吸熱面262係用於配置光源工工， 以便吸收並傳輸該光源11發光時所釋放之熱量，並由 散熱基體22外周面上的複數鰭片24予以散發至周圍空 ❹氣中，從而達到輕量化燈具以及強化散熱之功效；上述 光源11與散熱部20構成一光引擎。 該腔體26内的兩擴散斜面264因設置在出光通道 12中，從而形成導引所述光源u向外射出光線的光杯 121，達到簡化照明配光之功效；所述光源^發光時所 釋放之熱量除可對應吸熱面262的散熱基體22傳輸到 對應的鰭片24處，亦可藉由該散熱基體22傳輸到兩侧 ❹的擴散斜面264及其對應的鰭片24，以分攤所述光源 11的熱負％，使所述對應於該光杯121位置的腔體外侧 所設置的鰭片24形成另一擴增的散熱面積，達到進一 步強化散熱之功效；且由於所述散熱部2〇可藉由擠形 製，一體成形，不但適用於量產而大幅降低成本，且較 之藉由接合不同散熱元件的習知傳熱方式，本創作可大 幅降低介面熱阻，從而確保光引擎獲致低結點溫度的高 出光效率。 導光罩122為包括至少一光學鏡片的透光罩蓋，圖 201028609 示的一與散熱基體22形狀相匹配的導光罩122係扣合 ‘ 於腔體26出口所設置的托架226上，並於兩端以側蓋 • 124封閉，該侧蓋124係以穿設於固定孔1242的螺絲鎖 固於散熱部20的散熱基體22兩端上，並於該侧蓋124 上開設一電線通孔1244 ’以便光源11及電氣部30的電 源電連接；所述導光罩122亦可以其他形式的透光罩蓋 扣合於腔體26出口所設置的托架226的卡槽225中。 上述導光罩中的光學鏡片型式可以依配光及照明 ❹需求而有不同的設計，亦可以在光源的封裝過程中直接 與該透明發光體一體成型，又可將該導光罩中的光學鏡 片直接罩蓋於個別的光源上，以避免二次光學造成的光 損耗。 在實際應用時，上述光源有可能由複數分離的個別 光源組合而成，此時出光通道中的光杯及導光罩可以是 對應於該複數分離的光源分開設置；亦可以只用一個2 ❿城-料鮮的配置；㈣，亦可以數組光杯分別涵 盍數組分離的光源’以及數組導光罩分別涵蓋數組分離 的光源之配置。 本發明的光引擎係透過氣流溫差導致的密度差而 力，絲由熱空氣向上漂浮㈣性趨勢引導嗜 片24外的冷空氣進入該韓片^之間，使進入各鰭片導 之間的冷空氣吸收由光源傳至鰭旦 浮’在此同時’新的冷空氣會自：填補=上 空間’並同樣經现熱升温上洋而發_片局部敎熱 11 201028609 果；上述冷熱氣流交替進出各鰭片之間形成自秋循淨的 移熱通道，從而使所述光引擎具有高散熱效率，達到有 效移除該光源發光時釋出的熱量。 為進一步強化光引擎的散熱效率，必須使該腔體％ 内的兩擴散斜面264充分發揮因散熱面積的擴大所產生 的散熱效益’因此，實有必要在該腔體26内建立一持 續而順暢的自然循環氣流通道，以冷卻該擴散斜面 Φ201028609 VI. Description of the Invention: [Technical Field] The present invention relates to a semiconductor lighting device, and more particularly to a light emitting diode lamp and a light engine thereof. [Prior Art] Due to long-term excessive dependence on fossil fuels, in addition to causing energy shortages and high oil prices, economic development is affected, and the global concentration of carbon dioxide and antimony gases is increasing, resulting in climate anomalies caused by global warming. The destruction of the environment and the harm to human survival are increasingly manifested. For the sustainable development of the earth's ecological environment, it is necessary to solve the energy crisis and environmental pollution at the same time. The development of new energy and renewable energy is the most energy-saving and efficient use of energy. An important strategy, while the energy consumed by traditional lighting is extremely impressive. Developing lighting energy saving will be the most important new energy technology, while semiconductor lighting uses high-power and high-brightness light-emitting diode (LED) as the light source. High luminous efficiency, energy saving, longevity, environmental protection (without mercury), fast start-up, directivity, etc., have the potential to widely replace traditional lighting sources. LED is converted into heat due to 8〇%~9〇% of input power, only 10%~20% is converted into light energy, and because the LED chip area is small, heat dissipation of the core chip is a key problem that LED package must solve; excellent heat dissipation The system can obtain a lower operating temperature at the same input power, extend the life of the LED, or increase the input power or chip density within the same temperature limit, thereby increasing the brightness of the LED lamp; ^Junction temperature It is an important technical indicator to measure the LED sealing loss = 201028609. The temperature of the junction will increase due to poor heat dissipation, which will cause the shirt to illuminate to the wavelength, light intensity, luminous efficiency and service life. Applying high-power high-brightness LEDs to the new light source of illumination, it is necessary to cooperate with a high-efficiency heat-dissipating mechanism to minimize the junction temperature of the LEDs in order to exert the above-mentioned advantages. Otherwise, the luminance and service life of the LED lamps will be greatly reduced. The impact will make the energy-saving effect of the illuminating diode lamp inconsistency, and directly impact the sin of the illuminating diode lamp', causing serious light decay and even invalidating the illuminating diode lamp.日光 The fluorescent lamp is mainly composed of a lamp tube, a rectifier and a starter. Since the luminous efficiency is about twice that of a tungsten wire bulb, it has become the most commonly used illuminating diode lamp. The illuminating system utilizes a closed gas discharge principle, and the specific structure The inner wall of the glass tube included in the vacuum is plated with a fluorescent substance and filled with an inert gas such as Argon, Neon or Krypton and mercury vapor by means of a rectifier capable of generating a high voltage. The current conducted in the tube is excited to generate a gas discharge, and during the process, the ultraviolet light and heat are released, and the ultraviolet light is absorbed by the fluorescent material to emit visible light, and different fluorescent substances emit different visible light; However, the main gas discharge materials of the Xenon lamp are toxic mercury and fluorescent substances, and the accumulation of waste accumulated by fluorescent lamps for many years will seriously pollute the environment. SUMMARY OF THE INVENTION In view of the above, it is necessary to provide a full-scale light-emitting diode lamp with high heat dissipation efficiency and a light engine thereof. The illuminating one-pole luminaire comprises: an optical part comprising a hair source 201028609 light source and an light-emitting channel for providing required illumination brightness and illuminating characteristics and protection of the light-emitting diode light source; The method includes: at least one circuit board for providing driving power, control circuit and power management required for the light emitting diode light source; and a heat dissipating portion including an inwardly recessed heat dissipating base body and a plurality of fins extending from the outer peripheral surface of the heat dissipating base Forming a cavity in the longitudinal direction of the heat-dissipating base body, the cavity body is provided with at least one heat absorbing surface and a light-emitting window, and the light-emitting window is formed between the two end edges of the heat-dissipating base body along the longitudinal direction, The light-emitting diode 10 body light source is disposed on the heat absorbing surface and is in close thermal contact with the heat absorbing surface to transmit and remove heat released when the light-emitting diode light source emits light. A light engine includes: at least one light emitting diode light source and a heat dissipating portion; wherein the heat dissipating portion includes an inwardly recessed heat dissipating base body and a plurality of fins extending from an outer peripheral surface of the heat dissipating base body Extending to form a cavity, the cavity is provided with at least one heat absorbing surface and a light exiting window. The light exiting window is formed between the two end edges of the heat radiating substrate along the longitudinal direction. The light emitting diode light source is disposed at the heat absorbing end. The surface is in close thermal contact with the heat absorbing surface to transmit and remove heat released by the light emitting diode light source. Further improvement of the light-emitting diode lamp and its light engine is provided with two diffusion faces extending outward from both sides of the heat absorption surface. As a further improvement of the light-emitting diode lamp and its light engine, the end edges of the heat-dissipating substrate at the light-emitting window are folded outwardly and longitudinally respectively to form a bracket, and a transparent guide matching the shape of the heat-dissipating substrate The mask extends longitudinally and is fixed to the light-emitting window of the heat-dissipating substrate, and is combined with the 6 201028609 cavity to form an optical channel. As a further improvement of the light-emitting diode lamp and its light engine, the light guide cover is provided with air holes at intervals along the longitudinal direction of the two side edges of the heat-dissipating base body. As a further improvement of the light-emitting diode lamp and its light engine, the heat-dissipating substrate is disposed at a distance from the heat-absorbing surface of the light source at intervals in the longitudinal direction. The present invention has the following advantages: ❹ The present invention provides a light-emitting diode lamp having a plurality of fins and a heat-dissipating substrate, and a light engine thereof, wherein the heat-dissipating substrate is recessed inwardly on a side close to the light source to form a cavity, and the cavity The two diffused slopes in the body form an enlarged heat dissipation area, which achieves the effect of lightening the light engine and enhancing heat dissipation. The invention provides a light-emitting diode lamp with a plurality of fins and a heat-dissipating substrate, and a light engine thereof. The cavity of the heat-dissipating substrate is formed by two diffusing slopes, and a cavity is formed on the outer wall of the cavity corresponding to the position of the light cup. The fins provided by the crucible form another amplified heat dissipating area, which simplifies the illumination light distribution and enhances the heat dissipation effect. The invention utilizes the technical means for establishing a new low-flow resistance cooling airflow cooling channel in the lighting device, except that the thermal buoyancy generated by the temperature difference of the airflow guides the airflow between the fins and guides another new one. Airflow through the cavity further enhances the heat dissipation efficiency of the light engine. [Embodiment] Hereinafter, a light-emitting diode lamp of the present invention will be further described with reference to Figs. 1 to 10 . 7 is a perspective view of a first embodiment of the light-emitting diode lamp of the present invention (after removing the light guide), and FIG. 2 is a perspective view of the first embodiment of the light-emitting diode of the present invention. 3 is a three-dimensional assembly diagram of the first embodiment of the light-emitting diode lamp of the present invention, and FIG. 4 is a three-dimensional assembly diagram of the light engine in the first embodiment of the light-emitting diode lamp of the present invention. 5 is a perspective exploded view of FIG. 4, and FIG. 6 is a schematic cross-sectional view of FIG. The LED lamp mainly comprises a heat dissipating portion 1 , an optical portion 2 , and an electrical portion 3 . The optical portion 10 is attached to the heat dissipating portion 20, and includes at least one light emitting diode light source 11 and a light exiting channel 12. The light-emitting diode light source 11 includes a heat-conducting substrate lu, at least a light-emitting body 112 disposed on the heat-conductive substrate U1, and a plurality of electrodes (not shown), wherein the light-emitting body 112 is formed by at least one light-emitting diode wafer. Formed by a transparent package; the thermal contact between the thermally conductive substrate ηι of the illuminating diode source 11 and the surface of a heat absorbing surface 262 of the heat dissipating portion 2 can be first applied with a layer of thermal interface material (TIM) therebetween. Then, the plurality of screws (not shown) of the electric insulating gasket are respectively passed through a plurality of fixing holes (not shown) on the heat-conducting substrate ln, so as to be locked on the heat-absorbing surface 262 of the heat-dissipating portion 2, corresponding to the screw provided. The hole (not shown) may also be directly bonded (SMT) to the heat absorbing surface 262 by reflow soldering to transmit and remove heat released when the light emitting diode light source U emits light. The light emitting diode 11 can be connected to the circuit of the LED body 11 and the circuit board 31 of the electrical unit 30 by the electric wire 114, and the circuit board 31 is connected to the external power source by the electric line 20102609. . The close thermal contact between the light emitting body light source 11 and the heat absorbing surface 262 can also be performed by electrically insulating the surface of the heat absorbing surface 262 and then laying the substrate circuit on the surface of the heat absorbing surface 262 that is electrically insulated. For example, the copper-platinum substrate circuit is electrically connected to the at least one LED chip and the substrate circuit, and the transparent LED package is coated on the LED substrate. The LED light source in this manner is not used. The heat-conducting substrate 111' is included to avoid the occurrence of thermal resistance between the heat-conducting substrate 111 and the heat-absorbing surface 262. The heat generated by the light-emitting diode light source u can be directly absorbed by the heat-absorbing surface 262 and quickly dissipated, thereby further improving heat dissipation efficiency. For the convenience of description, the present embodiment and the following embodiments are only described by the light-emitting diode light source u including the heat-conducting substrate U1. In fact, the light-emitting diode light source u in each embodiment can be used without the above-mentioned heat conduction. The light emitting diode light source of the substrate 111 is replaced. The light exiting passage 12 is a passage for guiding the light source to emit light outward, and includes a light cup 121 and a light guide cover 122. Wherein, the light cup 121 is used to regulate the direction in which the light source 11 emits light outward, and has the effect of increasing the light utilization efficiency. The light cup 121 is combined by the heat dissipating portion 2'. Therefore, the following description of the light exit channel 12 is combined. The heat dissipation part will be explained together. The heat dissipating portion 20 includes an elongated heat dissipating base 22 having a concave cross section, and the outer peripheral surface of the heat dissipating base 22 is longitudinally arranged with a plurality of fins 24 juxtaposed. The inner circumferential surface of the heat dissipation base 22 extends longitudinally to form an inner cavity 26, the cavity 26 includes a heat absorption surface 262 at the top portion, and the suction surface of the heat surface 262 of the heat sink 262 is inclined outwardly at an angle. A diffusion ramp 264 is formed. The heat-dissipating base 22 has a space between the two end edges extending in the longitudinal direction to form a light window, and is folded outward from the two end edges to form the bracket 226 and the outer peripheral surface of the bracket 226 is outwardly horizontal. A flange 2 2 8 having a fixing hole 2 29 is extended, and a bracket 225 is provided inside the bracket. The heat absorbing surface 262 is used for arranging the light source to absorb and transmit the heat released when the light source 11 emits light, and is radiated by the plurality of fins 24 on the outer peripheral surface of the heat dissipation substrate 22 to the surrounding air enthalpy. Thereby, the light fixture and the heat dissipation effect are achieved; the light source 11 and the heat sink 20 constitute a light engine. The two diffusion slopes 264 in the cavity 26 are disposed in the light exit channel 12, thereby forming a light cup 121 for guiding the light source u to emit light outward, thereby achieving the effect of simplifying illumination light distribution; The heat released can be transmitted to the corresponding fins 24 corresponding to the heat dissipation substrate 22 of the heat absorption surface 262, and can also be transmitted to the diffusion slopes 264 of the two sides and their corresponding fins 24 by the heat dissipation substrate 22 to share the heat. The heat negative % of the light source 11 is such that the fin 24 disposed on the outer side of the cavity corresponding to the position of the light cup 121 forms another amplified heat dissipation area, thereby further enhancing the heat dissipation effect; and 2〇 can be formed by extrusion molding, which is not only suitable for mass production, but also greatly reduces the cost. Compared with the conventional heat transfer method by joining different heat dissipating components, this creation can greatly reduce the interface thermal resistance, thus ensuring light. The engine achieves high light output efficiency at low junction temperatures. The light guide cover 122 is a light transmissive cover including at least one optical lens, and a light guide cover 122 matching the shape of the heat dissipation base 22 is fastened to the bracket 226 provided at the outlet of the cavity 26, as shown in FIG. And the side cover 124 is closed on both ends of the heat dissipation base 22 of the heat dissipation portion 20 by a screw passing through the fixing hole 1242, and a wire is opened on the side cover 124. The hole 1244' is electrically connected to the power source 11 and the power supply of the electrical part 30. The light guide cover 122 can also be fastened to the card slot 225 of the bracket 226 provided at the outlet of the cavity 26 by other forms of the transparent cover. The optical lens type in the light guide cover may have different designs according to the requirements of light distribution and illumination, or may be integrally formed with the transparent light body during the packaging process of the light source, and the optical in the light guide cover. The lens is directly covered by an individual light source to avoid optical loss caused by secondary optics. In practical applications, the light source may be composed of a plurality of separate individual light sources. The light cup and the light guide in the light exit channel may be separately arranged corresponding to the plurality of separate light sources; or only one 2 ❿ may be used. City - fresh configuration; (d), can also be arrayed light cups respectively cover the array of separate light source 'and array light guide cover respectively separate array of light source configuration. The light engine of the present invention is forced by the density difference caused by the temperature difference of the airflow, and the filament floats upward by the hot air (four) trend to guide the cold air outside the tablet 24 to enter between the Korean wafers, so as to enter between the fin guides. The absorption of cold air from the light source to the fins floats 'at the same time' the new cold air will be: fill = upper space 'and the same heat is heated up on the ocean. _ piece local heat 11 201028609 fruit; the above hot and cold air flow alternate A heat transfer channel is formed between the fins and the fins, so that the light engine has high heat dissipation efficiency, and the heat released when the light source emits light is effectively removed. In order to further enhance the heat dissipation efficiency of the light engine, it is necessary to make the two diffusion slopes 264 in the cavity % fully utilize the heat dissipation benefit caused by the expansion of the heat dissipation area. Therefore, it is necessary to establish a continuous and smooth flow in the cavity 26. Natural circulation airflow passage to cool the diffusion ramp Φ
264;為達此目的，在該腔體26内靠近光源u的吸熱 面262上，沿縱向每隔一段距離開設有分別對應於鰭^ 24間隙的複數氣孔222,該等氣孔222分別貫穿散熱基 體22,以便使腔體26頂部與朝鰭片24方向的外^ 通，並在導光罩122的兩側邊沿轴向（或者縱向）設置另 一組複數氣孔123,以便使腔體26内之底部與朝導光罩 122方向的外界導通；藉由所述兩組複數氣孔η]以形 成自外界將冷卻氣流導入該腔體26内，並將吸熱後的 該氣流自頂部的氣孔222順利排出，從而持續驅動外部 低溫氣流導入腔體26中，進一步強化光引擎的散熱效 果0 所述持續驅動外部低溫氣流並導入腔體26中的散 熱機制，係藉由散熱基體22傳導光源η釋出的熱量而 使腔體26内壁呈現較高的溫度，並加熱腔體％中既有 的空氣而升溫’該熱空氣因密度降低而使體積膨脹並上 ^ ’進而自腔體26頂部的氣孔222排出，並在此同時 驅動外界較低溫的空氣自腔體26下方的導光罩122所 12 201028609 5又複數氣孔123引入腔體内，如此週而復始形成腔體26 内的自然冷卻循環，達到更進一步強化光引擎的散熱效 果’從而確保該發光二極體燈具發揮高效率與穩定的光 輸出效果。 所述貫通散熱基體的氣孔位置可依光源的形式作 不同的配置，例如：使用本實施例中的條狀光源時，則 因頂部平面的中央區已被整合各分散發光體於一共同 _ 的導熱基板所佔用，因此，除可在避開該導熱基板的頂 部平面設置該等氣孔外，亦可在接近該頂部平面的所述 擴散斜面上設置，以避免或降低高溫空氣滯留於腔體的 頂部而達到較佳的散熱效果；使用複數分散的獨立光源 寺了以在該光源之間的頂部平面設置該氣孔而達到最 佳的散熱效果。 綜上所述，本發明結合在腔體26内與腔體26外所 擴增的散熱面積’及由腔體26内的複數氣孔（222,123) 魯導引氣流通過其内擴增的散熱面積，形成一新增的氣流 通道，使本發明光引擎的散熱效果遠優於習知技術，從 而確保應用在半導體照明上獲致低結點溫度的高效率 照明效果。 電氣部30包括一電路板（圖未示）及一外殼，該 電路板係藉由電線與光源11的電極及電源連接，上述 電氣部30中的電源除可採用與光源η匹配的直流電源 外，亦可透過電源轉換器將交流市電轉換為適合該光源 11的直流電源，並提供該光源U之驅動電源及發光二 13 201028609 極體燈具之電源管理；該外殼為隔離保護該電路板的一 * 密封殼體。 ' 上述照明裝置還包括一燈盤40,用以整合所述複數 曰光燈官的光學部10、電氣部30及散熱部20 ,並藉以 形成一整合所述複數光引擎之模組化的照明裝置；該燈 盤40包括一罩體42及一扣合於該罩體42内的配光罩 46。該罩體42為由板狀體之中部内凹形成一背板422 以及一容置空間424。為使所述日光燈管穩固安裝於該 ❹燈盤40上，該罩體42上設有與日光燈管相同數量的長 形開孔426’用以使散熱部20凸伸於該發光二極體燈具 的背面，並使該等日光燈管的出光通道12凸伸於該發 光二極體燈具的正面；為達此目的，藉由在該散熱部2〇 的腔體26邊緣沿縱向的兩侧分別凸伸的條狀凸緣228 固設於所述罩體42上；組裝時，先將該等日光燈管的 出光通道12自罩體42背面的開孔426向該發光二極體 ❹燈具的正面凸伸，且以該凸緣228支撐於所述開孔426 的邊緣緣，並以螺絲將凸緣228上設置的複數固定孔與 該開孔426邊緣所對應的固定孔鎖固，以使燈盤4〇正 面形成該發光二極體燈具的光學部，並使燈盤4〇背 面形成該發光二極體燈具的散熱部2〇。 該配光罩46包括呈框型的本體46〇，其本體46〇 内對應於每個罩體42的開孔426兩邊緣位置向外傾斜 延伸形成二錐面462及一透空區464，以便將日光燈管 的射出光線作照明環境的配光；另外，在配光罩46上 201028609 沿該開孔426的橫向間隔設置複數遮光板466以防止眩 光。 照明裝置組裝的方法為：先將該等日光燈管的出光 通道12自罩體42的背面伸入該開孔426中，並將設置 於散熱部20的凸緣228支撐於所述開孔426的邊緣上， 使散熱部20凸伸於該罩體42的背面，以發揮最大的散 熱效果，再以螺絲將凸緣228上設置的複數固定孔與該 罩體42之開孔426邊緣所對應的固定孔予以鎖固，然 後將配光罩46扣合於該罩體42内；所述組裝完成的模 組化照明裝置使罩體42正面形成該照明裝置的光學部 1〇,背面形成該照明裝置的散熱部20;另外，在不妨礙 外觀的前題下電氣部30設置於罩體42的正面，以達方 便安裝及維護檢測之功效；安裝方法為：在安裝配光罩 4〇之A ’先將該電氣部30固設於罩體42正面相鄰開孔 426之間的中心線處並在罩體42的背板422上設有匯線 ❿孔428 ’用於各種電線等匯集後穿過，然後將配光罩46 扣合於该罩體42内即可，如此可使該電氣部3〇完全被 隱藏於燈盤40内的隱蔽空間内。 本發明藉由所述罩體42將複數支半導體日光燈管 整合成一模組’以形成一種能延伸照明容量的模組化照 明裝置，從而可依不同的照明需求，將該模組的數量及 配置作彈性的組合，達到降低成本，發揮設計多樣化及 應用靈活化之功效。 本發明藉由習用曰光燈裝置，只需在既有燈盤4〇 15 201028609 的罩體42上開設安裝半導體照明光引擎的開孔426，即 可將習用曰光燈轉換成為半導體照明裝置，不但可達到 既有資源的充分回收再利用之減廢功效，且可因此大幅 節省製造與安裝成本之經濟效益。 圖7係本發明發光二極體燈具第二實施例中光引擎 之組裝剖面示意圖；本實施例與第一實施例的主要區別 在於：本實施例中光源11a的導熱基板llla與腔體26a 的吸熱面262a之間另外安裝一壓扁的熱管50,該熱管 50係密合鑲喪於吸熱面262a的溝槽中，並使該熱管50 與導熱基板llla的接觸面及腔體26a的吸熱面262a維 持在同一平面，以便將光源na的熱負荷快速而均勻地 傳導至散熱基體22a ’使散熱基體22a的溫度分佈均勻 化，藉以進一步提升發光二極體燈具的整體散熱效率。 圖8係本發明發光二極體燈具第三實施例中光引擎 之組裝剖面示意圖；本實施例與前述實施例的主要區別 ❹在於：本實施例中腔體26b内沒有設置吸熱面262a，而 只設置了兩個擴散斜面264b，而光源1 lb分別設置於所 述兩擴散斜面264b上’以進一步擴大吸熱面積，使更 均勻地分攤光源lib的熱負荷，達到有效提升發光二極 體燈具的整體散熱效率；另外，為配合發光二極體燈具 的整體配光，所述兩擴散斜面264b之間的張角較前述 實施例為大，以避免出光的相互阻檔或干擾，此外，由 於兩擴散斜面264b上的光源1 lb相對稱，因此可在兩 擴散斜面264b的相交處，即腔體26b的至高點貫穿設 16 201028609 •置氣孔222b’以建立順暢的氣流通道，從而達到強化散 熱的功效。 3 9係本發明發光一極體燈具第四實施例中光引擎 之組裝剖面示意圖；本實施例與第二實施例的主要區別 j於：本實施例中腔體26c的兩擴散斜面264c上分別 設有一輔助光源11c，以進一步將總體光源熱負荷分佈 在擴大的吸熱面上，或藉以增加總體光源熱負荷。 ❹ 圖1〇係本發明發光二極體燈具第五實施例中光引 擎之組裝剖面示意圖；本實施例與第四實施例的主要區 別在於：本實施例中腔體26d的橫截面呈弧形，内凹形 成一弧形吸熱面266’該弧形吸熱面266上縱向並列設 有二個相同的光源lid，並三個光源lld的導熱基板 uid與弧形吸熱面266之間設有板形熱管5〇d，所述光 源lid的導熱基板llld及板形熱管5〇d的橫截面形狀 與弧形吸熱面266的弧度相對應，均呈弧形。本實施例 ❹其除可使配光較均勻外，亦由於不存在吸熱面與兩擴散 斜面間的張角，可使吸熱面作更充分的利用。 由上述的實施方式已進一步清楚說明本發明的技 術特徵及達成之功效，包括·· 1) 本發明提供一種具有散熱鰭片及實心體的光引 擎，該實心體於靠近光學室的一側向内凹陷形成一腔 體，且在腔體内的兩擴散斜面形成一擴增的散熱面積， 達到輕化光引擎並強化散熱之功效。 2) 本發明提供一種具有散熱鰭片及實心體的光引 17 201028609 •擎，該實心體的腔體内由兩擴散斜面形成一光杯，且在 對應於該光杯位置的腔體外壁所設置的鰭片形成另一 擴增的散熱面積，達到簡化照明配光並強化散熱之功 效。 3) 本發明運用在發光二極體燈具中建立一新的低流 阻冷卻氣流通道之技術手段，除透過氣流溫差所產生的 熱浮力導引氣流進入各鰭片之間，並導引另一股新的氣 ❹流通過該腔體内，進一步強化光引擎的散熱效率。 4) 本發明結合在腔體内與腔體外所擴增的散熱面 積，及由腔體内的複數氣孔導引氣流通過其内擴增的散 熱面積，形成一新增的氣流通道，使本發明光引擎的散 熱效果遠優於習知技術，從而確保應用在半導體照明上 獲致低結點溫度的高效率照明效果。 5) 本發明提供一種具有散熱鰭片及實心體的光引 擎，在該實心體的腔體内靠近光源之頂部還設有分別對 ❿應於該等鰭片之間的複數氣孔，並在導光罩設置另一組 複數氣孔，從而額外自該複數氣孔持續驅動外部低溫氣 流導入腔體中，進一步強化光引擎的散熱效果。 6) 本發明提供一種具有均熱功效的光引擎，進一步 以熱管強化光源的吸熱效率及鰭片的散熱效率，使該光 引擎應用在半導體照明上獲致低結點溫度的高效率照 明效果。 7) 本發明提供一種具有日光灯外觀特性之半導體發 光一極體燈具，特別係由一外周面向外分佈的複數鰭片 18 201028609 - .及由内周面凹腔體的散熱部，所述散熱部可藉由 擠形製程-體成形，不但可大幅降低熱阻，且適用於量 產而大幅降低成本。 8)本發明提供一種具有日光灯特性之半導體發光二 極體燈具’特㈣在不f整流器和啟動器的電連接特性 下，提供一種較習知日光燈供電需求更為簡單實用的半 導體發光-極體燈具及其光引擎，達到方便更換及安裝之 功效。 鲁 9)本發明提供一種能延伸照明容量的模組化半導體 日光燈裝置，藉由一燈盤整合複數支日光燈管成一模 組，依不同的照明需求，將該模組的數量及配置作彈性 的組合，達到降低成本，發揮設計多樣化及應用靈活化 之功效。 10) 本發明提供一種高效率散熱並兼顧照明與配光 的曰光燈模組及其光引擎，藉由自然循環、燈盤結構及 ❹腔體内壁的吸熱面與兩擴散斜面之張角或弧度，達到高 可罪度、長哥命及局光效之功效。 11) 本發明藉由不同的光引擎形狀搭配均一的光源 配置方式以簡化發光二極體燈具的配光工程，從而避免 驾知發光二極體燈具必需針對其中的每一光源作繁複 的個別導光調配，且使光源獲致更準確的定位而優化光 學的性能。 12) 本發明藉由不同的光引擎型式搭配習用日光燈 燈盤’只需在燈盤上設置安裝光引擎的開孔，即可轉換 19 201028609 •成為半導體發光二極體日光燈，達到節I成本、減廢再 利用、易於安裝、精減工時的經濟效益。 紅上所述，本發明確已符合發明專利之要件，遂依 f提出專利ΐ請。惟’以±所述者僅為本發明之較佳實 鉍例，自不能以此限制本案之申請專利範圍。舉凡熟悉 本案技藝之人士援依本發明.之精神所作之等效修飾或 變化，皆應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 ❹ m 圖1係本發明發光二極體燈具第一實施例（去除導 光罩後）之立體組裝示意圖。 圖2係本發明發光二極體燈具第一實施例與圖玉相 反視角之立體組裝示意圖。 圖3係本發明發光二極體燈具第一實施例之燈盤之 立體示意圖。 圖4係本發明發光二極體燈具第一實施例之光引擎 ❹之立體組裝不意圖。 圖5係圖4之立體分解示意圖。 圖6係圖4之橫向刮面示意圖。 圖7係本發明發光二極體燈具第二實施例之光引擎 之剖面示意圖。 圖8係本發明發光二極體燈具第三實施例之光引擎 之剖面不意圖。 圖9係本發明發光二極體燈具第四實施例之光引擎 之剖面示意圖。 201028609 圖ίο係本發明發光二極體燈具第五實施例之光引 擎之剖面示意圖。 【主要元件符號說明】264. In order to achieve the purpose, a plurality of air holes 222 corresponding to the gaps of the fins 24 are respectively disposed at intervals along the longitudinal direction of the heat absorption surface 262 of the cavity 26 near the light source u, and the air holes 222 respectively penetrate the heat dissipation substrate. 22, in order to make the top of the cavity 26 and the outer direction of the fin 24, and to form axially (or longitudinally) another set of plurality of air holes 123 on both sides of the light guide cover 122 so as to be inside the cavity 26. The bottom is electrically connected to the outside of the light guide 122; the two sets of plurality of air holes η] are formed to introduce a cooling airflow into the cavity 26 from the outside, and the airflow after the heat absorption is smooth from the air hole 222 at the top. Discharge, thereby continuously driving the external low-temperature airflow into the cavity 26, further enhancing the heat dissipation effect of the light engine. The heat dissipation mechanism for continuously driving the external low-temperature airflow and introducing into the cavity 26 is released by the heat-dissipating substrate 22 to conduct the light source η. The heat causes the inner wall of the cavity 26 to exhibit a higher temperature and heats up the existing air in the cavity %. The hot air expands and expands due to the decrease in density, and the pores 222 from the top of the cavity 26 Discharged and At the same time, the lower temperature air is driven from the lower portion of the light guide cover 122 12 201028609 5 and a plurality of air holes 123 are introduced into the cavity, so as to form a natural cooling cycle in the cavity 26 to further enhance the heat dissipation of the light engine. The effect 'ensificates to ensure high efficiency and stable light output of the LED luminaire. The position of the air venting through the heat dissipation substrate may be differently configured according to the form of the light source. For example, when the strip light source in this embodiment is used, the central area of the top plane has been integrated with the respective dispersed illuminants in a common The heat-conducting substrate is occupied, and therefore, in addition to the air holes disposed on the top plane of the heat-conducting substrate, the diffusion slopes may be disposed near the top plane to avoid or reduce the retention of high-temperature air in the cavity. The top part achieves better heat dissipation effect; the use of a plurality of discrete independent light source temples to set the air holes in the top plane between the light sources for optimal heat dissipation. In summary, the present invention combines the heat dissipating area 'extended in the cavity 26 with the outside of the cavity 26 and the heat radiating area through which the plurality of air holes (222, 123) in the cavity 26 guide the airflow to be amplified. The formation of a new airflow channel makes the heat dissipation effect of the light engine of the present invention far superior to the prior art, thereby ensuring the application of high-efficiency illumination effects at low junction temperatures on semiconductor illumination. The electrical part 30 includes a circuit board (not shown) and a casing connected to the electrodes and the power source of the light source 11 by wires, and the power source in the electrical part 30 can be replaced by a DC power source matched with the light source η. The AC power can be converted into a DC power source suitable for the light source 11 through a power converter, and the power source of the light source U and the power management of the light source of the light source can be provided; the outer casing is an isolation protection circuit board. * Sealed housing. The illumination device further includes a light panel 40 for integrating the optical portion 10, the electrical portion 30 and the heat dissipation portion 20 of the plurality of backlights, thereby forming a modular illumination integrating the complex light engine The lamp panel 40 includes a cover 42 and a light distribution cover 46 that is engaged in the cover 42. The cover 42 is recessed from a middle portion of the plate-like body to form a back plate 422 and an accommodating space 424. In order to securely mount the fluorescent tube on the xenon lamp 40, the cover 42 is provided with the same number of elongated openings 426' as the fluorescent tube for projecting the heat dissipating portion 20 to the light emitting diode lamp. The rear surface of the fluorescent tube protrudes from the front surface of the light-emitting diode lamp; for this purpose, respectively, by the edges of the cavity 26 of the heat-dissipating portion 2 The strip-shaped flanges 228 are fixed on the cover 42; when assembled, the light-emitting passages 12 of the fluorescent tubes are firstly convex from the opening 426 on the back of the cover 42 toward the front surface of the LED Stretching, and supporting the edge of the opening 426 with the flange 228, and locking the plurality of fixing holes provided on the flange 228 with the fixing holes corresponding to the edges of the opening 426 by screws, so as to make the lamp panel The optical portion of the light-emitting diode lamp is formed on the front surface of the light-emitting diode, and the heat-dissipating portion 2 of the light-emitting diode lamp is formed on the back surface of the light-emitting diode 4. The light distribution cover 46 includes a frame-shaped body 46〇, and the inner edge of the body 46 is correspondingly inclined to extend outwardly from the edge of the opening 426 of each cover 42 to form a biconical surface 462 and a transparent area 464. The light emitted from the fluorescent tube is used as a light distribution for the illumination environment; in addition, a plurality of light shielding plates 466 are disposed on the light distribution cover 46 at a lateral interval of the opening 426 to prevent glare. The lighting device is assembled by first extending the light exiting passage 12 of the fluorescent tube into the opening 426 from the back surface of the cover 42 and supporting the flange 228 disposed on the heat radiating portion 20 to the opening 426. On the edge, the heat dissipating portion 20 is protruded from the back surface of the cover body 42 to maximize the heat dissipation effect, and the plurality of fixing holes provided on the flange 228 are screwed to the edges of the opening 426 of the cover body 42. The fixing hole is locked, and then the light distribution cover 46 is fastened into the cover 42. The assembled modular illumination device forms the optical portion 1 of the illumination device on the front surface of the cover 42 and forms the illumination on the back surface. The heat dissipating portion 20 of the device; further, the electric portion 30 is disposed on the front surface of the cover 42 without impeding the appearance, so as to facilitate the installation and maintenance of the inspection effect; the installation method is: after installing the light distribution cover 4A 'The electrical part 30 is first fixed at the center line between the adjacent openings 426 on the front side of the cover 42 and the wire boring 428' is provided on the back plate 422 of the cover 42 for various wires and the like. Passing through, and then engaging the light hood 46 in the cover 42 so that The electrical part 3 is completely hidden within the concealed space within the light panel 40. The invention integrates a plurality of semiconductor fluorescent tubes into a module by the cover 42 to form a modular illumination device capable of extending the illumination capacity, so that the number and configuration of the modules can be different according to different lighting requirements. A combination of flexibility to reduce costs and diversify design and application flexibility. According to the present invention, the conventional xenon lamp device can be used to convert the conventional xenon lamp into a semiconductor lighting device by simply opening the opening 426 of the semiconductor illumination light engine on the cover 42 of the existing lamp panel 4〇15 201028609. Not only can the waste recycling effect of the full recycling of existing resources be achieved, but the economic benefits of manufacturing and installation costs can be greatly reduced. 7 is a schematic cross-sectional view showing the assembly of the light engine in the second embodiment of the light-emitting diode lamp of the present invention; the main difference between this embodiment and the first embodiment is that the heat-conducting substrate 111a and the cavity 26a of the light source 11a in this embodiment are A flattened heat pipe 50 is additionally disposed between the heat absorbing surface 262a, and the heat pipe 50 is closely adhered to the groove of the heat absorbing surface 262a, and the contact surface of the heat pipe 50 with the heat conductive substrate 111a and the heat absorbing surface of the cavity 26a. The 262a is maintained in the same plane to quickly and uniformly conduct the heat load of the light source na to the heat dissipation substrate 22a' to uniformize the temperature distribution of the heat dissipation substrate 22a, thereby further improving the overall heat dissipation efficiency of the light emitting diode lamp. 8 is a schematic cross-sectional view showing the assembly of the light engine in the third embodiment of the light-emitting diode lamp of the present invention; the main difference between the embodiment and the foregoing embodiment is that the heat absorption surface 262a is not disposed in the cavity 26b in the embodiment. Only two diffusion slopes 264b are provided, and the light sources 1 lb are respectively disposed on the two diffusion slopes 264b to further enlarge the heat absorption area, so as to more evenly distribute the heat load of the light source lib, thereby effectively improving the light-emitting diode lamps. In addition, in order to cooperate with the overall light distribution of the light-emitting diode lamp, the opening angle between the two diffusion slopes 264b is larger than that of the foregoing embodiment to avoid mutual blocking or interference of light, and further, due to two diffusions The light source 1 lb on the inclined surface 264b is symmetrical, so that the intersection of the two diffusion slopes 264b, that is, the highest point of the cavity 26b, can be set through 16 201028609 • the air hole 222b' to establish a smooth air flow passage, thereby enhancing the heat dissipation effect. . 3 9 is a schematic sectional view of the assembly of the light engine in the fourth embodiment of the present invention; the main difference between the present embodiment and the second embodiment is as follows: in the embodiment, the two diffusion slopes 264c of the cavity 26c are respectively An auxiliary light source 11c is provided to further distribute the overall light source thermal load on the enlarged heat absorption surface or to increase the overall light source thermal load. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic cross-sectional view showing the assembly of a light engine in a fifth embodiment of the light-emitting diode lamp of the present invention; the main difference between this embodiment and the fourth embodiment is that the cross section of the cavity 26d is curved in this embodiment. The concave concave surface forms a curved heat absorbing surface 266'. The curved heat absorbing surface 266 is provided with two identical light sources lid in the longitudinal direction, and a plate shape is arranged between the heat conducting substrate uid and the curved heat absorbing surface 266 of the three light sources 11d. The heat pipe 5〇d, the cross-sectional shape of the heat-conducting substrate 11ld and the plate-shaped heat pipe 5〇d of the light source lid corresponds to the curvature of the curved heat-absorbing surface 266, and is curved. In this embodiment, in addition to making the light distribution more uniform, and because there is no opening angle between the heat absorbing surface and the two diffusion slopes, the heat absorbing surface can be more fully utilized. The technical features and the achieved effects of the present invention are further clarified by the above-described embodiments, including: 1) The present invention provides a light engine having a heat dissipating fin and a solid body, the solid body being on a side close to the optical chamber The inner recess forms a cavity, and the two diffused slopes in the cavity form an enlarged heat dissipation area, thereby achieving the effect of lightening the light engine and enhancing heat dissipation. 2) The present invention provides a light guide 17 with a heat sink fin and a solid body. The body of the solid body is formed by two diffusing slopes, and a light cup is formed on the outer wall of the chamber corresponding to the position of the light cup. The fins are formed to form another amplified heat dissipation area, which simplifies the illumination light distribution and enhances the heat dissipation effect. 3) The present invention utilizes a technical means for establishing a new low flow resistance cooling air flow passage in a light-emitting diode lamp, except that the thermal buoyancy generated by the temperature difference of the air flow guides the airflow between the fins and guides the other A new gas turbulent flow through the cavity further enhances the heat dissipation efficiency of the light engine. 4) The present invention combines the heat dissipation area amplifying in the cavity and outside the cavity, and the heat dissipation area amplified by the airflow guided by the plurality of pores in the cavity to form a new airflow channel, so that the present invention The light engine's heat dissipation is far superior to conventional technology, ensuring high-efficiency illumination with low junction temperatures on semiconductor lighting. 5) The present invention provides a light engine having a heat dissipating fin and a solid body, and a plurality of air holes respectively corresponding to the fins are respectively disposed on the top of the solid body cavity near the light source, and are guided The mask is provided with another set of a plurality of air holes, so that the external low temperature airflow is continuously driven into the cavity from the plurality of air holes, thereby further enhancing the heat dissipation effect of the light engine. 6) The present invention provides a light engine having a soaking efficiency, further enhancing the heat absorbing efficiency of the light source and the heat dissipation efficiency of the fin by the heat pipe, so that the light engine is applied to the semiconductor lighting to obtain a high-efficiency illumination effect at a low junction temperature. 7) The present invention provides a semiconductor light-emitting diode lamp having the appearance characteristics of a fluorescent lamp, in particular, a plurality of fins 18 201028609 - which are distributed outward from an outer peripheral surface, and a heat radiating portion of the concave cavity by the inner peripheral surface, the heat radiating portion The extrusion process can be formed by the extrusion process, which not only greatly reduces the thermal resistance, but also is suitable for mass production and greatly reduces the cost. 8) The present invention provides a semiconductor light-emitting diode lamp having the characteristics of a fluorescent lamp, which provides a simpler and more practical semiconductor light-emitting body than that of the conventional fluorescent lamp without the electrical connection characteristics of the rectifier and the actuator. The luminaire and its light engine are easy to replace and install. Lu 9) The present invention provides a modular semiconductor fluorescent lamp device capable of extending the illumination capacity, which integrates a plurality of fluorescent tubes into a module by a lamp panel, and flexibly adjusts the number and configuration of the modules according to different lighting requirements. Combine to reduce costs and maximize design diversification and application flexibility. 10) The present invention provides a high-efficiency heat-dissipating light-emitting lamp module and a light engine thereof, which have a natural circulation, a lamp panel structure, and an opening angle or curvature of the heat absorbing surface of the inner wall of the cavity and the two diffusion slopes. , to achieve high guilty, long brother life and the effectiveness of the light effect. 11) The invention simplifies the light distribution engineering of the light-emitting diode lamp by using different light engine shapes and uniform light source configuration manners, thereby avoiding the need to know that the light-emitting diode lamps must be complicated for each light source. The light is blended and the light source is more accurately positioned to optimize optical performance. 12) The present invention can be converted by using different light engine types with the conventional fluorescent lamp panel. It is only necessary to set the opening of the light engine on the lamp panel to convert 19 201028609. Reduce waste and reuse, easy to install, and reduce the economic benefits of working hours. According to the above description, the present invention has indeed met the requirements of the invention patent, and the patent application is filed by F. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application in this case. Equivalent modifications or variations made by those skilled in the art to the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing a three-dimensional assembly of a first embodiment of the light-emitting diode lamp of the present invention (after removing the light guide). Fig. 2 is a perspective view showing the three-dimensional assembly of the first embodiment of the light-emitting diode lamp of the present invention and the opposite perspective of the figure. Fig. 3 is a perspective view showing the lamp panel of the first embodiment of the light-emitting diode lamp of the present invention. Fig. 4 is a perspective view showing the three-dimensional assembly of the light engine of the first embodiment of the light-emitting diode lamp of the present invention. FIG. 5 is a perspective exploded view of FIG. 4. FIG. Figure 6 is a schematic view of the transverse scraping surface of Figure 4. Figure 7 is a cross-sectional view showing a light engine of a second embodiment of the light-emitting diode lamp of the present invention. Fig. 8 is a cross-sectional view showing a light engine of a third embodiment of the light-emitting diode lamp of the present invention. Fig. 9 is a cross-sectional view showing the light engine of the fourth embodiment of the light-emitting diode lamp of the present invention. 201028609 Fig. 1 is a schematic cross-sectional view showing a light engine of a fifth embodiment of the light-emitting diode lamp of the present invention. [Main component symbol description]
光學部 10 發光二極體光源11、11a、lib 、11c、lid 導熱基板 111、111a、llld 發光體 112 出光通道 12 光杯 121 導光罩 122 氣孔 123 、 222 側蓋 124 固定孔 1242、229 電線通孔 1244 散熱部 20 散熱基體 22 卡槽 225 托架 226 凸緣 228 腔體 26 ' 26a ' 26b 、26c、26d 吸熱面 262 ' 262a 擴散斜面 264、264 b ' 264c 弧形吸熱面 266 電氣部 30 燈盤 40 罩體 42 背板 422 容置空間 424 開孔 426 匯線孔 428 配光罩 46 本體 460 錐面 462 透空部 464 遮光板 466 熱管 50、50d 21Optical portion 10 Light-emitting diode light source 11, 11a, lib, 11c, lid Heat-conducting substrate 111, 111a, llld Light-emitting body 112 Light-emitting passage 12 Light cup 121 Light guide cover 122 Air hole 123, 222 Side cover 124 Fixing hole 1242, 229 Wire Through hole 1244 heat sink 20 heat sink base 22 card slot 225 bracket 226 flange 228 cavity 26 ' 26a ' 26b , 26c , 26d heat absorption surface 262 ' 262a diffusion slope 264 , 264 b ' 264c curved heat absorption surface 266 electrical part 30 Lamp plate 40 Cover 42 Back plate 422 accommodating space 424 Opening 426 Wire hole 428 Light distribution cover 46 Body 460 Cone surface 462 Air 464 Light Shield 466 Heat pipe 50, 50d 21