TW201026897A - Protective coating and method - Google Patents

Protective coating and method Download PDF

Info

Publication number
TW201026897A
TW201026897A TW098129194A TW98129194A TW201026897A TW 201026897 A TW201026897 A TW 201026897A TW 098129194 A TW098129194 A TW 098129194A TW 98129194 A TW98129194 A TW 98129194A TW 201026897 A TW201026897 A TW 201026897A
Authority
TW
Taiwan
Prior art keywords
layer
metal
temperature
interface
precursor
Prior art date
Application number
TW098129194A
Other languages
Chinese (zh)
Other versions
TWI405872B (en
Inventor
Samir Biswas
Suzanne Karajaberlian
William Brashear Mattingly Iii
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of TW201026897A publication Critical patent/TW201026897A/en
Application granted granted Critical
Publication of TWI405872B publication Critical patent/TWI405872B/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B5/00Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
    • C03B5/16Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
    • C03B5/167Means for preventing damage to equipment, e.g. by molten glass, hot gases, batches
    • C03B5/1672Use of materials therefor
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/50Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B17/00Forming molten glass by flowing-out, pushing-out, extruding or drawing downwardly or laterally from forming slits or by overflowing over lips
    • C03B17/06Forming glass sheets
    • C03B17/064Forming glass sheets by the overflow downdraw fusion process; Isopipes therefor
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B5/00Melting in furnaces; Furnaces so far as specially adapted for glass manufacture
    • C03B5/16Special features of the melting process; Auxiliary means specially adapted for glass-melting furnaces
    • C03B5/167Means for preventing damage to equipment, e.g. by molten glass, hot gases, batches
    • C03B5/1672Use of materials therefor
    • C03B5/1675Platinum group metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/36Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including layers graded in composition or physical properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Laminated Bodies (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

A device comprising (i) a first layer having a first surface comprising a first metal; and (ii) a second layer comprising an oxide of a second metal bonding directly to the first surface of the first layer and covering at least a part of the first surface of the first layer, wherein: (A) the interface between the first layer and the second layer is substantially dense and has an irregular topography; and (B) the second metal is capable of forming an alloy with the first metal when the second metal is deposited on the first surface of the first metal at an elevated temperature. The device can be advantageously formed by a process including a step of forming a mixture such as an intermetallic of the first metal and the second metal over the first metal, followed by oxidation of the metal mixture at an elevated temperature.

Description

201026897 六、發明說明: 【發明所屬之技術領域】 本說明是有關金屬的保護塗層和方法。尤其,本發明 是有關貴重金屬的氧化物保護塗層和形成這種塗層的方法 。本發明在氧化空氣提升的溫度下對於玻璃輸送系統鉑元 件的純化保護是很有用的。 '【先前技術】 ^ 近來,人們把注意力集中在減少元件傷害方法和組成 份的發展,這可能發生在惡劣的熱環境中譬如高溫可能引 發或加速主要處理元件的劣化。這種處理元件的傷害是很 耗費成本的,也容易造成其他潛藏的處理問題。 在惡劣的熱環境中執行的處理範例是玻璃生產處理, 譬如美國專利第3, 338, 696號(Dockerty)和美國專利第3, 6 82, 609號(Dockerty)。雖然很多玻璃處理裝置是由可持久 ,惰性材料譬如貴重金屬所製成,然而高處理作業溫度可能 鲁 產生惡劣的環境,如此一來元件會受到氧化和熱應力。例 如,電子顯示器的玻璃可使用貴重金屬輸送,固定,和形成 . 裝置來加以處理。像這種玻璃處理技術所用的溫度很高足 以氧花貴重金屬零件的赤裸表面產生揮發性責重金屬氧化 • · 物,接著被還原,可能形成金屬粒子。在這種處理過程中, 可能在玻璃内產生還原金屬粒子的夾雜污染物。這種污染 物的容限度可能很低,尤其在半導體應用上需要極高的玻 璃品ΐ(平滑度,均質性等)。 因而需要解決先前所提及物體以及有關傳統玻璃製造 201026897 以及其他處理過程之缺點。這些需求以及其他需求藉由本 發明内容之組成份以及方法加以滿足。 【發叼内容】 可藉由一個或多個實施例來說明每項,依序可包括一 個或多個特定的實施例。應該要瞭解實施例可以或不可以 互相重疊。因而,一項實施例或其特定實施範例的一部分 可以或不可以落在另一個或其特定實施例的範圍,反之亦 ❹201026897 VI. Description of the invention: [Technical field to which the invention pertains] This description relates to protective coatings and methods for metals. In particular, the present invention relates to oxide protective coatings for precious metals and methods of forming such coatings. The present invention is useful for the purification protection of platinum elements in glass delivery systems at elevated temperatures of oxidizing air. '[Prior Art] ^ Recently, attention has been focused on reducing the development of component damage methods and components, which may occur in harsh thermal environments such as high temperatures that may cause or accelerate degradation of the primary processing components. The damage of such processing elements is costly and can easily cause other hidden processing problems. An example of a process performed in a harsh thermal environment is glass production processing, such as U.S. Patent No. 3,338,696 (Dockerty) and U.S. Patent No. 3,682,609 (Dockerty). While many glass processing units are made of durable, inert materials such as precious metals, high processing temperatures can create harsh environments, and as a result, components can be subject to oxidation and thermal stress. For example, the glass of an electronic display can be handled, transported, and formed using precious metals. Temperatures such as those used in glass processing techniques are high enough to produce volatile volatility on the bare surface of oxygen-rich metal parts. Metals are then reduced to form metal particles. During this treatment, it is possible to produce inclusion contaminants of the reduced metal particles in the glass. The limits of this contaminant may be low, especially for semiconductor applications where high glass ΐ (smoothness, homogeneity, etc.) is required. There is therefore a need to address the previously mentioned objects and the shortcomings associated with conventional glass manufacturing 201026897 and other processing. These and other needs are met by the components and methods of the present invention. [Brief Content] Each item may be illustrated by one or more embodiments, and may include one or more specific embodiments. It should be understood that the embodiments may or may not overlap each other. Thus, an embodiment or a portion of a particular embodiment thereof may or may not fall within the scope of another or particular embodiments thereof, and vice versa

4發明的第一項相關的裝置包括: 中: (1)具有包含第一金屬第一表面的第一層;和 (ι〇包含第二金屬氧化物的第二層直接黏接到第一層 的第τ表面,並覆蓋至少第—層第—表_至少—部分,其 (Α)第一層和第二層之_介面是實質上密實的,而且有 不規則的形狀;和 (Β)當,二金屬在提升的溫度下沉積在第—金屬的第一 表面%,第二金屬可以和第一金屬形成合金。 j本發明第-項的特定實施例中⑹由第二金屬和第 -金屬混合物_份金屬_,厚度是實f 板支撐的第二層,當薄_—個主要表面暴露到空氣中基显 金屬的、縣溫度—段賴的時間時 薄膜。’以w化,在惰性基板上形成密實的氧化物 在本發明第-項的特定實關中,第―金屬包含責金 4 201026897 屬,以及第二金屬包含至少一種Ai,zr以及&。 在本發明第一項的特定實施例中,第一層包含Pt· 以及第二層實質上由Al2〇3構成。 在本發明第一項的特定實施例中,第一層與第二層間 之介面具有疊積折射率至少為15(),在特定實施例中k少 1· 60’在特定實施例中至少h 65,在特定實施例中至少 在本發明第-項的特定實施例中第二層具有厚度為 ^米至8G财,在特定實關巾為職米錢微米,在特 =他實施例中為20微米至6〇微米在特定其他實施例中 ^ 25微米至45微米,傾定其她晰為30微米至40微 米。 奇本發月第項的特定實施例中裝置為溶 輸系統之組件。 裝置為玻璃熔融系 裝置為攪拌槽,在該 在本發明第-項的特定實施例中, 〇 統之澄清器管件。 在本發明第-項的特定實施例中, 處炼融玻璃施以剪應力。 +在本發明第1的特定實施例巾裝置為餅槽之覆 盍0 i本U第項的特定實施例中,裝置為翼緣,例如傳 送電功率之導電·翼緣。 在本發明第—項的特定實施例中,第二層覆蓋實質上 ^置所有外絲面,蝴騎祕於含錄氣之大氣。 201026897 二層實質上對第 二層實質上對〇2 二層實質上不含 在本發明第-項的特定實施例中第 一金屬之氧化物例如Pt〇2為不滲透的。 在本發明第-項的特定實施例中第 為不滲透的。 在本發明第:-項的特定實施例中,第 為金4狀態之第二金屬。 ©The first related device of the invention includes: (1) having a first layer comprising a first metal first surface; and (i) a second layer comprising a second metal oxide directly bonding to the first layer a τ surface, and covering at least a first layer - a table - at least a portion, wherein the first layer and the second layer are substantially dense and have an irregular shape; and (Β) When the second metal is deposited on the first surface % of the first metal at elevated temperatures, the second metal may form an alloy with the first metal. j In a particular embodiment of the invention of item - (6) by the second metal and - The metal mixture _ part metal _, the thickness is the second layer supported by the real f plate, when the thin _- a major surface is exposed to the time of the base metal in the air, the temperature of the county is the film. Forming a dense oxide on an inert substrate In a particular implementation of the first aspect of the invention, the first metal contains the genus 4 201026897 and the second metal contains at least one of Ai, zr and & In a particular embodiment, the first layer comprises Pt· and the second layer consists essentially of Al 2〇3。 In a particular embodiment of the first aspect of the invention, the interface between the first layer and the second layer has a laminated refractive index of at least 15 (), in a particular embodiment k is less than 1 60' At least h 65 in the embodiment, in a particular embodiment, at least in the particular embodiment of the invention, the second layer has a thickness of from 2 m to 8 G, in the particular real towel, the m-micron, in the special = In other embodiments, from 20 micrometers to 6 micrometers, in certain other embodiments, from 25 micrometers to 45 micrometers, it is destined to be from 30 micrometers to 40 micrometers. The specific embodiment of the first embodiment of the present invention is dissolved. Component of the transport system. The apparatus is a glass melting system which is a stirred tank. In the particular embodiment of the invention, the clarifier tube of the system is in the specific embodiment of the invention. The molten glass is subjected to shear stress. In a specific embodiment of the first embodiment of the present invention, the towel device is a cover of the cake, and the device is a flange, for example, a conductive flange for transmitting electric power. In a particular embodiment of the first aspect of the invention, the second layer covers substantially ^ All outer silk surfaces, the butterfly ride secrets the atmosphere containing the gas. 201026897 The two layers are substantially opposite to the second layer. The second layer is substantially free of the first metal in the specific embodiment of the first item of the present invention. An oxide such as Pt 〇 2 is impermeable. In a particular embodiment of the invention, it is first impermeable. In a particular embodiment of the invention: - the second metal in the gold 4 state ©

在本發明第-項_定實施例中第二層以及 在其介面處形成交互鎖定之特徵。 -声二項是有關保護裝置中包含第-金屬的第 之in 的溫度下暴露職化__氧化 之方法’该方法包括下列的步驟: (a) 在第-金屬的第—表面至少—部份上提供包含 ^屬的先質層’在提供先質層的情況下此第二金屬可以和 第一金屬形成合金;以及 (b) 藉^絲#層暴_提升的溫度下魏化空氣中,形 成匕含第二金屬氧化物的第二層。 在本發明第二項的特定實施例中,第-層包含pt。 >在本伽第二餐狀實_巾第—層包含pt,以及 第二金屬包含至少一種Al si及社。 在本發明第二項的特定實施例巾在步驟(a)中先質層 具有厚度為7微米至i2G微米,在特定私射為1()微米至 ⑽微米,在特定其他實施例中為15微米至8〇微米在特定 其,實施例中為20微米i 60微米,在特定其他實施例中為 20微米至50微来,在特定其他實施例中為25微米至45微米, 6 201026897 在特定其他實施例中為3Q微米至4Q微米。 在本發明帛二_料實施射,在步雜) 2第二層間之介_上為_叫具有棚的 〇 在本發明第二項的特定實施例中,在步驟(b)中形成第 := 第-與第二層間之介面具有具有疊積二率= •,在特定實施例中至少為1.55,在特定實施例中至少 為1,在特定實施例中至少从65,在特定實施例中至少 為1.70,在特定實施例中至少為175。 在本發明第二項的特定實施例中,在步驟(a)包含至少 項包3至少-項化學蒸氣沉積包覆粉浴 喷漱,電^ 在本發明第二項的特定實施例中,步驟(b)在預先加熱 步驟中進行。 /在本發明第二項的特定實施例中,當裝置按裝於操作 ❾系、統卞時步驟(b)在原處進行。在特定實施例中,操作系統 為玻璃炫融及/或傳輸系統。 4本發明第二項的特定實施例中,在步驟⑹結束時, 第二層具有厚度為5微米至⑼微米,在特定實施例中為1〇微 米至70微米,在特定其他實施例中為2〇微米至6〇微米,在特 定其他實施例中為20微米至50微米,在特定其他實施例中 為30微米至40微米。在本發明第二項的特定實施例中,在 步驟(a)中,所提供先質層實質上包含第—金屬及第二金屬 之混合物。 201026897 在本發明第二項的特定實施例中,在步驟(b)結束時 提昇溫度在IGGiTC至先質層熔融溫度之範_。 ’ 所在本發明第二項的特定實施例中,在步驟⑹中,在先 貝層中第二金屬完全地轉變為其氧化物。In the first embodiment of the present invention, the second layer and the feature of mutual locking are formed at the interface thereof. - The acoustical term is a method of exposing the exposure to the temperature of the first metal in the protective device. The method comprises the following steps: (a) at least the first surface of the first metal Providing a precursor layer comprising a genus, the second metal may form an alloy with the first metal in the case where the precursor layer is provided; and (b) in the Wei air at the elevated temperature Forming a second layer of germanium containing a second metal oxide. In a particular embodiment of the second aspect of the invention, the first layer comprises pt. > In the second meal of the Bhagada, the first layer contains pt, and the second metal contains at least one type of Al si and society. In a particular embodiment of the second aspect of the invention, the precursor layer has a thickness of from 7 micrometers to i2G micrometers in step (a), from 1 () micrometers to (10) micrometers in a particular private shot, and 15 in certain other embodiments. Micrometers to 8 Å micrometers in particular, in embodiments 20 micrometers i 60 micrometers, in certain other embodiments 20 micrometers to 50 micrometers, in certain other embodiments 25 micrometers to 45 micrometers, 6 201026897 in particular In other embodiments, it is from 3Q microns to 4Q microns. In the present invention, in the second embodiment of the second aspect of the present invention, in the specific embodiment of the second aspect of the present invention, the first step is formed in the step (b): = the interface between the first and second layers has a combined second rate = •, in a particular embodiment at least 1.55, in a particular embodiment at least 1, in a particular embodiment at least from 65, in a particular embodiment It is at least 1.70, and in a particular embodiment at least 175. In a particular embodiment of the second aspect of the invention, at least one of the at least three chemical vapor deposition coated powder bath squirts is included in step (a), in a particular embodiment of the second aspect of the invention, the steps (b) is carried out in a preheating step. / In a particular embodiment of the second aspect of the invention, step (b) is performed in situ when the apparatus is installed in the operating system. In a particular embodiment, the operating system is a glass glaze and/or transmission system. In a particular embodiment of the second aspect of the invention, at the end of step (6), the second layer has a thickness of from 5 micrometers to (9) micrometers, and in particular embodiments from 1 micrometer to 70 micrometers, in certain other embodiments 2 microns to 6 microns, in certain other embodiments 20 microns to 50 microns, and in certain other embodiments 30 microns to 40 microns. In a particular embodiment of the second aspect of the invention, in step (a), the precursor layer is provided substantially comprising a mixture of a first metal and a second metal. 201026897 In a particular embodiment of the second aspect of the invention, the temperature is raised at the end of step (b) as a measure of the melting temperature of the IGGiTC to the precursor layer. In a particular embodiment of the second aspect of the invention, in step (6), the second metal is completely converted to its oxide in the first layer.

在本發明第二項的特定實施例中,在步驟(b)中,先質 層加熱至提高溫度,其提高溫度速率使得第二金屬發生氧 化而不會顯著流動熔融第二金屬在第一金屬上。 本發明第三項係關於製造玻璃片之處理過程,其藉由 使用丄述所說明裝置進行以及將詳細說明於底下。 在本發明第三項的特定實施例中,裝置包含為攪拌槽, 澄清器,翼緣,或連接管件。 本發明一項或多項之實施例具有下列一項或多項優點 。第一,密實,耐火性保護性塗層能夠形成於金屬結構之外 部表面上以保護避免有害的氧化。第二,塗膜能夠形成於 具有複雜形狀之表面上。第三,塗層能夠以相當低費用形 成。第四,塗層在第一金屬層及第二金屬氧化保護層之間 具有而的介面黏接強度。 本發明其他實施例部份被揭示於詳細說明,下列申請 專利範圍中,以及部份由詳細說明衍生出,或藉由實施本發 明了解。人們瞭解先前一般說明及下列詳細說明只作為範 例性及說明性,以及並非限制本發明及/或申請專利範圍。 【實施方式】 g 201026897 本發明藉由下列詳細說明,附圖,範例以及申請專利範 圍,以及先前以及下列說明能夠立即地瞭解。不過,在目前 組成份,物體,裝置,以及方法被揭示出以及加以說明之前, 人們瞭解本發明並不受限於所揭示特定組成份,物體,裝置 以及方法,除非另有說明,當然這些能夠加以變化。人們亦 瞭解在此所使用名詞只作為說明特定項目以及並不預期作 為限制。 在本說明書及申請專利範圍中,所使用一些名詞定義 如下: 必需說明說明書及申請專利範圍中,單數形式之冠詞 "a"," an"以及"the"亦包含複數之含意,除非另有清楚地表 示。例如”成份"包含該兩種或多種該成份等。 範圍能夠以"大約"為一個特定數值及/或至"大約"另 一特定值表示。當以該範圍表示時,另一項包含由一個特 定數值及/或至另一特定數值。同樣地,當數值藉由前面加 上大約”表示為近似值,人們瞭解該特定值形成另外一項 。人們更進一步瞭解每一範圍之每一端點值表示與另一端 點關係以及不受另一端點支配兩種意義。 舛如,假如特定金屬成份被揭示出以及說明以及對金 屬成垮作一些變化被討論,將考慮到金屬成份每一組合以 及排列為可能的,除非另有說明。因而假如成份A B,及c 201026897 種類以及成份D,E,及F種類以及組合A-D被揭示出,則每一In a particular embodiment of the second aspect of the invention, in step (b), the precursor layer is heated to an elevated temperature which increases the temperature rate such that the second metal oxidizes without significant flow of molten second metal at the first metal on. The third aspect of the present invention relates to the process of making a glass sheet, which is carried out by using the apparatus described in the above description and will be described in detail below. In a particular embodiment of the third aspect of the invention, the apparatus comprises a stirred tank, a clarifier, a flange, or a connecting tubular member. Embodiments of one or more of the present invention have one or more of the following advantages. First, a dense, fire resistant protective coating can be formed on the outer surface of the metal structure to protect against harmful oxidation. Second, the coating film can be formed on a surface having a complicated shape. Third, the coating can be formed at a relatively low cost. Fourth, the coating has an interface bonding strength between the first metal layer and the second metal oxide protective layer. The other embodiments of the invention are disclosed in the Detailed Description of the Drawings. The prior general description and the following detailed description are to be considered as illustrative and illustrative and not restrictive. [Embodiment] g 201026897 The present invention will be immediately understood by the following detailed description, drawings, examples, and claims. However, it is understood that the present invention is not limited to the specific components, objects, devices and methods disclosed, unless otherwise stated. Change it. It is also understood that the terms used herein are used merely to describe a particular item and are not intended to be limiting. In the specification and the scope of the patent application, the terms used are defined as follows: In the specification and the scope of the patent application, the singular articles "a","an" and "the" also include the meaning of the plural unless It is also clearly stated. For example, "ingredients" include the two or more of the ingredients, etc. The range can be expressed as a specific value and/or to "about" another specific value. When expressed in the range, An item consists of a particular value and/or to another particular value. Similarly, when the value is expressed as an approximation by the preceding plus, it is understood that the particular value forms the other. It is further understood that each endpoint value of each range represents a relationship with another endpoint and is not governed by the other endpoint. For example, if a particular metal component is revealed and described, and some changes are made to the metal composition, it will be considered that each combination and arrangement of metal components is possible unless otherwise stated. Therefore, if the components A B, and c 201026897 types and the components D, E, and F types and the combination A-D are revealed, then each

各別及共同情況將被考慮到。即在該範例中每一組合A-E ,A-F,B-D,B-E,B-F,C-D, C-E,以及C-F被明確地考慮到以及 應該考慮由A,B與C;D,E與F,以及範例組合A-D揭示出。同 樣地,該觀念亦適用於本發明各項,包含非限制性製造及使 用所揭示組成份方法中之各步驟。因而,假如存在可實施 不同的額外步驟,人們瞭解每一這些額外的步驟能夠實施 ® 於所揭示方法任何特定實施例或實施例之組合,以及使得 每一這些組合特定地被考慮到以及視為已揭示出。 在此所使用”重量百分比"或"%重量比"除非另有說明 係指成份重量與包含各成份之組成份總重量以百分比表示 的比值。 知這裡使用的疊積折射率"一詞是描述材料的第一層 _和材料的第二層間介面的形狀。疊積折射率(⑴定義如下 :Cl = Lc/Ls’其中Lc是連接介面上兩點的、彎曲線段長度, 取自和實質上垂直於材料第一層中央平面的平面的介面戴 距’以大約1卵的解析度測量;而Ls是連接同樣兩點的直線 段長度。測量疊積折射率的規約將在以TF詳細說明。因此 ,完美的平坦介面會使得CI =1,而α越高,介面的形狀越不 規則。應該要瞭解,測量的解析度可能影響最終的U值因 而在目:前的應用上CI是以大約的解析度測量。"不規 201026897 則的形狀π是指介面的疊積折射率至少1.48。ci值越高第 一層和第二層間的接觸面積越大,因此第一層和第二層間 的黏著性越強。 如這裡使用的,實質上密實的介面是指以1//m的解析 度觀察時,介面是實質上沒有空隙的。 * I.本發明之裝置: 知以上所描述,本發明的裝置包括:(i)具有包含第一 金屬第一表面的第一層;和⑴)包含第二金屬氧化物的第 二層,直接黏接到第一層的第一表面,並覆蓋至少第-層第 表面的至〉、为,其中:(A)第一層和第二層之間的介 面是真正密實的,而且有不規則的形狀;和⑻當第二金屬 錢升的溫度下,沉積在第—金屬㈣—表辦,第二金屬 可以和第一金屬形成合金。在特定實施例中,第一金屬和 ⑩第二金屬更進步符合下列條件:⑹包含第-金屬和第二 金^的金屬細厚度是實質上等於惰性基板支撐的第二層 ’田4獏的―個主要表面暴露到空氣中,在從誦。c到第一 度之間的提升溫度金屬薄賴第二金屬可以完 氧匕,在隋性基板上形成密實的氧化物薄膜。 發明的|置可以是獨立的裝置,也可以是大型系統 ☆ P刀因此’例如裝置可以是包含流體或反應介質的 ° .除了以上指出的兩層,裝置可進一步包含此鄰第一 201026897 或第异層的另外一層。例如,裝置可以包含在上方毗鄰第 二層覆蓋第二層至少一部份的第三層。又例如,裝置可進 一步包含在上方毗鄰第一層的第二表面覆蓋至少第一層第 二表®的第四層。裝置可進一步包含和第一和第二層分開 的其他功能元件。 在一項實施例中,本發明的裝置包含承載譬如玻璃熔 融物的高溫流體導管,其包含由第二金屬氧化物的第二層 覆蓋的第一金屬造成的壁板。這種導管可以是玻璃熔融和 輸送赛統不同站之間的澄清器,或連接管等等。在另一實 施例中,本發明的裝置包含譬如玻璃熔融物的高溫流體,在 其中授拌和均勻化的容器。 在以提升的溫度運作裝置的實施例中譬如以上所討 瀹處理玻璃流體的裝置,第一金屬最好是包含貴重金屬。 貴重金屬以耐咼溫著名,可以抵抗像是玻璃流體這些材料 的氧化和腐蝕。因此,在第一層第一表面的反面,本發明裝 置的第一層可以·用來接觸裝置處理的高溫流體。例如,裝 置包含處理玻璃流體的澄清器,澄清器的壁板可由pt或^一 肋試片構成,在正常運作期間内部表面可以包含玻璃熔融 物,而外部表面則以Ah〇3塗層覆蓋。因此,第一層可由一 種金屬或多種金屬的組合所構成。 然而,貴重金屬通常非常昂貴,因此第一層最好儘可能 12 201026897 的薄。此外,即使是像Pt和Rh的貴重金屬也很容易在高於 500 C的溫度下氧化,其經由下列反應:Individual and common situations will be considered. That is, in this example each combination AE, AF, BD, BE, BF, CD, CE, and CF are explicitly considered and should be considered by A, B and C; D, E and F, and the combination of examples AD reveals Out. Similarly, the concept is also applicable to the various aspects of the invention, including the non-limiting steps of making and using the disclosed components. Thus, if there are additional steps that can be implemented, it is understood that each of these additional steps can be implemented in any particular embodiment or combination of embodiments of the disclosed methods, and that each of these combinations are specifically contemplated and considered It has been revealed. As used herein, "% by weight" or "% by weight" unless otherwise indicated is the ratio of the weight of the component to the total weight of the components comprising the components. Percentage of the refractive index used herein. The term is used to describe the shape of the first layer of material and the second interlayer of the material. The refractive index of the laminate ((1) is defined as follows: Cl = Lc/Ls' where Lc is the length of the curved line segment at two points on the joint interface, The interface wear distance from a plane substantially perpendicular to the central plane of the first layer of material is measured at a resolution of about 1 egg; and Ls is the length of a straight segment connecting the same two points. The gauge for measuring the refractive index of the laminate will be TF details. Therefore, a perfect flat interface will make CI =1, and the higher the α, the more irregular the shape of the interface. It should be understood that the resolution of the measurement may affect the final U value and thus the target: CI is measured at an approximate resolution. The shape π of the irregularity of 201026897 means that the laminated refractive index of the interface is at least 1.48. The higher the ci value, the larger the contact area between the first layer and the second layer, so the first layer And second The stronger the adhesion between the two. As used herein, a substantially dense interface means that the interface is substantially free of voids when viewed at a resolution of 1/m. * I. Apparatus of the invention: The device of the present invention comprises: (i) a first layer having a first surface comprising a first metal; and (1) a second layer comprising a second metal oxide directly bonded to the first surface of the first layer, and Covering at least the surface of the first layer to:, wherein: (A) the interface between the first layer and the second layer is truly dense and has an irregular shape; and (8) when the second metal is raised At a temperature, deposited in the first metal (four) - table, the second metal may form an alloy with the first metal. In a particular embodiment, the first metal and the second metal are more advanced to meet the following conditions: (6) comprising a -metal and The thin metal thickness of the second metal is substantially equal to the second layer of the inert substrate supported by the 'main surface' exposed to the air, and the temperature between the 诵.c and the first degree is increased. The second metal can be oxidized and formed on an inert substrate Real oxide film. The invention can be a stand-alone device or a large system ☆ P-knife so that the device can be a fluid or a reaction medium. In addition to the two layers indicated above, the device can further comprise Adjacent to the first 201026897 or another layer of the first layer. For example, the device may include a third layer adjacent to the second layer covering at least a portion of the second layer. Further, for example, the device may further include an upper layer adjacent to the first layer. The second surface covers at least a fourth layer of the first layer of the second sheet. The apparatus may further comprise other functional elements separate from the first and second layers. In one embodiment, the apparatus of the present invention comprises a carrier such as glass melt. A high temperature fluid conduit comprising a wall made of a first metal covered by a second layer of a second metal oxide. Such a conduit may be a clarifier between the glass melting and transporting different stations of the race, or a connecting pipe or the like. In another embodiment, the apparatus of the present invention comprises a high temperature fluid such as a glass melt, a vessel in which the mixing and homogenization is imparted. In embodiments in which the apparatus is operated at elevated temperatures, such as the apparatus for treating glass fluids as discussed above, the first metal preferably comprises a precious metal. Precious metals are known for their resistance to enthalpy and resist oxidation and corrosion of materials such as glass fluids. Thus, on the reverse side of the first surface of the first layer, the first layer of the apparatus of the present invention can be used to contact the high temperature fluids treated by the apparatus. For example, the apparatus includes a clarifier for treating a glass fluid, and the wall of the clarifier may be composed of a pt or a rib test piece, the inner surface may contain glass melt during normal operation, and the outer surface may be covered with an Ah 〇 3 coating. Therefore, the first layer may be composed of a metal or a combination of metals. However, precious metals are usually very expensive, so the first layer is preferably as thin as 12 201026897. In addition, even precious metals like Pt and Rh are easily oxidized at temperatures above 500 C, which are via the following reactions:

Pt(固體)+ 〇2(氣體)<—> Pt〇2 (氣體)〇)Pt (solid) + 〇 2 (gas) <-> Pt 〇 2 (gas) 〇)

Rh(固體)+ 〇2(氣體)> Rh〇2 (氣體)⑵ 氧化會導致金屬的損耗,使金屬壁板變薄,和玻璃熔融物内 的Pt失雜物,這是由於pt〇2氣體後續的解離和較冷的表面 上Pt微粒的凝結,都是很不好的現象。本發明裝置的第二 金屬氧化物的第二層可用來抑制〇2從空氣中擴散到暴露的 裝置,因而抑制以上的反應式(1),即使是在提升的溫度下 例如玻璃澄清器:的正常運作溫度可能超過^卯^。 當兩種金屬可在提升的溫度下接觸時譬如5〇〇ΐ以上 金屬爿i態的第二金屬可以和金屬狀態的第一金屬形成合金 。合金化的能力可使本發明裝置的第一層和第二層之間形 成交錯和疊積的介面。應該要注意如以上所描述,合金可 以是不同莫耳百分比的兩種金屬混合物或组合。的確,在 既定的合金化條件下,第-金屬和第二金屬可以形成多種 型態的合金。例如,當兩種金屬在譬如800<t的提升溫度下 互相接觸時,第二金屬可以是Pt,可以和第二金屬的^以 PtxAly表示各種組成份形成合金。更者,如以上所述,第一 層可以包含組合的多種金屬(譬如Pt—Rh試片)。在這種情 況下,除了第-金屬(譬如Pt)之外,第一層包括的其他金屬 13 201026897 可以在提升的溫度下和第二金屬形成合金,_這在本發 明並不是那麼需要。 包含第二金屬氧化物的第二層覆蓋至少第一層第一表 面的至少-部分以及至少部分將第—層第-表面的覆蓋部 分隔開所要暴露的環境,譬如在第一層正常運作的條件下 ^對第—層的第—表面為反應性之大氣,該條件例如為當施 加提升的溫度時,對第-層第一表面為腐錄的流體,或是 額外的-層,而第-層的第-表面與該額外的一層並不符 合匹配性之需求。 本發明裝置的實_是設計时提相溫度譬如麵 c以上’因此第二層的氧化物最好是耐火材料。例如,玻璃 '熔融和輸料_澄料可在高達· t的高溫運作。pt 和PlRh試片是適合澄清器壁板的材料。覆蓋澄清器壁板 Φ的外表面的第二層適合的氧化物可以是Ah〇3, Zr〇2, Mg0, Ti〇2’Si〇2等,以及其混合物和組合。在特定實施例中,Rh (solid) + 〇 2 (gas) > Rh 〇 2 (gas) (2) Oxidation causes loss of metal, thinning of metal siding, and loss of Pt in the glass melt, which is due to pt〇2 Subsequent dissociation of the gas and condensation of Pt particles on the cooler surface are very undesirable phenomena. The second layer of the second metal oxide of the apparatus of the present invention can be used to inhibit the diffusion of ruthenium 2 from the air to the exposed device, thereby inhibiting the above reaction formula (1), even at elevated temperatures such as glass clarifiers: The normal operating temperature may exceed ^卯^. When the two metals can be contacted at an elevated temperature, such as 5 〇〇ΐ or more, the second metal of the metal 爿i state can be alloyed with the first metal in the metallic state. The ability to alloy can result in a staggered and stacked interface between the first and second layers of the apparatus of the present invention. It should be noted that as described above, the alloy may be a mixture or combination of two metals of different molar percentages. Indeed, under the established alloying conditions, the first metal and the second metal can form alloys of various types. For example, when the two metals are in contact with each other at a lifting temperature of, e.g., 800 < t, the second metal may be Pt, and may form an alloy with the various components of the second metal represented by PtxAly. Further, as described above, the first layer may contain a combination of a plurality of metals (e.g., Pt-Rh test pieces). In this case, in addition to the first metal (e.g., Pt), the other metal included in the first layer 13 201026897 can form an alloy with the second metal at elevated temperatures, which is not so required in the present invention. The second layer comprising the second metal oxide covers at least a portion of the first surface of the at least first layer and at least partially separates the portion of the first layer first surface from the environment to be exposed, such as in the first layer Under the condition, the first surface of the first layer is a reactive atmosphere, for example, when the elevated temperature is applied, the first surface of the first layer is a rotting fluid, or an additional layer, and - The first surface of the layer does not meet the matching requirements of the additional layer. The actual device of the present invention is designed to have a phase-lifting temperature such as a surface c or more. Therefore, the oxide of the second layer is preferably a refractory material. For example, glass 'melting and conveying materials' can operate at high temperatures up to t. The pt and PlRh test strips are suitable for clarifier panels. A suitable oxide for the second layer covering the outer surface of the clarifier panel Φ may be Ah〇3, Zr〇2, Mg0, Ti〇2'Si〇2, etc., as well as mixtures and combinations thereof. In a particular embodiment,

AhO+Zr〇2是特別需要的。為了方便說明本發日月的應用, Si也被包括在可能的第二金屬族群中。 為了在第-層和第二層間取得堅固的黏著,並避免在 幾次運作週期之後第-層和第二層之間的,第一層金 屬和第二廣的氧化物最好有實質上相似的熱膨服係數( CTE)。在正常的玻璃製造條件下,pt,p卜Rh和A·有相似 201026897 的 CTE 〇 在特定實施例中,我們高度希望第二層是實質上密實 的,亦即貫質上沒有大於1以m的空隙和裂痕。在特定實施 例中,我們希望第二層是實質上沒有大於5〇〇nm力空隙和裂 痕。在特定其他實施例中,我們希望第二層是實質上沒有 A^ 300nm的空隙和裂痕。在特定實施例中,我們希望第二 ❹層是實質上沒有大於l〇〇nm的空隙和裂痕。第二層越密實 流體(譬如〇2或其他㈣)透過層的賊率越慢就可以提供 第一$的第一表面更有效的分隔和保護。 為了保護包含Pt的第一層避免和包含&的大氣接觸 我們南度希望第二層是實質上沒有可以使pt〇2並無空隙和 裂痕。如先前所說明,Pt及a經歷底下反應〇):AhO+Zr〇2 is especially needed. In order to facilitate the application of the present day and month, Si is also included in the possible second metal group. In order to achieve a strong bond between the first layer and the second layer, and avoid between the first layer and the second layer after several cycles of operation, the first layer of metal and the second broad oxide are preferably substantially similar Thermal expansion coefficient (CTE). Under normal glass manufacturing conditions, pt, p, Rh, and A· have a CTE similar to 201026897. In a particular embodiment, we highly expect the second layer to be substantially dense, ie, no greater than 1 in the permeation. Voids and cracks. In a particular embodiment, we desire that the second layer is substantially free of voids and cracks greater than 5 〇〇 nm. In certain other embodiments, we desire that the second layer is substantially free of voids and cracks of A^300 nm. In a particular embodiment, we prefer that the second layer of germanium is substantially free of voids and cracks greater than 10 nm. The denser the second layer, the slower the thief rate of the fluid through the layer (such as 〇2 or other (4)), the more effective separation and protection of the first surface of the first $. In order to protect the first layer containing Pt from the atmospheric contact with && we hope that the second layer is substantially free of pt〇2 without voids and cracks. As explained previously, Pt and a undergo a bottom reaction 〇):

Pt (固體)+ 〇2(氣體)<--> pt〇2 (氣體)⑴ ❹ Pt〇2的分子大小明顯比〇2大,因此透過第二層擴散會 有較犬的空間體積阻力。因此,假使第二層的空隙和裂痕 允許〇2的快速擴散,但禁止Pt〇2的擴散,那麼反應式(丨)可 很快達到平衡狀態,因而避免進一步的氧化作用和pt耗損 。因此,在本發明特定實施例中,我們高度希望第二層是實 質上密實的,在運作條件下實質上抑制氣相的第一金屬氧 化物擴散通過。因此,在裝置的正常運作條件下,當第一層 包含Pt B夺,我們希望第二層(譬如Ah〇3層)是實質上沒有使 15 201026897 .Pt (solid) + 〇2 (gas) <--> pt〇2 (gas) (1) ❹ The molecular size of Pt〇2 is significantly larger than 〇2, so there is a smaller space volume resistance of the dog through the second layer. . Therefore, if the voids and cracks of the second layer permit the rapid diffusion of 〇2, but the diffusion of Pt〇2 is prohibited, the reaction formula (丨) can quickly reach an equilibrium state, thereby avoiding further oxidation and pt loss. Thus, in a particular embodiment of the invention, it is highly desirable that the second layer be substantially compact, substantially inhibiting the diffusion of the first metal oxide in the gas phase under operating conditions. Therefore, under normal operating conditions of the device, when the first layer contains Pt B, we hope that the second layer (such as the Ah 〇 3 layer) is essentially not made 15 201026897 .

Pt〇2自.由擴散的空隙和裂痕。在特定實施例中,我們更希 望第二層是實質上沒有空隙和裂痕,在正常運作條件下抑 制〇2擴散。 在特定實施例中,我們更希望第二層基本上沒有金屬 狀態的第二金屬,亦即第二層的第二金屬是完全被氧化的 - 。這種完全氧化的第二層在裝置的正常運作條件下是很穩 .❹ 定的。然而,在特定實施例中,可能不排除第二層的第二金 屬部分是金屬狀態的。我們也不排除金屬狀態第二金屬的 一部分在步驟(b)結束時,在第二層下方形成一種譬如介金 屬的混合物。 在那些實把例中,我們焉度希望假使第二層的設計是 暴路到流體,至少暴露到流體的第二層表面是完全被氧化 的。其餘金屬狀態的第二金屬,特別是和第一層相鄰的區 〇 域可以補足運作期間消耗的第二層部分,因而在特定實施 例是需要的。然而在其他實施例中,由於金屬狀態的第二 . 金屬可以和第-金屬合金化,可能在裝置運作期間更深入 擴散至整塊的第一層,造成第一層的減弱,因此是不好的。 如以上摘要描述的,本發明裝置的第一層和第二層之 間的介面是實質上疊積的。因此當介面以實質上垂直於第 ,層中央平面的平面載距以取得橫截面時,可經由電子顯 微鏡觀察到Ι/zm解析度的粗糙曲線。在特定實施例中第 16 201026897 二層和第二層之間介面的高叠積折射率是區別本發明和先 讀術塗層金屬的重要特徵。本發明裝置第一層和第二層 之間介面的疊積折射率至妓丨.48,在特定實施例至少ι % ,在特定實施例至少丨.6〇,在特定實施啦少h 實施例至少1.80。 • 可紐解的是,較厚的第二層可以提供流體透過其擴 〇政的1 乂冋抵抗性。然而,形成較厚的塗層可能更費成本,在 特定實施例中是不需要的。第二層厚度的定義是為離第一 層較遠的第二概面—層第—表面的平均最短距離。 因此,声特定實施例中,第二層的厚度最多是80微米,在特 2其他實施範例中,最多是60微米,在某些其他實施例中, 最多是5〇微米,在特定其他實施例中最多是40微米,在特定 其他實施例中最多是30微米。為了取得抑制擴散的門播值 〇 ’在狀實施例H層的厚度最好至少是5微米,在特定 實施例中至:/疋10微米,在特定實施例中至少是⑼微米在 特定實施例中至少是30微米。 第一層和第:二層之間的疊積介面可包含特定交互鎖定 特徵,亦即第一層的特定部分突出到第二層,和/或第二層 的特疋部分出到第-層。這種交互鎖定特徵對於兩層之 間堅固的黏著是特戦钱。藉由傳統的塗層方法譬如 第二層氧化物直接的化學蒸氣沉積,不太容易形成i微米解 17 201026897 析度的交互鎖定特徵。由於可共祕力提供高介面黏著強 度和低流體(譬如〇2)擴散率,基本上沒有空隙的交互鎖定 特徵疋我們尚度:需要的,使用傳統的塗層方法很難形成,但 本發明則可以達成。在特定實施射,第—金屬的突出部 分最好直接連結到整塊的第—層,和/或第二層氧化物的突 出部分直接連結到整塊的第二層氧化物。這種第一層和第 一層連續性的結構有助於第一層和第二層之間的黏接強度 。然而,在特定實施例不排除第二層的整塊第二金屬氧化 物中出現第-金屬不狀注意的粒子而沒有直接和整塊 的第一金屬黏接。在特定實施例中不排除在第二層下方, 在整塊的第—金肩_成和捕獲特定第二金屬氧化物不引 人注意的島狀物。 * 第一層和第二層之間介面的高疊積折射率在這兩層間 提供很大的接峨域,@此可提升這兩狀間_著性。 如果有交互鎖定特徵的話,可進一步改善黏接》 本發明裝置第二層的保護性塗層可能減少氧化和第一 層的耗損。在實施例中,第-金屬包括像是Pt的責重金屬, 這種保護可以轉化為明顯延長裝置的使用壽命和節省費 用。 換句話說,我們知道由於冷區域的Pt〇2解離和金屬Pt 粒子的凝結,玻璃製造處理中的Pt氧化作用可能導致最後 201026897 玻璃内的Pt錄祕人玻_融物並形成令人討厭的缺陷 。因此,本發明的裝置適當使用在玻璃製造系統,也可以提 升玻璃的品質。 圖1顯示的是包含金屬A1先質層Pt—Rh試片橫截面1〇〇 的掃瞒電子顯讎像。圖1橫截_結構和組成份以下將 . 更詳巧說明。 -❹ @2顯示的是使用以下說明的本發明金屬化處理所準 備的70王氧化Ah〇3層Pt-Rh試片橫截面的掃瞄電子顯微影 像。 ·〜 圖3顯示的是移除原先形成其上的Ah〇3層後,pt_Rh基 板表面的掃聪電子顯微影像。這個影像顯*pt Rh層第一 表面的疊積性質。 , 【I·製造裝置之處理過程: ❾+發明的第二項是針對倾裝包含第―金屬的第 —層第-表面的方法,避免暴朗氧化的空氣巾時在提升 的溫度下氧化,該方法包括下列步驟:⑷在第一金屬第一 表面的至少-部分上提供包含金屬狀態第二金屬的先質層 ’在提供_層_件下此第二金屬可以和第—金屬形成 合金;以及⑹在提升的溫度下,將先質層暴露到氧化的空 氣中形成包含第二金屬氧化物的第二層。 步驟(a)可以包括喷濺,化學蒸氣沉積漿料沉積 201026897 驟以形成金屬狀態第一金屬的先質層。在步驟(a)期間第 二金屬可以進入第一層,而第—金屬可以進入先質層,同一 時間在介面中形成第一金屬梯度和第二金屬梯度。在特定 實施範例中,先質層最好包括實質上沒有第一層的至少頂 端部分,而且最好第二金屬不會穿透第一層的完全厚度。 在特定其他實施範例中,先質層在整個厚度中包含第一金 屬和第二金屬的:混合物。例如,假使A1沉積在Pt基板表面, ® 可以形成實質上是由P七Aly構成的先質層。 在第一金屬是Pt或Pt~Rh以及第二金屬是A1的情況下, 可藉由噴濺,傳統化學蒸氣沉積,漿料沉積等方式沉積A1層 。因為已知Pt和A1是用來形成以PtxAly表示的合金,其介 面因而是各式Pt/Al莫耳比的Pt-A1混合物。 第一金屬,第一層,和第二金屬可如以上和本發明裝置 一起描述。因此,第一金屬可以是譬如Pt或Pt-Rh試片的責 重金屬,而第二金屬可以是A1,Zr,Ti,Si,Mg,和這些的混合 物和組合等。 先質層的厚度定義為離第一層較遠的先質層表面到第 一層第一表面的平均最短距離。這裡第二金屬的濃度是可 忽略的。因而,先質層的厚度有部份是藉由第二層氧化物 的最後第二層所需厚度來決定。尤其是第一金屬包含pt, 而第二金屬包含A1時,先質層的厚度最好不要超過120微米 20 201026897 ,在特定實施例中不超過100微米,在特定實施例中不超過 80微杂,在特定實施例中不超過60微米,在特定實施例中不Pt〇2 from the voids and cracks that are diffused. In a particular embodiment, we prefer that the second layer be substantially free of voids and cracks to inhibit 〇2 diffusion under normal operating conditions. In a particular embodiment, we prefer that the second layer be substantially free of the second metal in the metallic state, i.e., the second metal of the second layer is completely oxidized. This fully oxidized second layer is very stable under normal operating conditions of the device. However, in certain embodiments, it may not be excluded that the second metal portion of the second layer is in a metallic state. It is also not excluded that a portion of the second metal in the metallic state forms a mixture of, for example, a metal under the second layer at the end of step (b). In those practical examples, we hope that if the design of the second layer is a violent path to the fluid, at least the surface of the second layer exposed to the fluid is completely oxidized. The second metal in the remaining metallic state, particularly the zone 相邻 adjacent to the first layer, can complement the second layer portion consumed during operation and is therefore desirable in certain embodiments. However, in other embodiments, since the second metal in the metallic state can be alloyed with the first metal, it may diffuse further into the first layer of the monolith during operation of the device, causing the first layer to weaken, and thus is not good. of. As described in the above summary, the interface between the first layer and the second layer of the device of the present invention is substantially superimposed. Therefore, when the interface is loaded with a plane substantially perpendicular to the plane of the center plane of the first layer to obtain a cross section, a roughness curve of Ι/zm resolution can be observed via an electron microscope. In a particular embodiment, the high laminated refractive index of the interface between the second layer and the second layer of the 16th 201026897 is an important feature distinguishing the present invention from the prior art coating metal. The laminated refractive index of the interface between the first layer and the second layer of the device of the present invention is 妓丨.48, at least ι% in the specific embodiment, at least 〇6〇 in the specific embodiment, and less in the specific embodiment. At least 1.80. • It can be explained that the thicker second layer provides the resistance of the fluid through its expansion. However, forming a thicker coating can be more costly and undesirable in certain embodiments. The second layer thickness is defined as the average shortest distance from the second profile-layer first surface that is further from the first layer. Thus, in a particular embodiment of the acoustics, the thickness of the second layer is at most 80 microns, and in other embodiments, up to 60 microns, and in some other embodiments, at most 5 microns, in certain other embodiments. Up to 40 microns in the middle, and up to 30 microns in certain other embodiments. In order to achieve a gated value that inhibits diffusion, the thickness of the layer of embodiment H is preferably at least 5 microns, in particular embodiments to: / 10 microns, in particular embodiments at least (9) microns in a particular embodiment. At least 30 microns. The stacking interface between the first layer and the second layer may include a specific interactive locking feature, that is, a specific portion of the first layer protrudes to the second layer, and/or a special portion of the second layer reaches the first layer . This interactive locking feature is particularly costly for a strong bond between the two layers. By conventional coating methods such as direct chemical vapor deposition of the second layer of oxide, it is less likely to form an interactive locking feature of the imicron solution. Because of the high interfacial adhesion strength and the low fluid (such as 〇2) diffusion rate, the interlocking feature with substantially no voids is still needed: it is difficult to form using conventional coating methods, but the present invention It can be achieved. In a particular implementation, the protruding portion of the first metal is preferably directly bonded to the first layer of the monolith, and/or the protruding portion of the second layer of oxide is directly bonded to the second layer of oxide of the monolith. This first layer and the first layer of continuous structure contribute to the bond strength between the first layer and the second layer. However, in certain embodiments, it is not excluded that the first metal-depleted particles of the second layer of the second metal oxide do not directly adhere to the first metal of the monolith. In the particular embodiment, it is not excluded that under the second layer, the first-thickness of the monolith is formed and the islands that capture the particular second metal oxide are not noticeable. * The high laminated refractive index of the interface between the first layer and the second layer provides a large interface between the two layers, @ this can improve the relationship between the two. The adhesion can be further improved if there is an interlocking feature. The protective coating of the second layer of the device of the present invention may reduce oxidation and loss of the first layer. In an embodiment, the first metal includes a heavy metal such as Pt, which protection can translate into significantly longer device life and cost savings. In other words, we know that due to the Pt〇2 dissociation in the cold zone and the condensation of metal Pt particles, the Pt oxidation in the glass manufacturing process may lead to the final Peptide in the glass of 201026897 and form an annoying defect. Therefore, the apparatus of the present invention can be suitably used in a glass manufacturing system, and the quality of the glass can also be improved. Figure 1 shows a broom electronic image showing a cross section of a metal A1 precursor Pt-Rh test piece. Figure 1 is a cross-sectional view of the structure and composition of the following. - ❹ @2 shows a scanning electron micrograph of a cross section of a 70-doped Ah3 layer Pt-Rh test piece prepared by the metallization process of the present invention described below. • Figure 3 shows the scanning electron micrograph of the surface of the pt_Rh substrate after removing the Ah〇3 layer on which it was originally formed. This image shows the stacked nature of the first surface of the *pt Rh layer. [I. Process of manufacturing the device: 第二 + The second item of the invention is a method for pouring the first layer-surface of the first metal to avoid oxidation at elevated temperatures when the air towel is oxidized, The method comprises the steps of: (4) providing a precursor layer comprising a second metal in a metallic state on at least a portion of the first surface of the first metal; the second metal may be alloyed with the first metal under the providing layer; And (6) exposing the precursor layer to oxidized air at elevated temperatures to form a second layer comprising the second metal oxide. Step (a) may include sputtering, chemical vapor deposition slurry deposition 201026897 to form a precursor layer of the first metal in the metallic state. The second metal may enter the first layer during step (a), and the first metal may enter the precursor layer, forming a first metal gradient and a second metal gradient in the interface at the same time. In a particular embodiment, the precursor layer preferably includes at least a top end portion that is substantially free of the first layer, and preferably the second metal does not penetrate the full thickness of the first layer. In certain other embodiments, the precursor layer comprises a mixture of the first metal and the second metal throughout the thickness. For example, if A1 is deposited on the surface of a Pt substrate, ® can form a precursor layer consisting essentially of P7 Aly. In the case where the first metal is Pt or Pt~Rh and the second metal is A1, the A1 layer can be deposited by sputtering, conventional chemical vapor deposition, slurry deposition, or the like. Since Pt and A1 are known to form an alloy represented by PtxAly, the interface thereof is thus a Pt-Al mixture of various Pt/Al molar ratios. The first metal, the first layer, and the second metal can be as described above along with the apparatus of the present invention. Therefore, the first metal may be a responsible metal such as a Pt or Pt-Rh test piece, and the second metal may be A1, Zr, Ti, Si, Mg, and a mixture and combination of these. The thickness of the precursor layer is defined as the average shortest distance from the surface of the precursor layer farther from the first layer to the first surface of the first layer. Here the concentration of the second metal is negligible. Thus, the thickness of the precursor layer is determined in part by the desired thickness of the last second layer of the second layer of oxide. In particular, when the first metal comprises pt and the second metal comprises A1, the thickness of the precursor layer preferably does not exceed 120 microns 20 201026897, in certain embodiments does not exceed 100 microns, and in particular embodiments does not exceed 80 microns. Not exceeding 60 microns in a particular embodiment, not in a particular embodiment

超過50微米,在特定實施例中不超過4〇微米。儘管如此,在 特定實施例中需要先質層厚度至少為2 〇微米以形成第二金 屬之氧化物的第一層為相當厚。因而,在步驟(a)中,在特 定實施例中先質層厚度為在20微米至6〇微米範圍内,在特 定其他實施例中為在20微米至50微米範圍内,在特定其他 實施例中為在25微米至45微米範圍内,在特定其他實施例 中為在30微米至40微米範圍内。 在步驟(a)中,可利用各種技術形成先質層譬如傳統化 學蒸氣沉積,漿料沉積,_,紐等。雖然_各種技術 可達到先質層的各種厚度’應該要瞭解特定處理可能最適 合製造特定厚度範圍的金屬塗層。因此,假使第二層開始 的金屬層太厚而無法完全氧化到帛二_咐二層,最好 積的第二金屬先質層進行打薄的步驟,例如化 :她光她谢㈣爾顺需的範圍。 寺別需要的,技術可在譬如包含Pt的第— 枓沉積直接形成含A1金制。這種處理可產生 的A卜Pt合金層均勻的厚度範圍是2〇 後 薄的步驟。 微未,而不需要打 在特定實施例中, 步驟⑷可以包括步驟(b)之前的後 21 201026897 沉積加熱處理步驟。在步驟(b)之前,形成包含第一金屬和 第一金屬的混合物是很需要的以形成本發明裝置高疊積折 射率的介面。特‘定打薄的沉積處理步驟可以在第一金屬和 第一金屬之間的混合物或介金屬,以很低速度形成的溫度 下進行。在步驟(b)之前,後沉積加熱處理步驟使介面加熱 高於沉積溫度可促使先質層内金屬混合物的形成。例如, 我們發現傳統的A1 CVD處理可在50(TC以下進行,在Al-Pt 合金基板上產生在Pt傾斜的先質A1層,在大約1000〇c進行 的後沉積加熱處理有助於A1和pt介金屬的形成。 不論使用的技術為何,我們需要在步驟(a)形成第一和 第二金屬之間的合金。因而,第一層和先質層之間的介面 包含第一金屬和第二金屬的梯度,範圍從包含第二金屬可 忽略水準一端上的區域到合金或混合物呈現的中間區域, 再到包含第一金屬最低水準的另一端。因此,在特定實施 例中’第一金屬是Pt,第二金屬是A1,介面範圍從主要由pt 組成份的第一層到以pt ·Α1表示的中間區域,再到主要由 Α1組成份的區域。在另一實施例中第一金屬是汽,第二金 屬疋Α1,介面範圍從主要由pt組成份的第一層表面到以R • A1表不的中間區域再到主要由尅屮七組成份的另外一端 。在後者的實施例中,先質層在整個厚度包含Pt和A1的混 合物,由於AhPt明顯比A1高的熔融溫度可能特別有用。 22 201026897 在本發明的處理步驟(b)中,在提升的溫度下將先質層 暴露到包含02的空氣中。例如,步驟⑹的這種氡化作用可 以在500〇C以上的空氣中進行譬如8〇{rc以上,又譬如 ◦C以上。在這種情況下先質層氧化到第二層。舉第一金 屬是今Pt組成▲第二金屬是由A1組成份的實施例作為例 ' 子。含A1先質層表面區域的鋁首先氧化成Ah〇3。接著〇2 ^ 透過AhCb層擴散,氧化下方的金屬M。 在提升的溫度下,金屬狀態的第二金屬需要比含⑶的 第一金屬有更高的反應性,如同第一金屬是pt,第二金屬是 A1實施例的情況。在這種情況下,〇2擴散通過在步驟化)第 一金屬上形成的氧化物層達到介面中間區域中第一金屬的 原子,由於第二金屬減少的效應,第-金屬轉在降低的金 屬狀態。因此’在步驟⑹最好氧化第二金屬。不想被限制 〇 在特定的理論上,我們相信先質層内的第二金屬氧化物會 和頂端氧化物層聚合,而金屬狀態的第一金屬會和整塊的 第—層聚合,最終在鄰接第一層的連續第一表面上形成密 實’貫貝上沒有空隙的第二層。我們也相信步驟(b)先質層 内第一金屬和第二金屬氧化物的聚合是以隨機的方式發生 的,在步驟(b)最後產生第一層和第二層間粗糙不規則形狀 的μ面。在特定實施例中,結果會形成//m尺度的交互鎖定 特徵。如以上和本發明裝置所描述的,這種粗糙介面和交 23 201026897 互鎖定特徵有助於第二層到第一層的強力黏著。 可理解的是,先質層越厚在所有金屬A1氧化之前形成 的Al2〇3層就會越厚,在既定的〇2部份壓力和溫度下就越難 也需要越久使〇2擴散透過越厚的尅2〇3層達到下方剩餘的 A1金屬。因此,以上描述過先質層所需的厚度範圍。 在狀實施财,在氧化伽·件下第二金屬很需 要能芩全氧化成穩定的氧化物。這種完全的氧化會產生穩 疋的苐二層,在形成裝置正常的運作期間不再進一步氧化^ 。然而,在特定實施例中,不排除第二層除了第二金屬氧化 物之外還包含不可忽略的金屬狀態第二金屬的量。在有些 應用中,第一層結構強度很重要,而且進入和剩餘在第一金 屬層的第二金屬可能不適度地損及第一層的強度,因此先 質層中所有的第二金屬最好要在步驟(b)中氧化。在有些 ❹實施例中,由於第一金屬和剩餘第二金屬之間的合金化導 致的传構強度降低是可容忍或可忽略的,最好可允許第二 金屬的特定量剩下來在步驟(b)最後和第一金屬合金化因 而剩餘的第二金屬可在稍後階段的裝置運作期間進一步氧 化可$疋修復或維持第二層的完整性也可能是和處理條 件妥協譬如正常的磨損和裂縫。 如以上和本發明裝置所描述的,我們希望步驟(b)中第 層和第二層之間的介面是實質上密實的,並有不規則的 24 201026897 形狀。 x上和本發明裝置所描述的我們希望步驟(b)中形 成的第一層可使得第―層和第二層之間的介_疊積折射 率至少是1. 50,在特定實施例中至少為丨55,在特定實施例 中至少為1. 6G’在特定實施射至少為h 65,在狀實施例 中至少為1.7〇,在較實施例中至少為175。 在特定實施例夂在步驟(b)最後,所形成的包含第二 金屬氡化物的第:二層可有效抑制&的擴散通過更由於第 -層的③、實特性進—步氧化第—金屬。在特定其他實施例 _,在步驟⑹最後,所形成的第二層可能是〇2可渗透的,但 仍然不可渗透至第—金屬軌體氧化物。例如,當第二金 屬是A1時第一金屬是pt,由於pt〇2明顯較大的分子大小, AhOs層可能比〇2扮演更明顯的抑制層以祖擋擴散,有 效抑制金屬Pt連續性的氧化和移除。因此,譬如Ah〇3的第 二金屬氧化物可充當保護層以抵擋第一金屬的氧化。 在本發明處理過程的特定實施例中,在步驟(b)中提升 溫度的範圍是從100(TC到第一金屬的熔融溫度。我們發現 當包含在先質層中的第二金屬在第一層上氧化成密實的塗 層時,需要較高的溫度以促進〇2擴散至氧化物層,這在第二 金屬的完全氧化是需要的。然而,我們希望氧化步驟不會 導致第一層熔融。在特定其他實施例中,先質層是由第一 25 201026897 金屬和第二金屬的介金屬混合物所組成份,在步驟(b)中, 提升溫度的範圍:最好是從1 ooor到先質層混合物的溶融溫 度。這是因為,假使先質層加熱到高於其熔融溫度,材料會 熔融,而且可能流出第一層的表面,損及形成連續和實質上 密實的第二金屬氧化物層。 在特定實施例中,在步驟(b)中,先質層最好以溫度上 升速率加熱到提升溫度以使第二金屬的氧化作用不會出現 明顯的融態金屬流出第一金屬。在一項實施例中,第一金 屬是Pt,而第二金屬是A1,我們發現A1容易藉由形成合金, 在約1_°C滲4Pt。在約議。(:較高的氧化溫度是較理 想的’使得A1可以快速氧化到八丨必,而不會實質上滲透到 整塊的第-金屬。然而,需要介金屬的形成以得到堅固的 ❹More than 50 microns, in certain embodiments no more than 4 microns. Nonetheless, in certain embodiments, a first layer requiring a precursor layer thickness of at least 2 Å to form an oxide of the second metal is relatively thick. Thus, in step (a), the thickness of the precursor layer in the particular embodiment is in the range of 20 microns to 6 microns, in certain other embodiments in the range of 20 microns to 50 microns, in certain other embodiments. The range is in the range of 25 microns to 45 microns, and in certain other embodiments is in the range of 30 microns to 40 microns. In step (a), various techniques can be used to form precursor layers such as conventional chemical vapor deposition, slurry deposition, _, New Zealand, and the like. While various techniques can achieve various thicknesses of the precursor layer, it should be understood that a particular treatment may be best suited to produce a metal coating of a particular thickness range. Therefore, if the metal layer at the beginning of the second layer is too thick to be completely oxidized to the second layer of the second layer, it is preferable to carry out the thinning step of the second metal precursor layer, for example, she: she is thankful (four) Ershun The scope of the need. What the temple does not need, the technology can form a gold-containing A1 directly, for example, in the deposition of the first 枓 containing Pt. This treatment produces a uniform thickness range of the A-Pt alloy layer of 2 Å and then a thin step. Micro-no, without need to be in a particular embodiment, step (4) may include a post-step 21 201026897 deposition heat treatment step prior to step (b). Prior to step (b), it is desirable to form a mixture comprising the first metal and the first metal to form a high overlap refractive index interface of the apparatus of the present invention. The deposition process of the specific thinning can be carried out at a temperature at a very low speed in the mixture or intermetallic metal between the first metal and the first metal. Prior to step (b), the post-deposition heat treatment step causes the interface to be heated above the deposition temperature to promote the formation of a metal mixture within the precursor layer. For example, we found that the conventional A1 CVD process can be performed at 50 (TC or less) to produce a Pt-tipped precursor A1 layer on an Al-Pt alloy substrate, and a post-deposition heat treatment at about 1000 〇c contributes to A1 and The formation of pt-mediated metal. Regardless of the technique used, we need to form an alloy between the first and second metals in step (a). Thus, the interface between the first layer and the precursor layer contains the first metal and The gradient of the two metals ranges from the region containing the negligible level of the second metal to the intermediate region exhibited by the alloy or mixture to the other end comprising the lowest level of the first metal. Thus, in a particular embodiment, the first metal Is Pt, the second metal is A1, and the interface ranges from a first layer mainly composed of the components of the pt group to an intermediate region represented by pt · Α 1 to a region mainly composed of Α 1. In another embodiment, the first metal Is the vapor, the second metal crucible 1, the interface ranges from the first layer surface mainly composed of the pt component to the intermediate portion represented by R • A1 to the other end mainly composed of the crucible seven. In the latter embodiment Precursor It may be particularly useful to include a mixture of Pt and A1 throughout the thickness due to the higher melting temperature of AhPt than A1. 22 201026897 In process step (b) of the present invention, the precursor layer is exposed to 02 at elevated temperatures. In the air, for example, the deuteration of the step (6) can be carried out in an air of 500 〇C or more, for example, 8 〇{rc or more, such as ◦C or more. In this case, the precursor layer is oxidized to the second layer. The first metal is composed of the present Pt ▲ the second metal is an example of the composition of the A1 as an example. The aluminum containing the surface region of the A1 precursor layer is first oxidized to Ah 〇 3. Then 〇 2 ^ diffuses through the AhCb layer, The underlying metal M is oxidized. At elevated temperatures, the second metal in the metallic state needs to be more reactive than the first metal containing (3), as is the case where the first metal is pt and the second metal is in the case of the A1 embodiment. In this case, 〇2 diffuses through the oxide layer formed on the first metal to reach the atom of the first metal in the intermediate region of the interface, and the first metal turns to the reduced metal due to the effect of the second metal reduction status. Therefore, it is preferable to oxidize the second metal in the step (6). Without wishing to be bound by a particular theory, we believe that the second metal oxide in the precursor layer will polymerize with the top oxide layer, while the first metal in the metal state will polymerize with the first layer of the monolith, eventually contiguous. A second layer having no voids is formed on the continuous first surface of the first layer. We also believe that the polymerization of the first metal and the second metal oxide in the precursor layer in step (b) occurs in a random manner, and at the end of step (b), a rough irregular shape of the first layer and the second layer is produced. surface. In a particular embodiment, the result will form an interactive locking feature of the //m scale. As described above and in the apparatus of the present invention, such a rough interface and cross-linking feature contributes to the strong adhesion of the second layer to the first layer. It can be understood that the thicker the precursor layer is, the thicker the Al2〇3 layer formed before the oxidation of all the metal A1 is. The more difficult it is at a given pressure and temperature of the 〇2 part, the longer it takes to diffuse the 〇2. The thick gram 2 〇 3 layer reaches the remaining A1 metal below. Therefore, the thickness range required for the precursor layer has been described above. In the case of the implementation of the economy, the second metal is required to be fully oxidized to a stable oxide under the oxidized gamma. This complete oxidation produces a stable layer of ruthenium which is no longer oxidized during normal operation of the forming apparatus. However, in a particular embodiment, it is not excluded that the second layer contains a non-negligible amount of metal in the second state in addition to the second metal oxide. In some applications, the strength of the first layer of structure is important, and the second metal entering and remaining in the first metal layer may unduly impair the strength of the first layer, so all of the second metal in the precursor layer is preferably To be oxidized in step (b). In some embodiments, the reduction in the strength of the bond due to alloying between the first metal and the remaining second metal is tolerable or negligible, and preferably allows a specific amount of the second metal to remain in the step ( b) finally alloying with the first metal and thus the remaining second metal may be further oxidized during operation of the device at a later stage. The repair or maintenance of the integrity of the second layer may also be compromised with processing conditions such as normal wear and tear. crack. As described above and in the apparatus of the present invention, we prefer that the interface between the first layer and the second layer in step (b) is substantially dense and has an irregular shape of 24 201026897. The first layer formed in the step (b) of the present invention, which is described in the apparatus of the present invention, may be such that the inter-layered refractive index between the first layer and the second layer is at least 1.50, in a particular embodiment. At least 丨55, in a particular embodiment at least 1. 6G' is at least h 65 in a particular embodiment, at least 1.7 在 in the embodiment, and at least 175 in the more embodiment. In a specific embodiment, at the end of step (b), the formed second layer comprising the second metal halide can effectively inhibit the diffusion of & metal. In certain other embodiments, at the end of step (6), the second layer formed may be 〇2 permeable, but still impermeable to the first metal orthorhombic oxide. For example, when the second metal is A1, the first metal is pt. Due to the significantly larger molecular size of pt〇2, the AhOs layer may play a more pronounced inhibitory layer than 〇2 to diffuse the aprons, effectively inhibiting the continuity of the metal Pt. Oxidation and removal. Therefore, a second metal oxide such as Ah3 can act as a protective layer to withstand oxidation of the first metal. In a particular embodiment of the process of the present invention, the elevated temperature in step (b) ranges from 100 (TC to the melting temperature of the first metal. We find that the second metal contained in the precursor layer is in the first When the layer is oxidized to a dense coating, a higher temperature is required to promote diffusion of 〇2 to the oxide layer, which is required for complete oxidation of the second metal. However, we hope that the oxidation step does not result in melting of the first layer. In certain other embodiments, the precursor layer is comprised of a first 25 201026897 metal-to-metal intermetallic mixture, and in step (b), the range of elevated temperatures: preferably from 1 ooor to the first The melting temperature of the mixture of the layers. This is because if the precursor layer is heated above its melting temperature, the material will melt and may flow out of the surface of the first layer, damaging the formation of a continuous and substantially dense second metal oxide. In a particular embodiment, in step (b), the precursor layer is preferably heated to a elevated temperature at a rate of temperature rise such that oxidation of the second metal does not occur as apparently molten metal exits the first metal. In the embodiment, the first metal is Pt and the second metal is A1, and we find that A1 is easy to form 4Pt at about 1 ° C by forming an alloy. (: Higher oxidation temperature is more desirable. 'Allows A1 to oxidize rapidly to gossip without substantially penetrating into the monolithic metal. However, the formation of a intermetallic is required to obtain a strong crucible.

Ah〇3塗層。我們相信在氧化步驛中較陡的上升溫度對於 形成堅固密實的氧化層是較有利的。; t本發明處理過程的特定實施例中在本發明裝置形 成並錢卿業系統之前以預先加熱的步驟來進行步驟 ⑹。例如在一項實施例中,裝置是本發明處理所製造以 ⑽覆蓋的Pt聲清管件,藉著在提升溫度的氧化步驟中 以-層Al-Pt合金覆蓋Pt管澄清管可在安裝 糸統之前製造完成。 埽裟1^ 換句話說,本發卿置可料在含G晰氣中在提升 26 201026897 的溫度下運作,裳置可在作鮮統絲時縣形成。例如 在-項實施例中,裝置是本發明處理所製造以Ah〇3覆蓋 的pt澄清管件可藉著下列步驟原處製造:⑴在pt澄清管 的外表面沉積包含A1的-層;⑵安裝從步驟⑴產生的澄 清管件到玻魏融系統;和⑶預先加熱玻魏融系統使 澄清官件在空氣巾加細提升的溫度氧化含A1的先質層 以形成第二層。 Ο III·製造玻璃處理過程: 本發明的第三項是使用本發明裝置的玻璃製造處理過 程。玻璃製造處理過程包括(D在熔融槽熔融整批材料以 取得玻璃熔融物;(2)經由導管輸送玻璃熔融物到下游的處 理過程;(3)調整:玻璃炼融物;以及(4)將玻璃炫融物形成所 需的形狀。在(1)到(4)的每個步驟可以使用本發明一個或 Φ 多個裝置。例如,在步驟(1),玻璃熔融槽的特定元件可以 是依據本項發明以Ah〇3和/或Zr〇2層覆蓋的貴重金屬;在 步驟(2)中’輸送系統可以有Alz〇3和/或Zr〇2覆蓋外部表面 的Pt-Rh管件;在步驟(3)中,澄清器或攪拌室可以是本發明 的裝置;而在步驟(4)中,包括熔融抽拉,浮置,槽孔抽拉,或 其他形成處理的裝置譬如熔融向下抽拉處理的等管可以是 本發明的包含Pt裝置,部份或全部以A12〇3和/或Zr〇2覆蓋。 範例:· 27 201026897 所有Pt-Rh測試試片包含大約2〇%重量比肋。 準備—系列乾淨的Pt-Rh試片,其包含20%重量的Rh,接 著依據本發明的處理,利用漿料沉積處理或CVD處理,以A1-Pt介金屬塗層。接著觀察和/或測試在Pt-Rh試片上產生的 Al-Pt銘塗層。然後在空氣中以大約145{rc氧化鋁覆蓋的Ah〇3 coating. We believe that the steeper rise in temperature in the oxidation step is advantageous for forming a dense, dense oxide layer. In a particular embodiment of the process of the invention, step (6) is carried out in a preheating step prior to the formation of the apparatus of the invention and the Qianqing system. For example, in one embodiment, the apparatus is a Pt sonic tube member manufactured by the present invention (10), and the Pt tube clarification tube is covered with a layer of Al-Pt alloy in the oxidation step of the elevated temperature. The manufacturing was completed before.埽裟1^ In other words, the hair of the hair can be operated in the temperature of 26 201026897 in the gas containing G, and the dress can be formed in the county. For example, in the embodiment, the device is a pt clarified tube manufactured by the treatment of the present invention and covered with Ah 〇 3 can be manufactured by the following steps: (1) depositing a layer containing A1 on the outer surface of the pt clarification tube; (2) mounting From the clarified tube produced in step (1) to the glass-fused system; and (3) the pre-heated glass-fused system causes the clarification member to oxidize the precursor layer containing A1 at a temperature at which the air towel is lifted to form a second layer. Ο III. Manufacture of glass processing: The third aspect of the present invention is a glass manufacturing process using the apparatus of the present invention. The glass manufacturing process includes (D melting the entire batch of material in the melting tank to obtain the glass melt; (2) processing the glass melt through the conduit to the downstream process; (3) adjusting: glass smelting; and (4) The glass spurs form the desired shape. One or more Φ devices of the present invention may be used in each of steps (1) through (4). For example, in step (1), the specific elements of the glass melting tank may be based on The present invention is a precious metal covered with an Ah〇3 and/or Zr〇2 layer; in the step (2), the 'transport system may have Alz〇3 and/or Zr〇2 covering the outer surface of the Pt-Rh pipe; In (3), the clarifier or the stirring chamber may be the apparatus of the present invention; and in the step (4), the apparatus including melt drawing, floating, slot drawing, or other forming treatment, such as smelting downward drawing The treated tube may be a Pt-containing device of the present invention, partially or entirely covered with A12〇3 and/or Zr〇2. Example:· 27 201026897 All Pt-Rh test pieces contain approximately 2% by weight ribs. Preparation - a series of clean Pt-Rh test pieces containing 20% by weight of Rh, followed by The treatment of the present invention utilizes a slurry deposition process or a CVD process to coat the metal with an A1-Pt. The Al-Pt coating produced on the Pt-Rh test piece is then observed and/or tested. 145{rc alumina covered

Pt-Rh試片約72·小時。接下來觀察和/或測試產生的Ah〇3 塗層Pt-Rh試片。 © 圖1顯示的是包含金屬A1先質層pt — Rh試片橫截面1〇〇 的掃瞄電子顯微影像。先質層,第一層,和介面的組成份可 藉由任何適合的特徵化方法來決定。例如,可使用掃瞄電 子顯微鏡(SEM)和電子微探儀(έρμα)來確定先質層和/或整 塊金屬成份内某一特定位置的組成份。請參考圖11〇3是 —層鍍Ni層用來幫助準備樣本的橫截面所以不是裝置的 Q —部分;111a和111b是先質層各種的主相,每 —種肴不同組成份的成分濃度和不同的物理結構,113是整 .塊Pt-Rh金屬。在各種位置由EPMA決定的組成份列示於以 下的表1。 28 201026897 表1The Pt-Rh test piece is about 72 hours. Next, the resulting Ah〇3 coated Pt-Rh test piece was observed and/or tested. © Figure 1 shows a scanning electron micrograph of a cross section of a metal A1 precursor pt-R sample. The composition of the precursor layer, the first layer, and the interface can be determined by any suitable characterization method. For example, a scanning electron microscope (SEM) and an electronic microprobe (έρμα) can be used to determine the composition of a particular location within the precursor layer and/or the entire metal component. Please refer to Fig. 11〇3 is a layer of Ni plating to help prepare the cross section of the sample so it is not the Q part of the device; 111a and 111b are the main phases of the precursor layer, and the concentration of each component of each ingredient And a different physical structure, 113 is a whole block of Pt-Rh metal. The components determined by EPMA at various locations are listed in Table 1 below. 28 201026897 Table 1

顯示於圖1巧Pt-Rh試片之醜組成份數The number of ugly components shown in Figure 1 Pt-Rh test piece

Lc是連接介面上兩點的彎曲線段長度 圖2是使肋下說明的本發明銘氧化方法解備包含 完全氧化祕層201的Pt-Rh基板橫截面掃瞒電子顯微影 像。在這個圖中,203是整塊金屬,2〇5是一層裱稍材料,幫 忙準備影像處理的橫截面。Lc is the length of the curved line segment connecting the two points on the interface. Fig. 2 is a cross-sectional broom electron micrograph of the Pt-Rh substrate including the fully oxidized secret layer 201, which is illustrated by the ribs described below. In this figure, 203 is a single piece of metal, and 2〇5 is a layer of stencil material to help prepare the cross section of the image processing.

圖3是移除原先形成其上的Ah〇3層後,pt_Rh基板表面 的掃晦電子顯微影像。這個影像顯示pt_Rh層第一表面的 疊積性質。 ,備用來影像處理的每個塗層試片,以樹脂保護其橫 截面。取得準備橫截面的SEC照片。每個試片收集並分析 大約20個這種影像。為了量化疊積程度,以下列方式來測 量和計算"疊積折射率"。 在JEOL 6610 SEM裝置上以20kV進行收集背向散射影 像。 29 201026897 首先收集低放大的影像(〜10χ - 25x),使得試片可以整 個看的見。從試片的上下邊緣收集大約10個影像。在選定 位置後,聚焦並調整SEM影像以確保試片定位在視野的水平 方向。然後以最大可能解析度收集15〇χ的背向散射電子影 像。 使用 NIH ImageJ 程式(http://rsbweb.nih.gov/ij/) 勿析景^像。如果需要的話,可調整亮度和對比以碟保 區域和Ah〇3或Zr〇2塗層的亮度有強烈的對比。影像上不 再進行其他的㈣。接著數位化影像,使pt Rh區域顯示純 粹的黑色(晝素值〇),而影像的其他部份是純粹的白色(晝 素值255)。然後使用魔術棒的工具圈選pt Rh區域,並測量 其周長。在從周長減去水平和垂直的長度後得到叠積介 面的長度。 ❹ 為了、.隹持資料的品質和統計顯著性:⑴以同樣的放大 L數收集^有影像:⑽以⑴賴麵敝觸像的位置 :(m)從每個樣本彳_目當個數的輯(,;㈤以高解 TIF^集心像以清楚定義介面的疊積;(V)以不會遺失的 式轉影像_免由於施魏產生的影像加工; ‘在办像刀析期間’以肉眼檢查影像確保正確 邊緣,而且不冬㈣的波^ 圖4顯示影像處理以取得樣本疊積折射率的流程。在 30 201026897 _域40樣本橫戴面的®影像,包括純區域和 八隔伽數1购4. 2中,職㈣區域和整娜像 _ 4 3中,量測㈣區域臟週 2=^刪,⑽麻之 長度再,十异如下:Lc=Lp_L1_L2_L3。疊積折射率C!再計算 如下:CI=Lc/Ls=(Lp-U-L2-L3)/L2。Figure 3 is a broom electron micrograph of the surface of the pt_Rh substrate after removal of the Ah〇3 layer on which it was originally formed. This image shows the stacked nature of the first surface of the pt_Rh layer. Each coated test piece to be image-processed is protected by a resin to protect its cross section. Get a SEC photo of the prepared cross section. Approximately 20 such images were collected and analyzed for each test piece. In order to quantify the degree of deposition, the "deposited refractive index" is measured and calculated in the following manner. Backscattered images were collected at 20 kV on a JEOL 6610 SEM apparatus. 29 201026897 First collect low-magnification images (~10χ - 25x) so that the test strips can be seen from the whole. Approximately 10 images were collected from the upper and lower edges of the test piece. After selecting the position, focus and adjust the SEM image to ensure that the test strip is positioned horizontally in the field of view. Then 15 〇χ of backscattered electron images were collected at the maximum possible resolution. Use the NIH ImageJ program (http://rsbweb.nih.gov/ij/) to analyze the image. If necessary, the brightness and contrast can be adjusted to have a strong contrast between the disc area and the brightness of the Ah〇3 or Zr〇2 coating. No other (4) is performed on the image. The image is then digitized so that the pt Rh area shows pure black (the 昼 value 〇), while the rest of the image is pure white (the 昼 255 value). Then use the magic wand tool to circle the pt Rh area and measure its circumference. The length of the stacking interface is obtained after subtracting the horizontal and vertical lengths from the circumference. ❹ In order to maintain the quality and statistical significance of the data: (1) Collect the same number of enlarged L numbers ^ There are images: (10) With (1) the position of the touch surface: (m) From each sample 目 目The series (,; (5) with a high solution TIF^ set the heart image to clearly define the stack of the interface; (V) with the image that will not be lost _ free of image processing due to Shi Wei; 'during the analysis of the knife' Visually inspecting the image to ensure the correct edge, and not the winter (four) wave ^ Figure 4 shows the process of image processing to obtain the sample laminated refractive index. In the 30 201026897 _ domain 40 sample cross-section of the ® image, including pure area and eight compartments Gamma 1 purchase 4. 2, occupation (four) region and neat image _ 4 3, measurement (four) regional dirty week 2 = ^ delete, (10) length of hemp, then ten different as follows: Lc = Lp_L1_L2_L3. C! is again calculated as follows: CI = Lc / Ls = (Lp - U - L2 - L3) / L2.

在四個比較的範例中,評估取自不同來源,藉由電聚喷 霧處理以ZrU塗層直接沉積的pt_n圖_示依據 本項毛月和四個比較範例(CE1,對應影像5· 2A和5歲CE2, 對應影像5. 3A和5. 3B;CE3,,對應影像5. 4A和5· 4B;以及CE4 ,對應影像5. 5A和5· 5B)的-個範例樣本(E1,對應影像5.1A 和5.1.B)介面影像。較大的影像放在左欄中(即影像5. u, 2A,3A,5. 4A及5· 5A),而左攔中影像以長方形圍著的放 大影像區域則放在右欄(及影像5.1Β,5. 2Β,5. 3Β,5. 4Β及 5. 5β,分別地對應於 5· 1Α,5. 2Α,5. 3Α,5. 4Α 及 5. 5Α)。In the four comparative examples, the pt_n maps obtained by direct deposition of ZrU coatings by electropolymerization were measured from different sources. According to this item, and the four comparative examples (CE1, corresponding image 5·2A) And 5 years old CE2, corresponding images 5. 3A and 5. 3B; CE3, corresponding images 5. 4A and 5 · 4B; and CE4, corresponding images 5. 5A and 5 · 5B) - sample samples (E1, corresponding Image 5.1A and 5.1.B) interface images. Larger images are placed in the left column (ie, images 5. u, 2A, 3A, 5. 4A, and 5·5A), while the enlarged image area surrounded by rectangles in the left block is placed in the right column (and image) 5.1Β, 5. 2Β, 5. 3Β, 5. 4Β and 5. 5β, respectively corresponding to 5·1Α, 5. 2Α, 5. 3Α, 5. 4Α and 5. 5Α).

影像分析結果列於底下表II中。 表II sms' 平均疊積折鼾率 分析數目 (誤差為In) El 1-71 ±〇.〇8 21 CE1 1-46 ±〇.〇8 19 CE2 ~~ _ 1.43 ± 0.08 20 CE3 116±〇.〇6 20 CE4 1·17±〇·〇5 20 31 201026897 與塗覆電漿噴灑锆石之試片比較,塗覆礬土 pt-Rh試片具有 較複雜的界面。 熟知此技術者瞭·解本發明能夠作許多變化及改變而並 不會脫離本發明之精神及範圍。預期本發明含蓋本發明各 種變化及改變,等屬於下列申請專利範圍以及同等物範圍 内。. 【圖式簡單說明】 ❹ 所包含附圖顯示出本發明特定範例以及在此加入以及 構成說明書之一部份,以及隨同說明書作為說明本發明原 理以及並非作為限制用途。相同的參考數字代表相同的或 類似的元件。 圖1顯示出承載包含金屬A1先質層之pt—此試片斷面 100之掃瞄電子顯微鏡影像。 Q 圖2顯示出承載完全氧化Al2〇3層之Pt_Rh試片斷面之 掃瞄電子顯微鏡影像。 • 冑3為先前形成則3層被去雜,pt,基板表面之掃 . 猫電子顯微鏡影像。 圖4及5顯示影像收集以及分析處理過程以得到在pt_ Rh基板上依據本發明特定實施例處理之資訊。 【主要元件符銳說明】 橫戴面100;銘1〇1;鍵則層103;先質層各種主相 32 201026897 * 105,107,109, llla,lllb,111;整塊Pt-Rh 金屬 113;完全 氧化Al2〇3層201;整塊金屬203;裱褙材料205;氧化區 域 401。 ❿ ❿ 33The results of the image analysis are listed in Table II below. Table II sms' average number of stacked fold analysis (error is In) El 1-71 ±〇.〇8 21 CE1 1-46 ±〇.〇8 19 CE2 ~~ _ 1.43 ± 0.08 20 CE3 116±〇. 〇6 20 CE4 1·17±〇·〇5 20 31 201026897 The coated pt-Rh test piece has a more complicated interface than the test piece coated with zircon. It is apparent to those skilled in the art that the present invention is capable of various changes and modifications without departing from the spirit and scope of the invention. It is intended that the present invention cover the modifications and variations of the invention and the scope of the inventions BRIEF DESCRIPTION OF THE DRAWINGS The accompanying drawings, which are incorporated in FIG. The same reference numbers represent the same or similar elements. Figure 1 shows a scanning electron microscope image of a pt containing the metal A1 precursor layer. Q Figure 2 shows a scanning electron microscope image of the Pt_Rh test piece carrying the fully oxidized Al2〇3 layer. • 胄3 is previously formed, then 3 layers are removed, pt, and the surface of the substrate is scanned. Cat electron microscope image. Figures 4 and 5 show image acquisition and analysis processes to obtain information processed on a pt_R substrate in accordance with a particular embodiment of the present invention. [Major component Fu Rui description] horizontal wear surface 100; Ming 1〇1; key layer 103; precursor layer various main phases 32 201026897 * 105,107,109, llla,lllb,111; monolithic Pt-Rh metal 113; fully oxidized Al2 〇 3 layers 201; monolithic metal 203; tantalum material 205; oxidized region 401. ❿ ❿ 33

Claims (1)

201026897 七、申請專利範圍 1. 一#裝置,其包含: (i) 具有包含第一金屬第一表面的第一層;以及 (ii) 包含第二金屬氧化物的第二層,直接黏接到第一 的第一表面,並覆蓋至少第一層第一表面的至少一部分其201026897 VII. Patent Application 1. A device comprising: (i) having a first layer comprising a first surface of a first metal; and (ii) a second layer comprising a second metal oxide, directly bonded a first first surface and covering at least a portion of at least the first surface of the first layer (A)第一層和第二層之間的介面實質上為密實的 不規則的形狀;和 ,而且有(A) the interface between the first layer and the second layer is substantially dense and irregular in shape; and (B)當第二金屬在提升的溫度下沉積在第一金屬的第一 表面時,第二金屬可以和第一金屬形成合金。 2.依辞申請專利範圍» 1項之裝置,其中(C)由第二金屬和 第一金屬混合物組成份金屬薄膜,厚度是實質上等於惰性 基板支樓的第二層,當薄膜的—個主要表面暴露到空氣中 溫度範圍從圆。(:到第-金屬的熔融溫度—段足夠的時門 時^屬_可以完錄化,在雜絲上形絲實的氧^ 3.依據申請專利範圍第1或2項之震置, 貴金屬;以及第二金屬包含至少一種A1, 其中:第一金屬包含 Zr以及Si。 4.依據申請專利範圍第1或2項之裝 ,·以及第二層實質上由Al2〇3構成。 置,其中:第一層包含Pt 5·依射請專利範群〗或2項之裝置,其中第二層 對第一金屬之氧化物為不滲透的。 6.依據申請專利範圍第1或2 對〇2為不滲透的。 項之裝置,其中第二層實質上 34 201026897 7.依射請專利範圍第丨或2項之裝置其中第 層間之介面具有疊積折射率至少為1 50。 、 =:=第1或2項,其中第二層具有厚 ===㈣或2吻置,物跑融玻 參 10.依據申请專利範圍第1或2項之裝置其中| 融系統之澄清器管件。 < 置為玻璃溶 φ(B) When the second metal is deposited on the first surface of the first metal at an elevated temperature, the second metal may be alloyed with the first metal. 2. According to the application for the scope of patents»1, wherein (C) consists of a metal film composed of a second metal and a first metal mixture, the thickness is substantially equal to the second layer of the inert substrate branch, when the film The main surface is exposed to air in a temperature range from a circle. (: to the melting temperature of the first metal - the segment is sufficient when the gate is _ can be completed, the silk is solid on the wire ^ 3. According to the scope of claim 1 or 2, the precious metal And the second metal comprises at least one A1, wherein: the first metal comprises Zr and Si. 4. According to the scope of claim 1 or 2, the second layer consists essentially of Al2〇3. : The first layer comprises a device of Pt 5 · Depending on the patent group or 2 items, wherein the second layer is impermeable to the oxide of the first metal. 6. According to the patent application range 1 or 2 The device is impervious. The second layer is substantially 34. 201026897 7. According to the scope of the patent or the device of the second item, the interface between the first layers has a laminated refractive index of at least 1 50., =:= Item 1 or 2, wherein the second layer has a thickness ===(four) or 2 kisses, and the material is fused to the glass ginseng 10. According to the device of claim 1 or 2, the clarifier tube of the system is melted. Set to glass soluble φ :===:r裝置’其中裝置為_ 置為攪拌槽 12.依據申請專利範圍第1或2項之裝置,其中裝 之覆蓋。 13·依據申請專利範圍第1或2項之裝置,其中裳置為翼緣。 14. 依據申請專利範圍第1或2項之裝置,其中第二層覆蓋實 質上裝置所有外露表面,侧其會暴露於含有氧氣之大氣。 15. 依據申請專利範圍第丨或2項之裝置其中裝置 面由第二層覆蓋。 ° 16. —種保護裝置中包含第一金屬的第一層第一表面在提 升的溫度下暴露到氧化空氣時避免氧化之方法該方法包 括下列的步驟: (a) 在第一金屬的第一表面至少一部份上提供包含第二 金屬鲜先質層,在形成的情況下此第二金屬可以和第一金 屬形成合金;以及 (b) 藉著將先質層暴露到提升的溫度下的氧化大氣中,形 35 201026897 成包含第二金屬氧化物的第二層。 17. 依據申請專利範圍第16項之方法,其中第一層包含pt。 18. 依據申請專利範圍第16或17項之方法,其中第一層包含 Pt,以及第二金屬包含至少一種Al,Si及Zr。 19. 依據申晴專利範圍第16或17項之方法,其中在步驟(a) 中先質層具有厚度為7微米至120微米。 20. 依^申請專利範圍第16或17項之方法其中在步驟(b) & 結束時,第一與第二層間之介面實質上為密實的以及具有 不規則的形狀。 21·依據申請專利範圍第16或17項之方法,其中在步驟(b) 中形成第二層使得第一與第二層間之介面具有具有疊積 折射率至少為1.5〇。 22·依據申請專利範圍第16或17項之方法其中在步驟(a) 中所提供絲層:實質上包含第一以及第二金屬之混合物。 23.依據申請專利範圍第16或17項之方法,其中在步驟卬) 〇 中’提·昇溫度在1000°C至第一金屬熔融溫度之範圍内。 24·依據申請專利範圍第16或17項之方法其中在步驟(b) • 中,提昇溫度在1000。〇至先質層熔融溫度之範圍内。 :依據申請專利範圍第16或17項之方法其中在步棘⑹ 結束時,在先質層中第二金屬完全地轉變為其氧化物。 依據申請專利範圍第16或17項之方法,其中在步驟⑻ ,先質層加熱至提昇溫度,其提昇溫度速率使得第二金 屬發生氧化而不會顯著祕熔融第二金屬 27.依射物_第16或17項之蛛其中步包 36 201026897 少一項化學蒸氣沉積,包覆粉浴法,裝料塗覆,喷 =據^專·_6或17歡枝 預先加熱步驟中進行。 y你 16 417項之方法,其中當裝置按裝 呆作系統中時,步驟⑻在原處進行。 30. 依據申請專利範圍第29 ❹ 溶融及/或傳輪系統。 之方法,射操作系統為玻璃 31. 依挺申請專利範圍 St層具有厚度為二= 利範圍1或=1圍置第4或17項之方法,其中使用申請專 澄清器項之方法,其中装置為授摔槽, 37:===: r device' wherein the device is set to a stirring tank 12. According to the device of claim 1 or 2, the covering is covered. 13. A device according to claim 1 or 2 wherein the skirt is a flange. 14. Apparatus according to claim 1 or 2 wherein the second layer covers substantially all exposed surfaces of the device and the side is exposed to an atmosphere containing oxygen. 15. A device according to the scope of claim 2 or 2 wherein the device surface is covered by a second layer. ° 16. A method of preventing oxidation of a first layer of a first surface of a first metal comprising a first metal when exposed to oxidizing air at elevated temperatures. The method comprises the steps of: (a) first in the first metal a second metal fresh precursor layer is provided on at least a portion of the surface, the second metal may be alloyed with the first metal in the case of formation; and (b) by exposing the precursor layer to elevated temperatures In the oxidizing atmosphere, shape 35 201026897 into a second layer containing a second metal oxide. 17. The method of claim 16, wherein the first layer comprises pt. 18. The method of claim 16 or 17, wherein the first layer comprises Pt and the second metal comprises at least one of Al, Si and Zr. 19. The method of claim 16 or 17, wherein the precursor layer has a thickness of from 7 micrometers to 120 micrometers in step (a). 20. The method of claim 16 or 17, wherein at the end of steps (b) & the interface between the first and second layers is substantially dense and has an irregular shape. The method according to claim 16 or 17, wherein the second layer is formed in the step (b) such that the interface between the first layer and the second layer has a laminated refractive index of at least 1.5 Å. 22. The method according to claim 16 or 17, wherein the silk layer provided in step (a) comprises substantially a mixture of the first and second metals. 23. The method according to claim 16 or 17, wherein in step 卬) ’, the temperature is raised from 1000 ° C to the first metal melting temperature. 24. According to the method of claim 16 or 17, wherein in step (b), the elevated temperature is 1000. It is within the range of the melting temperature of the precursor layer. The method according to claim 16 or 17, wherein at the end of the step (6), the second metal is completely converted into its oxide in the precursor layer. The method according to claim 16 or 17, wherein in the step (8), the precursor layer is heated to a lifting temperature, and the temperature is raised to cause the second metal to oxidize without significantly melting the second metal. Spider 16 or 17 of which is a step package 36 201026897 One less chemical vapor deposition, coated powder bath method, charge coating, spray = according to ^ _ 6 or 17 Huanzhi preheating step. y The method of item 16 417, wherein step (8) is performed in situ when the device is installed in the system. 30. According to the scope of application for patents 29 溶 melting and / or transfer system. The method of shooting the operating system is glass 31. According to the patent application range, the St layer has a thickness of two = the range of 1 or =1, and the method of applying the special clarifier item, wherein the device is used For the pitch, 37
TW098129194A 2008-08-29 2009-08-28 Protective coating and method TWI405872B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US19048808P 2008-08-29 2008-08-29

Publications (2)

Publication Number Publication Date
TW201026897A true TW201026897A (en) 2010-07-16
TWI405872B TWI405872B (en) 2013-08-21

Family

ID=41722189

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098129194A TWI405872B (en) 2008-08-29 2009-08-28 Protective coating and method

Country Status (5)

Country Link
JP (1) JP5662314B2 (en)
KR (1) KR101639088B1 (en)
CN (1) CN102187490B (en)
TW (1) TWI405872B (en)
WO (1) WO2010024940A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102869621B (en) * 2010-04-28 2014-12-24 旭硝子株式会社 Molten glass treatment apparatus, process for production thereof, and use thereof
JP5610299B2 (en) * 2011-03-08 2014-10-22 株式会社ディ・ビー・シー・システム研究所 Oxidation-resistant platinum alloy, oxidation-resistant platinum alloy film and oxidation-resistant metal member
JP5821948B2 (en) * 2011-03-28 2015-11-24 旭硝子株式会社 Refractory for holding molten glass, glass manufacturing apparatus using refractory for holding molten glass, and glass manufacturing method using the glass manufacturing apparatus
JP2016179925A (en) * 2015-03-24 2016-10-13 旭硝子株式会社 Platinum structure for glass production, glass producing device and glass production method
JP6965269B2 (en) * 2016-05-06 2021-11-10 コーニング インコーポレイテッド Glass tube manufacturing equipment and method
JP6641317B2 (en) * 2017-03-02 2020-02-05 不二越機械工業株式会社 Single crystal manufacturing equipment
KR20180125117A (en) * 2017-05-12 2018-11-22 코닝 인코포레이티드 Refractory article, composition for coating refractory article and method of manufacturing the refractory article

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8005A (en) * 1851-04-01 He ne y bo o t
JPS62212228A (en) * 1986-03-13 1987-09-18 Tanaka Kikinzoku Kogyo Kk Platinum container for high temperature
US6413589B1 (en) * 1988-11-29 2002-07-02 Chou H. Li Ceramic coating method
US5334263A (en) * 1991-12-05 1994-08-02 General Electric Company Substrate stabilization of diffusion aluminide coated nickel-based superalloys
JP4166088B2 (en) * 2001-03-16 2008-10-15 日本板硝子株式会社 Method for producing metal ultrathin film, metal ultrathin film laminate, and metal ultrathin film or metal ultrathin film laminate
US6855212B2 (en) * 2002-02-15 2005-02-15 Honeywell International Inc. Elevated temperature oxidation protection coatings for titanium alloys and methods of preparing the same
US6746783B2 (en) * 2002-06-27 2004-06-08 General Electric Company High-temperature articles and method for making
BE1015823A3 (en) * 2003-12-17 2005-09-06 Ct Rech Metallurgiques Asbl Process for coating a surface by metal layer ultrafine.
KR100587686B1 (en) * 2004-07-15 2006-06-08 삼성전자주식회사 Method for forming TiN and method for manufacturing capacitor used the same
US7531217B2 (en) * 2004-12-15 2009-05-12 Iowa State University Research Foundation, Inc. Methods for making high-temperature coatings having Pt metal modified γ-Ni +γ′-Ni3Al alloy compositions and a reactive element
KR100772099B1 (en) * 2005-06-28 2007-11-01 주식회사 하이닉스반도체 Method for forming capacitor of semiconductor device
US20080057275A1 (en) * 2006-08-31 2008-03-06 Paul Richard Grzesik Method and apparatus for minimizing oxidation pitting of refractory metal vessels
CN101158041A (en) * 2007-09-11 2008-04-09 太原理工大学 Method for forming ZrO2 ceramic composite material on metal surface

Also Published As

Publication number Publication date
WO2010024940A2 (en) 2010-03-04
CN102187490B (en) 2014-03-12
TWI405872B (en) 2013-08-21
KR101639088B1 (en) 2016-07-12
JP5662314B2 (en) 2015-01-28
WO2010024940A3 (en) 2010-07-08
JP2012501384A (en) 2012-01-19
KR20110069792A (en) 2011-06-23
CN102187490A (en) 2011-09-14

Similar Documents

Publication Publication Date Title
TW201026897A (en) Protective coating and method
TWI354706B (en) Hot-dip galvanealed high-strength steel sheet and
US7560138B2 (en) Oxidation resistant coatings for ultra high temperature transition metals and transition metal alloys
CN101760712B (en) Production method for hot dip galvanized steel sheet in high manganese steel with great coating surface quality
TWI726896B (en) Coatings for glass shaping molds and molds comprising the same
JP2010502841A (en) Copper sputtering target having very small crystal grain size and high electromigration resistance and method for producing the same
JP4189350B2 (en) Titanium material, manufacturing method thereof and exhaust pipe
Tryon et al. Multilayered ruthenium-modified bond coats for thermal barrier coatings
Li et al. High temperature corrosion behavior of a multilayer CrAlN coating prepared by magnetron sputtering method on a K38G alloy
JP6593574B1 (en) Steel plate for container and method for producing steel plate for container
Völker et al. Mechanical and chemical investigation of the interface between tungsten-based metallizations and annealed borophosphosilicate glass
CA2785322C (en) Methods of forming nickel aluminide coatings
Karanikas et al. Quantitative interfacial energy measurements of adhesion-promoted thin copper films by supercritical fluid deposition on barrier layers
Song et al. The self-formation graded diffusion barrier of Zr/ZrN
JP6793419B2 (en) Rust preventive member and its manufacturing method
Vives et al. Mixed SiO2–TiO2 (1: 1) sol–gel films on mild steel substrates: Sol composition and thermal treatment effects
CN115572932B (en) Zinc-aluminum-magnesium coating, zinc-aluminum-magnesium coating steel plate and preparation method thereof
US20110151140A1 (en) Methods Of Forming Nickel Aluminde Coatings
Wang Microstructure evolution and surface defect formation in tin films
KR101271394B1 (en) Manufacturing Method for Palladium-Silver Alloy Diffusion Barrier Layer
US8632890B2 (en) Nickel aluminide coating systems and coated articles
JP2004204280A (en) Galvannealed steel sheet
Louro Hardness evaluation of W–Si–N sputtered coatings after thermal degradation
TWI530587B (en) Metallic substrate for producing electronic device and panel
KR20230027272A (en) Stainless steel sheet with Al coating layer

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees