TW201009974A - Integrated circuit placement system - Google Patents

Abstract

This invention relates to a dice placement assembly for placing dice on a carrier. The assembly includes a support platform with a clamp mechanism configured to clamp the carrier onto said platform, and at least one camera operatively directed at the platform to detect alignment fiducials on the carrier. The assembly also includes a placement device having a vacuum mechanism to retrieve the dice from a supply mechanism, said placement device having actuators to align the dice with the carrier and to place the dice thereon once aligned, and a heater to heat the dice prior to placement on the test bed. Further included is a controller operatively controlling the clamp mechanism, the camera and the placement device, to facilitate accurate placement of the dice on the carrier.

Description

201009974 IX. Description of the Invention [Technical Field of the Invention] The present invention generally relates to a combination of print head integrated circuit components. DETAILED DESCRIPTION OF THE INVENTION The present invention provides a combiner for assembling a printhead integrated circuit on a carrier and a method of association. [Prior Art] A page wide printer containing a microelectromechanical member typically has a print head integrated circuit 'which includes a base of a microelectromechanical nozzle configuration with a large number of densely arranged. Each nozzle configuration is responsible for emitting a stream of ink droplets. In order for this printer to accurately print and maintain quality, it is important to test the print head integrated circuit. This is especially important during the design and development of such integrated circuits. Testing such integrated circuits generally requires some form of platform or carrier. According to a first aspect of the present invention, a combiner for combining a print head die on a carrier is provided, the combiner comprising: a support combination; a wafer positioning assembly disposed in the support combination And configured to hold and position the wafer, the wafer containing the print head die selected from the wafer; a die selection combination disposed on the support assembly and configured to be selected from the wafer a pre-selected print head die; a die arrangement combination disposed on the support assembly and configured to receive -5 - 201009974 the pre-selected print head die and to place the die on the carrier a die transport mechanism disposed on the support assembly and configured to selectively transport the die from the die to the die arrangement combination; and a control system operatively engaging the wafer location, die selection, The grain arrangement and the grain transfer combination are used to control the operation thereof. The support assembly can include an optical table and a block mount positioned on the optical table, the wafer positioning assembly being located on the block mount, and the support member configured to support the die selection combination The wafer is positioned above the assembly. The wafer positioning assembly may include a base member mounted on the block and first and second stages mounted on the base member, the first table being interposed between the base member and the second stage and Comparing the base member along the first linear axis, the second stage is displaceable relative to the first stage along a second linear axis orthogonal to the first linear axis, and the wafer support assembly is located On the second stage, the wafer support assembly is configured to support the wafer by rotating about a rotational axis that is orthogonal to both the first and second linear axes. • the die selection combination includes a carrier combination that is fastened in combination with the support and that can be displaced in combination with the support assembly toward or away from the wafer, on the carrier combination and configured to A die pick and lift head that engages the preselected die when the position is lowered and releases the preselected die when the carrier is assembled in the raised position. The die transport mechanism can include an elevated combination of elevated members positioned across the support assembly and configured to receive and support the predetermined predetermined die mounted on the elevated member and compared A shuttle combination in which the elevated member receives a displacement between the receiving position of the die released by the die selection combination and a transport position in which the -6-201009974 die is transported to the arrangement. According to a second aspect of the present invention, there is provided a transport apparatus for transporting a component of an integrated circuit from a receiving location to a delivery location in an integrated circuit assembly machine. The transport apparatus includes: a support structure defining a transport path between the locations a component carrier defining a receiving zone retention mechanism configured to receive the component of the integrated circuit, the component carrier being disposed on the component carrier to maintain the component of the integrated circuit in the receiving zone in position, the retention mechanism operable To release the member at the delivery position; and a displacement mechanism engaged with the member carrier to displace the member carrier along the transport path. The support structure can include a support arm extending between the receiving and delivery positions, the transport path being linear, the displacement mechanism including a linear motor disposed on the support arm. The component carrier can include a shuttle plate defined by a vacuum plate disposed on the shuttle plate, the retention mechanism including a gel block that holds the member of the integrated circuit. The component carrier can include a vacuum tube configured to fluidly communicate with the vacuum plate, the vacuum tube configured to fluidly communicate with the vacuum pump, the vacuum pump can be operated to draw air through an aperture defined in the vacuum plate to operatively maintain the integrated circuit The member to the vacuum plate. The displacement mechanism can include a linear motor disposed on the support structure, 201009974. The linear motor is configured to displace the component carrier along the transport path. According to a third aspect of the present invention, a die picker for selecting a printhead integrated circuit from a wafer is provided, the picker comprising: a wafer platform having a displacement actuator for receiving the wafer with displacement operability a platform; a picker head having a vacuum mechanism to lift the die of the circuit from the wafer; a φ alignment sensor configured to detect a position of the die on the wafer; and a controller Configuring communication with the displacement actuator control signal, the picker head and the sensor assisting alignment of the wafer with the picker head, and picking the die from the wafer for transport to transport device. The displacement actuator can include two piezoelectric motor stages attached to the platform to move the platform in a plane below the picker head. The displacement actuator can include a rotary shaft motor configured to rotate the wafer crucible platform below the picker head. The wafer platform can include a heater plate configured to heat the wafer to soften the die to the wafer, with a vacuum plate holding the wafer to the platform. The alignment sensor can include a camera having a lens adapter and a beak to focus on identifying an index on the wafer to assist the controller in aligning the picker head with the die. The controller can operatively perform a set of instructions to align the wafer with the picker head based on a predetermined wafer base map. The picker head can include a heater element to heat the die prior to lifting the die from the wafer to hold the die to the paste in a soft -8-201009974. According to a fourth aspect of the present invention, there is provided a die arrangement for arranging an integrated circuit die on a carrier, the combination comprising: a support platform having a clamping mechanism configured to clamp the carrier to the platform At least one camera operatively directed to the platform to detect an alignment mark on the carrier; a φ arrangement having a vacuum mechanism to extract the die from a supply mechanism, the arrangement having an actuator Aligning the die with the carrier and arranging the die thereon in alignment, and heating the die prior to being disposed on the carrier; and a controller operatively controlling the clamping mechanism, The camera and the arrangement are arranged to assist in the proper placement of the die on the carrier. Preferably, the integrated circuit die is an ink jet print head die. The camera can include a camera module that is linked to the prism by an adapter tube to focus the camera on the test bed. The support platform can include a self-leveling platform that is pneumatically operated by the controller. The actuators of the arranging device may include three stepper motors each independently responsible for vertical, horizontal and angular alignment of the die with the test bed. The actuators of the arranging device can include a linear translation stage that moves the dies in a vertical direction to position the dies on the test bed. The arranging device can include a hot gas blower to direct hot gases to the die prior to arranging the die on the test bed. The arranging device can include an illumination configuration to illuminate the test bed to assist the camera in detecting the -9-201009974 alignment targets. According to a fifth aspect of the present invention, a method of attaching an integrated circuit die to a carrier is provided, the method comprising: scanning a wafer having a circuit die thereon to delimit individual dies; A substrate map is aligned with the die picker head and the die on the wafer; the die is removed from the wafer by the die picker head; and the die is transported to an operationally positioned arrangement of the carrier Standing; aligning the die with the carrier; and thermally adding the die to the carrier. Preferably, the integrated circuit die is an ink jet print head die. Preferably, the scanning step includes scanning the wafer in a camera configuration to identify a landmark mark on the wafer. Preferably, the step of removing the die comprises heating the wafer and applying a vacuum to individual dies that are to be removed by the die picker. • Preferably, the step of transporting the die comprises storing the die on a shuttle combination of the combiner, the shuttle combination being displaceable between a receiving position of the receiving die and a delivery position of the delivery die to the arrangement. Preferably, the step of aligning the die comprises scanning the die and the carrier in a camera configuration to identify a base mark on both the die and the carrier, and displacing the crystal relative to the carrier The particles are up to the base marks on the die in a predetermined position relative to the base marks of the carrier. Preferably, the step of distinguishing the base marks comprises inspecting the carrier with a camera having a focusing lens to discriminate the micro holes -10- 201009974 in the surface of the carrier, the apertures being identified as the base labels mark. Preferably, the individual steps are performed by a controller of the combiner having a wafer positioning combination, a die selection combination, a die transfer mechanism, and a die arrangement combination to include one included in the software product. The group instructions implement such steps. According to a sixth aspect of the present invention, there is provided a wafer positioning assembly of a combiner for combining an integrated circuit die on a carrier, the combiner having a support combination comprising an operational φ support having a wafer having a die thereon a closed body, a combination of crystal grains from which the crystal grains are selected, a combination of grain arrangements for arranging the crystal grains on the carrier, and operatively transporting the crystal grains of the crystal grains from the plurality of crystal grains a transport mechanism and a control system for controlling the combiner, the wafer positioning assembly comprising: a layout combination having a bottom plate on which the first and second stages are mounted; and a wafer support plate rotatably mounted on the second On the stage, the support plate set is configured to receive the wafer and has a motor under control of the control system to rotate the support plate assembly below the die selection combination. Preferably, the integrated circuit die is an ink jet print head die. Preferably, the first stage is interposed between the bottom plate and the second stage, and the first stage is slidably mounted on the bottom plate along a first axis, the second stage being along the first axis A second shaft is slidably mounted on the first stage. Preferably, the combination has a first piezoelectric motor interconnecting the bottom plate and the first stage, the first motor displacing the first stage along the first axis under the control of the control system. -11 - 201009974 Preferably, the combination has a second piezoelectric motor interconnecting the first stage and the second stage, the second motor displacing the second along the second axis under the control of the control system station. Preferably, the wafer support plate assembly includes a bearing table rotatably mounted to the second stage, the wafer support plate assembly having a bearing holder sandwiched between the second stage and the bearing table to ensure the crystal The circular support plate combines smooth rotation on the second stage. Preferably, the wafer support plate assembly includes a rotating pin having a compression spring surrounding the pin that provides damping of the vertical movement of the wafer support plate combination on the second stage. Preferably, the heater plate is mounted on the bearing table with a spacer to provide thermal isolation between the heater plate and the bearing table to which the vacuum plate is mounted and secured thereto. Preferably, the vacuum plate and the heater plate define a plurality of vacuum apertures connected to the underside of the heating Φ plate in fluid communication with the vacuum tubes, the tubes being connected to the vacuum manifold The vacuum manifold is coupled to a vacuum pump of the combiner that operates to hold the wafer to the wafer. Preferably, the heater is interposed between the vacuum plate and the heater plate, and the heater is connected to the hot gas supply of the combiner to enable the heater plate to heat the wafer. Preferably, the stepper motor is mounted on the second stage, and the power screw of the stepper motor combination extends from the stepper motor to tangentially engage the wafer support plate assembly. Preferably, the working end of the power screw is secured to the connector arm extending from the bearing table such that the extension and contraction of the power supply screw causes the wafer support plate assembly to rotate counterclockwise and clockwise, respectively. According to a seventh aspect of the present invention, there is provided a die selection and lift head for a combiner for combining an integrated circuit die on a carrier, the combiner having a wafer having an operative support having a die thereon Supporting the combined enclosure, selecting a combination of crystal grains from the wafer, arranging a combination of grain arrangements of the die on the crucible carrier, operatively transporting the die from the die selection and arrangement a die transport mechanism and a control system for controlling the combiner, the die selection and lifting head comprising: a first translation stage mounted on the die selection combination, the first translation stage being combinable relative to the support a vertical axis operative displacement; a second translation stage mounted on the first translation stage, the second translation stage being operatively displaceable along a horizontal axis relative to the support combination; and a die picker head mounted on On the second translation stage, the picker head defines a vacuum chamber and a die contact surface having a vacuum aperture for fluid communication with the vacuum chamber. Preferably, the integrated circuit die is an ink jet print head die. Preferably, the first translation stage includes a stepper motor under control of the control system, the motor having a linear encoder to provide position feedback to the control system. Preferably, the linear encoder is disposed adjacent to the scale band of the die selection combination to assist the linear encoder in generating the position feedback. Preferably, the second translation stage includes a pair of micro-13-201009974 meters of drivers fixed to the first stage to displace the picker head along the horizontal axis, the drives being under the control of the control system . Preferably, the die picker head includes a pair of sealing strips disposed on individual sides of the vacuum apertures on the die contact surface to assist in contact of the lifted die with the die The creation of a vacuum between them. Preferably, the die selection and lifting head has a vacuum tube fixed to the vacuum body, the tube is connected to a vacuum pump, and the vacuum pump is configured under the control system of the control system when the contact surface touches the die A vacuum is created in the chamber. Preferably, the heater is disposed in the vacuum body and connected to the hot gas supply to heat the die contact surface, and the thermocouple is coupled to the contact surface to sense the temperature thereof and notify the sensed temperature to The control system. According to an eighth aspect of the present invention, there is provided a arrangement head for combining a die arrangement of a combiner circuit die on a carrier, the combiner having a wafer having an operative support having a die thereon The combination of the support assembly, the combination of the crystal grains from the wafer, the combination of the crystal grains arranged on the carrier, and the operative operation of the crystal from the die selection and arrangement a grain transfer mechanism of the grain and a control system for controlling the combiner, the arrangement head comprising a first translation stage mounted on the die arrangement, the first translation stage being combinable along a layout relative to the die arrangement a first axis operative displacement; a second translation stage mounted on the first translation stage, the second translation stage being displaceable orthogonally to the first stage; a third translation stage mounted on the second platform The third stage is displaced at right angles to the first and second stages; and a-14-201009974 die placement head is mounted on the third translation stage to adjust the shape and size of the arrangement head for operative reception Crystal of the grain transport mechanism And the die is disposed on the carrier. Preferably, the integrated circuit die is an ink jet print head die. Preferably, the arrangement head has an angle motor mounted through the third stage in contact with the die placement head such that actuation of the angular motor by the control system causes the die placement head to surround the second stage The translational pivot angle is pivoted. Preferably, the arrangement head has an angular motion spring affixed to the third stage, the spring being configured to bias the arranging against angular motion provided by the angle motor. Preferably, the arrangement head has a head mounting block assembly that includes a mounting plate that is secured to the upright portion of the frame of the die arrangement combination via the mounting plate. Preferably, the arrangement head has a first stepper motor fixed to the block combination via a bracket assembly, the first stepper motor having operability Φ to engage the first stage push rod to The first axis drives the first station in relation to the block combination. Preferably, the arrangement head has a second stepper motor fixed to the first stage via a bracket assembly, the push bracket is fixed to the second stage and the second stage motor is engaged via a compression spring a pusher, the linear encoder being mounted on the first stage, wherein the scale band is secured to the second stage, the scale band being read by the linear encoder to provide feedback to the control along the position of the second axis system. Preferably, the arrangement head has a pair of third micro-drives mounted on the second stage and engaging the third stage to provide adjustment of the third stage, the micro-drives in the control system Under the control. Preferably, the die arranging head defines an aperture for fluid communication with the vacuum tube, the vacuum tube being coupled to the vacuum pump of the combiner, the shape and size of the aperture being adjusted to receive dies from the wafer, by which the vacuum pump will The die is operatively held in the aperture. According to a tenth aspect of the present invention, there is provided a clamp assembly for combining a printhead integrated body with a combiner on a carrier, the combiner having a wafer having an operative support having a die thereon Supporting the combined enclosure, selecting a combination of crystal grains from the wafer, arranging a combination of grain arrangements on the carrier, and operatively transporting the die from the die selection and arrangement a die transport mechanism and a control system for controlling the combiner, the clamp combination comprising: a long profile, the clamp being specifically shaped and configured to be received by the die arrangement; Ο a pair of elongated retaining plates, Mounted above the clip; the insert is adjusted in shape and size to be specifically received by the clip under the plates, the insert operatively receives the carrier; and a diaphragm positioned in the clip, the diaphragm The pneumatically controlled displacement operatively urges the insert against the retaining plates. The insert may include a plurality of positioning tabs that complement the associated apertures defined in the carrier to ensure proper positioning of the carrier. The insert is slidably received in the clip, the clip specifically includes a plug stop at one end thereof, a proximity switch is mounted on the stop and configured - 16-201009974 to be generated when the insert arrives at the stop Signal to the control system. The plates are mountable on the clip to define an access gap of sufficient width to allow the printhead integrated circuit to be positioned over the carrier through the gap. The clip may specifically include a pneumatic control fitting and define a pneumatic control chamber to assist in the pneumatic actuation of the diaphragm of the pneumatic control system via the combiner. The clamp assembly can include a handle secured to the insert to assist in maneuvering the load bearing member into position between the clamp plates. According to a tenth embodiment of the present invention, there is provided a software product for execution by a processor, the software product having instructions configured to cause the processor to perform the steps of the above method. According to an eleventh embodiment of the present invention, there is provided a computer readable medium operatively storing a software product executed by a processor, the software product having instructions configured to cause the processor to perform the steps of the above method. [Embodiment] The aspect of the present invention will be discussed with reference to specific embodiments of the present invention. References to "embodiments" or "an embodiment" are made by way of limitation and not limitation. Accordingly, references to specific features that appear in an embodiment do not exclude those features in other embodiments. The following description is intended to assist those skilled in the art to understand the invention. Therefore, features that are common in the art are not detailed, as those skilled in the art can readily understand these features. -17- 201009974 OVERVIEW In a broad sense, the invention relates to a combination of a print head circuit on a test bed or carrier. The combination typically involves removing the die from the wafer and placing the die on the carrier or test bed with high accuracy. The print head integrated circuit includes a series of print head integrated circuits (1C) having a plurality of micro-electromechanical nozzle configurations for injecting ink droplets onto the print surface. 1C defines a number of tiny ink inlets that are directed to individual nozzles, Φ which are configured to be in fluid communication with the ink distribution. The ink distribution combination fluid is responsible for feeding the ink to 1C. Figure 1 shows an example of a wafer 6. As shown, wafer 6 includes a plurality of print heads 1C or die 8 thereon. Wafer 6 is a product of various uranium engraving and lithography procedures for the manufacture of medium and long pieces in 1C. To test the print head 1C, each 1C is mounted to a carrier that defines a plurality of winding ink paths to form such an ink distribution combination. The ink path terminates in the surface of the carrier with a tiny ink outlet. In the case of the 1C ink inlet and the small size of the ink outlet, it is important that the 1C is accurately and accurately aligned with the carrier. The present invention provides a combiner and associated equipment and techniques for accurately securing a 1C to a carrier. Vehicle 10 FIG. 2 shows an embodiment of the carrier 10. It is to be understood that the reference to the carrier, test bed, base assembly, carrier sub-combination, liquid crystal polymer (LCP) combination or platform substructure 10 reference is made to the same elements indicated by reference numeral 10. The carrier 10 is typically a combination of two liquid crystal polymers -18- 201009974 (LCP) micromolds 11a and lib. The micro-mold 11 defines a plurality of discrete winding ink paths ' to transport ink from an ink reservoir (not shown) to a print head integrated circuit (not shown). Therefore, the carrier or test bed 1 is used to test the operation of the prototype of such a print head integrated circuit (1C) before mass production of 1 c. Under the premise of the operation of these print heads 1C, it is generally necessary to establish a seal between the winding ink path defined in the carrier 10 and the fluid inlet of the IC. Accordingly, the inventors have discovered that by laminating the carrier 10 with the laminated film 12, this fluid tight seal can be established between the carriers 1 and 1C when the 1C is secured to the carrier 10. This assists in the fluid tight supply of ink to the print head 1C. The ink path through the carrier 10 typically terminates in the surface of the carrier 10 with a standard aperture or "base" 14 as shown in Figure 1. It is therefore necessary to arrange 1C on the carrier 10 without blocking or obstructing these bases 14, otherwise the ink will not flow through the carrier 1 to the print head 1C. An example of a carrier 10 having a laminate 14 is shown in Figure 2. It is clear that the base 12 is not blocked to ensure proper ink supply. The carrier 10 also defines two position openings 13 at their respective opposite ends as shown. The purpose of the position opening 13 is to accurately fix and align the carrier 10 before placing the 1C on the carrier 10. The carrier base 15 is also included to aid in the alignment of the carrier 1 固 prior to attachment of the 1C to the carrier 10. A view of the combiner In Fig. 3, an embodiment of a printhead assembly machine or combiner 16 in accordance with an embodiment of the present invention is shown. Physically, the print head combiner • 19- 201009974 The 16 includes a support assembly or structure 24' defining a main enclosure 25 having a support frame 27 and side louvers 29, as shown. The side panels 29 are typically transparent to allow the operator of the combiner 16 to see the operation inside. The front panel 32 is shown and the internal components visible through it are shown as shown. The internal components of the combiner 16 include a die selection combination or die picker 18. A wafer positioning assembly 17 according to an embodiment of the present invention, a transport device or a die transport mechanism in accordance with an embodiment of the present invention 20. A die arrangement 22 according to an embodiment of the present invention. The support structure includes a self-leveling optical table 26 supported by a support frame 27 in the enclosure 25. The die selection assembly 18 is mounted on the optical table 26 and is detailed below. The die selection combination 18 is configured to select the die from the wafer 6 loaded into the enclosure 25. The panels of the enclosure are typically slidable to assist in the loading of the wafer 6 and the carrier 10. The die arrangement 22 is also mounted on the optical table 26 and is detailed below. The die arrangement combination 22 is configured to place the die 8 on the carrier 1 . The beta grain transport mechanism or shuttle transport combination 20 is interposed between the die selection assembly 18 and the grain arrangement combination 22. The grain transport mechanism 20 includes a via beam 1 14 which will be described in detail later. The die transport mechanism 20 is configured to receive the die from the die selection combination 18 and transport the die to the die arrangement combination 22. The die transfer mechanism 20 includes a transport or shuttle overhead 28 mounted on an optical table 26. The elevated frame 28 extends from the die selection combination 18 to the die arrangement combination 22. The touch panel PC 34 is mounted on the frame of the casing 24 and is set to be accessible by an operator. Control panel 36 is also mounted on a frame that can be accessed by an operator. An optical beacon 35 is also mounted on the enclosure 24 to indicate the operational status of the combiner 16-20-201009974. The touchpad PC 34 interfaces with the control panel 36, whereby the operator can monitor and control the combiner 16. It can be understood that most of the functions of the combiner can be controlled by the controller or with, as will be described later, including programmable logic controllers. The operator interface allows the operator to start and stop the combiner 1 ί control. The ion bar 40 is positioned in the enclosure 24, along with a high φ (ΗΕΡΑ) fan/filter configuration 42 to achieve a closed environment. The electrical enclosure 44 is mounted to the support frame and incorporates various electrical components for operation of the machine 16, and includes a pneumatic enclosure 46 for operation of the closure printhead assembly 16. Grain selection combination 18 Referring to Fig. 4, the selection of the die selection combination 18 selects the die from the wafer 6, the wafer 6 operates the strut combination 63, and lifts the die and arranges it in the core. . The die selection assembly 18 includes a block mount 50 mounted in the form of a rock block 26. Block 50 is typical. Wafer positioning assembly 48 is mounted on block 50. The wafer support plate assembly 63 allows the wafer to be vacuumed. The heater board 71 is used to heat the wafer 6 under the control of the PLC 38 to loosen the operation of holding the crystal grains or 1C 8 to the crystal to constitute the operator. However the control system monitors: (PLC) 38. >, and there are additional low-efficiency particle air bodies in the appropriate ring closed print head group. The casing 24 is provided with a granule as a rectangular shape according to a predetermined fixed fixing to the wafer support assembly 20, so as to maintain the position of the stem by a thermocouple 79 round adhesive, so that the - 21 - 201009974 grain The pick and lift heads 7 8 can select a die from the wafer 6. A pick overhead 80 is also installed on block 50. As shown, the elevated frame 80 includes opposing pairs of elevated columns 81 mounted at opposite corners of the block 50. The overhead 80 spans the wafer positioning assembly 18 and supports the die selection and lift head 78 with the carrier. Head 78 includes a pair of inter-wafer camera and optical assemblies 82. The combination 82 is coupled to the PC 34 and is configured to receive image data representative of the wafer 6 and control movement of the wafer support plate stack 63 to align the successive die 8 with the head 78. And includes a crystal line reader 1 0 0. The individual combinations will be detailed below. Wafer Positioning Assembly 48 The wafer positioning assembly 48, shown in detail in FIG. 5, includes a bottom member or plate 52 on the mounting block 50. The displacement assembly 54 is mounted on the base plate. The displacement assembly 54 includes two stages 56 and 58 with the first stage 56 disposed between the bottom plate 52 and the second stage 58. The first table 56 is displaced relative to the base member 52 along the first or U axis. The first piezoelectric motor 60 interconnects the bottom plate 52 with the first stage 56. Therefore, the first piezoelectricity 60 is displaced relative to the bottom plate 52 by the first and second stages along the V axis. The second electric motor 62 interconnects the bottom plate 52 with the first stage 56. Therefore, the second piezoelectric horse 62 is displaced relative to the first stage 56 along the x-axis by the second stage 58. The piezoelectric motors 60 and 62 are connected to the PLC 36' to have a suitable controller to be described later to control the operation of the piezoelectric motor. The PLC 3 6 and the operation mode will be described in detail later. The zone is slidably mounted on the second stage 58 when it is separated by a 52-pin pressure when its -22-201009974 wafer support plate assembly 63 wafer support plate assembly 63 is rotated. The wafer support plate assembly 63 has a bearing table 69 (Fig. 6) that is rotatably mounted on the bottom plate 64 above the second stage 58. The wafer support plate assembly 63 includes a bearing retainer 65 sandwiched between the plate 64 and the bearing table 69 to ensure smooth rotation of the wafer support plate assembly 63. The wafer support plate assembly 63 includes a rotating pin 67 having a compression spring 61 around which the wafer support plate assembly 63 can be rotated. The compression spring 61 provides damping of the vertical movement of the wafer support plate assembly 63. The heater board 71 is mounted on the bearing table 69 with a spacer 75 for thermal isolation (Fig. 7). The bearing table 69 is mounted on the bottom plate 64. The vacuum plate 76 is mounted and fixed to the heater board 71. Both the vacuum plate and the heater plate define a plurality of vacuum apertures 59. A plurality of vacuum tubes 57 are connected to the underside of the heater plate 7 1 that is in fluid communication with the vacuum aperture 59, as shown. The tube 5 7 is connected to a vacuum manifold 55 which is connected to a vacuum pump 472 housed in the air control enclosure 46 as will be described later. Supply tube 77 connects vacuum pump 472 to manifold 55 as shown. The operation of the vacuum pump 472 is controlled such that when the wafer is positioned on the vacuum panel 76, the wafer can be held in position by the vacuum created by the vacuum pump 472. The heater crucible 74 is interposed between the vacuum panel 76 and the heater board 71. The heater crucible 74 is coupled to the hot gas supply unit so that the heater plate 7 can heat the wafer 6 in use to release the adhesive holding the die or IC 8 to the wafer 6. The thermocouple 79 is connected to the heater board 71 and is operatively connected to a PLC 3 8 (described later) having a controller -23-201009974 to control the heater board 7 via the heater 匣 74 using a PLC 3 8 having a controller. 1 temperature. The stepper motor assembly 66 is mounted on the second stage 58. The power screw 68 of the stepper motor combination 66 extends from the stepper motor assembly and engages the wafer support plate assembly 63 in a tangential manner. In particular, and as seen in Figure 7, the connector arm 83 is secured to the heater plate 71 and extends radially therefrom. The working end of the power screw 68 is secured to the connector arm 83 such that the elongation φ and contraction of the power screw 68 causes the wafer support plate assembly 63 in the illustrated embodiment to rotate counterclockwise and clockwise, respectively. The power screw 68 passes through the screw plate 70 extending from the second stage 58. The spring 72 is fixed between the screw plate 70 and the connector arm 83. Therefore, the wafer support plate assembly 63 can be rotated in one direction under the operation of the power supply screw 68 and rotated in the opposite direction by the action of the spring. The stepper motor assembly 66 is also coupled to a PLC 38 having a suitable controller to control the operation of the stepper motor assembly 66. The electrical box 85 assists in the individual electrical connection of the PLC 38 and the components of the controller described below. • Die Select and Lift Head 78 The die pick and lift head 78 is shown in more detail in Figures 8-11. The die selection and lift head 78 includes a mount 89 that is secured to the bracket 87 and is displaced along the Z axis (operability perpendicular) relative to the bracket 87. The mount 8 9 and the bracket 87 are configured such that the displacement of the mount 8 9 and the bracket 87 is linear, and the mount 89 defines a linear translation stage 92. Linear encoder 94 provides the desired position Z-axis feedback 値 which is facilitated by the scale band 103 to PLC 38 (Fig. 1). Also included is a vertical stepper motor 96 that is affixed to the bracket 87 and engages the -24-201009974 mount 89 to use the position feedback from the linear code $ under the control of the PLC 38. The die picker is displaced along the Z-axis. head. The picker head plate 97 is attached to the mount 89. The picker head plates 97 and 89 are configured such that the picker head plate 97 is displaced along the (operability vertical) relative to the mount 89. The drive bracket 99 is fixed to the mount 89. The micro-drive 98 is secured to the bracket 99 and engages the picker head plate 97 with the X-axis displacement picker head plate 97. The drive 98 is connected to the PLC: 位移 The selector head plate 97 is displaced under the control of the PLC 38. Thus, the picker head plate 97 can be adjusted in two degrees by the stepper motor 96 and the microdriver 98 under the control of 38. A die picker head 91 (shown in more detail in Figure 11) is affixed to the picker head plate 97 via a frame 101 and has a true 84 defining a vacuum chamber. The vacuum body 84 has a die contact surface 86 configured to contact the die that lifts the wafer 6 on the blank plate 76. The die contact surface 86 defines a vacuum aperture 91 that is in fluid communication with the vacuum chamber of the vacuum body 84. The sealing strips 93 are disposed on individual sides of the vacuum aperture array 9 1 to contact the die and die contact surfaces. 86 auxiliary vacuum generation. The vacuum tube 88 is affixed to the vacuum body 84 and connected to the vacuum pump, and under the control of 38, the contact surface 86 is evacuated indoors when it contacts the die. A heater crucible 90 is disposed in the vacuum body 84 and connected to the hot gas to heat the surface 86. Thermocouple 95 is coupled to surface 86 to sense it and communicate the sensed temperature to the controller (described in more detail later). The controller states a valve to control the supply of hot gas to the crucible 90 to produce sufficient to assist in the separation of the die from the wafer on the vacuum panel 76. H 94 A pair of X-axis holders with a set of free free-standing bodies along the 18th axis «To be raised by the PLC, the true temperature of the reactor is set to heat-25- 201009974 Camera and optical combination 82 Figure 12 shows the camera and An embodiment of optical assembly 82. In this embodiment, the camera assembly 82 is mounted on a camera holder 85 that is attached to the overhead frame 80 (Fig. 4). As seen in Fig. 12, each camera assembly 82 includes a camera 102. A suitable camera is an IEEE1 394 SXGA+ C-seat camera (AVT F-131B) with a million-pixel Sony 2/3” progressive CCD array manufactured by Allied Vision. Camera 102 Installation At the end of the adapter tube 104 having a 2X permeable adapter, the body tube 106 is mounted on the adapter tube 104. The body tube 106 is in the form of a T-piece and includes an LED assembly 108 having a cooling heat sink 110 To illuminate the wafer 6. The camera assembly 82 also includes a prism 1 12 that is coupled to one end of the body tube 106. The camera assembly 82 is configured to produce an image of the portion of the wafer 6 by the PLC 38. The camera assembly 82 is coupled to the touch panel PC. 34. The image can be displayed on the screen of the PC 34 (detailed later). PC #34 is programmed to identify the wafer base mark and thus assist in the positioning of the picker head 78 according to the wafer map. This allows for software control combinations. The device 16 uses the wafer map to identify and select individual dies on the wafer 6. The wafer scribe reader 100 wafer scribe reader 100 (Fig. 4) is also mounted on the overhead 80. The scribing reader 100 is configured to read and load in the crystal using optical symbol recognition The wafer identification code on the wafer 6 on the support plate assembly 63. The wafer identification code is associated with the position of the suitably lifted die 8 and the control software used to lift the die 26-201009974 from the wafer. Line reader 100 is operatively coupled to PC 34.

3 4 to produce a visible image of the wafer identification code. In addition, the PC is programmed with a graphical user interface (GUI). Therefore, if the scribing reader has difficulty in fetching the wafer identification code, the operator can manually input the J code using the GUI. The wafer line reader 100 can be seen in Fig. 13 | Φ The reader 100 includes a casing 107 mounted to the overhead frame 80 with a bracket 109 configured to support a camera 11 111 having a video lens 113. Connected to the PC 34, the PC 34 can generate a wafer identification code & The housing 107 also includes a light source 115 to illuminate the wafer 6B circular identification code in use. Shuttle transport equipment/die transport mechanism 20 is shown in Figures 14 and 15 in accordance with one embodiment of the present invention. The shuttle transport assembly 2 sets the picking and lifting heads 7 to receive the dies and transport them to the grain arrangement set as described below. The shuttle transport device includes an overhead beam 114. The elevated beam 114 and one of the pair of elevated columns 116 mounted on the optical table 26. A shuttle or slide f is mounted on the beam 14 and moves along the beam 114. A linear motor i2〇g 114 is actuated to drive the shuttle 118 back and forth along the beam. A pair of relative closure configurations 117 are disposed on the overhead beam 114 and are coupled to the excess movement of the PLC stop shuttle 1 1 8 . The linear motor 120 also programmed the PC 34 to produce 100 readings and wafer details. Love 1 07 ° 1. Camera 丨 Image. L reads the shuttle i from the selection 22, including: An: 1 1 8 A: installed in the beam f limit open 38 to control the control of the -27- 201009974 and is controlled by the PLC 3 8 As will be described later. Figure 15 shows in more detail the shuttle or slider comprising a sliding plate 122 secured to the die plate 126. The true grain plates 126 extend orthogonally from the sliding plate 122. A number of apertures 1 28 whose true opening is upward. The vacuum tube 118 is connected to the operability of the vacuum plate 124 (shown in the figure) to position the die when the die is 1 24 φ empty. The colloid block 132 is also disposed on the die plate 126 to provide a storage area, and the picker head 78 is programmed for sampling. Once stored, the die can be lifted from the die plate 126 overhead beam 114 on the support assembly 26, and the shuttle 118 can be moved from a position where the vacuum plate 124 can be self-granulated. The position where the elevated beam member 1 1 8 is moved can be lifted by the crystal celite plate 124 as will be described later. The grain arrangement combination 22 grain arrangement combination 22 (Fig. 16) configures the die and places it in a desired position on the liquid crystal polymer assembly 10, the carrier being clamped. The die placement assembly 22 includes a frame 138 mounted on a resisting | optical table 126. In the present invention, 1 18 . The shuttle 1 1 8 empty plate 124 is fixed to the crystal: the empty plate 124 defines the operation 1 3 0 is installed on the lower part of the shuttle ί and the vacuum pump (the appropriate true when it is on. The colloid block 132 is used to arrange other crystals there) The granule removes the colloidal block 132, such that once the crystal 1 1 4 is received from the wafer ejector head 78, the shuttle [arrangement assembly 22 can be connected from the traverse to the shuttle 1 1 8 to the I ( LCP ) carrier or In the support platform or the embodiment of the clamp assembly 16 described later, the frame -28-201009974 138 is granite. The frame 138 has a bed portion 14 and an upright portion 134, as any. The spacer 136 is disposed at the bed portion 140. The cross rolling combination 142 is mounted on the spacer 136. The rolling combination 142 is configured to be in a loading position (shown in Fig. 16) in which the carrier is loaded and an arrangement position in which the crystal grains are arranged on the carrier 10 ( Rolling between the panels. The clamp plate 144 is mounted on the cross-roll combination 142 and is displaceable along the X-axis indicated by the arrow shown in Figure 16. Carrier clamp or clamp combination 146 (post As described above, the fixture plate 142 is mounted to position the LCP carrier 10 for die bonding. The grain arrangement assembly 22 includes a carrier loading door 32 that is disposed on the bed portion 140 and mounted to the receiving frame 24 (Fig. 3) of the combiner 16 via the bracket in to allow the carrier 1 to be loaded into the fixture 146. The arranging head assembly 160 is mounted on the mounting plate 162 as shown. The mounting plate 162 is secured to the upright portion 34. The arranging head assembly 16 is configured to lift the die from the shuttle member 8 and position it in The carrier arrangement 22 also includes a void gas heating gas combination 164 (described later) to assist the bonding of the die to the carrier 10 held in the clamp 146. The placement head assembly 160 includes a placement head ι68 and Arranging the camera and associated optics 166. Layout heads 168 Figures 18 and 19 show a closer view of the placement head 168. The placement head 168 includes a placement head mounting block combination 1 2 3. Arrangement head mounting block combinations 123 is affixed to the upright portion 134 of the frame 138 via the mounting plate 162. The Z-axis table 125 is mounted on the block assembly 123 and is limited to being displaced along the Z-axis along -29-201009974. For this purpose, the Z-axis stepper Motor 182 is secured to block assembly 123 via bracket assembly 133. Z-axis stepper motor 182 has Operate the Z-axis table 1 2 5 push rod 1 3 5 to push the Z-axis table 125 along the Z-axis with respect to the block combination 123. The Z-axis stepper motor is operated under the control of the plc 38 via a suitable controller 182. The Y-axis table 127 is mounted on the Z-axis table 125 and is limited to be displaced along the gamma axis (i.e., operatively vertical). For this purpose, the gamma-axis stepper horses 180 are secured via the bracket assembly 137. Connected to the Z-axis stage 125. The push bracket 139 is fixed to the Y-axis table 127 and engages the push rod 141 of the Z-axis table 125 via the compression spring 143. A linear encoder 145 is mounted on the Z-axis stage 125 as shown. The scale band 147 is affixed to the gamma stage 127 and will be read by a linear encoder 145 that is coupled to the Plc 38 to provide position feedback along the Y axis. The X-axis table 129 is mounted on the Y-axis table 127 and is limited to being displaced along the X-axis. For this purpose, the adjustment block 149 is fixed to the Y-axis table 127. A pair of X-axis micro-drivers 176 are secured to the adjustment block 149 and engage the X-axis table 129 to provide adjustment of the X-axis table 129 along the X-axis relative to the Y-axis table 127. The X-axis micro-drive 176 is coupled to the PLC 38 via a suitable controller to control the degree of adjustment of the X-axis stage 129. The connector block 151 is fixed to the X-axis stage 129. The elastic device 172 (which may be a T-type elastic device) is then connected to the connector block 151. The appliance 1 72 defines a recess that receives the die arranging head 丨 7 , such that the die arranging head 170 extends from the appliance 172 portion. Portions of the die arranging head 170 from the appliance 172 extend so that a portion of the head 170 can be received between the retaining plates 150 of the jig -30-201009974 146 as described below. The die placer head 170 is ceramic and defines an aperture 153 that is in fluid communication with the vacuum tube 186. The vacuum tube 186 is connected to a vacuum pump under the control of the PLC 38. The shape and size of the die placer head 170 is adjusted to receive the die from the wafer 6 that is operatively held on the vacuum plate 76. At that time, the PLC 3 8, via a suitable controller, operates to remove the vacuum applied to the vacuum panel 76 and applies a vacuum to the dispenser head 170 via the tube 186 such that the die φ is permeable to the head 170. The air heater tube 155 is connected to the hot air supply nozzle 600 of the heater valve assembly 602 of the air heater assembly 164 (Fig. 20). The air heater tube 155 is coupled to the die distributor head 170 to heat the die distributor head 170 such that the die can be bonded to the laminate film 12 of the carrier 10. The angle motor 161 is also mounted and secured to the connector block 151 via the X-axis table 129. Actuation of the diagonal motor 161 by the PLC 38 via a suitable controller causes the die arranging head 170 to pivot about the angle of the Y-axis. An angular movement spring 131 that secures φ to the X-axis table 129 is also provided, as shown, to offset the angular movement of the arranging device 170 against the drive of the motor 161 to ensure smooth operation thereof. Thus, the programmable PLC 38 allows the head 170 to be positioned against the laminate film 12 and heated to bond the die to the laminate film 12 when the insert 152 of the clamp 146 is properly positioned in the clamp 146. Air Heater Combination 164 The air heater assembly 164 is mounted on the cross rolling assembly 142 to direct heated air to the carrier 10 held in the clamp 146 at -31 - 201009974. This assists the bonding of the die to the thermoset laminate film 12 on the carrier 10. The air heater assembly 164 is shown in more detail in the figures. The air heater group 164 includes a heater mounting plate 6 04 (Fig. 20). The air treatment heating 6 06 is mounted on the mounting plate 604. The air treatment heater 606 receives an electrical power supply at 608 electrical box 614 (Fig. 16). The air treatment heater 706 is in the form of a strip having a cold air supply 610 at one end, such as a heater valve assembly 602 mounted on the opposite end of the air supply 606 on the air treatment heater 606. The thermocouple 612 is disposed in the heater assembly 602 to provide a signal to the PLC 38 to assist in the control of the heater valve assembly 602 through the electrical box 614 (Fig. 16). Hot air supply spray 600 and hot air steering tube 616 are coupled to heater valve assembly 602. A pneumatic actuator 618 is mounted on the heater mounting plate 60 to control the operation of the heater valve assembly 602 via the connecting rod 620. Air Control Actuation 618 is operatively coupled to PLC 38 via a suitable controller as described below to effect hot air exit from heater valve assembly 602. Arranging the Camera and Optics Combination 166 Arranging the Camera and Optics Combination 166 allows the PC 34 to position the die front head 170 above the carrier 10. The camera and optics assembly 1 66 is mounted on the camera and optics set bracket 622 (Fig. 16), which is then attached to the mounting plate 162 on the upright portion 134 of the granite frame ι38. The combination of the camera and the optics 166 and the splicer is similar to that shown in the above-described wafer camera and optics 82 from the thermally cooled valve to the nozzle. Therefore, the same reference numerals are used to refer to the components of the combination 166. Each camera 102 is coupled to the touchpad PC 34 such that the image of the clamp 146 and portions of the vehicle 10 can be displayed to the operator. The touch panel PC 34 is programmed to communicate with the PLC 38 as soon as the PC 34 discriminates the ink outlet 14 in the laminate film. The discrimination of the ink outlet 14 allows the PC 34 to control the PLC 38 so that the carrier base 15 (Fig. 2) and the ink outlet 14 serve as the arrangement basis. Therefore, the PC 34 can judge the correct arrangement of the crystal grains of the laminated film 12 to be bonded to the carrier 10 as described above. Each of the dies 8 typically has a base at each end thereof and can be imaged by the camera 1 〇 2 . Since a pair of cameras 102 are used to "see" the base, the PC 34 can determine the coordinates of the individual bases relative to one another. This allows adjustment of the head 170 to ensure that individual dies are placed on the carrier 10 in alignment with each other. Clamp Combinations β Figures 21 and 22 show the clamp combination 146 in more detail. Air-controlled operation of the base clamp 146. It includes an elongate clip 148 in which the carrier 10 can be received. In particular, the insert 152 can be housed in the clip 148. The carrier 1〇 is mounted on the insert 152 having the position concealed 157 to ensure proper positioning of the insert 152. Clamp assembly 146 includes an insert stop 156 at the end of clip 148. The proximity switch 159 is mounted on the stop 156 to generate a signal receivable by the PLC 38 when the insert 152 reaches the stop 156. The clamp assembly 146 includes a pair of elongate-33-201009974 holding plates 150 mounted on the clip body 148 and defining an access spacing 624 having a sufficient width to stack the head integrated circuit 8 in the carrier 10. The positioning diaphragm 625 on the layer film 12 is positioned in the clip body 148 and is configured such that the film 625 and the insert 152 are displaced toward the retaining plate 150 or away from the retaining plate 150 by air supplied through the air guide 1 such that when the clip is specifically 148 accommodated When f is inserted, the diaphragm 625 can be actuated to urge the carrier 10 against the retaining plate 150, which provides the space required to position the integrated circuit. Thus, under the control of the weir 38, when the insert 152 is inserted into the clip body 148, the controllable fitting 158 provides air supply to the diaphragm 155 to urge the carrier 10 to the air control plate 150 such that during deployment of the integrated circuit 8 The carrier 10 is in position. A handle or knob 154 is secured to the insert 152 to assist in maneuvering the carrier 10 between the clamp plates 150 prior to clamping the molybdenum 10. In general, the program performed by the combiner 16 can be summarized as follows: β • Scan the serial number of the carrier 10 mounted on the insert 152 and load it into the jig 146 as described above so that the laminated film 12 is set. The attachment surface is substantially flat. • The carrier 10, along with the insert 152, moves to the camera and optical 166, along with the PC 34, for positioning the base position on the surface of the carrier to provide the first die 8 to be disposed on the surface of the carrier. The wafer is scanned and loaded into a vacuum and heater plate assembly 76. The combiner 16 determines the actual thickness of the laminated film 12 to be attached to the carrier 10 using the input command file or wafer associated with the wafer 6. The die allows 〇626. Between the 152, the PLC is controlled by the gas against the carrier. on. Tulai, and -34- 201009974 its location. • Once the die 8 is released from the wafer 6 and transported to the die placement position, aligned and attached to the laminate film. How to achieve this will be described with reference to the relevant components. • Once the die 8 is aligned, it is lowered into contact with the laminate film 12 and the set temperature is applied. • Once in contact with the laminate film 12, the die 8 is heated for a predetermined length of time to attach the die 8 to the laminate film, which is typically a thermoset film. These steps are performed by various components controlled by the PLC 38 under the supervision of the PC 34 of various controllers. In order to describe how the above components perform these steps, it is necessary to first refer to the high-order data flow diagram shown in Fig. 23. The diagram shown in Figure 23 shows a method or system for controlling the operation of a printhead combination machine or combiner 16 for a combined printhead integrated circuit on a carrier, in accordance with an embodiment of the present invention, and a system . In this embodiment, such a system is indicated by reference numeral 630. System 630 includes a Manufacturing Execution System (MES) server 632 and an industrial computer 634, executing a printhead combination machine (PAM) application software for combiner 16. The MES server 63 2 and the industrial computer 63 4 are collectively referred to as a remote monitoring system. In this embodiment, the MES server 632 provides the wafer map and operational commands to the PLC 38 of the combiner 16 as described above. The industrial computer 634 (equivalent to the PC 34) receives data via the Ethernet module of the PLC 38. This -35- 201009974 data typically includes the position or shaft coordinates, operational response, program variables, or the like of the individual actuators or actuators described above. In addition, PLC 38 also sends state machine operations to industrial computer 634 as shown. The data sent by the PLC 38 to the computer 634 may include the number of dies that are consumed from the wafer 6, the order in which the dies are arranged, the identification code for each wafer scan, the position of the die and the carrier base, and the start and stop cycles. Time, operator identity, vehicle bar code, status of the parts used, etc. ❿ Industrial computer 634 and MES server 632 exchange instructions and information regarding the operation of combiner 16, typically via TCP-IP » MES server 63 2 provides information on which die on the loaded wafer will be mounted on Information on the wafer map, program parameters, etc. on which carrier is given to PLC 38. As shown, the PLC 3 8 is configured to define a number of state machines required to control the operation of the combiner 16 via appropriate software instructions. This PLC 3 8 defines an arrangement state machine 636 that controls the operation of the die arrangement 22, a transport state machine 63 8 that controls the shuttle delivery assembly 20, and a selection state machine 640 that controls the die selection combination Φ 18. The PLC 38 also defines a motion control state machine array 644 that is responsible for controlling the associated actuators and actuators that are represented by different components and are collectively designated 637. A supervisory state machine 642 responsible for the operational safety and supervision of the combiner 16 is also shown.

Figure 24 shows a control combiner 1 executed by various components under control of a PC 34, PLC 38, operator and/or remote monitoring system (RMS, indicated at 408), in accordance with one embodiment of the present invention, as described above. A general flow chart of the method or procedure of 6. As mentioned above, RMS 408 includes MES 632 and industrial computer 634. It will be appreciated that some of the steps are performed automatically by PC-36-201009974 34, PLC 38 and RMS 408, while others require input from the operator. References to the reference symbols representing a particular method step are meant to refer to the individual blocks indicated by such reference numerals in the drawings. Therefore, the methods included in the present invention are not limited or subject to the specific method steps referred to in this manner. Those skilled in the art will appreciate that there may be other methods underlying the present invention that may exclude some or include additional steps. φ shows the general steps of the combiner 16 having a die selection combination 18, a die transport mechanism 20, and a die arrangement combination 22. The remote monitoring system 408 is configured to signal communication with the PLC 38, as described above, and allows the remote to monitor and control the operational status of the combiner 16. The RMS 408 is also capable of tracking the carrier and wafer and which carrier the die will be placed on. RMS is an integrated position for quality and assurance control of the combination of vehicles. As shown, the program includes a wafer loading phase 398, a carrier loading phase 412, a die attach phase 424, and a processed carrier removal phase 436. • Wafer loading stage 3 98 has wafer removal from a clean cartridge that stores the wafer (block 400), loading the wafer into combiner 16 (block 402), and PLC 38 reading the wafer barcode ( Step 404). In the illustrated embodiment, a crystal map (block 406) is retrieved from remote monitoring system 408 by PLC 38, as described above. This wafer map typically provides the location and selection order of 1C on wafer 6. The wafer 6 is then placed on the wafer heating and vacuum panel 76. The carrier loading phase 412 has the step of removing the carrier 10 from the tray (block 414), after which the bar code of the carrier 10 is scanned by the PLC 38 and sent from -37 to 201009974 to the remote monitoring system 408. In the illustrated embodiment, the carrier 10 is constructed of a liquid crystal polymer (LCP) substrate, as shown in some of the blocks. The remote monitoring system 408 checks whether the carrier has a quality control test that has been previously passed thereon before commanding the PLC to combine the die thereon. If the carrier passes such a test (block 408) and is of sufficient quality, the operator removes the protective liner of the overlay stack 14 (block 4 20 ) and loads the carrier into the combiner 16 (block 422) ). The die attach procedure 424 is followed by the combiner initialization (block 426) and the wafer is scanned to determine the location of the die based on the wafer base map from the remote monitoring system 408 (block 428). The die is then removed from the wafer (block 43 0 ) and transported to the layout assembly 22 where the die will be bonded to the carrier (block 432). The selection and placement steps are repeated until the carrier includes the required number of dies specified by the wafer map (block 434). The processed carrier removal stage 436 includes scanning the completion of the 1C with the defined printheads. (Block 438) is sent and a quality report is sent to the remote monitoring system at block 44 0. The carrier 10 is then moved to the unloading position (block 4 42) where the operator can remove the carrier 1 from the combiner 16 and visually inspect the carrier 1 区 (block 444). The finished carrier 10 having the print head is then placed in the tray (block 446). Figure 25 shows the specific steps performed by the die selection combination 18 during the operation of selecting the die from the wafer 6. The method typically begins with the operator loading the wafer 6 into the combiner 16, as shown by block 200. Wafer 6 is positioned on wafer positioning combiner 48 as described above. -38- 201009974 The combiner 16 initializes (block 202) and scans the wafer bar code (block 204) under the control of the PLC 38 using the scribing reader 100. Unsuccessful scanning of the PLC 38 configured as a bar code (determined at decision block 206) causes the PLC 38 to unlock the wafer loading gate of the combiner 16 (block 208) so that the operator can remove and/or reposition the crystal. Round on the combiner 16 (block 21 0 ). The PC 34 is configured to control the wafer camera and optics 82 to check the starting point or reference (block 2 1 2) marked on the wafer as a reference for the wafer substrate map used by the PLC 38. Point to position individual dies on wafer 6. • Once the camera and optics 82 have been focused at 214, the PLC 38 checks the position of the stage 92 and the driver 98 for the die picker 81 and heater 90 (block 216). If the die picker 81 fails the check, the combiner 16 is reinitialized and may issue a warning to the operator. If the die picker 81 passes the check, it is lifted (block 218) and moved to the reference point indicated by the map lock. (Block 220) 〇PLC 38 uses the camera and optics 82 β to find the reference point on the wafer 6 (block 222) » If the PLC cannot locate the reference point, the wafer loading gate is unlocked, allowing the wafer 6 to be picked up. The optics 82 inspect the wafer (block 224) and the coordinates of the selected die (block 226) are requested by the PLC from the map. Failure of either of these two steps will unlock the wafer access door as shown. If a coordinate is provided, the die picker 81 is moved to the correct position (block 228), otherwise the coordinates are requested again. Once the die picker 8 is in place, the selected surface 86 (block 230) is lowered and contacted with the die and the wafer is heated by the heater 90 (block 232) to loosen the adhesion of the die to the wafer 6. . Then, by -39-201009974, the vacuum gripping die (block 234) is created by selecting the surface 86 as described above, and the die picker (block 238) is raised to remove the crystal chip from the wafer 6. grain. The die selection combination 18 then waits for the die transport mechanism 20 (block 240) to be positioned, then lowers the die onto the shuttle 1 18 (block 242) and releases the die by removing the vacuum (block) 244) ° If additional dies must be removed from the wafer, raise the die picker again (block 246) and repeat the procedure as shown. If the map does not require the selection of additional dies 'grain picker return to the wait position' to load a new wafer into the combiner 16 (block 2 50 ). Figure 26 shows an embodiment of a method performed by the die transport mechanism 20. Similar to the die selection combination described above, the program begins with initialization of mechanism 20 (block 260). The shuttle 1 18 waits until the picker 81 (block 262) until the picker moves to a position above the shuttle 118 (block 2 64). Once the die picker 81 is in place, the vacuum plate on the shuttle 118 receives the die and grips the die by creating a vacuum (block 266). The shuttle 118 waits for the picker head to rise (block 268), after which it is transported along the overhead beam 114 to the die arrangement 22 (block 270). The placement head assembly 160 includes a die arranger 170. The shuttle 118 waits for the arranging device 170 to be in place (blocks 272 and 274), after which the vacuum plate releases the grasped die (block 276) and remains in place (block 278) so that the picker 170 can pick it up. Start. When the picker 170 removes the die, the shuttle moves back to the die selection combination 18 to repeat the process (block 280). Figure 27 shows an example of one of the -40-201009974 method steps for the work performed by the die placement assembly 22. The program begins with a combination 22 initialization (block 300), after which the carrier 1〇 is loaded into the fixture 146 through the carrier loading gate 119 and clamped in the fixture 146 (block 304). The carrier 1 is then moved by the cross-roller 142 to the reference position at block 306. Arranging the camera and optics 166 scans the base index 15 of the carrier 1 to align the grains thereon. If the base mark is not found (decision block 308), station 142 moves carrier 1 to the unloading position (block 3 1 2). Φ If the base mark is not found, the stage 142 moves the carrier 1 to the arrangement position (block 314) where the combination 16 is placed to place the die on the carrier 1〇. The placement head 168 waits for the shuttle 1 1 8 to deliver the grain selected from the wafer as described above (block 314). Once the shuttle is in place, the placement head 168 is lowered (block 316). If the die is properly positioned (decision block 318), the die arranger 170 (block 320) is lowered to grip the die (block 3 2 2 ). Otherwise, the arrangement combination 160 moves back to the arrangement position. Once the die 'grain arranger 170 has been gripped (block Φ 324) and the shuttle shuttle 118 is checked for a clean pluck (block 326) and moved back to the die selection combination 18 (block) 3 2 8). The die arranger is moved to a position above the carrier 10 (block 330) and the gripped die and carrier (block 332) are aligned with the optical member 160 via a camera. The die arranger 170 is lowered at 336. The die arranging head 17 is then placed on the carrier 10 via the spacing 159 of the clamp 146. The air heater assembly 164 heats the die and carrier to hold the die to the thermoset stack 14 (block 3 3 8 ), after which the die is cooled (block 340). Arranging the camera and optics 166 before raising the placement head 168 (block 344) and moving to the next die placement 201009974 then allows the PC 34 to inspect the placement of the die on the carrier (block 342). Once the head 168 is removed (block 346), the PLC 38 can check the final position of the die (block 3 4 8) and move the carrier 10 to the unloading position (block 350) 'where the other carrier is loaded Front (block 3 54 ), the operator can release the carrier (block 352) and remove it from the housing 24 of the combiner 16. Reference Operator Interface Figure 28 is a schematic representation of the left portion of the combiner 16 of Figure 3, showing the operator interface in more detail. The interface includes a touch panel PC 34 and a control button table 36. Warning beacon 464 (symbol 35 in Fig. 3) and emergency stop buttons 460 and 462 are also displayed. Button 460 is the operator emergency stop button ' and button 462 is the maintenance emergency stop button. The carrier loading door 119 is disposed on the front plate 461 of the enclosure 24 of the combiner 16, as shown. The granite frame 138 of the die arrangement 22 can be seen through the load gate 1 19, and the fixture plate 144 and clamp 146. Electrical Member Fig. 29 shows the electrical enclosure behind the combiner 16 in the open state (Fig. 3). The control system of the combiner includes a PLC 38, which is a Mitsubishi® FX3U-64M PLC unit 645, having a FX2N-2LC temperature control block 646 in the form of a module, an FX3U-ENET Ethernet interface module 647 and FX0N-3A analog I/O special function block or module 648 and FX2N-32CAN controller area network (CAN) serial bus -42- 201009974 block 649 expansion block. The PLC 38 is connected to the PC 34 by the Ethernet switch 650 shown in Fig. 32. The PLC 38 receives programming instructions from the PC 34 such that the PLC 38 can control the operation of the die selection combination 18, the transport mechanism 20, and the die placement combination 22. A lighting controller 470 (Fig. 29) is included to control the LED adapters 1 to 8 of the camera and optics 82 and 166. Controller 470 is a defensive (Gradasoft) PP610 lighting controller. And includes a vacuum pump 472 for providing various vacuums required for the wafer and die of the associated component of the associated assembly 16. The vacuum pump 472 is a Busch dry running rotary vane type. It will be appreciated that the various components are coupled together via electrical and/or pneumatic connections (blocks 420) housed in line 47 1 . Rail 473 provides a mounting location for the different components housed in enclosure 44. Thus, the physical connections between the components are schematically indicated, as those skilled in the art will be aware of the required links. A motor shaft controller, indicated by symbol 474, is coupled to PLC 38 to assist in controlling the different motors and drives of the components of combiner 16. A detailed description of this motor control is provided below. Power supply 476 is configured to provide a 160 volt DC supply to operate vacuum pump 472. Power supply 496 is configured to provide 5, 9, 15 and 24 volt power supplies to the combined relay and motor contactors. The relay 478 and the fuse 480 are provided to the connection and protection of the electrical components powered by the power supply 476, and the relay 492 and the fuse 494 provide the connection and protection of the electrical components powered by the power supply 496 from -43 to 201009974. . Relay 482 provides a connection of the heater elements of combiner 16. It can be appreciated that different relays allow the PLC 38 to activate and deactivate individual components. A 48 volt power supply 484 and an Ethernet switch 486 (shown as 650 in Fig. 32) are shown. Circuit breaker 488 provides overcurrent protection of the components. Motor contactor 490 is coupled to controller 474 to allow PLC 38 to control the various motors of the combiner. The safety mute controller 498 and the door open switch controller 5 00 are disabled by the door, such as the carrier loading door 1 1 9 when the combiner 16 is activated, to disable the combiner to provide security. The pneumatically controlled enclosure 5〇1 forms part of the pneumatically controlled closure 46 of the combiner 16 (Fig. 3). Motor Controller Figure 31 provides a schematic representation of the motor control work performed by the PLC 38. As described above, the PLC receives wafer maps and associated operational parameters from a remote monitoring system (or PC 34) having an MES server 632 and an industrial computer 634. The various motors and drives described above are controlled by the PLC 38 via individual motor shaft controllers that are collectively indicated by reference numeral 474. The arrangement head 168 as described above includes actuators 161, 176, 180 and 182. The inventors have found that an Akribis linear motor 180 with a die (] Eimo) drive 474.1 is suitable for this application. Similarly, a Zaber 2 step stepper motor 176' having a Copley drive 474.2 is used along with a C〇pley driver 474.4.

Zaber 2nd stepper motor 182. The angle motor M1 is also a Zaber 2 step stepper motor with a Copley drive 474.3. -44 - 201009974 The grain transport mechanism or shuttle transport mechanism 20 includes a linear motor 120, which is an Akribis AC servo motor with an Elmo actuator 474.5. Similarly, die selection assembly 18 includes actuators 66, 96, 62 and 60' as described above. Wafer positioning assembly 48 has two stages that are actuated by nano-motion piezoelectric track-type motors 60 and 62 having a nanomotion driver 4 74 . The wafer rotary motor 66 is a Zaber 2 step pacer motor having a Copley drive 474.6, and the selector head vertical motor 96 is a Zaber 2 step motor with a Copley drive 474.7. It should be understood that all of the drivers 474 provide position feedback information for the drive to the PLC 38. Air Control Enclosure 46 Fig. 30 shows the air control enclosure 501 (portion of the enclosure 46 in Fig. 3) of the combiner 16 in the open state, showing the air control members used in the embodiment of the combiner. Immediately after the main shut-off valve 502 filters impurities from the air supply, use the SMC AF40 Series Air Filter 5 04. The filter 504 has a floating automatic discharge system. The combiner 16 also includes an SMC AFM series mist separator 530 to filter particles from the supply, and then an SMC AFD series micro-mist separator 532 to filter smaller particles that may pass through the separator 530. A SMC® series mist separator 514 is included to absorb fine oil particles from the gas control system of the combiner 16. The direct vent filter 51 8 is included from the SMC SF series to remove any remaining particles from the air control supply. Filter 518 includes a PTFE thin -45-201009974 membrane. A high purity valve 520 that operates various gas control components, and a membrane air dryer 534 are included to remove moisture. Pressure regulators 506, 510, 512, and 526 are used to regulate the pressure in various gas control systems. Isolation valves 502 and 528 are used to isolate individual gas control circuits from each other. The air control system is controlled by a PLC 38 using a solenoid valve 524 having a fluid sensor 516 that communicates fluid information to the pLC 3 8 . φ Safety The controller or PLC 3 8 includes several safety features that protect the combiner 16. The carrier and wafer 6 are not damaged and the operator is not injured. Therefore, P L C 3 8 is configured to monitor the operational state of the combiner 16 by the various components described above. If a potentially dangerous situation is detected, the PLC 3 8 is configured to disable the combiner 16. Hazardous conditions may include unintended electrical fluctuations, pressure fluctuations, unintended operational parameters, and PLC 38 senses foreign objects in the vicinity of moving objects of combiner 16 and the like. φ Figures 32 to 37 show circuit diagrams of interconnections between some of the above-described electrical components. It will be appreciated that the circuit diagram is depicted in a manner that only indicates some of the connections. The circuit diagram is intended to assist those skilled in the art in explaining the interconnections between the components, rather than providing an exhaustive circuit description. In the circuit diagram, like reference characters indicate similar connections unless otherwise indicated. A primary safety relay 668 is shown in Fig. 35 (indicated by reference numeral 492 in Fig. 29). Relay 668 is an OMron G9SA-321-T safety relay unit&apos; and is coupled to emergency stop buttons 460 and 462 as shown. Relay 668 also has a -46 - 201009974 link to PLC 38 at 666 as shown. Figure 36 shows the other components of the safety system of the combiner. The door mute controller 498 is coupled to the door switch controller 5 00, as shown, and to the door safety switch 670. The door switch controller 500 is configured to communicate with the magnetic door switches 6 72, 6 74 and 6 76 as shown. If the door panel of any combiner is open during operation, the safety system automatically deactivates the combiner to prevent injury and/or damage. Reference Computer Control Figure 32 shows the control system depicting a function of the optical components of the PC 34 control combiner 16. As can be seen, the camera 1 1 1 is selected and the camera 1 16 is placed in direct connection to the PC 34 with a live wire connection 652. As previously described, the PC 34 is configured to control the operation of the cameras 1 11 and 1 16 . Wafer line reader 100 is also coupled to P C 34' as shown by a suitable U S B connection. The PC 34 has an RS232 communication port 654 whereby it can communicate with a pair of LED lighting controllers 470 (Fig. 33). Figure 3 3 shows the lighting controller 470 in more detail. The lighting controller 470.1 is configured to control the LED 660 for the picker head 78 to assist in the detection of the camera 112. Controller 470.1 is also configured to control LED 662 for placement head 1 70 to assist in the detection of camera 166. The lighting controller 470.2 is configured to control the LEDs 664 for side lighting of the placement head 170. Figure 32 also shows the connection between the PC 34 and the Ethernet switch 486. Switch 486 is connected to PLC 38 at 664 and to 666 to Ethernet. -47- 201009974 Figure 34 shows the control system of the combiner, including PLC 38, which is the Mitsubishi FX3U-64M PLC unit 645, with FX2N-2LC temperature control block 646 and FX3U-ENET Ethernet in modular form. Interface module 647 and FX0N-3 A analog I/O special function block or module 648 and FX2N-32CAN controller area network (CAN) sequence bus block block 649 expansion block. Figure 37 shows the mutual control between the temperature control module 646 of the PLC 38 and the individual heaters and thermocouples of the heaters 90 for adjusting the φ and controlling the wafer 6, the air heater combination 164 and the lifting head 78. even. As shown, a temperature module 646 is responsible for controlling the heater 匣 684 for the die picker head 78 via the relay 682 and the thermocouple 686. Similarly, temperature 匣 690 of wafer support 63 is heated via relay 680 and thermocouple 688 to provide temperature feedback. The second temperature module 646 is responsible for controlling the heater 匣 698 for the die placement head via the relay 692 and the thermocouple 694. Those skilled in the art will appreciate that the above-described embodiments may include various modifications that are still within the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Preferred features, embodiments, and variations of the present invention will become apparent from the Detailed Description of the Detailed Description of the <RTIgt; The detailed description should not limit the scope of the inventive content of the invention in any way. For a detailed description, reference will be made to the following figures: Figure 1 shows an example of a wafer defining a complex integrated circuit (1C) or a die; -48- 201009974 Figure 2 shows a printed head integrated circuit on which the head assembly circuit will be arranged or combined (IC) a perspective view of a carrier or test bed; Figure 3 shows a perspective view of an embodiment of a combiner that combines ic on a carrier; Figure 4 shows a 1C selected from a wafer in accordance with an embodiment of the present invention. a grain selection combination or a perspective view of a die picker; FIG. 5 shows a wafer positioning combination of the picker φ of FIG. 4 according to an embodiment of the present invention; FIG. 6 shows a fifth embodiment shown in FIG. A side cross-sectional view of the wafer positioning assembly, FIG. 7 shows a bottom view of the wafer positioning combination shown in FIG. 5; and FIG. 8 shows a wafer selection and lifting of the fourth drawing according to an embodiment of the present invention. a perspective view of the head; Figure 9 shows a further perspective view of the die selection and lifting head shown in Figure 8; φ Figure 10 shows a further perspective view of the die selection and lifting head shown in Figure 8; Figure 11 shows the selection of the "A" in Figure 10 and the grain selection of the lifting head. An enlarged view of a portion of the device; FIG. 12 shows an embodiment of a camera configuration of the die selection combination of FIG. 4; and FIG. 13 shows a perspective view of the wafer line reader of the die selection combination of FIG. Figure 14 shows a perspective view of a transport apparatus in the form of a die transport combination having a combiner of Figure -49 - 201009974 according to an embodiment of the present invention; Figure 15 is a view showing the die transport combination of Figure 14 a closer view of the component carrier or the shuttle; FIG. 16 shows a die arrangement of the die combiner of FIG. 3 in accordance with an embodiment of the present invention, the arrangement being in the carrier loading position; Fig. 18 is a perspective view showing a die arrangement head of a die arrangement according to Fig. 16 of an embodiment of the present invention; Fig. 19 shows Further perspective view of the die placement head of the die arrangement combination of Fig. 16; Fig. 20 shows the air heater combination of the die arrangement of Fig. 16 according to an embodiment of the present invention; To locate the second image in the combiner A perspective view of the clamp mechanism of the test bed or φ carrier; Figure 22 shows a side cross-sectional view of the clamp mechanism of Figure 21; and Figure 23 shows a schematic diagram of the high-order data flow for controlling the combiner of Figure 3. Figure 24 shows a diagram of the high-order method steps for combining the printhead circuit on the carrier of Figure 2 using the combiner of Figure 3; Figure 25 shows the block representing the method steps for selecting the die from the wafer; Figure 26 is a block diagram showing the method steps for transporting the grain between -50-201009974 in the combination of die selection and die arrangement; Figure 27 shows the carrier on the carrier in Figure 2 Block diagram of the method steps; Figure 28 shows an embodiment of the operator interface of the combiner of Figure 3; Figure 29 shows the electrical enclosure of the combiner showing the internal electrical components in the open position; Figure 30 shows the pneumatically controlled closure of the combiner showing the pneumatic control member in the open position; Figure 31 shows a schematic diagram depicting the interaction of the electrical components for motor control of the combiner of Figure 3: Figure 32 shows the combination Circuit of touch panel PC and optical component Figure 33 shows the circuit diagram of the LED controller of the combiner; Figure 34 shows the circuit diagram of the arrangement of the main controller of the combiner; 〇 Figure 35 shows the circuit diagram of the main safety relay of the combiner; Figure 36 shows the combination A circuit diagram of one embodiment of the safety system of the device; and a circuit diagram of the temperature control circuit of the combiner shown in Figures 7A and 7B. [Main component symbol description] 6 : Wafer 8: Print head 1C or die -51 - 201009974 1 〇: Carrier 1 1 , 1 1 a, 1 1 b : Micro mold 12 : Laminated film 1 3 : Position Opening 14: Base 15: Carrier Base 1 6: Printhead Combination Machine or Combiner 1 7: Wafer Positioning Combination 18: Die Selection or Die Picker 20: Transport Equipment or Grain Transfer Mechanism 22: die placement combination 2 4: support combination or structure 26: from horizontal optical table 27: support frame 2 9: side window plate φ 2 8 · · overhead 3 2 : carrier loading door 3 5 : optical beacon 3 6 : Control Board 38: Programmable Logic Controller (PLC) 40: Ion Bar 42: Fan/Filter Configuration 44: Electrical Enclosure 46: Air Control Enclosure - 52 - 201009974

34 : PC 4 8 : Wafer positioning assembly 50 : Block mounting member 52 : Base plate 5 4 : Displacement combination 5 5 : Vacuum manifold 56 : First stage φ 57 : Vacuum tube 58 : Second stage 5 9 : Vacuum aperture 60: first piezoelectric motor 61: compression spring 62: second piezoelectric motor 63: wafer support plate assembly 65: bearing holder φ 66: step motor combination 67: rotary pin 68: power supply screw 69: bearing table 70 : Screw plate 71 : Heater plate 7 2 : Spring 74 : Heater 匣 7 5 : Spacer - 53 - 201009974 76 : Vacuum plate 77 : Supply pipe 7 8 : Grain selection and lifting head 7 9 : Thermocouple 80 : Elevated 8 1 : Elevated column 82 : Wafer camera and optical combination φ 83 : Connector arm 8 5 : Electrical box 8 7 : Bracket 89 : Rack 91 : Die picker head 9 1 : Vacuum aperture column 92 : Linear Translation stage 94: Linear encoder φ 96: Vertical step motor 97: Pick head plate 98: Micro driver 99: Drive carrier 1: Wafer line reader 101: Bracket 103: Scale tape 84: Vacuum Body 86: die contact surface -54- 201009974

9 3 ·· 88 : 90 : 95 : 114 : 102 : 1 04 : 106 : 107 : 108 : 109 : 110 : 111 : 113 : 115 : 116 : 118 : 117 : 119 : 120 : 121 : 122 : 123 : 124 : Sealing strip vacuum tube heater 匣 thermocouple overhead beam camera adapter tube body tube housing LED combination bracket cooling radiator camera video lens source overhead column shuttle or carrier limit switch configuration carrier loading door linear motor bracket sliding plate Place head mounting block combination vacuum plate -55- 201009974 125 : Z-axis table 1 2 6 : die plate 1 2 7 : Y-axis table 1 2 8 : aperture 129 : X-axis table 1 30 : vacuum tube 131 : angular movement spring Φ 132 : colloidal block 1 3 3 : bracket combination 1 34 : upright portion 1 3 5 : push rod 1 3 6 : spacer 1 3 7 : bracket assembly 138 : frame 139 : push bracket 10 1 4 0 : bed Part 1 4 1 : Push rod 142 : Cross rolling combination 143 : Compression spring 1 44 : Fixture plate 1 4 5 · Linear encoder 146: Carrier clamp or clamp combination 147 : Scale belt 149 : Adjustment block -56- 201009974 148: Clip specific 1 5 0 : Holding plate 151 : Connector block 152 : Insert 1 5 3 : Aperture 154 : Handle or Button 1 5 5 : Air heater tube _ 1 5 5 : Diaphragm 1 5 6 : Insert stopper 1 5 7 : Position 榫 1 5 8 : Air control fitting 159 : Proximity switch 1 6 0 : Place head combination 1 6 1 : Angle motor 162: Mounting plate. 164: Air heating gas combination 166 _·Placing the camera and associated optics 1 68: Placement head 170: Die placer head 172: Elastic device 176: X-axis micro-driver 180: Y-axis step Step motor 182: Z-axis step motor 1 86 : Vacuum tube - 57 - 201009974 408 : Remote monitoring system 460, 462 : Emergency stop button 461 : Front plate 464 : Warning beacon 472 : Vacuum pump 470, 470.1, 470.2: Lighting control 4 7 1 : Line φ 472 : Vacuum pump 473 : Rails 476 , 484 , 496 : Power supply 478 , 482 , 492 : Relay 4 8 0 , 494 : Fuses 486 : Ethernet switch 48 8 : Circuit open 490: motor contactor φ 498: safety mute controller 5 00: door switch controller 501: air control enclosure 502: main shutoff valve 502, 528: isolation valve 504: air filter 506, 510, 512, 526: Pressure Regulator 5 1 6 : Fluid Sensor 5 1 8 : Direct Exhaust Body Filter -58- 201009974 520 : High Purity Valve 5 2 4 : Solenoid valve 5 3 0, 514 : mist separator 5 3 2 : micro mist separator 534 : membrane air dryer 600 : hot air supply nozzle 602 : heater valve combination φ 604 : heater mounting plate 606 : Air treatment heater 6 1 〇: Cold air supply 6 1 2 : Thermocouple 6 1 4 : Electric box 616: Hot air steering tube 6 1 8 : Air control actuator 620 : Connection rod φ 622 : Camera and optics Assembly bracket 624: access interval 625: diaphragm 626: air duct 6 3 0: system 632: manufacturing execution system (MES) server 634: industrial computer 63 6: placement state machine 63 8: transport state machine 59- 201009974 640: State Machine 642: Supervisory State Machine 644: Motion Control State Machine Array 645: PLC Unit 646: Temperature Control Block 647: Ethernet Interface Module 648: Analog I/O Special Function Block or Module 649 : Controller Area Network (CAN) Sequence Bus Block 650: Ethernet Switch 652: Firewire Link 654: RS232 Communication 埠 660, 662, 664: LED 668: Main Safety Relay 670: Door Safety Switch 672, 674, 676: magnetic door switches 682, 680, 692: relays 684, 6 98: Heater 686 686, 688, 694: Thermocouple 6 9 0 : Temperature 匣 -60-

Claims (1)

201009974 X. Patent application scope 1. A combination of grain arrangement for arranging integrated circuit chips on a carrier' The combination comprises: a support platform having a clamping mechanism configured to clamp the carrier to the platform; At least one camera operatively directed to the platform to detect an alignment mark on the carrier: φ arranging device having a vacuum mechanism to extract the die from a supply mechanism, the arranging device having an actuator Pre-aligning the die with the carrier and aligning the die thereon, and a heater to heat the die prior to being disposed on the carrier; and a controller operatively controlling the clamping mechanism, The camera and the arrangement are arranged to assist in the proper placement of the die on the carrier. 2. The combination of the first aspect of the patent application, wherein the integrated circuit die is an ink jet print head die. φ 3- As set forth in the scope of claim 1, wherein the camera includes a camera module that is linked to the cassette by an adapter tube to focus the camera on the carrier. 4. The arrangement of claim 1, wherein the actuators of the arranging device comprise three stepper motors each independently responsible for vertical, horizontal and angular alignment of the die with the carrier . 5. The combination of parts of claim 1, wherein the actuators of the arranging device comprise a linear translation stage that moves the grains in a vertical direction to arrange the dies on the carrier. -61 - 201009974 6. The arrangement of claim 1, wherein the arrangement comprises a hot gas blower configured to direct hot gas to the die prior to arranging the die on the carrier . 7. The arrangement of claim 1, wherein the arrangement comprises an illumination configuration to illuminate the vehicle to assist the camera in detecting the alignment marks. 8. The combination of arrangements of claim 1 wherein the support platform comprises a self-leveling platform operated by the controller. -62-