TW201008952A - Silane based compound, method for preparing the same, and surface treating agent composition for copper foil including the silane based compound - Google Patents

Abstract

Provided is a silane-based compound represented by Formulae 1 through 4: (Formula 1) (Formula 2) (Formula 3) (Formula 4) wherein R1, R2, and R3 are each independently a C1-C3 alkyl group and R4 and R5 are each independently hydrogen or a C1-C5 alkyl group.

Description

201008952 VI. Description of the Invention: [Related Application] The priority of the present application is the Korean Patent Application No. 10-2008-0070080 filed on Jan. 18, 2008 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference. . TECHNICAL FIELD OF THE INVENTION The present invention relates to a silane-based compound, a process for the preparation thereof, and a surface treatment composition for a copper foil comprising the above-described decyl compound, and more particularly to a novel decane. A base compound and a method for producing the same, and a surface treatment composition for a copper foil containing the above-described decyl group compound. [Prior Art] A flexible copper clad laminate (FCCL) is a form of a printed circuit board (PCB), and its demand is increasing today. The FCCL is formed of two or three layers of a film in which polyacrylonitrile (P〇lyimjde) is laminated on a copper foil. When the accuracy of the wiring printed on the FCCL is increased, the accuracy of the surname is also increased. Therefore, it is necessary to reduce the surface roughness of the copper H. However, when the surface roughness of the copper foil is lowered, the peel strength between the copper foil and the substrate (for example, the polyimide film is lowered). In this regard, the means of peeling strength is used. The shop is usually made of a surface treatment agent for the purpose of strengthening (4) and the strength of the substrate, which is disclosed in Japanese Patent Application No. 1990-026097. However, with the use of a copper box in the PCB The physical property requirement 201008952 is tight, and there is still a need for a copper foil for a PCB formed by a surface-treated film having improved physical properties. SUMMARY OF THE INVENTION The present invention provides a novel fluorenyl compound (which Providing excellent peel strength between the substrate and the copper foil, and a method for preparing the same, and a surface treatment composition for a copper foil containing the fluorenyl compound. According to an aspect of the invention, the stone represented by Formulas 1 to 4 is provided Xi Xuan base compound: <Formula 1> 10

<Formula 2>

<Formula 3>

<Formula 4> 6 201008952 D iy I D\)U.

Wherein RrRs and R3 may each independently be an alkyl group of (^ to C3), and R4 and R5 may each independently be hydrogen or (^ to (: 5 alkyl).

According to another aspect of the present invention, there is provided a surface treating agent composition for copper foil comprising a selected from the group consisting of a decyl group compound represented by Formulas 1 to 4.

At least one compound of the group, and a solvent. &lt;Formula 1&gt;

&lt;Formula 4&gt; 201008952

Further, J may be independently a hydrogen or an alkyl group of (^ to ^. According to the m-plane of the present invention, a method of preparing a compound selected from the group consisting of the compound represented by Formula 1 to Formula 4 is provided. The method comprises the hydrazine alkyl compound represented by Formula 5 or Formula 7 and a compound selected from the group consisting of Formula 6, Sljecinic anhydride, 2,3-pyridinedicarboxylie anhydride, and trimellitic anhydride ( The compound of one of the groups consisting of 1,2,4-benzenetricarboxylic anhydride is reacted at a temperature of -10 ° C to 1 ° C: <Formula 1> r / &lt; Formula 2 &gt; 〇hr / &lt; Formula .3 &gt;; 201008952 j iy / jpii

4 &lt;Formula 4&gt;

&lt;Formula 5&gt;. 7 Bu/2 4

&lt;Formula 6&gt;

r/ Where RpRz and R3 can each be independent! Alkyl group to C3, 201008952 J 17 ! jpil and R_4 and R5 may each independently be hydrogen or an alkyl group of (C to C5). To make the above features and advantages of the present invention more apparent, the following specific examples, The present invention will be described in detail below with reference to the accompanying drawings. [Embodiment] The following description will be made in more detail based on an embodiment of the present invention, and a method for preparing a ruthenium alkyl compound and a copper drop surface treatment comprising the same. According to the present embodiment, the 'alkylene compound can be represented by the formula 1 to the formula 4. &lt;Formula 1&gt;

&lt;Formula 4&gt;

10 201008952

Wherein Ri, R2 and R3 may each independently be a C to C3 alkyl group, and 1^4 and 5 may each independently be hydrogen or a C to C5 alkyl group. The sulphur-based compound has a siloxane group at one end for forming a covalent bond with the copper foil and an imidazole group and/or an imide group at the other end. Among them, '&quot; rice sigma and/or saponin have a structure similar to that of a polyimide film, and thus the bonding strength with the polyimide film can be improved. Therefore, the bonding strength between the copper foil and the polyimide film can be improved. According to another embodiment of the present invention, &amp;, and R3 are each independently a methyl group or an ethyl group, and R4 and Rs may be hydrogen. 2

According to another embodiment of the present invention, the surface treatment composition for copper foil may comprise at least one compound selected from the group consisting of the fluorenyl compounds represented by Formulas 1 to 4, and a solvent, and a solvent. , &lt;Formula 1&gt;

&lt;Formula 2&gt; 11 201008952 〇 iy

In Equations 1 to 4 above, R!, R2, and R3 may be independent of each other.

It is a ci to C3 alkyl group, and hydrazine and r5 may each independently be hydrogen or a C to C5 alkyl group. In the decyl group compound contained in the surface treating agent composition, the alk〇xy group is changed to a hydroxy group by hydrolysis with a solvent. The fluorenyl compounds are bonded to each other by a concentration reaction, and the linked fluorenyl compound is fixed to the copper tank by a covalent bond with a radical formed on the copper tank. The surface-treated silk yarn may contain, in addition to the Wei-based compound, a general surface thereof, or a silk surface thereof, or a surface treatment agent or a rust inhibitor, which is not particularly limited. According to another embodiment of the present invention, Ri, R2 and R_3 of the mercaptoalkyl compound may each independently be a methyl group or an ethyl group, and I and the heart may be a gas. The solvent contained in the surface treatment composition for copper foil according to another embodiment of the present invention may be selected from one of the groups consisting of water, methanol, ethanol, and a combination thereof. For example, the solvent may be a mixture of water and alcohol obtained by mixing water and alcohol (methanol or ethanol) in a volume ratio of 1:9. The amount of the cerium compound may range from 0.001 to 20% by weight of the composition, may be from 〇·〇ι to 1% by weight of the composition, 〇〇5 to 5% by weight, for example, 0,1 to 2% by weight. When the amount of the decyl group compound is 0.001% by weight or less, the organic layer obtained from the surface treating agent may not sufficiently cover the copper foil, and thus the peel strength may not be improved. When the number of = alkyl compounds is 20% by weight. /. Or higher, the thickness of the organic layer obtained from the surface treatment is increased, and may cover nodules on the copper foil, so peeling strength may not be improved. The copper foil comprises a copper foil treated by tuberculosis, and the copper foil has a thermal resistance formed thereon (in addition to the pure copper foil) (heai_bl〇ckin phantom layer and rustproof layer, or copper foil has an alloy surface) In addition, the copper foil contains any copper coating and can be used in one of the coating processes used by those skilled in the art. The surface treatment composition is limited to copper foil use; however, it can also be used in other metals. Therefore, the surface treatment composition can be used in rhetoric or other alloys. The surface treatment composition can be used in water, alcohol such as methanol' or B13 201008952 jiy/jpu alcohols such as propyl, esters such as ethyl acetate (ethylacetate), or an aromatic solvent such as toluene diluted in an amount of 1 to 2% by weight, which is prepared from at least one of the group consisting of a group of compounds represented by the formula 4 to the formula 4. The surface treatment composition is coated with a polyamie acid or polyimide film on the copper foil, so that a two-layer or three-layer flexible copper-clad laminate (FCCL) can be prepared. The polyimine film can be obtained by coating and hardening a polyamic acid varnish. The polyaminic acid can comprise at least one dianhydride monomer and at least one diamine monomer. The elements of the dianhydride monomer and the diamine monomer are not particularly limited, and other monomers which are generally used by those skilled in the art may be used. At least one dianhydride monomer may be selected from pyromellitic acid (pyromellitic dianhydride) and biphenyltetradecanoic acid, a group consisting of Sf (3,3,4,4-biphenonetetrahydrocarboxylic dianhydride; BTDA), and at least one diamine monomer may be selected from 4,4'-diamino 2 a group of phenyl ether (4,4, _OXydianiline; 〇DA), para-phenylene diamine (PDA) and siloxane oxime diamine (SD). Polyglycolic varnish can be used. For example, a pMDA/〇DA mixture, a BTDA/PDA mixture, a BTDA/PMDA/ODA/PDA mixture, or a PMDA/ODA-SD mixture. According to another embodiment of the present invention, the oxime alkyl compound represented by Formulas 1 to 4 is composed. Preparation of a compound of one of the ethnic groups Containing a fluorenylalkyl compound represented by Formula 5 or Formula 7 and a compound selected from Formula 6 : 201008952 / pu succinic anhydride, 2,3- pyridine dianhydride (2,3- pyridine dicarboxylic anhydride) And a compound of one of the groups consisting of trimellitic anhydride (1,2,4-benzenetricarboxylie anhydride) is reacted at a temperature of from -10 °C to 100 °C.

&lt;Formula 1&gt;

&lt;Formula 3&gt;

&lt;Formula 4>

&lt;Formula 5&gt; 15 201008952

&lt;Formula 6&gt;

r / wherein ' Ri , R 2 and R s may each independently be a C + to c 3 院 , and R 4 and R 5 may each independently be hydrogen or a C to C 5 alkyl group. The compound represented by the formula 5 is reacted with the compound represented by the formula 6 at a temperature of about 95 C, whereby a compound of the invention can be obtained. The compound represented by Formula 7 and succinic anhydride are at about -5. 〇: Reaction at a temperature of 5 ° C. Thus, a fluorenyl compound represented by Formula 2 can be obtained. The compound represented by the formula 7 and the 2,3-pyridine dianhydride are at about -5. (: a reaction to a temperature of 5 ° C. Thus, a mercaptoalkyl compound represented by Formula 3 can be obtained. The compound represented by Formula 7 reacts with the trimellitic anhydride at a temperature of about -5 ° (: to 5 ° C, thus The calcined compound represented by Formula 4 can be obtained. The present invention will be described in more detail below with reference to the following examples; however, the invention is not limited thereto. Brucker DRX-SOOMHzJH-lSiMR.:: 16 201008952 4· / / Nine and Jasco 610 FT-IR to confirm the structure of the compound synthesized in the following examples. (Synthesis of the mercapto compound (1)) Example 1 · Synthesis of the compound 1 According to the following reaction mechanism 1 Compound represented by Formula 1

&lt;Reaction mechanism 1&gt;

Ch3 P 0 1-(3-Aminopropyl)imidazole 3-glycidyloxypropyltrimethoxydecane H0 ch3 'i 0 •wW suspected C«3 s 'H ? API-decane CH3 162.68 g of tetrahydrogen 0 tetrahydrofiirane, 6.259 g φ (0.05 mol) of glycidoxypropyltrimetihoxysilane and 11.81 g (0.05 mol) of 1-(3-aminopropyl)p The l-(3-aminopropyl)-imidazole was charged into the reactor and reacted for 6 hours, the reactor temperature was maintained at 95 ° C under a nitrogen atmosphere, and the mechanical stirrer was rotated at 300 rpm. After the reaction was completed, a rotary evaporator was used for 2 hours to remove the solvent from the product. Then, the resultant was dried in a vacuum oven for 24 hours, so that 7 g (yield 98%) of Compound 1 represented by Formula 1 was obtained. 2 17 201008952 ji^/jpn bNMR (300 MHz): δ 0.62~0.68 (m, 1H), 1.89~1.96 (m, 8H), 1.64~1.67 (t, 2H), 2, 54~2.56 (t, 7H) ), 2.58~2,61(m,6H), 3.28~3.31(m, SiOCH3), 3.38~3.40(d,3H), 3.42~3.44(d, 4H), 3.50~3.58(m,5H), 3.64 (s, -NH-), 3.80 (s, OH), 4.05 to 4.10 (m, 9H), 6.95 (s, 10H), 7.12 to 7.13 (t, 11H), 7.65 (s, 12H) IR (pure ( Neat), cnT1): 3650~3200 (vOH), 3300~3200〇NH), 1120~1050 (v Jane_(decyloxy)) (Manufacture of surface treatment composition for copper foil) Example 2 Water and methanol were mixed in a volume ratio of 1:9 to obtain a solvent mixture, and the solvent mixture was mixed with Compound 1 prepared in Example 1 to prepare a mixed solution having 1.0% by weight of Compound 1. (Manufacture of two-layer FCCL) Example 3 The mixed solution prepared in Example 2 was allowed to stand alone for 60 minutes for hydrolysis, and then sprayed on a Cr-coated rolled copper foil (il-2, manufactured by Hjin). on. Next, the rolled copper foil was coated using an applicator (appiicat®). The coated copper foil was dried in an oven at 120 ° C for 30 minutes. Spraying a copper foil treated with a surface treatment agent grade with KRICT-PAA varnish (BPDA: PMDA: PDA: 0DA = 3:7:6:4) and coating with a doctor blade (d〇ct〇r blade) It. 3G minutes, 12Gt at 6G C under nitrogen 201008952 (4): 3 minutes, 3 minutes, 30 minutes, and 40 minutes for 1 minute to harden the coated = acid to prepare a polyimide film, thus, the wound is ^· Overlaid on _. Copper prepared in Example 3 ==Coating Example 4 Recklessly prepared a polyimide film in the same manner as in Example 3; the copper ruthenium was used in addition to the varnish used in &amp; J〇〇y_g Industry Co., Ltd. Produced ML1) minus Krict_Paa $ scale. The copper foil prepared in Example 1 is hereinafter referred to as Sample 2. 'Examples of the copper yttrium on the yimide film prepared in the same manner as in Example 3 except that a roll made of Nikko material: AHY Fu·Τ was used instead of Cr, coated rolled copper ( IL_2, by

Manufactured, and the bright J-generation KRICT_PAA varnish of the Upilex form manufactured by UBE Co., Ltd. The sample prepared in the Example 5 towel was used for the comparison of Example 1 to prepare the copper H which was thinner than the above in the form of the cap of Example 3, except that the silk-treated composition was omitted to treat the copper. The step of falling the surface. The copper prepared in the taste example 1 is referred to as Comparative Sample 1 as follows. - One.... 19 201008952

J 1 7 fJUlL Comparative Example 2 A copper foil coated with a polyimide film was prepared in the same manner as in Example 4 except that the step of treating the surface of the copper foil using the surface treating agent composition was omitted. The copper foil prepared in Comparative Example 2 is hereinafter referred to as Comparative Sample 2. Comparative Example 3 A copper foil coated with a polyimide film was prepared in the same manner as in Example 5 except that the step of treating the surface of the copper foil using the surface treating agent composition was omitted. The copper foil prepared in Comparative Example 3 is hereinafter referred to as Comparative Sample 3. Evaluation Example 剥离: Peeling Strong Tang Zhejiang Test The peel strengths of Samples 1 to 3 and Comparative Samples 1 to 3 were measured using the method specified by ASTM D-638. The cross-head speed is 25 mm/min and the width of the sample is 5 mm. The Instron 8516 was used for ❹ measurement. The results of the measurements are shown in Table 1 below. &lt;Table 1&gt; Peel strength [kg/cm] Example 3 (Sample 1) 0.73 Comparative Example 1 (Comparative Sample 1) 0.32 Example 4 (Sample 2) 0.76 - 20 201008952 JI ^pxi. Comparative Example 2 (Comparative Sex sample 2) 0.38 Example 5 (Sample 3) 0.58 Comparative Example 3 (Comparative Sample 3) 0.28 ·· ---- As shown in Table 1, according to the embodiment of the present invention, no surface treatment agent was used. Comparative Samples i to 3 for Composition Preparation, Samples 1 to 3 prepared using the surface treatment composition containing the sulphur-based compound showed a greatly increased peel strength between the polyfluorene ymine and the copper foil. Evaluation Example 1-2: Moisture-proof Pan Wei at 50 C, relative humidity 80% in thermo-hygrostat HIRAYANAPC-R7 to store samples 1 to 3 for 7 days, sample 1 to 3 discoloration (discoloration )obvious. After 7 days, the colors of samples 1 to 3 did not change. (Synthesis of the compound (2); - Example 6A: Synthesis of the compound The compound 2A represented by the formula 2 was synthesized according to the following reaction mechanism 2. &lt;Reaction mechanism 2&gt; 〇

Wherein R is a thiol group. 21 201008952

Jiy/^pu pours 125.712 grams of tetrahydrofuran, 8.9645 grams (0.05 moles) of 3-aminopropyltrimethoxysilane and 5.035 grams of succinic anhydride into the succinic anhydride. The reaction was carried out for 6 hours in the reactor. The temperature of the reactor was maintained at _5 ° C to 5 ° C under a nitrogen atmosphere, and the mechanical stirrer was rotated at 300 rpm. After the reaction was completed, a rotary evaporator was used for 2 hours to remove the solvent from the product. Then, the resultant was dried in a vacuum oven for 24 hours, whereby 13.9 g (yield 99%) of the compound 2A represented by the formula 2 was obtained. _ !H NMR (300 MHz, (CD3)2SO) : δ 0.53~0.58(m, 1Η) &gt; 1.42~1.45(m,2H), 2.29~2.31(d, 4H), 2.38~2.43(m,5H ), 2.98~3.00 (m, 3H), 3.40~3.46 (m, SiOCH3), 8.00 (s, -NH-), 12.00 (s, -OH) IR (pure, cm·1): 3650~3200 (vOH ), 3300 to 3200 (vNH), 1650 (vc〇nh) '1120~l〇50 (v ❹ f Example 6B: Synthesis of Compound 2B According to the following reaction mechanism 2, the compound represented by Formula 2 is synthesized &lt; Reaction Mechanism 2&gt ;

22 201008952 wherein R is ethyl. Pour 125.712 g of tetrahydrofuran, u 0685 g (〇05 mol) of 3-amethylpyridylpyridylphosphine (Iamin〇pr〇pyitriethoxysiIane) and 5.035 g (0.05 mol) of succinic anhydride The reactor was reacted for 6 hours, the temperature of the reactor was maintained at _5 ° C to 5 ° C under a nitrogen atmosphere, and the mechanical stirrer was rotated at 300 rpm. After the completion of the reaction, the solvent was removed from the product using a rotary evaporator for 2 hours. Then, the resultant was dried in a vacuum oven for 24 hours, so that 16 g (yield 99%) of the compound 2B represented by the formula 2 was obtained. ^NMR (300 MHz, (CD3)2SO): 50.58~0.60 (m, 1H) &gt; 1.22~1.25 (m, Si-CH2), 1.60~1.63 (m, 2H), 2.45~2.49 (m, 4H) , 2.51 to 2.54 (m, 5H), 3.20 to 3.25 (m, 3H), 3.83 to 3.87 (m, Si-CH3) IR (pure, cm·1): 3650 to 3200 (voh), 3300 to 3200 (Vnh ), 1650 (vc〇nh), 1120 to 1050 (νβ·(alkoxy)) (manufacture of a surface treatment composition for copper foil) Examples 7 to 11 by mixing water and hydrazine in a volume ratio of 1:9 Alcohol was used to obtain a solvent mixture, and the solvent mixture was mixed with Compound 2A prepared in Example 6A to prepare a mixed solution of Compound 2A having 0.5% by weight, 1% by weight, 2% by weight, 3% by weight and 5% by weight, respectively. 23 201008952 oiy/〇pu Examples 12 to 16 Mixture of the solvent mixture with the compound prepared in Example 6B and 5% by weight of Compound 2B by mixing water and methanol in a volume ratio of 1:9 to obtain a solvent full compound. Solution. Summer (manufactured by the second layer FCCL) Example 17 £ 26 Φ In the (four) 7 phantom 6 towel system mixed solution _ fine (10) minutes to ^ water ^, after the wealth of Q (four) rolling steel can _2, mold ^ (four) on the H use smear The device (CK TRADING. co., ,, name. CKAF-1003) was coated with a rolled copper drop. The coated copper foil was dried in the oven for 30 minutes in the oven. Φ knives manufactured by Jooyoung Industries Co., Ltd. (product name: JY-001) coated with a copper box treated with a surface treatment agent composition, and subjected to a nitrogen atmosphere at 6 Torr for 30 minutes using a brake j. 120 ° C for 30 minutes % and Wc for 1G minutes to harden the brewed imine cage 2 acid ' to prepare poly (tetra) amine lysate, thus preparing a polyethered pine / knife coated on the copper box . The copper (tetra) prepared in Examples 17 to 26 is referred to as Samples 4 to 13. The above 11 examples of the 17 μ sample preparation of the light amine film coating smelting 'except the use of the surface treatment composition to treat the copper box 24 201008952 • J X. y ! Surface steps. The copper foil prepared in Comparative Example 4 is hereinafter referred to as Comparative Sample 4. Evaluation Paste 2-1: Peel Strength Test The peel strengths of Samples 4 to 13 and Comparative Sample 4 were measured using the method specified in ASTM D-638. The cross-arm speed was 25 mm/min and the width of the sample was 5 匪. Measurements were performed using Instr〇n85l6. The results of the measurements are shown in Table 2 below. &lt;Table 2&gt; | Departure strength [kg/cm] at 8 — 1 _ 0.86 Example 17 (Sample 4) Example 18 (Sample 5) Example 19 (Sample 6), 0^93 Example 20 (Sample 7) i〇5 Example 21 (Sample 8) ^92 Example 22 (Sample 9), 0.82 Example 23 (Sample 10), 0.89 Example 24 (Sample 11) L〇2 Example 25 (Sample 12) 1.12 Example 26 (Sample 13) ^ 0.94 Comparative Example 4 (Comparative Sample 4) A38 As shown in Table 2, according to the example of the present invention, compared with no. The use of 25 201008952 jiy/3pn film and steel f| shows a large; two to 13 in Juyi Amine-like::: Use contains Weiji

Moisture resistance test CA PC_in _# / humidity 80% in the strange temperature diffuser HIRAYA &amp; obvious. After 7 days, the two fj3〗 f rows for 7 days 'The color of the samples 4 to 13 (4) & σσ 4 to 13 did not change. (Synthesis of the saponin compound (3)) Synthesis of the urethane 3 The compound 3 represented by the formula 3 was synthesized according to the following reaction mechanism 3. &lt;Reaction mechanism 3&gt;

2,3-«bipyridinedicarboxylic acid 0 0 u • 3-aminopropyltrimethoxymethane

125.712 grams of tetrahydrofuran, 8.9645 grams (0.05 moles) of 3-aminopropyltrimethoxyoxydecane and 7.4550 grams (0.05 moles) of 2,3-sebacic anhydride were poured into the reactor and reacted for 5 hours. The reactor temperature was maintained at -5 °C to 5 t: under a nitrogen atmosphere, and the mechanical stirrer was rotated at 300 rpm. - 26 201008952 jsiy/jpit After completion of the reaction, a rotary evaporator was used for 2 hours to remove the solvent from the product. Then, the resultant was dried in a vacuum oven for 24 hours, whereby 16.4 g (yield 99%) of the compound 3 represented by the formula 3 was obtained. 4 NMR (300 MHz, (CD3) 2SO): δ0·57~0.59 (t, 1H), 1.62~1.80 (m, 2H), 3.62~3.67 (m, Si-CH3), 3.85~3.87 (t, 3H) ), 7.93~7.95(t,4H), 8.56(s, NH), 8.64~8.67(d,5H), 9.09~9.11(d 6H), 13.80(s,OH) 'IR (pure, cm·1) : 3650 to 3200 (vOH), 3300 to 3200 (Vnh), 1650 (vCONH), 1120 to 1050 (v 矽. (alkoxy)) (manufacture of a surface treatment composition for copper foil) Example 28 29 by Water and decyl alcohol were mixed at a volume ratio of 1:9 to obtain a solvent mixture, and the solvent mixture was mixed with Compound 3 prepared in Example 27, and a mixture of Compound 3 having 0.5% by weight and i by weight was prepared. (Manufacturing of two-layer FCCL) AM. 30 JL 31 The mixed solutions prepared in Examples 28 to 29 were separately allowed to stand for 6 〇 to perform hydrolysis 'and then sprayed separately on a Cr-coated rolled copper knives · manufactured by Iljm) on. Next, the copper drop was coated using an applicator. The coated copper was dried at 12 CTC for 30 minutes. In the baking phase, the varnish of the Upilex form manufactured by UBE Co., Ltd. 27 201008952 31973pit The steel treated with the surface treatment composition is subjected to a nitrogen atmosphere at 6 (τ (10) rows, 3G minutes #, 12Q. The boots are subjected to 30 cents and the castings are carried out.丨_来钟之=酸=备聚醯;, 'so' preparation of yttrium imine: ===, &quot;. Preparation to 31 - upper 匕 comparative example 5 φ in the same way as in Example 30 A copper foil coated with a polyimide film was prepared except that the surface treatment composition was omitted to treat the surface of the copper foil. The copper foil prepared in Comparative Example 5 is hereinafter referred to as Comparative Evaluation Tube Example 3 1 : Peel strength measurement 剥离 The samples were measured using the method specified in ASTM D-638 to measure the peel strength of the samples 4 to 15 and the comparative sample 5. The entrainment speed was 25 nini/niiii and the width of the sample was 5 mm. The amount was measured using Instron 8516. The results of the measurement are shown in Table 3. ^3&gt; Peel strength [kgf/cml ^Example 30 (Sample 14) 0.82 1 case 31 (Sample 15) 0.78&quot; - 28 201008952

Comparative Example 5 (Comparative Sample 5) 0.32 As shown in Table 3, according to the embodiment of the present invention, surface treatment containing a decyl group compound was used as compared with Comparative Sample 5 prepared without using a surface treatment composition. Samples 14 to 15 prepared from the composition of the agent had a greatly increased peel strength between the polyamine film and the steel foil. Guangdong Example 3 - 2: Moisture-proof sea otter at 50. (:, relative humidity 8〇% was stored in the thermostat HIRayana PC-R7 for 14 days, and the discoloration of the samples 14 to 15 was remarkable. After 7 days, the color of the samples 14 to 15 did not change. Synthesis of Compound (4) Example 32A: Synthesis of Compound 4A Compound 4A represented by Formula 4 was synthesized according to the following Reaction Mechanism 4. • &lt; Reaction Mechanism 4&gt;

+ Φ*» OR

龙八?OR where R is methyl. 125.712 grams of tetrahydrofuran' 8.9645 grams (0.05 moles) of 3-aminopropyltrimethoxy decane and 9.6065 grams of (0. Q3 molar) of trimellitic anhydride (2,3-pyridine dianhydride) Into the reactor and react for 6 hours in a nitrogen atmosphere 29 201008952

• The reactor temperature was maintained at -5 °C to 5 °C at MV/jpiI and the mechanical stirrer was rotated at 250 rpm. After the completion of the reaction, a rotary evaporator was used for 1 hour to remove the solvent from the resultant. Then, the resultant was dried in a vacuum oven for 48 hours, so that 18.5 g (yield 99%) of the compound represented by the formula 4 4A ° JH NMR (300 MHz, (CD3) 2SO): 60.62 to 0.65 (t, 1H) was obtained. &gt; 1.71 to 1.76 (tn, 2H), 3.41 to 3.47 (m, Si-CH3), 3.56 to 3.60 (m, 3H) &gt; 7.45 (s, NH) ❹ IR (pure, cm·1): 3650 ~3200 (vOH), 3300 to 3200 (vNH), 1650 (vc〇nh) '1120 to 1050 (v Example 32B: Synthesis of Compound 4B The compound 4B represented by Formula 4 is synthesized according to the following reaction mechanism 4. &lt;Reaction Mechanism 4&gt;

Wherein R is an ethyl group.

125.712 grams of tetrahydrofuran, 8.9645 grams (0.05 moles) of 3-aminopropyltriethoxysulfate and 9.6065 grams (0.05 moles) of trimellitic anhydride (2,3-t dianhydride) were poured into the reactor and After reacting for 6 hours, the temperature of the reactor was maintained at _5 ° C to 5 under air. (:, and mechanical_cry to = 30 201008952 J t jyii rpm rotation. After the reaction is completed, a rotary evaporator is used for 1 hour to remove the solvent from the product. Then, the product is dried in a vacuum oven for 48 hours, so 20.6 g (yield 99%) of the compound 4B represented by the formula 4 was obtained. hNMR (300 MHz): δ0·71~〇.73 (t, 1H), 1.14 to 1.23 (m, Si-CH3), 1.71 ~1.74 (m, 2H), 3.58~3.60 (t, 3H), 3.79~3.86 (m, ❹ Si-CH2), 8.55 (s, NH) IR (pure, cm*1): 3650~3200 (vOH) 3300 to 3200 (vNH), 1650 (vCONH), 1120 to 1050 (ν$·(Pitoxy)) (Manufacture of surface treatment composition for copper foil) Examples 33 to 34 by volume of 1:9 Water and methanol were mixed in ratio to obtain a solvent mixture, and the solvent mixture was mixed with Compound 4A prepared in Example 32A to prepare a mixed Φ solution having 0.5% by weight and 1% by weight of Compound 4A, respectively. Examples 35 to 36 A volume ratio of 1:9 was mixed with water and decyl alcohol to obtain a solvent mixture, and the solvent mixture was mixed with Compound 4B prepared in Example 32B to prepare 0.5% by weight and 1 weight, respectively. a mixed solution of the compound 4B in %. 31 201008952 : uy /, pu (manufactured by two-layer FCCL) The mixed solution prepared in Example 37 to Examples 33 to 36 was allowed to stand alone for 6 minutes to carry out hydrolysis 'and then sprayed separately On a Cr coated roll steel knife / manufactured by Iljin). Next, the copper book is coated with an applicator. The coated copper box was dried at 120 ° C for 30 minutes to obtain a varnish made by Jooyoung Co., Ltd.

^) 〇 1) A copper box treated with a surface treatment composition and sprayed with a knife. J was subjected to 3Q minutes, (10) minutes, and 1Q minutes at 60t under a nitrogen atmosphere for Ϊ = 祺, therefore, a copper box comparative example 6 prepared by concentrating the following samples 16 to ... in Examples 37 to 4 was prepared. The copper H coated on the (i) quinone imine film was prepared in the same manner as in the example except that the surface treatment composition was omitted to treat the copper surface. The copper fl prepared in Comparative Example 6 is hereinafter referred to as Comparative Biosample 6. Evaluation Example 4-1: iL Detachment The sample was measured to the β and the comparative sample 6 _(four) degrees using the method specified in ASTM D-638. The cross-feed Μ—and the sample's 201008952 width is 5 mm. Measurements were performed using an instron 8516. The results of the measurements are shown in Table 4 below. &lt;Table 4&gt; Peel strength [kgf/cm] Example 37 (Sample 16) 1.60 Example 38 (Sample 17) 1.35 Example 39 (Sample 18) 1.98 Example 40 (Sample 19) 1.57 Comparative Example 6 (Comparative Sample 6) 0.38 As shown in Table 4, samples 16 to 19 prepared using a surface treatment composition containing a decyl compound were compared to Comparative Sample 6 prepared without using a surface treatment composition, according to an embodiment of the present invention. There is a substantial increase in peel strength between the yttrium imide film and the copper box. g. Example 4-2: Moisture resistance test Samples 16 to 19 were stored in a thermostatic humidifier HIRAYANA PC-R7 at 50 ° C and a relative humidity of 80% for 7 days, and the samples 16 to 19 were significantly changed. After 7 days, the colors of samples 16 to 19 did not change. As described above, the surface treatment composition for copper foil containing the decyl compound of the present invention is used as compared with the case where the surface treatment composition is not used on the PCB or the surface treatment composition containing the general ceramide compound is used. The prepared PCB has improved peel strength. The present invention has been disclosed in the above embodiments, but it is not intended to limit the invention, and any one of ordinary skill in The scope of protection of the present invention is defined by the scope of the appended claims. [Simple description of the diagram] None. [Main component symbol description] None.

Claims (1)

201008952 VII. Patent application scope: 1. A fluorenyl compound, represented by formulas 1 to 4: <Formula 1> &lt;Formula 3&gt; Wherein Ri, R2 and R3 are each independently an alkyl group of q to C3, and "R4 35 201008952 and r5 are each independently hydrogen or an alkyl group of (C to C5). 2. The alkyl group as described in claim 1 a compound wherein Ri, R 2 and R 3 are each independently a fluorenyl or ethyl ' and R 4 and R 5 are · SL. 3. A surface treatment composition for a copper box comprising a decyl compound selected from the group consisting of Formulas 1 to 4. At least one compound of the group consisting of, and a solvent &lt;Formula 1&gt; &lt;Formula 4&gt; 36 201008952 Wherein Ri, R2 &amp; R3 are each independently an alkyl group of Q to C3, and R4 and R5 are each independently hydrogen or an alkyl group of (C to C5). 4. Surface treatment of copper foil as described in claim 3 And a composition of the surface treatment agent for copper foil according to the second aspect of the invention, wherein the composition of the composition, wherein the Ri, the R2 and the core are each independently a methyl group or an ethyl group, and the ruler 4 and the R5 are nitrogen. The solvent comprises one selected from the group consisting of water, decyl alcohol, ethanol, and mixtures thereof. 6. A method for preparing a compound selected from the group consisting of decyl compounds represented by Formulas 1 to 4, comprising a compound of 5 or a compound represented by Formula 7 and a compound selected from the group consisting of a compound represented by Formula 6, succinic anhydride, 2,3-Acridine dianhydride, and trimellitic anhydride at a temperature of from -10 ° C to 100 ° C Lower reaction: &lt;Formula 1&gt; &lt;Formula 2&gt; 37 201008952 3iy/jpn &lt;Formula 4&gt; &lt;Formula 6&gt; 38 201008952 -J i 7 / jpUL r/ wherein, Ri, R2 and R3 are each independently (:! to C3 alkyl group, and R4 and R5 are each independently hydrogen or (^ to C5 alkyl group). 39 201008952 J 1 7 / jpil IV. Designated representative map: (1) The designated representative of the case: None. (2) A brief description of the symbol of the representative figure: Benefits 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 4 201008952 /8124124 Chinese manual without line correction page Hair (This manual format, order 'Do not change any more, ※Application number: ※Application曰: ※Please do not fill in the mark) &lt;Γ〇Π户η/γ (2006.01Ϊ来11&gt;(:Classification: Invention name: C^C (2006.01) 矽 矽alkyl compound, its preparation method and containing the decyl compound SILANE BASED COMPOUND, METHOD FOR PREPARING THE SAME, AND SURFACE TREATING AGENT COMPOSITION FOR COPPER FOIL INCLUDING THE SILANE BASED COMPOUND II. SUMMARY OF THE INVENTION: Provided by the formula 1 to 4 · &lt;Formula 1&gt; <Formula 3> 201008952 Description of invention patents (This specification is in the format and order, please do not change it at will, please do not fill in the ※ part) ※Application number: (township % f2006.01) ※Application曰: ※^(:Classification ·· 1. Name of the invention: (4) Capital (10) coffee chopping mixture and its preparation method and surface treatment composition ef i-- -v*· f -';, ' i · of copper foil containing the dream burning mixture . SILANE BASED COMPOUND, METHOD FOR PREPARING THE SAME, AND SURFACE TREATING AGENT COMPOSITION FOR COPPER FOIL INCLUDING THE SILANE BASED COMPOUND II. SUMMARY OF THE INVENTION: The oxime alkyl compound represented by Formulas 1 to 4 is provided: ❹ &lt;Formula 1&gt; &lt;Formula 3&gt; 201008952 -» 1 / / 6. Invention Description: [Related application] This application claims priority to Korean Patent Application No. 10-2008-0070080 filed on July 18, 2008 in Korea Intellectual Property Office. The disclosures of which are incorporated herein by reference. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a silane-based compound and a method for preparing the same, and a surface treatment composition for a copper foil comprising the same, particularly relating to a new one A sulfonyl compound and a process for the preparation thereof, and a copper surface treatment composition comprising the novel decyl compound. [Prior Art] Flexible copper clad laminate (FCCL) is a form of printed circuit board _nte (J circuit b〇ard; and its demand is increasing today. FCCL· is composed of two or three Layer formed = layer film in which a p〇lyimide film is laminated on a copper foil. 'I3 brush has increased wiring accuracy on FCCL, and the accuracy of the remaining is also increased' so it needs to be reduced (4) The rough surface of the surface. However, when the surface roughness is used, the peel strength of copper and the substrate (for example, _ sub_) may decrease. At this point, the means for peeling off the strength is required. (4) Usually the time_mixture is the surface of the copper box; the peeling strength of the ==::li;==9, but the requirements of the physical properties of the use in the PCB 201008952 J 17 /^pjuL [Related application] The priority of the present application is the Korean Patent Application No. 10-2008-0070080, filed on Jan. 18, 2008, filed in the Korean Intellectual Property Office, the disclosure of which is hereby incorporated by reference. Technical field] The present invention is A silane_based compound and a ruthenium preparation method thereof, and a surface treatment composition for a copper box containing the dream alkyl group compound, particularly relating to a novel decyl group compound and a preparation method thereof, and the like A surface treatment composition for a copper foil of a dream base compound. ν [Prior Art] Flexible copper clad laminate (w FCCL) ^ £p ^ ij (printed circuit board; PCB) 4^. One form, and its demand is increasing today. FCCL is a multilayer film formed of two or three layers, in which polyimide is laminated on copper foil. When the accuracy of wiring printed on FCCL is increased, the last name The accuracy of the engraving is also increased, so it is necessary to reduce the surface roughness of the copper foil. However, when the surface roughness of the copper foil is lowered, the peeling strength between the copper foil and the substrate (for example, the polyimide film) Peel strength) will fall. At this point, there is a need to improve the peel strength. The copper sway for the PCB is usually used to strengthen the surface of the copper smashing agent. The peel strength between the foil and the substrate is disclosed in Japanese Patent Application No. 1990-026097. However, with the requirement of the physical properties of the copper foil used in the PCB 5 201008952, there is still a need for improved physics. The surface treated film of the nature is formed on the copper foil for the PCB. SUMMARY OF THE INVENTION The present invention provides a novel fluorenyl compound (which provides excellent peel strength between a substrate and a copper foil), a preparation method thereof, and a copper pig surface treatment composition comprising the novel decyl compound . According to an aspect of the invention, a decyl compound represented by Formula 1 to Formula 4 is provided: &lt;Formula 1&gt; &lt;Formula 2> &lt;Formula 3&gt; &lt;Formula 4&gt; 201008952 3iy/3pit is tight, and a copper foil for a PCB on which a surface-treated film having improved physical properties is formed is still required. SUMMARY OF THE INVENTION The present invention provides a novel fluorenyl compound (which provides excellent peel strength between a substrate and a copper foil), a method for preparing the same, and a surface treatment composition for a copper foil comprising the ceramide compound . According to an aspect of the invention, a decyl compound represented by Formula 1 to Formula 4 is provided: &lt;Formula 1&gt; &lt;Formula 4&gt; 6 201008952 jiy /opu Wherein R!, R2 and R3 may each independently be an alkyl group of (^ to c3), and R4 and R5 may each independently be hydrogen or (^ to an alkyl group of 0:5). According to another aspect of the present invention, there is provided a surface treating agent composition for copper foil comprising at least one compound selected from the group consisting of a fluorenyl compound represented by Formulas 1 to 4, and a solvent. &lt;Formula 1&gt; &lt;Formula 2&gt; &lt;Formula 4&gt; 201008952 31973pii And r ^: heart and uldent 3 may each independently be a C to C3 alkyl group, and 5 ff may be independently hydrogen or an alkyl group. 〇 According to still another aspect of the present invention, a selected Wei group compound is provided. Formulation of a compound of one of the constituent groups: The method comprises the sulfonyl group compound represented by Formula 5 or Formula 7 and a compound selected from Formula 6, succinic anhydri (ie), 2,3-pyridinedicarboxylic acid One of the groups consisting of 2,3-pyridinedicarboxylic anhydride and 1,2,4-benzenetricarboxylic anhydride reacts at a temperature of -10 ° C to 10 ° C. &lt;Formula 3&gt; 8 201008952 Jiy/jpu &lt;Formula 5&gt; r/ <Formula 6> &lt;Formula 7&gt; Wherein, Ri, R2 and R3 may each independently be an alkyl group of (^ to C3, 201008952 31973 pif and R4 and R5 may each independently be hydrogen or an alkyl group of Cl to ruthenium. To make the above features and advantages of the present invention more apparent BRIEF DESCRIPTION OF THE DRAWINGS The following detailed description of the embodiments, together with the accompanying drawings, will be described in detail below. [Embodiment] Hereinafter, a fluorenylalkyl compound and a preparation method thereof, and a decane containing the same will be described in more detail according to an embodiment of the present invention. A surface treatment agent composition for a copper foil of a base compound. According to the present embodiment, the oxime group compound can be represented by Formulas 1 to 4. [Formula 1] &lt;Formula 4&gt; 201008952 Jiy/jpu Wherein Ri, R2 and 尺3 may each independently be: (: to C3 alkyl group, and R4 and R5 may each independently be 氲 or (^ to C5 alkyl. The dazzle-based compound has a chopping chamber at one end thereof) The siloxane group is used to form a covalent bond with copper, and has an imidazole group and/or an imide group at the other end, wherein the mercapto group and/or the amide group It has a structure similar to that of the polyimide film, so that the bonding strength with the polyimide film can be improved. Therefore, the bonding strength between the copper foil and the polyimide film can be improved. According to another embodiment of the present invention For example, in the alkylene compound, Ri, R2 and R3 are each independently a methyl group or an ethyl group, and the scales 4 and R5 may be hydrogen. ❹ According to another embodiment of the present invention, the surface treatment composition for copper foil may include At least one compound of the group consisting of the dream alkyl compound represented by Free Formula 1 to Formula 4, and a solvent. &lt;Formula 2&gt; 11 201008952 31973pif h &lt;式3&gt; &lt;Formula 4&gt; K2 In the above formulae 1 to 4, R1, R2 and 玟3 may each independently be calcined, and K and R5 may each independently be hydrogen or a thio group of Q to c5. In the composition of the surface treatment agent, the alkoxy group is changed to a hydroxy group by hydrolysis with a solvent. The mercaptoalkyl compounds are bonded to each other by a concentration reaction and the linked Wei-based compound is fixed to the copper drop by a covalent bond with a meridine on the copper drop. The surface treatment composition may contain, in addition to the decyl group compound, other surface treatment agents or rust preventants known to those skilled in the art, and the surface treatment agent or rust inhibitor is not particularly limited. According to another embodiment of the present invention, Ri, R2 and &amp; of the dream alkyl compound may each independently be a methyl group or an ethyl group, and the oxime and the oxime may be hydrogen. According to another embodiment of the present invention, the solvent contained in the surface treatment composition for copper foil may be selected from one of the group consisting of water, decyl alcohol, ethanol, and combinations thereof. For example, the solvent may be a mixture of water and alcohol obtained by mixing water and alcohol (sterol or ethanol) in a volume ratio of 1:9. The amount of the ruthenium-based compound may range from 0.001 to 20% by weight of the composition. It may be from 1 to 1% by weight of the composition, from 5 to 5% by weight, for example, from 0.1 to 2% by weight. When the amount of the fluorenyl compound is 〇·〇〇1% by weight or less, the organic layer obtained from the surface treating agent may not be sufficiently covered on the copper foil, and thus the peel strength may not be improved. When the amount of the 1 f alkyl compound is 20% by weight or more, the thickness of the organic layer obtained from the surface treating agent is increased, and it is possible to cover the nodules on the copper foil, and thus the peel strength may not be improved. Tongzhi contains copper foil treated by tuberculosis (n〇duiati〇n). In addition to pure copper pigs, copper foil has a heat-blocking layer and a rust-proof layer or copper formed thereon. The foil has an alloy surface. Further, the copper foil contains any copper foil and the copper foil can be subjected to a general coating process which is generally used by those skilled in the art. The surface treatment composition is limited to use in copper foil; however, it can also be used in other metals. Therefore, the surface treatment composition can be used in zinc or other alloys. The surface treatment composition can be diluted by 0.001 to 20% by weight in water, alcohol such as methanol or B 13 201008952 31973 pif alcohol, ketone such as propyl acetate, vinegar such as ethylacetate, or an aromatic solvent such as toluene. It is prepared by at least one of the groups consisting of the fluorenyl compounds represented by Free Formulas 1 to 4. A polyamic acid or polyimide film may be further coated on the copper foil coated with the surface treatment composition, so that a two-layer or three-layer flexible copper-clad laminate can be prepared. (FCCL). The polyimide film can be obtained by coating and hardening a varnish. The poly-aracine may comprise at least one dianhydride monomer and at least one diamine monomer. The elements of the dianhydride monomer and the diamine monomer are not particularly limited, and other monomers which are generally used by those skilled in the art can be used. The at least one dianhydride monomer may be selected from the group consisting of pyromellitic dianhydride and 3,3',4,4,-diphenyltetracarboxylic acid (3,3',4,4'-biphenonetetrahydrocarboxylic dianhydride; The group consisting of BTDA) and at least one diamine monomer may be selected from 4,4'-diaminodiphenyl ether (ODA), para-phenylene diamine (PDA). And a group consisting of a sulfoxane diamine (Sii0xane diamine; SD). The polyglycolic varnish can be, for example, a PMDA/ODA mixture, a BTDA/PDA mixture, a BTDA/PMDA/ODA/PDA mixture or a PMDA/ODA-SD mixture. According to another embodiment of the present invention, a method for producing a compound of a group consisting of a pyrophoric compound represented by Formulas 1 to 4 includes a decyl group compound represented by Formula 5 or Formula 7 and a compound selected from Formula 6, 201008952 jiy u^u. One of the groups consisting of succinic anhydride, 2,3- bis 2,3-pyridinedicarboxylic anhydride and trimellitic anhydride (1,2,4-benzenetricarboxylic anhydride) React at a temperature of -10 °C to 100 °C. &lt;Formula 1&gt; &lt;Formula 3&gt; n R &lt;Formula 4&gt; Ο , / &lt;式5&gt; 15 201008952 31973pif Λ &lt;式6&gt; 3 &lt;Formula 7&gt; «/ wherein Ri, R; 2 and R3 may each independently be a C! to C3 alkyl group, - and R4 and R5 may each independently be hydrogen or (: 丨 to ^5 alkyl. Compound represented by formula 5) The compound represented by Formula 6 is reacted at a temperature of about 95 ° C, whereby a chopper-based compound represented by Formula 1 can be obtained. The compound represented by Formula 7 and S. sinensis are at about -5 ° C to 5 ° C. The temperature is reversed G, so that a fluorenyl compound represented by Formula 2 can be obtained. The compound represented by Formula 7 reacts with 2,3-pyridine dianhydride at a temperature of about -5 ° C to 5 ° C. The dream alkyl compound represented by 3. The compound represented by the formula 7 and the trimellitic anhydride are reacted at a temperature of about _5 t to 5. The temperature of the reaction is 'resolved to obtain a calcined compound represented by the formula 4. The invention will be described in more detail with reference to the following examples; however, the invention is not limited thereto. The structure of the synthesized compounds in the following examples was confirmed using Brucker DRX-300 MHz h-NMR 16 201008952 and Jasco 610 FT-IR. (Synthesis of fluorenyl compound (1)) Example 1: Synthesis of compound 1 according to the next Surface reaction mechanism 1 to synthesize the compound represented by Formula 1 &lt;Reaction mechanism 1&gt; K3-Aminopropyl)imidazole 3-glycidyloxypropyltrimethoxydecane Η〇ch3 0 0 API-decane 162.68 g of tetrahydrofurane, 6.259 g of ginseng (0.05 mol) of 3-glycidyl ether Oxypropyl propyl trimethoxy shovel (3-笆1)^£1〇\}^1*〇卩5^11:1^11^11(^&gt;^1&amp;1^) and 11.81 g (0.05 Mo 1-(3-aminopropyl)imidazole (l-(3-aminopropyl)-imidazole) was charged into the reactor and reacted for 6 hours, maintaining the reactor temperature at 95 °C under a nitrogen atmosphere. And the mechanical stirrer was rotated at 300 rpm. After the reaction was completed, a rotary evaporator was used for 2 hours to remove the solvent from the product. Then, the resultant was dried in a vacuum oven for 24 hours, so that 7. g (yield 98.%) of Compound 1 represented by Formula 1 was obtained. 17 201008952 and Jasco 610 FT-IR to confirm the structure of the synthesized compounds in the following examples. (Synthesis of Alkyl Compound (1)) Example 1: Synthesis of Compound 1 The compound represented by Formula 1 was synthesized according to the following Reaction Scheme 1 1 ° &lt; Reaction Mechanism 1&gt; 1-(3-aminopropyl)imidazole 3-glycidyl ether decyl trimethoxymethane 162.68 grams of tetrahydrogen "Family Plus 117 (11' 〇 61 goods 116), 6.259 grams (0.05 moles) of glycidoxypropyltrimethoxysilane and 11.87 grams (0.05 moles) 1-(3-aminopropyl)-imidazole was charged into the reactor and reacted for 6 hours, maintaining the reactor temperature at 95 °C under a nitrogen atmosphere. 'And the mechanical stirrer rotates at 300 rpm. After the reaction was completed, a rotary evaporator was used for 2 hours to remove the solvent from the product. Then, the resultant was dried in a vacuum oven for 24 hours, so that 7 g (yield 98%) of Compound 1 represented by Formula 1 was obtained. 17 201008952 ^iy/^piri ^NMR (300 MHz) : δ 0.62~0.68(m, 1H)&gt; 1.89-1.96(m, 8H), 1.64~1.67(t,2H), 2.54~2.56(t,7H ), 2.58~2.61 (m, 6H), 3.28~3.31 (m, SiOCH3), 3.38~3.40 (d, 3H), 3.42~3.44 (d, 4H), 3.50~3.58 (m, 5H), 3.64 (s) ,·ΝΗ_), 3.80(s, OH), 4.05~4.10(m, 9H), 6.95(s,10H), 7.12~7.13(t,11H), 7.65(s, 12H) IR (neat, Cm'1) : 3650~3200(v〇H), 3300~3200(vNH), 1120~1050(v methoxy)) ❹ (Manufacture of surface treatment composition for copper foil) Example 2 by 1 A volume ratio of 9 was mixed with water and decyl alcohol to obtain a solvent mixture, and a solvent mixture was mixed with Compound 1 prepared in Example 1 to prepare a mixed solution having 1.0% by weight of Compound 1. (Manufacturing of two-layer FCCL) Example 3 The mixed solution prepared in Example 2 was allowed to stand alone for 6 minutes to carry out hydrolysis, and then sprayed on a Cr-coated rolled copper foil (IL-2, by Made by Iljin). The rolled copper foil was then applied using an applicator (appiicat®). The coated copper foil was dried in an oven at 120 ° C for 30 minutes. α KRICT-PAA varnish (BPDA: PMDA: PDA: ODA = 3:7:6:4) sprayed copper enamel treated with a surface treatment composition and coated with a doctor blade (d〇et〇r blade) :3⁄4在氮二:二:乂18 201008952 31973pif b NMR (300 MHz): δ 0.62~0.68(m,1H), 1.89~1.96(m, 8H), 1.64~1.67(t,2Η), 2.54 〜2.56(t,7H), 2.58~2.61(m,6H), 3.28~3.31(m,SiOCH3), 3.38~3.40(d,3H), 3.42~3.44(d, 4H), 3.50~3.58(m, 5H), 3.64 (s, -NH-), 3.80 (s, OH), 4.05 to 4.10 (m, 9H), 6.95 (s, 10H), 7.12 to 7.13 (t, 11H), 7.65 (s, 12H) IR (neat, cm&quot;1) * 3650~3200(v〇H) 3300~3200(vnh), 1120~1050(v 矽_(alkoxy)) (for surface treatment composition of copper foil) Manufactured Example 2 A solvent mixture was mixed with Compound 1 prepared in Example 1 by mixing water and methanol in a volume ratio of 1:9 to prepare a mixed solution of Compound 1 having 1.0 wt/min. . (Manufacture of two-layer FCCL) Example 3 The mixed solution prepared in Example 2 was allowed to stand alone for 60 minutes for hydrolysis' and then sprayed on a Cr-coated rolled copper box (IL-2, manufactured by Hjin). Next, the rolled copper box was coated using an applicator (appijcat〇r). In the oven at 120. (: Dry coated copper foil for 30 minutes. Spray the copper foil treated with the surface treatment composition with KRICT-PAA varnish (BPDA: PMDA: PDA: 0DA = 3:7:6:4) and use Coating with a doctor blade. Performing at 60 ° C for 30 minutes in a nitrogen 18 201008952 atmosphere, 12 (rC for 3 〇 * clock, 25 (Γ (: 2: 30: clock and Wc for 1 来 to harden) The coated polyamic acid was used to prepare a polyimide film, and thus, the copper smear coated with the polyimide film was prepared. The copper box prepared in Example 3 is hereinafter referred to as sample b. A copper foil coated with a polyimide film was prepared in the same manner as in Example 3 except that the KRICT-PAA varnish was replaced with a varnish (product name: JY-001) manufactured by Jooyoung Industries Co., Ltd. The copper foil prepared in Example 4 is hereinafter referred to as Sample 2. Example 5' A copper foil coated with a polyimide film was prepared in the same manner as in Example 3 except that a rolled copper foil made of Nikk0 material was used. (Product name: BHY-22B-T) Replaces Cr-coated rolled copper foil (IL-2, manufactured by Iljin)' and is UBE Limited The manufactured illuminating paint of the Upilex form was replaced with a KRICT-PAA varnish. The copper foil prepared in Example 5 is hereinafter referred to as Sample 3. Comparative Example 1 A polyimide film was prepared in the same manner as in Example 3. The copper foil covered thereon was omitted except that the surface treatment composition was omitted to treat the surface of the copper foil. The copper foil prepared in Comparative Example 1 is hereinafter referred to as Comparative Sample 1. 201008952 31973ptf Comparative Example 2 In the same manner as in 4, a copper box coated with a polyimide film was prepared except that the surface treatment composition was omitted to treat the step of the copper pig surface. The preparation prepared in Comparative Example 2 is hereinafter referred to as comparison. Comparative Example 3 A procedure of preparing a ruthenium (tetra) film coated φ on top was performed in the same manner as in Example 5, except that the step of treating the fine surface was omitted using the surface treatment composition. The copper prepared in Comparative Example 3 Box-like sample 3. Evaluation Example 1-1: Peel strength test The peel strength of the sample 丨 to 3 and the comparative sample im 1 to 3 was measured using the method specified in ASTM D-638. Cross-arm speed (er〇ss_jjead Spee ( j) is 25 mm/min and the width of the sample is 5 mm. The measurement is performed using Instron Ml6. The results of the measurement are shown in Table 1 below. &lt;Table 1&gt; Peel strength [kg/cm] Example 3 ( Sample 1) 0.73 Comparative Example 1 (Comparative sample n 1 0.32 Example 4 (Sample 2) 0.76 20 201008952 Example 5 As shown in Table 1, the example of the preparation of the root scorpion surface treatment composition was compared with the surface treatment product 1 to 3' which did not use the alkylate compound. It shows a large 増 == to 3 to poly a - an example (synthesis of a dream base compound (2)) f down 6A: a gold 2A synthesis of a compound represented by H 2 according to the following reaction mechanism 2 &lt; Reaction mechanism 2 &gt; 〇+ Wv, 〇OR. OR OR OR ΧοΗ where R is methyl α OR SKC3R (bR 21 201008952 jiy uuiL Comparative Example 2 (Comparative Sample 2) 0.38 Example 5 (Sample 3) 0.58 Comparative Example 3 (Comparative Samples) u -------, 0.28 As shown in Table 1, according to the examples of the present invention, the surface containing the decyl compound was used as compared with Comparative Samples 1 to 3 prepared without using the surface treatment composition. Samples 1 to 3 prepared with the treatment composition showed a greatly increased peel strength between the poly(0)imide and the copper foil. Evaluation Example 1-2: Moisture resistance test at 50 C, relative humidity 80% in the strange temperature and humidity device (thermo-hygrostat) Store samples 1 to 3 for 7 days in HIRAYANAPC-R7 The discoloration of samples 1 to v 3 was remarkable. After 7 days, the color of samples 1 to 3 did not change. (Syntaxyl Compound (2) Synthesis) 〇 Example 6A: Synthesis of Compound 2A According to the following reaction mechanism 2 Compound 2A represented by Formula 2 is synthesized. &lt;Reaction mechanism 2&gt; Wherein R is a methyl group. 21 201008952 125.712 grams of tetrahydrofuran, 8.9645 grams (0.05 moles) of 3-aminopropyltrimethoxysilane and 5.035 grams (0.05 moles) of succinic anhydride were poured into the reactor and reacted The reactor temperature was maintained at _5 ^ to 5 t under a nitrogen atmosphere for 6 hours, and the mechanical agitator was rotated at 300 rpm. After the completion of the reaction, a rotary evaporator was used for 2 hours to remove the solvent from the product. Then, the resultant was dried in a vacuum oven for 24 hours. Thus, 13 9 g (yield 99%) of the compound 2A represented by the formula 2 was obtained. 10 ^ NMR (300 MHz, (CD3) 2SO) : δ 0.53~0.58(m, 1Η) ' 1.42~1.45(m,2H), 2.29~2.31(d,4H), 2.38~2.43(m,5H), 2.98 to 3.00 (m, 3H), 3.40 to 3.46 (m, SiOCH3), 8.00 (s, -NH-), 12.00 (s, -OH) IR (pure, cm·1): 3650 to 3200 (vOH), 3300 to 3200 (vNH), 1650 (Vc〇nh), 1120 to 1050 (v$_(alkoxy)) Example 6B: Synthesis of Compound 2B According to the following reaction mechanism 2, the compound 2B ° &lt;; reaction mechanism 2&gt; 〇 201008952 31973pif Pour 125.712 grams of tetrahydrofuran, 8.9645 grams (0.05 moles) of 3-aminopropyltrimethoxysilane and 5.035 grams (0.05 moles) of succinic anhydride into the reactor. After reacting for 6 hours, the temperature of the reactor was maintained at -5 ° C to 5 ° C under a nitrogen atmosphere, and the mechanical stirrer was rotated at 300 rpm. After the reaction was completed, a rotary evaporator was used for 2 hours to remove the solvent from the product. Then, the resultant was dried in a vacuum oven for 24 hours, whereby 13.9 g (yield 99%) of the compound 2A represented by the formula 2 was obtained. 4 NMR (300 MHz, (CD3) 2SO): δ 0.53~0.58 (m, 1H), 1.42~1.45 (m, 2H), 2.29~2.31 (d, 4H), 2.38~2.43 (m, 5H), 2.98 ~3.00 (m, 3H), 3.40~3.46 (m, SiOCH3), 8.00 (s, -ΝΗ·), 12.00 (s, -OH) IR (pure, cm1): 3650~3200 (vOH), 3300~3200 (vNH), 1650 (Vc〇nh), 1120 to 1050 (v oxy)) Example 6B: Synthesis of Compound 2B Compound 2B represented by Formula 2 was synthesized according to the following Reaction Scheme 2. &lt;Reaction mechanism 2&gt; 22 201008952 j ty uuu. where R is ethyl. &gt; U5*712g of tetrahydrofuran, 11.0685g (0.05m) of 3-methoxypropyldiethoxylate (3 amin〇pr〇pyitrieth〇XySiiane) and 5.035g (〇.〇5m) The succinic anhydride was poured into the reactor and reacted for 6 hours, maintaining the temperature of the reactor under a nitrogen atmosphere. “^ to 5 and the mechanical stirrer rotates at 300 rpm. After the completion of the reaction, the solvent was removed from the product using a rotary evaporator for 2 hours. Then, the resultant was dried in a vacuum oven for 24 hours, so that 16 g (yield 99%) of the compound 2B represented by the formula 2 was obtained. !HNMR (300 MHz, (CD3)2SO): 60.58~0.60 (m, 1H) &gt; 1.22~1.25 (m, Si-CH2), 1.60~1.63 (m, 2H), 2.45~2.49 (m, 4H) , 2.51 to 2.54 (m, 5H), 3.20 to 3, 25 (m, 3H), 3.83 to 3.87 (m, Si-CH3) IR (pure, cm-1): 3650 to 3200 (voh), 3300 to 3200 (vNH), 1650 (Vc〇nh), 1120 to 1050 (v 矽·(alkoxy)) (Manufacture of surface treatment composition for copper foil) Examples 7 to 11 were mixed by a volume ratio of 1:9 Water and methanol were used to obtain a solvent mixture, and the solvent mixture was mixed with Compound 2A prepared in Example 6A to prepare a mixture of Compound 2A having 0.5% by weight, 1% by weight, 2% by weight, 3% by weight, and 5% by weight, respectively. Solution. 23 201008952 31973 pif Examples 12 to 16 The solvent mixture was mixed with the compound 26 prepared in Example 6B by mixing water and methanol in a volume ratio of 1:9 to prepare a mixture having 0.5% by weight and 1 weight. %, 2% by weight, 3% by weight and 5 parts by weight. /. A mixed solution of the compound 2B. (Manufacturing of two-layer FCCL) Examples 17 to 26 The mixed solutions prepared in Examples 7 to 16 were separately allowed to stand for 6 Torr for 10 minutes to carry out hydrolysis' and then sprayed separately on a Cr-coated rolled copper foil (IL_2, Made by Iljin). Next, the roll (4) was coated with an applicator (c ktrading c〇, model name: CKAF_1GG3). In the oven, at 12 (Γ: dry copper coated for 30 minutes. Spray the copper foil treated with the surface treatment composition with a varnish made by Jooyoung Industries Co., Ltd. (product name: ^(九)丨), And coating with a doctor blade. Polyurethane acid was applied at 6 (TC for 3 minutes, for 30 minutes, and for 1 G minutes) under a nitrogen atmosphere to prepare a polyimide film. Copper foils to which the polyimide films were respectively applied were prepared. The copper foils prepared in Examples 17 to % are hereinafter referred to as Samples 4 to 13. Comparative Example 4 The polymerization was carried out in the same manner as in Example 17 The coated aluminum alloy film is coated on the copper box' except that the surface treatment composition is omitted to treat the copper foil 24 201008952 Surface steps. (4) prepared in Comparative Example 4 is hereinafter referred to as Comparative Sample 4. Evaluation Example 2-1: Peel strength test The peel strengths of Samples 4 to 13 and Comparative Sample 4 were measured by the method specified in ASTM D-638. The cross-arm speed was 25 mm/min and the width of the sample was 5 mm. Measurements were performed using an Instron 8516. The results of the measurements are shown in Table 2 below. &lt;Table 2&gt; Peel strength [kg/cm] Example 17 (Sample 4) 0.78 Example 18 (Sample 5) - 0.86 Example 19 (Sample 6) ^93 Example 20 (Sample 7) 1.05 Example 21 (Sample 8) 0.92 Example 22 (Sample 9) 0.82 Example 23 (Sample 10) p-I 1.89 Example 24 (Sample 11) 1.02 Example 25 (Sample 12) 1.12 Example 26 (Sample 13) 0.94 Comparative Example 4 (Comparative Sample 4) 0.38 2, according to an embodiment of the present invention, samples 4 to 13 prepared using a surface treatment composition containing a decyl compound were compared to Comparative Sample 4 prepared without using 25 201008952 31973 pif surface treatment composition. The bismuth imide film and the copper foil showed a greatly increased peel strength. Evaluation Example 2_2: Moisture Resistance Test Samples 4 to 13 were stored in a thermostat HIRAYANA PC-R7 at 50 ° C for 80 days at a relative humidity of 80%, and the discoloration of the samples 4 to 13 was remarkable. After 7 days, the colors of samples 4 to 13 did not change. (Synthesis of the chopped alkyl compound (3)) Example 27: Synthesis of the compound 3 The compound 3 represented by the formula 3 was synthesized according to the following reaction mechanism 3. &lt;Reaction mechanism 3&gt; 125.712 grams of tetrahydrofuran, 8.9645 grams (0.05 moles) of 3-aminopropyltrimethoxynonane and 7.4550 grams of 2,3-pyridine dianhydride were poured into the reactor and reacted 5 The reactor was maintained at a temperature of -5 ° C to 5 ° C under a nitrogen atmosphere, and the mechanical stirrer was rotated at 300 rpm. 26 201008952 After the reaction was completed, a rotary evaporator was used for 2 hours to remove the solvent from the product. Then, the resultant was dried in a vacuum oven for 24 hours, so that 16.4 g (yield 99%) of the compound 3 represented by the formula 3 was obtained. NMR (300 MHz, (CD3)2SO): δ0·57~0.59(t,1H), 1.62~1.80(m, 2H), 3.62~3.67(m,Si-CH3), 3.85~3.87(t,3H ), 7.93~7.95(t, 4Η)'8.56(3,ΝΗ)&gt;8.64~8.67(^ 5H)&gt;9.09-9.11(^d 6H) &gt; 13.80(s, OH) · ' ❷ IR (pure , cm_1) : 3650 to 3200 (V〇H), 3300 to 3200 (Vnh), 1650 (vCONH), 1120 to 1050 (v 矽·(alkoxy)) (Manufacture of surface treatment composition for copper foil) Example 28黾2Q A solvent mixture was mixed with Compound 3 prepared in Example 27 by mixing water and methanol in a volume ratio of 1:9 to prepare Compound 3 having 0.5% by weight and 丨% by weight, respectively. Mixed solvent solution. ° ' (Manufacture of two-layer FCCL) Example 30黾31 The mixed solutions prepared in Examples 28 to 29 were allowed to stand alone for 6 minutes to carry out hydrolysis' and then sprayed separately on Cr-coated rolled copper foil (IL_2, Made by Iljb). Next, the copper foil was coated using an applicator. The coated copper foil was dried in an oven at 120 C for 30 minutes. s :_ varnish in the form of Upilex manufactured by UBE Co., Ltd. (Product 27 201008952 /jpu After completion of the reaction, use a rotary evaporator for 2 hours to remove from the product: the granule. Then, dry in the vacuum baking phase The product was formed for 24 hours, so that 16.4 g (yield 99%) of the compound 3 represented by the formula 3 can be obtained. H NMR (300 MHz, (CD3) 2S 〇): δ θ.57 〇.59 (t, 1H), 1.62~1.80 (m, 2H), 3.62~3.67 (m, Si-CH3), 3.85~3.87 (t, 3H), 7.93~7.95 (t, 4H), 8.56 (s, NH), 8.64~8.67 (d , 5H), 9. 〇9~9.ii (d 6H), 13.80 (s, OH) IR (pure, cm1): 3650~3200 (vOH), 3300~3200 (vNH), 1650 (vc〇nh) 1120 to 1050 (v, _ (decyloxy)) (manufacture of a surface treatment composition for copper foil), Examples 28 to 29 by mixing water and decyl alcohol in a volume ratio of 1:9 to obtain a solvent mixture, The solvent mixture was mixed with Compound 3 prepared in Example 27 to prepare a mixed solution of 0.5% by weight and 1 weight of Compound 3. φ (Manufacture of two-layer FCCL) Examples 30 to 31 In Examples 28 to 29. The prepared mixed solution is left to stand alone 6 〇 minute to carry out hydrolysis' and then sprayed separately on a Cr-coated rolled copper foil (IL 2, manufactured by Iljin). Then, the copper foil was coated with an applicator, and dried in an oven at 120 ° C for 30 minutes. Coated copper foil. A varnish in the form of upilex manufactured by UBE Co., Ltd. (produced 27 201008952 fl and 2::=Li. Copper bell, minute, row-divided treatment treated with surface treatment composition Stuffed (four), (d) prepared Wei-Si si hardened imide film coated on the scales, the grades of the poly-awake steel foil are referred to below as samples 14 to 15. The actual preparations of the "3" to 31 The H sample was prepared by coating the enamel surface with a polyimide film (4) 10 ❺ pain using a surface treatment composition to treat copper foil = 。. In Comparative Example 5 _ hereinafter referred to as = j £ j ancient example 3 -1 : Peeling the strong Tang μ The peel strength of the samples 14 to 5 and the comparative sample 5 was measured using the method specified by ASTM D-638. The cross speed was 25 mm/min and the width of the sample was 5 mm. Using Instron 8516 The measurement results are shown in Table 3 below. &lt;Table 3&gt; ——-, --- Peeling Strength [kgf/cml Example 30 (Sample 14) Λ82 Example 31 (Sample 15) ----- 0.78 :: ------ _ " 28 201008952 31973pif Copper =: U · Liang Tong _s) Spray Sprinkle the foil at the surface treatment composition and apply it with a spatula. Under the nitrogen atmosphere, 3G minutes at 6GCit, 3W at 25 〇t for 3W, and 3 (minutes) for 1 () minutes to harden the coated = imiline' to prepare polyimine. A copper drop coated with a polyimide film separately coated thereon. Preparations in Examples 3G to 31 are hereinafter referred to as Samples 14 to 15. Comparative Example 5 © A copper foil coated with a polyimide film was prepared in the same manner as in Example 3, except that the step of treating the surface of the copper foil using the surface treating agent composition was omitted. The copper ruthenium prepared in Comparative Example 5 is hereinafter referred to as Comparative Sample 5. Evaluation Example 3-1: Peel strength test The peel strengths of Samples 14 to 15 and Comparative Sample 5 were measured using the method specified by ASTM D-638. The cross-arm speed was 25 mm/min and the sample had a ❹ width of 5 mm. Measurements were performed using an Instron 8516. The results of the measurements are shown in Table 3 below. &lt;Table 3&gt; Width 30 (Sample 14) - (Sample 15) Ion Strength Ikgf/cm] Application 0.78 28 201008952 J IJUU. Comparative Reality i 5 (Comparative Sample 5) 1〇.32 As shown in Table 3, According to an embodiment of the present invention, samples 14 to 15 prepared from a surface treatment composition containing a sulphur-based compound are used in a polyimide film and a comparative sample 5 prepared without using a surface treatment composition. There is a substantial increase in peel strength between the copper foils. Evaluation Example 3-2: Moisture Resistance Test Samples 14 to 15 were stored in a thermostatic humidifier HIRAYANA PC-R7 at 50 ° C and a relative humidity of 80% for 7 days, and the samples 14 to 15 were noticeably changed. After 7 days, the colors of samples 14 to 15 did not change. (Synthesis of a mercaptoalkyl compound (4)) Example 32A: Synthesis of Compound 4A Compound 4A represented by Formula 4 was synthesized according to the following Reaction Scheme 4. &lt;Reaction mechanism 4&gt; 125.712 grams of tetrahydrofuran, 8.9645 grams (0.05 moles) of 3-aminopropyltrimethoxynonane and 9.6065 grams of trimellitic anhydride (2,3-pyridinedicarboxylic anhydride) were poured into the reactor. After reacting for 6 hours, the temperature of the reactor was maintained at -5 ° C to 5 ° C under a nitrogen atmosphere of 29 201008952 31973 pif, and the mechanical stirrer was rotated at 250 rpm. After the completion of the reaction, a rotary evaporator was used for 1 hour to remove the solvent from the resultant. Then, the product was dried in a vacuum oven for 48 hours. Thus, 18.5 g (yield 99%) of the compound 4A 〇4 NMR (300 MHz, (CD3) 2SO) represented by the formula 4 was obtained: δ θ.62 to 0.65 (t , 1H), 1.71 to 1.76 (m, 2H), 3.41 to 3.47 (m, Si-CH3), 3.56 to 3.60 (m, 3H), 7.45 (s, NH) IR (pure, cm·1): 3650~ 3200 (vOH), 3300 to 3200 (vNH), 1650 (vc〇nh) '1120 to 1050 (v Example 32B: Synthesis of Compound 4B The compound 4b represented by Formula 4 is synthesized according to the following reaction mechanism 4. &lt;Reaction mechanism 4&gt; Wherein R is an ethyl group. 125.712 g of tetrahydrofuran, 8.9645 g (〇.〇5 mol) of 3·aminopropyl triethoxy dream and 9.6065 g (0.05 mol) of trimellitic acid Sf (2,3-°tb bite The diacid liver was poured into the reactor and reacted for 6 hours, and the temperature of the reactor was maintained at -5 ° C to 5 ° C in a nitrogen atmosphere and the mechanical stirrer was rotated at 25 〇 30 201008952 / ^ pu rpm. After the completion of the reaction, a rotary evaporator was used for 1 hour to remove the solvent from the resultant. Then, the resultant was dried in a vacuum oven for 48 hours, whereby 20.6 g (yield 99%) of the compound 4B represented by the formula 4 was obtained. iHNMRpOOMHz) : δ0·71 ～0.73(t,1H), 1.14~1.23(m, Si-CH3), 1.71~1.74(m, 2H), 3.58~3.60(t,3H), 3.79~3.86(m, © Si-CH2), 8.55 (s, NH) IR (pure, cm·1): 3650~3200 (vOH), 3300~3200 (vNH), 1650 (vCONH), 1120~l〇50 (v#_( Oxy)) (Production of surface treatment composition for copper foil) Examples 33 to 34 Solvent mixture was obtained by mixing water and methanol in a volume ratio of 1:9 'Compound 4A prepared in Example 32A The mixture was mixed to prepare a mixed hydrazine solution having 〇·5% by weight and i% by weight of Compound 4A, respectively. Examples 35 to 36 were prepared by mixing water and methanol in a volume ratio of 1:9 to obtain a solvent mixture 'The solvent mixture was mixed with the compound 4B prepared in Example 32B to prepare 5% by weight and 1% by weight, respectively. A mixed solution of Compound 4B. 31 201008952 31973pif (manufacturing of two-layer FCCL) Examples 37 to 40, ... The mixed solutions prepared in Examples 33 to 36 were allowed to stand alone for 60 minutes =: hydrolysis, and then sprayed separately on a Cr-coated rolled copper (IL-2, above. Then 'Painted with an applicator. Dry the coated copper foil in an oven at 120 C for 30 minutes. Shine lacquer made by 〇 Co., Ltd. (Product name: Knife coating using surface treatment# 1 (4) of the composition treatment and using a scraping under a nitrogen atmosphere at 6 Gt: 3 G minutes, 12 (rc for 3 〇 minutes, 2 = for 3 G minutes, and Na for 1 () minutes to harden the coated acid' In order to prepare a polyimide film, therefore, a copper coated with a polyimide film was prepared. Examples 37 to 4 are referred to as samples 16 to 19 below. (iv) Copper-berth Comparative Example 6 Q (4) The same prescription of 37 towels (4) Imine = _ 'except that the treatment with the surface treatment agent was omitted 』 Sr. The copper drop prepared in Comparative Example 6 is hereinafter referred to as Comparative Evaluation Example 4-1: Peel strength The test measures the sample 丨6 to 丨9 by the method specified in ASTM D-63 8 Product 6 _off strength. Cross-arm speed is 25 mm/min and sample 32 201008952 ^ Ly I ^/yix width is 5 mm. Measurements were made using Instron 8516. The results of the measurement are shown in Table 4 below. Table 4 &gt; Peel Strength [kgf/cm] Example 37 (Sample 16) 1.60 Example 38 (Sample 17) 1.35 Example 39 (Sample 18) 1.98 Example 40 (Sample 19) 1.57 Specific Freshness Example 6 (Comparative Sample 6) 0.38 As shown in Table 4, samples 16 to 19 prepared using a surface treatment composition containing a decyl compound were compared to Comparative Sample 6 prepared without using a surface treatment composition, according to an embodiment of the present invention. There was a significant increase in peel strength between the yttrium imide film and the copper foil. Evaluation Example 4-2: Moisture resistance test Samples 16 to 19 were stored in a thermostatic humidifier HIRAYANA PC-R7 at 5 ° C and a relative humidity of 80 %. After 7 days, the discoloration of samples 16 to 19 was remarkable. After 7 days, the color of samples 16 to 19 did not change. As described above, no surface treatment composition was used on the PCB or a surface containing a general fluorenyl compound was used. Treatment composition, use containing The PCB prepared from the surface treatment composition of the copper halide of the invention has an improved peel strength. 33 201008952 31973pif Although the invention has been disclosed above by way of example, it is not intended to limit the invention, in any technical field. The scope of the present invention is defined by the scope of the appended claims, and the scope of the invention is intended to be limited by the scope of the invention. [Simple description of the diagram] None. [Main component symbol description] 34 201008952 /8124124 Chinese manual without line correction page Hair (This manual format, order 'Do not change any more, ※Application number: ※Application曰: ※Please do not fill in the mark) &lt;Γ〇Π户η/γ (2006.01Ϊ来11&gt;(:Classification: Invention name: C^C (2006.01) 矽 矽alkyl compound, its preparation method and containing the decyl compound SILANE BASED COMPOUND, METHOD FOR PREPARING THE SAME, AND SURFACE TREATING AGENT COMPOSITION FOR COPPER FOIL INCLUDING THE SILANE BASED COMPOUND II. SUMMARY OF THE INVENTION: Provided by the formula 1 to 4 · &lt;Formula 1&gt; <Formula 3> 201008952 Description of invention patents (This specification is in the format and order, please do not change it at will, please do not fill in the ※ part) ※Application number: (township % f2006.01) ※Application曰: ※^(:Classification ·· 1. Name of the invention: (4) Capital (10) coffee chopping mixture and its preparation method and surface treatment composition ef i-- -v*· f -';, ' i · of copper foil containing the dream burning mixture . SILANE BASED COMPOUND, METHOD FOR PREPARING THE SAME, AND SURFACE TREATING AGENT COMPOSITION FOR COPPER FOIL INCLUDING THE SILANE BASED COMPOUND II. SUMMARY OF THE INVENTION: The oxime alkyl compound represented by Formulas 1 to 4 is provided: ❹ &lt;Formula 1&gt; &lt;Formula 3&gt; 201008952 : uy/3pin Wherein R!, 112 and R3 are each independently q to C3 alkyl, and R4 and R5 are each independently hydrogen or (^ to C5 alkyl 201008952 31973 pif Wherein R!, R2 and R3 are each independently a Q to C3 alkyl group, and R4 and R5 are each independently hydrogen or (^ to C5 alkyl group 201008952. Abstract: Provided is a silane-based compound represented by Formulae 1 through 4: <Formula 1> 〇 k/ <Formula 3 &gt; <Formula 4&gt; n R o Λ如Rls R2, and R3 are each independently a Q-C3 alkyl group and R4 and R5 are each independently hydrogen or a C1-C5 alkyl group. 201008952 jiy/3pin No. 98124124 Chinese patent scope without scribe correction VII. Patent scope: 1. A fluorenyl compound, represented by formulas 1 to 4: &lt;Formula 3&gt; &lt;Formula 4&gt; Wherein R!, R2 and R3 are each independently C! to C3 alkyl 'H4 - ' 35 201008952 jiyi^uu VII. Patent scope: 1. A dream base compound, represented by formulas 1 to 4: 1&gt; &lt;Formula 3&gt; Wherein R!, R2 and R3 are each independently (^ to C3 alkyl, and R4 35 201008952 31973pifl and R5 are each independently 氲 or (^ to c5 alkyl. 2. As described in claim 1 a decyl group compound, wherein R!, R_2 and R3 are each independently a methyl group or an ethyl group, and Κ·4 and R5 are ·fii. 3. A surface treatment agent composition for copper foil, comprising selected from the group consisting of Formulas 1 to 4. At least one compound of the group consisting of a halogenated alkyl compound, and a solvent &lt;Formula 1&gt; <Formula 4> 36 201008952 31973pif and R5 are each independently hydrogen or an alkyl group of (^ to ^) 2. The alkylene compound of claim 1, wherein RrRz and R3 are each independently a thiol or ethyl group, and the IU and R5 is hydrogen. 3. A surface treatment composition for copper foil, comprising at least one compound selected from the group consisting of decyl compounds represented by Formulas 1 to 4, and a solvent &lt;Formula 1&gt; &lt;Formula 4&gt; 36 201008952 31973pifl R2 wherein R1 and R^^ are each independently a ruthenium of 〇1 to 〇3, and each of R4 and R5 is independently a wind or a burnt group of C! to c5. ❹ 4. For the copper surface treatment composition described in the third paragraph, wherein R!, 2 and 1 are each independently f-based or the ruler 5 is hydrogen. ~ 5. If applying for a patent _ The copper (iv) surface treatment composition according to 3, wherein the solvent comprises one selected from the group consisting of water, methanol, ethanol and hydrazine. The VIII is selected from the group consisting of the formulas 1-4. A method for preparing a compound consisting of a compound comprising a hetero group compound represented by Formula 5 or Formula 7 and a compound selected from the group consisting of a compound represented by Formula 6, Betung Hepat, 2,3-pyridine dianhydride, and trimellitic anhydride One of the compounds is reacted at a temperature of -10 ° C to 100 ° (:: &lt; Formula 1 &gt; r / &lt; Formula 2 &gt; 37 201008952 Wherein R!, R2 and Rs are each independently an alkyl group of 〇1 to C3, and each of K and Rs is independently hydrogen or an alkyl group of C to C5. ο The surface treatment composition for copper foil according to claim 3, wherein R!, R2 and I are each independently methyl or ethyl and &amp; and R5 is nitrogen. 5. The surface treatment agent composition for copper foil according to claim 2, wherein the solvent comprises one selected from the group consisting of water, methanol, ethanol, and a mixture thereof. 6. A process for producing a compound selected from the group consisting of a fluorenyl compound represented by Formulas 1 to 4, comprising a calcined compound represented by Formula 5 or Formula 7 and a compound selected from Formula 6 A compound of one of the groups consisting of an acid anhydride, 2,3-pyridine dianhydride, and trimellitic anhydride is reacted at a temperature of from -10 ° C to 100 ° C: &lt;Formula 1&gt; &lt;Formula 2&gt; 37 201008952 31973pifl &lt;Formula 3&gt; &lt;Formula 4&gt; &lt;Formula 5&gt; . Bu/2 &lt;Formula 6&gt; 38 201008952 31973pif &lt;Formula 5&gt; <Formula 6> &lt;Formula 7&gt; 38 201008952 31973pifl r/ wherein Ri, R2 and R3 are each independently an alkyl group of (C to C3), and each of R4 and R5 is independently hydrogen or a cardyl group of c5. 39 201008952 J / ^Uli. A r / wherein, Ri, R 2 and R 3 are each independently (^ to C 3 alkyl, and R 4 and R 5 are each independently hydrogen or (^ to (: 5 alkyl). 39 201008952 31973pif IV. Designated representative circle: (1) The designated representative of the case: None. (2) A brief description of the component symbols of this representative figure: None. 5. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: 4